A collimated light coupling leveling device and method

Abstract

The application relates to the technical field of optical communication, in particular to a collimated light coupling leveling device and method. The device comprises a block and a light spot imaging unit, which are used for adjusting the coupling between a light emitting chip and a collimated lens, the light paths of the light emitting chip, the collimated lens, the block and the light spot imaging unit are located on the same horizontal plane, and the collimated light is output after the outgoing light of the light emitting chip is injected into the collimated lens; the block can move horizontally between the collimated lens and the light spot imaging unit, so that the collimated light is partially blocked at different positions; the light spot imaging unit is used for imaging the collimated light partially blocked by the block, so that the position of the collimated lens is adjusted according to the position parameters of the light spot, and the collimated light coupling leveling is completed. The application can quickly and accurately complete the light path coupling leveling between the light emitting chip and the collimated lens.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, and in particular to a collimating optical coupling leveling device and method. Background Technology

[0002] In optical communication, collimating lenses are needed to convert the light emitted from the optical emitting chip into collimated light to ensure that the signal strength is not reduced during propagation due to scattering or optical path deviation. The ideal collimated light has the following form: Figure 1 As shown, the light emitted from the light emitting chip 100 passes through the collimating lens 101 to form collimated light in a horizontal direction. The collimated light is parallel to the ideal light path shown by the dotted line, and the center of the theoretical light path is located at the center of the collimated light spot.

[0003] However, since the light-emitting chip and the collimating lens are independent optical devices, when the optical paths of the two devices are not fully coupled, it may cause the collimated beam to defocus or deviate. Figure 2 The diagram illustrates several typical propagation patterns of the actual light beam after passing through the collimating lens 101. The dotted line represents the ideal optical path, the dashed line represents the ideal collimated light spot shape, defocus and vertical skew are shown in the side view, and horizontal skew is shown in the top view. In real-world scenarios, these typical conditions may coexist, such as simultaneous defocus and skew, or upward skew. These propagation patterns cannot meet the requirements of optical communication; therefore, coupling and leveling of the light-emitting chip and the collimating lens are necessary.

[0004] Existing collimation light coupling and leveling techniques commonly employ two schemes. The first involves placing a collimating lens at the front end of the light-emitting chip and a collimator at the distal end of the collimating lens. Coupling the collimating lens maximizes the light received in the collimator, thus completing the coupling. The second involves placing a collimating lens at the front end of the light-emitting chip and a spot analyzer at the distal end of the collimating lens. Coupling the collimating lens minimizes the spot size on the spot analyzer, thus completing the coupling. Both coupling methods have drawbacks. The first method, lacking image display, relies on manual and experience-based coupling of invisible light, resulting in very low efficiency. The second method, with its large receiving range of the spot analyzer, cannot distinguish whether the collimated light is incident at an angle or horizontally. This leads to the light output from the collimating lens randomly scattering in various directions (up, down, left, right).

[0005] Therefore, how to overcome the shortcomings of existing technologies and solve the problem of inconvenient coupling and leveling of light emitting chips and collimating lenses is a problem to be solved in this technical field. Summary of the Invention

[0006] In view of the above-mentioned defects or improvement needs of the existing technology, the present invention solves the problem of inconvenient coupling and leveling of the light emitting chip and the collimating lens.

[0007] The embodiments of the present invention adopt the following technical solutions:

[0008] In a first aspect, the present invention provides a collimating light coupling leveling device, specifically comprising a stop block 200 and a light spot imaging unit 300. The device is used to adjust the coupling between a light emitting chip 100 and a collimating lens 101. Specifically, the optical paths of the light emitting chip 100, the collimating lens 101, the stop block 200, and the light spot imaging unit 300 are located on the same horizontal plane. The emitted light from the light emitting chip 100 enters the collimating lens 101 and outputs collimated light. The stop block 200 can move horizontally between the collimating lens 101 and the light spot imaging unit 300 to partially block the collimated light at different positions. The light spot imaging unit 300 is used to image the collimated light after it is partially blocked by the stop block 200, so as to adjust the position of the collimating lens 101 according to the position parameters of the light spot, thereby completing the collimating light coupling leveling.

[0009] Preferably, the device further includes a first adjustment frame 104. Specifically, the light emitting chip 100 is disposed on the first adjustment frame 104, and the first adjustment frame 104 is used to adjust the level of the light emitting chip 100.

[0010] Preferably, the device further includes a CCD 400, specifically: the CCD 400 is located on the same horizontal plane on the same side of the light emitting chip 100 and the collimating lens 101, and can move horizontally along the optical path direction of the collimated light; the CCD 400 is used to acquire images of the light emitting chip 100 and the collimating lens 101 to assist in adjusting the levelness of the light emitting chip 100 and the collimating lens 101.

[0011] Preferably, the device further includes a tray 201 and a second adjusting frame 202. Specifically, the stop block 200 is disposed on the tray 201 and can move on the upper surface of the tray 201; the second adjusting frame 202 is used to adjust the levelness of the tray 201 so that the plane in which the stop block 200 moves is horizontal.

