Sound production device and electronic device

Abstract

The application discloses a sound production device and electronic equipment. The sound production device comprises a sound production body, the sound production body comprises a coil and a coil support, and the coil is arranged around the coil support. The coil support is provided with an accommodating space, and the accommodating space is filled with a phase change material. When the sound production device is in a sound production state, the phase change material absorbs heat generated by the coil and changes phase.

Description

Technical Field

[0001] This invention relates to the field of sound-generating devices, and more particularly to a sound-generating device and an electronic device. Background Technology

[0002] With the rapid development of electronic devices, sound-generating devices have become indispensable components. A sound-generating device is a transducer that converts electrical signals into sound signals. When an alternating current is passed through the coil of a sound-generating device, the device can produce sound; however, the coil also generates heat.

[0003] In related technologies, the heat generated by the sound-generating device is mainly dissipated through other components of the electronic device, such as the device's casing. Although some of the heat from the sound-generating device can be dissipated through other components, the device is usually located inside the electronic device's cavity, where heat dissipation is not very effective, and the sound-generating device still suffers from high temperatures. Summary of the Invention

[0004] This invention discloses a sound-generating device and an electronic device to solve the problem of high temperature in sound-generating devices in related technologies due to poor heat dissipation.

[0005] To solve the above-mentioned technical problems, the present invention is implemented as follows:

[0006] In a first aspect, this application discloses a sound-generating device, including a sound-generating body, the sound-generating body including a coil and a coil support, the coil being wound around the coil support; wherein, the coil support has an accommodating space, the accommodating space being filled with a phase change material;

[0007] When the sound-generating device is in the sound-generating state, the phase change material absorbs the heat generated by the coil and undergoes a phase change.

[0008] Secondly, this application also discloses an electronic device, which includes the sound-generating device described in the first aspect.

[0009] The technical solution adopted in this invention can achieve the following technical effects:

[0010] The sound-generating device disclosed in this application provides a phase change material within the housing space of the coil support. When an alternating current is applied to the coil to activate the sound-generating device, some of the heat generated by the coil is transferred to the phase change material through the coil support. This causes the phase change material to absorb the heat and undergo a phase change. Since the temperature of the phase change material does not change during the heat absorption and phase change, some of the heat generated by the coil is absorbed by the phase change material, and this heat does not raise the temperature of the sound-generating device. This effectively alleviates the problem of high temperatures in related technologies due to poor heat dissipation, thus preventing the high temperature from affecting the sound output of the device. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of the electronic device disclosed in an embodiment of the present invention;

[0012] Figure 2 This is a partial cross-sectional view of the electronic device disclosed in an embodiment of the present invention;

[0013] Figure 3 This is a schematic diagram of the cooperation between the magnetic shielding component and the magnet disclosed in an embodiment of the present invention;

[0014] Figure 4 This is a cross-sectional view of the sound-generating device disclosed in an embodiment of the present invention;

[0015] Figure 5 This is a schematic diagram of the coil support structure disclosed in an embodiment of the present invention;

[0016] Figure 6 for Figure 5 A sectional view.

[0017] Explanation of reference numerals in the attached figures:

[0018] 100 - Sound-generating body, 110 - Coil, 120 - Coil support, 121 - Accommodation space, 130 - Magnet, 131 - Heat dissipation groove, 140 - Flexible heat-conducting component, 150 - Diaphragm

[0019] 200 - First heat-conducting element, 210 - Through hole

[0020] 300-Sound cavity,

[0021] 400 - Housing, 410 - First surface, 411 - Heat dissipation protrusion. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this invention, and not all of them. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0023] The technical solutions disclosed in the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0024] Please refer to Figures 1 to 6 This invention discloses a sound-generating device, which includes a sound-generating body 100, and the sound-generating body 100 includes a coil 110 and a coil support 120.

[0025] The coil support 120 has a receiving space 121, which can be a closed space inside the coil support 120. The receiving space 121 is filled with a phase change material, which can change its physical state while its temperature remains constant, thereby absorbing or releasing a large amount of latent heat.

