A low power supply management circuit for dual mode communication
By designing a low-power power management circuit and utilizing the multi-functional power management chip U1 to control voltage conversion and power supply path, a disconnectable operating power supply is provided, solving the problems of high power consumption and insufficient power supply in the dual-mode communication module, and achieving continuous reliability of power supply and energy saving.
Patent Information
- Application Number
- CN202310217642.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-03-08
- Publication Date
- 2026-01-13
- Estimated Expiration
- 2043-03-08
AI Technical Summary
The existing dual-mode communication modules have high power consumption, resulting in insufficient power supply, which affects normal operation and contradicts the goal of energy saving and loss reduction.
Design a low-power power management circuit, including a power supply, a first-stage power supply voltage output adjustment circuit, a second-stage power supply voltage adjustment circuit, a 12V power switch circuit, and a 3.3V power switch circuit. The voltage conversion and power supply path are controlled by a multi-functional power management chip U1 to provide a disconnectable working power supply and to start a backup power supply circuit when the power supply is insufficient.
It effectively reduces the power consumption of the dual-mode communication module, improves the continuous reliability of power supply, solves the problem of insufficient power supply, and achieves the goal of energy saving and loss reduction.
Smart Images

Figure CN116169769B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of power supply circuit technology, and more specifically to a low-power power management circuit for dual-mode communication. Background Technology
[0002] Currently, driven by the need to enhance power grid distribution security and orderly electricity consumption management, and in line with the national dual-carbon strategy, power grid manufacturers are placing increasingly higher demands on power system communication and data acquisition equipment. This has led to increasingly complex equipment functions and higher power consumption. In power systems, power line broadband carrier communication (HPLC) is a unique and fundamental communication method. For low-voltage distribution networks, HPLC, based on the power line network for wired communication, significantly improves the availability and reliability of power line carrier communication, making this technology more promising. Utilizing low-voltage power lines to transmit user electricity consumption data for timely and effective collection, management, and statistics is currently recognized as the best solution both domestically and internationally. Whether it's the State Grid's power user electricity consumption information acquisition system or the Southern Power Grid's low-voltage centralized meter reading system, the last-mile communication technology primarily employs power line carrier communication. As power grid companies continue to expand their business, they are adding many new and in-depth application functions to the existing system capabilities.
[0003] In past practical applications, due to the diverse types of electrical appliances on power lines and the complex wiring in some power station areas, single-carrier communication has proven insufficient. When a power line is disconnected due to a fault, effective power outage reporting becomes impossible. Therefore, we have proposed a dual-mode communication scheme combining power line broadband carrier and low-power wireless communication. However, this increases the power consumption of the communication module. The existing power supply capacity for hundreds of millions of installed metering and intelligent production equipment is limited, and the upgrade poses a potential risk of insufficient power supply affecting normal operation. Furthermore, the increased power consumption of hundreds of millions of devices is substantial, which contradicts the goals of smart grid transformation and energy conservation. Summary of the Invention
[0004] To address the problems in existing technologies, this invention provides a low-power power management circuit for dual-mode communication. By setting up mutually cooperating power supplies, a first-stage power supply voltage output adjustment circuit, a second-stage power supply voltage adjustment circuit, a 12V power switch circuit, and a 3.3V power switch circuit, the multi-functional power management chip U1 can improve power conversion efficiency, effectively reduce the power consumption of the dual-mode communication module, improve the continuous reliability of power supply to the dual-mode communication module, and also activate a rechargeable backup power supply circuit and a backup power boost circuit to temporarily replace the power supply. This solves the problems in existing technologies where insufficient power supply affects normal operation of dual-mode communication modules, and where high power consumption contradicts the goal of energy saving and loss reduction.
[0005] This invention provides a low-power power management circuit for dual-mode communication, comprising a power supply, a primary power voltage output adjustment circuit, a secondary power voltage adjustment circuit, a 12V power switch circuit, and a 3.3V power switch circuit. The dual-mode communication module includes a dual-mode communication main control unit, a broadband carrier communication unit, and a low-power wireless communication unit. The input terminal of the primary power voltage output adjustment circuit is connected to the output terminal of the power supply. The output terminal of the primary power voltage output adjustment circuit is connected to the input terminals of the secondary power voltage adjustment circuit, the dual-mode communication main control unit, the 12V power switch circuit, and the 3.3V power switch circuit. The output terminal of the secondary power voltage adjustment circuit is connected to the input terminal of the dual-mode communication main control unit. The output terminal of the dual-mode communication main control unit is connected to the input terminals of the 12V power switch circuit, the 3.3V power switch circuit, and the broadband carrier communication unit. The system includes a carrier communication unit and a low-power wireless communication unit. The output of the 12V power switch circuit is connected to the broadband carrier communication unit, and the output of the 3.3V power switch circuit is also connected to the low-power wireless communication unit. The primary power supply voltage output adjustment circuit contains a multi-functional power management chip U1 (ETA9098). The dual-mode communication main control unit includes a communication MCU and a system-on-a-chip U3. The multi-functional power management chip U1 can control the primary power supply voltage output adjustment circuit to directly provide different input voltages to the secondary power supply voltage adjustment circuit and the dual-mode communication main control unit. It provides disconnectable operating power to the broadband carrier communication unit via the 12V power switch circuit and to the low-power wireless communication unit via the 3.3V power switch circuit. It can also provide a rechargeable backup power supply to temporarily replace the main power supply.