[0012] Preferably, the device further includes a suction head 105 and a third adjustment frame, wherein the suction head 105 is disposed on the third adjustment frame; the suction head 105 is used to adsorb the collimating lens 101; and the third adjustment frame is used to adjust the position of the suction head 105 so as to adjust the position of the collimating lens 101.

[0013] Preferably, when the stop block 200 is set in the first position, the spot imaging unit 300 is used to obtain the first Y coordinate of the spot center; when the stop block 200 is set in the second position, the spot imaging unit 300 is used to obtain the second Y coordinate of the spot center, wherein the first position and the second position are on the collimated light path between the collimating lens 101 and the spot imaging unit 300, and partially block the collimated light; the third adjustment frame is used to adjust the vertical position of the collimating lens 101 up and down so that the difference between the first Y coordinate and the second Y coordinate is lower than a preset threshold; provided that the difference between the first Y coordinate and the second Y coordinate is lower than the preset threshold, the third adjustment frame is also used to adjust the horizontal position of the collimating lens 101 so as to adjust the X width and Y width of the spot parameters to the minimum.

[0014] On the other hand, the present invention provides a method for collimating light coupling leveling, specifically using the collimating light coupling leveling device provided in the first aspect, specifically including: adjusting the positions of the light emitting chip 100 and the collimating lens 101 to minimize the X-width and Y-width of the collimated light spot, and the Y-coordinate of the spot center located between the maximum value of the Y-coordinate system of the spot imaging unit 300 and 0; setting the block 200 in a first position to obtain the first Y-coordinate of the spot center, and then setting the block 200 in a second position to obtain the second Y-coordinate of the spot center, wherein the first position and the second position are on the collimated light path between the collimating lens 101 and the spot imaging unit 300, and partially blocking the collimated light; adjusting the collimating lens 101 up and down, and repeatedly obtaining the first Y-coordinate and the second Y-coordinate after each adjustment, so that the difference between the first Y-coordinate and the second Y-coordinate is lower than a preset threshold; adjusting the horizontal position of the collimating lens 101, and on the premise that the difference between the first Y-coordinate and the second Y-coordinate is lower than the preset threshold, adjusting the X-width and Y-width of the spot parameters to the minimum.

[0015] Preferably, adjusting the positions of the light emitting chip 100 and the collimating lens 101 specifically includes: adjusting the levelness of the light emitting chip 100 and the collimating lens 101 respectively, so that their optical paths are horizontal and coupled; coupling the outgoing optical path of the collimating lens 101 and the incoming optical path of the spot imaging unit 300, so that the collimated light output from the collimating lens 101 is incident on the spot imaging unit 300 and meets the position requirements.

[0016] Preferably, the adjustment of the level of the light emitting chip 100 and the collimating lens 101 respectively includes: moving the CCD 400 to the position of the light emitting chip 100 for observation, adjusting the first adjustment frame 104 so that the light emitting chip 100 is displayed horizontally in the CCD 400; moving the CCD 400 to the position of the collimating lens 101 for observation, and adjusting the third adjustment frame so that the collimating lens 101 adsorbed by it is displayed horizontally in the CCD 400.

[0017] Preferably, when the light emitting chip is in a device housing, the adjustment of the level of the light emitting chip 100 and the collimating lens 101 specifically includes: moving the CCD 400 to the position of the device housing sidewall 107 for observation; adjusting the first adjustment frame 104 so that the upper or lower edge of the device housing sidewall 107 appears horizontal in the CCD 400; using the suction head 105 to lift the collimating lens 101 above the device housing sidewall 107; then moving the CCD 400 to the position of the collimating lens 101 for observation; adjusting the third adjustment frame so that the collimating lens 101 adsorbed by it appears horizontal in the CCD 400; and then vertically lowering the collimating lens 101 to the corresponding optical path position inside the device housing.

[0018] Compared with the prior art, the beneficial effects of the embodiments of the present invention are as follows: the light spot shape is visualized and the light spot parameters are automatically measured by using the light spot imaging unit, so as to more accurately and intuitively determine the parallelism and direction of the current collimated light. By using the block to assist in the measurement, the Y coordinate of the light spot after being blocked at different positions is compared to determine whether the collimated light is ideal, thereby quickly and accurately adjusting the optical path coupling between the complete light emitting chip and the collimating lens. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments of the present invention will be briefly described below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0020] Figure 1 A schematic diagram of the ideal state of collimated light;

[0021] Figure 2 This is a typical propagation mode of the actual light beam after passing through collimating lens 101;

[0022] Figure 3 A schematic diagram of a collimating optical coupling leveling device provided in an embodiment of the present invention;

[0023] Figure 4 A schematic diagram illustrating the usage of a collimating optical coupling leveling device provided in an embodiment of the present invention;

[0024] Figure 5 A schematic diagram illustrating the usage of a collimating optical coupling leveling device provided in an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the optical path and spot position when the optical path deviates.

