Non-contact storage media, magnetic tape cassettes, working methods of non-contact storage media, and storage media

By incorporating an IC chip that supports multiple communication standards into the tape cartridge, the compatibility limitations caused by the single communication standard in existing technologies are solved, achieving multi-standard compatibility and cost reduction.

CN116194928BActive Publication Date: 2026-04-03FUJIFILM CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-06-23
Publication Date
2026-04-03

AI Technical Summary

Technical Problem

The existing contactless storage media of magnetic tape cassettes can only correspond to one communication standard, which limits compatibility between different communication devices and increases manufacturing costs.

Method used

An IC chip is embedded in the tape cartridge. This IC chip can be connected to the communication destination via electromagnetic induction coupling through the magnetic field provided by the communication destination, supports multiple communication standards, and switches to a new communication standard when a change instruction is received.

Benefits of technology

This enables contactless storage media for magnetic tape cartridges to be compatible with multiple communication devices, reducing manufacturing costs and improving communication flexibility.

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Abstract

This invention relates to a contactless storage medium, a magnetic tape cassette, a method for operating the contactless storage medium, and the storage medium itself. The contactless storage medium mounted on the magnetic tape cassette includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards.
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Description

Technical Field

[0001] The present invention relates to a non-contact storage medium, a magnetic tape cassette, a method for operating the non-contact storage medium, and the storage medium itself. Background Technology

[0002] International Publication No. 2019 / 198323 discloses a magnetic tape cassette. The cassette contains a magnetic tape. The cassette is used in a magnetic tape drive assembly. The magnetic tape drive assembly includes a head unit. The head unit selectively writes and reads data from the magnetic tape.

[0003] The magnetic tape cassette described in International Publication No. 2019 / 198323 includes a cartridge memory. The cartridge memory stores information for managing the magnetic tape. The cartridge memory is a contactless storage medium with an antenna coil and IC chip mounted on a substrate. In International Publication No. 2019 / 198323, an RFID (radio frequency identifier) ​​tag is shown as an example of a contactless storage medium. A reader / writer is included in the magnetic tape drive device. The reader / writer reads and writes information to the cartridge memory in a contactless manner by wirelessly communicating with it. Summary of the Invention

[0004] One embodiment of the present invention provides a method and procedure for operating a contactless storage medium, a magnetic tape cassette, and a contactless storage medium that enables contactless communication with a communication destination using multiple communication standards, compared to a case where the IC chip of a contactless storage medium mounted on a magnetic tape cassette corresponds to only one communication standard.

[0005] means for solving technical problems

[0006] The first aspect of the technology involved in this invention is a contactless storage medium mounted on a magnetic tape cassette. The contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards.

[0007] The second aspect of the technology of the present invention is the contactless storage medium involved in the first aspect, wherein the communication destination is any one of a plurality of communication devices, and the plurality of communication devices have any one of a plurality of communication standards.

[0008] The third aspect of the technology of the present invention is the contactless storage medium involved in the first or second aspect. In this invention, the IC chip is configured with any one of a plurality of communication standards as the default communication standard. When an external instruction is given to change the communication standard to a different communication standard from the default communication standard, the IC chip changes the communication standard setting from the default communication standard and fixes it to the communication standard corresponding to the change instruction among the plurality of communication standards as the new communication standard.

[0009] The fourth method involved in the technology of the present invention is the contactless storage medium involved in the third method, wherein the change instruction is a change command indicating a change to a communication standard different from the default communication standard.

[0010] The fifth method involved in the technology of the present invention is the contactless storage medium involved in the fourth method, wherein the external is the communication destination, and the IC chip receives change commands from the communication destination by communicating with the default communication standard.

[0011] The sixth aspect of the present invention is the contactless storage medium involved in the fifth aspect, wherein the IC chip can communicate with the communication destination using a special communication standard that is different from multiple communication standards and is only used for changing the setting of communication standards, and receive change commands by communicating with the communication destination using the special communication standard.

[0012] The seventh aspect of the technology of the present invention is a contactless storage medium involved in any of the fourth to sixth aspects, wherein the IC chip fixes the setting of the new communication standard on the condition that the setting of the communication standard has been changed from the default communication standard to the new communication standard.

[0013] The eighth aspect of the technology of the present invention is a contactless storage medium involved in any of the fourth to sixth aspects, wherein when the communication standard setting has been changed from the default communication standard to a new communication standard and the predetermined conditions are met, the IC chip fixes the setting of the new communication standard.

[0014] The ninth aspect of the present invention is the contactless storage medium involved in the eighth aspect, wherein the IC chip has a storage area for storing parameters that can determine the set communication standard among a plurality of communication standards, and the given condition includes the condition that the parameters in the storage area have been changed from the default communication standard to the parameters of the new communication standard.

[0015] The tenth aspect of the present invention is the contactless storage medium involved in the eighth or ninth aspect, wherein the predetermined condition includes the condition that a communication standard change flag indicating that the communication standard setting has been changed from the default communication standard to the new communication standard is set in the IC chip.

[0016] The 11th aspect of the technology of the present invention is a contactless storage medium involved in any of the 8th to 10th aspects, wherein the predetermined condition includes setting a specific process completion mark in the IC chip to indicate that a specific process among a plurality of processes included in the manufacturing process of the magnetic tape cartridge has been completed.

[0017] The 12th aspect of the technology of the present invention is the contactless storage medium involved in any of the 4th to 11th aspects, wherein the change command is a special command used only for changing the setting of communication standards.

[0018] The 13th aspect of the present invention is a contactless storage medium involved in any of the 4th to 12th aspects, wherein the IC chip has a memory, the change command is a rewrite command that rewrites the stored content of the memory, the stored content includes setting communication standard information representing the set communication standard, and the setting of the communication standard is changed by rewriting the setting communication standard information according to the rewrite command.

[0019] The 14th aspect of the present invention is a contactless storage medium involved in any of the 4th to 13th aspects, wherein the IC chip has a holding area for holding communication standard information related to multiple communication standards, and information related to communication standards other than the new communication standard is cleared from the communication standard information in the holding area when the setting of a new communication standard has been fixed.

[0020] The 15th aspect of the present invention is a magnetic tape cassette comprising: a non-contact storage medium as described in any of the 1st to 14th aspects; and a magnetic tape, wherein the non-contact storage medium stores information related to the magnetic tape.

[0021] The 16th aspect of the present invention relates to a method for operating a contactless storage medium, which is a method for operating a contactless storage medium mounted on a magnetic tape cartridge. The contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards, and one of the multiple communication standards is set as the default communication standard in the IC chip. The method for operating the contactless storage medium includes the following steps: when a change command indicating a change to a communication standard different from the default communication standard is given externally, the IC chip changes the setting of the communication standard from the default communication standard to the communication standard corresponding to the change command among the multiple communication standards as the new communication standard; and fixes the new communication standard.

[0022] The 17th aspect of the present invention is a program for causing a computer applicable to a contactless storage medium mounted on a magnetic tape cartridge to perform processing, wherein the contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards, and the IC chip is configured with any one of the multiple communication standards as a default communication standard. The processing includes the following steps: when a change command indicating a change to a communication standard different from the default communication standard is given from the outside, the IC chip changes the setting of the communication standard from the default communication standard to the communication standard corresponding to the change command among the multiple communication standards as the new communication standard; and fixes the new communication standard. Attached Figure Description

[0023] Figure 1 This is a schematic perspective view showing an example of the appearance of a cassette tape cassette.

[0024] Figure 2 This is a schematic perspective view showing an example of the structure of the right rear end of the inner side of the lower casing of a magnetic tape cassette.

