Laminate, mechanically reinforced laminate and method for producing same, method for producing a photosensitive device containing same

Abstract

The present application provides a kind of laminated body, mechanical reinforcement laminated body and its preparation method, the preparation method of photosensitive component containing it.The laminated body includes support layer and resin layer, wherein, resin layer is prepared by foaming agent and resin composition, resin composition includes epoxy resin, inorganic filler and epoxy curing agent;Wherein, resin layer has cell structure after 140 DEG C ~ 250 DEG C heat curing, the porosity of resin layer is 0.02 ~ 0.20, and cell aperture is 20 ~ 1000 nm.Form laminated body by adding foaming agent in photosensitive resin composition of epoxy resin, epoxy curing agent and inorganic filler, it is applied to multilayer circuit board production, as interlayer insulation film isolation circuit and conductor layer.Introduce nanometer to submicron closed pore in interlayer insulation film by foaming technology, further reduce the Df and Dk of interlayer insulation film, optimize the dielectric property of product.

Description

Technical Field

[0001] This invention relates to the field of polymer materials technology, and more specifically, to a laminate, a mechanically reinforced laminate and its preparation method, and a method for preparing a photosensitive device containing the laminate. Background Technology

[0002] The use of mobile cordless phones in the 1840s heralded the beginning of a new era of wireless communication. In the 1880s, Motorola's analog communication technology enabled the practical application of the first-generation mobile communication system (1G), propelling the rapid development of wireless communication. Now, the fifth-generation mobile communication system (5G) has been commercially deployed globally. Compared to 1G, 5G offers communication speeds more than a million times faster. High-speed communication requires high-frequency transmission, therefore 5G places higher demands on the materials used for signal transmission compared to its predecessors. These materials consist of two parts: a conductor for conducting and receiving signals, and an insulating material for the wiring. To obtain high-quality signals at high speeds, we must consider signal loss and delay during transmission. Signal transmission losses mainly include conductor loss, dielectric loss, and radiation loss. To reduce conductor loss, the main methods are to use conductors with lower resistivity and reduce the surface roughness of the conductors. Radiation loss is relatively small, but it will generate electromagnetic interference (EMI), so metal shielding is generally used. Dielectric loss is generally reduced by lowering the dielectric loss factor (Df) and / or the dielectric constant (Dk) of the material, or by directly using materials with low Df and low Dk. The signal delay on the transmission line mainly depends on the dielectric constant (Dk) of the insulating material, the line length, and the geometry of the transmission line profile. The line length is determined by the transmission distance and therefore cannot be changed. The transmission line profile can be adjusted according to the design, and most transmission lines adopt the optimal profile design. Therefore, the improvement of signal delay ultimately depends on the dielectric properties of the insulating material. Lowering the Dk of the insulating material can effectively improve the signal delay. Equation (1) shows the relationship between dielectric loss and the dielectric constant Dk and dielectric loss factor Df:

[0003]

[0004] Where L is the dielectric loss, f is the frequency, and Dk is the dielectric constant.

[0005] According to equation (1), as the frequency increases, Df and Dk must continuously decrease to reduce dielectric loss and prevent signal loss, distortion, or damage during transmission; equation (2) shows the relationship between signal transmission speed and dielectric constant Dk:

[0006]

[0007] Where υ is the signal transmission speed, c is the speed of light, and Dk is the dielectric constant of the medium. Therefore, in order to increase the transmission speed, Dk must be reduced.

[0008] Based on the above, the development of insulating materials with low Df and low Dk plays a crucial role in the development of high-frequency and high-speed communication.

[0009] However, in the application of insulating materials in 5G and 5G+ communication-related equipment and terminals, an irreconcilable contradiction has seriously affected the continuous development of this field: Theories suggest that low-Df and low-Dk insulating materials are needed in the high-frequency, high-speed 5G and 5G+ domains; however, these materials often exhibit poor adhesion to the substrate, leading to reduced product reliability. Therefore, reconciling low Df and low Dk with increased adhesion between the insulating material and the substrate has become a key breakthrough in the development of insulating materials for 5G and 5G+ applications.

[0010] The primary methods for reducing Df and Dk are to employ fluorinated or fluorinated modified materials, olefin materials, and liquid crystal polymers to lower the Df / Dk ratio of the insulating layer. For example, Japanese Patent Application Publication No. 6-13495 discloses a method for reducing the Df / Dk of the insulating layer using a fluorinated resin combined with polyimide. International Patent Publication No. 2016 / 027446 proposes using a monomer with a large-volume substituent to copolymerize with a liquid crystal polyester resin to reduce the Dk of the insulating layer, and also proposes using a naphthalene ring monomer to reduce the material's Df. However, firstly, fluorinated and olefin materials have low surface energy, resulting in weak adhesion strength and poor bonding with metals. To anchor the insulating layer, the surface roughness of the metal is generally increased, which can maintain adhesion through interlocking. However, due to the skin effect, the surface roughness of the metal cannot be too high in the high-frequency domain, thus limiting the application of fluorinated and olefin materials. Secondly, fluorine-based materials and liquid crystal materials are relatively expensive, and if used in small quantities, the reduction in the overall insulation layer's Df / Dk ratio is limited. Therefore, cost factors restrict the large-scale application of fluorine-based materials and liquid crystal materials.

[0011] Japanese Patent Application Publication No. 2006-63297 discloses a method for reducing the dielectric constant (Df / Dk) of an insulating layer: a low-Df / Dk insulating material, including polystyrene and polyolefins, is filled into the pores of a porous filler (e.g., porous silica), and then used as a filler to form a formulation with other insulating resins to reduce the overall Df / Dk of the insulating layer. While currently reported technologies optimize the dielectric properties of interlayer insulating films by continuously optimizing formulations and using low-Df, low-Dk materials, there remains a necessity and possibility for further optimization of the dielectric properties. Summary of the Invention

[0012] The main objective of this invention is to provide a laminate, a mechanically reinforced laminate, a method for preparing the same, and a method for preparing photosensitive components containing the same, so as to solve the problem that the comprehensive performance of insulating materials, such as dielectric loss factor, dielectric constant, and curing ability, needs to be optimized in the prior art.

[0013] To achieve the above objectives, according to one aspect of the present invention, a laminate is provided, comprising a support layer and a resin layer, wherein the resin layer is prepared from a foaming agent and a resin composition, the resin composition comprising an epoxy resin, an inorganic filler, and an epoxy curing agent; wherein the resin layer has a cellular structure after being thermocured at 140°C to 250°C, the porosity of the resin layer is 0.02 to 0.20, and the pore size is 20 to 1000 nm.

