Method, device, equipment and medium for determining coordinates of rectangular chip glue drawing

Abstract

This application relates to the field of chip glue technology, and more particularly to a method, apparatus, device, and medium for determining glue coordinates for rectangular chips. The method includes determining the glue area of ​​the rectangular chip; wherein the glue area is the maximum area allowed to be covered by the glue; obtaining a retracted area based on a preset ratio and the glue area; calculating a target area based on the glue area and the length and width of the retracted area; and determining glue coordinates based on the target area. The method provided in this application can quickly determine the glue position, prevent glue overflow and leakage during the glue application process, and improve the quality and performance of the camera module.

Description

Technical Field

[0001] The present application relates to the field of chip glue painting technology, and in particular to a method, device, equipment and medium for determining the coordinates of a rectangular chip glue painting. Background Art

[0002] During the production and assembly process of the camera module, it is often necessary to use a glue painting process to fix the chip. The glue painting process is to determine the glue painting coordinates on the chip, and then apply glue on the PCB (circuit board) according to the glue painting coordinates, and then fit the chip to the PCB. In theory, the glue painting center coincides with the chip center. You only need to scale a certain ratio according to the chip size to get the glue painting coordinates. However, in the actual glue painting process, due to the asymmetrical distribution of conductive contacts on the chip, it is necessary to manually adjust the glue painting position repeatedly according to the distribution position of the conductive contacts. The adjustment process is time-consuming and easily causes the glue painting track to deviate, resulting in uneven glue coating on the chip, glue overflow and leakage, and reducing the quality and performance of the camera module. Therefore, how to quickly and accurately determine the glue painting position is a technical problem that needs to be solved urgently. Summary of the Invention

[0003] The present application solves the technical problem of how to quickly and accurately determine the position of the glue drawing by providing a method, device, equipment and medium for determining the coordinates of the glue drawing on a rectangular chip.

[0004] In a first aspect, the present application provides a method for determining the coordinates of a rectangular chip glue drawing, the method comprising:

[0005] Determine the glue drawing area of ​​the rectangular chip; wherein the glue drawing area is the maximum area allowed to be covered by the glue;

[0006] Obtaining a retracted area based on a preset ratio and the glue area;

[0007] Calculating a target area based on the length and width of the glue area and the retracted area;

[0008] The coordinates of the glue are determined based on the target area.

[0009] Furthermore, determining the glue area of ​​the rectangular chip includes:

[0010] Determining whether there is a conductive contact on each side of the rectangular chip;

[0011] If not, draw the edge of the glue drawing area toward the center of the rectangle, 50 μm to 100 μm away from the edge corresponding to the rectangular chip;

[0012] If yes, draw the edge of the glue drawing area in the direction of the center of the rectangle, 100 μm to 150 μm away from the edge corresponding to the rectangular chip;

[0013] The four edges of the painting glue area intersect to form the painting glue area.

[0014] Furthermore, obtaining the retracted area based on the preset ratio and the drawing glue area includes: taking the center of the drawing glue area as a base point, obtaining the retracted area after the drawing glue area is reduced by the preset ratio.

[0015] Furthermore, the calculating the target area based on the length and width of the drawing glue area and the retracted area includes:

[0016] Calculating the difference in length between the long side and the wide side between the glue area and the retracted area;

[0017] Taking half of the sum of the difference between the long side length and the wide side length as the target indentation length;

[0018] The four sides of the glue area are translated toward the base point by the target retraction length to obtain the target area.

[0019] Furthermore, determining the coordinates of the glue drawing based on the target area includes:

[0020] Drawing the perpendicular bisectors of the wide side and the long side of the target area, as well as the diagonal line of the target area, respectively, wherein the perpendicular bisectors and the diagonal line intersect with the four sides of the rectangular area to form a cross shape;

[0021] The center of the cross-shaped figure is determined as the drawing glue center, and the coordinates of the drawing glue center and the coordinates of the eight endpoints of the cross-shaped figure are obtained as the drawing glue coordinates.

