Resin compound and resin composition containing the same

Abstract

The present invention relates to a resin compound and a resin composition containing the same. The resin compound has a structure shown in the following chemical formula (I): 1 Each independently represents C 1 ‑C 20 Alkylene or C 7 ‑C 40 Aralkylene groups, each R 1 are the same or different from each other, n each independently represents an integer of 1-4, R 2 Each independently represents C 1 ‑C 20 Alkyl or C 2 ‑C 20 terminal alkenyl, and each R 2 The same or different from each other. 1 Represents C 1 ‑C 20 When the alkylene group is 2 C 2 ‑C 20 The resin composition including the resin compound of the present invention can simultaneously have low dielectric loss characteristics, high mechanical properties, and high thermal stability.

Description

Technical Field

[0001] The present disclosure relates to a resin compound and a resin composition comprising the same, in particular to a cycloalkane derivative resin compound and a resin composition comprising the same. Background Art

[0002] The fifth generation mobile network (5G mobile network) is the latest generation of mobile communication technology. 5G mobile communication technology has the characteristics of high-speed transmission, wide connection, and low latency. At present, 5G mobile communication technology can be divided into three types according to the frequency band used: high-frequency 5G, medium-frequency 5G, and low-frequency 5G.

[0003] High-frequency 5G can provide ultra-high connection speeds. However, during the transmission process, high-frequency 5G will affect the quality of signal reception and transmission due to high-frequency path loss, conductor loss, and dielectric loss. Dielectric loss is directly related to packaging materials. Therefore, it is necessary to develop packaging materials with low dielectric loss to reduce the dielectric loss of high-frequency 5G during transmission, thereby improving the quality of signal reception and transmission.

[0004] The goal of reducing dielectric loss can be achieved by lowering the dielectric properties of the packaging material (dielectric constant εr (Dielectric Constant, Dk) and dissipation factor (Dissipation Factor, Df)). Hydrocarbon resins or polyolefin materials composed of carbon and hydrogen atoms have low dielectric loss characteristics due to their small number of polar functional groups. However, too few polar functional groups will reduce the mechanical properties and adhesion of hydrocarbon resins or polyolefin materials, thereby reducing the reliability of the packaging material. Summary of the invention

[0005] In view of the above problems, the present disclosure provides a resin compound having low dielectric loss characteristics, high mechanical properties and high thermal stability, and a resin composition comprising the same.

[0006] According to one embodiment of the present disclosure, a resin compound is provided, which has a structure shown in the following chemical formula (I):

[0007]

[0008] Where R 1 Each independently represents C 1 -C 20 Alkylene or C 7 -C 40 Aralkylene groups, each R 1 are the same or different from each other, n each independently represents an integer of 1 to 4, R 2 Each independently represents C 1 -C20 Alkyl or C 2 -C 20 terminal alkenyl, and each R 2 The same or different from each other. When at least one R 1 Represents C 1 -C 20 When the alkylene group is 2 C 2 -C 20 Terminal olefinic group.

[0009] According to another embodiment of the present disclosure, a resin composition is provided, which includes the above-mentioned resin compound. DETAILED DESCRIPTION

[0010] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0011] The term "and / or" as used herein includes any and all combinations of one or more of the related listed items. When "may" is used to describe an embodiment of the present disclosure, it means "one or more embodiments of the present disclosure."

[0012] The C used in this article 1 -C 20 Alkyl refers to a linear or branched aliphatic hydrocarbon monovalent group having 1 to 20 carbon atoms in the main carbon chain, and non-limiting examples thereof include, but are not limited to, methyl, ethyl, propyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, and hexyl. 1 -C 20 Alkylene refers to a group having 1 -C 20 A divalent group with the same structure as an alkyl group. 1 -C 20 Non-limiting examples of alkylene groups include, but are not limited to, methylene, ethylene, propylene, isobutylene, sec-butylene, tert-butylene, pentylene, isopentylene, and hexylene.

