Display panel, display module, display device and crack detection method

Abstract

A display panel, a display module, a display device and a crack detection method. The display panel includes a display area and a frame area located at the periphery of the display area. The frame area includes a binding pin area and an electrical test area on the side away from the display area. The electrical test area is located on the side of the binding pin area away from the display area. The binding pin area includes at least a first binding pin and a second binding pin. The electrical test area includes at least a first electrical test pad and a second electrical test pad. The display panel further includes a panel crack detection line arranged around the display area. One end of the panel crack detection line is connected to the first electrical test pad through the first binding pin. The other end of the panel crack detection line is connected to the second electrical test pad through the second binding pin.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display panel, display device, and crack detection method. Background Technology

[0002] With the continuous development of display technology, the types of display products are increasing, such as liquid crystal displays (LCDs), organic light-emitting diode (OLEDs), plasma display panels (PDPs), and field emission displays (FEDs). Cracks are prone to occur during the manufacturing process of display panels, leading to reliability issues. Therefore, crack detection of display panels is necessary.

[0003] The inventors of this application have discovered that crack detection of display panels requires complex wiring. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0005] This disclosure provides a display panel, display module, display device, and crack detection method to solve the problem of complex wiring in crack detection of display panels.

[0006] In a first aspect, embodiments of this disclosure provide a display panel, including a display area and a border area surrounding the display area; along a side away from the display area, the border area includes a bonding pin area and an electrical test area, the electrical test area being located on the side of the bonding pin area away from the display area; the bonding pin area includes at least a first bonding pin and a second bonding pin, and the electrical test area includes at least a first electrical test pad and a second electrical test pad; the display panel further includes a panel crack detection line disposed around the display area, one end of the panel crack detection line being connected to the first electrical test pad via the first bonding pin, and the other end of the panel crack detection line being connected to the second electrical test pad via the second bonding pin.

[0007] In one exemplary embodiment, the bonding pin area further includes a third bonding pin and a fourth bonding pin; one end of the panel crack detection line is connected to the third bonding pin, and the other end of the panel crack detection line is connected to the fourth bonding pin.

[0008] In one exemplary embodiment, the first electrical test pad and the second electrical test pad are located at opposite ends of the electrical test area along the extension direction of the electrical test area; and the first bonding pin and the second bonding pin are located at opposite ends of the bonding pin area along the extension direction of the bonding pin area.

[0009] In one exemplary embodiment, the third bonding pin and the fourth bonding pin are located at opposite ends of the bonding pin region along the extension direction of the bonding pin region, and the third bonding pin and the fourth bonding pin are located between the first bonding pin and the second bonding pin.

[0010] In one exemplary embodiment, the bezel area further includes a driver chip area located on the side of the bonding pin area closer to the display area; the driver chip area includes a first driver test pad and a second driver test pad; the bonding pin area further includes a fifth bonding pin and a sixth bonding pin; one end of the panel crack detection line is connected through the first driver test pad and the fifth bonding pin, and the other end of the panel crack detection line is connected through the second driver test pad and the sixth bonding pin.

[0011] In one exemplary embodiment, the border area further includes a unit test area located on the side of the driver chip area close to the display area, and the unit test area includes multiple unit test pads.

[0012] Secondly, this disclosure also provides a crack detection method applied to the display panel described above. The method includes: inputting a first test signal to a first electrical test pad; receiving a second test signal returned by a second electrical test pad; determining a test resistance value of a crack detection line on the panel based on the first test signal and the second test signal; and determining whether the display panel has a crack based on the test resistance value.

[0013] In one exemplary embodiment, before inputting the first test signal to the first electrical test pad, the method further includes: determining the range of initial resistance values ​​of the panel crack detection line.

[0014] In one exemplary embodiment, the range of the initial resistance value includes: greater than or equal to 0.7 times the initial resistance value and less than or equal to 1.3 times the initial resistance value.

[0015] In one exemplary embodiment, determining whether the display panel has a crack based on the test resistance value includes: comparing the test resistance value with the range of the initial resistance value; if the test resistance value is within the range of the initial resistance value, determining that the display panel has no crack; if the test resistance value is outside the range of the initial resistance value, determining that the display panel has a crack.

