A slice basket detection method and detection mechanism

Abstract

The present application provides a wafer basket detection method, which comprises detecting the axial deformation between the two end bottom plates of the wafer basket and detecting the defects of all the side rods in the wafer basket for placing silicon wafers, and when the axial deformation of the bottom plate is unqualified and / or the side rods have defects, the wafer basket is an abnormal product. The present application detects the dislocation and tilt deformation of the two bottom plates through two groups of opposite light emitting fibers arranged on the two sides of the bottom plate of the wafer basket, and performs multiple position scanning on each side rod on the wafer basket through the movable visual detection to perform visual analysis, checks whether the side rod has problems such as broken teeth, skewed teeth, broken rods or cracking, and the like; the accuracy of the judgment is high and the speed is fast, the wafer basket can be used for production while being detected, the degree of automation is high and the detection efficiency is high. The present application also provides a wafer basket detection mechanism.

Description

Technical Field

[0001] This invention belongs to the field of wafer basket detection technology, and in particular relates to a method for detecting abnormal deformation of wafer baskets and a detection mechanism for using this method. Background Technology

[0002] In the manufacturing process of photovoltaic silicon wafers, wafer cleaning is one of the key steps in the entire wafer production process. The wafer basket, as the tooling that carries the wafers, plays a crucial role and directly affects the cleaning effect. In automated production, wafer loader tools experience wear and tear and need to be replaced periodically based on their deformation. Previously, abnormal wafer baskets could only be identified through regular manual inspections or when quality issues were reported. Wafer basket abnormalities mainly focus on deformation of the basket base plate and the side rods used to support the wafers. The base plate may exhibit misalignment or tilting deformation; while the side rod deformation mainly includes broken or misaligned teeth in the grooves and broken or cracked rods themselves. Therefore, how to quickly detect wafer basket deformation on the production line is an urgent technical problem to be solved to improve wafer basket detection efficiency and wafer cleaning quality. Summary of the Invention

[0003] This invention provides a wafer basket inspection method and an inspection mechanism for the method, which solves the technical problems in the prior art where manual identification of wafer basket deformation leads to low production efficiency and easily causes abnormal silicon wafer quality.

[0004] To solve at least one of the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0005] A wafer basket inspection method includes detecting the axial deformation between the base plates at both ends of the wafer basket and detecting defects in all side rods in the wafer basket used to place silicon wafers. When the measured axial deformation of the base plate is unqualified and / or the side rods are defective, the wafer basket is considered an abnormal product.

[0006] Furthermore, the detection of the axial deformation between the bottom plates at both ends of the basket includes:

[0007] Obtain the inner and outer deformation of the base plate along its length.

[0008] The inner and outer deformation amounts are compared with the standard deformation values, respectively.

[0009] If any inner deformation and / or any outer deformation exceeds the standard deformation value, the basket is judged to be deformed and is considered an abnormal product.

[0010] Furthermore, when all inner and outer deformations are within the range of standard deformation values, it is necessary to further determine whether the side rods of the basket have defects.

[0011] The standard axial deformation of the base plate ranges from 0 to 1.5 mm.

[0012] Furthermore, both the inner deformation and the outer deformation are axial offsets of test points at different positions at the same height on the base plate.

[0013] The test points for the inner deformation and the test points for the outer deformation are arranged sequentially along the width direction of the base plate and are symmetrical with respect to the length axis of the basket.

[0014] Furthermore, both the inner deformation and the outer deformation are measured by fiber optic sensors configured on the outer sides of the two bottom plates and arranged in a relatively opposite manner.

[0015] When each set of fiber optic sensors is used for cross-beam testing, two sets of position coordinates can be obtained, thereby obtaining the axial offset of the test point corresponding to that set of fiber optic sensors.

[0016] Furthermore, the fiber optic sensors used to measure the inner deformation are all configured on the inner side of the two side rods in the same row in the basket;

[0017] The fiber optic sensor used to measure the amount of deformation on the outside is configured on the outside of two side bars in the same row in the basket.

[0018] Furthermore, the defect detection of all side bars in the wafer basket used to place silicon wafers includes:

[0019] Imaging information of the side rods and the tooth grooves on the side rods is obtained segment by segment along the length direction of each row of side rods;

[0020] After each row of side bars has been inspected, the side bars of other rows are inspected and identified in sequence along the height direction of the basket.

[0021] All imaging information is captured and analyzed, and compared with preset defect images to identify the type of side bar defect;

[0022] If a defect is found on either side of the rod, the basket is determined to be an abnormal product.

