A flexure for a suspension of a disk drive and a suspension for a disk drive

Abstract

A flexible member of a suspension for a magnetic disk device according to one embodiment includes a metal base and a wiring portion provided along the metal base. The wiring portion has a base insulating layer, a conductor layer laminated on the base insulating layer, and an insulating cover layer laminated on the conductor layer. The metal base has a pair of first portions having side surfaces opposite to each other. At least one of the base insulating layer and the cover insulating layer is in contact with the side surfaces between the pair of first portions, and the conductor layer does not overlap the metal base in a lamination direction of the wiring portion.

Description

[0001] Cross-reference of related applications

[0002] This application is based on an earlier application filed in Japan on November 16, 2021 (Japanese Patent Application No. 2021-186538) and enjoys priority for all matters set forth in the earlier application. Technical Field

[0003] The present invention relates to a flexural element for a suspension for a disk drive and a suspension for a disk drive. Background Technology

[0004] Hard disk drives (HDDs) are used in information processing devices such as personal computers. An HDD includes a disk that rotates around a spindle, a carriage that rotates around a pivot, and so on. The carriage has an actuator arm and rotates around the pivot in the direction of the disk's track width via a positioning motor, such as a voice coil motor.

[0005] The actuator arm is equipped with a suspension for the disk drive (hereinafter referred to as the suspension). The suspension includes a load-bearing beam and a flexure superimposed on the load-bearing beam. A slider constituting the read / write head is provided on a universal joint formed near the front end of the flexure.

[0006] The slider has access elements (converters) for things like reading or writing data. These support beams, flexural elements, and sliders constitute the head universal joint assembly.

[0007] To increase disk recording density, the head gimbal assembly needs to be made more compact and the slider needs to be positioned on the disk's recording surface with greater precision.

[0008] With the increasing demand for higher recording density and recording capacity of disk drives, existing technologies employ methods that increase the number of disks included in the disk drive (the so-called increase in the number of disks). For example, Japanese Patent Publication No. 2020-129423 discloses a disk drive capable of increasing the number of disks used as recording media.

[0009] To increase the number of disks, not only do the disks need to be thinner, but the spacing between them also needs to be reduced. However, reducing the spacing between disks increases the risk of the suspended disks touching each other. Therefore, a thinner suspension is needed.

[0010] However, there is still room for improvement in reducing the thickness of the suspension. For example, it may be difficult to thin the load-bearing beam because it could significantly affect the spring load and suspension resonance. Summary of the Invention

[0011] One of the objectives of this invention is to provide a flexural element for a disk drive suspension that can be manufactured to be thinner, and a disk drive suspension.

[0012] According to one embodiment, a flexural member for a disk drive suspension includes a metal substrate and wiring portions disposed along the metal substrate. The wiring portions have a substrate insulating layer, a conductor layer superimposed on the substrate insulating layer, and a cover insulating layer superimposed on the conductor layer. The metal substrate has a pair of first portions having sides facing each other.

[0013] At least one of the base insulating layer and the cover insulating layer is in contact with the side surface between the pair of first portions, and the conductor layer does not overlap with the metal substrate in the lamination direction of the wiring portion.

[0014] The base insulating layer, the conductor layer, and the cover insulating layer are located between the side surfaces, and the thickness of the wiring portion may be less than or equal to the thickness of the pair of first portions. At least a portion of the conductor layer may be embedded in the base insulating layer.

[0015] The base insulating layer is located between the sides, and the conductor layer and the cover insulating layer may also be located between the sides. An air layer is also included, and the base insulating layer may be in contact with the air layer between the sides.

[0016] It also includes a support layer that supports the wiring portion. In the lamination direction, the base insulating layer has a first surface that is in contact with the conductor layer and a second surface that is opposite to the first surface. The support layer may also be in contact with the second surface.

[0017] It also includes a connecting portion, wherein the conductor layer has a plurality of parallel wirings in a direction perpendicular to the extension direction of the wiring portion, and the connecting portion can be electrically connected to at least one of the plurality of wirings.

[0018] According to one embodiment, the flexural member of a disk drive suspension has a metal substrate and a wiring portion disposed along the metal substrate. The wiring portion has a substrate insulating layer, a conductor layer superimposed on the insulating layer, and a cover insulating layer superimposed on the conductor layer. The metal substrate has a pair of first portions and a second portion, the pair of first portions having sides facing each other, and the second portion overlapping the conductor layer and connected to the pair of first portions.

[0019] At least one of the base insulating layer and the cover insulating layer is in contact with the side between the pair of first portions, and the thickness of the second portion is less than the thickness of the first portion. The second portion may also have an opening that overlaps with the conductor layer.

[0020] According to one embodiment, a suspension for a disk drive includes a load-bearing beam and a flexure member overlapping the load-bearing beam.

[0021] This configuration allows for the provision of a flexural element and a suspension for disk drives that can be manufactured to be thinner. Attached Figure Description

[0022] The accompanying drawings, which form part of this specification, illustrate presently preferred embodiments of the invention and, in conjunction with the foregoing summary of the invention and the following preferred embodiments, serve to explain the nature of the invention.

[0023] Figure 1 A side view of an example disk device is shown.

[0024] Figure 2 A cross-sectional view of a portion of the disk drive is shown.

[0025] Figure 3 This is a plan view of the suspension according to the first embodiment.

[0026] Figure 4 yes Figure 3 The diagram shows a plan view of the flexural element.

[0027] Figure 5 It shows along Figure 4 A side sectional view of the VV-line flexural member.

[0028] Figure 6 yes Figure 5 The cross-sectional view of the flexural member shown.

[0029] Figure 7 This is a comparative example of the flexural member according to the first embodiment.

[0030] Figure 8 This is a cross-sectional view of the flexural member according to the second embodiment.

[0031] Figure 9 This is a cross-sectional view of the flexural member according to the third embodiment.

[0032] Figure 10 This is a cross-sectional view of the flexural member according to the fourth embodiment.

[0033] Figure 11 This is a cross-sectional view of the flexural member according to the fifth embodiment.

[0034] Figure 12 This is a cross-sectional view of the flexural member according to the sixth embodiment.

[0035] Figure 13 This is a cross-sectional view of the flexural member according to the 7th embodiment.

[0036] Figure 14 This is a cross-sectional view of the flexural member according to the 8th embodiment.

[0037] Figure 15This is a cross-sectional view of the flexural member according to the 9th embodiment.

[0038] Figure 16 This is a cross-sectional view of the flexural member according to the 10th embodiment.

[0039] Figure 17 This is a plan view of the flexural member according to the 11th embodiment.

[0040] Figure 18 It is along Figure 17 A cross-sectional view of the flexural element along the XVIII-XVIII line.

[0041] Figure 19 This is a partial plan view of the flexural member according to the 12th embodiment.