[0006] The present invention is further improved in that the primary power supply voltage output adjustment circuit includes a power detection and switching output circuit, a buck output DC-DC conversion circuit, a rechargeable backup power supply circuit, and a backup power supply boost circuit. The input terminal of the power detection and switching output circuit is connected to the output terminal of the power supply. The output terminal of the power detection and switching output circuit is connected to the input terminals of the buck output DC-DC conversion circuit, the rechargeable backup power supply circuit, and the 12V power switch circuit. The output terminal of the buck output DC-DC conversion circuit is connected to the input terminals of the secondary power supply voltage adjustment circuit and the 3.3V power switch circuit. The output terminal of the buck output DC-DC conversion circuit is also connected to the power supply of the on-chip system-on-a-chip U3. The output terminal of the rechargeable backup power supply circuit is connected to the backup power supply boost circuit, and the output terminal of the backup power supply boost circuit is connected to the input terminal of the 12V power switch circuit.
[0007] The present invention is further improved in that the multi-functional power management chip U1 has 10 pins, and the power detection and switching circuit includes detection resistor R3, detection resistor R5, detection capacitor C3, detection capacitor C5, and pins 2, 3, 4, and 5 of the multi-functional power management chip U1. Pin 3 of the multi-functional power management chip U1 is connected to the power supply output terminal, one end of the detection capacitor C5, and one end of the detection resistor R3. Pin 2 of the multi-functional power management chip U1 is connected to one end of the detection capacitor C3. Pin 5 of the multi-functional power management chip U1 is connected to the other end of the detection resistor R3 and one end of the detection resistor R5. Pin 4 of the multi-functional power management chip U1 is connected to the input terminal of the step-down output DC-DC conversion circuit, the input terminal of the rechargeable backup power supply circuit, and the input terminal of the 12V power switch circuit. The other ends of the detection capacitor C5, the other ends of the detection capacitor C3, and the other ends of the detection resistor R5 are grounded.
[0008] The present invention is further improved in that the buck output DC-DC conversion circuit includes filter capacitor C7, filter capacitor C11, filter capacitor C12, filter capacitor C13, filter inductor L3, and pins 6, 7, and 9 of the multi-functional power management chip U1. The input terminal of the buck output DC-DC conversion circuit is located within the multi-functional power management chip U1 and connected to pin 4 of the multi-functional power management chip U1. Pin 6 of the multi-functional power management chip U1 is connected to one end of the filter capacitor C7 and one end of the filter inductor L3. Pin 7 of chip U1 is connected to the other end of the filter capacitor C7. The other end of the filter inductor L3 is connected to pin 9 of the multi-functional power management chip U1, one end of the filter capacitor C11, one end of the filter capacitor C12, one end of the filter capacitor C13, the input terminal of the secondary power supply voltage adjustment circuit, and the input terminal of the 3.3V power switch circuit. The other end of the filter inductor L3 is also connected to the power supply of the on-chip system-on-a-chip U3. The other ends of the filter capacitors C11, C12, and C13 are grounded.
[0009] The present invention is further improved in that the rechargeable backup power supply circuit includes a supercapacitor C1, a buffer capacitor C2, and the 10th pin of the multi-functional power management chip U1. The input terminal of the rechargeable backup power supply circuit is located inside the multi-functional power management chip U1 and connected to the 4th pin of the multi-functional power management chip U1. The 10th pin of the multi-functional power management chip U1 is connected to one end of the supercapacitor C1 and one end of the buffer capacitor C2. The other end of the supercapacitor C1 and the other end of the buffer capacitor C2 are grounded.
[0010] The present invention is further improved in that the backup power boost circuit includes a filter inductor L1, a buffer capacitor C4, and pins 1 and 8 of the multi-functional power management chip U1. The output terminal of the backup power boost circuit is located inside the multi-functional power management chip U1 and connected to pin 4 of the multi-functional power management chip U1. Pin 1 of the multi-functional power management chip U1 is connected to one end of the filter inductor L1 and one end of the buffer capacitor C4. The other end of the filter inductor L1 is connected to pin 10 of the multi-functional power management chip U1, one end of the supercapacitor C1, and one end of the buffer capacitor C2. The other end of the buffer capacitor C4 is connected to pin 8 of the multi-functional power management chip U1.