[0022] Furthermore, the step of obtaining the coordinates of the center of the drawing glue and the coordinates of the eight endpoints of the cross shape includes:

[0023] A drawing glue model is established by taking the center of the rice-shaped figure as the drawing glue center, and the coordinates of the eight endpoints of the rice-shaped figure are obtained through the drawing glue model.

[0024] Furthermore, the method further includes setting a glue drawing path based on the glue drawing coordinates; wherein the glue drawing path is on the rice character pattern.

[0025] In a second aspect, the present application provides a device for determining the coordinates of a rectangular chip glue drawing, the device comprising:

[0026] A glue drawing area determination module, configured to determine the glue drawing area of ​​the rectangular chip, wherein the glue drawing area is the maximum area allowed to be covered by the glue;

[0027] A retracted area determination module, configured to obtain a retracted area based on a preset ratio and the glue area;

[0028] a target area determination module, configured to obtain the target area based on the length and width of the drawing glue area and the retracted area;

[0029] The coordinate determination module is used to determine the coordinates of the painting glue based on the target area.

[0030] In a third aspect, the present application provides an electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the method steps described in any one of the first aspects are implemented.

[0031] In a fourth aspect, the present application provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements any of the method steps described in the first aspect.

[0032] One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:

[0033] In an embodiment of the present invention, the glue area of ​​the rectangular chip is first determined, wherein the glue area is the maximum area allowed to be covered by the glue; then, based on a preset ratio and the glue area, the retracted area is obtained; then, based on the glue area and the length and width of the retracted area, the target area is calculated; finally, the glue coordinates and the glue path are determined based on the target area, thereby realizing rapid determination of the glue position, preventing inconsistency in the glue center caused by differences in machine adjustment by different staff, thereby preventing glue overflow and leakage during the glue application process, and achieving the technical effect of improving the quality and performance of the camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be construed as limiting the present invention. Throughout the accompanying drawings, the same reference figures represent the same components.

[0035] In the attached figure:

[0036] Figure 1 The method steps in the embodiment of the present invention are shown Figure 1 ;

[0037] Figure 2 shows a schematic diagram of the chip structure in an embodiment of the present invention;

[0038] Figure 3 The method steps in the embodiment of the present invention are shown Figure 2 ;

[0039] Figure 4The method steps in the embodiment of the present invention are shown Figure 3 ;

[0040] Figure 5 A schematic diagram of the structure of the device in an embodiment of the present invention is shown;

[0041] Figure 6 A schematic diagram of an electronic structure device in an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0042] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0043] Example 1

[0044] The first embodiment of the present application solves the technical problem of how to quickly and accurately determine the position of the glue drawing in the prior art by providing a method for determining the glue drawing coordinates of a rectangular chip.

[0045] To solve the above technical problems, the overall technical solution of the embodiment of the present application is as follows:

[0046] Determine the glue area of ​​the rectangular chip; wherein the glue area is the maximum area allowed to be covered by the glue; obtain the retracted area based on a preset ratio and the glue area; calculate the target area based on the glue area and the length and width of the retracted area; and determine the glue coordinates based on the target area.

[0047] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0048] First, the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0049] This embodiment provides a method for determining the coordinates of the rectangular chip glue drawing, which is applied to the bonding of the rectangular chip and the PCB. The method includes the following steps: Figure 1 Steps S101 to S104 are shown.

[0050] Step S101 : determining a glue-drawing area of ​​the rectangular chip, wherein the glue-drawing area is the maximum area allowed to be covered by the glue.

