Chip power consumption simulation method and simulation system

Abstract

The application discloses a chip power consumption simulation method and a simulation system. The simulation method comprises the following steps: obtaining a power consumption cloud atlas of a chip to be simulated; and simulating the power consumption distribution of the chip to be simulated in a preset region of a workpiece based on the power consumption cloud atlas. The chip power consumption simulation method can simulate the power consumption simulation diagram of chips with different sizes and different power consumptions, the accuracy of the simulated power consumption distribution diagram is higher, and simulation does not need to be performed on a mainboard to which the chip to be simulated is welded during the simulation process.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more specifically, to a chip power consumption simulation method and simulation system. Background Technology

[0002] Laptop cooling designs typically employ a heat pipe + fan + fin configuration or a ventilated cooling system (VCS) + fan + fin configuration, primarily relying on the fan to dissipate heat from the laptop system. As computer users increasingly demand higher processing speeds, chip temperature becomes a key indicator affecting user performance. Due to the complexity of chip packaging and uneven power density distribution, the design requirements for cooling modules are very high. Furthermore, in traditional laptop designs, the initial cooling module design lacks a motherboard and chip, and prototype verification relies solely on heating blocks for simulation, resulting in low accuracy. Alternatively, the cooling module is designed after the motherboard is developed, leading to a non-parallel development cycle and significant time consumption. Summary of the Invention

[0003] In view of this, this application provides a chip power consumption simulation method and simulation system, the simulation method comprising:

[0004] Obtain the power consumption cloud map of the chip to be simulated;

[0005] Based on the power consumption cloud map, the power consumption distribution of the chip to be simulated is simulated in a preset area of ​​the workpiece.

[0006] Preferably, in the above simulation method, simulating the power consumption distribution of the chip to be simulated in a preset area of ​​the workpiece based on the power consumption cloud map includes:

[0007] Based on the power consumption cloud map, generate scan path information;

[0008] Based on the scanning path information, the laser heating device is controlled to heat the preset area of ​​the workpiece to form the power consumption distribution of the chip to be simulated.

[0009] Preferably, in the above simulation method, generating scan path information based on the power consumption cloud map includes:

[0010] Based on the power consumption cloud map, an equal power consumption stripe map is generated;

[0011] Based on the equal power consumption stripe pattern, the power consumption cloud map is divided into multiple sequentially arranged first stripe sub-regions; wherein, in the length direction of the first stripe sub-region, the power consumption difference between two adjacent points does not exceed a set threshold.

[0012] The scan path information is generated based on the isoelectric stripe pattern.

[0013] Preferably, in the above simulation method, controlling the laser heating device to heat the preset area of ​​the workpiece based on the scanning path information includes:

[0014] The preset area is divided into multiple second stripe-shaped areas that correspond one-to-one with the first stripe-shaped sub-area;

[0015] Based on the scan path information, the scan speed and power consumption of the second strip-shaped sub-region are determined;

[0016] Based on the scanning speed and the loading power consumption, the laser heating device is controlled to scan each of the second stripe sub-regions sequentially in the arrangement direction of the second stripe sub-regions, so as to heat the second stripe sub-regions and form the power consumption distribution of the second stripe sub-regions.

[0017] Preferably, in the above simulation method, based on the scanning speed and the loading power consumption, controlling the laser heating device to sequentially scan each of the second stripe sub-regions in the arrangement direction of the second stripe sub-regions includes:

[0018] In the extension direction of the second strip-shaped sub-region, the scanning speed of the laser heating device in the second strip-shaped sub-region is negatively correlated with the temperature of the region corresponding to the power consumption cloud map.

[0019] Preferably, in the above simulation method, based on the scanning speed and the loading power consumption, controlling the laser heating device to sequentially scan each of the second stripe sub-regions in the arrangement direction of the second stripe sub-regions includes:

[0020] In the extension direction of the second strip-shaped sub-region, the power consumption of the laser heating device when scanning the second strip-shaped sub-region is positively correlated with the temperature of the corresponding region of the power consumption cloud map.

