An LED unit substrate, an LED panel, an LED device, and a manufacturing method

Abstract

The application discloses an LED unit substrate, an LED panel, an LED device and a preparation method, relates to the technical field of microelectronics, and can reduce the number of pins for electrically connecting the LED and a driving substrate, reduce the number of piece-making processes, improve the space utilization of the driving substrate, and realize the LED device with high PPI. An LED unit substrate comprises a control signal generator and a plurality of LEDs; the control signal generator comprises a first signal input end and a signal output end, the first signal input end is used for accessing a driving signal, and the signal output end is electrically connected with the LEDs; the control signal generator is used for generating a control signal based on the received driving signal, and the control signal is used for controlling the lighting state of the corresponding connected LEDs.

Description

Technical Field

[0001] This application relates to the field of microelectronics technology, and in particular to an LED unit substrate, an LED panel, an LED device, and a method for fabricating them. Background Technology

[0002] Currently, in LED (Light-Emitting Diode) applications, a bonding process is typically used to solder the LED chip onto a driver substrate. However, the driver circuitry on the driver substrate occupies a portion of the area, and the bonding of the LED chip needs to avoid the driver circuitry corresponding to each pixel. Therefore, the space reserved for the LED on the driver substrate is limited by the driver circuitry, resulting in a compression of the effective pixel area of ​​the driver substrate. Consequently, the utilization rate of the pixel layout on the driver substrate is low, making it difficult to achieve high PPI (pixel count) LED devices. Summary of the Invention

[0003] This application provides an LED unit substrate, an LED panel, an LED device, and a manufacturing method, which can reduce the number of pins for electrical connection between the LED and the driving substrate, reduce the number of forming processes, improve the space utilization of the driving substrate, and realize a high PPI LED device.

[0004] A first aspect of this application provides an LED unit substrate, comprising:

[0005] Control signal generator and multiple LEDs;

[0006] The control signal generator includes a first signal input terminal and a signal output terminal. The first signal input terminal is used to receive a driving signal, and the signal output terminal is electrically connected to the LED.

[0007] The control signal generator is used to generate a control signal based on the received drive signal, and the control signal is used to control the lighting state of the corresponding connected LED.

[0008] In some embodiments, the LED unit substrate further includes:

[0009] The second signal input terminal is electrically connected to the LED.

[0010] The total number of the first signal input terminal and the second signal input terminal is less than 9.

[0011] In some embodiments, the plurality of said LEDs are arranged in an array.

[0012] In some implementations, the first signal input terminal includes a clock signal input terminal and a strobe signal input terminal;

[0013] The signal output terminal includes an enable control signal output terminal and a scan signal output terminal;

[0014] The second signal input terminal includes a high-level signal input terminal, a low-level signal input terminal, and a data signal input terminal.

[0015] In some embodiments, the plurality of LEDs includes at least two types of LEDs, with different types of LEDs emitting different colors of light;

[0016] Each of the scan signal output terminals is connected to an LED that emits light of the same color.

[0017] In some embodiments, the second signal input terminal is connected to any of the LEDs;

[0018] The LEDs are electrically connected to each other via signal transmission lines, which are used to transmit high-level signals, low-level signals, and data signals.

[0019] In some embodiments, the control signal generator includes a frame start signal generation latch, a clock signal rising edge detector, a clock signal falling edge detector, and an RS flip-flop;

[0020] The frame start signal generation latch is electrically connected to the clock signal rising edge detector, the clock signal rising edge detector is electrically connected to the clock signal falling edge detector, and the RS flip-flop is electrically connected to the clock signal rising edge detector and the clock signal falling edge detector.

[0021] The clock signal input terminal is electrically connected to the frame start signal generation latch, the clock signal rising edge detector, and the clock signal falling edge detector, respectively.

[0022] The strobe signal input terminal is electrically connected to the frame start signal generation latch, the clock signal rising edge detector, the clock signal falling edge detector, and the RS flip-flop, respectively.

[0023] In some embodiments, the number of RS flip-flops is at least two, the output of any one RS flip-flop is electrically connected to the enable control signal output, and the outputs of the remaining RS flip-flops are respectively electrically connected to the scan signal output.

[0024] In some implementations, the clock signal rising edge detector is electrically connected to the RS flip-flop in a one-to-one correspondence;

[0025] The clock signal falling edge detector is electrically connected to the RS flip-flop in a one-to-one correspondence.

[0026] In some implementations, the output of the frame start signal generation latch is electrically connected to the cascaded input of the clock signal rising edge detector of the first stage.