[0051] Specifically, in order to avoid affecting the performance of the chip, glue cannot be applied to the conductive contacts on the rectangular chip. Therefore, the maximum area that the glue is allowed to cover should be determined first. When there are conductive contacts on the edge of the rectangular chip, the distance between the conductive contacts and the corresponding edges is generally 50μm-150μm. After the glue is applied, the glue extends to both sides with the glue track as the center by a distance of about 50μm-100μm. Therefore, in order to avoid glue overflow, first determine whether there are conductive contacts on the edges of each side of the rectangular chip; if not, draw the edge of the glue area 50μm-100μm away from the edge corresponding to the rectangular chip in the direction of the center of the rectangle; if so, draw the edge of the glue area 100μm-150μm away from the edge corresponding to the rectangular chip in the direction of the center of the rectangle; wherein, the four sides of the glue area correspond to the four sides parallel to the rectangular chip.

[0052] The above steps are described below with reference to specific embodiments. Figure 2 As shown in the figure, a rectangular chip is used for the implementation of this glue drawing method. First, the chip is identified and the four edges with conductive contacts are located. Since the glue will extend to both sides during the pressing or air drying process, to prevent glue overflow, the edges of the glue drawing area are drawn towards the center of the rectangular chip, 100μm-150μm away from the edges corresponding to the rectangular chip. The four edges intersect to form the glue drawing area, as shown in the attached figure. Figure 3 In the rectangle A shown, the four sides of the glue area are tangent to the inner side of the conductive contact. Rectangle A is the maximum area allowed to be covered by the glue.

[0053] Step S102 : obtaining a retracted area based on a preset ratio and the glue area.

[0054] Specifically, first, the shrinkage ratio is determined based on the extended area of ​​the colloid after the glue is applied, and then the shrinkage area after the glue application area is simulated and reduced according to the preset ratio is obtained with the center of the glue application area as the base point.

[0055] The DB (Die Bonding) glue used in this embodiment extends to both sides along the glue track after glue is applied. According to the experimental test of the extended area after glue is applied, the shrinkage ratio is determined to be 75%. Therefore, the center of the glue application area is used as the base point. Figure 3 Rectangle A in FIG is shrunk inward by 75% to obtain rectangle B, which is the shrunk area.

[0056] The space between the glue application area and the indented area, that is, the space between rectangles A and B, represents the area actually covered by the rectangular chip after the DB glue of this embodiment is applied to the glue application area. The glue extension width can be calculated based on this area. The glue application position is designed based on the glue extension width to avoid glue overflow on the chip surface after glue application.

[0057] Step S103 : acquiring a target area based on the length and width of the drawing glue area and the retracted area.

[0058] Specifically, first, the difference in the long side length and the wide side length between the glue area and the retracted area is calculated; half of the sum of the long side length difference and the wide side length difference is used as the target retracted length, which is the glue extension width mentioned in step S102; and the four sides of the glue area are translated toward the base point by the distance of the target retracted length to obtain the target area.

[0059] In this step, the four sides of the glue-drawing area are equidistantly translated toward the base point by the distance of the glue extension width. This ensures that when glue is drawn within the target area, the glue will overlap with the glue-drawing area after extension, avoiding glue leakage.

[0060] For example, this embodiment calculates the distance between the long sides of rectangle A and rectangle B, c = 0.54, and the distance between the short sides, d = 0.72, and uses L = (c + d) / 2 = 0.63 as the target indentation length. The four sides of rectangle A are translated toward the base point by the target indentation length L = 0.63 to obtain the target area. Figure 3 Rectangle C in .

[0061] Step S104 : determining the coordinates of the glue drawing based on the target area.

[0062] Specifically, the perpendicular bisectors of the wide and long sides of the target area, as well as the diagonal of the target area, are first drawn. These perpendicular bisectors and diagonals intersect with the four sides of the rectangular area to form a cross-shaped pattern. The center of the cross-shaped pattern is determined as the center of the adhesive strip. The chip pattern is simulated using CAD software, and the determined adhesive strip center is used as the origin. The coordinates of the eight endpoints of the cross-shaped pattern are calculated based on the origin to serve as the adhesive strip coordinates.