[0026] The coil 110 is wound around the coil support 120. When an alternating current is applied, the coil 110 can magnetically engage with the magnet 130 of the sound-generating device. When the magnet 130 is fixed and the diaphragm 150 of the sound-generating device is connected to the coil support 120, the coil 110 can drive the coil support 120 to vibrate, so that the coil support 120 drives the diaphragm 150 to vibrate and generate sound. When the coil support 120 is fixed and the diaphragm 150 is connected to the magnet 130, the magnet 130 can drive the diaphragm 150 to vibrate and generate sound.

[0027] When the sound-generating device is in sound-generating mode, an alternating current needs to be supplied to the coil 110 to produce sound. Simultaneously, the coil 110 generates heat. At least a portion of this heat can be transferred to the phase change material (PCM) through the coil support 120. The PCM absorbs the heat generated by the coil 110 and undergoes a phase change. During this phase change, the PCM's temperature remains unchanged, ensuring that some of the heat generated by the coil 110 is absorbed and undergoes a phase change, preventing the sound-generating device's temperature from rising. When the sound-generating device is not in sound-generating mode, the PCM undergoes a phase change as the temperature of the coil support 120 gradually decreases. This allows the heat generated by the phase change to gradually dissipate from the coil support 120, preventing it from overheating. Since the sound-generating device is in a non-sound-generating state, this heat does not affect its sound production.

[0028] The sound-generating device disclosed in this application provides a phase change material within the receiving space 121 of the coil support 120. When an alternating current is applied to the coil 110 to activate the sound-generating device, some of the heat generated by the coil 110 can be transferred to the phase change material through the coil support 120. This allows the phase change material to absorb the heat generated by the coil 110 and undergo a phase change. Since the temperature of the phase change material does not change during the heat absorption and phase change, some of the heat generated by the coil 110 is absorbed by the phase change material, and this heat does not raise the temperature of the sound-generating device. This effectively alleviates the problem of high temperatures in related technologies due to poor heat dissipation in sound-generating devices, thus preventing the high temperature from affecting the sound generation.

[0029] The phase change material can be paraffin wax. Because paraffin wax has a high ignition point, much higher than the maximum temperature at which the coil 110 heats up, it can better ensure the safety of the sound-generating device. Of course, the phase change material can also be ester acids and polymer compounds, etc. There are no specific restrictions on the phase change material here.

[0030] When the sound-generating device is in a non-sound-generating state, heat generated by other components of the electronic device is transferred to the sound-generating body 100, causing its temperature to rise. Consequently, when the sound-generating device enters the sound-generating state, the sound-generating body 100 is at a high temperature, affecting its sound output. To prevent the sound-generating body 100 from overheating in the non-sound-generating state, the sound-generating device may optionally include a first heat-conducting element 200, which may be disposed opposite to the sound-generating body 100. The first heat-conducting element 200 can be used to connect to a heat dissipation component of the electronic device (e.g., the housing 400 of the electronic device). When the sound-generating device is in the sound-generating state, there may be a gap between the sound-generating body 100 and the first heat-conducting element 200 to prevent the coil support 120 from impacting the first heat-conducting element 200 during vibration and causing damage to the sound-generating device. When the sound-generating device is in a non-sound-generating state, the coil support 120 may contact the first heat-conducting element 200.

[0031] Specifically, the coil support 120 can be moved to a position in contact with the first heat-conducting element 200 by a drive mechanism, which can be a drive motor. Alternatively, the coil support 120 can be moved by the magnetic interaction between the coil 110 and the magnet 130, causing the coil 110 to drive the coil support 120. Other methods of movement for the coil support 120 are also possible, but will not be elaborated upon here.

