Dual-band dielectric resonator antenna and communication device

Abstract

The embodiment of the present application relates to the technical field of antenna, and discloses a dual-frequency dielectric resonant antenna, which comprises a substrate, a feeding unit and an antenna unit; the substrate is provided with a plurality of feeding slots; the feeding unit is arranged on the substrate and is coupled with the feeding slots; the antenna unit comprises a plurality of dielectric resonators, the plurality of dielectric resonators are arranged on the substrate, and the plurality of dielectric resonators are sequentially connected in the same direction to form an integrated antenna unit, and one dielectric resonator is connected with one feeding slot.The embodiment of the present application sequentially connects the plurality of dielectric resonators in the same direction to form an integrated antenna unit, so that the integrated plurality of dielectric resonators only need to be bonded and fixed once, the installation of the antenna unit can be completed, the installation process is simplified, the installation alignment error caused by multiple installations of the antenna unit is reduced, and the performance simulation error and actual error of the antenna unit are avoided from being increased.

Description

Technical Field

[0001] This invention relates to the field of antenna technology, and in particular to a dual-frequency dielectric resonant antenna and communication device. Background Technology

[0002] According to 3GPP TS38.101-2 5G Terminal RF Technical Specification and TR38.817 Terminal RF Technical Report, the 5G mmWave frequency bands include n257 (26.5-29.5GHz), n258 (24.25-27.25GHz), n260 (37-40GHz), n261 (27.5-28.35GHz), and the newly added n259 (39.5-43GHz). Clearly, in 5G millimeter-wave mobile terminal communication, we can use multiple antennas to cover the above frequency bands, but this will inevitably reduce the terminal's space. Therefore, using a single antenna to achieve dual-band or even multi-band characteristics will simplify the structure and design process of integrated antennas.

[0003] Generally speaking, multi-band microstrip patch antennas are the first choice for most designers because they have advantages such as simple structure, clear principle, and acceptable performance. However, their drawbacks, such as the need for complex dielectric substrate stack-up structures and non-integrated dual-band implementation methods, pose challenges to the application of current 5G millimeter-wave dual-band antennas.

[0004] A typical 5G terminal millimeter-wave antenna design is a 1x4 unit, which requires four discrete dielectric resonators for installation. This means that the bonding and fixing process also requires four steps. This design method results in a large error between the simulated and actual antenna performance.

[0005] If the millimeter-wave antenna of a 5G terminal is designed as an integrated 4-unit module, and the installation only needs to be done once, the uncertainties can be reduced and mass production can be facilitated. Therefore, an integrated 4-unit dielectric resonator module is urgently needed. Summary of the Invention

[0006] The main technical problem solved by the embodiments of the present invention is to provide a dual-frequency dielectric resonant antenna and communication equipment, which can simplify the installation process and reduce uncertainties.

[0007] To solve the above-mentioned technical problems, one technical solution adopted in this embodiment of the invention is: a dual-frequency dielectric resonant antenna, including a substrate, a feeding unit, and an antenna unit; the substrate is provided with a plurality of feeding slots; the feeding unit is disposed on the substrate and coupled to the feeding slots; the antenna unit includes a plurality of dielectric resonators, all of which are disposed on the substrate and are sequentially connected in the same direction to form a whole, and one dielectric resonator is connected to one feeding slot.

[0008] Optionally, the antenna element may also include several through holes, one of which is disposed between one dielectric resonator and another dielectric resonator.

[0009] Optionally, the antenna unit further includes several metal plating layers, one of which surrounds and adheres to the sidewall of a through hole; wherein, after the metal plating layer surrounds and adheres to the sidewall of the through hole, the middle of the metal plating layer has a receiving cavity for receiving solder, and the antenna unit is fixed to the substrate by soldering.

[0010] Optionally, the dielectric resonator can be shaped like an "I".

[0011] Optionally, the number of dielectric resonators is four, and the four dielectric resonators are connected in sequence along the same direction to form a whole.

[0012] Optionally, it also includes an RF chip, which is disposed on the side of the substrate away from the antenna unit and is connected to the feed unit.

[0013] Optionally, the power supply unit includes a first power supply line and a second power supply line; the substrate includes a first plate, a second plate, and a third plate, which are connected sequentially by a dielectric, and a first interlayer and a second interlayer are formed between the first plate, the second plate, and the third plate. The substrate also includes a first metallized via and a second metallized via, the first metallized via connecting the first interlayer and the second interlayer, and the second metallized via connecting the second interlayer and the outside; the first power supply line is disposed in the first interlayer, the second power supply line is disposed in the second interlayer, one end of the first power supply line and one end of the second power supply line are connected through the first metallized via, the other end of the first power supply line is connected to the power supply gap, and the other end of the second power supply line is connected to the RF chip through the second metallized via.