[0016] Thirdly, embodiments of this disclosure provide a display module, including a display panel and an integrated circuit. The display panel includes a display area and a border area surrounding the display area. Along the side away from the display area, the border area includes a driver chip area and a bonding pin area. The driver chip area is located on the side of the bonding pin area closer to the display area. The integrated circuit is bonded to the driver chip area. The bonding pin area includes at least a third bonding pin and a fourth bonding pin. The display panel also includes a panel crack detection line disposed around the display area. One end of the panel crack detection line is connected to the third bonding pin, and the other end of the panel crack detection line is connected to the fourth bonding pin.

[0017] Fourthly, this disclosure provides a crack detection method applied to the display module described above. The method includes: inputting a third test signal to a third bonding pin; receiving a fourth test signal returned by a fourth bonding pin; obtaining a test resistance value of a panel crack detection line based on the third test signal and the fourth test signal; and determining whether the display panel has a crack based on the test resistance value.

[0018] Fifthly, embodiments of this disclosure provide a display device, including the display module described above.

[0019] The display panel disclosed in this embodiment connects the panel crack detection line to the corresponding electrical test pad using bonding pins. This allows the resistance value of the panel crack detection line to be tested through the electrical test area while the display panel is in its current state, thereby detecting the presence of cracks in the display panel. This method of detecting display panel cracks using resistance values ​​while the display panel is in its current state not only improves the accuracy of crack detection results, preventing defective products from entering subsequent processes and saving display module materials, but also reduces the complexity of wiring, decreases the number of test pads required in the bonding pin area and electrical test area, and helps to reduce the bezel size of the display panel, improving its aesthetics. It solves the problem of complex wiring for crack detection of display panels.

[0020] After reading and understanding the accompanying diagrams and detailed descriptions, the other aspects can be understood. Attached Figure Description

[0021] The accompanying drawings are provided to further understand the technical solutions of this disclosure and constitute a part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure.

[0022] Figure 1 This is a schematic diagram of the structure of a display panel;

[0023] Figure 2 This is a schematic diagram of the structure of the display panel provided in the embodiments of this disclosure;

[0024] Figure 3 This is a schematic diagram of crack detection performed on the display panel.

[0025] Figure 4 A resistance distribution diagram of the test resistance value of the panel crack detection line in an exemplary embodiment. Detailed Implementation

[0026] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Note that the embodiments can be implemented in many different forms. Those skilled in the art will readily understand that the methods and content can be varied in many ways without departing from the spirit and scope of this disclosure. Therefore, this disclosure should not be construed as limited to the contents described in the following embodiments. Without conflict, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0027] The ordinal numbers “first,” “second,” and “third” used in this specification are used to avoid confusion among the constituent elements, not to limit their quantity.

[0028] In this specification, for convenience, terms such as "middle," "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer" are used to indicate orientation or positional relationships in conjunction with the accompanying drawings. This is solely for the purpose of facilitating the description and simplification, and does not imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this disclosure. The positional relationships of the constituent elements may be appropriately varied depending on the orientation of each constituent element being described. Therefore, the use of terms not limited to those described in the specification may be appropriately replaced as needed.

[0029] In this specification, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection, an indirect connection via an intermediate component, or a connection within two components. Those skilled in the art will understand the specific meaning of these terms in this disclosure based on the specific circumstances.

[0030] In this specification, "parallel" refers to the state where the angle formed by two straight lines is greater than or equal to -10° and less than 10°, and therefore also includes the state where the angle is greater than or equal to -5° and less than 5°. Similarly, "perpendicular" refers to the state where the angle formed by two straight lines is greater than or equal to 80° and less than 100°, and therefore also includes the state where the angle is greater than or equal to 85° and less than 95°.

[0031] In this specification, triangles, rectangles, trapezoids, pentagons, or hexagons are not strictly defined; they can be approximate triangles, rectangles, trapezoids, pentagons, or hexagons. Small deformations due to tolerances are possible, as are chamfers, curved edges, and other variations.

[0032] In this disclosure, “about” means a value that is not strictly limited and allows for process and measurement errors.