[0042] Figure 20 It is along Figure 19 A cross-sectional view of the flexural member along the XX-XX line.

[0043] Figure 21 This is a cross-sectional view of the flexural member according to the 13th embodiment. Detailed Implementation

[0044] [First Embodiment]

[0045] Figure 1 This is a schematic side view showing an example of a disk drive (HDD) 1. Figure 1 In the example shown, the disk drive 1 includes a housing 2, a plurality of disks (hereinafter referred to as disks 4) that rotate around a spindle 3, a bracket 6 that can rotate around a pivot 5, and a positioning motor (voice coil motor) 7 for driving the bracket 6. The housing 2 is sealed with a cover (not shown).

[0046] Figure 2 This is a schematic cross-sectional view showing a portion of disk device 1. For example... Figure 1 and Figure 2 As shown, the bracket 6 has multiple arms (bracket arms) 8. Suspension 10s are respectively mounted on the front ends of the multiple arms 8. The slider 11 constituting the magnetic head is provided at the front end of each suspension 10.

[0047] As disk 4 rotates at high speed, air flows between disk 4 and slider 11 to form an air bearing. As bracket 6 rotates via positioning motor 7, suspension 10 moves radially along disk 4, thereby moving slider 11 onto the desired track of disk 4.

[0048] like Figure 2 As shown, disk 4 has a first disk 4A and a second disk 4B. The first disk 4A and the second disk 4B are opposed to each other with a predetermined gap. A plurality of suspensions 10 provided in disk device 1 include a first suspension 10A and a second suspension 10B.

[0049] The first suspension 10A and the second suspension 10B are located between the first disk 4A and the second disk 4B. The first suspension 10A is opposite to the second suspension 10B in the thickness direction of the housing 2. The number of disks 4 is not limited to two, but can be three or more. The number of suspensions 10 can be appropriately changed according to the number of disks 4.

[0050] Figure 3 This is a schematic plan view of the suspension 10 according to the first embodiment. Figure 4 yes Figure 3 The schematic plan view of the flexure 30 is shown. The suspension 10 has a base plate 21, a load-bearing beam 22 and the flexure 30.

[0051] Both the load-bearing beam 22 and the flexure 30 extend in the longitudinal direction of the suspension 10. In the following text, the longitudinal direction of the suspension 10, the load-bearing beam 22 and the flexure 30 is defined as longitudinal direction X, and the direction orthogonal to longitudinal direction X is defined as transverse direction Y of the suspension 10, the load-bearing beam 22, the flexure 30 and so on.

[0052] The direction intersecting (e.g., perpendicularly) with the longitudinal (X) and transverse (Y) directions is defined as the thickness direction Z of the suspension 10, the load-bearing beam 22, the flexure 30, etc. Furthermore, the sway direction S is defined near the front end of the load-bearing beam 22, as indicated by the arc-shaped arrow.

[0053] The base plate 21 is made of a metal material such as stainless steel. The thickness of the base plate 21 is, for example, 120 μm, but is not limited thereto. An arm 8 (e.g., for attaching the suspension 10 to the bracket 6) is provided on the base plate 21. Figure 1 and Figure 2 The boss portion 23 (as shown).

[0054] The load-bearing beam 22 is made of a metal material such as stainless steel. The thickness of the load-bearing beam 22 is, for example, 30 to 80 μm. The load-bearing beam 22 has a shape that gradually tapers towards its front end (left side in the figure).

[0055] The load-bearing beam 22 has a spring portion 24 at one end in the longitudinal direction X. The load-bearing beam 22 is fixed to the base plate 21 at the weld portion 25 by, for example, laser spot welding. The load-bearing beam 22 is elastically supported by the base plate 21 by the spring portion 24.

[0056] The flexural member 30 is arranged along the base plate 21 and the load-bearing beam 22. The flexural member 30 is fixed to the base plate 21 and the load-bearing beam 22 at the welded portion 25 by, for example, using laser spot welding.

[0057] The flexure 30 includes a front end portion 31 (left side in the figure) that overlaps with the load-bearing beam 22, and a flexure tail portion 32 that extends from the front end portion 31 toward the rear of the base plate 21 (right side in the figure).

[0058] The flexural member 30 includes a metal substrate 40 made of, for example, a thin stainless steel sheet and wiring portions 50 disposed along the metal substrate 40. The flexural member 30 has a laminated structure. The metal substrate 40 may be referred to as a stainless steel layer. The thickness of the metal substrate 40 is less than the thickness of the load-bearing beam 22.

[0059] In the front end portion 31, the flexural member 30 also has a tongue 33 and a pair of outriggers 34A and 34B. The slider 11 is mounted on the tongue 33. A component capable of converting magnetic signals and electrical signals, such as an MR element, is provided at the front end of the slider 11.

[0060] In the front-end portion 31, the wiring section 50 is electrically connected to the components of the slider 11 via terminals 51. These components allow for data access to the disk, such as writing or reading data. The slider 11, the support beam 22, and the flexure 30 constitute the head gimbal assembly.

[0061] A pair of protruding supports 34A and 34B are respectively arranged on both sides of the transverse Y direction of the tongue 33. The pair of protruding supports 34A and 34B are formed to protrude outward from both sides of the tongue 33 in the transverse Y direction. The tongue 33 and the pair of protruding supports 34A and 34B are both part of the metal substrate 40, and their respective contours are formed by etching, for example.

[0062] The universal joint 35 consists of a tongue 33 and a pair of outriggers 34A and 34B. The universal joint 35 is formed in the front end portion 31 of the flexural member 30. The universal joint 35 is equipped with micro-actuator elements 36A and 36B. The micro-actuator elements 36A and 36B have the function of causing the tongue 33 to swing in the swing direction S.

[0063] Microactuator elements 36A and 36B are disposed on both sides of slider 11 along the transverse Y direction. Microactuator elements 36A and 36B are made of piezoelectric materials such as lead zirconate titanate (PZT). Microactuator elements 36A and 36B are each fixed to the actuator support of tongue 33 by conductive adhesive or the like.

[0064] Figure 5 It is along Figure 4 The VV line in the figure shows a schematic perspective sectional view of the flexural member 30. Figure 6 yes Figure 5 A schematic sectional view of the flexural member 30 is shown. Figure 5 and Figure 6 In the middle, the cross-section is viewed from the 32nd side of the flexible tail.

[0065] Hereinafter, the direction orthogonal to the extending direction of the wiring portion 50 will sometimes be referred to as the "width direction of the wiring portion 50". The width direction of the wiring portion 50 varies depending on the position of the wiring portion 50 in the length direction X. For example, in Figure 5 and Figure 6 In the example shown, the extension direction of the wiring section 50 corresponds to the length direction X, and the width direction of the wiring section 50 corresponds to the width direction Y.

