Loudspeaker module and electronic device
By dividing the cavity in the speaker module and using dual coil drive, deep integration and full-band coverage of the speaker module are achieved, solving the problem that multiple sound-generating units cannot be miniaturized in the existing technology, and improving sound quality and sensitivity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGDONG HONGQIN COMM TECH CO LTD
- Filing Date
- 2023-03-30
- Publication Date
- 2026-08-04
AI Technical Summary
Existing speaker modules, which consist of multiple sound-generating units stacked together, cannot achieve miniaturization and deep integration, thus failing to meet the requirements for high-quality, full-range sound effects.
The speaker module's housing is divided into a first cavity and a second cavity by a support plate. Each cavity corresponds to a diaphragm and a connecting rod, respectively. The connecting rods in the two cavities are driven by an armature and a coil that pass through the support plate, thereby enabling the generation of high-frequency and low-frequency sounds. The sensitivity is improved by using dual coil drive, and the frequency band is dynamically adjusted by adjusting the cavity volume and armature thickness.
It achieves deep integration of speaker modules, reducing size while maintaining full-range sound effects, and improving audio quality and sensitivity.
Smart Images

Figure CN116233705B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of electroacoustic product technology, and in particular to a loudspeaker module and an electronic device. Background Technology
[0002] As users demand higher and higher sound quality across the entire frequency range, they require loudspeakers to have greater high-frequency extension and lower low-frequency extension. However, conventional single balanced armature loudspeakers are limited by their small size and cannot cover the entire frequency range, thus failing to meet users' sound quality requirements. Therefore, sound-producing devices usually need to stack multiple sound-producing units to form loudspeaker modules to broaden the frequency band coverage.
[0003] The inventors discovered that when multiple sound-generating units are stacked to form a speaker module, it is simply two independent sound-generating units stacked together, which cannot be deeply integrated. In other words, existing speaker modules containing multiple sound-generating units cannot guarantee miniaturization. Summary of the Invention
[0004] The purpose of this invention is to provide a speaker module and electronic device that integrates speaker sound-producing units and reduces the size of the speaker module.
[0005] To address the aforementioned technical problems, embodiments of the present invention provide a speaker module, comprising: an upper cover and a lower cover, the upper cover and the lower cover together forming a receiving cavity; a support plate is disposed within the receiving cavity, the support plate dividing the receiving cavity into a first cavity and a second cavity; a first diaphragm and a second diaphragm are also disposed within the receiving cavity, the first diaphragm being located in the first cavity and the second diaphragm being located in the second cavity, and the first diaphragm and the second diaphragm being fixed on opposite sides of the support plate; an armature is also disposed within the receiving cavity, the armature penetrating the support plate and being fixed to the support plate, the armature being provided with a magnetic element and a coil, the coil magnetizing the armature when energized, the magnetized armature reciprocating under the magnetic force of the magnetic element; a first connecting rod and a second connecting rod are fixed to the armature, the first connecting rod being located in the first cavity, the first connecting rod driving the first diaphragm to vibrate with the reciprocating motion of the armature; the second connecting rod being located in the second cavity, the second connecting rod driving the second diaphragm to vibrate with the reciprocating motion of the armature.
[0006] Embodiments of the present invention also provide an electronic device, including: a housing and the above-described speaker module disposed within the housing.
[0007] Compared to existing technologies, this invention utilizes a support plate to divide the accommodating cavity enclosed by the upper and lower covers into a first cavity and a second cavity. Each cavity has a corresponding diaphragm and a connecting rod that drives the diaphragm to vibrate. The connecting rods corresponding to the two cavities share the same driving component. Specifically, an armature penetrating the support plate, along with a magnetic component and coil mounted on the armature, drives the movement of the two connecting rods within the two cavities. When the coil is energized, it magnetizes the armature. Under the magnetic force of the magnetic component, the magnetized armature reciprocates, driving the first and second connecting rods at both ends of the armature to move. This, in turn, causes the first and second diaphragms in the first and second cavities to vibrate, respectively, emitting high-frequency and low-frequency sounds. By sharing a portion of the driving component between the high-frequency and low-frequency sound units, deep integration of the speaker module is achieved, minimizing the overall size of the speaker module.
