A fully automated mixed chip placement equipment and method for multiple chip types

Abstract

This invention discloses a fully automated mixed chip mounting equipment and method for multiple chip types, comprising a feeding station, a calibration station, and a mounting station arranged in parallel; a chip feeding mechanism located at the feeding station; a calibration mechanism located at the calibration station; a platform transfer mechanism located at the mounting station; a substrate feeding mechanism that automatically supplies substrates to the platform transfer mechanism; and a mounting mechanism. The mounting mechanism is horizontally movably mounted on an X-axis beam, and its transfer range covers the feeding station, the calibration station, and the mounting station. A vision camera is positioned above each of the feeding station, the calibration station, and the mounting station, and a nozzle storage container is located below the transfer range of the mounting mechanism. This invention enables automatic feeding of multiple different types of chips and automatic changing of different chip nozzles, greatly improving the mounting efficiency of multiple types of chips on a substrate.

Description

Technical Field

[0001] This invention relates to the field of chip mounting technology, and more specifically, to a fully automated mixed mounting equipment and method for multiple types of chips. Background Technology

[0002] In recent years, with the rapid development of optical communication and semiconductors, the industry's requirements for chip mounting efficiency have become increasingly stringent. On some substrates, multiple chips of different types typically need to be mounted, and their sizes vary depending on their functions. For high-density integrated substrates, the chips mounted are extremely small, some even submicron in size. For mounting chips of this size, the precision requirements for mounting equipment are extremely high, including the design of the chip nozzle size. The suction surface of the chip nozzle should not be larger than the outline of the chip's upper surface; otherwise, interference with surrounding chips or other electronic components may occur during chip suction or mounting. Conversely, the suction surface of the chip nozzle should not be too small, as this makes it difficult to provide effective and reliable suction force, leading to unstable chip adhesion and mounting failure. Therefore, different sizes of chips require the use of matching chip nozzles for mounting operations.

[0003] The prior art patent publication number CN114980554A discloses a chip placement machine. Although the chip placement machine realizes fully automatic chip placement, it cannot achieve high-precision placement for various types of chips; and the placement efficiency and placement accuracy cannot meet the higher requirements of placement.

[0004] Therefore, it is necessary to provide a new fully automated mixed placement equipment and method for multiple types of chips to solve the above-mentioned technical problems. Summary of the Invention

[0005] One of the main objectives of this invention is to provide a fully automated mixed-mount device for multiple types of chips, which can realize the automatic feeding of various types of chips and the automatic replacement of different chip nozzles, greatly improving the mounting efficiency of multiple types of chips on the substrate.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a fully automated mixed placement equipment for multiple types of chips, comprising a feeding station, a calibration station, and a placement station arranged in parallel, a chip feeding mechanism disposed at the feeding station, a calibration mechanism disposed at the calibration station, a platform transfer mechanism disposed at the placement station, a substrate feeding mechanism that automatically supplies substrates to the platform transfer mechanism, and a placement mechanism. The placement mechanism is horizontally movably disposed on an X-axis beam and its transfer range covers the feeding station, the calibration station, and the placement station. A vision camera is disposed above each of the feeding station, the calibration station, and the placement station, and a nozzle storage container is disposed below the transfer range of the placement mechanism.

[0007] Furthermore, the chip feeding mechanism includes a first XY-axis transfer module, a first support plate driven by the first XY-axis transfer module to move horizontally, a first motor fixed on the first support plate, a feeding turntable driven by the first motor to rotate around the Z-axis, and a plurality of material trays distributed in a ring on the feeding turntable.

[0008] Furthermore, the nozzle storage container includes a support base, on which a plurality of carrier slots for carrying chip nozzles are provided, and chip nozzles are placed on the carrier slots.

[0009] Furthermore, the nozzle storage container also includes a Y-axis transfer module and a fourth support plate that is driven by the Y-axis transfer module to move horizontally along the Y-axis. The support base and the correction mechanism are disposed on the fourth support plate and share a vision camera.

