A light-curable adhesive composition and its preparation method and application

Abstract

The invention relates to a photocurable adhesive composition and a preparation method and application thereof, belonging to the technical field of adhesives. The photocurable adhesive composition comprises 5 to 40 parts of epoxy acrylate compounds, 20 to 50 parts of alicyclic (meth)acrylates, 20 to 50 parts of heterocyclic (meth)acrylates, 5 to 30 parts of hydroxyl (meth)acrylates and 0.5 to 10 parts of photoinitiators. The prepared photocurable adhesive composition has higher light transmittance, adhesion and lower curing shrinkage.

Description

Technical Field

[0001] The invention belongs to the technical field of adhesives and relates to a light-curable adhesive composition and a preparation method and application thereof. Background Art

[0002] Liquid crystal display (LCD) and organic light-emitting diode display (OLED) are the mainstream of current display technology, among which OLED display screens are widely used in mobile phones, televisions and other electronic products. In recent years, mobile phones and other electronic products have gradually adopted full-screen technology. In order to install the front camera, the LCD display modules in the industry include two technologies: blind hole mode and through hole mode. The through hole mode will cause a hollow environment between the glass cover and the camera assembly. Although it has strong light transmittance, there is a risk of residual foreign matter and refractive index problems. At the same time, the cost is high and the yield rate is low. Compared with the through hole mode, the blind hole mode has the advantages of small opening diameter, high yield rate and easier control of production costs, and is deeply loved by developers.

[0003] A light-curable adhesive composition is required in a blind hole mode liquid crystal display module, which is used to bond the liquid crystal panel and the camera. The light-curable adhesive is applied between the camera and the liquid crystal panel by precision production and processing equipment, and then cured by ultraviolet light. However, the light-curable adhesive composition in the prior art often fails to simultaneously meet the requirements of low curing shrinkage, high light transmittance and adhesion.

[0004] In view of this, this patent provides a curable adhesive composition with high light transmittance, low curing shrinkage and excellent adhesion, which can be widely used in liquid crystal display modules of front cameras. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and to propose a photocurable adhesive composition and a preparation method and application thereof, which solve the problems of low light transmittance, high curing shrinkage and poor adhesion of the photocurable adhesive used in the liquid crystal display module of the front camera.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] The first aspect of the present invention provides a photocurable adhesive composition, which includes, by weight, 5 to 40 parts of epoxy acrylate compounds, 20 to 50 parts of alicyclic (meth)acrylates, 20 to 50 parts of heterocyclic (meth)acrylates, 5 to 30 parts of hydroxyl (meth)acrylates, and 0.5 to 10 parts of photoinitiators.

[0008] Furthermore, the photocurable adhesive composition comprises, by weight, 10 to 30 parts of epoxy acrylate compounds, 30 to 40 parts of alicyclic (meth)acrylates, 30 to 40 parts of heterocyclic (meth)acrylates, 10 to 20 parts of hydroxyl-containing (meth)acrylates, and 0.5 to 5 parts of photoinitiators.

[0009] Furthermore, the structural formula of the epoxy acrylate compound is shown in 1:

[0010]

[0011] Wherein, R1 and R2 are each independently any one of substituted or unsubstituted C1-C20 alkylene, substituted or unsubstituted C1-C20 alkyleneoxy, substituted or unsubstituted C6-C30 arylene, substituted or unsubstituted C6-C30 heteroaryl, substituted or unsubstituted C6-C30 cycloalkyl, R3 and R4 are each independently any one of hydrogen or methyl, and n is an integer greater than 1.

[0012] Furthermore, the mass average molecular weight of the epoxy acrylate compound is 3000 to 8000;

[0013] Furthermore, the alicyclic group-containing (meth)acrylate is one or more of dicyclopentadienyloxyethyl (meth)acrylate, dicyclopentyl (meth)acrylate, 2-adamantyl (meth)acrylate, 1,3-adamantanediol di(meth)acrylate, dihydrodicyclopentadienyl (meth)acrylate, and dicyclo[2.2.1]hept-2-yl (meth)acrylate.

