Drive components and camera modules

Abstract

Disclosed are a drive assembly and camera module. The drive assembly utilizes a circuit board's elastic member assembly as the reset and limiter elements of the SMA actuator, reducing the overall height of the chip's anti-shake system through component reuse. Furthermore, in the drive assembly, the chip's anti-shake movable portion and at least one SMA wire are positioned above the inner circuit board, while the outer circuit board is secured to a substrate. This arrangement more fully utilizes the internal space of the chip's anti-shake fixed portion, reducing the overall height of the drive assembly.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and in particular to a driving assembly and a camera module, wherein the driving assembly uses an elastic component group of a circuit board as a reset and limiting element of an SMA driver to reduce the overall height size of a chip anti-shake part by reusing components. Background Art

[0002] With the popularization of mobile electronic devices, the relevant technologies of camera modules used in mobile electronic devices to help users obtain images (for example, videos or pictures) have developed and progressed rapidly. In recent years, camera modules have been widely used in many fields such as medical care, security, and industrial production.

[0003] Consumers are increasingly demanding and diverse functionalities in camera modules for mobile electronic devices. For example, they are demanding image stabilization. Understandably, when using mobile electronic devices to record video, the human body experiences certain physiological tremors and movement-induced jitters, which can lead to poor image quality. Therefore, it is desirable for mobile electronic devices to be equipped with image stabilization devices that drive the optical lens or photosensitive chip to achieve optical image stabilization.

[0004] Currently, a variety of solutions have been applied to solve the anti-shake problem of camera modules. One of the major technical difficulties is that the anti-shake structure will increase the size of the camera module, which is contrary to the development trend of mobile electronic devices towards lightweight and thinness.

[0005] Therefore, an optimized anti-shake structure for camera modules is expected to meet the dual technical requirements of anti-shake and structural design. Summary of the Invention

[0006] One advantage of the present application is that it provides a driving component and a camera module, wherein the driving component reduces the overall height size of the chip anti-shake part by reusing the reset and limit elements of the SMA driver of the elastic member group of the circuit board.

[0007] Another advantage of the present application is that it provides a driving assembly and a camera module, wherein the chip anti-shake movable part and at least one SMA wire are located above the inner circuit board of the circuit board and the outer circuit board of the circuit board is fixed to the base. Through such a position arrangement, the internal space of the chip anti-shake fixed part is more fully utilized so that the overall height size of the driving assembly can be reduced.

[0008] Other advantages and features of the present application will become apparent from the following description, and may be achieved by means of the instruments and combinations particularly pointed out in the claims.

[0009] To achieve at least one of the above advantages, the present application provides a drive assembly, comprising:

[0010] A chip anti-shake fixing portion having a receiving cavity, wherein the chip anti-shake fixing portion includes at least one fixing portion;

[0011] A chip anti-shake movable part located in the receiving cavity, wherein the chip anti-shake movable part includes at least one movable part and a movable carrier that can be linked to the at least one movable part;

[0012] a circuit board fixed within the receiving cavity, wherein the circuit board comprises an outer circuit board, an inner circuit board, and an elastic member group extending between the inner circuit board and the outer circuit board, the inner circuit board being suspended within the outer circuit board by the elastic member group and movable relative to the outer circuit board, wherein the inner circuit board has a photosensitive chip mounting area formed on its upper surface, the movable carrier is attached to a periphery of the photosensitive chip mounting area, and the at least one fixing portion is fixed to the upper surface of the outer circuit board;

[0013] a driving element comprising at least one SMA wire extending between the at least one fixed portion and the at least one movable portion, the at least one SMA wire being higher than an upper surface of the outer circuit board;

[0014] Among them, when the at least one SMA wire is driven, the at least one SMA wire is suitable for actuating the at least one movable part to drive the movable carrier of the chip anti-shake movable part, thereby driving the inner circuit board of the circuit board to move relative to the outer circuit board. In this way, it is suitable for driving the photosensitive chip installed on the inner circuit board to move, and the elastic member group of the circuit board is suitable for resetting the inner circuit board.

[0015] In the driving assembly according to the present application, the anti-shake fixed part includes a base and an upper cover buckled with the base, the receiving cavity is formed between the upper cover and the base, the receiving cavity has a first corner, a third corner opposite to the first corner, a second corner, and a fourth corner opposite to the second corner, wherein the at least one SMA wire, the at least one fixed part, and the chip anti-shake movable part are located between the external circuit board and the upper cover.

[0016] In the driving assembly according to the present application, the at least one movable part includes a first movable part and a second movable part located at the fourth corner, and a third movable part and a fourth movable part located at the second corner, wherein the at least one fixed part includes a first fixed part and a second fixed part arranged on the upper surface of the external circuit board and located at the first corner, and a third fixed part and a fourth fixed part arranged on the upper surface of the external circuit board and located at the third corner, wherein the at least one SMA wire includes a first SMA wire extending between the first fixed part and the second movable part, a second SMA wire extending between the second fixed part and the third movable part, a third SMA wire extending between the third fixed part and the fourth movable part, and a fourth SMA wire extending between the fourth fixed part and the first movable part.

[0017] In the driving assembly according to the present application, the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located in the same plane, and the plane where the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire are located is parallel to the plane where the inner circuit board is located, wherein the first SMA wire is parallel to the third SMA wire, and the first SMA wire is perpendicular to the second SMA wire, and the first SMA wire is perpendicular to the fourth SMA wire, and the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire have the same length.

[0018] In the driving assembly according to the present application, in the Z-axis direction set by the driving assembly, there is a gap between the first SMA wire, the second SMA wire, the third SMA wire and the fourth SMA wire and the elastic member group, and the gap is greater than or equal to 0.1 mm.

[0019] In the driving assembly according to the present application, the outer circuit board of the circuit board is fixed to the inner bottom surface of the base.

[0020] In the driving assembly according to the present application, the inner circuit board is higher than the outer circuit board so that the elastic member group is in a stretched state.

[0021] In the driving assembly according to the present application, the driving assembly further includes a supporting assembly disposed on the base and supporting the inner circuit board thereon.

[0022] In the driving assembly according to the present application, a height difference between the inner circuit board and the outer circuit board is between 0.05 mm and 0.1 mm.

[0023] In the driving assembly according to the present application, the force exerted by the inner circuit board on the supporting assembly is between 20 mN and 50 mN.

[0024] In the driving assembly according to the present application, the support assembly includes at least three supporting protrusions protruding from the base and arranged in a non-completely collinear manner.

[0025] In the driving component according to the present application, the driving component also includes an anti-collision component arranged on the movable carrier, and the anti-collision component includes at least one anti-collision upper protrusion arranged on the upper surface of the movable carrier and located between the upper surface of the movable carrier and the upper cover, and the at least one anti-collision upper protrusion is higher than the upper surfaces of the first to fourth movable parts.

[0026] In the driving assembly according to the present application, the anti-collision assembly also includes at least one lower anti-collision protrusion arranged on the lower surface of the movable carrier and located between the lower surface of the movable carrier and the upper surface of the external circuit board, and the at least one anti-collision lower protrusion is lower than the lower surfaces of the first to fourth movable parts.

[0027] In the driving assembly according to the present application, the movable carrier includes a movable carrier main body attached around the photosensitive chip mounting area and a first movable carrier branch and a second movable carrier branch extending outward from two opposite diagonals of the movable carrier main body, wherein the first movable part and the second movable part are connected to the first movable carrier branch, and the first movable part and the second movable part are connected to the second movable carrier branch.

[0028] In the driving assembly according to the present application, the chip anti-shake fixing part also includes a first fixing carrier and a second fixing carrier fixed to the upper surface of the external circuit board and located at the first corner, and a third fixing carrier and a fourth fixing carrier fixed to the upper surface of the external circuit board and located at the third corner, wherein the first fixing part is fixedly stacked on the first fixing carrier, the second fixing part is fixedly stacked on the second fixing carrier, the third fixing part is fixedly stacked on the third fixing carrier, and the fourth fixing part is fixedly stacked on the fourth fixing carrier.

[0029] In the driving assembly according to the present application, the first fixed carrier is electrically connected to the external circuit board, and the first fixing portion is electrically connected to the first fixed carrier, so that the end of the first SMA wire fixed to the first fixing portion is electrically connected to the external circuit board; the second fixed carrier is electrically connected to the external circuit board, and the second fixing portion is electrically connected to the second fixed carrier, so that the end of the second SMA wire fixed to the second fixing portion is electrically connected to the external circuit board; the third fixed carrier is electrically connected to the external circuit board, and the third fixing portion is electrically connected to the third fixed carrier, so that the end of the third SMA wire fixed to the third fixing portion is electrically connected to the external circuit board; the fourth fixed carrier is electrically connected to the external circuit board, and the fourth fixing portion is electrically connected to the fourth fixed carrier, so that the end of the fourth SMA wire fixed to the fourth fixing portion is electrically connected to the external circuit board.

[0030] In the driving component according to the present application, one end of the first SMA wire fixed to the second movable part is electrically connected to the second movable part, one end of the second SMA wire fixed to the third movable part is electrically connected to the third movable part, and one end of the third SMA wire fixed to the fourth movable part is electrically connected to the fourth movable part; one end of the fourth SMA wire fixed to the first movable part is electrically connected to the first movable part, wherein the first movable part, the second movable part, the third movable part and the fourth movable part are respectively electrically connected to the outer circuit board through the movable carrier, the inner circuit board and the elastic member group which are electrically connected to each other.

[0031] According to another aspect of the present application, a camera module is provided, comprising:

[0032] Optical lens;

[0033] Photosensitive chip; and

[0034] The driving component as described above, wherein the photosensitive chip is mounted on the inner circuit board.