[0013] The C used in this article 2 -C 20 A terminal alkenyl group is a group having at least one carbon-carbon double bond at C 2 -C 20 The alkyl group is a terminal hydrocarbon group on the carbon chain, and non-limiting examples thereof include, but are not limited to, ethenyl, 2-propenyl (n-allyl), and 1-butenyl.

[0014] The C used in this article 7 -C 40 Aralkylene refers to a group consisting of -R a Ar-represented divalent group of the structure, wherein Ra represents C as described above 1 -C 20 Alkylene, Ar represents C 6 -C 20 Arylene. 6 -C 20 Arylene refers to a divalent group containing a carbocyclic aromatic system having 6 to 20 carbon atoms. 6 -C 20 Non-limiting examples of arylene groups include, but are not limited to, phenylene, naphthylene, anthracene, and phenanthrenyl. 7 -C 40 Non-limiting examples of aralkylene groups include, but are not limited to, methylphenylene, ethylphenylene, propylphenylene, pentylphenylene, hexylphenylene, and methylnaphthylenene.

[0015] One aspect of the present disclosure provides a resin compound having a structure shown in the following chemical formula (I):

[0016]

[0017] Where R 1 Can be expressed independently of C 1 -C 20 Alkylene or C 7 -C 40 Aralkylene groups, each R 1 may be the same or different from each other, n may each independently represent an integer of 1 to 4, R 2 Can be expressed independently C 1 -C 20 Alkyl or C 2 -C 20 terminal alkenyl, and each R 2 They may be the same or different from each other. 1 Represents C 1 -C 20 When the alkylene group is 2 C 2 -C 20 In one embodiment, R 1 Can be expressed independently of C 1 -C 6 Alkylene or C 7 -C 10 Aralkylene, and R 2 Each independently represents C 1 -C 6Alkyl or C 2 -C 6 In one embodiment, R 1 R may independently represent methylene, ethylene, propylene, isobutylene, sec-butylene, tert-butylene, pentylene, isopentylene, hexylene, methylphenylene, ethylphenylene, propylphenylene, pentylphenylene, hexylphenylene, or methylnaphthylene. 2 Each independently may represent a methyl group, an ethyl group, a propyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, an isopentyl group, a hexyl group, a vinyl group, a 2-propenyl group, or a 1-butenyl group.

[0018] The resin compound disclosed herein has a dicyclopentadiene core structure, a benzene ring, a polymerizable functional group, and an ether oxygen. The dicyclopentadiene core structure has low dielectric properties. The benzene ring can make the resin compound disclosed herein have better heat resistance, lower dielectric constant, and lower dielectric loss.

[0019] The resin compound disclosed herein is a viscous liquid at room temperature. Ether oxygen can enhance the adhesion of the resin compound disclosed herein. By including ether oxygen, the viscosity of the resin compound disclosed herein can be 100-200 Pa.s at 25°C. In one embodiment, the viscosity of the resin compound disclosed herein can be 110-150 Pa.s at 25°C. The viscosity of the resin compound disclosed herein can be 1-20 Pa.s at 50°C. In one embodiment, the viscosity of the resin compound disclosed herein can be 5-10 Pa.s at 50°C. According to the above-mentioned viscosity characteristics, the resin compound disclosed herein has high adhesion. Based on the above-mentioned liquid properties and high adhesion properties, the resin compound disclosed herein can be suitable for use as a solvent-free liquid semiconductor packaging material.

[0020] In one embodiment, the resin compound disclosed herein may have a structure represented by the following chemical formula (II):

[0021]

[0022] Where R 1 Can be expressed independently of C 1 -C 20 Alkylene or C 7 -C 40 Aralkylene groups, each R 1 They may be the same or different from each other. 2 Can be expressed independently of C 1 -C 20 Alkyl or C 2 -C 20 terminal alkenyl, m each independently represents an integer of 0-3, and each R 2 They may be the same or different from each other. 3Each independently represents a single bond or C 1 -C 18 alkylene, and each R 3 can be the same or different from each other. In one embodiment, R 2 Each independently represents C 1 -C 6 Alkyl or C 2 -C 6 In one embodiment, R 2 Each independently may represent a methyl group, an ethyl group, a propyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, an isopentyl group, a hexyl group, a vinyl group, a 2-propenyl group, or a 1-butenyl group.

