Sensor shift module and camera module
By using a combination of drive coils and soft magnetic materials, the problem of magnetic field influence on adjacent electronic components by permanent magnet actuators was solved, achieving optical image stabilization at low power and simplifying camera setup and operation.
Patent Information
- Application Number
- CN202211396780.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Priority Date
- 2021-11-15
- Filing Date
- 2022-11-09
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2042-11-09
AI Technical Summary
In the prior art, the optical image stabilization function of mobile device cameras is difficult to effectively arrange multiple cameras in a limited space because the use of permanent magnet actuators causes the magnetic field to affect adjacent electronic components.
By employing a combination of a drive coil and a soft magnetic material drive yoke, the image sensor is moved in a direction orthogonal to the optical axis through electromagnetic interaction, avoiding the use of permanent magnets and reducing the magnetic field influence on adjacent electronic components.
It achieves effective optical image stabilization at low power, reduces the influence of magnetic fields on adjacent electronic components, and simplifies camera setup and operation.
Smart Images

Figure CN116132775B_ABST
Abstract
Description
[0001] Cross-references to related applications
[0002] This application claims priority to Korean Patent Application No. 10-2021-0156564, filed on November 15, 2021, with the Korean Intellectual Property Office, the entire disclosure of which is incorporated herein by reference for all purposes. Technical Field
[0003] The following description relates to a method for achieving optical image stabilization by driving an image sensor. Background Technology
[0004] With the development of communication technology, mobile devices such as smartphones have become widely available. Consequently, the demand for camera functionality included in mobile devices has increased. For example, despite the small size of cameras included in mobile devices, they can be designed to provide advanced imaging features (e.g., autofocus, image stabilization, etc.) found in ordinary DSLR cameras.
[0005] Optical image stabilization (OIS) prevents image blur when the camera shakes during exposure, and is particularly desirable when imaging in low-light conditions with camera shake and relatively long exposure times. OIS can include digital IS (DIS), electronic IS (EIS), and optical IS (OIS). Among these, optical IS (OIS) fundamentally prevents image degradation caused by camera shake by moving a lens or image sensor in a direction orthogonal to the optical axis to correct the optical path. While its implementation as a device can be complex and relatively expensive due to the potential need for mechanical actuators, it offers excellent compensation performance.
[0006] The lens barrel can include an optical system, which may require relatively large forces to drive it. On the other hand, the image sensor can be relatively lightweight and achieve excellent OIS functionality even with small forces. However, when the actuator used to drive the image sensor includes a permanent magnet, the magnetic field of the permanent magnet may affect adjacent electronic components. Furthermore, when a mobile device includes multiple cameras arranged adjacent to each other, the permanent magnet in each camera may negatively affect the operation of adjacent cameras, making it functionally difficult to arrange the cameras adjacent to each other or adjacent to other electronic components within the cameras. Summary of the Invention
[0007] This summary is provided to present, in a simplified form, the selection of concepts further described below. This summary is not intended to identify key or essential features of the claimed subject matter, nor is it intended to help determine the scope of the claimed subject matter.
[0008] In one general aspect, the sensor shifting module includes a fixed body, a movable body, a substrate, and a driver. The movable body is movably arranged within the fixed body and includes an image sensor having an imaging surface oriented in a first direction. The substrate connects the movable body to the fixed body and is configured to deform based on movement of the movable body relative to the fixed body. The driver is configured to move the movable body relative to the fixed body in a direction orthogonal to the first direction and includes a drive coil and a drive yoke. The drive coil is coupled to one of the fixed body and the movable body, and the drive yoke is coupled to the other of the fixed body and the movable body. The drive yoke is arranged opposite the drive coil in the direction orthogonal to the first direction. When a current is applied to the drive coil, the movable body is configured to move in the direction orthogonal to the first direction via electromagnetic interaction between the drive coil and the drive yoke.
[0009] The driving yoke can be made of soft magnetic material.
[0010] When there is no current flowing in the drive coil, the magnetic field caused by the drive yoke can be zero.
[0011] The drive coil and the drive yoke can be opposite each other in a second direction orthogonal to the first direction, and the electromagnetic interaction between the drive coil and the drive yoke can be configured to move the movable body in the second direction.
[0012] The drive coil and the drive yoke can be opposite each other in a second direction orthogonal to the first direction. The drive coil may include a first drive coil and a second drive coil respectively arranged on both sides of the movable body in the second direction. The drive yoke may include a first drive yoke and a second drive yoke respectively opposite to the first drive coil and the second drive coil in the second direction.
[0013] The driver may also include a yoke disposed on one side of the drive coil, and the drive coil may be disposed between the drive yoke and the yoke.
[0014] The drive coil and drive yoke can be opposite each other in the diagonal direction of the image sensor.
[0015] The substrate may include electrical traces connected to the image sensor.
[0016] The substrate may include a movable portion fixedly connected to a movable body, a fixed portion fixedly connected to a fixed body, and a support portion interconnecting the movable portion and the fixed portion with each other. The support portion may include multiple bridges having embedded electrical traces therein.
[0017] The support may include a guide disposed between the movable part and the fixed part, and connected to the movable part and the fixed part by a plurality of bridges.
[0018] The multiple bridges also include a first bridge and a second bridge, wherein the first bridge extends from the movable part to the guide in a second direction orthogonal to the first direction, and the second bridge extends from the guide to the fixed part in a third direction orthogonal to the first direction. The second direction and the third direction may intersect each other.
[0019] The movable body may also include a sensor substrate connected to the image sensor. The sensor substrate may be disposed on the movable part, and the sensor substrate and the movable part may be connected to each other at corresponding contact points by solder balls.