[0021] This application provides a chip power consumption simulation system, which includes:

[0022] A controller is used to simulate the power consumption distribution of the chip to be simulated in a preset area of ​​the workpiece based on a power consumption cloud map.

[0023] A laser heating device is used to heat a preset area of ​​the workpiece under the control of the controller, so as to form the power consumption distribution of the chip to be simulated.

[0024] Preferably, in the above simulation system, the laser heating device includes:

[0025] A laser generator, used to emit laser light to a driving device;

[0026] A driving device is used to respond to scanning path information and control the laser to heat a preset area of ​​the workpiece to form the power consumption distribution of the chip to be simulated.

[0027] Preferably, in the above simulation system, the driving device includes:

[0028] Laser scanning device;

[0029] A guide rail is used to support the laser scanning device and change its position to perform laser heating in a preset area of ​​the workpiece, thereby forming the power consumption distribution of the chip to be simulated.

[0030] Preferably, in the above simulation system, the controller can also be used to control the laser generator to emit laser light to the driving device.

[0031] Based on the above, this application provides a chip power consumption simulation method and system. The simulation method includes: acquiring a power consumption cloud map of the chip to be simulated; and simulating the power consumption distribution of the chip to be simulated in a preset area of ​​a workpiece based on the power consumption cloud map. The above chip power consumption simulation method can simulate power consumption maps of chips of different sizes and power consumptions, and the accuracy of the simulated power consumption distribution map is higher. Furthermore, the simulation process does not require simulation on a motherboard on which the chip to be simulated is soldered. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0033] The structures, proportions, sizes, etc., shown in the accompanying drawings are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this application. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0034] Figure 1 A flowchart illustrating a chip power consumption simulation method provided in this application embodiment;

[0035] Figure 2 This is a flowchart of a method for simulating the power consumption distribution of a chip to be simulated in a preset area of ​​a workpiece based on a power consumption cloud map, according to another embodiment of this application.

[0036] Figure 3 This is a flowchart of a method for generating scan path information based on a power consumption cloud map in another embodiment of this application;

[0037] Figure 4 The power consumption cloud map is obtained based on a chip power consumption simulation method according to another embodiment of this application;

[0038] Figure 5 for Figure 4 A schematic diagram of multiple first stripe sub-regions on the power consumption cloud map shown;

[0039] Figure 6 This is a flowchart illustrating a method for controlling a laser heating device to heat a workpiece in a preset area based on scanning path information, according to another embodiment of this application.

[0040] Figure 7 A schematic diagram of a chip power consumption simulation system provided in another embodiment of this application;

[0041] Figure 8 A schematic diagram of a chip power consumption simulation system provided in another embodiment of this application;

[0042] Figure 9 This is a schematic diagram of laser scanning of a laser scanning device in another embodiment of this application. Detailed Implementation

[0043] The embodiments of this application will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0044] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0045] Figure 1 This is a flowchart illustrating a chip power consumption simulation method provided in this application embodiment. The simulation method includes:

[0046] Step S1: Obtain the power consumption cloud map of the chip to be simulated;

[0047] Step S2: Based on the power consumption cloud map, simulate the power consumption distribution of the chip to be simulated in a preset area of ​​the workpiece.

[0048] This application provides a chip power consumption simulation method comprising: acquiring a power consumption cloud map of the chip to be simulated; and, based on the acquired power consumption cloud map, simulating a power consumption distribution map of the chip to be simulated in a preset area of ​​a workpiece. The method for acquiring the power consumption cloud map of the chip to be simulated includes: obtaining the power consumption cloud map of the chip to be simulated through a prediction method, or the power consumption cloud map of the chip to be simulated can be directly provided by the manufacturer. The preset area of ​​the workpiece is a pre-determined area on the workpiece before simulation, and the size of the preset area is consistent with the size of the chip to be simulated. Based on the above chip power consumption simulation method, power consumption distribution maps of chips of different sizes and power consumptions can be simulated, and the accuracy of the simulated power consumption distribution maps is high. Furthermore, the simulation process does not require simulation on a motherboard on which the chip to be simulated is soldered.

