micro thermal cycler

Abstract

The present invention relates to a micro-thermal cycler comprising at least one micro-reservoir, at least one temperature control assembly, at least one displacement unit, and at least one displacement drive, the at least one displacement unit comprising the at least one micro-reservoir or the at least one temperature control assembly, and the at least one displacement unit being movable along a first direction from a first position to a second position by the displacement drive, and wherein the at least one temperature control assembly thermally interacts with the at least one micro-reservoir in the first position, and the displacement drive operably couples the at least one displacement unit and another temperature control assembly or another micro-reservoir.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Luxembourg Patent Application No. LU102014, filed on August 25, 2020, entitled “Microthermal Circulator”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to a micro thermal circulator, and more particularly to a thermal circulator for a microelectromechanical system. Background Technology

[0004] A thermal cycler is a device that repeatedly heats and cools a sample at a specific temperature.

[0005] Thermal cyclers can be used for various temperature cycling programs; however, the most commonly used programs are for nucleic acid amplification. For example, polymerase chain reaction (PCR) typically requires analytes and reagents to be cycled through three temperature steps multiple times, such as denaturation at 94°C, annealing at 50°C, and then extension at 72°C. Furthermore, depending on the cycling program, there may be only two or even one temperature step. The temperatures in each step can be selected as needed and / or desired.

[0006] Thermal cyclers can be used for a variety of testing applications, including pathogen detection, antigen typing, disease diagnosis, sequencing, and genotyping. Summary of the Invention

[0007] To enable rapid, low-cost, and on-site testing, thermal cyclers can be miniaturized onto a chip. The micro thermal cycler provided by this invention has a size range of 1.5 mm to 60 mm in thickness, 3 mm to 300 mm in width, and 3 mm to 150 mm in depth. For larger sizes, conventional manufacturing processes can be used instead of microelectromechanical systems (MEMS).

[0008] In the context of this invention, a temperature control component is a component capable of generating and / or removing heat in a controlled manner via active or passive means. Examples of temperature control components include thermoelectric components, resistive components, radiative components, etc. When the temperature control component functions as a cooling component, it may also include a combination of passive components, such as heat sinks, radiators, or other heat-conducting components, or active components such as thermoelectric components or fans. The temperature control component can also function as both a heating and cooling component, for example, when it is a thermoelectric component (e.g., a thermoelectric cooling chip (TEC)). The temperature control component can be integrated into the structure of a micro-thermal circulator or made as a detachable component. Furthermore, the temperature control component can be located inside or outside the micro-storage tank. A temperature control component inside the micro-storage tank can have the advantage that if the micro-storage tank is moved from one location to another, the micro-storage tank may already be heated or cooled to a ready state. Such a temperature control component can be located below or above at least one micro-storage tank, or within at least one sidewall of the micro-thermal circulator adjacent to the micro-storage tank. If movement is described along or in one direction, it should be understood that the movement can be reversed, for example, in opposite directions (bidirectional). Direction should be understood as a path of movement and not unidirectional. Furthermore, if the movement involves more than one direction, any sequence of movement from the starting position to the desired ending position is possible and disclosed. That is, movement can begin entirely along a first direction and then follow a second direction, or vice versa, or move partially in two directions simultaneously or alternately in each direction. The same applies to movements in three directions.

[0009] According to one aspect of the invention, a micro-thermal circulator is provided, comprising at least one micro-storage tank, at least one temperature control component, at least one displacement unit, and at least one displacement transmission mechanism. The at least one displacement unit comprises either the at least one micro-storage tank or the at least one temperature control component. The at least one displacement unit can be moved from a first position to a second position along a first direction via the displacement transmission mechanism, and vice versa. The at least one temperature control component thermally acts on the at least one micro-storage tank at the first position. This can be to cool the contents (e.g., a sample or analyte) of the at least one micro-storage tank and / or the contents of the at least one micro-storage tank. The displacement transmission mechanism operatively couples the at least one displacement unit to another temperature control component or another micro-storage tank. That is, at least one displacement unit can be moved via the displacement transmission mechanism such that at least one micro-storage tank and one or more temperature control components can move relative to each other. It is also possible that at least one micro-storage tank and one or more temperature control components can both move relative to each other.

[0010] In other words, the at least one displacement unit can move between two positions. The at least one displacement unit may comprise one or more micro-reservoirs or one or more temperature control components. The micro-reservoirs or temperature control components may be positioned to protrude or recess into the at least one displacement unit. The temperature control components apply heat to one or more micro-reservoirs in an alternating manner, causing the one or more micro-reservoirs to move and thus undergo changes in thermal conditions, or the one or more temperature control components to move. Movement of the temperature control components and one or more micro-reservoirs relative to each other is also possible. This movement or displacement is driven by at least one displacement transmission mechanism, which may be, for example, an actuator or an externally coupled actuator. The displacement transmission mechanism can be implemented by various forces, such as electrostatic force, piezoelectric force, electromagnetic force, or thermal force. In addition to motion actuation, the displacement transmission mechanism may also act on at least one displacement unit in other ways, such as through motion attenuation and sag compensation.

[0011] Such a micro-thermal circulator can have the following advantages: the contents of the micro-storage tank can be subjected to rapid changes in heating conditions. For example, in a first position, the contents of the micro-storage tank can be heated or cooled, and then the micro-storage tank can be moved to a second position to cool (e.g., actively or passively) or heat (e.g., in the case of pre-cooling, determined by the ambient temperature) the contents of the micro-storage tank. For example, the micro-storage tank and the first temperature control component at least partially overlap in the first position. The overlap can be in any direction between the first temperature control component and the micro-storage tank. There can be more than one displacement unit, each displacement unit containing one or more micro-storage tanks and / or one or more temperature control components. The one or more displacement units can be displaced or moved by one or more displacement drive mechanisms. That is, one displacement drive mechanism can move one or more displacement units, or multiple displacement drive mechanisms can move multiple displacement units, or any combination thereof.

[0012] Furthermore, the micro thermal circulator is a planar three-dimensional structure comprising one or more surfaces. These surfaces are stacked. This design allows for miniaturization of the micro thermal circulator. It also makes its fabrication easier to standardize. In the context of this application, a planar structure is one that extends in three dimensions, however, it is significantly smaller in one of these dimensions than the other two. In other words, the micro thermal circulator can be implemented on or on a silicon wafer.

[0013] According to another aspect of the invention, the micro-thermal circulator further includes a second temperature control component, wherein the second temperature control component cools or heats the at least one micro-storage tank at the first position or the second position. The second temperature control component may also be included in a displacement unit. In other words, the first temperature control component and / or the micro-storage tank moves to the first position, wherein the first temperature control component heats the micro-storage tank. The second temperature control component and / or the micro-storage tank moves to the second position, wherein the second temperature control component heats the micro-storage tank. For example, the micro-storage tank and the first temperature control component at least partially overlap at the first position, and the micro-storage tank and the second temperature control component at least partially overlap at the second position. The temperature control component and the micro-storage tank may overlap in any direction.