[0020] The movable body may also include a sensor support, which includes a plate disposed on the upper side of the sensor substrate and an extension extending from the edge of the plate, and a drive coil or drive yoke may be mounted on the extension.
[0021] The actuator may also include a position sensor and a sensing magnet, wherein the position sensor is arranged on one of the fixed body and the movable body, and the sensing magnet is arranged on the other of the fixed body and the movable body and is opposite to the position sensor in a first direction.
[0022] In another general aspect, the camera module includes a lens module and a sensor shifting module, wherein the lens module includes a lens. The sensor shifting module includes a fixed body, a movable body, a substrate, and a driver, wherein the movable body is movably arranged in the fixed body and includes an image sensor having an imaging surface oriented in a first direction; the substrate connects the movable body to the fixed body and is configured to deform based on movement of the movable body relative to the fixed body; the driver is configured to move the movable body relative to the fixed body in a direction orthogonal to the first direction and includes a drive coil and a drive yoke, wherein the drive coil is coupled to one of the fixed body and the movable body, and the drive yoke is coupled to the other of the fixed body and the movable body. The drive yoke is arranged opposite the drive coil in a direction orthogonal to the first direction, and the space between the drive yoke and the drive coil is an air gap.
[0023] The driving yoke can be made of soft magnetic material.
[0024] The substrate may include electrical traces connected to the image sensor.
[0025] In another general aspect, the sensor shifting module includes a fixed body, a movable body, a substrate, and drivers, wherein the movable body is movably arranged within the fixed body and includes an image sensor having an imaging surface oriented in a first direction; the substrate connects the movable body to the fixed body and is configured to deform based on movement of the movable body relative to the fixed body; the drivers are configured to move the movable body in a direction orthogonal to the first direction; each of the drivers includes a drive coil and a drive yoke, wherein the drive coil is coupled to one of the fixed body and the movable body, and the drive yoke is coupled to the other of the fixed body and the movable body. A first driver and a second driver are arranged opposite each other, and a third driver and a fourth driver are arranged opposite each other.
[0026] Other features and aspects will be apparent from the accompanying drawings, claims and the following detailed description. Attached Figure Description
[0027] Figure 1 This is a diagram illustrating components included in a camera module according to an exemplary embodiment of the present disclosure.
[0028] Figure 2 This is a diagram illustrating a sensor shifting module according to an exemplary embodiment of the present disclosure.
[0029] Figure 3 This is a diagram showing a substrate on which an image sensor is mounted, according to an exemplary embodiment of the present disclosure, as viewed from above.
[0030] Figure 4 This is a diagram showing an OIS driver according to an example embodiment of the present disclosure, as viewed from above.
[0031] Figures 5A to 5D It is shown Figure 4 A diagram showing the movement of a movable body caused by an OIS driver.
[0032] Figure 6 This is a diagram illustrating an example of a unit driving unit arranged diagonally in the driving direction of an image sensor according to an exemplary embodiment of the present disclosure.
[0033] Figures 7A to 7D It is shown Figure 6 A diagram showing the movement of a movable body caused by the OIS drive unit.
[0034] Figures 8A to 8D This is a diagram showing the deformation of the substrate as it moves according to the movable body.
[0035] Figure 9A and Figure 9B It shows having with Figure 2 The diagram shows examples of different forms of sensor brackets.
[0036] Throughout all the accompanying drawings and detailed descriptions, the same reference numerals denote the same or similar elements. The drawings may not be drawn to scale, and for clarity, illustration, and convenience, the relative dimensions, scale, and descriptions of elements in the drawings may be exaggerated. Detailed Implementation
[0037] The following detailed description is provided to assist the reader in gaining a full understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will be apparent after understanding the disclosure of this application. For example, the sequence of operations described herein is merely illustrative and is not limited to the sequence set forth herein, but may be changed as will be apparent after understanding the disclosure of this application, except for operations that must occur in a certain order. Furthermore, for clarity and conciseness, descriptions of features that become apparent after understanding the disclosure of this application may be omitted.
[0038] The features described herein may be embodied in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways in which the methods, apparatus, and / or systems described herein will become apparent upon understanding the disclosure of this application.
[0039] Throughout the specification, when an element such as a layer, region, or substrate is described as being "on," "connected to," or "attached to" another element, it may be directly "on," "connected to," or "attached to" the other element, or one or more other elements may be interposed between them. Conversely, when an element is described as being "directly on," "directly connected to," or "directly attached to" another element, no other elements may be interposed between them.
[0040] As used herein, the term “and / or” includes any one or any combination of any two or more of the associated listed items.
[0041] Although terms such as “first,” “second,” and “third” may be used herein to describe various components, parts, regions, layers, or sections, these components, parts, regions, layers, or sections should not be limited by these terms. Rather, these terms are used only to distinguish one component, part, region, layer, or section from another. Thus, without departing from the teachings of the examples described herein, the first component, first part, first region, first layer, or first section mentioned in the examples may also be referred to as a second component, second part, second region, second layer, or second section.
[0042] Spatial relative terms such as “above,” “above,” “below,” and “lower” may be used herein for ease of description to describe the relationship of one element to another, as shown in the accompanying drawings. In addition to the orientations depicted in the drawings, these spatial relative terms are intended to also encompass different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as being “above” or “above” another element would be “below” or “lower” relative to that element. Thus, the term “above” includes both above and below orientations, depending on the spatial orientation of the device. The device may also be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative terms used herein will be interpreted accordingly.