[0049] refer to Figure 2 , Figure 2 This is a flowchart illustrating a method for simulating the power distribution of a chip to be simulated in a preset region of a workpiece based on a power cloud map, according to another embodiment of this application. In this chip power consumption simulation method, simulating the power distribution of the chip to be simulated in a preset region of a workpiece based on a power cloud map includes:

[0050] Step S21: Generate scan path information based on the power consumption cloud map;

[0051] Step S22: Based on the scanning path information, control the laser heating device to heat the workpiece in a preset area to form the power consumption distribution of the chip to be simulated.

[0052] In another embodiment of the chip power consumption simulation method of this application, after obtaining the power consumption cloud map, the specific steps of forming a power consumption distribution map of the chip to be simulated on the workpiece based on the power consumption cloud map include: generating scanning path information based on the power consumption cloud map, wherein the scanning path information generated based on the power consumption cloud map can be obtained by computer analysis or manual calculation, preferably by computer analysis, decomposing the power consumption cloud map into laser scanning path, scanning speed and loading power consumption, the decomposed scanning speed and loading power consumption are the scanning speed and loading power consumption in the entire power consumption cloud map, and the scanning path in this embodiment is a continuous straight line, the shape of the scanning path generated based on the power consumption cloud map includes: straight line or curve, wherein the shape of the scanning path includes but is not limited to the above shape, the optimal scanning path can be determined based on the power consumption cloud map, thereby simulating the power consumption distribution of the chip to be simulated; based on the scanning path information, controlling the laser heating device to heat in a preset area of ​​the workpiece to form the power consumption distribution of the chip to be simulated, the controller controlling the laser heating device to heat in the preset area is based on the laser scanning path in the scanning path information obtained by the controller heating in the preset area.

[0053] refer to Figures 3-5 , Figure 3This is a flowchart of a method for generating scan path information based on a power consumption cloud map in another embodiment of this application. Figure 4 The power consumption cloud map is obtained based on a chip power consumption simulation method according to another embodiment of this application. Figure 5 for Figure 4 The schematic diagram of multiple first stripe sub-regions on the power consumption cloud map shown is illustrated in another embodiment of the chip power consumption simulation method provided in this application. Based on the power consumption cloud map, scan path information is generated, including:

[0054] Step S211: Generate an equal power stripe pattern based on the power consumption cloud map;

[0055] Step S212: Reference Figure 5 Based on the equal power consumption fringe pattern, the power consumption cloud map is divided into multiple sequentially arranged first stripe sub-regions; wherein, in the length direction of the first stripe sub-region, the power consumption difference between two adjacent points does not exceed a set threshold.

[0056] Step S213: Generate scan path information based on the equal power stripe pattern.

[0057] refer to Figure 4 and Figure 5 In another embodiment of the chip power consumption simulation method provided in this application, the specific method for generating scan path information based on the power consumption cloud map includes: generating an equal power consumption stripe map based on the power consumption cloud map; dividing the power consumption cloud map into multiple sequentially arranged first stripe sub-regions based on the equal power consumption stripe map; wherein, in the length direction of the first stripe sub-region, the power consumption difference between two adjacent points does not exceed a set threshold; and generating scan path information based on the equal power consumption stripe map. The specific method for generating an isothermal stripe pattern based on a power consumption cloud map includes: generating an isothermal stripe pattern based on the power consumption cloud map; obtaining the isothermal stripe pattern corresponding to the power consumption cloud map based on the isothermal stripe pattern; dividing the power consumption cloud map into multiple sequentially arranged first stripe sub-regions based on the isothermal stripe pattern; requiring that the power consumption difference H between two adjacent points A and B in the first stripe sub-region does not exceed a set threshold along the length of the first stripe sub-region; this threshold can be set based on the overall power consumption difference value in the power consumption cloud map of the chip to be simulated; the distance between points A and B is not required, only that the power consumption difference H between points A and B does not exceed the threshold, and the threshold for each first stripe sub-region can be the same. In this embodiment, the set threshold for the power consumption cloud map is 3W; and generating scanning path information for scanning a preset area based on the isothermal stripe pattern and the divided power consumption cloud map with multiple first stripe sub-regions.