[0063] For example, CAD software simulation as shown in the attached Figure 4For the chip pattern shown, in the PR calibration mode, identify the target area, rectangle C. Connect the diagonals of rectangle C, and use the intersection of the diagonals as the center of the PR calibration, i.e., the origin. Draw the perpendicular bisectors of the wide and long sides of the target area. The perpendicular bisectors and diagonals intersect with the four sides of the rectangular area to form a cross-shaped pattern. The center point and eight endpoints of the cross-shaped pattern are used as the PR calibration coordinates.

[0064] To increase the glue volume, you can repeatedly apply glue along the line segments of the cross. Therefore, based on the glue coordinates, the glue path is set from point 1 to point 2 to point 13. Points 1, 4, 7, 10, and 13 are the center of the cross, and points 2, 3, 5, 6, 8, 9, 10, and 11 are the eight endpoints of the cross. The glue coordinates are directly calculated using CAD software, as shown in Table 1:

[0065] Table 1:

[0066]

[0067] This method first determines the glue application area and the indentation area to determine the glue coverage range. It then uses this area to determine the target area, and uses the target area to determine the glue application center and glue application path. This method then determines the specific glue application coordinates, thereby preventing glue overflow or leakage caused by asymmetric glue application coordinates. This method can quickly determine the glue application position, preventing inconsistent glue application centers due to differences in machine adjustments by different staff, thereby preventing glue overflow and leakage during the application process. This method achieves the technical effect of improving the quality and performance of the camera module, and is fast, efficient, accurate, and feasible.

[0068] Example 2

[0069] Based on the same inventive concept, this embodiment also provides a device for determining the coordinates of a rectangular chip glue drawing, the device comprising a glue drawing area determination module 201, a shrinking area determination module 202, a target area determination module 203, and a path and coordinate determination module 204. Figure 5 shown.

[0070] The glue area determination module 201 is configured to determine the glue area of ​​the rectangular chip, wherein the glue area is the maximum area allowed to be covered by the glue.

[0071] As an optional implementation, the glue area determination module 201 determines whether there is a conductive contact on the edge of each side of the rectangular chip; if not, the edge of the glue area is drawn toward the center of the rectangle at a distance of 50μm-100μm from the edge corresponding to the rectangular chip; if so, the edge of the glue area is drawn toward the center of the rectangle at a distance of 100μm-150μm from the edge corresponding to the rectangular chip; wherein the four sides of the glue area correspond to the four sides parallel to the rectangular chip.

[0072] The retracted area determining module 202 is configured to obtain the retracted area based on a preset ratio and the glue area.

[0073] As an optional embodiment, the shrinkage area determination module 202 determines the shrinkage ratio based on the extended area of ​​the colloid after the glue is applied, and then obtains the shrinkage area after simulating the glue area to be reduced by a preset ratio based on the center of the glue area.

[0074] The target area determination module 203 is configured to obtain a target area based on the length and width of the glue area and the retracted area.

[0075] As an optional implementation, the target area determination module 203 calculates the difference in long side length and wide side length between the glue area and the retracted area; then takes half of the sum of the long side length difference and the wide side length difference as the target retracted length; finally, translates the four sides of the glue area toward the base point by the distance of the target retracted length to obtain the target area.

[0076] The path and coordinate determination module 204 is configured to determine the glue coordinates and glue path based on the target area.

[0077] As an optional embodiment, the path and coordinate determination module 204 draws the perpendicular bisectors of the wide and long sides of the target area, as well as the diagonal of the target area. The perpendicular bisectors and diagonal lines intersect with the four sides of the rectangular area to form a cross-shaped figure, which is determined as the drawing glue path. A drawing glue model is established with the center of the cross-shaped figure as the origin. The coordinates of the eight endpoints of the cross-shaped figure are calculated using the drawing glue model as the drawing glue coordinates.

[0078] Example 3

[0079] Based on the same inventive concept, the third embodiment of the present application provides an electronic device, as shown in the attached Figure 6 As shown, it includes a memory 304, a processor 302 and a computer program stored in the memory 304 and executable on the processor 302. When the processor 302 executes the program, the steps of the above-mentioned method for determining the coordinates of the rectangular chip glue are implemented.