[0014] Furthermore, the heterocyclic (meth)acrylate is as shown in Formula 2:

[0015]

[0016] Wherein, X1 is a C3-C20 aryl group substituted by a heteroatom or a C2-C20 cycloalkyl group substituted by a heteroatom; W1 is a C1-C10 alkyl group substituted or unsubstituted by a hydroxyl group or a C1-C10 alkoxy group substituted or unsubstituted by a hydroxyl group; R5 is hydrogen or methyl;

[0017] Furthermore, the heteroatoms include N, O, and S elements.

[0018] Further, the heterocyclic (meth)acrylate may include furfuryl acrylate, (tetrahydropyran-2-yl)methyl methacrylate, 2-(2-oxo-1,3-oxazolidin-3-yl)ethyl acrylate, 2-(1,3-dioxo-1,3-dihydro-2H-isoindol-2-yl)ethyl acrylate, (2-thio-1,3-oxathiolan-5-yl)methyl methacrylate, 2-oxotetrahydrofuran-3-yl methacrylate, 2-(4-morpholinyl)ethyl 2-acrylate, tetrahydrofuran methacrylate, 2-N-morpholinylethyl methacrylate, 2-(1,3-dioxo-1,3-dihydro-2H-isoindol-2-yl)ethyl acrylate. any one of 1,3-benzothiazol-2-yl methacrylate, 2-(3-oxazolidinyl)ethyl methacrylate, 2-(3-oxazolidinyl)ethyl methacrylate, 2-(1H-imidazol-1-yl)ethyl methacrylate, 2-(2,5-dihydro-3,4-dimethyl-2,5-dioxo-1H-pyrrol-1-yl)ethyl methacrylate, (5-ethyl-1,3-dioxan-5-yl)methacrylate, 1,4,4-trimethyl-2-oxo-3-pyrrolidinyl acrylate and 1H-1,2,3-triazol-4-yl methacrylate.

[0019] Furthermore, the viscosity of the hydroxyl-containing (meth)acrylate is 1 to 10 cps at 25°C.

[0020] Further, the hydroxyl-containing (meth)acrylate may include one or more of hydroxypropyl methacrylate, 2-hydroxy-1,3-propanediol-2-acrylate, 6-hydroxyhexyl acrylate, 2,3-dihydroxypropyl acrylate, 3-butoxy-2-hydroxypropyl acrylate, 2-(2-hydroxyethoxy)ethyl acrylate, 2-hydroxyisopropyl acrylate, 2-hydroxyisopropyl acrylate, and 5-hydroxypentyl acrylate.

[0021] Further, the photoinitiator is at least one of 2-isopropylthioxanthone, benzoin dimethyl ether, dimethylbenzil ketal, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl)butanone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxycyclohexyl phenyl ketone and benzophenone.

[0022] Furthermore, the photocurable adhesive composition further comprises an auxiliary agent, and the auxiliary agent is a leveling agent and / or a defoaming agent.

[0023] Furthermore, the auxiliary agent accounts for 0-2% in the light-curable adhesive composition.

[0024] Furthermore, the defoaming agent is modified silicon polydimethylsiloxane and / or silicone.

[0025] Furthermore, the leveling agent is a modified silicone leveling agent, such as BYK 333.

[0026] The second aspect of the present invention provides a method for preparing a photocurable adhesive composition, comprising the following steps: sequentially placing an epoxy acrylate compound, alicyclic (meth)acrylate, heterocyclic (meth)acrylate, hydroxyl-containing (meth)acrylate, a photoinitiator and an auxiliary agent into a reactor, mixing them evenly, vacuuming and stirring until there are no bubbles, and standing to room temperature to obtain a UV-curable adhesive.

[0027] Furthermore, the prepared photocurable adhesive composition has a viscosity of about 1500 to 2000 cps.

[0028] A third aspect of the present invention provides an application of a photocurable adhesive composition in a display module of a front camera.

[0029] As Figure 1 and Figure 2 As shown, Figure 1 A front camera display module with a blind hole pattern that requires the use of the light-curable adhesive composition of the present invention, Figure 2 The front camera display module is a through-hole mode, and the front camera display module includes a glass cover plate 1, a liquid crystal panel 2, a backlight layer 3, and a front camera 4. Figure 2 It can be seen from the structure that the backlight layer 3 and the liquid crystal panel 2 of the through-hole mode front camera display module are both perforated with through holes, which not only has the risk of residual foreign matter and affects the refractive index, but also has high cost and glare. Figure 1 In the embodiment, the liquid crystal panel is complete, which requires bonding the front camera 4 to the liquid crystal panel 2 without affecting the light transmittance. The light-curable adhesive in the present invention solves this problem and has high light transmittance, low curing shrinkage and excellent adhesion.

