Display panel, manufacturing method thereof and display module

Abstract

This application relates to a display panel and its manufacturing method, as well as a display module. The display panel has a bonding area and includes a substrate, a first insulating layer, a shim block, and a plurality of first bonding pads. The first insulating layer is disposed on one side of the substrate and located in the bonding area. The first insulating layer has a plurality of first cutout areas, and the plurality of first bonding pads are disposed one-to-one in the plurality of first cutout areas. The shim block is disposed in the first cutout area and located between the first bonding pads and the substrate. In the display panel of this application, the shim block serves to elevate the first bonding pads. When the first bonding pads are bonded to the flexible circuit board using conductive adhesive, the distance between the flexible circuit board and the first bonding pads can be reduced. This increases the probability of bonding particles in the conductive adhesive being crushed and reduces the possibility of bonding abnormalities between the flexible circuit board and the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and its manufacturing method, and a display module. Background Technology

[0002] In recent years, OLED (Organic Light-Emitting Diode) has received widespread attention due to its huge application market in the display field. Compared with other display technologies, OLED modules have many advantages, such as wide viewing angle, fast response speed, no need for backlighting, and the ability to achieve flexible displays.

[0003] In related technologies, an OLED display module includes a display panel and a flexible circuit board bonded to the display panel. Specifically, the display panel has bonding pads (also called solder pads), and the flexible circuit board is bonded to the bonding pads using conductive adhesive. If the connection between the flexible circuit board and the display panel is not secure, it will seriously affect the performance of the display module. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel and its manufacturing method, as well as a display module, in order to improve the connection reliability between the flexible circuit board and the display panel.

[0005] According to one aspect of this application, a display panel is provided. The display panel has a bonding area and includes: a substrate; a plurality of pads located within the bonding area and disposed on the substrate at intervals; a plurality of first bonding pads corresponding one-to-one with the plurality of pads, each first bonding pad being disposed on the side of the corresponding pad away from the substrate; and a first insulating layer located within the bonding area, the first insulating layer covering the surface of the substrate facing the pads and having a plurality of first cutout areas, the plurality of first cutout areas corresponding one-to-one with the plurality of first bonding pads, each first cutout area exposing a corresponding first bonding pad.

[0006] In this embodiment of the display panel, the first bonding pad is used to bond the display panel to the flexible circuit board using conductive adhesive. Since the first bonding pad is located in the first cutout area of ​​the first insulating layer, and the shim is located between the first bonding pad and the substrate, the shim elevates the first bonding pad, thereby reducing the height difference between the surface of the first insulating layer away from the substrate and the surface of the first bonding pad away from the substrate. Therefore, when the first bonding pad is bonded to the flexible circuit board using conductive adhesive, the distance between the flexible circuit board and the first bonding pad can be reduced. This increases the probability of bonding particles in the conductive adhesive being crushed, thereby reducing the possibility of bonding abnormalities between the flexible circuit board and the display panel, and improving the connection reliability between the flexible circuit board and the display panel.

[0007] In some embodiments, along the thickness direction of the display panel, the distance from the surface of the first insulating layer away from the substrate to the plane of the substrate is greater than the distance from the surface of the first bonding pad away from the substrate to the plane of the substrate; and, along the thickness direction of the display panel, the difference between the distance from the surface of the first insulating layer away from the substrate and the distance from the surface of the first bonding pad away from the substrate to the plane of the substrate is less than or equal to 1 μm.

[0008] In some embodiments, along the thickness direction of the display panel, the difference between the surface of the first insulating layer away from the substrate and the surface of the first bonding pad away from the substrate and the plane where the substrate is located is greater than or equal to 0.3 μm.

[0009] In some embodiments, the display panel further includes a display area, and the bonding area is located outside the display area; the display panel further includes a pixel definition layer, which is disposed on the side of the substrate near the first insulating layer, and the pixel definition layer is located in the display area, wherein the first insulating layer and the pixel definition layer are disposed in the same layer and are made of the same material.

[0010] In some embodiments, the display panel further includes a display area, the bonding area is located outside the display area, and the display panel further includes a driving circuit layer disposed on the side of the substrate near the first insulating layer. The driving circuit layer is located in the display area, and the driving circuit layer includes a plurality of conductive layers and a plurality of insulating layers stacked along the thickness direction of the substrate. The shim is disposed in the same layer as one of the plurality of insulating layers and is made of the same material.