[0008] In addition, there are two coils, one located in the first cavity and the other in the second cavity. The two coils on both sides of the support plate are energized simultaneously, providing more energy to drive the armature movement and improving sensitivity.
[0009] Furthermore, the first and second cavities have different volumes. With only one coil, the coil is housed in the larger of the two cavities. A larger cavity volume is more advantageous for coil placement and improves space utilization.
[0010] In addition, the support plate is provided with through holes, which connect the first cavity and the second cavity. Audio filtering is achieved through the through holes to improve audio quality.
[0011] In addition, there may be one or more through holes. When there are multiple through holes, the through holes are set on the support plate and distributed on the upper and lower sides of the armature.
[0012] In addition, damping material can be filled into the through hole to adjust the frequency response.
[0013] In addition, the magnetic components are: a first magnet pair disposed in the first cavity and a second magnet pair disposed in the second cavity, wherein the first magnet pair and the second magnet pair are respectively disposed on both sides of the armature away from the support plate.
[0014] Furthermore, the first and second cavities have different volumes, and the thickness of the armature portion in the first cavity differs from that in the second cavity, with the armature portion in the larger cavity being thicker. By controlling the armature thickness and by changing the position of the support plate to control the volumes of the first and second cavities, the sound frequency band of the sound-generating unit can be dynamically adjusted to achieve full-frequency coverage.
[0015] In addition, a sound outlet tube is fixedly installed on the top cover. The sound outlet tube connects the outside of the first cavity and the receiving cavity, and also connects the outside of the second cavity and the receiving cavity. The first cavity and the second cavity have different volumes. The sound outlet tube is positioned close to the smaller cavity among the first cavity and the second cavity to improve the quality of high-frequency sound.
[0016] In addition, the sound tube and the top cover are independent of each other and are fixed by assembly; or the sound tube and the top cover are integrally formed. Attached Figure Description
[0017] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.
[0018] Figure 1 This is an exploded structural diagram of a speaker module according to an embodiment of the present invention;
[0019] Figure 2 This is a front view of the structure of a speaker module according to an embodiment of the present invention;
[0020] Figure 3 This is a left view of the structure of a speaker module according to an embodiment of the present invention;
[0021] Figure 4 This is an exploded structural diagram of another speaker module according to an embodiment of the present invention;
[0022] Figure 5 This is a front view of the structure of another speaker module according to an embodiment of the present invention;
[0023] Figure 6 This is a left view of the structure of another speaker module according to an embodiment of the present invention;
[0024] Figure 7 This is a three-dimensional structural diagram of an armature structure according to an embodiment of the present invention;
[0025] Figure 8 This is a three-dimensional structural schematic diagram of another armature structure according to an embodiment of the present invention;
[0026] Figure 9 This is a schematic diagram of the armature state when the coil is not energized, according to an embodiment of the present invention;
[0027] Figure 10 This is a schematic diagram of the armature state when the coil is energized according to an embodiment of the present invention;
[0028] Figure 11 This is a schematic diagram of the armature state when the coil is not energized, according to another embodiment of the present invention;
[0029] Figure 12 This is a schematic diagram of the armature state under another coil energization condition according to an embodiment of the present invention;
[0030] Figure 13 This is a schematic diagram of an integrally formed sound tube and top cover structure according to an embodiment of the present invention;
[0031] Figure 14 This is a schematic diagram of another integrally formed sound tube and top cover structure according to an embodiment of the present invention. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the various embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been presented in the various embodiments of the present invention to enable the reader to better understand this application. However, the technical solutions claimed in this application can be implemented even without these technical details and various changes and modifications based on the following embodiments.
[0033] The division of the following embodiments is for ease of description and should not constitute any limitation on the specific implementation of the present invention. The various embodiments can be combined with and referenced by each other without contradiction.