[0023] The resin compound represented by the chemical formula (II) has at least four arms that can undergo free radical polymerization, and thus has high cross-linking reactivity. The resin compound represented by the chemical formula (II) can generate a network structure after curing with a cross-linking agent, thereby further reducing its dissipation factor (Df) and dielectric constant (Dk) after curing, improving its dielectric stability and thermal stability, and achieving the purpose of low dielectric constant, low dielectric loss and high reliability.

[0024] In one embodiment, the resin compound disclosed herein may have a structure represented by the following chemical formula (II-1):

[0025]

[0026] Where R 1 Can be expressed independently of C 1 -C 20 Alkylene or C 7 -C 40 Aralkylene. 2 Can be expressed independently of C 1 -C 20 Alkyl or C 2 -C 20 Terminal olefinic group. 3 Each independently represents a single bond or C 1 -C 18 Alkylene. Each R 1 , R 2 and R 3 Can be the same as or different from each other.

[0027] In one embodiment, the resin compound disclosed herein may have a structure represented by the following chemical formula (II-2):

[0028]

[0029] In another embodiment, the resin compound disclosed herein may have a structure represented by the following chemical formula (III):

[0030]

[0031] Where R 2 Can be expressed independently of C 1 -C 20 Alkyl or C 2 -C 20 Terminal olefin group, R 4 Can be expressed independently C 1 -C 34 alkylene, n each independently represents an integer of 1 to 4, and each R 2 and R 4 can be the same or different from each other. In one embodiment, R 2 Each independently represents C 1 -C 6 Alkyl or C 2 -C 6 In one embodiment, R 2 Each independently may represent a methyl group, an ethyl group, a propyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, an isopentyl group, a hexyl group, a vinyl group, a 2-propenyl group, or a 1-butenyl group.

[0032] The resin compound represented by the chemical formula (III) has two arms that can undergo free radical polymerization, and the two arms have a highly reactive 4-vinylphenyl structure, and thus have high cross-linking reactivity. The resin compound represented by the chemical formula (III) can generate a network structure after curing with a cross-linking agent, thereby further reducing its dissipation factor (Df) and dielectric constant (Dk) after curing, improving its dielectric stability and thermal stability, and achieving the purpose of low dielectric constant, low dielectric loss and high reliability.

[0033] In one embodiment, the resin compound disclosed herein may have a structure represented by the following chemical formula (III-1):

[0034]

[0035] Where R 2 Each independently represents C 1 -C 20 Alkyl and R 2 The same as or different from each other.

[0036] In one embodiment, the resin compound disclosed herein may have a structure represented by the following chemical formula (III-2):

[0037]

[0038] Another aspect of the present disclosure provides a resin composition, which includes the above-mentioned resin compound.

[0039] According to one embodiment, the resin composition may further include a crosslinking agent. The crosslinking agent is selected from the group consisting of divinylbenzene (DVB), 4-tert-butoxystyrene (tBOS), triallyl isocyanurate (TAIC), triallyl cyanurate (TAC), and 2,2-bis[3-allyl-4-(4-vinylbenzyl)phenyl]propane (AV-BPA). AV-BPA is represented by the following chemical formula:

[0040]

[0041] The resin composition disclosed herein has a low dissipation factor (Df) and dielectric constant (Dk), good dielectric stability and good heat resistance between 10-80 GHz, and can meet the requirements of low dielectric loss at high frequencies. Therefore, the resin composition disclosed herein is suitable for use as a high-frequency packaging material.

