Lens driving assembly, chip driving assembly and camera module

Abstract

The application discloses a lens driving assembly, a chip driving assembly and a camera module. The camera module comprises an optical lens, a photosensitive assembly, a lens driving assembly and a chip driving assembly. The optical lens is arranged to be driven on the lens driving assembly. The photosensitive assembly is arranged to be driven on the chip driving assembly. The chip driving assembly is arranged below the lens driving assembly, and the optical lens is kept on the photosensitive path of the photosensitive assembly. The lens driving assembly is arranged to drive the optical lens to translate to realize anti-shake and drive the optical lens to move along the optical axis to realize focusing. The chip driving assembly is arranged to drive the photosensitive assembly to translate to realize anti-shake and / or drive the photosensitive assembly to rotate to realize anti-shake.

Description

Technical Field

[0001] This invention relates to optical imaging devices, and more particularly to a lens driving assembly, a chip driving assembly, and a camera module. Background Technology

[0002] With the widespread adoption of mobile electronic devices, the technology related to camera modules used in these devices to help users capture images has developed and progressed rapidly. Currently, consumers in the market have increasingly higher and more diverse requirements for the functions of camera modules configured in mobile electronic devices (e.g., smartphones), such as demanding image stabilization for better image quality.

[0003] When using mobile electronic devices for video recording, the natural physiological tremors of the human body and the shaking caused by movement can lead to a decrease in video quality. This is especially true for ordinary consumers who lack professional training and are more prone to shaking, and the shaking can be more pronounced. Therefore, mobile electronic devices are usually equipped with image stabilization motors (i.e., drive components) to drive the optical lens to achieve image stabilization.

[0004] As the image quality requirements of camera modules become increasingly demanding, the size and weight of optical lenses are also increasing, placing higher demands on the driving force of the drive components. The space occupied by the image stabilization motor increases accordingly with the lens size. Furthermore, the current trend towards thinner and lighter mobile electronic devices significantly limits the size of camera modules, making them increasingly unable to meet the configuration needs of electronic devices. In other words, while optical lenses are becoming larger and heavier, the driving force provided by the drive components cannot be increased accordingly. With limited driving force, the heavier the lens, the shorter the stroke the drive components can take to move the optical lens, affecting image stabilization capabilities. Additionally, the heavier the optical lens, the slower the speed at which the drive components can move it, and the longer it takes for the optical lens to reach the predetermined compensation position, which also affects the image stabilization effect. Summary of the Invention

[0005] One object of the present invention is to provide a lens driving assembly, a chip driving assembly, and a camera module, wherein the lens driving assembly enables the camera module to focus and stabilize.

[0006] One object of the present invention is to provide a lens driving assembly, a chip driving assembly, and a camera module, wherein the lens driving assembly is capable of driving an optical lens of the camera module to translate, and the chip driving assembly is capable of driving a photosensitive component of the camera module to translate and / or rotate, thereby improving the image stabilization effect of the camera module.

[0007] One object of the present invention is to provide a lens driving assembly, a chip driving assembly, and a camera module, wherein while the lens driving assembly drives the optical lens to translate, the chip driving assembly can drive the photosensitive assembly to move and / or rotate, thereby significantly improving the image stabilization effect of the camera module.

[0008] One object of the present invention is to provide a lens driving component, a chip driving component, and a camera module, wherein the lens driving component and the chip driving component can be magnetically isolated, thereby avoiding magnetic interference between the two and ensuring the reliability and stability of the camera module.

[0009] According to one aspect of the present invention, a lens driving assembly is provided, comprising:

[0010] One lens focuses on the outer frame;

[0011] A lens focusing inner frame, wherein the lens focusing inner frame is suspended to the side of the lens focusing outer frame, wherein the lens focusing inner frame has a receiving cavity.

[0012] A lens stabilization carrier, wherein the lens stabilization carrier is suspended in the receiving cavity of the inner frame of the lens stabilization;

[0013] A lens focusing drive unit, wherein the lens focusing drive unit includes at least one corresponding lens focusing magnet and at least one lens focusing coil, the lens focusing magnet being disposed in one of the lens focusing outer frame and the lens focusing inner frame, and the lens focusing coil being disposed in the other of the lens focusing outer frame and the lens focusing inner frame; and

[0014] A lens stabilization drive unit, wherein the lens stabilization drive unit includes at least two corresponding lens stabilization magnets and at least two lens stabilization coils, wherein the lens stabilization magnets are disposed in one of the lens focusing inner frame and the lens stabilization carrier, and the lens stabilization coils are disposed in the other of the lens focusing inner frame and the lens stabilization carrier; wherein the center of the lens stabilization magnets is higher than the center of the lens focusing magnets.

[0015] According to one embodiment of the present invention, the height position of the lens stabilization magnet is lower than the height position of the lens focusing magnet.

[0016] According to one embodiment of the present invention, the lens stabilization magnet is disposed on the top surface of the lens stabilization carrier, and the lens stabilization coil is disposed on the bottom surface of the inner frame of the lens focusing inner frame.

[0017] According to one embodiment of the present invention, the lens drive assembly further includes at least two lens stabilization position sensing elements, wherein each lens stabilization position sensing element is disposed on the bottom surface of the inner frame of the lens focusing inner frame, and each lens stabilization position sensing element corresponds to each lens stabilization magnet.

[0018] According to one embodiment of the present invention, at least one of the lens stabilization position sensing elements is disposed in the middle of the lens stabilization coil so as to be surrounded by the lens stabilization coil.

[0019] According to one embodiment of the present invention, the lens focusing magnet is disposed on a side of the inner lens focusing frame of the inner lens focusing frame, and the lens focusing coil is disposed on the outer lens focusing frame.

[0020] According to one embodiment of the present invention, the lens driving assembly further includes at least one lens focusing sensing unit, the lens focusing sensing unit including a lens focusing sensing magnet and a lens focusing position sensing element, the lens focusing sensing magnet being disposed on the side of the inner lens focusing frame of the inner lens focusing frame, the lens focusing position sensing element being disposed on the outer lens focusing frame, and the lens focusing position sensing element corresponding to the lens focusing sensing magnet.

[0021] According to one embodiment of the present invention, the lens driving assembly further includes at least one lens focus position sensing element, wherein the lens focus position sensing element is disposed on the lens focus outer frame, and the lens focus position sensing element corresponds to the lens focus magnet.

[0022] According to one embodiment of the present invention, the lens driving assembly further includes at least one lens stabilization magnetic unit and one lens stabilization support unit, wherein the lens stabilization magnetic unit is disposed on the top of the inner lens stabilization frame of the inner lens stabilization frame, and the lens stabilization magnetic unit and the lens stabilization magnet correspond to each other to generate a magnetic attraction force in the height direction between them, wherein the lens stabilization support unit is disposed between the lens stabilization carrier and the top of the inner lens focusing frame of the inner lens focusing frame, thereby suspending the lens stabilization carrier in the receiving cavity of the inner lens focusing frame.

[0023] According to one embodiment of the present invention, the lens stabilization support unit includes at least three lens stabilization tracks and at least three lens stabilization balls, wherein each lens stabilization track includes a lower groove track and an upper groove track, the lower groove track is formed on the top surface of the lens stabilization carrier, the upper groove track is formed on the bottom surface of the inner frame of the lens focusing inner frame, the lower groove track and the upper groove track correspond to each other and their extending directions are perpendicular to each other, wherein the bottom and top of the lens stabilization balls are respectively slidably held in the lower groove track and the upper groove track.

[0024] According to one embodiment of the present invention, the lens driving assembly further includes at least one lens focusing magnetic unit and a lens focusing support unit, wherein the lens focusing magnetic unit is disposed on the lens focusing outer frame, and the lens focusing magnetic unit and the lens focusing magnet correspond to each other to generate a horizontal magnetic attraction between them, wherein the lens focusing support unit is disposed between the lens focusing outer frame and the lens focusing inner frame side portion, thereby suspending the lens focusing inner frame to the side portion of the lens focusing outer frame.

[0025] According to one embodiment of the present invention, the lens focusing support unit includes at least two lens focusing tracks and at least two lens image stabilization balls, wherein each lens focusing track includes an inner groove track and an outer groove track, the inner groove track being formed on the side of the inner lens focusing frame, the outer groove track being formed on the outer lens focusing frame, the inner groove track and the outer groove track corresponding to each other and extending in the same direction, wherein the inner and outer sides of the lens focusing balls are respectively rotatably held in the inner groove track and the outer groove track.

[0026] According to one embodiment of the present invention, the lens focusing support unit includes four lens stabilization balls, and each lens focusing track is provided with two lens stabilization balls.

[0027] According to one embodiment of the present invention, the lens stabilization drive unit includes two lens stabilization magnets, and the included angle formed between the extending directions of the two lens stabilization magnets is less than 180°.

[0028] According to one embodiment of the present invention, the angle formed between the extending directions of the two lens stabilizing magnets is 90°, and the two lens stabilizing magnets are axially symmetrical.

[0029] According to one embodiment of the present invention, the lens stabilization drive unit includes four lens stabilization magnets, two of which are arranged side by side on the far side of the lens stabilization carrier, and the other two are respectively arranged on the two sides of the lens stabilization carrier.

[0030] According to another aspect of the invention, the invention further provides a camera module comprising:

[0031] One photosensitive component;

[0032] An optical lens, wherein the optical lens is positioned within the light-sensitive path of the photosensitive element; and

[0033] A lens driving assembly, wherein the lens driving assembly further includes:

[0034] One lens focuses on the outer frame;

[0035] A lens focusing inner frame, wherein the lens focusing inner frame is suspended to the side of the lens focusing outer frame, wherein the lens focusing inner frame has a receiving cavity.

[0036] A lens stabilization carrier, wherein the lens stabilization carrier is suspended in the receiving cavity of the inner frame of the lens stabilization;

[0037] A lens focusing drive unit, wherein the lens focusing drive unit includes at least one corresponding lens focusing magnet and at least one lens focusing coil, the lens focusing magnet being disposed in one of the lens focusing outer frame and the lens focusing inner frame, and the lens focusing coil being disposed in the other of the lens focusing outer frame and the lens focusing inner frame; and

[0038] A lens stabilization drive unit, wherein the lens stabilization drive unit includes at least two corresponding lens stabilization magnets and at least two lens stabilization coils, wherein the lens stabilization magnets are disposed in one of the lens focusing inner frame and the lens stabilization carrier, and the lens stabilization coils are disposed in the other of the lens focusing inner frame and the lens stabilization carrier; wherein the center of the lens stabilization magnets is higher than the center of the lens focusing magnets; wherein the lens stabilization carrier has a carrier channel, and the optical lens is disposed in the carrier channel of the lens stabilization carrier. Attached Figure Description

[0039] Figure 1A This is a perspective view of a camera module according to a preferred embodiment of the present invention.

[0040] Figure 1B A cross-sectional view of the camera module is shown.

[0041] Figure 2A perspective view of a lens driving component of the camera module is shown.

[0042] Figure 3A and Figure 3B Exploded views of the lens drive assembly of the camera module from different perspectives are shown.

[0043] Figure 4 yes Figure 3B A magnified diagram of a local location.

[0044] Figure 5A A cross-sectional view of one location of the lens drive assembly of the camera module is shown.

[0045] Figure 5B yes Figure 5A A magnified diagram of a local location.

[0046] Figure 6A A cross-sectional view of another location of the lens drive assembly of the camera module is shown.

[0047] Figure 6B yes Figure 6A A magnified diagram of a local location.

[0048] Figure 7A A cross-sectional view of another location of the lens drive assembly of the camera module is shown.

[0049] Figure 7B yes Figure 7A A magnified diagram of a local location.

[0050] Figure 8 A perspective view of a chip driver component of the camera module is shown.

[0051] Figure 9A and Figure 9B Exploded views of the chip driver component of the camera module from different perspectives are shown.

[0052] Figure 10A and Figure 10B Cross-sectional views of different locations of the chip driver component of the camera module are shown.

[0053] Figure 11 A perspective view of a partial structure of the chip driver assembly of the camera module is shown.

[0054] Figure 12 A top view of a partial structure of the chip driver assembly of the camera module is shown.

[0055] Figure 13 A top view of a partial structure of a modified example of the chip driver assembly of the camera module is shown.

[0056] Figure 14A A cross-sectional view of a location is shown for a modified example of the lens drive assembly of the camera module.

[0057] Figure 14B yes Figure 14A A magnified diagram of a local location.

[0058] Figure 15A and Figure 15B Exploded views of the lens drive assembly of the camera module from different perspectives are shown.

[0059] Figure 16A and Figure 16B Exploded views of the other lens drive component of the camera module from different perspectives are shown.

[0060] Figure 16C A perspective view of a partial structure of the lens drive assembly of the camera module is shown.

[0061] Figure 17A A cross-sectional view of another location of the lens drive assembly of the camera module is shown.

[0062] Figure 17B yes Figure 17A A magnified diagram of a local location.

[0063] Figure 18A A cross-sectional view of another location of the lens drive assembly of the camera module is shown.

[0064] Figure 18B yes Figure 18A A magnified diagram of a local location.

[0065] Figure 19A A cross-sectional view of another location of the lens drive assembly of the camera module is shown.

[0066] Figure 19B yes Figure 19A A magnified diagram of a local location.

[0067] Figure 20A A cross-sectional view of another location of the lens drive assembly of the camera module is shown.

[0068] Figure 20B yes Figure 20A A magnified diagram of a local location.

[0069] Figure 21A and Figure 21B Exploded views from different perspectives of another driving component of the camera module are shown.

[0070] Figure 22A and Figure 22B Cross-sectional views of different locations of the chip driver component of the camera module are shown.

[0071] Figure 23 A cross-sectional view of a modified example of the chip driver assembly of the camera module is shown.

[0072] Figure 24 An exploded view of another variant example of the chip driver assembly of the camera module is shown.

[0073] Figure 25 An exploded view of another variant example of the chip driver assembly of the camera module is shown.

[0074] Figure 26 An exploded view of another variant example of the chip driver assembly of the camera module is shown.

[0075] Figure 27A The diagram shows the current direction and force direction of a stabilization movable part of the chip driver assembly of the camera module when it translates in the X-axis direction.

[0076] Figure 27B yes Figure 27A A cross-sectional view of position AA.

[0077] Figure 28A The diagram shows the current direction and force direction of the image stabilization movable part of the chip driver assembly of the camera module when it translates in the Y-axis direction.

[0078] Figure 28B yes Figure 28A A cross-sectional view of the BB position.

[0079] Figure 29A The diagram shows the direction of current and force when the image stabilization movable part of the chip driver assembly of the camera module rotates about the Z-axis.

[0080] Figure 29B yes Figure 29A A cross-sectional view of the BB position.

[0081] Figure 30 A cross-sectional view of a modified example of the camera module is shown. Detailed Implementation

[0082] Before detailing any embodiment of the invention, it should be understood that the invention is not limited in its application to the details of the construction and arrangement of the components set forth in the following description or illustrated in the following figures. The invention can have other embodiments and can be practiced or carried out in various ways. Furthermore, it should be understood that the wording and terminology used herein are for descriptive purposes and should not be considered limiting. The use of “comprising,” “including,” or “having,” and variations thereof is intended to cover the items set forth below and their equivalents, as well as any additional items. Unless otherwise specified or limited, the terms “installation,” “connection,” “support,” and “linkage,” and variations thereof are used broadly and cover both direct and indirect installation, connection, support, and linking. Moreover, “connection” and “linkage” are not limited to physical or mechanical connections or links.

[0083] Furthermore, firstly, in the disclosure of this invention, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting this invention. Secondly, the term "a" should be understood as "at least one" or "one or more," that is, in one embodiment, the number of an element can be one, while in another embodiment, the number of the element can be multiple. The term "a" should not be construed as a limitation on the quantity.

[0084] Referring to Figures 1 to 12 of the accompanying drawings in the specification of this invention Figure 12 A preferred embodiment of the present invention will be disclosed and described in the following description, wherein the camera module includes a lens assembly 20, a photosensitive assembly 30, and a lens driving assembly 40. The lens assembly 20 includes an optical lens 21, which is disposed on the lens driving assembly 40 to maintain the optical lens 21 in the photosensitive path of the photosensitive assembly 30. The lens driving assembly 40 is configured to drive the optical lens 21 to translate in order to achieve image stabilization of the camera module, and to drive the optical lens 21 to move along the optical axis of the camera module to achieve focusing of the camera module.

[0085] Preferably, referring to Figure 1 and Figure 8 The camera module further includes a chip driving component 10, wherein the photosensitive component 30 is drivably disposed on the chip driving component 10 so that the photosensitive component 30 is driven to move by the chip driving component 10 to achieve image stabilization of the camera module.

[0086] In other words, in this specific example of the camera module of the present invention, the chip driving component 10 is configured to drive the photosensitive component 30 to move, and the lens driving component 40 is configured to drive the optical lens 21 to move, thereby greatly improving the image stabilization effect of the camera module.

[0087] The lens drive assembly 40 includes a lens stabilization carrier 410, a lens focusing inner frame 420, and a lens focusing outer frame 430. The optical lens 21 is disposed on the lens stabilization carrier 410. The lens stabilization carrier 410 is drivably connected to the lens focusing inner frame 420. The lens focusing inner frame 420 is drivably connected to the lens focusing outer frame 430. The lens focusing outer frame 430 can be directly or indirectly disposed on the photosensitive assembly 30 so that the lens drive assembly 40 maintains the light-sensing path of the optical lens 21 on the photosensitive assembly 30.

[0088] When the inner focusing frame 420 remains stationary and the lens stabilization carrier 410 is driven to move relative to the inner focusing frame 420, the lens stabilization carrier 410 can drive the optical lens 21 to move relative to the photosensitive element 30 in a direction perpendicular to the optical axis of the camera module, thereby achieving image stabilization of the camera module; that is, the optical lens 21 can be translated. In other words, the lens stabilization carrier 410 can form a movable part of a lens stabilization section 41 of the lens drive assembly 40, thus forming a lens stabilization movable unit 411 of the lens stabilization section 41. Correspondingly, the inner focusing frame 420 can form a fixed part of the lens stabilization section 41 of the lens drive assembly 40, thus forming a lens stabilization fixed unit 412 of the lens stabilization section 41.

[0089] When the outer focusing frame 430 remains stationary and the inner focusing frame 420 is driven to move relative to the outer focusing frame 430, the inner focusing frame 420 drives the optical lens 21 to move along the optical axis of the camera module via the lens image stabilization carrier 410, thereby achieving focusing of the camera module. In other words, the inner focusing frame 420 can form a movable part of the lens focusing section 42 of the lens drive assembly 40, thus forming a movable lens focusing unit 421 of the lens focusing section 42. Correspondingly, the outer focusing frame 430 can form a fixed part of the lens focusing section 42, thus forming a fixed lens focusing unit 422 of the lens focusing section 42.

