A magnetic levitation cleaning device suitable for magnetic wafers

Abstract

The application discloses a kind of magnetic levitation cleaning devices suitable for magnetic wafer, it is related to goods transport field, including ultrasonic cleaning tank, drive two electric telescopic rods for carrying the placement frame of magnetic wafer to carry out up and down movement, the inner cavity of the placement frame is vertically placed with several magnetic wafers, the bottom of each magnetic wafer is equipped with two load-bearing permanent magnets that are vertically outwardly inclined and spread, two limit permanent magnets that are horizontally outwardly inclined and spread are installed on the two opposite side walls of the placement frame, and two limit permanent magnets are located on the two sides of the magnetic wafer respectively. The cooperation of the four limit permanent magnets and two load-bearing permanent magnets arranged obliquely can make the magnetic wafer stable levitation, to realize the non-contact ultrasonic cleaning of the magnetic wafer, so that the magnetic wafer cleaning is more thorough and will not be deformed.

Description

Technical Field

[0001] This invention relates to the field of wafer cleaning technology, and in particular to a magnetic levitation cleaning device suitable for magnetic wafers. Background Technology

[0002] A wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. It is called a wafer because of its circular shape. Various circuit element structures can be fabricated on silicon wafers to create IC products with specific electrical functions. The raw material for wafers is silicon, while silicon dioxide is an inexhaustible resource on the Earth's crust.

[0003] Wafers can be divided into magnetic wafers (i.e., magnetic wafers) and non-magnetic wafers (which are more common). For magnetic wafers, a strong magnetic thin film is deposited on one end face, which is the basic material for making spintronic chips. Then, complex processing processes such as photolithography and etching are performed to make the wafer have circuits. After photolithography and etching, various impurities will be attached to the wafer, which needs to be cleaned. Since the high temperature generated during plasma cleaning will affect the magnetism of the magnetic thin film, water washing is generally used. The magnetic wafer is placed vertically in the limiting groove of the wafer frame, and then the wafer frame is placed in an ultrasonic cleaning tank with cleaning solution for cleaning. Since the outer end of the wafer is in contact with the inner wall of the limiting groove, the contact area cannot be thoroughly cleaned during cleaning (impurities easily accumulate at this contact point and cannot fall off). At the same time, the contact part between the wafer and the limiting groove is prone to rapid collision due to the vibration generated by the operation of the ultrasonic cleaning tank, which causes the wafer to deform due to the collision. Therefore, this application provides a magnetic levitation cleaning device suitable for magnetic wafers to meet the needs. Summary of the Invention

[0004] The purpose of this application is to provide a magnetic levitation cleaning device suitable for magnetic wafers. By using four inclined limiting permanent magnets and two load-bearing permanent magnets, the magnetic wafer can be stably levitated to achieve non-contact ultrasonic cleaning of the magnetic wafer, making the cleaning of the magnetic wafer more thorough and preventing deformation.

[0005] To achieve the above objectives, this application provides the following technical solution: a magnetic levitation cleaning device suitable for magnetic wafers, comprising an ultrasonic cleaning tank, two electrically operated telescopic rods driving a placement frame for supporting magnetic wafers to move up and down, wherein a plurality of magnetic wafers are vertically placed in the inner cavity of the placement frame, and the plurality of magnetic wafers are separated by a plurality of magnetic shielding plates, and two load-bearing permanent magnets are installed at the bottom of each magnetic wafer, which are vertically inclined outwards and positioned at the bottom of the magnetic wafer. On both sides of the magnetic wafer, the distance between the two ends of the two load-bearing permanent magnets and the two opposite sidewalls of the placement frame is equal. The magnetic poles of the two load-bearing permanent magnets and the opposite end faces of the magnetic wafer are the same. Two limiting permanent magnets that are horizontally inclined and open are installed on the two opposite sidewalls of the placement frame. The two limiting permanent magnets are located on both sides of the magnetic wafer. The magnetic poles of the two limiting permanent magnets and the opposite ends of the magnetic wafer are the same. All four sets of limiting permanent magnets are located above the two load-bearing permanent magnets.