[0066] As described above, the flexural member 30 has a metal substrate 40 and a wiring portion 50. For example... Figure 5 and Figure 6 As shown, the metal substrate 40 has a pair of first portions 41A and 41B.

[0067] A pair of first parts 41A and 41B are located on both sides of the flexure 30 in the transverse Y direction. The width of the metal base 40 in the transverse Y direction is greater than the width of the wiring portion 50 in the transverse Y direction. From another angle, the metal base 40 can be visually identified in a plan view of the suspension 10 viewed from the side of the flexure 30.

[0068] exist Figure 5 and Figure 6 In the example shown, a pair of first portions 41A and 41B are formed with rectangular cross sections. A pair of first portions 41A and 41B may have square cross sections. The cross sections of a pair of first portions 41A and 41B may include curved surfaces. The dimensions of a pair of first portions 41A and 41B are approximately equal.

[0069] Part 1, 41A, has a surface 42, a surface 43 opposite to surface 42 in the thickness direction Z, and a side surface 44 connecting surfaces 42 and 43. Part 1, 41B, has a surface 45, a surface 46 opposite to surface 45 in the thickness direction Z, and a side surface 47 connecting surfaces 45 and 46.

[0070] In the front-end portion 31, surfaces 43 and 46 are, for example, connected to the load-bearing beam 22 (as shown in the image). Figure 3 (As shown) Opposite surfaces. In the thickness direction Z, surface 42 and surface 45 are located on the same plane, and surface 43 and surface 46 are located on the same plane.

[0071] Sides 44 and 47 are opposite each other in the lateral Y direction. Figure 5 and Figure 6 In the example shown, sides 44 and 47 are, for example, surfaces that are substantially parallel to a plane defined by the length direction X and the thickness direction Z.

[0072] The wiring section 50 has a substrate insulating layer 61, a conductor layer 71 covering the substrate insulating layer 61, and a cover insulating layer 81 covering the conductor layer 71. The lamination direction of the wiring section 50 is along the thickness direction Z.

[0073] The base insulating layer 61 and the cover insulating layer 81 are composed of electrically insulating resin materials such as polyimide. Figure 5 and Figure 6In the example shown, the substrate insulating layer 61 has a uniform thickness in the transverse Y direction.

[0074] The base insulating layer 61 has a surface 62 (first surface) and a surface 63 (second surface) opposite to surface 62 in the thickness direction Z. Surface 62 is the surface in contact with the conductor layer 71 and the covering insulating layer 81. In the front end side portion 31, surface 63 is, for example, the surface in contact with the supporting beam 22 (such as...). Figure 3 (As shown) the opposite surfaces.

[0075] exist Figure 5 , Figure 6 In the example shown, surface 63 in the thickness direction Z is coplanar with surfaces 43 and 46. The substrate insulating layer 61 also has an end face 64 and an end face 65 opposite to end face 64 in the transverse direction Y. End faces 64 and 65 connect to surfaces 62 and 63.

[0076] The insulating layer 81 has an end face 82 and an end face 83 opposite to the end face 82 in the transverse Y direction. In the thickness direction Z, the end face 64 is located directly below the end face 82, and the end face 65 is located directly below the end face 83.

[0077] The conductor layer 71 is composed of a highly conductive metallic material such as copper. The conductor layer 71 is formed by etching along the substrate insulating layer 61 to form a specific pattern. Alternatively, the conductor layer 71 can also be formed on the substrate insulating layer 61 masked by a layer forming process such as electroplating.

[0078] like Figure 5 and Figure 6 As shown, the conductor layer 71 has a width direction along the wiring portion 50. Figure 5 and Figure 6 The example shown shows multiple wirings 72 arranged horizontally (Y). These wirings 72 include, for example, read wirings and write wirings. The multiple wirings 72 are covered by an insulating layer 81.

[0079] The covering insulation layer 81 is located in the region between the pair of first parts 41A and 41B and the conductor layer 71. The covering insulation layer 81 is also located in the region between the plurality of wirings 72. Thus, the plurality of wirings 72 are insulated from each other.

[0080] The covering insulating layer 81 does not overlap with the conductor layer 71 in the thickness direction Z in the regions between the pair of first portions 41A, 41B and the conductor layer 71, and in the regions between the plurality of wirings 72. In these regions, the covering insulating layer 81 is in contact with the surface 62 of the base insulating layer 61.

[0081] In the region between the pair of first portions 41A, 41B and the conductor layer 71, and in the region between the plurality of wirings 72, a plurality of grooves 84 are formed on the covering insulating layer 81. The plurality of grooves 84 are recessed toward the surface 62 and formed along the conductor layer 71.

[0082] like Figure 5 and 6 In the example shown, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between side 44 and side 47 in the transverse Y direction. From another angle, the wiring portion 50 is sandwiched between side 44 and 47. In the thickness direction Z, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 do not overlap with the pair of first portions 41A and 41B of the metal substrate 40.

[0083] At least one of the base insulating layer 61 and the cover insulating layer 81 is in contact with the sides 44 and 47 between a pair of first portions 41A and 41B. Figure 5 and Figure 6 In the example shown, the base insulating layer 61 and the cover insulating layer 81 are connected to the sides 44 and 47, respectively.

[0084] More specifically, end faces 64 and 82 are respectively connected to side face 44, and end faces 65 and 83 are respectively connected to side face 47. On the other hand, no gap is formed between end faces 64 and 82 and side face 44, and no gap is formed between end faces 65 and 83 and side face 47. Side faces 44 and 47 have portions that are not connected to the base insulating layer 61 and the covering insulating layer 81.

[0085] Here, as Figure 6 As shown, the thickness of the pair of first parts 41A and 41B is thickness T41, the thickness of the wiring part 50 is thickness T50, the thickness of the base insulation layer 61 is thickness T61, the thickness of the conductor layer 71 is thickness T71, and the thickness of the covering insulation layer 81 is thickness T81.

[0086] The thickness T41 of the pair of first parts 41A and 41B is approximately equal to the distance between surfaces 42 and 45 and surfaces 43 and 46 in the thickness direction Z. The thickness T50 of the wiring section 50 refers to the thickness in the thickness direction Z of the portion where the base insulation layer 61, conductor layer 71, and cover insulation layer 81 completely overlap.

[0087] exist Figure 6 In the example shown, the thickness T50 of the wiring section 50 is the sum of the thickness T61 of the base insulation layer 61, the thickness T71 of the conductor layer 71, and the thickness T81 of the covering insulation layer 81.

[0088] The thickness T61 of the base insulating layer 61 is approximately equal to the distance between it and surfaces 62 and 63 in the thickness direction Z. The thickness T81 of the covering insulating layer 81 refers, for example, to the thickness of the region overlapping with the conductor layer 71. The thickness T81 of the covering insulating layer 81 is thinner than, for example, the thickness T61 of the base insulating layer 61.