[0033] Figure 1 This is a schematic diagram of the structure of a display panel. In some examples, such as... Figure 1 As shown, the display panel may include a display area 100 and a bezel area surrounding the display area 100. Along the side away from the display area 100, the bezel area may include a cell test (CT) area 200, a driver chip area 300, a bonding pin area 400, and an electrical test area 500. The electrical test area 500 allows for electronic testing (ET) of the display panel. The cell test area 200 is provided with multiple cell test pads 201. After the display panel is manufactured, signals can be supplied to the cell test pads 201 via a fixture. The cell test pads 201 transmit the signals to the signal lines within the display panel to detect any image defects. Figure 1The diagram illustrates the use of two unit test pads 201. The driver chip area 300 can be configured for subsequent bonding with integrated circuits, such as data integrated circuits. The driver chip area 300 can include driver test pads 301, which can be used to perform relevant tests on the display panel. The bonding pin area 400 can be configured to have multiple bonding pins 401, which can be used to bond flexible printed circuit boards (FPCs), allowing multiple signal leads (e.g., drive control lines, power lines, etc.) to be connected to external control devices through these bonding pins. The electrical test area 500 can include multiple electrical test pads 501, which can be used to perform electronic tests on the display panel. When cracks exist on the display panel, progressive dark spots (GDS) are easily formed at the crack locations, severely impacting the user experience. In practical applications, for... Figure 1 After the display panel is tested, the electrical test area 500 is cut off, and the integrated circuit is bonded to the display panel to form a display module. In some technologies, crack detection is performed on the display panel in its current state and the display module in its current state to prevent defective products from being distributed to customers.

[0034] like Figure 1As shown, a panel crack detection line 101 is arranged around the display area 100. Since the display module is bonded to the integrated circuit, when crack detection is performed on the display module, a test signal can be provided to the drive test pad 301 through the corresponding bonding pin to detect the resistance of the panel crack detection line 101. When a crack passes through the panel crack detection line 101, the panel crack detection line 101 breaks, causing a significant increase in resistance. In practical applications, the upper limit value of the resistance of the panel crack detection line 101 is preset based on experience. After providing a test signal to the drive test pad 301, the testing device will return the comparison result between the resistance detection value of the panel crack detection line 101 and the upper limit value, thereby determining whether there is a crack in the display panel. In the display module state, no specific resistance detection value is obtained. However, in the display panel state, since it is not bonded to the integrated circuit, a second crack detection line 102 needs to be set separately around the display area 100. The second crack detection line 102 is connected to the unit test pad 201, and the presence of a crack in the display panel is determined based on the lighting status of the signal lines within the display panel. During crack detection, an electrical test pad is used to provide conduction and data signals to the corresponding unit test pad 201 via bonding pins. The conduction signal controls the conduction of the corresponding electrical test unit, allowing the data signal to enter the signal circuit within the display panel for display. In some technologies, a bright line will appear on the display panel when a crack exists; otherwise, the display panel will display normally. That is, crack detection is performed on the display panel while it is in its normal state, using a bright line detection method. This bright line detection method requires additional detection lines and supporting control circuitry, resulting in complex wiring.

[0035] Furthermore, when a crack exists in the display panel, but the crack does not cause the second crack detection line 102 to break, the bright line detection method is prone to missed detections, resulting in low accuracy of the detection results. According to the inventors' statistics, the accuracy of bright line detection for detecting cracks in display panels is less than 30%.

[0036] This disclosure provides a display panel including a display area and a frame area surrounding the display area. On the side away from the display area, the frame area includes a bonding pin area and an electrical test area, with the electrical test area located on the side of the bonding pin area away from the display area. The bonding pin area includes at least a first bonding pin and a second bonding pin, and the electrical test area includes at least a first electrical test pad and a second electrical test pad. The display panel also includes a panel crack detection line disposed around the display area, with one end of the panel crack detection line connected to the first electrical test pad via the first bonding pin and the other end of the panel crack detection line connected to the second electrical test pad via the second bonding pin.