[0025] Figure 3 This is a side sectional view showing an example of a support member provided on the inner surface of the lower housing of a magnetic tape cassette.

[0026] Figure 4 This is a schematic diagram illustrating an example of the hardware structure of a magnetic tape drive.

[0027] Figure 5 This is a schematic perspective view illustrating an example of how a magnetic field is released from the underside of a magnetic tape cassette via a contactless reader / writer.

[0028] Figure 6 This is a conceptual diagram illustrating an example of how a magnetic field is applied to a cartridge memory inside a magnetic tape cassette from a contactless reader / writer.

[0029] Figure 7 This is a schematic bottom view showing an example of the structure of the back side of the substrate of a cartridge memory inside a magnetic tape cassette.

[0030] Figure 8 This is a schematic top view showing an example of the structure of the surface of the substrate of a cartridge memory inside a magnetic tape cassette.

[0031] Figure 9 This is a schematic circuit diagram illustrating an example of the circuit structure of a cartridge memory inside a magnetic tape cassette.

[0032] Figure 10 This is a block diagram illustrating an example of the hardware structure of a computer with an IC chip for cartridge memory mounted in a magnetic tape cassette.

[0033] Figure 11 This is a block diagram illustrating one example of CPU functionality.

[0034] Figure 12 This is a block diagram illustrating an example of the processing involved when a cassette memory communicates with a contactless reader / writer using the default communication standard.

[0035] Figure 13 This is a block diagram illustrating an example of the processing involved when a change command is received from a contactless reader / writer via communication between the communication department and the contactless reader / writer using the default communication standard.

[0036] Figure 14 This is a block diagram illustrating an example of the processing involved when the communication standard setting of an IC chip is changed from the default communication standard to the communication standard corresponding to the change command.

[0037] Figure 15 This is a block diagram illustrating an example of the communication unit's processing when the communication standard setting of an IC chip is changed from the default communication standard to the communication standard corresponding to the change command.

[0038] Figure 16 This is a flowchart illustrating an example of the communication standard setting process.

[0039] Figure 17 This is a flowchart representing the first variation of the communication standard setting process.

[0040] Figure 18 This is a flowchart of the second variation of the communication standard setting process.

[0041] Figure 19 This is a block diagram illustrating an example of how a communication standard setting program is installed into a computer from a storage medium containing the communication standard setting program. Detailed Implementation

[0042] Hereinafter, an example of an implementation method of the non-contact storage medium, magnetic tape cassette, and working method and procedure of the non-contact storage medium involved in the present invention will be described with reference to the accompanying drawings.

[0043] First, let me explain the words and phrases used in the following instructions.

[0044] CPU stands for Central Processing Unit. RAM stands for Random Access Memory. DRAM stands for Dynamic Random Access Memory. SRAM stands for Static Random Access Memory. NVM stands for Non-Volatile Memory. ROM stands for Read-Only Memory. EEPROM stands for Electrically Erasable and Programmable Read Only Memory. SSD stands for SolidState Drive. USB stands for Universal Serial Bus. ASIC stands for Application Specific Integrated Circuit. PLD stands for Programmable Logic Device. FPGA stands for Field-Programmable Gate Array. SoC stands for System-on-a-Chip. IC stands for Integrated Circuit. RFID stands for Radio Frequency Identifier. LTO stands for Linear Tape-Open. IBM stands for International Business Machines Corporation.

[0045] In the following explanation, for ease of explanation, Figure 1 In the diagram, arrow A indicates that the tape cassette 10 is loaded into the tape drive 30 (see reference). Figure 4 In the direction shown in the diagram, arrow A is defined as the front direction of tape cassette 10, and the front side of tape cassette 10 is defined as the front side of tape cassette 10. In the following description of the structure, "front" refers to the front side of tape cassette 10.

[0046] Furthermore, in the following explanation, for ease of explanation, Figure 1In the following description of the structure, arrow B, which is orthogonal to arrow A, is defined as the right direction, and the right side of tape cassette 10 is defined as the right side of tape cassette 10. In the following description of the structure, "right" refers to the right side of tape cassette 10.

[0047] Furthermore, in the following explanation, for ease of explanation, Figure 1 In the diagram, arrow C represents a direction orthogonal to both arrow A and arrow B. Arrow C is defined as the upward direction of tape cassette 10, and the upward side of tape cassette 10 is defined as the upper side of tape cassette 10. In the following description of the structure, "upper" refers to the upper side of tape cassette 10.

[0048] Furthermore, in the following explanation, for ease of explanation, Figure 1 In this design, the direction opposite to the front direction of the tape cassette 10 is defined as the rear direction of the tape cassette 10, and the rear side of the tape cassette 10 is defined as the rear side of the tape cassette 10. In the following description of the structure, "rear" refers to the rear side of the tape cassette 10.

[0049] Furthermore, in the following explanation, for ease of explanation, Figure 1 In this design, the direction opposite to the upward direction of the tape cassette 10 is defined as the downward direction of the tape cassette 10, and the downward side of the tape cassette 10 is defined as the lower side of the tape cassette 10. In the following description of the structure, "lower" refers to the lower side of the tape cassette 10.

[0050] Furthermore, in the following description, LTO is used as an example of the standard for tape cartridge 10, but this is just one example and other standards such as IBM 3592 can also be used.

[0051] As an example, such as Figure 1 As shown, the tape cassette 10 is generally rectangular in top view and has a box-shaped housing 12. The housing 12 is made of resin such as polycarbonate and has an upper housing 14 and a lower housing 16. The upper housing 14 and the lower housing 16 are joined together by welding (e.g., ultrasonic welding) and screw fixing, with the lower peripheral surface of the upper housing 14 in contact with the upper peripheral surface of the lower housing 16. The joining method is not limited to welding and screw fixing, and other joining methods may also be used.

[0052] A magnetic tape cassette reel 18 is rotatably housed inside the housing 12. The magnetic tape cassette reel 18 includes a reel hub 18A, an upper flange 18B1, and a lower flange 18B2. The reel hub 18A is cylindrical. The reel hub 18A is the central portion of the magnetic tape cassette reel 18, with its axis aligned vertically along the housing 12 and positioned at the center of the housing 12. The upper flange 18B1 and the lower flange 18B2 are both annular. The upper flange 18B1 is fixed to the center of the upper flange in plan view at the upper end of the reel hub 18A, and the lower flange 18B2 is fixed to the center of the lower flange in plan view at the lower end of the reel hub 18A. A magnetic tape MT is wound around the outer circumferential surface of the reel hub 18A, and the width end of the magnetic tape MT is held by the upper flange 18B1 and the lower flange 18B2.

[0053] An opening 12B is formed on the front side of the right wall 12A of the housing 12. The magnetic tape MT is pulled out through the opening 12B.

[0054] As an example, such as Figure 2 As shown, a cartridge memory 19 is mounted in the tape cassette 10. Figure 2 In the example shown, a cassette memory 19 is housed at the right rear end of the lower housing 16. In this embodiment, a so-called passive RFID tag is used as the cassette memory 19. Furthermore, the cassette memory 19 is an example of the "contactless storage medium" involved in the technology of this invention.

[0055] The cartridge memory 19 stores information related to the magnetic tape MT (illustration omitted). The information related to the magnetic tape MT refers to, for example, management information for managing the magnetic tape cartridge 10 (illustration omitted). The management information includes, for example, information related to the cartridge memory 19, information that can identify the magnetic tape cartridge 10, information indicating the recording capacity of the magnetic tape MT, a summary of the information recorded in the magnetic tape MT (hereinafter also referred to as "recording information"), the items of the recording information, and the recording format of the recording information.

