High-precision electronic DIP connector element ball mounting jig and process thereof

Abstract

The application discloses a high-precision electronic DIP connector element ball mounting jig and a process thereof, which comprises a base, a positioning plate, a ball mounting aluminum frame, a pressing plate, positioning pins and a cover plate. A profiling groove for placing the DIP connector element is arranged on the middle boss of the base, the positioning plate is arranged around the boss, the ball mounting aluminum frame is arranged in butt joint on the upper side of the boss, the ball mounting aluminum frame is provided with mesh holes corresponding to the pin feet of the DIP connector element, the pressing plate is arranged in butt joint on the upper side of the ball mounting aluminum frame, the positioning pins are installed on the pressing plate, the ball mounting aluminum frame and the base are provided with positioning holes matched with the positioning pins for accurate positioning, and the cover plate is placed on the upper side of the ball mounting aluminum frame. Through the above mode, the ball mounting jig is simple in structure and can quickly weld the tin ball to the pin feet of the DIP connector element, so that the reuse rate of the DIP connector element is greatly improved, the electronic device is reduced in scrap, and the environmental pollution caused by the electronic part scrap is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic original value maintenance, in particular to a high-precision electronic DIP connector element ball mounting jig and process thereof. BACKGROUND

[0002] At present, people like to pursue fashion, beauty, durability and novelty of electronic products, and the function of electronic product components directly relates to the function of the whole machine assembly of customers. In the production process, the tin ball on the pin tip of the DIP connector element will be scrapped due to the poor board after passing through the reflow furnace, resulting in loss of part cost. The poor board includes PCB or FPC board surface problems such as bruising, damage or board circuit problems. In order to not waste resources, the DIP connector element can be disassembled and used, and the tin ball on the pin tip of the DIP connector element will be damaged during disassembly. In order to ensure that the DIP connector element can continue to be used, the pin tip needs to be planted with a ball.

[0003] At present, the BGA packaging adopts the tin paste + tin ball method, and the BGA packaging is for planar packaging. However, the DIP connector element needs to plant the tin ball on the top end of the part pin. The conventional BGA planar tin paste ball planting maintenance process is operated on the plane, which cannot be applied to the pin tip type PIN foot of the DIP connector element. Based on the above defects and deficiencies, it is necessary to improve the existing technology and design a high-precision electronic DIP connector element ball mounting jig and process. SUMMARY

[0004] The technical problem solved by the present application is to provide a high-precision electronic DIP connector element ball mounting jig and process, which improves the utilization rate of the DIP connector element, reduces the part scrap rate and saves production cost.

[0005] To solve the above technical problems, one technical scheme adopted by the present application is to provide a high-precision electronic DIP connector element ball mounting jig and process. The high-precision electronic DIP connector element ball mounting jig comprises a base, a positioning plate, a ball planting aluminum frame, a pressing plate, a positioning pin and a cover plate. A profiling groove for placing the DIP connector element is arranged on the middle boss of the base. The positioning plate is arranged around the boss. The ball planting aluminum frame is arranged in butt joint on the upper side of the boss. A mesh hole corresponding to the pin of the DIP connector element is arranged on the ball planting aluminum frame. The pressing plate is arranged in butt joint on the upper side of the ball planting aluminum frame. The positioning pin is installed on the pressing plate. A positioning hole for accurate positioning matched with the positioning pin is arranged on the ball planting aluminum frame and the base. The cover plate is placed on the upper side of the ball planting aluminum frame.

[0006] Preferably, the mesh hole depth is higher than the pin length of the DIP connector element, and the mesh hole diameter is not less than the tin ball diameter.

[0007] Preferably, the profiled groove is provided with a relief groove on both sides to facilitate the taking and placing of products.

[0008] Preferably, the positioning plate is provided with an opening groove to facilitate the taking and placing of the ball mounting aluminum frame.

[0009] A ball mounting process of a high-precision electronic DIP connector element ball mounting jig includes the following steps:

[0010] S1, first prepare the tin ball mounting jig base, then clean it with a cleaning agent and dry it, which facilitates smooth rolling of the tin balls;

[0011] S2, position the pre-prepared DIP connector element to be repaired on the profiled groove of the base;

[0012] S3, evenly apply a suitable amount of soldering paste to the DIP connector element pins with a brush, without using a steel mesh to print the tin paste, but directly brushing the soldering paste evenly to the DIP connector element pins;

[0013] S4, appearance inspection confirms that each pin of the DIP connector element must be evenly coated with soldering paste, then the ball mounting aluminum frame and the pressing plate are sleeved on the base, and precise positioning is performed by using the positioning holes and positioning pins on the body, and the appearance CCD is enlarged to confirm that each pin of the DIP connector element must correspond to the hole position on the top of the ball mounting aluminum frame without offset, and then fixed with high-temperature adhesive tape;