[0042] The resin composition disclosed herein is liquid at room temperature, and has a viscosity of 1000-5000 cps at 25° C. In one embodiment, the viscosity is 1000-3000 cps at 25° C. Based on the above liquid properties, the resin composition disclosed herein can be suitable for use as a solvent-free liquid semiconductor packaging material.

[0043] One or more embodiments of the present disclosure will now be described in detail with reference to the following examples. However, these examples are only used to illustrate the present disclosure and are not intended to limit the scope of the present disclosure.

[0044] Synthesis Example 1

[0045]

[0046] Step 1

[0047] 77.1 g (0.7143 mol) of o-cresol (2-(CH 3 )C 6 H 4 OH) and 2 g (0.015 mol) of aluminum chloride (AlCl 3) was added into a 250 ml round bottom reaction bottle, nitrogen was introduced, a stirrer was placed, and then the temperature was raised to 100°C and the above compounds were uniformly mixed to obtain a mixture. After the obtained mixture was gradually heated to 120°C, 13.2 g (0.1 mol) of dicyclopentadiene (DCPD) was slowly added within 2 hours, and then reacted at 120°C for 4 hours. After the reaction was completed, a 5 mol% sodium hydroxide aqueous solution containing 2.4 g of sodium hydroxide (NaOH) was added, and stirring was continued for 1 hour to obtain a reaction mixture. Then the obtained reaction mixture was filtered, and the filtrate was washed with water for 3 times. After the organic phase was distilled to remove excess 2,6-dimethylphenol, it was dissolved in toluene and extracted with water for 3 times. Finally, the organic phase was drained to obtain 32 g of dark brown dicyclopentadiene phenol formaldehyde (1) (DCPDNO (1)) solid.

[0048] Step 2

[0049] 32g of DCPDNO (1) and 400g of acetone were added to a 1000ml round-bottomed reaction flask, nitrogen was introduced, a stirrer was placed, and then 5.49g of NaOH was added and stirred. After stirring for 30 minutes, 16.64g of allylbromide was added and the reaction was allowed to proceed overnight at room temperature. After the reaction was completed, the reaction solution was filtered to remove the solids, and the filtrate was drained. The crude product was dried with dichloromethane (CH 2 Cl 2 ) was dissolved and extracted with water for 3 times, and finally the organic phase was drained again to obtain 33 g of dark brown liquid 4-arm precursor (1).

[0050] Step 3

[0051] 33 g of the four-arm precursor (1) was placed in a 150 ml round-bottomed reaction bottle, and the temperature was raised to 240-250 degrees under nitrogen, and the temperature was maintained for 5 hours to carry out the allyl group transposition reaction. After the reaction was completed, the four-arm precursor (2) was obtained.

[0052] Step 4

[0053] 33 g of the 4-arm precursor (2) and 350 g of acetone were added to a 1000 ml round-bottom reaction bottle, nitrogen was introduced, a stirrer was placed, and then 5.67 g of NaOH was added and stirred. After stirring for 30 minutes, 17.22 g of allyl bromide was added and reacted at room temperature overnight. After the reaction was completed, the reaction solution was filtered to remove the solids, and the filtrate was drained. The above-drained crude product was dissolved in dichloromethane and extracted with water 3 times, and the organic phase was drained again to obtain a dark brown liquid 4-arm resin compound (1).

[0054] The obtained 4-arm resin compound (1) was identified by 1H-NMR, and the obtained spectral information was as follows: 1 H NMR (500 MHz, CDCl 3 , 294K): 1.10~2.48(m, 20H), 3.34(br.s, 4H), 4.32(br.s, 4H), 4.95~5.15(m, 4H), 5.25 (br.s, 2H), 5.45 (br.t, 2H), 5.85~6.05 (m, 2H), 6.05~6.20 (m, 2H), 6.05~7.20 (m, 4H).

[0055] The viscosity of the four-arm resin compound (1) at 25° C. was measured by a rheometer (BROOKFIELD-87333) and was 116 Pa.s. The viscosity of the four-arm resin compound (1) at 50° C. was measured by a high shear rate viscometer (BROOKFIELD-CAP2000H) and was 9.7 Pa.s.