[0056] The cartridge memory 19 performs contactless communication with an external communication device (not shown). Examples of such external communication devices include, for instance, the read / write device used in the manufacturing process of the tape cartridge 10 and the tape drive (e.g., Figure 4 The read / write device (e.g., tape drive 30) used in the tape drive 30 is shown. Figures 4-6 The non-contact reading and writing device 50 shown.

[0057] The external communication device reads and writes various information to the cassette memory 19 in a non-contact manner. Details will be described later. The cassette memory 19 reads and writes information via a magnetic field MF (reference) applied from the external communication device. Figure 5It generates electricity by acting electromagnetically. Then, the cassette memory 19 uses the generated electricity to operate and communicates with an external communication device via a magnetic field, thereby sending and receiving various information with the external communication device.

[0058] As an example, such as Figure 2 As shown, a support member 20 is provided on the inner surface of the bottom plate 16A at the right rear end of the lower housing 16. The support member 20 is a pair of tilting platforms that support the cassette memory 19 from below in an inclined state. The pair of tilting platforms are a first tilting platform 20A and a second tilting platform 20B. The first tilting platform 20A and the second tilting platform 20B are arranged spaced apart in the left-right direction of the housing 12 and are integral with the inner surface of the rear wall 16B and the inner surface of the bottom plate 16A of the lower housing 16. The first tilting platform 20A has an inclined surface 20A1 that slopes downward from the inner surface of the rear wall 16B toward the inner surface of the bottom plate 16A. The second tilting platform 20B has an inclined surface 20B1 that also slopes downward from the inner surface of the rear wall 16B toward the inner surface of the bottom plate 16A.

[0059] On the front side of the support member 20, a pair of limiting ribs 22 are arranged at intervals in the left-right direction. The pair of limiting ribs 22 are vertically provided on the inner surface of the base plate 16A, limiting the position of the lower end of the cassette memory 19 arranged in the support member 20.

[0060] As an example, such as Figure 3 As shown, a reference surface 16A1 is formed on the outer surface of the base plate 16A. The reference surface 16A1 is a plane. Here, a plane refers to a plane that is parallel to the horizontal plane when the base plate 16A is used as the lower side and the lower housing 16 is placed on a horizontal plane. Here, "parallel" means not only perfectly parallel, but also parallel in the sense of a degree of error that is generally permissible in the technical field to which this invention pertains and does not violate the technical spirit of this invention. The tilt angle θ of the support member 20 is the tilt surface 20A1 and the tilt surface 20B1 (see reference). Figure 2 The tilt angle of the plane is 45 degrees relative to the reference plane 16A1. In addition, 45 degrees is just one example, and it can also be "0 degrees < tilt angle θ < 45 degrees".

[0061] The cassette memory 19 includes a substrate 26. The substrate 26 is placed on a support member 20 with its back surface 26A facing downwards, and the support member 20 supports the back surface 26A of the substrate 26 from below. A portion of the back surface 26A of the substrate 26 is connected to the inclined surfaces 20A1 and 20B1 of the support member 20 (see reference). Figure 2 The surface 26B of the substrate 26 is exposed to the inner surface 14A1 side of the top plate 14A of the upper housing 14.

[0062] The upper housing 14 has a plurality of ribs 24. The plurality of ribs 24 are arranged at intervals in the left-right direction of the housing 12. The plurality of ribs 24 protrude downward from the inner surface 14A1 of the top plate 14A of the upper housing 14, and the front end face 24A of each rib 24 has inclined surfaces 20A1 and 20B1 (see reference). Figure 2 The corresponding inclined surface. That is, the front end surface 24A of each rib 24 is inclined at 45 degrees relative to the reference surface 16A1.

[0063] If the upper housing 14 is joined to the lower housing 16 as described above, with the cassette memory 19 disposed on the support member 20, then the front end face 24A of each rib 24 contacts the substrate 26 from the surface 26B side. The substrate 26 is protected by the front end face 24A of each rib 24 and the inclined surfaces 20A1 and 20B1 of the support member 20 (see reference). Figure 2 Clamping. Thus, the vertical position of the cassette memory 19 is restricted by the rib 24.

[0064] As an example, such as Figure 4 As shown, the magnetic tape drive 30 includes a transport device 34, a read head 36, and a control device 38. A magnetic tape cassette 10 is loaded into the magnetic tape drive 30. The magnetic tape drive 30 is a device for pulling out a magnetic tape MT from the magnetic tape cassette 10 and reading recorded information from the pulled-out magnetic tape MT in a linear scanning manner using the read head 36. Furthermore, in this embodiment, reading recorded information refers to the playback of recorded information. While the reading of recorded information based on the read head 36 is illustrated here, the technology of the present invention is not limited to this; data can also be written to the magnetic tape MT using a write head, or data can be written to or read from the magnetic tape MT using a magnetic head.

[0065] The control device 38 controls the overall operation of the tape drive 30. In this embodiment, the control device 38 is implemented using an ASIC, but the technology of the present invention is not limited thereto. For example, the control device 38 can also be implemented using an FPGA. Furthermore, the control device 38 can also be implemented using a computer including a CPU, ROM, and RAM. Moreover, it can also be implemented by combining two or more of the following: ASIC, FPGA, and computer. That is, the control device 38 can also be implemented using a combination of hardware and software structures.

[0066] The conveying device 34 is a device for selectively conveying magnetic tape MT in both forward and reverse directions, and includes a feed motor 40, a take-up reel 42, a take-up motor 44, multiple guide rollers GR, and a control device 38.

[0067] The delivery motor 40 rotates the tape reel 18 inside the tape cassette 10 under the control of the control device 38. The control device 38 controls the rotation direction, speed, and torque of the tape reel 18 by controlling the delivery motor 40.

[0068] When the magnetic tape MT is wound by the take-up reel 42, the control device 38 rotates the delivery motor 40 to make the magnetic tape MT travel in the forward direction. The speed and torque of the delivery motor 40 can be adjusted according to the speed of the magnetic tape MT wound by the take-up reel 42.

[0069] The take-up motor 44 rotates the take-up reel 42 under the control of the control device 38. The control device 38 controls the rotation direction, speed, and torque of the take-up reel 42 by controlling the take-up motor 44.

[0070] When the magnetic tape MT is wound by the take-up reel 42, the control device 38 rotates the take-up motor 44 so that the magnetic tape MT travels in the forward direction. The speed and torque of the take-up motor 44 can be adjusted according to the speed of the magnetic tape MT wound by the take-up reel 42.

[0071] By adjusting the respective speeds and torques of the feed motor 40 and the take-up motor 44, a tension within a predetermined range is applied to the magnetic tape MT. Here, the predetermined range refers to, for example, the range of tension that enables the read head 36 to read data from the magnetic tape MT, obtained through computer simulation and / or based on actual machine testing.

[0072] Additionally, when the magnetic tape MT is wound back onto the tape reel 18, the control device 38 causes the tape MT to rotate the feed motor 40 and the take-up motor 44 in the reverse direction.

[0073] In this embodiment, the tension of the magnetic tape MT is controlled by controlling the rotational speed and torque of the feed motor 40 and the take-up motor 44, but the technology of the present invention is not limited thereto. For example, the tension of the magnetic tape MT can also be controlled by using a tension adjustment roller, or by pulling the magnetic tape MT into a vacuum chamber.

[0074] Multiple guide rollers GR are rollers that guide the magnetic tape MT. The travel path of the magnetic tape MT is defined by multiple guide rollers GR being separately arranged across the read head 36 between the tape cassette 10 and the take-up reel 42.