[0006] Preferably, the device further includes magnetic spin-drying units. Two magnetic spin-drying units are fixedly installed on both sides of each magnetic wafer. Each magnetic spin-drying unit includes a cylindrical body with mounting holes. An electromagnet is rotatably mounted on the cylindrical body via a rotating shaft, and the axis of the electromagnet is on the same straight line as the axis of the magnetic wafer. A motor is fixed on the side end of the cylindrical body, and the output shaft of the motor located in the inner cavity of the cylindrical body is meshed with one end of the rotating shaft located in the inner cavity of the cylindrical body via a gear. The connecting wire of the electromagnet passes through the rotating shaft and is connected to the rotating end of a conductive slip ring inside the cylindrical body. The connecting wire of the fixed end of the conductive slip ring passes through the cylindrical body and the placement frame and is electrically connected to a controller installed on the outer wall of the ultrasonic cleaning tank. A sealing cover is rotatably mounted on the placement frame via a hinge.

[0007] Preferably, the placement frame includes an inner spiral plate and an outer spiral plate located around the inner spiral plate and fixedly connected by connecting columns. A downward flow gap is provided between the inner spiral plate and the outer spiral plate. Several first flow guide strips are provided on the opposite side walls of the outer spiral plate, which are the same as the number of magnetic wafers placed thereon. Long strip-shaped first openings are provided on the opposite side walls of the inner spiral plate, corresponding to the first flow guide strips.

[0008] The sealing cover includes an outer cover plate and an inner cover plate located in the inner cavity of the outer cover plate. The inner cover plate has several elongated second openings corresponding to the magnetic wafer. The inner cavity of the outer cover plate is fixed with several second guide strips arranged opposite to the second openings. The inner cover plate is fixed with a U-shaped connecting plate, and the upper end and side wall of the U-shaped connecting plate are respectively sealed and fixed to the top and side wall of the inner cavity of the outer cover plate. The end of the inner cover plate near the hinge is provided with a mating gap with the inner wall of the outer cover plate.

[0009] The horizontal cross-sections of the first and second guide strips are both isosceles triangular structures, and the horizontal cross-sections of the first and second openings are both isosceles trapezoidal structures. The narrow ends of the first and second openings are respectively positioned opposite to the tips of the first and second guide strips.

[0010] Preferably, both inclined ends of the first and second guide strips are connected to spiral pipes with liquid inlet notches.

[0011] Preferably, it also includes a telescopic hose, wherein the upper end of the telescopic hose is sealed and fixed in the docking gap, and the lower end of the telescopic hose is fixed and sealed in the downstream gap.

[0012] Preferably, an L-shaped plate is fixed to the rear end face of the placement frame, and the upper end of the L-shaped plate is located above the upper end face of the placement frame.

[0013] Preferably, the surfaces of the inner spiral plate, the outer spiral plate, the outer cover plate, the inner cover plate, the first guide strip, and the second guide strip are all provided with a hydrophobic coating.

[0014] In summary, the technical effects and advantages of this invention are as follows:

[0015] 1. The present invention has a reasonable structure. The combination of four inclined limiting permanent magnets and two load-bearing permanent magnets can make the magnetic wafer stably suspended, so as to realize non-contact ultrasonic cleaning of the magnetic wafer, making the magnetic wafer cleaner more thorough and without deformation.

[0016] 2. This invention also includes a magnetic spin-drying unit, which can drive the magnetic wafer to rotate rapidly. Through centrifugal force, the cleaning fluid adhering to the magnetic wafer can be removed, achieving non-contact rapid spin-drying of the magnetic wafer.

[0017] 3. In this invention, a first guide bar, a second guide bar, a first opening, and a second opening are provided, so that the collision and sputtering point of the liquid with the inner wall of the outer ring plate is far away from the first opening, thereby reducing the possibility of the liquid being sputtered onto the magnetic wafer through the narrow opening of the first opening.

[0018] 4. In this invention, a spiral pipe is provided, which can consume the kinetic energy of the liquid by changing the movement path of the droplets, thereby effectively preventing the droplets from colliding and splashing. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a schematic diagram of the disassembled structure of the present invention;

[0022] Figure 3 For the present invention Figure 2 Schematic diagram of the internal structure of the ultrasonic cleaning tank;

[0023] Figure 4 For the present invention Figure 3 Schematic diagram of the disassembled structure of the middle sealing cap;

[0024] Figure 5 For the present invention Figure 4 A schematic diagram of the inner and outer cover plates from below;

[0025] Figure 6 For the present invention Figure 3 Schematic diagram of the magnetic spin-drying unit structure;

[0026] Figure 7 For the present invention Figure 6 Schematic diagram of the cross-sectional structure of the middle cylinder;

[0027] Figure 8 For the present invention Figure 3 A partial cross-sectional structural diagram of a medium-sized ultrasonic cleaning tank;

[0028] Figure 9 For the present invention Figure 3 Schematic diagram of the position and structure of the first guide strip and the first opening;

[0029] Figure 10 This is a diagram illustrating the spiral pipe structure of the present invention.

