A current testing system and method for MiniLed TV products and TV

Abstract

The present invention provides a current testing system and method for a MiniLed television product and a television. A terminal amplification test board is added between a backlight source and a logic driver board of a backlight module. The terminal amplification test board consists of two columns of PIN terminal blocks in a left and a right column. The first FFC line is led out from the backlight source and connected to the PIN terminal block in the left column of the terminal amplification test board. The second FFC line is led out from the PIN terminal block in the right column of the terminal amplification test board and connected to the logic driver board. Then, corresponding pads on the terminal amplification test board are connected using a bridge line to achieve circuit conduction. Finally, an oscilloscope or a multimeter is used to test the current. This solves the problem in actual product production that, because a single FFC line is a combination of N series and M parallel, both the oscilloscope and the multimeter can only test the current of a single channel in the FFC line, but the FFC line is covered with a layer of insulating film, which makes the current test operation inconvenient.

Description

Technical Field

[0001] The present invention relates to the technical field of current testing, and in particular to a current testing system and method for a MiniLed television product and a television. Background Art

[0002] In recent years, with MiniLed backlight technology gaining increasing attention, MiniLed TVs have become a highly sought-after TV category. Conventional direct-lit TVs use LEDs arranged on the back of the TV, resulting in a thicker body. Because the backlight layer is a module composed of numerous LEDs that emit white light, the number of LEDs significantly impacts the maximum brightness and uniformity of the screen. MiniLed backlight technology achieves this by reducing the size of the LEDs, allowing them to accommodate more while maintaining the same panel area. This allows for high-brightness displays and more precise light control.

[0003] Among them, the TV product needs to test the current during the design process to confirm whether it is consistent with the design value. Conventional direct-type TV products use electronic wires, and there are two ways to test the current: 1. Test with an oscilloscope current probe; 2. Test with a multimeter probe. MiniLed TV products use FFC wires. A single FFC wire is a combination of N series and M parallel. Whether using an oscilloscope or a multimeter, you can only test the current of a single channel in the FFC wire. In actual production, since the FFC wire is wrapped with a layer of insulating film, if you want to perform a current test, you need to cut the insulating film on the FFC wire and then use an oscilloscope or multimeter to perform a current test. This will cause a lot of inconvenience in the actual production process of TV products. Summary of the Invention

[0004] The purpose of the present invention is to provide a current testing system and method for a MiniLed television product and a television. The system adds a terminal amplification test board between the backlight source and the logic driver board of the backlight module, and the terminal amplification test board is composed of two columns of PIN terminal blocks on the left and right. The first FFC line and the second FFC line connected to the same terminal amplification test board are the same FFC lines. The first FFC line is drawn out from the backlight source and connected to the PIN terminal block in the left column of the terminal amplification test board. The second FFC line is drawn out from the PIN terminal block in the right column of the terminal amplification test board and connected to the logic driver board. The corresponding pads on the terminal amplification test board are then connected using a bridge line to achieve circuit conduction. Finally, an oscilloscope or a multimeter is used to test the current. This solves the problem in actual product production that a single FFC line is a combination of N series and M parallel, and both the oscilloscope and the multimeter can only test the current of a single channel in the FFC line. However, the FFC line is wrapped with a layer of insulating film, which makes the operation of the current test inconvenient.

[0005] In order to solve the above technical problems, the present invention adopts the following solutions:

[0006] A current testing system for a MiniLed TV product includes a terminal amplification test board, a first FFC line, a second FFC line, a backlight module, and a logic driver board. The backlight module includes a backlight source. The terminal amplification test board is located between the backlight source and the logic driver board. The first FFC line is drawn from the input end of the backlight source and connected to the port of the terminal amplification test board. The second FFC line is drawn from the port of the terminal amplification test board and connected to the output end of the logic driver board.

[0007] The terminal amplification test board includes two columns of symmetrical PIN terminal blocks and exposed solder pads. The first FFC line is connected to the PIN terminal block in the left column, and the second FFC line is connected to the PIN terminal block in the right column. The solder pads are composed of solder points in the left and right columns. The solder points in the left column are connected to the ports of the PIN terminal block in the left column in a one-to-one correspondence, and the solder points in the right column are connected to the ports of the PIN terminal block in the right column in a one-to-one correspondence. The corresponding solder points on the left and right can be connected with a bridge line to achieve circuit conduction.

[0008] Furthermore, the backlight source in the backlight module is a MiniLed light bar.

[0009] Furthermore, the first FFC line and the second FFC line are connected to the same terminal amplification test board and are the same FFC line.

[0010] Furthermore, the length and width of the pad are 4 cm and 1 cm respectively, and the pad is used to be tested by a current test pen.

[0011] Furthermore, the current test probe includes an oscilloscope clip and a multimeter probe.