[0090] In other words, the lens driving assembly 40 includes a lens stabilization unit 41 and a lens focusing unit 42. The lens stabilization unit 41 includes a movable lens stabilization unit 411 and a fixed lens stabilization unit 412. The optical lens 21 is disposed on the movable lens stabilization unit 411. When the movable lens stabilization unit 411 is driven to move relative to the fixed lens stabilization unit 412 in a direction perpendicular to the optical axis of the camera module, the camera module achieves image stabilization. The lens focusing unit 42 includes a movable lens focusing unit 421 and a fixed lens focusing unit 422. When the movable lens focusing unit 421 is driven to move relative to the fixed lens focusing unit 422 in a direction perpendicular to the optical axis of the camera module, the camera module achieves focusing.

[0091] Specifically, the lens stabilization movable unit 411 includes the lens stabilization carrier 410, the lens stabilization fixing unit 412 includes the lens focusing inner frame 420, the lens focusing movable unit 421 includes the lens focusing inner frame 420, and the lens focusing fixing unit 422 includes the lens focusing outer frame 430. That is, the lens focusing inner frame 420 serves as part of both the lens stabilization part 41 and the lens focusing part 42. Thus, the lens driving assembly 40 has a compact structure, which helps to reduce the overall size of the camera module.

[0092] Continue to refer to the appendix Figures 3A to 7B The lens stabilization unit 41 further includes a lens stabilization drive unit 413, wherein the lens stabilization drive unit 413 includes at least two lens stabilization magnets 4131 and at least two lens stabilization coils 4132. Each lens stabilization magnet 4131 is respectively disposed on the lens stabilization carrier 410, and each lens stabilization coil 4132 is respectively disposed on the lens focusing inner frame 420. Each lens stabilization magnet 4131 and each lens stabilization coil 4132 correspond to each other. When a current is passed through each lens stabilization coil 4132 to generate a magnetic field, the magnetic field of each lens stabilization coil 4132 and the magnetic field of each lens stabilization magnet 4131 interact to drive the lens stabilization carrier 410 to move the optical lens 21 along a direction perpendicular to the optical axis of the camera module, thereby realizing the image stabilization of the camera module.

[0093] It is worth mentioning that the lens stabilization carrier 410 needs to be repositioned both during the image stabilization process and the focusing process of the camera module. Conversely, the lens focusing inner frame 420 only needs to be repositioned during the focusing process; it remains stationary during image stabilization. Therefore, by placing each lens stabilization magnet 4131 on the lens stabilization carrier 410 and each lens stabilization coil 4132 on the lens focusing inner frame 420, the camera module of the present invention simplifies the circuit design and ensures the reliability of the camera module during use.

[0094] Nevertheless, in other examples of the camera module of the present invention, each of the lens stabilization magnets 4131 of the lens stabilization drive unit 413 may be disposed in the lens focusing inner frame 420, and correspondingly, each of the lens stabilization coils 4132 may be disposed in the lens stabilization carrier 410.

[0095] Further, please refer to the appendix. Figures 3A to 4 The lens stabilization carrier 410 has a carrier top surface 4101, a carrier bottom surface 4102 opposite to the carrier top surface 4101, and a carrier channel 4103 extending from the carrier top surface 4101 to the carrier bottom surface 4102. The lens stabilization carrier 410 surrounds the optical lens 21 to allow the optical lens 21 to be disposed within the carrier channel 4103 of the lens stabilization carrier 410. Preferably, the outer wall of the optical lens 21 and the inner wall of the lens stabilization carrier 410 for forming the carrier channel 4103 are attached to fix the optical lens 21 to the lens stabilization carrier 410.

[0096] The lens focusing inner frame 420 includes a lens focusing inner frame top 4201 and a lens focusing inner frame peripheral portion 4202, and the lens focusing inner frame 420 has a receiving cavity 4203. The lens focusing inner frame top 4201 has an inner frame top surface 42011, an inner frame bottom surface 42012 opposite to the inner frame top surface 42011, and an inner frame channel 42013 extending from the inner frame top surface 42011 to the inner frame bottom surface 42012. The lens focusing inner frame peripheral portion 4202 extends integrally downward from the inner frame bottom surface 42012 of the lens focusing inner frame top 4201 to form the receiving cavity 4203 between the lens focusing inner frame top 4201 and the lens focusing inner frame peripheral portion 4202. The inner frame channel 42013 of the lens focusing inner frame top 4201 and the receiving cavity 4203 are connected. The lens stabilization carrier 410 is suspended in the receiving cavity 4203 of the lens focusing inner frame 420 and driven to move within the receiving cavity 4203 of the lens focusing inner frame 420. The bottom surface 42012 of the inner frame top 4201 of the lens focusing inner frame corresponds to the carrier top surface 4101 of the lens stabilization carrier 410. The optical lens 21 is movably held in the inner frame channel 42013 of the lens focusing inner frame top 4201, so that the lens focusing inner frame top 4201 surrounds the optical lens 21.

[0097] It is understood that there is a gap between the inner wall of the top 4201 of the lens focusing inner frame that defines the inner frame channel 42013 and the outer wall of the optical lens 21, so as to allow the optical lens 21 to translate and achieve image stabilization of the camera module.

[0098] Each lens stabilization magnet 4131 of the lens stabilization drive unit 413 is respectively disposed on the top surface 4101 of the lens stabilization carrier 410, and each lens stabilization coil 4132 is respectively disposed on the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame, thus:

[0099] On the one hand, each of the lens stabilization magnets 4131 and each of the lens stabilization coils 4132 can be adjacent to each other to ensure that the magnetic field generated by the lens stabilization coil 4132 when it is energized and the magnetic field of the lens stabilization magnet 4131 can interact, thereby providing sufficient driving force to drive the lens stabilization carrier 410 to move the optical lens 21 in a direction perpendicular to the optical axis of the camera module, so as to achieve the stabilization of the camera module;

[0100] On the other hand, each of the lens stabilization magnets 4131 and each of the lens stabilization coils 4132 can be held between the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame, so that each of the lens stabilization magnets 4131 and each of the lens stabilization coils 4132 is far away from the photosensitive assembly 30, thereby reducing the magnetic interference of the magnetic field overflowing from the lens stabilization magnets 4131 toward the photosensitive assembly 30 on the circuit board, photosensitive element and other components of the photosensitive assembly 30 and the chip driving assembly 10.

[0101] Preferably, the lens stabilization carrier 410 further has at least two stabilization magnet grooves 4104, each of which extends from the top surface 4101 of the carrier towards the bottom surface 4102 of the carrier. Each lens stabilization magnet 4131 is embedded in each of the stabilization magnet grooves 4104 of the lens stabilization carrier 410, thus each lens stabilization magnet 4131 is disposed in the lens stabilization carrier 410. Furthermore, by embedding each lens stabilization magnet 4131 into each of the stabilization magnet grooves 4104 of the lens stabilization carrier 410, the height of the lens stabilization magnet 4131 can be reduced, thereby facilitating a reduction in the height of the lens drive assembly 40.

[0102] It is worth mentioning that, by embedding each of the lens stabilization magnets 4131 into each of the stabilization magnet grooves 4104 of the lens stabilization carrier 410, the top surface of the lens stabilization magnet 4131 can be lower than the carrier top surface 4101 of the lens stabilization carrier 410, or the top surface of the lens stabilization magnet 4131 can be flush with the carrier top surface 4101 of the lens stabilization carrier 410. It is understood that, by embedding each of the lens stabilization magnets 4131 into each of the stabilization magnet grooves 4104 of the lens stabilization carrier 410, the top surface of the lens stabilization magnet 4131 can be higher than the carrier top surface 4101 of the lens stabilization carrier 410.

[0103] Alternatively, in other examples of the camera module of the present invention, each of the lens stabilization magnets 4131 may be directly attached to the top surface 4101 of the lens stabilization carrier 410.

[0104] Continue to refer to Figure 1 to... Figure 12In this specific example of the camera module of the present invention, the lens stabilization drive unit 413 comprises two lens stabilization magnets 4131 and two lens stabilization coils 4132. The two lens stabilization magnets 4131 are fixed at the corners of the two ends on the same side of the lens stabilization carrier 410, and are arranged axially symmetrically. Thus, the two lens stabilization magnets 4131 provide a symmetrical magnetic field, enabling the lens stabilization drive unit 413, composed of the two lens stabilization magnets 4131 and the two lens stabilization coils 4132, to provide a driving force perpendicular to the optical axis of the camera module.

[0105] In other words, the two lens stabilization magnets 4131 and the two lens stabilization coils 4132 of the lens stabilization drive unit 413 can cooperate to provide driving force along the X-axis and Y-axis directions, so as to drive the lens stabilization carrier 410 to move relative to the lens focusing inner frame 420 in the plane defined by the X-axis and Y-axis, thereby realizing the image stabilization of the camera module. It can be understood that the optical axis of the camera module is perpendicular to the plane defined by the X-axis and Y-axis.

[0106] It is understood that for the lens stabilization carrier 410, a stabilization magnet groove 4104 is provided at the corner of each of the two ends on the same side, and the two stabilization magnet grooves 4104 are arranged symmetrically. Thus, the two lens stabilization magnets 4131 embedded in the two stabilization magnet grooves 4104 of the lens stabilization carrier 410 are arranged symmetrically.

[0107] Preferably, refer to the appendix Figure 3A and Figure 3B The extension directions of the two lens stabilization magnets 4131 in the lens stabilization drive unit 413 form an angle of 45° with the X-axis, meaning the extension directions of the two lens stabilization magnets 4131 are perpendicular to each other. This allows the lens stabilization drive unit 413 to provide a symmetrical magnetic field, smoothly driving the lens stabilization carrier 410 to move relative to the lens focusing inner frame 420 in the plane defined by the X and Y axes, thereby achieving image stabilization of the camera module. Furthermore, the lens stabilization drive unit 413 provides sufficient driving force to drive the lens stabilization carrier 410 to move relative to the lens focusing inner frame 420 in the plane defined by the X and Y axes, thereby improving the sensitivity of the camera module during image stabilization.

[0108] Accordingly, the extension direction of the two lens stabilization coils 4132 of the lens stabilization drive unit 413 is 45° with the X-axis, and each lens stabilization coil 4132 corresponds to each lens stabilization magnet 4131, so as to ensure that the lens stabilization drive unit 413 can provide sufficient driving force when each lens stabilization coil 4132 is powered.

[0109] Alternatively, in other examples of the camera module of the present invention, the angle between the extending direction of the two lens stabilization magnets 4131 of the lens stabilization drive unit 413 and the X-axis can be other angles less than 90°.

[0110] Continue to refer to Figure 1 to... Figure 12 The lens stabilization unit 41 further includes a lens stabilization circuit board 414. Two lens stabilization coils 4132 are respectively fixed and electrically connected to the lens stabilization circuit board 414. The lens stabilization circuit board 414 is fixed to the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame. Thus, the two lens stabilization coils 4132 are disposed on the lens focusing inner frame 420 through the lens stabilization circuit board 414. The camera module supplies power to each lens stabilization coil 4132 through the lens stabilization circuit board 414 to generate a magnetic field. Thus, the magnetic field of each lens stabilization coil 4132 and the magnetic field of each lens stabilization magnet 4131 interact to drive the lens stabilization carrier 410 to move relative to the lens focusing inner frame 420 in a plane defined by the X and Y axes, thereby achieving image stabilization of the camera module.

[0111] Preferably, the lens stabilization circuit board 414 is a flexible circuit board (FPC), so that the lens stabilization circuit board 414 has a thinner thickness, which helps to reduce the overall height of the lens drive assembly 40.

[0112] Continue to refer to Figure 1 to... Figure 12 The lens stabilization unit 41 further includes at least two lens stabilization position sensing elements 415. Each lens stabilization position sensing element 415 is disposed in the middle of each lens stabilization coil 4132 and electrically connected to the lens stabilization circuit board 414. Thus, each lens stabilization position sensing element 415 senses the translation direction and distance of the optical lens 21 driven by the lens stabilization carrier 410 by sensing the position of each lens stabilization magnet 4131. Specifically, the lens stabilization position sensing element 415 is mounted on the lens stabilization circuit board 414, thus being disposed and electrically connected to the lens stabilization circuit board 414.

[0113] Preferably, the lens stabilization unit 41 includes two lens stabilization position sensing elements 415, each of which is held between and surrounded by a lens stabilization coil 4132. This ensures that, on the one hand, the lens stabilization unit 41 ensures that the lens stabilization position sensing element 415 is directly facing the lens stabilization magnet 4131, thereby improving sensing accuracy. On the other hand, by placing the lens stabilization position sensing element 415 in the middle of the lens stabilization coil 4132, the structure of the lens stabilization unit 41 can be made more compact, thus optimizing the structure of the lens drive assembly 40.

[0114] Alternatively, in other examples of the camera module of the present invention, the lens stabilization position sensing element 415 may be located outside the lens stabilization coil 4132.

[0115] It is worth noting that the type of the lens stabilization position sensing element 415 is not limited in the camera module of the present invention. For example, the lens stabilization position sensing element 415 may be, but is not limited to, a Hall element.

[0116] Continue to refer to Figure 1 to... Figure 12 The lens stabilization unit 41 further includes at least one lens stabilization magnetic unit 416 and one lens stabilization support unit 417. The lens stabilization magnetic unit 416 is disposed on the top 4201 of the inner lens focusing frame of the lens focusing inner frame 420, and each lens stabilization magnet 4131 of the lens stabilization drive unit 413 corresponds to the lens stabilization magnetic unit 416. Thus, the lens stabilization magnetic unit 416 and the lens stabilization magnet 4131 attract each other due to magnetic attraction, so that the lens stabilization carrier 410 and the top 4201 of the inner lens focusing frame of the lens focusing inner frame 420 tend to move closer to each other. The lens stabilization support unit 417 is disposed between the top surface 4101 of the lens stabilization carrier 410 and the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame, to prevent the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame 420 from fitting together. With this structure, the lens stabilization carrier 410 is suspended in the receiving cavity 4203 of the lens focusing inner frame 420.

[0117] Furthermore, the lens stabilization support unit 417 includes at least three lens stabilization tracks 4171 and at least three lens stabilization balls 4172. Each lens stabilization track 4171 includes a lower groove track 41711 and an upper groove track 41712, wherein the lower groove track 41711 is formed on the top surface 4101 of the lens stabilization carrier 410, and the upper groove track 41712 is formed on the bottom surface 42012 of the inner frame of the lens focusing inner frame top 4201 of the lens focusing inner frame 420. The positions of the lower groove track 41711 and the upper groove track 41712 correspond to each other, and the extension direction of the lower groove track 41711 and the extension direction of the upper groove track 41712 are perpendicular to each other, forming a cross shape. The bottom and top of the lens stabilization ball 4172 are respectively housed in the lower groove track 41711 and the upper groove track 41712 of the lens stabilization track 4171, and are allowed to roll along the lower groove track 41711 and the upper groove track 41712, so that the lens stabilization ball 4172 is rotatably held between the lens stabilization carrier 410 and the top of the lens focusing inner frame 4201, so as to prevent the lens stabilization carrier 410 and the top of the lens focusing inner frame 4201 of the lens focusing inner frame 420 from sticking to each other, thereby suspending the lens stabilization carrier 410 in the receiving cavity 4203 of the lens focusing inner frame 420. Furthermore, by allowing the extension directions of the lower groove track 41711 and the upper groove track 41712 to be perpendicular to each other, interference can be avoided when the lens stabilization carrier 410 is driven by the lens stabilization drive unit 413 to translate in the plane defined by the X and Y axes.

[0118] Preferably, the lens stabilization balls 4172 of the lens stabilization support unit 417 have the same diameter, which can ensure the flatness of the top surface 4101 of the lens stabilization carrier 410 and the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame.

[0119] In Figure 1 to Figure 12In this specific example of the camera module of the present invention shown, the lens stabilization support unit 417 includes four lens stabilization rails 4171 and four lens stabilization balls 4172. The lower grooved rails 41711 of the four lens stabilization rails 4171 are respectively formed at the four corners of the lens stabilization carrier 410, and the upper grooved rails 41712 of the four lens stabilization rails 4171 are respectively formed at the four corners of the top 4201 of the lens focusing inner frame. Thus, the four lens stabilization balls 4172 are respectively held between the lens stabilization carrier 410 and the top 4201 of the lens focusing inner frame at the four corners of the lens stabilization carrier 410. That is, these lens stabilization balls 4172 can be spaced around the optical lens 21 at intervals, so that: on the one hand, the lens stabilization drive unit 413 can smoothly drive the lens stabilization carrier 410 to move the optical lens 21 relative to the lens focusing inner frame 420 in the plane defined by the X and Y axes; on the other hand, during the movement of the optical lens 21 driven by the lens stabilization carrier 410, the lens stabilization carrier 410 and the optical lens 21 can be prevented from tilting.

[0120] Continue to refer to Figure 1 to... Figure 12 The lens stabilization unit 41 further includes four sets of lens stabilization and anti-collision units 418, which are disposed on the outer wall of the lens stabilization carrier 410 to limit the translation range of the lens stabilization carrier 410 within the receiving cavity 4203 of the lens focusing inner frame 420.

[0121] Preferably, the outer wall of the lens stabilization carrier 410 has four "V"-shaped carrier grooves 4105, and the angle between the extension direction of the two groove walls 4106 of the lens stabilization carrier 410 that form the carrier grooves 4105 and the X-axis is 45°. Each group of lens stabilization and anti-collision units 418 includes two anti-collision protrusions 4180. Each anti-collision protrusion 4180 of the lens stabilization and anti-collision unit 418 is respectively disposed on each groove wall 4106 of the lens stabilization carrier 410, so that the angle between the extension direction of each anti-collision protrusion 4180 and the X-axis is 45°. Accordingly, the lens focusing inner frame 4202 of the lens focusing inner frame 420 includes four "V"-shaped limiting protrusions 42021, which extend integrally downward from the top 4201 of the lens focusing inner frame, and the angle between the extending direction of the two limiting walls 42022 of the lens focusing inner frame 4202 that form the limiting protrusions 42021 and the X-axis is 45°. Each of the limiting protrusions 42021 of the lens focusing inner frame periphery 4202 is respectively disposed in each of the carrier grooves 4104 of the lens image stabilization carrier 410. Each of the image stabilization and anti-collision protrusions 4180 is respectively facing the two limiting walls 42022 of the lens focusing inner frame periphery 4202 for forming the limiting protrusion 42021, and there is a gap between each image stabilization and anti-collision protrusion 4180 and each limiting wall 42022. Thus, on the one hand, the lens image stabilization carrier 410 is allowed to translate within the receiving cavity 4203 of the lens focusing inner frame 420 to achieve image stabilization of the camera module. On the other hand, the image stabilization and anti-collision protrusions 4180 prevent the lens focusing inner frame periphery 4202 and the lens image stabilization carrier 410 from directly colliding.