[0010] Furthermore, the correction mechanism includes a third motor and an adsorption seat that is driven by the third motor to rotate around the Z-axis.

[0011] Furthermore, the platform transfer mechanism includes a second XY-axis transfer module and a docking platform module disposed at the movable end of the second XY-axis transfer module.

[0012] Furthermore, the mounting mechanism includes an X-axis transfer module mounted on the X-axis beam, a second support plate driven by the X-axis transfer module to move along the X-axis, a Z-axis transfer module fixed on the second support plate, a third support plate driven by the Z-axis transfer module to move along the Z-axis, a second motor mounted on the third support plate, and a mounting head driven by the second motor to rotate around the Z-axis.

[0013] Furthermore, the mounting head includes a connector, a nozzle mounting base, and a chip nozzle. The connector is fixedly mounted around the rotating shaft of the second motor. The nozzle mounting base has an air chamber and an adsorption surface at the bottom. The central axis of the air chamber is parallel and offset from the rotating shaft of the second motor. The air chamber has a top and a bottom that extend vertically. The top is sealed with a transparent top cover, and the bottom is an open structure that extends downward to the adsorption surface. The chip nozzle is adsorbed and mounted on the adsorption surface.

[0014] Furthermore, the chip suction nozzle is provided with an adsorption channel communicating with the air cavity. The central axis of the adsorption channel is collinear with the central axis of the air cavity, so that the adsorption channel and the air cavity together form an observation channel for the visual camera to observe the angle of the chip.

[0015] Furthermore, the nozzle mounting base is provided with two air paths, one of which is connected to the air chamber for adsorbing the chip, and the other is connected to the adsorption surface for adsorbing the chip nozzle, thereby realizing automatic replacement of the chip nozzle.

[0016] Another object of the present invention is to provide a mounting method based on the above-mentioned fully automated mixed mounting equipment for multiple types of chips, which includes the following steps:

[0017] S1. Place the chip wafer to be mounted on the chip feeding mechanism;

[0018] S2. The mounting mechanism moves above the nozzle storage container and automatically assembles the corresponding chip nozzle according to the type of chip to be mounted.

[0019] S3. The chip feeding mechanism rotates the chip wafer to be mounted to a set position. The vision camera located above the feeding station takes a picture of the entire chip wafer to obtain the position information of each chip. The mounting mechanism moves above the chip wafer and picks up the chips in a set order.

[0020] S4. The mounting mechanism adsorbs the chip and moves it above the calibration station, and places the chip on the calibration mechanism. The vision camera above the calibration station adjusts the chip to the angle state required for mounting on the substrate.

[0021] S5. During the execution of S1~S4, the substrate to be mounted is moved to the mounting station, and the mounting position of the chip to be mounted on the substrate is adjusted to the set position. The vision camera located above the mounting station acquires the precise position information of the mounting position.

[0022] S6. The mounting mechanism picks up the chip with the adjusted angle and moves it above the mounting position. The vision camera above the mounting station detects the angle position of the chip again through the observation channel on the mounting mechanism. If there is no angle deviation, the chip is mounted on the mounting position. If there is an angle deviation, the chip nozzle is driven by the motor in the mounting mechanism to rotate and the chip angle is finely adjusted. Then the chip mounting action is performed to complete the chip mounting.

[0023] The advantages of this invention's fully automated multi-type chip mounting equipment and method compared to existing technologies are: it enables automatic feeding of multiple different types of chips and automatic changing of different chip nozzles, achieving the goal of multi-chip mixed mounting and greatly improving the mounting efficiency of multiple types of chips on the substrate. Specifically,

[0024] 1) By setting up a rotary chip feeding mechanism, the automatic feeding of various types of chips can be achieved using a feeding turntable, laying the foundation for the automatic mounting of various types of chips on the same substrate;

[0025] 2) By setting up a nozzle storage library, a variety of chip nozzle structures are provided, which provides the basis for high-precision placement of different types of chips;

[0026] 3) Based on the rotary chip feeding mechanism and nozzle storage, a placement mechanism with replaceable chip nozzles is set up to realize the automatic replacement of chip nozzles. This enables the placement equipment to complete the automatic placement of all different types of chips on the substrate on one machine, which greatly improves the placement efficiency of different types of chip substrates.

