Multipole filter on a quantum device with multiplexing and signal separation

Abstract

Apparatus and / or computer-implemented methods are provided for assisting a multi-pole filter on a quantum device with multiplexing capability and signal separation to mitigate crosstalk. According to embodiments, an apparatus can include an intermediate substrate comprising a readout resonator. The apparatus can further include a qubit chip substrate comprising a qubit coupled onto the readout resonator and onto a multi-pole filter.

Description

Background Technology

[0001] This disclosure relates to multipole filters on quantum devices, and more specifically to multipole filters on quantum devices having multiplexing and signal separation capabilities. Summary of the Invention

[0002] The following overview is provided to offer a basic understanding of one or more embodiments of the invention. This overview is not intended to identify key or essential elements, or to depict any scope of a particular embodiment or any scope of the claims. Its sole purpose is to present concepts in a simplified form as a prelude to the more detailed description that follows. In one or more embodiments described herein, systems, apparatuses, computer-implemented methods, and / or computer program products are described that facilitate the mitigation of crosstalk by using multipole filters on quantum devices with multiplexing capabilities and signal separation.

[0003] According to one embodiment, the device may include an intermediate substrate comprising a readout resonator. The device may further include a qubit chip substrate comprising qubits coupled to the readout resonator and to a multipole filter.

[0004] According to another embodiment, a computer-implemented method may include: a system operatively coupled to a processor coupling a qubit formed on a qubit chip substrate to a readout resonator formed on an insertion substrate. The computer-implemented method may further include the system coupling the qubit to a multipole filter.

[0005] According to another embodiment, a device may include an intermediate substrate comprising a readout resonator. The device may further include a qubit chip substrate including a plurality of qubits coupled to the readout resonators; a multipole filter; and multiplexed readout lines formed on the intermediate substrate. The qubits, readout resonators, multipole filter, and multiplexed readout lines are separated from the drive lines formed on the intermediate substrate by a defined distance. Attached Figure Description

[0006] Figure 1 , Figure 2 and Figure 3 Circuit diagrams of example non-limiting devices according to one or more embodiments described herein are shown, which can facilitate multi-pole filters on quantum devices with multiplexing capabilities and signal separation to mitigate crosstalk.

[0007] Figure 4 A cross-sectional view of an example, non-limiting device according to one or more embodiments described herein is shown, which can assist a multipole filter on a quantum device with multiplexing capabilities and signal separation to mitigate crosstalk.

[0008] Figure 5 An example, non-limiting circuit diagram is shown according to one or more embodiments described herein, which can facilitate multipole filters on quantum devices with multiplexing capabilities and signal separation to mitigate crosstalk.

[0009] Figure 6 Examples of non-limiting diagrams illustrating one or more embodiments described herein are shown, which can facilitate multipole filters on quantum devices with multiplexing capabilities and signal separation to mitigate crosstalk.

[0010] Figure 7 Based on example non-limiting diagrams of one or more embodiments described herein, multipole filters on quantum devices with multiplexing capabilities and signal separation can be facilitated to mitigate crosstalk.

[0011] Figure 8 and Figure 9 According to flowchart examples of non-limiting computer-implemented methods based on one or more embodiments described herein, the methods can facilitate multipole filters on quantum devices with multiplexing capabilities and signal separation to mitigate crosstalk.

[0012] Figure 10 A block diagram is shown that illustrates an example non-limiting operating environment that may facilitate one or more embodiments described herein. Detailed Implementation

[0013] The following detailed description is illustrative only and is not intended to limit the embodiments and / or their application or use. Furthermore, it is not intended to be construed as being bound by any express or implied information provided in the foregoing background or invention summary or specific embodiments.

[0014] One or more embodiments will now be described with reference to the accompanying drawings, wherein like reference numerals are used throughout to refer to like elements. In the following description, numerous specific details are set forth for purposes of explanation in order to provide a more thorough understanding of one or more embodiments. However, it will be apparent that one or more embodiments may be practiced without these specific details in various circumstances.

[0015] It should be understood that when an element that is a layer (also called a film), region, and / or substrate is referred to as being "on" or "above" another element, it may be directly on the other element, or there may be intermediate elements present. Conversely, when an element is referred to as being "directly on" or "directly on" another element, there are no intermediate elements present. It should also be understood that when an element is referred to as being "below" or "under" another element, it may be directly below or under the other element, or there may be intermediate elements present. Conversely, when an element is referred to as being "directly below" or "directly under" another element, there are no intermediate elements present. It will be understood that when an element is referred to as being "coupled" to another element, it may describe one or more different types of coupling, including but not limited to chemical coupling, communication coupling, capacitive coupling, electrical coupling, electromagnetic coupling, inductive coupling, operational coupling, optical coupling, physical coupling, thermal coupling, and / or other types of coupling.

[0016] As referenced herein, entities may include people, clients, users, computing devices, software applications, agents, machine learning models, artificial intelligence, and / or other entities. It should be understood that such entities may facilitate the design, manufacture, and / or implementation (e.g., simulation, quantization, testing, etc.) of one or more embodiments of the present disclosure described herein.

[0017] Quantum computing typically uses quantum-mechanical phenomena to perform computational and information processing functions. It can be compared to conventional computing, which usually uses transistors to manipulate binary values. That is, while conventional computers operate on bit values ​​of 0 or 1, quantum computers operate on qubits (quantum bits) that include a superposition of 0 and 1, can entangle multiple qubits, and use interference.

[0018] A qubit is coupled to a resonator to achieve quantum non-destructive (QND) readout via chi-shift. The readout time is related to the full width at half maximum (FWHM) of the resonator (e.g., a larger FWHM results in faster readout). The lifetime of the qubit (e.g., radiative lifetime) is also related to the FWHM of the resonator (e.g., a larger FWHM results in a smaller lifetime). The resonant frequency is typically around 7 GHz, and the qubit frequency is around 5 GHz. Residual transmission of the resonator at the qubit frequency results in a shortened lifetime (e.g., radiative lifetime). For a larger FWHM, this residual transmission is also larger.

[0019] Using on-chip filters (often called Purcell filters) in the readout chain yields two advantageous effects: faster readout and longer lifetime. Purcell filters allow for a large FWHM at the resonator frequency while suppressing residuals at the qubit frequency. A single resonator is a single-pole filter, and multiple Purcell filters combined with resonators act as multipole filters. An additional feature of the readout chain is the ability to read multiple resonators on the same output port. This utilizes frequency domain multiplexing (MUX).

[0020] Figure 1 A circuit diagram of an example, non-limiting device 100 is shown according to one or more embodiments described herein, which can help mitigate crosstalk by using a multipole filter on a quantum device with multiplexing capabilities and signal separation. Device 100 may include semiconductor and / or superconducting devices that can be implemented in a quantum device. For example, device 100 may include integrated semiconductor and / or superconducting circuits (e.g., quantum circuits) that can be implemented in a quantum device, such as quantum hardware, a quantum processor, a quantum computer, and / or another quantum device. Device 100 may include semiconductor and / or superconducting devices, such as flip-chip quantum devices that can be implemented in such quantum devices as defined above. In some embodiments, device 100 may include a quantum readout device.

[0021] As in Figure 1 As illustrated in the example embodiment depicted, device 100 may include a qubit 102 that may be capacitively coupled to a readout resonator 106, wherein such capacitive coupling is represented as capacitor 104a. In this example embodiment, the readout resonator 106 may be further capacitively coupled to a multipole filter (in... Figure 1 (Unannotated), this multi-stage filter may include a bandpass filter 108 and a bandstop filter 114, wherein this capacitive coupling is represented by a capacitor 104b. For example, in Figure 1 In the example embodiment shown, the readout resonator 106 can be capacitively coupled in series to the bandpass filter 108 of such a multi-pole filter, and the bandpass filter 108 can be further coupled in series to the bandstop filter 114 of such a multi-pole filter.

[0022] exist Figure 1In the exemplary embodiment shown, such a multipole filter may include a multipole Purcell filter, such as a second-order Purcell filter, a higher-order Purcell filter, and / or another multipole Purcell filter. In this example embodiment, a bandpass filter 108 may indicate a single pole (e.g., a first pole) of such a multipole filter (e.g., a second-order Purcell filter), and a bandstop filter 114 may indicate another pole (e.g., a second pole) of the multipole filter.

[0023] As in Figure 1 As shown in the exemplary embodiments described herein, the bandpass filter 108 may be further coupled to ground 110a and / or output terminal 112 (e.g., the output port of device 100). In this example embodiment, the bandstop filter 114 may be capacitively coupled to ground 110b, wherein such capacitive coupling is represented by capacitor 104c.

[0024] exist Figure 1 The qubit 102 shown in the exemplary embodiments depicted may include, for example, a transmission qubit, a fixed-frequency qubit, a fixed-frequency transmission qubit, a superconducting qubit, a tunable qubit, a tunable transmission qubit, and / or another qubit. Figure 1 The readout resonator 106 shown in the exemplary embodiments depicted may include, for example, a coplanar waveguide resonator.

[0025] In an embodiment, the qubit 102 may have an operating frequency (e.g., a resonant frequency) ranging from approximately 4.5 GHz to approximately 5.5 GHz. Figure 1 In the exemplary embodiments shown, the readout resonator 106 can operate at or approximately at an operating frequency higher than the operating frequency of the qubit 102 (e.g., the resonant frequency). For example, in an example embodiment, the readout resonator 106 can operate at or approximately 7.5 GHz to be in a dispersed state of the qubit frequency space (e.g., a dispersed state of the qubit computation space that can store quantum information and / or quantum states). Figure 1 In the exemplary embodiments depicted, the bandpass filter 108 may operate at or approximately the operating frequency of the readout resonator 106 (e.g., the resonant frequency) (e.g., at 7.5 GHz or approximately 7.5 GHz), and the bandstop filter 114 may operate at or approximately the operating frequency of the qubit 102 (e.g., the resonant frequency) (e.g., 4.5 GHz to 5.5 GHz). In various embodiments, such operating frequencies (e.g., resonant frequencies) of the qubit 102, readout resonator 106, bandpass filter 108, and / or bandstop filter 114 may be set during the design and / or manufacturing process of the device 100.

[0026] Device 100, qubit 102, and / or readout resonator 106 can be coupled to an external device (not shown). For example, device 100, qubit 102, and / or readout resonator 106 can be coupled to an external device, which can be outside device 100, such as a pulse generator device and / or a microwave laser device. In an exemplary embodiment, although in Figure 1 Not depicted, but device 100, qubit 102, and / or readout resonator 106 can be coupled to a pulse generator device, including but not limited to an arbitrary waveform generator (AWG), a vector network analyzer (VNA), and / or another pulse generator device that can be external to device 100 and can send pulses (e.g., microwave pulses, microwave signals, control signals, etc.) to device 100, qubit 102, and / or readout resonator 106, and / or receive pulses (e.g., microwave pulses, microwave signals, control signals, etc.) from device 100, qubit 102, and / or readout resonator 106. In another exemplary embodiment, although in Figure 1 Not depicted, but device 100, qubit 102 and / or readout resonator 106 can be coupled to a microwave laser device, including but not limited to a microwave maser, and / or another microwave laser device that may be located outside device 100 and can transmit microwave light to device 100, qubit 102 and / or readout resonator 106 and / or receive microwave light from device 100, qubit 102 and / or readout resonator 106.