[0011] The present invention is further improved in that the secondary power supply voltage adjustment circuit includes a voltage adjustment chip U2, a filter inductor L2, filter capacitors C6, C9, and C10, resistors R1, R2, and R4. The voltage adjustment chip U2 has five pins. The fourth pin of the voltage adjustment chip U2 is connected to the other end of the filter inductor L1 and one end of the resistor R2. The first pin of the voltage adjustment chip U2 is connected to the other end of the resistor R2. The third pin of the voltage adjustment chip U2 is connected to the... One end of the filter inductor L2 is connected to the filter capacitor C9, the filter capacitor C10, the filter capacitor C6, and the resistor R1. The other end of the filter inductor L2 is also connected to the power supply of the communication MCU with a power supply voltage of 1.1V. The other end of the resistor R1 is connected to one end of the resistor R4 and the 6th pin of the voltage adjustment chip U2. The other ends of the filter capacitor C9, the filter capacitor C10, the filter capacitor C6, and the resistor R4 are grounded.
[0012] The present invention is further improved in that the 12V power switch circuit includes a field-effect transistor Q1, a transistor Q3, a filter capacitor C14, a filter capacitor C15, a resistor R6, a resistor R8, and a resistor R9. The base of the transistor Q3 is connected to one end of the resistor R8 and one end of the resistor R9. The other end of the resistor R8 is connected to the on-chip system-on-a-chip U3. The collector of the transistor Q3 is connected to the gate of the field-effect transistor Q1, one end of the resistor R6, and one end of the filter capacitor C14. The drain of the field-effect transistor Q1 is connected to the fourth pin of the multi-functional power management chip U1, the other end of the resistor R6, and the other end of the filter capacitor C14. The source of the field-effect transistor Q1 is connected to one end of the filter capacitor C15 and the broadband carrier communication unit. The emitter of the transistor Q3, the other end of the resistor R9, and the other end of the filter capacitor C15 are grounded.
[0013] The present invention is further improved in that the 3.3V power switch circuit includes a field-effect transistor Q2, a filter capacitor C16, a filter capacitor C17, and a resistor R7. The gate of the field-effect transistor Q2 is connected to one end of the resistor R7 and one end of the filter capacitor C16. The gate of the field-effect transistor Q2 is also connected to the on-chip system-on-a-chip U3. The drain of the field-effect transistor Q2 is connected to the other end of the filter inductor L3, the other end of the resistor R7, and the other end of the filter capacitor C16. The source of the field-effect transistor Q2 is connected to one end of the filter capacitor C17 and the low-power wireless communication unit.
[0014] The present invention is further improved in that the voltage adjustment chip U2 is model ETA3406S2F, the on-chip system-on-a-chip U3 is model SPE7301, and the power supply voltage is 12V.
[0015] Compared with the prior art, the beneficial effects of the present invention are: it provides a low-power power management circuit for dual-mode communication. By setting up mutually cooperating power supplies, a first-stage power supply voltage output adjustment circuit, a second-stage power supply voltage adjustment circuit, a 12V power switch circuit, and a 3.3V power switch circuit, the multi-functional power management chip U1 can control the first-stage power supply voltage output adjustment circuit to directly provide different input voltages to the second-stage power supply voltage adjustment circuit and the dual-mode communication main control unit, thereby improving power conversion efficiency. The communication MCU uses a lower voltage of 1.1V for power supply, effectively reducing the power consumption of the dual-mode communication module, while improving the continuous reliability of power supply to the dual-mode communication module. The 12V power switch circuit provides power to a wide-range... The dual-mode communication module features a carrier communication unit and a 3.3V power switch circuit that provides a disconnectable power supply to the low-power wireless communication unit. When the broadband carrier communication unit is not in use, the 12V power switch circuit disconnects the power supply; when the low-power wireless communication unit is not in use, the 3.3V power switch circuit provides power, effectively reducing the power consumption of the dual-mode communication module. When the multi-functional power management chip U1 detects that the power supply voltage is lower than the set threshold, it can activate the rechargeable backup power supply circuit and the backup power boost circuit to temporarily replace the power supply. This solves the problems of insufficient power supply affecting normal operation in existing dual-mode communication modules and the contradiction between high power consumption and energy saving. Attached Figure Description
[0016] To more clearly illustrate the solutions in this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0017] Figure 1 This is a schematic block diagram of the low-power power management circuit for dual-mode communication according to the present invention.
[0018] Figure 2 This is a circuit diagram of the first-stage power supply voltage output adjustment circuit of the low-power power management circuit for dual-mode communication of the present invention.