[0027] 4) Both the chip feeding mechanism and the substrate platform transfer mechanism are equipped with XY axis transfer modules. Before the chip is picked up, the planar position of the chip is adjusted so that the chip nozzle can completely cover the chip on the blue film. The XY axis transfer module in the substrate platform transfer mechanism can automatically transfer each chip area to be mounted on the substrate to the set position, eliminating the need for planar position adjustment of the mounting head and improving mounting efficiency.

[0028] 5) By setting up a chip calibration mechanism, the placement head picks up the chip and places it on the calibration mechanism. The calibration mechanism adjusts the chip to the angle state required for placement on the substrate, achieving a primary adjustment of the chip angle and eliminating the need for significant adjustments to the chip placement angle during chip placement by the placement head. In addition, during chip placement, a vision camera collects the angle position information of the chip on the chip nozzle. The chip nozzle is rotated to make precise fine adjustments to the chip angle position, achieving a secondary fine adjustment of the chip angle. This ensures the accuracy of chip placement while improving the efficiency of chip placement.

[0029] 6) Through the optimized design of the placement head structure in the placement mechanism, a vertically connected air chamber is set on the nozzle mounting base. A transparent top cover is set on the top of the air chamber and a chip nozzle is set at the bottom of the air chamber, so as to form a vertically unobstructed observation channel inside the placement head. With the help of a vision camera, the position information of the chip on the chip nozzle is detected in real time through the observation channel. With the fine adjustment of the placement head, the chip placement angle can be precisely adjusted, eliminating the placement error caused by the transfer error of the mechanism and the deviation between multiple vision cameras. This ensures the placement accuracy of submicron-level chips and meets the requirements of high-precision placement. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of the chip feeding mechanism in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the structure of the calibration mechanism and the nozzle storage container in an embodiment of the present invention;

[0033] Figure 4 This is a schematic diagram of the mounting mechanism in an embodiment of the present invention;

[0034] Figure 5 This is a schematic diagram of the mounting head structure in an embodiment of the present invention;

[0035] Figure 6 This is a schematic cross-sectional view of the mounting head in an embodiment of the present invention;

[0036] Figure 7 This is a schematic diagram of the chip structure in an embodiment of the present invention;

[0037] Figure 8 This is a schematic diagram of the platform transfer mechanism in an embodiment of the present invention;

[0038] The attached figures are labeled as follows:

[0039] 100-Fully automated mixed placement equipment for multiple chip types;

[0040] 200 - Chip, 201 - Location marker;

[0041] 1-Chip feeding mechanism, 11-First XY axis transfer module, 12-First support plate, 13-Feeding turntable, 14-Material tray;

[0042] 2-Correction mechanism, 21-Third motor, 22-Adsorption seat;

[0043] 3-Platform transfer mechanism; 31-Second XY axis transfer module; 32-Connecting platform module;

[0044] 4-Substrate feeding mechanism;

[0045] 5-Placement mechanism, 51-X-axis transfer module, 52-Second support plate, 53-Z-axis transfer module, 54-Third support plate, 55-Second motor, 56-Placement head, 561-Connecting seat, 562-Nozzle mounting seat, 5621-Air chamber, 5622-Adsorption surface, 563-Chip nozzle, 5631-Adsorption channel, 564-Transparent top cover;

[0046] 6-X-axis crossbeam; 7-vision camera; 8-nozzle storage container; 81-support base; 82-carrying slot; 83-Y-axis transfer module; 84-fourth support plate. Detailed Implementation

[0047] Please refer to Figures 1-8 This embodiment is a fully automated mixed placement equipment 100 for multiple types of chips, which includes a feeding station, a calibration station and a placement station arranged in parallel, a chip feeding mechanism 1 set at the feeding station, a calibration mechanism 2 set at the calibration station, a platform transfer mechanism 3 set at the placement station, a substrate feeding mechanism 4 that automatically supplies substrates to the platform transfer mechanism 3, and a placement mechanism 5. The placement mechanism 5 is horizontally movably set on an X-axis beam 6 and its transfer range covers the feeding station, the calibration station and the placement station; a vision camera 7 is set above each of the feeding station, the calibration station and the placement station.

