Irradiation module and apparatus for processing a substrate having the same

Abstract

The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a support unit configured to support and rotate a substrate in a processing space; a liquid supply unit configured to supply liquid to the substrate supported on the support unit; a housing having a mounting space; a laser unit configured to include a laser irradiation unit positioned in the mounting space for irradiating a laser, and an irradiation end having an end positioned to protrude from the housing and irradiating the laser irradiated from the laser irradiation unit onto the substrate supported on the support unit; and a cover having an internal space and positioned such that the protruding end of the irradiation end from the housing is positioned in the internal space, wherein an opening is formed at the bottom end of the cover so that, when viewed from above, the opening coincides with the laser irradiated from the irradiation end.

Description

Technical Field

[0001] The embodiments of the inventive concept described herein relate to an irradiation module and a substrate processing apparatus having said irradiation module, and more specifically, a substrate processing apparatus having an irradiation module for irradiating a substrate with light. Background Technology

[0002] The photolithography process for forming patterns on a wafer includes an exposure process. The exposure process is a previously performed operation to cut the semiconductor integrated material attached to the wafer into a desired pattern. The exposure process can serve various purposes, such as forming patterns for etching and forming patterns for ion implantation. During exposure, patterns are drawn on the wafer using light by using a mask that acts as a 'framework'. When the semiconductor integrated material on the wafer (e.g., a photoresist on the wafer) is exposed to light, the chemical properties of the photoresist change according to the pattern through the light and the mask. When a developer is supplied to the photoresist whose chemical properties have been changed according to the pattern, the pattern is formed on the wafer.

[0003] To accurately execute the exposure process, the pattern formed on the mask needs to be precisely manufactured. It must be verified that the formed pattern meets the process conditions. A large number of patterns are formed on a single mask. This means that a significant amount of time is required to inspect all of these numerous patterns to inspect a single mask. Therefore, a monitoring pattern representing a group of patterns comprising multiple patterns is formed on the mask. Additionally, anchor patterns representing multiple groups of patterns are formed on the mask. The operator can estimate the quality of the pattern formed on the mask by inspecting the monitoring pattern. Furthermore, the operator can estimate the quality of the pattern formed on the mask by inspecting the anchor patterns.

[0004] Furthermore, to improve the accuracy of mask inspection, it is preferable that the critical dimensions of the monitoring pattern and the anchoring pattern are the same. Therefore, a critical dimension correction process is additionally performed to accurately correct the critical dimensions of the pattern formed on the mask.

[0005] Figure 1The diagram illustrates the normal distribution of the first critical dimension CDP1 and the second critical dimension CDP2 (critical dimension of the anchoring pattern) of the monitoring pattern of the mask before the critical dimension correction process is performed during mask manufacturing. Furthermore, both the first critical dimension CDP1 and the second critical dimension CDP2 are smaller than the target critical dimension. Before the critical dimension correction process, there is an intentional deviation between the critical dimensions (CD, critical dimensions) of the monitoring pattern and the anchoring pattern. Additionally, the anchoring pattern is further etched during the critical dimension correction process to make the critical dimensions of the two patterns identical. During the over-etching of the anchoring pattern, if the anchoring pattern is over-etched compared to the monitoring pattern, a difference in the critical dimensions of the monitoring pattern and the anchoring pattern will occur, and therefore the critical dimensions of the pattern formed at the mask may not be accurately corrected. When the anchoring pattern is etched again, precise etching of the anchoring pattern should accompany the process.

[0006] For the anchor pattern to be accurately etched, the angle and output of the light illuminating the anchor pattern must be precisely adjusted. If particles or droplets of processing liquid adhere to the illuminator that illuminates the anchor pattern, the angle of the light illuminating the anchor pattern is distorted, and the light path changes. Therefore, the profile of the light illuminating the anchor pattern may change. For this reason, precise etching of the anchor pattern cannot be performed. Furthermore, particles or droplets adhering to the illuminator cause corrosion of the illuminator and become a factor reducing its durability. Summary of the Invention

[0007] Embodiments of the present invention provide an irradiation module and a substrate processing apparatus having said irradiation module for effectively processing a substrate.

[0008] Embodiments of the present invention provide an irradiation module and a substrate processing apparatus having said irradiation module for performing precise etching on a substrate.

[0009] Embodiments of the present invention provide an irradiation module and a substrate processing apparatus having said irradiation module, which has high durability to minimize the impact of particles and ink droplets generated during the process.

