BMS battery management system thermoelectric cooling structure and lithium battery pack system
By introducing a thermoelectric cooling structure into the BMS battery management system, and using a heat transfer layer and thermoelectric semiconductor cooling components to perform contact cooling on the MOSFET, the problem of MOSFET overheating is solved, the appearance design of the Pack system becomes more versatile and the heat dissipation effect is improved, the MOSFET lifespan is extended, and the cost is reduced.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CAMEL GRP WUHAN OPTICS VALLEY R&D CENT CO LTD
- Filing Date
- 2022-12-02
- Publication Date
- 2026-07-24
AI Technical Summary
Existing technologies suffer from MOSFET overheating under high current conditions, which leads to complex and larger Pack system designs. Current solutions cannot effectively solve the MOSFET overheating problem without affecting the overall Pack system design.
The BMS battery management system employs a thermoelectric cooling structure, which transfers heat from the MOSFET component to the thermoelectric semiconductor cooling component through a heat transfer layer. The thermoelectric semiconductor cooling component then transfers the heat to the heat dissipation component, and finally dissipates the heat to the outside air, thus achieving contact cooling of the MOSFET.
It effectively solves the heat dissipation problem of MOSFETs under high temperature and high current, maintains the universality of Pack system appearance design, reduces size, improves MOSFET lifespan and reduces product failure rate, and reduces cost.
Smart Images
Figure CN116093485B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of lithium battery technology, specifically a thermoelectric cooling structure for a BMS battery management system and a lithium battery pack system having the structure. Background Technology
[0002] The Battery Management System (BMS) of lithium batteries is generally integrated into the battery pack system, and its design size and application environment are based on the overall design of the battery pack system. MOSFETs are field-effect transistors widely used in analog and digital circuits. In recent years, MOSFET products have been widely used in BMS battery management systems. Their design is limited by the design space and application current of the BMS battery management system. Under high current (e.g., greater than 150A), MOSFETs can overheat, leading to MOSFET failure and ultimately causing the battery pack system to malfunction. Current solutions to this problem involve designing MOSFET arrays of different sizes based on different current requirements to address MOSFET overheating. However, this leads to adjustments in the overall battery pack system design after changing the MOSFET size, causing design difficulties. Furthermore, even if the battery pack system is readjusted according to the changed MOSFET sizes, insufficient design margin in the MOSFET array can still cause MOSFET overheating under extreme conditions during actual use. The design margin for the MOSFET array cannot be increased indefinitely, resulting in an excessively large battery pack system. Therefore, there is an urgent need for a solution to address the technical problem of MOSFET overheating under high current conditions without affecting the overall design of the battery pack system. Summary of the Invention
[0003] The purpose of this invention is to overcome the above-mentioned technical deficiencies and provide a thermoelectric cooling structure for a BMS battery management system and a lithium battery pack system having the structure, thereby solving the technical problem of MOSFET overheating under high current conditions in the prior art.
[0004] To achieve the above-mentioned technical objectives, the present invention provides a thermoelectric cooling system for a battery management system (BMS), comprising: A lithium battery cover, wherein ventilation holes are provided in the lithium battery cover; A BMS management system integrated into the top cover of the lithium battery; The MOSFET component installed in the BMS management system has a heat transfer layer, a thermoelectric cooling component, and a heat dissipation component sequentially disposed on its upper surface. The upper surface of the MOSFET component is in contact with the heat transfer layer, the heat transfer layer is in contact with the thermoelectric cooling component, and the thermoelectric cooling component is in contact with the heat dissipation component. The top of the heat dissipation component is disposed through the ventilation hole. The heat generated by the MOSFET component is transferred to the thermoelectric cooling component through the heat transfer layer. The thermoelectric cooling component absorbs the heat and transfers the heat to the heat dissipation component, which then transfers the heat to the outside of the lithium battery cover.
[0005] Furthermore, the thermoelectric semiconductor cooling component includes a cold end and a hot end, the cold end being in contact with the heat transfer layer and the hot end being in contact with the heat dissipation component.