[0027] The output of the rising edge detector of the first stage is electrically connected to the cascaded input of the falling edge detector of the first stage. The output of the falling edge detector of the first stage is electrically connected to the cascaded input of the rising edge detector of the next stage. The output of the falling edge detector of the last stage is connected to the same RS flip-flop as the rising edge detector of the first stage.

[0028] The output terminals of the rising edge detector and the falling edge detector are respectively electrically connected to the corresponding RS flip-flops.

[0029] A second aspect of this application provides an LED panel, comprising:

[0030] LED unit substrate as described in the first aspect.

[0031] In some embodiments, the LED panel further includes:

[0032] A driving substrate, the driving substrate including driving signal lines and cascade lines;

[0033] The driving signal lines are electrically connected to the first signal input terminal, the signal output terminal, and the second signal input terminal of the LED unit substrate, respectively.

[0034] When there are multiple LED unit substrates, adjacent LED unit substrates are connected through the cascade wire.

[0035] In some embodiments, the plurality of LEDs on the LED unit substrate are arranged in a row;

[0036] In a single frame of display, the signal output terminal of the LED unit substrate that refreshes the first line includes a reset signal output terminal, and the reset signal is transmitted to other LED unit substrates through the cascaded lines.

[0037] A third aspect of this application provides an LED device, comprising:

[0038] LED panel as described in the second aspect.

[0039] A fourth aspect of this application provides a method for manufacturing an LED panel, comprising:

[0040] LED unit substrate and driving substrate are fabricated separately. The LED unit substrate includes a control signal generator and a plurality of LEDs. The control signal generator includes a first signal input terminal and a signal output terminal. The first signal input terminal is used to receive a driving signal, and the signal output terminal is electrically connected to the LED. The control signal generator is used to generate a control signal based on the received driving signal. The control signal is used to control the lighting state of the corresponding connected LED.

[0041] The LED unit substrate and the driving substrate are bonded together to electrically connect the LED unit substrate and the driving substrate.

[0042] In some embodiments, the separate fabrication of the LED unit substrate and the driver substrate includes:

[0043] The LED is disposed on a first substrate to obtain the LED unit substrate;

[0044] A driving circuit is disposed on a second substrate to obtain the driving substrate;

[0045] The bonding of the LED unit substrate and the driving substrate includes:

[0046] The first substrate and the second substrate are removed respectively, and the driving circuit is bonded to the first signal input terminal, the signal output terminal and the second signal input terminal respectively to electrically connect the LED unit substrate and the driving substrate.

[0047] The LED unit substrate provided in this application integrates multiple LEDs into a single unit substrate and includes a control signal generator. The control signal generator processes the driving signals received from the driving substrate to obtain control signals, which are then transmitted to each LED to control their illumination state. This eliminates the need for individual LEDs to be directly electrically connected to the driving substrate; each LED unit substrate can be electrically connected via a first signal input terminal. This eliminates the need for soldering pins for each LED, reducing the total number of pins connecting the LED unit substrate and the driving substrate. When using a die-casting process, this reduces the number of die-casting operations required to connect multiple LEDs to the driving substrate, thus reducing the defect rate. Furthermore, the pixel driving circuit is not required on the driving substrate. The driving substrate only needs to have driving signal lines to transmit driving signals or a simple driving circuit. The pixel driving circuit can be integrated into the LED unit substrate via the control signal generator, increasing the effective pixel area of ​​the driving substrate, allowing for more LEDs to be mounted, and overcoming the space limitations imposed by the pixel driving circuit on the driving substrate, thus facilitating the achievement of high PPI. Attached Figure Description

[0048] Figure 1 A schematic structural diagram of an LED unit substrate provided in an embodiment of this application;

[0049] Figure 2 A schematic structural diagram of another LED unit substrate provided in an embodiment of this application;

[0050] Figure 3 A schematic structural diagram of a control signal generator provided in an embodiment of this application;

[0051] Figure 4 A schematic structural diagram of another control signal generator provided in the embodiments of this application;

[0052] Figure 5 A schematic circuit diagram of a frame start signal latch provided in an embodiment of this application;

[0053] Figure 6 A schematic transistor connection circuit diagram of a frame start signal latch provided for an embodiment of the application;

[0054] Figure 7 A schematic circuit diagram of a clock signal rising edge detector provided for embodiments of this application;

[0055] Figure 8 A schematic transistor connection circuit diagram of a clock signal rising edge detector provided for an embodiment of the application;