[0037] The display panel provided in this disclosure connects the panel crack detection line to the corresponding electrical test pad using bonding pins. This allows the resistance value of the panel crack detection line to be tested through the electrical test area while the display panel is in its current state, thereby detecting the presence of cracks in the display panel. This method of detecting display panel cracks using resistance values ​​while the display panel is in its current state not only improves the accuracy of crack detection results, preventing defective products from entering subsequent processes and saving display module materials, but also reduces the complexity of wiring, decreases the number of test pads required in the bonding pin area and electrical test area, and helps to reduce the bezel size of the display panel, improving its aesthetics.

[0038] In one exemplary embodiment, the bonding pin area further includes a third bonding pin and a fourth bonding pin; one end of the panel crack detection line is connected to the third bonding pin, and the other end of the panel crack detection line is connected to the fourth bonding pin.

[0039] In an exemplary embodiment, in the display module state, the resistance value of the panel crack detection line can be directly detected through the third and fourth bonding pins, thereby obtaining the specific resistance value of the panel crack detection line.

[0040] In some technologies, crack detection is performed using bright line detection in the display panel state, and resistance value detection with a preset upper limit is used in the display module state. The results of these two methods are not comparable, easily leading to over-detection or under-detection. Furthermore, the specific resistance value of the crack detection line cannot be obtained in the display module state. In this embodiment, crack detection is performed using resistance value detection in both the display panel and display module states, and the same crack detection line is used in both states. Specific resistance values ​​can be obtained in both states, resulting in highly comparable detection results and more accurate detection of cracks in the display panel.

[0041] In one exemplary embodiment, along the extension direction of the electrical test area, the first electrical test pad and the second electrical test pad are located at opposite ends of the electrical test area; along the extension direction of the bonding pin area, the first bonding pin and the second bonding pin are located at opposite ends of the bonding pin area.

[0042] In one exemplary embodiment, along the extension direction of the bonding pin region, the third bonding pin and the fourth bonding pin are located at opposite ends of the bonding pin region, and the third bonding pin and the fourth bonding pin are located between the first bonding pin and the second bonding pin.

[0043] In one exemplary embodiment, the bezel area further includes a driver chip area located on the side of the bonding pin area close to the display area. The driver chip area includes a first driver test pad and a second driver test pad. The bonding pin area further includes a fifth bonding pin and a sixth bonding pin. One end of the panel crack detection line is connected through the first driver test pad and the fifth bonding pin, and the other end of the panel crack detection line is connected through the second driver test pad and the sixth bonding pin.

[0044] In this embodiment, by connecting the panel crack detection line and the bonding pin of the driver chip area, after the integrated circuit is bonded to the display panel, the panel crack detection line can be detected by the integrated circuit bonded to the driver chip area, and can be compared with the preset upper limit of resistance, thus realizing another crack detection method in the display module state.

[0045] In one exemplary embodiment, the border area may further include a unit test area located on the side of the driver chip area near the display area, and the unit test area includes multiple unit test pads.

[0046] Figure 2 This is a schematic diagram of the structure of the display panel provided in an embodiment of this disclosure. Figure 2 As shown, the display panel includes a display area 100 and a border area surrounding the display area. On the side away from the display area 100, the border area includes a bonding pin area 400 and an electrical test area 500. The electrical test area 500 is located on the side of the bonding pin area 400 away from the display area 100. The bonding pin area 400 includes at least a first bonding pin 411 and a second bonding pin 412. The electrical test area 500 includes at least a first electrical test pad 511 and a second electrical test pad 512. The display panel also includes a panel crack detection line 101 surrounding the display area 100. One end of the panel crack detection line 101 is connected to the first electrical test pad 511 through the first bonding pin 411, and the other end of the panel crack detection line 101 is connected to the second electrical test pad 512 through the second bonding pin 412. When detecting cracks in the display panel while it is in its display panel state, a detection signal can be input through the first electrical test pad 511 and the second electrical test pad 512 to detect the resistance value of the panel crack detection line 101. The presence of cracks on the display panel can be determined by the resistance value of the panel crack detection line 101. Figure 2 As shown, along the extension direction of the electrical test area 500, the first electrical test pad 511 and the second electrical test pad 512 may be located at opposite ends of the electrical test area 500; along the extension direction of the bonding pin area 400, the first bonding pin 411 and the second bonding pin 412 may be located at opposite ends of the bonding pin area 400.