[0032] The sound-generating device disclosed in this application embodiment, by providing a first heat-conducting element 200, creates a gap between the sound-generating body 100 and the first heat-conducting element 200 when the sound-generating device is in the sound-generating state. This prevents the coil support 120 from impacting the first heat-conducting element 200 during vibration, thus avoiding damage to the sound-generating device. When the sound-generating device is not in the sound-generating state, the coil support 120 can contact the first heat-conducting element 200, allowing heat from the sound-generating body 100 to be transferred to the first heat-conducting element 200 and then dissipated through it. This avoids the problem of the sound-generating body 100 being at a high temperature when the sound-generating device is in the sound-generating state, which could affect the sound output of the sound-generating body 100.

[0033] In some embodiments, the contact between the coil support 120 and the first heat-conducting element 200 requires external force to perform work. In order to reduce the energy consumption of the electronic device, optionally, when the sound-emitting device is in a non-sound-emitting state, and when the temperature of the sound-emitting body 100 is greater than the temperature of the first heat-conducting element 200, and the temperature difference between the sound-emitting body 100 and the first heat-conducting element 200 is greater than a first preset difference, the coil support 120 may contact the first heat-conducting element 200.

[0034] Specifically, the temperatures of the sound-generating body 100 and the first heat-conducting component 200 can be detected by corresponding temperature detection devices. These devices can detect the air temperature near the sound-generating body 100 as the temperature of the sound-generating body 100, or they can directly detect the temperature of the coil 110, coil support 120, or other components of the sound-generating body 100 as the temperature of the sound-generating body 100. The first preset temperature difference can be a preset temperature difference that can be adjusted according to actual needs.

[0035] When the sound-generating device disclosed in this application is in a non-sound-generating state, and the temperature of the sound-generating body 100 is greater than the temperature of the first heat-conducting element 200, and the temperature difference between the sound-generating body 100 and the first heat-conducting element 200 is greater than a first preset difference, the coil bracket 120 will contact the first heat-conducting element 200. Thus, when the sound-generating device is in a non-sound-generating state, the coil bracket 120 and the first heat-conducting element 200 will not be in constant contact under the driving force of components such as the motor or coil 110, thereby reducing the energy consumption of the electronic device.

[0036] Since the sound-generating device generates sound based on the magnetic interaction between the coil 110 and the magnet 130, it produces a magnetic field. When the sound-generating device is installed in electronic devices, it is necessary to prevent the magnetic field generated by the device from interfering with other components of the electronic device, and also to prevent other components of the electronic device from interfering with the sound generation of the device. To avoid interference from the magnetic field of the device with other components of the electronic device, and to prevent other components of the electronic device from interfering with the sound generation of the device, optionally, the first heat-conducting element 200 can be a magnetic shielding element, which can be used to block external magnetic fields from reaching the sound-generating body 100.

[0037] The sound-generating device disclosed in this application configures the first heat-conducting element 200 as a magnetic shielding element, so that the first heat-conducting element 200 is not only used for heat dissipation of the sound-generating body 100, but also used to block external magnetic fields from interfering with the sound-generating body 100, and to block the magnetic field of the sound-generating device from interfering with other components of the electronic device. This makes the first heat-conducting element 200 serve multiple purposes, thereby avoiding the need to set up multiple components to achieve the corresponding functions, and making the sound-generating device more compact.

[0038] In an optional embodiment, the sound-generating device may further include a magnet 130, and the sound-generating body 100 may further include a diaphragm 150. A coil support 120 is connected to the diaphragm 150. The magnet 130 may be disposed on the side of the first heat-conducting element 200 facing the diaphragm 150. The magnet 130 may be used to magnetically engage with the coil 110 to drive the diaphragm 150 to vibrate, thereby realizing sound generation by the sound-generating device. When the sound-generating device is in the sound-generating state, a first current may be passed through the coil 110. The first current may be a current that varies with the audio signal. The coil 110 may magnetically engage with the magnet 130, so that the coil 110 drives the diaphragm 150 to vibrate through the coil support 120, thereby realizing sound generation by the sound-generating device. When the sound-generating device is in a non-sound-generating state, a second current can be passed through the coil 110. The second current can be a constant direct current. The coil 110 can magnetically cooperate with the magnet 130 so that the coil 110 can drive the coil support 120 to move to a position that contacts the first heat-conducting element 200. The absolute value of the second current can be greater than the absolute value of the first current.