[0058] refer to Figure 6 , Figure 6This is a flowchart illustrating a method for controlling a laser heating device to heat a preset area of ​​a workpiece based on scanning path information, as described in another embodiment of this application. In a chip power consumption simulation method provided in another embodiment of this application, controlling a laser heating device to heat a preset area of ​​a workpiece based on scanning path information includes:

[0059] Step S221: Divide the preset area into multiple second stripe sub-regions that correspond one-to-one with the first stripe sub-region;

[0060] Step S222: Based on the scan path information, determine the scan speed and power consumption of the second stripe sub-region;

[0061] Step S223: Based on the scanning speed and power consumption, control the laser heating device to scan each of the second stripe regions sequentially in the arrangement direction of the second stripe regions, so as to heat the second stripe regions and form the power consumption distribution of the second stripe regions.

[0062] In another embodiment of this application, a chip power consumption simulation method is provided. The specific method for controlling a laser heating device to heat a preset area of ​​a workpiece based on scan path information to simulate the power consumption distribution of the chip to be simulated includes: dividing the preset area of ​​the workpiece into multiple second stripe-shaped sub-regions that correspond one-to-one with the first stripe-shaped sub-regions; wherein, when dividing the first stripe-shaped sub-regions, the position of the first stripe-shaped sub-region on the power consumption cloud map corresponds to the position of its corresponding second stripe-shaped sub-region in the preset area, and the positions of the multiple second stripe-shaped sub-regions correspond to the scan path in the scan path information; determining the scan speed and loaded power consumption of each second stripe-shaped sub-region based on the scan path information; and after obtaining the power consumption cloud map of the chip to be simulated, decomposing the power consumption cloud map into scan path information, scan speed, and loaded power consumption, which can be used based on the scan path information. The path information determines the position information of each second sub-region. Based on the position information of the second sub-region, the scanning speed and power consumption of each second sub-region can be determined. Based on the scanning speed and power consumption, the laser heating device is controlled to scan each second sub-region sequentially in the arrangement direction of the second sub-regions to heat the second sub-regions and form the power consumption distribution of the second sub-regions. The step of sequentially scanning each second sub-region includes: in the length direction of the second sub-region, the second sub-region has a first end and a second end. For two adjacent second sub-regions in the arrangement direction of multiple second sub-regions, after scanning one second sub-region from the first end to the second end, the other second sub-region is scanned from the second end to the first end.

[0063] In the chip power consumption simulation method of the above embodiment, based on the scanning speed and loading power consumption, the laser heating device is controlled to sequentially scan each of the second stripe regions in the arrangement direction of the second stripe region, including:

[0064] In the extension direction of the second stripe region, the scanning speed of the laser heating device in the second stripe region is negatively correlated with the temperature of the region corresponding to the power consumption cloud map.

[0065] In the chip power consumption simulation method of the above embodiment, based on the scanning speed and the loaded power consumption, the laser heating device is controlled to scan each of the second stripe sub-regions sequentially in the arrangement direction of the second stripe sub-regions to simulate the power consumption distribution of the chip to be simulated. In the simulation process, the laser heating device simulates the power consumption distribution of the chip to be simulated in the preset area of ​​the workpiece by laser heating. During the heating process, when the power consumption of the laser beam is set to a fixed value, different power consumptions on the power consumption cloud map can be simulated by changing the scanning speed of the laser beam. In the simulation process, the temperature of the area corresponding to the power consumption cloud map is negatively correlated with the scanning speed of the area corresponding to the preset area. That is, if the temperature to be simulated in the area corresponding to the power consumption cloud map is high, the scanning speed of the area corresponding to the preset area is slow; if the temperature to be simulated in the area corresponding to the power consumption cloud map is low, the scanning speed of the area corresponding to the preset area is fast.

[0066] In the chip power consumption simulation method of the above embodiment, based on the scanning speed and loading power consumption, the laser heating device is controlled to sequentially scan each of the second stripe regions in the arrangement direction of the second stripe region, including:

[0067] In the extension direction of the second sub-region, the power consumption of the laser heating device during scanning of the second sub-region is positively correlated with the temperature of the corresponding region in the power consumption cloud map.

