Display panel and manufacturing method thereof
By adjusting the distance between subpixels and the encapsulation layer and optimizing the thickness of the light-transmitting area of the filter layer in the OLED display panel, the problem of uneven light emission efficiency of subpixels of different colors was solved, achieving a display panel design with high efficiency, low cost and long lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2023-03-27
- Publication Date
- 2026-07-03
AI Technical Summary
In existing OLED display technology, the luminous intensity of different color subpixels is uneven, resulting in uneven light output efficiency, which affects the display effect. Furthermore, existing equalization methods have problems such as short lifespan, high cost, and complex processes.
By setting different distances from the encapsulation layer to the side away from the substrate for subpixels of different colors in the OLED display panel, the length of the light emission path is adjusted. Combined with the design of the filter layer and the light transmission layer, the thickness of the light emission path and the light transmission area are optimized to balance the light emission efficiency of subpixels of different colors.
It achieves a balance in light extraction efficiency for sub-pixels of different colors, extends service life, improves resolution, reduces costs, simplifies the process, and reduces lateral current drift and crosstalk.
Smart Images

Figure CN116169149B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the same. Background Technology
[0002] In OLED (Organic Light-Emitting Diode) display technology, the current colorization method mainly uses the light-emitting structure of different color sub-pixels. However, due to the limitations of the development of organic materials themselves, the light emission intensity of different color sub-pixels is different under the same current load, resulting in uneven light emission efficiency, which will affect the display effect.
[0003] The methods for balancing the light output efficiency of sub-pixels in related technologies have drawbacks such as low lifespan, low pixel density, high cost, and complex processes. Therefore, there is an urgent need for a display panel structure that can simply and efficiently balance the light output efficiency of sub-pixels. Summary of the Invention
[0004] In view of this, the purpose of this application is to provide a display panel and a method for manufacturing the same.
[0005] In a first aspect, this application provides a display panel comprising: a substrate having a plurality of pixel units, wherein an encapsulation layer is provided on the side of the pixel units away from the substrate, and each pixel unit includes sub-pixels of multiple colors, wherein the distances of the sub-pixels of different colors from the encapsulation layer on the side away from the substrate are different.
[0006] In some embodiments, the distance from any of the sub-pixels to the side of the encapsulation layer away from the substrate is positively correlated with the luminous intensity of the sub-pixel.
[0007] In some embodiments, the encapsulation layer has a filter layer and a light-transmitting layer on the side away from the substrate. The filter layer includes color resist blocks of different colors that are arranged one-to-one with the sub-pixels. The light-transmitting layer has a first light-transmitting area of different thickness corresponding to the different color resist blocks. The area in the light-transmitting layer outside the first light-transmitting area is a second light-transmitting area. The refractive index of the first light-transmitting area is greater than the refractive index of the second light-transmitting area.
[0008] In some embodiments, the thickness of the first light-transmitting region corresponding to any of the color resist blocks is negatively correlated with the luminous intensity of the sub-pixel corresponding to the color resist block.
[0009] In some embodiments, the thickness of the first light-transmitting area corresponding to the sub-pixel with the highest luminous intensity is 0; and / or, the thickness of the first light-transmitting area corresponding to the sub-pixel with the lowest luminous intensity is equal to the thickness of the light-transmitting layer.
[0010] In some embodiments, the filter layer includes at least one filter sublayer, and each filter sublayer includes at least one color resist block corresponding to the sub-pixel.
[0011] In some embodiments, each of the filter sublayers includes only one type of color resist block corresponding to the sub-pixel; the distance from each filter sublayer to the side of the encapsulation layer away from the substrate is positively correlated with the luminous intensity of the corresponding sub-pixel.
[0012] In some embodiments, the substrate is a non-subpixel area outside the subpixel, and the filter layer is provided with a non-transparent area corresponding to the non-subpixel area; the non-transparent area is a black matrix; or, the non-subpixel area corresponds to the non-transparent area of at least two layers of the filter sublayer, and the non-transparent area of each layer of the filter sublayer has the same color as the subpixel corresponding to the color resist block of that layer.
[0013] In some implementations, the area of any of the sub-pixels is negatively correlated with the luminous intensity of the sub-pixel, and the sub-pixels with lower luminous intensity are arranged around the sub-pixels with higher luminous intensity.
[0014] A second aspect of this application provides a method for manufacturing a display panel as described in any of the preceding claims, comprising: depositing a planarization layer on a substrate; forming carrier structures of different heights on the side of the planarization layer away from the substrate by a patterning process; depositing sub-pixels of different colors on the different carrier structures; and depositing an encapsulation layer on the side of the plurality of sub-pixels away from the substrate, such that the distance from the sub-pixels of different colors to the side of the encapsulation layer away from the substrate is different.
