A single-chip LCD projector

Abstract

This invention discloses a single-panel LCD projector, comprising: a housing, an optical engine assembly, and a heat dissipation assembly; the housing has an air inlet and an air outlet; the optical engine assembly is disposed within the housing, and includes a housing and a heat exchanger, the housing having an inner cavity and a mounting port communicating with the inner cavity; the heat exchanger includes a heat exchange substrate and a plurality of heat exchange fins disposed on the heat exchange substrate; the heat exchange substrate is disposed at the mounting port, and the heat exchange fins are disposed in the inner cavity; the heat dissipation assembly is disposed within the housing, and the heat dissipation assembly is detachably connected to the side of the heat exchange substrate away from the heat exchange fins, and at least partially corresponds to the air inlet or air outlet. The technical solution of this invention improves the structural flexibility of the single-panel LCD projector by placing the heat exchanger on the housing and detachably connecting the heat dissipation assembly to the heat exchanger. The shape and size of the heat exchanger can be designed according to the structure of the housing and the internal components of the housing. The heat dissipation assembly and the air inlet or air outlet on the housing can be flexibly arranged according to the space inside the housing.

Description

Technical Field

[0001] This invention relates to the field of projector technology, and in particular to a single-chip LCD projector. Background Technology

[0002] Currently, single-chip LCD projectors on the market have begun to use fully enclosed optical engines to achieve better dust protection. However, a large amount of heat inside the fully enclosed optical engine cannot be effectively dissipated to the outside of the engine in a timely manner, resulting in higher temperatures for the various optical components inside the fully enclosed optical engine.

[0003] Typically, an optical engine houses optical components and a circulating fan within its casing. A heat exchanger for heat exchange is also mounted on the casing. The circulating fan and heat exchanger form the internal cooling system of the optical engine, dissipating heat from the optical components and lowering their temperature. However, once the location of the heat exchanger on the optical engine casing is determined, the outer shell of a single-chip LCD projector needs to have corresponding air inlets or outlets. Due to limitations imposed by the structure of the optical engine casing and the installation positions of the optical components and circulating fan, the location and space available for the heat exchanger are limited, resulting in insufficient flexibility in the placement of the air inlets or outlets on the outer shell. Therefore, the existing structural design of single-chip LCD projectors suffers from low flexibility. Summary of the Invention

[0004] The main objective of this invention is to propose a single-chip LCD projector, which aims to solve the problem of low structural design flexibility of existing single-chip LCD projectors.

[0005] To achieve the above objectives, the present invention proposes a single-chip LCD projector, comprising:

[0006] The outer casing is equipped with an air inlet and an air outlet;

[0007] An optomechanical assembly is disposed within the housing; the optomechanical assembly includes a housing and a heat exchanger, the housing having an inner cavity and a mounting port communicating with the inner cavity; the heat exchanger includes a heat exchange substrate and a plurality of heat exchange fins disposed on the heat exchange substrate; the heat exchange substrate is disposed at the mounting port, and the heat exchange fins are disposed in the inner cavity.

[0008] A heat dissipation component is disposed inside the housing. The heat dissipation component is detachably connected to the side of the heat exchange substrate away from the heat exchange fins. The heat dissipation component is at least partially corresponding to the air inlet or the air outlet.

[0009] Preferably, the optomechanical assembly further includes an LCD screen and a first fan, both of which are disposed within the inner cavity. The first fan is used to drive the air in the inner cavity to flow sequentially through the LCD screen and the heat exchange fins.

[0010] Preferably, it further includes a thermally conductive layer disposed between the heat exchange substrate and the heat dissipation component.

[0011] Preferably, the heat exchange substrate is sealed to the mounting port, and the side of the heat exchange substrate away from the heat exchange fins is provided with a plurality of threaded blind holes. The heat dissipation assembly is provided with through holes corresponding to the threaded blind holes. The heat dissipation assembly also includes a threaded connector, which passes through the through holes and is threadedly connected to the threaded blind holes.

[0012] Preferably, the heat dissipation assembly includes a heat sink, one side of which abuts against and is connected to the heat exchange substrate; at least part of the side of the heat sink away from the heat exchange substrate corresponds to the air inlet or the air outlet.