[0010] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0011] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a support unit configured to support and rotate a substrate in a processing space; a liquid supply unit configured to supply liquid to the substrate supported on the support unit; a housing having a mounting space; a laser unit configured to include a laser irradiation unit positioned in the mounting space for irradiating a laser, and an irradiation end having an end positioned to protrude from the housing and irradiating the laser irradiated from the laser irradiation unit onto the substrate supported on the support unit; and a cover having an internal space and positioned such that the protruding end of the irradiation end from the housing is positioned in the internal space, wherein an opening is formed at the bottom end of the cover so that, when viewed from above, the opening coincides with the laser irradiated from the irradiation end.

[0012] In one embodiment, the substrate processing apparatus further includes a purge gas supply unit for supplying purge gas to the internal space.

[0013] In one embodiment, an annular partition is installed in the interior space of the cover to divide the interior space into an upper buffer space and a bottom space.

[0014] In one embodiment, the partition member includes: a first slit formed in the interior space at a region adjacent to the location where the purge gas is supplied to the interior space, and the first slit having a first opening area; and a second slit formed in the interior space facing the region where the purge gas is supplied to the interior space, and the second slit having a second opening area, wherein the first opening area is smaller than the second opening area.

[0015] In one embodiment, the partition member includes: a first hole, which is provided in a plurality of locations and formed in the interior space in a region adjacent to the location where the purge gas is supplied to the interior space; and a second hole, which is provided in a plurality of locations and formed in the interior space in a region facing the location where the purge gas is supplied to the interior space, wherein the average diameter of the first hole is smaller than the average diameter of the second hole.

[0016] In one embodiment, a purge port is formed at the end of the housing and the purge port is connected to the purge gas supply unit, and a supply port for supplying the purge gas to the internal space is formed on the side of the cover, and the substrate processing apparatus further includes a flow cover, which is combined with the side of the cover to connect the purge port and the supply port, the flow cover having a flow space for allowing the purge gas to flow therein.

[0017] In one embodiment, the supply port is located at a position spaced apart from the central axis of the irradiation end when viewed from the front.

[0018] In one embodiment, the substrate processing apparatus further includes a cover plate provided for covering the opening, and the cover plate being provided as a material through which the laser passes.

[0019] In one embodiment, the substrate processing apparatus further includes: an imaging unit for imaging the laser light irradiated from the laser unit; and wherein the imaging unit is positioned at the mounting space.

[0020] In one embodiment, the laser unit further includes a beam expander for controlling the characteristics of the laser irradiated by the laser irradiation unit, and wherein the imaging unit includes: a camera unit configured to image an image of the laser irradiated from the laser unit and / or the substrate; and an illumination unit configured to provide light for acquiring the image of the camera unit, wherein the irradiation direction of the laser, the imaging direction of the camera unit, and the irradiation direction of the light are coaxial.

[0021] In one embodiment, an irradiation module for irradiating a substrate includes: a housing having a mounting space; a laser unit configured to include a laser irradiation unit positioned in the mounting space for irradiating a laser and an irradiation end having an end positioned to protrude from the housing and irradiating the laser irradiated from the laser irradiation unit onto the substrate; and a cover having an internal space and positioned such that the protruding end of the irradiation end from the housing is positioned in the internal space, wherein an opening is formed at the bottom end of the cover so that, when viewed from above, the opening coincides with the laser irradiated from the irradiation end.

[0022] In one embodiment, the irradiation module further includes a purge gas supply unit for supplying purge gas to the interior space.

[0023] In one embodiment, an annular partition is installed in the interior space of the cover to divide the interior space into an upper buffer space and a bottom space.

[0024] In one embodiment, the partition member includes: a first slit formed in the interior space at a region adjacent to the location where the purge gas is supplied to the interior space, and the first slit having a first opening area; and a second slit formed in the interior space facing the region where the purge gas is supplied to the interior space, and the second slit having a second opening area, wherein the first opening area is smaller than the second opening area.

[0025] In one embodiment, a purge port is formed at the end of the housing and connected to the purge gas supply unit, and a supply port is mounted on the side of the cover, which is spaced apart from the central axis of the irradiation end when viewed from the front, and the supply port supplies the purge gas to the internal space. The irradiation module also includes a flow cover, which is combined with the side of the cover to connect the purge port and the supply port, and the flow cover has a flow space for allowing the purge gas to flow therein.

[0026] In one embodiment, the irradiation module further includes a cover plate provided for covering the opening, and the cover plate is provided as a material through which the laser can pass.

[0027] The present invention provides a substrate processing apparatus for processing a mask having multiple units. The substrate processing apparatus includes: a support unit configured to support and rotate the mask, on which a first pattern is formed within the multiple units and a second pattern is formed outside the area where the units are formed; a liquid supply unit configured to supply liquid to the mask supported at the support unit; a housing having a mounting space; a laser unit configured to include a laser irradiation unit positioned in the mounting space for irradiating a laser, and a second pattern having an end positioned to protrude from the housing and irradiating the laser irradiated from the laser irradiation unit into the first and second patterns; and a cover having an internal space and positioned such that the protruding end of the irradiation end is positioned in the internal space, and wherein an opening is formed so that, when viewed from above, the opening coincides with the laser irradiated from the irradiation end.