[0048] In the same substrate, there are often chips of different types, sizes, or shapes that need to be mounted. Each type of chip may also need to be mounted multiple times. For chips with very small size, the mounting accuracy requirements are high. The nozzles for chips of different shapes and sizes also need to be specially designed to meet the stable and accurate adsorption, picking up and mounting. Therefore, in order to meet the high-efficiency chip mounting requirements of such substrate products, this embodiment has optimized the structure of the chip feeding mechanism 1 and added a nozzle storage storage 8.

[0049] Specifically, in this embodiment, the chip feeding mechanism 1 includes a first XY-axis transfer module 11, a first support plate 12 driven by the first XY-axis transfer module 11 to move horizontally, a first motor (not shown in the figure) fixed on the first support plate 12, a feeding turntable 13 driven by the first motor to rotate around the Z-axis, and several trays 14 arranged in a ring on the feeding turntable 13. The trays 14 are used to carry wafers. By using the feeding turntable 13, various types and shapes of chips are fed. When a certain type of chip needs to be mounted, the feeding turntable 13 rotates the tray 14 carrying that type of chip to below the vision camera 7, and then the mounting mechanism 5 picks up the chip. When the position of the chip wafer on the tray 14 is deviated, the position of the chip wafer as a whole can be adjusted by the first XY-axis transfer module 11 to meet the picking requirements.

[0050] Secondly, the nozzle storage container 8 is located below the transfer range of the placement mechanism 5, and includes a support base 81 with several carrier slots 82 for carrying chip nozzles. The nozzle storage container 8 works in conjunction with the placement mechanism 5 to achieve automatic replacement of chip nozzles, thus making it suitable for the adsorption and placement of chips of various sizes and shapes.

[0051] The chip size in this embodiment is very small, at the submicron level, and the precision requirements for its mounting are also very high. Therefore, the mounting mechanism 5 only has long-distance transfer in the X-axis direction and does not have transfer function in the Y-axis direction. In order to shorten the overall size of the mounting equipment in the X-axis direction, the nozzle storage container 8 in this embodiment also includes a Y-axis transfer module 83 that drives the support base 81 to move horizontally along the Y-axis, and multiple bearing slots 82 are provided in the Y-axis direction.

[0052] To improve the accuracy of chip nozzle replacement, this embodiment places the nozzle storage unit 8 at the calibration station, sharing a vision camera 7 with the calibration mechanism 2. The calibration mechanism 2 and the support base 81 are mounted together on a fourth support plate 84, and are driven by the Y-axis transfer module 83 to move horizontally synchronously.

[0053] In another embodiment, the support base 81 in the nozzle storage container 8 can also be fixedly installed, wherein the carrier slots 82 are arranged along the X-axis below the transfer path of the mounting mechanism 5, and various different chip nozzles can be replaced by moving the mounting mechanism 5 along the X-axis.

[0054] The mounting mechanism 5 includes an X-axis transfer module 51, a second support plate 52 driven by the X-axis transfer module 51 to move along the X-axis, a Z-axis transfer module 53 fixed on the second support plate 52, a third support plate 54 driven by the Z-axis transfer module 53 to move along the Z-axis, a second motor 55 disposed on the third support plate 54, and a mounting head 56 driven by the second motor 55 to rotate around the Z-axis.

[0055] A wafer is composed of several individual chips arranged in an array. When the wafer arrives, it is placed on the material tray 14. After the placement mechanism 5 moves to the material supply station, it adjusts its position and works with the second motor 55 to drive the placement head 56 to rotate so that the placement head 56 can pick up all the chips in the wafer.

[0056] The calibration mechanism 2 includes a third motor 21 and an adsorption seat 22 driven by the third motor 21 to rotate around the Z-axis.