[0035] Further objectives and advantages of the present application will be fully reflected through understanding of the following description and drawings.

[0036] These and other objects, features and advantages of the present application are fully reflected in the following detailed description, drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0038] Figure 1 The figure shows a three-dimensional schematic diagram of a camera module according to an embodiment of the present application.

[0039] Figure 2A This is a schematic diagram of the photosensitive component and chip anti-shake unit of the camera module according to an embodiment of the present application.

[0040] Figure 2B For the Figure 2A Schematic cross-section of midline segment AA.

[0041] Figure 3 3D exploded diagram of the chip anti-shake unit according to an embodiment of the present application.

[0042] Figure 4A This is a three-dimensional schematic diagram of the chip anti-shake unit after removing the upper cover according to an embodiment of the present application.

[0043] Figure 4B for Figure 4A A partially enlarged schematic diagram of the circular area A of the chip anti-shake part.

[0044] Figure 4C 2 is a partial schematic diagram of the chip anti-shake fixing part of the chip anti-shake part according to an embodiment of the present application.

[0045] Figure 4D for Figure 4A A partially enlarged schematic diagram of the circular area B of the chip anti-shake part.

[0046] Figure 5 This is a schematic diagram of a top view of the chip anti-shake unit after removing the upper cover according to an embodiment of the present application.

[0047] Figure 6 This is a schematic diagram of a top view of a circuit board according to an embodiment of the present application.

[0048] Figure 7A For the Figure 5 Schematic cross-section of midline segment BB.

[0049] Figure 7B for Figure 7A A partially enlarged schematic diagram of the rectangular area C of the chip anti-shake part. DETAILED DESCRIPTION

[0050] Below, the exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the exemplary embodiments described herein.

[0051] Exemplary camera module

[0052] like Figures 1 to 7B As shown, a camera module 1 according to an embodiment of the present application is illustrated, which includes a photosensitive component 30, an optical lens 10 held on the photosensitive path of the photosensitive component 30, and a driving component 20 for driving the optical lens 10 and / or the photosensitive component 30 to move to achieve optical performance adjustment, such as optical image stabilization, optical focus, etc.

[0053] Correspondingly, the optical lens 10 includes a lens barrel and a lens group installed in the lens barrel, the lens group includes at least one optical lens, and the number of the at least one optical lens can be one or more, and is not limited. It is worth mentioning that in the embodiment of the present application, the shape, type and size of the optical lens 10 are not limited, and it only needs to be able to collect imaging light. The photosensitive component 30 includes a circuit board 31 and a photosensitive chip 321 electrically connected to the circuit board 31, an electronic component 322 and a connector, wherein the photosensitive chip 321 is used to receive the external light imaging collected by the optical lens 10 and electrically connect to the external mobile electronic device through the circuit board 31 and the connector.

[0054] Specifically, the photosensitive chip 321 includes a photosensitive area and a non-photosensitive area. The photosensitive chip 321 is electrically connected to the circuit board 31 via a photosensitive chip pad located in the non-photosensitive area. For example, the photosensitive chip 321 can be electrically connected to the circuit board 31 by wire bonding (gold wire), welding, FC process (chip flip-chip) or RDL (rewiring layer technology). The photosensitive chip 321 is suitable for being fixed to the upper surface of the circuit board 31 by an adhesive medium (here, in the embodiment of the present application, the surface of the circuit board 31 facing the lens is defined as the upper surface).

[0055] In some embodiments of the present application, the photosensitive component 30 further includes a filter element 324, which is retained on the photosensitive path of the photosensitive chip 321 and is used to filter the imaging light entering the photosensitive chip 321. In a specific example, the filter element 324 is mounted on the base 323 of the photosensitive component 30 and corresponds to at least the photosensitive area of ​​the photosensitive chip 321. The base 323 is implemented as a separately molded plastic bracket, which is attached to the surface of the circuit board 31 through an adhesive medium and is used to support other components. Alternatively, the base 323 is implemented as a molded base, which is integrally formed at a preset position of the circuit board 31 through a molding process. Alternatively, the base 323 is implemented as a plastic base with metal parts embedded therein, which is formed through an insert injection molding process. This is not limited to the present application. It is worth mentioning that in other examples of the present application, the filter element 324 can also be installed at other positions of the camera module. For example, the filter element 324 is formed in the optical lens 10 (for example, as a layer of filter film attached to the surface of a certain optical lens of the optical lens 10).

[0056] The function of the driving component 20 is to change the relative positional relationship between the optical lens 10 and the photosensitive component 20, including but not limited to the relative positional relationship between the optical lens 10 and the photosensitive component 20 in the X-axis direction and / or in the Y-axis direction and / or in the Z-axis direction. Accordingly, in the embodiment of the present application, the driving component 20 includes a chip driving part 201, and the chip driving part 201 may include a chip anti-shake unit 21. The chip anti-shake unit 21 is suitable for driving the photosensitive chip 321 of the photosensitive component 30 to translate in the X-axis direction and the Y-axis direction and / or rotate around the Z-axis direction to achieve translational anti-shake and / or rotational anti-shake of the photosensitive component 30; or, the chip anti-shake unit 21 is suitable for driving the photosensitive chip 321 of the photosensitive component 30 to rotate around the X-axis direction and around the Y-axis direction to achieve tilt anti-shake of the photosensitive component 30. In the present application, the X-axis and Y-axis directions are perpendicular to each other, the plane where the X-axis and Y-axis directions are located is parallel to the surface of the photosensitive chip 321, and the Z-axis direction is perpendicular to the plane where the X-axis and Y-axis directions are located. In other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system.

[0057] That is to say, in the embodiment of the present application, one of the driving objects of the driving component 20 is the photosensitive chip 321 of the photosensitive component 30 so as to change the relative position relationship between the photosensitive chip 321 and the optical lens 10 by driving the photosensitive component 20 .

[0058] In some examples of the present application, the chip driving part 201 also includes a chip focusing part, that is, the chip driving part 201 can also drive the photosensitive chip 321 of the photosensitive component 30 to move along the optical axis (i.e., the Z-axis direction, perpendicular to the direction of the photosensitive chip 321) to realize the chip focusing function.

[0059] In an embodiment of the present application, the chip anti-shake unit 21 and the chip focus unit can be drive motors of the type of voice coil motor, piezoelectric motor, SMA (Shape Memory Alloy) motor, etc. Shape memory alloy is an alloy material that can completely eliminate its deformation at a lower temperature and restore its original shape before deformation after heating. For example, when a shape memory alloy is subjected to a limited plastic deformation below the phase transition temperature, it can be restored to its original shape before deformation by heating, wherein the temperature of the SMA wire can be changed by energizing the SMA wire.

[0060] In some specific examples of the present application, the drive assembly 20 may further include a lens drive portion 202, wherein the lens drive portion 202 includes a lens drive fixed portion, a lens drive movable portion, a lens suspension portion connecting the lens drive fixed portion and the lens drive movable portion, and a drive element. The optical lens 10 is mounted on the lens drive movable portion of the lens drive portion 202, and the drive element drives the lens drive movable portion and the optical lens 10 to move to achieve lens anti-shake or lens focus functions. That is, in other embodiments of the present application, the drive assembly 20 also drives the optical lens 10.

[0061] In one embodiment of the present application, the lens driving part 202 includes a lens focusing part, and the lens focusing part is suitable for driving the optical lens 10 to move along the optical axis to realize the lens focusing function; in another embodiment of the present application, the lens driving part 202 includes a lens focusing part and a lens anti-shake part, so that the lens driving part 202 is suitable for simultaneously realizing the lens focusing function and the lens anti-shake function; in another embodiment of the present application, the lens driving part 202 only includes a lens anti-shake part, so that the lens anti-shake part drives the optical lens 10 to move to realize the lens anti-shake function. It is worth mentioning that when the lens driving part 202 and the chip driving part 201 both have anti-shake functions, the camera module is suitable for simultaneously realizing the lens anti-shake and chip anti-shake functions, realizing the "dual OIS" function, thereby improving the anti-shake effect of the camera module.

[0062] In the embodiments of the present application, the lens focusing unit and the lens stabilization unit may be drive motors of a type such as a voice coil motor, a piezoelectric motor, or an SMA (Shape Memory Alloy) motor. When the lens stabilization unit is a voice coil motor, the drive element is a coil-magnet pair; when the lens stabilization unit is a piezoelectric motor, the drive element is a piezoelectric element; when the lens stabilization unit is an SMA motor, the drive element is an SMA wire.

[0063] like Figures 2A to 7B As shown, the chip anti-shake part of the driving component according to the embodiment of the present application is explained, wherein, Figure 2A Schematic diagram of the photosensitive component and chip anti-shake unit of the camera module according to an embodiment of the present application, Figure 2B For the Figure 2A Schematic diagram of the cross section of the midline segment AA, Figure 3 2 is a three-dimensional exploded schematic diagram of the chip anti-shake unit according to an embodiment of the present application. Figure 4A This is a three-dimensional schematic diagram of the chip anti-shake unit after removing the upper cover according to an embodiment of the present application. Figure 4B for Figure 4A 4C is a partial schematic diagram of the chip anti-shake fixing part of the chip anti-shake part according to an embodiment of the present application. Figure 4D for Figure 4A A partial enlarged schematic diagram of the circular area B of the chip anti-shake part, Figure 5 This is a schematic plan view of the chip anti-shake unit according to an embodiment of the present application, with the upper cover removed, as viewed from above. Figure 6 : is a schematic plan view of a circuit board according to an embodiment of the present application, Figure 7A For the Figure 5 Schematic diagram of the cross section of the midline segment BB, Figure 7B for Figure 7A A partially enlarged schematic diagram of the rectangular area C of the chip anti-shake part.