[0014] This can have the following advantages: for example, the first temperature control component heats the contents of the micro-storage tank while the second temperature control component cools the contents of the micro-storage tank. This enables rapid temperature changes in the contents of the micro-storage tank. Another advantage is the ability to pre-preheat unoccupied positions. That is, for example, if the micro-storage tank and / or the first temperature control component are in the first position, the second temperature control component can be preheated or pre-cooled, and vice versa.

[0015] The micro-thermal circulator may include a second temperature control component located in the same position as the first temperature control component, such as the first position. The second temperature control component may be stacked perpendicularly to the first temperature control component, or it may be adjacent to the first temperature control component in the same plane. The temperature control components may also be arranged in an alternating manner. Accordingly, cooling and heating can be achieved at the locations of the temperature control components. For example, the first temperature control component acts on a micro-storage tank located at the first position, then the storage tank or micro-storage tank is moved to a second position. Then the storage tank or micro-storage tank is moved back to the first position, at which point the second temperature control component acts on the micro-storage tank.

[0016] According to another aspect of the invention, the micro-thermal circulator further includes at least one receiving structure, wherein the at least one receiving structure holds the at least one displacement unit and includes at least one micromechanical structure. The micromechanical structure may include a combination of one or more micromechanical components, such as suspension components, flexible components, motion guides, stabilizing components, pivots, and / or motor components. This has the advantage of allowing for more precise control of the temperature control components and / or the displacement of the micro-storage tank.

[0017] According to another aspect of the invention, the micro-thermal circulator further includes a third position and / or a fourth position. In the third position, the at least one micro-reservoir is accessible via at least one connector port to allow a substance to be transferred or moved from the micro-reservoir. The fourth position is a transport position for the displacement unit. This can have the advantages that the substance can be fed into and out of the micro-reservoir in a defined manner by active or passive means (e.g., by mechanical components, fluid systems, pumps, or manual operation), and that if the micro-thermal circulator needs to be moved, the movable displacement unit can be held in a dedicated position to prevent damage to the micro-thermal circulator.

[0018] According to another aspect of the invention, the micro-thermal circulator further includes at least one readout sensor, which serves to sense the contents of the at least one micro-reservoir. The at least one readout sensor is located at a defined position either inside or outside the at least one micro-reservoir. Detection of the contents of the micro-reservoir is achieved by means of displacement of the micro-reservoir and / or the at least one readout sensor. This has the advantage that the contents of at least one micro-reservoir can be analyzed according to desired characteristics. Characteristics used for detection and / or monitoring may include fluorescence, light, color, impedance, charge, or other visual, chemical, or electrical signals. Multiple readout sensors may be present, both fixed and / or movable. The readout sensors can utilize various methods, such as optical detection, electrostatic detection, and / or electrochemical detection. The sensors can simultaneously detect a single feature or multiple features of the micro-reservoir. Where additional circuitry or components, such as a fluorescent excitation diode, are required for the readout sensor, this should be understood to be included in the definition of the readout sensor.

[0019] According to another aspect of the invention, the at least one displacement unit can be displaced in a second direction different from the first direction, for example, perpendicular to the first direction. Different positions can be reached by the displacement of the at least one displacement unit in at least one direction. This can have the advantages of better spatial separation between positions, improved functional reliability of each position, such as improved reading or thermal conductivity. Furthermore, it has the advantage of reducing the mutual influence between one position and another.

[0020] According to another aspect of the invention, the at least one displacement unit can be fixed in at least one position. This can have the advantages of more accurate and reliable positioning and / or heat transfer by one or more temperature control components and / or safer transportation of the micro-thermal circulator.

[0021] According to another aspect of the invention, the displacement along at least one direction is rotational motion and / or linear motion. This can have the advantage that the design of the micro thermal circulator can be adapted to different system sizes or shapes.

[0022] According to another aspect of the invention, the micro-thermal circulator further includes at least one thermal sensor located inside and / or outside the micro-storage tank, the thermal sensor sensing temperature at a specific location within the micro-thermal circulator. This can have the advantage of allowing the temperature of the contents in the micro-storage tank to be known and measured continuously or at specific points in time. The thermal sensor can be integrated into the structure of the micro-thermal circulator or made into a detachable component.

[0023] According to another aspect of the invention, at least one hole is located near the temperature control component and / or the at least one micro-reservoir, and wherein the at least one hole is a recess and / or a groove. The recess and / or groove can be a through hole or a blind hole. The hole can be filled with air and / or an insulating material. This can have the advantage that at least one micro-reservoir or temperature control component is better isolated from the temperature of the surrounding structure and / or environment. This can have a further advantage that the required temperature treatment time for the contents of the micro-reservoir can be shortened. This can also have a further advantage that there is better heat flow from the temperature control component to the micro-reservoir.

[0024] According to another aspect of the invention, the at least one miniature storage tank further includes an openable lid. This can have the advantage that the contents can be better contained within the miniature storage tank when it is displaced. Furthermore, the contents are better protected from external contamination. The lid can be a movable component or a passive opening; however, in the case of a passive opening, the lid is considered part of the miniature storage tank.

[0025] According to another aspect of the invention, the at least one micro-reservoir and / or the at least one temperature control component includes a material coating to improve thermal and / or reactivity. This includes coating to improve thermal conductivity or coating to prevent cross-reaction between the reaction liquid and the substrate. The coating can be applied to the side or bottom of the micro-reservoir that contacts the sample and the temperature control component. The bottom side can be one side of the at least one micro-reservoir to which the temperature control component exerts heat. The bottom side can also be the bottom side of the at least one temperature control component, i.e., the side of the component that is neither hot nor cold. This can have the advantage of shortening the time required for temperature treatment of the contents in the micro-reservoir. This can have a further advantage of making the heat conduction and / or operation of the micro-thermal circulator more efficient and / or reliable because the coating prevents reaction with the material of the micro-reservoir.

[0026] According to another aspect of the invention, the interior of the at least one micro-storage tank includes at least one irregularly shaped surface. This may include a structured surface profile to increase the surface area. This can have the advantage of shortening the time required for temperature treatment of the contents in the micro-storage tank. It can also have the further advantage of making the heat conduction and / or operation of the micro-thermal circulator more efficient and / or reliable.