[0056] Synthesis Example 2

[0057]

[0058] Step 1

[0059] Take 87.3 g (0.7143 mol) of 2,6-dimethylphenol and 2 g (0.015 mol) of AlCl 3Add to a 250 ml round-bottom reaction bottle, introduce nitrogen, place a stirrer, then raise the temperature to 100°C and uniformly mix the above compounds to obtain a mixture. After gradually heating the obtained mixture to 120°C, slowly add 13.2 g (0.1 mol) of DCPD within 2 hours, and react the mixture at 120°C for 4 hours. After the reaction is completed, add a 5 mol% sodium hydroxide aqueous solution containing 2.4 g of sodium hydroxide (sodium hydroxide; NaOH), and continue stirring for 1 hour to obtain a reaction mixture. Then filter the obtained reaction mixture, and wash the filtrate with water 3 times. After distilling the organic phase to remove excess 2,6-dimethylphenol, dissolve it in toluene and extract it with water several times. Finally, drain the organic phase to obtain a dark brown DCPDNO (2) solid.

[0060] Step 2

[0061] 15 g of DCPDNO (2) and 200 g of acetone were added to a 500 ml round bottom reaction bottle, nitrogen was introduced, a stirrer was placed, and then 1.76 g of NaOH was added and stirred. After stirring for 30 minutes, 13.5 g of 4-vinylbenzyl chloride was added and reacted at room temperature overnight. After the reaction was completed, the reaction liquid was filtered to remove the solid, and the filtrate was drained to obtain a liquid product. The obtained liquid product was analyzed by NMR and showed that only 60% of the reaction was completed.

[0062] Therefore, the obtained liquid product and 500g acetone were added to a 500ml round-bottomed reaction bottle, nitrogen was introduced, a stirrer was placed, and then 1.76g NaOH was added and stirred. The reaction was allowed to react overnight at room temperature. After the reaction was completed, the reaction liquid was filtered to remove the solid, and the filtrate was drained. The above-drained crude product was dissolved in dichloromethane and washed with water for 3 times, and finally the organic phase was drained to obtain a dark blue-green viscous liquid 2-arm resin compound (2).

[0063] The obtained 2-arm resin compound (2) was identified by 1H-NMR, and the obtained spectral information was as follows: 1 H NMR (500 MHz, CDCl 3 , 294K): 1.00~2.80(m, 26H), 4.80(br.s, 4H), 5.31(br.d, 2H), 5.78(br.d, 2H), 6.45~7.15(m, 6H), 7.48(br.s, 8H).

[0064] The viscosity of the two-arm resin compound (2) at 25° C. was measured by a rheometer (BROOKFIELD-87333) and was 147 Pa.s. The viscosity of the two-arm resin compound (2) at 50° C. was measured by a high shear rate viscometer (BROOKFIELD-CAP2000H) and was 15 Pa.s.

[0065] Synthesis Comparative Example 1

[0066]

[0067] Step 1

[0068] Take 87.3 g (0.7143 mol) of 2,6-dimethylphenol and 2 g (0.015 mol) of AlCl 3 Add to a 250 ml round-bottom reaction bottle, introduce nitrogen, place a stirrer, then raise the temperature to 100°C and uniformly mix the above compounds to obtain a mixture. After gradually heating the obtained mixture to 120°C, slowly add 13.2 g (0.1 mol) of DCPD within 2 hours, and react the mixture at 120°C for 4 hours. After the reaction is completed, add a 5 mol% sodium hydroxide aqueous solution containing 2.4 g of sodium hydroxide (sodium hydroxide; NaOH), and continue stirring for 1 hour to obtain a reaction mixture. Then filter the obtained reaction mixture, and wash the filtrate with water 3 times. After distilling the organic phase to remove excess 2,6-dimethylphenol, dissolve it in toluene and extract it with water several times. Finally, drain the organic phase to obtain a dark brown DCPDNO (2) solid.