[0015] As can be seen from the above description, this application provides a display panel and its manufacturing method. The substrate is provided with multiple pixel units, and an encapsulation layer is provided on the side of the pixel unit away from the substrate. Each pixel unit includes sub-pixels of multiple colors. By setting different distances from the sub-pixels of different colors to the side of the encapsulation layer away from the substrate, the light emission path length corresponding to the sub-pixels of different colors can be changed. The longer the light emission path, the greater the light loss and the lower the corresponding light emission efficiency. Thus, by adjusting different light emission path lengths, the light emission efficiency of different sub-pixels can be balanced. Changing the light emission path length of different sub-pixels, compared to changing the load current of different sub-pixels, does not accelerate the aging of sub-pixels and has a longer service life. Compared to changing the area ratio between different sub-pixels, this method does not reduce pixel density and ensures the display panel resolution. Changing the light path length of different sub-pixels, compared to changing the volume of the light-emitting material in different sub-pixels, does not increase the amount of light-emitting material used, resulting in lower cost and simpler process. Furthermore, because the distance from different colored sub-pixels to the side of the encapsulation layer furthest from the substrate is different, it effectively increases the vertical distance between sub-pixels, which can effectively reduce lateral current drift and improve crosstalk compared to setting sub-pixels in the same layer. This display panel and its manufacturing method have a simple structure, are easy to manufacture, and have low cost. They can effectively balance the light emission efficiency of different colored sub-pixels, improve display effect, have a long service life, high resolution, and improve the overall product performance. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 This is a schematic diagram of the cross-sectional structure of the first type of display panel in the embodiments of this application;
[0018] Figure 2 This is a schematic diagram of the cross-sectional structure of the second type of display panel in the embodiments of this application;
[0019] Figure 3 This is a schematic diagram of the cross-sectional structure of the third type of display panel in the embodiments of this application;
[0020] Figure 4 This is a schematic diagram of the cross-sectional structure of the fourth type of display panel in the embodiments of this application;
[0021] Figure 5 This is a top view of the structure of the first type of pixel unit in the embodiments of this application;
[0022] Figure 6 for Figure 5 A schematic diagram of the arrangement of the middle pixel units;
[0023] Figure 7 This is a top view of the structure of the second type of pixel unit in the embodiments of this application;
[0024] Figure 8 for Figure 7 A schematic diagram of the arrangement of the middle pixel units;
[0025] Figure 9 This is a top view of the third type of pixel unit in the embodiments of this application;
[0026] Figure 10 for Figure 9 A schematic diagram of the arrangement of the middle pixel units;
[0027] Figure 11 This is a top view of the fourth type of pixel unit in the embodiments of this application;
[0028] Figure 12 for Figure 11 A schematic diagram of the arrangement of the middle pixel units.
[0029] Reference numerals: 1. Substrate; 2. Pixel unit; 2-1. Sub-pixel; 3. Encapsulation layer; 4. Filter layer; 4-1. Filter sub-layer; 4-2. Color resist block; 5. Transparent layer; 5-1. Slot; 5-2. First transparent area; 5-3. Second transparent area; 6. Non-sub-pixel area; 7. Non-transparent area; 8. Planarization layer; 8-1. Support structure; 9. First gate insulating layer; 10. Active layer; 11. Second gate insulating layer; 12. Gate; 13. Interlayer dielectric layer; 14. Source / drain electrode; 15. Via; 16. Anode; 17. Light-emitting functional layer; 18. Protective layer; 19. Cover plate. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.
[0031] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0032] OLED (Organic Light-Emitting Diode) display technology has many advantages, such as self-illumination, fast response time, wide viewing angle, low cost, simple manufacturing process, high resolution and high brightness, and has been widely used.
[0033] In OLED display technology, the current colorization method mainly adopts the light-emitting structure of different color sub-pixels. This structure is an organic electroluminescent structure formed by chemical vapor deposition of organic materials on the corresponding positions of the substrate through a high-precision mask. It has high brightness and stable technology. However, due to the limitations of the development of organic materials themselves, the light emission intensity of different color sub-pixels is different under the same current load. For example, when using red, green and blue sub-pixels, the light emission intensity of green sub-pixels is usually greater than that of red sub-pixels, which is greater than that of blue sub-pixels. This leads to an uneven light emission efficiency, which will affect the display effect.
[0034] In related technologies, there are three main methods for balancing the light emission efficiency of sub-pixels. One method involves changing the load current of different sub-pixels, such as increasing the load current of a sub-pixel with low luminous intensity to increase its luminous intensity and thus balance the light emission efficiency. However, increasing the load current accelerates sub-pixel aging and reduces its lifespan. Another method involves changing the area ratio between different sub-pixels, such as increasing the area of a sub-pixel with low luminous intensity to increase its light emission and thus balance the light emission efficiency. However, increasing the area reduces the pixel density and resolution of the device, and simply increasing the area ratio also degrades the display effect. Yet another method involves changing the volume of the light-emitting material of different sub-pixels, such as increasing the volume of the light-emitting material of a sub-pixel with low luminous intensity to increase its light emission and thus balance the light emission efficiency. While this method does not reduce pixel density, it increases the cost of the light-emitting material and makes the manufacturing process more difficult. Therefore, there is an urgent need for a display panel structure that can simply and efficiently balance the light emission efficiency of sub-pixels.