[0019] Figure 3 This is a circuit diagram of the secondary power supply voltage adjustment circuit of the low-power power management circuit for dual-mode communication of the present invention;
[0020] Figure 4This is a 12V power switch circuit diagram of the low-power power management circuit for dual-mode communication according to the present invention.
[0021] Figure 5 This is a 3.3V power switch circuit diagram for the low-power power management circuit used in dual-mode communication according to the present invention. Detailed Implementation
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.
[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0024] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings.
[0025] like Figure 1-5As shown, this invention provides a low-power power management circuit for dual-mode communication, including a power supply, a first-stage power supply voltage output adjustment circuit, a second-stage power supply voltage adjustment circuit, a 12V power switch circuit, and a 3.3V power switch circuit. The dual-mode communication module includes a dual-mode communication main control unit, a broadband carrier communication unit, and a low-power wireless communication unit. The input terminal of the first-stage power supply voltage output adjustment circuit is connected to the output terminal of the power supply. The output terminal of the first-stage power supply voltage output adjustment circuit is connected to the input terminal of the second-stage power supply voltage adjustment circuit, the input terminal of the dual-mode communication main control unit, and the output terminal of the 12V power switch circuit. The input terminal of the primary power supply voltage adjustment circuit is connected to the input terminal of the 3.3V power switch circuit. The output terminal of the secondary power supply voltage adjustment circuit is connected to the input terminal of the dual-mode communication main control unit. The output terminal of the dual-mode communication main control unit is connected to the input terminals of the 12V power switch circuit, the 3.3V power switch circuit, the broadband carrier communication unit, and the low-power wireless communication unit. The output terminal of the 12V power switch circuit is connected to the power supply of the broadband carrier communication unit, and the output terminal of the 3.3V power switch circuit is connected to the power supply of the low-power wireless communication unit. The primary power supply voltage output adjustment circuit contains a multi-functional power management chip U1. The power management chip U1 is an ETA9098. The dual-mode communication main control unit includes a communication MCU and an on-chip system-on-a-chip (SoC) U3, model SPE7301. The power supply voltage is 12V. The multi-functional power management chip U1 can control the primary power supply voltage output adjustment circuit to directly provide different input voltages to the secondary power supply voltage adjustment circuit and the dual-mode communication main control unit, improving power conversion efficiency. The communication MCU uses a lower voltage of 1.1V, effectively reducing the power consumption of the dual-mode communication module and improving the continuous reliability of power supply to the dual-mode communication module. The broadband carrier communication unit is supplied with disconnectable power via a 12V power switch circuit, and the low-power wireless communication unit is supplied with power via a 3.3V power switch circuit. When the broadband carrier communication unit is not in use, the 12V power switch circuit disconnects the power supply. When the low-power wireless communication unit is not in use, the 3.3V power switch circuit supplies power, which also effectively reduces the power consumption of the dual-mode communication module. When the multi-functional power management chip U1 detects that the supply voltage of the power supply is lower than the set threshold, the multi-functional power management chip U1 can activate the rechargeable backup power supply circuit and the backup power boost circuit to temporarily replace the power supply.
[0026] like Figure 1-5As shown, the primary power supply voltage output adjustment circuit includes a power detection and switching output circuit, a buck output DC-DC conversion circuit, a rechargeable backup power supply circuit, and a backup power supply boost circuit. The input terminal of the power detection and switching output circuit is connected to the output terminal of the power supply. Its output terminal is connected to the input terminals of the buck output DC-DC conversion circuit, the rechargeable backup power supply circuit, and the 12V power switch circuit. The output terminal of the buck output DC-DC conversion circuit is connected to the input terminals of the secondary power supply voltage adjustment circuit and the 3.3V power switch circuit. The output terminal of the buck output DC-DC conversion circuit is also connected to the on-chip system-on-a-chip U3 for power supply. The output terminal of the rechargeable backup power supply circuit is connected to the backup power supply boost circuit, and the output terminal of the backup power supply boost circuit is connected to the input terminal of the 12V power switch circuit. (Multi-functional power supply) The management chip U1 has 10 pins. The power detection and switching circuit includes detection resistors R3 and R5, detection capacitors C3 and C5, and pins 2, 3, 4, and 5 of the multi-functional power management chip U1. Pin 3 of the multi-functional power management chip U1 is connected to the power supply output terminal, one end of detection capacitor C5, and one end of detection resistor R3. Pin 2 of the multi-functional power management chip U1 is connected to one end of detection capacitor C3. Pin 5 of the multi-functional power management chip U1 is connected to the other end of detection resistor R3 and one end of detection resistor R5. Pin 4 of the multi-functional power management chip U1 is connected to the input terminal of the step-down output DC-DC conversion circuit, the input terminal of the rechargeable backup power supply circuit, and the input terminal of the 12V power switch circuit. The other ends of detection capacitors C5, C3, and R5 are grounded. In this embodiment, the power detection and switching output circuit is built into the multi-functional power management chip U1. Pin 3 of the multi-functional power management chip U1 can receive the power supply and limit it before outputting a 12V voltage from pin 4. Pin 4 of the multi-functional power management chip U1 is the overvoltage protection output pin for the dual-mode communication module power supply. When the output is higher than 20V, the clamping voltage output is used to supply power to the broadband carrier communication unit. The maximum operating voltage of the broadband carrier communication unit is 28V, which can effectively protect the broadband carrier communication unit from damage by high voltage surges. Pin 5 of the multi-functional power management chip U1 can detect the power supply voltage and can set a voltage threshold. In this embodiment, the voltage threshold is set to 9V. The minimum operating voltage of the broadband carrier communication unit is 8V. At the same time, the 9V voltage is 75% of the input voltage of 12V, which also has sufficient margin to effectively avoid the influence of input power fluctuations. Pin 2 of the multi-functional power management chip U1 is a safety protection pin for buffering.