[0006] Furthermore, the BMS management system is equipped with a controller, and the thermoelectric semiconductor refrigeration component is electrically connected to the controller.
[0007] Furthermore, the MOSFET assembly is equipped with a temperature sensor and a current sensor, which are electrically connected to the controller.
[0008] Furthermore, the heat transfer layer is a thermally conductive adhesive applied to the upper surface of the MOSFET component.
[0009] Furthermore, the upper surface area of the thermally conductive adhesive is the same as the lower surface area of the thermoelectric semiconductor cooling component.
[0010] Furthermore, the heat dissipation component is a finned, one-piece structure made of extruded aluminum alloy.
[0011] Furthermore, the heat dissipation assembly includes multiple fins, a side fixing interface, and a bottom heat dissipation interface. The side fixing interface is disposed on two fins located on both sides and is used to connect with the ventilation hole. The bottom heat dissipation interface is disposed at the bottom of the multiple fins and is used to connect with the thermoelectric semiconductor cooling assembly. The tops of the multiple fins extend out of the ventilation hole.
[0012] Furthermore, the lithium battery cover and the heat dissipation component are an integral structure manufactured by injection molding.
[0013] In addition, the present invention also provides a lithium battery pack system, wherein the lithium battery pack includes the thermoelectric cooling structure of the BMS battery management system described in the above technical solution.
[0014] Compared with the prior art, the beneficial effects of the present invention mainly include: This invention provides a thermoelectric cooling structure for a BMS (Battery Management System). A heat transfer layer transfers heat generated by the MOSFET components to a thermoelectric semiconductor cooling component, which then transfers the heat to a heat dissipation component. Finally, the heat dissipation component releases the heat into the outside air. This primarily utilizes the thermoelectric semiconductor cooling component for contact cooling of the MOSFETs in the BMS, ensuring timely and effective heat dissipation. This solves the heat dissipation problem of MOSFETs under high temperature and high current without requiring different MOSFET arrangements. Therefore, for lithium battery pack systems incorporating this structure, lithium batteries of the same size and shape can be designed regardless of changes in temperature and current, increasing the versatility of lithium battery pack system product design and contributing to a smaller overall lithium battery size. Furthermore, the heat dissipation method of this invention is highly effective, significantly reducing the ambient temperature of the MOSFETs, increasing their lifespan, reducing product failure rate, lowering costs, and benefiting the thermal management of the BMS. Attached Figure Description
[0015] Figure 1 This is a general diagram of the thermoelectric cooling structure described in this invention integrated into the top cover of a lithium battery; Figure 2 yes Figure 1 Exploded view; Figure 3 This is a schematic diagram of the thermoelectric semiconductor refrigeration component described in this invention; Figure 4 This is a schematic diagram of the heat dissipation component described in this invention.
[0016] As shown in the figure: 1-Lithium battery cover, 11-Ventilation holes; 2-BMS Management System; 3- MOSFET components; 4-Heat transfer layer; 5-Thermoelectric semiconductor refrigeration component, 51-Cold end, 52-Hot end; 6-Heat dissipation component, 61-Fins, 62-Side mounting interface, 63-Bottom heat dissipation interface. Detailed Implementation
[0017] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.
[0018] Please see Figures 1-2As shown, the present invention provides a thermoelectric cooling structure for a battery management system (BMS), including a lithium battery cover 1, a BMS management system 2, a MOSFET assembly 3, a heat transfer layer 4, a thermoelectric semiconductor cooling assembly 5, and a heat dissipation assembly 6. The lithium battery cover 1 has a pre-drilled ventilation hole 11. The BMS management system 2 is integrated inside the lithium battery cover 1. The MOSFET assembly 3 is disposed within the BMS management system 2. The heat transfer layer 4, the thermoelectric semiconductor cooling assembly 5, and the heat dissipation assembly 6 are sequentially disposed from bottom to top on the upper surface of the MOSFET assembly 3. The upper surface of the MOSFET assembly 3 is in contact with the heat transfer layer 4, the heat transfer layer 4 is in contact with the thermoelectric semiconductor cooling assembly 5, and the thermoelectric semiconductor cooling assembly 5 is in contact with the heat dissipation assembly 6. The top end of the heat dissipation assembly 6 passes through the ventilation hole 11. In this way, the heat generated by the MOSFET component 3 is transferred to the thermoelectric semiconductor cooling component 5 through the heat transfer layer 4. The thermoelectric semiconductor cooling component 5 absorbs the heat and transfers it to the heat dissipation component 6, which in turn transfers the heat to the outside of the lithium battery cover 1. This effectively dissipates heat from the MOSFET component 3, reduces its temperature, and solves the heat dissipation problem of the MOSFET under high temperature and high current without redesigning the MOSFET arrangement or changing the overall appearance design of the Pack system product.