[0027] According to one or more embodiments of the present invention, such external devices (e.g., AWG, VNA, maser, etc.) may also be coupled to a computer including a memory for storing instructions and a processor for executing those instructions. For example, in these embodiments, the external devices (e.g., AWG, VNA, maser, etc.) may also be coupled to the following reference... Figure 10The described computer 1012 may include a system memory 1016 on which instructions (e.g., software, routines, processing threads, etc.) are stored and a processing unit 1014 on which these instructions are executed. In these embodiments, such a computer may be used to operate and / or control (e.g., by executing the instructions stored in the system memory 1016 by the processing unit 1014) the aforementioned external devices (e.g., AWG, VNA, maser, etc.). For example, in these embodiments, such a computer can be used to enable the aforementioned external devices (e.g., AWG, VNA, microwave maser, etc.) to: a) send pulses (e.g., microwave pulses, microwave signals, control signals, etc.) to and / or receive pulses (e.g., microwave pulses, microwave signals, control signals, etc.) from and from the device 100, qubit 102, and / or readout resonator 106; and / or b) emit microwave laser light to and / or receive microwave laser light from and from the device 100, qubit 102, and / or readout resonator 106.

[0028] In the above embodiments, such microwave light pulses and / or lasers can form a drive line that can be provided to device 100 (the drive line is in...). Figure 1 (Not shown in the diagram) drive power. In these embodiments, such drive power can achieve the capacitive coupling described above between different components of device 100. For example, in these embodiments, such drive power can achieve: a) capacitive coupling from qubit 102 to readout resonator 106, wherein such capacitive coupling in Figure 1 a) Represented by capacitor 104a; b) Readout resonator 106 and bandpass filter 108 capacitive coupling, wherein, in Figure 1 This capacitive coupling is represented by capacitor 104b; and / or c) the band-stop filter 114 is capacitively coupled to ground 110b, wherein, Figure 1 This capacitive coupling is represented by capacitor 104c. In these embodiments, the capacitive coupling from qubit 102 to readout resonator 106 and the capacitive coupling from readout resonator 106 to a multipole filter including bandpass filter 108 and bandstop filter 114 can constitute the coupling from qubit 102 to the multipole filter.

[0029] The fabrication of device 100 may include a multi-step sequence of steps, such as photolithography and / or chemical processing steps, which facilitate the stepwise creation of electronic-based systems, devices, components, and / or circuits in semiconductor and / or superconducting devices (e.g., integrated circuits). For example, device 100 can be fabricated on one or more substrates (e.g., silicon (Si) substrates, etc.) using techniques including but not limited to: photolithography, microlithography, nanolithography; nanoimprint lithography; photomask technology; patterning technology; photoresist technology (e.g., positive photoresist, negative photoresist, mixed photoresist, etc.); etching technology (e.g., reactive ion etching (RIE), dry etching, wet etching, ion beam etching, plasma etching, laser ablation, etc.); evaporation technology; sputtering technology; plasma ashing technology; heat treatment (e.g., rapid thermal annealing, furnace annealing, thermal oxidation, etc.); chemical vapor deposition (CVD); atomic layer deposition (ALD); physical vapor deposition (PVD); molecular beam epitaxy (MBE); electrochemical deposition (ECD); chemical mechanical planarization (CMP); back-side polishing technology and / or other technologies for manufacturing integrated circuits.

[0030] Device 100 can be manufactured using a variety of materials. For example, device 100 can be manufactured using one or more different material classes, including but not limited to: conductive materials, semiconductor materials, superconducting materials, dielectric materials, polymer materials, organic materials, inorganic materials, nonconducting materials, and / or another material that can be used in conjunction with one or more of the techniques described above for manufacturing integrated circuits.

[0031] Figure 2 A circuit diagram of an example, non-limiting device 200 according to one or more embodiments described herein is shown, which can help mitigate crosstalk on a multipole filter on a quantum device with multiplexing capabilities and signal separation. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0032] Device 200 may include the above references Figure 1 Examples and non-limiting alternative embodiments of the described device 100. Device 200 may include semiconductor and / or superconducting devices that can be implemented in a quantum device. For example, device 200 may include integrated semiconductor and / or superconducting circuits (e.g., quantum circuits) that can be implemented in a quantum device, such as quantum hardware, a quantum processor, a quantum computer, and / or another quantum device. Device 200 may include semiconductor and / or superconducting devices, such as flip-chip quantum devices, which can be implemented in such quantum devices as defined above. In some embodiments, device 200 may include a quantum readout device.

[0033] As in Figure 2 As illustrated in the example embodiment depicted, device 200 may include qubit 102 and qubit 202, which may be capacitively coupled to readout resonators 106 and 206, respectively, wherein such capacitive coupling is represented by capacitors 104a and 204a, respectively. In this example embodiment: qubit 202 may include the same structure and / or functionality as qubit 102; readout resonator 206 may include the same structure and / or functionality as readout resonator 106; and capacitor 204a may include the same structure and / or functionality as capacitor 104a.

[0034] exist Figure 2 In the exemplary embodiment shown, the readout resonator 106 and the readout resonator 206 can each be further capacitively coupled to a multipole filter. Figure 2 (Unannotated), this multi-stage filter may include a bandpass filter 108, a bandstop filter 114, and a bandstop filter 214, wherein such capacitive coupling is represented by capacitors 104b and 204b, respectively. For example, in Figure 2 In the example embodiment shown, sense resonators 106 and 206 can each be capacitively coupled in parallel to a bandpass filter 108 of such a multi-pole filter, and the bandpass filter 108 can be further coupled in parallel to bandstop filters 114 and 214 of such a multi-pole filter. Figure 2 In the exemplary embodiment shown, band-stop filter 214 may include the same structure and / or function as band-stop filter 114, and capacitor 204b may include the same structure and / or function as capacitor 104b.

[0035] exist Figure 2 In the exemplary embodiments shown, such a multipole filter may include a multipole Purcell filter, such as a second-order Purcell filter, a higher-order Purcell filter, and / or other multipole Purcell filters. In this example embodiment: a bandpass filter 108 may indicate a single pole (e.g., a first pole) of such a multipole filter (e.g., a second-order Purcell filter); a bandstop filter 114 may indicate another pole (e.g., a second pole) of the multipole filter; and / or a bandstop filter 214 may indicate another pole (e.g., a third pole) of the multipole filter.

[0036] As in Figure 2As shown in the exemplary embodiments described, bandpass filter 108 may be further coupled to ground 110a and / or output terminal 112 (e.g., the output port of device 100). In this example embodiment, bandstop filter 114 may be capacitively coupled to ground 110b, wherein such capacitive coupling is represented by capacitor 104c. In this example embodiment, bandstop filter 214 may be capacitively coupled to ground 210b, wherein such capacitive coupling is represented by capacitor 204c. Figure 2 In the exemplary embodiment shown, ground 210b may include the same structure and / or function as ground 110b, and capacitor 204c may include the same structure and / or function as capacitor 104c.

[0037] although Figure 2 The example embodiments shown depict certain numbers of certain device 200 components, such as two qubits (e.g., qubit 102 and qubit 202), two readout resonators (e.g., readout resonator 106 and readout resonator 206), and two band-stop filters (e.g., band-stop filter 114 and band-stop filter 214), but it should be understood that the subject matter disclosure described herein is not limited thereto. For example, in some embodiments, device 200 may include a higher or lower number of each of these particular device 200 components. For example, in some embodiments, device 200 may include three or more qubits, readout resonators, and / or band-stop filters.

[0038] exist Figure 2 The qubits 102 and / or 202 shown in the exemplary embodiments depicted may include, for example, transport qubits, fixed-frequency qubits, fixed-frequency transport qubits, superconducting qubits, tunable qubits, tunable transport qubits, and / or other qubits. Figure 2 The readout resonator 106 and / or readout resonator 206 shown in the exemplary embodiments depicted may include, for example, a coplanar waveguide resonator.

[0039] In an embodiment, qubit 102 and qubit 202 may each have an operating frequency (e.g., a resonant frequency) ranging from approximately 4.5 GHz to approximately 5.5 GHz. Figure 2 In the exemplary embodiments shown, the readout resonator 106 and / or the readout resonator 206 can operate at or approximately at an operating frequency (e.g., a resonant frequency) higher than the operating frequency of the qubits 102 and / or 202. For example, in an example embodiment, the readout resonator 106 and / or the readout resonator 206 can operate at or approximately 7.5 GHz to be in a dispersed state of the qubit frequency space (e.g., a dispersed state of the qubit computation space that can store quantum information and / or quantum states). Figure 2 In the exemplary embodiments depicted, the bandpass filter 108 can operate at or approximately the operating frequency (e.g., resonant frequency) of the readout resonator 106 and / or the readout resonator 206 (e.g., the resonant frequency or approximately 7.5 GHz). In this example embodiment, the bandstop filter 114 and / or the bandstop filter 214 can operate at or approximately the operating frequency (e.g., resonant frequency) of the qubit 102 and / or the qubit 202 (e.g., 4.5 GHz to 5.5 GHz). In various embodiments, such operating frequencies (e.g., resonant frequencies) of the qubit 102, qubit 202, readout resonator 106, readout resonator 206, bandpass filter 108, bandstop filter 114, and / or bandstop filter 214 can be set during the design and / or manufacturing process of the device 200.

[0040] In some embodiments, band-stop filter 114 may operate at or approximately at the operating frequency (e.g., resonant frequency) of qubit 102, and band-stop filter 214 may operate at or approximately at the operating frequency (e.g., resonant frequency) of qubit 202 (e.g., 4.5 GHz to 5.5 GHz). In these embodiments, the multi-pole filter of device 200 may include bandpass filter 108 and multiple band-stop filters (e.g., band-stop filter 114, band-stop filter 214, and / or another band-stop filter of device 200, which operates at...). Figure 2 (Not shown in the image). In these embodiments, such a plurality of band-stop filters (e.g., band-stop filter 114, band-stop filter 214, and / or another band-stop filter of device 200) can accommodate multiple different qubit frequency bands of multiple qubits, for example, qubit 102, qubit 202, and / or another qubit (in the image) of device 200. Figure 2 (Not shown in the image).

[0041] In some embodiments, both band-stop filter 114 and band-stop filter 214 can operate at or near the operating frequency (e.g., resonant frequency) of qubit 102 (e.g., 4.5 GHz to 5.5 GHz). In these embodiments, the aforementioned multipole filter of device 200 may include bandpass filter 108 and multiple band-stop filters (e.g., band-stop filter 114, band-stop filter 214, and / or another band-stop filter of device 200, which in Figure 2 (Not shown in the image). In these embodiments, such a plurality of band-stop filters (e.g., band-stop filter 114, band-stop filter 214, and / or another band-stop filter of device 200) can each be adapted to a certain qubit band of a certain qubit, such as the qubit band of qubit 102, thereby enabling improved Purcell protection of qubit 102.