[0064] like Figure 2A and Figure 2B As shown, in the embodiment of the present application, the photosensitive component 30 includes a circuit board 31 and a mounting member 32 and a connector mounted on the circuit board 31. The circuit board 31 includes a circuit board body 311, a connecting strip and a connector portion (the connecting strip, the connector portion and the connector are not shown in the figure), the connector is mounted at the end of the connector portion, the connecting strip connects the circuit board body 311 and the connector portion and realizes electrical conduction between the circuit board body 311 and the connector portion.

[0065] like Figure 2B and Figure 5As shown, the circuit board body 311 includes an outer circuit board 3113, an inner circuit board 3111, and an elastic member group 3112 extending from the outer circuit board 3113 and the inner circuit board 3111, wherein the circuit board body 311 is electrically connected to the connecting strip and the connector through the outer circuit board 3113, thereby being electrically connected to an external mobile electronic device. In the embodiment of the present application, the mounting member 32 is suitable for being mounted on the upper surface of the inner circuit board 3111. The mounting member 32 includes a photosensitive chip 321 electrically connected to the inner circuit board 3111 (that is, in the embodiment of the application, the inner circuit board 3111 has a photosensitive region mounting area forming its upper surface, and the photosensitive chip mounting area is suitable for mounting the photosensitive chip 321 thereon. Here, the surface of the inner circuit board 3111 facing the optical lens 10 is defined as the upper surface of the inner circuit board 3111), an electronic component 322, and a base 323 mounted and fixed to the inner circuit board 3111 and a filter element 324 mounted on the base 323. Figure 2B and Figure 5 In the illustrated example, the photosensitive chip mounting area is at least a portion of the upper surface of the inner circuit board 3111. In one embodiment of the present application, the inner circuit board 3111 may be provided with a groove or a through-hole, and the photosensitive chip 321 is mounted and fixed in the groove or through-hole of the inner circuit board 3111 to reduce the height of the camera module. That is, in other examples of the present application, the photosensitive chip mounting area is a groove formed concavely on the upper surface of the inner circuit board 3111, or a through-hole formed through the upper and lower surfaces of the inner circuit board.

[0066] That is, the upper surface of the inner circuit board 3111 includes a photosensitive chip mounting area and a peripheral area surrounding the photosensitive chip mounting area, wherein the photosensitive chip 321 is mounted on the photosensitive chip mounting area, and the electronic component 322 and the base 323 are mounted on the peripheral area. Furthermore, in the embodiment of the present application, when the upper surface of the inner circuit board 3111 is partially recessed to form a groove or a through hole, the photosensitive chip mounting area serves as the groove or the through hole.

[0067] like Figure 5As shown, in the embodiment of the present application, the outer circuit board 3113 is arranged around the inner circuit board 3111, and the outer circuit board 3113 and the inner circuit board 3111 are connected by the elastic member group 3112, wherein the inner circuit board 3111 is suspended on the inner side of the outer circuit board 3113 by the elastic member group 3112. In this way, the inner circuit board 3111 can move relative to the outer circuit board 3113 under the action of an external force (for example, the inner circuit board 3111 can be translated, rotated or tilted relative to the outer circuit board 3113), and when the external force disappears, the inner circuit board 3111 can rely on the elasticity of the elastic member group 3112 to return to its initial position.

[0068] That is, in the embodiment of the present application, the circuit board 31 has at least the following characteristics compared to a conventional circuit board: (1) the circuit board 31 includes an inner circuit board 3111 and an outer circuit board 3113, and the inner circuit board 3111 and the outer circuit board 3113 are movable relative to each other; (2) after the inner circuit board 3111 moves relative to the outer circuit board 3113, the elastic member group 3112 can restore the inner circuit board 3111 to its original position; it is worth mentioning that the elastic member group 3112 can restore the inner circuit board 3111 to its original position; 112 can restore the inner circuit board 3111 to its original position, which means that the elastic member group 3112 can drive the inner circuit board 3111 to restore to its original position. The elastic member group provides a restoring force, but in the end the inner circuit board 3111 may not be able to restore to its original position but tends to restore to its original position. This should be understood by ordinary technicians in this field; (3) Due to the existence of the elastic member group 3112, the function of the circuit board 31 is reused (which will be explained in detail in the subsequent description).

[0069] Furthermore, in the embodiment of the present application, the elastic member group 3112 is also adapted to electrically connect the inner circuit board 3111 and the outer circuit board 3113, so that the photosensitive chip 321 mounted on the inner circuit board 3111 can be electrically connected to the outer circuit board 3113 via the inner circuit board 3111 and the elastic member group 3112. That is, in the embodiment of the present application, the elastic member group 3112 not only structurally connects the inner circuit board 3111 and the outer circuit board 3113, but also electrically connects the inner circuit board 3111 and the outer circuit board 3113.

[0070] In an embodiment of the present application, the elastic member group 3112 includes multiple elastic members. Preferably, the multiple elastic members have the same shape and are made of the same material, so that each of the multiple elastic members provides the same elastic force to the inner circuit board 3111. In one embodiment of the present application, the elastic member group 3112 is rotationally symmetrical with respect to the center of the inner circuit board 3111. That is, after rotating the elastic member group 3112 around its center by a certain angle, it is adapted to coincide with its original shape. Therefore, under external force, the inner circuit board 3111 can translate relative to the outer circuit board 3113 and rotate within the plane of the inner circuit board 3111. In another embodiment of the present application, the elastic member group 3112 is axisymmetric, so that the inner circuit board 3111 can be driven to translate and tilt relative to the outer circuit board 3113 by external force. The structure of the elastic member group 3112 can also have other irregular shapes, and the present application is not limited to this.

[0071] In such Figure 6 In the illustrated example, the outer circuit board 3113 is generally rectangular in structure, with a rectangular through-hole defined on its inner side. The inner circuit board 3111 is also rectangular and positioned within the rectangular through-hole of the outer circuit board 3113. The four inner side surfaces of the outer circuit board 3113 are parallel to the four outer side surfaces of the inner circuit board 3111. The elastic member assembly 3112 includes four elastic members, each disposed around the four corners of the inner circuit board 3111 and connecting one of the inner side surfaces of the outer circuit board 3113 and one of the outer side surfaces of the inner circuit board 3111, which are perpendicular to each other. In other words, the inner side surface of the outer circuit board 3113 and the outer side surface of the inner circuit board 3111, to which the elastic members are attached, are perpendicular to each other.

[0072] More specifically, in the embodiment of the present application, each elastic member includes at least one elastic arm. The at least one elastic arm extends from the outer side surface of the inner circuit board 3111 in a direction perpendicular to the outer side surface, away from the inner circuit board 3111, then bends and extends in a direction parallel to the outer side surface of the inner circuit board 3111, then bends and extends in a direction parallel to another outer side surface adjacent to the outer side surface, and finally extends in a direction perpendicular to the other outer side surface, away from the inner circuit board 3111, thereby connecting to the inner side surface of the outer circuit board 3113. In other words, the at least one elastic arm extends outward from the outer side surface of the inner circuit board 3111 through three 90° bends to connect to the inner side surface of the outer circuit board 3113. In the present application, when there are multiple elastic arms, the gaps between the multiple elastic arms can be equal or unequal, depending on the requirements for the outer circuit board 3113 to suspend the inner circuit board 3111 and ensure electrical continuity with the photosensitive chip 321. At least one electrical conductive circuit is provided on the elastic arm for providing electrical connection between the inner circuit board 3111 and the outer circuit board 3113. At least one electrical conductive circuit is provided on the elastic member for providing electrical connection between the inner circuit board 3111 and the outer circuit board 3113.

[0073] In one example of the present application, the four elastic members of the elastic member group 3112 are defined as a first elastic member 31121, a second elastic member 31122, a third elastic member 31123, and a fourth elastic member 31124. The four adjacent inner side surfaces of the outer circuit board 3113 are, in counterclockwise order, a first inner side surface 31131, a second inner side surface 31132, a third inner side surface 31133, and a fourth inner side surface 31134, and the adjacent inner side surfaces are perpendicular to each other. The four adjacent outer side surfaces of the inner circuit board 3111 are, in counterclockwise order, a first outer side surface 31111, a second outer side surface 31112, a third outer side surface 31113, and a fourth outer side surface 31114, and the adjacent outer side surfaces are perpendicular to each other. The first inner side surface 31131 is parallel to the first outer side surface 31111 , the second inner side surface 31132 is parallel to the second outer side surface 31112 , the third inner side surface 31133 is parallel to the third outer side surface 31113 , and the fourth inner side surface 31134 is parallel to the fourth outer side surface 31114 .

[0074] The first elastic member 31121 extends from the first outer side surface 31111 of the inner circuit board 3111 to the fourth inner side surface 31134 of the outer circuit board 3113, connecting the inner circuit board 3111 and the outer circuit board 3113. The second elastic member 31122 extends from the second outer side surface 31112 of the inner circuit board 3111 to the first inner side surface 31131 of the outer circuit board 3113, connecting the inner circuit board 3111 and the outer circuit board 3113. The third elastic member 31123 extends from the third outer side surface 31113 of the inner circuit board 3111 to the second inner side surface 31132 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113; the fourth elastic member 31124 extends from the fourth outer side surface 31114 of the inner circuit board 3111 to the third inner side surface 31133 of the outer circuit board 3113, and connects the inner circuit board 3111 and the outer circuit board 3113.