[0019] Specifically, in combination Figure 2 and Figure 3 As shown, the thermoelectric semiconductor refrigeration component 5 includes a cold end 51 and a hot end 52. The cold end 51 is in contact with the heat transfer layer 4, and the hot end 52 is in contact with the heat dissipation component 6. Thermoelectric refrigeration is a direct conversion of voltage generated by temperature difference. It refers to the phenomenon where electrons in a heated object move from a high-temperature region to a low-temperature region along a temperature gradient, generating an electric current, and vice versa. When direct current is passed through it, materials with thermoelectric energy conversion characteristics can produce a cooling function, which is called thermoelectric refrigeration. Figure 3 As shown, the cold end 51 of the thermoelectric semiconductor cooling component 5 is brought into contact with the heat transfer layer 4. The cold end 51 can absorb the heat generated by the MOSFET component 3 transferred by the heat transfer layer 4 and transfer the heat to the hot end 52. Then, the heat is carried away by the heat dissipation component 6 connected to the hot end 52, thus completing the heat dissipation work.
[0020] Specifically, the BMS management system 2 includes a controller, and the thermoelectric semiconductor cooling component 5 is electrically connected to the controller. Furthermore, the MOSFET component 3 is equipped with a temperature sensor and a current sensor, both of which are electrically connected to the controller. The thermoelectric semiconductor cooling component 5 is self-powered by a lithium battery, with the power supply provided by the Pack system itself. The operation of the thermoelectric semiconductor cooling component 5 is based on the temperature of the MOSFET and the magnitude of the current flowing through the MOSFET. In a specific embodiment, the maximum temperature of the MOSFET can be set to 100°C, and the maximum current flowing through the MOSFET can be set to 70% of the maximum current. The temperature and current of the MOSFET are monitored by the temperature and current sensors, respectively. When the detected MOSFET temperature exceeds 100°C or the current flowing through it exceeds 70% of the maximum current, a signal is fed back to the controller, which then activates the thermoelectric semiconductor cooling component 5 to dissipate heat from the MOSFET component 3.
[0021] Specifically, the heat transfer layer 4 is a thermally conductive adhesive applied to the upper surface of the MOSFET component 3. This thermally conductive adhesive has the advantage of good heat transfer performance, allowing it to transfer the heat generated by the MOSFET component 3 to the thermoelectric semiconductor cooling component 5 to the maximum extent possible. In one specific embodiment, the upper surface area of the thermally conductive adhesive is the same as the lower surface area of the thermoelectric semiconductor cooling component 5 to ensure effective heat transfer.
[0022] Specifically, such as Figure 4 As shown, the heat dissipation component 6 is a finned integrated structure extruded from aluminum alloy. The heat dissipation component 6 includes multiple fins 61, side fixing interfaces 62, and bottom heat dissipation interfaces 63. The side fixing interfaces 62 are located on two fins 61 on either side and are used to connect to the ventilation holes 11. The bottom heat dissipation interfaces 63 are located at the bottom of the multiple fins 61 and are used to connect to the thermoelectric semiconductor cooling component 5. The tops of the multiple fins 61 extend beyond the ventilation holes 11. Thus, the fins 61 have a larger contact area, effectively increasing heat exchange with the air and optimizing heat dissipation. The side fixing interfaces 62 increase the strength and airtightness of the connection with the ventilation holes 11. The bottom heat dissipation interfaces 63 are connected to the MOSFET component 3 through the heat transfer layer 4, directly dissipating the heat from the MOSFET component 3.