[0027] According to another aspect of the invention, the micro thermal circulator further includes control signals and / or sensing signals that can be dynamically controlled and / or pre-programmed. Components controllable or readable by these signals include any active components, such as temperature control components, readout sensors, thermal sensors, displacement transmission mechanisms, openable lids, and locking mechanisms. This can have the further advantage of enabling various thermal cycling protocols to be implemented with a single device. Components for implementing control or readings of the micro thermal circulator, such as control circuitry, computing units, power controls, memory, and / or display units, can be integrated within the micro thermal circulator or externally connected.

[0028] According to another aspect of the invention, the micro-thermal circulator further includes at least one position sensor. The position sensor detects the position of at least one displacement unit within the micro-thermal circulator. The position sensor can be integrated into the micro-thermal circulator or be a detachable component of the micro-thermal circulator. Alternatively, it can be implemented using a component including a displacement transmission mechanism. That is, the position sensor can be a separate component, or it can be, for example, an independent frequency signal within the displacement transmission mechanism.

[0029] According to another aspect of the present invention, a reaction method is provided, comprising the steps of: placing a sample and a plurality of reaction materials into at least one micro-reservoir; moving the micro-reservoir from a first position to a second position; and heating or cooling the sample at the first position and the second position according to a predetermined procedure. This can have the advantage that the sample in the micro-reservoir can be effectively subjected to heat treatment.

[0030] According to another aspect of the invention, the space not occupied by the micro-storage tank for preheating or precooling can be shortened.

[0031] According to another aspect of the invention, the characteristics of the sample can be detected continuously or at specific time points. This can have the advantage that the characteristics of the sample can be detected automatically within a micro-thermal cycler, rather than through manual operation outside the micro-thermal cycler. Furthermore, the time required to detect important characteristics of the sample can be reduced and / or detected in real time.

[0032] According to another aspect of the invention, heating and / or cooling are cyclical. Accordingly, repeated cyclical temperature treatment steps can be performed on the contents of the micro-storage tank.

[0033] According to another aspect of the invention, heating and / or cooling are dynamically controlled by a plurality of variable signals generated based on a plurality of temperature readings. This can be achieved using a control loop, such as a proportional-integral-derivative controller. This can have the advantage of allowing for more precise control of the thermal control components.

[0034] According to another aspect of the invention, a computer program product is provided for use in a laminated fabrication apparatus. The computer program product comprises a plurality of instructions, which, when loaded and executed by the laminated fabrication apparatus, cause the apparatus to manufacture a micro-thermal circulator as described in any of the preceding aspects. This can have the advantage that the micro-thermal circulator can be manufactured more easily.

[0035] Furthermore, the present invention has a scalable architecture and can be scaled down, scaled up, or adjusted to various configurations to achieve improved performance and / or functionality.

[0036] This invention can be configured for single-use and / or reusable applications.

[0037] This invention can be manufactured using any combination of technologies, including but not limited to: semiconductor component manufacturing processes, microelectromechanical systems (MEMS) manufacturing processes, chip packaging processes, 3D printing technology, printed circuit board (PCB) manufacturing processes, and / or any other means of manufacturing small devices.

[0038] This invention can be manufactured using a combination of various materials, including but not limited to: silicon, glass, polymers and / or metals.

[0039] This invention can be used as a standalone thermal cycler chip / device, or integrated with other functions into an integrated circuit chip or system.

[0040] To better understand the present invention, the latter will be described with reference to the accompanying drawings.

[0041] The following diagrams are shown in a very simplified and illustrative manner.

[0042] Figure 1 The first embodiment of the present invention is schematically illustrated and includes a temperature control component.

[0043] Figure 2 The second embodiment of the invention, having two temperature control components, is illustrated schematically.

[0044] Figure 3 The third embodiment of the invention, having four positions, is schematically illustrated.

[0045] Figure 4The fourth embodiment of the invention, having six positions, is schematically illustrated.

[0046] Figure 5 Schematic representation similar to Figure 2 The fifth embodiment of the present invention.

[0047] Figure 6 Schematic representation similar to Figure 4 The sixth embodiment of the present invention.

[0048] Figure 7 This schematically illustrates the possible configurations of the temperature control components.

[0049] Figure 8 The seventh embodiment of the present invention is shown schematically.

[0050] Figure 9 and Figure 10 schematic representation Figure 8 Variations of the illustrated embodiment.

[0051] Figure 11 The eighth embodiment of the present invention is shown schematically.

[0052] Figure 12 and Figure 13 schematic representation Figure 11 Variations of the illustrated embodiment.

[0053] Figure 14 The ninth embodiment of the present invention is shown schematically.

[0054] Figure 15 The tenth embodiment of the present invention is illustrated schematically.

[0055] Figure 16 The eleventh embodiment of the present invention is shown schematically.

[0056] Figure 17 The twelfth embodiment of the present invention is illustrated schematically.

[0057] Figure 18 The thirteenth embodiment of the present invention is shown schematically.

[0058] Figure 19 The fourteenth embodiment of the present invention is illustrated schematically.

[0059] Figure 20 The fifteenth embodiment of the present invention is illustrated schematically.

[0060] Figure 21 The sixteenth embodiment of the present invention is illustrated schematically.

[0061] Figure 22 The seventeenth embodiment of the present invention is shown schematically.

[0062] Figure 23 The eighteenth embodiment of the present invention is shown schematically.

[0063] Figure 24 The nineteenth embodiment of the present invention is shown schematically.

[0064] Figure 25 The twentieth embodiment of the present invention is illustrated schematically.

[0065] Figure 26 This schematically represents movement in the second direction.

[0066] Figure 27 The illustration shows examples of grooves and recesses applied to components of a micro thermal circulator.

[0067] It should be noted that in the different embodiments described herein, the same parts / components are numbered using the same reference numerals; however, the disclosure in the detailed description is applicable to all parts / components having the relevant reference numerals. Furthermore, the directional / positional indication terms selected in this description, such as up, up, down, down, lateral, and sideways, refer directly to the described figure and can be applied accordingly to a new position after a positional change or to another described position in another figure. Detailed Implementation

[0068] Please refer to Figure 1 . Figure 1 A first embodiment of the invention is shown. The micro-thermal circulator 10 includes a temperature control component 30 and a displacement unit 70, the displacement unit 70 further including a micro-storage tank 20. In the described embodiment, the displacement unit 70 and the micro-storage tank 20 are integral. However, the displacement unit 70 may include more than one micro-storage tank 20 (see below; this applies to all embodiments). The micro-storage tank 20 can be moved or displaced from a first position P1 to a second position P2 along a first direction D1 via a displacement transmission mechanism 60 (not shown). In the following description of all embodiments, the specific function of one or more temperature control components is explicitly stated; otherwise, they may heat or cool, or both. In other words, if only “temperature control component” is mentioned, they may heat or cool, or both. The disclosed method steps describe the function of the following embodiments.