[0089] The thickness T50 of the wiring portion 50 is less than, for example, the thickness T41 of a pair of first portions 41A and 41B (T50 ≤ T41). In this case, the flexural member 30... Figure 5 and Figure 6 The thickness at the portion shown is approximately equal to the thickness T41 of a pair of portions 41A and 41B.

[0090] exist Figure 6 In the example shown, the thickness T50 of the wiring portion 50 is approximately equal to the thickness T41 of the pair of first portions 41A and 41B. The thickness T50 of the wiring portion 50 may be less than the thickness T41 of the pair of first portions 41A and 41B.

[0091] The thickness T41 of parts 41A and 41B is, for example, 11 to 50 μm. The thickness T41 of a pair of parts 41A and 41B is, for example, 18 μm. The thickness T61 of the substrate insulating layer 61 is, for example, 5 to 20 μm. The thickness T61 of the substrate insulating layer 61 is, for example, 6 μm.

[0092] The thickness T81 of the covering insulating layer 81 is, for example, 2 to 10 μm. The thickness T81 of the covering insulating layer 81 is, for example, 2 μm. The thickness T71 of the conductor layer 71 is, for example, 4 to 16 μm. The thickness T71 of the conductor layer 71 is, for example, 10 μm.

[0093] exist Figure 3 and Figure 4 In at least a portion of the flexural member 30 shown, the metal substrate 40, the substrate insulating layer 61, the conductor layer 71, and the covering insulating layer 81 do not all overlap simultaneously.

[0094] In the flexural component 30 Figure 5 and Figure 6 The example shown is mainly applicable to areas other than, for example, the terminal portion of the wiring portion 50 located on the side of the tail 32 of the flexure, the vicinity of the tongue 33, the portion forming the overhead wiring portion, and the portion forming the passage portion.

[0095] The overhead wiring section is the part of the wiring section 50 that is not connected to the metal substrate 40. The overhead wiring section is formed, for example, along the extension brackets 34A and 34B. The passage section is, for example, a part that includes a through hole penetrating the substrate insulation layer 61.

[0096] In the first embodiment, the flexure 30 can be constructed, in addition to the portion indicated by the VV line, for example, to the range between the portions forming an extension bracket 34A and 34B and the flexure tail 32. This range includes the portion formed by the extension bracket 34A and 34B. Figure 4 The area represented by the AA, BB, and CC lines and its vicinity.

[0097] As another example, the configuration of the flexure 30 can be applied to the tail portion 32 of the flexure. As another example, the configuration of the flexure 30 can be applied to the area where the flexure 30 overlaps with the load-bearing beam 22. As another example, the configuration of the flexure 30 can be applied to the area where the flexure 30 does not overlap with the load-bearing beam 22.

[0098] As another example, the configuration of the flexure 30 can be applied to both the area where the flexure 30 overlaps with the load-bearing beam 22 and the area where the flexure 30 does not overlap with the load-bearing beam 22. However, the applicable scope varies depending on the shape of the suspension 10, etc., and is not limited to the above example.

[0099] In the flexure 30 of the suspension 10 constructed as described above, the conductor layer 71 does not overlap with the metal substrate 40 in the thickness direction Z in at least a portion of the flexure 30, and the metal substrate 40, the base insulation layer 61, the conductor layer 71 and the covering insulation layer 81 do not overlap simultaneously.

[0100] The wiring portion 50 is disposed on the metal substrate 40 such that at least one of the base insulation layer 61 and the cover insulation layer 81 is in contact with the sides 44, 47 between a pair of first portions 41A, 41B. By configuring the flexure 30 in this way, the increase in the thickness of the flexure 30 can be suppressed and the thickness of the flexure 30 can be reduced.

[0101] Figure 7 This is a comparative example of the flexural member 30 according to the first embodiment. Figure 7 The flexural member 300 shown has a wiring portion 50 disposed on a metal substrate 40. A substrate insulating layer 61 is disposed on the metal substrate 40, and a conductor layer 71 and a cover insulating layer 81 overlap the substrate insulating layer 61.

[0102] In this case, the thickness of the flexural element 300 is the sum of the thickness of the metal substrate 40 and the thickness of the wiring portion 50. This is achieved by constructing as follows: Figure 5 and Figure 6 The flexural element 30 shown is, with Figure 3 Compared to the flexural member 300 shown, the thickness of the flexural member can be reduced.

[0103] The base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between side 44 and side 47 in the transverse Y direction. Furthermore, by setting the thickness T50 of the wiring portion 50 to be equal to or less than the thickness T41 of the pair of first portions 41A and 41B, the thickness of the flexure 30 will not become greater than the thickness T41 of the pair of first portions 41A and 41B; therefore, the increase in the thickness of the flexure 30 can be suppressed.

[0104] For example, if the thickness T50 of the wiring section 50 is approximately equal to the thickness T41 of a pair of first parts 41A and 41B, then the thickness of the flexure 30 can be approximately equal to the thicknesses T41 and T41B of a pair of first parts 41A.

[0105] Additionally, at least one of the base insulating layer 61 and the cover insulating layer 81 is in contact with the side surfaces 44 and 47. At least one of the base insulating layer 61 and the cover insulating layer 81 supports a pair of first portions 41A and 41B in the width direction Y. Therefore, the stiffness of the flexure 30 in the transverse Y direction can be increased. The stiffness of the flexure 30 in the transverse Y direction is sometimes referred to as "in-plane stiffness".

[0106] exist Figure 5 and Figure 6 In the example shown, the base insulation layer 61 and the cover insulation layer 81 are in contact with the sides 44 and 47, respectively. Therefore, compared with the case where one of the base insulation layer 61 and the cover insulation layer 81 is in contact with the sides 44 and 47, the stiffness of the flexural member 30 in the transverse Y direction can be further improved.

[0107] Furthermore, by utilizing the flexure 30 of the first embodiment, in-plane rigidity can be maintained and the spring constant of the flexure 30 can be reduced. This increases the degrees of freedom in designing the vibration characteristics and other aspects of the flexure 30.

[0108] As the number of components laminated along the thickness direction Z decreases and the thickness of the flexure 30 decreases, the thickness T61 of the substrate insulation layer 61 can be designed more freely in the wiring section 50, for example. By changing the thickness T61 of the substrate insulation layer 61, it is easier to optimize the transmission characteristics of the flexure 30, such as impedance matching.

[0109] Furthermore, by thinning the flexure 30, the suspension 10, including the flexure 30, can be made thinner. Such a suspension 10 can be adapted to disk drives 1 with small distances between disks 4, and thus can accommodate an increase in the number of disks 4.

[0110] According to this embodiment, the flexural element 30 and the suspension 10 can be manufactured to be thinner. In addition to the above description, this embodiment can also achieve various advantageous effects.