[0027] like Figure 2As shown, the step-down DC-DC converter circuit includes filter capacitors C7, C11, C12, and C13, filter inductor L3, and pins 6, 7, and 9 of the multi-functional power management chip U1. The input terminal of the step-down DC-DC converter circuit is located inside the multi-functional power management chip U1 and is connected to pin 4 of the multi-functional power management chip U1. Pin 6 of the multi-functional power management chip U1 is connected to one end of filter capacitor C7 and one end of filter inductor L3. Pin 7 of the multi-functional power management chip U1 is connected to the other end of filter capacitor C7. The other end of filter inductor L3 is connected to pin 9 of the multi-functional power management chip U1, one end of filter capacitor C11, one end of filter capacitor C12, one end of filter capacitor C13, the input terminal of the secondary power supply voltage adjustment circuit, and the input terminal of the 3.3V power switch circuit. The other end of filter inductor L3 is also connected to the on-chip system-on-a-chip U3 for power supply. The other ends of filter capacitors C11, C12, and C13 are grounded. In this embodiment, the step-down section of the step-down output DC-DC converter circuit is built into the multi-functional power management chip U1. The multi-functional power management chip U1 steps down the 12V voltage to 3.3V and outputs it through pins 6, 7, and 9. Among them, pin 6 of the multi-functional power management chip U1 is the output feedback pin. The filtering and decoupling circuit composed of filter capacitors C11, C12, C13 and filter inductor L3 can adjust the PWM power output from the multi-functional power management chip U1 to a stable 3.3V DC power supply, and then output it to the secondary power supply voltage adjustment circuit, the 3.3V power switch circuit and the on-chip system-on-a-chip U3.
[0028] like Figure 2 As shown, the rechargeable backup power supply circuit includes a supercapacitor C1, a buffer capacitor C2, and pin 10 of a multi-functional power management chip U1. The input terminal of the rechargeable backup power supply circuit is located within the multi-functional power management chip U1 and connected to pin 4 of the chip. Pin 10 of the chip is connected to one end of the supercapacitor C1 and one end of the buffer capacitor C2, while the other ends of both are grounded. In this embodiment, pin 10 of the multi-functional power management chip U1 is set to output a 2.53V voltage to charge the supercapacitor C1. The charging process is divided into two stages: constant current charging when 90% of the charging voltage is reached, and constant voltage charging after reaching 90%. Small-capacity batteries can also be charged by adjusting the output voltage set on pin 10 of the chip.
[0029] like Figure 2As shown, the backup power boost circuit includes a filter inductor L1, a buffer capacitor C4, and pins 1 and 8 of a multi-functional power management chip U1. The output of the backup power boost circuit is located within the multi-functional power management chip U1 and connected to pin 4 of the chip. Pin 1 of the multi-functional power management chip U1 is connected to one end of the filter inductor L1 and one end of the buffer capacitor C4. The other end of the filter inductor L1 is connected to pin 10 of the multi-functional power management chip U1, one end of the supercapacitor C1, and one end of the buffer capacitor C2. The other end of the buffer capacitor C4 is connected to pin 8 of the multi-functional power management chip U1. In this embodiment, when pin 5 of the multi-functional power management chip U1 detects that the output voltage of the power supply fails to reach the set voltage threshold, pins 1 and 8 of the multi-functional power management chip U1 can receive temporary power from the supercapacitor C1. The boost circuit built into the multi-functional power management chip boosts the voltage and outputs it to pin 4.