[0028] In one embodiment, the substrate processing apparatus further includes a purge gas supply unit for supplying purge gas to the internal space.

[0029] In one embodiment, an annular partition is installed in the interior space of the cover to divide the interior space into an upper buffer space and a bottom space, and the partition includes: a first slit formed in the interior space in a region adjacent to the portion of the purge gas supplied thereto in the interior space, and the first slit having a first opening area; and a second slit formed in the interior space facing the region of the purge gas supplied thereto in the interior space, and the second slit having a second opening area, wherein the first opening area is smaller than the second opening area.

[0030] In one embodiment, a purge port is formed at the end of the housing and connected to the purge gas supply unit, and a supply port is mounted on the side of the cover, which is spaced apart from the central axis of the irradiation end when viewed from the front, and the supply port supplies the purge gas to the internal space. The substrate processing apparatus also includes a flow cover, which is combined with the side of the cover to connect the purge port and the supply port, and the flow cover has a flow space for allowing the purge gas to flow therein.

[0031] According to embodiments of the present invention, substrates can be processed efficiently.

[0032] According to embodiments conceived in this invention, precise etching can be performed on the substrate.

[0033] According to embodiments conceived in this invention, etching of specific patterns formed on a substrate can be performed precisely.

[0034] According to embodiments of the present invention, the impact of particles or ink droplets generated during the process is minimized to increase the durability of the irradiation module and the substrate processing equipment.

[0035] The effects of this invention are not limited to those described above, and other effects not mentioned will become apparent to those skilled in the art from the following description. Attached Figure Description

[0036] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals refer to the same parts in the various drawings, and in the drawings:

[0037] Figure 1The normal distribution of the critical dimensions of the monitoring pattern and the anchoring pattern is shown.

[0038] Figure 2 This is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention.

[0039] Figure 3 The illustration shows the view from above. Figure 2 The state of the substrate being processed in the liquid processing chamber.

[0040] Figure 4 schematically shown Figure 2 An example of a liquid handling chamber.

[0041] Figure 5 yes Figure 4 A top view of the liquid handling chamber.

[0042] Figure 6 schematically shown Figure 4 Illumination module viewed from the front.

[0043] Figure 7 schematically shown Figure 6 The illumination module as seen from above.

[0044] Figure 8 It schematically shows the following based on Figure 6 The embodiment shows the cover and the flow cover as viewed from above.

[0045] Figure 9 The diagram schematically illustrates the basis as viewed from above. Figure 6 The partition member of the embodiment.

[0046] Figure 10 The purge gas is schematically shown in... Figure 6 The state of flow inside the irradiation module.

[0047] Figure 11 The detection unit and are schematically shown. Figure 4 An embodiment of the support unit.

[0048] Figure 12 yes Figure 11 A view of the detection unit as seen from above.

[0049] Figure 13 schematically shown Figure 6 A top view of another embodiment of the separator component.

[0050] Figure 14 schematically shown Figure 6 A top view of another embodiment of the lid and the flow cover.

[0051] Figure 15 The purge gas is schematically shown in... Figure 14 The state of flow in the blowing space.

[0052] Figure 16 schematically shown Figure 6 A front view of another embodiment of the irradiation module. Detailed Implementation

[0053] The inventive concept can be modified and taken in various forms, and specific embodiments of the inventive concept will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions included within the spirit and scope of the inventive concept. In the description of the inventive concept, detailed descriptions of relevant prior art may be omitted where it may obscure the essence of the inventive concept.

[0054] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, the word “the” is intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that, when used in this specification, the term “comprising” indicates the presence of the stated features, integrals, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “exemplary” is intended to refer to an example or illustration.

[0055] In the following, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings.

[0056] In the following text, reference will be made to Figures 2 to 16 The embodiments of the present invention are described in detail. Figure 2 This is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention.

[0057] refer to Figure 2 The substrate processing apparatus includes a transposition module 10, a processing module 20, and a controller 30. According to one embodiment, when viewed from the front, the transposition module 10 and the processing module 20 can be arranged along one direction.

[0058] In the following text, the direction of setting the transposition module 10 and the processing module 20 is defined as the first direction X, the direction perpendicular to the first direction X when viewed from above is defined as the second direction Y, and the direction perpendicular to the plane including both the first direction X and the second direction Y is defined as the third direction Z.