[0014] Optionally, the substrate further includes a fourth plate and a fifth plate; the fourth plate and the fifth plate are connected sequentially below the third plate through a dielectric, and a third interlayer and a fourth interlayer are formed between the third plate, the fourth plate and the fifth plate, and a second metallized via penetrates the third interlayer and the fourth interlayer, which are used to place analog and digital circuits.

[0015] Optionally, it may also include several isolation posts that surround and enclose the second feeder line.

[0016] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of the present invention is to provide a communication device, including the above-mentioned dual-frequency dielectric resonant antenna.

[0017] The beneficial effects of this invention are as follows: Unlike the prior art, this invention forms an integrated antenna unit by sequentially connecting several dielectric resonators in the same direction. This allows the integrated dielectric resonators to be glued and fixed only once to complete the installation of the antenna unit, simplifying the installation process, reducing the installation alignment error caused by multiple installations of the antenna unit, and avoiding an increase in the performance simulation error between the antenna unit and the actual performance. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in specific embodiments of the present invention or the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0019] Figure 1 This is a schematic diagram of the overall structure of the antenna in an embodiment of the present invention;

[0020] Figure 2 This is an explosion of the overall structure of the antenna in the embodiment of the present invention. Figure 1 ;

[0021] Figure 3 This is an explosion of the overall structure of the antenna in the embodiment of the present invention. Figure 2 ;

[0022] Figure 4 This is a schematic diagram of the antenna feeding unit in an embodiment of the present invention;

[0023] Figure 5 This is an S-parameter diagram of the antenna in an embodiment of the present invention;

[0024] Figure 6 This is the 28GHz 3D radiation pattern of the antenna in this embodiment of the invention;

[0025] Figure 7 This is the 3D radiation pattern of the antenna at 39 GHz in this embodiment of the invention.

[0026] In the figure: 1. Substrate, 10. Feed gap, 11. First plate, 12. Second plate, 13. Third plate, 14. Fourth plate, 15. Fifth plate, 16. First interlayer, 17. Second interlayer, 18. Third interlayer, 19. Fourth interlayer, 2. Feed unit, 20. First feed line, 21. Second feed line, 3. Antenna unit, 30. Dielectric resonator, 31. Through hole, 32. Metal plating, 4. RF chip, 5. Isolation pillar. Detailed Implementation

[0027] To facilitate understanding of the present invention, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0029] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0030] Please see Figures 1 to 7 A dual-frequency dielectric resonant antenna includes a substrate 1, a feeding unit 2, and an antenna unit 3. The substrate 1 is provided with a plurality of feeding slots 10. The feeding unit 2 is disposed on the substrate 1 and coupled to the feeding slots 10. The antenna unit 3 includes a plurality of dielectric resonators 30, all of which are disposed on the substrate 1 and are connected sequentially in the same direction to form a whole. One dielectric resonator 30 is connected to one feeding slot 10. The dielectric resonator 30 is in the shape of an I-beam.

[0031] In one embodiment, for the overall structure of the antenna element 3, the dielectric resonator 30 is shaped like an I-beam with the same length for both the upper and lower base sides, and the bottoms of several dielectric resonators 30 are connected in pairs to form an integrated plurality of dielectric resonators 30. In actual simulation, as shown... Figure 5As shown in the diagram, the S-parameters of the antenna are less than -10dB at 28GHz and less than -15dB at 39GHz. Therefore, the I-shaped dielectric resonator 30 can excite 5G millimeter waves in the 28GHz and 39GHz bands, enabling it to achieve integrated single-unit coverage of dual frequencies. Consequently, the antenna element 3 covers both the 28GHz and 39GHz bands.

[0032] For the overall structure of the antenna, during assembly, the antenna unit 3 is installed on one side of the substrate 1, and several dielectric resonators 30 are connected to several feed slots 10 in a one-to-one correspondence. The other side of the substrate 1 is used to install the radio frequency chip 4. The feed unit 2 is installed inside the substrate 1, and one end of the feed unit 2 extends to one side of the substrate 1 and is connected to the feed slot 10. The other end of the feed unit 2 extends to the other side of the substrate 1 and is connected to the radio frequency chip 4.

[0033] In another embodiment, since the antenna is usually a 1x4 unit structure in practical applications, that is, the antenna unit 3 is formed by four discrete dielectric resonators 30. Therefore, the number of dielectric resonators 30 is four, and the four dielectric resonators 30 are connected in sequence along the same direction to form a whole. The number of feed gaps 10 also corresponds to the number of dielectric resonators 30, which is four. The four feed gaps 10 are evenly distributed along the direction in which the four dielectric resonators 30 are connected in sequence.