[0013] Preferably, the heat dissipation assembly includes a heat sink, a heat pipe, and a heat-conducting substrate. The two ends of the heat pipe are fixedly connected to the heat sink and the heat-conducting substrate, respectively. The heat-conducting substrate is detachably connected to the side of the heat exchange substrate away from the heat exchange fins. The side of the heat sink away from the heat exchanger is at least partially opposite to the air inlet or the air outlet.

[0014] Preferably, the heat dissipation assembly includes a radiator, a heat pipe, a heat-conducting substrate, and a second fan. The two ends of the heat pipe are fixedly connected to the radiator and the heat-conducting substrate, respectively. The heat-conducting substrate is detachably connected to the side of the heat exchange substrate away from the heat exchange fins. The air intake of the second fan faces the air inlet of the housing, and the air outlet of the second fan faces the radiator.

[0015] Preferably, it further includes a controller disposed within the housing; a temperature sensor is provided on the inner side of the heat exchange substrate, and the controller is electrically connected to the temperature sensor and electrically connected to the second fan.

[0016] Preferably, the device further includes a semiconductor cooler, the cold end of which is detachably connected to the heat exchange substrate, and the hot end of which is connected to the heat dissipation assembly.

[0017] Preferably, the semiconductor cooler is surrounded by a heat-insulating sealing layer.

[0018] The present invention provides a single-chip LCD projector, comprising a housing, an optical engine assembly, and a heat dissipation assembly; the housing is provided with an air inlet and an air outlet; the optical engine assembly is disposed within the housing, comprising a housing and a heat exchanger, the housing being provided with an inner cavity and a mounting port communicating with the inner cavity, the heat exchanger comprising a heat exchange substrate and a plurality of heat exchange fins disposed on the heat exchange substrate; the heat exchange substrate is disposed at the mounting port, and the heat exchange fins are disposed in the inner cavity; the heat dissipation assembly is disposed within the housing, and the heat dissipation assembly is detachably connected to the side of the heat exchange substrate away from the heat exchange fins, and the heat dissipation assembly is at least partially corresponding to the air inlet or the air outlet. The technical solution of this invention involves placing the heat exchange fins of the heat exchanger within the inner cavity of the housing, allowing the fins to transfer heat from the housing to the heat exchange substrate of the heat exchanger. Furthermore, the heat dissipation assembly is detachably connected to the side of the heat exchange substrate away from the heat exchange fins, and at least partially corresponds to the air inlet or outlet on the housing, enabling heat transfer from the heat exchange substrate to the heat dissipation assembly, which is then discharged to the outside through the air inlet or outlet on the housing. Moreover, since the heat exchanger is located on the housing, its shape and size can be designed according to the structure of the housing and other components within it. The heat dissipation assembly and the air inlet or outlet on the housing can be flexibly arranged according to the space within the housing, improving the structural flexibility of the single-panel LCD projector. In addition, because the heat dissipation assembly is detachably connected to the heat exchanger, its specifications can be flexibly set according to the heat generated within the optical engine component housing, effectively ensuring the heat dissipation efficiency of the single-panel LCD projector. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of an embodiment of the single-chip LCD projector of the present invention.

[0021] Figure 2 This is a schematic diagram of the optical engine component of an embodiment of the single-chip LCD projector of the present invention.

[0022] Figure 3 This is a schematic diagram of the heat exchanger structure of an embodiment of the single-chip LCD projector of the present invention.

[0023] Figure 4 This is a schematic diagram of another embodiment of the single-chip LCD projector of the present invention.

[0024] Figure 5This is a schematic diagram of another embodiment of the single-chip LCD projector of the present invention.

[0025] Figure 6 This is a schematic diagram of another embodiment of the single-chip LCD projector of the present invention.

[0026] Explanation of icon numbers:

[0027] label name label name 1 Optomechanical components 4 Heat dissipation components 11 case 41 heat sink 12 heat exchanger 42 heat pipe 121 Heat exchange fins 43 Second fan 122 heat exchange substrate 5 semiconductor cooler 3 shell 6 Thermal insulation sealing layer 31 air inlet 7 thermal conductive layer 32 air vent

[0028] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0030] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0031] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0032] This invention proposes a single-chip LCD projector.