[0014] Further, by weight, the resin composition includes 5 to 35 parts of epoxy resin, 10 to 80 parts of inorganic filler and 0.15 to 10 parts of epoxy curing agent, and the content of foaming agent is 0.02 to 0.5 parts by weight.

[0015] Preferably, the resin composition further includes an acid-modified epoxy resin, a photosensitive monomer, and a photoinitiator;

[0016] Preferably, the resin composition comprises 5 to 35 parts by weight of acid-modified epoxy resin, 3 to 15 parts by weight of photosensitive monomer and 0.5 to 5 parts by weight of photoinitiator.

[0017] Furthermore, after foaming, the pore size of the resin layer is less than or equal to 2.5% of the thickness of the foamed resin layer, preferably less than or equal to 2% of the thickness of the foamed resin layer.

[0018] Preferably, the porosity of the resin layer is 0.04 to 0.20, and the pore size is 50 to 1000 nm;

[0019] Preferably, the heat curing time is 1 to 2 hours.

[0020] Furthermore, the foaming agent is a closed-cell foaming agent, and preferred foaming agents include any one or more selected from azodicarbonamide, 2'-azobisisobutyronitrile, diethyl azodicarbonate, azoaminobenzene, diisopropyl azodicarbonate, N,N'-dinitrospentamethylenetetramine, N,N'-dimethyl-N,N'-dinitrosterephthalamide, benzenesulfonyl hydrazine, p-toluenesulfonyl hydrazine, 3,3'-disulfonyl hydrazine diphenyl sulfone, 1,3-benzenedichlorohydrazine, p-toluenesulfonamide, 4,4'-oxobis(benzenesulfonamide), 5-phenyltetrazole, trihydrazine triazine, and polysiloxane-polyalkoxyether copolymers.

[0021] Furthermore, the inorganic filler includes any one or more of silica and modified silica;

[0022] And / or, epoxy resins include any one or more of the following: bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol phenolic type epoxy resin, dicyclopentadiene type epoxy resin with aromatic structure, and anthracene type epoxy resin.

[0023] And / or, the acid-modified epoxy resin includes any one or more of phthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride, and (meth)acrylic acid-modified epoxy resin. Preferably, the acid-modified epoxy resin includes any one or more of (meth)acrylic acid-modified bisphenol A type epoxy resin, (meth)acrylic acid-modified bisphenol F type epoxy resin, (meth)acrylic acid-modified bisphenol AF type epoxy resin, (meth)acrylic acid-modified phenolic type epoxy resin, and (meth)acrylic acid-modified cresol phenolic type epoxy resin.

[0024] Furthermore, the resin composition also includes additives, preferably including any one or more of defoamers, leveling agents, pigments, and epoxy curing accelerators; preferably, the epoxy curing accelerators include any one or more of nitrogen heterocyclic compounds and their derivatives, quaternary ammonium salts of nitrogen heterocyclic compounds, urea derivatives, organic guanidine derivatives, and phosphorus-containing compounds.

[0025] To achieve the above objectives, according to one aspect of the present invention, a mechanically reinforced laminate is provided, the mechanically reinforced laminate comprising a support layer and a mechanically reinforced resin layer, the mechanically reinforced resin layer comprising any of the above-described resin layers and a mechanically reinforced layer disposed on one or both surfaces of the resin layer, the mechanically reinforced layer being obtained by disposing a mechanically reinforced layer composition on the resin layer, the mechanically reinforced layer composition comprising any of the above-described resin compositions and a hollow filler.

[0026] Furthermore, the content of hollow filler is 5 to 17 parts by weight;

[0027] Preferably, the D50 of the hollow packing is 0.7–1.2 μm;

[0028] Preferably, the hollow filler is any one or more of the following: hollow silica, inorganic hollow vitrified microspheres, inorganic hollow oxide microspheres, inorganic hollow sulfide microspheres, inorganic hollow selenide microspheres, and inorganic hollow carbide microspheres.

[0029] Preferably, the thickness of the mechanical reinforcement layer on one side is not less than 5 μm;

[0030] More preferably, the total thickness of the mechanical reinforcement layer accounts for 50% or less of the total thickness of the mechanical reinforcement resin layer.

[0031] According to another aspect of this application, a method for preparing the mechanically reinforced laminate as described above is provided. The method includes: step S1, mixing any of the above-mentioned resin compositions and foaming agents evenly, adding solvent, and preparing a resin layer composition solution with a solid content of 55-75 wt%; mixing any of the above-mentioned resin compositions and hollow fillers, adding solvent, and preparing a mechanically reinforced layer composition solution with a solid content of 55-75 wt%; step S2, sequentially coating the mechanically reinforced layer composition solution, the resin layer composition solution, and the mechanically reinforced layer composition solution onto the surface of a PET support film, and drying to obtain a mechanically reinforced laminate; or, sequentially coating the mechanically reinforced layer composition solution and the resin layer composition solution onto the surface of a PET support film, and drying to obtain a mechanically reinforced laminate.

[0032] According to another aspect of this application, a method for preparing a photosensitive element is provided, the method comprising: step S3, attaching any of the above-mentioned laminates or any of the mechanically reinforced laminates onto a carrier, exposing the material, peeling off the PET support film, and performing development and drying treatments; step S4, subjecting the developed and dried laminates or mechanically reinforced laminates to secondary exposure, and performing thermal curing at 140°C to 250°C to foam the foaming agent, thereby obtaining the photosensitive element.

[0033] Furthermore, the heat curing time is 1 to 2 hours, and preferably, the heat curing temperature is 150°C to 200°C.

[0034] Preferably, the preparation method further includes: step S5, chemically plating metal onto the photosensitive element, and then electroplating to form a metal layer; step S6, etching the metal layer formed above using an etching dry film to form a circuit pattern; step S7, attaching any of the above-mentioned laminates or any of the mechanically reinforced laminates to the metal layer etched in step 6, and repeating steps S3 to S6 to add layers, thereby obtaining the photosensitive element.

[0035] The present invention utilizes a photosensitive resin composition consisting of epoxy resin, epoxy curing agent, and inorganic filler to form a laminate, which is then applied to the fabrication of multilayer circuit boards as an interlayer insulating film separating circuits and conductor layers. The foaming technology introduces nano- to submicron closed pores into the interlayer insulating film, thereby reducing the dielectric constant (Df) and dielectric density (Dk) of the interlayer insulating film and optimizing the dielectric properties of the product. Simultaneously, the raw material resin composition and foaming agent used to prepare the laminate are widely available and inexpensive, effectively reducing the cost of the photosensitive insulating film. Furthermore, the photosensitive resin composition can be laminated, which can effectively improve production efficiency and simultaneously enable finer wiring, increased wiring density, and ultimately, miniaturization and thinning of the final product. Detailed Implementation

[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the embodiments.