[0035] The following describes specific embodiments in conjunction with... Figures 1 to 12 The technical solution of this application will be described in detail below.
[0036] Some embodiments of this application provide a display panel, such as Figures 1 to 4 As shown, the system includes a substrate 1, which has a plurality of pixel units 2. Each pixel unit 2 has an encapsulation layer 3 (EN, Encap) on the side away from the substrate 1. Each pixel unit 2 includes sub-pixels 2-1 of various colors. The distances of the sub-pixels 2-1 of different colors from the side of the encapsulation layer 3 away from the substrate 1 are different.
[0037] like Figures 1 to 4 As shown, a planarization layer 8 (PLN) is provided on the substrate 1. On the side of the planarization layer 8 away from the substrate 1, sub-pixels 2-1 of different heights are provided for different colors. For example, in the figure, sub-pixel B 2-1 is blue sub-pixel 2-1, sub-pixel R 2-1 is red sub-pixel 2-1, and sub-pixel G 2-1 is green sub-pixel 2-1. The sub-pixels 2-1 of the three colors have different heights. An encapsulation layer 3 is provided on the side of the three sub-pixels 2-1 away from the substrate 1. This makes the distance from the sub-pixels 2-1 of different colors to the side of the encapsulation layer 3 away from the substrate 1 different.
[0038] By setting different distances from the side of the encapsulation layer 3 away from the substrate 1 to the sub-pixels 2-1 of different colors, the light emission path length corresponding to the sub-pixels 2-1 of different colors can be changed. The longer the light emission path, the greater the loss of light emission and the lower the light emission efficiency. In this way, by adjusting different light emission path lengths, the light emission efficiency of different sub-pixels 2-1 can be balanced. Furthermore, because the distances from the side of the encapsulation layer 3 away from the substrate 1 to the sub-pixels 2-1 of different colors are different, it is equivalent to increasing the vertical distance between the sub-pixels 2-1. Compared with setting the sub-pixels 2-1 in the same layer, this can effectively reduce the lateral current drift and improve the crosstalk problem.
[0039] Changing the light path length of different sub-pixels 2-1, compared to changing the load current of different sub-pixels 2-1, does not accelerate the aging of sub-pixels 2-1, resulting in a longer lifespan; changing the light path length of different sub-pixels 2-1, compared to changing the area ratio between different sub-pixels 2-1, does not reduce pixel density, ensuring the resolution of the display panel; changing the light path length of different sub-pixels 2-1, compared to changing the volume of the light-emitting material of different sub-pixels 2-1, does not increase the amount of light-emitting material used, resulting in lower cost and simpler process.
[0040] This display panel has a simple structure, is easy to manufacture, and has low cost. It can effectively balance the light output efficiency of different color sub-pixels 2-1, improve the display effect, has a long service life, high resolution, and improves the overall performance of the product.
[0041] In some embodiments, such as Figures 1 to 4 As shown, the distance from any of the sub-pixels 2-1 to the side of the encapsulation layer 3 away from the substrate 1 is positively correlated with the luminous intensity of the sub-pixel 2-1.
[0042] The distance from any sub-pixel 2-1 to the side of the encapsulation layer 3 away from the substrate 1 is positively correlated with the luminous intensity of the sub-pixel 2-1. That is, the higher the luminous intensity of the sub-pixel 2-1, the longer the distance from the side of the encapsulation layer 3 away from the substrate 1.
[0043] Typically, the luminous intensity of green sub-pixel 2-1 is greater than that of red sub-pixel 2-1, which in turn is greater than that of blue sub-pixel 2-1. Figures 1 to 4As shown, the height of the green sub-pixel 2-1 is set to be less than the height of the red sub-pixel 2-1, which is less than the height of the blue sub-pixel 2-1. This makes the distance from the green sub-pixel 2-1 to the side of the encapsulation layer 3 away from the substrate 1 greater than the distance from the red sub-pixel 2-1 to the side of the encapsulation layer 3 away from the substrate 1, which is greater than the distance from the blue sub-pixel 2-1 to the side of the encapsulation layer 3 away from the substrate 1. In other words, the light path length of the green sub-pixel 2-1 is greater than the light path length of the red sub-pixel 2-1, which is greater than the light path length of the blue sub-pixel 2-1. The light intensity attenuation effect weakens in sequence, thereby making the light emission efficiency of the three color sub-pixels 2-1 more balanced. This also helps to reduce power consumption, extend pixel lifespan, make the pixel design more reasonable, and achieve higher resolution.