[0059] The transposition module 10 transfers the substrate M from the container C containing the substrate M to the processing module 20 that processes the substrate M. The transposition module 10 stores the substrate M, which has undergone predetermined processing at the processing module 20, in the container C. The longitudinal direction of the transposition module 10 can be formed in the second direction Y. The transposition module 10 may have a loading port 12 and a transposition frame 14.

[0060] The container C containing the substrate M is located on the loading port 12. The loading port 12 can be positioned on the opposite side of the processing module 20 relative to the indexing frame 14. Multiple loading ports 12 can be provided, and the multiple loading ports 12 can be arranged in a row along the second direction Y. The number of loading ports 12 can be increased or decreased according to the process efficiency and area requirements of the processing module 20.

[0061] As container C, a sealed container, such as a front-opening unified pod (FOUP), can be used. Container C can be placed on loading port 12 by a conveying device (not shown) (such as an overhead conveyor, overhead transport, or automated guided vehicle) or by an operator.

[0062] The indexing frame 14 provides a transport space for transferring substrate W. An indexing robot 120 and an indexing track 124 can be disposed at the indexing frame 14. The indexing robot 120 transports substrate M. The indexing robot 120 can transport substrate M between the indexing module 10 and the buffer unit 200, which will be described later. The indexing robot 120 includes an indexing hand 122. Substrate M can be placed on the indexing hand 122. The indexing hand 122 can be configured to be movable back and forth, rotatable in the third direction Z, and movable along the third direction Z. Multiple hands 122 can be provided. Multiple hands 122 can be configured to be spaced apart from each other in the up / down direction. Multiple hands 122 can move back and forth independently of each other.

[0063] The indexing track 124 is disposed in the indexing frame 14. The indexing track 124 is configured to extend longitudinally along the second direction Y. The indexing robot 120 can be placed on the indexing track 124 and can move linearly along the indexing track 124.

[0064] The controller 30 can control the substrate processing apparatus 1. The controller 30 can control the configuration provided to the substrate processing apparatus 1. The controller 30 may include a process controller comprising a microprocessor (computer) that performs control over the substrate processing apparatus 1, a user interface such as a keyboard through which an operator inputs commands to manage the substrate processing apparatus 1, a display showing the operating status of the substrate processing apparatus 1, and a memory unit that stores processing schemes (i.e., control programs that execute the processing procedures of the substrate processing apparatus 1 by controlling the process controller, or programs that execute components of the substrate processing apparatus 1 according to data and processing conditions). Additionally, the user interface and the memory unit may be connected to the process controller. The processing schemes may be stored in a storage medium in the memory unit, and the storage medium may be a hard disk, a portable disk (such as a CD-ROM or DVD), or a semiconductor memory (such as flash memory).

[0065] Processing module 20 may include a buffer unit 200, a transfer frame 300, and a liquid processing chamber 400. The buffer unit 200 provides space for substrates M fed into and discharged from processing module 20 to temporarily reside therein. The transfer frame 300 provides space for transferring substrates M between the buffer unit 200, the liquid processing chamber 400, and the drying chamber 500. The liquid processing chamber 400 supplies liquid to substrates M to perform a liquid processing procedure for processing substrates M. The drying chamber 500 performs a drying procedure for drying substrates M that have undergone liquid processing.

[0066] A buffer unit 200 can be disposed between the indexing frame 14 and the transfer frame 300. The buffer unit 200 can be positioned at the end of the transfer frame 300. A slot (not shown) for placing the substrate M is provided inside the buffer unit 200. Multiple slots (not shown) can be provided. Multiple slots (not shown) can be spaced apart from each other in the third direction Z.

[0067] The front and rear of the buffer unit 200 are open. The front is the surface facing the indexing module 10, and the rear is the surface facing the transfer frame 300. The indexing robot 120 can access the buffer unit 200 through the front, and the transfer robot 320, which will be described later, can access the buffer unit 200 through the rear.

[0068] The conveyor frame 300 may have a longitudinal direction arranged in the first direction X. The liquid processing chamber 400 and the drying chamber 500 may be arranged on both sides of the conveyor frame 300. Alternatively, the liquid processing chamber 400 and the drying chamber 500 may be arranged on one side of the conveyor frame 300. The conveyor frame 300 and the liquid processing chamber 400 may be arranged along the second direction Y.

[0069] According to one embodiment, the liquid processing chambers 400 can be disposed on both sides of the conveying frame 300. The liquid processing chambers 400 can be arranged in an A×B pattern along a first direction X and a third direction Z on the sides of the conveying frame 300 (where A and B are natural numbers greater than 1 or 1, respectively).