[0023] If no defects are found in any of the side bars, the basket is considered a good product.

[0024] A wafer basket testing mechanism, comprising:

[0025] The deformation detection group is equipped with sensors for detecting misalignment and tilting of the bottom plate of the tray, and the sensors are arranged in pairs on the bottom plates at both ends.

[0026] The defect inspection team is equipped with an imaging device for detecting defects in the side bars of the tray basket. The imaging device is placed between the side bars of the tray basket and is suspended in the air.

[0027] The main control center, which is electrically connected to the deformation detection group and the defect detection group, receives and processes the input information of the sensors and the imaging devices, and determines whether the tray can be returned to the good product area at the loading port or transferred to the abnormal area at the unloading port in response to the operation of the sensors and the imaging devices.

[0028] Furthermore, the deformation inspection group and the defect inspection group are both configured on the same conveyor, and the good product area and the abnormal product area are located at both ends of the length of the conveyor;

[0029] The deformation inspection group and the defective parts group are placed in the middle of the conveyor;

[0030] The tray is positioned along the width of the conveyor.

[0031] Furthermore, the deformation detection group can move along the width direction of the conveyor;

[0032] The defect inspection group is placed on a stand mounted on the transmission machine;

[0033] The stand causes the defect inspection group to move along the width of the conveyor and / or perpendicular to the plane of the conveyor.

[0034] Furthermore, the deformation detection group also includes:

[0035] A positioning cylinder for securing the tray, the positioning cylinder being configured on the outer side of the bottom plates at both ends and partially surrounding the periphery of the bottom plates;

[0036] And a fixing plate for fixing the sensor, the fixing plate being disposed opposite to the outer wall surface of the base plate and arranged along the width of the base plate;

[0037] The fixing plate is located above the positioning cylinder.

[0038] Furthermore, the sensors are arranged sequentially at intervals along the width direction of the base plate and are symmetrical with respect to the axis of the basket length; all sensors are configured at the same horizontal height on the fixed plate.

[0039] Furthermore, there are at least four sets of sensors, two of which are arranged between two side rods in the same row and are located on the inner side of the groove in the bottom plate, respectively.

[0040] The other two sensors are arranged on the outside of the two side bars in the same row and are located on the outer wall of the base plate, respectively;

[0041] All of the sensors are optical fiber sensors with a through-beam configuration.

[0042] Furthermore, the defect detection group also includes a light source for illuminating the imaging element, and a movable arm for fixing the imaging element and the light source, the movable arm being configured as a flat structure;

[0043] The movable arm can drive the imaging element and the light source element to move along the length of the side rod or in a vertical direction perpendicular to the length of the side rod.

[0044] Furthermore, the imaging element and the light source element are both arranged opposite to each other on both sides of the movable arm, and the light source element is located directly below the imaging element;

[0045] The imaging element is inclined downward relative to the length direction of the side rod, and the included angle with the length direction of the side rod is 30-90°.

[0046] The method for detecting sheet baskets designed in this invention uses two sets of opposing optical fibers on both sides of the sheet basket base plate to detect misalignment and tilting deformation of the two base plates. It also uses a movable and adjustable vision detector to perform multiple position scans on each side rod of the sheet basket for visual analysis to check for problems such as broken teeth, crooked teeth, broken rods, or cracks. The method has high accuracy and speed, can be used in production while detecting, and has a high degree of automation and high detection efficiency.

[0047] The wafer basket inspection mechanism designed in this invention has a simple overall structure and can simultaneously detect defects such as deformation of the silicon wafer substrate and whether the side rods have broken teeth, crooked teeth, broken rods or cracks. The structure is ingeniously designed, occupies a small area and does not interfere with each other. It operates automatically and judges the inspection results without the need for personnel assistance. It has good detection accuracy and high efficiency. Attached Figure Description

[0048] Figure 1 This is a flowchart of a basket detection method according to an embodiment of the present invention;

[0049] Figure 2 This is a schematic diagram of the structure of a basket detection according to an embodiment of the present invention;

[0050] Figure 3 This is a top view of a basket detection according to an embodiment of the present invention;

[0051] Figure 4 This is a schematic diagram of the base plate detection structure according to an embodiment of the present invention;

[0052] Figure 5 This is a schematic diagram of the side rod detection structure according to an embodiment of the present invention;

[0053] Figure 6 This is a schematic diagram of the tilt angle between the imaging element and the side rod according to an embodiment of the present invention;

[0054] Figure 7This is a schematic diagram of the detection principle according to an embodiment of the present invention.