[0075] The read head 36 includes a read element 46 and a holder 48. The read element 46 is held by the holder 48 in contact with the traveling magnetic tape MT and reads recorded information from the magnetic tape MT conveyed by the transport device 34.

[0076] The tape drive 30 includes a contactless read / write device 50. The contactless read / write device 50 is an example of a "communication destination" according to the technology of this invention. The contactless read / write device 50 is arranged on the underside of the drive 30, which is loaded with the tape cassette 10, facing the back surface 26A of the cartridge memory 19. Furthermore, the state in which the tape cassette 10 is loaded into the tape drive 30 refers to, for example, a state in which the tape cassette 10 has reached a predetermined position as the position where the tape cassette 10 begins reading recording information from the tape MT using the read head 36.

[0077] exist Figure 4 The example shown illustrates a configuration where the contactless reader / writer 50 is mounted within the magnetic tape drive 30, but the technology of the present invention is not limited thereto. The contactless reader / writer 50 can also be used during the manufacturing stage of the magnetic tape cassette 10, the inspection stage of the magnetic tape cassette 10, or the stage at which the magnetic tape cassette 10 is shipped. In such cases, for example, a stationary or portable contactless reader / writer 50 can be used.

[0078] As an example, such as Figure 5 As shown, the non-contact read / write device 50 releases a magnetic field MF from the underside of the tape cassette 10 toward the cartridge memory 19. The magnetic field MF penetrates the cartridge memory 19.

[0079] As an example, such as Figure 6 As shown, the contactless read / write device 50 is connected to the control device 38. The control device 38 outputs a control signal to the contactless read / write device 50 to control the cassette memory 19. The contactless read / write device 50 releases a magnetic field MF toward the cassette memory 19 according to the control signal input from the control device 38. The magnetic field MF penetrates from the back side 26A side of the cassette memory 19 toward the surface side 26B side.

[0080] The contactless read / write device 50 assigns commands corresponding to control signals to the cartridge memory 19 through contactless communication with it. More specifically, the contactless read / write device 50 transmits command space to the cartridge memory 19 under the control of the control device 38. A command is a signal indicating an instruction to the cartridge memory 19.

[0081] Furthermore, this description illustrates an example where the contactless read / write device 50 transmits command space to the cartridge memory 19 under the control of the control device 38, but the technology of the present invention is not limited thereto. For example, during the manufacturing stage of the tape cartridge 10, the inspection stage of the tape cartridge 10, or the stage when the tape cartridge 10 is shipped from the factory, the contactless read / write device 50 transmits command space to the cartridge memory 19 under the control of a control device different from the control device 38.

[0082] When a command is transmitted from the contactless read / write device 50 to the cartridge memory 19, the command corresponding to the instruction from the control device 38 is contained in the magnetic field MF via the contactless read / write device 50. In other words, the command is superimposed on the magnetic field MF via the contactless read / write device 50. That is, the contactless read / write device 50 sends the command to the cartridge memory 19 via the magnetic field MF under the control of the control device 38.

[0083] However, there are several communication standards, such as ISO18092, ISO14443A, ISO14443B and ISO15693, used for wireless communication between cartridge memory mounted on commonly known magnetic tape cassettes and contactless reading / writing devices (also known as readers).

[0084] However, the existence of multiple communication standards may also be due to the communication standards differing according to product category (e.g., according to the types of traditional magnetic tape cassettes). Therefore, it is necessary to integrate an IC chip corresponding to the communication standard into the cassette memory. Regarding most of the components used in cassette memory, apart from the IC chip (e.g., substrate, wires, and protective agents), although the same types of components can be used across cassette memory models, if the IC chip has to be changed according to product category, it will lead to increased manufacturing costs.

[0085] In view of this situation, in the tape cassette 10 according to this embodiment, an IC chip 52 is mounted in the cartridge memory 19. Hereinafter, the IC chip 52 and its surroundings will be described in detail.

[0086] An IC chip 52 and a capacitor 54 are mounted on the surface 26B of the cassette memory 19. The IC chip 52 and the capacitor 54 are bonded to the surface 26B. Furthermore, the IC chip 52 and the capacitor 54 are sealed to the surface 26B of the cassette memory 19 by a sealing material 56. Here, an ultraviolet-curable resin that cures upon reaction with ultraviolet light is used as the sealing material 56. However, ultraviolet-curable resin is only one example; light-curable resins that cure upon reaction with light in wavelengths other than ultraviolet light can also be used as the sealing material 56, as can thermosetting resins, or other adhesives.

[0087] As an example, such as Figure 7 As shown, a coil 60 is formed in a ring shape on the back surface 26A of the cassette memory 19. The coil 60 is an example of an "antenna" according to the technology of this invention. Here, copper foil is used as the material for the coil 60. Copper foil is just one example; other conductive materials such as aluminum foil can also be used. The coil 60 is connected by a magnetic field MF (see reference 50) supplied by the contactless read / write device 50. Figure 5 and Figure 6The induced current is generated by the action of )

[0088] A first conductive portion 62A and a second conductive portion 62B are provided on the back surface 26A of the cassette memory 19. The first conductive portion 62A and the second conductive portion 62B have solder to connect the two ends of the coil 60 to the IC chip 52 (reference) on the surface 26B. Figure 6 and Figure 8 ) and capacitor 54 (reference) Figure 6 and Figure 8 Electrical connection.

[0089] As an example, such as Figure 8 As shown, on surface 26B of the cassette memory 19, IC chip 52 and capacitor 54 are electrically connected to each other via wires. Specifically, one terminal of the positive and negative terminals of IC chip 52 is connected to the first conductive section 62A via wiring 64A, and the other terminal is connected to the second conductive section 62B via wiring 64B. Furthermore, capacitor 54 has a pair of electrodes. Figure 8 In the example shown, the pair of electrodes are electrodes 54A and 54B. Electrode 54A is connected to the first conductive part 62A via wiring 64C, and electrode 54B is connected to the second conductive part 62B via wiring 64D. Thus, for coil 60, IC chip 52 and capacitor 54 are connected in parallel.

[0090] As an example, such as Figure 9 As shown, the IC chip 52 includes a built-in capacitor 80, a power supply circuit 82, a computer 84, and a signal processing circuit 88. Here, as an example of the IC chip 52, a general-purpose IC chip capable of being used for purposes other than the cassette cartridge 10 is used. However, this general-purpose IC chip is only one example; it could also be an IC chip designed solely for the cassette cartridge 10.

[0091] The cassette memory 19 includes a power generator 70. The power generator 70 generates electricity by applying a magnetic field MF supplied from the contactless read / write device 50 to a coil 60. Specifically, the power generator 70 uses a resonant circuit 92 to generate alternating current (AC) power and converts the generated AC power into direct current (DC) power for output.

[0092] The power generator 70 has a resonant circuit 92 and a power supply circuit 82. The resonant circuit 92 includes a capacitor 54, a coil 60, and a built-in capacitor 80. The built-in capacitor 80 is a capacitor built into the IC chip 52, and the power supply circuit 82 is also a circuit built into the IC chip 52. The built-in capacitor 80 is connected in parallel with the coil 60.

[0093] Capacitor 54 is an external capacitor mounted on IC chip 52. IC chip 52 is a general-purpose IC chip that can be used in applications different from tape cartridge 10. Therefore, the capacitance of the built-in capacitor 80 is insufficient to achieve the resonant frequency required in the cartridge memory 19 used in tape cartridge 10. Therefore, in cartridge memory 19, capacitor 54 is mounted on IC chip 52 as a capacitor with the capacitance value required to cause resonant circuit 92 to resonate at a predetermined resonant frequency through the action of magnetic field MF. In addition, the predetermined resonant frequency is the same frequency as the magnetic field MF, which is 13.56MHz in this case. Furthermore, the capacitance of capacitor 54 is specified based on the measured value of the capacitance of built-in capacitor 80.