[0026] Figure 7A schematic diagram of the spot image and spot parameters presented by the spot imaging unit 300;

[0027] Figure 8 A schematic diagram of another collimating optical coupling leveling device provided in an embodiment of the present invention;

[0028] Figure 9 A schematic diagram of another collimating optical coupling leveling device provided in an embodiment of the present invention;

[0029] Figure 10 A schematic diagram of another collimating optical coupling leveling device provided in an embodiment of the present invention;

[0030] Figure 11 A schematic diagram of another collimating optical coupling leveling device provided in an embodiment of the present invention;

[0031] Figure 12 A flowchart of a collimation optical coupling leveling method provided in an embodiment of the present invention;

[0032] Figure 13 This is a schematic diagram illustrating a usage scenario of a collimation optical coupling leveling method provided in an embodiment of the present invention;

[0033] Figure 14 This is a schematic diagram illustrating a usage scenario of a collimation optical coupling leveling method provided in an embodiment of the present invention;

[0034] The reference numerals in the attached figures are as follows:

[0035] 100: Light emitting chip; 101: Collimating lens; 102: Substrate; 103: Cooler; 104: First adjustment frame; 105: Suction head; 106: UV adhesive; 107: Device housing sidewall.

[0036] 200: Stop block, 201: Support plate, 202: Second adjustment bracket

[0037] 300: Light spot imaging unit; 301: Light probe; 302: Display.

[0038] 400: CCD. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0040] This invention is an architecture of a specific functional system. Therefore, the specific embodiments mainly describe the functional logic relationship of each structural module, and do not limit the specific software and hardware implementation methods.

[0041] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] Example 1:

[0043] To address the inconvenience of coupling and leveling the light-emitting chip and collimating lens in current technical solutions, this invention provides a collimating light coupling and leveling device that can couple collimated light into… Figure 1 The ideal state shown.

[0044] like Figure 3 The diagram shown is a schematic diagram of the device structure provided in an embodiment of the present invention. The device includes a stop block 200 and a light spot imaging unit 300. The device is used to adjust the coupling between the light emitting chip 100 and the collimating lens 101.

[0045] The optical paths of the light-emitting chip 100, collimating lens 101, block 200, and spot imaging unit 300 are located on the same horizontal plane. The emitted light from the light-emitting chip 100 enters the collimating lens 101 and outputs collimated light. To ensure the collimated light is parallel and horizontally emitted, the emitted light path of the light-emitting chip 100 and the transmitted light path of the collimating lens 101 need to be on the same horizontal plane. To allow for blocking at different positions of the collimated light during subsequent adjustments, the block 200 is located on the same horizontal plane as the other components, i.e., on the optical path between the collimating lens 101 and the spot imaging unit 300. To obtain a spot image, the spot imaging unit 300 must also be located on this horizontal plane, serving as the endpoint of the optical path. In certain specific scenarios, for the light-emitting chip 100 encapsulated within a device housing, the horizontality of the light-emitting chip 100 can also be indirectly determined by the horizontality of the upper or lower edge of the sidewall of the device housing.

[0046] The stop block 200 can move horizontally between the collimating lens 101 and the spot imaging unit 300 to partially block the collimated light at different positions. In the device provided in this embodiment, the moving stop block 200 assists in leveling the collimated light in the Y direction. Specifically, when the stop block 200 is set in the first position, the spot imaging unit 300 is used to obtain the first Y coordinate of the spot center; when the stop block 200 is set in the second position, the spot imaging unit 300 is used to obtain the second Y coordinate of the spot center. The first and second positions are on the collimated light path between the collimating lens 101 and the spot imaging unit 300, and partially block the collimated light.

[0047] like Figure 4 and Figure 5As shown, the block 200 is moved to the first position and the second position respectively. The Y coordinates of the light spot center are the first Y coordinate (hereinafter referred to as Y1) and the second Y coordinate (hereinafter referred to as Y2), respectively. The bold part indicates the diameter of the light spot in the Y direction. Since the ideal collimated light is parallel light and is horizontally incident into the light spot imaging unit 300, the part blocked by the block 200 is the same at any position. Therefore, the Y coordinates of the light spot center should coincide when the block 200 is placed in different positions. However, in the cases of positive defocus, negative defocus, upward tilt, and downward tilt, such as Figure 6 As shown in the diagram, the dashed line represents the position of the block 200 and the optical path in the second position. It can be seen that because the light is not parallel or there is a vertical deviation, the portion blocked varies at different positions, resulting in different light spot positions. Therefore, there will be a deviation between the Y1 and Y2 coordinates. The greater the deviation of the collimated light, the greater the difference between Y1 and Y2. Therefore, the difference between the two can be used to determine whether the collimated light is coupled and leveled. The block 200 is only centimeter in size, allowing for easy movement and operability.