[0055] In the picture:

[0056] 10. Slab basket; 20. Deformation inspection group; 21. Sensor component one.

[0057] 22. Sense Item Two 23. Sense Item Three 24. Sense Item Four

[0058] 25. Positioning cylinder; 26. Fixing plate; 30. Defect inspection team

[0059] 31. Imaging component; 32. Light source component; 33. Moving arm

[0060] 40. Transmission machine; 50. Stand; 60. Abnormal area

[0061] 70. Good Quality Section Detailed Implementation

[0062] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0063] This embodiment proposes a basket detection method, such as Figure 1 As shown, the process includes detecting the axial deformation between the base plates at both ends of the wafer basket 10 and detecting defects in all the side rods in the wafer basket 10 used to place silicon wafers. If the measured axial deformation of the base plate is unqualified and / or the side rods are defective, the wafer basket 10 is considered an abnormal product. In other words, if either the measured axial deformation of the base plate or the side rods are defective, the wafer basket 10 is judged to be an abnormal product. Only when the axial deformation of all base plates is qualified and there are no defects in the side rods is the wafer basket 10 considered a good product and can be used.

[0064] like Figure 2-6 As shown, on the automated production line, a robotic arm places an empty tray 10 onto a horizontally positioned conveyor 40, with the length of the tray 10 extending along the width of the conveyor 40. The tray 10 is then moved to the location of the upright 50, which houses the deformation inspection group 20 and the defect inspection group 30, and placed there. Simultaneously, the bottom plates at both ends of the tray 10 and the side rod assemblies on its inner side are inspected.

[0065] Specifically, in one embodiment, the detection of the misalignment deformation along the Y-axis between the bottom plates at both ends of the basket 10 includes:

[0066] Obtain the inner and outer deformations of the two end base plates along their length direction. The inner and outer deformations are both the Y-axis offsets of the measured points at the same height position on the two end base plates.

[0067] Then, the measured inner and outer deformation values ​​are compared with the standard axial deformation values.

[0068] If any measured inner deformation and / or any measured outer deformation exceeds the standard deformation value, the basket 10 is deemed deformed and an abnormal product. Only when all inner and outer deformations are within the standard deformation value range is it necessary to further determine if the side rods are defective. In other words, if any set of inner deformations, any set of outer deformations, or both sets of inner and outer deformations exceed the standard deformation value range, the basket 10 is deformed and judged as an abnormal product. Even if the bottom plate of the basket 10 shows no deformation, it cannot be definitively determined that the basket 10 is a good product; further determination of side rod defects is still required.

[0069] Both the inner and outer deformation amounts are the offsets along the Y-axis of test points at different positions at the same height of the base plate; and the test points for the inner and outer deformation amounts are set sequentially along the width direction of the base plate and are symmetrical with respect to the length axis of the basket 10.

[0070] like Figure 2 , Figure 3 and Figure 4 As shown, both the inner and outer deformation amounts are obtained by detecting deformation detection groups 20 arranged on the outer sides of the two base plates. The tray 10 is fixed on the conveyor 40 by a positioning cylinder 25, and is measured by several sets of relatively opposite fiber optic sensors mounted on a fixed frame. Four sets of fiber optic sensors are arranged sequentially along the width of the base plate, namely sensor 1 21, sensor 22, sensor 3 23, and sensor 4 24. Sensor 1 21 and sensor 4 24 are used to measure the outer deformation amount of the base plate. They are both arranged on the outer side of two side rods in the same row in the tray 10 and are close to the outer wall surface of the base plate to detect the outward misalignment and tilting deformation of the two base plates. Sensor 2 22 and sensor 3 23 are used to measure the inner deformation amount of the base plate. They are both arranged on the inner side of two side rods in the same row in the tray 10 and are close to the inner wall surface of the groove on the base plate to detect the inward misalignment and tilting deformation of the two base plates.

[0071] During testing, the transmitter and receiver ends of each fiber optic sensor are mounted on a bracket on the outer wall of the base plate, tightly against the outer surface of the base plate. When the base plate is normal and undeformed, the through-beam fiber optic sensors will transmit signals, and the through-beam signal reception will be normal. Once the base plate is deformed, the through-beam fiber optic signal will be blocked by the deformed base plate, indicating that the signal from the fiber optic sensor at the measured position cannot be received. The fiber optic sensor will then transmit the information to the external main control center via a communication signal. After receiving the signal, the main control center will further determine the positional offset of the test point.