[0014] S5, then put in 0.40mm diameter tin balls, evenly shake the tin ball mounting jig, let each tin ball smoothly roll into the mesh hole, and the appearance is confirmed under an electron microscope that each mesh hole has a tin ball, and there is no missing phenomenon;

[0015] S6, place the DIP connector element with mounted tin balls and the ball mounting jig into a nitrogen reflow soldering machine, heat and solder in the oven, the highest temperature range is between 240 degrees and 250 degrees, after the product is completed by reflow soldering, wear high-temperature gloves, and gently take the oven product and place it on the heating plate for secondary heating, the temperature range is between 280 degrees and 290 degrees;

[0016] S7, when secondary heating on the heating plate, a special matching synthetic stone cover plate is needed to press, confirm that each tin ball is dissolved into the DIP connector element pins in each jig mesh hole, then take it off the heating plate and cool for 3 minutes, then take off the repaired DIP connector element, and complete the pin tin ball repair;

[0017] S8, appearance inspection under an electron microscope confirms that each tin ball on the DIP connector element pin needs to be consistent in height, without defects and skewing abnormalities, and after re-packaging, it can be used for secondary soldering production.

[0018] Compared with the prior art, the present application has the following advantages:

[0019] The tin ball can be welded to the pin of the DIP connector element by the ball mounting jig, and the rework process of the solder paste + tin ball method has the advantages of good uniformity, good solderability, good gloss, no abnormal phenomenon such as tin ball deviation and missing welding during tin melting, and easy personnel control of rework quality. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 It is a structural schematic diagram of an electronic DIP connector element assembly state.

[0021] Fig. 2 It is a structural schematic diagram of a high-precision electronic DIP connector element ball mounting jig.

[0022] Fig. 3 It is a structural schematic diagram of a high-precision electronic DIP connector element ball mounting jig.

[0023] 01, DIP connector element, 1, base, 10, profiling groove, 11, avoiding groove, 2, positioning plate, 20, opening groove, 3, ball mounting aluminum frame, 30, mesh hole, 4, pressing plate, 5, positioning pin, 6, cover plate. DETAILED DESCRIPTION

[0024] The preferred embodiments of the present application will be described in detail below with reference to the accompanying drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art, and the protection scope of the present application can be more clearly and definitely defined.

[0025] Please refer to Figs. 1 to 3 The embodiments of the present application include:

[0026] A high-precision electronic DIP connector element ball mounting jig, which comprises a base 1, a positioning plate 2, a ball mounting aluminum frame 3, a pressing plate 4, a positioning pin 5 and a cover plate 6, wherein a profiling groove 10 for placing a DIP connector element is arranged on the middle boss of the base 1, a positioning plate 2 is arranged around the boss, and a ball mounting aluminum frame 3 is arranged in butt joint on the boss, a mesh hole 30 corresponding to the pin of the DIP connector element is arranged on the ball mounting aluminum frame 3, a pressing plate 4 is arranged in butt joint on the ball mounting aluminum frame 3, a positioning pin 5 is installed on the pressing plate 4, a positioning hole for accurate positioning is arranged on the ball mounting aluminum frame 3 and the base 1 in cooperation with the positioning pin, and a cover plate 6 is placed on the ball mounting aluminum frame 3.

[0027] The depth of the mesh hole 30 is higher than the length of the pin of the DIP connector element, and the aperture of the mesh hole 30 is not less than the diameter of the tin ball.

[0028] The profiled groove 10 is provided with an avoiding slot 11 on both sides to facilitate the taking and placing of products.

[0029] The positioning plate 2 is provided with an opening slot 20 to facilitate the taking and placing of the ball mounting aluminum frame 3.

[0030] A ball mounting process of a high-precision electronic DIP connector element ball mounting jig includes the following steps:

[0031] S1, first prepare the tin ball mounting jig base 1, then clean it with a cleaning agent and dry it, which is beneficial to smooth rolling of the tin balls;

[0032] S2, position the pre-prepared DIP connector element 01 to be repaired on the profiled groove 10 of the base 1;

[0033] S3, evenly apply a suitable amount of soldering paste to the DIP connector element 01 pin with a brush, without using a steel mesh to print the tin paste, but directly brushing the soldering paste evenly to the DIP connector element pin;

[0034] S4, appearance inspection confirms that each pin of the DIP connector element 01 must be evenly coated with soldering paste, then the ball mounting aluminum frame 3 and the pressing plate 4 are sleeved on the base 1, and precise positioning is performed by using the positioning holes and positioning pins 5 on the body, and the appearance CCD is enlarged to confirm that each pin of the DIP connector element 01 must correspond to the hole position on the upper surface of the ball mounting aluminum frame 3 without deviation, and then fixed with high-temperature adhesive tape;

