Circuit arrangement and motor vehicle

By thermally connecting the busbar to the heat sink, the problem of the filter device's temperature being affected by the environment is solved, achieving a circuit device design with low heat generation, long lifespan, and efficient cooling.

CN116171001BActive Publication Date: 2026-07-10AUDI AG
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
AUDI AG
Filing Date
2022-11-11
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In the prior art, the components of the filter device are thermally connected to the housing of the circuit device, which makes their temperature highly susceptible to environmental influences, limiting their service life and requiring the use of high-cost temperature stabilizing components.

Method used

By thermally connecting the busbar to the heat sink, the temperature of the filter device is reduced through the cooling of the busbar, and the direct thermal connection between the filter device and the circuit device housing is eliminated, with the heat sink providing effective cooling.

Benefits of technology

It reduces the temperature of the filter device, extends its service life, simplifies the installation of the circuit device, reduces the need for high-temperature components, and improves the flexibility and cooling efficiency of the circuit device.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN116171001B_ABST
    Figure CN116171001B_ABST
Patent Text Reader

Abstract

The circuit arrangement comprises a power electronics circuit (14) with at least one power electronics module (7, 8, 9), a filter device (6), a heat sink (12), a connection (13) and at least one busbar (10, 11), wherein the filter device (6) is at least partially coupled with the busbar (10, 11), the busbar (10, 11) electrically connecting the connection (13) with the power electronics circuit (14), wherein the power electronics module (7, 8, 9) and at least one section (15) of the busbar (10, 11) are thermally connected with the heat sink (12).
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