[0072] During the beam-to-beam (BTB) operation of each set of fiber optic sensors, the sensors at both ends can obtain two sets of position coordinates. Since the BTB sensors are set at the same height, their X-axis and Z-axis positions remain unchanged. The deformation of the base plate only affects the position along the Y-axis, which is the offset along the width of the basket 10. By obtaining the two sets of position coordinates of the base plate at both ends corresponding to the measured position, the interface obtains the axial offset of the Y-axis of the test point corresponding to the set of fiber optic sensors, which is the misalignment offset of the measured position. In this embodiment, two sets of outer offsets of the two test points corresponding to sensor 1 21 and sensor 4 24 can be obtained; two sets of inner offsets of the two test points corresponding to sensor 2 22 and sensor 3 23 can be obtained. If any one or more of these four offsets exceeds the standard deformation range, the basket 10 can be judged to be deformed. The standard axial deformation range of the Y-axis of the base plate is 0-1.5mm. That is, as long as one inner deformation and / or outer deformation is greater than 1.5mm, the basket 10 is considered deformed and is an abnormal part. Once the tray 10 is determined to be an abnormal item, it is directly moved to the abnormal area 60 at the other end of the conveyor 40 for centralized processing.

[0073] In one embodiment, defect detection is performed on all side bars in the wafer basket 10 used to place silicon wafers, such as... Figure 5 As shown, the steps include:

[0074] Imaging information of the side bars and their teeth is acquired segment by segment along the length of each row of side bars. Because the side bars are quite long, a single imaging element 31 cannot capture the entire bar. Therefore, for the same row of side bars, it is necessary to divide them into several segments and photograph each segment separately. During the imaging process, the imaging element 31 also needs to image the side bars under the illumination of the light source 32. When sampling along the length of the side bars, the position of the imaging element 31 is first determined, ensuring its imaging area completely covers a section of the side bar being measured and all its teeth. The imaging element 31 is tilted towards the side bar to capture the image. Then, it moves forward at the same height along the horizontal X-axis, and is positioned at the second segment, capturing the second segment of the side bar and all its teeth. This process is repeated until the entire length of the side bars in that row has been imaged by the imaging element 31 before moving on to the next row of side bars. This continues until all side bars have been imaged.

[0075] Imaging element 31 and light source element 32 are both arranged opposite to each other on the two side walls of the same moving arm 33. Each imaging element 31 is equipped with a light source element 32, and the light source element 32 is located directly below the imaging element 31. That is, the imaging element 31 and the light source element 32 on the same side correspond to the side rod on the same side. The moving arm 33 is vertically arranged in the middle of all the side rods. That is, the moving arm 33 drives the imaging element 31 and the light source element 32 to be deeply inserted into the inner cavity of the film basket 10 to take pictures of the side rods.

[0076] Furthermore, the imaging element 31's head is tilted downwards relative to the length of the side rod, as shown in the structure... Figure 6 As shown. Preferably, the angle θ between the head of the imaging element 31 and the length direction of the side rod is 30-90°, so as to ensure a longer scanning and imaging length while maintaining clear imaging.

[0077] In order to ensure that the imaging element 31 can move horizontally along the X-axis (i.e., the length direction of the side rod) and the Z-axis (i.e., the height direction of the tray 10) to fully cover the imaging of all side rods, the moving arm 33 is required to be able to drive the imaging element 31 and the light source element 32 to move along the length direction of the side rod or in a vertical direction perpendicular to the side rod.

[0078] After the side bars of the previous row have been inspected, the machine returns to its initial position and moves down one row along the height of the basket to the height of the second row of side bars. This process is repeated, capturing images of segments of the second row of side bars and transmitting the images synchronously to the main control center for inspection and identification to check for defects. This process is repeated for the third row of side bars as well.

[0079] Imaging unit 31 transmits all captured imaging information to the main control center, which is connected to it for analysis and processing. In advance, the main control center optimizes the images using AI algorithms through deep learning on a large number of images, pre-setting image information for various defects. It then compares several photos of each row of side bars captured by imaging unit 31 with the pre-set defect photos to identify the defect categories of the side bars.

[0080] If any defect is found in any side bar, then the basket 10 is determined to be an abnormal product;

[0081] If no defects are found in any of the side bars, then the basket 10 is deemed to be of good quality and can continue to be used.