[0033] Reference Figures 1 to 6In one embodiment of the present invention, the single-chip LCD projector includes: an optical engine assembly 1, a housing 3, and a heat dissipation assembly 4. The housing 3 has an air inlet 31 and an air outlet 32; the optical engine assembly 1 is disposed within the housing 3; the optical engine assembly 1 includes a housing 11 and a heat exchanger 12, the housing 11 having an inner cavity and a mounting port communicating with the inner cavity; the heat exchanger 12 includes a heat exchange substrate 122 and a plurality of heat exchange fins 121 disposed on the heat exchange substrate 122; the heat exchange substrate 122 is disposed at the mounting port, and the heat exchange fins 121 are disposed within the inner cavity; the heat dissipation assembly 4 is disposed within the housing 3, and the heat dissipation assembly 4 is detachably connected to the side of the heat exchange substrate 122 away from the heat exchange fins 121, and the heat dissipation assembly 4 at least partially corresponds to the air inlet 31 or the air outlet 32 ​​on the housing 3.

[0034] The aforementioned single-panel LCD projector includes a heat exchanger 12 comprising a heat exchange substrate 122 and a plurality of heat exchange fins 121 disposed on the heat exchange substrate 122. By disposing the heat exchange fins 121 of the heat exchanger 12 in the inner cavity of the housing 11, the heat exchange fins 121 transfer heat from the inner cavity of the housing 11 to the heat exchange substrate 122 of the heat exchanger 12. Furthermore, the heat dissipation assembly 4 is detachably connected to the side of the heat exchange substrate 122 away from the heat exchange fins 121, and at least a portion of the heat dissipation assembly 4 corresponds to the air inlet 31 or air outlet 32 ​​on the housing 3, enabling the heat on the heat exchange substrate 122 to be transferred to the heat dissipation assembly 4 and finally discharged to the outside through the air inlet 31 or air outlet 32 ​​on the housing 3. Furthermore, the heat exchanger 12 is mounted on the housing 11, and its shape and size can be designed according to the structure of the housing 11 and the internal components. The heat dissipation assembly 4 and the air inlet 31 or outlet 32 ​​on the housing 3 can be flexibly arranged according to the space within the housing 3, improving the structural flexibility of the single-panel LCD projector. In addition, since the heat dissipation assembly 4 is detachably connected to the heat exchanger 12, the specifications of the heat dissipation assembly 4 can be flexibly set according to the heat generation within the housing 11 of the optical engine assembly 1, effectively ensuring the heat dissipation efficiency of the single-panel LCD projector. For example, if the heat generation within the housing 11 is large, a larger heat dissipation assembly 4 can be used to ensure the heat dissipation efficiency of the single-panel LCD projector.

[0035] Preferably, the optomechanical assembly 1 further includes an LCD screen and a first fan, both of which are located within the inner cavity. The first fan drives the air within the inner cavity to flow sequentially through the LCD screen and the heat exchange fins 121. When the single-chip LCD projector is working, the LCD screen modulates light into a projected image and generates a large amount of heat. The first fan circulates the air within the inner cavity of the housing 11, transferring the heat from the LCD screen to the heat exchanger 12, and then dissipating it through the heat dissipation assembly 4, ensuring that the temperature of the LCD screen is maintained within a suitable operating range.

[0036] refer to Figures 1 to 2 The plurality of heat exchange fins 121 are disposed inside the heat exchange substrate 122 and located within the inner cavity of the housing 11, while the heat exchange substrate 122 is located outside the housing 11. The side of the heat exchange substrate 122 away from the heat exchange fins 121 is detachably connected to the heat dissipation assembly 4. In the above structure, the heat exchange fins 121 are used for heat exchange with the air inside the housing 11 to transfer the heat inside the housing 11 to the heat exchange substrate 122 and the heat dissipation assembly 4. Compared with existing single-panel LCD projectors, the heat exchange substrate 122 in this invention is detachably connected to the heat dissipation assembly 4 on its outer side. The heat dissipation assembly 4 and the corresponding air inlet 31 or air outlet 32 ​​can be flexibly arranged according to the space inside the housing 3.

[0037] Preferably, the single-chip LCD projector further includes a thermally conductive layer 7, which is disposed between the heat exchange substrate 122 and the heat dissipation assembly 4. In the above structure, the thermally conductive layer 7 can be made of materials with excellent thermal conductivity, such as thermally conductive grease, thermally conductive silicone, thermally conductive graphite, or copper. The thermally conductive layer 7 has the function of assisting heat conduction and improving the thermal conductivity efficiency at the connection interface between the heat exchange substrate 122 and the heat dissipation assembly 4.