[0070] The transfer frame 300 includes a transfer robot 320 and a transfer track 324. The transfer robot 320 transfers a substrate M. The transfer robot 320 transfers the substrate M between the buffer unit 200, the liquid handling chamber 400, and the drying chamber 500. The transfer robot 320 includes a transfer hand 322 on which the substrate M is placed. The substrate M can be placed on the transfer hand 322. The transfer hand 322 can be configured to move back and forth, rotate about a third direction Z, and move along the third direction Z. Multiple hands 322 are configured to be spaced apart from each other in the up / down direction, and multiple hands 322 can move back and forth independently of each other.

[0071] The conveyor track 324 can be disposed within the conveyor frame 300 along its longitudinal direction. In one embodiment, the longitudinal direction of the conveyor track 324 can be disposed along a first direction X. The conveyor robot 320 can be placed on the conveyor track 324 and can move on the conveyor track 324.

[0072] Figure 3 The illustration shows the view from above. Figure 2 The substrate is processed in the liquid processing chamber. Reference will be made below. Figure 3 The substrate M processed in the liquid processing chamber 400 is described in detail in an embodiment of the present invention.

[0073] refer to Figure 3 The object to be processed in the liquid processing chamber 400 can be any of a wafer, glass, and a photomask. For example, the substrate M processed in the liquid processing chamber 400 according to an embodiment of the present invention can be a photomask serving as a 'frame' used in the exposure process.

[0074] The substrate M may be rectangular. The substrate M may serve as a photomask acting as a "frame" during the exposure process. At least one reference mark AK may be marked on the substrate M. For example, multiple reference marks AK may be formed in each corner region of the substrate M. The reference mark AK may be a mark called an alignment key used when aligning the substrate M. Furthermore, the reference mark AK may be a mark used to derive the position of the substrate M. For example, the imaging unit 4540, described later, can acquire an image by imaging the reference mark AK and transmit the acquired image to the controller 30. The controller 30 can then analyze the image including the reference mark AK to detect the precise position of the substrate M. Additionally, the reference mark AK can be used to determine the position of the substrate M when it is being transported.

[0075] Cells CE can be formed on the substrate M. For example, at least one cell CE can be formed, or multiple cells CE can be formed. Multiple patterns can be formed at each cell CE. The pattern formed at each cell CE can be defined as a pattern group. The pattern formed at the cell CE may include an exposure pattern EP and a first pattern P1. A second pattern P2 may be displayed in an area outside the cell area where multiple cells are formed.

[0076] An exposure pattern EP can be used to form an actual pattern on a substrate M. A first pattern P1 can be a single-cell representative pattern representing the exposure pattern EP within a cell CE. Alternatively, when multiple cells CE are provided, a first pattern is provided in each cell, thereby allowing for multiple first patterns P1. In one embodiment, each of the multiple cells CE may have a single first pattern P1. However, the inventive concept is not limited to this, and multiple first patterns P1 can be formed within a single cell CE. A first pattern P1 may have a form that combines portions of each exposure pattern EP. A first pattern P1 may be referred to as a monitoring pattern. The average critical size of the multiple first patterns P1 may be referred to as a critical size monitoring macro (CDMM).

[0077] When an operator examines the first pattern P1 formed at any cell CE using a scanning electron microscope (SEM), the form of the exposure pattern EP formed in that cell CE can be estimated to be good or poor. The first pattern P1 can serve as a check pattern for examining the exposure pattern EP. Furthermore, unlike the example above, the first pattern P1 can be any of the exposure patterns EP used in the actual exposure process. Optionally, the first pattern P1 can serve not only as a check pattern for examining the exposure pattern but also simultaneously as the exposure pattern used in the actual exposure.

[0078] The second pattern P2 can be a whole-cell representative pattern representing the exposure pattern EP on all cells of the substrate M. For example, the second pattern P2 can have a form that combines portions of each of the first patterns P1.

[0079] When an operator inspects the second pattern P2 using a scanning electron microscope (SEM), they can estimate whether the form of the exposure pattern EP formed on a substrate M is good or poor. Therefore, the second pattern P2 can serve as an inspection pattern. Alternatively, the second pattern P2 can be an inspection pattern not used in the actual exposure process. The second pattern P2 can also be a pattern used to set the process conditions of the exposure equipment. The second pattern P2 can be referred to as an anchoring pattern.

[0080] The liquid processing chamber 400 according to an embodiment of the present invention will be described in detail below. The process performed in the liquid processing chamber 400 during the fabrication of a mask for an exposure process, specifically a fine critical dimension correction (FCC) process, will be described as an example below.