[0122] Continue to refer to the appendix Figure 3A and Figure 3B In this specific example of the camera module of the present invention, the four sets of lens stabilization and anti-collision units 418 are sequentially defined as a first stabilization and anti-collision unit 4181, a second stabilization and anti-collision unit 4182, a third stabilization and anti-collision unit 4183, and a fourth stabilization and anti-collision unit 4184, respectively, in a counterclockwise direction. The first stabilization and anti-collision unit 4181 and the second stabilization and anti-collision unit 4182 are located at opposite ends of one lens stabilization magnet 4131, and the second stabilization and anti-collision unit 4182 and the fourth stabilization and anti-collision unit 4184 are located at opposite ends of another lens stabilization magnet 4131. Preferably, the first stabilization and anti-collision unit 4181 and the fourth stabilization and anti-collision unit 4184 are arranged axially symmetrically, and the second stabilization and anti-collision unit 4182 and the third stabilization and anti-collision unit 4183 are also arranged axially symmetrically.

[0123] Optionally, in other examples of the camera module of the present invention, each of the anti-shake and anti-collision protrusions 4180 of the lens anti-shake and anti-collision unit 418 is respectively disposed on each of the limiting protrusions 42021 of the lens focusing inner frame periphery 4202, and the anti-shake and anti-collision protrusions 4180 are held between the limiting wall 42022 and the groove wall 4106.

[0124] Optionally, in other examples of the camera module of the present invention, each of the anti-shake and anti-collision protrusions 4180 of at least one set of the lens anti-shake and anti-collision units 418 is respectively disposed on each of the groove walls 4106 of the lens anti-shake carrier 410, and each of the additional lens anti-shake and anti-collision protrusions 4180 of the lens anti-shake and anti-collision units 418 is respectively disposed on each of the limiting protrusions 42021 of the lens focusing inner frame periphery 4202, and the anti-shake and anti-collision protrusions 4180 are held between the limiting wall 42022 and the groove wall 4106.

[0125] Continue to refer to Figure 1 to... Figure 12 The lens focusing unit 42 further includes a lens focusing drive unit 423, wherein the lens focusing drive unit 423 includes at least one lens focusing magnet 4231 and at least one lens focusing coil 4232. Each lens focusing magnet 4231 is fixed to the periphery 4202 of the inner lens focusing frame 420, and each lens focusing coil 4232 is fixed to the outer lens focusing frame 430. Corresponding to each of the lens focusing coils 4232, when an electric current is passed through each of the lens focusing coils 4232 to generate a magnetic field, the magnetic field of each lens focusing coil 4232 interacts with the magnetic field of each image stabilization focusing magnet 4231 to drive the lens focusing inner frame 420 to move the lens image stabilization carrier 410 and the optical lens 21 along the optical axis of the camera module, thereby achieving focusing of the camera module.

[0126] It is worth mentioning that during the focusing process of the camera module, the outer focusing frame 430 remains stationary, while the inner focusing frame 420 needs to be driven to move relative to the outer focusing frame 430. Based on this, the camera module of the present invention simplifies the circuit design of the camera module and ensures the reliability of the camera module during use by placing each lens focusing magnet 4231 in the inner focusing frame 420 and each lens focusing coil 4232 in the outer focusing frame 430.

[0127] Nevertheless, in other examples of the camera module of the present invention, each of the lens focusing magnets 4231 of the lens focusing drive unit 423 may be disposed on the lens focusing outer frame 430, and correspondingly, each of the lens focusing coils 4232 may be disposed on the lens focusing inner frame periphery 4202 of the lens focusing inner frame 420.

[0128] Continue to refer to the appendix Figure 3A and Figure 3B The lens focusing inner frame 4200 further includes a lens focusing inner frame side portion 42023, which extends integrally downward from the top 4201 of the lens focusing inner frame. Each lens focusing magnet 4231 is respectively disposed on the lens focusing inner frame side portion 42023. The lens focusing outer frame 430 and the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420 are disposed opposite to each other, so as to allow each lens focusing coil 4232 disposed on the lens focusing outer frame 430 and each lens focusing magnet 4231 disposed on the lens focusing inner frame side portion 42023 to correspond to each other.

[0129] Specifically, in Figures 1 to 12 Figure 12 In this specific example of the camera module of the present invention shown, the lens focusing drive unit 423 has two lens focusing magnets 4231 and two lens focusing coils 4232. The two lens focusing magnets 4231 are respectively fixed to the two ends of the same side of the inner lens focusing frame 42023, and correspondingly, the two lens focusing coils 4232 are respectively fixed to the two ends of the outer lens focusing frame 430, so that the two lens focusing coils 4232 and the two lens focusing magnets 4231 correspond to each other.

[0130] Preferably, the peripheral portion 4202 of the lens focusing inner frame further has two focusing magnet grooves 42024, which are respectively formed at two ends on the same side of the side portion 42023 of the lens focusing inner frame. Each lens focusing magnet 4231 is embedded in each of the focusing magnet grooves 42024 of the peripheral portion 4202 of the lens focusing inner frame, thus each lens focusing magnet 4231 is respectively disposed in the side portion 42023 of the lens focusing inner frame. Furthermore, by embedding each lens focusing magnet 4231 into each of the focusing magnet grooves 42024 of the peripheral portion 4202 of the lens focusing inner frame, the length and width dimensions of the lens drive assembly 40 can be reduced.

[0131] It is worth mentioning that, by embedding each of the lens focusing magnets 4231 into each of the focusing magnet grooves 42024 of the peripheral portion 4202 of the lens focusing inner frame, the lens focusing magnet 4231 can protrude from the side portion 42023 of the lens focusing inner frame, or the lens focusing magnet 4231 can be flush with the side portion 42023 of the lens focusing inner frame, or the lens focusing magnet 4231 can be recessed into the side portion 42023 of the lens focusing inner frame.

[0132] Alternatively, in other examples of the camera module of the present invention, each of the lens focusing magnets 4231 may be directly attached to the surface of the lens focusing inner frame side portion 42023.

[0133] Continue to refer to Figure 1 to... Figure 12 The lens focusing unit 42 further includes a lens focusing circuit board 424. Two lens focusing coils 4232 are respectively fixed and electrically connected to the lens focusing circuit board 424. The lens focusing circuit board 424 is fixed to the lens focusing outer frame 430. Thus, the two lens focusing coils 4232 are fixed to the lens focusing outer frame 430 through the lens focusing circuit board 424. The camera module supplies power to each lens focusing coil 4232 through the lens focusing circuit board 424 to generate a magnetic field. Thus, the magnetic field of each lens focusing coil 4232 and the magnetic field of each lens focusing magnet 4231 interact to drive the lens focusing inner frame 420, thereby moving the lens image stabilization carrier 410 and the optical lens 21 along the optical axis of the camera module, thereby achieving focusing of the camera module.

[0134] Specifically, the lens focusing frame 430 has an outer frame 4301, an inner frame 4302 opposite to the outer frame 4301, and two focusing coil through holes 4303. The two focusing coil through holes 4303 are axially symmetrical and extend from the outer frame 4301 to the inner frame 4302 at opposite ends of the lens focusing frame 430. The lens focusing circuit board 424 is attached to the outer frame 4301 of the lens focusing frame 430, and each lens focusing coil 4232 is held in each focusing coil through hole 4303 of the lens focusing frame 430. Thus, the two lens focusing coils 4232 are fixed to the lens focusing frame 430 by the lens focusing circuit board 424.

[0135] Preferably, the lens focusing circuit board 424 is a flexible printed circuit board (FPC) to help reduce the length and width of the lens drive assembly 40.

[0136] Furthermore, the lens focusing circuit board 424 includes a mounting portion 4241, on which two lens focusing coils 4232 are respectively mounted, so that the two lens focusing coils 4232 are respectively fixed and electrically connected to the lens focusing circuit board 424, and the mounting portion 4241 is mounted on the outer side 4301 of the lens focusing outer frame 430.

[0137] The lens focusing circuit board 424 further includes at least one connecting portion 4242, which integrally extends from the mounting portion 4241 and is used for electrical connection to the lens image stabilization circuit board 414. For example, in Figures 1 to 2010... Figure 12 In this specific example of the camera module shown, the lens focusing circuit board 424 has one connecting portion 4242, which is approximately "U"-shaped. The connecting portion 4242 is arranged around the receiving cavity 4203 of the lens focusing inner frame 420 on the bottom surface 42012 of the inner frame of the lens focusing inner frame 420, and the free end of the connecting portion 4242 is connected to the bottom surface 42012 of the inner frame of the lens focusing inner frame 420. Thus, the length of the connecting portion 4242 can be increased, and correspondingly, the deformation range of the connecting portion 4242 can be increased.

[0138] In other words, when the lens focusing drive unit 423 drives the inner lens focusing frame 420 to move relative to the outer lens focusing frame 430 along the optical axis of the camera module, the inner lens focusing frame 420 can cause the connecting portion 4242 of the lens focusing circuit board 424 to deform. By setting the connecting portion 4242 to a "U" shape and increasing the length of the connecting portion 4242, on the one hand, the influence of the lens focusing circuit board 424 on the movement amplitude of the inner lens focusing frame 420 can be reduced, and on the other hand, the impact on the circuit design and reliability of the lens focusing circuit board 424 can be reduced.

[0139] It is worth mentioning that the electrical connection method between the lens stabilization circuit board 414 and the lens focusing circuit board 424 is not limited in the camera module of the present invention. For example, in an optional example, after the lens stabilization circuit board 414 is attached to the bottom surface 42012 of the inner frame of the lens focusing inner frame 420 and the free end of the connecting portion 4242 of the lens focusing circuit board 424 is attached to the bottom surface 42012 of the inner frame of the lens focusing inner frame 420, the lens stabilization circuit board 414 and the free end of the connecting portion 4242 of the lens focusing circuit board 424 are connected by a connecting wire to electrically connect the lens stabilization circuit board 414 and the lens focusing circuit board 424. In another alternative example, the inner lens focusing frame 420 may have an embedded conductor (e.g., a lead wire or the lens stabilization magnetic unit 416) or a conductor may be provided on the surface of the inner lens focusing frame 420. When the lens stabilization circuit board 414 is attached to the bottom surface 42012 of the inner frame of the inner lens focusing frame 420, the conductor and the lens stabilization circuit board 414 are connected. When the free end of the connecting portion 4242 of the lens focusing circuit board 424 is attached to the bottom surface 42012 of the inner frame of the inner lens focusing frame 420, the conductor and the free end of the connecting portion 4242 are connected, thus electrically connecting the lens stabilization circuit board 414 and the lens focusing circuit board 424.

[0140] In the camera module of the present invention, the lens focusing magnet 4231 and the lens focusing coil 4232 of the lens focusing drive unit 423 are disposed opposite to each other on the outer side of the lens focusing inner frame side portion 42023, and the lens stabilization magnet 4131 and the lens stabilization coil 4132 of the lens stabilization drive unit 413 are disposed opposite to each other on the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame, and the lens stabilization magnet 4131 of the lens stabilization drive unit 413 is disposed on the lens stabilization carrier 410. In an optional example, the center of the lens stabilization magnet 4131 is higher than the center of the lens focusing magnet 4231 to increase the distance between the lens stabilization magnet 4131 and the photosensitive component 30 located below the lens drive assembly 40, thereby reducing the magnetic interference of the lens stabilization magnet 4131 to the circuit board, photosensitive element and other components of the photosensitive component 30 or to the chip drive assembly 10. Furthermore, having the center of the lens stabilization magnet 4131 higher than the center of the lens focusing magnet 4231 prevents the distance between the lens stabilization coil 4132 and the lens stabilization magnet 4131 from becoming too large, which would result in a stronger magnetic field force provided by the lens stabilization magnet 4131 to the lens stabilization coil 4132, thus reducing the stabilization effect of the lens stabilization unit 21. In another optional example, the height of the lens stabilization magnet 4131 is set lower than the height of the lens focusing magnet 4232, reducing the height of the lens stabilization carrier 410 and lowering the height of the lens focusing inner frame 420, thereby reducing the height of the lens drive assembly 40.

[0141] Continue to refer to Figure 1 to... Figure 12 The lens focusing unit 42 further includes a lens focusing sensing unit 425, wherein the lens focusing sensing unit 425 includes a lens focusing sensing magnet 4251 and a lens focusing position sensing element 4252. The lens focusing sensing magnet 4251 is fixed to the lens focusing inner frame side portion 42023 of the lens focusing inner frame 420. The lens focusing position sensing element 4252 is fixed to and electrically connected to the lens focusing circuit board 424, and the lens focusing position sensing element 4252 corresponds to the lens focusing sensing magnet 4251. The lens focusing position sensing element 4252 is adapted to obtain the position of the lens focusing inner frame 420 by sensing the position change of the lens focusing sensing magnet 4251.

[0142] It is worth noting that the type of the lens focus position sensing element 4252 is not limited in the camera module of the present invention. For example, in one alternative example, the lens focus position sensing element 4252 may be a Hall element. In another alternative example, the lens focus position sensing element 4252 may be a focus drive chip adapted to control the current of the lens focus coil 4232 while acquiring the position change of the lens focus sensing magnet 4251.

[0143] Specifically, the lens focusing inner frame 4202 of the lens focusing inner frame 420 further has a sensing magnet groove 42025, which is formed in the middle of the side portion 42023 of the lens focusing inner frame, and the lens focusing sensing magnet 4251 is embedded in the sensing magnet groove 42025 of the lens focusing inner frame 420 between the two focusing magnet grooves 42024. The lens focusing outer frame 430 has a sensing element through hole 4304, which extends from the outer side 4301 to the inner side 4302 of the outer frame in the middle of the lens focusing outer frame 430. The lens focusing position sensing element 4252 is mounted on the lens focusing circuit board 424, and the lens focusing position sensing element 4252 is held in the sensing element through hole 4304 of the lens focusing outer frame 430.

[0144] Continue to refer to Figure 1 to... Figure 12 The lens focusing unit 42 further includes at least one lens focusing magnetic unit 426 and one lens focusing support unit 427. The lens focusing magnetic unit 426 is fixed to the mounting portion 4241 of the lens focusing circuit board 424, and each lens focusing magnet 4231 of the lens focusing drive unit 423 corresponds to a lens focusing magnetic unit 426. Thus, the lens focusing magnetic unit 426 and the lens focusing magnet 4231 attract each other due to magnetic attraction, causing the peripheral portion 42023 of the inner focusing frame 420 and the outer focusing frame 430 of the inner focusing frame 420 to tend to move closer together. The lens focusing support unit 427 is disposed between the peripheral portion 42023 of the inner focusing frame 420 and the outer focusing frame 430 to prevent the side portion 42023 of the inner focusing frame 420 and the outer focusing frame 430 of the inner focusing frame 420 from fitting together. With the above structure, the inner lens focusing frame 420 is suspended on the side of the outer lens focusing frame 430.

[0145] Preferably, the lens focusing magnetic attraction unit 426 is fixed to one side of the mounting portion 4241 of the lens focusing circuit board 424 relative to the lens focusing coil 4232, so that the lens focusing coil 4232 is located between the lens focusing magnet 4231 and the lens focusing magnetic attraction unit 426.

[0146] Optionally, in other examples of the imaging module of the present invention, the lens focusing magnetic attraction unit 426 is fixed to the outer side 4301 of the lens focusing outer frame 430.

[0147] Furthermore, the lens focusing support unit 427 includes at least two lens focusing tracks 4271 and at least three lens focusing balls 4272. Each of the lens focusing tracks 4271 respectively includes an inner groove track 42711 and an outer groove track 42712. The inner groove track 42711 is formed on the side portion 42023 of the lens focusing inner frame and is located outside the lens focusing magnet 4231. The outer groove track 42712 is formed on the inner side 4302 of the lens focusing outer frame 430 and is located outside the lens focusing coil 4232. And the inner groove track 42711 and the outer groove track 42712 respectively extend along the height direction of the imaging module, forming an "I" shape, that is, the inner groove track 42711 and the outer groove track 42712 respectively extend along the Z-axis direction. The inner and outer parts of the lens focusing ball 4272 are respectively accommodated in the inner groove track 42711 and the outer groove track 42712 of the lens focusing track 4271, so that the lens focusing ball 4272 is rollably held between the side portion 42023 of the lens focusing inner frame and the lens focusing outer frame 430 to prevent the side portion 42023 of the lens focusing inner frame 420 and the lens focusing outer frame 430 from being mutually adhered, thereby suspending the lens focusing inner frame 420 at the side of the lens focusing outer frame 430. And by allowing the inner groove track 412711 and the outer groove track 42712 to respectively extend along the height direction of the imaging module, the lens focusing inner frame 420 is allowed to move relative to the lens focusing outer frame 430 along the height direction of the imaging module.

[0148] Preferably, in FIGS. 1 to Figure 12In this specific example of the camera module shown, the lens focusing support unit 427 includes two lens focusing tracks 4271 and four lens focusing balls 4272. The two lens focusing tracks 4271 are arranged axially symmetrically, and each lens focusing track 4271 houses two lens focusing balls 4272. This helps to ensure that the lens focusing drive unit 423 smoothly drives the inner lens focusing frame 420 to move relative to the outer lens focusing frame 430 along the height direction of the camera module.

[0149] Preferably, the lens focusing balls 4272 of the lens focusing support unit 427 have the same diameter, which can ensure the flatness of the inner lens focusing frame side 42023 of the inner lens focusing frame 420 and the inner side 4302 of the outer frame of the outer lens focusing frame 430.

[0150] Continue to refer to the appendix Figures 3A to 4 The lens focusing track 4271 includes at least one partition 42713, which is disposed in the middle of the inner groove track 42711 to separate the two lens focusing balls 4272, thereby reducing interference between the two lens focusing balls 4272 disposed in the same lens focusing track 4271, so as to ensure the reliability and stability of the lens drive assembly 40.

[0151] Optionally, in other examples of the camera module of the present invention, the partition 42713 may be disposed in the middle of the outer groove track 42712 to separate the two lens focusing balls 4272. Alternatively, a partition 42713 may be disposed in the middle of the inner groove track 42711 and the middle of the outer groove track 42712 of the lens focusing track 4271 to separate the two lens focusing balls 4272.

[0152] Optionally, in other examples of the camera module of the present invention, the lens focusing ball 4272 may be glued or welded to the inner groove track 42711 of the lens focusing track 4271, or the lens focusing ball 4272 may be glued or welded to the outer groove track 42712 of the lens focusing track 4271.

[0153] Furthermore, in some examples of the camera module of the present invention, the size of the lens focusing ball 4272 of the lens focusing support unit 427 can be smaller than or equal to the size of the lens stabilization ball 4172 of the lens stabilization support unit 417. It is understood that reducing the size of the lens focusing ball 4272 can reduce the size of the lens focusing track 4271, thereby reducing the length and width (i.e., the lateral dimension) of the lens drive assembly 40. For example, in a specific example of the camera module of the present invention, the diameter of the lens focusing ball 4272 of the lens focusing support unit 427 is 0.7 mm, and the diameter of the lens stabilization ball 4172 of the lens stabilization support unit 417 is 0.8 mm.