[0057] Since the placement head 56 in the placement mechanism 5 covers all the chips on the wafer by rotating, there will be a certain angle difference when the chips are attracted to the placement head 56. This angle difference can be addressed by setting an upward-facing vision camera to take pictures of the chips on the placement head 56, and then using the second motor 55 to rotate and adjust the chips to the set placement angle before placing them onto the substrate. However, if the upward-facing vision camera is used to directly adjust the chip angle by rotating the placement head 56, the chip center will not coincide with the chip nozzle center. During placement, fine-tuning the chip position will be more complicated, greatly increasing the programming difficulty of the control system and reducing the response speed of the control system, which is not conducive to improving placement efficiency.

[0058] In this embodiment, the horizontal angle of the chip is adjusted by the calibration mechanism 2 in conjunction with the vision camera 7 at the calibration station, and adjusted to be consistent with the angle and posture of the chip being mounted on the substrate. At the same time, the vision camera 7 can also capture the center point and the surrounding contour position of the chip. When the mounting head 56 comes to pick up the chip, it can pick up the chip at the set relative position, thereby ensuring that the chip is in a uniform position on the mounting head 56 relative to the chip nozzle before mounting, that is, the center point of the chip coincides with the center point of the chip nozzle. This makes the control accuracy of the chip position more accurate and reliable when the mounting head 56 makes fine-tuning of the angle, and simplifies the coordinate calculation program inside the control system, improves the response speed of the control system, and thus improves the chip mounting efficiency.

[0059] The platform transfer mechanism 3 is used to carry and fix the substrate. Working in conjunction with the vision camera 7 above the mounting station, it moves each position on the substrate to be mounted to a predetermined uniform position so that the mounting mechanism 5 can perform the mounting operation. The platform transfer mechanism 3 includes a second XY-axis transfer module 31 and a connecting platform module 32 located at the movable end of the second XY-axis transfer module 31. The connecting platform module 32 is used to connect the substrate in the substrate feeding mechanism 4, and the second XY-axis transfer module 31 is used to drive the connecting platform module 32 to perform planar transfer, thereby causing the substrate to move in a planar position.

[0060] In this embodiment, the substrate feeding mechanism 4 adopts a drawer-type hopper structure, and its specific structure can be referred to the feeding mechanism disclosed in patent publication number CN114980554A.

[0061] Although the chip angle is adjusted by the calibration mechanism 2, and the vision camera 7 provides accurate position data for the placement head 56 to pick up the chip, due to the inherent errors in the linear and rotary drive mechanisms, the center point of the chip may still deviate from the center point of the chip nozzle after it is picked up by the chip nozzle on the placement head 56. To meet the high-precision chip placement requirements, this embodiment uses the vision camera 7 to monitor the chip placement process throughout and track the chip's position on the chip nozzle, allowing for precise fine-tuning of the chip angle and accurate placement onto the substrate. This embodiment also improves the structure of the placement head 56 so that the vision camera 7 can detect the angular position of the chip on the chip nozzle. Specifically, the mounting head 56 includes a connector 561, a nozzle mounting base 562, and a chip nozzle 563. The connector 561 is fixed around the rotating shaft of the second motor 55. The nozzle mounting base 562 has an air chamber 5621 and an adsorption surface 5622 at the bottom. The central axis of the air chamber 5621 is parallel and offset from the rotating shaft of the second motor 55. The air chamber 5621 has a top end A and a bottom end B that are vertically connected. The top end A is sealed and covered by a transparent top cover 564. The bottom end B is an open structure that extends downward to the adsorption surface 5622. The chip nozzle 563 is adsorbed and assembled on the adsorption surface 5622 to achieve connection with the nozzle mounting base 562. The chip suction nozzle 563 is provided with an adsorption channel 5631 that communicates with the air cavity 5621. The central axis of the adsorption channel 5631 is collinear with the central axis of the air cavity 5621, so that the adsorption channel 5631 and the air cavity 5621 together form an observation channel for the vision camera 7 to observe the angle of the chip.