[0030] like Figure 3 As shown, the secondary power supply voltage adjustment circuit includes a voltage adjustment chip U2, a filter inductor L2, filter capacitors C6, C9, and C10, and resistors R1, R2, and R4. The voltage adjustment chip U2 has five pins. Pin 4 of U2 is connected to the other end of filter inductor L1 and one end of resistor R2. Pin 1 of U2 is connected to the other end of resistor R2. Pin 3 of U2 is connected to one end of filter inductor L2. The other end of filter inductor L2 is connected to one end of filter capacitors C9, C10, C6, and R1. The other end of filter inductor L2 is also connected to the power supply of the communication MCU, with a supply voltage of 1.1V. The other end of resistor R1 is connected to one end of resistor R4 and pin 6 of voltage adjustment chip U2. The other ends of filter capacitors C9, C10, C6, and R4 are grounded. In this embodiment, the voltage regulator chip U2 is model ETA3406S2F. The voltage regulator chip U2 can convert 3.3V power supply to 1.1V power supply to provide operating power for the communication MCU. Its conversion efficiency is as high as 95%. The filter inductor L2, filter capacitor C6, filter capacitor C9 and filter capacitor C10 can filter and decouple to output a stable 1.1V power supply. The first pin of the voltage regulator chip U2 outputs the enable pin and is pulled up to the input power supply through the 20K resistor R2, so that the communication MCU can work as long as it has power. Providing different operating power supplies according to different functional circuits can reduce the power consumption of the device.
[0031] like Figure 4As shown, the 12V power switch circuit includes a field-effect transistor Q1, a transistor Q3, filter capacitors C14 and C15, resistors R6, R8, and R9. The base of transistor Q3 is connected to one end of resistor R8 and one end of resistor R9. The other end of resistor R8 is connected to the on-chip system-on-a-chip (SoC) U3. The collector of transistor Q3 is connected to the gate of field-effect transistor Q1, one end of resistor R6, and one end of filter capacitor C14. The drain of field-effect transistor Q1 is connected to pin 4 of the multi-functional power management chip U1, the other end of resistor R6, and the other end of filter capacitor C14. The source of field-effect transistor Q1 is connected to one end of filter capacitor C15 and the broadband carrier communication unit. The emitter of transistor Q3, the other end of resistor R9, and the other end of filter capacitor C15 are grounded. In this embodiment, as... Figure 4 As shown, the field-effect transistor Q1 is a PMOS transistor. The power supply is switched on and off by the voltage between the gate and the source of the field-effect transistor Q1, which is the VGS voltage. Since the power supply voltage is 12V and the control voltage output by the on-chip system-on-chip U3 is 3.3V, a transistor Q3 is added to control the VGS voltage of the field-effect transistor Q1. When the control voltage output by the on-chip system-on-chip U3 to the resistor R8 is high, the 12V power switch circuit is turned on; when it is low, the 12V power switch circuit is turned off.
[0032] like Figure 5 As shown, the 3.3V power switch circuit includes a field-effect transistor (FET) Q2, filter capacitors C16 and C17, and a resistor R7. The gate of FET Q2 is connected to one end of resistor R7 and one end of filter capacitor C16. The gate of FET Q2 is also connected to the on-chip system-on-a-chip (SoC) U3. The drain of FET Q2 is connected to the other end of filter inductor L3, the other end of resistor R7, and the other end of filter capacitor C16. The source of FET Q2 is connected to one end of filter capacitor C17 and the low-power wireless communication unit. In this embodiment, the VGS voltage of FET Q2 achieves the power switching effect. When the control voltage output from SoC U3 to the gate of FET Q2 is high, the 3.3V power switch circuit is off; when it is low, the 3.3V power switch circuit is on.
[0033] As can be seen from the above, this invention provides a low-power power management circuit for dual-mode communication. By setting up mutually cooperating power supplies, a first-stage power supply voltage output adjustment circuit, a second-stage power supply voltage adjustment circuit, a 12V power switch circuit, and a 3.3V power switch circuit, the multi-functional power management chip U1 can control the first-stage power supply voltage output adjustment circuit to directly provide different input voltages to the second-stage power supply voltage adjustment circuit and the dual-mode communication main control unit, thereby improving power conversion efficiency. The communication MCU uses a lower voltage of 1.1V for power supply, effectively reducing the power consumption of the dual-mode communication module and improving the continuous reliability of power supply to the dual-mode communication module. The 12V power switch circuit provides power to the broadband carrier communication. The unit provides a disconnectable power supply to the low-power wireless communication unit via a 3.3V power switch circuit. When the broadband carrier communication unit is not in use, the 12V power switch circuit disconnects the power supply, and when the low-power wireless communication unit is not in use, the 3.3V power switch circuit provides power, which also effectively reduces the power consumption of the dual-mode communication module. When the multi-functional power management chip U1 detects that the power supply voltage is lower than the set threshold, the multi-functional power management chip U1 can activate the rechargeable backup power supply circuit and the backup power boost circuit to temporarily replace the power supply, which solves the problem in the existing dual-mode communication module that insufficient power supply affects normal operation and that high power consumption contradicts the purpose of energy saving and loss reduction.