[0043] The terminology used herein is for the purpose of describing various examples only and is not intended to limit this disclosure. The articles “a,” “an,” and “the” are intended to include plural forms as well, unless the context clearly indicates otherwise. The terms “comprising,” “including,” and “having” indicate the presence of the stated features, numbers, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, operations, components, elements, and / or combinations thereof.
[0044] Due to manufacturing techniques and / or tolerances, variations in the shapes shown in the accompanying drawings may occur. Therefore, the examples described herein are not limited to the specific shapes shown in the accompanying drawings, but include changes in shape that may occur during manufacturing.
[0045] It will be apparent upon understanding the disclosure of this application that the features of the examples described herein can be combined in various ways. Furthermore, although the examples described herein have various configurations, it will be apparent upon understanding the disclosure of this application that other configurations are also possible.
[0046] In the example embodiments, as shown in the figures, the X direction, Y direction, and Z direction can refer to the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis, respectively. Additionally, unless otherwise indicated, the X direction can include both the +X-axis direction and the -X-axis direction; the same applies to the Y and Z directions.
[0047] In the example embodiments, two directions (or axes) being parallel or orthogonal to each other may also include examples where two directions (or axes) are substantially parallel or orthogonal to each other. For example, a configuration in which the first axis and the second axis are orthogonal to each other may indicate that the first axis and the second axis can form an angle of 90 degrees or close to 90 degrees.
[0048] "Example embodiment" does not necessarily represent the same example embodiment. Specific features, structures, or characteristics may be combined in any suitable manner consistent with the example embodiment.
[0049] In the example embodiment, “configured to” may indicate that the component may include structures necessary to achieve the function.
[0050] Exemplary embodiments of this disclosure can enable a camera to provide effective optical image stabilization at low power, or eliminate or reduce the influence of the magnetic field of the actuator used to drive the image sensor on electronic components arranged outside the camera.
[0051] Figure 1 This is a diagram illustrating components included in camera module 1 according to an example embodiment.
[0052] In an example embodiment, camera module 1 may include lens module 20, which includes at least one lens 21, a lens barrel 22 housing the at least one lens 21, and an image sensor 11. Light L can pass through lens module 20 and reach the imaging surface of image sensor 11. Camera module 1 may include an AF driver 23 that can move lens module 20 in the optical axis direction to adjust focal length. AF driver 23 may include, for example, coils and magnets facing each other. The coils may be fixedly coupled to lens module 20, the magnets may be coupled to a fixed body such as a housing, and the electromagnetic interaction between the coils and the magnets can allow lens module 20 to move in the optical axis direction.
[0053] In an example embodiment, camera module 1 may provide optical image stabilization (hereinafter referred to as "OIS") functionality. Camera module 1 may provide OIS functionality by driving image sensor 11. For example, camera module 1 may include OIS driver 12 configured to move image sensor 11 in a direction orthogonal to the optical axis, or configured to enable image sensor 11 to rotate about an axis parallel to the optical axis or about an axis orthogonal to the optical axis.
[0054] In an example embodiment, camera module 1 may include sensor shifting module 10. Sensor shifting module 10 may include components necessary to implement OIS functionality by driving image sensor 11. For example, sensor shifting module 10 may include image sensor 11 and OIS driver 12 for driving image sensor 11. As another example, sensor shifting module 10 may refer only to OIS driver 12 and may not include image sensor 11.
[0055] In an example embodiment, in addition to lens module 20 and image sensor 11, camera module 1 may also include optical elements. In an example embodiment, camera module 1 may include two or more lens modules. For example, the first optical element 30 and / or the second optical element 40 may be lens modules different from lens module 20.
[0056] In an example embodiment, camera module 1 may include an optical path alteration element disposed in front of lens module 20. For example, the first optical element 30 may be implemented as a prism or a mirror. In another example embodiment, the optical path alteration element may be disposed between image sensor 11 and lens module 20. For example, the second optical element 40 may be implemented as a prism or a mirror.
[0057] In the following text, see references Figure 2 The sensor shifting module 100 or OIS driver 120 described in Figure 8 can be applied to Figure 1 Camera module 1 in the middle.
[0058] Figure 2 A sensor shifting module 100 according to an example embodiment is shown. The sensor shifting module 100 may include an OIS driver 120 that drives an image sensor 111. In the example embodiment, the OIS driver 120 may include a movable body 110 and a fixed body 130, wherein the movable body 110 includes the image sensor 111. The movable body 110 may be movably arranged within the fixed body 130. The movable body 110 may be configured to move together with the image sensor 111. For example, the movable body 110 may include a sensor substrate 112 and a sensor support 113, wherein the image sensor 111 is mounted on the sensor substrate 112 and the sensor support 113 is coupled to the sensor substrate 112.
[0059] refer to Figure 2 The sensor holder 113 may include a plate 113a connected to the lower part of the sensor substrate 112, and an extension 113b extending upward (in the +Z direction) from the edge of the plate 113a. The extension 113b may be opposite to the drive coil 122, and the drive yoke 121 may be disposed on the extension 113b. In another example embodiment, the drive yoke 121 may be mounted on the fixture 130, and the drive coil 122 may be mounted on the sensor holder 113. In this case, the drive coil 122 and / or the yoke 123 may be disposed on the extension 113b.
[0060] The signal from the image sensor 111 can be transmitted to another electronic component (e.g., an image signal processor (ISP)) via the sensor substrate 112 and the connector.
[0061] The fixing body 130 may include a base 131 and components fixedly connected to the base 131. For example, the fixing body 130 may include a drive coil 122 and a yoke 123, which will be described later.