[0034] Embodiments of the present invention relate to a speaker module, such as... Figures 1 to 6 As shown, the device includes: an upper cover 11 and a lower cover 12, which together form a receiving cavity; a support plate 2 is disposed within the receiving cavity, with its bottom and sides fixed to the lower cover, and its upper end connected to the upper cover and the diaphragm; the support plate 2 divides the receiving cavity into a first cavity and a second cavity; a first diaphragm 31 and a second diaphragm 32 are also disposed within the receiving cavity, with the first diaphragm 31 located in the first cavity and the second diaphragm 32 located in the second cavity, and the first diaphragm 31 and the second diaphragm 32 respectively fixed to both sides of the support plate 2; an armature is also disposed within the receiving cavity. 4. An armature 4 passes through and is fixed to the support plate 2. A magnetic element 5 and a coil 6 are provided on the armature 4. When the coil 6 is energized, it magnetizes the armature 4. The magnetized armature 4 reciprocates under the magnetic force of the magnetic element 5. A first connecting rod 71 and a second connecting rod 72 are fixed on the armature 4. The first connecting rod 71 is located in the first cavity. The first connecting rod 71 drives the first diaphragm 31 to vibrate with the reciprocating motion of the armature 4. The second connecting rod 72 is located in the second cavity. The second connecting rod 72 drives the second diaphragm 32 to vibrate with the reciprocating motion of the armature 4.
[0035] Compared to existing technologies, this invention utilizes a support plate to divide the accommodating cavity enclosed by the upper and lower covers into a first cavity and a second cavity. Each cavity has a corresponding diaphragm and a connecting rod that drives the diaphragm to vibrate. The connecting rods corresponding to the two cavities share the same driving component. Specifically, an armature penetrating the support plate, along with a magnetic component and coil mounted on the armature, drives the movement of the two connecting rods within the two cavities. When the coil is energized, it magnetizes the armature. Under the magnetic force of the magnetic component, the magnetized armature reciprocates, driving the first and second connecting rods at both ends of the armature to move. This, in turn, causes the first and second diaphragms in the first and second cavities to vibrate, respectively, emitting high-frequency and low-frequency sounds. By sharing a portion of the driving component between the high-frequency and low-frequency sound units, deep integration of the speaker module is achieved, minimizing the overall size of the speaker module.
[0036] To enable the speaker module to provide sound across different frequency bands, the frequency band of the sound-generating unit can be changed by adjusting the size of the first and second cavities, or by adjusting the thickness of the armature. Increasing the cavity volume lowers the frequency band of the sound-generating unit, and increasing the thickness of the armature portion within the cavity lowers the frequency band. Conversely, decreasing the cavity volume increases the frequency band, and decreasing the thickness of the armature portion within the cavity increases the frequency band. In this embodiment of the invention, by adjusting the cavity volume and the armature thickness, the speaker module can cover the entire frequency range.
[0037] In addition, such as Figure 1 As shown, the speaker module can have two coils (6), one in the first cavity and the other in the second cavity. The two coils can be symmetrically arranged based on the support plate to uniformly provide driving force to the armatures in the high-frequency and low-frequency sound units. Alternatively, the coil positions can be adjusted according to the different driving forces required by the high-frequency and low-frequency sound units during vibration. When the speaker module is working, both coils on the left and right sides of the support plate are simultaneously energized, providing more energy to drive the armature movement and improving sensitivity.
[0038] In addition, such as Figure 4 As shown, the number of coils 6 in the speaker module can also be one. When there is only one coil and the volumes of the first cavity and the second cavity are different, the coil is located in the larger of the two cavities. For example... Figure 4As shown, the volume of the cavity on the right side of the support plate 2 is significantly larger than that on the left side. Placing the coil 6 in the cavity on the right side of the support plate 2, with its larger volume, is more conducive to coil placement and improves space utilization. If the first and second cavities have the same volume and the number of coils is one, either cavity can be chosen for coil placement, or the specific placement position of the coil can be determined according to the requirements of the sound frequency band. This embodiment of the invention does not specifically limit the number or placement position of the coils; the number and position of the coils can be dynamically adjusted according to the actual sound frequency band requirements.