[0081] The substrate M to be fed into the liquid processing chamber 400 and processed therein can be a substrate M that has already undergone pretreatment. The critical dimensions of the first pattern P1 and the second pattern P2 of the substrate M to be fed into the liquid processing chamber 400 can be different from each other. According to an embodiment of the present invention, the critical dimension of the first pattern P1 can be larger than the critical dimension of the second pattern P2. In one embodiment, the critical dimension of the first pattern P1 has a first width (e.g., 69 nm). The critical dimension of the second pattern P2 can have a second width (e.g., 68.5 nm).

[0082] Figure 4 schematically shown Figure 2 An example of a liquid handling chamber. Figure 5 yes Figure 4 A top view of the liquid handling chamber. (Reference) Figure 4 and Figure 5 The liquid processing chamber 400 may include a housing (not shown), a support unit 420, a processing container 430, a liquid supply unit 440, and an irradiation module 450.

[0083] The housing 410 has an internal space. The internal space may include a support unit 420, a processing container 430, a liquid supply unit 440, and an irradiation module 450. The housing 410 may have a passageway (not shown) through which the substrate M can be fed and discharged. The inner wall surface of the housing (not shown) may be coated with a material highly resistant to the chemicals supplied to the liquid supply unit 440.

[0084] An vent (not shown) can be formed on the bottom surface of the housing (not shown). The vent (not shown) can be connected to an exhaust component, such as a pump, capable of venting the internal space. Smoke and other fumes generated in the internal space can be discharged outside the housing (not shown) through the vent (not shown).

[0085] The support unit 420 can support the substrate M. The support unit 420 can support the substrate W in the processing space of the processing container 430, which will be described later. The support unit 420 can rotate the substrate M. The support unit 420 may include a body 421, a support pin 422, a support shaft 426, and a drive member 427.

[0086] The main body 421 may be in the form of a plate. The main body 421 may be in the form of a plate with a constant thickness. When viewed from above, the main body 421 may have a top surface arranged in a generally circular shape. The top surface of the main body 421 may be configured to have an area larger than that of the substrate M. A support pin 422 may be mounted on the main body 421.

[0087] Support pin 422 supports substrate M. When viewed from above, support pin 422 may have a downward stepped portion to support substrate M. The stepped portion of support pin 422 may have a first surface and a second surface. For example, the first surface may support the back (bottom) surface at the edge region of substrate M. The second surface may face the side surface of the edge region of substrate M. Therefore, if substrate M rotates, the lateral movement of substrate M can be restricted.

[0088] At least one support pin 422 is provided. In one embodiment, multiple support pins 422 may be provided. The number of support pins 422 may be set to correspond to the number of corners of the substrate M having a rectangular shape. The support pins 422 may support the back side (bottom surface) of the substrate M spaced apart from the top surface of the body 421.

[0089] A support shaft 426 is connected to the main body 421. The support shaft 426 is positioned below the main body 421. The support shaft 426 may be a hollow shaft. A fluid supply line 428 may be formed inside the hollow shaft. The fluid supply line 428 may supply processing fluid and / or processing gas to the bottom portion of the substrate M. For example, the processing fluid may include a chemical liquid or a rinsing liquid. The chemical may be an acid or a liquid with alkaline properties. The rinsing liquid may be pure water. For example, the processing gas may be an inert gas. The processing gas may dry the bottom portion of the substrate M. However, unlike the example above, the fluid supply line 428 may not be located inside the support shaft 426.

[0090] The support shaft 426 can be rotated by the drive member 427. The drive member 427 can be a hollow motor. When the drive member 427 rotates the support shaft 426, the main body 421 connected to the support shaft 426 can rotate. The base plate M can rotate together with the main body 421 via the support pin 422.

[0091] Processing container 320 has a processing space. Processing container 430 has a processing space in which substrate M is processed. In one embodiment, processing container 430 may have a processing space with an open top. Processing container 430 may have a cylindrical form with an open top. Substrate M can undergo liquid processing and heat treatment in the processing space. Processing container 430 can prevent processing liquid supplied to substrate M from splashing into housing 410, liquid supply unit 440, and irradiation module 450.

[0092] The processing container 430 may have multiple collection containers 432a, 432b, and 432c. Each of the collection containers 432a, 432b, and 432c can individually collect different liquids from the liquid used to process the substrate M. Each of the collection containers 432a, 432b, and 432c may have a collection space for collecting the liquid used to process the substrate M. When viewed from above, each of the collection containers 432a, 432b, and 432c may be arranged in a ring around the support unit 420. When performing the liquid processing process, the liquid dispersed by the rotation of the substrate W is introduced into the collection space through an inlet, which is a space formed between the collection containers 432a, 432b, and 432c respectively. Different types of processing liquids can be introduced into each of the collection containers 432a, 432b, and 432c.

