Apparatus and system for two-phase server cooling

By using a cooling device that separates liquid and vapor compartments in the server cooling system, and combining liquid and vapor circuits, the problem of insufficient local cooling in high power density servers is solved, achieving efficient thermal management and fluid management, adapting to different hardware, and being easy to deploy and maintain.

CN116339465BActive Publication Date: 2026-07-17BAIDU USA LLC
View PDF 2 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BAIDU USA LLC
Filing Date
2022-07-05
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing single-phase and dual-phase immersion cooling solutions are insufficient to support high power density servers, especially in terms of the lack of effective acceleration in localized cooling.

Method used

The system employs a cooling device and system that divides the internal volume into liquid and vapor compartments via partitions. It utilizes gravity and fluid motion to achieve the separation and circulation of the two-phase cooling fluid, including liquid and vapor outlets, combined with liquid and vapor circuits, and uses sensors and pumps to control fluid flow.

Benefits of technology

It achieves efficient thermal management for high power density servers, adapts to non-uniform power density, solves hotspot challenges, prevents fluid loss, has high operational efficiency, is easy to deploy and maintain, and has good scalability and flexibility.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN116339465B_ABST
    Figure CN116339465B_ABST
Patent Text Reader

Abstract

Embodiments of a cooling device are disclosed. The cooling device includes a housing that encloses an interior volume, the housing having at least a heat transfer contact surface adapted to be thermally coupled to a heat generating electronic component. A partition is located within the interior volume; the partition divides the interior volume into a liquid compartment and a vapor compartment, and the partition has a gap therein to allow fluid movement between the liquid compartment and the vapor compartment. A liquid inlet is fluidly coupled to the liquid compartment; a liquid outlet is fluidly coupled to the vapor compartment; and a vapor outlet is fluidly coupled to the vapor compartment. Embodiments of a cooling system including designs and operations using the cooling device are also disclosed.
Need to check novelty before this filing date? Find Prior Art