[0039] In addition, such as Figures 7 to 8 As shown, the support plate also has through holes connecting the first cavity and the second cavity. These through holes enable audio filtering, adjusting the low-frequency extension of the speaker and improving audio quality. There can be one or more through holes; when there are multiple through holes, they are distributed on the support plate and located on the upper and lower sides of the armature, as shown below. Figure 8 As shown, there are two through holes, one on each of the upper and lower sides of the armature. Alternatively, the two through holes can be arranged symmetrically with respect to the armature. This embodiment of the invention does not specifically limit the number, position, and size of the through holes. To improve the sound filtering effect, the number, position, and size of the through holes can be dynamically adjusted.
[0040] In addition, such as Figures 7 to 8 As shown, the thickness of the armature in different cavities can be the same or different. If the thickness of the armature portion in the first cavity is different from the thickness of the armature portion in the second cavity, and the volumes of the first and second cavities are different, then the armature portion in the larger of the two cavities will be thicker. By controlling the armature thickness, the sound frequency band of the speaker unit can be dynamically adjusted to achieve full-band coverage. When the armature thickness is different, the thickness of the armature portion within the same cavity is consistent; only the thicknesses of the two armature portions located in different cavities are different. In practical applications, by adjusting the armature thickness and the position of the support plate within the receiving cavity, the stiffness and resonant point of the speaker module's driving components can be changed, thereby altering the frequency response of the speaker module and achieving dynamic control of its frequency response.
[0041] Furthermore, the magnetic components in this embodiment of the invention consist of a first pair of magnets disposed in the first cavity and a second pair of magnets disposed in the second cavity. The first and second pairs of magnets are respectively disposed on both sides of the armature away from the support plate. When the speaker module is not working and the coil is not energized, the armature is located in the middle position of the magnet pair and maintains a balanced state. When an AC sound signal is applied to the coil, the armature is magnetized and moves back and forth with the magnets under the action of magnetism, driving the connecting rod and the diaphragm to move. The diaphragm compresses the air to radiate sound waves, which are then emitted through the sound tube.
[0042] When the speaker module is equipped with two coils, the two coils are loaded with sound signals in the same direction. In order to ensure that the armatures on the left and right sides of the support plate 2 are simultaneously pointing upwards or downwards to compress air, the magnetization directions of the two magnet pairs need to be opposite. Figures 9 to 10 The results of finite element simulation of the armature motion under this condition are shown. The armature state before the coil is energized is as follows: Figure 9 As shown, the armature remains balanced, and the state of the armature at a certain moment after the coil is energized is as follows. Figure 10 As shown, the movement of the armature causes the diaphragm to deflect.
[0043] When a coil is set in the speaker module and the volumes of the first cavity and the second cavity are different, in order to ensure that the armatures on the left and right sides of the support plate 2 are simultaneously extruding air upwards or downwards, the magnetization directions of the two magnet pairs need to be opposite. Figures 11 to 12 The results of finite element simulation of the armature motion under this condition are shown. The armature state before the coil is energized is as follows: Figure 11 As shown, the armature remains balanced, and the state of the armature at a certain moment after the coil is energized is as follows. Figure 12 As shown, the armature's movement causes the diaphragm to deflect. When the first and second cavities have different volumes, the first and second diaphragms also differ in size; a larger diaphragm is housed in the larger cavity, and a smaller diaphragm in the smaller cavity. The larger cavity serves as the woofer, and the smaller cavity as the tweeter. The different frequency bands produced by the two cavities blend naturally at the sound outlet and propagate to the outside of the speaker module.
[0044] In addition, such as Figure 1 and Figure 4 As shown, the speaker module also includes a first magnetic ring 91 disposed in the first cavity and a second magnetic ring 92 disposed in the second cavity. The first magnetic ring 91 surrounds the first magnet pair, and the second magnetic ring 92 surrounds the second magnet pair. The magnetic rings can effectively suppress high-frequency noise and play an anti-interference role.
[0045] In addition, a sound outlet tube 8 is fixedly installed on the top cover 11. The sound outlet tube 8 connects the outside of the first cavity and the receiving cavity, and the sound outlet tube 8 also connects the outside of the second cavity and the receiving cavity. The first cavity and the second cavity have different volumes. The sound outlet tube 8 is positioned close to the smaller cavity among the first cavity and the second cavity to improve the quality of high-frequency sound.