[0093] According to one embodiment, the processing container 430 may have a first recollection container 432a, a second recollection container 432b, and a third recollection container 432c. The first recollection container 432a may be arranged in a ring around the support unit 420. The second recollection container 432b may be arranged in a ring around the first recollection container 432a. The third recollection container 432c may be arranged in a ring around the second recollection container 432b.

[0094] Vertically extending redistribution lines 434a, 434b, and 434c on the respective bottom surfaces can be connected to each of the redistribution containers 432a, 432b, and 432c. Each of the redistribution lines 434a, 434b, and 434c can discharge treated liquid introduced through each of the redistribution containers 432a, 432b, and 432c. The discharged treated liquid can be reused using an external treated liquid regeneration system (not shown).

[0095] The processing container 430 can be connected to a lifting / lowering member 436. The lifting / lowering member can move the processing container 430. For example, the lifting / lowering member 436 can change the position of the processing container 430 along a third direction Z. The lifting / lowering member 436 can be a drive device for moving the processing container 430 in the up / down direction. The lifting / lowering member 436 can move the processing container 430 in the upward direction while performing liquid processing and / or heat treatment on the substrate M. When the substrate M is placed into or removed from the internal space, the lifting / lowering member 436 can move the processing container 430 in the downward direction.

[0096] Liquid supply unit 440 can supply liquid to substrate W. Liquid supply unit 440 can supply processing liquid for processing substrate M. Liquid supply unit 440 can supply processing liquid to substrate M supported by support unit 420. In one embodiment, liquid supply unit 440 can supply processing liquid to substrate M, which has a first pattern formed within a plurality of units CE and a second pattern P2 formed outside the area where the units CE are formed.

[0097] The processing liquid can be an etching liquid or a rinsing liquid. The etching liquid can be a chemical. The etching liquid can etch patterns formed on the substrate M. The etching liquid can also be referred to as an etching solution. The etching liquid can be a liquid containing a mixed solution of ammonia, water, and additives, and including hydrogen peroxide. The rinsing liquid can clean the substrate M. The rinsing liquid can be provided as a known chemical liquid.

[0098] refer to Figure 5 The liquid supply unit 440 may include a nozzle 441, a fixed body 442, a rotating shaft 443, and a rotating member 444. The nozzle 441 supplies the processing liquid to the substrate M supported by the support unit 420. One end of the nozzle 441 may be connected to an end of the fixed body 442, and its other end may extend from the fixed body 442 toward the substrate M. The nozzle 411 may extend from the fixed body 442 in a first direction X.

[0099] Nozzle 411 may include a first nozzle 411a, a second nozzle 411b, and a third nozzle 411c. Any one of the first nozzle 411a, the second nozzle 411b, or the third nozzle 411c may supply the chemicals in the aforementioned treated liquid. Additionally, the other one of the first nozzle 411a, the second nozzle 411b, and the third nozzle 411c may supply the rinsing liquid R in the aforementioned treated liquid. The last of the first nozzle 411a, the second nozzle 411b, or the third nozzle 411c may supply a different type of chemical than the chemical supplied by the other one of the first nozzle 411a, the second nozzle 411b, or the third nozzle 411c.

[0100] The main body 442 can fix and support the nozzle 441. The main body 442 can be connected to a rotating shaft 443 that rotates in the third direction Z via a rotating member 444. When the rotating member 444 rotates the rotating shaft 443, the main body 442 can rotate about the third direction Z. Therefore, the outlet of the nozzle 441 can move between a liquid supply position, which is a position for supplying processing liquid to the substrate M, and a standby position, which is a position for not supplying processing liquid to the substrate M.

[0101] Figure 6 schematically shown Figure 4 Illumination module viewed from the front. Figure 7 schematically shown Figure 6 The illumination module is shown as viewed from above. References will be made below. Figure 6 and Figure 7 A detailed description of an irradiation module according to an embodiment of the present invention is provided.

[0102] The irradiation module 450 can irradiate the substrate M with light. For example, the irradiation module 450 can heat the substrate M. In addition, the irradiation module 450 can monitor the heat treatment performed on the substrate M. The irradiation module 450 may include a housing 4510, a moving unit 4520, a laser unit 4530, an imaging unit 4540, a purge gas supply unit 4550, a cover 4560, and a flow cover 4580.

[0103] The housing 4510 has mounting space. The laser unit 4530 and imaging unit 4540 can be positioned within the mounting space of the housing 4510. In one embodiment, the laser unit 4530, camera unit 4542, and imaging unit 4544 can be positioned within the mounting space of the housing 4510. The housing 4510 protects the laser unit 4530 and imaging unit 4540 from particles, fumes, or scattered droplets generated during the process.