[0044] In some embodiments, the anode 16 (AND, Anode) of sub-pixel 2-1 is a reflective electrode. The reflective electrode reflects the light emitted by the light-emitting layer of sub-pixel 2-1, so that the reflected light is emitted from the encapsulation layer 3. By setting sub-pixels 2-1 at different heights as described above, the reflected light of sub-pixels 2-1 is also reflected at different heights. This changes the light path length of the reflected light of sub-pixels 2-1 of different colors. The longer the light path, the greater the loss of the reflected light output, which is equivalent to a decrease in reflectivity and a corresponding decrease in light output efficiency. This balances the light output efficiency of the reflected light of different sub-pixels 2-1.
[0045] The material of anode 16 may be, for example, Ti / Al / Ti / ITO, Ti / Ag / Ti / ITO, Ti / Al / Ti / SiOx / ITO, Ti / Ag / Ti / SiOx / ITO, or Ag, Mg, Al, Pt, Au, Cr, W, Mo, Ti, Pd, or alloys of these materials; no specific limitation is imposed.
[0046] In some embodiments, such as Figures 1 to 4 As shown, the encapsulation layer 3 has a color filter layer 4 (CF) and a light-transmitting layer 5 (OC) on the side away from the substrate 1. The color filter layer 4 includes color resist blocks 4-2 of different colors that are arranged one-to-one with the sub-pixels 2-1. The light-transmitting layer 5 has a first light-transmitting area 5-2 of different thicknesses corresponding to the different areas of the color resist blocks 4-2. The area in the light-transmitting layer 5 located outside the first light-transmitting area 5-2 is a second light-transmitting area 5-3. The refractive index of the first light-transmitting area 5-2 is greater than the refractive index of the second light-transmitting area 5-3.
[0047] The filter layer 4 is used to filter the light emitted by the light-emitting functional layer 17, thereby improving the color effect of the emitted light. The filter layer 4 includes color resist blocks 4-2 of different colors that are set one-to-one with the sub-pixels 2-1, such as... Figures 1 to 4As shown, color block 4-2 (B) is blue, color block 4-2 (R) is red, and color block 4-2 (G) is green. By using the light emitted from the three first color blocks 4-2, different colors can be mixed to achieve full color gamut display.
[0048] The material of the light-transmitting layer 5 is, for example, negative photoresist, and is not specifically limited. The light-transmitting layer 5 is used to form the first light-transmitting area 5-2 of different thicknesses, and can also serve to protect the encapsulation layer 3. Figure 1 As shown, the light-transmitting layer 5 can be disposed on the side of the filter layer 4 away from the substrate 1, such as... Figure 2 As shown, the light-transmitting layer 5 can also be disposed between the encapsulation layer 3 and the filter layer 4, and there is no specific limitation. The materials of the first light-transmitting area 5-2 and the second light-transmitting area 5-3 can be two negative photoresists with different refractive indices. The manufacturing process can first deposit a layer of the first light-transmitting layer material, and then form slots 5-1 of different depths on the light-transmitting layer 5 through a patterning process. The second light-transmitting layer material is deposited in the slots 5-1. In this way, the area inside the slots 5-1 forms the first light-transmitting area 5-2, and the area outside the slots 5-1 forms the second light-transmitting area 5-3.
[0049] For color resist blocks 4-2 of different colors, a first light-transmitting area 5-2 of different thicknesses is provided. The area of the light-transmitting layer 5 outside the first light-transmitting area 5-2 is the second light-transmitting area 5-3. In this way, the light-emitting paths of different sub-pixels 2-1 will pass through the first light-transmitting area 5-2 and the second light-transmitting area 5-3 of different lengths, such as... Figure 1 As shown by the dashed line, when light from sub-pixel 2-1 passes through the first light-transmitting area 5-2, because the refractive index of the first light-transmitting area 5-2 is greater than that of the second light-transmitting area 5-3, the light is more easily reflected at the boundary between the first light-transmitting area 5-2 and the second light-transmitting area 5-3, causing the light to converge and ensuring high light output and efficiency. However, when light from sub-pixel 2-1 passes through the second light-transmitting area 5-3, because there is no reflection boundary, the light is more diffused, reducing the light output and resulting in low light output efficiency. Thus, by adjusting the thickness of different first light-transmitting areas 5-2, the light output efficiency of different sub-pixels 2-1 can be balanced. Compared to changing the load current of different sub-pixels 2-1, this method does not accelerate the aging of sub-pixels 2-1, resulting in a longer lifespan. Compared to changing the area ratio between different sub-pixels 2-1, this method does not reduce pixel density, ensuring the resolution of the display panel. Compared to changing the volume of the light-emitting material of different sub-pixels 2-1, this method does not increase the amount of light-emitting material used, resulting in low cost and simple process.
[0050] In some embodiments, such as Figures 1 to 4 As shown, the thickness of the first light-transmitting area 5-2 corresponding to any of the color resist blocks 4-2 is negatively correlated with the luminous intensity of the sub-pixel 2-1 corresponding to the color resist block 4-2.