[0046] In addition to treating the sound tube 8 and the upper cover 11 as independent components, as described in the above embodiments, and assembling them later to obtain the speaker module, it is also possible to... Figure 13 and Figure 14 As shown, the sound outlet tube 8 and the upper cover 11 are integrally molded to reduce the number of assembly steps required. The position of the sound outlet tube 8 on the upper cover 11 can be adjusted according to changes in the volume of the first cavity and the second cavity.
[0047] Embodiments of the present invention also relate to an electronic device, including: a housing and the aforementioned speaker module disposed within the housing. The electronic device further includes: a device sound outlet; the device sound outlet is disposed near the sound outlet tube of the speaker module, or the sound outlet tube of the speaker module extends to the housing of the electronic device, and the sound outlet tube of the speaker module serves as the device sound outlet.
[0048] In addition, electronic devices include, but are not limited to, full-range sound-producing devices such as headphones and speakers.
[0049] The speaker module in this embodiment is consistent with the implementation details in the previous speaker module embodiment. The relevant technical details mentioned in the speaker module embodiment are still valid in this embodiment. In order to reduce repetition, they will not be repeated here.
[0050] Those skilled in the art will understand that the above embodiments are specific embodiments for implementing the present invention, and in practical applications, various changes in form and detail may be made without departing from the spirit and scope of the present invention.
Claims
1. A speaker module, characterized by, include: An upper cover and a lower cover together form a receiving cavity; a support plate is provided inside the receiving cavity, and the support plate divides the receiving cavity into a first cavity and a second cavity; The cavity is further provided with a first diaphragm and a second diaphragm, the first diaphragm being located in the first cavity and the second diaphragm being located in the second cavity, and the first diaphragm and the second diaphragm being fixed on both sides of the support plate respectively; An integrated armature is also provided inside the cavity. The armature passes through the support plate and is fixed on the support plate. A magnetic element and a coil are provided on the armature. The coil magnetizes the armature when it is energized. The magnetized armature reciprocates under the magnetic force of the magnetic element. The armature is fixed with a first connecting rod and a second connecting rod. The first connecting rod is located in the first cavity, and the first connecting rod drives the first diaphragm to vibrate with the reciprocating motion of the armature. The second connecting rod is located in the second cavity, and the second connecting rod drives the second diaphragm to vibrate with the reciprocating motion of the armature. The support plate is also provided with a through hole, which connects the first cavity and the second cavity.
2. The speaker module of claim 1, wherein The number of coils is two, with one coil located in the first cavity and the other coil located in the second cavity.
3. The speaker module of claim 1, wherein, The first cavity and the second cavity have different volumes. When there is only one coil, the coil is located in the larger of the first cavity and the second cavity.
4. The speaker module of claim 1, wherein, The number of through holes can be one or more. When there are multiple through holes, the through holes are distributed on the upper and lower sides of the armature.
5. The speaker module of claim 1, wherein, The magnetic components are: a first magnet pair disposed in the first cavity and a second magnet pair disposed in the second cavity, wherein the first magnet pair and the second magnet pair are respectively disposed on both sides of the armature away from the support plate.
6. The speaker module of claim 1, wherein, The first cavity and the second cavity have different volumes, and the thickness of the armature portion in the first cavity is different from the thickness of the armature portion in the second cavity. The armature portion in the larger of the first and second cavities is thicker.
7. The speaker module of claim 1, wherein, A sound outlet tube is fixedly installed on the upper cover. The sound outlet tube connects the first cavity to the outside of the receiving cavity, and the sound outlet tube also connects the second cavity to the outside of the receiving cavity. The first cavity and the second cavity have different volumes, and the sound outlet tube is positioned close to the smaller of the first cavity and the second cavity.
8. The speaker module of claim 7, wherein, The sound outlet tube and the upper cover are independent of each other, and the sound outlet tube and the upper cover are fixed by an assembly method; Alternatively, the sound outlet tube and the top cover are integrally formed.
9. An electronic device, comprising: It includes: a housing and a speaker module as described in any one of claims 1 to 8 disposed within the housing.