[0075] Furthermore, a method for manufacturing a circuit board 31 having the elastic member group 3112 (first elastic member 31121, second elastic member 31122, third elastic member 31123, and fourth elastic member 31124) is described. First, a base layer is provided, wherein the base layer includes a PI layer (polyimide layer); then, a metal layer is formed on one side of the PI layer of the base layer. The material of the metal layer can be titanium copper or other alloys. For example, copper material is deposited on one side of the PI layer of the base layer to form an electrical conductive circuit; then, the base layer is divided by laser cutting, mechanical cutting, etching, etc., and unnecessary portions of the base layer are removed to form at least one elastic arm, thereby forming the elastic members (first elastic member 31121, second elastic member 31122, third elastic member 31123, and fourth elastic member 31124). The base layer has a certain degree of elasticity, and the elastic arms formed are suitable for providing elastic force to restore the inner circuit board 3111. In other embodiments, the metal layer can be omitted. Alternatively, the base layer can include multiple PI layers to achieve multi-layer circuit conductivity. Accordingly, in the embodiment of the present application, the elastic member can also include an insulating layer that wraps the metal layer to prevent short circuits between the multiple elastic arms in the elastic member.

[0076] In the above embodiment, the base layer including the PI layer is a component of a common rigid-flex PCB. A rigid-flex PCB is a circuit board formed by combining a flexible circuit board and a rigid circuit board through processes such as lamination, and has the characteristics of both a flexible circuit board and a rigid circuit board. In other words, the elastic member of the circuit board 31 described in the present application can be formed by a portion of the circuit board 31. For example, the circuit board 31 described in the present application can be a rigid-flex PCB including the outer circuit board 3113, the inner circuit board 3111, and a flexible circuit board located between the outer circuit board 3113 and the inner circuit board 3111 and electrically connecting the outer circuit board 3113 and the inner circuit board 3111. The flexible circuit board of the circuit board 31 is divided by laser cutting, mechanical cutting, etching, or the like to form one or more elastic arms, thereby forming the elastic member. In this embodiment, by removing unnecessary portions of the flexible circuit board, four groups of elastic members are formed, forming a rotationally symmetrical elastic member group 3112. Furthermore, the flexible circuit board of the circuit board 31 may be provided with other components such as a metal layer made of titanium copper or other alloys to enhance the elasticity (K value) of the elastic member.

[0077] Furthermore, in the embodiments of the present application, Figures 2A to 7B As shown, the chip anti-shake unit 21 includes a chip anti-shake fixed portion 211, a chip anti-shake movable portion 212, a driving element for driving the chip anti-shake movable portion 212 to move relative to the chip anti-shake fixed portion 211, and a chip anti-shake electrical connection portion. The driving element is used to drive the chip anti-shake movable portion 212 to move relative to the chip anti-shake fixed portion 211. The chip anti-shake electrical connection portion is electrically connected to the circuit board 31 and provides the electrical energy required for driving the driving element. Specifically, in the embodiment of the present application, the chip anti-shake fixed portion 211 has a receiving cavity, and the circuit board 31 is fixed in the receiving cavity. Specifically, the outer circuit board 3113 of the circuit board 31 is fixed in the receiving cavity, and the inner circuit board 3111 of the circuit board 31 is movable relative to the outer circuit board 3113. Furthermore, the chip anti-shake movable part 212 and the inner circuit board 3111 can be linked. For example, the chip anti-shake movable part 212 is installed and fixed on the inner circuit board 3111 of the circuit board 31, so that when the driving element drives the chip anti-shake movable part 212 to move relative to the chip anti-shake fixed part 211, the inner circuit board 3111 of the circuit board 31 moves relative to the outer circuit board 3113, thereby driving the photosensitive chip 321 installed on the inner circuit board 3111 to move, thereby realizing the chip anti-shake function.

[0078] It should be noted that in the embodiment of the present application, the elastic member group 3112 of the circuit board 31 forms a suspension system for the chip anti-shake unit 21, and the chip anti-shake movable part 212 is suspended in the chip anti-shake fixed part 211 via the elastic member group 3112. Specifically, the chip anti-shake movable part 212 is connected to the elastic member group 3112 via the inner circuit board 3111, and the chip anti-shake fixed part 211 is connected to the elastic member group 3112 via the outer circuit board 3113. Thus, the elastic member group 3112 serves as a suspension system to suspend the chip anti-shake movable part 212 in the chip anti-shake fixed part 211.

[0079] Figures 3 to 7B The specific structure of the chip anti-shake unit 21 is shown. The chip anti-shake fixed part 211 includes a base 2111 and an upper cover 2112, wherein the upper cover 2112 has an upper cover through hole 21121 (rectangular through hole) for providing a light aperture for the photosensitive chip 321 to obtain the imaging light converged by the optical lens 10. In the embodiment of the present application, the base 2111 and the upper cover 2112 are fixedly connected (for example, the base 2111 and the upper cover 2112 are buckled together to achieve a fixed connection), wherein the mutually buckled base 2111 and the upper cover 2112 form the receiving cavity to accommodate and protect the chip anti-shake movable part 212, the driving element, the photosensitive component 30 and other camera module components.

[0080] Accordingly, in the embodiment of the present application, the base 2111 includes a base body 21111 and a plurality of base side arms 21112 arranged around the base body 21111. Specifically, the four base side arms 21112 extend perpendicularly to and integrally with the base body 21111 along the four sides of the base body 21111 (i.e., the base body 21111 has a rectangular structure), wherein one of the four base side arms 21112 has a side arm opening 211121, so that a portion of the circuit board 31 can extend outward from the interior of the receiving cavity through the side arm opening 211121. In the embodiment of the present application, the receiving cavity of the chip anti-shake fixing portion 211 formed by the base 2111 and the upper cover 2112 has four corners in the counterclockwise direction, namely, a first corner, a second corner, a third corner, and a fourth corner.

[0081] In the embodiment of the present application, the outer circuit board 3113 of the circuit board 31 is fixed in the receiving cavity by bonding. Figure 2A and Figure 4AAs shown, the outer circuit board 3113 is fixed to the base 2111 by being attached to the inner bottom surface of the base 2111. That is, an adhesive is provided between the bottom surface of the outer circuit board 3113 and the inner bottom surface of the base so that the outer circuit board 3113 is bonded and fixed to the inner bottom surface of the base 2111. Here, the inner bottom surface of the base 2111 is the upper surface of the base body 21111.

[0082] It is worth mentioning that in other embodiments of the present application, the circuit board 31 can also be fixed in the receiving cavity of the chip anti-shake fixing part 211 by other means, which is not limited to the present application. For example, the outer circuit board 3113 of the circuit board 31 is clamped between the upper cover 2112 and the base 2111, so that the outer circuit board 3113 remains stationary relative to the chip anti-shake fixing part 211 (that is, the position of the outer circuit board 3113 in the receiving cavity is fixed).

[0083] like Figures 4A to 4D As shown, the chip anti-shake fixing portion 211 also includes a fixing carrier 2113 and four driving element fixing portions fixed to the fixing carrier 2113 (for ease of explanation, the four driving element fixing portions are defined as a first fixing portion 2114, a second fixing portion 2115, a third fixing portion 2116, and a fourth fixing portion 2117, respectively). In one embodiment of the present application, the fixing carrier 2113 is fixed to the upper surface of the external circuit board 3113 (here, the side surface of the external circuit board 3113 facing the optical lens 10 is defined as the upper surface) via an adhesive medium, and the four driving element fixing portions are further fixed to the external circuit board 3113.

[0084] More specifically, in the embodiment of the present application, the first fixing portion 2114 and the second fixing portion 2115 are disposed at the first corner of the receiving cavity to form a first fixing group, and the third fixing portion 2116 and the fourth fixing portion 2117 are disposed at the third corner of the receiving cavity to form a second fixing group. Accordingly, in the embodiment of the present application, the external circuit board 3113 also has four corners, wherein the first corner of the external circuit board 3113 corresponds to the first corner of the receiving cavity, the second corner of the external circuit board 3113 corresponds to the second corner of the receiving cavity, the third corner of the external circuit board 3113 corresponds to the third corner of the receiving cavity, and the fourth corner of the external circuit board 3113 corresponds to the fourth corner of the receiving cavity. That is to say, in the embodiment of the present application, the first fixing portion 2114 and the second fixing portion 2115 are arranged at the first corner of the outer circuit board 3113 to form a first fixing group, and the third fixing portion 2116 and the fourth fixing portion 2117 are arranged at the third corner of the outer circuit board 3113 to form a second fixing group.

[0085] Furthermore, in the embodiment of the present application, the chip anti-shake movable part 212 includes a movable carrier 2121 and four driving element movable parts fixed to the movable carrier 2121 (for ease of explanation, the four driving element movable parts are defined as a first movable part 2122, a second movable part 2123, a third movable part 2124, and a fourth movable part 2125, respectively). In one embodiment of the present application, the movable carrier 2121 is fixed to the upper surface of the inner circuit board 3111 (the side of the inner circuit board 3111 facing the optical lens 10 is defined as the upper surface) via an adhesive medium. More specifically, the movable carrier 2121 is attached to the periphery of the photosensitive area mounting area on the upper surface of the inner circuit board 3111. That is, when the movable carrier 2121 is attached to the upper surface of the inner circuit board 3111, the movable carrier 2121 surrounds the photosensitive chip 321 disposed on the upper surface of the inner circuit board 3111. It should be understood that when the movable carrier 2121 is fixed to the upper surface of the inner circuit board 3111, the four movable parts of the driving elements are fixed to the inner circuit board 3111, that is, when the movable parts of the driving elements are driven, the movable parts of the driving elements can drive the inner circuit board 3111 to move relative to the outer circuit board 3113.