[0012] A current testing method for a MiniLed TV product specifically includes the following steps:

[0013] S1: After connecting the MiniLed light strip board to the FFC line, lead the FFC line from the input end of the backlight source and connect it to the PIN terminal block on the left column of the terminal amplifier test board;

[0014] S2: Use the same FFC line to connect from the PIN terminal block on the right column of the terminal amplifier test board to the output terminal of the logic driver board;

[0015] S3: Use bridge wires to connect two corresponding solder points on the pads to achieve circuit conduction for current testing;

[0016] S4: After the connection is made, light up the TV to confirm whether the TV current is conducting;

[0017] S5: After the current is turned on, use the test pen tip to perform a TV current test on the pad;

[0018] Furthermore, the current testing method in S5 includes using an oscilloscope clip to clamp a certain series of circuits at the pad position or using a multimeter probe to connect the positive and negative poles of a certain series of circuits at the pad position.

[0019] A television set includes an LED panel assembly and a backlight assembly. The backlight assembly affects the display performance of the LED panel assembly. The backlight assembly includes a back shell, a backlight source, a logic drive board, and a terminal amplification test board. The input end of the backlight source is connected to the terminal amplification test board, and the output end of the logic drive board is connected to the terminal amplification test board. An inspection port is opened on the back shell, and the soldering pads of the terminal amplification test board are located facing the inspection port.

[0020] Beneficial effects of the present invention: The present invention provides a current testing system and method for a Mini LED TV product and a TV set. By adding a terminal amplifier test board between the backlight source of the backlight module and the logic driver board, a first FFC line is led out from the backlight module and connected to the PIN terminal block in the left column of the terminal amplifier test board. A second FFC line is led out from the PIN terminal block in the right column of the terminal amplifier test board and connected to the logic driver board. Then, corresponding pads on the terminal amplifier test board are connected using bridge wires to achieve circuit conduction.

[0021] The terminal amplification test board is equivalent to splitting the same FFC cable into two sections, and connecting the FFC cables to the PIN terminal blocks in the left and right columns of the terminal amplification test board. Furthermore, by using the solder points on the pads of the terminal amplification test board to correspond one-to-one with the PIN terminal blocks in the left and right columns, the FFC cable terminals are enlarged to the size of the solder points on the pads, allowing the pads to enlarge the size of the FFC cable terminals. Therefore, the FFC cable does not need to be sheared from the outer insulating film, and the amplification of the terminals allows the current value of the FFC cable circuit to be measured with an oscilloscope or multimeter tip, making current testing more convenient in actual product production. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a cross-sectional view of an enlarged terminal test board of the present invention;

[0023] Figure 2 It is a structural schematic diagram of the present invention;

[0024] Figure 3 A top view of the terminal magnification test board of the present invention;

[0025] Figure 4 is a schematic diagram of the present invention;

[0026] Explanation of the accompanying drawings: 1-terminal amplification test board, 2-soldering pad, 21-soldering point, 3-PIN terminal seat, 4-FFC line, 41-first FFC line, 42-second FFC line, 5-backlight source, 6-logic driver board, 7-back shell. DETAILED DESCRIPTION

[0027] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] Unless otherwise specifically stated, the relative arrangement of components and steps, the numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0029] At the same time, it should be understood that for the convenience of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship.

[0030] Additionally, descriptions of well-known structures, functions, and configurations may be omitted for clarity and conciseness. Those skilled in the art will recognize that various changes and modifications can be made to the examples described herein without departing from the spirit and scope of the present disclosure.

[0031] Technologies, methods and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods and equipment should be considered part of the authorization specification.

[0032] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0033] The present invention will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments:

[0034] Example 1

[0035] A current testing system for a MiniLed TV product includes a terminal amplification test board 1, a first FFC line 41, a second FFC line 42, a backlight module, and a logic driver board 6. The backlight module includes a backlight source 5. The terminal amplification test board 1 is located between the backlight source 5 and the logic driver board 6. The first FFC line 41 is drawn from the input end of the backlight source 5 and connected to the port of the terminal amplification test board 1. The second FFC line 42 is drawn from the port of the terminal amplification test board 1 and connected to the output end of the logic driver board 6.

[0036] The terminal amplification test board 1 includes two columns of symmetrical PIN terminal blocks 3 and exposed solder pads 2. The first FFC line 41 is connected to the PIN terminal block 3 in the left column, and the second FFC line 42 is connected to the PIN terminal block 3 in the right column. The solder pads 2 are composed of solder points 21 in the left and right columns. The solder points 21 in the left column are connected to the ports of the PIN terminal block 3 in the left column in a one-to-one correspondence, and the solder points 21 in the right column are connected to the ports of the PIN terminal block 3 in the right column in a one-to-one correspondence. The corresponding solder points 21 on the left and right can be connected with a bridge line to achieve circuit conduction.