[0069] exist Figure 1In this embodiment, the micro-storage tank 20 is located at a first position P1, wherein the temperature control component 30 can be thermally applied to the micro-storage tank 20, thereby affecting the contents (e.g., a sample) within the micro-storage tank 20. The temperature control component 30 can heat or cool the micro-storage tank 20. In one embodiment, the temperature control component 30 is parallel to the bottom of the micro-storage tank 20. However, the temperature control component described in this invention is not limited to this. The temperature control component can, for example, be oriented parallel to or parallel to the sidewall of the micro-storage tank, or located above the top of the micro-storage tank 20. It should also be understood that a micro-storage tank located above the temperature control component can also be implemented using a similar structure.

[0070] The micro-storage tank 20 can move along a first direction D1 from a first position P1 to a second position P2 (described here as a dashed line). In the second position, only ambient temperature acts on the micro-storage tank 20; therefore, if the micro-storage tank 20 is heated in the first position P1, it will also be cooled there, or if the micro-storage tank 20 is cooled (below ambient temperature) in the first position, it will be heated in the first position P1. The first position P1 and the second position P2 lie in the same plane containing the first direction D1. The plane defined in this invention can be a plane parallel to said direction.

[0071] Figure 2 The second embodiment is Figure 1 A variation of the first embodiment depicted. The micro-thermal circulator 10 of the second embodiment further includes a second temperature control component 40 located at a second position P2. The micro-storage tank 20 is movable between the two positions P1 and P2, and the temperature control component in the position not occupied by the micro-storage tank 20 can preheat or precool according to the temperature that the corresponding temperature control component should have. Figure 2 In this configuration, the micro storage tank 20 is located at the first position P1, so the second temperature control component 40 is not occupied and can therefore be preheated or precooled. Thus, when the micro storage tank 20 moves from the first position to the second position, the second temperature control component 40 is already at the required temperature. Then, the first temperature control component 30 can be preheated or precooled.

[0072] Figure 3 The third embodiment is Figure 1 The first embodiment and Figure 2 The second embodiment is a variant of the second embodiment. Compared to the second embodiment, the third embodiment further includes two additional positions: a third position P3 and a fourth position P4. Furthermore, the second embodiment includes a second direction D2 in which the displacement unit 70 (integrated with the micro-storage tank 20) ​​is movable.

[0073] The micro-storage tank 20 moves parallel to the first direction D1 and also to the second direction D2 to reach the third position P3. At the third position P3, contents or samples can be delivered into the micro-storage tank 20 via the connector port 80. The micro-storage tank 20 moves parallel to the first direction D1 and also to the second direction D2 to reach the fourth position P4. However, in this case, the fourth position P4 is opposite in position / direction to the third position P3. The displacement unit 70 / micro-storage tank 20 can be locked in the fourth position P4, for example, in the case of transport of a micro-thermal cycler. The temperature control components 30 and 40 are located in a coplanar plane that also includes the first direction D1. However, the first position P1 and the second position P2 can be located in different positions, such that, for example, the displacement unit 70 / micro-storage tank 20 can move in both directions D1 and D2 to reach one or both of them.

[0074] Figure 4 The fourth embodiment is Figure 3 A variation of the third embodiment. Here, the micro-thermal circulator 10 also includes two additional positions: a fifth position P5 and a sixth position P6. Additionally, a third temperature control component 41 is located at the fifth position P5, and a fourth temperature control component 42 is located at the sixth position P6. Figure 4 In the fourth embodiment, the first position P1, the second position P2, the fifth position P5, and the sixth position P6 are only accessible when the micro-storage tank 20 (which is also integrated with the displacement unit 70) moves in both directions D1 and D2. In contrast, in the third embodiment, the temperature control components 30 and 40 are located on a coplanar plane including the first direction D1. Figure 4 In the fourth embodiment shown, the first position P1, the second position P2, and the third position P3 are located on the same plane, and the fourth position P4, the fifth position P5, and the sixth position P6 are also located on another coplanar plane. In any case, any distribution of the positions on the respective planes is possible.

[0075] In the fourth embodiment, it is possible to preheat or precool the temperature control component not occupied by the displacement unit 70. Furthermore, it is possible for two components to simultaneously heat or cool the displacement unit 70 / miniature storage tank 20 at the same time or location, for example, if the distance between the relevant temperature control components is set accordingly, then temperature control component 30 and the third temperature control component 41 are located at the first position P1 or the fifth position P5. Alternatively, in the fourth embodiment, one position and one temperature control component may be omitted.

[0076] Figure 5 The fifth embodiment is similar to Figure 2 The second embodiment. However, in Figure 5The micro-thermal circulator 10 comprises four temperature control components 30a, 40a, 41b, and 42b located at a first position P1 and a second position P2. These temperature control components are stacked and layered on top of each other at each of the two positions. The upper temperature control components at each position (closer to the micro-storage tank 20) ​​are temperature-controlled heating components 40a and 30a. The lower temperature control components at each position (further away from the micro-storage tank 20) ​​are temperature-controlled cooling components 41b and 42b. However, the temperature control components can also be stacked and layered in other forms, such that the temperature control component closer to the micro-storage tank is a temperature-controlled cooling component (this applies to all embodiments). The temperature-controlled cooling components 41b and 42b can be TEC components (themoelectric cooler components, cooling coils).

[0077] Figure 6 The sixth embodiment is similar to Figure 4 The fourth embodiment and Figure 5 The fifth embodiment shown. Figure 6 The micro-thermal circulator 10 includes six temperature control components 30, 40, 41a, 42a, 43b, and 44b at four positions: a first position P1, a second position P2, a fifth position P5, and a sixth position P6. Here, the four temperature control components 41a, 42a, 43b, and 44b are stacked and layered on top of each other in each of positions P5 and P6. The upper temperature control components at each position (closer to the micro-storage tank 20) ​​are temperature-controlled heating components 41a and 42a. The lower temperature control components at each position (further away from the micro-storage tank 20) ​​are temperature-controlled cooling components 41b and 42b. The temperature-controlled cooling components 41b and 42b can be TEC components. Additional temperature control components 30 and 40 are also present at the first position P1 and the second position P2.

[0078] At Figure 7 The interlocking arrangement of the two temperature control components, temperature control component 41 and temperature control component 43, is shown in a top view (e.g., through the bottom of the miniature storage tank). This arrangement is exemplary and can be applied to all embodiments. For example, in Figure 5 and Figure 6 The temperature control components are stacked in the middle. It is also possible that the temperature control components are interlocked not only in the same plane but also in another plane, such as angled planes (vertical interlocking). The same interlocking arrangement is also possible for components such as displacement transmission mechanism 60 and / or reading sensor 90.