[0154] In some other examples of the camera module of the present invention, the size of the lens focusing ball 4272 of the lens focusing support unit 427 can be larger than the size of the lens stabilization ball 4172 of the lens stabilization support unit 417. Reducing the size of the lens stabilization ball 4172 is beneficial to reducing the height dimension (i.e., the longitudinal dimension) of the lens drive assembly 40.

[0155] In addition, the height position of the lens stabilization ball 4172 of the lens stabilization support unit 417 is between the two lens focusing balls 4272 of the lens focusing support unit 427 located on the same lens focusing track 4271. In this way, the height position of the lens stabilization carrier 410 can be lowered, which helps to reduce the height of the lens drive assembly 40.

[0156] Continue to refer to Figure 1 to... Figure 12 The lens focusing unit 42 further includes at least one lens focusing anti-collision unit 428, which is disposed on the top surface 42011 of the inner frame of the lens focusing inner frame 420 to limit the movement range of the lens focusing inner frame 420 and protect the lens focusing inner frame 420. Preferably, the number of lens focusing anti-collision units 428 is two or more. For example, in a specific example of the camera module of the present invention, the number of lens focusing anti-collision units 428 is two, which protrude from the top surface 42011 of the inner frame of the lens focusing inner frame 420 and are located on the same side.

[0157] Continue to refer to Figure 1 to... Figure 12The lens focusing and fixing unit 422 further includes a lens driving base 440 and a lens driving housing 450. The lens driving base 440 has a base channel 441, and the lens driving housing 450 has a housing channel 451. The lens driving housing 450 is mounted on the lens driving base 440 to form an accommodating space 460 between the lens driving housing 450 and the lens driving base 440. The base channel 441 of the lens driving base 440 and the housing channel 451 of the lens driving housing 450 correspond to each other and are respectively connected to the accommodating space 460. The lens focusing frame 430 is fixed to the lens drive base 440 by bonding or integral injection molding, and is located in the accommodating space 460. The two openings of the carrier channel 4103 of the lens image stabilization carrier 410 correspond to the base channel 441 of the lens drive base 440 and the housing channel 451 of the lens drive housing 450, respectively. This allows the light-emitting side and the light-receiving side of the optical lens 21 to correspond to the base channel 441 of the lens drive base 440 and the housing channel 451 of the lens drive housing 450, respectively.

[0158] Preferably, the lens drive housing 450 is made of non-magnetic stainless steel, which gives it high strength and a thin profile, thus providing better protection. Furthermore, by using non-magnetic stainless steel, the lens drive housing 450 prevents mutual magnetic attraction between itself and the lens stabilization magnet 4131, and also prevents mutual magnetic attraction between itself and the lens focusing magnet 4231. Additionally, the lens drive housing 450 provides metallic shielding for both the lens stabilization magnet 4131 and the lens focusing magnet 4231.

[0159] Preferably, the lens drive housing 450 has a housing notch 452 on one side, and the lens focusing magnetic unit 426 can be accommodated in the housing notch 452 of the lens drive housing 450, thereby helping to reduce the length and width dimensions (i.e., the lateral dimension) of the lens drive assembly 40.

[0160] Continue to refer to the appendix Figure 7A and Figure 7BThe lens focusing unit 42 further includes at least one lens focusing magnetic shielding unit 429. The lens focusing magnetic shielding unit 429 is located at the bottom of the lens focusing magnet 4231 to block at least a portion of the bottom of the lens focusing magnet 4231. In this way, the lens focusing magnetic shielding unit 429 can isolate the magnetic field of the lens focusing magnet 4231, thereby reducing the magnetic interference of the lens focusing magnet 4231 on the circuit board, photosensitive element and other components of the photosensitive component 30 located below the lens driving assembly 40, and preventing the lens focusing magnet 4231 from being attracted by the magnetic components located below the lens driving assembly 40, thus reducing the lens focusing effect.

[0161] Preferably, the lens focusing magnetic shielding unit 429 blocks at least three-quarters of the area of ​​the lens focusing magnet 4231 to improve the magnetic shielding effect of the lens focusing magnetic shielding unit 429.

[0162] It is worth noting that the number of lens focusing magnetic shielding units 429 in the camera module of the present invention is not limited, as long as they can cover the bottom of the lens focusing magnet 4231. For example, in some examples, the number of lens focusing magnetic shielding units 429 may be less than the number of lens focusing magnets 4231, so that at least one lens focusing magnetic shielding unit 429 is disposed at the bottom of at least two lens focusing magnets 4231. Specifically, in camera modules with two lens focusing magnets 4231, the number of lens focusing magnetic shielding units 429 may be one, so that the two lens focusing magnets 4231 correspond to different positions of the lens focusing magnetic shielding unit 429. In other examples, the number of lens focusing magnetic shielding units 429 is the same as the number of lens focusing magnets 4231, so that one lens focusing magnetic shielding unit 429 is disposed at the bottom of each lens focusing magnet 4231.

[0163] Preferably, there is a gap between the lens focusing magnetic shielding unit 429 and the lens focusing magnet 4231 to reduce the magnetic force leaking out of the lens focusing magnet 4231, thereby improving the magnetic shielding effect.

[0164] Preferably, the lens focusing magnetic shielding unit 429 is disposed in the lens focusing inner frame 420 so that the lens focusing magnetic shielding unit 429 is held at the bottom of the lens focusing magnet 4231 by the lens focusing inner frame 420.

[0165] It is worth noting that the manner in which the lens focusing magnetic shielding unit 429 is disposed within the lens focusing inner frame 420 is not limited in the camera module of the present invention. For example, in some examples, the lens focusing magnetic shielding unit 429 is disposed within the lens focusing inner frame 420 by adhesive bonding. In other examples, the lens focusing magnetic shielding unit 429 is disposed within the lens focusing inner frame 420 by insert injection molding.

[0166] Continue to refer to the appendix Figure 3A and Figure 3B The lens focusing unit 42 further includes at least one lens focusing magnetic guiding unit 4210. The lens focusing magnetic guiding unit 4210 is disposed in the lens focusing inner frame 420, and the lens focusing magnetic guiding unit 4210 and the lens focusing magnet 4231 correspond to each other so that the lens focusing magnetic guiding unit 4210 enhances the magnetic field that the lens focusing magnet 4231 can act on the lens focusing coil 4232.

[0167] It is worth noting that the manner in which the lens focusing magnetic guiding unit 4210 is disposed within the lens focusing inner frame 420 is not limited in the camera module of the present invention. For example, in some examples, the lens focusing magnetic guiding unit 4210 is disposed within the lens focusing inner frame 420 by adhesive bonding. In other examples, the lens focusing magnetic guiding unit 4210 is disposed within the lens focusing inner frame 420 by insert injection molding.

[0168] Preferably, the lens focusing magnetic guiding unit 4210 is connected to the lens image stabilization magnetic attraction unit 416 and the lens focusing magnetic isolation unit 429. More preferably, the lens image stabilization magnetic attraction unit 416, the lens focusing magnetic guiding unit 4210, and the lens focusing magnetic isolation unit 429 are integrally formed from magnetically conductive material.

[0169] Optionally, the lens image stabilization magnetic unit 416, the lens focusing magnetic guiding unit 4210, and the lens focusing magnetic isolation unit 429 are independent of each other, and the lens image stabilization magnetic unit 416, the lens focusing magnetic guiding unit 4210, and the lens focusing magnetic isolation unit 429 can be fitted into the lens focusing inner frame 420 through an insert injection molding process, so that the lens image stabilization magnetic unit 416, the lens focusing magnetic guiding unit 4210, and the lens focusing magnetic isolation unit 429 are fixed to the lens focusing inner frame 420.

[0170] Optionally, the lens focusing magnetic isolation unit 429 and the lens focusing magnetic guiding unit 4210 are integrally formed from magnetically conductive material. The lens image stabilization magnetic suction unit 416 is independent of the lens focusing magnetic isolation unit 429 and the lens focusing magnetic guiding unit 4210. The lens image stabilization magnetic suction unit 416, the lens focusing magnetic guiding unit 4210 and the lens focusing magnetic isolation unit 429 can be fitted into the lens focusing inner frame 420 through an insert injection molding process, thereby fixing the lens image stabilization magnetic suction unit 416, the lens focusing magnetic guiding unit 4210 and the lens focusing magnetic isolation unit 429 to the lens focusing inner frame 420.

[0171] It is understandable that, in Figures 1 to 2019 Figure 12 In this specific example of the camera module shown, the lens stabilization magnets 4131 of the lens stabilization drive unit 413 and the lens focusing magnets 4231 of the lens focusing drive unit 423 are located on opposite sides of the lens drive assembly 40, and the magnetic field direction of the lens focusing magnet 4231 is perpendicular to that of the lens stabilization magnet 4131. This reasonable internal structural layout of the lens drive assembly 40 helps to reduce the size of the lens drive assembly 40 and minimize magnetic field interference between the lens focusing magnet 4231 and the lens stabilization magnet 4131. In other words, the lens stabilization magnets 4131 of the lens stabilization drive unit 413 are located on one side of the optical lens 21, and the lens focusing magnets 4231 of the lens focusing drive unit 423 are located on the opposite side of the optical lens 21.

[0172] Optionally, in other examples of the camera module of the present invention, the lens stabilization magnets 4131 of the lens stabilization drive unit 413 and the lens focusing magnets 4231 of the lens focusing drive unit 423 are adjacent to each other. In other words, the lens stabilization magnets 4131 of the lens stabilization drive unit 413 and the lens focusing magnets 4231 of the lens focusing drive unit 423 are all located on the same side of the optical lens 21.

[0173] Reference Appendix Figures 8 to 12The chip driving assembly 10 includes a chip stabilization fixing part 11, a chip stabilization movable part 12, and a chip stabilization driving part 13. The chip stabilization fixing part 11 has a receiving cavity 1101 and a top opening 1102 communicating with the receiving cavity 1101. The photosensitive component 30 is disposed in the chip stabilization movable part 12, the chip stabilization movable part 12 is suspended in the receiving cavity 1101 of the chip stabilization fixing part 11, and the top opening 1102 of the chip stabilization fixing part 11 corresponds to the photosensitive component 30. The chip stabilization driving part 13 is used to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, so as to realize translational and / or rotational stabilization of the camera module. Furthermore, the chip stabilization fixing part 11 includes a base 111 and a top cover 112, the top opening 1102 is formed in the top cover 112, the base 111 and the top cover 112 are snapped together to form the receiving cavity 1101 between the base 111 and the top cover 112, such that the receiving cavity 1101 formed between the base 111 and the top cover 112 communicates with the top opening 1102 formed in the top cover 112.

[0174] The movable chip stabilization part 12 and the driving chip stabilization part 13 are respectively housed in the receiving cavity 1101 of the fixed chip stabilization part 11, so that the fixed chip stabilization part 11 forms the appearance of the chip driving assembly 10. In this way, on the one hand, the fixed chip stabilization part 11 can prevent the movable chip stabilization part 12 and the driving chip stabilization part 13 from being collided, thereby protecting the movable chip stabilization part 12 and the driving chip stabilization part 13. On the other hand, the base 111 and the top cover 112 of the fixed chip stabilization part 11 cooperate with each other to form a sealed receiving cavity 1101, so as to prevent dust and other contaminants from entering the receiving cavity 1101 of the fixed chip stabilization part 11 and contaminating the photosensitive element 32 and reducing stray light.

[0175] Preferably, the base 111 and the top cover 112 of the chip stabilization fixing part 11 are made of metal to ensure the strength of the chip driving assembly 10. For example, the base 111 and the top cover 112 of the chip stabilization fixing part 11 can be made of non-magnetic stainless steel.

[0176] It is understood that when the camera module implements the image stabilization function, the base 111 and the top cover 112 of the chip image stabilization fixing part 11 remain stationary so that the chip image stabilization fixing part 11 forms a stator.

[0177] Continue to refer to the appendix Figures 8 to 12The photosensitive component 30 includes a circuit board 31 and a photosensitive element 32 connected to the circuit board 31, wherein the circuit board 31 is disposed on the chip stabilization movable part 12 to dispose the photosensitive component 30 on the chip stabilization movable part 12.

[0178] The photosensitive component 30 further includes a series of electronic components 33, which may be, but are not limited to, passive components such as resistors, capacitors, and processors, wherein these electronic components 33 are mounted on the circuit board 31.

[0179] Additionally, the photosensitive component 30 may also include a filter, such as an infrared cut-off filter, which is held in the photosensitive path of the photosensitive element 32.

[0180] Reference Appendix Figures 8 to 12 The circuit board 31 has two extension arms 311. These two extension arms 311 extend from opposite sides of the circuit board 31 through the connection point between the base 111 and the top cover 112 to the outside of the chip stabilization fixing part 11 and further upwards. This ensures stability and reduces resistance when the chip stabilization movable part 12 is driven by the chip stabilization driving part 13 to perform translational and / or rotational movements within the receiving cavity 1101 of the chip stabilization fixing part 11. Optionally, the two extension arms 311 can extend from adjacent sides of the circuit board 31 through the connection point between the base 111 and the top cover 112 to the outside of the chip stabilization fixing part 11 and further upwards.

[0181] Continue to refer to the appendix Figures 8 to 12 The chip stabilization movable part 12 includes a chip stabilization movable carrier 121 and a set of chip stabilization balls 122. The set of chip stabilization balls 122 is rotatably disposed between the chip stabilization movable carrier 121 and the upper cover 112, so that the chip stabilization movable part 12 and the chip stabilization fixed part 11 make point friction contact, thereby ensuring that the chip stabilization driving part 13 smoothly drives the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixed part 11.

[0182] Specifically, the chip stabilization movable carrier 121 has a carrier front side 1211, a carrier back side 1212 opposite to the carrier front side 1211, and a carrier opening 1213 extending from the carrier front side 1211 to the carrier back side 1212. The circuit board 31 of the photosensitive component 30 is disposed on the carrier back side 1212 of the chip stabilization movable carrier 121, and the photosensitive element 32 of the photosensitive component 30 corresponds to the carrier opening 1213 of the chip stabilization movable carrier 121, so that incident light is allowed to pass through the carrier opening 1213 of the chip stabilization movable carrier 121 to reach the photosensitive element 32.

[0183] There is a gap between the circuit board 31 of the photosensitive component 30 and the base 111 of the chip stabilization fixing part 11. A set of chip stabilization balls 122 are rotatably disposed between the carrier front 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112, so that the chip stabilization movable part 12 and the chip stabilization fixing part 11 make point friction contact, so that the chip stabilization driving part 13 smoothly drives the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11.

[0184] Optionally, in some specific examples of the camera module of the present invention, the photosensitive component 30 can be embedded in the carrier opening 1213 of the chip image stabilization movable carrier 121, which helps to reduce the height of the camera module. In other words, the chip image stabilization movable carrier 121 is arranged around the photosensitive component 30. At this time, on the one hand, there is a gap between the back surface 1212 of the chip stabilization movable carrier 121 and the base 111 of the chip stabilization fixing part 11. On the other hand, a set of rolling chip stabilization balls 122 are provided between the front surface 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112 of the chip stabilization fixing part 11, thereby suspending the chip stabilization movable part 12 in the receiving cavity 1101 of the chip stabilization fixing part 11, so as to ensure that the chip stabilization driving part 13 can smoothly drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11.

[0185] Optionally, in some specific examples of the camera module of the present invention, the circuit board 31 of the photosensitive component 30 is mounted on the front side 1211 of the carrier of the chip image stabilization movable carrier 121. At this time, on the one hand, there is a gap between the back surface 1212 of the chip stabilization movable carrier 121 and the base 111 of the chip stabilization fixing part 11. On the other hand, a set of rolling chip stabilization balls 122 is provided between the front surface 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112 of the chip stabilization fixing part 11. The set of chip stabilization balls 122 ensures that there is a gap between the photosensitive component 30 and the upper cover 112, thereby suspending the chip stabilization movable part 12 in the receiving cavity 1101 of the chip stabilization fixing part 11, so as to ensure that the chip stabilization driving part 13 can smoothly drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11. It is understood that in these examples where the circuit board 31 of the photosensitive component 30 is mounted on the front side 1211 of the chip image stabilization movable carrier 121, the chip image stabilization movable carrier 121 may not need to have the carrier opening 1213.

[0186] Continue to refer to the appendix Figures 8 to 12 The chip stabilization driving unit 13 includes a plurality of chip stabilization magnets 131 and a plurality of chip stabilization coils 132. The chip stabilization magnets 131 are respectively disposed on the chip stabilization fixing part 11, and the chip stabilization coils 132 are respectively disposed on the chip stabilization movable part 12. The chip stabilization magnets 131 and the chip stabilization coils 132 correspond to each other. The magnetic field generated by the chip stabilization coils 132 after being energized can interact with the magnetic field of the chip stabilization magnets 131 to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, thereby realizing translational and / or rotational stabilization of the camera module. For example, the chip stabilization magnets 131 and the chip stabilization coils 132 of the chip stabilization drive unit 13 can interact to drive the chip stabilization movable part 12 to perform translational motion relative to the chip stabilization fixed part 11 along the X-axis and / or Y-axis directions, thereby achieving translational stabilization of the camera module. The chip stabilization magnets 131 and the chip stabilization coils 132 of the chip stabilization drive unit 13 can also interact to drive the chip stabilization movable part 12 to perform rotational motion relative to the chip stabilization fixed part 11 about the Z-axis direction, thereby achieving rotational stabilization of the camera module.

[0187] Preferably, in the appendix Figures 2 to 8In the camera module shown, the chip stabilization magnets 131 of the chip stabilization drive unit 13 are respectively disposed on the upper cover 112 of the chip stabilization fixing unit 11. Correspondingly, the chip stabilization coils 132 of the chip stabilization drive unit 13 are respectively disposed on the chip stabilization movable part 12, and each chip stabilization magnet 131 corresponds to each chip stabilization coil 132. For example, from the attached... Figure 2 From the direction shown, the chip stabilization magnet 131 is located above the chip stabilization coil 132, that is, the chip stabilization magnet 131 and the chip stabilization coil 132 are arranged vertically.

[0188] Furthermore, the chip driving assembly 10 includes at least one chip stabilization magnetic guide member 14, which is disposed above the chip stabilization magnet 131. In this way, on the one hand, the chip stabilization magnetic guide member 14 can strengthen the magnetic field intensity downward (i.e., in the direction where the chip stabilization coil 132 is located), so that the chip stabilization driving part 13 has sufficient driving force to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixed part 11. On the other hand, the chip stabilization magnetic guide member 14 can prevent magnetic leakage in the direction towards the lens driving assembly 40, thereby avoiding interference with the magnetic field of the lens driving assembly 40.

[0189] Specifically, the chip-based image stabilization magnetic guide member 14 is disposed on the upper cover 112 of the chip-based image stabilization fixing part 11, and the chip-based image stabilization magnet 131 is disposed on the chip-based image stabilization magnetic guide member 14. That is, the chip-based image stabilization magnet 131 is disposed on the upper cover 112 by being disposed on the chip-based image stabilization magnetic guide member 14, thus keeping the chip-based image stabilization magnetic guide member 14 between the chip-based image stabilization magnet 131 and the upper cover 112. With this structural design, the chip-based image stabilization magnetic guide member 14 allows the magnetic lines of force of the chip-based image stabilization magnet 131 to concentrate towards the direction of the chip-based image stabilization coil 132, thereby increasing the magnetic field strength of the chip-based image stabilization driving part 13 and reducing the magnetic field strength overflowing to the lens driving assembly 40, thereby avoiding magnetic interference to the lens driving assembly 40.