[0068] In the chip power consumption simulation method of the above embodiment, based on the scanning speed and the loading power consumption, the laser heating device is controlled to sequentially scan each of the second stripe sub-regions in the arrangement direction of the second stripe sub-regions to simulate the power consumption distribution map of the chip to be simulated. During the scanning process, when the scanning speed of the laser beam is set to a fixed value, the loading power consumption of the laser beam can be changed to simulate different loading power consumptions at various positions in the preset area. When scanning the preset area of ​​the workpiece, if the scanning speed of the laser beam is a fixed value, the loading power consumption of the laser beam is continuously changed to heat and simulate different power consumptions on the first stripe sub-region of the corresponding power consumption cloud map on each of the second stripe sub-regions of the preset area. The loading power consumption during scanning on the second stripe sub-region is positively correlated with the temperature of the corresponding area of ​​the power consumption cloud map. That is, if the temperature to be simulated on the first stripe sub-region is high, the loading power consumption of the laser beam scanning the second stripe sub-region corresponding to the first stripe sub-region should be set higher; if the temperature to be simulated on the first stripe sub-region is low, the loading power consumption of the laser beam scanning the second stripe sub-region corresponding to the first stripe sub-region should be set lower.

[0069] refer to Figure 7 , Figure 7 This application provides a schematic diagram of the structure of a chip power consumption simulation system according to another embodiment of the present application. The chip power consumption simulation system provided in this application includes:

[0070] Controller 6 is used to simulate the power consumption distribution of the chip to be simulated in a preset area of ​​the workpiece based on the power consumption cloud map;

[0071] The laser heating device 7 is used to heat a preset area of ​​the workpiece based on the control of the controller 6, so as to form the power consumption distribution of the chip to be simulated.

[0072] refer to Figure 7 Another embodiment of this application provides a chip power consumption simulation system, which includes a controller 6 and a laser heating device 7. In this embodiment, the controller 6 is used to control the laser heating device 7 to simulate the power consumption distribution of the chip to be simulated in a preset area of ​​the workpiece based on a power consumption cloud map. The controller includes a display screen 61 and a main control box 62. The controller 6 can obtain the scanning path, scanning speed, and loading power consumption based on the power consumption cloud map, and can also obtain an isoelectric stripe pattern based on the power consumption cloud map. The laser heating device 7 is used to simulate the power consumption distribution of the chip to be simulated by laser heating in the preset area of ​​the workpiece under the control of the controller 6.

[0073] refer to Figure 8 , Figure 8 This application provides a schematic diagram of the structure of a chip power consumption simulation system according to another embodiment. In this chip power consumption simulation system according to another embodiment, the laser heating device 7 includes:

[0074] Laser generator 71 is used to emit laser light to drive device 8;

[0075] The driving device 8 is used to respond to the scanning path information and control the laser to heat the preset area of ​​the workpiece to form the power consumption distribution of the chip to be simulated.

[0076] In another embodiment of the simulation system of this application, the laser heating device 7 includes a laser generator 71 and a driving device 8. The laser generator 71 generates a laser beam with corresponding laser parameters based on laser parameters received from the controller 6, and then emits the laser beam to the driving device 8. The driving device 8 reflects the laser beam onto the surface of the workpiece based on the incident laser beam. The driving device 8, under the control of the controller 6, controls the laser to heat a preset area of ​​the workpiece, thereby simulating the power consumption distribution of the chip to be simulated. Specifically, in a first aspect, when the controller 6 keeps the laser scanning speed constant, the power consumption of the laser beam can be changed by altering the laser parameters transmitted to the laser generator 71, thereby simulating the power consumption distribution of the chip to be simulated. In a second aspect, when the controller 6 does not change the laser parameters and sets them to a constant value, the laser can be controlled to heat a preset area of ​​the workpiece by changing the scanning speed of the laser beam, thereby simulating the power consumption distribution of the chip to be simulated. In a third aspect, when the controller changes both the laser parameters transmitted to the laser generator 71 and the scanning speed of the laser beam, the laser can be controlled to heat a preset area of ​​the workpiece, thereby simulating the power consumption distribution of the chip to be simulated.