[0082] Taking this case as an example, each row of side bars in the tray 10 is photographed in six segments. This means six photos are taken of each single side bar in each row, and twelve photos are taken of the same row of side bars. Correspondingly, a total of 36 photos are taken of the three rows of side bars. These photos are then transmitted to the main control center, which processes the collected images to extract target feature values. These extracted feature values ​​are compared with the features of preset defect photos to determine if the side bars of the tray 10 have defects. If any defect is found in any side bar, the tray is deemed defective. Since each tray 10 has three rows of opposite side bars from top to bottom, each row must be inspected sequentially along its height. Only if the base plate remains undeformed and no defects are detected in any of the side bars is the tray 10 considered good and can be removed by the robotic arm for continued use.

[0083] Furthermore, the preset defect images include at least imaging information of cracks in the side bar body, broken bars, and broken or crooked teeth in the tooth grooves.

[0084] All photographs are taken by using the imaging device 31 to take pictures of the side rod under the illumination of the light source 32.

[0085] This embodiment proposes a basket detection mechanism, such as... Figure 2 and Figure 3 As shown, the system includes a deformation inspection group 20, a defect inspection group 30, and a main control center. Both the deformation inspection group 20 and the defect inspection group 30 are mounted on the same conveyor 40. At each end of the conveyor 40 are a good product area 70 and an abnormal product area 60 for placing sheet baskets. Sheet baskets 10 are placed on the conveyor 40 by a robotic arm. The conveyor 40 is equipped with a moving conveyor belt. The deformation inspection group 20 and the defect inspection group 30 are located in the middle of the conveyor 40. The deformation inspection group 20 is positioned on the conveyor 40 and along its width. The defect inspection group 30 is placed on a support frame 50 mounted on the conveyor 40. The deformation inspection group 20 can move along the width of the conveyor 40. The support frame 50 drives the defect inspection group 30 to move along the width of the conveyor 40 and / or perpendicular to the plane of the conveyor 40. The sheet basket 10 is positioned along the width of the conveyor 40, and the main control center is located outside the conveyor 40. Among them, the deformation inspection group 20 is equipped with a sensor for detecting misalignment and tilting of the bottom plate of the tray 10, and the sensor is arranged in a photoelectric configuration on the bottom plates at both ends; the defect inspection group 30 is equipped with an imaging element 31 for detecting defects in the side rods of the tray 10, and the imaging element 31 is placed between the side rods of the tray 10 and is suspended in the air.

[0086] On the automated production line, a robotic arm places an empty tray 10 onto a horizontally positioned conveyor 40, with the length of the tray 10 extending along the width of the conveyor 40. The tray 10 is then moved to the location of the upright 50 equipped with a deformation inspection group 20 and a defect inspection group 30, where it remains stationary. Simultaneously, the bottom plates at both ends of the tray 10 and the side rod assemblies on its inner side are inspected. For example... Figure 7 As shown, the main control center is electrically connected to the deformation inspection group 20, the defect inspection group 30 and the transmission machine 40 respectively. The main control center can receive and process the input information of the sensor and the imaging device 31, and determine whether the tray 10 can be returned to the good product area 70 of the loading port or transferred to the abnormal area 60 of the unloading port in response to the operation of the sensor and the imaging device 31.

[0087] The sensor is used to detect the misalignment and tilting deformation between the base plates at both ends of the wafer basket 10. The imaging sensor 31 is used to detect defects in all the side rods in the wafer basket 10 used to place silicon wafers. If any or more of the measured axial deformation of the base plate is unqualified and / or any defect of the side rod, the wafer basket 10 is an abnormal product. That is, if either the measured misalignment and tilting deformation of the base plate or the defect of the side rod is unqualified, the wafer basket 10 is judged to be an abnormal product and is directly assigned to the abnormal area 60. Only when the misalignment and tilting deformation of all base plates is qualified and there are no defects in the side rods is the wafer basket 10 a good product. It is then returned to the good product area 70 and taken away by the robot for continued use.

[0088] Specifically, such as Figure 4 As shown, the deformation detection assembly 20 also includes a positioning cylinder 25 for securing the tray 10 and a fixing plate 26 for fixing the sensor. The positioning cylinder 25 is disposed on the outer side of both end plates and partially surrounds the periphery of the width side of the base plate. The fixing plate 26 is disposed opposite to the outer wall of the base plate and is arranged along the width direction of the base plate. The positioning cylinder 25 is preferably a cylinder-controlled positioning cylinder, which is low in cost and easy to control. The positioning cylinder 25 can stably secure the tray 10 and fix it on the conveyor 40. Since the deformation of the base plate is mainly manifested at its upper opening position, the fixing plate 26 for placing the sensor should be disposed in the upper part of the base plate, so the fixing plate 26 is located above the positioning cylinder 25.