[0047] Figure 2The illustration uses a rectangular shape for both the display panel and the display area as an example. In other embodiments, the shape of the display panel can be a triangle, a quadrilateral of other shapes, a polygon, or an irregular shape, etc. The shape of the display area can be the same as or different from the shape of the display panel, and this disclosure does not impose any limitations on this. In an exemplary embodiment, the display panel can include at least two display areas. A separate panel crack detection line can be set for each display area, or multiple display areas can share a single panel crack detection line, and this disclosure does not impose any limitations on this.

[0048] In one exemplary embodiment, the bonding pin area 400 further includes a third bonding pin 413 and a fourth bonding pin 414; one end of the panel crack detection line 101 is connected to the third bonding pin 413, and the other end of the panel crack detection line is connected to the fourth bonding pin 414.

[0049] In an exemplary embodiment, in the display module state, the resistance value of the panel crack detection line 101 can be directly detected through the third bonding pin 413 and the fourth bonding pin 414, thereby obtaining the specific resistance value of the panel crack detection line 101. By comparing the resistance value in the display module state with the resistance value in the display panel state, cracks existing in the display panel can be detected more accurately.

[0050] In an exemplary embodiment, the third bonding pin 413 and the fourth bonding pin 414 may be located at opposite ends of the bonding pin area 400 along the extending direction of the bonding pin area 400. In an exemplary embodiment, the first bonding pin 411 may be located on the side of the third bonding pin 413 near the edge, the second bonding pin 412 may be located on the side of the fourth bonding pin 414 near the edge, and the third bonding pin 413 and the fourth bonding pin 414 may be located between the first bonding pin 411 and the second bonding pin 412. This disclosure does not limit this.

[0051] In an exemplary embodiment, the bezel area further includes a driver chip area 300, which is located on the side of the bonding pin area 400 near the display area 100. The driver chip area 300 includes a first driver test pad 311 and a second driver test pad 312. The bonding pin area 400 also includes a fifth bonding pin 415 and a sixth bonding pin 416. One end of the panel crack detection line 101 is connected through the first driver test pad 311 and the fifth bonding pin 415, and the other end of the panel crack detection line 101 is connected through the second driver test pad 312 and the sixth bonding pin 416. In the display module state, the panel crack detection line 101 can be detected by the integrated circuit bonded to the driver chip area 300, and can be compared with a preset upper limit resistance value, thus realizing another crack detection method in the display module state. Figure 2The connection relationship between the first driving test pad 311 and the second driving test pad 312 and the panel crack detection line 101 is not shown. In practical applications, the connection method between the two can be designed as needed.

[0052] In the exemplary embodiment, when detection is performed using the first driving test pad 311 and the second driving test pad 312 of the driving chip area 300, the accurate resistance value of the panel crack detection line cannot be obtained. Therefore, the first driving test pad 311, the second driving test pad 312, the fifth bonding pin 415, and the sixth bonding pin 416 can be omitted, further reducing the number of test pads that need to be set. In practical applications, the settings can be configured as needed, and this disclosure does not impose any limitations on this.

[0053] In an exemplary embodiment, the border area may further include a unit test area (not shown), which may be located on the side of the driver chip area 300 near the display area 100, and the unit test area may include multiple unit test pads (not shown).

[0054] This disclosure also provides a crack detection method applied to the above-mentioned display panel. The method includes: inputting a first test signal to a first electrical test pad, receiving a second test signal returned by a second electrical test pad, determining a test resistance value of a crack detection line on the panel based on the first test signal and the second test signal, and determining whether a crack exists in the display panel based on the test resistance value.

[0055] In one exemplary embodiment, before inputting a first test signal to the first electrical test pad, the method further includes: determining the range of initial resistance values ​​for the panel crack detection line.