[0080] Among them, Figure 6 In the embodiment of the present invention, a bus architecture (represented by bus 300) is shown. Bus 300 may include any number of interconnected buses and bridges, and bus 300 links together various circuits including one or more processors represented by processor 302 and memory represented by memory 304. Bus 300 may also link together various other circuits such as peripherals, voltage regulators, and power management circuits, which are well known in the art and therefore will not be described further herein. Bus interface 306 provides an interface between bus 300 and receiver 301 and transmitter 303. Receiver 301 and transmitter 303 may be the same component, namely a transceiver, which provides a unit for communicating with various other devices over a transmission medium. Processor 302 is responsible for managing bus 300 and general processing, while memory 304 may be used to store data used by processor 302 when performing operations.

[0081] Example 4

[0082] Based on the same inventive concept, a fourth embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon. When the program is executed by a processor, the steps of the above-mentioned method for determining the coordinates of the rectangular chip glue are implemented.

[0083] The algorithm and display provided herein are not inherently related to any particular computer, virtual system or other device. Various general-purpose systems can also be used together with the teachings based on this. According to the above description, it is obvious that the structure required for constructing this type of system. In addition, the present invention is not directed to any specific programming language. It should be understood that various programming languages ​​can be utilized to realize the content of the present invention described herein, and the above description of specific languages ​​is for the purpose of disclosing the best mode of the present invention.

[0084] In the description provided herein, numerous specific details are described. However, it is understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques are not shown in detail so as not to obscure the understanding of this description.

[0085] Similarly, it should be understood that in order to streamline the present disclosure and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together into a single embodiment, figure, or description thereof. However, this disclosed method should not be interpreted as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the claims below, inventive aspects lie in less than all the features of the individual embodiments disclosed above. Accordingly, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim standing on its own as a separate embodiment of the invention.

[0086] Those skilled in the art will appreciate that the modules in the devices in the embodiments may be adaptively changed and arranged in one or more devices different from the embodiments. The modules or units or components in the embodiments may be combined into one module or unit or component, and in addition may be divided into multiple submodules or subunits or subcomponents. All features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed herein may be combined in any combination, except that at least some of such features and / or processes or units are mutually exclusive. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature providing the same, equivalent or similar purpose.

[0087] Furthermore, those skilled in the art will appreciate that although some embodiments herein include certain features included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of the present invention and to form different embodiments. For example, in the claims below, any of the claimed embodiments may be used in any combination.

[0088] The various component embodiments of the present invention can be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. It should be understood by those skilled in the art that a microprocessor or digital signal processor (DSP) can be used in practice to implement some or all of the functions of some or all of the components in the electronic device according to an embodiment of the present invention. The present invention can also be implemented as a device or apparatus program (e.g., a computer program and a computer program product) for executing a part or all of the methods described herein. Such a program implementing the present invention can be stored on a computer-readable medium, or can have the form of one or more signals. Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.