[0030] In the diagram: 1. Ultrasonic cleaning tank; 2. Placement frame; 21. Inner U-shaped plate; 22. Outer U-shaped plate; 23. Connecting column; 24. First opening; 25. First guide strip; 26. Spiral pipe; 3. Sealing cover; 31. Outer cover plate; 32. Inner cover plate; 33. Second opening; 34. U-shaped connecting plate; 35. Telescopic hose; 36. Second guide strip; 4. Electric telescopic rod; 5. Hinge; 6. Magnetic shielding plate; 7. Limiting permanent magnet; 8. Load-bearing permanent magnet; 9. Magnetic spin-drying unit; 91. Motor; 92. Cylinder; 93. Electromagnet; 94. Rotating shaft; 95. Gear; 96. Conductive slip ring; 10. L-shaped plate. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example: Reference Figure 1-3The magnetic levitation cleaning device for magnetic wafers shown includes an ultrasonic cleaning tank 1 and two electrically operated telescopic rods 4 that drive a placement frame 2 for supporting the magnetic wafers to move up and down. Several magnetic wafers are vertically placed inside the placement frame 2, and each magnetic wafer is separated by multiple magnetic shielding plates 6. Two vertically inclined, outwardly oriented, load-bearing permanent magnets 8 are installed at the bottom of each magnetic wafer, located on opposite sides of the wafer. The distance between the two ends of the two load-bearing permanent magnets 8 and the two opposite sidewalls of the placement frame 2 is equal. The magnetic poles of the end face of the body 8 opposite to the magnetic wafer are the same. Two horizontally inclined, outwardly oriented, limiting permanent magnets 7 are installed on the two opposite side walls of the placement frame 2, with each limiting permanent magnet 7 located on one side of the magnetic wafer. The magnetic poles of the two limiting permanent magnets 7 are the same as the opposite ends of the magnetic wafer. All four sets of limiting permanent magnets 7 are located above the two load-bearing permanent magnets 8. When cleaning the magnetic wafer, it can be placed vertically between the two load-bearing permanent magnets 8 and the four limiting permanent magnets 7. Through the principle of repulsion between like magnetic poles, the inclined load-bearing permanent magnets 8 can both repel the magnetic wafer. The circle generates an upward-sloping magnetic force of equal magnitude. The resultant force of the two magnetic forces is vertically upward, while the gravity of the magnetic wafer is vertically downward. The resultant force cancels out gravity, allowing the magnetic wafer to levitate. To ensure the magnetic wafer is properly positioned, four inclined limiting permanent magnets 7 are also installed to restrain it. When the magnetic wafer is placed, if the distance between the outer edge of the ring and the two limiting permanent magnets 7 on the same side is not equal, the repulsive force formed by the two limiting permanent magnets 7 on the same side closer to the outer edge of the ring, based on the principle of repulsion between like magnetic poles, can push the magnetic wafer away from the ring. Ultimately, the distance between the two limiting permanent magnets 7 on both sides of the outer edge of the magnetic wafer and the two limiting permanent magnets 7 on the same side is made consistent. Through the cooperation of the four limiting permanent magnets 7, the gravity on the magnetic wafer and the repulsive force generated by the two supporting permanent magnets 8 are on the same straight line. The cooperation of the two supporting permanent magnets 8 and the four limiting permanent magnets 7 can make the magnetic wafer float stably. After the magnetic wafer is placed, the placement frame 2 can be immersed in the cleaning solution for ultrasonic cleaning by means of an electric telescopic rod. After cleaning, the magnetic wafer can be removed. The suspension cleaning method makes the magnetic wafer cleaner more thorough and prevents deformation.