[0094] The resonant circuit 92 generates AC power by using the magnetic field MF to pass through the coil 60 and induce a current in the coil 60 to generate a resonant frequency at a predetermined resonant frequency, and outputs the generated AC power to the power supply circuit 82.

[0095] The power supply circuit 82 includes a rectifier circuit and a smoothing circuit. The rectifier circuit is a full-wave rectifier circuit with multiple diodes. A full-wave rectifier circuit is just one example; a half-wave rectifier circuit could also be used. The smoothing circuit consists of capacitors and resistors. The power supply circuit 82 converts the AC power input from the resonant circuit 92 into DC power and supplies the converted DC power (hereinafter also simply referred to as "power") to various driving elements within the IC chip 52. Examples of various driving elements include the computer 84 and the signal processing circuit 88. Thus, by supplying power to the various driving elements within the IC chip 52 using the power generator 70, the IC chip 52 operates using the power generated by the power generator 70.

[0096] Computer 84 is an example of a "computer applicable to non-contact storage media" according to the technology of the present invention, which controls the entire cassette memory 19.

[0097] Signal processing circuit 88 is connected to resonant circuit 92. Signal processing circuit 88 has a decoding circuit (not shown) and an encoding circuit (not shown). The decoding circuit of signal processing circuit 88 extracts the command from the magnetic field MF received by coil 60, decodes it, and outputs it to computer 84. Computer 84 outputs a response signal to the command to signal processing circuit 88. That is, computer 84 performs processing corresponding to the command input from signal processing circuit 88 and outputs the processing result as a response signal to signal processing circuit 88. In signal processing circuit 88, if a response signal is input from computer 84, the encoding circuit of signal processing circuit 88 modulates the response signal by encoding it and outputs it to resonant circuit 92. Resonant circuit 92 sends the response signal input from the encoding circuit of signal processing circuit 88 to contactless read / write device 50 via magnetic field MF. That is, when the response signal is sent from cassette memory 19 to contactless read / write device 50, the response signal is contained in magnetic field MF. In other words, the response signal is superimposed on magnetic field MF.

[0098] Thus, the IC chip 52 is connected to a coil 60 that is electromagnetically coupled to the contactless reader / writer 50 via a magnetic field MF supplied from the contactless reader / writer 50, and via the magnetic field MF (reference) Figure 5 and Figure 6 The IC chip 52 communicates with the contactless reader / writer 50. Furthermore, the IC chip 52 corresponds to multiple communication standards. Here, multiple communication standards refer to, for example, ISO18092, ISO14443A, ISO1443B, and ISO15693. The contactless reader / writer 50 has any one of these multiple communication standards. That is, the contactless reader / writer 50 is not only equipped with... Figure 4 The tape drive 30 shown also exists in multiple ways during the manufacturing and inspection processes, and each contactless read / write device 50 has any one of multiple communication standards.

[0099] As an example, such as Figure 10 As shown, computer 84 includes CPU 94, NVM 96, and RAM 98. CPU 94, NVM 96, and RAM 98 are connected to bus 100.

[0100] CPU 94 controls the operation of computer 84. NVM 96 is an example of the "memory" involved in the technology of this invention. An example of NVM 96 is EEPROM. EEPROM is just one example; for example, ferroelectric memory could be used instead of EEPROM. Any memory can be used as long as it is a non-volatile memory that can be mounted on IC chip 52. RAM 98 temporarily stores various information and is used as working memory. Examples of RAM 98 include DRAM or SRAM.

[0101] The NVM96 has multiple storage blocks, including a configurable parameter storage block 102, a current setting parameter storage block 104, and a program storage block 106. Management information (not shown) and other data are stored in these multiple storage blocks.

[0102] The configurable parameter storage block 102 stores a plurality of communication standard parameters 108 that can determine the communication standard that can be set in the IC chip 52. Furthermore, here, the communication standard parameters 108 are an example of the "parameters" involved in the technology of this invention. Moreover, the plurality of communication standard parameters 108 are an example of "communication standard information related to a plurality of communication standards" involved in the technology of this invention, and the configurable parameter storage block 102 is an example of a "retention area for holding communication standard information" involved in the technology of this invention.

[0103] The current setting parameter storage block 104 is an example of a "storage area" according to the technology of this invention. The current setting parameter storage block 104 stores a current setting parameter 110. The current setting parameter 110 is a communication standard parameter 108 among a plurality of communication standard parameters 108 that corresponds to the communication standard currently set in the IC chip 52. Furthermore, the current setting parameter 110 is an example of "memory storage content" and "setting communication standard information representing the set communication standard" according to the technology of this invention.

[0104] The program storage block 106 stores a communication standard setting program 112. The communication standard setting program 112 is an example of a "program" according to the present invention. Furthermore, the program storage block 106 also stores a plurality of communication standard-specific programs 114. Each of the plurality of communication standard-specific programs 114 corresponds one-to-one with a plurality of communication standard parameters 108. The CPU 94 reads the communication standard-specific program 114 corresponding to the current setting parameter 110 stored in the current setting parameter storage block 104 from the program storage block 106. The CPU 94 executes the program storage block 106 read from the program storage block 106 to achieve communication under the communication standard corresponding to the current setting parameter 110 stored in the current setting parameter storage block 104.

[0105] The communication standard determined by the current setting parameter 110 stored in the current setting parameter storage block 104 is the communication standard currently set in the IC chip 52. That is, by executing the dedicated communication standard program 114 corresponding to the current setting parameter 110 stored in the current setting parameter storage block 104 through the CPU 94, the IC chip 52 can communicate via the coil 60 using the currently set communication standard. Figure 9 It communicates with the contactless reader / writer 50.

[0106] As an example, such as Figure 11As shown, CPU 94 reads the communication standard setting program 112 from NVM 96 and executes the read communication standard setting program 112 on RAM 98. CPU 94 performs the communication standard setting process described later (see reference) by operating as communication unit 94A and setting unit 94B according to the communication standard setting program 112 executed on RAM 98. Figure 16 ).

[0107] As an example, such as Figure 12 As shown, the program storage block 106 stores a default communication standard program 114A as one of a plurality of communication standard dedicated programs 114. When the IC chip 52 is in the initial setting state, the current setting parameter storage block 104 stores a default communication standard parameter 110A as the current setting parameter 110. The default communication standard parameter 110A is a parameter that can determine the communication standard (hereinafter also referred to as "default communication standard") used by the IC chip 52 by default. When the default communication standard parameter 110A is stored in the program storage block 106, the setting unit 94B reads the default communication standard program 114A from the program storage block 106 in the RAM 98. The setting unit 94B communicates with the contactless read / write device 50 via the coil 60 using the default communication standard by executing the default communication standard program 114A in the RAM 98. For example, ISO 14443A can be cited as a default communication standard. In this embodiment, ISO 14443A is a special communication standard used only for changing the setting of the communication standard.

[0108] In addition, ISO 14443A is just one example of the default communication standard and special communication standards. The default communication standard and special communication standard can also be communication standards such as ISO 18092, ISO 1443B or ISO 15693.

[0109] In the IC chip 52, any one of multiple communication standards is set as the default communication standard, for example, ... Figure 13 As shown, when communication is established between the communication unit 94A and the contactless reader / writer 50 under the default communication standard, the contactless reader / writer 50 sends a change command to the communication unit 94A. The communication unit 94A receives the change command from the contactless reader / writer 50 by communicating with the contactless reader / writer 50 using the default communication standard.