[0062] The movable body 110 can be moved by the OIS driver 120 in a direction orthogonal to the direction pointing to the imaging surface 111a of the image sensor 111. In an example embodiment, the OIS driver 120 can compensate for jitter in a direction orthogonal to the optical axis O of the camera module 1 or electronics on which the image sensor 111 is mounted. The OIS driver 120 enables the image sensor 111 to move in a first direction and a second direction orthogonal to the optical axis O. The first direction and the second direction may intersect each other. For example, the OIS driver 120 enables the movable body 110 to move in the X and / or Y directions orthogonal to the Z-axis, thereby compensating for jitter in the X and / or Y directions.
[0063] In the example embodiment, the direction in which the imaging surface 111a of the image sensor 111 points can be referred to as the optical axis O direction. That is, the movable body 110 can move relative to the fixed body 130 in a direction orthogonal to the optical axis O. In the figures, the optical axis O can be parallel to the Z-axis; therefore, the Z-direction can refer to a direction parallel to the optical axis O. Furthermore, the X-direction or Y-direction can refer to a direction orthogonal to the optical axis O. For example, in the example embodiment, the configuration of the movable body 110 moving in the X-direction can indicate that the movable body 110 can move in a direction orthogonal to the optical axis O. For example, as another example, the configuration of the drive yoke 121 and the drive coil 122 facing each other in the X-direction can indicate that the drive yoke 121 and the drive coil 122 are facing each other in a direction orthogonal to the optical axis O. Furthermore, the X-direction or Y-direction can be an example of two directions orthogonal to the optical axis O and intersecting each other, and in the example embodiment, the X-direction and Y-direction can be configured as two directions orthogonal to the optical axis O and intersecting each other.
[0064] In an example embodiment, the sensor shifting module 100 may include a substrate 140 that mechanically connects a movable body 110 to a fixed body 130. The substrate 140 connects the movable body 110 to the fixed body 130 such that the movable body 110 can move relative to the fixed body 130 in a direction orthogonal to the optical axis O. A portion of the substrate 140 can deform according to the movement of the movable body 110 relative to the fixed body 130. That is, a portion of the substrate 140 can be flexible. When the substrate 140 deforms, a restoring force can be generated in the substrate 140, and this restoring force can allow the movable body 110 to return to its initial position. In an equilibrium state, the movable body 110 can move relative to the fixed body 130 as current is applied to the drive coil 122, and when no current flows in the drive coil 122, the movable body 110 can be moved back to its initial position via the substrate 140.
[0065] Figure 3 This is a diagram showing, as viewed from above, a substrate 140 on which an image sensor 111 is mounted, according to an exemplary embodiment. (See reference) Figure 2 and Figure 3 The substrate 140 may include a movable portion 141 on which the sensor substrate 112 is mounted, and a fixed portion 142 fixed to the fixing body 130. The sensor substrate 112 and the movable portion 141 may be electrically connected to each other at corresponding contact points P1 and P2 by solder balls.
[0066] When the movable body 110 (or image sensor 111) moves relative to the fixed body 130, the movable portion 141 can move relative to the fixed portion 142. The substrate 140 may include a support portion 143 connecting the movable portion 141 to the fixed portion 142. At least a portion of the support portion 143 can deform according to the relative movement between the movable portion 141 and the fixed body 130. For example, the support portion 143 may be configured as a flexible substrate. The flexible substrate may be provided in the form in which conductive patterns (or electrical traces (also referred to as "wire lines") 145) are formed in a film formed of a polyimide material.
[0067] In an example embodiment, the substrate 140 may include a plurality of bridge elements 144 connecting the movable portion 141 to the fixed portion 142. The plurality of bridge elements 144 may be included in at least a portion of the support portion 143. The plurality of bridge elements 144 may be formed of a flexible material such that they may deform as the movable portion 141 moves relative to the fixed portion 142. When the movable body 110 moves relative to the fixed body 130, the movable portion 141 may move relative to the fixed portion 142, and the bridge elements 144 may deform. The restoring force generated by the deformation of the bridge elements 144 may enable the movable body 110 or the movable portion 141 to return to its initial position. Each of the plurality of bridge elements 144 may include at least one electrical wiring 145. That is, the plurality of bridge elements 144 may electrically and mechanically connect the movable portion 141 (or the movable body 110) to the fixed portion 142 (or the fixed body 130). That is, the bridge element 144 can support the image sensor 111 and can act as a path for transmitting signals from the image sensor 111.
[0068] In an example embodiment, substrate 140 may include a guide 146 disposed between movable portion 141 and fixed portion 142. For example, guide 146 may be arranged in the form of a picture frame surrounding movable portion 141. Fixed portion 142, guide 146, and movable portion 141 may be connected to each other by bridge element 144. For example, substrate 140 may include a second bridge 148 extending from movable portion 141 to guide 146 and a first bridge 147 extending from guide 146 to fixed portion 142. First bridge 147 and second bridge 148 may extend in a direction orthogonal to optical axis O. First bridge 147 and second bridge 148 may extend in a direction intersecting each other. For example, first bridge 147 may extend in the Y direction, and second bridge 148 may extend in the X direction.
[0069] Each of the first bridge 147 and the second bridge 148 may include one or more bridge elements 144. The first bridge 147 may include four bridge elements 144 extending in the X direction, and the second bridge 148 may include four bridge elements 144 extending in the Y direction. Figure 3 The substrate 140 can be an example, and the form of the support 143 connecting the movable part 141 to the fixed part 142 can be varied. For example, the support 143 may include a plurality of bridge elements 144 extending directly from the movable part 141 to the fixed part 142. As another example, the first bridge 147 or the second bridge 148 may include five bridge elements 144. The number of bridge elements 144 included in the first bridge 147 or the second bridge 148 may correspond to the number of terminals of the image sensor 111.