[0086] In the embodiment of the present application, the first movable portion 2122 and the second movable portion 2123 are disposed at the fourth corner to form a first movable group, and the third movable portion 2124 and the fourth movable portion 2125 are disposed at the second corner to form a second movable group. In other words, the first movable group is located at the fourth corner of the outer circuit board 3113, and the second movable group is located at the second corner of the outer circuit board 3113. In other words, in a counterclockwise direction, the first fixed group, the first movable group, the second fixed group, and the second movable group are alternately distributed at the four corners of the receiving cavity. In other words, the first fixed group, the second movable group, the second fixed group, and the first movable group are alternately distributed at the four corners of the outer circuit board 3113.

[0087] Accordingly, in the embodiment of the present application, the driving element of the chip anti-shake part 21 includes four SMA wires 213 respectively fixed between the four driving element fixed parts and the four driving element movable parts (for the convenience of explanation, the four SMA wires are respectively defined as the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134), wherein the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are arranged adjacent to each other counterclockwise.

[0088] Specifically, in the embodiment of the present application, two ends of the first SMA wire 2131 are respectively fixed to the first fixed portion 2114 and the second movable portion 2123; two ends of the second SMA wire 2132 are respectively fixed to the second fixed portion 2115 and the third movable portion 2124; two ends of the third SMA wire 2133 are respectively fixed to the fourth movable portion 2125 and the third fixed portion 2116; and two ends of the fourth SMA wire 2134 are respectively fixed to the fourth fixed portion 2117 and the first movable portion 2122. By driving the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133, and the fourth SMA wire 2134 to extend and retract, the movable carrier 2121 is driven to move relative to the fixed carrier 2113, and the inner circuit board 3111 is driven to move relative to the outer circuit board 3113, thereby achieving chip anti-shake.

[0089] Furthermore, in an embodiment of the present application, the fixing carrier 2113 includes a first fixing carrier 21131, a second fixing carrier 21132, a third fixing carrier 21133 and a fourth fixing carrier 21134 respectively fixed to the outer circuit board 3113, wherein the first fixing portion 2114 is fixed to the outer circuit board 3113 through the first fixing carrier 21131, the second fixing portion 2115 is fixed to the outer circuit board 3113 through the second fixing carrier 21132, the third fixing portion 2116 is fixed to the outer circuit board 3113 through the third fixing carrier 21133, and the fourth fixing portion 2117 is fixed to the outer circuit board 3113 through the fourth fixing carrier 21134. More specifically, in an embodiment of the present application, the first fixing carrier 21131 and the second fixing carrier 21132 are fixed in an overlapping manner to the first corner of the outer circuit board 3113, wherein the first fixing portion 2114 is fixed in an overlapping manner to the first fixing carrier 21131, and the second fixing portion 2115 is fixed in an overlapping manner to the second fixing carrier 21132. In this way, the first fixing portion 2114 and the second fixing portion 2115 are fixed at the first corner of the outer circuit board 3113. Correspondingly, the third fixing carrier 21133 and the fourth fixing carrier 21134 are fixed at the third corner of the outer circuit board 3113 in an overlapping manner, wherein the third fixing portion 2116 is fixed at the third fixing carrier 21133 in an overlapping manner, and the fourth fixing portion 2117 is fixed at the fourth fixing carrier 21134 in an overlapping manner. In this way, the third fixing portion 2116 and the fourth fixing portion 2117 are fixed at the third corner of the outer circuit board 3113.

[0090] More specifically, the movable carrier 2121 includes a movable carrier body 21211 fixed to the upper surface of the inner circuit board 3111 and two movable carrier branches located at opposite corners of the movable carrier body 21211 (for ease of explanation, the two movable carrier branches are defined as a first movable carrier branch 21211 and a second movable carrier branch 21212, respectively). That is, in the embodiment of the present application, the movable carrier 2121 includes a movable carrier body 21211 and the first movable carrier branch 21211 and the second movable carrier branch 21212 extending outward from two opposite corners of the movable carrier body 21211, wherein the movable carrier body 2111 is bonded and fixed to the upper surface of the inner circuit board 3111 by an adhesive medium, and more specifically, is fixed around the photosensitive chip mounting area on the upper surface of the inner circuit board 3111. It should be noted that the movable carrier body 21211 also has a movable carrier through hole 212111 to provide a through hole for the photosensitive chip 321 of the photosensitive component 30 to pass through for imaging light.

[0091] In particular, in the embodiment of the present application, the movable carrier body 21211 has a first corner, a second corner, a third corner, and a fourth corner, wherein the first corner of the movable carrier body 21211 corresponds to the first corner of the outer circuit board 3113, the second corner of the movable carrier body 21211 corresponds to the second corner of the outer circuit board 3113, the third corner of the movable carrier body 21211 corresponds to the third corner of the outer circuit board 3113, and the fourth corner of the movable carrier body 21211 corresponds to the fourth corner of the outer circuit board 3113. Accordingly, in the embodiment of the present application, the first movable carrier branch 21211 extends from the fourth corner of the movable carrier body 21211 to the fourth corner of the outer circuit board 3113, and the second movable carrier branch 21212 extends from the second corner of the movable carrier body 21211 to the second corner of the outer circuit board 3113.

[0092] Furthermore, in an embodiment of the present application, the first movable part 2122 is fixed to the first movable carrier branch 21211 by bonding or integral molding, and the second movable part 2123 is fixed to the first movable carrier branch 21211 by bonding or integral molding. In this way, the first movable part 2122 and the second movable part 2123 are arranged at the fourth corner of the receiving cavity (or, the fourth corner of the external circuit board 3113); the third movable part 2124 is fixed to the second movable carrier branch 21212 by bonding or integral molding, and the fourth movable part 2125 is fixed to the second movable carrier branch 21212 by bonding or integral molding. In this way, the third movable part 2124 and the fourth movable part 2125 are arranged at the second corner of the receiving cavity (or, the second corner of the external circuit board 3113).

[0093] It should be noted that in the embodiment of the present application, there is a gap between the first movable part 2122, the second movable part 2123, the third movable part 2124 and the fourth movable part 2125 and the outer circuit board 3113. More specifically, in the embodiment of the present application, the first movable part 2122, the second movable part 2123, the third movable part 2124 and the fourth movable part 2125 are located above the upper surface of the outer circuit board 3113, that is, between the outer circuit board 3113 and the upper cover 2112.

[0094] Furthermore, in this embodiment of the present application, each of the drive element fixing portions further includes a drive element fixing body and a drive element fixing end, wherein the drive element fixing end is in the shape of a clamp and clamps and fixes one end of the SMA wire. The first fixing portion 2114 includes an integrally formed first fixing body 21141 and a first fixing end 21142, the second fixing portion 2115 includes an integrally formed second fixing body 21151 and a second fixing end 21152, the third fixing portion 2116 includes an integrally formed third fixing body 21161 and a third fixing end 21162, and the fourth fixing portion 2117 includes an integrally formed fourth fixing body 21171 and a fourth fixing end 21172. Correspondingly, each of the movable parts of the driving element also includes a driving element movable body and a driving element movable end, wherein the first movable part 2122 includes a first movable body 21221 and a first movable end 21222, the second movable part 2123 includes a second movable body 21231 and a second movable end 21232, the third movable part 2124 includes a third movable body 21241 and a third movable end 21242, and the fourth movable part 2125 includes a fourth movable body 21251 and a fourth movable end 21252.

[0095] In particular, in the embodiment of the present application, the two ends of the first SMA wire 2131 are respectively fixed to the first fixed end 21142 and the second movable end 21232, the two ends of the second SMA wire 2132 are respectively fixed to the second fixed end 21152 and the third movable end 21242, the two ends of the third SMA wire 2133 are respectively fixed to the fourth movable end 21252 and the third fixed end 21162, and the two ends of the fourth SMA wire 2134 are respectively fixed to the fourth fixed end 21172 and the first movable end 21222.

[0096] In particular, in one embodiment of the present application, the four SMA wires 213 (the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134) are located on one side of the upper surface of the circuit board 31 (i.e., above the outer circuit board 3113 of the circuit board 31, or between the outer circuit board 3113 and the upper cover 2112). Through such a position setting, the height position of the photosensitive chip 321 can be set as low as possible (while still higher than the outer circuit board 3113), thereby reducing the height of the chip anti-shake part 21.

[0097] As shown in FIG4A , in the embodiment of the present application, the four SMA wires 213 located above the upper surface of the outer circuit board 3113 are located outside the inner circuit board 3111. In other examples of the present application, the four SMA wires 213 may be higher than the upper surface of the inner circuit board 3111.

[0098] In one embodiment of the present application, the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133, and the fourth SMA wire 2134 are located in the same plane, and the plane is parallel to the plane of the inner circuit board 3111. Thus, by driving the four SMA wires 213 to deform, the inner circuit board 3111 is driven to move within the plane of the inner circuit board 3111. In a specific embodiment of the present application, the first fixed end 21142, the second fixed end 21152, the third fixed end 21162, the fourth fixed end 21172, the first movable end 21222, the second movable end 21232, the third movable end 21242, and the fourth movable end 21252 are at the same height, thereby ensuring that the four SMA wires 213 have the same height.

[0099] In one embodiment of the present application, the distance between the first fixed end 21142 and the second movable end 21232, the distance between the second fixed end 21152 and the third movable end 21242, the distance between the fourth movable end 21252 and the third fixed end 21162, and the distance between the fourth fixed end 21172 and the first movable end 21222 are equal, so that the lengths of the first SMA wire 2131, the second SMA wire 2132, the third SMA wire 2133 and the fourth SMA wire 2134 are the same, thereby easily providing the same driving force and stroke.