[0077] refer to Figure 8 Another embodiment of this application provides a chip power consumption simulation system. In this embodiment, the driving device 8 includes:

[0078] Laser scanning device 81;

[0079] The guide rail 9 is used to support the laser scanning device 81 and change the position of the laser scanning device to perform laser heating in a preset area of ​​the workpiece to form the power consumption distribution of the chip to be simulated.

[0080] In another embodiment of this application, a chip power consumption simulation system is provided, in which the driving device 8 includes a laser scanning device 81 and a guide rail 9. The laser scanning device 81 is a laser scanning galvanometer. The guide rail 9 includes an electric lifting column 91, an optical bench 92, and an industrial control computer 93. The electric lifting column 91 is used to support the optical bench 92 and change the height of the optical bench 92. The optical bench 92 is used to support the laser scanning device 81. The industrial control computer 93 is used to control the movement of the electric lifting column 91 and the optical bench 92, thereby changing the scanning path of the laser scanning device 81 and simulating the power consumption distribution of the chip to be simulated. When selecting the laser scanning device 81, the rotational inertia of the rotating motor of the laser scanning device 81 is required to be much smaller than the rotational inertia of the optical bench 92, so as to ensure that the laser scanning device 81 can change the optical path at a very fast speed and with high accuracy, and can complete the rapid back-and-forth movement of the beam.

[0081] Another embodiment of this application provides a chip power consumption simulation system. In this embodiment, the controller 6 can also be used to control the laser generator 71 to emit laser to the driving device 8.

[0082] refer to Figure 9 , Figure 9 This is a schematic diagram of laser scanning of a laser scanning device in another embodiment of this application. In a chip power consumption simulation system provided in another embodiment of this application, the controller 6 can also be used to control the laser generator 71 to emit laser light to the driving device 8. The laser scanning device 81 in this embodiment includes: an X-axis scanning galvanometer corresponding motor 2, a Y-axis scanning galvanometer corresponding motor 3, and a focusing lens 4. In the simulation process of the chip power consumption simulation system in this embodiment, the controller 6 determines the laser parameters of each second stripe sub-region of the preset area based on the chip power consumption distribution obtained from the power consumption cloud map. Based on the laser parameters, the controller controls the laser generator 71 to generate laser and transmits the laser beam 1 to the laser scanning device 81 through the optical fiber. The two scanning diaphragms of the X-axis and Y-axis in the laser scanning device 81 reflect the received laser beam 1 and focus it on the workpiece 5 through a focusing lens 4. After the position information is input to the controller 6, the X-axis scanning diaphragm corresponding motor 2 and the Y-axis scanning diaphragm corresponding motor 3 in the laser scanning device 81 drive the corresponding scanning diaphragms to rotate along the axis based on the rotation angle controlled by the controller 6, thereby changing the scanning path of the laser beam 1. The position information includes the loading power consumption information and scanning speed information of each second stripe sub-region in the preset area.

[0083] Based on the above, this application provides a chip power consumption simulation method and system. In this simulation method, based on the power consumption cloud map of the chip to be simulated, an isoelectric stripe map corresponding to the power consumption cloud map is obtained. Based on the isoelectric stripe map, the power consumption cloud map is divided into multiple sequentially arranged first stripe sub-regions. A preset area is divided into multiple second stripe sub-regions corresponding one-to-one with the first stripe sub-regions. Scanning path information is generated based on the power consumption cloud map. Based on the scanning path information, the scanning speed and loaded power consumption of the multiple second stripe sub-regions are determined. Based on the scanning speed and loaded power consumption, a laser heating device is controlled to scan the multiple second stripe sub-regions to simulate the power consumption distribution of the chip to be simulated. Based on the above simulation method, power consumption simulation maps of chips of different sizes and power consumptions can be simulated, and the accuracy of the simulated power consumption distribution map is higher. Moreover, during the simulation process, it is not necessary to perform the simulation on the motherboard on which the chip to be simulated is soldered.