[0011] In some embodiments, the plurality of conductive layers include an active layer, a gate layer, and a source / drain layer, and the plurality of insulating layers include a gate insulating layer and an interlayer insulating layer, wherein the shim block is disposed in the same layer as the gate insulating layer and is made of the same material.

[0012] In some embodiments, the plurality of conductive layers include an active layer, a gate layer, and a source / drain layer, and the plurality of insulating layers include a gate insulating layer and an interlayer insulating layer, wherein the first bonding pad is disposed in the same layer as the source / drain layer and is made of the same material.

[0013] According to another aspect of this application, a method for manufacturing a display panel is provided. The method for manufacturing the display panel includes:

[0014] A substrate is provided, the substrate being divided into bonding areas;

[0015] Multiple raised blocks are formed on the substrate, and the multiple raised blocks are located in the bonding area and are spaced apart from each other.

[0016] A plurality of first bonding pads are formed, each first bonding pad corresponding one-to-one with a plurality of the raised blocks, and each first bonding pad is located on the side of the raised block away from the substrate; and

[0017] A first insulating layer having a plurality of first cutout areas is formed on the side of the substrate facing the pad block. The first insulating layer is located within the bonding area, and the first cutout areas expose the first bonding pads.

[0018] The display panel manufactured using the method described in this application embodiment has a first bonding pad that can be bonded to the flexible circuit board using conductive adhesive. Since the first bonding pad 130 is disposed in the first cutout area 121 of the first insulating layer 120, and the shim 140 is located between the first bonding pad 130 and the substrate 110, the shim elevates the first bonding pad, thereby reducing the height difference between the surface of the first insulating layer away from the substrate and the surface of the first bonding pad away from the substrate. Therefore, when the first bonding pad is bonded to the flexible circuit board using conductive adhesive, the distance between the flexible circuit board and the first bonding pad can be reduced. This increases the probability of bonding particles in the conductive adhesive being crushed, thereby reducing the possibility of bonding abnormalities between the flexible circuit board and the display panel, and improving the connection reliability between the flexible circuit board and the display panel.

[0019] According to another aspect of this application, a display module is provided. The display module includes the display panel and flexible circuit board as described in any of the above embodiments.

[0020] The display module in this embodiment includes a display panel and a flexible circuit board. The first bonding pad of the display panel can be bonded to the flexible circuit board using conductive adhesive. Since the first bonding pad is located in the first hollow area of ​​the first insulating layer, and the shim is located between the first bonding pad and the substrate, the shim elevates the first bonding pad, thereby reducing the height difference between the surface of the first insulating layer away from the substrate and the surface of the first bonding pad away from the substrate. Therefore, when the first bonding pad is bonded to the flexible circuit board using conductive adhesive, the distance between the flexible circuit board and the first bonding pad can be reduced. This increases the probability of bonding particles in the conductive adhesive being crushed, thereby reducing the possibility of bonding abnormalities between the flexible circuit board and the display panel and improving the connection reliability between the flexible circuit board and the display panel.

[0021] In some embodiments, the flexible circuit board includes a flexible circuit board body and a plurality of second bonding pads disposed on the flexible circuit board body, wherein the second bonding pads are bonded to the first pads by conductive adhesive.

[0022] In some embodiments, along the thickness direction of the display module, the second bonding pad is close to the surface of the substrate, and the distance between it and the first bonding pad is away from the surface of the substrate is less than 1 μm. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of a display module in one embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of the bonding area of ​​the display panel in one embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the display area of ​​a display panel in one embodiment of this application.

[0026] The attached figures are labeled as follows:

[0027] 10. Display module;

[0028] 100. Display panel;

[0029] 110. Substrate; 120. First insulating layer; 121. First cutout area; 130. First bonding pad; 140. Raising block;

[0030] 150. Pixel definition layer; 151. Pixel aperture;

[0031] 160. Driver circuit layer; 161. Thin-film transistor;

[0032] 1611. Active layer; 1612. Gate insulating layer; 1613. Gate layer; 1614. Interlayer insulating layer; 1615. Source-drain layer;

[0033] 200, Flexible circuit board; 210, Flexible circuit board body; 220, Second bonding pad;

[0034] 300. Conductive adhesive. Detailed Implementation

[0035] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0037] When describing positional relationships, unless otherwise specified, when an element, such as a layer, film, or substrate, is referred to as being "on" another element, it may be directly on the other element or there may be intermediate elements present. Furthermore, when a layer is referred to as being "below" another layer, it may be directly below it or there may be one or more intermediate elements present. It is also understood that when a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or there may be one or more intermediate elements present.