[0079] At Figure 8 The seventh embodiment is similar to Figure 5 The fifth embodiment is shown in cross-sectional view. Figure 8The middle section shows the stacked surface or multiple surfaces of the micro-thermal circulator 10. The micro-storage tank 20 includes a displacement unit 70 and a displacement transmission mechanism 60, which are arranged in two rows on the upper surface of the displacement unit 70. A single row or more than two rows of displacement transmission mechanisms 60 are also possible and can be applied in all embodiments. The "row" is located on one side of the opening of the micro-storage tank 20. The displacement unit 70 is movable in a first direction D1 and a second direction D2. Above the displacement unit 70 is the displacement transmission mechanism 60 together with the readout sensor 90. The displacement transmission mechanism 60 and the readout sensor 90 are positioned on a substrate 110, which serves as a support material. The substrate 110 includes a connector port 80 in the middle, which is in the projection of the stacked temperature control components 40a and 42b adjacent to the stacked temperature control components 30a and 41b located below the displacement unit 70. Temperature control components 30a and 40a are temperature-controlled heating components, and temperature control components 42b and 41b are temperature-controlled cooling components.

[0080] Figure 8 The upper part is a detailed illustration A showing a plan view indicating the cross-section in the middle section along direction A. A displacement transmission mechanism 60 is disposed on the side of the two readout sensors 90, corresponding to the displacement transmission mechanism 60 disposed on the displacement unit 70, so as to engage with the aforementioned displacement transmission mechanism 60. The displacement transmission mechanism 60 and the readout sensors 90 are located on the substrate 110 including the connector port 80, with their openings facing the opening of the micro-storage slot 20. The displacement transmission mechanisms 60 are spaced apart from each other in two rows. Figure 8 As can be seen in the detailed diagram A, two rows sandwich the readout sensor 90 and the connector port 80.

[0081] Figure 8The lower part is a detailed plan view of the cross-sectional view of the middle part in direction B, specifically a plan view of the upper surface of the displacement unit 70. The displacement unit 70 is coupled to the receiving structure 50 on both sides of the micro-storage tank. Here, the receiving structure is a micromechanical structure 120 comprising an elastic element structure, a spring-like structure. The receiving structure 50 holds the micro-storage tank 20 at the center of the micro-thermal circulator and below the connector port 80. In detailed diagram A, the displacement transmission mechanism 60 located on the upper surface of the displacement unit 70 has the same orientation as the displacement transmission mechanism 60 and can interact with it. Here, the displacement transmission mechanism 60 is an electrode. If the displacement transmission mechanism 60 is controlled, the displacement unit 70 can overcome the traction force of the receiving structure 50 and move along the first direction D1 to the first position P1 and the second position P2, where the temperature control components 30a, 40a, 41b, and 42b can thermally act on the micro-storage tank 20, and the micro-storage tank 20 is then positioned above (at least partially overlapping) the corresponding temperature control component. Furthermore, the micro-storage tank 20 can be displaced along the second direction D2 towards the temperature control components 30a, 40a, 41b, and 42b and / or the readout sensor 90 via the displacement transmission mechanism 60. Between the displacement transmission mechanisms 60 shown in detail (Figure B), there are openings for the micro-storage tank 20 to receive samples and / or reaction materials from the connector port 80. The temperature control components 30a, 40a, 41b, and 42b are also located on the substrate 110.

[0082] exist Figure 9 In, with similar Figure 8 The cross-sectional view depicts a variation of the seventh embodiment. (Compared to...) Figure 8 The difference is that, Figure 9 In the second position P2, there are only two stacked temperature control components 40a and 42b. Temperature control components 40a and 42b are also located on the substrate 110.

[0083] exist Figure 10 In, with similar Figure 8 The cross-sectional view depicts a variation of the seventh embodiment. (Compared to...) Figure 8 The difference is that, Figure 10 There are only two temperature control components, 30c and 40c, located at the first position P1 and the second position P2, respectively. The two temperature control components 30c and 40c are a temperature control combination assembly, which can be used to heat or cool the micro storage tank. The temperature control components are located on the substrate 110.

[0084] exist Figure 11 The eighth embodiment is shown in a cross-sectional view, and its arrangement is similar to that of the previous embodiment. Figure 8 .exist Figure 11The upper part also depicts a cross-sectional view of the micro-thermal circulator 10. Here, the micro-storage tank 20 includes a readout sensor 90 on its inner surface and a displacement transmission mechanism 60 on its lower side. The displacement unit 70, oriented toward and mechanically coupled to the fixed housing structure 50 (detailed icon B), also includes a displacement transmission mechanism 60 that engages with the displacement transmission mechanism 60 located on its lower side. This housing structure includes a micromechanical structure 120 in the form of a guide rail. Here, the displacement transmission mechanism 60 is an electrode. Above the micro-storage tank 20 are four temperature control components 30a, 40a, 41b, and 42b corresponding to those in the seventh embodiment. The corresponding activation of the displacement transmission mechanism 60 causes the micro-storage tank 20 to move along the first direction D1 to either a first position P1 or a second position P2.

[0085] exist Figure 12 In, with similar Figure 11 The cross-sectional view depicts a variation of the eighth embodiment. (Compared to...) Figure 11 The difference is that, Figure 12 Only the temperature control components 40a and 42b of the two stacks are located in the second position P2, and the reading sensor 90 is located in the first position P1, instead of as... Figure 11 It is located at the bottom of the miniature storage tank.

[0086] exist Figure 13 China and Israel are similar Figure 11 The cross-sectional view depicts a variation of the eighth embodiment. (Compared to...) Figure 11 The difference lies in, Figure 13 In the middle, only the temperature control combination components 30c and 42c remain in the first position P1 and the second position P2.

[0087] exist Figure 14 The ninth embodiment is shown in a cross-sectional view, and its arrangement is similar to... Figure 11 However, the displacement unit 70 here includes a displacement transmission mechanism 60 on its upper surface along the opening of the micro-storage tank 20, and the temperature-controlled heating components 30a and 40a are located on a plane below the micro-storage tank 20 and on the substrate 110. The displacement transmission mechanism 60 on the upper surface of the displacement unit 70 engages with the displacement transmission mechanism 60 in the upper part (shown in detailed icon A). Here, the displacement transmission mechanism 60 is an electrode. The displacement unit 70 is mechanically connected to the fixed receiving structure 50 (shown in detailed icon A). Here, the receiving structure includes a micromechanical structure 120 in the form of a guide rail.

[0088] Figure 14The upper part shows a detailed plan view of plan view A of the cross-sectional view in the middle section indicated by direction A. The displacement transmission mechanism 60 is disposed on the sides of the two readout sensors 90 and is disposed on the upper surface of the displacement unit 70 to engage with them. The displacement transmission mechanism 60 and the readout sensors 90 are located on the substrate 110 containing the connector port 80, with its opening facing the opening of the micro-storage slot 20. The displacement transmission mechanism 60 is disposed adjacent to the readout sensors 90 and the connector port 80, from... Figure 14 The detailed illustration A in the image can be viewed.