[0034] The specific embodiments described above are preferred embodiments of the present invention and are not intended to limit the specific scope of the present invention. The scope of the present invention includes, but is not limited to, these specific embodiments. All equivalent changes made in accordance with the present invention are within the protection scope of the present invention.
Claims
1. A low-power power management circuit for dual-mode communication, wherein the output terminal is connected to the input terminal of a dual-mode communication module, characterized in that: The power supply includes a power supply, a primary power voltage output adjustment circuit, a secondary power voltage adjustment circuit, a 12V power switch circuit and a 3.3V power switch circuit, wherein the dual-mode communication module includes a dual-mode communication main control unit, a wideband carrier communication unit and a micro-power wireless communication unit, the input end of the primary power voltage output adjustment circuit is connected with the output end of the power supply, the output end of the primary power voltage output adjustment circuit is connected with the input end of the secondary power voltage adjustment circuit, the input end of the dual-mode communication main control unit, the input end of the 12V power switch circuit and the input end of the 3.3V power switch circuit, the output end of the secondary power voltage adjustment circuit is connected with the input end of the dual-mode communication main control unit, the output end of the dual-mode communication main control unit is connected with the input end of the 12V power switch circuit, the input end of the 3.3V power switch circuit, the wideband carrier communication unit and the micro-power wireless communication unit, the output end of the 12V power switch circuit is connected with the wideband carrier communication unit for power supply, the output end of the 3.3V power switch circuit is connected with the micro-power wireless communication unit for power supply, the multifunctional power management chip U1 is arranged in the primary power voltage output adjustment circuit, the model of the multifunctional power management chip U1 is ETA9098, the dual-mode communication main control unit is provided with a communication MCU and a system-on-chip chip U3, the multifunctional power management chip U1 can control the primary power voltage output adjustment circuit to directly provide different input voltages for the secondary power voltage adjustment circuit and the dual-mode communication main control unit, respectively provide disconnectable working power for the wideband carrier communication unit through the 12V power switch circuit and for the micro-power wireless communication unit through the 3.3V power switch circuit, and can also provide a chargeable backup power source to temporarily replace the power supply.
2. The low power supply management circuit for dual mode communication according to claim 1, wherein: The primary power voltage output adjustment circuit includes a power supply detection switching output circuit, a step-down output DC-DC conversion circuit, a chargeable backup power source circuit and a backup power supply boost circuit, wherein the input end of the power supply detection switching output circuit is connected with the output end of the power supply, the output end of the power supply detection switching output circuit is connected with the input end of the step-down output DC-DC conversion circuit, the input end of the chargeable backup power source circuit and the input end of the 12V power switch circuit, the output end of the step-down output DC-DC conversion circuit is connected with the input end of the secondary power voltage adjustment circuit and the input end of the 3.3V power switch circuit, the output end of the step-down output DC-DC conversion circuit is also connected with the system-on-chip chip U3 for power supply, the output end of the chargeable backup power source circuit is connected with the backup power supply boost circuit, and the output end of the backup power supply boost circuit is connected with the input end of the 12V power switch circuit.
3. The low power supply management circuit for dual mode communication according to claim 2, wherein: The multifunctional power management chip U1 is provided with 10 pins, the power detection switching circuit includes detection resistance R3, detection resistance R5, detection capacitor C3, detection capacitor C5 and the 2nd, 3rd, 4th and 5th pins of the multifunctional power management chip U1, wherein the 3rd pin of the multifunctional power management chip U1 is connected with the power supply output end, one end of the detection capacitor C5 and one end of the detection resistance R3, the 2nd pin of the multifunctional power management chip U1 is connected with one end of the detection capacitor C3, the 5th pin of the multifunctional power management chip U1 is connected with the other end of the detection resistance R3 and one end of the detection resistance R5, the 4th pin of the multifunctional power management chip U1 is connected with the input end of the step-down output DC-DC conversion circuit, the input end of the chargeable backup power supply circuit and the input end of the 12V power switch circuit, and the other end of the detection capacitor C5, the other end of the detection capacitor C3 and the other end of the detection resistance R5 are grounded.
4. The low power supply management circuit for dual mode communication according to claim 3, wherein: The step-down output DC-DC conversion circuit includes filter capacitor C7, filter capacitor C11, filter capacitor C12, filter capacitor C13, filter inductor L3 and the 6th, 7th and 9th pins of the multifunctional power management chip U1, wherein the input end of the step-down output DC-DC conversion circuit is arranged in the multifunctional power management chip U1 and connected with the 4th pin of the multifunctional power management chip U1, the 6th pin of the multifunctional power management chip U1 is connected with one end of the filter capacitor C7 and one end of the filter inductor L3, the 7th pin of the multifunctional power management chip U1 is connected with the other end of the filter capacitor C7, the other end of the filter inductor L3 is connected with the 9th pin of the multifunctional power management chip U1, one end of the filter capacitor C11, one end of the filter capacitor C12, one end of the filter capacitor C13, the input end of the secondary power voltage adjustment circuit and the input end of the 3.3V power switch circuit, and the other end of the filter inductor L3 is also connected with the power supply of the system-on-chip U3, and the other end of the filter capacitor C11, the other end of the filter capacitor C12 and the other end of the filter capacitor C13 are grounded.