[0038] Preferably, the heat exchange substrate 122 is sealed to the mounting port, and the side of the heat exchange substrate 122 away from the heat exchange fins 121 is provided with a plurality of threaded blind holes. The heat dissipation assembly 4 is provided with through holes corresponding to the threaded blind holes. The heat dissipation assembly 4 also includes a threaded connector, which passes through the through hole and is threaded to the threaded blind holes.

[0039] Specifically, the heat exchange substrate 122 has a mounting surface on the side away from the heat exchange fins 121. This mounting surface has several threaded blind holes, which are non-through threaded holes. These threaded blind holes allow for the installation of the heat dissipation assembly 4 using threaded connectors (such as screws) without affecting the sealing performance of the optomechanical assembly 1. The heat dissipation assembly 4 is secured to the mounting surface of the heat exchanger 12 using threaded connectors. The heat exchange substrate 122 can also be made of thermally conductive materials such as aluminum or aluminum alloy. The heat exchange substrate 122 provides a standardized connection point between the heat exchanger 12 and the heat dissipation assembly 4. Based on the appearance design and performance indicators, different structures of the heat dissipation assembly 4 can be flexibly selected for the entire machine.

[0040] Preferably, refer to Figure 1 The heat dissipation assembly 4 includes a heat sink 41, one side of which abuts against and is connected to the heat exchange substrate 122; at least part of the side of the heat sink 41 away from the heat exchange substrate 122 corresponds to the air inlet 31 or the air outlet 32.

[0041] In the above structure, the heat sink 41 is made of aluminum or aluminum alloy and includes multiple heat dissipation fins spaced apart. The heat sink 41 is fastened to the heat exchange substrate 122 by a threaded connector. There is a thermally conductive layer 7 between the heat sink 41 and the heat exchange substrate 122. At least part of the side of the heat sink 41 away from the heat exchange substrate 122 corresponds to the air inlet 31 or the air outlet 32 ​​to improve heat dissipation efficiency.

[0042] In another embodiment, reference Figure 4 The heat dissipation assembly 4 includes a heat sink 41, a heat pipe 42, and a heat-conducting substrate (not shown in the figure). The two ends of the heat pipe 42 are fixedly connected to the heat sink 41 and the heat-conducting substrate, respectively. The heat-conducting substrate is detachably connected to the side of the heat exchange substrate 122 away from the heat exchange fins 121. The side of the heat sink 41 away from the heat exchanger 12 is at least partially opposite to the air inlet 31 or the air outlet 32.

[0043] In the above structure, the heat dissipation component 4 includes a heat sink 41, a heat pipe 42, and a heat-conducting substrate. The heat sink 41 is extended to a suitable air inlet 31 or air outlet 32 ​​via the heat pipe 42, thereby improving the installation flexibility of the heat sink 41 and further enhancing the structural flexibility of the heat exchanger 12, heat dissipation component 4, air outlet 32, and air inlet 31 of the single-panel LCD projector. Preferably, the heat pipe 42 is a flexible heat pipe, which can be stretched and deformed, making the installation flexibility of the heat sink 41 even better.

[0044] In another embodiment, reference Figure 5 The heat dissipation assembly 4 includes a heat sink 41, a heat pipe 42, a heat-conducting substrate, and a second fan 43. The two ends of the heat pipe 42 are fixedly connected to the heat sink 41 and the heat-conducting substrate, respectively. The heat-conducting substrate is detachably connected to the side of the heat exchange substrate 122 away from the heat exchange fins 121. The air intake of the second fan 43 faces the air inlet 31 on the outer casing 3, and the air outlet of the second fan 43 faces the heat sink 41.

[0045] In the above structure, the heat sink 41 and the second fan 43 work together to improve the heat dissipation capacity of the single LCD projector. The exhaust port of the second fan 43 faces the heat sink 41, and by increasing the air flow speed, the heat of the heat sink 41 is carried away. Since the heat sink 41 and the heat-conducting substrate are connected by a heat-conducting pipe 42, the positions of the air inlet 31 and the air outlet 32 ​​can be flexibly set on the housing 3.