[0037] Furthermore, the backlight source 5 in the backlight module is a MiniLed light bar.

[0038] Specifically, the backlight module is a key component of a liquid crystal display panel. Since liquid crystals themselves do not emit light, the backlight module's function is to provide sufficient brightness and evenly distributed light to properly display images. The logic driver board 6 recombines the signals sent from the mainboard into continuous control signals, image data signals, and auxiliary signals that meet the requirements of the LCD screen. These signals are then transmitted to the row and column driver circuits within the LCD screen via the FFC line 4.

[0039] Furthermore, the first FFC line 41 and the second FFC line 42 are connected to the same terminal amplification test board 1 to form the same FFC line 4 .

[0040] Specifically, the first FFC line 41 is the FFC line 4 connected to the left column PIN terminal block 3 , and the second FFC line 42 is the FFC line 4 connected to the right column PIN terminal block 3 .

[0041] Furthermore, the length and width of the pad 2 are 4 cm and 1 cm respectively, and the pad 2 is used to be tested by a current test pen.

[0042] Furthermore, the current test probe includes an oscilloscope clip and a multimeter probe.

[0043] First, connect the MiniLed light strip board to the FFC cable 4, leading the FFC cable 4 from the input end of the backlight source 5 and connecting it to the PIN terminal block 3 in the left column of the terminal amplifier test board 1. Then, use the same FFC cable 4 to connect it from the PIN terminal block 3 in the right column of the terminal amplifier test board 1 and connect it to the output end of the logic driver board 6. Next, use a bridge wire to connect the two corresponding solder points 21 on the solder pad 2 to achieve circuit conduction. After connection, turn on the TV to confirm whether the current is flowing. After confirming that the current is flowing, use the test pen tip to test the TV current. The current test is mainly performed by clamping a certain series of circuits with an oscilloscope clip or connecting the positive and negative poles of a certain series of circuits with the test leads of a multimeter. Finally, read the value of the oscilloscope or multimeter to obtain the current of the TV product.

[0044] Specifically, the terminal amplification test board 1 has a length and width of 5 cm and 3 cm respectively. The terminal amplification test board 1 includes two rows of symmetrical PIN terminal blocks 3 and exposed solder pads 2. The definition of the PIN terminal blocks 3 is the same as the PIN definition on the light bar PCB board. The solder pads 2 are composed of two rows of solder points 21 on the left and right. The solder points 21 are squares with a side length of 2 mm. The solder points 21 on the left row are connected to the ports of the PIN terminal blocks 3 on the left row in a one-to-one correspondence. The solder points 21 on the right row are connected to the ports of the PIN terminal blocks 3 on the right row in a one-to-one correspondence. The corresponding solder points 21 can be connected with electronic wires to achieve circuit conduction, which is convenient for testing using oscilloscope clips and multimeter probes.

[0045] Specifically, the terminal amplification test board 1 is set in the backlight source 5 and the logic driver board 6, so that the terminal amplification test board 1 is equivalent to splitting the same FFC line 4 into two parts, so that the first FFC line 41 is led out from the input end of the backlight source 5 and connected to the PIN terminal seat 3 in the left column, and the second FFC line 42 is led out from the output end of the logic driver board 6 and connected to the PIN terminal seat 3 in the right column.

[0046] The PIN terminal blocks 3 in the left and right columns correspond to the solder points 21 in the left and right columns on the pad 2 and are conductive. The two corresponding solder points 21 are connected by bridge lines, so that the first FFC line 41 and the second FFC line 42 can realize the flow of current through the pad 2. The connection between the terminal of the FFC line 4 and the PIN terminal block 3 makes the terminal of the FFC line 4 equivalent to being enlarged to the solder point 21 of the corresponding pad 2. The pad 2 is exposed to the outside and the size of the solder point 21 is larger than the size of the FFC terminal, so that the pad 2 can play the role of enlarging the terminal of the FFC line 4. Therefore, the FFC line 4 does not need to be cut on the outer insulating film, and an oscilloscope or multimeter can be used to test the current value of the FFC line 4 circuit, so that the current can be tested more conveniently in actual product production.

[0047] Example 2

[0048] A current testing method for a MiniLed TV product specifically includes the following steps:

[0049] S1: After the MiniLed light strip board is connected to the FFC line 4, lead the FFC line 4 from the input end of the backlight source 5 and connect it to the PIN terminal block 3 on the left column of the terminal amplifier test board 1;

[0050] S2: Use the same FFC line 4 to connect from the PIN terminal block 3 in the right column of the terminal amplifier test board 1 to the output end of the logic driver board 6;

[0051] S3: Connecting two corresponding solder joints 21 on the pad 2 with bridge wires to achieve circuit conduction for current testing;

[0052] S4: After the connection is made, light up the TV to confirm whether the TV current is conducting;

[0053] S5: After the current is turned on, use the test pen tip to perform a TV current test on pad 2;

[0054] Furthermore, the current test method in S5 includes using an oscilloscope clip to clamp a certain series of circuits at the position of pad 2 or using a multimeter probe to connect the positive and negative poles of a certain series of circuits at the position of pad 2 respectively.