[0056] In this embodiment, the initial resistance value is the design value of the panel crack detection line. The initial resistance value of the panel crack detection line can be calculated based on parameters such as the line width and length of the designed line. The initial resistance value of the panel crack detection line is a fixed value. However, during the manufacturing process of the display panel, due to process reasons, the line width, length, and other parameters of the panel crack detection line may fluctuate, leading to changes in the initial resistance value. Furthermore, during resistance value testing, different environmental parameters and the use of different testing instruments may cause deviations in testing conditions, resulting in a reasonable fluctuation range between the measured resistance value and the initial resistance value. Therefore, the range of the initial resistance value of the panel crack detection line can be determined by comprehensively considering the fluctuations in the initial resistance value caused by process factors, measurement factors, and other possible influencing factors. When the measured resistance value falls within this range, it can be considered that the measured resistance value is close to the initial resistance value, and the display panel does not have cracks. The range of the initial resistance value of the panel crack detection line can be determined as needed, and this disclosure does not impose any limitations on it.

[0057] In one exemplary embodiment, determining whether a display panel has a crack based on a test resistance value includes: comparing the test resistance value with a range of initial resistance values; if the test resistance value is within the range of the initial resistance value, determining that the display panel has no crack; if the test resistance value is outside the range of the initial resistance value, determining that the display panel has a crack.

[0058] In an exemplary embodiment, the range of the initial resistance value can be set according to the calculation results or empirical values. For example, the range of the initial resistance value can be within 30% above or below the initial resistance value. If the initial resistance value is 100 kΩ, the range of the initial resistance value can be from 70 kΩ to 130 kΩ. This disclosure does not limit this.

[0059] When a crack in the display panel causes the crack detection line to break, the test resistance value will be significantly higher than the initial resistance value, which is clearly unreasonable. Even when a crack exists in the display panel but does not cause the crack detection line to break, the test resistance value will still be higher than the initial resistance value, but the value may not be excessively high. Therefore, the presence of a crack in the display panel can be accurately determined based on the range of the initial resistance value.

[0060] In an exemplary embodiment, in the display module state, the resistance value of the panel crack detection line 101 can be directly detected through the third bonding pin 413 and the fourth bonding pin 414, thereby obtaining the specific resistance value of the panel crack detection line 101. For example, a multimeter can be connected to the third bonding pin 413 and the fourth bonding pin 414 to detect the resistance value of the panel crack detection line 101. The crack information obtained by judging by the resistance value has a higher accuracy rate, enabling the early detection of defective products. Furthermore, the crack detection results in the display panel state and the crack detection in the display module state can be compared, effectively improving the accuracy of crack detection.

[0061] In an exemplary embodiment, the first test signal and the second test signal may include a current signal or a voltage signal, and other detection parameters may be selected as needed, which is not limited in this disclosure.

[0062] Figure 3 This is a schematic diagram illustrating crack detection in the display panel state. (Example) Figure 3 As shown, the resistance detection device can be connected to the first electrical test pad 511 and the second electrical test pad 512. The resistance detection device can input a first test signal to the first electrical test pad 511 and receive a second test signal returned from the second electrical test pad 512.

[0063] In an exemplary embodiment, the resistance detection device can be connected to a PC (not shown). The PC can output a first test signal to the resistance detection device, which may be a timing signal. The resistance detection device returns a received second test signal to the PC. The PC can display the range of the test resistance value and the initial resistance value using images, numbers, or other methods. Based on the comparison result of the range of the test resistance value and the initial resistance value, it can provide information on whether the display panel has a crack. Alternatively, the PC can display the range of the test resistance value and the initial resistance value using images, numbers, or other methods, allowing a manual judgment to determine whether the display panel has a crack. This disclosure does not limit this approach.

[0064] In an exemplary embodiment, the first electrical test pad 511 and the second electrical test pad 512 can be connected to a printed circuit board (PCB) via a flexible circuit board (FPC). An input channel and an output channel for test signals can be provided between the flexible circuit board and the printed circuit board. The printed circuit board can be connected to the PC. The resistance detection device can be a resistance detection module provided on the PC. This disclosure does not limit this.