[0048] The spot imaging unit 300 is used to image the collimated light beam partially blocked by the block 200, so as to adjust the position of the collimating lens 101 according to the position parameters of the spot, and complete the collimated light coupling leveling. In this embodiment, in order to use the block 200 for spot coupling leveling, it is necessary to accurately obtain the values ​​of Y1 and Y2. On the other hand, since the ideal collimated light is parallel and perpendicular to the spot imaging unit 300, the spot is equivalent to the perpendicular section of the beam, while the deflected collimated light is not perpendicular to the spot imaging unit 300, and the spot is equivalent to the oblique section of the beam. Therefore, after eliminating the negative defocus case by comparing the difference between Y1 and Y2, the ideal collimated light has the smallest X-direction width and Y-direction width relative to the deflected collimated light. Therefore, during coupling leveling, the size of the X-width and Y-width of the spot can be used to determine whether the collimated light is deflected, so it is also necessary to accurately obtain the X-width and Y-width data. In order to obtain the spot parameters more accurately and intuitively, the device provided in this embodiment uses the spot imaging unit 300 to obtain the spot pattern. Figure 7 As shown, the light spot imaging unit 300 can intuitively present the light spot image and automatically and accurately acquire the X width, Y width, and light spot center coordinates Y1 and Y2 when the stop block 200 is in two positions, etc. By adjusting the position of the collimating lens, the X width and Y width are minimized, and the difference between Y1 and Y2 is within an acceptable range, indicating that the current collimated light is a horizontal and parallel ideal collimated light, thus completing the coupling and leveling of the collimated light. In specific implementations, such as... Figure 8 As shown, the light spot imaging unit 300 may include a light probe 301 for receiving light signals and a display 302 for displaying light spot images.

[0049] Based on the above-described device, it can be supplemented and adjusted according to different usage requirements or actual scenarios in different specific application scenarios, so as to facilitate the spatial position adjustment of each component in the device. Where there is no conflict, one or more components can be selected and combined with the above-described technical solutions.

[0050] Since both the light-emitting chip and the collimating lens are precision optical components, requiring high adjustment accuracy, an adjustment frame can be used to assist in adjusting their positions. Commonly used adjustment frames in optical equipment include fine-tuning components, enabling high-precision position adjustments.

[0051] like Figure 9 As shown, the device also includes a first adjustment bracket 104. The light-emitting chip 100 is located on the substrate 102, and the first adjustment bracket 104 is used to adjust the level of the light-emitting chip 100, ensuring that the optical path of the light emitted by the light-emitting chip 100 is horizontal. Furthermore, to prevent the light-emitting chip 100 from overheating, the device also includes a cooler 103, located on the substrate 102. The first adjustment bracket 104 and the collimating lens 101 are located on the cooler 103 to provide cooling for the light-emitting chip 100. Furthermore, to ensure the stability of the light-emitting chip 100 during leveling, the device also includes the substrate 102, on which the light-emitting chip 100 is placed. The level of the substrate 102 is adjusted by the first adjustment bracket 104, thereby indirectly modulating the level of the light-emitting chip 100.

[0052] To facilitate the movement of the aligned lens 101, such as Figure 9 As shown, the system also includes a suction head 105 and a third adjustment frame. The suction head 105 is mounted on the third adjustment frame and is used to attach the collimating lens 101. The third adjustment frame is used to adjust the position of the system 105 to adjust the position of the collimating lens 101. Specifically: the third adjustment frame is used to adjust the vertical position of the collimating lens 101 so that the difference between the first Y coordinate and the second Y coordinate is lower than a preset threshold; provided that the difference between the first Y coordinate and the second Y coordinate is lower than the preset threshold, the third adjustment frame is also used to adjust the horizontal position of the collimating lens 101 to minimize the X width and Y width of the light spot parameters.

[0053] In practical implementation, to facilitate leveling of devices such as the light-emitting chip 100, collimating lens 101, stop block 200, and suction head 105, and to ensure that the horizontality does not change when moving again after leveling, auxiliary moving devices such as the first adjusting frame 104, the second adjusting frame 202, and the third adjusting frame can use a six-dimensional fine-tuning frame. The six-dimensional fine-tuning frame can decompose the displacement into six dimensions: positive X, negative X, positive Y, negative Y, positive Z, and negative Z. It moves only along one dimension at a time, so that the movement of the device will not produce angular sway that may cause changes in horizontality.

[0054] Furthermore, in practical use, in order to keep the collimating lens 101 in a stable position after each adjustment, such as... Figure 9 As shown, UV adhesive 106 can also be used for initial fixation of the collimating lens 101 to prevent further offset after coupling and leveling. After completing the entire coupling and leveling process, the UV adhesive 106 is cured to fix the collimating lens 101 in the final adjusted position. In typical implementation scenarios, the offset distance that the collimating lens 101 needs to adjust is generally 3-5 μm. The typical adhesive thickness for fixing with UV adhesive is 50 μm, and the elasticity and extensibility of the adhesive can meet the adjustment requirements. After the collimating lens 101 is leveled, the adhesive is immediately irradiated with a UV lamp. The adhesive can cure within milliseconds, fixing the position of the collimating lens 101. At the same time, since the coefficient of thermal expansion of the adhesive does not change significantly in liquid and solid states, it will not pull down or lift the lens, and the optical path after collimation and coupling will not change.

[0055] When the stop block 200 is moved, if there is a deviation in the horizontal height of the two positions of the stop block 200, the collected spot position data will also be incorrect. To ensure that the two positions of the stop block 200 are horizontal, such as... Figure 10 As shown, the device also includes a tray 201 and a second adjusting frame 202. A stop block 200 is mounted on the tray 201 and can move on the upper surface of the tray 201. The second adjusting frame 202 is used to adjust the levelness of the tray 201 so that the plane in which the stop block 200 moves is horizontal. Furthermore, when the stop block 200 moves, moving it along the direction of the collimated light path can minimize the error before and after movement. Therefore, positioning devices such as grooves or guide rails corresponding to the collimated light path can also be provided on the surface of the tray 201 to ensure the consistency of collimated light blocking before and after the stop block 200 moves, thereby improving the accuracy of coupling and leveling.