[0037] As analyzed in the background section of this application, the dielectric loss factor and dielectric constant of insulating materials in the prior art need to be optimized to meet the development needs of the communications field. In order to solve this problem, this application provides a laminate, a mechanically reinforced laminate and a method for preparing the same, and a method for preparing a photosensitive device containing the same.

[0038] According to a typical embodiment of this application, a laminate is provided, the laminate comprising a support layer and a resin layer, the resin layer being prepared from a foaming agent and a resin composition, wherein the resin composition comprises epoxy resin, inorganic filler and epoxy curing agent; the resin layer having a cellular structure after being thermocured at 140°C to 250°C, the resin having a porosity of 0.02 to 0.20 and a pore size of 20 to 1000 nm.

[0039] This invention involves adding a foaming agent to a photosensitive resin composition of epoxy resin, epoxy curing agent, and inorganic filler to form a laminate, which is then applied to the fabrication of multilayer circuit boards as an interlayer insulating film to isolate circuits and conductor layers. The foaming technology introduces nano- to submicron closed pores into the interlayer insulating film, thereby reducing the dielectric constant (Df) and dielectric density (Dk) of the interlayer insulating film and optimizing the dielectric properties of the product. Simultaneously, the raw material resin composition and foaming agent used to prepare the laminate are widely available and inexpensive, effectively reducing the cost of the photosensitive insulating film. Furthermore, the photosensitive resin composition can be laminated, which can effectively improve production efficiency and enable finer wiring, increasing wiring density and making the final product smaller and thinner.

[0040] To facilitate the preparation of a resin layer with the aforementioned porosity and pore size, in some embodiments of this application, the weight ratio of the foaming agent to the resin composition in the resin layer is 0.02% to 0.5%. In some typical embodiments of this application, the resin composition comprises 5 to 35 parts of epoxy resin, 10 to 80 parts of inorganic filler, and 0.15 to 10 parts of epoxy curing agent, with the foaming agent content being 0.02 to 0.5 parts by weight, which can better leverage the synergistic effect of each component.

[0041] In some preferred embodiments of this application, the resin composition further includes an acid-modified epoxy resin, a photosensitive monomer, and a photoinitiator. To further enhance the synergistic effect of the components, the resin composition includes 5-35 parts by weight of the acid-modified epoxy resin, 3-15 parts by weight of the photosensitive monomer, and 0.5-5 parts by weight of the photoinitiator. In some typical embodiments of this application, to enhance the synergistic effect among the components, the resin composition, by weight, includes: 5-35 parts by weight of the acid-modified epoxy resin, 3-15 parts by weight of the photosensitive monomer, 10 parts by weight of the epoxy resin, 10-80 parts by weight of the inorganic filler, 0.15-10 parts by weight of the epoxy curing agent, and 0.5-5 parts by weight of the photoinitiator.

[0042] In some embodiments of this application, the pore size of the foam obtained by thermosetting the resin layer is less than or equal to 2.5% of the thickness of the resin layer after thermosetting and foaming. Preferably, the pore size of the foam obtained by thermosetting the resin layer is less than or equal to 2% of the thickness of the resin layer after thermosetting and foaming, and not less than 50 nm. This ensures that the photosensitive resin composition layer has a certain strength after thermosetting while reducing the Df and Dk of the photosensitive insulating film. In particular, when the porosity of the resin layer is 0.04 to 0.20 and the pore size is 50 to 1000 nm, the overall performance of the formed insulating film is better. In some preferred embodiments of this application, the thermosetting time is 1 to 2 hours. The thermosetting temperature is determined according to the specific type of foaming agent and resin composition in the resin layer, as well as the process requirements. In some embodiments of this application, the thermosetting temperature is 150°C to 200°C, or 140°C to 170°C.

[0043] The foaming agent used in this application can be selected from existing technologies, as long as it can form the required cell structure as described above after thermosetting with the resin composition; there are no other special requirements. To further improve the overall performance of the laminate, the foaming agent is preferably a closed-cell foaming agent, such as azo foaming agents, nitroso foaming agents, benzenesulfonyl hydrazine foaming agents, benzenesulfonamide urea foaming agents, etc. In some embodiments of this application, considering that the foaming temperature of the foaming agent is adapted to the curing temperature of the resin composition, the foaming agent includes any one or more selected from azodicarbonamide, 2'-azobisisobutyronitrile, diethyl azodicarbonate, azoaminobenzene, diisopropyl azodicarbonate, N,N'-dinitrospentamethylenetetramine, N,N'-dimethyl-N,N'-dinitrosterephthalamide, benzenesulfonyl hydrazine, p-toluenesulfonyl hydrazine, 3,3'-disulfonyl hydrazine diphenyl sulfone, 1,3-benzenedichlorohydrazine, p-toluenesulfonamide, 4,4'-oxobis(benzenesulfonamide), 5-phenyltetrazole, trihydrazine triazine, and polysiloxane-polyalkoxy ether copolymer. By using the above-mentioned foaming agent and controlling the foaming process, the film formed by the photosensitive resin composition of this application has a suitable pore size and porosity, which can further reduce the dielectric constant and dielectric loss of the film.

[0044] The epoxy resin in the above-mentioned photosensitive resin composition can be selected from existing technologies. In some embodiments of this application, the epoxy resin includes any one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol phenolic type epoxy resin, dicyclopentadiene type epoxy resin with an aromatic structure, and anthracene type epoxy resin. Exemplarily, the epoxy resin can be selected from DIC Corporation's HP-4700 series, HP4032H, HP-7200 series, EXA-7311 series, etc., or Nippon Kayaku's NC3000 series, NC7000 series, etc.

[0045] The aforementioned acid-modified epoxy resin contains photopolymerizable vinyl groups and carboxyl groups that aid in development. In some embodiments of this application, the acid-modified epoxy resin includes any one or more of phthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride modified with (meth)acrylic acid resin, where (meth)acrylic acid represents either methacrylic acid or acrylic acid. The modification of (meth)acrylic acid aims to introduce photopolymerizable double bonds, while the modification with phthalic anhydride, hexahydrophthalic anhydride, or tetrahydrophthalic anhydride aims to introduce a certain amount of carboxyl groups to achieve developability. In some embodiments, the acid-modified epoxy resin includes any one or more selected from (meth)acrylic acid-modified bisphenol A type epoxy resin, (meth)acrylic acid-modified bisphenol F type epoxy resin, (meth)acrylic acid-modified bisphenol AF type epoxy resin, (meth)acrylic acid-modified phenolic type epoxy resin, and (meth)acrylic acid-modified cresol phenolic type epoxy resin. For example, acid-modified epoxy resins can be DIC's UE-9090, Nippon Kayaku's CCR series, UXE series, ZAR series, ZFR series, etc.