[0030] Compared with the prior art, the present invention has the following beneficial effects:

[0031] 1. The present invention increases the wettability of the curable adhesive composition to the glass substrate through the synergistic effect of the heterocyclic (meth)acrylate and the hydroxyl-containing (meth)acrylate, has good leveling performance, can effectively avoid the generation of bubbles, and at the same time increases the adhesion, the adhesion can reach more than 4B, and when the light-curable adhesive is filled between the glass sheets, the occurrence of undesirable phenomena such as "water ripples, cracks", etc., at the same time, the curing speed is fast, and no heating is required, and complete curing can still be achieved.

[0032] 2. The present invention adopts bisphenol A epoxy acrylate compound with a mass average molecular weight of 3000-8000, which can effectively improve the mechanical properties of the light-curable adhesive composition and reduce the curing shrinkage rate, and at the same time, can also increase the viscosity of the system, avoid the adhesive composition from shifting during the preparation and lamination process, and has a fixing effect, with a mass average molecular weight of 5000mJ / cm 2 When cured with 365nm light, the cured film is flat and uniform.

[0033] 3. The present invention improves the hardness and toughness of the light-curable adhesive system and also reduces the curing shrinkage of the system through the synergistic effect of the bisphenol A epoxy acrylate compound and the alicyclic (meth) acrylate.

[0034] 4. The present invention effectively improves the refractive index of the photocurable adhesive system by adding alicyclic (meth) acrylates and heterocyclics (aryl or cycloalkyl substituted by N, O, S), making its optical signal stronger, having no absorption at wavelengths of 400 to 780 nm in the visible light region, and showing high transmittance to visible light, with a transmittance of >99%. In addition, the presence of heteroatoms also effectively improves the adhesion to the glass substrate.

[0035] 5. The light-curable adhesive prepared by the present invention has a reasonable composition ratio and extremely low volatility. During the use of the display module, even if the use temperature is very high, very little volatile matter is released, thereby ensuring the clarity of the front camera. In the present invention, other features and advantages of the present invention will become clear through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings are incorporated in and constitute a part of this specification and, together with the description, serve to explain the principles of the present invention.

[0037] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0038] Figure 1 A front camera display module having a blind hole pattern that requires the use of the light-curable adhesive composition of the present invention;

[0039] Figure 2 This is a through-hole front camera display module.

[0040] Among them: 1. Glass cover; 2. LCD panel; 3. Backlight layer; 4. Front camera. DETAILED DESCRIPTION

[0041] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices consistent with some aspects of the present invention as detailed in the appended claims.

[0042] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0043] Preparation Example 1

[0044]

[0045] Add 25g of bisphenol A epoxy resin A1 (epoxy equivalent of 184-195, purchased from Hebei Ruqi Technology Co., Ltd.) to a 250mL three-necked flask equipped with a magnet, a condenser, a nitrogen protection device, and a thermometer, add 100mL of toluene, then add 0.05g of 2,6-di-tert-butyl-p-cresol, 0.05g of triphenylphosphine catalyst, and drop 9.71g of acrylic acid. React at 80-90oC until the acid value is less than 3mg KOH / g, then stop the reaction. When the reaction solution is cooled to 50°C, distill under reduced pressure until no liquid drips out, then distill under reduced pressure at 60°C for more than 2h until no liquid drips out, and obtain a colorless transparent liquid, that is, resin C1. The mass average molecular weight (Mw) of the epoxy acrylate compound measured by GPC made by Tosoh is about 5500.

[0046] Preparation Example 2

[0047]

[0048] Add 25g of epoxy resin A2 (epoxy equivalent of 100-110) to a 250mL three-necked flask equipped with a magnet, a condenser, a nitrogen protection device, and a thermometer, add 100mL of toluene, then add 0.08g of p-methoxyphenol and 0.05g of triphenylphosphine catalyst, drop 8.14g of acrylic acid, react at 80-90°C until the acid value is less than 20mg KOH / g, and stop the reaction. When the reaction solution is cooled to 50°C, distill under reduced pressure until no liquid drips out, then distill under reduced pressure at 60°C for more than 2h until no liquid drips out, and obtain a colorless transparent liquid, that is, resin C2. The mass average molecular weight (Mw) of the epoxy acrylate compound measured by GPC made by Tosoh is about 2300.