[0051] The thickness of the first light-transmitting area 5-2 corresponding to any color resist block 4-2 is negatively correlated with the luminous intensity of the sub-pixel 2-1 corresponding to that color resist block 4-2, that is, the higher the luminous intensity of the sub-pixel 2-1, the thinner the thickness of the first light-transmitting area 5-2.
[0052] like Figure 1 As shown, the thickness of the first light-transmitting area 5-2 corresponding to the green sub-pixel 2-1 is set to be less than the thickness of the first light-transmitting area 5-2 corresponding to the red sub-pixel 2-1, which is less than the thickness of the first light-transmitting area 5-2 corresponding to the blue sub-pixel 2-1. That is, the light reflection and convergence path length of the green sub-pixel 2-1 is less than the light reflection and convergence path length of the red sub-pixel 2-1, which is less than the light reflection and convergence path length of the blue sub-pixel 2-1. The light intensity attenuation effect weakens in sequence, thereby making the light output efficiency of the three color sub-pixels 2-1 more balanced, and also helping to reduce power consumption, extend pixel life, make the pixel design more reasonable, and achieve higher resolution.
[0053] In some embodiments, such as Figures 2 to 4 As shown, the thickness of the first light-transmitting area 5-2 corresponding to the sub-pixel 2-1 with the highest luminous intensity is 0; and / or, the thickness of the first light-transmitting area 5-2 corresponding to the sub-pixel 2-1 with the lowest luminous intensity is equal to the thickness of the light-transmitting layer 5.
[0054] like Figures 2 to 4 As shown, the green sub-pixel 2-1 has the highest luminous intensity. The thickness of the first light-transmitting area 5-2 corresponding to the green sub-pixel 2-1 is 0, so that the light from the green sub-pixel 2-1 will only pass through the second light-transmitting area 5-3 when passing through the light-transmitting layer 5. The light is the most diffused and the light output is the lowest. This design can simplify the process and omit the step of forming a slot 5-1 in the light-transmitting layer 5 and depositing the material of the first light-transmitting area 5-2 through a patterning process.
[0055] Similarly, such as Figures 2 to 4 As shown, the blue sub-pixel 2-1 has the lowest luminous intensity. The thickness of the first light-transmitting area 5-2 corresponding to the blue sub-pixel 2-1 is the same as the thickness of the light-transmitting layer 5. This ensures that the light from the blue sub-pixel 2-1 will only pass through the first light-transmitting area 5-2 when passing through the light-transmitting layer 5, resulting in the most concentrated light and the highest light output. This design facilitates the manufacturing process and reduces the difficulty of forming the slot 5-1.
[0056] In some embodiments, such as Figure 3 and Figure 4 As shown, the filter layer 4 includes at least one filter sub-layer 4-1, and each filter sub-layer 4-1 includes at least one color resist block 4-2 corresponding to the sub-pixel 2-1.
[0057] like Figure 3 and Figure 4As shown, the filter layer 4 contains three filter sub-layers 4-1. Each filter sub-layer 4-1 includes a color resist block 4-2 corresponding to a sub-pixel 2-1 of a certain color. This allows the color resist blocks 4-2 to be set in layers, providing a basis for meeting different filtering needs of users.
[0058] In some embodiments, such as Figure 3 and Figure 4 As shown, each filter sub-layer 4-1 includes only one type of color resist block 4-2 corresponding to the sub-pixel 2-1; the distance from each filter sub-layer 4-1 to the side of the encapsulation layer 3 away from the substrate 1 is positively correlated with the luminous intensity of the sub-pixel 2-1 corresponding to the color resist block 4-2 of the filter sub-layer 4-1.
[0059] The distance from each filter sublayer 4-1 to the side of the encapsulation layer 3 away from the substrate 1 is positively correlated with the luminous intensity of the corresponding sub-pixel 2-1. That is, the higher the luminous intensity of the sub-pixel 2-1, the longer the distance from the filter sublayer 4-1 to the side of the encapsulation layer 3 away from the substrate 1. In this way, after the material of the first light-transmitting area 5-2 is deposited into the slot 5-1 of the corresponding color resist block 4-2 away from the substrate 1, the thickness of the first light-transmitting area 5-2 can be negatively correlated with the luminous intensity of the sub-pixel 2-1 corresponding to the color resist block 4-2, and the overall height of the light-transmitting layer 5 is consistent, ensuring the flatness of the display panel. It can also make the light directly reflect and converge after passing through the color resist block 4-2, ensuring the light emission effect.
[0060] like Figure 3 and Figure 4 As shown, each filter sublayer 4-1 includes only one color resist block 4-2 corresponding to the sub-pixel 2-1 of a certain color. The height of the green resist block 4-2 is set to be greater than the height of the red resist block 4-2, which is greater than the height of the blue resist block 4-2. This makes the distance from the filter sublayer 4-1 containing the green resist block 4-2 to the side of the encapsulation layer 3 away from the substrate 1 greater than the distance from the filter sublayer 4-1 containing the red resist block 4-2 to the side of the encapsulation layer 3 away from the substrate 1, which is greater than the distance from the filter sublayer 4-1 containing the blue resist block 4-2 to the side of the encapsulation layer 3 away from the substrate 1. Therefore, the thickness of the first light-transmitting area 5-2 corresponding to the green sub-pixel 2-1 is less than the thickness of the first light-transmitting area 5-2 corresponding to the red sub-pixel 2-1, which is less than the thickness of the first light-transmitting area 5-2 corresponding to the blue sub-pixel 2-1, thereby making the light output efficiency of the three colors of sub-pixels 2-1 more balanced.