[0046] The aforementioned photosensitive monomers can be selected from existing technologies, for example, any one or more of difunctional (meth)acrylate monomers, trifunctional (meth)acrylate monomers, tetrafunctional (meth)acrylate monomers, pentafunctional (meth)acrylate monomers, and hexafunctional (meth)acrylate monomers. Examples of the aforementioned multifunctional (meth)acrylate monomers include: ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, triethylene glycol dimethacrylate, 1,3-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, tripropylene glycol dimethacrylate, ethoxylated bisphenol A dimethacrylate, tricyclodecanediethanol dimethacrylate, oxetane dimethacrylate, hydroxypentanoic acid polydiethylene glycol dimethacrylate, tripropylene glycol dimethacrylate, triethylene glycol dimethacrylate, 9,9-(4-phenyl-2-acryloylethoxy)bisfluorene, etc. Monomers with varying degrees of functionality; trifunctional monomers such as trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, ethoxylated glycerol tri(meth)acrylate, and tri(2-acryloyloxyethyl isocyanurate); tetrafunctional monomers such as dimethoxypropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, and ethoxylated pentaerythritol tetra(meth)acrylate; and pentafunctional or hexafunctional monomers such as dipentaerythritol penta(meth)acrylate, benzene-oxidized dipentaerythritol hexa(meth)acrylate, ethoxylated dipentaerythritol hexa(meth)acrylate, and dipentaerythritol hexa(meth)acrylate. In some preferred embodiments, the multifunctional (meth)acrylate monomers include any combination of difunctional (meth)acrylates and hexafunctional (meth)acrylates, that is, any combination of any difunctional acrylate monomer and any hexafunctional acrylate monomer.

[0047] In some embodiments of this application, the epoxy curing agent includes any one or more of the following: phenolic resin curing agent, naphthol-based curing agent with phenolic resin structure, phenolic curing agent containing triazine skeleton, and dicyclopentadiene-type curing agent containing aromatic structure. Specific examples include DIC's LA series and EXB series curing agents, Mitsubishi Chemical's DC808 and YLH1026, or ordinary phenolic resin curing agents. More preferably, the above-mentioned curing agent is a reactive ester curing agent derived from the above-mentioned curing agent, that is, the hydroxyl groups in the above-mentioned curing agent are modified into ester groups, and no longer generate hydroxyl groups with high Df and Dk during the thermosetting process.

[0048] The aforementioned photoinitiators can be selected from existing technologies, such as oxime ester photoinitiators, thioxanthone photoinitiators, phenyl ketone photoinitiators, phosphine oxide photoinitiators, diimidazole photoinitiators, and benzophenone photoinitiators. For example, photoinitiators include: oxime ester photoinitiators such as 1-[4-(phenylthio)phenyl]-1,2-octanedione 2-(O-benzoyl oxime), 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl] ethyl ketone 1-(O-acetyl oxime); 2-methyl-2-(4-morpholinyl)-1-[4-(methylthio)phenyl]-1-propanone, 2-dimethylamino-2-benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-dimethylamino-2-(4-methyl)benzyl-1-[4-(4-morpholinyl)phenyl]-1-butanone, 2-hydroxy-2-methyl-1-phenyl-1-propanone, 2-hydroxy-2-methyl-1-(4-hydroxyethoxy)phenyl-1-propanone, 2- Phenyl ketone photoinitiators such as hydroxy-2-methyl-1-(4-methoxy)phenyl-1-propanone and 1-hydroxycyclohexylphenyl ketone; thioxanthone photoinitiators such as isopropylthioxanthone and 2,4-diethylthioxanthone; phosphine oxide photoinitiators such as (2,4,6-trimethylbenzoyl)diphenylphosphine oxide and phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide; diimidazole photoinitiators such as 2,2'-di-o-chlorophenyl-4,4',5,5'-tetraphenyl-1,2'-bisimidazole and 2,2',5-tri-(o-chlorophenyl)-4-(3,4-dimethoxyphenyl)-4',5'-diphenylbisimidazole; and benzophenone photosensitizers such as tetraethylmichalcohol, 3-phenylbenzophenone and 3-methylbenzophenone. In some preferred embodiments, the photoinitiator is any one of the phenyl ketones, any one of the thioxanthones, and a combination of tetraethylmielone, which can synergize with the photosensitive resin composition of this application to prepare a low-Df, low-Dk photosensitive insulating film.

[0049] The addition of inorganic fillers to the above-mentioned photosensitive resin composition not only helps to reduce the Df and Dk of the formed insulating film, but also significantly increases the mechanical properties of the film. In some embodiments of this application, the inorganic fillers include any one or more of silica and modified silica; preferably, the modified silica is silica modified with any one or more of vinyl, epoxy, and amino groups. Specific modification methods can refer to existing technologies, such as modifying silica by grafting or coupling the above groups.

[0050] In some preferred embodiments, the filler is optimized by using a compounding method with different particle sizes, and is divided into a first particle size filler (D50 = 0.7~1.5μm) and a second particle size filler (D50 = 0.1~0.5μm) according to particle size. The first particle size filler includes any one or more types of modified silica, and the second particle size filler includes silica and modified silica; more preferably, the content of modified silica in the second particle size filler is 45wt%~100wt%.

[0051] In a preferred embodiment, in addition to the above-mentioned components, depending on the application environment requirements of the product, the photosensitive resin composition of this application may also selectively add commonly used organic and / or inorganic additives in the art, including but not limited to defoamers, leveling agents, pigments, and epoxy curing accelerators. Taking the epoxy curing accelerator as an example, the epoxy curing accelerator can be selected from the prior art, including any one or more of nitrogen heterocyclic compounds and their derivatives, quaternary ammonium salts of said nitrogen heterocyclic compounds, urea derivatives, organic guanidine derivatives, and phosphorus-containing compounds. Preferably, the epoxy curing accelerator includes any one or more of imidazole compounds, pyridine compounds, imidazole quaternary ammonium salts, and pyridine quaternary ammonium salts. More preferably, the epoxy curing accelerator includes CN series imidazole and azazine series imidazole curing agents from Shikoku Chemical for medium and high temperature curing, unmodified original imidazole curing agents from Shikoku Chemical for medium and low temperature curing, isocyanate-terminated imidazole latent curing agents, Ajinomoto PN-23, etc. For those skilled in the art, it is easy to select appropriate additives based on the product's own needs, so I will not elaborate further here.