[0038] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0039] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0040] It should also be understood that, in interpreting an element, although not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of a particular value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0041] Furthermore, in the instruction manual, the phrase "planar distribution diagram" refers to the diagram when the target part is viewed from above, and the phrase "cross-sectional diagram" refers to the diagram when the target part is viewed from the side as a cross-section taken by vertically cutting the target part.

[0042] Furthermore, the accompanying drawings are not drawn to a 1:1 scale, and the relative dimensions of the components are shown in the drawings only as examples and not necessarily to actual scale.

[0043] In recent years, OLED (Organic Light-Emitting Diode) has received widespread attention due to its huge application market in the display field. Compared with other display technologies, OLED display modules have many advantages, such as wide viewing angle, fast response speed, no need for backlighting, and the ability to achieve flexible displays.

[0044] Display modules typically consist of a display panel and a flexible circuit board (PCB) bonded to it. In related technologies, display panels, especially COF (Chip on Flex) products, often employ a cutout design in the insulating film layer to expose bonding pads. Conductive adhesive is then filled into the cutout areas, allowing the PCB to connect to the bonding pads via the adhesive. However, due to the relatively thick insulating film layer (1.6μm to 2.1μm), bonding particles in the conductive adhesive may not be broken down during PCB bonding, leading to abnormal bonding between the PCB and the display panel. This severely impacts the performance of the display module.

[0045] To address the aforementioned issues, the first aspect of this application proposes a display panel designed to improve the reliability of the connection between the flexible circuit board and the display panel.

[0046] like Figure 1 , Figure 2As shown, the display panel 100 in the first aspect embodiment of this application has a bonding area. The display panel 100 includes a substrate 110, a plurality of raised blocks 140, a plurality of first bonding pads 130, and a first insulating layer 120. The plurality of raised blocks 140 are located in the bonding area and are disposed on the substrate 110 at intervals. The plurality of first bonding pads 130 correspond one-to-one with the plurality of raised blocks 140, and each first bonding pad 130 is disposed on the side of the corresponding raised block 140 away from the substrate 110. The first insulating layer 120 is located in the bonding area and covers the surface of the substrate 110 facing the raised blocks 140 and has a plurality of first cutout areas 121. The plurality of first cutout areas 121 correspond one-to-one with the plurality of first bonding pads 130, and each first cutout area 121 exposes the corresponding first bonding pad 130.

[0047] In this embodiment, the display panel 100 has a first bonding pad 130 for bonding to the flexible circuit board 200 via conductive adhesive 300. Since the first bonding pad 130 is located in the first cutout area 121 of the first insulating layer 120, and the shim 140 is located between the first bonding pad 130 and the substrate 110, the shim 140 elevates the first bonding pad 130, thereby reducing the height difference between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110. Therefore, when bonding the first bonding pad 130 to the flexible circuit board 200 with the conductive adhesive 300, the distance between the flexible circuit board 200 and the first bonding pad 130 can be reduced. This increases the probability of bonding particles in the conductive adhesive 300 being crushed, thereby reducing the possibility of bonding abnormalities between the flexible circuit board 200 and the display panel 100 and improving the connection reliability between the flexible circuit board 200 and the display panel 100.

[0048] Optionally, the substrate 110 can be a flexible substrate or a rigid substrate. The flexible substrate may include materials such as polyimide. The rigid substrate may include materials such as glass substrates.

[0049] In some embodiments, along the thickness direction of the display panel 100, the distance from the surface of the first insulating layer 120 away from the substrate 110 to the plane of the substrate 110 is greater than the distance from the surface of the first bonding pad 130 away from the substrate 110 to the plane of the substrate 110. Furthermore, along the thickness direction of the display panel 100, the distance difference h between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110 to the plane of the substrate 110 is less than or equal to 1 μm. That is, after raising the first bonding pad 130 by the shim block 140, the height difference between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110 relative to the substrate 110 is less than or equal to 1 μm. After extensive testing, the inventors discovered that, under the above-mentioned conditions, the possibility of bonding abnormalities between the flexible circuit board 200 and the display panel 100 can be reduced to an extremely low level, thereby significantly improving the connection reliability between the flexible circuit board 200 and the display panel 100.