[0061] In some embodiments, such as Figures 1 to 4As shown, the area of the substrate 1 outside the sub-pixel 2-1 is the non-sub-pixel 2-1 area, and the filter layer 4 is provided with a non-transparent area 7 corresponding to the non-sub-pixel 2-1 area; the non-transparent area 7 is a black matrix (BM); or, the non-sub-pixel 2-1 area corresponds to the non-transparent area 7 of at least two layers of the filter sub-layer 4-1, and the non-transparent area 7 of each layer of the filter sub-layer 4-1 has the same color as the sub-pixel 2-1 corresponding to the color resist block 4-2 of that layer.
[0062] like Figure 2 and Figure 4 As shown in the figure, the solid line box is the non-subpixel 2-1 area, and the dashed line box is the corresponding non-transparent area 7. The non-transparent area 7 is used to block light, distinguish pixels, and avoid crosstalk.
[0063] like Figures 1 to 3 As shown, the non-transparent area 7 is, for example, a black matrix, such as... Figure 3 As shown, the non-subpixel 2-1 area corresponds to at least two layers of black matrix of filter sub-layer 4-1. Setting multiple layers of black matrix can further improve the light blocking effect and ensure the final display effect.
[0064] like Figure 4 As shown, the material of the non-transparent area 7 is the same as that of the color resist block 4-2. The non-sub-pixel 2-1 area corresponds to at least two layers of filter sub-layers 4-1 with non-transparent areas 7. The color of the non-transparent area 7 of each filter sub-layer 4-1 is the same as that of the sub-pixel 2-1 corresponding to the color resist block 4-2 of that layer. By setting at least two colors of non-transparent areas 7 to superimpose and block light, such as setting blue and green superimpose and block light, blue and red superimpose and block light, green and red superimpose and block light, blue, green and red superimpose and block light, etc., a similar light blocking effect can be achieved instead of the black matrix. In this way, when making the color resist block 4-2 in layers, the non-transparent area 7 can be made simultaneously, which greatly simplifies the process and saves black matrix material.
[0065] In some embodiments, such as Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, the area of any sub-pixel 2-1 is negatively correlated with the luminous intensity of that sub-pixel 2-1, and the sub-pixel 2-1 with lower luminous intensity is arranged around the sub-pixel 2-1 with higher luminous intensity.
[0066] The area of any sub-pixel 2-1 is negatively correlated with its luminous intensity; that is, the higher the luminous intensity, the smaller the area of the sub-pixel 2-1. Figure 5 , Figure 7 , Figure 9 and Figure 11As shown, the area of green sub-pixel 2-1 is set to be smaller than the area of red sub-pixel 2-1, which is smaller than the area of blue sub-pixel 2-1. This makes the light output of green sub-pixel 2-1 less than the light output of red sub-pixel 2-1, which is less than the light output of blue sub-pixel 2-1, thereby making the light output efficiency of the three color sub-pixels 2-1 more balanced.
[0067] The sub-pixel 2-1 with lower luminous intensity is positioned around the sub-pixel 2-1 with higher luminous intensity, such as... Figure 5 , Figure 7 , Figure 9 and Figure 11 As shown, the green sub-pixel 2-1 with the highest luminous intensity is a block sub-pixel 2-1 and is located in the center. The red sub-pixel 2-1 with the second highest luminous intensity is a ring sub-pixel 2-1 and is located around the green sub-pixel 2-1. The blue sub-pixel 2-1 with the lowest luminous intensity is a ring sub-pixel 2-1 and is located around the red sub-pixel 2-1. Because the blue sub-pixel 2-1 is located on the outside and has the largest radius, the reflective area on both sides of the first light-transmitting area 5-2 corresponding to the blue sub-pixel 2-1 is also larger, and the light intensity attenuation effect is the weakest. This makes the light output efficiency of the three color sub-pixels 2-1 more balanced.
[0068] The shape of the pixel unit 2 formed by the surrounding arrangement of sub-pixels 2-1 is, for example, a circle, a triangle, a rectangle, or a hexagon, etc., and is not specifically limited. The arrangement of the corresponding pixel unit 2 is as follows: Figure 6 , Figure 8 , Figure 10 and Figure 12 As shown, this allows for a more compact layout, higher space utilization, and improved resolution.