[0089] At Figure 15 The tenth embodiment is shown in a cross-sectional view, and its arrangement is similar to... Figure 11 However, these two micro-storage slots 20 are included in a displacement unit 70, which has a displacement transmission mechanism 60 on its bottom side, and each micro-storage slot 20 includes a read sensor 90 on its inner surface. This embodiment also includes three positions: a first position P1, a second position P2, and a fifth position P5. Each position includes temperature control components 30a and 41b of two stacks in the first position P1, 40a and 42b in the second position P2, and 41a and 43b in the fifth position P5. The temperature control components of the stacks correspond to... Figure 11 The temperature control components, specifically the temperature control components 30a, 40a, and 41a closer to the micro-storage tank 20, are temperature control heating components. The temperature control components 41b, 42b, and 43b farther from the micro-storage tank 20 are temperature control cooling components. Each stack is also disposed on a substrate 110 containing a connector port 80. The connector port 80 also extends into the gap between the temperature control components of the stack. In this embodiment, there is a displacement unit 70. The displacement unit 70 is movable and contains the micro-storage tank 20, which in turn contains each readout sensor 90, and is mechanically coupled to a fixed receiving structure 50, which includes a displacement transmission mechanism 60 that engages with a displacement transmission mechanism 60 disposed below the movable displacement unit 70.

[0090] At Figure 16 The eleventh embodiment is shown in a cross-sectional view, and its arrangement is similar to... Figure 8 However, in this detailed diagram A, the temperature-controlled heating components 30a and 40a are positioned between the two rows of displacement transmission mechanisms 60. Therefore, the readout sensor 90 is located in the miniature storage tank 20. Below the miniature storage tank, there are two temperature-controlled cooling components 41b and 42b. Figure 16 The remaining functions of the micro-thermal circulator can be corresponding to... Figure 8 As shown.

[0091] At Figure 17 A cross-sectional view of the twelfth embodiment, the arrangement of which is similar to Figure 8As shown. However, the kinematic system here is different from... Figure 8 The embodiments described herein differ. For example... Figure 17 As shown in the upper part (detailed illustration A) and lower part (detailed illustration B), the miniature storage tank 20 moves along the first direction D1. That is, as... Figure 17 The projection plane of the middle part. The micro-thermal circulator 10 is depicted at the first position P1, as well as... Figure 17 As shown at the top. Figure 8 In the first position P1, there are two stacks of temperature control components 30a and 41b, and in the second position P2, there are 40a and 42b (in Figure 17 (Not shown because P2 is located in the projection plane). The accommodating structure 50 includes the displacement element 70 and also includes the micromechanical structure 120. Here, the micromechanical structure 120 is a flexible beam. The beam is located at each corner of the micro-storage tank 20 (see detailed drawing B) and may also be located at other locations between the ends. The arrangement in detailed drawing A is similar to... Figure 8 They are roughly the same.

[0092] Figure 18 The thirteenth embodiment is shown in cross-sectional view. Here, the micro-reservoir 20 is fixedly overlapped with the connector port 80 and contained within a substrate 110. The substrate is coupled to the substrate 110 containing the connector port 80. The micro-reservoir 20 includes a readout sensor 90. The connector port 80 is located on the substrate 110, at the center and above the micro-reservoir 20. The receiving structure 50 includes a displacement unit 70 and a micromechanical structure 120 (such as...). Figure 8 (The elastic element in the middle). The displacement unit 70 includes four stacked temperature control components 30a, 40a, 41b and 42b and a displacement transmission mechanism 60. The temperature control components are stacked at a first position P1 and a second position P2. The displacement transmission mechanism 60 spans the two stacked temperature control components and is located on the substrate 110 (see detailed figure A). The displacement unit 70 includes a displacement transmission mechanism 60 arranged parallel to the first direction D1, so that the displacement unit 70 can move between the two positions of the first position P1 and the first position P2. As described above, the temperature control components aligned with the micro storage tank 20 at the corresponding positions can thermally act on the micro storage tank 20. Below the movable displacement unit 70, another displacement transmission mechanism 60 is also provided parallel to the first direction D1 (see detailed figure B), which corresponds to the displacement transmission mechanism 60 on the substrate 110. The accommodating structure 50 and the displacement transmission mechanism 60 can also be similar here. Figure 11 The method described above is implemented by using a guide rail structure to replace the aforementioned elastic element.

[0093] At Figure 19 The fourteenth embodiment is shown in a cross-sectional view, and its arrangement is similar to that of the previous one. Figure 8 However, with Figure 8 The difference lies in, at Figure 19 The micro storage tank 20 is a temperature control heating component 41a contained on the inner surface of the micro storage tank.

[0094] At Figure 20 The cross-sectional view of the fifteenth embodiment is similar in arrangement to Figure 8 As shown. However, there are two movable displacement units 70 here. One displacement unit 70 includes a miniature storage tank 20, and is connected to a receiving structure 50 and a micromechanical structure 120 (elastic element) (corresponding to...). Figure 8 The displacement unit 70 is coupled with another displacement unit 70, which includes temperature control assemblies 30c and 40c and is coupled to the micromechanical structure 120. Therefore, the displacement unit 70 with the micro-storage tank 20 is movable along the first direction D1 between the first position P1 and the second position P2, and also movable in the first portion of the second direction D2a. Accordingly, the displacement unit 70 also includes temperature control assemblies 30c and 40c in the first direction D1 between the first position P1 and the second position P2, and in the second portion of the second direction D2b. The first portion of the second direction D2a and the second portion of the second direction D2b are similar to the second direction D2 and perpendicular to the first direction D1.

[0095] At Figure 21 A cross-sectional view of the sixteenth embodiment, the arrangement of which is similar to Figure 20 As shown. Figure 21 and Figure 20 The difference is, Figure 21 Both temperature control assemblies 30c and 40c consist of individual displacement units 70, which are also connected to individual receiving structures 50 and displacement transmission mechanisms 60. Therefore, the two displacement units 70 move in the first direction D1, the second partial direction D2b of the second direction, and the third partial direction D2c of the second direction. Furthermore, each individual displacement transmission mechanism 60 within the displacement unit 70 is a separate displacement transmission mechanism 60 containing the temperature control assembly, located below the substrate 110 (see [link to documentation]). Figure 21 The first position P1 and the second position P2 below).