[0033] As a preferred embodiment of this example, Figure 2 , Figure 6 and Figure 7As shown, it also includes magnetic spin-drying units 9. Two magnetic spin-drying units 9 are fixedly installed on both sides of each magnetic wafer. The magnetic spin-drying unit 9 includes a cylindrical body 92 with mounting holes. An electromagnet 93 is rotatably mounted on the cylindrical body 92 via a rotating shaft 94, and the axis of the electromagnet 93 is on the same straight line as the axis of the magnetic wafer. A motor 91 is fixed on the side end of the cylindrical body 92, and the output shaft of the motor 91 located in the inner cavity of the cylindrical body 92 is meshed with one end of the rotating shaft 94 located in the inner cavity of the cylindrical body 92 via a gear 95. The connecting wire of the electromagnet 93 passes through the rotating shaft 94 and is connected to the rotating end of the conductive slip ring 96 inside the cylindrical body 92. The connecting wire of the fixed end of the conductive slip ring 96 passes through the cylindrical body 92 and the placement frame 2 and is connected to the control on the outer wall of the ultrasonic cleaning tank 1. The device is electrically connected. A sealing cover 3 is mounted on the placement frame 2 via a hinge 5. After cleaning, the placement frame 2 is moved out of the ultrasonic cleaning tank 1 by an electric telescopic rod 4. At this time, the sealing cover 3 is closed. Several electromagnets 93 are simultaneously energized by the controller. The two electromagnets 93 located on both sides of the magnetic wafer and facing each other exert repulsive forces of the same magnitude and opposite direction on the magnetic wafer, which can clamp and fix the magnetic wafer. Several motors 91 can be controlled to work simultaneously, driving the two opposing electromagnets 93 to rotate rapidly. Under the action of magnetic force, the magnetic wafer can be driven to rotate rapidly. The centrifugal force can remove the cleaning liquid adhering to the magnetic wafer, realizing non-contact and rapid spin-drying of the magnetic wafer.

[0034] It should be noted that, since the magnetic wafer is stably suspended under the action of the two load-bearing permanent magnets 8 and the four limiting permanent magnets 7, when installing the magnetic spin-drying unit 9, it is only necessary to keep the axis of the electromagnet 93 aligned with the axis of the magnetic wafer. This allows the magnetic wafer to rotate stably under the repulsive clamping action of the two electromagnets 93, which can prevent the magnetic wafer from being thrown out due to centrifugal force and causing collision damage.

[0035] As a preferred embodiment of this example, Figure 3-5 and Figure 9As shown, the placement frame 2 includes an inner spiral plate 21 and an outer spiral plate 22 located around the inner spiral plate 21 and fixedly connected by a connecting post 23. A downward flow gap is provided between the inner spiral plate 21 and the outer spiral plate 22. Several first guide strips 25, consistent with the number of magnetic wafers placed, are provided on the opposite side walls of the outer spiral plate 22. Elongated first openings 24, corresponding to the first guide strips 25, are provided on the opposite side walls of the inner spiral plate 21. The sealing cover 3 includes an outer cover plate 31 and an inner cover plate located in the inner cavity of the outer cover plate 31. 32. The inner cover plate 32 has several elongated second openings 33 corresponding to the magnetic wafer. The inner cavity of the outer cover plate 31 has several second guide strips 36 arranged opposite to the second openings 33. The inner cover plate 32 is fixed with a U-shaped connecting plate 34, and the upper end and side wall of the U-shaped connecting plate 34 are sealed and fixed to the top and side wall of the inner cavity of the outer cover plate 31, respectively. The end of the inner cover plate 32 near the hinge 5 has a mating gap with the inner wall of the outer cover plate 31. The horizontal cross-sections of the first guide strip 25 and the second guide strip 36 are both isosceles. The triangular structure has an isosceles trapezoidal horizontal cross-section for both the first opening 24 and the second opening 33. The narrow ends of the first opening 24 and the second opening 33 are respectively positioned opposite to the tips of the first guide strip 25 and the second guide strip 36. When the magnetic wafer is spun dry using the magnetic spin-drying unit 9, droplets spun towards the inner wall of the placement frame 2 can enter the downstream gap along the first opening 24. The first opening 24 is an isosceles trapezoidal structure, and its inclined surface helps to gather and guide the liquid entering its inner cavity. The liquid is used to make it fly out from the narrow opening and come into contact with the tip of the first guide bar 25. After being cut into two parts by the tip, it moves away from the first opening 24 along its inclined surface. This makes the collision and sputtering point of the liquid with the inner wall of the outer ring plate 22 away from the first opening 24, thereby reducing the possibility of the liquid being sputtered again from the narrow opening of the first opening 24 onto the magnetic wafer. This is beneficial for the rapid drying of the magnetic wafer. For the droplets that are thrown upward, the second opening 33 and the second guide bar 36 have the same function as the first opening 24 and the first guide bar 25.