[0089] Furthermore, in this embodiment, four sets of sensors are provided: sensor 21 and sensor 24 for detecting the deformation of the outer side of the base plate; and sensor 22 and sensor 23 for detecting the deformation of the inner side of the base plate. Sensors 21, 22, 23, and 24 are arranged sequentially at intervals along the width direction of the base plate and are symmetrical with respect to the axis of the length of the basket 10; all sensors are configured at the same horizontal height on the fixed plate 26. The sensors are all fiber optic sensors configured with opposite beams; sensor 22 and sensor 23 are configured between two side rods in the same row and are located on the inner side of the groove in the base plate, to detect the deformation of the base plates at both ends that are misaligned and tilted inward; sensor 21 and sensor 24 are configured on the outer side of two side rods in the same row and are located on the outer wall of the base plate, to detect the deformation of the base plates at both ends that are misaligned and tilted outward.

[0090] During testing, when the base plate is normal and undeformed, the through-beam fiber optic sensor receives a signal, and signal reception is normal. However, if the base plate is deformed, the through-beam fiber optic signal is blocked, meaning the signal from the fiber optic sensor at the measured position cannot be received. The fiber optic sensor transmits this information to an external control center via communication signals. Upon receiving the signal, the control center compares it with a standard deformation value to further determine the positional offset of the test point. During each pair of through-beam fiber optic sensors, the sensors at both ends obtain two sets of position coordinates. Since the through-beam fiber optic sensors are set at the same height, their X-axis and Z-axis positions remain unchanged. The deformation of the base plate only affects the Y-axis position, i.e., the offset of the misalignment and tilt along the width of the basket 10. By obtaining the two sets of position coordinates of the base plate at the measured position, the interface obtains the axial offset of the Y-axis of the test point corresponding to that pair of fiber optic sensors, which is the misalignment and tilt offset of the measured position.

[0091] In this embodiment, two sets of outer offsets corresponding to two test points of sensors 21 and 24, and two sets of inner offsets corresponding to two test points of sensors 22 and 23 are obtained. If any one or more of these four sets of offsets exceeds the standard deformation range, the tray 10 is determined to be deformed. The standard axial deformation range of the Y-axis of the base plate is 0-1.5mm; that is, if one or more inner and / or outer deformations exceed 1.5mm, the tray 10 is considered deformed and is an abnormal item. Once the tray 10 is determined to be an abnormal item—that is, if any set of inner deformations, any set of outer deformations, or simultaneously one or more sets of inner and outer deformations exceed the standard deformation range—it indicates that the tray 10 is deformed and is judged as an abnormal product. Trays judged as abnormal products are directly transferred along the conveyor 40 to the abnormal area 60 at the discharge port after testing for collection and further processing. Only when the inner deformation and outer deformation measured by all sensors are within the standard deformation range, that is, when the bottom plate of the basket 10 has no deformation, can it be completely determined that the basket 10 is a good product. Further judgment is needed to determine whether the side rod has defects.

[0092] like Figure 5 As shown, the defect inspection group 30 also includes a light source 32 for illuminating the imaging element 31, and a movable arm 33 for fixing the imaging element 31 and the light source 32. The movable arm 33 is constructed as a flat structure to facilitate fixing the imaging element 31 and the light source 32. In this embodiment, the imaging element 31 is a visual inspection instrument, that is, it is used to take pictures and capture images. The imaging element 31 transmits the captured imaging information to the main control center connected to it for analysis and processing. The processing process is to convert the captured target into an image signal and transmit it to a dedicated image processing system. The image processing system converts the image into a digital signal based on pixel distribution and information such as brightness and color. The image system performs various operations on these signals to extract target features. In advance, the main control center optimizes the image information of various defects by deep learning of a large number of images and using AI algorithms. Several pictures of each row of side bars captured by the imaging element 31 are compared with the preset defect pictures to identify the defect category of the side bars. The preset defect images include at least the imaging information of cracks in the side bar body, broken bars, and broken or crooked teeth in the tooth grooves. All photographic images are taken by the imaging device 31 under illumination from the light source 32.