[0034] Furthermore, regarding antenna element 3 mentioned above, please refer to... Figures 1 to 3 The antenna unit 3 also includes several through holes 31, one through hole 31 being disposed between one dielectric resonator 30 and another dielectric resonator 30. In addition, the antenna unit 3 also includes several metal plating layers 32, one metal plating layer 32 being attached to the sidewall of one through hole 31. When the metal plating layer 32 is attached to the sidewall of the through hole 31, the middle part of the metal plating layer 32 has a receiving cavity for receiving solder, and the antenna unit 3 is fixed to the substrate 1 by soldering.

[0035] In one embodiment, the through-hole 31 is circular. Since the metal plating layer 32 surrounds and adheres to the sidewall of the through-hole 31, the metal plating layer 32 is also circular. That is, the shape of the through-hole 31 is the same as the shape of the metal plating layer 32. In addition, the height of the through-hole 31 is the same as the height of the metal plating layer 32. By having the same height and shape, the metal plating layer 32 completely covers the sidewall of the through-hole 31. During assembly, several dielectric resonators 30 are first connected one-to-one with several feeding gaps 10. Then, molten solder is poured into the receiving cavity in the middle of several metal plating layers 32. Finally, the cooled solder is fixed to the surface of one side of the substrate 1. The cooled solder is also fixed to the sidewall of several metal plating layers 32, thereby realizing the fixation of several integrated dielectric resonators 30 to the surface of one side of the substrate 1. During operation, coupling occurs between different dielectric resonators 30, meaning energy from one dielectric resonator 30 can be transferred to another. Therefore, the presence of several metal plating layers 32 prevents energy transfer between the dielectric resonators 30, achieving decoupling and thus avoiding mutual interference, ensuring normal operation. It should be noted that the number of vias 31 is the same as the number of metal plating layers 32, and both are one less than the number of dielectric resonators 30.

[0036] In one embodiment, since different metals are used for the metal plating layer 32, the resulting decoupling effect is different. Therefore, in practical applications, considering both production cost and decoupling effect, the preferred material for the metal plating layer 32 is copper.

[0037] Furthermore, for the overall structure of the aforementioned antenna, please refer to [link / reference needed]. Figures 1 to 3 It also includes an RF chip 4, which is disposed on the side of the substrate 1 away from the antenna unit 3, and is connected to the feed unit 2.

[0038] In one embodiment, the radio frequency (RF) chip 4 is fixed to the side of the substrate 1 opposite to the antenna element 3 by ball-bearing bonding. The RF chip 4 includes a phase shifter and an amplifier. The phase shifter provides a phase difference between the dielectric resonators 30 to achieve beam scanning capability, and the amplifier compensates for the losses of the phase shifter. Additionally, a digital integrated circuit chip and a power supply chip are disposed on the same side as the RF chip 4. The digital integrated circuit chip controls the amplitude and phase of the signal from the RF chip 4. The power supply chip provides power to the RF chip 4.

[0039] Furthermore, regarding the aforementioned power supply unit 2, please refer to... Figures 1 to 4The power supply unit 2 includes a first power supply line 20 and a second power supply line 21; the substrate 1 includes a first plate 11, a second plate 12 and a third plate 13, which are connected sequentially by a medium, and a first interlayer 16 and a second interlayer 17 are formed between the first plate 11, the second plate 12 and the third plate 13. The substrate 1 also includes a first metallized via and a second metallized via. The first metallized via connects the first interlayer 16 and the second interlayer 17, and the second metallized via connects the second interlayer 17 and the outside. The first power supply line 20 is disposed in the first interlayer 16, and the second power supply line 21 is disposed in the second interlayer 17. One end of the first power supply line 20 and one end of the second power supply line 21 are connected through the first metallized via. The other end of the first power supply line 20 is connected to the power supply gap 10, and the other end of the second power supply line 21 is connected to the radio frequency chip 4 through the second metallized via.

[0040] In one embodiment, the substrate 1 is a rectangular substrate 1, that is, the first plate 11, the second plate 12 and the third plate 13 are all rectangular plates. During assembly, the first plate 11, the second plate 12 and the third plate 13 are stacked in sequence, thereby forming a first interlayer 16 and a second interlayer 17 with a fixed height. The first feed line 20 and the second feed line 21 are respectively installed in the first interlayer 16 and the second interlayer 17. After the first feed line 20 and the second feed line 21 are installed in the first interlayer 16 and the second interlayer 17, the remaining part between the first interlayer 16 and the second interlayer 17 can be filled with dielectric.

[0041] The first feed line 20 has multiple first branches, and the second feed line 21 has multiple second branches. One end of a second branch is connected to one end of a first branch through a first metallized via, and the other end of a second branch is connected to the RF chip 4 through a second metallized via. The other end of a first branch is connected to a feed gap 10. Thus, a feed gap 10, a first branch, and a second branch are sequentially connected to form a complete feed line. It should be noted that the number of dielectric resonators 30, feed gaps 10, first branches, second branches, first metallized vias, and second metallized vias are all the same.