[0056] Figure 9 A schematic circuit diagram of a clock signal falling edge detector provided for embodiments of this application;

[0057] Figure 10 A schematic transistor connection circuit diagram of a clock signal falling edge detector provided for an embodiment of the application;

[0058] Figure 11 A schematic circuit diagram of an RS flip-flop provided for an embodiment of this application;

[0059] Figure 12 A schematic transistor connection circuit diagram of an RS flip-flop provided for an embodiment of the application;

[0060] Figure 13 A schematic structural diagram of an LED panel provided in an embodiment of this application;

[0061] Figure 14 A schematic structural diagram of an LED device provided in an embodiment of this application;

[0062] Figure 15A schematic flowchart illustrating a method for manufacturing an LED panel according to an embodiment of this application;

[0063] Figure 16 This is a first timing diagram of an LED panel driving method provided in an embodiment of this application;

[0064] Figure 17 This is a second timing diagram of an LED panel driving method provided in an embodiment of this application;

[0065] Figure 18 A third timing diagram of an LED panel driving method provided in an embodiment of this application;

[0066] Figure 19 A fourth timing diagram of an LED panel driving method provided in an embodiment of this application;

[0067] Figure 20 This is a fifth timing diagram of an LED panel driving method provided in an embodiment of this application. Detailed Implementation

[0068] To better understand the technical solutions provided in the embodiments of this specification, the technical solutions of the embodiments of this specification will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of this specification and the specific features in the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. In the absence of conflict, the embodiments of this specification and the technical features in the embodiments can be combined with each other.

[0069] In this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element. The term "two or more" includes two or more cases.

[0070] Currently, LED applications typically employ a bonding process to solder LED chips onto a driver substrate. However, the driver circuitry on the driver substrate occupies a portion of the area, and the bonding of the LED chips needs to avoid the driver circuitry corresponding to each pixel. Therefore, the space reserved for LEDs on the driver substrate is limited by the driver circuitry, resulting in a compression of the effective pixel area of ​​the driver substrate. Consequently, the utilization rate of the pixel layout on the driver substrate is low, making it difficult to achieve high PPI LED devices.

[0071] In view of this, embodiments of this application provide an LED unit substrate, an LED panel, an LED device, and a manufacturing method, which can reduce the number of pins for electrical connection between the LED and the driving substrate, reduce the number of forming processes, improve the space utilization of the driving substrate, and realize a high PPI LED device.

[0072] A first aspect of this application provides an LED unit substrate. Figure 1 This is a schematic structural diagram of an LED unit substrate provided in an embodiment of this application. Figure 1 As shown, the LED unit substrate includes: a control signal generator 100 and a plurality of LEDs; the control signal generator 100 includes a first signal input terminal 110 and a signal output terminal 120, the first signal input terminal 110 being used to receive a driving signal, and the signal output terminal 120 being electrically connected to the LEDs; for example, the driving signal may include a clock signal and a strobe signal, etc. The control signal generator 100 is used to generate a control signal based on the received driving signal, and the control signal is used to control the lighting state of the corresponding connected LEDs.

[0073] For example, Figure 1 The illustrated LED unit substrate includes three LEDs, namely LED1, LED2, and LED3. This is merely illustrative and may include more LEDs. The number of first signal input terminals 110 and signal output terminals 120 of the control signal generator 100 are also illustrative and not intended to limit the specific implementation of this application. The LED unit substrate can be electrically connected to the driving substrate via the first signal input terminal 110. The driving signal is processed by the control signal generator 100 from the driving substrate to obtain a control signal, which is then transmitted to the LEDs. This control signal can drive the LEDs to light up and control the lighting effect, such as controlling brightness and lighting time. Driving signal lines can be provided on the driving substrate to provide driving signals to the LED unit substrate. The first signal input terminal 110 and the driving substrate can be electrically connected by bonding or die bonding; this application does not impose specific limitations on this connection.

[0074] It should be noted that LED chips are typically soldered onto a driver substrate using a die-casting process. The driver circuitry on the substrate then drives the LEDs. Each LED requires a corresponding pixel driver circuit, which occupies the area of ​​a pixel. This reduces the space occupied by the LED, thus limiting the number of LEDs that can be placed on the driver substrate. Furthermore, each LED requires a die-casting process, which can easily damage the driver circuitry on the substrate, affecting the reliability of the driver substrate and the yield of the final product.