[0100] In one embodiment of the present application, the first SMA wire 2131 and the third SMA wire 2133 are parallel, the second SMA wire 2132 and the fourth SMA wire 2134 are parallel, and the first SMA wire 2131 and the second SMA wire 2132 are perpendicular to each other, thereby driving the deformation of the four SMA wires 213 to drive the inner circuit board 3111 to translate in the X-axis direction or the Y-axis direction. It is worth mentioning that in some embodiments of the present application, the four SMA wires 213 are located outside the elastic member group 3112, so that when driving the inner circuit board 3111 to move, the four SMA wires 213 are less likely to interfere with the elastic member group 3112.

[0101] In an embodiment of the present application, the chip anti-shake electrical connection portion is used to provide driving power to the four SMA wires 213 to drive the deformation of the four SMA wires 213. For example, in a specific example of the present application, the chip anti-shake electrical connection portion is implemented as four driving element fixing portions, the fixed carrier 2113, four driving element movable portions and the movable carrier 2121, that is, the chip anti-shake electrical connection portion is formed by the four driving element fixing portions, the fixed carrier 2113, four driving element movable portions and the movable carrier 2121. For example, in one embodiment, the four driving element fixing portions, the fixed carrier 2113, four driving element movable portions and the movable carrier 2121 are all or partially made of conductive materials (for example, conductive metal materials, such as copper, stainless steel, etc.). Of course, in other examples of the present application, the chip anti-shake electrical connection portion can also be implemented in other forms. For example, the movable carrier 2121 includes a connection circuit embedded therein.

[0102] like Figure 4A and Figure 4B As shown, the first fixing carrier 21131 is fixed to and electrically connected to the external circuit board 3113, and the first fixing portion 2114 is fixed to and electrically connected to the first fixing carrier 21131, thereby electrically connecting one end of the first SMA wire 2131 and the external circuit board 3113. Specifically, the first fixing carrier 21131 is electrically connected to the external circuit board 3113 by welding a welding portion on the first fixing carrier 21131 to a welding pad on the external circuit board 3113. The welding portion on the first fixing carrier 21131 can be implemented as a through hole, and the first fixing portion 2114 is electrically connected to the first fixing carrier 21131 by welding or laser welding. The movable carrier 2121 is fixed and electrically connected to the inner circuit board 3111 , and the second movable portion 2123 is fixed and electrically connected to the movable carrier 2121 , thereby electrically connecting the other end of the first SMA wire 2131 and the inner circuit board 3111 to achieve electrical conduction of the first SMA wire 2131 .

[0103] Laser welding refers to setting the driving element fixing part on the fixed carrier 2113, irradiating the driving element fixing part with laser, and using high temperature to melt the driving element fixing part and the fixed carrier 2113. After stopping the laser irradiation, the temperature drops, and the driving element fixing part and the fixed carrier 2113 are welded to each other.

[0104] The second fixing carrier 21132 is fixed to and electrically connected to the external circuit board 3113, and the second fixing portion 2115 is fixed to and electrically connected to the second fixing carrier 21132, thereby electrically connecting one end of the second SMA wire 2132 to the external circuit board 3113. Specifically, the second fixing carrier 21132 is electrically connected to the external circuit board 3113 by welding a welding portion on the second fixing carrier 21132 to a welding pad on the external circuit board 3113. The welding portion on the second fixing carrier 21132 can be implemented as a through hole, and the second fixing portion 2115 is electrically connected to the second fixing carrier 21132 by welding or laser welding. The movable carrier 2121 is fixed and electrically connected to the inner circuit board 3111 , and the third movable portion 2124 is fixed and electrically connected to the movable carrier 2121 , thereby electrically connecting the other end of the second SMA wire 2132 and the inner circuit board 3111 , thereby achieving electrical conduction of the second SMA wire 2132 .

[0105] The third fixing carrier 21133 is fixed to and electrically connected to the external circuit board 3113, and the third fixing portion 2116 is fixed to and electrically connected to the third fixing carrier 21133, thereby electrically connecting one end of the third SMA wire 2133 to the external circuit board 3113. Specifically, the third fixing carrier 21133 is electrically connected to the external circuit board 3113 by welding a welding portion on the third fixing carrier 21133 to a welding pad on the external circuit board 3113. The welding portion on the third fixing carrier 21133 can be implemented as a through hole, and the third fixing portion 2116 is electrically connected to the third fixing carrier 21133 by welding or laser welding. The movable carrier 2121 is fixed and electrically connected to the inner circuit board 3111 , and the fourth movable portion 2125 is fixed and electrically connected to the movable carrier 2121 , thereby electrically connecting the other end of the third SMA wire 2133 and the inner circuit board 3111 , thereby achieving electrical conduction of the third SMA wire 2133 .

[0106] The fourth fixing carrier 21134 is fixed to and electrically connected to the outer circuit board 3113, and the fourth fixing portion 2117 is fixed to and electrically connected to the fourth fixing carrier 21134, thereby electrically connecting one end of the fourth SMA wire 2134 to the outer circuit board 3113. Specifically, the fourth fixing carrier 21134 is electrically connected to the outer circuit board 3113 by welding a welding portion on the fourth fixing carrier 21134 to a welding pad on the outer circuit board 3113. The welding portion on the fourth fixing carrier 21134 can be implemented as a through hole, and the fourth fixing portion 2117 is electrically connected to the fourth fixing carrier 21134 by welding or laser welding. The movable carrier 2121 is fixed and electrically connected to the inner circuit board 3111 , and the first movable portion 2122 is fixed and electrically connected to the movable carrier 2121 , thereby electrically connecting the other end of the fourth SMA wire 2134 and the inner circuit board 3111 , thereby achieving electrical conduction of the fourth SMA wire 2134 .

[0107] In one embodiment of the present application, the first movable portion 2122, the second movable portion 2123, the third movable portion 2124, and the fourth movable portion 2125 can be fixed to the movable carrier 2121 by integral molding. The external circuit board 3113 provides ground electrical conductivity to the first movable portion 2122, the second movable portion 2123, the third movable portion 2124, and the fourth movable portion 2125 through the movable carrier 2121.

[0108] That is, in the embodiment of the present application, the first fixing carrier 21131 is electrically connected to the external circuit board 3113, and the first fixing portion 2114 is electrically connected to the first fixing carrier 2113, so that the end of the first SMA wire 2131 fixed to the first fixing portion 2114 is electrically connected to the external circuit board 3113; the second fixing carrier 21132 is electrically connected to the external circuit board 3113, and the second fixing portion 2115 is electrically connected to the second fixing carrier 21132, so that the end of the second SMA wire 2132 fixed to the second fixing portion 2115 is electrically connected to the external circuit board 3113. circuit board 3113; the third fixed carrier 21133 is electrically connected to the external circuit board 3113, and the third fixed portion 2116 is electrically connected to the third fixed carrier 21133, so that the end of the third SMA wire 2133 fixed to the third fixed portion 2116 is electrically connected to the external circuit board 3113; the fourth fixed carrier 31134 is electrically connected to the external circuit board 3113, and the fourth fixed portion 2117 is electrically connected to the fourth fixed carrier 21134, so that the end of the fourth SMA wire 3134 fixed to the fourth fixed portion 2117 is electrically connected to the external circuit board 3113. One end of the first SMA wire 2131 fixed to the second movable part 2122 is electrically connected to the second movable part 2123, one end of the second SMA wire 2132 fixed to the third movable part 2124 is electrically connected to the third movable part 2123, and one end of the third SMA wire 2133 fixed to the fourth movable part 2125 is electrically connected to the fourth movable part 2125; one end of the fourth SMA wire 2134 fixed to the first movable part 2122 is electrically connected to the first movable part 2122, wherein the first movable part 2122, the second movable part 2123, the third movable part 2124 and the fourth movable part 2125 are electrically connected to the external circuit board 3113 through the movable carrier 2121.

[0109] It is worth mentioning that since the driving element fixing portion includes four separate first fixing portions 2114, second fixing portions 2115, third fixing portions 2116 and fourth fixing portions 2117, in order to ensure accurate positioning, the first fixing portion 2114 and the second fixing portion 2115 connected in one piece and the third fixing portion 2116 and the fourth fixing portion 2117 connected in one piece can be provided first, and after the installation and fixing are completed, the first fixing portion 2114 and the second fixing portion 2115, the third fixing portion 2116 and the fourth fixing portion 2117 can be separated. Specifically, referring to Figures 4A-4CThe two driving element fixing parts (the first fixing part 2114 and the second fixing part 2115 / the third fixing part 2116 and the fourth fixing part 2117) are connected by a bridge 2118 to form a fixing part mounting component. After the fixing part mounting component is installed and fixed to the fixing carrier 2113, the bridge 2118 is cut and separated by laser or other means, thereby obtaining the two driving element fixing parts (the first fixing part 2114 and the second fixing part 2115 / the third fixing part 2116 and the fourth fixing part 2117) respectively fixed to the fixing carrier 2113. In order to avoid damage to the fixed carrier 2113 when cutting and separating the bridge 2118, the fixed carrier 2113 (the first fixed carrier 21131, the second fixed carrier 21132, the third fixed carrier 21133, and the fourth fixed carrier 21134) is provided with a groove opposite to the cutting position, thereby increasing the distance between the fixed carrier 2113 and the cutting position and reducing the damage caused by cutting. After the cutting is completed, it is suitable to fill the groove of the fixed carrier 2113 with glue to seal the groove of the fixed carrier 2113, thereby reducing the risk of increased dirt in the camera module caused by particulate matter in the groove due to cutting.