[0050] In some embodiments, along the thickness direction of the display panel 100, the distance difference h between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110 and the plane containing the substrate 110 is greater than or equal to 0.3 μm. When the above-mentioned conditions are met, the surfaces of the first insulating layer 120 and the first bonding pad 130 away from the substrate 110 maintain a height difference relative to the substrate 110. That is, the height difference is less than or equal to 1 μm and greater than or equal to 0.3 μm. This satisfies the requirement of improving the connection reliability between the flexible circuit board 200 and the display panel 100, and also allows the first insulating layer 120 to isolate different first bonding pads 130 to prevent electrical conduction between them.

[0051] In some embodiments, such as Figure 1 , Figure 2 as well as Figure 3As shown, the display panel 100 also has a display area, and a bonding area is located outside the display area (i.e., there is no overlap between the bonding area and the display area). The display panel 100 also includes a pixel definition layer 150, which is disposed on the side of the substrate 110 near the first insulating layer 120, and is located in the display area. The pixel definition layer 150 is provided with a plurality of pixel openings 151 for defining sub-pixel areas. The first insulating layer 120 is disposed in the same layer as the pixel definition layer 150 and is made of the same material. It can be understood that the pixel openings 151 of the pixel definition layer 150 are used to define the sub-pixel areas of the pixel panel, and the pixel definition layer 150 is usually made of insulating material. In the embodiments of this application, the first insulating layer 120 and the pixel definition layer 150 located in the display area are disposed in the same layer and are made of the same material. Therefore, the first insulating layer 120 and the pixel definition layer 150 can be fabricated by the same process, which helps to simplify the process and reduce manufacturing costs.

[0052] In some embodiments, the display panel 100 further includes a display area, and a bonding area is located outside the display area (i.e., there is no overlap between the bonding area and the display area). The display panel 100 also includes a driving circuit layer 160, which is disposed on the side of the substrate 110 near the first insulating layer 120, and is located in the display area. The driving circuit layer 160 includes a plurality of conductive layers and a plurality of insulating layers stacked along the thickness direction of the substrate 110, and the pad 140 is disposed in the same layer as one of the plurality of insulating layers and is made of the same material. It is understood that the driving circuit layer 160 is provided with a driving circuit for connecting sub-pixels in the display area, for controlling whether each sub-pixel emits light or not. Wherein, the driving circuit layer 160 includes a plurality of conductive layers and a plurality of insulating layers stacked along the thickness direction of the substrate 110. In this embodiment, the pad 140 is disposed in the same layer as one of the plurality of insulating layers and is made of the same material. Therefore, the pad 140 and one of the insulating layers in the driving circuit layer 160 can be fabricated by the same process, which helps to simplify the process and reduce manufacturing costs.

[0053] Furthermore, the plurality of conductive layers may include an active layer 1611, a gate layer 1613, and a source / drain layer 1615, and the plurality of insulating layers may include a gate insulating layer 1612 and an interlayer insulating layer 1614. The shim block 140 is disposed in the same layer as the gate insulating layer 1612 and is made of the same material. In this embodiment, the shim block 140 and the gate insulating layer 1612 are disposed in the same layer and are made of the same material, thereby allowing the shim block 140 and the gate insulating layer 1612 to be fabricated using the same process, which simplifies the process and reduces manufacturing costs.

[0054] It is understood that the active layer 1611, gate insulating layer 1612, gate layer 1613, interlayer insulating layer 1614, source-drain layer 1615, etc., can be constructed as thin-film transistors 161 in the driving circuit layer 160. Thin-film transistors 161 can be used to control the light emission or non-light emission of sub-pixels in the display area.

[0055] Furthermore, the plurality of conductive layers may include an active layer 1611, a gate layer 1613, and a source / drain layer 1615, and the plurality of insulating layers may include a gate insulating layer 1612 and an interlayer insulating layer 1614. The first bonding pad 130 is disposed in the same layer as the source / drain layer 1615 and is made of the same material. Therefore, the first bonding pad 130 and the source / drain layer 1615 can be fabricated using the same process, simplifying the process and reducing manufacturing costs.

[0056] An embodiment of the second aspect of this application provides a method for manufacturing a display panel 100, the method comprising:

[0057] A substrate 110 is provided, and the substrate 110 is divided into bonding areas;

[0058] Multiple raised blocks 140 are formed on the substrate 110, and the multiple raised blocks 140 are located in the bonding area and are spaced apart from each other.