[0049] The components used in the embodiments are as follows:

[0050] (A) Acrylate compounds: (A1) Preparation Example 1 (Mw=5500), (A2) Preparation Example 2 (Mw=2300).

[0051] (B) Alicyclic group-containing (meth)acrylates: (B1) 2-adamantyl acrylate (CAS: 128756-71-8), (B2) dicyclopentadienyloxyethyl acrylate (CAS: 65983-31-5).

[0052] (C) Heterocyclic (meth)acrylates: (C1) 2-(3-oxazolidinyl)ethyl methacrylate (CAS: 46235-93-2), (C2) furfuryl acrylate (CAS: 10525-17-4).

[0053] (D) Hydroxyl-containing (meth)acrylates: (D1) 2,3-dihydroxypropyl acrylate (CAS: 10095-20-2), (D2) 2-hydroxy-1,3-propylene glycol 2-acrylate (CAS: 1709-71-3).

[0054] (E) Photoinitiator: 1-hydroxycyclohexylphenyl ketone (CAS: 947-19-3).

[0055] (F) Additive: modified silicone leveling agent BYK 333.

[0056] Example 1

[0057] The photocurable adhesive provided in this embodiment comprises, by weight, 20 parts of epoxy acrylate compound, 35 parts of alicyclic (meth)acrylate, 35 parts of heterocyclic (meth)acrylate, 15 parts of hydroxyl-containing (meth)acrylate, and 3 parts of photoinitiator.

[0058] (A) The epoxy acrylate compound is Compound 1 obtained in Preparation Example 1, and its mass average molecular weight (Mw) is 5,500.

[0059] (B) The alicyclic group-containing (meth)acrylate is (B1) 2-adamantyl acrylate.

[0060] (C) The heterocyclic ring-containing (meth)acrylate is (C1) 2-(3-oxazolidinyl)ethyl methacrylate.

[0061] (D) The hydroxyl group-containing (meth)acrylate is (D1) 2,3-dihydroxypropylacrylate.

[0062] (E) The photoinitiator is 1-hydroxycyclohexyl phenyl ketone.

[0063] The preparation method of the photocurable adhesive is to sequentially put an epoxy acrylate compound, alicyclic (meth)acrylate, heterocyclic (meth)acrylate, hydroxyl (meth)acrylate, a photoinitiator and an auxiliary agent into a reactor, mix them evenly, evacuate and stir until there are no bubbles, and let it stand to room temperature to obtain a UV-curable adhesive.

[0064] Example 2

[0065] The photocurable adhesive provided in this embodiment comprises, by weight, 10 parts of epoxy acrylate compounds, 35 parts of alicyclic (meth)acrylates, 34 parts of heterocyclic (meth)acrylates, 12 parts of hydroxyl-containing (meth)acrylates, 2 parts of photoinitiators, and 0.5 parts of leveling agents.

[0066] (A) The epoxy acrylate compound is Compound 1 obtained in Preparation Example 1, and its mass average molecular weight (Mw) is 5,500.

[0067] (B) The alicyclic group-containing (meth)acrylate is (B2) dicyclopentadienyloxyethyl acrylate.

[0068] (C) The heterocyclic ring-containing (meth)acrylate is (C2) furfuryl acrylate.

[0069] (D) The hydroxyl group-containing (meth)acrylate is (D2) 2-hydroxy-1,3-propanediol-2-acrylate.

[0070] (E) The photoinitiator is 1-hydroxycyclohexyl phenyl ketone.

[0071] The preparation method of the photocurable adhesive is to sequentially put an epoxy acrylate compound, alicyclic (meth)acrylate, heterocyclic (meth)acrylate, hydroxyl (meth)acrylate, a photoinitiator and an auxiliary agent into a reactor, mix them evenly, evacuate and stir until there are no bubbles, and let it stand to room temperature to obtain a UV-curable adhesive.