[0096] Figure 22 The seventeenth embodiment is shown in cross-sectional view. Here, the movement of the displacement unit 70, which includes the micro-storage tank 20, is rotational. The micro-thermal circulator consists of three different disks stacked on top of each other (as shown in detail icons A, B, and C). Detail icon A corresponds to, for example... Figure 8Detailed illustration A is shown. Similarly, substrate 110 supports a plurality of displacement transmission mechanisms 60 as an electrode array, the electrode array being arranged in a circular pattern on substrate 110. The substrate also includes two readout sensors 90 and connector ports 80. The readout sensors 90 and connector ports are disposed in or around any empty space between or around the displacement transmission mechanisms 60. Receiving structure 50 includes displacement unit 70, which in turn includes a miniature storage tank 20 and a displacement actuation device 60 arranged in a circular pattern on receiving structure 50, which corresponds to the displacement actuation device 60 in detailed illustration A. The miniature storage tank 20 is also disposed in an empty sector of displacement unit 70.

[0097] The first direction D1 is a rotational motion about the center of the disk-shaped housing structure 50 containing the displacement unit 70. Furthermore, the second direction D2 is parallel to the rotation axis of the displacement unit 70 and the housing structure 50 (perpendicular to...). Figure 22 (Projection plane). The displacement unit 70 can move parallel to the second direction D2 toward the reading sensor 90 or toward the temperature control assembly. The temperature control assemblies 30a, 40a, 41b, and 42b are also stacked in pairs as described above. Here, the temperature control assemblies 30a, 40a, 41b, and 42b are configured to correspond to the miniature storage tank 20 on which they should be heated. In detailed icon C (similar to detailed icons A and B, each with its own top view), only the temperature control heating assemblies 30a and 40a are visible, because the temperature control cooling assemblies 41b and 42b are located below the temperature control heating assemblies 30a and 40a, and located on... Figure 22 The detailed diagram is shown in the projection plane of C. By controlling the displacement transmission mechanism 60, the displacement unit 70 can rotate, aligning the micro-storage tank 20 with the temperature control component of the stack at a first position P1 or a second position P2. Furthermore, the displacement unit 70 can move along the second direction D2 towards the reading sensor 90 or towards the temperature control component. It is understood that variations of this embodiment can also be implemented using different numbers of housing structures, temperature control components, displacement units, displacement transmission mechanisms, positions, sensors, and micro-storage tanks.

[0098] At Figure 23 The cross-sectional view of the eighteenth embodiment is similar in arrangement to Figure 22 As shown. Here, only one read sensor 90 is located at detailed diagram A. However, the accommodating structure 50 and the displacement unit 70 have circular and concentric displacement transmission mechanisms 60. An additional displacement transmission mechanism 60 is provided on the accommodating structure 50, which corresponds to the displacement transmission mechanism 60 in detailed diagram A, and the miniature storage tank 20 can also move in the second direction D2, that is, move toward or away from the read sensor 90.

[0099] At Figure 24 The cross-sectional view of the nineteenth embodiment is similar in arrangement to Figure 18As shown. The temperature control components in this stack are also located on a movable displacement unit 70, which includes a displacement transmission mechanism 60 and is coupled to a receiving structure 50. The micro-thermal circulator 10 also includes a micro-storage tank 20 located on a substrate 110 and containing a readout sensor 90. However, the micro-storage tank is arranged in... Figure 24 The bottom. For the material (e.g., liquid) to enter the micro-reservoir 20 from the connector port 80, the displacement unit 70 needs to be located between the first position P1 and the second position P2 so that the material (e.g., liquid) can pass through the displacement unit 70 and reach the micro-reservoir 20. Of course, the position for entering the micro-reservoir 20 via the connector port (P3) can be different from the aforementioned intermediate position and can be achieved through a groove 101 in the displacement unit 70, which traverses the displacement unit 70 and all its constituent structures.

[0100] At Figure 25 A cross-sectional view of the twentieth embodiment, the arrangement of which is similar to Figure 9 As shown. Here, the temperature control assembly 30c is located to the left of detailed diagram A, and the reading sensor 90 is located to the right of detailed diagram A. Furthermore, the temperature control assembly 40c is located... Figure 25 On the bottom substrate 110. Other functions and settings are compared. Figure 8 and Figure 9 .

[0101] Figure 26 This indicates the movement of the display displacement unit 70 specific to the second direction D2 via the displacement transmission mechanism 60, the accommodating structure 50, and the micromechanical structure 120. For example, its arrangement might be... Figure 8 One of them. Figure 26 In the upper part, the micro storage tank 20 is located at the bottom and close to (and may even contact or be fixed to) the substrate 110 containing the stacked temperature control components. The aforementioned micro storage tank 20 is located at the transport position P4 of the micro thermal circulator 10.

[0102] Figure 26 The lower part describes the micro-storage tank 20 located near the upper part of the connector port 80, allowing substances to be transferred to or from the micro-storage tank. The upper part of the micro-storage tank 20 is the loading position P3 of the micro-thermal cycler 10. Figure 26 yes Figure 3 and Figure 4 As a supplementary note, it can operate in at least one of the third position P3 or the fourth position P4 shown in any micro-thermal circulator 10 that can move in the second direction.

[0103] Figure 27This describes an embodiment showing the groove 101 and / or recess 100. The groove 101 is a through-hole penetrating a structure (e.g., displacement unit 70). The recess 100 is a depression in a surface. Both the groove 101 and the recess 100 can be used in the thermally decoupled elements of a micro-thermal circulator. Furthermore, the groove 101 can be used in access areas of the micro-thermal circulator at certain locations (e.g., connecting the micro-storage tank 20 from connector port 80). The groove 101 and recess 100 can be applied to all embodiments and components (e.g., displacement unit 70 and substrate 110. However, they can also be applied to temperature control components, micro-storage tanks, displacement transmission mechanisms, accommodating structures, readout sensors, micromechanical structures) in any necessary or required number or location. The embodiments describe possible variations of the invention; however, it should be noted that the invention is not limited to the depicted embodiments / variations, but rather to various possible combinations of the embodiments / variations described herein, and these combinations can be derived by those skilled in the art from the inspiration of these embodiments. For example, one readout sensor 90 at each location, or multiple readout sensors 90 in any configuration combination (e.g., in the structure of a miniature storage tank or detailed illustration A). It should be understood that variations of the embodiment can also be implemented with different numbers of housing structures, temperature control components, displacement units, displacement transmission mechanisms, positions, sensors, and miniature storage tanks. The temperature control components and / or readout sensors can be positioned wherever needed and / or desired. For example, the temperature control components and / or readout sensors can be disposed in at least one sidewall of the miniature storage tank. Furthermore, in the above embodiments and figures, the temperature control components are depicted as horizontal. However, the temperature control components can be vertically arranged.