[0111] Next, another embodiment will be described. In other embodiments and variations described below, the same components as in the first embodiment described above are labeled with the same reference numerals as in the first embodiment, and their detailed descriptions may be omitted or simplified.

[0112] [Second Embodiment]

[0113] Figure 8 This is a schematic cross-sectional view of the flexible member 30 according to the second embodiment. The difference between the flexible member 30 of the second embodiment and the flexible member of the first embodiment lies in the wiring portion 50.

[0114] like Figure 8 As shown, the wiring section 50 has a base insulating layer 61, a conductor layer 71, and a cover insulating layer 81. The cover insulating layer 81 has a surface 85 opposite to the surface 62 and a surface 86 opposite to the surface 85 in the thickness direction Z. In the thickness direction Z, the surface 86 lies on the same plane as the surfaces 42 and 45 of the pair of first portions 41A and 41B. No plurality of grooves 84 are formed in the cover insulating layer 81.

[0115] The entire sides 44 and 47 are in contact with the base insulating layer 61 and the cover insulating layer 81. There are no parts of sides 44 and 47 that are not in contact with the base insulating layer 61 and the cover insulating layer 81; the space between sides 44 and 47 is filled by the base insulating layer 61 and the cover insulating layer 81. End faces 64 and 82 are in contact with side 44, and end faces 65 and 83 are in contact with side 47.

[0116] The thickness T82 of the covering insulation layer 81 in the region between the pair of first parts 41A and 41B and the conductor layer 71, and in the region between the plurality of wirings 72, is greater than the thickness T81 of the covering insulation layer 81 in the region overlapping with the conductor layer 71.

[0117] In the region between the pair of first parts 41A, 41B and the conductor layer 71, and in the region between the plurality of wirings 72, the sum of the thickness T61 of the base insulation layer 61 and the thickness T82 of the cover insulation layer 81 is approximately equal to the thickness T41 of the pair of first parts 41A, 41B.

[0118] The same effects as those in the first embodiment can be achieved by constructing the flexural member 30 of the second embodiment. In the flexural member 30 of the second embodiment, the base insulating layer 61 and the cover insulating layer 81 are filled between the sides 44 and 47.

[0119] The base insulating layer 61 and the cover insulating layer 81 are integrally connected to the sides 44 and 47. Therefore, compared with the first embodiment, the stiffness of the flexural member 30 in the transverse Y direction can be further increased.

[0120] [Third Embodiment]

[0121] Figure 9 This is a schematic cross-sectional view of the flexible member 30 according to the third embodiment. The difference between the flexible member 30 of the third embodiment and the one described above is the wiring portion 50.

[0122] like Figure 9 As shown, a plurality of grooves 66 are formed in the substrate insulating layer 61, recessed from surface 62 toward surface 63. A plurality of wirings 72 overlap with the plurality of grooves 66 respectively. From another angle, the plurality of wirings 72 are formed along the plurality of grooves 66.

[0123] At least a portion of the conductor layer 71 is embedded in the substrate insulating layer 61. Figure 9 In the example shown, the depth D66 of the groove 66 is less than the thickness T71 of the conductor layer 71. Therefore, the plurality of wirings 72 each have a portion 73 protruding from the groove 66 and a portion 74 embedded in the groove 66 in the thickness direction Z. Figure 9 In the example shown, the thickness of the protruding part 73 is greater than the thickness of the embedded part 74.

[0124] In the construction of the flexure 30 in the third embodiment, the same effect as in the above embodiments can also be obtained. In the flexure 30 of the third embodiment, multiple wires 72 are respectively embedded in multiple grooves 66 of the substrate insulating layer 61, making it difficult for the multiple wires 72 to move in the lateral Y direction.

[0125] During manufacturing, positioning the conductor layer 71 becomes easier. The thickness of the protruding portion 73 can be less than the thickness of the embedded portion 74, or the thickness of the protruding portion 73 can be equal to the thickness of the embedded portion 74.

[0126] [Fourth Embodiment]

[0127] Figure 10 This is a schematic cross-sectional view of the flexural member 30 according to the fourth embodiment. In the fourth embodiment, the depth D66 of the groove 66 is greater than the depth in the third embodiment.

[0128] exist Figure 10 In the example shown, the depth D66 of the groove 66 is approximately equal to the thickness T71 of the conductor layer 71. Multiple wirings 72 are embedded in multiple grooves 66. Figure 9 Compared to the example shown, the multiple wirings 72 do not have a portion 73 protruding from the groove 66. The covering insulation layer 81 has a uniform thickness in the transverse Y direction.

[0129] In the construction of the flexural member 30 of the fourth embodiment, the same effect as in the above embodiments can also be obtained. In the flexural member 30 of the fourth embodiment, multiple wires 72 are respectively embedded in multiple grooves 66 of the substrate insulating layer 61, making it difficult for the multiple wires 72 to move in the lateral Y direction. The depth D66 of the groove 66 can be greater than the thickness T71 of the conductor layer 71. In this case, a portion of the covering insulating layer 81 is embedded in the groove 66.

[0130] [5th ​​Embodiment]

[0131] Figure 11 This is a schematic cross-sectional view of the flexible member 30 according to the fifth embodiment. The flexible member 30 of the fifth embodiment differs from that of the above embodiments in that the wiring portion 50 is different.

[0132] like Figure 11 As shown, in the transverse Y direction, the base insulating layer 61 is located between sides 44 and 47, and the conductor layer 71 and the covering insulating layer 81 are located between sides 44 and 47.

[0133] The thickness T61 of the substrate insulating layer 61 is approximately equal to the thickness T41 of the pair of first portions 41A and 41B. In the thickness direction Z, the surface 62 of the substrate insulating layer 61 is on the same plane as the surfaces 42 and 45 of the pair of first portions 41A and 41B, and the surface 63 of the substrate insulating layer 61 is on the same plane as the surfaces 43 and 46 of the pair of first portions 41A and 41B.

[0134] End face 64 is connected to side face 44, and end face 65 is connected to side face 47. Side faces 44 and 47 do not have portions that are not connected to the base insulating layer 61. End faces 82 and 83 are not connected to side faces 44 and 47.

[0135] The conductive layer 71 and the covering insulating layer 81 overlap with the surface 62. Figure 11 In the example shown, a portion of the covering insulation layer 81 overlaps with surfaces 42, 45 of a pair of first portions 41A, 41B.

[0136] The width of the transverse Y of the covering insulating layer 81 is greater than the width of the base insulating layer 61. From another perspective, end faces 82 and 83 are further away from the conductor layer 71 in the transverse Y than the sides 44 and 47 (end faces 64 and 65).