[0072] Example 3

[0073] The photocurable adhesive provided in this embodiment comprises, by weight, 30 parts of epoxy acrylate compounds, 35 parts of alicyclic (meth)acrylates, 38 parts of heterocyclic (meth)acrylates, 18 parts of hydroxyl (meth)acrylates, and 4 parts of photoinitiators.

[0074] (A) The epoxy acrylate compound is Compound 1 obtained in Preparation Example 1, and its mass average molecular weight (Mw) is 5,500.

[0075] (B) The alicyclic ring-containing (meth)acrylate is (B2) dicyclopentadienyloxyethyl acrylate.

[0076] (C) The heterocyclic ring-containing (meth)acrylate is (C1) 2-(3-oxazolidinyl)ethyl methacrylate.

[0077] (D) The hydroxyl group-containing (meth)acrylate is (D2) 2-hydroxy-1,3-propanediol-2-acrylate.

[0078] (E) The photoinitiator is 1-hydroxycyclohexyl phenyl ketone.

[0079] (F) The leveling agent is modified silicone leveling agent BYK 333.

[0080] The preparation method of the photocurable adhesive is to sequentially put an epoxy acrylate compound, alicyclic (meth)acrylate, heterocyclic (meth)acrylate, hydroxyl (meth)acrylate, a photoinitiator and an auxiliary agent into a reactor, mix them evenly, evacuate and stir until there are no bubbles, and let it stand to room temperature to obtain a UV-curable adhesive.

[0081] Comparative Example 1

[0082] Different from Example 1, the epoxy acrylate compound in Comparative Example 1 is Compound C2 obtained in Preparation Example 2, and its mass average molecular weight (Mw) is 2300.

[0083] Comparative Example 2

[0084] Different from Example 1, in Comparative Example 2, no heterocyclic (meth)acrylate is added.

[0085] Comparative Example 3

[0086] Different from Example 1, in Comparative Example 3, the alicyclic (meth)acrylate is replaced by a benzene ring-containing (meth)acrylate, and the benzene ring-containing (meth)acrylate is 2-biphenyl-4-methacrylate (CAS: 46904-74-9).

[0087] Comparative Example 4

[0088] Different from Example 1, in Comparative Example 4, no alicyclic (meth)acrylate is added.

[0089] Performance Test:

[0090] The photocurable adhesive compositions obtained in Examples 1 to 3 and Comparative Examples 1 to 4 were coated on glass substrates, respectively, with a thickness of about 8 μm, and a 5000 mJ / cm 2 The sample was irradiated with 365 nm ultraviolet light for 2 min to obtain a cured sample.

[0091] Light transmittance: The light transmittance of the cured film in the visible light range of 400 nm to 700 nm was measured by an ultraviolet spectrophotometer (Fluoromax-4, HORIBA Jobin Yvon, France).

[0092] Curing shrinkage: The photocurable adhesive composition was placed in a polytetrafluoroethylene mold and heated at 5000 mJ / cm 2 The sample was irradiated with 365 nm ultraviolet light for 2 min for UV curing. After the curing was completed, the length of the sample was measured with a caliper. The curing shrinkage of the UV-curing adhesive was calculated according to the following equation: curing shrinkage ratio η = (Vb-Va) / Vb×100%; where Vb is the volume before curing and Va is the volume after curing.

[0093] Adhesion: The test is carried out using the 100-grid test method. First, use a 100-grid knife to evenly cut a certain size of squares on the film layer of the test color chip, and then use 3M tape to stick and pull, and evaluate the degree of adhesion of the film layer to the substrate by evaluating the integrity of the film layer in the square (refer to GB9286-1998).

[0094] The performance test results are shown in Table 1:

[0095] Table 1.

[0096] Light transmittance / % Curing shrinkage / % Adhesion Example 1 98.4 5.12 5B Example 2 98.1 5.48 4B Example 3 98.3 5.14 5B Comparative Example 1 96.1 7.52 4B Comparative Example 2 94.7 5.38 3B Comparative Example 3 95.8 5.76 3B Comparative Example 4 95.4 7.11 3B

[0097] As shown in Table 1, the light-curable adhesive composition prepared in the present invention has excellent light transmittance and adhesion, and low curing shrinkage.