[0039] The sound-generating device disclosed in this application discloses that, when the sound-generating device is in a non-sound-generating state, a second current is applied to the coil 110. The coil 110 can magnetically engage with the magnet 130, causing the coil 110 to move the coil support 120 to a position contacting the first heat-conducting element 200. This allows the sound-generating device to utilize the coil 110, which drives the diaphragm 150 to vibrate, to drive the coil support 120 to a position contacting the first heat-conducting element 200 when the second current is applied. This eliminates the need for other separate driving mechanisms, allowing the coil 110 to serve a dual purpose. Consequently, the number of components in the sound-generating device is reduced, which is beneficial for its thinness and compactness. The first heat-conducting element 200 provides a mounting base for the magnet 130 and also prevents the magnetic field generated by the magnet 130 and the coil 110 from interfering with other components of the electronic device.

[0040] To ensure that the heat from the sound-generating body 100 can be effectively transferred to and dissipated from the first heat-conducting element 200 when the coil support 120 moves to a position contacting the first heat-conducting element 200, optionally, when the sound-generating device is in a non-sound-generating state, and when the temperature of the sound-generating body 100 is greater than the temperature of the first heat-conducting element 200, and the temperature difference between the sound-generating body 100 and the first heat-conducting element 200 is greater than a first preset temperature difference, a second current can be applied to the coil 110. In this case, the heat generated by the coil 110 is less than the heat transferred from the coil support 120 to the first heat-conducting element 200. When the sound-generating device is in a non-sound-generating state, and when the temperature difference between the sound-generating body 100 and the first heat-conducting element 200 is less than or equal to the first preset temperature difference, the current can be stopped flowing through the coil 110.

[0041] Specifically, the coil support 120 can be a metal heat-conducting component, such as aluminum alloy, iron, copper, etc. Of course, the coil support 120 can also be other non-metallic heat-conducting components. This application does not impose specific limitations on the material of the coil support 120. The first preset difference can be determined based on the fact that the heat generated by the coil 110 is less than the heat transferred from the coil support 120 to the first heat-conducting component 200. The embodiments of this application do not limit the specific size of the first preset difference.

[0042] The sound-generating device disclosed in this application, when the sound-generating device is in a non-sound-generating state, and the temperature of the sound-generating body 100 is greater than the temperature of the first heat-conducting element 200, and the temperature difference between the sound-generating body 100 and the first heat-conducting element 200 is greater than a first preset difference, a second current is applied to the coil 110. At this time, the heat generated by the coil 110 is less than the heat transferred from the coil support 120 to the first heat-conducting element 200, thereby ensuring that when the coil support 120 moves to a position in contact with the first heat-conducting element 200, the heat of the sound-generating body 100 can be better transferred to the first heat-conducting element 200 and dissipated. When not emitting sound, and when the temperature difference between the sound-emitting body 100 and the first heat-conducting element 200 is less than or equal to a first preset difference, the current can be stopped flowing through the coil 110. At this time, the temperature difference between the sound-emitting body 100 and the first heat-conducting element 200 is small, and the heat transfer efficiency is limited. At this time, stopping the current flowing through the coil 110 can reduce energy consumption and also prevent the coil 110 from generating heat by flowing through a second current.

[0043] Optionally, the sound-generating body 100 and the magnet 130 can form a sound-generating cavity 300. Specifically, the coil support 120, the diaphragm 150, and the magnet 130 can form the sound-generating cavity 300. When the sound-generating device is in the sound-generating state, at least part of the heat generated by the coil 110 can be transferred to the magnet 130 and the first heat-conducting element 200 through the sound-generating cavity 300. By transferring at least part of the heat generated by the coil 110 to the magnet 130 and the first heat-conducting element 200 through the sound-generating cavity 300, the heat can be dissipated or transferred to other heat dissipation components of the electronic device through the magnet 130 and the first heat-conducting element 200, thereby reducing the temperature of the sound-generating body 100.