[0089] The above is only an embodiment of the present application. Common knowledge such as the known specific structures and characteristics in the scheme is not described in detail here. Ordinary technicians in the relevant field are aware of all common technical knowledge in the technical field of the invention before the application date or priority date, can obtain all existing technologies in the field, and have the ability to apply conventional experimental means before that date. Ordinary technicians in the relevant field can improve and implement this scheme in combination with their own abilities under the inspiration given by this application. Some typical known structures or known methods should not become obstacles for ordinary technicians in the relevant field to implement this application. It should be pointed out that for those skilled in the art, without departing from the structure of this application, several variations and improvements can be made, which should also be regarded as the scope of protection of this application. These will not affect the effect of the implementation of this application and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A method for determining the coordinates of a rectangular chip glue drawing, characterized in that: The method comprises, Determine the glue area of ​​the rectangular chip; wherein the glue area is the maximum area allowed to be covered by the glue; the step of determining the glue area of ​​the rectangular chip includes: Determining whether there is a conductive contact on each side of the rectangular chip; If not, draw the edge of the glue drawing area toward the center of the rectangle, 50 μm to 100 μm away from the edge corresponding to the rectangular chip; If yes, draw the edge of the glue drawing area in the direction of the center of the rectangle, 100 μm to 150 μm away from the edge corresponding to the rectangular chip; The four edges of the painting glue area intersect to form the painting glue area; Obtaining a retracted area based on a preset ratio and the glue area; The obtaining of the retracted area based on the preset ratio and the drawing glue area includes: taking the center of the drawing glue area as a base point, obtaining the retracted area after the drawing glue area is reduced by the preset ratio; Calculating a target area based on the length and width of the glue area and the retracted area; The calculating the target area based on the length and width of the drawing glue area and the retracted area includes: Calculating the difference in length between the long side and the wide side between the glue area and the retracted area; Taking half of the sum of the difference between the long side length and the wide side length as the target indentation length; Shifting the four sides of the glue area toward the base point by the target retraction length to obtain the target area; Determining the coordinates of the glue drawing based on the target area; Determining the coordinates of the glue drawing based on the target area includes: Draw the perpendicular bisectors of the wide side and the long side of the target area, and the diagonal line of the target area, wherein the perpendicular bisectors and the diagonal line intersect with the four sides of the rectangular area to form a cross shape; The center of the cross-shaped figure is determined as the drawing glue center, and the coordinates of the drawing glue center and the coordinates of the eight endpoints of the cross-shaped figure are obtained as the drawing glue coordinates.

2. The method for determining the coordinates of a rectangular chip glue drawing according to claim 1, wherein: The step of obtaining the coordinates of the center of the drawing glue and the coordinates of the eight endpoints of the cross shape includes: A drawing glue model is established by taking the center of the rice-shaped figure as the drawing glue center, and the coordinates of the eight endpoints of the rice-shaped figure are obtained through the drawing glue model.

3. The method for determining the coordinates of the rectangular chip glue drawing according to claim 2, characterized in that: The method further includes setting a glue drawing path based on the glue drawing coordinates, wherein the glue drawing path is on the rice-shaped pattern.

4. A device for determining the coordinates of rectangular chip glue drawing, characterized in that: The device comprises, A glue drawing area determination module, configured to determine the glue drawing area of ​​the rectangular chip, wherein the glue drawing area is the maximum area allowed to be covered by the glue; The glue area determination module is further used to determine whether there is a conductive contact on the edge of each side of the rectangular chip; If not, draw the edge of the glue drawing area toward the center of the rectangle, 50 μm to 100 μm away from the edge corresponding to the rectangular chip; If yes, draw the edge of the glue drawing area in the direction of the center of the rectangle, 100 μm to 150 μm away from the edge corresponding to the rectangular chip; The four edges of the painting glue area intersect to form the painting glue area; A retracted area determination module, configured to obtain a retracted area based on a preset ratio and the glue area; The shrinking area determination module is further configured to obtain a shrinking area that is a result of shrinking the glue area at a preset ratio, taking the center of the glue area as a base point; a target area determination module, configured to obtain the target area based on the length and width of the drawing glue area and the retracted area; The target area determination module is further configured to calculate a difference in length between the long side and the wide side between the glue area and the retracted area; Taking half of the sum of the difference between the long side length and the wide side length as the target indentation length; Shifting the four sides of the glue area toward the base point by the target retraction length to obtain the target area; A coordinate determination module, configured to determine the coordinates of the drawing glue based on a target area; The coordinate determination module is further configured to draw perpendicular bisectors of the wide side and the long side of the target area, and a diagonal line of the target area, wherein the perpendicular bisectors and the diagonal line intersect with the four sides of the rectangular area to form a cross-shaped figure; The center of the cross-shaped figure is determined as the drawing glue center, and the coordinates of the drawing glue center and the coordinates of the eight endpoints of the cross-shaped figure are obtained as the drawing glue coordinates.

5. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the program, the method steps according to any one of claims 1 to 3 are implemented.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the method steps according to any one of claims 1 to 3 are implemented.

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