[0098] On the contrary, in Comparative Example 1, when the mass average molecular weight (Mw) of the epoxy acrylate compound is 2300, that is, not between 3000 and 8000, its curing shrinkage is large and the transmittance is reduced; in Comparative Example 2, no heterocyclic (meth)acrylate is added, and in Comparative Example 3, the alicyclic (meth)acrylate is replaced with a benzene ring-containing (meth)acrylate, and its transmittance and adhesion are reduced to a certain extent; in Comparative Example 4, no alicyclic (meth)acrylate is added, and the transmittance, curing shrinkage and adhesion all achieve ideal effects.

[0099] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention.

[0100] It should be understood that the present invention is not limited to what has been described above and that various modifications and changes may be made without departing from its scope. The scope of the present invention is limited only by the appended claims.

Claims

1. A photocurable adhesive composition, characterized in that: In parts by weight, it comprises 5 to 40 parts of epoxy acrylate compound, 20 to 50 parts of alicyclic (meth)acrylate, 20 to 50 parts of heterocyclic (meth)acrylate, 5 to 30 parts of hydroxyl (meth)acrylate, and 0.5 to 10 parts of photoinitiator; The structural formula of the epoxy acrylate compound is shown in Formula 1: Wherein, R1 and R2 are each independently any one of substituted or unsubstituted C1-C20 alkylene, substituted or unsubstituted C1-C20 alkyleneoxy, substituted or unsubstituted C6-C30 arylene, substituted or unsubstituted C6-C30 heteroaryl, substituted or unsubstituted C6-C30 cycloalkyl, R3 and R4 are each independently hydrogen or methyl, and n is an integer greater than 1; The mass average molecular weight of the epoxy acrylate compound is 3000 to 8000; The alicyclic group-containing (meth)acrylate is one or more of dicyclopentadienyloxyethyl (meth)acrylate, dicyclopentyl (meth)acrylate, 2-adamantyl (meth)acrylate, 1,3-adamantanediol di(meth)acrylate, dihydrodicyclopentadienyl (meth)acrylate, and bicyclo[2.2.1]hept-2-yl (meth)acrylate; The heterocyclic (meth)acrylate is shown in Formula 2: Wherein, X1 is a C3-C20 aryl group substituted by a heteroatom or a C2-C20 cycloalkyl group substituted by a heteroatom, and the heteroatom includes N, O, and S elements; W1 is a C1-C10 alkyl group substituted or unsubstituted by a hydroxyl group or a C1-C10 alkoxy group substituted or unsubstituted by a hydroxyl group; R5 is hydrogen or methyl.

2. A photocurable adhesive composition according to claim 1, characterized in that: The hydroxyl-containing (meth)acrylate includes one or more of hydroxypropyl methacrylate, 2-hydroxy-1,3-propanediol 2-acrylate, 6-hydroxyhexyl acrylate, 2,3-dihydroxypropyl acrylate, 3-butoxy-2-hydroxypropyl acrylate, 2-(2-hydroxyethoxy)ethyl acrylate, 2-hydroxyisopropyl acrylate, 2-hydroxyisopropyl acrylate, and 5-hydroxypentyl acrylate.

3. A photocurable adhesive composition according to claim 1, characterized in that: The photoinitiator is at least one of 2-isopropylthioxanthone, benzoin dimethyl ether, dimethylbenzil ketal, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-phenylbenzyl-2-dimethylamine-1-(4-morpholinobenzylphenyl)butanone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxycyclohexylphenyl ketone and benzophenone.

4. A photocurable adhesive composition according to claim 1, characterized in that: The invention also comprises an auxiliary agent, which is a leveling agent and / or a defoaming agent.

5. A method for preparing a photocurable adhesive composition according to any one of claims 1 to 4, characterized in that: The method comprises the following steps: sequentially placing epoxy acrylate compound, alicyclic (meth)acrylate, heterocyclic (meth)acrylate, hydroxyl (meth)acrylate, photoinitiator and auxiliary agent into a reactor, mixing evenly, vacuuming and stirring until there are no bubbles, and standing to room temperature to obtain ultraviolet light curing adhesive.

6. The method for preparing a photocurable adhesive composition according to any one of claim 5, characterized in that: The viscosity of the photocurable adhesive composition is 1500-2000 cps at 25°C.

7. Use of a photocurable adhesive composition according to any one of claims 1 to 4, characterized in that: Application of the photocurable adhesive composition in a display module of a front camera.

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