[0190] More specifically, looking at the plane along one side of the optical axis of the camera module, the chip-based image stabilization magnetic guide member 14 has a quadrilateral structure. The area of ​​the chip-based image stabilization magnetic guide member 14 is greater than or equal to the area of ​​the chip-based image stabilization magnet 131, and the chip-based image stabilization magnetic guide member 14 completely covers the chip-based image stabilization magnet 131. In this way, the chip-based image stabilization magnetic guide member 14 can effectively prevent the magnetic force of the chip-based image stabilization magnet 131 from leaking out. In other words, the chip-based image stabilization magnetic guide member 14 covers the surface of the chip-based image stabilization magnet 131 facing the lens drive assembly 40. For example, in a specific example of the camera module of the present invention, the shape of the chip-based image stabilization magnetic guide member 14 is the same as the shape of the chip-based image stabilization magnet 131, that is, the chip-based image stabilization magnetic guide member 14 is a square plate that is placed over the chip-based image stabilization magnet 131 and completely covers the upper surface of the chip-based image stabilization magnet 131.

[0191] Preferably, in the appendix Figures 8 to 12 In this specific example of the camera module of the present invention shown, the shape of the chip stabilization magnetic guide member 14 is different from the shape of the chip stabilization magnet 131. For example, the chip stabilization magnetic guide member 14 is a "U" shape with an opening, which can not only cover the upper surface of the chip stabilization magnet 131, but also wrap at least a portion of the two opposite sides of the chip stabilization magnet 131, so that the magnetic lines of force of the chip stabilization magnet 131 are concentrated in the direction of the chip stabilization coil 132.

[0192] It is worth mentioning that the correspondence between the number of the chip image stabilization magnetic conductive components 14 and the number of the chip image stabilization magnets 131 is not limited in the camera module of the present invention. For example, in the attached... Figures 8 to 12 In this specific example of the camera module of the present invention, the number of the chip stabilization magnetic guide members 14 is the same as the number of the chip stabilization magnets 131. Thus, one chip stabilization magnetic guide member 14 can be respectively placed over each chip stabilization magnet 131, and the chip stabilization magnetic guide member 14 and the chip stabilization magnet 131 can correspond one-to-one. Optionally, in other examples of the camera module of the present invention, the number of chip stabilization magnetic guide members 14 is less than the number of chip stabilization magnets 131, so that one chip stabilization magnetic guide member 14 can be placed over at least two chip stabilization magnets 131.

[0193] Those skilled in the art will understand that, with reference to the appendix Figure 12 and Figure 13The photosensitive element 32 of the photosensitive assembly 30 is rectangular and has four sides. For ease of description and understanding, the four sides of the photosensitive element 32 are defined sequentially in a clockwise direction as a first chip side 321, a second chip side 322, a third chip side 323, and a fourth chip side 324. A coordinate system is established with the center point of the photosensitive element 32 as the origin, the direction parallel to the first chip side 321 and the third chip side 323 as the X-axis, the direction parallel to the second chip side 322 and the fourth chip side 324 as the Y-axis, and the direction perpendicular to the photosensitive surface of the photosensitive element 32 as the Z-axis.

[0194] Based on the arrangement of the chip stabilization coils 132 in the chip stabilization drive unit 13, these chip stabilization coils 132 form a first coil group 133, a second coil group 134, and a third coil group 135. In the plane containing the X and Y axes, the first coil group 133 is arranged along the Y-axis, while the second coil group 134 and the third coil group 135 are arranged along the X-axis. The second coil group 134 and the third coil group 135 are located on opposite sides of the photosensitive element 32, thus surrounding the photosensitive element 32 of the photosensitive assembly 30. Preferably, the second coil group 134 and the third coil group 135 are symmetrical with respect to the Y-axis. It can be understood that the second coil group 134 and the third coil group 135 are located on opposite sides of the top opening 1102 of the chip stabilization fixing part 11.

[0195] The number of chip image stabilization coils 132 constituting the first coil group 133 is at least one, the number of chip image stabilization coils 132 constituting the second coil group 134 is at least two, and the number of chip image stabilization coils 132 constituting the third coil group 135 is at least two. Preferably, in the attached... Figures 8 to 12 In this specific example of the camera module shown, the number of chip stabilization coils 132 that make up the first coil group 133, the second coil group 134 and the third coil group 135 are all two.

[0196] Specifically, the two chip stabilization coils 132 constituting the first coil group 133 are defined as a first coil 1321 and a second coil 1322, respectively, and the first coil 1321 and the second coil 1322 are arranged opposite to each other and parallel along the Y-axis direction; the two chip stabilization coils 132 constituting the second coil group 134 are defined as a third coil 1323 and a fourth coil 1324, respectively, and the third coil 1323 and the fourth coil 1324 are arranged opposite to each other and parallel along the X-axis direction; the two chip stabilization coils 132 constituting the third coil group 135 are defined as a fifth coil 1325 and a sixth coil 1326, respectively, and the fifth coil 1325 and the sixth coil 1326 are arranged opposite to each other and parallel.

[0197] In other words, the first coil 1321 and the second coil 1322 are respectively disposed on the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, and the first coil 1321 and the second coil 1322 are respectively parallel to the fourth chip side 324 and the second chip side 322 of the photosensitive element 32. The third coil 1323 and the fifth coil 1325 are respectively disposed on the first chip side 321 of the photosensitive element 32, and the third coil 1323 and the fifth coil 1325 are respectively parallel to the first chip side 321 of the photosensitive element 32. The fourth coil 1324 and the sixth coil 1326 are respectively disposed on the third chip side 324 of the photosensitive element 32, and the fourth coil 1324 and the sixth coil 1326 are respectively parallel to the third chip side 323 of the photosensitive element 32.

[0198] In the appendix Figures 8 to 12In this specific example of the camera module of the present invention, the first coil 1321 and the second coil 1322, which constitute the first coil group 133, are respectively disposed on two opposite sides of the photosensitive element 32 along the Y-axis direction. The third coil 1323 and the fourth coil 1324, which constitute the second coil group 134, and the fifth coil 1325 and the sixth coil 1326, which constitute the third coil group 135, are respectively disposed at the four corners of the photosensitive element 32 along the X-axis direction. For example, the first coil 1321 is disposed adjacent to the third coil 1323 and the fourth coil 1324, and the first coil 1321 is perpendicular to the third coil 1323 and the fourth coil 1324, respectively. Correspondingly, the second coil 1322 is disposed adjacent to the fifth coil 1325 and the sixth coil 1326, and the second coil 1322 is perpendicular to the fifth coil 1325 and the sixth coil 1326, respectively. In other words, the distance between the second coil group 134 and the third coil group 135 and the center of the photosensitive element 32 is greater than the distance between the first coil group 133 and the center of the photosensitive element 32, and the torque is greater. Thus, the second coil group 134 and the third coil group 135 cooperate more easily to drive the chip stabilization movable part 12 to rotate relative to the chip stabilization fixed part 11, so as to achieve rotational stabilization.

[0199] Specifically, the first coil 1321 and the second coil 1322 constituting the first coil group 133 are of the same size; the third coil 1323 and the fourth coil 1324 constituting the second coil group 134, and the fifth coil 1325 and the sixth coil 1326 constituting the third coil group 135 are of the same size; and the size of the first coil 1321 and the second coil 1322 is larger than the size of the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326. The first coil 1321 and the second coil 1322 cooperate to drive the movable chip stabilization part 12 to translate relative to the fixed chip stabilization part 11 along the X-axis. The third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 cooperate to drive the movable chip stabilization part 12 to translate relative to the fixed chip stabilization part 11 along the Y-axis and / or drive the movable chip stabilization part 12 to rotate relative to the fixed chip stabilization part 11 around the Z-axis. It is understood that the first coil 1321 and the second coil 1322 have relatively large dimensions to ensure they have a large thrust to drive the movable chip stabilization part 12 to translate relative to the fixed chip stabilization part 11 along the X-axis.

[0200] Optionally, in other examples of the camera module of the present invention, the first coil 1321 and the second coil 1322 constituting the first coil group 133, the third coil 1323 and the fourth coil 1324 constituting the second coil group 134, and the fifth coil 1325 and the sixth coil 1326 constituting the third coil group 135 may have the same size.

[0201] Preferably, the geometric centers of the first coil 1321 and the second coil 1322 constituting the first coil group 133 are aligned with the center of the chip image stabilization drive unit 13. That is, the distance between the center of the first coil 1321 and the center of the photosensitive element 32 (the origin of the coordinate axis) is the same as the distance between the center of the second coil 1322 and the center of the photosensitive element 32. This ensures that the resultant force generated by the first coil 1321 and the second coil 1322 is still located at the center of the chip image stabilization drive unit 13, thereby avoiding unnecessary torque generated by the first coil 1321 and the second coil 1322.

[0202] For example, in a specific example of the camera module of the present invention, when viewed along one side of the optical axis of the camera module, the center of the first coil 1321 and the center of the second coil 1322 are aligned, such that the line connecting the center of the first coil 1321 and the center of the second coil 1322 passes through the center of the photosensitive element 32 and is parallel to the X-axis direction.

[0203] In another specific example of the camera module of the present invention, looking at its plane along one side of the optical axis of the camera module, the center of the first coil 1321 and the center of the second coil 1322 are somewhat off-center. The off-center direction of the center of the first coil 1321 and the center of the second coil 1322 can be either the positive direction of the Y-axis or the negative direction of the Y-axis. The line connecting the center of the first coil 1321 and the center of the second coil 1322 passes through the center of the photosensitive element 32 and intersects the X-axis direction. That is, in this embodiment of the camera module of the present invention, the center of the first coil 1321 can be off-center in the positive direction of the Y-axis, and correspondingly, the center of the second coil 1322 can be off-center in the negative direction of the Y-axis. The distance from the center of the first coil 1321 to the X-axis is the same as the distance from the center of the second coil 1322 to the X-axis. This ensures that the resultant force generated by the first coil 1321 and the second coil 1322 is located at the center of the chip image stabilization drive unit 13. Alternatively, the center of the first coil 1321 can be biased towards the negative direction of the Y-axis, and correspondingly, the center of the second coil 1322 can be biased towards the positive direction of the Y-axis. Furthermore, the distance from the center of the first coil 1321 to the X-axis is the same as the distance from the center of the second coil 1322 to the X-axis. This ensures that the resultant force generated by the first coil 1321 and the second coil 1322 is located at the center of the chip anti-shake drive unit 13.

[0204] Furthermore, the chip stabilization coils 132 of the chip stabilization drive unit 13 are all hollow planar coils, forming a coil plane 13201 and a coil space 13202. Preferably, the coil planes 13201 of the first coil 1321, the second coil 1322, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are flush, so that the chip stabilization drive unit 13 can drive the chip stabilization movable part 12 to translate within the plane XOY formed by the X-axis and Y-axis.

[0205] Furthermore, the movable carrier 121 for chip stabilization has a plurality of mounting positions 1210, the number of mounting positions 1210 being the same as the number of chip stabilization coils 132, and each mounting position 1210 being used to mount each chip stabilization coil 132.

[0206] Based on the placement positions 1210, these placement positions 1210 form a first position group 12101, a second position group 12102, and a third position group 12103, wherein each placement position 1210 constituting the first position group 12101 is respectively disposed on two opposite sides along the Y-axis direction, and each placement position 1210 constituting the second position group 12102 and the third position group 12103 is respectively disposed at four corners along the X-axis direction.

[0207] Further, each of the placement positions 1210 constituting the first position group 12101 is arranged along the Y-axis direction, each of the placement positions 1210 constituting the second position group 12102 is arranged along the X-axis direction, and each of the placement positions 1210 constituting the third position group 12103 is arranged along the X-axis direction. Furthermore, each of the placement positions 1210 constituting the second position group 12102 is arranged opposite to each other along the Y-axis direction, and each of the placement positions 1210 constituting the third position group 12103 is arranged opposite to each other along the Y-axis direction. Preferably, each of the placement positions 1210 constituting the second position group 12102 is symmetrical with respect to the Y-axis, and each of the placement positions 1210 constituting the third position group 12103 is symmetrical with respect to the Y-axis.

[0208] The shape of the mounting position 1210 is the same as that of the chip image stabilization coil 132, so as to facilitate the mounting of the chip image stabilization coil 132 on the mounting position 1210. Viewed from the optical axis side of the camera module, the mounting position 1210 is rectangular or approximately rectangular in structure. The long side of each mounting position 1210 forming the first position group 12101 is parallel to the Y-axis direction, while the long sides of each mounting position 1210 forming the second position group 12102 and the third position group 12103 are parallel to the X-axis direction. Furthermore, the long side of each mounting position 1210 forming the first position group 12101 is perpendicular to the long side of each mounting position 1210 forming the second position group 12102 and the third position group 12103, respectively.

[0209] In some examples of the camera module of the present invention, the mounting position 1210 may be a planar mounting position, such that the chip image stabilization coil 132 can be directly disposed on the surface of the mounting position 1210. In other examples of the camera module of the present invention, the mounting position 1210 may be a recessed mounting position, such that the chip image stabilization coil 132 can be embedded in the mounting position 1210 to reduce the height of the chip driving assembly 10. In still other examples of the camera module of the present invention, the mounting position 1210 may be a through-hole mounting position, such that the chip image stabilization coil 132 can be embedded in the mounting position 1210 to reduce the height of the chip driving assembly 10.

[0210] Based on the arrangement of the chip stabilization magnets 131 in the chip stabilization drive unit 13, these chip stabilization magnets 131 form a first magnet group 136, a second magnet group 137, and a third magnet group 138. In the plane containing the X and Y axes, the first magnet group 136 is arranged along the Y-axis, while the second magnet group 137 and the third magnet group 138 are respectively arranged along the X-axis. The second magnet group 137 and the third magnet group 138 are located on opposite sides of the photosensitive element 32, thus surrounding the photosensitive element 32 of the photosensitive assembly 30. Preferably, the second magnet group 137 and the third magnet group 138 are symmetrical with respect to the Y-axis.

[0211] The number of chip anti-shake magnets 131 constituting the first magnet group 136 is at least one, the number of chip anti-shake magnets 131 constituting the second magnet group 137 is at least two, and the number of chip anti-shake magnets 131 constituting the third magnet group 138 is at least two. Preferably, in the attached... Figures 8 to 12 In this specific example of the camera module shown, the number of chip anti-shake magnets 131 that make up the first magnet group 136, the second magnet group 137, and the third magnet group 138 are all two.

[0212] Specifically, the two chip-mounted image stabilization magnets 131 constituting the first magnet group 136 are defined as a first magnet 1311 and a second magnet 1312, respectively. The first magnet 1311 and the second magnet 1312 are arranged opposite to each other and parallel along the Y-axis direction, and the first magnet 1311 is arranged opposite to the first coil 1321, while the second magnet 1312 is arranged opposite to the second coil 1322. The two chip-mounted image stabilization magnets 131 constituting the second magnet group 137 are defined as a third magnet 1313 and a fourth magnet 1314, respectively. The third magnet 1313 and the fourth magnet 1314 are arranged opposite to each other and parallel along the X-axis direction, and the third magnet 1313 is arranged opposite to the third coil 1323, while the fourth magnet 1314 is arranged opposite to the fourth coil 1324. The two chip anti-shake magnets 131 that make up the third magnet group 138 are defined as a fifth magnet 1315 and a sixth magnet 1316, respectively. The fifth magnet 1315 and the sixth magnet 1316 are arranged opposite to each other and parallel to each other along the X-axis direction. The fifth magnet 1315 is arranged opposite to the fifth coil 1325, and the sixth magnet 1316 is arranged opposite to the sixth coil 1326.

[0213] In other words, the first magnet 1311 and the second magnet 1312 are respectively disposed on the fourth chip side 324 and the second chip side 322 of the photosensitive element 32, and the first magnet 1311 and the second magnet 1312 are respectively parallel to the fourth chip side 324 and the second chip side 322 of the photosensitive element 32. The third magnet 1313 and the fifth magnet 1315 are respectively disposed on the first chip side 321 of the photosensitive element 32, and the third magnet 1313 and the fifth magnet 1315 are respectively parallel to the first chip side 321 of the photosensitive element 32. The fourth magnet 1314 and the sixth magnet 1316 are respectively disposed on the third chip side 323 of the photosensitive element 32, and the fourth magnet 1314 and the sixth magnet 1316 are respectively parallel to the third chip side 323 of the photosensitive element 32.

[0214] In the appendix Figures 8 to 12In this specific example of the camera module of the present invention shown, the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136 are respectively disposed on two opposite sides of the photosensitive element 32 along the Y-axis direction, and the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137 and the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138 are respectively disposed at the four corners of the photosensitive element 32 along the X-axis direction. For example, the first magnet 1311 is arranged adjacent to the third magnet 1313 and the fourth magnet 1314 respectively, and the first magnet 1311 is perpendicular to the third magnet 1313 and the fourth magnet 1314 respectively. Correspondingly, the second magnet 1312 is arranged adjacent to the fifth magnet 1315 and the sixth magnet 1316 respectively, and the second magnet 1312 is perpendicular to the fifth magnet 1315 and the sixth magnet 1316 respectively.

[0215] Specifically, the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136 are of the same size; the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137 and the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138 are of the same size; and the size of the first magnet 1311 and the second magnet 1312 is larger than the size of the third magnet 1313, the fourth magnet 1314, the fifth magnet 1315, and the sixth magnet 1316. The first magnet 1311 and the second magnet 1312 cooperate to drive the chip stabilization driving part 13 to translate relative to the chip stabilization fixing part 11 along the X-axis. The third magnet 1313, the fourth magnet 1314, the fifth magnet 1315, and the sixth magnet 1316 cooperate to drive the chip stabilization driving part 13 to translate relative to the chip stabilization fixing part 11 along the Y-axis or to rotate relative to the chip stabilization fixing part 11 around the Z-axis. It is understood that the first magnet 1311 and the second magnet 1312 have large dimensions to ensure they have a large thrust to drive the chip stabilization movable part 12 to translate relative to the chip stabilization fixing part 11 along the X-axis.

[0216] Optionally, in other examples of the camera module of the present invention, the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136, the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137, and the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138 may have the same size.

[0217] In a specific example of the camera module of the present invention, the chip stabilization magnet 131 of the chip stabilization drive unit 13 is a unipolar magnet having one N pole and one S pole, the N pole and S pole being arranged horizontally and facing the chip stabilization coil 132. Optionally, in some other examples of the camera module of the present invention, the chip stabilization magnet 131 of the chip stabilization drive unit 13 is a bipolar magnet having two N poles and two S poles. The N poles and S poles in the first set of magnetic poles are arranged horizontally and facing the chip stabilization coil 132. The S pole in the second set of magnetic poles is located at the bottom of the N pole in the first set of magnetic poles, and the N pole in the second set of magnetic poles is located at the bottom of the S pole in the first set of magnetic poles. Thus, the S poles and N poles in the second set of magnetic poles are arranged horizontally and away from the chip stabilization coil 132.