[0044] In one optional embodiment, the sound-generating body 100 may include a second heat-conducting element, which may be a flexible heat-conducting element 140, disposed on the coil support 120. When the sound-generating device is in a sound-generating state, the flexible heat-conducting element 140 may have a gap with the first heat-conducting element 200. When the sound-generating device is in a non-sound-generating state, the coil support 120 may move the flexible heat-conducting element 140 to contact the first heat-conducting element 200. The flexible heat-conducting element 140 may be connected between the coil support 120 and the first heat-conducting element 200, so that the heat of the sound-generating body 100 is transferred to the first heat-conducting element 200 through the flexible heat-conducting element 140 and dissipated.

[0045] The sound-generating device disclosed in this application embodiment incorporates a flexible heat-conducting element 140, which connects the coil support 120 and the first heat-conducting element 200. This prevents rigid contact between the coil support 120 and the first heat-conducting element 200 when the coil support 120 moves to contact it, thus buffering impact and protecting the sound-generating device. With the flexible heat-conducting element 140 connected between the coil support 120 and the first heat-conducting element 200, heat from the coil support 120 can be effectively transferred to the first heat-conducting element 200 through the flexible heat-conducting element 140.

[0046] When the first preset difference is determined in the case that the sound-generating body 100 includes the flexible heat-conducting element 140, the heat of the coil 110 can be Q. 线圈 =I 2 R and I represent the current values ​​of coil 110, and R represents the resistance of coil 110. The heat O transferred from coil support 120 to the first heat-conducting element 200... 散热 =T 线圈 -T 第一导热件 / D 线圈支架 / K 线圈支架 *A+D 柔性导热件 / K 柔性导热件 *A, where T 线圈 The temperature of coil 110, T 第一导热件 The temperature of the first heat-conducting element is 200 K. 线圈支架 Let K be the thermal conductivity of the coil support 120. 柔性导热件 D represents the thermal conductivity of the flexible thermally conductive element 140. 线圈支架 For the thickness of the coil support 120, D 柔性导热件 A is the thickness of the flexible heat-conducting component 140, and A is the contact area between the flexible heat-conducting component 140 and the first heat-conducting component 200.

[0047] To ensure that the temperature of the sound-generating body 100 can be effectively reduced when the coil support 120 is in contact with the first heat-conducting element 200, it is necessary to ensure O 散热 Q 线圈 Therefore, it can be determined that in O 散热 =Q 线圈 In the case of T 线圈 With T 隔磁件 The first difference, the first preset difference can be set to be higher than the first difference, for example, the first preset difference is 2 degrees Celsius or 5 degrees Celsius higher than the first difference or other values. The first preset difference can be set according to the actual situation.

[0048] This application also discloses an electronic device, which may include the sound-generating device in the above embodiments. By configuring the electronic device to include the sound-generating device in the above embodiments, the embodiments of this application can prevent the sound-generating device from overheating when it is in the sound-generating state.

[0049] Optionally, the disclosed electronic device includes a housing 400, which can serve as the base for mounting various components of the electronic device and can also be the main heat dissipation area. The sound-generating device may include a magnet 130, which may be disposed within the housing 400. The sound-generating body 100 and the magnet 130 can form a sound-generating cavity 300, and the sound-generating body 100 may also include a diaphragm 150. Specifically, the coil support 120, the diaphragm 150, and the magnet 130 can form the sound-generating cavity 300. When the sound-generating device is in a sound-generating state, a first current can be passed through the coil 110. The coil 110 and the magnet 130 are magnetically engaged, allowing the coil 110 to drive the diaphragm 150 to vibrate via the coil support 120. At least a portion of the heat generated by the coil 110 can reach the magnet 130 through the sound-generating cavity 300 and be transferred to the housing 400.

[0050] The electronic device disclosed in this application uses a magnet 130, which is used to magnetically cooperate with the coil 110, to transfer heat. This allows at least a portion of the heat generated by the coil 110 to reach the magnet 130 through the sound-emitting cavity 300 and be transferred to the housing 400. This makes the magnet 130 serve two purposes, thereby allowing the heat generated by the sound-emitting device to be dissipated better, and thus keeping the temperature of the sound-emitting device at a low level.