[0069] In some embodiments, such as Figure 3As shown, substrate 1 has a thin film field-effect transistor (TFT) deposited corresponding to sub-pixel 2-1. The TFT includes a first gate insulating layer 9 (GI1), a second gate insulating layer 11 (GI2), an inter-layer dielectric layer 13 (ILD), an active layer 10 (ACT), a gate 12, and source / drain electrodes 14 (SD). A planarization layer 8 is deposited on the side of the thin-film field-effect transistor away from the substrate 1. On the planarization layer 8, carrier structures 8-1 of different heights are formed corresponding to sub-pixels 2-1. Vias 15 of different heights are formed within the planarization layer 8. A light-emitting functional layer 17 (EL, Electro-Luminescence) is deposited on the side of the planarization layer 8 away from the substrate 1. The light-emitting functional layer 17 includes multiple color sub-pixels 2-1. The anode 16 of each sub-pixel 2-1 is connected to the source / drain electrode 14 of the corresponding thin-film field-effect transistor through the via 15. An encapsulation layer 3 is deposited on the side of the light-emitting functional layer 17 away from the substrate 1. A filter sub-layer 4-1 and a light-transmitting layer 5 are deposited on the side of the encapsulation layer 3 away from the substrate 1. The filter sub-layer 4-1 includes a non-transparent region 7 and a color resist block 4-2. The light-transmitting layer 5 includes a first light-transmitting region 5-2 and a second light-transmitting region 5-3. A protective layer 18 (OC3, overlay) is deposited on the side of the light-transmitting layer 5 away from the substrate 1. The coating can flatten the surface; a cover plate (CG, cover glass), such as a glass cover plate, is provided on the side of the protective layer 18 away from the substrate 1 to improve the protection.
[0070] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.
[0071] In the embodiments of this application, "film" and "layer" can be interchanged. For example, sometimes "conductive layer" can be replaced with "conductive film". Similarly, sometimes "insulating film" can be replaced with "insulating layer". The scale of the drawings in the embodiments of this application can be used as a reference in actual processes, but is not limited thereto. For example, the aspect ratio of the channel, the thickness and spacing of each film layer can be adjusted according to actual needs. The number of pixels in the display panel and the number of sub-pixels 2-1 in each pixel are not limited to the quantities shown in the figures. The drawings described in the embodiments of this application are only structural schematic diagrams, and one method in the embodiments of this application is not limited to the shapes or values shown in the drawings.
[0072] In the embodiments of this application, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined, but can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons, etc., and may have some small deformations due to tolerances, and may have chamfers, curved edges, and other deformations.
[0073] Furthermore, given that details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that embodiments of this application may be practiced without these details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.
[0074] In some embodiments of this application, a method for manufacturing a display panel as described in any of the preceding claims includes: depositing a planarization layer 8 on a substrate 1; forming carrier structures 8-1 of different heights on the side of the planarization layer 8 away from the substrate 1 using a patterning process; depositing sub-pixels 2-1 of different colors on the different carrier structures 8-1; and depositing an encapsulation layer 3 on the side of the plurality of sub-pixels 2-1 away from the substrate 1, so that the distance from the sub-pixels 2-1 of different colors to the side of the encapsulation layer 3 away from the substrate 1 is different.
[0075] The carrier structure 8-1 on the planarization layer 8 is, for example, a stepped structure, which facilitates setting carrier structures 8-1 of different heights to form sub-pixels 2-1 of different heights, so that the distance from sub-pixels 2-1 of different colors to the side of the encapsulation layer 3 away from the substrate 1 is different, so as to balance the light emission efficiency.
[0076] In some embodiments, the fabrication method further includes: depositing a light filter layer 4 on the side of the encapsulation layer 3 away from the substrate 1 using a patterning process; the light filter layer 4 includes color resist blocks 4-2 of different colors that are disposed one-to-one with the sub-pixels 2-1; depositing a first light-transmitting layer material on one side of the light filter layer 4 to form a light-transmitting layer 5; forming slots 5-1 of different depths on the light-transmitting layer 5 using a patterning process; depositing a second light-transmitting layer material in the slots 5-1; thus, the area inside the slots 5-1 forms a first light-transmitting area 5-2, and the area outside the slots 5-1 forms a second light-transmitting area 5-3; the refractive index of the first light-transmitting layer material is less than the refractive index of the second light-transmitting layer material.
[0077] Setting slots 5-1 of different depths facilitates the formation of first light-transmitting zones 5-2 of different thicknesses, thereby balancing light output efficiency.