[0218] It should be noted that, in this specific example of the camera module of the present invention, the first coil 1321 and the second coil 1322 constituting the first coil group 133 correspond to the first magnet 1311 and the second magnet 1312 constituting the first magnet group 136, respectively. Thus, when the first coil 1321 and the second coil 1322 are energized, the magnetic field generated by the first coil 1321 and the magnetic field of the first magnet 1311 cooperate with each other, and the magnetic field generated by the second coil 1322 and the magnetic field of the second magnet 1312 cooperate with each other to drive the chip anti-shake movable part 12 to translate in the X-axis direction, so as to realize translational anti-shake in the X-axis direction. The third coil 1323 and the fourth coil 1324 constituting the second coil group 134 correspond to the third magnet 1313 and the fourth magnet 1314 constituting the second magnet group 137, respectively. The fifth coil 1325 and the sixth coil 1326 constituting the third coil group 135 correspond to the fifth magnet 1315 and the sixth magnet 1316 constituting the third magnet group 138, respectively. Thus, when the second coil group 134 and the third coil group 135 are supplied with currents of the same direction and magnitude, the second coil group 134 and the... The second magnet group 137 cooperates with the third coil group 135 and the third magnet group 138 to drive the chip anti-shake movable part 12 to translate in the Y-axis direction, thereby achieving translational anti-shake along the Y-axis. When the second coil group 134 and the third coil group 135 are energized with currents of opposite directions but the same value, the second coil group 134 and the second magnet group 137 cooperate with the third coil group 135 and the third magnet group 138 to drive the chip anti-shake movable part 12 to rotate around the Z-axis, thereby achieving rotational anti-shake around the Z-axis.

[0219] Preferably, the chip anti-shake drive unit 13 has a translational stroke of ±235μm in the X and Y axis directions and a rotational stroke of ±1° around the Z axis.

[0220] Continue to refer to the appendix Figures 8 to 12 The movable chip stabilization part 12 further includes a chip stabilization electrical connection part 123, wherein the chip stabilization coils 132 of the chip stabilization driving part 13 are respectively connected to the chip stabilization electrical connection part 123 to supply power to the chip stabilization coils 132 through the chip stabilization electrical connection part 123. Preferably, the chip stabilization electrical connection part 123 is electrically connected to the circuit board 31 of the photosensitive component 30.

[0221] Preferably, the chip stabilization electrical connection 123 is a frame-shaped structure forming a connection opening 1231, wherein the chip stabilization electrical connection 123 is attached to the back surface 1212 of the chip stabilization movable carrier 121, and the connection opening 1231 of the chip stabilization electrical connection 123 and the carrier opening 1213 of the chip stabilization movable carrier 121 correspond to and communicate with each other, wherein the circuit board 31 of the photosensitive component 30 is fixed to the chip stabilization electrical connection 123, so that incident light is allowed to reach the photosensitive element 32 through the carrier opening 1213 of the chip stabilization movable carrier 121 and the connection opening 1231 of the chip stabilization electrical connection 123.

[0222] Optionally, in some other examples of the camera module of the present invention, the chip stabilization movable part 12 may not have the chip stabilization electrical connection part 123. In this case, the chip stabilization coils 132 of the chip stabilization driving part 13 are respectively mounted on the circuit board 31 of the photosensitive component 30 so that power is supplied to the chip stabilization coils 132 through the circuit board 31. At this time, the circuit board 31 of the photosensitive component 30 can be directly mounted on the back surface 1212 of the chip stabilization movable carrier 121.

[0223] Continue to refer to the appendix Figures 8 to 12 The movable carrier 121 for chip stabilization has multiple carrier notches 1214 extending from the front side 1211 to the back side 1212. The chip stabilization coils 132 of the chip stabilization drive unit 13 are held in these carrier notches 1214. Thus, with the chip stabilization electrical connection 123 attached to the back side 1212 of the movable carrier 121, the chip stabilization coils 132 of the chip stabilization drive unit 13 can extend through the multiple carrier notches 1214 toward the chip stabilization magnet 131. In other words, these carrier notches 1214 of the movable carrier 121 can form mounting positions 1210 for mounting the chip stabilization coils 132.

[0224] It is worth mentioning that the shape of the carrier notch 1214 of the chip image stabilization movable carrier 121 is not limited in the camera module of the present invention.

[0225] Preferably, in this embodiment of the camera module of the present invention, the chip stabilization coils 132 of the chip stabilization drive unit 13 are respectively attached to the chip stabilization electrical connection part 123. By attaching the chip stabilization electrical connection part 123 to the back surface 1212 of the chip stabilization movable carrier 121, the chip stabilization coils 132 can be respectively held in the carrier notches 1214 of the chip stabilization movable carrier 121.

[0226] Optionally, in other examples of the camera module of the present invention, the chip stabilization coils 132 of the chip stabilization drive unit 13 are respectively fixed to the chip stabilization movable carrier 121, and the chip stabilization coils 132 can be connected to the chip stabilization electrical connection unit 123 or to the circuit board 31 via connecting wires. In this case, the chip stabilization movable carrier 121 may not have the carrier notch 1214 provided.

[0227] Continue to refer to the appendix Figures 8 to 12 The chip driving assembly 10 further includes at least one chip anti-shake magnetic member 15, wherein the chip anti-shake magnetic member 15 is disposed on the chip anti-shake movable part 12, and the position of the chip anti-shake magnetic member 15 corresponds to the position of the chip anti-shake magnet 131 of the chip anti-shake driving part 13, so that the chip anti-shake magnetic member 15 and the chip anti-shake magnet 131 can cooperate with each other to generate a magnetic attraction force in the Z-axis direction to suspend the chip anti-shake movable part 12 in the receiving cavity 1101 of the chip anti-shake fixing part 11.

[0228] In other words, the magnetic attraction force generated in the Z-axis direction by the chip stabilization magnetic attraction component 15 and the chip stabilization magnet 131 of the chip stabilization drive unit 13 can ensure that a set of chip stabilization balls 122 of the chip stabilization movable part 12 is always in close contact with the upper cover 112 of the chip stabilization fixing part 11. Since a set of rollable chip stabilization balls 122 is provided between the carrier front 1211 of the chip stabilization movable carrier 121 and the inner wall of the upper cover 112, the chip stabilization movable part 12 and the chip stabilization fixing part 11 are in point friction contact. In this way, the chip stabilization drive unit 13 can smoothly drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, so as to realize the translational and / or rotational stabilization of the camera module.

[0229] Preferably, the movable chip stabilization carrier 121 has a set of retaining grooves 1215 formed on the carrier front 1211 of the movable chip stabilization carrier 121, wherein the chip stabilization ball 122 is rotatably held in the retaining grooves 1215 of the movable chip stabilization carrier 121. In this way, when the chip stabilization driving part 13 drives the movable chip stabilization part 12 to perform translational and / or rotational movements relative to the chip stabilization fixing part 11, the chip stabilization ball 122 can be prevented from detaching from the movable chip stabilization carrier 121 and the upper cover 112, thereby ensuring the reliability and stability of the camera module. Specifically, when the chip stabilization driving unit 13 drives the chip stabilization movable carrier 121 of the chip stabilization movable unit 12 to perform translational and / or rotational movements relative to the chip stabilization fixing unit 11, the movement trajectory of the chip stabilization ball 122 can be restricted within the retaining groove 1215 of the chip stabilization movable carrier 121, so that the chip stabilization ball 122 always supports the chip stabilization movable carrier 121 and the upper cover 112 of the chip stabilization fixing unit 11.

[0230] In other words, the retaining groove 1215 and the chip stabilization balls 122 of the movable chip stabilization carrier 121 can form a chip stabilization support 17 of the chip driving assembly 10. That is, the chip stabilization support 17 includes a set of chip stabilization balls 122 and a set of retaining grooves 1215, wherein the set of retaining grooves 1215 are respectively formed on the carrier front 122 of the movable chip stabilization carrier 121, and the set of chip stabilization balls 122 are respectively rotatably held in the retaining grooves 1215 and located between the movable chip stabilization carrier 121 and the upper cover 112. Thus, the chip stabilization support 17 can support the movable chip stabilization carrier 121 and the upper cover 112. The chip stabilization balls 122 can move along the plane formed by the X-axis and Y-axis within the retaining grooves 1215 to provide movement space for the movement of the movable chip stabilization part 12.

[0231] Furthermore, the movable chip stabilization carrier 121 has at least one extension post 1216, and the retaining groove 1215 is formed in the extension post 1216, with the opening of the retaining groove 1215 facing the upper cover 112 of the chip stabilization fixing part 11. The depth of the retaining groove 1215 is less than or equal to the diameter of the chip stabilization ball 122, such that at least a portion of the chip stabilization ball 122 can protrude from the retaining groove 1215, and the height of the chip stabilization ball 122 is greater than the height of the chip stabilization coil 132, so that the chip stabilization ball 122 can make point frictional contact with the extension post 1216 and the upper cover 112 of the movable chip stabilization carrier 121, respectively.

[0232] Understandably, with the above structural design, the upper part of the chip stabilization ball 122 faces the plane formed by the inner wall of the upper cover 112, and the lower part of the chip stabilization ball 122 faces the groove formed by the retaining groove 1215. Thus, on the one hand, the chip stabilization ball 122 can roll between the chip stabilization movable carrier 121 and the upper cover 112; on the other hand, the retaining groove 1215 can limit the chip stabilization ball 122 to prevent it from falling off, thereby ensuring the reliability of the camera module.

[0233] It is understood that the chip stabilization ball 122 creates a gap between the chip stabilization magnet 131 and the chip stabilization coil 132 to prevent direct contact between them. Preferably, the gap between the chip stabilization magnet 131 and the chip stabilization coil 132 is between 0.05 mm and 0.5 mm to ensure good electromagnetic induction between them.

[0234] Furthermore, the chip driving assembly 10 includes at least three chip stabilization support portions 17 to ensure smooth translation of the chip stabilization movable portion 12 along the X-axis and Y-axis and rotation around the Z-axis. That is, the chip stabilization movable portion 12 includes at least three chip stabilization balls 122, and the chip stabilization movable carrier 121 has at least three retaining grooves 1215.

[0235] Preferably, in the appendix Figures 8 to 12In this specific example of the camera module shown, the chip driving assembly 10 includes four chip stabilization support portions 17, which are respectively disposed between the first position group 12101 and the second position group 12102, and between the second position group 12102 and the third position group 12103. That is, the four chip stabilization support portions 17 of the chip driving assembly 10 are respectively located at the four corners of the chip stabilization movable portion 12, providing more stable support for the chip stabilization movable portion 12, while making full use of the internal space of the chip driving assembly 10 to make the structure of the chip driving assembly 10 more compact. Optionally, in other examples of the camera module of the present invention, the chip stabilization support portion 17 of the chip driving assembly 10 can be a slider, which is slidably held between the chip stabilization movable carrier 121 and the upper cover 112 for stable support of the chip stabilization movable portion 12. (Continue referring to the appendix...) Figures 8 to 12 The chip driving assembly 10 includes four chip stabilization magnetic components 15, each of which is disposed at each corner of the chip stabilization movable part 12. This ensures the flatness of the chip stabilization movable part 12 and allows the optical axis of the camera module to be perpendicular to the photosensitive surface of the photosensitive element 32 of the photosensitive assembly 30.

[0236] Continue to refer to the appendix Figures 8 to 12 In this specific example of the camera module of the present invention, the chip stabilization magnetic member 15 is disposed on the chip stabilization electrical connection portion 123 to optimize the structure of the camera module. Optionally, in other examples of the camera module of the present invention, the chip stabilization magnetic member 15 may be disposed on the chip stabilization movable carrier 121, or the chip stabilization magnetic member 15 may be disposed on the circuit board 31 of the photosensitive component 30, or the chip stabilization magnetic member 15 may be disposed between the chip stabilization movable carrier 121 and the chip stabilization electrical connection portion 123, or the chip stabilization magnetic member 15 may be disposed between the chip stabilization electrical connection portion 123 and the circuit board 31.

[0237] In some examples of the camera module of the present invention, the chip stabilization magnetic member 15 and the chip stabilization magnet 131 of the chip stabilization drive unit 13 can be perfectly aligned, that is, the chip stabilization magnetic member 15 can be located directly below the chip stabilization magnet 131 of the chip stabilization drive unit 13. In other examples of the camera module of the present invention, the chip stabilization magnetic member 15 and the chip stabilization magnet 131 of the chip stabilization drive unit 13 may not be perfectly aligned, and there may be some deviation between them.

[0238] It is understood that when the chip stabilization driving unit 13 drives the chip stabilization movable unit 12 to perform translational and / or rotational movements relative to the chip stabilization fixed unit 11, the chip stabilization magnetic attraction member 15 will synchronously generate translational and / or rotational movements relative to the chip stabilization fixed unit 11. At this time, some deviations will also occur between the chip stabilization magnetic attraction member 15 and the chip stabilization magnet 131. However, the plane where the chip stabilization magnetic attraction member 15 is located and the plane where the chip stabilization magnet 131 is located are always parallel, that is, the plane where the chip stabilization magnetic attraction member 15 is located and the plane where the chip stabilization magnet 131 is located are always orthogonal to the Z-axis. Therefore, the ability of the chip stabilization magnetic attraction member 15 and the chip stabilization magnet 131 to cooperate with each other and generate magnetic attraction in the Z-axis direction refers to the magnetic attraction between the plane where the chip stabilization magnetic attraction member 15 is located and the plane where the chip stabilization magnet 131 is located, including but not limited to the magnetic attraction in the vertical direction and the tilting magnetic attraction that deviates from the vertical direction.

[0239] Continue to refer to the appendix Figures 8 to 12 The chip driving component 10 further includes at least three chip stabilization position sensing elements 16, which respectively sense the position information of the chip stabilization movable part 12 in the X-axis direction translation, Y-axis direction translation, and Z-axis direction rotation by sensing the position information of the first magnet group 136, the second magnet group 137, and the third magnet group 138.

[0240] Preferably, the three chip stabilization position sensing elements 16 are defined as a first sensing element 161, a second sensing element 162, and a third sensing element 163, respectively. The first sensing element 161 is disposed in the coil space 13202 of the first coil 1321, corresponding to the first magnet 1311, wherein the first sensing element 161 is used to sense changes in the magnetic field during translation in the X-axis direction. The second sensing element 162 is disposed in the coil space 13202 of the fourth coil 1324, corresponding to the fourth magnet 1314, wherein the second sensing element 162 is used to sense changes in the magnetic field during translation in the Y-axis direction. The third sensing element 163 is disposed in the coil space 13202 of the fifth coil 1325, corresponding to the fifth magnet 1315, wherein the second sensing element 162 and the third sensing element 163 are used to sense changes in the magnetic field during rotation in the Z-axis direction.

[0241] Preferably, the chip anti-shake position sensing element 16 is mounted on the chip anti-shake electrical connection portion 123.

[0242] In the camera module of the present invention, the first coil group 133, the second coil group 134 and the third coil group 135 of the chip image stabilization drive unit 13 are independently controlled coil groups. Therefore, only three chip image stabilization position sensing elements 16 need to be set. This not only reduces the number of components in the chip drive assembly 10, but also helps to reduce the size of the chip drive assembly 10 by using fewer interfaces to realize translational image stabilization and / or rotational image stabilization sensing. Furthermore, it makes full use of the internal space of the chip drive assembly 10, making the structure of the chip drive assembly 10 compact.

[0243] It is worth mentioning that, in some embodiments of the camera module of the present invention, the chip stabilization position sensing element 16 may be a Hall element. In other embodiments of the camera module of the present invention, the chip stabilization position sensing element 16 may be a driver IC, which is adapted to control the current of the chip stabilization coil 132 while acquiring the position change of the chip stabilization magnet 131. Specifically, when the camera module activates the image stabilization function, the chip image stabilization position sensing element 16 can sense the current positions of the first magnet group 136, the second magnet group 137, and the third magnet group 138, and drive the chip image stabilization movable part 12 to move to the sensed center position by controlling the current of the first coil group 133, the second coil group 134, and the third coil group 135. When the camera module deactivates the image stabilization function, the chip image stabilization movable part 12 returns to its initial position through the counterforce of the circuit board 31 of the photosensitive component 30 (i.e., the elastic force accumulated by the circuit board 31 due to elastic deformation when the chip image stabilization movable part 12 is translated and / or rotated).

[0244] Appendix Figure 13 A modified example of the camera module of the present invention is shown, in conjunction with Figures 1 to 12. Figure 12 Unlike the camera module shown, the attached... Figure 13In this modified example of the camera module shown, the first coil group 133 includes four image stabilization coils 132, wherein two of the image stabilization coils 132 constituting the first coil group 133 are symmetrically arranged at one end of the second chip side 322 and the fourth chip side 324 of the photosensitive element 32, and the other two image stabilization coils 132 are symmetrically arranged at the other end of the second chip side 322 and the fourth chip side 324 of the photosensitive element 32. The four retaining grooves 1215 of the chip stabilization movable carrier 121 are respectively formed in the middle of the first chip side 321, the second chip side 322, the third chip side 323 and the fourth chip side 324 of the photosensitive element 32, so that the four ball bearings 122 are rotatably held between the carrier front 1211 and the inner wall of the upper cover 112 of the chip stabilization movable carrier 121 in the middle of the first chip side 321, the second chip side 322, the third chip side 323 and the fourth chip side 324 of the photosensitive element 32.

[0245] Appendix Figure 9A and Figure 9B A modified example of the camera module according to the present invention is shown, in conjunction with Figures 1 to 12. Figure 12 Unlike the camera module shown, the attached... Figure 9A and Figure 9B In this specific example of the camera module shown, the lens focusing fixing unit 422 further includes a base magnetic shielding element 470, which is disposed on the lens drive base 440 so that the lens drive base 440 holds the base magnetic shielding element 470 at the bottom of the lens stabilization magnets 4131 of the lens stabilization drive unit 413, thereby reducing the magnetic field overflowing from the lens stabilization magnets 4131 toward the photosensitive assembly 30, and thus reducing the magnetic interference of the magnetic field on the circuit board, photosensitive element and other components of the photosensitive assembly 30.

[0246] It is worth mentioning that the manner in which the base magnetic shielding element 470 is disposed on the lens drive base 440 is not limited in the camera module of the present invention. For example, the base magnetic shielding element 470 can be disposed on the lens drive base 440 by adhesive bonding, or the base magnetic shielding element 470 can be disposed on the surface or inside of the lens drive base 440 by insert injection molding.