[0070] The substrate 140 may include electrical wiring 145 for transmitting signals from the image sensor 111. A plurality of bridge elements 144 in the support portion 143 may include embedded electrical wiring 145. The image sensor 111 may be mounted on a sensor substrate 112, and the sensor substrate 112 may be electrically connected to a fixing portion 142 of the substrate 140. The electrical wiring 145 may extend from each of the contact points P2 formed in the movable portion 141. The electrical wiring 145 may extend to the fixing portion 142 via the bridge elements 144. The electrical wiring 145 extending to the fixing portion 142 may be electrically connected to another substrate or electronic component.
[0071] at the same time, Figure 3 Electrical wiring 145 formed on substrate 140 is shown, and for ease of description, only electrical wiring 145 extending from some contact points is shown.
[0072] refer to Figure 2In an example embodiment, the OIS driver 120 may include a position sensor 127 that measures how much the movable body 110 has moved in a direction orthogonal to the optical axis O. The position sensor 127 may be implemented as a Hall sensor or a magnetoresistive sensor.
[0073] The OIS driver 120 may include a sensing magnet 124 that moves with the movable body 110 and is opposite to the position sensor 127. The position sensor 127 may be arranged opposite the sensing magnet 124. For example, the position sensor 127 may be arranged on the base 131, and the sensing magnet 124 may be arranged on the substrate 140 to be opposite the position sensor 127 in the optical axis direction (in the Z direction). As another example, the position sensor 127 may be arranged on the substrate 140, and the sensing magnet 124 may be arranged on the base 131. The position sensor 127 and the sensing magnet 124 may be provided in pairs.
[0074] refer to Figure 2 In an example embodiment, the OIS driver 120 may include a drive coil 122 and a drive yoke 121, wherein the drive coil 122 is coupled to one of the movable body 110 and the fixed body 130, and the drive yoke 121 is coupled to the other of the movable body 110 and the fixed body 130. For example, refer to Figure 2 In the example embodiment, the drive coil 122 and the drive yoke 121 can be connected to the base 131 and the sensor bracket 113, respectively. The drive yoke 121 and the drive coil 122 can be opposite each other in a direction orthogonal to the optical axis O. The electromagnetic interaction between the drive yoke 121 and the drive coil 122 enables the movable body 110 to move relative to the fixed body 130 in a direction orthogonal to the optical axis O.
[0075] In an example embodiment, the OIS driver 120 may further include a yoke 123 disposed on one side of the drive coil 122. The yoke 123 enables the magnetic field generated in the drive coil 122 to be concentrated only in the direction toward the drive yoke 121. Since the yoke 123 is disposed on one side of the drive coil 122, the magnetic field generated by the drive coil 122 can be prevented from affecting other electronic components, or the influence of the magnetic field on other electronic components can be reduced.
[0076] In an example embodiment, the drive coil 122 and the drive yoke 121 may be connected to the fixed body 130 and the movable body 110, respectively, but the example embodiment is not limited thereto. In another example embodiment, the drive coil 122 and the drive yoke 121 may be connected to the movable body 110 and the fixed body 130, respectively. For example, the drive coil 122 and the drive yoke 121 may be connected to the sensor bracket 113 and the base 131, respectively.
[0077] An air gap may be formed between the drive coil 122 and the drive yoke 121. Alternatively, the space between the drive coil 122 and the drive yoke 121 may be an air gap. That is, there may be no other components (e.g., a magnet) between the drive coil 122 and the drive yoke 121. The drive coil 122 and the drive yoke 121 may be directly opposite each other, with an air gap between them.
[0078] Figure 2 The components of the OIS driver 120 are shown, and its exemplary embodiments are not limited to those shown. Figure 2 The structure in.
[0079] In an example embodiment, the OIS driver 120 may not include a permanent magnet. In an example embodiment, when no current flows in the drive coil 122, the magnetic field generated by the drive yoke 121 may be zero or may have a relatively small level. Therefore, the magnetic field generated by the OIS driver 120 can be prevented from affecting other electronic components (e.g., other electronic components in camera module 1, or electronic components in other camera modules 1), or the influence of the magnetic field on other electronic components can be reduced.
[0080] In the example embodiment, the driving yoke 121 may be a soft magnetic material. Soft magnetic materials have low coercivity and can be magnetized when exposed to a magnetic field, but can lose magnetism or have a relatively low level of magnetism when the magnetic field is removed.
[0081] When current is applied to the drive coil 122, the drive yoke 121 can be magnetized, generating magnetic resistance between the drive coil 122 and the drive yoke 121. An attractive force can be generated in the direction in which the drive yoke 121 and the drive coil 122 are opposite to each other, which can enable the movable body 110 to move relative to the fixed body 130 in the corresponding direction. For example, refer to... Figure 4 When current is applied to the first drive coil 122a, an attractive force is generated between the first drive coil 122a and the first drive yoke 121a, allowing the movable body 110 to move in the -X direction. Conversely, when current is applied to the second drive coil 122b, an attractive force is generated between the second drive coil 122b and the second drive yoke 121b, allowing the movable body 110 to move in the +X direction.
[0082] Figure 4 This is a diagram showing the OIS driver according to an example embodiment, as viewed from above.