[0059] A plurality of first bonding pads 130 are formed, each first bonding pad 130 corresponding one-to-one with a plurality of padding blocks 140, and each first bonding pad 130 is located on the side of the padding block 140 away from the substrate 110; and

[0060] A first insulating layer 120 with a plurality of first cutout regions 121 is formed on the side of the substrate 110 facing the pad block 140. The first insulating layer 120 is located in the bonding area, and the first cutout regions 121 can expose the first bonding pads 130.

[0061] The display panel 100 manufactured by the method described in this application embodiment has a first bonding pad 130 that can be bonded to the flexible circuit board 200 via conductive adhesive 300. Since the first bonding pad 130 is disposed in the first cutout area 121 of the first insulating layer 120, and the shim 140 is located between the first bonding pad 130 and the substrate 110, the shim 140 serves to elevate the first bonding pad 130, thereby reducing the height difference between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110. Therefore, when the first bonding pad 130 is bonded to the flexible circuit board 200 using the conductive adhesive 300, the distance between the flexible circuit board 200 and the first bonding pad 130 can be reduced. This increases the probability that the bonding particles in the conductive adhesive 300 will be crushed, thereby reducing the possibility of bonding abnormalities between the flexible circuit board 200 and the display panel 100 and improving the connection reliability between the flexible circuit board 200 and the display panel 100.

[0062] In some embodiments, the distance from the surface of the first insulating layer 120 away from the substrate 110 to the substrate 110 is greater than the distance from the surface of the first bonding pad 130 away from the substrate 110 to the substrate 110. Furthermore, the difference in distance between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110 to the plane containing the substrate 110 is less than or equal to 1 μm. That is, after raising the first bonding pad 130 using the shim 140, the height difference between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110 relative to the substrate 110 is less than or equal to 1 μm. After extensive testing, the inventors discovered that, under the above-mentioned conditions, the possibility of bonding abnormalities between the flexible circuit board 200 and the display panel 100 can be reduced to an extremely low level, thereby significantly improving the connection reliability between the flexible circuit board 200 and the display panel 100.

[0063] In some embodiments, the distance difference between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110 and the plane containing the substrate 110 is greater than or equal to 0.3 μm. When the above-mentioned limiting conditions are met, the surfaces of the first insulating layer 120 away from the substrate 110 and the surfaces of the first bonding pad 130 away from the substrate 110 maintain a height difference relative to the substrate 110. That is, the height difference is less than or equal to 1 μm and greater than or equal to 0.3 μm. This satisfies the requirement of improving the connection reliability between the flexible circuit board 200 and the display panel 100, and also allows the first insulating layer 120 to isolate different first bonding pads 130 to prevent electrical conduction between them.

[0064] An embodiment of the third aspect of this application provides a display module 10, which includes the display panel 100 and flexible circuit board 200 in any of the embodiments of the first aspect described above.

[0065] The display module 10 in this embodiment includes a display panel 100 and a flexible circuit board 200. The first bonding pad 130 of the display panel 100 can be bonded to the flexible circuit board 200 by conductive adhesive 300. Since the first bonding pad 130 is disposed in the first cutout area 121 of the first insulating layer 120, and the shim 140 is located between the first bonding pad 130 and the substrate 110, the shim 140 serves to elevate the first bonding pad 130, thereby reducing the height difference between the surface of the first insulating layer 120 away from the substrate 110 and the surface of the first bonding pad 130 away from the substrate 110. Therefore, when the first bonding pad 130 is bonded to the flexible circuit board 200 using the conductive adhesive 300, the distance between the flexible circuit board 200 and the first bonding pad 130 can be reduced. This increases the probability that the bonding particles in the conductive adhesive 300 will be crushed, thereby reducing the possibility of bonding abnormalities between the flexible circuit board 200 and the display panel 100 and improving the connection reliability between the flexible circuit board 200 and the display panel 100.

[0066] In some embodiments, the flexible circuit board 200 includes a flexible circuit board body 210 and a plurality of second bonding pads 220 disposed on the flexible circuit board body 210. The second bonding pads 220 are bonded to the first pads by conductive adhesive 300. Thus, a bonding connection between the flexible circuit board 200 and the display panel 100 can be achieved.

[0067] In some embodiments, along the thickness direction of the display module 10, the distance between the second bonding pad 220 near the surface of the substrate 110 and the first bonding pad 130 away from the surface of the substrate 110 is less than 1 μm. After extensive testing, the inventors discovered that, under the aforementioned conditions, the possibility of bonding abnormalities between the flexible circuit board 200 and the display panel 100 can be reduced to an extremely low level, thereby significantly improving the connection reliability between the flexible circuit board 200 and the display panel 100.