[0247] Appendix Figure 15A and Figure 15B The camera module according to another preferred embodiment of the present invention, and Figures 1 to 2018. Figure 12 Unlike the camera module shown, the attached... Figure 15A and Figure 15B In this specific example of the camera module shown, the lens focusing drive unit 423 has one lens focusing magnet 4231 and one lens focusing coil 4232. The lens focusing magnet 4231 is located in the center of the inner lens focusing frame periphery 42023 of the inner lens focusing frame 420, and the lens focusing coil 4232 is located in the center of the outer lens focusing frame 430. Correspondingly, the center of the outer lens focusing frame 430 has a coil through-hole 4304 to accommodate the lens focusing coil 4232.

[0248] Preferably, the lens focusing unit 42 may include a lens focusing position sensing element 4252, which is disposed outside the lens focusing coil 4232, and the lens focusing position sensing element 4252 corresponds to the lens focusing magnet 4231. In this way, the lens focusing position sensing element 4252 obtains the position of the lens focusing inner frame 420 by sensing the position change of the lens focusing magnet 4231.

[0249] Optionally, in other examples of the camera module of the present invention, the lens focus position sensing element 4252 may be located in the middle of the lens focus coil 4232. By placing the lens focus position sensing element 4252 in the middle of the lens focus coil 4232, the lens focus position sensing element 4252 can be surrounded by the lens focus coil 4232. Thus, on the one hand, the lens focusing part 42 can ensure that the lens focus position sensing element 4252 is directly facing the lens focus magnet 4231, which is beneficial to improving sensing accuracy; on the other hand, by placing the lens focus position sensing element 4252 in the middle position of the lens focus coil 4232, the structure of the lens focusing part 42 can be made more compact, thereby optimizing the structure of the lens drive assembly 40.

[0250] With reference to Figures 1 to 1 Figure 12 The camera module shown is different from the one in the attached image. Figures 16A to 20B In this preferred example of the camera module shown, the lens stabilization drive unit 413 includes four lens stabilization magnets 4131 and four lens stabilization coils 4132, wherein the four lens stabilization magnets 4131 are sequentially defined as a first stabilization magnet 4131a, a second stabilization magnet 4131b, a third stabilization magnet 4131c, and a fourth stabilization magnet 4131d, and the four lens stabilization coils 4132 are sequentially defined as a first stabilization coil 4132a, a second stabilization coil 4132b, a third stabilization coil 4132c, and a fourth stabilization coil 4132d.

[0251] The first image stabilizing magnet 4131a, the second image stabilizing magnet 4131b, the third image stabilizing magnet 4131c, and the fourth image stabilizing magnet 4131d are respectively fixed to the lens image stabilization carrier 410. The first image stabilizing coil 4132a, the second image stabilizing coil 4132b, the third image stabilizing coil 4132c, and the fourth image stabilizing coil 4132d are respectively fixed to the lens focusing inner frame 420. The first image stabilizing magnet 4131a corresponds to the first image stabilizing coil 4132a, the second image stabilizing magnet 4131b corresponds to the second image stabilizing coil 4132b, the third image stabilizing magnet 4131c corresponds to the third image stabilizing coil 4132c, and the fourth image stabilizing magnet 4131d corresponds to the fourth image stabilizing coil 4131d. Corresponding to the image stabilization coil 4132d, when the first image stabilization coil 4132a, the second image stabilization coil 4132b, the third image stabilization coil 4132c, and the fourth image stabilization coil 4132d are energized to generate magnetic fields, the magnetic fields of the first image stabilization coil 4132a, the second image stabilization coil 4132b, the third image stabilization coil 4132c, and the fourth image stabilization coil 4132d interact with the magnetic fields of the first image stabilization magnet 4131a, the second image stabilization magnet 4131b, the third image stabilization magnet 4131c, and the fourth image stabilization magnet 4131d to drive the lens stabilization carrier 410 to move the optical lens 21 in a plane perpendicular to the optical axis of the camera module, thereby achieving image stabilization of the camera module.

[0252] Preferably, the top surface 4101 of the lens image stabilization carrier 410 is provided with four image stabilization magnet grooves 4104, which are respectively used to accommodate the first image stabilization magnet 4131a, the second image stabilization magnet 4131b, the third image stabilization magnet 4131c, and the fourth image stabilization magnet 4131d. Based on the positions of the first image stabilization magnet 4131a, the second image stabilization magnet 4131b, the third image stabilization magnet 4131c, and the fourth image stabilization magnet 4131d, the four image stabilization magnet grooves 4104 are sequentially defined as a first magnet groove 4104a, a second magnet groove 4104b, a third magnet groove 4104c, and a fourth magnet groove 4104d.

[0253] In other words, the first image stabilizing magnet 4131a is housed in the first magnet groove 4104a of the lens image stabilizing carrier 410, the second image stabilizing magnet 4131b is housed in the second magnet groove 4104b of the lens image stabilizing carrier 410, the third image stabilizing magnet 4131c is housed in the third magnet groove 4104c of the lens image stabilizing carrier 410, and the fourth image stabilizing magnet 4131d is housed in the fourth magnet groove 4104d of the lens image stabilizing carrier 410.

[0254] The lens stabilization carrier 410 has a near side 41001, a far side 41002, and two side sides 41003. The near side 41001 and the far side 41002 correspond to each other, and the two side sides 41003 correspond to each other. The opposite ends of the two side sides 41003 extend to be connected to the ends of the near side 41001 and the far side 41002, respectively. The side of the lens stabilization carrier 410 closest to the lens focusing frame 430 is defined as the near side 41001. Correspondingly, the side of the lens stabilization carrier 410 furthest from the lens focusing frame 430 is defined as the far side 41002. The other two sides of the lens stabilization carrier 410 are defined as the side sides 41003.

[0255] The second magnetic groove 4104b and the third magnetic groove 4104c are disposed side-by-side on the distal side 41002 of the lens stabilization carrier 410, the first magnetic groove 4104a is disposed on one side 41003 of the lens stabilization carrier 410, and the fourth magnetic groove 4104d is disposed on the other side 41003 of the lens stabilization carrier 410, and the first magnetic groove 4104a and the second magnetic groove 4104b are parallel to each other. The second image stabilizing magnet 4131b and the third image stabilizing magnet 4131c are disposed side-by-side on the distal side 41002 of the lens image stabilization carrier 410, the first image stabilizing magnet 4131a is disposed on one side 41003 of the lens image stabilization carrier 410, and the fourth image stabilizing magnet 4131d is disposed on the other side 41003 of the lens image stabilization carrier 410, and the first image stabilizing magnet 4131a and the fourth image stabilizing magnet 4131d are parallel to each other. It can be understood that the first image stabilizing magnet 4131a and the second image stabilizing magnet 4131b are disposed adjacent to each other, and the third image stabilizing magnet 4131c and the fourth image stabilizing magnet 4131d are disposed adjacent to each other.

[0256] Preferably, the extension direction of the first anti-shake magnet 4131a is perpendicular to the extension direction of the second anti-shake magnet 4131b, the extension direction of the third anti-shake magnet 4131c is perpendicular to the extension direction of the fourth anti-shake magnet 4131d, and the first anti-shake magnet 4131a and the fourth anti-shake magnet 4131d are arranged axially symmetrically, while the second anti-shake magnet 4131b and the third anti-shake magnet 4131c are arranged axially symmetrically.

[0257] Preferably, the dimensions of the second image stabilizing magnet 4131b and the third image stabilizing magnet 4131c are smaller than the dimensions of the first image stabilizing magnet 4131a and the fourth image stabilizing magnet 4131d. This helps to reduce the lateral dimension of the lens image stabilizing carrier 410, thereby reducing the lateral dimension of the lens drive assembly 420.

[0258] Optionally, in other examples of the camera module of the present invention, the distal side 41002 of the lens stabilization carrier 410 may be provided with a stabilization magnet groove 4104 and a lens stabilization magnet 4131. In this case, the size of the lens stabilization magnet 4131 disposed on the distal side 41002 of the lens stabilization carrier 410 is the same as the size of the lens stabilization magnet 4131 disposed on the side 41003 of the lens stabilization carrier 410. It is understood that in this embodiment, the lens stabilization drive unit 413 includes three lens stabilization magnets 4131 and three lens stabilization coils 4132.

[0259] The first image stabilization coil 4132a, the second image stabilization coil 4132b, the third image stabilization coil 4132c, and the fourth image stabilization coil 4132d are all fixed to the bottom surface 42012 of the inner frame of the lens focusing inner frame 420 via the lens stabilization circuit board 414. For example, the first image stabilization coil 4132a, the second image stabilization coil 4132b, the third image stabilization coil 4132c, and the fourth image stabilization coil 4132d are respectively mounted on the lens image stabilization circuit board 414. The lens image stabilization circuit board 414 is fixed to the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame 420. Thus, the first image stabilization coil 4132a, the second image stabilization coil 4132b, the third image stabilization coil 4132c, and the fourth image stabilization coil 4132d are all fixed to the bottom surface 42012 of the inner frame of the top 4201 of the lens focusing inner frame 420 through the lens image stabilization circuit board 414.

[0260] Continue to refer to the appendix Figures 16A to 20B The lens stabilization unit 41 further includes two lens stabilization position sensing elements 415, which are respectively fixedly disposed on the lens stabilization circuit board 414. One lens stabilization position sensing element 415 is disposed in the middle of the second stabilization coil 4132b to sense the position change of the second stabilization magnet 4131b, and the other lens stabilization position sensing element 415 is disposed outside the fourth stabilization coil 4132d to sense the position change of the fourth stabilization magnet 4131d, thereby obtaining the position of the lens stabilization carrier 410.

[0261] Continue to refer to the appendix Figures 16A to 20B The first image stabilization and anti-collision unit 4181, the second image stabilization and anti-collision unit 4182, the third image stabilization and anti-collision unit 4183, and the fourth image stabilization and anti-collision unit 4184 of the lens image stabilization unit 41 are respectively disposed on the four sides of the lens image stabilization carrier 410, and the first image stabilization and anti-collision unit 4181, the second image stabilization and anti-collision unit 4182, the third image stabilization and anti-collision unit 4183, and the fourth image stabilization and anti-collision unit 4184 each include two image stabilization and anti-collision protrusions 4180 protruding from the side of the lens image stabilization carrier 410.

[0262] In the appendix Figures 16A to 20B In this specific example of the camera module of the present invention shown, the lens stabilization magnetic unit 416 fixed to the inner lens focusing frame 420 is disposed above the four lens stabilization magnets 4131. That is, the first stabilization magnet 4131a, the second stabilization magnet 4131b, the third stabilization magnet 4131c, and the fourth stabilization magnet 4131d correspond to different positions of the lens stabilization magnetic unit 416, so that the lens stabilization magnetic unit 416 and the lens stabilization magnets 4131 attract each other due to magnetic attraction, and under the action of the lens stabilization support unit 417, the lens stabilization carrier 410 is suspended in the receiving cavity 4203 of the inner lens focusing frame 420.

[0263] Preferably, the lens image stabilization magnetic unit 416 is configured to electrically connect the lens image stabilization circuit board 414 and the lens focusing circuit board 424. Specifically, refer to the attached drawing. Figure 16C The lens stabilization magnetic unit 416 includes four conductive elements 4161 spaced apart from each other, which are respectively defined as a first conductive element 4161a, a second conductive element 4161b, a third conductive element 4161c, and a fourth conductive element 4161d. The first conductive element 4161a and the second conductive element 4161b are respectively disposed above the first stabilizing magnet 4131a and the second stabilizing magnet 4131b, thereby providing an upward magnetic attraction force for the first stabilizing magnet 4131a and the second stabilizing magnet 4131b. The third conductive element 4161c and the fourth conductive element 4161d are respectively disposed above the third stabilizing magnet 4131c and the fourth stabilizing magnet 4131d, thereby providing an upward magnetic attraction force for the third stabilizing magnet 4131c and the fourth stabilizing magnet 4131d.

[0264] Preferably, the first conductive element 4161a, the second conductive element 4161b, the third conductive element 4161c, and the fourth conductive element 4161d are respectively embedded in the lens focusing inner frame 420 by insert injection molding, and the first conductive element 4161a, the second conductive element 4161b, the third conductive element 4161c, and the fourth conductive element 4161d are not connected to the lens focusing magnetic guiding unit 4210. The first ends of the first conductive element 4161a, the second conductive element 4161b, the third conductive element 4161c, and the fourth conductive element 4161d are electrically connected to the lens image stabilization circuit board 414 by welding or other means, and the second ends are electrically connected to the lens focusing circuit board 424 by welding or other means. In this way, the lens image stabilization magnetic unit 416 is electrically connected to the lens image stabilization circuit board 414 and the lens focusing circuit board 424.

[0265] The connecting portion 4242 of the lens focusing circuit board 424 is distributed along the four sides of the top surface 42011 of the inner frame of the lens focusing inner frame 420, and is distributed in a circular manner around the inner frame channel 42013 of the lens focusing inner frame 420.

[0266] Furthermore, the connecting portion 4242 of the lens focusing circuit board 424 includes a movable electrical connection portion 42421 and four deformable electrical connection portions 42422. The movable electrical connection portion 42421 is fixed to the inner lens focusing frame 420 and electrically connected to the lens image stabilization magnetic unit 416. The four deformable electrical connection portions 42422 are electrically connected to the mounting portion 4241 and the movable electrical connection portion 42421. When the inner lens focusing frame 420 is driven to move relative to the outer lens focusing frame 430 along the optical axis of the camera module, the four deformable electrical connection portions 42422 can reduce the resistance of the lens focusing circuit board 424 to the movement of the inner lens focusing frame 420, thereby allowing the inner lens focusing frame 420 to be driven smoothly.

[0267] Specifically, the four deformable electrical connections 42422 are sequentially defined as a first connection 42422a, a second connection 42422b, a third connection 42422c, and a fourth connection 42422d. The first connection 42422a and the third connection 42422c are arranged symmetrically, as are the second connection 42422b and the fourth connection 42422d. The first connection 42422a and the second connection 42422b are connected and used to conduct electricity between the mounting portion 4241 and the movable electrical connection 42421. Correspondingly, the third connection 42422c and the fourth connection 42422d are connected and used to conduct electricity between the mounting portion 4241 and the movable electrical connection 42421.

[0268] Appendix Figures 21A to 22B Another embodiment of the camera module of the present invention is shown, which is illustrated in Figures 1 to 12. Figure 12 The difference in the camera module shown lies in the specific structure of the chip driver component 10. Specifically, in the attached... Figures 21A to 22B In this specific example of the camera module shown, the chip stabilization magnets 131 of the chip stabilization drive unit 13 are respectively disposed on the chip stabilization movable part 12, and the chip stabilization coils 132 are respectively disposed on the chip stabilization fixed part 11. The chip stabilization magnets 131 and the chip stabilization coils 132 correspond to each other. The magnetic field generated by the chip stabilization coils 132 after being energized and the magnetic field of the chip stabilization magnets 131 can interact to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixed part 11, thereby realizing translational and / or rotational stabilization of the camera module. For example, the chip stabilization magnets 131 and the chip stabilization coils 132 of the chip stabilization drive unit 13 can interact to drive the chip stabilization movable part 12 to perform translational motion relative to the chip stabilization fixed part 11 along the X-axis and / or Y-axis directions, thereby achieving translational stabilization of the camera module. The chip stabilization magnets 131 and the chip stabilization coils 132 of the chip stabilization drive unit 13 can also interact to drive the chip stabilization movable part 12 to perform rotational motion relative to the chip stabilization fixed part 11 about the Z-axis direction, thereby achieving rotational stabilization of the camera module.

[0269] Preferably, in the appendix Figures 21A to 22BIn the camera module shown, the chip stabilization magnets 131 of the chip stabilization drive unit 13 are respectively disposed on the chip stabilization movable carrier 121 of the chip stabilization movable unit 12. Correspondingly, the chip stabilization coils 132 of the chip stabilization drive unit 13 are respectively disposed on the upper cover 112 of the chip stabilization fixing unit 11, and each chip stabilization magnet 131 and each chip stabilization coil 132 correspond one-to-one.

[0270] Preferably, the chip stabilization magnets 131 of the chip stabilization drive unit 13 are respectively installed in the mounting positions 1210 of the chip stabilization movable carrier 121.

[0271] Continue to refer to the appendix Figures 21A to 22B The chip anti-shake electrical connection portion 123 is attached to the inner wall of the upper cover 112, and the connection opening 1231 of the chip anti-shake electrical connection portion 123 corresponds to and communicates with the top opening 1102 of the chip anti-shake fixing portion 11, so as to prevent the chip anti-shake electrical connection portion 123 from blocking the light entering the interior of the chip driving assembly 10 through the top opening 1102 of the chip anti-shake fixing portion 11. The chip anti-shake coils 132 of the chip anti-shake driving portion 13 can be respectively attached to the chip anti-shake electrical connection portion 123, so that the chip anti-shake coils 132 are set on the upper cover 112 through the chip anti-shake electrical connection portion 123.

[0272] In addition, the chip stabilization electrical connection 123 may have a plurality of clearance positions 1232, the size of which is larger than the size of the extension post 1216 of the chip stabilization movable carrier 121, so as to ensure that the chip stabilization movable part 12 can be driven to translate along the X-axis and / or Y-axis and / or rotate around the Z-axis.

[0273] Optionally, in other examples of the camera module of the present invention, the camera module may not have the chip stabilization electrical connection part 123. Instead, the chip stabilization coils 132 of the chip stabilization drive part 13 may be directly disposed on the upper cover 112, and the chip stabilization coils 132 may be connected to the circuit board 31 of the photosensitive component 30 through connecting wires.

[0274] Continue to refer to the appendix Figures 21A to 22BThe chip anti-shake magnetic members 15 of the chip driving assembly 10 are respectively disposed on the upper cover 112 of the chip anti-shake fixing part 11, and the positions of the chip anti-shake magnetic members 15 correspond to the positions of the chip anti-shake magnets 131 of the chip anti-shake driving part 13. In this way, the chip anti-shake magnetic members 15 and the chip anti-shake magnets 131 can cooperate with each other to generate magnetic attraction in the Z-axis direction, so as to suspend the chip anti-shake movable part 12 in the receiving cavity 1101 of the chip anti-shake fixing part 11.

[0275] Optionally, in other examples of the camera module of the present invention, the chip stabilization magnetic components 15 of the chip driving assembly 10 may be disposed in the chip stabilization electrical connection portion 123, or the chip stabilization magnetic components 15 may be disposed between the chip stabilization electrical connection portion 123 and the upper cover 112.

[0276] In the appendix Figure 23 In this modified example of the camera module shown, the chip stabilization magnetic guide member 14 of the chip driving assembly 10 is located below the chip stabilization magnet 131. Thus, on the one hand, the chip stabilization magnetic guide member 14 can strengthen the magnetic field upwards (i.e., in the direction of the chip stabilization coil 132), so that the chip stabilization driving part 13 has sufficient driving force to drive the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixed part 11; on the other hand, the chip stabilization magnetic guide member 14 can prevent the magnetic field of the chip stabilization magnet 131 from leaking out, thereby avoiding interference with the circuit board 31 and the photosensitive element 32 of the photosensitive assembly 30.