[0056] Furthermore, because the light-emitting chip 100 and the collimating lens 101 are small in size and require high adjustment precision, judging whether they are level with the naked eye may not be accurate. Therefore, as Figure 11As shown, the device further includes a Charge-coupled Device (CCD) 400. The CCD 400 is located on the same horizontal plane on the same side of the optical emission chip 100 and the collimating lens 101, and can move horizontally along the optical path direction of the collimated light, so as to obtain images of the optical emission chip 100 and the collimating lens 101, and assist in adjusting the horizontality of the optical emission chip 100 and the collimating lens 101. In a specific implementation, the CCD 400 can be moved to the position of the optical emission chip 100 or the collimating lens 101 for observation to obtain images of the optical emission chip 100 and the collimating lens 101. Further, the horizontality of the device can be finely adjusted through the image magnification function of the CCD 400, or the horizontality of the device can be more accurately judged through the image processing software supporting the CCD 400.

[0057] Further, in order to improve the adjustment accuracy and convenience, the first adjusting frame 104, the second adjusting frame 202, the third adjusting frame and the stopper 200 can all be connected to high-precision motors, and the motors are controlled to move and select through an external control system to complete the horizontality and position adjustment of each adjusting frame and the stopper.

[0058] As can be seen from the above technical solutions, the collimated light coupling and leveling device provided in this embodiment determines the defocusing and skewing conditions of the collimated light by moving the centimeter-level stopper, and obtains the spot parameters through the image display and automatic measurement functions of the spot imaging unit, so as to couple and level the collimated light more simply and accurately.

[0059] Embodiment 2:

[0060] Based on the device provided in Embodiment 1, the coupling and leveling between the optical emission chip and the collimating lens can be completed by the method for collimated light coupling and leveling provided in this embodiment.

[0061] As Figure 12 shown, the specific steps of the method provided in the embodiment of the present invention are as follows:

[0062] Step 1: Adjust the positions of the optical emission chip 100 and the collimating lens 101 to make the spot X width and Y width of the collimated light the smallest, and the Y coordinate of the spot center is between the maximum value and 0 of the Y coordinate system of the spot imaging unit 300.

[0063] During coupling and leveling, in order to obtain the spot coordinates using the spot imaging unit 300, the optical paths of the light emitting chip 100, collimating lens 101, and spot imaging unit 300 are first pre-coupled to ensure that the collimated light spot falls within the spot imaging unit 300. During pre-coupling, the horizontality of the optical path also needs to be preliminarily adjusted: the X and Y widths of the spot are adjusted to their minimum to avoid vertical and horizontal skew; the Y coordinate of the spot center is adjusted to be between the maximum value of the Y coordinate system of the spot imaging unit 300 and 0, so that the spot imaging unit 300 can be used in subsequent steps to obtain the accurate Y coordinate value of the spot center.

[0064] Step 2: Set the block 200 to the first position, obtain the first Y coordinate of the center of the light spot, and then set the block 200 to the second position, obtain the second Y coordinate of the center of the light spot. The first position and the second position are on the collimated light path between the collimating lens 101 and the light spot imaging unit 300, and partially block the collimated light.

[0065] After pre-coupling is completed, the stop 200 can be used for higher-precision horizontal coupling. By comparing the Y-coordinate of the spot center after the collimated light is blocked when the stop 200 is set in the first and second positions, it can be determined whether there is defocusing or vertical skew in the optical path of the current collimated light.

[0066] Step 3: Adjust the horizontal position of the collimating lens 101, and repeatedly obtain the first Y coordinate and the second Y coordinate after each adjustment, so that the difference between the first Y coordinate and the second Y coordinate is lower than the preset threshold.

[0067] As described in Example 1, the lower the difference between the first Y-coordinate (Y1) and the second Y-coordinate (Y2), the smaller the defocusing and skew of the collimated light. Ideally, Y1 and Y2 should be adjusted to be completely coincident, but in actual operation, it is generally impossible to achieve the ideal state. Therefore, a preset threshold can be set according to the actual required accuracy. It is acceptable when the difference between Y1 and Y2 is lower than the preset threshold.

[0068] Step 4: Adjust the horizontal position of the collimating lens 101. Provided that the difference between the first Y coordinate and the second Y coordinate is lower than the preset threshold, adjust the X width and Y width of the light spot parameters to the minimum.

[0069] After adjusting for defocus and Y-direction skew in step 3, the horizontal skew also needs to be adjusted. According to the description in Example 1, when there is no defocus, the X and Y widths are minimized, indicating that the collimated light is not skewed. Therefore, the left and right skew can be corrected by minimizing the X width. Ultimately, when the collimated light spot parameters simultaneously satisfy the minimum X and Y widths, and the difference between Y1 and Y2 remains within a preset threshold, a usable ideal collimated light state can be achieved, avoiding coupling to… Figure 2The undesirable state shown is illustrated.

[0070] After completing steps 1-4 provided in this embodiment, the device provided in embodiment 1 can be used to complete the coupling and leveling of the collimated light, thereby obtaining an ideal collimated light that meets the required accuracy.