[0046] In another embodiment, reference Figure 6The heat dissipation assembly 4 includes a heat sink 41, a heat-conducting substrate, and a second fan 43. The heat sink 41 is fixedly connected to the heat-conducting substrate, and the side of the heat-conducting substrate away from the heat sink 41 is detachably connected to the heat exchange substrate 122. The mounting plane of the heat-conducting substrate and the heat exchange substrate 122 are parallel. The air intake of the second fan 43 faces the air inlet 31 of the outer casing 3, and the air outlet of the second fan 43 faces the heat sink 41.

[0047] In the above structure, similarly, the radiator 41 and the second fan 43 work together to improve the heat dissipation capacity of the single LCD projector. The exhaust port of the second fan 43 faces the radiator 41, and by increasing the air flow speed, the heat of the radiator 41 is carried away.

[0048] Preferably, the single-chip LCD projector further includes a controller (not shown in the figure) disposed inside the housing 3; a temperature sensor (not shown in the figure) is provided on the inner side of the heat exchange substrate 122, and the controller is electrically connected to the temperature sensor and electrically connected to the second fan 43.

[0049] In the above structure, the temperature sensor is used to detect the temperature inside the heat exchange substrate 122 (i.e., the temperature inside the cavity of the housing 11). The controller controls the rotation speed of the second fan 43 based on the temperature detected by the temperature sensor, thereby controlling the heat dissipation efficiency and ensuring that the temperature of the LCD screen is within the operating range. Optionally, the controller can also be electrically connected to the first fan so that the controller controls the rotation speed of the first fan based on the temperature detected by the temperature sensor, thereby changing the airflow rate inside the housing 11. Furthermore, the controller can also be electrically connected to both the first fan and the second fan 43 simultaneously to control the rotation speeds of both fans 43 at the same time.

[0050] Preferably, the single-chip LCD projector further includes a semiconductor cooler 5, the cold end of which is detachably connected to the heat exchange substrate 122, and the hot end of which is connected to the heat dissipation assembly 4.

[0051] In the above structure, the Thermo Electric Cooler (TEC) 5 is made using the Peltier effect of semiconductor materials. The Peltier effect refers to the phenomenon that when a direct current passes through a thermocouple composed of two semiconductor materials, one end absorbs heat and the other end releases heat. The TEC includes P-type and N-type pairs (groups) connected together by electrodes and sandwiched between two ceramic electrodes. When current flows through the TEC, the heat generated by the current is transferred from one side of the TEC to the other, creating a hot end side and a cold end side on the TEC. For a high-brightness monolithic LCD projector, the LCD screen inside the housing 11 of its optomechanical assembly 1 generates a lot of heat, and the temperature of the LCD screen needs to be controlled within a low range. Active cooling is achieved by adding a TEC between the heat exchanger 12 and the heat dissipation assembly 4. The cold end side of the TEC contacts the heat exchange substrate 122 through the thermally conductive layer 7, and the hot end side of the TEC contacts the external heat dissipation assembly 4, thereby further improving the heat dissipation efficiency of the monolithic LCD projector and keeping the interior of the optomechanical assembly 1 within a stable and low temperature range.

[0052] Preferably, the thermoelectric cooler 5 is surrounded by a heat-insulating sealing layer 6. In the above structure, the heat-insulating sealing layer 6 improves the sealing between the cold end side of the thermoelectric cooler 5 and the heat exchange substrate 122, and the heat insulation strip 6 can improve the efficiency of heat conduction and heat transfer between the cold end side of the thermoelectric cooler 5 and the heat exchange substrate 122.

[0053] Preferably, the air inlet 31 includes several air inlets, and the air outlet 32 ​​includes several air outlets. The air inlet 31 and the air outlet 32 ​​are located on opposite sides of the outer casing 3. In the above structure, the air inlets and outlets are located on opposite sides of the outer casing 3, creating airflow between the interior and exterior spaces of the outer casing 3. The optical engine assembly 1 is located between the air inlet 31 and the air outlet 32. The heat inside the optical engine assembly 1 is transferred to the heat dissipation assembly 4 outside the optical engine assembly 1 through the heat exchanger 12. The flowing air then carries away the heat from the heat dissipation assembly 4. At the same time, the flowing air can also carry away the residual heat between the optical engine assembly 1 and the outer casing 3, further improving the overall heat dissipation efficiency of the single-chip LCD projector.