[0036] It is important to note that the width of the narrow opening should not be too large, and should be controlled between 0.2-1mm. When the width of the narrow opening is too large, it can increase the possibility of the liquid re-attaching to the magnetic wafer after collision and sputtering, and it will not be able to make the liquid after convergence and guidance be cut into two parts and move along its slope after contact with the tip. When the width of the narrow opening is too small, it is not conducive to the large-scale discharge of the liquid droplets after convergence and guidance from the narrow opening.

[0037] In this embodiment, as Figure 10As shown, spiral pipes 26 with liquid inlet notches are connected to the two inclined ends of the first guide bar 25 and the second guide bar 36. The droplets moving along the inclined surfaces of the first guide bar 25 or the second guide bar 36 enter the inner cavity of the spiral pipe 26 through the liquid inlet notches and move spirally along the inner wall of the pipe. When the kinetic energy of the droplets is consumed, the droplets in the spiral pipe 26 in the placement frame 2 can fall into the ultrasonic cleaning tank 1 by their own gravity. As for the spiral pipe 26 in the sealing cover 3, the droplets will remain in the spiral pipe 26 after consuming their kinetic energy. The droplets can be made to flow from the docking gap to the downstream gap and finally discharged into the ultrasonic cleaning tank 1 by rotating the sealing cover 3. The spiral pipe 26 can consume the kinetic energy of the liquid by changing the movement path of the droplets, which can effectively prevent the droplets from colliding and splashing.

[0038] It should be noted that both ends of the spiral pipe 26 are open.

[0039] In this embodiment, as Figure 8 As shown, it also includes a telescopic hose 35, with the upper end of the telescopic hose 35 sealed and fixed in the docking gap, and the lower end of the telescopic hose 35 fixed and sealed in the downstream gap. When rotating the sealing cover 3, in order to prevent the liquid droplets left in the docking gap from falling onto the magnetic wafer, the telescopic hose 35 is provided, which can effectively prevent the liquid droplets in the spiral pipe 26 from falling onto the magnetic wafer. At the same time, because it has a certain degree of flexibility and extensibility, it does not affect the rotation operation of the sealing cover 3.

[0040] In this embodiment, as Figure 1 As shown, an L-shaped plate 10 is fixed on the rear end face of the placement frame 2, and the upper end of the L-shaped plate 10 is located above the upper end face of the placement frame 2. After the magnetic wafer is cleaned, the sealing cover 3 is rotated so that the upper end of the sealing cover 3 can contact the L-shaped plate 10. The L-shaped plate 10 is used to tilt and support the sealing cover 3, which can prevent the upper end of the sealing cover 3 from contacting the side end of the ultrasonic cleaning tank 1, making it difficult for the operator to rotate the sealing cover 3 to close the ultrasonic cleaning tank 1.

[0041] As a preferred embodiment of this work (not shown in the figure), the surfaces of the inner spiral plate 21, outer spiral plate 22, outer cover plate 31, inner cover plate 32, first guide strip 25, and second guide strip 36 are all coated with a hydrophobic coating. This effectively prevents liquid from adhering to the ultrasonic cleaning tank 1 and the sealing cover 3, and facilitates the downward flow of liquid droplets.

[0042] The working principle of this invention is as follows: When cleaning a magnetic wafer, the wafer can be placed vertically between two supporting permanent magnets 8 and four limiting permanent magnets 7. Based on the principle of repulsion between like magnetic poles, both inclined supporting permanent magnets 8 exert an upward and equal magnetic force on the magnetic wafer. The resultant force of the two magnetic forces is vertically upward, while the weight of the magnetic wafer is vertically downward. The resultant force cancels out the weight, allowing the magnetic wafer to levitate. To ensure the magnetic wafer is properly positioned, four limiting permanent magnets 7 are also inclined to limit its movement. When the outer edge of the magnetic wafer is not at the same distance from the two limiting permanent magnets 7 on the same side, the principle of repulsion between like magnetic poles applies. The repulsive force exerted by the two limiting permanent magnets 7 on the same side near the outer edge of the ring can push the magnetic wafer away, and eventually make the distance between the two limiting permanent magnets 7 on the same side of the outer edge of the ring of the magnetic wafer equal. Through the cooperation of the four limiting permanent magnets 7, the gravity on the magnetic wafer and the repulsive force generated by the two load-bearing permanent magnets 8 are on the same straight line. Through the cooperation of the two load-bearing permanent magnets 8 and the four limiting permanent magnets 7, the magnetic wafer can be stably suspended. After the magnetic wafer is placed, the placement frame 2 can be immersed in the cleaning solution for ultrasonic cleaning by means of an electric telescopic rod. After cleaning, the magnetic wafer can be removed. The suspension cleaning method makes the magnetic wafer cleaner more thorough and prevents deformation.