[0084] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on its differences from other embodiments, and similar or identical parts between embodiments can be referred to interchangeably. For the systems disclosed in the embodiments, since they correspond to the methods disclosed in the embodiments, the descriptions are relatively simple, and relevant parts can be referred to the method section.

[0085] It should be noted that, in the description of this application, the drawings and embodiments are illustrative rather than restrictive. The same reference numerals throughout the embodiments identify the same structures. Additionally, for ease of understanding and description, the thicknesses of some layers, films, panels, regions, etc., may be exaggerated in the drawings. It is also understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element may be directly on the other element or there may be intermediate elements. Furthermore, "on" means positioning an element on or below another element, but does not inherently mean positioning it above another element according to the direction of gravity.

[0086] The terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the middle.

[0087] It should also be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0088] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for simulating chip power consumption, the simulation method comprising: Obtain the power consumption cloud map of the chip to be simulated; Based on the power consumption cloud map, generate scan path information; Based on the scanning path information, the laser heating device is controlled to heat the workpiece in a preset area to form the power consumption distribution of the chip to be simulated. Based on the power consumption cloud map, scan path information is generated, including: Based on the power consumption cloud map, an equal power consumption stripe map is generated; Based on the equal power consumption stripe pattern, the power consumption cloud map is divided into multiple sequentially arranged first stripe sub-regions; wherein, in the length direction of the first stripe sub-region, the power consumption difference between two adjacent points does not exceed a set threshold. The scan path information is generated based on the isoelectric stripe pattern.

2. The simulation method according to claim 1, wherein, based on the scanning path information, the laser heating device is controlled to heat the workpiece in a preset area, comprising: The preset area is divided into multiple second stripe-shaped areas that correspond one-to-one with the first stripe-shaped sub-area; Based on the scan path information, the scan speed and power consumption of the second strip-shaped sub-region are determined; Based on the scanning speed and the loading power consumption, the laser heating device is controlled to scan each of the second stripe sub-regions sequentially in the arrangement direction of the second stripe sub-regions, so as to heat the second stripe sub-regions and form the power consumption distribution of the second stripe sub-regions.

3. The simulation method according to claim 2, based on the scanning speed and the loading power consumption, controls the laser heating device to sequentially scan each of the second stripe sub-regions in the arrangement direction of the second stripe sub-regions, including: In the extension direction of the second strip-shaped sub-region, the scanning speed of the laser heating device in the second strip-shaped sub-region is negatively correlated with the temperature of the region corresponding to the power consumption cloud map.

4. The simulation method according to claim 2, wherein, based on the scanning speed and the loading power consumption, the laser heating device is controlled to sequentially scan each of the second stripe sub-regions in the arrangement direction of the second stripe sub-regions, comprising: In the extension direction of the second strip-shaped sub-region, the power consumption of the laser heating device when scanning the second strip-shaped sub-region is positively correlated with the temperature of the corresponding region of the power consumption cloud map.

5. A chip power consumption simulation system, using the method of any one of claims 1-4, wherein the simulation system comprises: The controller is used to generate scan path information based on the power consumption cloud map and simulate the power consumption distribution of the chip to be simulated in a preset area of ​​the workpiece. A laser heating device is used to respond to scanning path information and control the laser to heat a preset area of ​​the workpiece to form the power consumption distribution of the chip to be simulated.

6. The simulation system according to claim 5, wherein the laser heating device comprises: A laser generator, used to emit laser light to a driving device; A driving device is used to respond to scanning path information and control the laser to heat a preset area of ​​the workpiece to form the power consumption distribution of the chip to be simulated.

7. The simulation system according to claim 6, wherein the driving device comprises: Laser scanning device; A guide rail is used to support the laser scanning device and change its position to perform laser heating in a preset area of ​​the workpiece, thereby forming the power consumption distribution of the chip to be simulated.

8. The simulation system according to claim 6, wherein the controller is further configured to control the laser generator to emit laser light to the driving device.

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