[0051] In order to ensure that at least part of the heat generated by the coil 110 reaches the magnet 130 through the sound-generating cavity 300 and is well transferred to the housing 400, the housing 400 may optionally have a first surface 410 and a heat dissipation protrusion 411 provided on the first surface 410, the magnet 130 may have a second surface and a heat dissipation groove 131 provided on the second surface, the second surface may be located on the side of the magnet 130 away from the diaphragm 150, the heat dissipation protrusion 411 may pass through the heat dissipation groove 131, the outer surface of the heat dissipation protrusion 411 may fit with the inner surface surrounding the heat dissipation groove 131, and the first surface 410 may fit with the second surface.

[0052] The electronic device disclosed in this application is configured such that the housing 400 has a heat dissipation protrusion 411 on the first surface 410 and the magnet 130 has a heat dissipation groove 131 on the second surface, so that the heat dissipation protrusion 411 can pass through the heat dissipation groove 131, and the outer surface of the heat dissipation protrusion 411 is in contact with the inner surface of the heat dissipation groove 131, and the first surface 410 is in contact with the second surface, thereby increasing the contact area between the magnet 130 and the magnet 131. This allows at least part of the heat generated by the coil 110 to reach the magnet 130 through the sound-emitting cavity 300 and to be better transferred to the housing 400 for heat dissipation.

[0053] Optionally, the sound-generating device may also include a first heat-conducting element 200, which may be disposed on the second surface. The first heat-conducting element 200 may be connected between the magnet 130 and the housing 400. The first heat-conducting element 200 may have a through hole 210, which may be opposite to the heat dissipation groove 131. The heat dissipation protrusion 411 may pass through the through hole 210 and the heat dissipation groove 131. The outer surface of the heat dissipation protrusion 411 may be attached to the inner surface of the heat dissipation groove 131 and the inner surface of the through hole 210. The first surface 410 and the second surface may be attached to the two opposite sides of the first heat-conducting element 200, respectively.

[0054] The electronic device disclosed in this application embodiment provides a first heat-conducting element 200 and a through hole in the first heat-conducting element 200, so that the outer surface of the heat dissipation protrusion 411 is in contact with the inner surface of the heat dissipation groove 131 and the inner surface of the through hole 210. The first surface 410 and the second surface are respectively in contact with the two opposite sides of the first heat-conducting element 200, thereby increasing the contact area between the sound-generating device and the housing 400, and thus allowing the heat of the sound-generating device to be better dissipated from the housing 400.

[0055] It should be noted that electronic devices can be mobile phones, tablets, game consoles, etc., and this application does not limit the types of electronic devices.

[0056] The above embodiments of the present invention focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0057] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of the present invention.

Claims

1. A sound-generating device, characterized in that, The device includes a sound-generating body (100) and a first heat-conducting component (200). The first heat-conducting component (200) is disposed opposite to the sound-generating body (100) and is used to connect to a heat dissipation component of an electronic device. The sound-generating body (100) includes a coil (110) and a coil support (120). The coil (110) is wound around the coil support (120). The coil support (120) has an accommodating space (121) and the accommodating space (121) is filled with a phase change material. When the sound-generating device is in the sound-generating state, the phase change material absorbs the heat generated by the coil and undergoes a phase change. There is a gap between the sound-generating body (100) and the first heat-conducting element (200) to avoid the coil support (120) from impacting the first heat-conducting element (200) when vibrating. When the sound-generating device is in a non-sound-generating state, the coil support (120) contacts the first heat-conducting element (200), so that the heat of the sound-generating body (100) is transferred to the first heat-conducting element (200).

2. The sound-generating device according to claim 1, characterized in that, When the sound-generating device is in a non-sound-generating state, and when the temperature of the sound-generating body (100) is greater than the temperature of the first heat-conducting element (200), and the temperature difference between the sound-generating body (100) and the first heat-conducting element (200) is greater than a first preset difference, the coil bracket (120) contacts the first heat-conducting element (200).