[0071] To achieve pre-coupling of the optical path, the optical paths of the light emitting chip 100, collimating lens 101, and spot imaging unit 300 need to be coupled, that is, the optical paths of each of the three devices need to be coupled in pairs. In specific implementation, the positions of the light emitting chip 100 and collimating lens 101 in step 1 can be adjusted through the following process. First, adjust the levelness of the light emitting chip 100 and collimating lens 101 respectively, so that their optical paths are horizontal and coupled. Then, couple the output optical path of collimating lens 101 and the incident optical path of spot imaging unit 300, so that the collimated light (400) output from collimating lens 101 is incident on spot imaging unit 300 and meets the position requirements.

[0072] When the device uses a CCD 400 for auxiliary observation, the levelness of the pre-coupled light-emitting chip 100 and collimating lens 101 can be further improved through the CCD 400 display. First, the CCD 400 is moved to the position of the light-emitting chip 100 for observation, and the first adjustment frame 104 is adjusted so that the light-emitting chip 100 appears level within the CCD 400. Then, the CCD 400 is moved to the position of the collimating lens 101 for observation, and the third adjustment frame is adjusted so that the collimating lens 101 it attracts appears level within the CCD 400. Through the magnified display of the CCD 400 or the scale display of the image processing software, as well as the fine-tuning of each adjustment frame, more convenient and higher-precision levelness adjustment can be achieved. In each step of the method provided in this embodiment, the adjustment of each component in the device can be performed through the corresponding adjustment frame, and the accuracy can be confirmed through observation using the CCD 400.

[0073] Based on the above method, a complete example of collimated optical coupling leveling is provided below, which uses, for example... Figure 13 The device structure shown is used for coupling leveling. In actual implementation, the coupling leveling process can be completed by referring to the following example. Alternatively, the coupling leveling process can be adaptively adjusted according to actual needs, or combined with other measurement or observation methods to further improve the accuracy of coupling leveling. In the following practical scenario, based on actual needs and experimental test results, 5% of the first Y-coordinate is used as the preset threshold for the difference in the Y-coordinate of the spot center. In actual implementation, this value can also be adjusted according to actual needs.

[0074] The first step is to place the light emitting chip 100, collimating lens 101, and light spot imaging unit 300 on the same horizontal plane, and use the suction head 105 to hold the collimating lens 101. Other auxiliary components are placed according to actual needs.

[0075] The second step, following step 1, involves pre-coupling. The side-mounted CCD 400 can be moved left and right. First, move the CCD 400 to the position of the light-emitting chip 100 for observation, and adjust the first adjustment bracket 104 so that the light-emitting chip 100 appears horizontal within the CCD 400. Then, move the CCD 400 to the position of the collimating lens 101 for observation, and adjust the collimating lens 101 to be horizontal as well. Here, the suction head 105 is also mounted on the third adjustment bracket, allowing adjustment of the suction head 105 to indirectly adjust the collimating lens 101. The third adjustment bracket is not shown in the diagram to avoid obstruction; only a textual description is provided.

[0076] The third step involves applying UV adhesive 106 between the collimating lens 101 and the cooler 103 to couple the optical paths of the collimating lens 101 and the light-emitting chip 100. This allows the light (400) output from the collimating lens 101 to be incident on the photodetector 301 of the spot imaging unit 300, and the shape and parameters of the spot are displayed on the display 302. The spot parameters are then observed to minimize the X and Y widths, while ensuring the Y coordinate of the spot center is approximately between the maximum value of the probe and 0. This completes the pre-coupling.

[0077] Fourth, place the stop 200 between the collimating lens 101 and the light probe 301. Move the CCD 400 to the position of the support plate 201 for observation, and adjust the second adjustment frame 202 to make the support plate 201 horizontal.

[0078] Fifth step, according to step 2, set the block 200 to the first position and the second position respectively, read the spot parameters of the two positions, record the Y coordinate of the spot center in the spot parameters, and record the Y coordinates of position 1 and position 2 as Y1 and Y2 respectively.

[0079] Step 6: According to step 3, adjust the collimating lens 101 up and down, and repeatedly move the stop block 200 until the difference between Y1 and Y2 in step 5 is within 5% of Y1. The leveling is then complete.

[0080] Step 7: Following step 4, adjust the horizontal position of the collimating lens 101 and observe the light spot parameters to minimize the X and Y widths. Simultaneously, repeat step 6 to keep the difference between Y1 and Y2 within 5% of Y1. After coupling, cure the UV adhesive 106 at the collimating lens 101.

[0081] As can be seen from the above specific examples, by using the device provided in Example 1 according to the method provided in this embodiment, the coupling and leveling of collimated light can be conveniently and accurately completed.