[0035] S5, then put in 0.40mm diameter tin balls, evenly shake the tin ball mounting jig, let each tin ball smoothly roll into the mesh hole 30, and the appearance is confirmed under an electron microscope that each mesh hole 30 has a tin ball, and there is no missing phenomenon;

[0036] S6, put the DIP connector element 01 with tin balls mounted therein and the ball mounting jig into a nitrogen reflow soldering machine, heat and solder in the oven, the highest temperature range is between 240 degrees and 250 degrees, after the product is completed by reflow soldering, wear high-temperature resistant gloves, and gently take the product out of the oven and place it on a heating plate for secondary heating, the temperature range is between 280 degrees and 290 degrees;

[0037] S7, when secondary heating on the heating plate, a special matching synthetic stone cover plate 6 is needed to cover and press, to confirm that each tin ball is dissolved into the DIP connector element pin in each jig mesh hole, then take it off the heating plate and cool for 3 minutes, then take out the repaired DIP connector element 01, and complete the pin tin ball repair;

[0038] S8, appearance inspection under an electron microscope confirms that each tin ball on the DIP connector element pin needs to be consistent in height, without defects and skewing abnormalities, and after re-packaging, it can be used for secondary soldering production.

[0039] The application discloses a high-precision electronic DIP connector element ball mounting jig and a process thereof.

[0040] The above merely illustrates the embodiments of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which is made by using the content of the specification and drawings, is also included in the patent protection scope of the application.

Claims

1. A high-precision ball-mounting process for electronic DIP connectors, characterized in that: Includes the following steps: S1. First, prepare the solder ball mounting fixture base, then clean it with a cleaning agent and dry it to facilitate smooth rolling of the solder balls; S2. Position the pre-prepared DIP connector to be repaired on the contoured groove of the base; S3. Apply an appropriate amount of flux evenly to the pins of the DIP connector directly with a brush. There is no need to print solder paste with a stencil. Instead, apply the flux evenly to the pins of the DIP connector directly. S4. Visual inspection confirms that each pin of the DIP connector must be evenly coated with solder paste. Then, place the ball-mounted aluminum frame and pressure plate on the base and use the positioning holes and positioning pins on the main body for precise positioning. After visually confirming that each pin of the DIP connector corresponds to the hole on the ball-mounted aluminum frame without any offset using CCD magnification, fix it with high-temperature tape. S5. Next, place 0.40mm diameter solder balls and shake the solder ball placement fixture evenly to allow each solder ball to roll smoothly into the mesh. Under an electron microscope, confirm that each mesh has a solder ball and there should be no missing balls. S6. Place the DIP connector with solder balls attached, along with the ball-attaching fixture, into a nitrogen reflow oven for reflow soldering. The maximum temperature range is 240-250 degrees Celsius. After the product has passed through reflow soldering, put on high-temperature resistant gloves, gently handle the reflow product and place it on a heating plate for secondary heating, with a temperature range of 280-290 degrees Celsius. S7. When heating the heating plate for the second time, a special matching synthetic stone cover plate should be placed on top to apply pressure. Ensure that each solder ball is melted into the pin of the DIP connector in each jig mesh. After removing it from the heating plate and cooling for 3 minutes, remove the DIP connector to be repaired and complete the pin solder ball repair. S8. Under an electron microscope, the appearance of each solder ball on the pins of the DIP connector must be consistent in height, without defects or skew, and can be repackaged for secondary soldering and production. This high-precision electronic DIP connector ball-mounting fixture includes a base, a positioning plate, a ball-mounting aluminum frame, a pressure plate, positioning pins, and a cover plate. The base has a raised platform in the center with a contoured groove for placing the DIP connector. A positioning plate surrounds the raised platform, and the ball-mounting aluminum frame is mounted on top of the raised platform. The ball-mounting aluminum frame has mesh holes that correspond one-to-one with the pins of the DIP connector. A pressure plate is mounted on top of the ball-mounting aluminum frame, and positioning pins are installed on the pressure plate. Both the ball-mounting aluminum frame and the base have positioning holes that mate with the positioning pins for precise positioning. A cover plate is placed on top of the ball-mounting aluminum frame.

2. The ball-mounting process for high-precision electronic DIP connectors according to claim 1, characterized in that: The mesh depth is greater than the pin length of the DIP connector, and the mesh diameter is not less than the solder ball diameter.

3. The ball-mounting process for high-precision electronic DIP connectors according to claim 1, characterized in that: The contoured groove has clearance slots on both the front and rear sides to facilitate the picking and placing of products.

4. The ball-mounting process for high-precision electronic DIP connectors according to claim 1, characterized in that: The positioning plate has an opening slot for easy placement and removal of the aluminum frame for planting the balls.

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