[0062] The nozzle mounting base 562 is equipped with two air passages. One passage is connected to the air chamber 5621 for adsorbing the chip, and the other passage is connected to the adsorption surface 5622 for adsorbing the chip nozzle 563, so as to realize the automatic replacement of the chip nozzle 563.

[0063] In this embodiment, a cross-shaped position mark 201 is provided at the center of the chip 200. During mounting, the vision camera 7 first acquires the chip position to be mounted on the substrate, and then the chip suction nozzle 563 picks up the chip and moves it under the vision camera 7. The vision camera 7 detects the position mark 201 on the chip 200 through the transparent top cover 564 and the observation channel. If the angle position of the chip 200 is not deviated from the set position, the mounting head 56 performs the mounting action. If the angle position of the chip 200 deviates from the set position, the second motor 55 fine-tunes the chip angle to the set position. The fine-tuning process is monitored throughout by the vision camera 7. After the adjustment is completed, the mounting action is performed, thereby achieving high-precision chip mounting.

[0064] This embodiment also provides a mounting method based on a fully automated hybrid mounting equipment for multiple chip types, which includes the following steps:

[0065] S1. Place the chip wafer to be mounted on the chip feeding mechanism 1;

[0066] S2. The mounting mechanism 5 moves above the nozzle storage box 8 and automatically assembles the corresponding chip nozzle 563 according to the type of chip to be mounted.

[0067] S3. The chip feeding mechanism 1 rotates the chip wafer to be mounted to a set position. The vision camera 7 located above the feeding station takes a picture of the entire chip wafer to obtain the position information of each chip. The mounting mechanism 5 moves above the chip wafer and adsorbs the chips in a set order.

[0068] S4. The mounting head 56 on the mounting mechanism 5 picks up the chip and moves it above the calibration station, and places the chip on the adsorption seat 22 in the calibration mechanism 2. Under the rotation drive of the third motor 21, the chip is adjusted to the angle state when it is mounted on the substrate in conjunction with the vision camera 7 above the calibration station.

[0069] S5. During the execution of S1~S4, the substrate to be mounted is moved to the mounting station, and under the driving action of the second XY axis transfer module 31, the mounting position of the chip to be mounted on the substrate is adjusted to the set position. At the same time, the vision camera 7 located above the mounting station acquires the precise position information of the mounting position.

[0070] S6. The placement mechanism 5 picks up the chip with the adjusted angle from the suction holder 22, and then moves it above the placement position. The vision camera 7 located above the placement station detects the chip's angle position again through the observation channel on the placement head 56. If the angle is correct, the placement head 56 places the chip on the placement position. If the angle is incorrect, the second motor in the placement mechanism 5 drives the placement head 56 to rotate slightly to fine-tune the chip's angle, and then the placement action is performed to complete the chip placement. For the next chip placement, if the chip nozzle 563 needs to be replaced, steps S2 to S6 are repeated; if the chip nozzle 563 does not need to be replaced, steps S3 to S6 are repeated until all chips are placed on the substrate.

[0071] The above descriptions are merely some embodiments of the present invention. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of the present invention, and all such modifications and improvements fall within the scope of protection of the present invention.