[0082] Furthermore, the device provided in Embodiment 1 is also applicable to situations where the light-emitting chip 100 and the collimating lens 101 are obscured by a device housing. Currently, the commonly used device housing is a rectangular shell with an open top. After encapsulation with the device housing, the relative position of the light-emitting chip 100 and the sidewall of the device housing is fixed. Therefore, the levelness of the light-emitting chip 100 can be determined by the position and levelness of the sidewall 107 of the device housing. Specifically, the CCD 400 is moved to the position of the sidewall 107 of the device housing for observation, and the first adjustment bracket 104 is adjusted so that the upper or lower edge of the sidewall 107 of the device housing appears horizontal within the CCD 400. However, the collimating lens is located inside the housing of the device housing, and its relative position to the sidewall of the housing is uncertain, therefore, leveling cannot be observed from the side. In the method provided in this embodiment, such as... Figure 14 As shown, the collimating lens 101 is lifted above the side wall 107 of the device housing using the suction head 105, ensuring that the collimating lens 101 is not obstructed by the side wall when viewed from the side. The CCD 400 is then moved to the position of the collimating lens 101 for observation. The third adjustment bracket is adjusted so that the collimating lens 101 appears horizontal in the CCD 400. After leveling, the collimating lens 101 is vertically lowered to the corresponding optical path position inside the device housing. During the descent, only a downward vertical movement occurs, without any vertical rotation; therefore, the horizontality of the collimating lens remains unchanged. Subsequent steps are consistent with the adjustment method in the scenario without the device housing, using the moving stop to assist in further coupling and leveling, ultimately obtaining ideal collimated light. Using this method, even when the internal structure of the housing cannot be observed from the side, collimated light can be coupled to an ideal state, avoiding coupling to... Figure 2 The undesirable state shown is illustrated.

[0083] Furthermore, in scenarios where high-precision motors are used in the equipment to adjust the adjusting frame and stops, image recognition can be combined to automatically complete the coupling alignment of the light emitting chip 100 and the collimating lens 101. In practical implementation, the following process can be used to complete automatic coupling and leveling, or adjustments or improvements can be made according to actual needs.

[0084] The first step is to use a CCD 400 to acquire an image of the light emitting chip 100, and to determine the levelness of the light emitting chip 100 through image recognition. If it is not level, the tilt angle is automatically calculated and a high-precision motor is controlled to drive the light emitting chip 100 to adjust to a level position.

[0085] The second step is to use CCD 400 to acquire an image of the collimation chip 101, and use image recognition to determine the levelness of the collimation lens 101. If it is not level, the tilt angle is automatically calculated and a high-precision motor is controlled to drive the collimation lens 101 to adjust to level.

[0086] The third step is to acquire the light spot image and determine whether the X and Y widths of the light spot are at their minimum. If not, calculate the direction and distance that the collimating lens 101 should move based on the light spot parameters, control the high-precision motor to drive the collimating lens 101 to adjust its position, and adjust the X and Y widths of the light spot to their minimum to complete the pre-coupling.

[0087] The fourth step involves controlling a high-precision motor to set the stop blocks in the first and second positions, acquiring the corresponding Y1 and Y2 values, automatically calculating the difference between Y1 and Y2, and determining the direction and distance that the collimating lens 101 should move up and down based on the difference, until the difference between Y1 and Y2 is lower than a preset threshold, at which point the leveling process ends.

[0088] The fifth step involves acquiring a light spot image and determining if the X-width of the light spot is at its minimum. If not, the direction and distance that the collimating lens 101 should move left or right are calculated based on the light spot parameters. A high-precision motor is then controlled to adjust the position of the collimating lens 101, minimizing the X-width of the light spot. Simultaneously, the difference between Y1 and Y2 is kept within 5% of Y1. The coupling process then concludes.

[0089] Through the above steps, coupling leveling can be completed automatically. High-precision motors improve coupling leveling accuracy, and image recognition and automatic calculation improve coupling leveling efficiency, avoiding the phenomenon that manual coupling leveling requires repeated adjustments to achieve the ideal accuracy.

[0090] As can be seen from the above description of the technical solution and the implementation process in actual scenarios, the method provided by the present invention has the following beneficial effects.

[0091] 1. Set the stop block in two positions, and read the center coordinates Y1 and Y2 of the vertical direction of the light spot corresponding to the two positions respectively. Use the difference between the two to determine whether the collimated light is leveled. Since the stop block is only centimeter in size, it can be easily moved and is easy to operate.

[0092] 2. The spot parameters are precisely obtained through the spot imaging unit, ensuring that the adjusted spot image satisfies the minimum X and Y widths, and that the difference between Y1 and Y2 remains within a preset threshold. By simultaneously satisfying these parameters, the ideality of the collimated light is determined. This avoids coupling to… Figure 2 The undesirable state shown is illustrated.

[0093] 3. The method provided in this embodiment is also applicable to situations where the light-emitting chip and collimating lens are obscured by the device housing. Using this method, even when the internal structure of the housing cannot be observed from the side, the collimated light can still be coupled to an ideal state, avoiding coupling to... Figure 2 The undesirable state shown is illustrated.