[0075] To address the aforementioned issues, the LED unit substrate provided in this application integrates multiple LEDs into a single unit substrate. A control signal generator 100 is incorporated within the LED unit substrate. This control signal generator processes the driving signals received from the driving substrate to obtain control signals, which are then transmitted to each LED to control its illumination state. This eliminates the need for individual LEDs to be directly electrically connected to the driving substrate. Each LED unit substrate can be electrically connected to the driving substrate via a first signal input terminal 110, eliminating the need for soldering pins for each LED and reducing the total number of pins connecting the LED unit substrate and the driving substrate. When using a die-casting process, this reduces the number of die-casting operations required to connect multiple LEDs to the driving substrate, thus reducing the defect rate caused by the die-casting process. Furthermore, there is no need to set up a pixel driving circuit on the driving substrate. The driving substrate only needs to provide driving signal lines to transmit driving signals or a simple driving circuit. The pixel driving circuit can be integrated into the LED unit substrate via the control signal generator 100, increasing the effective pixel area of ​​the driving substrate, allowing for more LEDs to be installed, and overcoming the space limitations imposed by the pixel driving circuit on the driving substrate, thus facilitating the achievement of high PPI.

[0076] In some embodiments, the LED unit substrate further includes a second signal input terminal, which is electrically connected to the LED; the total number of the first signal input terminal and the second signal input terminal is less than 9. Limiting the external signal input pins of the LED unit substrate to 9 or less avoids the compression of LED space occupied by too many pins electrically connected to the driver substrate, making it easier to set up more LEDs and achieve a high PPI.

[0077] In some implementations, multiple LEDs on the LED unit substrate are arranged in an array. For example, multiple LEDs can be arranged in a row, which can serve as a row of pixels on a display panel, facilitating driving.

[0078] For example, Figure 2 This is a schematic structural diagram of another LED unit substrate provided in an embodiment of this application. Figure 2As shown, the first signal input terminal 110 may include a clock signal input terminal SCLK and a strobe signal input terminal SCS; the signal output terminal 120 includes an enable control signal output terminal EM and a scan signal output terminal, for example, Figure 2 The LED unit substrate shown includes three LEDs, and therefore three scan signal output terminals, namely G1, G2, and G3, corresponding to LED1, LED2, and LED3 respectively. The second signal input terminal 200 includes a high-level signal input terminal LVDD, a low-level signal input terminal LVSS, and a data signal input terminal Data. It should be noted that when the LED unit substrate is used to form a display panel, and when the LED unit substrate serves as the first line refresher of the display panel, the signal output terminals also include a reset signal output terminal Reset. Other LED unit substrates not serving as the first line do not require a reset signal output terminal Reset. Therefore... Figure 2 This diagram illustrates the specific structure of the LED unit substrate used for refreshing the first row. The high-level signal input terminal LVDD, the low-level signal input terminal LVSS, and the data signal input terminal Data can be directly connected to the corresponding drive signal lines on the drive substrate, which are respectively the high-level signal line, the low-level signal line, and the data signal line. The high-level and low-level signals provide high and low levels to the LED unit substrate, while the data signal provides the signal for writing data to the display screen. The enable control signal controls whether the corresponding LED has data written to it, the reset signal resets the refreshed LED, the scan signal refreshes the LED's gate, and the strobe signal controls whether the corresponding control signal generator is turned on, i.e., whether the LED unit substrate is turned on. It's easy to understand that the drive signals include high-level signals, low-level signals, data signals, clock signals, and strobe signals.

[0079] For example, such as Figure 2 As shown, three LEDs correspond to three different types of LEDs: LED1, LED2, and LED3 emit light of different colors, such as red, green, and blue, forming three primary colors of light. These can be used as sub-pixels to achieve color image display. Each scan signal output is connected to an LED emitting the same color of light. For example, G1 is connected to LED1 emitting red light, G2 to LED2 emitting green light, and G3 to LED3 emitting blue light.

[0080] For example, such as Figure 2As shown, the second signal input terminal 200 is connected to any LED, that is, the second signal input terminal 200 is connected to LED1; the LEDs are electrically connected to each other through the signal transmission line 300. The signal transmission line 300 is used to transmit high-level signals, low-level signals and data signals. Thus, all LEDs in the same LED unit substrate are cascaded one by one. Reset signals, high-level signals, low-level signals and data signals can all be transmitted step by step through the signal transmission line.