[0042] In some embodiments, both band-stop filter 114 and band-stop filter 214 can operate at or approximately at the operating frequency (e.g., resonant frequency) of qubit 202 (e.g., 4.5 GHz to 5.5 GHz). In these embodiments, the aforementioned multipole filter of device 200 may include band-pass filter 108 and multiple band-stop filters (e.g., band-stop filter 114, band-stop filter 214, and / or...). Figure 2 (Another band-stop filter not shown). In these embodiments, such a plurality of band-stop filters (e.g., band-stop filter 114, band-stop filter 214, and / or another band-stop filter of device 200) can each be adapted to a specific qubit frequency band of a particular qubit, such as the qubit frequency band of qubit 202, thereby enabling improved Purcell protection of qubit 202.

[0043] Device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206 can be coupled to an external device (not shown). For example, device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206 can be coupled to an external device, which can be outside device 200, such as a pulse generator device and / or a microwave laser device. In an exemplary embodiment, although in Figure 2 Not depicted, but device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206 can be coupled to a pulse generator device, including but not limited to an arbitrary waveform generator (AWG), a vector network analyzer (VNA), and / or another pulse generator device that can be external to device 200 and can send pulses (e.g., microwave pulses, microwave signals, control signals, etc.) to and / or receive pulses (e.g., microwave pulses, microwave signals, control signals, etc.) from device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206. In another exemplary embodiment, although in Figure 2 Not depicted, but device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206 can be coupled to a microwave laser device, including but not limited to a microwave maser, and / or another microwave laser device that can be external to device 200 and can emit microwave light to device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206, and / or receive microwave light from the device.

[0044] According to one or more embodiments of the present invention, such external devices (e.g., AWG, VNA, maser, etc.) may also be coupled to a computer including a memory for storing instructions and a processor for executing those instructions. For example, in these embodiments, the external devices (e.g., AWG, VNA, maser, etc.) may also be coupled to the following reference... Figure 10 The described computer 1012 may include a system memory 1016 on which instructions (e.g., software, routines, processing threads, etc.) are stored and a processing unit 1014 on which these instructions are executed. In these embodiments, such a computer may be used to operate and / or control (e.g., by executing the instructions stored in the system memory 1016 by the processing unit 1014) the aforementioned external devices (e.g., AWG, VNA, maser, etc.). For example, in these embodiments, such a computer can be used to enable the aforementioned external devices (e.g., AWG, VNA, microwave maser, etc.) to: a) send pulses (e.g., microwave pulses, microwave signals, control signals, etc.) to and / or receive pulses (e.g., microwave pulses, microwave signals, control signals, etc.) from and from the device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206; and / or b) emit microwave laser light to and / or receive microwave laser light from and from the device 200, qubit 102, qubit 202, readout resonator 106, and / or readout resonator 206.

[0045] In the above embodiments, such microwave light pulses and / or lasers can form a drive line that can be provided to device 200 (the drive line is in...). Figure 2 (not shown in the diagram) drive power. In these embodiments, such drive power can achieve the capacitive coupling described above between different components of device 200. For example, in these embodiments, such drive power can achieve: a) capacitive coupling of qubits 102 and 202 to readout resonators 106 and 206, respectively, wherein such capacitive coupling in Figure 2 a) The readout resonator 106 and readout resonator 206 are represented by capacitors 104a and 204a respectively; b) the readout resonator 106 and readout resonator 206 are capacitively coupled to the bandpass filter 108, wherein, in Figure 2 Such capacitive coupling is represented by capacitors 104b and 204b respectively; and / or c) band-stop filters 114 and 214 are capacitively coupled to ground 110b and ground 210b respectively, wherein, in Figure 2Such capacitive coupling is represented by capacitors 104c and 204c, respectively. In these embodiments, the capacitive coupling from qubit 102 to the readout resonator 106 and the capacitive coupling from the readout resonator 106 to the multi-pole filter including bandpass filter 108, bandstop filter 114, and bandstop filter 214 can constitute the coupling from qubit 102 to the multi-pole filter. In these embodiments, the capacitive coupling from qubit 202 to the readout resonator 206 and the capacitive coupling from the readout resonator 206 to the multi-pole filter including bandpass filter 108, bandstop filter 114, and bandstop filter 214 can constitute the coupling from qubit 202 to the multi-pole filter.

[0046] The fabrication of device 200 may include a multi-step sequence of steps, such as photolithography and / or chemical processing steps, which facilitate the stepwise creation of electronic-based systems, devices, components, and / or circuits in semiconductor and / or superconducting devices (e.g., integrated circuits). For example, device 200 can be fabricated on one or more substrates (e.g., silicon (Si) substrates, etc.) using techniques including but not limited to: photolithography, microlithography, nanolithography; nanoimprint lithography; photomask technology; patterning technology; photoresist technology (e.g., positive photoresist, negative photoresist, mixed photoresist, etc.); etching technology (e.g., reactive ion etching (RIE), dry etching, wet etching, ion beam etching, plasma etching, laser ablation, etc.); evaporation technology; sputtering technology; plasma ashing technology; heat treatment (e.g., rapid thermal annealing, furnace annealing, thermal oxidation, etc.); chemical vapor deposition (CVD); atomic layer deposition (ALD); physical vapor deposition (PVD); molecular beam epitaxy (MBE); electrochemical deposition (ECD); chemical mechanical planarization (CMP); back polishing technology and / or other technologies for manufacturing integrated circuits.

[0047] The device 200 can be manufactured using a variety of materials. For example, the device 200 can be manufactured using one or more different material categories, including but not limited to: conductive materials, semiconductor materials, superconducting materials, dielectric materials, polymer materials, organic materials, inorganic materials, nonconducting materials, and / or another material that can be used in conjunction with one or more of the techniques described above for manufacturing integrated circuits.

[0048] Figure 3 A circuit diagram of an example, non-limiting device 300 according to one or more embodiments described herein is shown, which can help mitigate crosstalk on a multi-pole filter in a quantum device with multiplexing capabilities and signal separation. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0049] Device 300 may include the above-mentioned references respectively Figure 1 and Figure 2 Examples, non-limiting alternative embodiments of the described devices 100 and / or 200. Device 300 may include semiconductor and / or superconducting devices that can be implemented in a quantum device. For example, device 300 may include integrated semiconductor and / or superconducting circuits (e.g., quantum circuits) that can be implemented in a quantum device, such as quantum hardware, a quantum processor, a quantum computer, and / or another quantum device. Device 300 may include semiconductor and / or superconducting devices, such as flip-chip quantum devices that can be implemented in such quantum devices as defined above. In some embodiments, device 300 may include a quantum readout device.

[0050] As in Figure 3 As illustrated in the example embodiments depicted, device 300 may include qubits 102 and 202, which may be coupled to each other (e.g., capacitively coupled) to form a qubit-qubit coupler 302. In some embodiments, the qubit-qubit coupler 302 may be implemented to perform quantum gate operations (e.g., cross-resonance gate operations, etc.). In some embodiments, the qubit-qubit coupler 302 may include, for example, a double-junction qubit, a fixed-frequency coupler, a multimode double-junction coupler, a flux-tunable coupler, a tunable coupler qubit, a flux-tunable coupler qubit, a tunable qubit, a tunable bus, or a flux-tunable qubit bus, and / or another tunable coupler that may perform quantum gate operations.

[0051] exist Figure 3 In the exemplary embodiment shown, qubit 102 and qubit 202 can be coupled to sense resonator 106 and sense resonator 206 respectively via bump joint 304a and bump joint 304c. In this example embodiment, sense resonator 106 can be further coupled to a multipole filter via bump joint 304b and capacitive coupling represented as capacitor 104b. Figure 3 (Unannotated), the multi-pole filter may include a bandpass filter 108 and a bandstop filter 114. In this example embodiment, the readout resonator 206 may be further coupled to the aforementioned multi-pole filter via a bump joint 304d and a capacitive coupling represented as capacitor 204b. Figure 3 (Unannotated), this multi-stage filter may include a bandpass filter 108 and a bandstop filter 114. For example, in Figure 3 In the exemplary embodiment shown, the readout resonator 106 and the readout resonator 206 can each be capacitively coupled in parallel to the bandpass filter 108 of such a multi-pole filter, and the bandpass filter 108 can be further coupled in series to the bandstop filter 114 of such a multi-pole filter.

[0052] exist Figure 3 In the exemplary embodiment shown, such a multipole filter may include a multipole Purcell filter, such as, for example, a second-order Purcell filter, a higher-order Purcell filter, and / or another multipole Purcell filter. In this example embodiment, a bandpass filter 108 may indicate a single pole (e.g., a first pole) of such a multipole filter (e.g., a second-order Purcell filter), and a bandstop filter 114 may indicate another pole (e.g., a second pole) of the multipole filter.

[0053] As in Figure 3 As shown in the exemplary embodiment described herein, bandpass filter 108 may be further coupled to ground 110a and / or output terminal 112 (e.g., the output port of device 300). In this example embodiment, bandstop filter 114 may be capacitively coupled to ground 110b, wherein such capacitive coupling is represented by capacitor 104c.

[0054] although Figure 3 The exemplary embodiments shown depict certain numbers of components of certain device 300, such as two qubits (e.g., qubit 102 and qubit 202), two readout resonators (e.g., readout resonator 106 and readout resonator 206), and a band-stop filter (e.g., band-stop filter 114), but it should be understood that the disclosure described herein is not so limiting. For example, in some embodiments, device 300 may include a higher or lower number of each of such particular device 300 components. For example, in some embodiments, device 300 may include three or more qubits and / or readout resonators. In another example, device 300 may include two or more band-stop filters.

[0055] exist Figure 3 The qubits 102 and / or 202 shown in the exemplary embodiments depicted may include, for example, transport qubits, fixed-frequency qubits, fixed-frequency transport qubits, superconducting qubits, tunable qubits, tunable transport qubits, and / or other qubits. Figure 3 The readout resonator 106 shown in the exemplary embodiments depicted may include, for example, a coplanar waveguide resonator.

[0056] In an embodiment, qubit 102 and qubit 202 may each have an operating frequency (e.g., a resonant frequency) ranging from approximately 4.5 GHz to approximately 5.5 GHz. Figure 3In the exemplary embodiments shown, the readout resonator 106 and / or the readout resonator 206 can operate at or approximately at an operating frequency (e.g., a resonant frequency) higher than the operating frequency of the qubits 102 and / or 202. For example, in an example embodiment, the readout resonator 106 and / or the readout resonator 206 can operate at or approximately 7.5 GHz to be in a dispersed state of the qubit frequency space (e.g., a dispersed state of the qubit computation space that can store quantum information and / or quantum states). Figure 3 In the exemplary embodiments depicted, the bandpass filter 108 can operate at or approximately the operating frequency (e.g., resonant frequency) of the readout resonator 106 and / or the readout resonator 206 (e.g., the resonant frequency or approximately 7.5 GHz). In this example embodiment, the bandstop filter 114 can operate at or approximately the operating frequency (e.g., resonant frequency) of the qubit 102 and / or the qubit 202 (e.g., 4.5 GHz to 5.5 GHz). In various embodiments, such operating frequencies (e.g., resonant frequencies) of the qubit 102, qubit 202, readout resonator 106, readout resonator 206, bandpass filter 108, and / or bandstop filter 114 can be set during the design and / or manufacturing process of the device 300.