[0110] The change command is an example of a "change instruction" and a "rewrite command to rewrite the stored contents of the memory" as described in this invention. A change command is an instruction to change the communication standard setting in the IC chip 52 to a communication standard different from the default communication standard. That is, the contactless read / write device 50 is an example of an "external" device as described in this invention, and by communicating with the communication unit 94A using the default communication standard, it assigns a change instruction to change the communication standard to a different communication standard as a change command to the communication unit 94A.

[0111] Furthermore, in this embodiment, the change command is a special command used only for changing the settings of the communication standard. However, the technology of the present invention is not limited to this, and the rewrite command commonly used in rewriting the storage content of NVM96 can also be used for indicating changes to the settings of the communication standard.

[0112] If a change command is given from the contactless reader / writer 50 to the communication unit 94A, the setting unit 94B changes the communication standard setting from the default communication standard and fixes it to the communication standard corresponding to the change command among multiple communication standards as the new communication standard.

[0113] In this case, as an example, such as Figure 14 As shown, firstly, the setting unit 94B retrieves the communication standard parameter 108 corresponding to the change command given to the communication unit 94A from the settable parameter storage block 102. Next, the setting unit 94B updates the current setting parameter 110 by overwriting the current setting parameter storage block 104 with the communication standard parameter 108 retrieved from the settable parameter storage block 102 and saving it. That is, the setting unit 94B updates the current setting parameter 110 in the current setting parameter storage block 104 by changing the current setting parameter 110 from the default communication standard parameter 110A (see reference 110A). Figure 12 The communication standard setting is changed by rewriting the latest communication standard parameter 108 obtained from the configurable parameter storage block 102. As a result, the communication standard setting of IC chip 52 is changed from the default communication standard to the communication standard determined according to the latest communication standard parameter 108 obtained from the configurable parameter storage block 102.

[0114] Then, the setting unit 94B fixes the communication standard setting determined by the current setting parameter 110 in the current setting parameter storage block 104 by fixing the current setting parameter 110 in the current setting parameter storage block 104. That is, the setting unit 94B fixes the new communication standard setting when the communication standard setting of the IC chip 52 has changed from the default communication standard to the new communication standard. Specifically, the setting of the communication standard determined by the latest communication standard parameter 108 is fixed when the current setting parameter 110 in the current setting parameter storage block 104 has been updated from the default communication standard parameter 110A to the latest communication standard parameter 108 obtained from the settable parameter storage block 102.

[0115] Furthermore, here, "fixing the current setting parameter 110" means fixing it to a state where the current setting parameter 110 cannot be rewritten. As a method to fix the current setting parameter 110 within the current setting parameter storage block 104, one could, for example, lock the entire current setting parameter storage block 104 to a state where it cannot be rewritten.

[0116] Furthermore, the setting unit 94B clears unnecessary communication standard information from each storage block based on the condition that the new communication standard setting has been fixed. Specifically, the setting unit 94B clears multiple communication standard parameters 108 from the settable parameter storage block 102 and from the program storage block 106 (see reference). Figure 10 Remove communication standard dedicated programs 114 except those corresponding to the communication standard determined according to the current setting parameter 110.

[0117] As an example, such as Figure 15 As shown, the communication unit 94A retrieves the current setting parameter 110 from the current setting parameter storage block 104. Then, the communication unit 94A reads the communication standard dedicated program 114 corresponding to the current setting parameter 110 retrieved from the current setting parameter storage block 104 from the program storage block 106, and executes the read communication standard dedicated program 114. The setting unit 94B communicates with the contactless reader / writer 50 via the coil 60 using the communication standard corresponding to the current setting parameter 110 by executing the communication standard dedicated program 114 corresponding to the current setting parameter 110.

[0118] Next, refer to Figure 16 The function of the cassette memory 19 involved in the implementation method will be explained.

[0119] exist Figure 16 The diagram shows an example of the communication standard setting process executed by the CPU94 during the manufacturing process of the tape cartridge 10. Figure 16The communication standard setting process shown is an example of the "operating method of non-contact storage medium" involved in the technology of this invention.

[0120] Furthermore, this example illustrates a method where the CPU 94 performs communication standard setting processing during the manufacturing process of the tape cartridge 10, but the technology of the present invention is not limited to this. For example, the communication standard setting processing can be performed by the CPU 94 during a stage where the tape cartridge 10 is inspected or shipped from the factory, or it can be performed by the CPU 94 after the tape cartridge 10 is loaded into the tape drive 30. For ease of explanation, the following description assumes that the default communication standard parameter 110A is already stored in the current setting parameter storage block 104 as the current setting parameter 110.

[0121] exist Figure 16 In the communication standard setting process shown, firstly, in step ST100, the communication unit 94A starts communicating with the contactless reader / writer 50 via the coil 60 using the default communication standard by executing the default communication standard program 114A.

[0122] In the next step ST102, the communication unit 94A determines whether a change command has been received from the contactless reader / writer 50 by the coil 60. If, in step ST102, the coil 60 does not receive a change command from the contactless reader / writer 50, the determination is rejected, and step ST102 is repeated. If, in step ST102, the coil 60 receives a change command from the contactless reader / writer 50, the determination is affirmative, and the communication standard setting process transitions from step ST102 to step ST104.

[0123] In step ST104, the setting unit 94B retrieves the communication standard parameter 108 corresponding to the change command received by the coil 60 in step ST102 from the settable parameter storage block 102.

[0124] In the next step ST106, the setting unit 94B updates the current setting parameter 110 by changing the current setting parameter 110 stored in the current setting parameter storage block 104 from the default communication standard parameter 110A to the communication standard parameter 108 obtained in step ST104.

[0125] In the next step ST108, the setting unit 94B fixes the current setting parameter 110 in the current setting parameter storage block 104 by locking the current setting parameter storage block 104 as unwritable.

[0126] In the next step ST110, as unwanted communication standard information, the setting unit 94B clears multiple communication standard parameters 108 and communication standard dedicated programs 114 from the NVM96, except for the communication standard dedicated program 114 corresponding to the communication standard determined according to the current setting parameter 110.

[0127] In the next step ST112, the setting unit 94B retrieves the current setting parameter 110 from the current setting parameter storage block 104.

[0128] In the next step ST114, the setting unit 94B terminates the communication under the default communication standard between itself and the contactless reader / writer 50.

[0129] In the next step ST116, the setting unit 94B starts communicating with the contactless reader / writer 50 via the coil 60 by executing a communication standard dedicated program 114 corresponding to the current setting parameter 110 stored in the current setting parameter storage block 104, using the communication standard corresponding to the current setting parameter 110.

[0130] As explained above, in the cartridge memory 19, the IC chip 52 corresponds to multiple communication standards. Therefore, according to this structure, compared to the case where the IC chip of the cartridge memory mounted on the tape cassette corresponds to only one communication standard, the cartridge memory 19 mounted on the tape cassette 10 can perform contactless communication with the contactless reader / writer 50 using many communication standards.

[0131] Furthermore, in the cassette memory 19, the contactless read / write device 50 is not only mounted on... Figure 4 The tape drive 30 shown also exists in multiple ways during manufacturing and inspection processes, and each contactless reader / writer 50 has any one of multiple communication standards. Therefore, according to this structure, even if the contactless reader / writer 50 has any one of multiple communication standards, contactless communication can be achieved between the cartridge memory 19 and the contactless reader / writer 50.