[0137] Similarly, in the construction of the flexural member 30 in the fifth embodiment, the same effect as in the above embodiments can be obtained. In the flexural member 30 of the fifth embodiment, the base insulating layer 61 is located between the sides 44 and 47. Therefore, the thickness of the flexural member 30 can be reduced by an amount corresponding to the thickness T61 of the base insulating layer 61.

[0138] Furthermore, by setting the thickness of the base insulating layer 61 to be the same as the thickness T41 of the pair of first parts 41A, 41B, the process of reducing the thickness T61 of the base insulating layer 61 in the manufacturing process can be omitted. In the transverse Y direction, the width of the covering insulating layer 81 can be less than the width of the base insulating layer 61, or the width of the covering insulating layer 81 can be equal to the width of the base insulating layer 61.

[0139] [Sixth Embodiment]

[0140] Figure 12 This is a schematic cross-sectional view of the flexible member 30 according to the sixth embodiment. The flexible member 30 of the sixth embodiment differs from that of the above embodiments in that the wiring portion 50 is different.

[0141] The flexural element 30 also has an air layer 91 in contact with the surface 63 of the substrate insulating layer 61. The surface 63 of the substrate insulating layer 61 is in contact with the air layer 91 between the side surfaces 44 and 47. The conductor layer 71 overlaps with the air layer 91.

[0142] like Figure 12 As shown, surface 63 of the substrate insulating layer 61 is separated from surfaces 43 and 46 of the pair of first portions 41A and 41B in the thickness direction Z. From another perspective, surface 63 of the substrate insulating layer 61 is not on the same plane as surfaces 42 and 45 and surfaces 43 and 46 of the pair of first portions 41A and 41B.

[0143] The thickness T61 of the substrate insulating layer 61 is greater than that of the substrate insulating layer 61. Figure 6 The thickness T61 of the substrate insulating layer 61 shown is small. Figure 12 The substrate insulating layer 61 shown is formed, for example, by over-etching during the removal of the support layer described later in an etching process.

[0144] When the flexural element 30 is superimposed on the supporting beam 22, the air layer 91 is located directly above the supporting beam 22. The thickness T91 of the air layer 91 can be appropriately changed by changing the thickness T61 of the base insulation layer 61.

[0145] In the construction of the flexure 30 in the sixth embodiment, similar effects to those in the above embodiments can also be obtained. In the flexure 30 of the sixth embodiment, when the suspension 10 is formed, the air layer 91 of the flexure 30 overlaps with the load-bearing beam 22.

[0146] Therefore, the air layer 91 expands the adjustment range of the dielectric constant of the flexure 30 and increases the degree of freedom in designing the flexure 30 to further optimize the transmission characteristics.

[0147] Although the air layer 91 is formed entirely between sides 44 and 47 in the transverse Y direction, the air layer 91 may be formed only partially between sides 44 and 47 in the transverse Y direction. Although the air layer 91 is formed with a uniform thickness in the transverse Y direction, the thickness of the air layer 91 in the transverse Y direction may also be appropriately varied.

[0148] [Seventh Embodiment]

[0149] Figure 13 This is a schematic cross-sectional view of the flexural member 30 according to the seventh embodiment. The flexural member 30 of the seventh embodiment differs from that of the above embodiments in that it provides a support layer 92.

[0150] like Figure 13 As shown, the flexible member 30 also includes a support layer 92 for supporting the wiring portion 50. The support layer 92 is, for example, a support layer used in the manufacturing process of the flexible member 30.

[0151] The pair of first portions 41A and 41B and the wiring portion 50 overlap with the support layer 92. More specifically, the support layer 92 is in contact with the surfaces 43 and 46 of the pair of first portions 41A and 41B and the surface 63 of the base insulating layer 61.

[0152] The support layer 92 is made of an electrically insulating resin material such as polyimide. Figure 13 In the example shown, the support layer 92 has a uniform thickness in the transverse Y direction. The thickness of the support layer 92 is smaller than, for example, the thickness of the base insulating layer 61.

[0153] In the construction of the flexural member 30 of the seventh embodiment, the same effects as in the above embodiments can be obtained. In the flexural member 30 of the seventh embodiment, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between the side surfaces 44 and 47 in the transverse Y direction. Therefore, even when the flexural member 30 includes the support layer 92, an increase in the thickness of the flexural member 30 can be prevented.

[0154] By reducing the thickness of the support layer 92, the increase in the thickness of the flexure 30 can be further suppressed. Furthermore, by providing the support layer 92 made of an electrically insulating resin material, insulation from the load-bearing beam 22 can be easily achieved during the formation of the suspension 10. At this time, the flexure 30 is fixed to the load-bearing beam 22, for example, with an adhesive.

[0155] Furthermore, the process of removing the support layer 92 is unnecessary in the manufacturing process, thus reducing the number of steps. Figure 13 In the example shown, the support layer 92 overlaps with the wiring section 50 and a pair of first parts 41A and 41B, respectively, but the support layer 92 may also overlap only with the wiring section 50.

[0156] [Embodiment 8]

[0157] Figure 14 This is a schematic cross-sectional view of the flexural member 30 according to the eighth embodiment. The difference between the eighth and seventh embodiments is that the flexural member 30 has a support layer 92. Figure 14 In the example shown, the support layer 92 is made of a metallic material such as copper. The support layer 92 is formed, for example, by methods such as electroplating or sputtering.

[0158] In the construction of the flexural member 30 of the eighth embodiment, the same effects as in the above embodiments can also be obtained. In the flexural member 30 of the eighth embodiment, by forming the support layer 92 from a metallic material, the support layer 92 can be used as a ground layer for the conductor layer 71. By providing a highly conductive ground layer near the conductor layer 71, the electrical characteristics of the flexural member 30 can be improved.

[0159] exist Figure 14 In the example shown, the support layer 92 overlaps with the wiring section 50 and a pair of first parts 41A and 41B, respectively, but the support layer 92 may also overlap only with the wiring section 50.

[0160] [Version 9]

[0161] Figure 15 This is a schematic cross-sectional view of the flexural member 30 according to the 9th embodiment. The flexural member 30 of the 9th embodiment differs from the one described above in that it provides a connecting portion 93.

[0162] like Figure 15 As shown, the flexural member 30 also includes a connecting portion 93. The connecting portion 93 is made of a metallic material such as copper. The connecting portion 93 is formed by methods such as electroplating or sputtering. In the transverse Y direction, the connecting portion 93 is located, for example, between side surfaces 44 and 47. The connecting portion 93, for example, does not overlap with a pair of first portions 41A, 41B.

[0163] The connector 93 is electrically connected to at least one of the plurality of wires 72. The connector 93 has a connector 94 and a connector 95. The plurality of wires 72 have wires 72A to 72D.

[0164] Connector 94 electrically connects part 41B and wiring 72A. Connector 94 is connected, for example, to side 47 of part 41B. Connector 95 electrically connects wiring 72B and wiring 72D.