[0057] exist Figure 3 In the exemplary embodiment shown, device 300 may further include high-power drive lines 306a and / or 306b. In this example embodiment, high-power drive lines 306a and 306b may be capacitively coupled to sense resonators 106 and 206, respectively, wherein such capacitive coupling is represented by capacitors 308a and 308b, respectively. In this example embodiment, the aforementioned multipole filter, which may include bandpass filter 108 and bandstop filter 114, may be coupled to sense line 310 via bump joint 304e. For example, in this example embodiment, bandpass filter 108 and bandstop filter 114 may be coupled to sense line 310 via bump joint 304e. Figure 3 In the exemplary embodiments depicted, high-power drive lines 306a, 306b, and / or readout lines 310 may include, for example, traces that enable device 300 and / or one or more of its components to transmit and / or receive pulses (e.g., microwave pulses, microwave signals, control signals, etc.) and / or microwave lasers. In this example embodiment, readout line 310 may include a multiplexed readout line that can use the same output port (e.g., using readout line 310 and frequency domain multiplexing) to enable reading of multiple resonators of device 300 (e.g., readout resonator 106, readout resonator 206, and / or non-resonators of device 300). Figure 3 Other readout resonators shown in the figure).

[0058] Device 300, high-power drive lines 306a, 306b, and / or readout line 310 can be coupled to an external device (not shown). For example, device 300, high-power drive lines 306a, 306b, and / or readout line 310 can be coupled to an external device that may be outside device 300, such as a pulse generator device and / or a microwave laser device. In an exemplary embodiment, although not shown in Figure 3 As depicted, device 300, high-power drive lines 306a, 306b, and / or readout line 310 can be coupled to a pulse generator device, which includes, but is not limited to, an arbitrary waveform generator (AWG), a vector network analyzer (VNA), and / or can be external to device 300 and can transmit and / or receive pulses (e.g., microwave pulses, microwave signals, control signals, etc., to and / or from device 300, high-power drive lines 306a, 306b, and / or readout line 310). In another exemplary embodiment, although not described in... Figure 3 As depicted, however, device 300, high-power drive line 306a, high-power drive line 306b and / or readout line 310 may be coupled to a microwave laser device, including but not limited to a microwave maser, and / or other microwave laser devices that may be external to device 300 and may emit and / or receive microwave light to and / or from device 300, high-power drive line 306a, high-power drive line 306b and / or readout line 310.

[0059] According to one or more embodiments of this disclosure, such external devices (e.g., AWG, VNA, maser, etc.) can also be coupled to a computer including a memory for storing instructions and a processor for executing those instructions. For example, in these embodiments, the external devices (e.g., AWG, VNA, maser, etc.) can also be coupled to the following references Figure 10The described computer 1012 may include a system memory 1016 on which instructions (e.g., software, routines, processing threads, etc.) are stored and a processing unit 1014 on which these instructions are executed. In these embodiments, such a computer may be used to operate and / or control (e.g., by executing the instructions stored in the system memory 1016 by the processing unit 1014) the aforementioned external devices (e.g., AWG, VNA, maser, etc.). For example, in these embodiments, such a computer can be used to enable the aforementioned external devices (e.g., AWG, VNA, microwave maser, etc.) to: a) transmit pulses (e.g., microwave pulses, microwave signals, control signals, etc.) to and / or receive pulses (e.g., microwave pulses, microwave signals, control signals, etc.) from and from the device 300, high-power drive line 306a, high-power drive line 306b, and / or readout line 310; and / or b) transmit microwave laser light to and / or receive microwave laser light from and from the device 300, high-power drive line 306a, high-power drive line 306b, and / or readout line 310.

[0060] In the above embodiments, such microwave light pulses and / or lasers can constitute driving power that can be provided to high-power drive lines 306a and / or 306b. In these embodiments, such driving power can achieve capacitive coupling as described above between the various components of device 300. For example, in these embodiments, such driving power can achieve: a) capacitive coupling of qubits 102 and 202 to readout resonators 106 and 206, respectively, wherein such capacitive coupling in Figure 3 a) The readout resonator 106 and readout resonator 206 are represented by capacitors 104a and 204a respectively; b) the readout resonator 106 and readout resonator 206 are capacitively coupled to the bandpass filter 108, wherein, in Figure 3 Such capacitive coupling is represented by capacitors 104b and 204b respectively; and / or c) capacitive coupling from band-stop filter 114 to ground 110b, wherein such capacitive coupling Figure 3 The capacitor 104c represents this. In these embodiments, the capacitive coupling of qubit 102 to the readout resonator 106 and the capacitive coupling of the readout resonator 106 to the multi-pole filter including bandpass filter 108 and bandstop filter 114 can constitute the coupling of qubit 102 to the multi-pole filter. In these embodiments, the capacitive coupling of qubit 202 to the readout resonator 206 and the capacitive coupling of the readout resonator 206 to the multi-pole filter including bandpass filter 108 and bandstop filter 114 can constitute the coupling of qubit 202 to the multi-pole filter.

[0061] As in Figure 3 As illustrated in the exemplary embodiments described herein, device 300 may further include a high-power signal portion 312 and a low-power resonant signal portion 314, which may be separated from each other (e.g., physically, spatially, vertically, laterally, etc.), such as Figure 3 The dashed line 316 represents this. In this example embodiment, components of device 300 located in the low-power resonant signal portion 314 can operate using a relatively low-power resonant signal, while components of device 300 located in the high-power signal portion 312 can operate using a relatively high-power signal. For example, qubit 102, qubit 202, qubit-qubit coupler 302, readout resonator 106, readout resonator 206, bandpass filter 108, bandstop filter 114, and / or another component of device 300 that can be located in the low-power resonant signal portion 314 can operate using a relatively low-power resonant signal. In another example, high-power drive line 306a, high-power drive line 306b, readout line 310, and / or another component of device 300 that can be located in the high-power signal portion 312 can operate using a relatively high-power signal.

[0062] exist Figure 3 In the exemplary embodiments shown, it should be understood that such device 300 components in the high-power signal section 312 and those components in the low-power resonant signal section 314 (e.g., as shown by...) Figure 3 The separation (visually represented by the dashed line 316) can mitigate crosstalk associated with device 300 and / or one or more of its components. In this example embodiment, it should be further understood that this reduced crosstalk associated with device 300 and / or one or more of its components can thereby promote improved accuracy, improved performance, and / or improved fidelity of the processing unit containing device 300. In this example embodiment, to facilitate this reduced crosstalk associated with device 300, components of device 300 that may be located in the low-power resonant signal section 314 may be spaced at a defined distance from components of device 300 that may be located in the high-power signal section 312. For example, qubit 102, qubit 202, qubit-qubit coupler 302, readout resonator 106, readout resonator 206, bandpass filter 108, bandstop filter 114 and / or readout line 310 may each be correspondingly separated by distances defined by each other and / or by distances defined by high-power drive lines 306a and / or high-power drive lines 306b.

[0063] In the above examples, such a defined distance can be a defined distance extending relative to device 300 in any dimension, any plane, and / or any direction (e.g., vertical, lateral, etc.). In this example, such a defined distance can be set (e.g., defined) by an entity that can design, manufacture, and / or implement device 300 as defined herein. In this example, such an entity can set the defined distance such that crosstalk associated with device 300 is mitigated to a level acceptable to such an entity. For example, such an entity can design and / or manufacture device 300 such that a certain layout (e.g., circuit architecture) and / or configuration of device 300 and / or one or more of its components (e.g., qubit 102, qubit 202, qubit-qubit coupler 302, readout resonator 106, readout resonator 206, bandpass filter 108, bandstop filter 114, readout line 310, etc.) can mitigate crosstalk associated with device 300 to a level acceptable to this entity. In some embodiments, all components of device 300 can be formed on a single substrate. In some embodiments, some components of device 300 may be formed on one substrate (e.g., one or more components of device 300 that may be located in the high-power signal portion 312), and other components of device 300 may be formed on another substrate (e.g., one or more components of device 300 that may be located in the low-power resonant signal portion 314). In these embodiments, such substrates and / or their components may be coupled to each other via one or more bump connections, such as bump connections 304a, 304b, 304c, 304d, 304e.

[0064] The fabrication of device 300 may include a multi-step sequence of steps, such as photolithography and / or chemical processing steps, which facilitate the stepwise creation of electronic-based systems, devices, components, and / or circuits in semiconductor and / or superconducting devices (e.g., integrated circuits). For example, device 300 can be fabricated on one or more substrates (e.g., silicon (Si) substrates) using techniques including but not limited to: photolithography, microlithography, nanolithography; nanoimprint lithography; photomask technology; patterning technology; photoresist technology (e.g., positive-tone photoresist, negative-tone photoresist, mixed-tone photoresist, etc.); etching technology (e.g., reactive ion etching (RIE), dry etching, wet etching, ion beam etching, plasma etching, laser ablation, etc.); evaporation technology; sputtering technology; plasma ashing technology; heat treatment (e.g., rapid thermal annealing, furnace annealing, thermal oxidation, etc.); chemical vapor deposition (CVD); atomic layer deposition (ALD); physical vapor deposition (PVD); molecular beam epitaxy (MBE); electrochemical deposition (ECD); chemical mechanical planarization (CMP); back polishing technology and / or another technology for manufacturing integrated circuits.

[0065] Device 300 may be manufactured using different materials. For example, device 300 may be manufactured using one or more different material classes, including but not limited to: conductive materials, semiconductor materials, superconducting materials, dielectric materials, polymer materials, organic materials, inorganic materials, nonconducting materials, and / or another material that may be used in conjunction with one or more of the techniques described above for manufacturing integrated circuits.

[0066] Figure 4 A cross-sectional view of an example, non-limiting device 400 according to one or more embodiments described herein is shown, which can help mitigate crosstalk on a multipole filter in a quantum device with multiplexing capabilities and signal separation. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0067] Device 400 may include the same as the one referenced above. Figure 3 The described device 300 has the same structure and / or function. Device 400 may include a manufacturing embodiment of device 300 that has already been implemented as a semiconductor and / or superconducting device, wherein... Figure 4 A cross-sectional view of such a semiconductor and / or superconducting device is shown. Device 400 may include a semiconductor and / or superconducting device, such as a flip-chip quantum device, which may be implemented in a quantum device, such as quantum hardware, a quantum processor, a quantum computer, and / or another quantum device. In some embodiments, device 400 may include a quantum readout device.

[0068] like Figure 4 In the exemplary embodiment shown, device 400 may include an intermediate substrate 402 having a readout resonator 106, a high-power drive line 306a, and a capacitor 308a formed thereon. Although not shown in Figure 4 As shown in the cross-sectional view of the exemplary embodiment illustrated, the intermediate substrate 402 may also include the components referenced above. Figure 3 One or more other components of the described device 300. For example, in some embodiments, the intermediate substrate 402 may further include a readout resonator 206, a high-power drive line 306b, a capacitor 308b, a readout line 310, a qubit 102, a qubit 202, a capacitor 104a, a capacitor 204a, a qubit-qubit coupler 302, and / or another component of the device 300.