[0093] Furthermore, the movable arm 33 can drive the imaging element 31 and the light source element 32 to move along the length of the side rod or in a vertical direction perpendicular to the length of the side rod. The imaging element 31 and the light source element 32 are both arranged opposite to each other on both sides of the movable arm 33, and the light source element 32 is located directly below the imaging element 32. Each imaging element 31 is equipped with a light source element 32. The imaging element 31 and the light source element 32 on the same side detect the side rod on the same side. The movable arm 33 is vertically arranged in the middle of all the side rods, that is, the movable arm 33 drives the imaging element 31 and the light source element 32 to be deeply inserted into the inner cavity of the film basket 10 to take a comprehensive picture of the side rod.

[0094] Furthermore, the imaging element 31's head is tilted downwards relative to the length of the side rod, as shown in the structure... Figure 6 As shown. Preferably, the angle θ between the head of the imaging element 31 and the length direction of the side rod is 30-90°, so as to ensure a longer scanning and imaging length while maintaining clear imaging.

[0095] Imaging unit 31 acquires imaging information of the side rods and their tooth grooves segment by segment along the length of each row of side rods. After the entire length of the previous row of side rods has been captured by imaging unit 31, it returns to its initial position. Then, it moves down one row along the height of the tray to the detection position where the second row of side rods can be detected. This process is repeated for the second row of side rods. This continues until all side rods have been captured. During the image capture process, all imaging units 31 simultaneously transmit the captured information to the main control center for detection and identification to check for defects in all side rods.

[0096] Imaging unit 31 transmits the photograph to the main control center. The main control center processes the acquired photograph image to extract target feature values. Based on the extracted feature values, it compares them with the features of preset defect photographs to determine whether there are defects in the side rods of the tray 10. If any defect is found in any side rod, the tray is determined to be an abnormal product. Only when the base plate is not deformed and no defects are detected in any side rods is the tray 10 considered a good product. The tray 10 is then moved to the good product area 70 and taken away again by the robotic arm for continued use.

[0097] The method for detecting sheet baskets designed in this invention uses two sets of opposing optical fibers on both sides of the sheet basket base plate to detect misalignment and tilting deformation of the two base plates. It also uses a movable and adjustable vision detector to perform multiple position scans on each side rod of the sheet basket for visual analysis to check for problems such as broken teeth, crooked teeth, broken rods, or cracks. The method has high accuracy and speed, can be used in production while detecting, and has a high degree of automation and high detection efficiency.

[0098] The wafer basket inspection mechanism designed in this invention has a simple overall structure and can simultaneously detect defects such as deformation of the silicon wafer substrate and whether the side rods have broken teeth, crooked teeth, broken rods or cracks. The structure is ingeniously designed, occupies a small area and does not interfere with each other. It operates automatically and judges the inspection results without the need for personnel assistance. It has good detection accuracy and high efficiency.

[0099] The embodiments of the present invention have been described in detail above. These descriptions are merely preferred embodiments and should not be construed as limiting the scope of the invention. All equivalent variations and modifications made within the scope of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A method for detecting a wafer basket, characterized in that, include: The axial deformation between the bottom plates at both ends of the basket is detected by means of fiber optic sensors arranged in a relatively opposing manner; when each set of fiber optic sensors is aligned, two sets of position coordinates can be obtained, thereby obtaining the axial offset of the test point corresponding to that set of fiber optic sensors. And perform defect detection on all side rods in the wafer basket used to place silicon wafers, wherein the defect detection includes acquiring imaging information of the side rods and the tooth grooves on the side rods in segments along the length direction of each row of side rods; performing image analysis on all imaging information and comparing it with preset defect images to identify the type of side rod defects; If the measured axial deformation of the base plate is unqualified and / or the side rod is defective, the basket is considered an abnormal product. The axial deformation includes the inner and outer deformation of the base plate along its length. The fiber optic sensors for measuring the inner deformation are arranged on the inner side of the two side rods in the same row in the tray and are in close contact with the inner wall of the groove on the base plate. The fiber optic sensors for measuring the outer deformation are arranged on the outer side of the two side rods in the same row in the tray and are in close contact with the outer wall of the base plate.

2. The method for detecting a wafer basket according to claim 1, characterized in that, The detection of the axial deformation between the bottom plates at both ends of the basket includes: Obtain the inner and outer deformation of the base plate along its length. The inner and outer deformation amounts are compared with the standard deformation values, respectively. If any inner deformation and / or any outer deformation exceeds the standard deformation value, the basket is judged to be deformed and is considered an abnormal product.