5. The low power supply management circuit for dual mode communication according to claim 4, wherein: The chargeable backup power supply circuit includes super capacitor C1, buffer capacitor C2 and the 10th pin of the multifunctional power management chip U1, wherein the input end of the chargeable backup power supply circuit is arranged in the multifunctional power management chip U1 and connected with the 4th pin of the multifunctional power management chip U1, the 10th pin of the multifunctional power management chip U1 is connected with one end of the super capacitor C1 and one end of the buffer capacitor C2, and the other end of the super capacitor C1 and the other end of the buffer capacitor C2 are grounded.
6. The low power supply management circuit for dual mode communication according to claim 5, wherein: The standby power supply boost circuit includes filter inductor L1, buffer capacitor C4 and the first and eighth pins of the multifunction power management chip U1. The output end of the standby power supply boost circuit is arranged in the multifunction power management chip U1 and connected with the fourth pin of the multifunction power management chip U1. The first pin of the multifunction power management chip U1 is connected with one end of the filter inductor L1 and one end of the buffer capacitor C4. The other end of the filter inductor L1 is connected with the tenth pin of the multifunction power management chip U1, one end of the super capacitor C1 and one end of the buffer capacitor C2. The other end of the buffer capacitor C4 is connected with the eighth pin of the multifunction power management chip U1.
7. The low power supply management circuit for dual mode communication according to claim 6, wherein: The secondary power voltage adjustment circuit is provided with a voltage adjustment chip U2, filter inductor L2, filter capacitors C6, C9 and C10, resistors R1, R2 and R4. The voltage adjustment chip U2 is provided with five pins. The fourth pin of the voltage adjustment chip U2 is connected with the other end of the filter inductor L1 and one end of the resistor R2. The first pin of the voltage adjustment chip U2 is connected with the other end of the resistor R2. The third pin of the voltage adjustment chip U2 is connected with one end of the filter inductor L2. The other end of the filter inductor L2 is connected with one end of the filter capacitor C9, one end of the filter capacitor C10, one end of the filter capacitor C6 and one end of the resistor R1. The other end of the filter inductor L2 is also connected with the communication MCU power supply and the power supply voltage is 1.1V. The other end of the resistor R1 is connected with one end of the resistor R4 and the sixth pin of the voltage adjustment chip U2. The other end of the filter capacitor C9, the other end of the filter capacitor C10, the other end of the filter capacitor C6 and the other end of the resistor R4 are grounded.
8. The low power supply management circuit for dual mode communication according to claim 7, wherein: The 12V power switch circuit is provided with a field effect transistor Q1, a transistor Q3, filter capacitors C14 and C15, resistors R6, R8 and R9. The base of the transistor Q3 is connected with one end of the resistor R8 and one end of the resistor R9. The other end of the resistor R8 is connected with the system on chip U3 control. The collector of the transistor Q3 is connected with the gate of the field effect transistor Q1, one end of the resistor R6 and one end of the filter capacitor C14. The drain of the field effect transistor Q1 is connected with the fourth pin of the multifunction power management chip U1, the other end of the resistor R6 and the other end of the filter capacitor C14. The source of the field effect transistor Q1 is connected with one end of the filter capacitor C15 and the wideband carrier communication unit. The emitter of the transistor Q3, the other end of the resistor R9 and the other end of the filter capacitor C15 are grounded.
9. The low power supply management circuit for dual mode communication according to claim 8, wherein: The 3.3V power switch circuit is provided with a field effect tube Q2, a filter capacitor C16, a filter capacitor C17 and a resistor R7, wherein the gate of the field effect tube Q2 is connected with one end of the resistor R7 and one end of the filter capacitor C16, the gate of the field effect tube Q2 is also connected with the system on chip U3 control, the drain of the field effect tube Q2 is connected with the other end of the filter inductor L3, the other end of the resistor R7 and the other end of the filter capacitor C16, and the source of the field effect tube Q2 is connected with one end of the filter capacitor C17 and the micro-power wireless communication unit.
10. The low power supply management circuit for dual mode communication according to claim 9, wherein: The model of the voltage regulation chip U2 is ETA3406S2F, the model of the system on chip U3 is SPE7301, and the voltage of the power supply is 12V.
Citation Information
Patent Citations
Low-power-consumption power management circuit for dual-mode communication
CN219458740U