[0069] exist Figure 4 In the exemplary embodiment shown, the device 400 may further include a qubit chip substrate 404 having qubits 102, capacitors 104b, bandpass filters 108, and / or bandstop filters 114 formed thereon. Although in Figure 4The cross-sectional view of the exemplary embodiment depicted is not shown, but the qubit chip substrate 404 may further include the components described above. Figure 3 One or more other components of the described device 300. For example, in some embodiments, the qubit chip substrate 404 may further include qubit 202, capacitor 104a, capacitor 204b, capacitor 104c, ground 110a, ground 110b, qubit-qubit coupler 302, readout line 310, and / or other components of device 300.

[0070] As mentioned above and in Figure 3 and Figure 4 As illustrated in the example embodiment depicted, the intermediate substrate 402 and the qubit chip substrate 404 and / or one or more components thereof can be coupled to each other via one or more bumps. For example, in Figure 3 and Figure 4 In the exemplary embodiment shown, the intermediate substrate 402 and the qubit chip substrate 404 and / or one or more of its components may be coupled to each other via bump bonds 304a, 304b, 304c, 304d and / or 304e.

[0071] Reference device 300 and Figure 3 ,exist Figure 4 In the exemplary embodiment shown, in order to mitigate crosstalk associated with device 400, various components of device 400 may be positioned in the low-power resonant signal portion 314 of device 400. Figure 4 (not noted in the text) so that they are connected with other components of device 400 (which can be located in the high-power signal section 312 of device 400). Figure 4 (Unannotated) The distances defined by the spaces between them. For example, qubit 102, qubit 202, qubit-qubit coupler 302, readout resonator 106, readout resonator 206, bandpass filter 108, bandstop filter 114 and / or readout line 310 may each be correspondingly defined by a distance defined between each other and / or between them and high-power drive lines 306a and / or 306b.

[0072] In the above example, such a defined distance can be a defined distance extending relative to device 400 in any dimension, any plane, and / or any direction (e.g., vertical, horizontal, etc.). In this example, such a defined distance can be set (e.g., defined) by an entity as defined herein, which can design, manufacture, and / or implement device 400. In this example, such an entity can set the defined distance such that crosstalk associated with device 400 is mitigated to a level acceptable to such an entity. For example, such an entity can design and / or manufacture device 400 such that a certain layout (e.g., circuit architecture) and / or configuration of device 400 and / or one or more of its components (e.g., qubit 102, qubit 202, qubit-qubit coupler 302, readout resonator 106, readout resonator 206, bandpass filter 108, bandstop filter 114, readout line 310, etc.) can mitigate crosstalk associated with device 400 to a level acceptable to such an entity.

[0073] Although the aforementioned multi-pole filter, including bandpass filter 108 and bandstop filter 114, is... Figure 4 The example embodiments shown are described as being located on a qubit chip substrate 404; however, it should be understood that the subject matter disclosed herein is not so limiting. For example, in some embodiments, the aforementioned multipole filter, including a bandpass filter 108 and a bandstop filter 114, may be formed on an intermediate substrate 402.

[0074] The fabrication of device 400 may include a multi-step sequence of steps, such as photolithography and / or chemical processing steps, which facilitate the stepwise creation of electronic-based systems, devices, components, and / or circuits in semiconductor and / or superconducting devices (e.g., integrated circuits). For example, device 400 can be fabricated on one or more substrates (e.g., silicon (Si) substrates, etc.) by employing techniques including but not limited to: photolithography, microlithography, nanolithography, nanoimprint lithography, photomask technology, patterning technology, photoresist technology (e.g., positive photoresist, negative photoresist, mixed photoresist, etc.), etching technology (e.g., reactive ion etching (RIE), dry etching, wet etching, ion beam etching, plasma etching, laser ablation, etc.), evaporation technology, sputtering technology, plasma ashing technology, heat treatment (e.g., rapid thermal annealing, furnace annealing, thermal oxidation, etc.), chemical vapor deposition (CVD), atomic layer deposition (ALD), physical vapor deposition (PVD), molecular beam epitaxy (MBE), electrochemical deposition (ECD), chemical mechanical planarization (CMP), back polishing technology and / or other technologies used for manufacturing integrated circuits.

[0075] Device 400 may be manufactured using different materials. For example, device 400 may be manufactured using one or more different material categories, including but not limited to: conductive materials, semiconductor materials, superconducting materials, dielectric materials, polymer materials, organic materials, inorganic materials, non-conductive materials, and / or another material that can be used in conjunction with one or more of the techniques described above for manufacturing integrated circuits.

[0076] Figure 5 An example, non-limiting circuit diagram 500 is shown according to one or more embodiments described herein, which can facilitate multi-pole filters on quantum devices with multiplexing capabilities and signal separation to mitigate crosstalk. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0077] Circuit diagram 500 may include representations of the above references Figure 1 The circuit diagram of the described device 100. Circuit diagram 500 may include... Figure 1 The circuit diagram shown is an example, a non-limiting alternative circuit diagram of the representation device 100. The circuit diagram 500 can be generated using a quantum-based simulation software application that can be used to simulate the operation of a superconducting device (such as device 100).

[0078] As in Figure 5 As depicted in the exemplary embodiment, qubit 102 may include qubit islands 502a and 502b. In this example embodiment, qubit islands 502a and 502b may be capacitively coupled to each other, wherein such capacitive coupling is... Figure 5 The middle is represented as capacitor 504a. In this example embodiment, qubit island 502a can be capacitively coupled to ground 506a, wherein such capacitive coupling is in Figure 5 The middle is represented as capacitor 504b. In this example embodiment, qubit island 502b can be capacitively coupled to ground 506b, wherein this capacitive coupling is in Figure 5 The capacitor in question is represented as 504C.

[0079] exist Figure 5 In the exemplary embodiments shown, output 112 may include a transmission line (e.g., a conductive trace) that can be represented as a resistor. For example, in some embodiments, output 112 may include a transmission line (e.g., a wire trace) that can be represented as a 50-ohm (Ω) resistor.

[0080] In some embodiments, an entity capable of designing, manufacturing, and / or implementing (e.g., simulating, quantizing, testing, etc.) device 100 as defined herein can employ a quantum-based simulation software application to generate a circuit diagram 500. In these embodiments, such an entity can further employ this quantum-based simulation software application to simulate the operation of device 100 using the circuit diagram 500. For example, such an entity can employ this quantum-based simulation software application to simulate the operation of device 100 using the circuit diagram 500, wherein the resulting data of such simulation can be presented as follows (refer to the following). Figure 6 The curve 606 in Figure 600 is described.

[0081] Figure 6 An example, non-limiting figure 600 is shown according to one or more embodiments described herein, which can facilitate multipole filters on quantum devices with multiplexing capabilities and signal separation to mitigate crosstalk. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0082] Figure 600 may include resulting data generated from one or more embodiments implementing (e.g., simulation, quantization, testing, etc.) the subject matter described herein. For example, Figure 600 may include data using references as described above. Figure 1 and Figure 5 The described circuit diagram 500 and / or one or more other embodiments disclosed in accordance with the subject matter described herein (e.g., referred to below respectively) Figure 8 and Figure 9 The described computer-implemented method 800 and / or 900) generates result data from the simulation device 100. Figure 6 In the example, non-limiting figure 600 described herein, such result data can be presented as curve 606 on figure 600, wherein, for the purpose of comparison, curves 602 and 604 of figure 600 include result data generated from implementing two prior art devices.

[0083] Figure 6 Curves 602, 604, and 606 shown in the exemplary, non-limiting Figure 600 represent result data generated by simulating the operation of device 100 and two prior art devices, respectively, wherein the same cavity FWHM and 7.5 GHz resonant were used to simulate all such devices to produce the same readout time. Figure 6The example non-limiting figure 600 depicted in the figure shows curves 602, 604, and 606, illustrating the radiative lifetime (e.g., Purcell relaxation) of a qubit in each device simulated to generate such curves. For example, curve 606 shows the radiative lifetime of qubit 102 in device 100. Curves 602, 604, and 606 show the radiative lifetime of such qubits as a function of frequency in GHz on the X-axis of Figure 600 and time in milliseconds (ms) on the Y-axis of Figure 600.

[0084] exist Figure 6 In the example non-limiting figure 600 depicted, curve 602 shows the radiation lifetime of a qubit in a first prior art device, wherein such a qubit is filtered using a single λ / 2 readout resonator (e.g., a single λ / 2 readout cavity) with an operating frequency (e.g., a resonant frequency) of 7.5 GHz.

[0085] exist Figure 6 In the example non-limiting figure 600 depicted, curve 604 shows the radiation lifetime of a qubit in a second prior art device, wherein such a qubit is filtered using a single λ / 2 readout resonator (e.g., a single λ / 2 readout cavity) with an operating frequency (e.g., a resonant frequency) of 7.5 GHz and a λ / 4 bandpass filter with the same operating frequency of 7.5 GHz.

[0086] exist Figure 6 In the non-limiting figure 600 depicting the example, curve 606 illustrates the radiative lifetime of qubit 102 in device 100, wherein qubit 102 is filtered using: a readout resonator 106 comprising a single λ / 2 readout resonator (e.g., λ / 2 readout cavity) having an operating frequency (e.g., resonant frequency) of 7.5 GHz; a bandpass filter 108 comprising a λ / 4 bandpass filter also having an operating frequency of 7.5 GHz; and a bandstop filter 114 comprising a single λ / 4 bandstop filter having an operating frequency of approximately 5 GHz. In some embodiments, device 100 may include a plurality of bandstop filters 114, the plurality of bandstop filters comprising a plurality of λ / 4 bandstop filters that may provide additional suppression or broaden the suppression bandwidth.

[0087] As in Figure 6As illustrated by curve 606 in the non-limiting figure 600 depicting the example, between approximately 4.8 GHz and approximately 5.4 GHz, device 100 provides an improved radiative relaxation time (e.g., Purcell relaxation time) associated with qubit 102 compared to curves 604 and 606, which respectively correspond to the first and second prior art devices described above. Therefore, device 100 can thereby facilitate an increased radiative lifetime and / or increased protection for qubit 102 between approximately 4.8 GHz and approximately 5.4 GHz, while maintaining the same readout time that can be produced by the first and / or second prior art devices described above.

[0088] Figure 7 A non-limiting example diagram 700 is shown according to one or more embodiments described herein, which can facilitate multi-pole filters on quantum devices with multiplexing capabilities and signal separation to mitigate crosstalk. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0089] Figure 700 illustrates a coupling configuration of one or more readout resonators, bandpass filters, and / or one or more bandstop filters that may be included in one or more embodiments of this subject matter. For example, referenced above... Figure 3 The described device 300 may include the components and coupling configuration shown in FIG700.