3. The method for detecting a wafer basket according to claim 2, characterized in that, When all inner and outer deformations are within the range of standard deformation values, it is necessary to further determine whether the side rods of the basket have defects. The standard axial deformation of the base plate ranges from 0 to 1.5 mm.

4. A method for detecting a wafer basket according to claim 2 or 3, characterized in that, Both the inner deformation and the outer deformation are axial offsets of test points at different locations at the same height on the base plate.

5. A method for detecting a wafer basket according to any one of claims 1-3, characterized in that, The defect detection of all side bars in the wafer basket used to place silicon wafers includes: After each row of side bars has been inspected, the side bars of other rows are inspected and identified in sequence along the height direction of the basket. If a defect is found on either side of the rod, the basket is determined to be an abnormal product. If no defects are found in any of the side bars, the basket is considered a good product.

6. The method for detecting a wafer basket according to claim 4, characterized in that, The defect detection of all side bars in the wafer basket used to place silicon wafers includes: After each row of side bars has been inspected, the side bars of other rows are inspected and identified in sequence along the height direction of the basket. If a defect is found on either side of the rod, the basket is determined to be an abnormal product. If no defects are found in any of the side bars, the basket is considered a good product.

7. A wafer basket detection mechanism, characterized in that, include: The deformation detection unit is equipped with sensors for detecting the axial deformation between the bottom plates of the tray. The sensors are arranged in opposite directions on the bottom plates at both ends, and are all fiber optic sensors arranged in opposite directions. The axial deformation is measured by the fiber optic sensors arranged in opposite directions. The axial deformation includes the inner deformation and the outer deformation of the bottom plate along its length. When each set of fiber optic sensors is used for beam-to-beam testing, two sets of position coordinates can be obtained, thereby obtaining the axial offset of the test point corresponding to that set of fiber optic sensors; two sets of the sensors are configured between two side rods in the same row and are located on the inner side of the groove in the base plate respectively; the other two sets of the sensors are configured on the outer side of two side rods in the same row and are located on the outer wall of the base plate respectively. The defect inspection team is equipped with an imaging device for detecting defects in the side rods of the tray. The imaging device is placed between the side rods of the tray and is suspended in the air. It is moved by a moving arm along the length of the side rod or in a vertical direction perpendicular to the length of the side rod. The main control center, which is electrically connected to the deformation detection group and the defect detection group, receives and processes the input information of the sensors and the imaging devices, and determines whether the tray can be returned to the good product area at the loading port or transferred to the abnormal area at the unloading port in response to the operation of the sensors and the imaging devices.

8. The wafer basket detection mechanism according to claim 7, characterized in that, The deformation inspection group and the defect inspection group are both configured on the same conveyor, and the good product area and the abnormal product area are located at both ends of the length of the conveyor; The deformation inspection group and the defective parts group are placed in the middle of the conveyor; The tray is positioned along the width of the conveyor.

9. A wafer basket detection mechanism according to claim 8, characterized in that, The defect inspection group is placed on a stand mounted on the transmission machine; The stand causes the defect inspection group to move along the width of the conveyor and / or perpendicular to the plane of the conveyor.

10. A wafer basket detection mechanism according to any one of claims 7-9, characterized in that, The deformation inspection group also includes: A positioning cylinder for securing the tray, the positioning cylinder being configured on the outer side of the bottom plates at both ends and partially surrounding the periphery of the bottom plates; And a fixing plate for fixing the sensor, the fixing plate being disposed opposite to the outer wall surface of the base plate and arranged along the width of the base plate; The fixing plate is located above the positioning cylinder.

11. A wafer basket detection mechanism according to claim 10, characterized in that, The sensors are arranged sequentially at intervals along the width of the base plate and are symmetrical with respect to the axis of the basket length; all sensors are positioned at the same horizontal height on the fixed plate.

12. The wafer basket detection mechanism according to claim 7, characterized in that, The sensors are in at least four groups.

13. A basket detection mechanism according to any one of claims 7-9 and 11-12, characterized in that, The defect inspection group also includes a light source for illuminating the imaging element and a movable arm for fixing the imaging element and the light source, the movable arm being configured as a flat structure; The movable arm can drive the light source to move along the length of the side rod or in a vertical direction perpendicular to the length of the side rod.

14. A wafer basket detection mechanism according to claim 13, characterized in that, The imaging element and the light source element are both arranged opposite to each other on both sides of the moving arm, and the light source element is located directly below the imaging element. The imaging element is inclined downward relative to the length direction of the side rod, and the included angle with the length direction of the side rod is 30-90°.

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