[0110] It is worth mentioning that, although in the embodiment of the present application, the chip anti-shake fixed part 211 includes four driving element fixed parts (2114, 2115, 2116, 2117), the chip anti-shake movable part 212 includes four driving element movable parts (2122, 2123, 2124, 2125), the four driving element fixed parts (2114, 2115, 2116, 2117) and the four driving element movable parts (2122, 2123, 2124, 2125) are located at the receiving end of the chip anti-shake fixed part 211. The four corners of the cavity and the four SMA wires 213 (2131, 2132, 2133, 2134) extending between the four driving element fixed parts and the four driving element movable parts are taken as examples. It should be understood that in the embodiment of the present application, the chip anti-shake fixed part 211 includes at least one driving element fixed part, the chip anti-shake movable part 212 includes at least one driving element movable part, and includes at least one SMA wire 213 extending between the at least one driving element fixed part and the at least one driving element movable part.

[0111] For example, in a specific example of the present application, the at least one driving element fixed part includes a first fixed part 2114 and a second fixed part 2115 arranged at the first corner, and the at least one driving element movable part includes a second movable part 2123 arranged at the fourth corner and a third movable part 2124 arranged at the second corner, and the at least one SMA wire 213 includes a first SMA wire 2131 extending between the first fixed part 2114 and the second movable part 2123 and a second SMA wire 2132 extending between the second fixed part 2115 and the third movable part 2124.

[0112] Of course, in the embodiment of the present application, when the number of the movable part of the driving element and the fixed part of the driving element is determined, a greater number or a smaller number of the SMA wires 213 can be set. For example, two first SMA wires 2131 can be set between the first fixed part 2114 and the second movable part 2124, or two second SMA wires 2132 can be set between the second fixed part 2115 and the third movable part 2124, or two third SMA wires 2133 can be set between the third fixed part 2116 and the fourth movable part 2125, or two fourth SMA wires 2134 can be set between the fourth fixed part 2117 and the first movable part 2122. This is not limited to the present application.

[0113] Furthermore, in the embodiments of the present application, Figure 4A and Figure 7A As shown, in order to avoid collision between the photosensitive component 30 and the upper cover 2112 and / or collision between the movable carrier 2121 and the external circuit board 3113, the chip anti-shake movable part 212 also includes an anti-collision component 2126 fixed on the movable carrier 2121.

[0114] In one embodiment of the present application, the anti-collision assembly 2126 includes at least one anti-collision upper protrusion disposed on the upper surface of the movable carrier 2121 and located between the upper surface of the movable carrier 2121 and the upper cover 2112, so as to prevent collision between the photosensitive assembly 30 and the upper cover 2112 through the at least one anti-collision upper protrusion. At the same time, in some embodiments of the present application, the anti-collision assembly 2126 also includes at least one lower anti-collision protrusion disposed on the lower surface of the movable carrier 2121 and located between the lower surface of the movable carrier 2121 and the upper surface of the external circuit board 3113.

[0115] More specifically, in a specific example of the present application, the anti-collision component 2126 includes a first anti-collision upper protrusion 21261 fixed to the upper surface of the first movable carrier branch 21211 of the movable carrier 2121 and a second anti-collision upper protrusion 21262 fixed to the upper surface of the second movable carrier branch 21212 of the movable carrier 2121. That is, in this specific example, the at least one anti-collision upper protrusion includes a first anti-collision upper protrusion 21261 and a second anti-collision upper protrusion 21262, wherein the first anti-collision upper protrusion 21261 is fixed to the upper surface of the first movable carrier branch 21211, and the second anti-collision upper protrusion 21262 is fixed to the upper surface of the second movable carrier branch 21212. In particular, in an embodiment of the present application, the first anti-collision upper protrusion 21261 and the second anti-collision upper protrusion 21262 are made of soft material, which can be fixed to the upper surface of the movable carrier 2121 by bonding, wherein the upper surface of the first anti-collision upper protrusion 21261 and the upper surface of the second anti-collision upper protrusion 21262 are higher than the first fixed end 21142, the second fixed end 21152, the third fixed end 21162, and the fourth fixed end 21172, so that when the chip anti-shake part 21 is hit or the chip anti-shake movable part 212 moves in the optical axis direction, the chip anti-shake movable carrier 2121, the first fixed end 21142, the second fixed end 21152, the third fixed end 21162, and the fourth fixed end 21172 are prevented from colliding with the upper cover 2112 to cause damage. In some examples of the present application, the upper surface of the first anti-collision upper protrusion 21261 and the upper surface of the second anti-collision upper protrusion 21262 are higher than the first movable end 21222, the second movable end 21232, the third movable end 21242, and the fourth movable end 21252, so that when the chip anti-shake part 21 is hit or the chip anti-shake movable part 212 moves in the optical axis direction, the first movable end 21222, the second movable end 21232, the third movable end 21242, and the fourth movable end 21252 are prevented from colliding with the upper cover 2112 and causing damage.

[0116] In a specific embodiment, there is an air gap between the first anti-collision upper protrusion 21261, the second anti-collision upper protrusion 21262 and the upper cover 2112. The air gap can avoid the first anti-collision upper protrusion 21261, the second anti-collision upper protrusion 21262 and the upper cover 2112 from rubbing against each other during the movement of the movable carrier 2121 when the chip is anti-shake, thereby avoiding unnecessary resistance.

[0117] Furthermore, the anti-collision component 2126 also includes a first anti-collision lower protrusion 21263 fixed to the lower surface of the first movable carrier branch 21211 of the movable carrier 2121 and a second anti-collision lower protrusion 21264 fixed to the lower surface of the second movable carrier branch 21212 of the movable carrier 2121. That is, in an embodiment of the present application, the at least one anti-collision lower protrusion includes a first anti-collision lower protrusion 21263 and a second anti-collision lower protrusion 21264, wherein the first anti-collision lower protrusion 21263 is fixed to the lower surface of the first movable carrier branch 21211 of the movable carrier 2121, and the second anti-collision lower protrusion 21264 is fixed to the lower surface of the first movable carrier branch 21211 of the movable carrier 2121.

[0118] In particular, in an embodiment of the present application, the first anti-collision lower protrusion 21263 and the second anti-collision lower protrusion 21264 are made of soft material, which can be fixed to the lower surface of the movable carrier 2121 by bonding, wherein the lower surface of the first anti-collision lower protrusion 21263 and the lower surface of the second anti-collision lower protrusion 21264 are lower than the first fixed end 21142, the second fixed end 21152, the third fixed end 21162, and the fourth fixed end 21172, so that when the chip anti-shake part 21 is hit or the chip anti-shake movable part 212 moves in the optical axis direction, the chip anti-shake movable carrier 2121, the first fixed end 21142, the second fixed end 21152, the third fixed end 21162 and the fourth fixed end 21172 are prevented from colliding with the external circuit board 3113 and causing damage. In some examples of the present application, the lower surface of the first anti-collision lower protrusion 21263 and the lower surface of the second anti-collision lower protrusion 21264 are lower than the first movable end 21222, the second movable end 21232, the third movable end 21242, and the fourth movable end 21252, so that when the chip anti-shake part 21 is hit or the chip anti-shake movable part 212 moves in the optical axis direction, the first movable end 21222, the second movable end 21232, the third movable end 21242 and the fourth movable end 21252 are prevented from colliding with the external circuit board 3113 and causing damage.

[0119] In a specific embodiment, there is an air gap between the first anti-collision lower protrusion 21263 and the second anti-collision lower protrusion 21264 and the upper surface of the external circuit board 3113. The air gap can avoid the first anti-collision lower protrusion 21263 and the second anti-collision lower protrusion 21264 and the external circuit board 3113 from rubbing against each other during the movement of the movable carrier 2121 when the chip is anti-shake, thereby avoiding unnecessary resistance.

[0120] In order to make the movement of the movable carrier 2121 and the inner circuit board 3111 more stable, Figure 3 and 7A As shown, in the embodiment of the present application, the chip anti-shake unit 21 further includes a support component 214 disposed on the base 2111 and supporting the inner circuit board 3111 thereon. In a specific embodiment of the present application, the support component 214 can be fixed to the lower surface of the inner circuit board 3111 or the inner bottom surface of the base 2111 by bonding or integral molding.

[0121] For example, the support component 214 is fixed to the inner bottom surface of the base 2111 by adhesive or integral molding, wherein the upper surface of the support component 214 is higher than the upper surface of the outer circuit board 3113, so that the position of the inner circuit board 3111 supported by the support component 214 is higher than the outer circuit board 3113. That is to say, the inner circuit board 3111 is higher than the outer circuit board 3113 through the supporting and lifting effect of the support component 214. In this case, the elastic member group 3112 is in a stretched state. The elastic member group 3112 in the stretched state provides a clamping force for the inner circuit board 3111 to press against the support component 214. The inner circuit board 3111 is clamped by the inner circuit board 3111 and the support component 214 on the plane provided by the upper surface of the support component 214. Therefore, when the chip anti-shake part 21 is in a non-working state, the chip anti-shake movable part 212 is not easy to move at will compared with the chip anti-shake fixed part 211.

[0122] In one embodiment of the present application, the plane on which the inner circuit board 3111 lies is higher than the plane on which the outer circuit board 3113 lies. The force generated by the elastic member assembly 3112 along the Z-axis (perpendicular to the inner circuit board 3111) causes the inner circuit board 3111 to press against the support assembly 214. The support assembly 214 is subjected to a pressure of 20 mN to 50 mN (millinewtons) from the inner circuit board 3111. When the pressure is greater than 20 mN, the inner circuit board 3111 is prone to unnecessary movement. When the pressure is less than 50 mN, the friction between the inner circuit board 3111 and the support assembly 214 is low. Thus, when the inner circuit board 3111 moves relative to the base 2111, the frictional resistance encountered by the inner circuit board 3111 is not excessive, thereby reducing the driving force required of the driving element (SMA wire).