[0083] OIS driver 120 may include a plurality of unit drivers 120a, 120b, 120c, and 120d. Unit drivers 120a, 120b, 120c, and 120d may include drive yokes 121 and drive coils 122 opposite to each other. Unit drivers 120a, 120b, 120c, and 120d may also include a yoke 123 disposed on one side of the drive coil 122. For example, a first unit driver 120a may include a first drive yoke 121a, a first drive coil 122a, and a first yoke 123a.
[0084] Since only an attractive force is generated between the drive coil 122 and the drive yoke 121, at least two unit drivers are required to move the movable body 110 back and forth in one direction.
[0085] refer to Figure 4 The OIS driver 120 may include a first unit driver 120a and a second unit driver 120b to correct jitter in the X direction, wherein the first unit driver 120a is arranged in the -X direction of the movable body 110, and the second unit driver 120b is arranged in the +X direction of the movable body 110. The first unit driver 120a may include a first drive yoke 121a coupled to the movable body 110 and a first drive coil 122a coupled to the base 131. The first unit driver 120a may also include a first yoke 123a arranged on one side of the first drive coil 122a. The second unit driver 120b may include a second drive yoke 121b coupled to the movable body 110 and a second drive coil 122b coupled to the base 131. The second unit driver 120b may also include a second yoke 123b arranged on one side of the second drive coil 122b.
[0086] refer to Figure 4 The OIS driver 120 may include a third unit driver 120c and a fourth unit driver 120d to correct jitter in the Y direction, wherein the third unit driver 120c is arranged in the +Y direction of the movable body 110, and the fourth unit driver 120d is arranged in the -Y direction of the movable body 110. The third unit driver 120c may include a third drive yoke 121c coupled to the movable body 110 and a third drive coil 122c coupled to the base 131. The third unit driver 120c may also include a third yoke 123c arranged on one side of the third drive coil 122c. The fourth unit driver 120d may include a fourth drive yoke 121d coupled to the movable body 110 and a fourth drive coil 122d coupled to the base 131. The fourth unit driver 120d may also include a fourth yoke 123d arranged on one side of the fourth drive coil 122d.
[0087] Figures 5A to 5DIt shows the movable body by Figure 4 The graph shows the movement caused by the OIS driver in the image.
[0088] refer to Figure 5A Current can be applied to the first drive coil 122a, causing the first drive coil 122a to pull the first drive yoke 121a in the direction of the arrow, and thus, the movable body 110 can move in the -X direction. (Reference) Figure 5B Current can be applied to the second drive coil 122b, causing the second drive coil 122b to pull the second drive yoke 121b in the direction of the arrow, and thus, the movable body 110 can move in the +X direction. (Reference) Figure 5C Current can be applied to the third drive coil 122c, causing the third drive coil 122c to pull the third drive yoke 121c in the direction of the arrow, and thus, the movable body 110 can move in the +Y direction. (Reference) Figure 5D Current can be applied to the fourth drive coil 122d, so that the fourth drive coil 122d can pull the fourth drive yoke 121d in the arrow direction, and thus the movable body 110 can move in the -Y direction.
[0089] Figure 6 This is a diagram illustrating an example of how the unit driving units 120a, 120b, 120c, and 120d are arranged diagonally in the driving direction of the image sensor 111, according to an exemplary embodiment.
[0090] In the example embodiment, the movable body 110 can move in a direction orthogonal to the optical axis O. For example, the movable body 110 can move in the X and Y directions. The OIS driver 120 enables the movable body 110 to move in a first direction OIS-X, which is parallel to the horizontal side 111c of the image sensor 111, and in a second direction OIS-Y, which is parallel to the vertical side 111d of the image sensor 111.
[0091] refer to Figure 6 The unit drivers 120a, 120b, 120c, and 120d can be arranged in a direction perpendicular to the optical axis O and intersecting with the two mutually perpendicular movement directions OIS-X and OIS-Y. For example, the first unit driver 120a and the second unit driver 120b can be arranged on both sides of the image sensor 111 in the first diagonal direction D1. The third unit driver 120c and the fourth unit driver 120d can be arranged on both sides of the image sensor 111 in the second diagonal direction D2.
[0092] In an example embodiment, when the OIS driver 120 is configured to move the movable body 110 in a first direction OIS-X and a second direction OIS-Y, the drive coil 122 and the drive yoke 121 may be opposite each other in a direction between the first direction OIS-X and the second direction OIS-Y. For example, when the OIS driver 120 is configured to move the movable body 110 in the X and Y directions, the drive coil 122 and the drive yoke 121 may be opposite each other in directions D1 and D2, forming a 45-degree angle with the X-axis or Y-axis.
[0093] Figures 7A to 7D It shows the movable body by Figure 6 The diagram shows the movement caused by the OIS drive unit in the diagram.
[0094] refer to Figure 7A Current can be applied to the first drive coil 122a and the fourth drive coil 122d, causing the first drive coil 122a and the fourth drive coil 122d to pull the first drive yoke 121a and the fourth drive yoke 121d respectively in the arrow direction, and thus, the movable body 110 can move in the -X direction. (Reference) Figure 7B Current can be applied to the second drive coil 122b and the third drive coil 122c, causing the second drive coil 122b and the third drive coil 122c to pull the second drive yoke 121b and the third drive yoke 121c respectively in the direction of the arrow, and thus, the movable body 110 can move in the +X direction. (Reference) Figure 7C Current can be applied to the first drive coil 122a and the third drive coil 122c, causing the first drive coil 122a and the third drive coil 122c to pull the first drive yoke 121a and the third drive yoke 121c respectively in the arrow direction, and thus, the movable body 110 can move in the +Y direction. (Reference) Figure 7D Current can be applied to the second drive coil 122b and the fourth drive coil 122d, so that the second drive coil 122b and the fourth drive coil 122d can pull the second drive yoke 121b and the fourth drive yoke 121d respectively in the arrow direction, and therefore, the movable body 110 can move in the -Y direction.