[0132] Furthermore, in the cassette memory 19, when a change command is given from the contactless read / write device 50, the IC chip 52 changes the communication standard setting from the default communication standard and fixes it to the communication standard corresponding to the change command as the new communication standard. Therefore, according to this structure, it is possible to prevent the communication standard changed from the default communication standard from being mistakenly changed. In addition, not limited to change commands, when certain physical switches are provided to the IC chip 52 and the switches are turned on, it is also possible to instruct the IC chip 52 to change the communication standard, and the same effect can be expected in this case.

[0133] Furthermore, in the cassette memory 19, the IC chip 52 receives change commands from the contactless reader / writer 50 by communicating with the contactless reader / writer 50 using a default communication standard. Therefore, according to this structure, compared to the case where no default communication standard is set in the IC chip 52, it is possible to enable the IC chip 52 to receive change commands without expending labor and time.

[0134] Furthermore, in the cassette memory 19, a special communication standard (a special communication standard used only for the exchange of change commands) is used as the default communication standard for changes to the communication standard settings. Therefore, according to this structure, compared to the case where the IC chip receives change commands and other commands using the same communication standard, the burden of identifying commands within the IC chip can be reduced.

[0135] Furthermore, in the cassette memory 19, the setting of the new communication standard is fixed based on the condition that the communication standard setting has been changed from the default communication standard to the new communication standard. Therefore, according to this structure, it is possible to prevent the communication standard changed from the default communication standard from being mistakenly changed after the communication standard setting has been changed from the default communication standard to the new communication standard.

[0136] Furthermore, in the cassette memory 19, information related to communication standards other than the new communication standard is cleared from the NVM96 as a condition that the setting of the new communication standard has been fixed. Therefore, according to this structure, compared to the case where information related to communication standards other than the new communication standard is still retained in the NVM96 even after the setting of the new communication standard has been fixed, the free capacity of the NVM96 can be increased.

[0137] Furthermore, in the above embodiment, the setting of the new communication standard is fixed based on the condition that the communication standard setting of IC chip 52 has been changed from the default communication standard to the new communication standard. However, the technology of the present invention is not limited to this, and the setting of the new communication standard can also be fixed when other predetermined conditions are met. For example, the setting of the new communication standard can be fixed when the condition that a communication standard change flag indicating that the communication standard setting of IC chip 52 has been changed from the default communication standard to the new communication standard is met. In other words, unless a communication standard change flag is set in IC chip 52, the setting of the new communication standard will not be fixed, so the setting of the communication standard can be changed according to an instruction given from the outside (e.g., a change command).

[0138] In this case, for example, executed by CPU94 Figure 17 The communication standard settings are shown. Figure 17 The flowchart shown is Figure 16The only difference in the flowchart shown is the presence of step ST107 between steps ST106 and ST108. Therefore, in this context, the flowchart is similar to... Figure 16 The flowchart shown illustrates the different steps.

[0139] exist Figure 17 In step ST107 of the communication standard setting process shown, the setting unit 94B activates the communication standard change flag. Here, activating the communication standard change flag means, for example, setting the communication standard change flag to NVM96.

[0140] The timing for setting the communication standard change flag can be, for example, at a time after a predetermined period of time (e.g., a few seconds) has elapsed after the processing of step ST106, or at a time when certain conditions are further met after the processing of step ST106.

[0141] Here, as a first example of certain conditions, one could cite the condition that the driving power level of IC chip 52 reaches a predetermined level (for example, a level pre-defined as the power level that can stably drive IC chip 52). Furthermore, as a second example of certain conditions, one could cite the condition that a response signal indicating a change in communication standard is sent from IC chip 52 to contactless reader / writer 50, and when contactless reader / writer 50 receives the response signal from IC chip 52, it sends a flag setting instruction command indicating the setting of a communication standard change flag, and the setting unit 94B receives the flag setting instruction command.

[0142] Therefore, the current setting parameter 110 will only be fixed in step ST108 if the communication standard change flag is set in the NVM96. In other words, the current setting parameter 110 will not be fixed unless the communication standard change flag is set in the NVM96.

[0143] Therefore, by fixing the current setting parameter 110 based on the condition of setting a communication standard change flag, the current setting parameter 110 can be fixed at a predetermined time after it is updated.

[0144] exist Figure 17 The example shown illustrates a method where a communication standard change flag is set based on the condition that the communication standard setting of IC chip 52 has changed from the default communication standard to a new communication standard, and the new communication standard setting is fixed based on the setting of the communication standard change flag. However, the technology of the present invention is not limited to this. For example, the new communication standard setting can also be fixed when the condition that a specific process completion flag indicating that a specific process (e.g., the final process in the manufacturing process) among the multiple processes included in the manufacturing process of tape cartridge 10 has been set in IC chip 52 is met.

[0145] In this case, for example, executed by CPU94 Figure 18 The communication standard settings are shown below. Figure 17 Compared to the flowchart shown, Figure 18 The difference in the flowchart shown is that it does not have steps ST107 to ST110, and it has steps ST118 to ST124 after step ST116. Therefore, here, regarding... Figure 17 The flowchart shown illustrates the different steps.

[0146] exist Figure 18 In step ST118 of the communication standard setting process, the communication unit 94A determines whether the coil 60 has received specific process completion information indicating that a specific process has been completed. This specific process completion information is, for example, sent from the contactless reader / writer 50 to the IC chip 52. In step ST118, if the coil 60 does not receive the specific process completion information, the determination is rejected, and step ST118 is repeated. In step ST118, if the coil 60 receives the specific process completion information, the determination is affirmative, and the communication standard setting process proceeds to step ST120.

[0147] In step ST120, the setting unit 94B activates the specific process completion flag. Here, activating the specific process completion flag means, for example, setting the specific process completion flag to NVM96.

[0148] In the next step ST122, the setting unit 94B performs and Figure 16 and Figure 17 The same process as step ST108 is performed in the next step ST124, where the setting unit 94B performs the same process. Figure 16 and Figure 17 The process shown in step ST110 is the same. After executing the process in step ST124, the process ends. Figure 18 The communication standard settings are shown.

[0149] according to Figure 18 In the example shown, the current setting parameter 110 will only be fixed by the setting unit 94B if a specific process completion flag is set in the NVM96. In other words, the current setting parameter 110 will not be fixed unless a specific process completion flag is set in the NVM96.

[0150] Therefore, by fixing the current setting parameter 110 based on a condition that a specific process completion flag is set, the current setting parameter 110 can be fixed at a predetermined time after the specific process is completed. In other words, the current setting parameter 110 will not be fixed unless the specific process is completed, thus allowing for further changes to the communication standard during this period.

[0151] In the above embodiments, an example of clearing unnecessary communication standard information from each storage block is given (refer to step ST110). However, the technology of the present invention is not limited to this. It is also possible to clear only a part of the unnecessary communication standard information (for example, at least one communication standard parameter in the parameter storage block 102 can be set), or not to clear the unnecessary communication standard information.

[0152] The above embodiments illustrate an example of storing a communication standard setting program 112 in the NVM96, but the technology of the present invention is not limited thereto. For example, as... Figure 19 As shown, the communication standard setting program 112 can also be stored in the storage medium 200.

[0153] Storage medium 200 is a non-transitory storage medium. Examples of storage medium 200 include any portable storage medium such as an SSD or USB flash drive. The communication standard setting program 112 stored in storage medium 200 is installed in computer 84. CPU 94 performs communication standard setting processing according to the communication standard setting program 112. Figure 19 In the example shown, CPU94 is a single CPU, but it can also be multiple CPUs.

[0154] Furthermore, the communication standard setting program 112 can also be stored in the storage device of other computers or server devices connected to the computer 84 via a communication network (not shown), and the communication standard setting program 112 can be downloaded and installed in the computer 84 upon request from the cassette memory 19.