[0042] Furthermore, regarding the aforementioned substrate 1, please refer to... Figure 2 and Figure 3The substrate 1 also includes a fourth plate 14 and a fifth plate 15; the fourth plate 14 and the fifth plate 15 are connected in sequence below the third plate 13 through a medium, and a third interlayer 18 and a fourth interlayer 19 are formed between the third plate 13, the fourth plate 14 and the fifth plate 15, and a second metallized via penetrates the third interlayer 18 and the fourth interlayer 19, and the third interlayer 18 and the fourth interlayer 19 are used to place analog and digital circuits.

[0043] Furthermore, for the overall structure of the aforementioned antenna, please refer to [link / reference needed]. Figures 2 to 4 It also includes several isolation pillars 5, which surround and enclose the second feeder line 21. By setting several isolation pillars 5, the multiple second branches of the second feeder line 21 can be prevented from interfering with each other, thus playing the role of shielding and adjusting impedance.

[0044] In this embodiment of the invention, several dielectric resonators are connected sequentially in the same direction to form an integrated antenna unit. This allows the antenna unit to be installed by simply bonding and fixing the integrated dielectric resonators once, simplifying the installation process, reducing the alignment error caused by multiple installations of the antenna unit, and avoiding increased discrepancies between the simulated and actual performance of the antenna unit.

[0045] The present invention also provides an embodiment of a communication device, which includes the above-mentioned dual-frequency dielectric resonant antenna. For the specific structure and function of the above-mentioned dual-frequency dielectric resonant antenna, please refer to the above embodiments, which will not be repeated here.

[0046] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A dual frequency dielectric resonant antenna, characterized by, Comprising: A substrate provided with a plurality of feeding slots; A feeding unit disposed on the substrate, the feeding unit being coupled to the feeding slots; An antenna unit including a plurality of dielectric resonators, the plurality of dielectric resonators being all disposed on the substrate, and the plurality of dielectric resonators being connected in sequence along the same direction to form an integral body, one of the dielectric resonators being connected to one of the feeding slots, the antenna unit further including a plurality of through holes and a plurality of metal coatings, one through hole being disposed between one dielectric resonator and another dielectric resonator, and one metal coating being circumferentially fitted around the side wall of one through hole; Wherein, after the metal coating is circumferentially fitted around the side wall of the through hole, a receiving cavity is formed in the middle of the metal coating, and the receiving cavity is used for receiving solder, and the antenna unit is fixed to the substrate through the solder.

2. The dual-band dielectric resonator antenna according to claim 1, characterized by The shape of the dielectric resonator is "I"-shaped.

3. The dual band dielectric resonator antenna according to claim 1, wherein, The number of the plurality of dielectric resonators is four, and the four dielectric resonators are connected in sequence along the same direction to form an integral body.

4. The dual band dielectric resonator antenna according to claim 1, wherein, It further includes a radio frequency chip, the radio frequency chip being disposed on a side of the substrate背离 the antenna unit, and the radio frequency chip being connected to the feeding unit.

5. The dual band dielectric resonator antenna according to claim 4, wherein, The feeding unit includes a first feeding line and a second feeding line; The substrate includes a first plate, a second plate and a third plate, the first plate, the second plate and the third plate being sequentially connected through a dielectric, and a first interlayer and a second interlayer are formed between the first plate, the second plate and the third plate, the substrate further includes a first metallized via and a second metallized via, the first metallized via connecting the first interlayer and the second interlayer, and the second metallized via connecting the second interlayer and the outside; The first feeding line is disposed in the first interlayer, the second feeding line is disposed in the second interlayer, one end of the first feeding line and one end of the second feeding line are conducted through the first metallized via, the other end of the first feeding line is conducted with the feeding slot, and the other end of the second feeding line is conducted with the radio frequency chip through the second metallized via.

6. The dual band dielectric resonator antenna according to claim 5, wherein, The substrate further includes a fourth plate and a fifth plate; The fourth plate and the fifth plate are sequentially connected to the lower side of the third plate through a dielectric, a third interlayer and a fourth interlayer are formed between the third plate, the fourth plate and the fifth plate, and the second metallized via penetrates through the third interlayer and the fourth interlayer, and the third interlayer and the fourth interlayer are used for placing analog and digital circuits.

7. The dual band dielectric resonator antenna according to claim 5, wherein, It further includes a plurality of isolation columns, the plurality of isolation columns surrounding and enclosing the second feeding line.

8. A communication device, characterized by Including the dual-band dielectric resonator antenna according to any one of claims 1-7.

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