[0104] The scope of protection sought by this invention is determined by the appended claims. However, the embodiments and drawings must be considered when interpreting the claims. A single feature or combination of features described and / or depicted may represent an independent inventive solution. The purpose of the independent solution can be found in the embodiments.

[0105] All symbols for numerical ranges in this specification should be understood to also include and disclose all arbitrary subranges therein. For example, the disclosure of 1 to 10 should be understood to also include and disclose all subranges from the lower limit of 1 to the upper limit of 10, that is, all subranges that begin with a lower limit of 1 or greater and have an upper limit of 10 or less, such as 1 to 1, 7, or 3, 2 to 8, 1, or 5, 5 to 10. Only the digit after the comma is described, but the same applies to any given number after the comma. It should also be noted that, for better understanding, some parts / components are not depicted to some extent at scale and / or enlarged and / or reduced scale.

[0106] [Symbol Explanation]

[0107] 10: Micro-thermal circulator

[0108] 20: Miniature storage tank

[0109] 30: Temperature control components

[0110] 40: Second temperature control component

[0111] 41: Third temperature control component

[0112] 42: Fourth temperature control component

[0113] 30a, 40a, 41a, 42a: Temperature-controlled heating components

[0114] 30b, 40b, 41b, 42b, 43b, 44b: Temperature-controlled cooling components

[0115] 30°C, 40°C, 41°C, 42°C: Temperature control combination components

[0116] 50: Accommodation Structure

[0117] 60: Displacement transmission mechanism

[0118] 70: Displacement element

[0119] 80: Connector Port

[0120] 90: Reading the sensor

[0121] 100: Hole

[0122] 101: Trench

[0123] 110: Substrate

[0124] 120: Micromechanical structure

[0125] P1: First position

[0126] P2: Second position

[0127] P3: Third position (loading position)

[0128] P4: Fourth position (locked or transported position)

[0129] P5: Fifth Position

[0130] P6: Sixth Position

[0131] D1: First Direction

[0132] D2: Second Direction

[0133] D2a: The first part of the second direction

[0134] D2b: Second direction, second part of the direction

[0135] D2c: The third part of the second direction

Claims

1. A micro-thermal circulator (10), characterized in that, The device comprises at least one miniature storage tank (20), at least one temperature control component (30), at least one displacement unit (70), and at least one displacement transmission mechanism (60), wherein the at least one displacement unit (70) comprises either the at least one miniature storage tank (20) or the at least one temperature control component, and wherein the at least one displacement unit (70) can be moved from a first position (P1) to a second position (P2) along a first direction (D1) via the displacement transmission mechanism (60), and wherein the at least one temperature control component (30) applies heat to the at least one miniature storage tank (20) at the first position (P1). 0), and wherein the displacement transmission mechanism operatively couples the at least one displacement unit (70) and another of the temperature control components or another of the micro storage tanks, wherein the micro thermal circulator (10) is a planar three-dimensional structure manufactured using microelectromechanical systems technology, comprising one or more surfaces, wherein the plurality of surfaces are stacked surfaces; wherein at least one hole is located near the temperature control component and / or the at least one micro storage tank (20), and wherein the at least one hole is a recess (100) and / or a groove (101), the hole being used for thermal decoupling and / or providing a connection path to the micro storage tank.

2. The micro-thermal circulator (10) as described in claim 1, characterized in that, It further includes a second temperature control component (40), wherein the second temperature control component (40) heats the at least one micro storage tank (20) at the first position (P1) or the second position (P2).

3. The micro-thermal circulator (10) as described in claim 1 or 2, characterized in that, It further includes at least one receiving structure (50), wherein the at least one receiving structure (50) holds the at least one displacement unit (70) and includes at least one micromechanical structure (120).

4. The micro-thermal circulator (10) as described in claim 1, characterized in that, It further includes a third position (P3) and / or a fourth position (P4), wherein in the third position (P3), the at least one micro-storage tank (20) can allow a substance to be transferred or transferred from the micro-storage tank via at least one connector port (80), wherein the fourth position (P4) is a transport position of the displacement unit.

5. The micro-thermal circulator (10) as described in claim 1, characterized in that, It further includes at least one readout sensor (90) for sensing the contents of the at least one micro-storage tank (20), wherein the at least one readout sensor (90) is located at a defined position inside or outside the at least one micro-storage tank (20), and wherein the contents of the micro-storage tank are detected by means of displacement of the micro-storage tank and / or the at least one readout sensor (90).

6. The micro-thermal circulator (10) as described in claim 1, characterized in that, The at least one displacement unit (70) can be displaced in a second direction (D2) different from the first direction (D1), and can reach different positions by displacement of the at least one displacement unit (70) in at least one of the first direction (D1) and the second direction (D2).

7. The micro-thermal circulator (10) as described in claim 1, characterized in that, The at least one displacement unit (70) can be fixed in at least one position.

8. The micro-thermal circulator (10) as described in claim 6, characterized in that, The displacement along at least one direction is rotational motion and / or linear motion.

9. The micro-thermal circulator (10) as described in claim 1, characterized in that, It further includes at least one thermal sensor located inside and / or outside the micro storage tank, which serves as a temperature sensor at a specific location within the micro thermal circulator.

10. The micro-thermal circulator (10) as described in claim 1, characterized in that, It further includes at least one position sensor, wherein the position sensor is used to detect the position of the at least one displacement unit (70) within the micro-thermal circulator.

11. The micro-thermal circulator (10) as described in claim 1, characterized in that, The at least one micro storage tank (20) further includes an openable lid.

12. The micro-thermal circulator (10) of claim 1, wherein the at least one micro-storage tank (20) and / or the temperature control component comprises a material coating to improve thermal and / or reaction properties.

13. The micro-thermal circulator (10) as described in claim 1, characterized in that, The interior of the at least one micro storage tank (20) includes at least one contoured surface.

14. The micro-thermal circulator (10) as described in claim 1, characterized in that, It further includes control signals and / or sensing signals that can be dynamically controlled and / or pre-programmed.

15. A reaction method employing the micro-thermal circulator as described in any one of claims 1 to 14, characterized in that, The reaction method includes: Place one sample and multiple reactants into at least one micro storage tank; Move the micro storage tank from a first position to a second position; and The sample is heated or cooled at the first and second positions according to a predetermined procedure.

16. The reaction method according to claim 15, characterized in that, The space occupied by the micro storage tank is not occupied by the preheating or precooling.

17. The reaction method as described in claim 15, characterized in that, The characteristic of the sample being detectable continuously or at specific points in time.

18. The reaction method according to claims 15 to 17, characterized in that, The heating and / or cooling are cyclical.

19. The reaction method according to claims 15 to 17, characterized in that, Heating and / or cooling are dynamically controlled by a plurality of variable signals, which are generated based on a plurality of temperature readings.

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