[0065] Figure 4 A resistance distribution diagram of the test resistance value of the panel crack detection line in an exemplary embodiment. Figure 4 The horizontal axis represents the number of display panels (Pcs), and the vertical axis represents the resistance value in kiloohms (kΩ). Figure 4 The initial resistance value of the panel crack detection line ranges from 67kΩ to 124kΩ. After testing the panel crack detection lines of 900 display panels, the obtained test resistance values ​​are all within the range of the initial resistance values, indicating that there are no cracks on the 900 display panels. In an exemplary embodiment, EAC TSP software can be used to test the resistance value of the panel crack detection line in the display panel state, and this disclosure does not limit this.

[0066] Table 1 is a comparison table of the test resistance values ​​of different samples in the display panel state and the display module state in the exemplary embodiment. In Table 1, 1 to 8 represent different samples, MDL state represents the display module state of the sample, PNL state represents the display panel state of the sample, and the display panel (samples 1 to 8) are from... Figure 4 The eight display panels selected from the statistics are shown in Table 1. The resistance values ​​are in kiloohms. In an exemplary embodiment, in the display module state, a multimeter can be connected to the third bonding pin 413 and the fourth bonding pin 414 to detect the resistance value of the panel crack detection line 101.

[0067] Table 1

[0068]

[0069] As shown in Table 1, for samples 1 through 7, regardless of whether they are in the PNL or MDL state, the test resistance values ​​of the panel crack detection line are all within the range of the initial resistance values, indicating that samples 1 through 7 do not have cracks in either the display panel state or the display module state. For sample 8, the test resistance value in the PNL state is within the range of the initial resistance values; however, the test resistance value in the MDL state is significantly too high, indicating that a crack appeared in the display panel of sample 8 during the manufacturing process from the display panel to the display module.

[0070] This disclosure also provides a display module, including a display panel and an integrated circuit. The display panel includes a display area and a bezel area surrounding the display area. Along the side away from the display area, the bezel area includes a driver chip area and a bonding pin area. The driver chip area is located on the side of the bonding pin area closer to the display area. The integrated circuit is bonded to the driver chip area. The bonding pin area includes at least a third bonding pin and a fourth bonding pin. The display panel also includes a panel crack detection line disposed around the display area. One end of the panel crack detection line is connected to the third bonding pin, and the other end of the panel crack detection line is connected to the fourth bonding pin.

[0071] In an exemplary embodiment, the display module may be made from the display panel in the above embodiments. The structure of the display panel can be referred to the description in the above embodiments, and will not be repeated here.

[0072] In an exemplary embodiment, when the display module is in operation, a resistance testing device such as a multimeter can be used to test the resistance value of the crack detection line on the panel. This disclosure does not limit the type of resistance testing device used.

[0073] This disclosure also provides a crack detection method applied to the aforementioned display module, the method comprising:

[0074] Input a third test signal to the third bonding pin, receive a fourth test signal returned from the fourth bonding pin, obtain the test resistance value of the panel crack detection line based on the third and fourth test signals, and determine whether there is a crack in the display panel based on the test resistance value.

[0075] The crack detection method provided in this disclosure can detect the resistance value of the crack detection line on the display module panel without relying on integrated circuits, and can obtain the specific resistance value of the crack detection line in the display module state. Furthermore, it can be compared with the specific resistance value of the crack detection line obtained in the display panel state to better determine whether a crack exists on the display panel.

[0076] In an exemplary embodiment, the third test signal and the fourth test signal may be current signals or voltage signals, or other detection signals, and this disclosure does not limit them.

[0077] This disclosure also provides a display device, including the display module described in any of the above embodiments. The display device can be any product or component with display function, such as an OLED display, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator, and this disclosure is not limited thereto.

[0078] While the embodiments disclosed in this invention are as described above, the content is merely for the purpose of facilitating understanding of the invention and is not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and changes to the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection of this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A display panel, characterized by, The display panel comprises a display area and a frame area located around the display area; The frame area comprises a driving chip area, a binding pin area and an electrical test area along a side away from the display area, the driving chip area is located on a side of the binding pin area close to the display area, and the electrical test area is located on a side of the binding pin area away from the display area; the binding pin area comprises at least a first binding pin and a second binding pin, and the electrical test area comprises at least a first electrical test pad and a second electrical test pad; The display panel further comprises a panel crack detection line arranged around the display area, one end of the panel crack detection line is connected to the first electrical test pad through the first binding pin, and the other end of the panel crack detection line is connected to the second electrical test pad through the second binding pin; In a display panel state, the display panel is not bound with an integrated circuit, the electrical resistance value of the panel crack detection line is tested through the electrical test area, and whether the display panel has a crack is detected; the electrical test area is arranged to be cut off after the crack test of the display panel is performed, so that the integrated circuit is bound on the display panel to form a display module.