[0023] Specifically, in actual manufacturing, the lithium battery cover 1 and the heat dissipation component 6 can be integrally manufactured through injection molding.
[0024] Meanwhile, the present invention also provides a lithium battery pack system, which includes the thermoelectric cooling structure of the BMS battery management system described in the above technical solution.
[0025] In summary, the thermoelectric cooling structure of the BMS battery management system provided by this invention mainly uses a thermoelectric semiconductor cooling component 5 to perform contact cooling on the MOSFET component 3 in the BMS management system 2. The heat dissipation effect is stable and reliable. Through this heat dissipation method, the arrangement of the MOSFET component 3 is no longer affected by temperature and current factors. Instead, the MOSFET component 3 can be formed into a unified standard pattern, making the BMS management system 2 universal. On the other hand, integrating the BMS management system 2 with this cooling structure into the lithium battery cover 1 of the Pack system allows the Pack system to adapt to different temperature and current application environments, increasing the versatility of the Pack system product's appearance design.
[0026] The specific embodiments of the present invention described above do not constitute a limitation on the scope of protection of the present invention. Any other corresponding changes and modifications made in accordance with the technical concept of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A thermoelectric cooling structure for a BMS (Battery Management System), characterized in that, include: A lithium battery cover, wherein ventilation holes are provided in the lithium battery cover; A BMS management system integrated into the top cover of the lithium battery; The MOSFET component installed in the BMS management system has a heat transfer layer, a thermoelectric semiconductor cooling component, and a heat dissipation component sequentially disposed on its upper surface. The upper surface of the MOSFET component is in contact with the heat transfer layer, the heat transfer layer is in contact with the thermoelectric semiconductor cooling component, and the thermoelectric semiconductor cooling component is in contact with the heat dissipation component. The top of the heat dissipation component is disposed through the ventilation hole. The heat generated by the MOSFET component is transferred to the thermoelectric semiconductor cooling component through the heat transfer layer. The thermoelectric semiconductor cooling component absorbs the heat and transfers the heat to the heat dissipation component, and then the heat is transferred to the outside of the lithium battery cover through the heat dissipation component. The BMS management system is equipped with a controller, and the thermoelectric semiconductor refrigeration component is electrically connected to the controller. The MOSFET assembly is equipped with a temperature sensor and a current sensor, which are electrically connected to the controller.
2. The thermoelectric cooling structure for a BMS battery management system according to claim 1, characterized in that, The thermoelectric semiconductor cooling component includes a cold end and a hot end, wherein the cold end is in contact with the heat transfer layer and the hot end is in contact with the heat dissipation component.
3. The thermoelectric cooling structure for a BMS battery management system according to claim 1, characterized in that, The heat transfer layer is a thermally conductive adhesive applied to the upper surface of the MOSFET component.
4. The thermoelectric cooling structure for a BMS battery management system according to claim 3, characterized in that, The upper surface area of the thermally conductive adhesive is the same as the lower surface area of the thermoelectric semiconductor cooling component.
5. The thermoelectric cooling structure for a BMS battery management system according to claim 1, characterized in that, The heat dissipation component is a finned, one-piece structure made of extruded aluminum alloy.
6. The thermoelectric cooling structure for a BMS battery management system according to claim 5, characterized in that, The heat dissipation assembly includes multiple fins, a side fixing interface, and a bottom heat dissipation interface. The side fixing interface is located on two fins on both sides and is used to connect with the ventilation hole. The bottom heat dissipation interface is located at the bottom of the multiple fins and is used to connect with the thermoelectric semiconductor cooling assembly. The tops of the multiple fins extend out of the ventilation hole.
7. The thermoelectric cooling structure for a BMS battery management system according to claim 1, characterized in that, The lithium battery cover and the heat dissipation component are an integral structure manufactured by injection molding.
8. A lithium battery pack system, characterized in that, The lithium battery pack includes the thermoelectric cooling structure of the BMS battery management system as described in any one of claims 1 to 7.