[0069] Step 2

[0070] Add 35g of DCPDNO (2) and 500g of acetone to a 1000ml round-bottomed reaction flask, introduce nitrogen, place a stirrer, then add 6.1g of NaOH and stir. After stirring for 30 minutes, add 18.53g (1.5N) of allyl bromide and react overnight at room temperature. After the reaction is completed, filter the reaction solution to remove the solids and drain the filtrate. Dissolve the above-drained crude product in dichloromethane and extract it with water 3 times. Finally, drain the organic phase again to obtain a dark brown liquid 2-arm comparative resin compound.

[0071] The obtained 2-arm comparative resin compound was identified by 1H-NMR, and the obtained spectral information was as follows: 1 H NMR (500 MHz, CDCl 3, 294K): 1.00~2.80(m, 26H), 4.30(br.s, 4H), 5.20~5.30(m, 2H), 5.40~5.50(m, 2H), 6.00~6.25(m, 2H), 6.80~7.10(m, 6H).

[0072] Preparation of Examples 1-8 and Comparative Examples

[0073] The synthetic resin compound (1), the resin compound (2), the comparative resin compound, divinylbenzene (DVB), 2,2-bis[3-allyl-4-(4-vinylbenzyl)phenyl]propane (AV-BPA), the toughening agent CTBN1300*13 and tert-butylperoxy-3,5,5-trimethyl-hexanoate (TBPIN) were mixed in the weight ratios shown in Table 1 below to prepare the compositions of Examples 1-8 and the comparative examples. Table 1 below is a resin formula combination of the resin compound and DVB or AV-BPA as a crosslinking agent, the total weight of which is 100 parts by weight, and the addition amounts of the initiator TBPIN and the toughening agent CTBN are expressed in phr units relative to the percentage content in the resin formula combination. The viscosity of the compositions of Examples 1-8 and Comparative Example was measured at 25° C. using a rheometer (BROOKFIELD-87333).

[0074] The AV-BPA used here was synthesized by the following method

[0075] Add 60g 85% 2,2'-diallylbisphenol A and 550ml acetone into a 1000ml round-bottomed reaction bottle, place a stirrer, then add 15.6g NaOH and stir. After stirring for 30 minutes, drop 72g 90% 4-vinylbenzyl chloride and react overnight at room temperature. After the reaction is completed, filter the reaction solution to remove the solid, and drain the filtrate. Wash the obtained solid crystals with methanol and drain again to obtain white 2,2-bis[3-allyl-4-(4-vinylbenzyl)phenyl]propane (BPA).

[0076]

[0077] Preparation of Cured Materials 1-8 and Comparative Cured Materials

[0078] The compositions of Examples 1-8 and Comparative Example were poured into a mold consisting of two 80 mm×80 mm glass plates and a 0.5 mm thick polytetrafluoroethylene (PTFE) gasket, and heated at 145° C. for 6 hours to obtain cured products 1-8 and Comparative cured products.

[0079] Dielectric properties and thermal stability analysis of cured products 1-8 and comparative cured products

[0080] The dielectric constant (Dk) and dissipation factor (Df) of the cured products 1-8 and the comparative cured products were measured at 10-80 GHz using a vector network analyzer. The decomposition temperature (Td) of each cured product 1-8 and the comparative cured product when losing 5 wt% and each cured product 1-8 were measured using a thermogravimetric analyzer (THE DSC 7 DIFFERENTIAL). The glass transition temperature (Tg) of each cured product 1-8 and the comparative cured product was measured using a dynamic mechanical analyzer (Q800). The molding effect, Td and Tg measurement results are shown in the following Table 2. In Table 2, the molding effect O represents a fully cured product, and the molding effect X represents a brittle or incompletely cured product.

[0081] The dielectric constant (Dk) and dissipation factor (Df) of each of the cured products 1-8 and the comparative cured product were measured by a vector network analyzer at 10-80 GHz. The results are shown in Table 3 below.