[0277] Specifically, the chip anti-shake magnetic conductive component 14 is disposed on the chip anti-shake movable carrier 121, and the chip anti-shake magnet 131 is disposed on the chip anti-shake magnetic conductive component 14. That is, the chip anti-shake magnet 131 is disposed on the chip anti-shake movable carrier 121 by being disposed on the chip anti-shake magnetic conductive component 14.

[0278] It is worth mentioning that the manner in which the chip-based image stabilization magnetic guide component 14 is disposed on the chip-based image stabilization movable carrier 121 is not limited in the camera module of the present invention. For example, in some embodiments of the camera module of the present invention, after the chip-based image stabilization magnetic guide component 14 and the chip-based image stabilization movable carrier 121 are respectively molded, the chip-based image stabilization magnetic guide component 14 can be disposed on the chip-based image stabilization movable carrier 121 by means of adhesive bonding. In other embodiments of the camera module of the present invention, when the chip-based image stabilization movable carrier 121 is injection molded, the chip-based image stabilization movable carrier 121 can be integrally molded on the chip-based image stabilization magnetic guide component 14, thus disposing the chip-based image stabilization magnetic guide component 14 on the chip-based image stabilization movable carrier 121.

[0279] With reference to Figures 1 to 1 Figure 12 Unlike the camera module shown, the attached... Figure 24 In this modified example of the camera module shown, the chip driving assembly 10 may not have the chip stabilization magnetic member 15, and the chip stabilization ball bearing 122 may not be provided between the chip stabilization movable carrier 121 and the upper cover 112. Specifically, the chip driving assembly 10 further includes a suspension portion 18 for suspending the chip stabilization movable portion 12 in the receiving cavity 1101 of the chip stabilization fixing portion 11.

[0280] Specifically, the suspension portion 18 includes at least three elastic suspension elements 181. The top end of each suspension element 181 is connected to the upper cover 112 of the chip stabilization fixing portion 11, and the bottom end of each suspension element 181 is connected to the chip stabilization movable carrier 121 of the chip stabilization movable portion 12. Thus, the chip stabilization movable portion 12 is suspended in the receiving cavity 1101 of the chip stabilization fixing portion 11 by these suspension elements 181.

[0281] When the chip stabilization coil 132 of the chip stabilization drive unit 13 is energized, allowing the chip stabilization coil 132 and the chip stabilization magnet 131 to cooperate in driving the chip stabilization movable part 12 to perform translational and / or rotational movements relative to the chip stabilization fixed part 11, the chip stabilization fixed part 11 drives the suspension elements 181, causing the suspension elements 181 to deform. Correspondingly, when the chip stabilization coil 132 of the chip stabilization drive unit 13 is de-energized, the suspension elements 181 can drive the chip stabilization movable part 12 to return to its initial position during the process of restoring its initial state.

[0282] Preferably, the suspension portion 18 includes four suspension elements 181, the top ends of which are respectively connected to the four corners of the upper cover 112, and the bottom ends of which are respectively connected to the four corners of the chip stabilization movable carrier 121. Thus, the four suspension elements 181 of the suspension portion 18 can cooperate with each other to ensure that the chip stabilization movable portion 12 can smoothly translate and / or rotate within the receiving cavity 1101 of the chip stabilization fixing portion 11. At this time, each chip stabilization coil 132 of the chip stabilization driving portion 13 is respectively disposed on each side of the chip stabilization movable portion 12 to form a clearance.

[0283] Optionally, in other examples of the camera module of the present invention, the top ends of the four suspension elements 181 of the suspension portion 18 are respectively connected to the middle of the four sides of the upper cover 112, and the bottom ends of the four suspension elements 181 are respectively connected to the middle of the four sides of the chip stabilization movable carrier 121. Thus, the four suspension elements 181 of the suspension portion 18 can cooperate with each other to ensure that the chip stabilization movable portion 12 can smoothly translate and / or rotate within the receiving cavity 1101 of the chip stabilization fixing portion 11. In this case, each chip stabilization coil 132 of the chip stabilization driving portion 13 is respectively disposed at each corner of the chip stabilization movable portion 12 to form a clearance.

[0284] It is worth mentioning that the type of the suspension element 181 of the suspension portion 18 is not limited in the camera module of the present invention. For example, the suspension element 181 can be a suspension wire, a spring, a spring sheet, a folded body, etc. (See attached diagram) Figures 21A to 22B Unlike the camera module shown, the attached... Figure 25 In this modified example of the camera module shown, the chip driving assembly 10 may not have the chip stabilization magnetic member 15, and the chip stabilization ball bearing 122 may not be provided between the chip stabilization movable carrier 121 and the upper cover 112. Specifically, with the attached... Figure 24 Similar to the camera module shown, in the attached Figure 25 In this specific example of the camera module shown, the chip driving assembly 10 suspends the chip stabilization movable part 12 in the receiving cavity 1101 of the chip stabilization fixing part 11 via the suspension part 18.

[0285] Optionally, in other examples of the camera module of the present invention, the chip driving assembly 10 includes two suspension portions 18, wherein the top end of the suspension elements 181 of one suspension portion 18 is connected to the upper cover 112 and the bottom end is connected to the chip stabilization movable carrier 121, and the top end of the suspension elements 181 of the other suspension portion 18 is connected to the chip stabilization movable carrier 1212 and the bottom end is connected to the base 111, so that the two suspension portions 18 cooperate with each other to suspend the chip stabilization movable portion 12 in the receiving cavity 1101 of the chip stabilization fixing portion 11.

[0286] Appendix Figure 26 Another preferred example of the camera module of the present invention is shown, wherein the chip stabilization magnetic member 15 is disposed on the chip stabilization movable part 12, and the chip stabilization magnetic member 15 corresponds to the chip stabilization magnet 131 to generate a magnetic attraction in the Z-axis direction, causing the chip stabilization movable part 12 to tend to approach the upper cover 112 of the chip stabilization fixed part 11. The top ends of the suspension elements 181 of the suspension part 18 are connected to the chip stabilization movable carrier 121 of the chip stabilization movable part 12, and the bottom ends are connected to the base 111 of the chip stabilization fixed part 11 to prevent the chip stabilization movable part 12 from moving toward the chip stabilization fixed part 11. In this way, the chip stabilization movable part 12 can be suspended in the receiving cavity 1101 of the chip stabilization fixed part 11.

[0287] Appendix Figures 27A to 29B The diagram illustrates the current direction and force direction of each chip stabilization coil 132 of the chip stabilization drive unit 13 when the chip stabilization movable part 12 translates along the X-axis, translates along the Y-axis, and rotates around the Z-axis, wherein the first coil 1321 and the second coil 1322 are connected in series, the third coil 1323 and the fourth coil 1324 are connected in series, and the fifth coil 1325 and the sixth coil 1326 are connected in series.

[0288] Reference Appendix Figure 27A and Figure 27B When a clockwise current is applied to the first coil 1321 and a counterclockwise current is applied to the second coil 1322, the first coil 1321 and the second coil 1322 are subjected to Lorentz force under the action of the magnetic field, causing the chip anti-shake movable part 12 to drive the photosensitive component 30 to translate in the negative direction of the X-axis for compensation, so as to realize the translational anti-shake of the camera module in the X-axis direction.

[0289] Continue to refer to the appendix Figure 27AArrow I indicates the direction of current, and symbol F indicates the force on the chip's anti-shake coil 132. During translational anti-shake in the X-axis direction, the current flowing through the first coil 1321 and the second coil 1322 is the same. At this time, the force on the first coil 1321 and the second coil 1322 is the same in magnitude and direction.

[0290] Conversely, when the first coil 1321 is supplied with a counterclockwise current and the second coil 1322 is supplied with a clockwise current, the first coil 1321 and the second coil 1322 are subjected to Lorentz force under the action of the magnetic field, causing the chip anti-shake movable part 12 to drive the photosensitive component 30 to translate along the positive X-axis for compensation, so as to realize the translational anti-shake of the camera module in the X-axis direction.

[0291] Reference Appendix Figure 28A and Figure 28B When a clockwise current is applied to the third coil 1323, a counterclockwise current is applied to the fourth coil 1324, a clockwise current is applied to the fifth coil 1325, and a counterclockwise current is applied to the sixth coil 1326, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to Lorentz force under the action of a magnetic field. This causes the chip anti-shake movable part 12 to drive the photosensitive component 30 to translate along the positive Y-axis for compensation, thereby achieving translational anti-shake in the Y-axis direction of the camera module.

[0292] Continue to refer to the appendix Figure 28A Arrow I indicates the direction of current, and symbol F indicates the force on the chip's anti-shake coil 132. During translational anti-shake in the Y-axis direction, the currents supplied to the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are of the same magnitude. At this time, the forces on the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are of the same magnitude and in the same direction.

[0293] Conversely, when the third coil 1323 is supplied with a counterclockwise current, the fourth coil 1324 with a clockwise current, the fifth coil 1325 with a counterclockwise current, and the sixth coil 1326 with a clockwise current, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to Lorentz force under the action of the magnetic field. This causes the chip stabilization movable part 12 to drive the photosensitive component 30 to translate along the negative Y-axis for compensation, thereby achieving translational stabilization of the camera module in the Y-axis direction.

[0294] Reference Appendix Figure 29A and Figure 29B When a clockwise current is applied to the third coil 1323, a counterclockwise current is applied to the fourth coil 1324, a counterclockwise current is applied to the fifth coil 1325, and a clockwise current is applied to the sixth coil 1326, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to Lorentz force under the action of a magnetic field. This causes the chip anti-shake movable part 12 to drive the photosensitive component 30 to rotate clockwise around the Z-axis for compensation, thereby achieving rotational anti-shake in the Z-axis direction of the camera module.

[0295] Continue to refer to the appendix Figure 29A Arrow I indicates the direction of current, and symbol F indicates the force on the chip's anti-shake coil 132. During the rotational image stabilization process in the Z-axis direction, the currents supplied to the third coil 1323 and the fifth coil 1325 are of the same magnitude but opposite in direction, and the currents supplied to the fourth coil 1324 and the sixth coil 1326 are of the same magnitude but opposite in direction. This results in the second coil group 134 located on the fourth chip side 324 of the photosensitive element 32 and the third coil group 135 located on the second chip side 322 of the photosensitive element 32 experiencing the same magnitude but opposite direction of force. That is, the fifth coil 1325 and the sixth coil 1326 located on the second chip side 322 of the photosensitive element 32 are subjected to a force in the negative direction along the Y-axis, while the third coil 1323 and the fourth coil 1324 located on the fourth chip side 324 of the photosensitive element 32 are subjected to a force in the positive direction along the Y-axis. This enables the chip image stabilization movable part 12 to rotate around the Z-axis, thereby achieving rotational image stabilization of the camera module.

[0296] Conversely, when the third coil 1323 is supplied with a counterclockwise current, the fourth coil 1324 with a clockwise current, the fifth coil 1325 with a clockwise current, and the sixth coil 1326 with a counterclockwise current, the third coil 1323, the fourth coil 1324, the fifth coil 1325, and the sixth coil 1326 are subjected to Lorentz force under the action of the magnetic field. This causes the chip anti-shake movable part 12 to drive the photosensitive component 30 to rotate counterclockwise around the Z-axis for compensation, thereby achieving rotational anti-shake in the Z-axis direction of the camera module.

[0297] Furthermore, when the chip stabilization movable part 12 moves the photosensitive component 30 along the X-axis, the first sensing element 161 can sense a significant change in the magnetic field and provide feedback on the change. When the chip stabilization movable part 12 moves the photosensitive component 30 along the Y-axis and rotates it around the Z-axis, the first sensing element 161 fails to sense a significant change in the magnetic field, while the second sensing element 162 and the third sensing element 163 can sense a significant change in the magnetic field. For the change in the magnetic field during translation along the Y-axis, the average of the sum of the sensing values ​​of the second sensing element 162 and the third sensing element 163 is used as a compensation value. For the change in the magnetic field during rotation around the Z-axis, the average of the difference between the sensing values ​​of the second sensing element 162 and the third sensing element 163 is used as a compensation value, where the sensing value is positive in the positive direction and negative in the negative direction.

[0298] Appendix Figure 30 A modified example of the camera module of the present invention is shown, in conjunction with Figures 1 to 12. Figure 12 The camera module shown here has the lens driver base 440 of the lens driver assembly 40 mounted on the upper cover 112 of the chip driver assembly 10. However, unlike the previous version, the attached... Figure 30 In this specific example of the camera module shown, the lens driving assembly 40 may not have the lens driving base 440. Instead, the lens driving housing 450 of the lens driving assembly 40 can be directly attached to the upper cover 112 of the chip driving assembly 10, which can further reduce the height of the camera module.

[0299] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the accompanying drawings are merely examples and do not limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functions and structural principles of the present invention have been demonstrated and explained in the embodiments, and any variations or modifications may be made to the implementation of the present invention without departing from the stated principles.

Claims

1. A lens driving assembly, characterized in that, include: One lens focuses on the outer frame; A lens focusing inner frame, wherein the lens focusing inner frame is suspended to the side of the lens focusing outer frame, wherein the lens focusing inner frame has a receiving cavity. A lens stabilization carrier, wherein the lens stabilization carrier is suspended in the receiving cavity of the inner focusing frame of the lens; A lens focusing drive unit, wherein the lens focusing drive unit includes at least one corresponding lens focusing magnet and at least one lens focusing coil, the lens focusing magnet being disposed in one of the lens focusing outer frame and the lens focusing inner frame, and the lens focusing coil being disposed in the other of the lens focusing outer frame and the lens focusing inner frame. A lens image stabilization drive unit, wherein the lens image stabilization drive unit includes at least two corresponding lens image stabilization magnets and at least two lens image stabilization coils, wherein the lens image stabilization magnets are disposed in one of the lens focusing inner frame and the lens image stabilization carrier, and the lens image stabilization coils are disposed in the other of the lens focusing inner frame and the lens image stabilization carrier; and At least one lens stabilization magnetic unit, wherein the lens stabilization magnetic unit is disposed on the top of a lens focusing inner frame of the lens focusing inner frame, and the lens stabilization magnetic unit and the lens stabilization magnet correspond to each other so that a magnetic attraction force in the height direction is generated between them, thereby suspending the lens stabilization carrier in the receiving cavity of the lens focusing inner frame. The center of the lens stabilizing magnet is higher than the center of the lens focusing magnet.

2. The lens drive assembly according to claim 1, wherein the height position of the lens stabilizing magnet is lower than the height position of the lens focusing magnet.

3. The lens drive assembly according to claim 1, wherein the lens stabilization magnet is disposed on the top surface of the lens stabilization carrier, and the lens stabilization coil is disposed on the bottom surface of the inner frame of the lens focusing inner frame.

4. The lens drive assembly according to claim 3, further comprising at least two lens stabilization position sensing elements, wherein each of the lens stabilization position sensing elements is disposed on the bottom surface of the inner frame of the lens focusing inner frame, and each of the lens stabilization position sensing elements corresponds to each of the lens stabilization magnets.

5. The lens drive assembly of claim 4, wherein at least one of the lens stabilization position sensing elements is disposed at the center of the lens stabilization coil so as to be surrounded by the lens stabilization coil.

6. The lens drive assembly according to claim 1, wherein the lens focusing magnet is disposed on a side of the inner lens focusing frame of the inner lens focusing frame, and the lens focusing coil is disposed on the outer lens focusing frame.

7. The lens driving assembly according to claim 6, further comprising at least one lens focusing sensing unit, the lens focusing sensing unit comprising a lens focusing sensing magnet and a lens focusing position sensing element, the lens focusing sensing magnet being disposed on the side of the inner lens focusing frame of the inner lens focusing frame, the lens focusing position sensing element being disposed on the outer lens focusing frame, and the lens focusing position sensing element corresponding to the lens focusing sensing magnet.

8. The lens drive assembly of claim 6, further comprising at least one lens focus position sensing element, wherein the lens focus position sensing element is disposed on the lens focus outer frame, and the lens focus position sensing element corresponds to the lens focus magnet.

9. The lens drive assembly according to any one of claims 1 to 5, further comprising a lens stabilization support unit, wherein the lens stabilization support unit is disposed between the lens stabilization carrier and the top of the lens focusing inner frame of the lens focusing inner frame.

10. The lens drive assembly of claim 9, wherein the lens stabilization support unit comprises at least three lens stabilization tracks and at least three lens stabilization balls, wherein each of the lens stabilization tracks comprises a lower groove track and an upper groove track, the lower groove track being formed on the top surface of the lens stabilization carrier, the upper groove track being formed on the bottom surface of the inner frame of the lens focusing inner frame, the lower groove track and the upper groove track corresponding to each other and extending in perpendicular directions to each other, wherein the bottom and top of the lens stabilization balls are respectively slidably held in the lower groove track and the upper groove track.

11. The lens driving assembly according to any one of claims 6 to 8, further comprising at least one lens focusing magnetic unit and a lens focusing support unit, wherein the lens focusing magnetic unit is disposed on the lens focusing outer frame, and the lens focusing magnetic unit and the lens focusing magnet correspond to each other to generate a horizontal magnetic attraction between them, wherein the lens focusing support unit is disposed between the lens focusing outer frame and the lens focusing inner frame side portion, thereby suspending the lens focusing inner frame on the side portion of the lens focusing outer frame.

12. The lens drive assembly of claim 11, wherein the lens focusing support unit comprises at least two lens focusing tracks and at least two lens stabilization balls, wherein each lens focusing track comprises an inner groove track and an outer groove track, the inner groove track being formed on the side of the inner lens focusing frame, the outer groove track being formed on the outer lens focusing frame, the inner groove track and the outer groove track corresponding to each other and extending in the same direction, wherein the inner and outer sides of the lens focusing balls are respectively rotatably held in the inner groove track and the outer groove track.

13. The lens drive assembly of claim 12, wherein the lens focusing support unit comprises four of the lens stabilization balls, and each of the lens focusing tracks is provided with two of the lens stabilization balls.

14. The lens drive assembly according to any one of claims 1 to 8, wherein the lens stabilization drive unit includes two lens stabilization magnets, and the included angle formed between the extending directions of the two lens stabilization magnets is less than 180°.

15. The lens drive assembly according to claim 14, wherein the angle formed between the extending directions of the two lens stabilizing magnets is 90°, and the two lens stabilizing magnets are axially symmetrical.

16. The lens driving assembly according to any one of claims 1 to 8, wherein the lens stabilization driving unit includes four lens stabilization magnets, two of the lens stabilization magnets are arranged side by side on the far side of the lens stabilization carrier, and the other two lens stabilization magnets are respectively arranged on two sides of the lens stabilization carrier.

17. A camera module, characterized in that, include: One photosensitive component; An optical lens, wherein the optical lens is held in the light-sensing path of the photosensitive element; as well as The lens drive assembly according to any one of claims 1 to 16, wherein the lens stabilization carrier has a carrier channel, and the optical lens is disposed in the carrier channel of the lens stabilization carrier.

Images