[0155] exist Figure 19 The example shown illustrates a computer 84, but the technology of the present invention is not limited thereto. Devices including ASICs, FPGAs, and / or PLDs can also be used instead of the computer 84. Furthermore, a combination of hardware and software structures can also be used instead of the computer 84.

[0156] As the hardware resource for performing communication standard setting processing, various processors, as shown below, can be used. For example, a general-purpose processor, i.e., a CPU, can function as the hardware resource for performing communication standard setting processing by executing software, i.e., a programmable programmable circuit, i.e., an FPGA, PLD, or ASIC, can also be used as a processor. All processors have built-in or connected memory, and all processors perform communication standard setting processing by using memory.

[0157] The hardware resources for performing communication standard setting processing can consist of one of these various processors, or a combination of two or more processors of the same or different types (e.g., a combination of multiple FPGAs or a combination of a CPU and an FPGA). Furthermore, the hardware resources for performing communication standard setting processing can also be a single processor.

[0158] As examples of processors, firstly, there are processors that combine one or more CPUs with software, functioning as hardware resources for performing communication standard setting processing. Secondly, there are processors, such as SoCs, that use a single IC chip to implement the overall system functionality, including the execution of communication standard setting processing. Thus, communication standard setting processing is implemented using one or more of the aforementioned processors as hardware resources.

[0159] Furthermore, the hardware architecture of these various processors, more specifically, can utilize circuits composed of semiconductor components and other circuit elements. Moreover, the aforementioned communication standard setting process is merely one example. Therefore, without departing from the intended purpose, unnecessary steps can certainly be removed, new steps added, or the processing order rearranged.

[0160] The descriptions and illustrations above are detailed explanations of the parts related to the technology of this invention, and are merely one example of the technology of this invention. For example, the descriptions related to the above-described structure, function, effect, and effect are examples of the structure, function, effect, and effect of the parts related to the technology of this invention. Therefore, without departing from the technical spirit of this invention, unnecessary parts may be deleted from the descriptions and illustrations above, or new elements may be added or replaced. Furthermore, to avoid complications and to facilitate understanding of the parts related to the technology of this invention, descriptions related to common technical knowledge that are not particularly necessary to explain in terms of enabling the implementation of this invention have been omitted from the descriptions and illustrations above.

[0161] In this specification, "A and / or B" has the same meaning as "at least one of A and B". That is, "A and / or B" can mean only A, only B, or a combination of A and B. Furthermore, in this specification, the same approach applies to situations where three or more cases are connected by "and / or".

[0162] All documents, patent applications and technical standards described in this specification, and the specific and separately described documents, patent applications and technical standards incorporated herein by reference, are incorporated herein by reference to the same extent.

Claims

1. A contactless storage medium mounted on a magnetic tape cassette, The contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards. The IC chip is configured with any one of the multiple communication standards as the default communication standard. The IC chip can communicate with the communication destination using a special communication standard that differs from the plurality of communication standards and is only used for changes to the settings of the communication standards. The IC chip receives a change command by communicating with the communication destination using the specific communication standard. The change command is an instruction to change to a communication standard different from the default communication standard. When the change command is received, the IC chip changes the setting of the communication standard from the default communication standard and fixes it to the communication standard corresponding to the change command among the plurality of communication standards as the new communication standard.

2. The contactless storage medium according to claim 1, wherein, The communication destination can be any one of multiple communication devices. The plurality of communication devices have any one of the plurality of communication standards.

3. The contactless storage medium according to claim 1 or 2, wherein, The IC chip fixes the setting of the new communication standard based on the condition that the communication standard setting has been changed from the default communication standard to the new communication standard.

4. The contactless storage medium according to claim 1 or 2, wherein, When the communication standard setting is changed from the default communication standard to the new communication standard and the predetermined conditions are met, the IC chip fixes the setting of the new communication standard.

5. The contactless storage medium according to claim 4, wherein, The IC chip has a storage area for storing parameters that can determine the set communication standard among the plurality of communication standards. The established conditions include the condition that the parameters in the storage area have been updated from the default communication standard to the parameters with respect to the new communication standard.

6. The contactless storage medium according to claim 4, wherein, The predetermined conditions include the condition that the IC chip has a communication standard change flag indicating that the communication standard setting has been changed from the default communication standard to the new communication standard.

7. A contactless storage medium mounted on a magnetic tape cassette. The contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards. The IC chip is configured with any one of the multiple communication standards as the default communication standard. When an external command is issued indicating a change to a communication standard different from the default communication standard, the IC chip changes the communication standard setting from the default communication standard to the communication standard corresponding to the change command among the plurality of communication standards as the new communication standard, and fixes the new communication standard when predetermined conditions are met. The predetermined conditions include the condition that a specific process completion flag is set within the IC chip to indicate that a specific process among a plurality of processes included in the manufacturing process of the tape cartridge has been completed.

8. The contactless storage medium according to claim 1 or 7, wherein, The change command is a special command used only for changing the settings of the communication standard.

9. The contactless storage medium according to claim 1 or 7, wherein, The IC chip has a memory. The change command is a rewrite command that rewrites the stored contents of the memory. The stored content includes setting communication standard information representing the established communication standard. The communication standard settings are changed by rewriting the communication standard information according to the rewrite command.

10. A contactless storage medium mounted on a magnetic tape cassette. The contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards. The IC chip is configured with any one of the multiple communication standards as the default communication standard. When an external command is given to change the communication standard to a different standard than the default communication standard, the IC chip changes the communication standard setting from the default communication standard and fixes it to the communication standard corresponding to the change command among the plurality of communication standards as the new communication standard. The IC chip has a storage area for holding communication standard information related to the plurality of communication standards. With the setting of the new communication standard already fixed as a condition, information related to communication standards other than the new communication standard is removed from the communication standard information in the retention area.

11. A magnetic tape cassette, comprising: The contactless storage medium according to any one of claims 1 to 10; and magnetic tape, The contactless storage medium stores information related to the magnetic tape.

12. A method for operating a contactless storage medium, wherein the method is for operating a contactless storage medium mounted on a magnetic tape cassette, wherein... The contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards. The IC chip is configured with any one of the multiple communication standards as the default communication standard. The IC chip can communicate with the communication destination using a special communication standard that differs from the plurality of communication standards and is only used for changes to the settings of the communication standards. The working method of the contactless storage medium includes the following steps: The IC chip receives a change command by communicating with the communication destination using the specific communication standard. The change command is an instruction to change to a communication standard different from the default communication standard. When the change command is received, the IC chip changes the communication standard setting from the default communication standard to the communication standard corresponding to the change command among the plurality of communication standards as the new communication standard; and The new communication standard is fixed.

13. A storage medium storing a program for causing a computer applicable to a contactless storage medium mounted on a magnetic tape cartridge to perform processing, wherein... The contactless storage medium includes an IC chip connected to an antenna that is electromagnetically coupled to the communication destination via a magnetic field supplied from the communication destination, and communicates with the communication destination via the magnetic field. The IC chip corresponds to multiple communication standards. The IC chip is configured with any one of the multiple communication standards as the default communication standard. The IC chip can communicate with the communication destination using a special communication standard that differs from the plurality of communication standards and is only used for changes to the settings of the communication standards. The process includes the following steps: The IC chip receives a change command by communicating with the communication destination using the specific communication standard. The change command is an instruction to change to a communication standard different from the default communication standard. When the change command is received, the IC chip changes the communication standard setting from the default communication standard to the communication standard corresponding to the change command among the plurality of communication standards as the new communication standard; and The new communication standard is fixed.

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