[0095] Figures 8A to 8D This is a diagram showing the deformation of the substrate 140 as it moves according to the movable body 110.
[0096] refer to Figure 8AWhen the movable body 110 moves in the -X direction, the movable portion 141 of the substrate 140 can also move in the -X direction, and therefore, the first bridge 147 connecting the guide 146 to the fixing portion 142 can deform. Since the bridge element 144 included in the first bridge 147 is elastic, the deformed first bridge 147 can provide a restoring force to allow the movable portion 141 to return in the opposite direction to the moving direction (+X direction). Therefore, when no current is applied to the OIS driver 120, the movable portion 141 can move in the +X direction.
[0097] refer to Figure 8B When the movable body 110 moves in the +X direction, the movable portion 141 of the substrate 140 can also move in the +X direction, and therefore, the first bridge 147 connecting the guide 146 to the fixing portion 142 can deform. Since the bridge element 144 included in the first bridge 147 is elastic, the deformed first bridge 147 can provide a restoring force so that the movable portion 141 can return in the opposite direction to the moving direction (-X direction).
[0098] refer to Figure 8C When the movable body 110 moves in the +Y direction, the movable portion 141 of the substrate 140 can also move in the +Y direction, and therefore, the second bridge 148 connecting the guide 146 to the movable portion 141 can deform. Since the bridge element 144 included in the second bridge 148 is elastic, the deformed second bridge 148 can provide a restoring force so that the movable portion 141 can return in the opposite direction to the moving direction (-Y direction).
[0099] refer to Figure 8D When the movable body 110 moves in the -Y direction, the movable portion 141 of the substrate 140 can also move in the -Y direction, and therefore, the second bridge 148 connecting the guide 146 to the movable portion 141 can deform. Since the bridge element 144 included in the second bridge 148 is elastic, the deformed second bridge 148 can provide a restoring force so that the movable portion 141 can return in the opposite direction to the moving direction (+Y direction).
[0100] Figure 9A and Figure 9B It shows having with Figure 2 The figure shows examples of different forms of sensor bracket 213.
[0101] refer to Figure 9AIn this embodiment, the sensor holder 213 can be disposed on the sensor substrate 112. In an example embodiment, the sensor holder 213 may include a plate 213a disposed on the sensor substrate 112 and an extension 213b extending downward (in the -Z direction) from the edge of the plate 213a. The extension 213b may connect to the drive coil of the OIS driver 120 (e.g., Figure 2 The drive coil 122 in the OIS driver 120 is opposite to the drive yoke (e.g., Figure 2 The drive yoke 121 in the sensor can be mounted on the extension 213b. In another example embodiment, the drive yoke can be mounted on the fixture 130, and the drive coil can be mounted on the sensor holder 213. In this case, the drive coil and / or the yoke (e.g., Figure 2 The yoke 123) can be mounted on the extension 213b. Figure 2 Compared to the sensor bracket 213 in Figure 9, the sensor bracket 213 in Figure 9 is more advantageous in avoiding interference with the solder balls that connect the sensor substrate 112 to the substrate 140. Furthermore, when the sensor bracket 213 is arranged on the upper side of the sensor substrate 112, the thickness of the sensor bracket 213 can be increased relatively freely, which can improve the mechanical rigidity of the sensor bracket 213.
[0102] refer to Figure 9A The image sensor 111 can be electrically connected to the sensor substrate 112 through a conductive via.
[0103] refer to Figure 9B The sensor holder 313 can be disposed on the sensor substrate 112. In an example embodiment, the sensor holder 313 may include a plate 313a disposed on the sensor substrate 112 and an extension 313b extending downward (in the -Z direction) from the edge of the plate 313a. The extension 313b may be connected to the drive coil of the OIS driver 120 (e.g., Figure 2 The drive coil 122 in the OIS driver 120 is opposite to the drive yoke (e.g., Figure 2 The drive yoke 121 in the sensor can be mounted on the extension 313b. In another example embodiment, the drive yoke can be mounted on the fixture 130, and the drive coil can be mounted on the sensor holder 313. In this case, the drive coil and / or the yoke (e.g., Figure 2 The yoke 123) can be mounted on the extension 313b. Figure 2Compared to the sensor bracket 313 in Figure 9, the sensor bracket 313 in Figure 9 is more advantageous in avoiding interference with the solder balls connecting the sensor substrate 112 and the substrate 140. Furthermore, when the sensor bracket 313 is arranged on the upper side of the sensor substrate 112, the thickness of the sensor bracket 313 can be increased relatively freely, which can improve the mechanical rigidity of the sensor bracket 313.
[0104] refer to Figure 9B The image sensor 111 can be directly mounted on the sensor substrate 112. Therefore, the sensor bracket 313 can include a through portion 313c in the portion corresponding to the image sensor 111. The image sensor 111 can be mounted on the sensor substrate 112, and the terminals of the image sensor 111 and the terminals of the sensor substrate 112 can be connected to each other by wiring.
[0105] According to the above example embodiments, the camera can provide effective optical image stabilization with low power. Furthermore, according to the example embodiments, the influence of the magnetic field of the actuator driving the image sensor on electronic components arranged outside the camera can be eliminated or reduced.