[0055] Example 3

[0056] A television set includes an LED panel assembly and a backlight assembly. The backlight assembly affects the display performance of the LED panel assembly. The backlight assembly includes a back shell 7, a backlight source 5, a logic drive board 6, and a terminal amplification test board 1. The input end of the backlight source 5 is connected to the terminal amplification test board 1, and the output end of the logic drive board 6 is connected to the terminal amplification test board 1. An inspection port is opened on the back shell 7, and the position of the soldering pad 2 of the terminal amplification test board 1 faces the inspection port.

[0057] The above description is merely a preferred embodiment of the present invention and does not constitute any form of limitation to the present invention. Based on the technical essence of the present invention and within the spirit and principles of the present invention, any simple modification, equivalent replacement and improvement of the above embodiment shall still fall within the scope of protection of the technical solution of the present invention.

Claims

1. A current testing system for MiniLed TV products, characterized in that: The invention comprises a terminal amplification test board (1), a first FFC line (41), a second FFC line (42), a backlight module and a logic drive board (6), wherein the backlight module comprises a backlight source (5), the terminal amplification test board (1) is located between the backlight source (5) and the logic drive board (6), the first FFC line (41) is led out from the input end of the backlight source (5) and connected to the port of the terminal amplification test board (1), the second FFC line (42) is led out from the port of the terminal amplification test board (1) and connected to the output end of the logic drive board (6), The terminal amplification test board (1) comprises two columns of symmetrical PIN terminal seats (3) and exposed solder pads (2); the first FFC line (41) is connected to the PIN terminal seat (3) in the left column, and the second FFC line (42) is connected to the PIN terminal seat (3) in the right column; the solder pads (2) are composed of solder joints (21) in the left and right columns; the solder joints (21) in the left column are connected to the ports of the PIN terminal seat (3) in the left column in a one-to-one correspondence; the solder joints (21) in the right column are connected to the ports of the PIN terminal seat (3) in the right column in a one-to-one correspondence; and the corresponding solder joints (21) in the left column and the solder joints (21) in the right column are connected to the ports of the PIN terminal seat (3) in the right column in a one-to-one correspondence; bridge lines are connected between the corresponding solder joints (21) in the left column and the solder joints (21) in the right column to realize circuit conduction.

2. The current testing system for a MiniLed TV product according to claim 1, characterized in that: The backlight source (5) in the backlight module is a MiniLed light bar.

3. The current testing system for a MiniLed TV product according to claim 1, characterized in that: The first FFC line (41) and the second FFC line (42) are connected to the same terminal amplification test board (1) to form the same FFC line (4).

4. The current testing system for a MiniLed TV product according to claim 1, characterized in that: The length and width of the soldering pad (2) are 4 cm and 1 cm respectively, and the soldering pad (2) is used for testing by a current test pen.

5. The current testing system for a MiniLed TV product according to claim 4, characterized in that: The current test pen head includes an oscilloscope clip and a multimeter pen head.

6. A current testing method for MiniLed TV products, characterized in that: The specific steps include: S1: After the MiniLed light strip board is connected to the FFC line (4), the FFC line (4) is led out from the input end of the backlight source (5) and connected to the PIN terminal block (3) on the left column of the terminal amplification test board (1); S2: Use the same FFC line (4) to connect from the PIN terminal block (3) on the right column of the terminal amplifier test board (1) to the output terminal of the logic driver board (6); S3: connecting two corresponding solder points (21) on the solder pad (2) with bridge wires to achieve circuit conduction for current testing; S4: After the connection is made, light up the TV to confirm whether the TV current is conducting; S5: After the current is turned on, use the test pen tip to perform a TV current test on the pad (2).

7. The current testing method for a MiniLed TV product according to claim 6, characterized in that: The current test method in S5 includes using an oscilloscope clip to clamp a certain series of circuits at the position of the pad (2) or using a multimeter pen to connect the positive and negative poles of a certain series of circuits at the position of the pad (2).

8. A television set, characterized in that: The invention comprises an LED panel assembly and a backlight assembly, wherein the backlight assembly affects the display performance of the LED panel assembly, and the backlight assembly comprises a back shell (7), a backlight source (5), a logic drive board (6) and a terminal amplification test board (1), wherein the input end of the backlight source (5) is connected to the terminal amplification test board (1), and the output end of the logic drive board (6) is connected to the terminal amplification test board (1), and an inspection port is opened on the back shell (7) and the position of the soldering pad (2) of the terminal amplification test board (1) faces the inspection port.

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