[0081] In some implementations, exemplary, Figure 3 This is a schematic structural diagram of a control signal generator provided in an embodiment of this application. Figure 3 As shown, the control signal generator includes a frame start signal generation latch 101, a clock signal rising edge detector 102, a clock signal falling edge detector 103, and an RS flip-flop 104. Figure 3 The number of clock signal falling edge detectors 103 and RS flip-flops 104 shown are illustrative and not intended to limit the specific implementation of this application. The frame start signal generation latch 101 is electrically connected to the clock signal rising edge detector 102, the clock signal rising edge detector 102 is electrically connected to the clock signal falling edge detector 103, and the RS flip-flops 104 are electrically connected to both the clock signal rising edge detector 102 and the clock signal falling edge detector 103. The clock signal input terminal SCLK is electrically connected to the frame start signal generation latch 101, the clock signal rising edge detector 102, and the clock signal falling edge detector 103, respectively. The strobe signal input terminal SCS is electrically connected to the frame start signal generation latch 101, the clock signal rising edge detector 102, the clock signal falling edge detector 103, and the RS flip-flops 104, respectively. There are at least two RS flip-flops 104. The output terminal X of any RS flip-flop 104 is electrically connected to the enable control signal output terminal EM, and the output terminal X of the remaining RS flip-flops 104 is electrically connected to the scan signal output terminal. Figure 3 As shown, there are five RS flip-flops 104, and their corresponding outputs are electrically connected to the reset signal output (Reset), the enable control signal output (EM), G1, G2, and G3, respectively. Figure 3 This corresponds to the LED unit substrate that refreshes the first row.

[0082] For example, Figure 4 This is a schematic structural diagram of another control signal generator provided in an embodiment of this application. Figure 4 As shown, there are four RS flip-flops 104, and their corresponding outputs are electrically connected to the enable control signal outputs EM, G1, G2, and G3, respectively. Figure 4 For the LED unit substrate that is not the first row of refresh, no reset signal output terminal Reset is set.

[0083] For example, refer to Figure 3 and Figure 4 The clock input terminal clk of the frame start signal generating latch 101 is connected to the clock signal input terminal SCLK, and the strobe input terminal cs of the frame start signal generating latch 101 is connected to the strobe signal input terminal SCS. The frame start signal generating latch 101 has two output terminals, Y and YB. Y can be floating, and YB can output the frame start signal STV. YB is connected to the cascade input terminal a of the clock signal rising edge detector 102. It should be noted that the clock signal rising edge detector 102 connected to the frame start signal generating latch 101 is the first-stage clock signal rising edge detector 102, and the clock signal falling edge detector 103 connected to the first-stage clock signal rising edge detector 102 is the first-stage clock signal falling edge detector 103. Both the rising edge detector 102 and the falling edge detector 103 include a cascaded input terminal a, a clock input terminal clk, and a strobe input terminal cs. The clock input terminal clk is connected to the clock signal input terminal SCLK, and the strobe input terminal cs is connected to the strobe signal input terminal SCS. The RS flip-flop 104 also includes a clock input terminal clk. Both the rising edge detector 102 and the falling edge detector 103 include two output terminals, z1 and z2, respectively. z1 is left floating, and z2 is connected to the RS flip-flop 104. The first-stage rising edge detector 102 is denoted as N1, the first-stage falling edge detector 103 is denoted as P1, and so on, with the cascaded relationship as follows: Figure 3 and Figure 4 As shown. The output terminal z2 of the rising edge detector 102 of the first stage clock signal is electrically connected to the cascade input terminal a of the falling edge detector 103 of the first stage clock signal. The output terminal z2 of the falling edge detector 103 of the first stage clock signal is electrically connected to the cascade input terminal a of the rising edge detector 102 of the next stage clock signal, and so on. Figure 3 As shown, the output terminal z1 of the falling edge detector 103 of the last stage clock signal is connected to the RS flip-flop 104 that outputs the reset signal; as Figure 4 As shown, the output terminal z1 of the falling edge detector 103 of the last stage is connected to the RS flip-flop 104 that outputs the enable control signal. The input terminals of the RS flip-flop 104 also include A and Bn, where A is connected to the rising edge detector 102 of the clock signal and Bn is connected to the falling edge detector 103 of the clock signal.

[0084] like Figure 3 and Figure 4 As shown, the clock signal rising edge detector 102 is electrically connected to the RS flip-flop 104 in a one-to-one correspondence; the clock signal falling edge detector 103 is electrically connected to the RS flip-flop 104 in a one-to-one correspondence.