[0054] The single-chip LCD projector provided by this invention utilizes a heat dissipation component 4 detachably connected to the heat exchanger 12 to effectively dissipate internal heat from the optical engine component 1, thereby improving the heat dissipation effect of the single-chip LCD projector. Furthermore, the heat dissipation component 4 and the air inlet 31 or outlet 32 ​​on the housing 3 can be flexibly arranged according to the space within the housing 3, no longer limited to the location of the heat exchanger 12 on the housing 11, thus improving the structural flexibility of the single-chip LCD projector. In addition, in this invention, heat dissipation components 4 of different structures and specifications can be used according to heat dissipation requirements, and the air inlet 31 and outlet 32 ​​can be placed in less conspicuous and more easily concealed locations on the housing 3 according to the appearance design of the housing 3, which not only improves heat dissipation efficiency but also meets the operational requirements of the single-chip LCD projector.

[0055] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A monolithic LCD projector characterized by comprising: include: The outer casing is equipped with an air inlet and an air outlet; An optomechanical assembly is disposed within the housing; the optomechanical assembly includes a housing and a heat exchanger, the housing having an inner cavity and a mounting port communicating with the inner cavity; the heat exchanger includes a heat exchange substrate and a plurality of heat exchange fins disposed on the heat exchange substrate; the heat exchange substrate is disposed at the mounting port, and the heat exchange fins are disposed in the inner cavity. A heat dissipation component is disposed inside the housing. The heat dissipation component is detachably connected to the side of the heat exchange substrate away from the heat exchange fins. The heat dissipation component is at least partially opposite to the air inlet or the air outlet. The heat dissipation assembly includes a heat sink, a heat pipe, and a heat-conducting substrate. The two ends of the heat pipe are fixedly connected to the heat sink and the heat-conducting substrate, respectively. The heat-conducting substrate is detachably connected to the side of the heat exchange substrate away from the heat exchange fins. The side of the heat sink away from the heat exchanger corresponds at least partially to the air inlet or the air outlet. The heat pipe is a flexible heat pipe that can be stretched and deformed.

2. The monolithic LCD projector of claim 1, wherein, The optomechanical assembly also includes an LCD screen and a first fan. The LCD screen and the first fan are both located inside the inner cavity. The first fan is used to drive the air inside the inner cavity to flow sequentially through the LCD screen and the heat exchange fins.

3. The monolithic LCD projector of claim 1, wherein, It also includes a thermally conductive layer disposed between the heat exchange substrate and the heat dissipation component.

4. The monolithic LCD projector of claim 1, wherein, The heat exchange substrate is sealed to the mounting port. The side of the heat exchange substrate away from the heat exchange fins is provided with a plurality of threaded blind holes. The heat dissipation assembly is provided with through holes corresponding to the threaded blind holes. The heat dissipation assembly also includes a threaded connector, which passes through the through holes and is threadedly connected to the threaded blind holes.

5. The monolithic LCD projector of any of claims 1 to 4, wherein, The heat dissipation assembly includes a radiator, one side of which abuts against and is connected to the heat exchange substrate; at least part of the side of the radiator away from the heat exchange substrate corresponds to the air inlet or the air outlet.

6. The single panel LCD projector of any one of claims 1 to 4, wherein, The heat dissipation assembly includes a radiator, a heat pipe, a heat-conducting substrate, and a second fan. The two ends of the heat pipe are fixedly connected to the radiator and the heat-conducting substrate, respectively. The heat-conducting substrate is detachably connected to the side of the heat exchange substrate away from the heat exchange fins. The air intake of the second fan faces the air inlet, and the air exhaust of the second fan faces the radiator.

7. The monolithic LCD projector of claim 6, wherein, It also includes a controller located inside the housing; a temperature sensor is provided on the inner side of the heat exchange substrate, and the controller is electrically connected to the temperature sensor and electrically connected to the second fan.

8. The monolithic LCD projector of any one of claims 1 to 4, wherein, It also includes a semiconductor cooler, the cold end of which is detachably connected to the heat exchange substrate, and the hot end of which is connected to the heat dissipation assembly.

9. The monolithic LCD projector of claim 8, wherein, The semiconductor cooler is surrounded by a heat-insulating sealing layer.

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