[0052] Those skilled in the art can easily prepare the laminate of this application based on the above-described resin composition and foaming agent. For example, the preparation method of the laminate is as follows: the resin composition and foaming agent are mixed evenly, a solvent is added, and a resin layer composition solution with a solid content of 55-75 wt% is prepared. The resin layer composition solution is coated on the surface of a PET support film and dried to obtain the above-described laminate.

[0053] According to another typical embodiment of this application, a mechanically reinforced laminate is provided. The mechanically reinforced layer includes a support layer and a mechanically reinforced resin layer. The mechanically reinforced resin layer includes any of the aforementioned resin layers and mechanically reinforced layers disposed on one or both surfaces of the resin layer. The mechanically reinforced layer is obtained by disposing a mechanically reinforced layer composition on the resin layer, wherein the mechanically reinforced layer composition includes any of the aforementioned resin compositions and a hollow filler. The mechanically reinforced layer of the above-mentioned mechanically reinforced laminate not only has lower Df and Dk values ​​but also effectively increases the mechanical strength after thermosetting.

[0054] The mechanical reinforcement layer composition differs from the raw material composition that forms the above-mentioned resin layer only in that it does not include a foaming agent and contains hollow filler. The selection of each component can refer to the above-mentioned resin composition, and there are no special requirements.

[0055] In some embodiments of this application, the content of the hollow filler is 5 to 17 parts by weight, such as 5 parts by weight, 7 parts by weight, 9 parts by weight, 11 parts by weight, 13 parts by weight, 15 parts by weight, 17 parts by weight, or any range between two of these. Preferably, the D50 of the hollow filler is 0.7 to 1.2 μm. Exemplarily, the D50 of the hollow filler is 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm, 1.1 μm, 1.2 μm, or any range between two of these. The hollow filler can be selected from existing technologies. For example, the hollow filler is any one or more of hollow silica, inorganic hollow vitrified microspheres, inorganic hollow oxide microspheres, inorganic hollow sulfide microspheres, inorganic hollow selenide microspheres, and inorganic hollow carbide microspheres. In some preferred embodiments, the pore size of the hollow filler is 40% to 65% of the outer diameter of the hollow filler.

[0056] In some preferred embodiments, the thickness of one side of the mechanical reinforcement layer is not less than 5 μm, such as 5 μm, 5.5 μm, 6 μm, 6.5 μm, 7 μm, etc., based on cost considerations, while ensuring the corresponding dielectric and mechanical properties, etc. More preferably, the total thickness of the mechanical reinforcement layer accounts for 50% or less of the total thickness of the mechanical reinforcement resin layer. When the thickness of the mechanical reinforcement layer is less than 5 μm, film formation is difficult, the process is more difficult, the production cost is increased, and the improvement of mechanical properties is limited. When the thickness is greater than 50% of the total thickness of the mechanical reinforcement resin layer, the production cost of the insulating film will increase sharply due to the increase in the amount of hollow filler.

[0057] According to another typical embodiment of this application, a method for preparing a mechanically reinforced laminate as described above is provided. The method includes: step S1, mixing the resin composition and foaming agent of any of the above-mentioned types evenly, adding a solvent to prepare a resin layer composition solution with a solid content of 55-75 wt%, mixing the resin composition and hollow filler of any of the above-mentioned types, adding a solvent to prepare a mechanically reinforced layer composition solution with a solid content of 55-75 wt%; step S2, sequentially coating the mechanically reinforced layer composition solution, the resin layer composition solution, and the mechanically reinforced layer composition solution onto the surface of a PET support film, drying to obtain a mechanically reinforced laminate; or, sequentially coating the mechanically reinforced layer composition solution and the resin layer composition solution onto the surface of a PET support film, drying to obtain a mechanically reinforced laminate.

[0058] The mechanically reinforced laminate prepared by the above method not only has low Df and Dk values, but also effectively increases the mechanical strength after thermosetting. Moreover, the preparation method is simple and easy to implement, which can reduce the production cost of the laminate.

[0059] According to another typical embodiment of this application, a method for preparing a photosensitive element is provided. The method includes: step S3, attaching any of the above-mentioned laminates or any of the above-mentioned mechanically reinforced laminates to a carrier, exposing the material, peeling off the PET support film, and performing development and drying treatments; step S4, subjecting the developed and dried laminates or mechanically reinforced laminates to secondary exposure, and performing thermal curing at 140°C to 250°C to foam the foaming agent.

[0060] In some embodiments, the heat curing time is 1 to 2 hours, and the heat curing temperature is 150°C to 200°C.

[0061] In some embodiments of this application, the above preparation method further includes: step S5, chemically plating metal onto the photosensitive element, and then electroplating to form a metal layer; step S6, etching the metal layer formed above using an etching dry film to form a circuit pattern; step S7, attaching the above-mentioned laminate or mechanically reinforced laminate onto the etched metal layer, and repeating steps S3 to S6 to add layers, thereby obtaining a photosensitive device.

[0062] In some typical embodiments of this application, a photosensitive insulating film is prepared using the above-mentioned photosensitive resin composition, and layering is performed to achieve finer wiring and increase wiring density. Exemplarily, the layering method is as follows:

[0063] 1) Preparation of photosensitive resin composition solution: According to the formula table, mix each component evenly according to the weight ratio, add a certain amount of butanone, and then stir thoroughly until evenly dispersed to prepare a resin composition solution with a solid content of 55-75 wt%.

[0064] 2) Preparation of the laminate: The photosensitive resin composition liquid prepared in 1) above is evenly coated onto the surface of a PET support film using a coating machine. It is then pre-baked in an 85°C oven for 8–20 minutes to form a dry film resist layer of predetermined thickness, which appears green under yellow light. A polyethylene protective film is then laminated onto its surface to obtain a three-layer photosensitive resin composition dry film product, which is stored in a freezer for later use.

[0065] 3) Laminate application, exposure, and development: Remove the laminate product prepared in step 2) from the freezer and thaw at room temperature for 1 hour. After peeling off the polyethylene protective film, apply the dry film of the photosensitive resin composition onto a commercial copper-clad laminate or copper foil using a vacuum laminator, roller laminator, or high-speed laminator (vacuum laminator: pressure 3.5–4 kgf, vacuum time 20–60 s, pressure time 20–60 s, temperature 65–100 °C; roller laminator: pressure 4–4.5 kgf, temperature 100–110 °C). After lamination, allow it to stand for 1 hour. Then, expose the resulting photosensitive resin composition layer using a high-pressure mercury lamp exposure machine with different masks and different exposure energies. After exposure, allow the material to stand for 1 hour, then peel off the PET support film. Develop the exposed photosensitive resin composition layer using an alkaline developer (0.8–1.2 wt% sodium carbonate aqueous solution) at 25°C (development time 45–75 s), followed by rinsing with deionized water for 20 seconds. Dry in a 120°C oven for 10 minutes.