[0085] For example, Figure 5 A schematic circuit diagram of a frame start signal latch provided in an embodiment of this application; Figure 6 This is a schematic transistor connection circuit diagram of a frame start signal latch provided for an embodiment of the application. (In conjunction with...) Figure 5 and Figure 6 The frame start signal latch contains one AND gate, two NAND gates, and two inverters; the output of the frame start signal latch can be represented as Q[n]. Figure 6 The VDD shown represents the high level of the driving transistor, and the VSS represents the low level of the driving transistor.

[0086] For example, Figure 7 A schematic circuit diagram of a clock signal rising edge detector provided for embodiments of this application; Figure 8 This is a schematic transistor connection circuit diagram of a clock signal rising edge detector provided for an embodiment of the application. (In conjunction with...) Figure 7 and Figure 8 The rising edge detector of the clock signal includes an AND gate, a NAND gate, a transmission gate, three inverters, and an N-type TFT (thin film transistor). The cascaded input terminal a of the first stage is connected to the output signal of the frame start signal latch. The output terminal of the rising edge detector of the clock signal can be represented as Q[n].

[0087] For example, Figure 9 A schematic circuit diagram of a clock signal falling edge detector provided for embodiments of this application; Figure 10 This is a schematic transistor connection circuit diagram of a clock signal falling edge detector provided for an embodiment of the application. (In conjunction with...) Figure 9 and Figure 10 The falling edge detector for the clock signal includes an AND gate, a NAND gate, a transmission gate, four inverters, and a P-type TFT.

[0088] For example, Figure 11 A schematic circuit diagram of an RS flip-flop provided for an embodiment of this application; Figure 12 This is a schematic transistor connection circuit diagram of an RS flip-flop provided for an embodiment of the application. (In conjunction with...) Figure 11 and Figure 12 The RS flip-flop contains an AND gate, a NAND gate, and four inverters. The SET signal is the output signal of the clock signal rising edge detector, and the RST signal is the output signal of the last stage clock signal falling edge detector. The output signals of the RS flip-flop are the reset signal, enable control signal, and scan signals for each row in the pixel circuit, respectively.

[0089] A second aspect of this application provides an LED panel. Figure 13 This is a schematic structural diagram of an LED panel provided as an embodiment of this application. Figure 13 As shown, the LED panel includes: an LED unit substrate 1000 as described in the first aspect.

[0090] For example, refer to Figure 13 , combined Figure 1 and Figure 2 The LED panel further includes a driver substrate 2000, which includes driver signal lines and cascade lines. The driver signal lines are electrically connected to the first signal input terminal 110, the signal output terminal 120, and the second signal input terminal 200 of the LED unit substrate 1000, respectively. Adjacent LED unit substrates are connected via cascade lines. Multiple LEDs on the LED unit substrate 1000 are arranged in a row. Multiple LED unit substrates 1000 can form an LED array. Therefore, the LED panel provided in this embodiment can be used as a light source for illumination or as a display panel, without specific limitations. (Reference) Figure 3 In a single frame of the display, the signal output terminal of the LED unit substrate 1000 that refreshes the first line includes a reset signal output terminal Reset. The reset signal is transmitted to other LED unit substrates 1000 through cascading lines.

[0091] A third aspect of this application provides an LED device. Figure 14 This is a schematic structural diagram of an LED device provided in an embodiment of this application. Figure 14 The LED device includes the LED panel 3000 as described in the second aspect.

[0092] It should be noted that the LED device provided in this application embodiment can be a lighting device, a smartphone, a television, a computer, or other display, etc.

[0093] A fourth aspect of this application provides a method for manufacturing an LED panel. Figure 15 This is a schematic flowchart illustrating a method for manufacturing an LED panel, as provided in an embodiment of this application. Figure 15 As shown, the method for manufacturing an LED panel includes:

[0094] S401: Prepare LED unit substrate and driving substrate respectively. The LED unit substrate includes a control signal generator and multiple LEDs. The control signal generator includes a first signal input terminal and a signal output terminal. The first signal input terminal is used to receive a driving signal, and the signal output terminal is electrically connected to the LED. The control signal generator is used to generate a control signal based on the received driving signal. The control signal is used to control the lighting state of the corresponding connected LED.

[0095] Step S401 may include:

[0096] LEDs are disposed on a first substrate to obtain an LED unit substrate;

[0097] A driving circuit is disposed on a second substrate to obtain a driving substrate. It should be noted that the driving circuit of the driving substrate mainly includes some driving signal lines and a driving chip, which can be bonded to the driving substrate.

[0098] S402: Bond the LED unit substrate and the driver substrate to electrically connect the LED unit substrate and the driver substrate.