[0068] An embodiment of the fourth aspect of this application provides a display device, including the display module 10 of any embodiment of the third aspect. The display device can be, for example, any product or component with display functionality, such as a monitor, television, digital camera, mobile phone, tablet computer, or navigator.

[0069] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel having a bonding area, characterized in that, The display panel includes: substrate; Multiple shims are located within the bonding area and are disposed on the substrate at intervals from each other; A plurality of first bonding pads correspond one-to-one with a plurality of the raised blocks, each first bonding pad being disposed on the side of the corresponding raised block away from the substrate; and A first insulating layer is located within the bonding area. The first insulating layer covers the surface of the substrate facing the shim block and has a plurality of first cutout areas. The plurality of first cutout areas correspond one-to-one with a plurality of first bonding pads. Each first cutout area exposes a corresponding first bonding pad. The first insulating layer can isolate different first bonding pads. The display panel also has a display area, and the bonding area is located outside the display area; the display panel also includes a pixel definition layer, which is located in the display area, and the first insulating layer is disposed in the same layer as the pixel definition layer and is made of the same material; The display panel further includes a driving circuit layer, which is disposed on the side of the substrate near the first insulating layer. The driving circuit layer is located in the display area. The driving circuit layer includes a plurality of conductive layers and a plurality of insulating layers stacked along the thickness direction of the substrate. The plurality of conductive layers include an active layer, a gate layer, and a source-drain layer. The plurality of insulating layers include a gate insulating layer and an interlayer insulating layer. The padding block is disposed in the same layer as the gate insulating layer and is made of the same material.

2. The display panel according to claim 1, characterized in that, Along the thickness direction of the display panel, the distance from the surface of the first insulating layer away from the substrate to the plane where the substrate is located is greater than the distance from the surface of the first bonding pad away from the substrate to the plane where the substrate is located; Furthermore, along the thickness direction of the display panel, the difference between the surface of the first insulating layer away from the substrate and the surface of the first bonding pad away from the substrate and the plane where the substrate is located is less than or equal to 1 μm.

3. The display panel according to claim 2, characterized in that, Along the thickness direction of the display panel, the difference between the distance from the surface of the first insulating layer away from the substrate and the distance from the surface of the first bonding pad away from the substrate to the plane of the substrate is greater than or equal to 0.3 μm.

4. The display panel according to claim 1, characterized in that, The first bonding pad is disposed in the same layer as the source and drain layers and is made of the same material.

5. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, the substrate being divided into a display area and a bonding area; A plurality of raised blocks and a driving circuit layer are formed on the substrate. The plurality of raised blocks are located in the bonding area and are spaced apart from each other. The driving circuit layer is disposed on the side of the substrate near the first insulating layer. The driving circuit layer is located in the display area. The driving circuit layer includes a plurality of conductive layers and a plurality of insulating layers stacked along the thickness direction of the substrate. The plurality of conductive layers include an active layer, a gate layer and a source-drain layer. The plurality of insulating layers include a gate insulating layer and an interlayer insulating layer. The raised blocks are disposed in the same layer as the gate insulating layer and are made of the same material. A plurality of first bonding pads are formed, each first bonding pad corresponding one-to-one with a plurality of the raised blocks, and each first bonding pad is located on the side of the raised block away from the substrate; and A first insulating layer and a pixel definition layer with multiple first cutout areas are formed on the side of the substrate facing the pad block. The pixel definition layer is located in the display area, and the first insulating layer is located in the bonding area. The first cutout areas can expose the first bonding pads. The first insulating layer can isolate different first bonding pads. The first insulating layer and the pixel definition layer are disposed in the same layer and are made of the same material.

6. A display module, characterized in that, Includes the display panel and flexible circuit board as described in any one of claims 1 to 4.

7. The display module according to claim 6, characterized in that, The flexible circuit board includes a flexible circuit board body and a plurality of second bonding pads disposed on the flexible circuit board body. The second bonding pads are bonded to the first bonding pads by conductive adhesive.

8. The display module according to claim 7, characterized in that, Along the thickness direction of the display module, the second bonding pad is close to the surface of the substrate, and the distance between it and the first bonding pad is less than 1 μm away from the surface of the substrate.

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