[0082]

[0083]

[0084] As can be seen from Tables 1 and 2 above, the cured product formed by the resin composition containing the comparative resin compound has the problem of being brittle or incompletely cured, and therefore is not suitable for use as a packaging material. In addition, as can be further seen from Tables 1 and 2 above, the Td of the resin composition containing the resin compound (1) and / or the resin compound (1) is higher than that of the resin composition containing the comparative resin compound. That is, the resin composition containing the resin compound (1) and / or the resin compound (1) has better thermal stability and mechanical properties than that of the resin composition containing the comparative resin compound.

[0085] As can be seen from Table 3 above, the resin composition disclosed herein has good dielectric constant (Dk) and dissipation factor (Df) between 10-80 GHz. Based on the above good dielectric properties, the resin compound disclosed herein can meet the demand for low dielectric loss at high frequencies compared to existing resin compounds.

[0086] Specifically, a cured product formed from a resin composition comprising a commercially available epoxy resin HP-7200 (manufactured by Dainippon Inkand Chemicals, Inc.) having the following structure is used as Comparative Example 2. The dielectric constant (Dk) and dissipation factor (Df) of the cured product of Comparative Example 2 at 1 GHz were measured in the same manner as described above, and it was found that the dielectric constant (Dk) of Comparative Example 2 at 1 GHz was 3.24, and the dissipation factor (Df) was 0.02. It can be clearly seen from Table 3 above that the dielectric constant (Dk) of the resin composition disclosed herein at 10-80 GHz is lower than the dielectric constant (Dk) of Comparative Example 2 at 1 GHz, and the dissipation factor (Df) is lower than the dissipation factor (Df) of Comparative Example 2 at 1 GHz. Accordingly, it is confirmed that the resin compound disclosed herein can further reduce the dielectric loss in high-frequency applications compared to the existing resin compounds, thereby improving the quality of signal reception and transmission.

[0087]

[0088] The features of the above embodiments are helpful for those with ordinary knowledge in the art to understand the present disclosure. Those with ordinary knowledge in the art should understand that the present disclosure can be used as a basis to design and change other processes and structures to achieve the same purpose and / or the same advantages of the above embodiments. Those with ordinary knowledge in the art should also understand that these equivalent substitutions do not depart from the spirit and scope of the present disclosure, and can be changed, replaced, or modified without departing from the spirit and scope of the present disclosure.

Claims

1. A resin compound having a structure represented by the following chemical formula (II): Where R 1 Each independently represents C 1 -C 20 Alkylene or C 7 -C 40 Aralkylene group; R 2 Each independently represents C 1 -C 20 Alkyl or C 2 -C 20 terminal olefin group; R 3 Each independently represents a single bond or C 1 -C 18 Alkylene; m each independently represents an integer from 0 to 3, and Each R 1 , R 2 and R 3 The same as or different from each other.

2. The resin compound according to claim 1, wherein R 2 Each independently represents a methyl group, an ethyl group, a propyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, a pentyl group, an isopentyl group, a hexyl group, a vinyl group, a 2-propenyl group, or a 1-butenyl group.

3. The resin compound according to claim 1, which has a structure represented by the following chemical formula (II-1): Where R 1 Each independently represents C 1 -C 20 Alkylene or C 7 -C 40 Aralkylene group; R 2 Each independently represents C 1 -C 20 alkyl; R 3 Each independently represents a single bond or C 1 -C 18 an alkylene group, and Each R 1 , R 2 and R 3 The same as or different from each other.

4. The resin compound according to claim 1, which has a structure represented by the following chemical formula (II-2):

5. A resin composition comprising the resin compound as claimed in any one of claims 1 to 4 and a cross-linking agent.

6. The resin composition of claim 5, wherein the crosslinking agent is selected from the group consisting of divinylbenzene, 4-tert-butoxystyrene, triallyl isocyanurate, triallyl cyanurate, and 2,2-bis[3-allyl-4-(4-vinylbenzyl)phenyl]propane.

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