Claims

1. A fully automated mixed placement equipment for multiple types of chips, characterized in that: It includes a feeding station, a calibration station, and a placement station arranged in parallel; a chip feeding mechanism located at the feeding station; a calibration mechanism located at the calibration station; a platform transfer mechanism located at the placement station; a substrate feeding mechanism that automatically supplies substrates to the platform transfer mechanism; and a placement mechanism. The placement mechanism is horizontally movably mounted on an X-axis beam, and its transfer range covers the feeding station, the calibration station, and the placement station. A vision camera is located above each of the feeding station, the calibration station, and the placement station. A nozzle storage container is located below the transfer range of the placement mechanism. The placement mechanism includes an X-axis transfer module mounted on the X-axis beam; a second support plate that moves along the X-axis driven by the X-axis transfer module; a Z-axis transfer module fixed on the second support plate; and a Z-axis transfer module that moves along the Z-axis driven by the Z-axis transfer module. A third support plate, a second motor mounted on the third support plate, and a placement head driven by the second motor to rotate around the Z-axis; the placement head includes a connecting seat, a nozzle mounting seat, and a chip nozzle. The connecting seat is fixedly mounted around the rotation shaft of the second motor. The nozzle mounting seat has an air cavity and an adsorption surface at the bottom. The central axis of the air cavity is parallel and offset from the rotation shaft of the second motor. The air cavity has a top and a bottom that extend vertically. The top is sealed with a transparent top cover, and the bottom is an open structure that extends downward to the adsorption surface. The chip nozzle is adsorbed and assembled on the adsorption surface. The chip nozzle has an adsorption channel communicating with the air cavity. The central axis of the adsorption channel is collinear with the central axis of the air cavity, so that the adsorption channel and the air cavity together form an observation channel for the visual camera to observe the chip angle.

2. The fully automated mixed placement equipment for multiple chip types as described in claim 1, characterized in that: The chip feeding mechanism includes a first XY-axis transfer module, a first support plate driven by the first XY-axis transfer module to move horizontally, a first motor fixed on the first support plate, a feeding turntable driven by the first motor to rotate around the Z-axis, and a plurality of material trays distributed in a ring on the feeding turntable.

3. The fully automated mixed placement equipment for multiple chip types as described in claim 1, characterized in that: The nozzle storage container includes a support base, on which a plurality of carrier slots for carrying chip nozzles are provided, and chip nozzles are placed on the carrier slots.

4. The fully automated mixed placement equipment for multiple chip types as described in claim 3, characterized in that: The nozzle storage unit also includes a Y-axis transfer module and a fourth support plate that is driven by the Y-axis transfer module to move horizontally along the Y-axis. The support base and the correction mechanism are mounted on the fourth support plate and share a vision camera.

5. The fully automated mixed placement equipment for multiple chip types as described in claim 1, characterized in that: The correction mechanism includes a third motor and an adsorption seat that is driven by the third motor to rotate around the Z-axis.

6. The fully automated mixed placement equipment for multiple chip types as described in claim 1, characterized in that: The platform transfer mechanism includes a second XY-axis transfer module and a docking platform module disposed at the movable end of the second XY-axis transfer module.

7. The fully automated mixed placement equipment for multiple types of chips as described in claim 1, characterized in that: The nozzle mounting base is provided with two air paths, one of which is connected to the air chamber for adsorbing the chip, and the other is connected to the adsorption surface for adsorbing the chip nozzle, so as to realize the automatic replacement of the chip nozzle.

8. A mounting method based on the fully automated mixed mounting equipment for multiple chip types as described in claim 1, comprising the following steps: S1. Place the chip wafer to be mounted on the chip feeding mechanism; S2. The mounting mechanism moves above the nozzle storage container and automatically assembles the corresponding chip nozzle according to the type of chip to be mounted. S3. The chip feeding mechanism rotates the chip wafer to be mounted to a set position. The vision camera located above the feeding station takes a picture of the entire chip wafer to obtain the position information of each chip. The mounting mechanism moves above the chip wafer and picks up the chips in a set order. S4. The mounting mechanism adsorbs the chip and moves it above the calibration station, and places the chip on the calibration mechanism. The vision camera above the calibration station adjusts the chip to the angle state required for mounting on the substrate. S5. During the execution of S1~S4, the substrate to be mounted is moved to the mounting station, and the mounting position of the chip to be mounted on the substrate is adjusted to the set position. The vision camera located above the mounting station acquires the precise position information of the mounting position. S6. The mounting mechanism picks up the chip with the adjusted angle and moves it above the mounting position. The vision camera above the mounting station detects the angle position of the chip again through the observation channel on the mounting mechanism. If there is no angle deviation, the chip is mounted on the mounting position. If there is an angle deviation, the chip nozzle is driven by the motor in the mounting mechanism to rotate and the chip angle is finely adjusted. Then the chip mounting action is performed to complete the chip mounting.

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