2. The display panel of claim 1, wherein, The binding pin area further comprises a third binding pin and a fourth binding pin; one end of the panel crack detection line is connected to the third binding pin, and the other end of the panel crack detection line is connected to the fourth binding pin.

3. The display panel of claim 2, wherein, The first electrical test pad and the second electrical test pad are located at opposite ends of the electrical test area along an extension direction of the electrical test area; The first binding pin and the second binding pin are located at opposite ends of the binding pin area along an extension direction of the binding pin area.

4. The display panel of claim 3, wherein, The third binding pin and the fourth binding pin are located at opposite ends of the binding pin area along an extension direction of the binding pin area, and the third binding pin and the fourth binding pin are located between the first binding pin and the second binding pin.

5. The display panel of claim 1 or 2, wherein, The driving chip area comprises a first driving test pad and a second driving test pad; The binding pin area further comprises a fifth binding pin and a sixth binding pin; one end of the panel crack detection line is connected to the first driving test pad and the fifth binding pin, and the other end of the panel crack detection line is connected to the second driving test pad and the sixth binding pin.

6. The display panel of claim 5, wherein, The frame area further comprises a unit test area, the unit test area is located on a side of the driving chip area close to the display area, and the unit test area comprises a plurality of unit test pads.

7. A crack detection method characterized by, The method applied to the display panel of any one of claims 1 to 6 comprises the following steps in a display panel state, wherein the display panel is not bound with an integrated circuit: a first test signal is input to the first electrical test pad; a second test signal returned by the second electrical test pad is received; a test resistance value of the panel crack detection line is determined according to the first test signal and the second test signal, and whether the display panel has a crack is determined according to the test resistance value.

8. The crack detection method according to claim 7, characterized by, Before inputting the first test signal to the first electrical property test pad, the method further comprises: determining a value range of an initial resistance value of the panel crack detection line.

9. The crack detection method according to claim 8, characterized by, The value range of the initial resistance value comprises: greater than or equal to 0.7 times the initial resistance value and less than or equal to 1.3 times the initial resistance value.

10. The crack detection method according to claim 8, characterized by, The determining whether the display panel has a crack according to the test resistance value comprises: comparing the test resistance value with the value range of the initial resistance value, in the case that the test resistance value is within the value range of the initial resistance value, determining that the display panel does not have a crack; in the case that the test resistance value is outside the value range of the initial resistance value, determining that the display panel has a crack.

11. A display module, characterized by The display panel comprises a display panel and an integrated circuit, the display panel is the display panel after the crack test of the display panel of claim 1 and the cutting off of the electrical property test area, the display panel after the cutting off of the electrical property test area comprises a display area and a frame area located at the periphery of the display area, the frame area comprises a driving chip area and a binding pin area along the side away from the display area, the driving chip area is located on the side of the binding pin area close to the display area; the integrated circuit is bound to the driving chip area; The binding pin area comprises at least a third binding pin and a fourth binding pin; the display panel further comprises a panel crack detection line arranged around the display area, one end of the panel crack detection line is connected with the third binding pin, and the other end of the panel crack detection line is connected with the fourth binding pin.

12. A crack detection method characterized by, The method is applied to the display module of claim 11, and the method comprises the following steps in the case that the integrated circuit is bound to the display panel after the cutting off of the electrical property test area in the display module state: inputting a third test signal to the third binding pin; receiving a fourth test signal returned by the fourth binding pin; obtaining a test resistance value of the panel crack detection line according to the third test signal and the fourth test signal, and determining whether the display panel has a crack according to the test resistance value.

13. A display device comprising: The display module comprises the display module of claim 11.

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