[0090] In some embodiments, the device 300 may include a sense resonator 106 and a sense resonator 206 that can be capacitively coupled in parallel with the bandpass filter 108, wherein such capacitive coupling is represented by capacitor 104b and capacitor 204b, respectively. In these embodiments, as in Figure 7 As illustrated in the example, which is a non-limiting example, as shown in Figure 700, the readout resonator 106 and the readout resonator 206 may each include a λ / 2 readout resonator. In these embodiments, as in... Figure 7 As illustrated in the example non-limiting figure 700, the bandpass filter 108 may be further coupled to the bandstop filter 114, wherein the bandpass filter 108 may include a single λ / 4 bandpass filter and the bandstop filter 114 may include a single λ / 4 bandstop filter.

[0091] In some embodiments, device 300 and / or illustrated 700 may include a plurality of band-stop filters 114. Figure 7(Not shown in the figure), the plurality of band-stop filters include a plurality of λ / 4 band-stop filters that can provide additional suppression or broaden the suppression bandwidth, wherein each of such a plurality of λ / 4 band-stop filters can resonate at one or more desired qubit frequencies (e.g., at the operating frequencies of qubit 102 and / or qubit 202). In some embodiments, device 300 and / or figure 700 may include bandpass filter 108, which includes a single λ / 2 bandpass filter. In some embodiments, device 300 and / or figure 700 may include lumped element equivalents that can replace any or all of the readout resonator 106 (e.g., λ / 2 readout resonator), readout resonator 206 (e.g., λ / 2 readout resonator), bandpass filter 108 (e.g., λ / 4 bandpass filter), and / or bandstop filter 114 (e.g., λ / 4 bandstop filter).

[0092] The various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) may be associated with different technologies. For example, the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) may be associated with quantum computing technology, quantum gate technology, quantum cross-resonant gate operation technology, quantum coupler technology, quantum device fabrication technology, quantum hardware and / or software technology, quantum circuit technology, superconducting circuit technology, machine learning technology, artificial intelligence technology, cloud computing technology, and / or other technologies.

[0093] The various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) can provide technical improvements to systems, apparatuses, components, operating steps, and / or processing steps associated with the various techniques identified above. For example, the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) can couple a readout resonator (e.g., readout resonator 106, readout resonator 206, etc.) to drive lines (e.g., high-power drive lines 306a, high-power drive lines 306b, etc.) formed on an intermediate substrate (e.g., intermediate substrate 402); and / or couple at least one of a qubit (e.g., qubit 102, qubit 202, etc.) or a multipole filter (e.g., a multipole filter that may include bandpass filter 108 and bandstop filter 114) to a readout line (e.g., readout line 310) formed on the intermediate substrate. In this example, such coupling of such components can thus provide a defined spatial separation (e.g., a relatively large spatial separation) between at least one of the drive line (e.g., high-power drive line 306a, high-power drive line 306b, etc.) and the readout resonator (e.g., readout resonator 106, readout resonator 206, etc.) or the drive line and the qubit (e.g., qubit 102, qubit 202, etc.) in order to mitigate crosstalk associated with devices (e.g., devices 100, 200, 300, 400, etc.) that include the aforementioned components.

[0094] In the examples above, based on such coupling of these different components, the various embodiments of the present disclosure described herein (e.g., device 100, device 200, device 300, device 400, etc.) can thereby increase the radiation lifetime and / or protection of such qubits (e.g., increased relaxation time, Purcell relaxation time, radiation lifetime, and / or protection of qubit 102 and / or qubit 202). In the examples above, based on such coupling of these components, the various embodiments of the present disclosure described herein (e.g., device 100, device 200, device 300, device 400, etc.) can further mitigate crosstalk associated with the qubit chip substrate (e.g., qubit chip substrate 404) and the interposer substrate, thereby assisting in at least one of improved accuracy, improved performance, or improved fidelity of the processing unit (e.g., quantum processor) including the qubit chip substrate and the interposer substrate (e.g., a quantum processor including device 100, device 200, device 300, device 400, etc.).

[0095] The various embodiments of this disclosure described herein (e.g., devices 100, 200, 300, 400, etc.) can provide technical improvements to processing units (e.g., quantum processors including devices 100, 200, 300, and / or 400). For example, by increasing the radiation lifetime and / or protection of such qubits (e.g., qubit 102, qubit 202, etc.), and / or by mitigating crosstalk associated with the qubit chip substrate and the intermediate substrate as described above, the various embodiments of this disclosure described herein (e.g., devices 100, 200, 300, 400, etc.) can thereby facilitate at least one of improved accuracy, improved performance, or improved fidelity of processing units (e.g., quantum processors) including the qubit chip substrate and the intermediate substrate (e.g., quantum processors including devices 100, 200, 300, 400, etc.).

[0096] Based on the increased qubit radiation lifetime, increased qubit protection, and / or mitigation of crosstalk described above, the practical applications of the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) are that they can be implemented in quantum devices (e.g., quantum processors, quantum computers, etc.) to compute one or more solutions (e.g., heuristics, etc.) to a variety of complex problems (e.g., estimation problems, optimization problems, etc.) in various fields (e.g., finance, chemistry, medicine, etc.) with improved fidelity and / or accuracy more quickly and efficiently. For example, based on the increased qubit radiation lifetime, increased qubit protection, and / or mitigation of crosstalk described above, practical applications of the various embodiments of this disclosure described herein (e.g., devices 100, 200, 300, 400, etc.) are that they can be implemented, for example, in a quantum processor to compute one or more solutions with improved fidelity and / or accuracy (e.g., heuristics for optimization problems in the chemical, medical, and / or financial fields), wherein such solutions can be used to engineer, for example, new compounds, new drugs, and / or new option pricing systems and / or methods.

[0097] It should be understood that the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) provide a novel approach driven by relatively new quantum computing techniques. For example, the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) provide a novel method to increase radiation lifetime and / or qubit protection and / or reduce crosstalk that causes quantum gate errors during quantum computing as described above. In this example, such a novel method of increasing the radiation lifetime of a qubit and / or protecting and / or mitigating such crosstalk can utilize improved fidelity and / or accuracy to achieve faster and more efficient quantum computing using a quantum processor, including one or more of the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.).

[0098] The various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) can employ hardware and / or software to solve problems that are inherently technical, non-abstract, and cannot be performed by humans as a set of mental actions. In some embodiments, one or more of the processes described herein can be executed by one or more dedicated computers (e.g., dedicated processing units, dedicated conventional computers, dedicated quantum computers, etc.) to perform tasks defined in relation to the different technologies identified above. The various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) can be employed to solve new problems arising from advancements in the aforementioned technologies, quantum computing systems, cloud computing systems, computer architectures, and / or other technologies.

[0099] It should be understood that since the various operations that can be performed by the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) are operations that are greater than human thought, the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) can utilize various combinations of electrical components, mechanical components, and circuits that cannot be copied in the human mind or performed by a human. For example, the amount of data processed, the speed at which such data is processed, or the type of data processed by the various embodiments of this disclosure described herein (e.g., apparatus 100, apparatus 200, apparatus 300, apparatus 400, etc.) within a certain time period may be greater than, faster than, or different from the amount, speed, or type of data that can be processed by the human mind within the same time period.

[0100] According to several embodiments, the various embodiments of this disclosure described herein (e.g., device 100, device 200, device 300, device 400, etc.) may also be fully operable to perform one or more other functions (e.g., full power-on, full execution, etc.) while simultaneously performing the various operations described herein. It should be understood that such simultaneous multi-operation execution is beyond the capabilities of the human mind. It should also be understood that the various embodiments of this disclosure described herein (e.g., device 100, device 200, device 300, device 400, etc.) may include information that is not manually obtainable by an entity (such as a human user). For example, the types, quantities, and / or various types of information included in the various embodiments of this disclosure described herein (e.g., device 100, device 200, device 300, device 400, etc.) are more complex than information manually obtainable by a human user.

[0101] Figure 8 A flowchart of an example, non-limiting computer-implemented method 800 according to one or more embodiments described herein is shown, which facilitates the mitigation of crosstalk by multipole filters on quantum devices with multiplexing capabilities and signal separation. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0102] At 802, the computer-implemented method 800 may include a system operatively coupled to a processor (e.g., a processing unit 1014, etc.) (e.g., a system including a device 100, for example, coupled to an AWG, VNA, and / or a microwave maser that may be coupled to a computer 1012) to couple qubits (e.g., qubit 102, qubit 202, etc.) formed on a qubit chip substrate (e.g., qubit chip substrate 404) to readout resonators (e.g., readout resonator 106, readout resonator 206, etc.) formed on an intermediate substrate (e.g., intermediate substrate 402).

[0103] At 804, the computer-implemented method 800 may include coupling qubits to a multipole filter (e.g., coupled to the above-referenced...) by a system (e.g., a system including a device 100, such as coupled to an AWG, VNA, and / or may be coupled to a microwave maser 1012). Figure 1 The described multi-stage filter may include a bandpass filter 108 and at least one bandstop filter 114.

[0104] Figure 9 A flowchart of a non-limiting computer-implemented method 900 according to one or more embodiments described herein is shown, which facilitates the mitigation of crosstalk by multipole filters on quantum devices with multiplexing capabilities and signal separation. For brevity, repeated descriptions of similar elements and / or processes employed in the corresponding embodiments are omitted.

[0105] At 902, the computer-implemented method 900 may include a system operatively coupled to a processor (e.g., a processing unit 1014, etc.) (e.g., a system including a device 100, for example, coupled to an AWG, VNA, and / or a microwave maser that may be coupled to a computer 1012) to couple qubits (e.g., qubit 102, qubit 202, etc.) formed on a qubit chip substrate (e.g., qubit chip substrate 404) to readout resonators (e.g., readout resonator 106, readout resonator 206, etc.) formed on an intermediate substrate (e.g., intermediate substrate 402).

[0106] At 904, the computer-implemented method 900 may include coupling qubits to a multipole filter (e.g., coupled to the above-described method) by a system (e.g., a system including a device 100, such as coupled to an AWG, VNA, and / or potentially coupled to a maser, computer 1012). Figure 1 The described multi-stage filter may include a bandpass filter 108 and at least one bandstop filter 114.

[0107] At 906, the computer-implemented method 900 may include coupling a readout resonator to drive lines (e.g., high-power drive line 306a, high-power drive line 306b, etc.) formed on an intermediate substrate by a system (e.g., a system including a device 100 including, for example, a microwave maser coupled to an AWG, VNA, and / or a device that may be coupled to a computer 1012).

[0108] At 908, the computer-implemented method 900 may include coupling at least one of a qubit or a multipole filter to a readout line (e.g., readout line 310) formed on an intermediate substrate by a system (e.g., a system including, for example, a device 100 coupled to an AWG, a VNA and / or a microwave maser that may be coupled to a computer 1012).

[0109] In 910, the computer-implemented method 900 may include coupling a readout resonator to drive lines (e.g., high-power drive line 306a, high-power drive line 306b, etc.) formed on an intermediate substrate by a system (e.g., a system including a device 100 including, for example, an AWG, VNA, and / or a microwave maser that may be coupled to a computer 1012).