[0165] Wiring 72C, which is not connected to connector 95, is located between wiring 72B and wiring 72D. Since the base insulation layer 61 is located between connector 94 and connector 95, connector 94 is insulated from connector 95.

[0166] exist Figure 15In the example shown, wirings 72A, 72B, and 72D are embedded in the substrate insulation layer 61, but wiring 72C is not embedded in the substrate insulation layer 61. The thickness of wirings 72A, 72B, and 72D is, for example, greater than the thickness of wiring 72C. By arranging wiring 72C in this way, wiring 72C can be insulated from the connection portion 95, and wirings 72B and 72D can be electrically connected through the connection portion 95.

[0167] Similarly, in the construction of the flexural member 30 in the 9th embodiment, the same effect as in the above-described embodiment can be obtained. In the flexural member 30 of the 9th embodiment, since the connecting portion 93 is located between the side surfaces 44 and 47 in the transverse Y direction, the increase in the thickness of the flexural member 30 can be suppressed.

[0168] The connector 93 can be used to ground the conductor layer 71 to the metal substrate 40, or it can be used as a jumper to connect the wiring 72 together. This improves the electrical characteristics of the flexure 30.

[0169] The shape of the connection portion 93 is not limited to the example described above. The connection portion 93 may be provided with either a connection portion 94 for grounding the conductor layer 71 or a connection portion 95 used as a jumper to connect multiple wirings 72 together. The connection between multiple wirings can be appropriately modified.

[0170] [Example 10]

[0171] Figure 16 This is a schematic cross-sectional view of the flexure 30 according to the 10th embodiment. The flexure 30 of the 10th embodiment differs from that of the above-described embodiments in that it has a wiring portion 50.

[0172] Figure 16 As shown, a pair of first portions 41A and 41B overlap with the substrate insulating layer 61. More specifically, surfaces 43 and 46 of the pair of first portions 41A and 41B are in contact with surface 62 of the substrate insulating layer 61. On the other hand, the substrate insulating layer 61 is not located between sides 44 and 47 in the transverse Y direction.

[0173] The conductor layer 71 and the covering insulating layer 81 are located between side surface 44 and side surface 47 in the transverse Y direction. The end faces 82 and 83 of the covering insulating layer 81 are in contact with side surfaces 44 and 47, respectively. Parts that are not in contact with the covering insulating layer 81 are formed on side surfaces 44 and 47.

[0174] Similarly, in the construction of the flexural member 30 of the tenth embodiment, the same effect as in the above embodiments can be obtained. In the flexural member 30 of the tenth embodiment, the base insulating layer 61 is not located between the sides 44 and 47.

[0175] Therefore, in Figure 16In the example shown, the distance between the conductor layer 71 and the covering insulating layer 81 and the surfaces 42, 45 of the pair of first portions 41A, 41B is greater than that in the thickness direction Z. Figure 6 The example shown is more separated.

[0176] In the flexure 30 of the 10th embodiment, when the suspension 10 is formed, the surfaces 42 and 45 of a pair of first parts 41A and 41B overlap in a manner facing the load-bearing beam 22, so that the conductor layer 7 can be separated not only from the metal substrate 40, but also from the load-bearing beam 22.

[0177] Therefore, the electrical characteristic difference between the flexible member 30 and the overhead wiring section can be reduced in the flexible member 30. Figure 13 The described support layer 92 can be applied to the base insulation layer 61 of the flexural member 30 in the 10th embodiment.

[0178] [Embodiment 11]

[0179] Figure 17 This is a schematic partial plan view of the flexural member 30 according to the 11th embodiment. Figure 18 It is along Figure 17 A schematic cross-sectional view of the flexural member 30 taken from the XVIII-XVIII line. Figure 17 The flexure 30 is shown as viewed from the side covered by the insulating layer 81. The flexure 30 of the 11th embodiment differs from the one described above in that it has a metal substrate 40.

[0180] like Figure 17 and Figure 18 As shown, the metal substrate 40 also has a second portion 48 connected to a pair of first portions 41A, 41B. The second portion 48 serves as a “thing” connecting the pair of first portions 41A and 41B.

[0181] exist Figure 17 In the diagram, the range of points represents the range formed by part 48 in section 2. For example... Figure 17 As shown, the second part 48 is formed in a portion of the metal substrate 40 along the length direction X. The shape of the second part 48 can be appropriately modified.

[0182] like Figure 18 As shown, the second part 48 is connected to the side surfaces 44 and 47 in the transverse Y direction. The second part 48 is integrally formed with, for example, a pair of first parts 41A and 41B.

[0183] Part 2 48 is formed, for example, by half-etching the portion corresponding to Part 2 48 of the metal substrate 40 during the etching process when forming the metal substrate 40. Part 2 48 has a uniform thickness in the transverse Y direction.

[0184] The thickness T48 of part 2 48 is less than the thickness T41 of the pair of parts 1 41A and 41B. As an example, the thickness T48 of part 2 48 is less than or equal to half the thickness T41 of the pair of parts 1 41A and 41B. As another example, the thickness T48 of part 2 48 is less than or equal to 1 / 4 the thickness T41 of the pair of parts 1 41A and 41B.

[0185] In the thickness direction Z, the second part 48 overlaps with the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81. The base insulating layer 61 and the cover insulating layer 81 are in contact with the side surfaces 44 and 47, respectively.

[0186] exist Figure 18 In the example shown, the base insulating layer 61, the conductor layer 71, and the cover insulating layer 81 are located between side 44 and side 47 in the transverse Y direction. The sum of the thickness T48 of the second part 48 and the thickness T50 of the wiring portion 50 is equal to or less than, for example, the thickness T41 of a pair of first parts 41A and 41B.

[0187] exist Figure 18 In the example shown, the total thickness of the second part 48 (T48) and the wiring part 50 (T50) is less than the thickness (T41) of the pair of first parts 41A and 41B. Therefore, the wiring part 50 does not protrude more than surfaces 42 and 45 in the thickness direction Z.

[0188] The flexural member 30 of the 11th embodiment can also provide the same effects as the embodiments described above. In the flexural member 30 of the 11th embodiment, since the wiring portion 50 is located between the side surface 44 and the side surface 47, the increase in the thickness of the flexural member 30 can be suppressed. Furthermore, by forming a second portion 48 connected to a pair of first portions 41A and 41B, the stiffness of the flexural member 30 in the transverse Y direction can be further improved.

[0189] [12th Embodiment]

[0190] Figure 19 This is a schematic partial plan view of the flexural member 30 according to the 12th embodiment. Figure 20 It is along Figure 19 A schematic cross-sectional view of the flexural member 30 taken along the XX-XX line. The flexural member 30 of the 12th embodiment differs from that of the 11th embodiment in that the second part 48 has an opening 49.