[0066] 4) Post-curing: After drying, the patterned precast panels are exposed again under a high-pressure mercury lamp exposure machine, and then heat-cured in an oven at 140℃~200℃ for 1~2 hours, adjusting the curing time according to the curing temperature and progress. During this process, the foaming agent foams to form a porous insulating layer.

[0067] 5) Copper plating: Chemical metal plating is performed on the formed pattern, followed by electroplating to form a metal layer.

[0068] 6) Etching: The metal layer is etched using an etching dry film to form a pattern.

[0069] 7) Adding layers: Then repeat steps 3)-6) to form the second layer, the third layer, and so on until the required number of layers is reached, thus completing the layer addition.

[0070] The above-described layering method is merely an example. Those skilled in the art can also use other methods to perform layering. The photosensitive resin composition of this application does not have any special requirements in this regard.

[0071] The beneficial effects that this application can achieve will be further illustrated below with reference to embodiments and comparative examples.

[0072] (1) Preparation of photosensitive resin composition liquid

[0073] The formulations of the photosensitive resin compositions in the examples and comparative examples are shown in Tables 1 and 2 below. According to the formulation tables, each component is mixed evenly according to the weight parts, a certain amount of butanone is added, and then the mixture is stirred thoroughly until it is evenly dispersed to prepare a resin composition liquid with a solid content of 58.4 wt%.

[0074] Table 1

[0075]

[0076] Table 2

[0077]

[0078]

[0079] The compounds listed in the table are as follows.

[0080] A1: ZFR-1401H (acid-modified bisphenol F epoxy resin, Nippon Kayaku);

[0081] B1: SR833NS (photopolymerized acrylate monomer, 2-functionality, Sartoma);

[0082] B2: DHPA (photopolymerized acrylate monomer, 6-functionality, Sartoma);

[0083] C1: HP-4700 (contains multiple naphthol structures, DICC);

[0084] C2: NPEL-128E (linear polybisphenol A, Nan Ya);

[0085] D1: 8000-65T (DIC, reactive ester curing agent);

[0086] D2: PN-23 (Ajinomoto, imidazole curing accelerator);

[0087] E1: GW01 (Jinlei Technology, modified silica filler, alkylsilane modified, D50 = 1μm); E2: NFS-200 (Yishitong, unmodified silica filler, D50 = 0.2μm);

[0088] E3: Hollow filler (Suiyou (Shanghai), particle size D50 is 0.9μm, median inner diameter (hollow part) is 0.4μm, hollow silica);

[0089] G1: 4,4-Oxobisbenzenesulfonylhydrazine (Aladdin);

[0090] G2: N,N'-Dinitrosopentamethylenetetramine (Xin'ao Rubber & Plastics Technology);

[0091] G3: Azodicarbonamide (Maclean);

[0092] F1: PI799 (Changzhou Qiangli, 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone, photoinitiator I);

[0093] F2: PI777 (Changzhou Qiangli, 2,4-diethylthioxanthracene-9-one, photoinitiator II);

[0094] F3: Tetraethylmirlidone (Aladdin, photoinitiator III);

[0095] H1: Defoamer SH-193 (Dow Chemical);

[0096] H2: Pigment PG7 (BASF);

[0097] (2) Preparation of photosensitive resin composition laminate products

[0098] 1) The above resin compositions P1-P12, P16 and the prepared photosensitive resin composition solution (solution A) are uniformly coated onto the surface of a PET support film using a coating machine. The film is then pre-baked in an 85°C oven for 8-12 minutes to form a dry film resist layer of a predetermined thickness (see Tables 3 and 4), which appears green under yellow light. A polyethylene protective film is then laminated onto its surface to obtain a three-layer photosensitive resin composition laminate product, which is stored in a freezer for later use.

[0099] Sensitivity test

[0100] 2) Remove the photosensitive resin composition laminate prepared in the above steps from the freezer and thaw at room temperature for 1 hour. After peeling off the polyethylene protective film, apply the photosensitive resin composition laminate onto a commercial copper-clad laminate using a vacuum laminator or roller laminator (vacuum laminator: pressure 3.5–4 kgf, vacuum time 30–60 s, pressure time 30–60 s, temperature 85–100 °C; roller laminator: pressure 4–4.5 kgf, temperature 100–110 °C). After lamination, allow it to stand for 1 hour, then expose the resulting photosensitive resin composition layer at different exposure energies using an ST21 exposure ruler mask. After exposure, allow it to stand for 1 hour, peel off the PET support film, and perform clock development on the exposed photosensitive resin composition layer using an alkaline developer (0.8–1.2 wt% sodium carbonate aqueous solution) at 25 °C (development time 45–75 s), followed by rinsing with deionized water for 20 seconds. After development, the lowest exposure energy at which the ST8 photosensitive resin composition dry film product is not developed and can be fully exposed is recorded as the sensitivity energy.

[0101] The porosity and pore size of the prepared porous insulating layer were tested.

[0102] 3) Photocuring: Based on the sensitivity test results, the dry film resist layer is exposed to ST8 / 21 exposure energy for full photocuring (dry film resist layer thickness is 50μm), or the dry film resist layer is attached to the copper plate and exposed to ST8 / 21 exposure energy for full photocuring (dry film resist layer thickness is 25μm). Then it is developed and dried.

[0103] 4) Post-curing: The dried precast panels are exposed again under a high-pressure mercury lamp exposure machine, and then heat-cured in an oven. The heat curing time is generally 1-2 hours, and the curing time is adjusted according to the curing temperature and curing progress, as shown in Tables 3 and 4. During this process, the foaming agent foams to form a porous insulating layer.

[0104] 5) The test results of porosity and pore size of the porous insulation layer are shown in Tables 3 and 4 below.

[0105] Among them, the test method for porosity is as follows:

[0106] After the 50μm thick product film was dried and exposed, its density before and after foaming was measured, according to the formula.

[0107] Porosity = (1 - ρ / ρa) × 100%;

[0108] Where ρ: bulk density, here is the density before foaming; ρa: apparent density, here is the density after foaming;

[0109] This allows us to calculate the porosity of the product after foaming.