[0094] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A collimated light coupling leveling device, characterized in that, The device includes a stop block (200) and a light spot imaging unit (300), and is used to adjust the coupling between the light emitting chip (100) and the collimating lens (101); The optical paths of the light emitting chip (100), collimating lens (101), block (200) and light spot imaging unit (300) are located on the same horizontal plane. The light emitted from the light emitting chip (100) enters the collimating lens (101) and outputs collimated light. The block (200) can move horizontally between the collimating lens (101) and the spot imaging unit (300) to partially block the collimating light at different positions; The light spot imaging unit (300) is used to image the collimated light after it is partially blocked by the block (200), so as to adjust the position of the collimating lens (101) according to the position parameters of the light spot and complete the collimating light coupling leveling. When the block (200) is set in the first position, the spot imaging unit (300) is used to obtain the first Y coordinate of the spot center; when the block (200) is set in the second position, the spot imaging unit (300) is used to obtain the second Y coordinate of the spot center, and the difference between the two is used to determine whether the collimated light is coupled and leveled; wherein, the first position and the second position are on the collimated light path between the collimating lens (101) and the spot imaging unit (300), and partially block the collimated light; The third adjustment bracket is used to adjust the vertical position of the collimating lens (101) up and down so that the difference between the first Y coordinate and the second Y coordinate is lower than a preset threshold. Provided that the difference between the first Y coordinate and the second Y coordinate is less than a preset threshold, the third adjustment frame is also used to adjust the horizontal position of the collimating lens (101) to minimize the X width and Y width of the light spot parameters.

2. The collimating optical coupling leveling device according to claim 1, characterized in that, The device also includes a first adjusting frame (104), specifically: The light emitting chip (100) is mounted on the first adjustment frame (104), which is used to adjust the level of the light emitting chip (100).

3. The collimating optical coupling leveling device according to claim 2, characterized in that, The device also includes a CCD (400), specifically: The CCD (400) is located on the same horizontal plane on the same side of the light emitting chip (100) and the collimating lens (101), and can move horizontally along the optical path direction of the collimated light; The CCD (400) is used to acquire images of the light emitting chip (100) and the collimating lens (101) to assist in adjusting the level of the light emitting chip (100) and the collimating lens (101).

4. The collimating optical coupling leveling device according to claim 1, characterized in that, The device also includes a tray (201) and a second adjusting frame (202), specifically: The stop (200) is disposed on the tray (201) and is movable on the upper surface of the tray (201); The second adjustment bracket (202) is used to adjust the level of the tray (201) so that the plane on which the stop block (200) moves is horizontal.

5. The collimating optical coupling leveling device according to claim 1, characterized in that, The device also includes a suction head (105), which is mounted on the third adjustment frame; The suction head (105) is used to adsorb the collimating lens (101); The third adjustment frame is used to adjust the position of the suction head (105) so as to adjust the position of the straight lens (101).

6. A method for collimating optical coupling and leveling, characterized in that, The collimating optical coupling leveling apparatus according to any one of claims 1-5 specifically includes: Adjust the positions of the light emitting chip (100) and the collimating lens (101) to minimize the X and Y widths of the collimated light spot, and make the Y coordinate of the spot center located between the maximum value of the Y coordinate system of the spot imaging unit (300) and (0); The block (200) is set in the first position to obtain the first Y coordinate of the center of the light spot, and then the block (200) is set in the second position to obtain the second Y coordinate of the center of the light spot. The first position and the second position are on the collimated light path between the collimating lens (101) and the light spot imaging unit (300), and partially block the collimated light. Adjust the collimating lens (101) up and down, and repeatedly obtain the first Y coordinate and the second Y coordinate after each adjustment, so that the difference between the first Y coordinate and the second Y coordinate is lower than a preset threshold. Adjust the horizontal position of the collimating lens (101) to minimize the X width and Y width of the light spot parameters, provided that the difference between the first Y coordinate and the second Y coordinate is lower than a preset threshold.

7. The collimating optical coupling leveling method according to claim 6, characterized in that, The adjustment of the positions of the light emitting chip (100) and the collimating lens (101) specifically includes: Adjust the level of the light emitting chip (100) and the collimating lens (101) respectively to make their optical paths horizontal and coupled; The outgoing light path of the collimating lens (101) and the incoming light path of the spot imaging unit (300) are coupled so that the collimated light output from the collimating lens (101) is incident on the spot imaging unit (300) and meets the position requirements.

8. The collimating optical coupling leveling method according to claim 7, characterized in that, The adjustment of the horizontality of the light emitting chip (100) and the collimating lens (101) specifically includes: The CCD (400) is moved to the position of the light emitting chip (100) for observation. The first adjustment frame (104) is adjusted so that the light emitting chip (100) is displayed horizontally in the CCD (400). The CCD (400) is moved to the position of the collimating lens (101) for observation. The third adjustment frame is then adjusted so that the collimating lens (101) attached to it appears horizontal within the CCD (400).

9. The method for collimating optical coupling and leveling according to claim 7, characterized in that, When the light-emitting chip has a device casing, the adjustment of the level of the light-emitting chip (100) and the collimating lens (101) specifically includes: The CCD (400) is moved to the position of the device housing sidewall (107) for observation. The first adjustment frame (104) is adjusted so that the upper or lower edge of the device housing sidewall (107) is displayed horizontally in the CCD (400). Use the suction head (105) to lift the collimating lens (101) above the side wall (107) of the device housing, then move the CCD (400) to the position of the collimating lens (101) for observation, adjust the third adjustment frame so that the collimating lens (101) it adsorbs is displayed horizontally in the CCD (400), and then lower the collimating lens (101) vertically to the corresponding optical path position in the device housing.

Images