[0191] like Figure 19 and 20 As shown, the second portion 48 of the metal substrate 40 has an opening 49. The opening 49 overlaps with the conductor layer 71 in the thickness direction Z. Among the plurality of wirings 72A to 72D, wirings 72A and 72B overlap with the opening 49, while wirings 72C and 72D do not overlap with the opening 49.

[0192] exist Figure 19 In the example shown, three openings 49 are formed along the length direction X. The number of openings 49 can be two or fewer, or four or more. They can be in the width direction of the wiring portion 50 ( Figure 19 and Figure 20 In the example shown, two or more openings 49 are formed in the horizontal direction (Y). The size of the openings 49 can be changed appropriately. By changing the size of the openings 49, the number and range of wiring overlapping with the openings 49 can be changed appropriately.

[0193] In the construction of the flexure 30 of the 12th embodiment, the same effects as in the above embodiments can also be obtained. In the flexure 30 of the 12th embodiment, the electrical characteristics of the flexure 30 can be adjusted by forming an opening 49 in the second part 48.

[0194] [13th Embodiment]

[0195] Figure 21 This is a schematic cross-sectional view of the flexure 30 according to the 13th embodiment. The flexure 30 of the 13th embodiment differs from the above embodiments in that it has multiple conductor layers.

[0196] like Figure 21 As shown, the wiring section 50 has a base insulating layer 61, multiple conductor layers, and a cover insulating layer 81. The multiple conductor layers include a first conductor layer 75 and a second conductor layer 76 overlapping the first conductor layer 75. The first conductor layer 75 and the second conductor layer 76 each have multiple wirings 77 and 78.

[0197] The first conductor layer 75 is in contact with the surface 62 of the substrate insulating layer 61. The first conductor layer 75 is located between side 44 and side 47 in the transverse Y direction. Multiple wirings 78 are arranged in a manner that overlaps with multiple wirings 77.

[0198] A portion 87 of the covering insulation layer 81 is disposed between the first conductor layer 75 and the second conductor layer 76. The first conductor layer 75 and the second conductor layer 76 are insulated by the covering insulation layer 81. The second conductor layer 76 is covered by the covering insulation layer 81.

[0199] In the construction of the flexure 30 in the 13th embodiment, the same effect as in the above embodiment can also be obtained. In the flexure 30 of the 13th embodiment, even if multiple conductor layers are provided, since the first conductor layer 75 is provided between the side surface 44 and the side surface 47, the increase in the thickness T30 of the flexure 30 can be suppressed, and the thickness of the flexure 30 can be reduced.

[0200] The thickness of the first conductor layer 75 may be the same as or different from the thickness of the second conductor layer 76. The number of conductor layers is not limited to two layers, but may also be three or more layers. Multiple conductor layers, as in the flexural member 30 of embodiment 13, can be applied to each of the above embodiments.

[0201] When implementing the invention disclosed in the above embodiments, specific aspects of each element constituting the suspension for the disk drive can be modified in various ways, including specific aspects such as the shape of the load-bearing beam and the flexural element.

[0202] Furthermore, the multiple wirings 72 can have different thicknesses. The grooves 66 described in the third and fourth embodiments can also be suitably applied to the substrate insulating layer 61 described in the fifth and subsequent embodiments. The air layer 91 described in the sixth embodiment can also be suitably applied to other embodiments.

Claims

1. A flexural element for a suspension system of a disk drive, comprising: Metal base, and Wiring section, the wiring section being disposed along the metal base, The wiring section has a base insulating layer, a conductor layer superimposed on the base insulating layer, and a cover insulating layer superimposed on the conductor layer. The metal base has a pair of first portions, the first portions having sides facing each other. The side surface connects a surface facing the load-bearing beam and a surface opposite to the side surface. The conductor layer has multiple wirings arranged in a direction orthogonal to the extension direction of the wiring portion. The base insulating layer, the multiple wirings, and the covering insulating layer are located between the sides. The base insulating layer, the conductor layer, and the cover insulating layer do not overlap with the metal base in the stacking direction of the wiring portion. The covering insulating layer has a plurality of grooves recessed toward the base insulating layer between adjacent wirings and formed along the wirings.

2. The flexural element of the suspension for a disk drive according to claim 1, The thickness of the wiring portion is equal to or less than the thickness of a pair of first portions.

3. The flexure of the suspension for a disk drive according to claim 1, wherein at least a portion of the conductor layer is embedded in the substrate insulating layer.

4. The flexural element of the suspension for a disk drive according to claim 1, It also includes an air layer, wherein the substrate insulating layer is in contact with the air layer between itself and the side surface.

5. The flexural element of the suspension for a disk drive according to claim 1, It also includes a support layer that supports the wiring section. In the stacking direction, the substrate insulating layer has a first surface in contact with the conductor layer and a second surface opposite to the first surface. The support layer is in contact with the second surface.

6. The flexural element of the suspension for a disk drive according to claim 1, It also includes the connecting part, The connecting part is electrically connected to at least one of the plurality of wirings.

7. A flexural element for a suspension system of a disk drive, comprising: Metal base, and Wiring section, the wiring section being disposed along the metal base, The wiring section has a base insulating layer, a conductor layer stacked on the base insulating layer, and a covering insulating layer stacked on the conductor layer. The conductor layer has multiple wirings arranged in a direction orthogonal to the extension direction of the wiring portion. The metal base has a pair of first portions and a second portion, the first portions having sides facing each other, and the second portion being connected to the pair of first portions. The second part overlaps with the plurality of wirings in the stacking direction of the wiring section. The base insulating layer, the multiple wirings, and the covering insulating layer are located between the sides. The base insulating layer and the cover insulating layer are in contact with the side surface between the pair of first portions. The thickness of the second part is less than the thickness of the first part. The sum of the thickness of the second part and the thickness of the wiring portion is less than the thickness of the first part, such that the side surface defines an open space therebetween that overlaps with the wiring portion. The covering insulating layer has a plurality of grooves recessed toward the base insulating layer between adjacent wirings and formed along the wirings.

8. The flexure of the suspension for a disk drive according to claim 7, wherein the second portion has an opening overlapping the conductor layer.

9. The flexure of the suspension for a disk drive according to claim 2 or 7, wherein each side has a portion that does not contact the base insulation layer and does not contact the covering insulation layer.

10. The flexural element of the suspension for a disk drive according to claim 9, wherein the covering insulating layer is located between the pair of first portions and the wiring, and between adjacent wirings, and The base insulation layer and the cover insulation layer are in contact with each other between the pair of first portions and the wiring, as well as between adjacent wirings.

11. A suspension for a disk drive, comprising a load-bearing beam and a flexure element according to claim 1 superimposed on the load-bearing beam.

Images