[0110] Methods for testing aperture:

[0111] The foam pore size was determined by cross-sectioning the product after foaming to a thickness of 25μm on a copper plate using SEM. The pore size was directly measured by selecting three random 25μm×50μm areas and calculating the arithmetic mean of all pore sizes. For hollow inorganic fillers, the filler itself was physically destroyed and then adhered to conductive adhesive. The pore size was observed using SEM, with three random 50μm×50μm areas selected and the arithmetic mean of the pore sizes of the destroyed samples calculated.

[0112] Table 3

[0113]

[0114] Table 4

[0115]

[0116]

[0117] (3) Preparation of mechanically reinforced laminates

[0118] 1) Prepare the mechanical reinforcement layer composition adhesive (adhesive B), i.e., resin compositions P13-P16 in Table 2, which do not contain foaming agents. When preparing the mechanically reinforced laminate product, adhesive B (forming a structural reinforcement layer after curing), adhesive A (forming a foaming layer after curing), and adhesive B (forming a structural reinforcement layer after curing) are sequentially coated onto the surface of the PET support film. The film is then pre-baked in an 85°C oven for 10 minutes according to different predetermined thicknesses to form a dry film resist layer of the predetermined thickness (see Table 5 for details), which appears green under yellow light. Then, a polyethylene protective film is laminated onto its surface to obtain a three-layer photosensitive resin composition mechanically reinforced laminate product, which is then stored in a freezer for later use.

[0119] Sensitivity test

[0120] 2) Remove the mechanically reinforced photosensitive resin composition laminate prepared in the above steps from the freezer and thaw at room temperature for 1 hour. After peeling off the polyethylene protective film, apply the photosensitive resin composition laminate onto a commercial copper-clad laminate using a vacuum laminator or roller laminator (vacuum laminator: pressure 3.5–4 kgf, vacuum time 30–60 s, pressure time 30–60 s, temperature 85–100 °C; roller laminator: pressure 4–4.5 kgf, temperature 100–110 °C). After lamination, allow it to stand for 1 hour, then expose the resulting photosensitive resin composition layer at different exposure energies using an ST21 exposure ruler mask. After exposure, allow it to stand for 1 hour, peel off the PET support film, and perform clock development (45–75 s) on the exposed photosensitive resin composition layer using an alkaline developer (0.8–1.2 wt% sodium carbonate aqueous solution) at 25 °C, followed by rinsing with deionized water for 20 seconds. After development, the lowest exposure energy at which the ST8 photosensitive resin composition dry film product is not developed and can be fully exposed is recorded as the sensitivity energy.

[0121] The pore size of the prepared porous insulating layer was tested.

[0122] 3) Photocuring: Based on the sensitivity test results, the dry film resist layer is exposed to ST8 / 21 exposure energy for full photocuring (50μm thickness), or the dry film resist layer is attached to the copper plate and exposed to ST8 / 21 exposure energy for full photocuring (25μm thickness). Then, it is developed and dried.

[0123] 4) Post-curing: The dried precast panels are exposed again under a high-pressure mercury lamp exposure machine, and then heat-cured in an oven. The heat curing time is generally 1-2 hours, and the curing time is adjusted according to the curing temperature and curing progress, as shown in Table 5. During this process, the foaming agent foams to form a porous insulating layer.

[0124] 5) The test results are shown in Table 5 below.

[0125] Methods for testing aperture:

[0126] The foam pore size is obtained by cross-sectioning the product after foaming with a thickness of 25μm on a copper plate, observing it with SEM, directly measuring the pore size of the voids, randomly selecting 3 25μm×50μm ranges, statistically analyzing all pore sizes, and taking their arithmetic mean.

[0127] Table 5

[0128]

[0129] Dielectric property (Df and Dk) testing

[0130] A 50 μm thick dry film of the photosensitive resin composition was prepared, and then exposed to the entire plate at a sensitivity of ST8 / 21. After standing for 1 hour, it was developed and then photocured a second time. Thermal curing was performed according to the temperatures and times specified in Tables 3, 4, and 5, thereby forming a cross-linked cured resin composition on the PET support film. The PET support film was removed, and the sample was cut into 10 cm × 10 cm samples for later use. Before testing, the samples were pre-treated by drying in a 150°C oven for 2 hours, and then placed in a split dielectric resonator (SPDR) for testing. The Df and Dk values ​​at 10 GHz were recorded. The sample was moved, and the measurements were repeated. After three tests, the arithmetic mean was recorded as the final Df and Dk values ​​of the sample.

[0131] Young's modulus test

[0132] A 50 μm thick dry film of the photosensitive resin composition was prepared, then exposed to the entire plate at a sensitivity of ST8 / 21. After standing for 1 hour, it was developed, light-cured a second time, and then thermo-cured according to the temperatures and times specified in Tables 3, 4, and 5, thereby forming a cross-linked cured resin composition on the PET support film. The PET support film was removed, and the sample was cut into (12.7±0.25) mm × 76.20 mm samples for later use. Tensile tests were performed using an Instron Model 4501 tensile testing machine with a uniform force of 0.2 kN to obtain tensile curves. This test was repeated ten times, and the arithmetic mean was recorded as the corresponding parameters (Young's modulus, elongation at break, etc.).

[0133] The test results of each embodiment and comparative example are shown in Tables 6 and 7.

[0134] Table 6

[0135]

[0136] Table 7

[0137]

[0138] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects: By adding a foaming agent to a photosensitive resin composition of epoxy resin, epoxy curing agent, and inorganic filler to form a laminate, it is applied to the fabrication of multilayer circuit boards as an interlayer insulating film to isolate circuits and conductor layers. The foaming technology introduces nano- to submicron closed pores into the interlayer insulating film, thereby reducing the dielectric constant (Df) and dielectric constant (Dk) of the interlayer insulating film and optimizing the dielectric properties of the product. Simultaneously, the raw material resin composition and foaming agent used to prepare the above-mentioned laminate are widely available, inexpensive, and readily available, effectively reducing the cost of the photosensitive insulating film. Furthermore, the photosensitive resin composition can be laminated, which can effectively improve production efficiency and simultaneously achieve finer wiring and increased wiring density, making miniaturization and thinning of the final product possible.

[0139] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A laminate comprising a support layer and a resin layer, characterized in that, The resin layer is prepared from a foaming agent and a resin composition, the resin composition includes 5-35 parts by weight of an epoxy resin, 10-80 parts by weight of an inorganic filler, and 0.15-10 parts by weight of an epoxy curing agent, the content of the foaming agent is 0.02-0.5 parts by weight; the weight ratio of the foaming agent to the resin composition in the resin layer is 0.02%-0.5%; the resin composition further includes 5-35 parts by weight of an acid-modified epoxy resin, 3-15 parts by weight of a photosensitive monomer, and 0.5-5 parts by weight of a photoinitiator. The resin layer has a cell structure after being heat-cured at 140-250°C, the porosity of the resin layer is 0.02-0.20, and the cell diameter is 20-1000 nm.