[0078] In some embodiments, such as Figure 3 As shown, the fabrication method includes: depositing thin-film field-effect transistors (TFTs) corresponding to sub-pixels 2-1 on a substrate 1; depositing a planarization layer 8 on the side of the TFTs away from the substrate 1 using a multi-grayscale mask (MTM) process, wherein carrier structures 8-1 of different heights are formed on the planarization layer 8 corresponding to sub-pixels 2-1, and vias 15 of different heights are formed within the planarization layer 8; depositing a light-emitting functional layer 17 (EL) on the side of the planarization layer 8 away from the substrate 1, the light-emitting functional layer 17 including multiple sub-pixels 2-1, wherein the anode 16 of each sub-pixel 2-1 is connected to the source / drain electrode 14 of the corresponding TFT through the via 15; depositing an encapsulation layer 3 on the side of the light-emitting functional layer 17 away from the substrate 1; depositing a first black matrix on the side of the encapsulation layer 3 away from the substrate 1, the first black matrix retaining the light-emitting channels of all sub-pixels 2-1 through patterning process openings, and in its blue sub-pixels... A blue resist block 4-2 is deposited at the opening corresponding to pixel 2-1; a light-transmitting layer 5 is deposited on the side of the blue resist block 4-2 away from the substrate 1, and slots 5-1 of different depths are formed through multiple patterning processes; a second black matrix and a red resist block 4-2 are deposited in the slots 5-1 corresponding to the red sub-pixel 2-1; material of the first light-transmitting area 5-2 is deposited in all slots 5-1, and a third black matrix is deposited on the side of the first light-transmitting area 5-2 away from the substrate 1. The third black matrix retains the light-emitting channels of all sub-pixels 2-1 through the patterning process openings, and a green resist block 4-2 is deposited at the opening corresponding to its green sub-pixel 2-1; a protective layer 18 is deposited on the side of the green resist block 4-2 away from the substrate 1; a cover plate is provided on the side of the protective layer 18 away from the substrate 1.
[0079] The "patterning process" described in this application includes, for metallic, inorganic, or transparent conductive materials, processes such as photoresist coating, mask exposure, development, etching, and photoresist stripping; for organic materials, it includes processes such as organic material coating, mask exposure, and development. Deposition can be performed using any one or more of sputtering, evaporation, and chemical vapor deposition; coating can be performed using any one or more of spraying, spin coating, and inkjet printing; and etching can be performed using any one or more of dry and wet etching, without limitation.
[0080] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.
[0081] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, well-known power / ground connections to other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be illustrated in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application may be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.
[0082] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. The embodiments of this application are intended to cover all such substitutions, modifications, and variations falling within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.
Claims
1. A display panel, characterized in that, include: The substrate has multiple pixel units. An encapsulation layer is provided on the side of each pixel unit away from the substrate. Each pixel unit includes sub-pixels of various colors, with different distances from the encapsulation layer to the side away from the substrate for each color. A filter layer and a light-transmitting layer are provided on the side of the encapsulation layer away from the substrate. The filter layer includes color resist blocks of different colors, each corresponding to a sub-pixel. The light-transmitting layer has first light-transmitting areas of different thicknesses corresponding to different color resist blocks. A second light-transmitting area is located within the light-transmitting layer outside the first light-transmitting area. The refractive index of the first light-transmitting area is greater than that of the second light-transmitting area. The thickness of the first light-transmitting area corresponding to any color resist block is negatively correlated with the luminous intensity of the sub-pixel corresponding to that color resist block.
2. The display panel according to claim 1, characterized in that, The distance from any of the sub-pixels to the side of the encapsulation layer away from the substrate is positively correlated with the luminous intensity of the sub-pixel.
3. The display panel according to claim 1, characterized in that, The thickness of the first light-transmitting area corresponding to the sub-pixel with the highest luminous intensity is 0; And / or, the thickness of the first light-transmitting area corresponding to the sub-pixel with the lowest luminous intensity is equal to the thickness of the light-transmitting layer.
4. The display panel according to claim 1, characterized in that, The filter layer includes at least one filter sub-layer, and each filter sub-layer includes at least one color resist block corresponding to the sub-pixel.
5. The display panel according to claim 4, characterized in that, Each filter sublayer includes only one type of color resist block corresponding to the sub-pixel; the distance from each filter sublayer to the side of the encapsulation layer away from the substrate is positively correlated with the luminous intensity of the corresponding sub-pixel.
6. The display panel according to claim 4, characterized in that, The substrate is a non-sub-pixel area outside the sub-pixel area, and the filter layer is provided with a non-transparent area corresponding to the non-sub-pixel area. The non-transparent area is a black matrix; or, the non-sub-pixel area corresponds to the non-transparent area of at least two layers of the filter sub-layer, and the non-transparent area of each layer of the filter sub-layer has the same color as the sub-pixel corresponding to the color resist block of that layer.
7. The display panel according to claim 1, characterized in that, The area of any of the sub-pixels is negatively correlated with the luminous intensity of that sub-pixel, and the sub-pixels with lower luminous intensity are arranged around the sub-pixels with higher luminous intensity.
8. A method for manufacturing a display panel according to any one of claims 1-7, characterized in that, include: Deposit a planarization layer on the substrate; A bearing structure of different heights is formed on the side of the planar layer away from the substrate using a patterning process; Subpixels of different colors are deposited on different carrier structures, and an encapsulation layer is deposited on the side of the multiple subpixels away from the substrate, so that the distance from the subpixels of different colors to the encapsulation layer on the side away from the substrate is different.