[0110] In 912, the computer-implemented method 900 may include coupling at least one of the qubit or the multipole filter to a readout line (e.g., readout line 310) formed on the intermediate substrate by a system (e.g., a system including a device 100, such as coupled to an AWG, VNA, and / or a microwave maser that may be coupled to a computer 1012) to mitigate crosstalk associated with the qubit chip substrate and the intermediate substrate, thereby promoting at least one of improved accuracy, improved performance, or improved fidelity of a processing unit (e.g., a quantum processor) including the qubit chip substrate and the intermediate substrate.

[0111] In order to provide context for the various aspects of the disclosed subject, Figure 10 The following discussion is intended to provide a general description of the suitable environment in which the various aspects of the disclosed subject matter can be realized. Figure 10 An example non-limiting operating environment diagram is shown that can facilitate one or more embodiments described herein. For example, operating environment 1000 can be used to implement the above-described embodiments, as described below. Figure 1 , 2 The examples, non-limiting multi-step manufacturing sequences described in 3 and 4 can be implemented to manufacture apparatus 100, apparatus 200, apparatus 300, and / or apparatus 400 according to one or more embodiments of the present disclosure described herein. In another example, as described below, operating environment 1000 can be used to implement the above-described embodiments respectively. Figure 8 and Figure 9 One or more examples, non-limiting computer-implemented methods 800 and / or 900, are described herein. For the sake of brevity, repeated descriptions of similar elements and / or processes employed in other embodiments described herein are omitted.

[0112] It can be done through a computing system (e.g., Figure 10 The operating environment 1000 shown and described below and / or computing devices (e.g., Figure 10 The computer 1012 shown and described below implements the above. Figure 1 , 2 The example non-limiting multi-step manufacturing sequence described in 3 and 4 can be implemented as manufacturing apparatus 100, apparatus 200, apparatus 300, and / or apparatus 400. In a non-limiting exemplary embodiment, such a computing system (e.g., operating environment 1000) and / or such a computing device (e.g., computer 1012) may include one or more processors and one or more memory devices on which executable instructions may be stored, which, when executed by the one or more processors, facilitate the above description. Figure 1 , 2The examples described in 3 and 4, and the execution of a non-limiting multi-step manufacturing sequence. As a non-limiting example, the one or more processors may facilitate the above-mentioned processes by bootsting and / or controlling one or more systems and / or devices. Figure 1 , 2 The examples described in 3 and 4, and the execution of non-limiting multi-step manufacturing sequences, are systems and / or devices that can be operated to perform the fabrication of semiconductor and / or superconductor devices.

[0113] In another example, the above refer to... Figure 8 and Figure 9 The one or more examples, non-limiting computer-implemented methods 800 and / or 900 described may also be implemented (e.g., executed) by the operating environment 1000. As a non-limiting example, one or more processors of such a computing device (e.g., computer 1012) may facilitate the above-described methods by booting and / or controlling one or more systems and / or devices (e.g., one or more types of external devices defined herein, such as AWG, VNA, maser, etc.) operable to perform the operations and / or routines of such computer-implemented methods. Figure 8 and 9 The execution of one or more example, non-limiting computer-implemented methods 800 and / or 900 described herein.

[0114] For simplicity of explanation, the computer-implemented method is depicted and described as a series of actions. It should be understood and recognized that the subject matter innovation is not limited to the actions shown and / or the order of the actions; for example, actions may occur in different orders and / or simultaneously, and may occur with other actions not presented and described herein. Furthermore, not all actions shown are necessary to implement the computer-implemented method according to the disclosed subject matter. Moreover, those skilled in the art will understand and appreciate that the computer-implemented method may alternatively be represented as a series of interrelated states via state diagrams or events. Furthermore, it should be understood that the computer-implemented method disclosed below and throughout this specification can be stored on an article of art to facilitate the transfer and assignment of such a computer-implemented method to a computer. As used herein, the term article of art is intended to encompass a computer program accessible from any computer-readable device or storage medium.

[0115] refer to Figure 10The suitable operating environment 1000 for implementing various aspects of this disclosure may also include a computer 1012. The computer 1012 may further include a processing unit 1014, system memory 1016, and a system bus 1018. The system bus 1018 couples system components, including but not limited to system memory 1016, to the processing unit 1014. The processing unit 1014 may be any of the various available processors. Dual microprocessors and other multiprocessor architectures may also be used as the processing unit 1014. The system bus 1018 may be any of several types of bus architectures, including memory buses or memory controllers, peripheral buses or external buses, and / or local buses using any of the various available bus architectures, including but not limited to Industry Standard Architecture (ISA), Micro Channel Architecture (MSA), Extended ISA (EISA), Intelligent Drive Electronics (IDE), VESA Local Bus (VLB), Peripheral Component Interconnect (PCI), Card Bus, Universal Serial Bus (USB), Advanced Graphics Port (AGP), Firewire (IEEE 1394), and Small Computer System Interface (SCSI).

[0116] System memory 1016 may also include volatile memory 1020 and non-volatile memory 1022. The Basic Input / Output System (BIOS) is stored in the non-volatile memory 1022, and the BIOS contains basic routines for transferring information between components within the computer 1012, such as during startup. The computer 1012 may also include removable / non-removable, volatile / non-volatile computer storage media. Figure 10 Disk storage 1024 is illustrated, for example. Disk storage 1024 may also include, but is not limited to, devices such as disk drives, floppy disk drives, tape drives, Jaz drives, Zip drives, LS-100 drives, flash memory cards, or memory sticks. Disk storage 1024 may also include storage media, either alone or in combination with other storage media. To facilitate connection of disk storage 1024 to system bus 1018, a removable or non-removable interface, such as interface 1026, is typically used. Figure 10 Software that acts as an intermediary between the user and the basic computer resources described in the suitable operating environment 1000 is also described. Such software may also include, for example, an operating system 1028. The operating system 1028, which may be stored on a disk storage device 1024, is used to control and allocate the resources of the computer 1012.

[0117] System application 1030 utilizes resource management by operating system 1028 through program modules 1032 and program data 1034 stored, for example, in system memory 1016 or disk storage 1024. It should be understood that this disclosure can be implemented using different operating systems or combinations of operating systems. Users input commands or information into computer 1012 via input device 1036. Input device 1036 includes, but is not limited to, pointing devices such as a mouse, trackball, stylus, touchpad, keyboard, microphone, joystick, game controller, satellite dish, scanner, TV tuner card, digital camera, digital camcorder, webcam, etc. These and other input devices are connected to processing unit 1014 via system bus 1018 through one or more interface ports 1038. Interface ports 1038 include, for example, serial ports, parallel ports, game ports, and Universal Serial Bus (USB). Output device 1040 uses some of the same type of ports as input device 1036. Thus, for example, a USB port can be used to provide input to computer 1012 and to output information from computer 1012 to output device 1040. Output adapter 1042 is provided to illustrate that, in addition to other output devices 1040 that require special adapters, there are other output devices 1040, such as monitors, speakers, and printers. By way of illustration and not limitation, output adapter 1042 includes video and sound cards that provide a connection between output device 1040 and system bus 1018. It should be noted that other devices and / or systems of devices provide input and output capabilities, such as remote computer 1044.

[0118] Computer 1012 can operate in a network environment using logical connections to one or more remote computers (such as remote computers 1044). Remote computer 1044 can be a computer, server, router, network PC, workstation, microprocessor-based appliance, peer-to-peer device, or other public network node, and typically may also include many or all of the elements described relative to computer 1012. For simplicity, memory storage device 1046 is described using only remote computer 1044 as an example. Remote computer 1044 is logically connected to computer 1012 via network interface 1048 and then physically connected via communication connection 1050. Network interface 1048 includes wired and / or wireless communication networks, such as local area networks (LANs), wide area networks (WANs), cellular networks, etc. LAN technologies include Fiber Distributed Data Interface (FDDI), Copper Wire Distributed Data Interface (CDDI), Ethernet, Token Ring, etc. WAN technologies include, but are not limited to, point-to-point links, circuit-switched networks (such as Integrated Services Digital Network (ISDN)) and its variants, packet-switched networks, and Digital Subscriber Line (DSL). Communication connection 1050 refers to the hardware / software used to connect network interface 1048 to system bus 1018. Although communication connection 1050 is shown inside computer 1012 for clarity, it may also be outside computer 1012. For illustrative purposes only, the hardware / software used to connect to network interface 1048 may also include internal and external technologies such as modems, including conventional telephone-grade modems, cable modems and DSL modems, ISDN adapters and Ethernet cards.

[0119] This invention can be a system, method, apparatus, and / or computer program product at any possible level of technical detail integration. The computer program product may include a computer-readable storage medium (or media) having computer-readable program instructions thereon for causing a processor to execute aspects of the invention. The computer-readable storage medium may be a tangible means capable of retaining and storing instructions for use by an instruction execution device. The computer-readable storage medium may be, for example, but not limited to, electronic storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination thereof. A non-exhaustive list of more specific examples of computer-readable storage media may also include: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), static random access memory (SRAM), portable compact disk read-only memory (CD-ROM), digital universal disk (DVD), memory sticks, floppy disks, mechanical encoding devices such as punch cards or protrusions in slots having instructions recorded thereon, and any suitable combination thereof. As used herein, computer-readable storage media should not be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses passing through fiber optic cables), or electrical signals transmitted through wires.

[0120] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to a corresponding computing / processing device via a network (e.g., the Internet, a local area network, a wide area network, and / or a wireless network), or downloaded to an external computer or external storage device. The network may include copper transmission cables, optical transmission fibers, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards them to a computer-readable storage medium within the corresponding computing / processing device. The computer-readable program instructions used to perform the operations of this invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, integrated circuit configuration data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages ​​(such as Smalltalk, C++, etc.) and procedural programming languages ​​(such as the "C" programming language or similar programming languages). Computer-readable program instructions may execute entirely on a user's computer, partially on a user's computer, as a standalone software package, partially on a user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer via any type of network (including a local area network (LAN) or a wide area network (WAN)) or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some embodiments, electronic circuitry including, for example, programmable logic circuitry, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs) may be personalized to execute computer-readable program instructions by utilizing state information of the computer-readable program instructions in order to perform aspects of the present invention.

[0121] The present invention will now be described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions. These computer-readable program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. These computer-readable program instructions can also be stored in a computer-readable storage medium that causes a computer, programmable data processing apparatus, and / or other device to operate in a particular manner, such that the computer-readable storage medium storing the instructions comprises an article of manufacture containing instructions for implementing aspects of the functions / actions specified in one or more blocks of the flowchart illustrations and / or block diagrams. Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device to cause a series of operations to be performed on the computer, other programmable apparatus, or other device to produce computer-implemented processing, such that the instructions executed on the computer, other programmable apparatus, or other device perform the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0122] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. Each block in a flowchart or block diagram may represent a module, segment, or portion of instructions, including one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions marked in the blocks may occur in a different order than indicated in the figures. For example, depending on the functions involved, two consecutively shown blocks may actually be executed substantially simultaneously, or these blocks may sometimes be executed in reverse order. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action or executes a combination of dedicated hardware and computer instructions.