[0099] Step S402 may include:

[0100] The first substrate and the second substrate are removed respectively, and the driving circuit is bonded to the first signal input terminal, the signal output terminal and the second signal input terminal respectively, so as to electrically connect the LED unit substrate and the driving substrate.

[0101] The method for preparing the LED panel provided in this application embodiment is based on the following: Figure 2 To achieve seamless, large-size direct-view displays and reduce LED chip manufacturing costs, RGB Micro LED wafers are bonded and integrated with TFT driving circuit arrays to create LED chips with integrated driving circuits, thus improving the area utilization of the driving substrate. To match current LED pixel sizes, such as 200μm × 200μm, the number of bonding port pins is reduced from nine to five. This is achieved by using a control signal generator to generate the reset signal, enable control signal, and scan signals for each row in the pixel circuit of the existing driving substrate. This facilitates the implementation of high-PPI display devices.

[0102] For example, taking an LED display panel with red, green and blue as the three primary colors as an example, a row of LEDs is an LED unit substrate, and each LED unit substrate includes three types of LEDs: red, green and blue. Figure 16 This is a first timing diagram of an LED panel driving method provided in an embodiment of this application; Figure 17 This is a second timing diagram of an LED panel driving method provided in an embodiment of this application; Figure 18 A third timing diagram of an LED panel driving method provided in an embodiment of this application; Figure 19 A fourth timing diagram of an LED panel driving method provided in an embodiment of this application; Figure 20 This is a fifth timing diagram illustrating an LED panel driving method provided in an embodiment of this application. The LED panel driving method is as follows:

[0103] refer to Figure 16The strobe signal (received at the strobe signal input terminal SCS) turns on one LED unit substrate. Simultaneously, the first pulse of the clock signal (received at the clock signal input terminal SCLK) enters. The rising edge turns off the enable control signal (output signal EM(n) of the previous LED unit substrate) and the falling edge turns on the reset signal for resetting. R, G, and B represent the data signals received by the red, green, and blue LEDs, respectively. Tr_em represents the duration of the clock signal's frame start signal. 1H represents the driving cycle of the current frame.

[0104] refer to Figure 17 The rising edge of the second pulse of the clock signal disables Reset, and the falling edge enables the scan signal of the blue LED (the output signal of G1). At this time, the blue LED data signal B (the signal input at the Data input terminal) begins to be written.

[0105] refer to Figure 18 The rising edge of the third pulse of the clock signal turns off G1, and the falling edge turns on the scan signal of the green LED (the output signal of G2). At this time, the data signal G of the green LED begins to be written.

[0106] refer to Figure 19 The rising edge of the fourth pulse of the clock signal turns off G2, and the falling edge turns on the scanning signal of the red LED (the output signal of G3). At this time, the data signal R of the red LED begins to be written.

[0107] refer to Figure 20 The rising edge of the fifth clock pulse turns off G3, the data signal for the red LED is written, and after a set time DOE, the falling edge turns on EM, and all LEDs on the current LED unit substrate light up.

[0108] The steps of the above driving method are merely illustrative and are not intended to limit the specific implementation of this application.

[0109] It should be noted that the descriptions of each embodiment in the above embodiments have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0110] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-readable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-readable program code.

[0111] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded computer, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create a machine for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0112] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0113] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0114] This application also provides a computer program product, which includes computer software instructions that, when executed on a processing device, cause the processing device to execute a process of driving an LED panel.

[0115] A computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a server or data center that integrates one or more available media. The available medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk (SSD)).

[0116] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0117] In the several embodiments provided in this application, it should be understood that the disclosed devices, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, or indirect coupling or communication connection between devices or units, and may be electrical, mechanical, or other forms.

[0118] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0119] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0120] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0121] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

[0122] Although preferred embodiments have been described in this specification, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this specification.

[0123] Obviously, those skilled in the art can make various modifications and variations to this specification without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims and their equivalents, this specification is also intended to include such modifications and variations.