[0043] It also includes a magnetic spin-drying unit 9, which can drive the magnetic wafer to rotate rapidly. Through centrifugal force, the cleaning fluid adhering to the magnetic wafer can be removed, enabling non-contact rapid spin-drying of the magnetic wafer.

[0044] The system is equipped with a first guide bar 25, a second guide bar 36, a first opening 24, and a second opening 33, which makes the collision and sputtering point of the liquid with the inner wall of the outer spiral plate 22 far away from the first opening 24, thereby reducing the possibility of the liquid being sputtered onto the magnetic wafer through the narrow opening of the first opening 24.

[0045] The spiral pipe 26 is provided, which can consume the kinetic energy of the liquid by changing the movement path of the droplets, and can effectively prevent the droplets from colliding and splashing.

[0046] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A magnetic levitation cleaning device suitable for magnetic wafers, comprising an ultrasonic cleaning tank (1), two electric telescopic rods (4) for driving a placing frame (2) for carrying magnetic wafers to move up and down, characterized in that: The inner cavity of the placing frame (2) vertically places a plurality of magnetic wafers, and the plurality of magnetic wafers are separated by a plurality of magnetic separation plates (6) one by one. It also includes a magnetic force spin-drying unit (9), and two magnetic force spin-drying units (9) are fixedly installed on the two sides of each magnetic wafer.

2. The magnetic levitation cleaning device for magnetic wafers according to claim 1, characterized in that: The placing frame (2) includes an inner meander plate (21) and an outer meander plate (22) which is fixedly connected to the periphery of the inner meander plate (21) through a connecting column (23), and a downward gap is arranged between the inner meander plate (21) and the outer meander plate (22). The opposite two side walls of the outer meander plate (22) are provided with a plurality of first flow guide strips (25) which are consistent with the number of the placed magnetic wafers. The opposite two side walls of the inner meander plate (21) are provided with a first opening (24) which is a long strip and is arranged correspondingly to the first flow guide strip (25). The sealing cover (3) comprises an outer cover plate (31) and an inner cover plate (32) in the inner cavity of the outer cover plate (31), a plurality of second openings (33) corresponding to the magnetic wafer are formed in the inner cover plate (32), a plurality of second flow guide strips (36) are arranged opposite to the second openings (33) in the inner cavity of the outer cover plate (31), a U-shaped connecting plate (34) is fixed to the inner cover plate (32), and the upper end and the side wall of the U-shaped connecting plate (34) are respectively sealed and fixed to the top and the side wall of the inner cavity of the outer cover plate (31), and the end of the inner cover plate (32) close to the hinge (5) is provided with a butt joint gap in the inner wall of the outer cover plate (31). The horizontal section of the first flow guide strip (25) and the second flow guide strip (36) is an isosceles triangle structure, the horizontal section of the first opening (24) and the second opening (33) is an isosceles trapezoidal structure, and the narrow end of the first opening (24) and the second opening (33) is arranged opposite to the tip of the first flow guide strip (25) and the second flow guide strip (36) respectively.

3. The magnetic levitation cleaning device for magnetic wafers according to claim 2, characterized in that: The two inclined surfaces of the first flow guide strip (25) and the second flow guide strip (36) are connected with a spiral pipeline (26) with a liquid inlet gap.

4. The magnetic levitation cleaning device for magnetic wafers according to claim 2, characterized in that: A flexible hose (35) is further arranged, and the upper end of the flexible hose (35) is sealed and fixed in the butt joint gap, and the lower end of the flexible hose (35) is sealed and fixed in the lower flow gap.

5. The magnetic levitation cleaning device for magnetic wafers according to claim 2, characterized in that: An L-shaped plate (10) is fixed to the rear end surface of the placing frame (2), and the upper end of the L-shaped plate (10) is located above the upper end surface of the placing frame (2).

6. The magnetic levitation cleaning device for magnetic wafers according to claim 2, characterized in that: The surfaces of the inner plate (21), the outer plate (22), the outer cover plate (31), the inner cover plate (32), the first flow guide strip (25) and the second flow guide strip (36) are provided with a hydrophobic coating.

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