[0123] While the subject matter has been described above in the general context of computer-executable instructions running on a computer and / or a computer program product on a computer, those skilled in the art will recognize that this disclosure may also be implemented in combination with other program modules. Typically, program modules include routines, programs, components, data structures, etc., that perform specific tasks and / or implement specific abstract data types. Furthermore, those skilled in the art will recognize that the computer implementation methods of the present invention can be practiced with other computer system configurations, including single-processor or multi-processor computer systems, small computing devices, mainframe computers, and computers, handheld computing devices (e.g., PDAs, telephones), microprocessor-based or programmable consumer or industrial electronic products, etc. The aspects shown can also be implemented in a distributed computing environment, where tasks are performed by remote processing devices linked via a communication network. However, some (if not all) aspects of the invention can be practiced on a standalone computer. In a distributed computing environment, program modules may reside in local and remote memory storage devices. For example, in one or more embodiments, computer-executable components may be executed from memory that may include or consist of one or more distributed memory cells. As used herein, the terms “memory” and “memory cell” are interchangeable. Furthermore, one or more embodiments described herein are capable of executing code from computer executable components in a distributed manner, for example, multiple processors working together or cooperating to execute code from one or more distributed memory units. As used herein, the term "memory" may include a single memory or memory unit at one location or multiple memories or memory units at one or more locations.

[0124] As used herein, the terms “component,” “system,” “platform,” “interface,” etc., may refer to and / or include computer-related entities or entities associated with an operating machine having one or more specific functions. Entities disclosed herein may be hardware, a combination of hardware and software, software, or software in execution. For example, a component may be, but is not limited to, a process running on a processor, a processor, an object, an executable file, a thread of execution, a program, and / or a computer. For illustration, both an application running on a server and the server itself can be components. One or more components may reside within a process and / or a thread of execution, and components may reside on one computer and / or be distributed across two or more computers. In another example, a corresponding component may be executed from a different computer-readable medium having different data structures stored thereon. Components may communicate via local and / or remote processes, such as according to a signal having one or more data packets (e.g., data from a component interacting with another component in a local system, a distributed system, and / or data from a component interacting with other systems across a network such as the Internet via that signal). As another example, a component may be a device having specific functions provided by mechanical parts operated by electrical or electronic circuitry, which is operated by a software or firmware application executed by a processor. In such a case, the processor can be internal or external to the device and can execute at least a portion of the software or firmware application. As another example, the component can be a device that provides a specific function through electronic components without mechanical parts, wherein the electronic components can include a processor or other means for performing software or firmware that at least partially imparts the functionality to the electronic components. In one aspect, the component can be simulated via a virtual machine, for example, within a cloud computing system.

[0125] Furthermore, the term "or" is intended to mean an inclusive "or" rather than an exclusive "or." That is, unless otherwise specified or clear from the context, "X adopts A or B" is intended to mean any natural inclusive permutation. That is, if X adopts A; X adopts B; or X adopts both A and B, then "X adopts A or B" is satisfied in any of the foregoing cases. Additionally, the articles "a" and "an" as used in the subject matter specification and figures should generally be interpreted as meaning "one or more," unless otherwise specified or clearly indicated from the context to the singular form. As used herein, the terms "example" and / or "exemplary" are used to indicate that something is used as an example, illustration, or illustration. For the avoidance of doubt, the subject matter disclosed herein is not limited to such examples. Furthermore, any aspect or design described herein as "example" and / or "exemplary" is not necessarily to be construed as superior to or better than other aspects or designs, nor does it imply the exclusion of equivalent exemplary structures and techniques known to those skilled in the art.

[0126] As used herein, the term "processor" can refer to substantially any computing processing unit or device, including but not limited to a single-core processor; a single processor with software multithreading capabilities; a multi-core processor; a multi-core processor with software multithreading capabilities; a multi-core processor with hardware multithreading technology; a parallel platform; and a parallel platform with distributed shared memory. Additionally, "processor" can refer to an integrated circuit, application-specific integrated circuit (ASIC), digital signal processor (DSP), field-programmable gate array (FPGA), programmable logic controller (PLC), complex programmable logic device (CPLD), discrete gate or transistor logic, discrete hardware components, or any combination thereof, designed to perform the functions described herein. Furthermore, processors can utilize nanoscale architectures, such as, but not limited to, molecular and quantum dot-based transistors, switches, and gates, to optimize space utilization or enhance the performance of user equipment. Processors can also be implemented as a combination of computing processing units. In this disclosure, terms such as “store,” “storage,” “data store,” “data storage,” “database,” and substantially any other information storage component, used in connection with the operation and function of a component, are used to refer to a “memory component,” an entity embodied in “memory,” or a component that includes memory. It should be understood that the memory and / or memory components described herein can be volatile or non-volatile memory, or may include both volatile and non-volatile memory. By way of example and not limitation, non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable ROM (EEPROM), flash memory, or non-volatile random access memory (RAM) (e.g., ferroelectric RAM (FeRAM)). Volatile memory may include, for example, RAM that can act as an external cache memory. By way of illustration and not limitation, RAM can be obtained in many forms, such as synchronous RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), Synchlink DRAM (SLDRAM), direct Rambus, etc. RAM (DRRAM), Direct Rambus Dynamic RAM (DRDRAM), and Rambus Dynamic RAM (RDRAM). Additionally, the memory components of the systems or computer-implemented methods disclosed herein inherently include (but are not limited to) these and any other suitable types of memory.

[0127] The above description includes only examples of systems and computer-implemented methods. Of course, for the purposes of describing this disclosure, it is impossible to describe every conceivable combination of components or computer-implemented method; however, those skilled in the art will recognize that many further combinations and substitutions of this disclosure are possible. Furthermore, the terms “comprising,” “having,” “possessing,” etc., used in the detailed description, claims, appendices, and drawings are intended to be inclusive in a manner similar to the term “including,” since “including” is interpreted as a transitional word in the claims.

[0128] Various embodiments have been described for illustrative purposes, but are not intended to be exhaustive or limiting of the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein has been chosen to best explain the principles of the embodiments, their practical application, or technical improvements to technologies found in the market, or to enable those skilled in the art to understand the embodiments disclosed herein.

Claims

1. A quantum device, comprising: An intermediate substrate, the intermediate substrate including a readout resonator, the readout resonator being coupled to a drive line formed on the intermediate substrate via a first capacitor; as well as Quantum bit chip substrate, the quantum bit chip substrate comprising: The qubits coupled to the readout resonator; and A multi-pole filter, the multi-pole filter comprising: A bandpass filter, the bandpass filter being coupled to a readout line formed on the intermediate substrate and coupled to the readout resonator via a second capacitor; and A band-stop filter is coupled to the band-pass filter and coupled to ground via a third capacitor.

2. The apparatus according to claim 1, wherein, The qubit is coupled to the readout resonator via a fourth capacitor.

3. The apparatus according to claim 2, wherein, The bandpass filter operates at the operating frequency of the readout resonator, and the bandstop filter operates at the operating frequency of the qubit.

4. The apparatus according to claim 3, wherein, The readout resonator is a first readout resonator, the qubit is a first qubit, the band-stop filter is a first band-stop filter, and the drive line is a first drive line, wherein: The intermediate substrate further includes a second readout resonator, which is coupled to a second drive line formed on the intermediate substrate via a fifth capacitor. The qubit chip substrate further includes a second qubit, which is coupled to the second readout resonator via a sixth capacitor. The multipole filter also includes a second band-stop filter, which is coupled to ground via a seventh capacitor.

5. The apparatus according to claim 4, wherein: The operating frequency of the readout resonator is higher than the corresponding operating frequencies of the first and second qubits, and The second band-stop filter operates at the operating frequency of the second qubit.

6. The apparatus of claim 2, wherein the operating frequency of the readout resonator is higher than the operating frequency of the qubit.

7. The apparatus according to claim 4, wherein: The first qubit is capacitively coupled to the second qubit.

8. A computer-implemented method, comprising: A system operatively coupled to a processor will couple qubits formed on a qubit chip substrate to a readout resonator formed on an intermediate substrate, wherein the readout resonator is coupled to a drive line formed on the intermediate substrate via a first capacitor; as well as The system couples the qubit to a multipole filter, wherein the multipole filter comprises: A bandpass filter is coupled to a readout line formed on the intermediate substrate and coupled to the readout resonator via a second capacitor; as well as A band-stop filter is coupled to the band-pass filter and coupled to ground via a third capacitor.

9. The computer-implemented method according to claim 8, further comprising: The system couples the qubit to the readout resonator via a fourth capacitor.

10. The computer-implemented method according to claim 9, wherein, The bandpass filter operates at the operating frequency of the readout resonator, and the bandstop filter operates at the operating frequency of the qubit.

11. The computer-implemented method according to claim 10, wherein, The readout resonator is a first readout resonator, the qubit is a first qubit, the band-stop filter is a first band-stop filter, and the drive line is a first drive line, wherein: The intermediate substrate further includes a second readout resonator, which is coupled to a second drive line formed on the intermediate substrate via a fifth capacitor. The qubit chip substrate further includes a second qubit, which is coupled to the second readout resonator via a sixth capacitor. The multipole filter also includes a second band-stop filter, which is coupled to ground via a seventh capacitor.

12. The computer-implemented method according to claim 11, wherein: The operating frequency of the readout resonator is higher than the corresponding operating frequencies of the first and second qubits, and The second band-stop filter operates at the operating frequency of the second qubit.

13. The computer-implemented method of claim 9, wherein the operating frequency of the readout resonator is higher than the operating frequency of the qubit.

14. The computer-implemented method according to claim 11, wherein: The first qubit is capacitively coupled to the second qubit.

15. A quantum device, comprising: An intermediate substrate, the intermediate substrate including a plurality of readout resonators, wherein the plurality of readout resonators are coupled to respective drive lines formed on the intermediate substrate via respective first capacitors; as well as Quantum bit chip substrate, the quantum bit chip substrate comprising: Multiple qubits, wherein the multiple qubits are correspondingly coupled to the multiple readout resonators; and A multi-pole filter, the multi-pole filter comprising: A bandpass filter, said bandpass filter being coupled to a readout line formed on said intermediate substrate, and being coupled to said plurality of readout resonators via respective second capacitors; and A plurality of band-stop filters are associated with the plurality of readout resonators, wherein the plurality of band-stop filters are coupled to the band-pass filter and are coupled to ground via a respective third capacitor.

16. The apparatus of claim 15, wherein the plurality of qubits are correspondingly coupled to the plurality of readout resonators via a corresponding fourth capacitor.

17. The apparatus of claim 16, wherein the bandpass filter operates at the operating frequency of at least one of the plurality of readout resonators, and the plurality of bandstop filters operate accordingly at the corresponding operating frequencies of the corresponding qubits among the plurality of qubits.

18. The apparatus of claim 15, wherein at least two of the plurality of qubits are capacitively coupled together.

19. The apparatus of claim 15, wherein the respective operating frequencies of the plurality of readout resonators are higher than the respective operating frequencies of the plurality of qubits.

20. The apparatus of claim 15, wherein the bandpass filter operates at an operating frequency of at least 7.5 GHz.

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