3. The sound-generating device according to claim 1, characterized in that, The first heat-conducting component (200) is a magnetic shielding component, which is used to block external magnetic fields from reaching the sound-generating body (100).

4. The sound-generating device according to claim 1, characterized in that, The sound-generating device further includes a magnet (130), the sound-generating body (100) further includes a diaphragm (150), the coil support (120) is connected to the diaphragm (150), and the magnet (130) is disposed on the side of the first heat-conducting element (200) facing the diaphragm (150); When the sound-generating device is in the sound-generating state, a first current is passed through the coil (110), and the coil (110) and the magnet (130) are magnetically engaged, so that the coil (110) drives the diaphragm (150) to vibrate through the coil support (120); When the sound-generating device is in a non-sound-generating state, a second current is passed through the coil (110), and the coil (110) and the magnet (130) are magnetically engaged, so that the coil (110) drives the coil support (120) to move to a position that contacts the first heat-conducting element (200).

5. The sound-generating device according to claim 4, characterized in that, When the sound-generating device is in a non-sound-generating state, and when the temperature of the sound-generating body (100) is greater than the temperature of the first heat-conducting element (200), and the difference between the temperature of the sound-generating body (100) and the temperature of the first heat-conducting element (200) is greater than a first preset difference, a second current is applied to the coil (110). When the temperature difference between the sound-generating body (100) and the temperature of the first heat-conducting component (200) is less than or equal to the first preset difference, the current is stopped flowing through the coil (110).

6. The sound-generating device according to any one of claims 2 to 5, characterized in that, The sound-generating body (100) includes a second heat-conducting component, which is a flexible heat-conducting component (140) and is disposed on the coil support (120). When the sound-generating device is in the sound-generating state, there is a gap between the flexible heat-conducting element (140) and the first heat-conducting element (200); When the sound-generating device is in a non-sound-generating state, the flexible heat-conducting element (140) is connected between the coil support (120) and the first heat-conducting element (200).

7. An electronic device, characterized in that, Includes the sound-generating device according to any one of claims 1 to 6.

8. The electronic device according to claim 7, characterized in that, The electronic device includes a housing (400), and the sound-generating device further includes a magnet (130). The magnet (130) is disposed in the housing (400). The sound-generating body (100) and the magnet (130) form a sound-generating cavity (300). The sound-generating body (100) further includes a diaphragm (150). When the sound-generating device is in the sound-generating state, a first current is passed through the coil (110), and the coil (110) and the magnet (130) are magnetically engaged so that the coil (110) drives the diaphragm (150) to vibrate through the coil support (120). At least part of the heat generated by the coil (110) can reach the magnet (130) through the sound-generating cavity (300) and be transferred to the housing (400).

9. The electronic device according to claim 8, characterized in that, The housing (400) has a first surface (410) and a heat dissipation protrusion (411) on the first surface (410). The magnet (130) has a second surface and a heat dissipation groove (131) on the second surface. The second surface is located on the side of the magnet (130) away from the diaphragm (150). The heat dissipation protrusion (411) passes through the heat dissipation groove (131). The outer surface of the heat dissipation protrusion (411) is in contact with the inner surface surrounding the heat dissipation groove (131), and the first surface (410) is in contact with the second surface.

10. The electronic device according to claim 9, characterized in that, The sound-generating device further includes a first heat-conducting element (200), which is disposed on the second surface. The first heat-conducting element (200) is connected between the magnet (130) and the housing (400). The first heat-conducting element (200) has a through hole (210) which is opposite to the heat dissipation groove (131). The heat dissipation protrusion (411) passes through the through hole (210) and the heat dissipation groove (131). The outer surface of the heat dissipation protrusion (411) is in contact with the inner surface of the heat dissipation groove (131) and the inner surface of the through hole (210). The first surface (410) and the second surface are respectively in contact with the two opposite sides of the first heat-conducting element (200).

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