[0106] While this disclosure includes specific examples, it will be apparent upon understanding the disclosure of this application that various changes in form and detail may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described herein are for descriptive purposes only and are not intended to be limiting. The description of features or aspects in each example is considered applicable to similar features or aspects in other examples. Suitable results may also be achieved if the described techniques are performed in a different order, and / or if components in the described system, architecture, device, or circuit are combined in a different manner, and / or replaced or supplemented by other components or their equivalents. Therefore, the scope of this disclosure is defined not by the detailed description but by the claims and their equivalents, and all variations within the scope of the claims and their equivalents shall be construed as included in this disclosure.
Claims
1. A sensor shifting module, comprising: Fixed body; A movable body, movably arranged in the fixed body, includes a sensor substrate and a sensor support connected to the sensor substrate, and an image sensor having an imaging surface oriented in a first direction is connected to the upper side of the sensor substrate. A substrate for connecting the movable body to the fixed body, configured to deform based on the movement of the movable body relative to the fixed body; as well as A driver, configured to move the movable body relative to the fixed body in a direction orthogonal to the first direction, includes a drive coil and a drive yoke, wherein the drive coil is coupled to one of the fixed body and the movable body, and the drive yoke is coupled to the other of the fixed body and the movable body. The drive yoke is arranged opposite the drive coil in the direction orthogonal to the first direction. When current is applied to the drive coil, the movable body is configured to move in the direction orthogonal to the first direction through the electromagnetic interaction between the drive coil and the drive yoke. The substrate includes a movable part fixedly connected to the movable body, a fixed part fixedly connected to the fixed body, and a support part interconnecting the movable part and the fixed part. The sensor substrate is disposed on the movable part and connected to the movable part at corresponding contact points. The sensor bracket includes a plate connected to the sensor substrate and an extension extending from the edge of the plate in the first direction, and the drive coil or the drive yoke is mounted on the extension.
2. The sensor shifting module according to claim 1, wherein, The driving yoke is made of soft magnetic material.
3. The sensor shifting module according to claim 1, wherein, When there is no current flowing in the drive coil, the magnetic field caused by the drive yoke is zero.
4. The sensor shifting module according to claim 1, wherein, The drive coil and the drive yoke are opposite each other in a second direction orthogonal to the first direction, and the electromagnetic interaction between the drive coil and the drive yoke is configured to move the movable body in the second direction.
5. The sensor shifting module according to claim 1, wherein, The drive coil and the drive yoke are opposite to each other in a second direction orthogonal to the first direction. The drive coil includes a first drive coil and a second drive coil respectively arranged on both sides of the movable body in the second direction, and the drive yoke includes a first drive yoke and a second drive yoke respectively opposite to the first drive coil and the second drive coil in the second direction.
6. The sensor shifting module according to claim 1, wherein, The driver also includes a yoke disposed on one side of the drive coil, and the drive coil is disposed between the drive yoke and the yoke.
7. The sensor shifting module according to claim 1, wherein, The drive coil and the drive yoke are opposite each other in the diagonal direction of the image sensor.
8. The sensor shifting module according to claim 1, wherein, The substrate includes electrical traces connected to the image sensor.
9. The sensor shifting module according to claim 8, in, The support includes a plurality of bridges having the electrical traces embedded therein.
10. The sensor shifting module according to claim 9, wherein, The support includes a guide member disposed between the movable part and the fixed part, and connected to the movable part and the fixed part via the plurality of bridges.
11. The sensor shifting module according to claim 10, wherein, The plurality of bridges further includes a first bridge and a second bridge, wherein the first bridge extends from the movable portion to the guide in a second direction orthogonal to the first direction, and the second bridge extends from the guide to the fixed portion in a third direction orthogonal to the first direction. The second direction intersects with the third direction.
12. The sensor shifting module according to claim 9, wherein, The sensor substrate and the movable part are connected to each other at their respective contact points by solder balls.
13. The sensor shifting module according to claim 1, wherein, The actuator further includes a position sensor and a sensing magnet, wherein the position sensor is disposed on one of the fixed body and the movable body, and the sensing magnet is disposed on the other of the fixed body and the movable body and is opposite to the position sensor in the first direction.
14. A camera module, including: Lens module, including lenses; as well as The sensor shifting module includes: Fixed body; A movable body, movably arranged in the fixed body, includes a sensor substrate and a sensor support connected to the sensor substrate, and an image sensor having an imaging surface oriented in a first direction is connected to the upper side of the sensor substrate. A substrate, connecting the movable body to the fixed body, configured to deform based on movement of the movable body relative to the fixed body; and A driver, configured to move the movable body relative to the fixed body in a direction orthogonal to the first direction, includes a drive coil and a drive yoke, wherein the drive coil is coupled to one of the fixed body and the movable body, and the drive yoke is coupled to the other of the fixed body and the movable body. The drive yoke is arranged opposite the drive coil in a direction orthogonal to the first direction, and the space between the drive yoke and the drive coil is an air gap. The substrate includes a movable part fixedly connected to the movable body, a fixed part fixedly connected to the fixed body, and a support part interconnecting the movable part and the fixed part. The sensor substrate is disposed on the movable part and connected to the movable part at corresponding contact points. The sensor bracket includes a plate connected to the sensor substrate and an extension extending from the edge of the plate in the first direction, and the drive coil or the drive yoke is mounted on the extension.
15. The camera module according to claim 14, wherein, The driving yoke is made of soft magnetic material.
16. The camera module according to claim 14, wherein, The substrate includes electrical traces connected to the image sensor.
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