Claims

1. An LED unit substrate, characterized in that, include: Control signal generator and multiple LEDs; The control signal generator includes a first signal input terminal and a signal output terminal. The first signal input terminal is used to receive a driving signal, and the signal output terminal is electrically connected to the LED. The control signal generator is used to generate a control signal based on the received drive signal, and the control signal is used to control the lighting state of the corresponding connected LED. The second signal input terminal is electrically connected to the LED. The first signal input terminal includes a clock signal input terminal and a strobe signal input terminal; The signal output terminal includes an enable control signal output terminal and a scan signal output terminal; The second signal input terminal includes a high-level signal input terminal, a low-level signal input terminal, and a data signal input terminal; The control signal generator includes a frame start signal generation latch, a clock signal rising edge detector, a clock signal falling edge detector, and an RS flip-flop; The frame start signal generation latch is electrically connected to the clock signal rising edge detector, the clock signal rising edge detector is electrically connected to the clock signal falling edge detector, and the RS flip-flop is electrically connected to the clock signal rising edge detector and the clock signal falling edge detector. The clock signal input terminal is electrically connected to the frame start signal generation latch, the clock signal rising edge detector, and the clock signal falling edge detector, respectively. The strobe signal input terminal is electrically connected to the frame start signal generation latch, the clock signal rising edge detector, the clock signal falling edge detector, and the RS flip-flop, respectively.

2. The LED unit substrate according to claim 1, characterized in that, Also includes: The total number of the first signal input terminal and the second signal input terminal is less than 9.

3. The LED unit substrate according to claim 2, characterized in that, The LEDs are arranged in an array.

4. The LED unit substrate according to claim 1, characterized in that, The plurality of LEDs includes at least two types of LEDs, with different types of LEDs emitting different colors of light; Each of the scan signal output terminals is connected to an LED that emits light of the same color.

5. The LED unit substrate according to claim 1, characterized in that, The second signal input terminal is connected to any of the LEDs; The LEDs are electrically connected to each other via signal transmission lines, which are used to transmit high-level signals, low-level signals, and data signals.

6. The LED unit substrate according to claim 1, characterized in that, The number of RS flip-flops is at least two, and the output terminal of any one of the RS flip-flops is electrically connected to the enable control signal output terminal, while the output terminals of the remaining RS flip-flops are respectively electrically connected to the scan signal output terminal.

7. The LED unit substrate according to claim 1, characterized in that, The clock signal rising edge detector is electrically connected to the RS flip-flop in a one-to-one correspondence. The clock signal falling edge detector is electrically connected to the RS flip-flop in a one-to-one correspondence.

8. The LED unit substrate according to claim 1, characterized in that, The output of the frame start signal generation latch is electrically connected to the cascaded input of the clock signal rising edge detector of the first stage. The output of the rising edge detector of the first stage is electrically connected to the cascaded input of the falling edge detector of the first stage. The output of the falling edge detector of the first stage is electrically connected to the cascaded input of the rising edge detector of the next stage. The output of the falling edge detector of the last stage is connected to the same RS flip-flop as the rising edge detector of the first stage. The output terminals of the rising edge detector and the falling edge detector are respectively electrically connected to the corresponding RS flip-flops.

9. An LED panel, characterized in that, include: The LED unit substrate as described in any one of claims 1-8.

10. The LED panel according to claim 9, characterized in that, Also includes: A driving substrate, the driving substrate including driving signal lines and cascade lines; The driving signal lines are electrically connected to the first signal input terminal, the signal output terminal, and the second signal input terminal of the LED unit substrate, respectively. When there are multiple LED unit substrates, adjacent LED unit substrates are connected through the cascade wire.

11. The LED panel according to claim 10, characterized in that, The LEDs on the LED unit substrate are arranged in a row; In a single frame of display, the signal output terminal of the LED unit substrate that refreshes the first line includes a reset signal output terminal, and the reset signal is transmitted to other LED unit substrates through the cascaded lines.

12. An LED device, characterized in that, include: The LED panel as described in any one of claims 9-11.

13. A method for manufacturing an LED panel, characterized in that, include: LED unit substrate and driving substrate are fabricated separately. The LED unit substrate includes a control signal generator and a plurality of LEDs. The control signal generator includes a first signal input terminal and a signal output terminal. The first signal input terminal is used to receive a driving signal, and the signal output terminal is electrically connected to the LED. The control signal generator is used to generate a control signal based on the received driving signal. The control signal is used to control the lighting state of the corresponding connected LED. The LED unit substrate and the driving substrate are bonded together to electrically connect the LED unit substrate and the driving substrate.

14. The method for preparing an LED panel according to claim 13, characterized in that, The process of separately fabricating the LED unit substrate and the driving substrate includes: The LED is disposed on a first substrate to obtain the LED unit substrate; A driving circuit is disposed on a second substrate to obtain the driving substrate; The bonding of the LED unit substrate and the driving substrate includes: The first substrate and the second substrate are removed respectively, and the driving circuit is bonded to the first signal input terminal, the signal output terminal and the second signal input terminal respectively to electrically connect the LED unit substrate and the driving substrate.

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