[0123] The magnitude of the force generated by elastic member assembly 3112 along the Z-axis is affected by the height difference between inner circuit board 3111 and outer circuit board 3113. The height difference between inner circuit board 3111 and outer circuit board 3113 is between 0.05 mm and 0.1 mm. When this height difference is less than 0.05 mm, the elastic force generated by elastic member assembly 3112 along the Z-axis is relatively small, and inner circuit board 3111 is prone to unwanted movement. When this height difference is greater than 0.1 mm, the elasticity of elastic member assembly 3112 in a plane perpendicular to the Z-axis (XY plane) is affected.

[0124] In one embodiment of the present application, the upper surface of the support assembly 214 fixed to the base 2111 has three or more supporting protrusions 2141. The at least three supporting protrusions 2141 are distributed in a non-completely collinear manner, providing stable surface support for the inner circuit board 3111. In a specific implementation, the number of the three or more supporting protrusions 2141 can be four. The three or more supporting protrusions 2141 reduce the contact area between the inner circuit board 3111 and the support assembly 214, thereby reducing frictional resistance between the inner circuit board 3111 and the support assembly.

[0125] Furthermore, the three or more supporting protrusions 2141 are located below the inner circuit board 3111 but not directly below the photosensitive chip 321, thereby preventing the three or more supporting protrusions 2141 from causing deformation of the inner circuit board 3111 when the support assembly 214 is under pressure, and directly or indirectly causing deformation of the photosensitive chip 321, thereby reducing the imaging quality of the camera module, for example, causing field curvature problems in the imaging. Specifically, along the direction perpendicular to the photosensitive chip 321, the projection of the photosensitive chip 321 on the base 2111 does not overlap with the projection of the three or more supporting protrusions 2141 of the support assembly 214 on the base 2111. That is, in the embodiment of the present application, the inner circuit board 3111 has a photosensitive chip mounting area and a peripheral area surrounding the photosensitive chip mounting area, wherein the three or more supporting protrusions 2141 correspond to the peripheral area.

[0126] In one embodiment of the present application, the chip stabilization fixing portion 211 of the chip stabilization unit 21 is integrally formed with the lens drive fixing portion of the lens drive portion 202. That is, the chip stabilization fixing portion 211 and the lens drive portion 202 can share the same structural components, thereby reducing tolerances during the assembly of the drive assembly 20. In a specific example of the present application, the upper cover 2112 of the chip stabilization fixing portion 211 is integrally formed with the lens drive fixing portion.

[0127] In summary, the camera module based on the embodiment of the present application is explained, wherein the driving component 20 of the camera module uses the elastic part group 3112 of the circuit board 31 as the reset and limiting element of the SMA driver, and reduces the overall height dimension of the chip anti-shake part 21 by reusing components. In this way, the anti-shake requirements and size requirements of the camera module are met.

[0128] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A drive assembly, characterized in that: include: A chip anti-shake fixing portion having a receiving cavity, wherein the chip anti-shake fixing portion includes at least one fixing portion; A chip anti-shake movable part located in the receiving cavity, wherein the chip anti-shake movable part includes at least one movable part and a movable carrier that can be linked to the at least one movable part; a circuit board fixed within the receiving cavity, wherein the circuit board comprises an outer circuit board, an inner circuit board, and an elastic member group extending between the inner circuit board and the outer circuit board, the inner circuit board being suspended within the outer circuit board by the elastic member group and movable relative to the outer circuit board, wherein the inner circuit board has a photosensitive chip mounting area formed on its upper surface, the movable carrier is attached around the photosensitive chip mounting area, and the at least one fixing portion is fixed to the upper surface of the outer circuit board; a driving element comprising at least one SMA wire extending between the at least one fixed portion and the at least one movable portion, the at least one SMA wire being higher than an upper surface of the outer circuit board; Among them, when the at least one SMA wire is driven, the at least one SMA wire is suitable for actuating the at least one movable part to drive the movable carrier of the chip anti-shake movable part, thereby driving the inner circuit board of the circuit board to move relative to the outer circuit board. In this way, it is suitable for driving the photosensitive chip installed on the inner circuit board to move, and the elastic member group of the circuit board is suitable for resetting the inner circuit board.

2. The drive assembly according to claim 1, wherein: The anti-shake fixed part includes a base and an upper cover buckled with the base, the receiving cavity is formed between the upper cover and the base, the receiving cavity has a first corner, a third corner opposite to the first corner, a second corner, and a fourth corner opposite to the second corner, wherein the at least one SMA wire, the at least one fixed part, and the chip anti-shake movable part are located between the external circuit board and the upper cover.

3. The drive assembly according to claim 2, wherein: The at least one movable part includes a first movable part and a second movable part located at the fourth corner, and a third movable part and a fourth movable part located at the second corner, wherein the at least one fixed part includes a first fixed part and a second fixed part provided on the upper surface of the outer circuit board and located at the first corner, and a third fixed part and a fourth fixed part provided on the upper surface of the outer circuit board and located at the third corner, wherein the at least one SMA wire includes a first SMA wire extending between the first fixed part and the second movable part, a second SMA wire extending between the second fixed part and the third movable part, a third SMA wire extending between the third fixed part and the fourth movable part, and a fourth SMA wire extending between the fourth fixed part and the first movable part.

4. The drive assembly according to claim 3, wherein: The first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are located in the same plane, and the plane where the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire are located is parallel to the plane where the inner circuit board is located, wherein the first SMA wire is parallel to the third SMA wire, and the first SMA wire is perpendicular to the second SMA wire, and the first SMA wire is perpendicular to the fourth SMA wire, and the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire have the same length.

5. The drive assembly according to claim 4, wherein: In the Z-axis direction set by the driving assembly, there is a gap between the first SMA wire, the second SMA wire, the third SMA wire, and the fourth SMA wire and the elastic member group, and the gap is greater than or equal to 0.1 mm.

6. The drive assembly according to claim 2, wherein: The outer circuit board of the circuit board is fixed to the inner bottom surface of the base.

7. The drive assembly according to claim 6, wherein: The inner circuit board is higher than the outer circuit board so that the elastic member group is in a stretched state.

8. The drive assembly according to claim 7, wherein: The driving component further includes a supporting component which is disposed on the base and supports the inner circuit board thereon.

9. The drive assembly according to claim 7, wherein: A height difference between the inner circuit board and the outer circuit board is between 0.05 mm and 0.1 mm.

10. The drive assembly according to claim 8, wherein: The force exerted by the inner circuit board on the supporting assembly is between 20mN and 50mN.

11. The drive assembly according to claim 8, wherein: The supporting assembly includes at least three supporting protrusions protruding from the base and arranged in a non-completely collinear manner.

12. The drive assembly according to claim 4, wherein: The driving assembly also includes an anti-collision assembly arranged on the movable carrier, the anti-collision assembly including at least one anti-collision upper protrusion arranged on the upper surface of the movable carrier and located between the upper surface of the movable carrier and the upper cover, and the at least one anti-collision upper protrusion is higher than the upper surfaces of the first to fourth movable parts.

13. The drive assembly according to claim 12, wherein: The anti-collision assembly further includes at least one anti-collision lower protrusion disposed on the lower surface of the movable carrier and located between the lower surface of the movable carrier and the upper surface of the outer circuit board, wherein the at least one anti-collision lower protrusion is lower than the lower surfaces of the first to fourth movable parts.

14. The drive assembly according to claim 4, wherein: The movable carrier includes a movable carrier main body attached around the photosensitive chip mounting area and a first movable carrier branch and a second movable carrier branch extending outward from two opposite diagonals of the movable carrier main body, wherein the first movable part and the second movable part are connected to the first movable carrier branch, and the third movable part and the fourth movable part are connected to the second movable carrier branch.

15. The drive assembly of claim 14, wherein: The chip anti-shake fixing part also includes a first fixing carrier and a second fixing carrier fixed to the upper surface of the outer circuit board and located at the first corner, and a third fixing carrier and a fourth fixing carrier fixed to the upper surface of the outer circuit board and located at the third corner, wherein the first fixing part is fixedly stacked on the first fixing carrier, the second fixing part is fixedly stacked on the second fixing carrier, the third fixing part is fixedly stacked on the third fixing carrier, and the fourth fixing part is fixedly stacked on the fourth fixing carrier.

16. The drive assembly according to claim 15, wherein: The first fixing carrier is electrically connected to the external circuit board, and the first fixing portion is electrically connected to the first fixing carrier, so that the end of the first SMA wire fixed to the first fixing portion is electrically connected to the external circuit board; the second fixing carrier is electrically connected to the external circuit board, and the second fixing portion is electrically connected to the second fixing carrier, so that the end of the second SMA wire fixed to the second fixing portion is electrically connected to the external circuit board; the third fixing carrier is electrically connected to the external circuit board, and the third fixing portion is electrically connected to the third fixing carrier, so that the end of the third SMA wire fixed to the third fixing portion is electrically connected to the external circuit board; the fourth fixing carrier is electrically connected to the external circuit board, and the fourth fixing portion is electrically connected to the fourth fixing carrier, so that the end of the fourth SMA wire fixed to the fourth fixing portion is electrically connected to the external circuit board.

17. The drive assembly of claim 16, wherein: One end of the first SMA wire fixed to the second movable part is electrically connected to the second movable part, one end of the second SMA wire fixed to the third movable part is electrically connected to the third movable part, and one end of the third SMA wire fixed to the fourth movable part is electrically connected to the fourth movable part; one end of the fourth SMA wire fixed to the first movable part is electrically connected to the first movable part, wherein the first movable part, the second movable part, the third movable part and the fourth movable part are respectively electrically connected to the outer circuit board through the movable carrier, the inner circuit board and the elastic member group that are electrically connected to each other.

18. A camera module, characterized in that: include: Optical lens; Photosensitive chip; as well as The driving assembly according to any one of claims 1 to 17, wherein the photosensitive chip is mounted on the inner circuit board.

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