2. The laminate according to claim 1, characterized by The cell diameter is less than or equal to 2.5% of the thickness of the resin layer after foaming.

3. The laminate according to claim 2, characterized by The cell diameter is less than or equal to 2% of the thickness of the resin layer after foaming.

4. The laminate according to claim 2, characterized by The porosity of the resin layer is 0.04-0.20, and the cell diameter is 50-1000 nm.

5. The laminate according to claim 2, characterized by The heat-curing time is 1-2 hours.

6. The laminate according to claim 1, characterized by The foaming agent is a closed-cell foaming agent.

7. The laminate according to claim 6, characterized by The foaming agent includes any one or more selected from azodicarbonamide, 2'-azobisisobutyronitrile, diethyl azodicarboxylate, azoaminobenzene, diisopropyl azodicarboxylate, N,N'-dinitrosopentamethylenetetramine, N,N'-dimethyl-N,N'-dinitrosophthalamide, benzenesulfonyl hydrazide, p-toluenesulfonyl hydrazide, 3,3'-disulfonyl hydrazine diphenyl sulfone, 1,3-benzenediyl hydrazide, p-toluenesulfonyl hydrazide, 4,4'-oxybis(benzenesulfonyl hydrazide), 5-phenyltetrazole, trihydrazinotriazine, and polysiloxane-polyalkoxy ether copolymer.

8. The laminate according to claim 1, characterized by The inorganic filler includes any one or more of silica and modified silica. The epoxy resin includes any one or more of bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresylic phenol aldehyde type epoxy resin, dicyclopentadiene type epoxy resin with aromatic structure, and anthracene type epoxy resin. The acid-modified epoxy resin includes any one or more of phthalic anhydride, hexahydrophthalic anhydride, and tetrahydrophthalic anhydride and (meth)acrylic acid-modified epoxy resin.

9. The laminate according to claim 8, characterized by The acid-modified epoxy resin includes any one or more selected from (meth)acrylic acid-modified bisphenol A type epoxy resin, (meth)acrylic acid-modified bisphenol F type epoxy resin, (meth)acrylic acid-modified bisphenol AF type epoxy resin, (meth)acrylic acid-modified phenol aldehyde type epoxy resin, and (meth)acrylic acid-modified cresylic phenol aldehyde type epoxy resin.

10. The laminate according to claim 1, characterized by The resin composition further includes an auxiliary agent.

11. The laminate according to claim 10, characterized by The auxiliary agent includes any one or more of defoaming agent, leveling agent, pigment, and epoxy curing agent accelerator.

12. The laminate according to claim 11, characterized by The epoxy curing agent accelerator includes any one or more of nitrogen heterocyclic compound and its derivative, urea derivative, organic guanidine derivative, and phosphorus-containing compound.

13. A mechanically-reinforced laminate characterized by comprising: The mechanical strengthening resin layer comprises the resin layer as claimed in any one of claims 1 to 12 and a mechanical strengthening layer provided on one surface or both surfaces of the resin layer, the mechanical strengthening layer being obtained by providing the resin layer with a mechanical strengthening layer composition comprising the resin composition as claimed in any one of claims 1 to 12 and a hollow filler.

14. The mechanically-reinforced laminate of claim 13, wherein, The content of the hollow filler is 5 to 17 parts by weight.

15. The mechanically-reinforced laminate of claim 14, wherein, The D50 of the hollow filler is 0.7 to 1.2 μm.

16. The mechanically-reinforced laminate of claim 14, wherein The hollow filler is any one or more of hollow silica, inorganic hollow vitrified microbead, inorganic hollow oxide microsphere, inorganic hollow sulfide microsphere, inorganic hollow selenide microsphere, and inorganic hollow carbide microsphere.

17. The mechanically-reinforced laminate of claim 14, wherein The single-sided thickness of the mechanical strengthening layer is not less than 5 μm.

18. The mechanically-reinforced laminate of claim 14, wherein, The total thickness of the mechanical strengthening layer accounts for 50% or less of the total thickness of the mechanical strengthening resin layer.

19. A method of producing a mechanically-reinforced laminate according to any one of claims 13 to 18, characterized by, The method comprises the following steps: In step S1, the resin composition as claimed in any one of claims 1 to 12 and a foaming agent are mixed uniformly, a solvent is added, and a resin layer composition glue solution with a solid content of 55 to 75 wt% is prepared, the resin composition as claimed in any one of claims 1 to 12 and a hollow filler are mixed, a solvent is added, and a mechanical strengthening layer composition glue solution with a solid content of 55 to 75 wt% is prepared, In step S2, the mechanical strengthening layer composition glue solution, the resin layer composition glue solution, and the mechanical strengthening layer composition glue solution are coated on the surface of the PET support film in sequence, and are dried to obtain a mechanical strengthening layer stack; or, In step S2, the mechanical strengthening layer composition glue solution and the resin layer composition glue solution are coated on the surface of the PET support film in sequence, and are dried to obtain a mechanical strengthening layer stack.

20. A method for fabricating a photosensitive element, characterized in that, The method comprises the following steps: In step S3, the stack as claimed in any one of claims 1 to 12 or the mechanical strengthening layer stack as claimed in any one of claims 13 to 18 is attached to a carrier, is exposed to light, and the PET support film is peeled off, and is subjected to developing and drying treatment; In step S4, the stack or the mechanical strengthening layer stack after the developing and drying treatment is subjected to secondary exposure, and is subjected to thermal curing at 140 to 250 °C to make the foaming agent foam, and a photosensitive component device is obtained.

21. The method of claim 20, wherein, The time of the thermal curing is 1 to 2 hours.

22. The method of claim 21, wherein, The temperature of the thermal curing is 150 to 200 °C.

23. The preparation method according to claim 21, characterized in that, The method further comprises the following steps: In step S5, the photosensitive component device is subjected to electroless plating of metal, and is subjected to electroplating to form a metal layer; In step S6, the metal layer formed above is etched by using an etching dry film to form a circuit pattern; In step S7, the stack as claimed in any one of claims 1 to 12 or the mechanical strengthening layer stack as claimed in any one of claims 13 to 18 is attached to the metal layer after the etching in step S6, and steps S3 to S6 are repeated to form a layer.

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