[0104] The purge gas supply line 4552, which will be described later, can be disposed in the mounting space of the housing 4510. A purge port 4512 can be formed on the bottom surface of the housing 4510. The purge port 4512 allows the flow of purge gas supplied from the purge gas supply unit 4550, which will be described later. The purge port 4512 can communicate with the flow space of the flow cover 4580, which will be described later.

[0105] An opening may be formed at the bottom of the housing 4510. The irradiation end 4535, which will be described later, can be inserted into the opening of the housing 4510. When the irradiation end 4535 is inserted into the opening of the housing 4510, the end of the irradiation end 4535 may be positioned to protrude from the bottom end of the housing 4510. For example, a portion of the lens barrel 4537, which will be described later, may protrude from the bottom end of the housing 4510.

[0106] The moving unit 4520 moves the housing 4510. The moving unit 4520 can move the irradiation end 4535, which will be described later, via the moving housing 4510. The moving unit 4520 may include a driver 4522, a shaft 4524, and a moving member 4526.

[0107] The driver 4522 can be a motor. The driver 4522 can be connected to the shaft 4524. The driver 4522 can move the shaft 4524 in the vertical direction. The driver 4522 can rotate the shaft 4524. In one embodiment, multiple drivers 4522 can be provided. One of the multiple drivers 4522 can be configured as a rotary motor for rotating the shaft 4524, and another of the multiple drivers 4522 can be configured as a linear motor for moving the shaft 4524 in the vertical direction.

[0108] Shaft 4524 can be connected to housing 4510. Shaft 4524 can be connected to housing 4510 via movable member 4526. As shaft 4524 rotates, housing 4510 can also rotate. Therefore, the position of irradiation end 4535, which will be described later, can also be changed. For example, the position of irradiation end 4535 can be changed in the third direction Z. In addition, the position of irradiation end 4535 can be changed relative to the third direction Z, which is the axis of rotation.

[0109] When viewed from above, the center of the irradiation end 4535 can move while tracing an arc toward the center of the axis 4524. When viewed from above, the center of the irradiation end 4535 can move to pass through the center of the substrate M supported by the support unit 420. The irradiation end part 4535 can move between a process position where the laser L is irradiated onto the substrate M via the moving unit 4520 and a standby position, wherein the standby position is a standby position in which no heat treatment is performed on the substrate M.

[0110] The movable member 4526 can be disposed between the housing 4510 and the shaft 4524. The movable member 4526 can be an LM guide. The movable member 4526 can move the housing 4510 in the lateral direction. The movable member 4526 can move the housing 4510 in the first direction X and / or the second direction Y. The position of the irradiation end 4535 can be changed in various ways by the actuator 4522 and the movable member 4526.

[0111] Laser unit 4530 can heat substrate M. Laser unit 4530 can heat substrate M supported by support unit. Laser unit 4530 can heat a portion of substrate M. Laser unit 4530 can heat a specific area of ​​substrate M. Laser unit 4530 can heat substrate M on which a liquid film is formed by supplying chemicals. Laser unit 4530 can heat a pattern formed on substrate M. Laser unit 4530 can heat either a first pattern P1 or a second pattern P2. Laser unit 4530 can heat the second pattern P2 of the first pattern P1 and the second pattern P2. According to one embodiment, laser unit 4530 can heat the second pattern P2 by irradiating with laser L.

[0112] The laser unit 4530 may include a laser irradiation unit 4531, a beam expander 4532, a tilting member 4533, a bottom reflector 4534, and a lens member 4535. The laser irradiation unit 4531 irradiates a laser L. The laser irradiation unit 4531 can irradiate a laser L having straightness. The laser L irradiated from the laser irradiation unit 4531 can be projected onto the substrate M via the bottom reflector 4534 and the lens member 4535, which will be described later. In one embodiment, the laser L irradiated from the laser irradiation unit 4531 can sequentially irradiate a second pattern P2 formed on the substrate M via the bottom reflector 4534 and the lens member 4535.

[0113] The beam expander 4532 can control the characteristics of the laser L irradiated by the laser irradiation unit 4531. The beam expander 4532 can adjust the shape of the laser L irradiated from the laser irradiation unit 4531. Furthermore, the beam expander 4532 can adjust the contour of the laser L irradiated from the laser irradiation unit 4531. For example, the diameter of the laser L emitted from the laser irradiation unit 4531 can be changed in the beam expander 4532. The diameter of the laser L emitted from the laser irradiation unit 4531 can be expanded or reduced in the beam expander 4532.

[0114] The tilting member 4533 can tilt the irradiation direction of the laser L emitted by the laser irradiation unit 4531. The tilting member 4533 can rotate the laser irradiation unit 4531 based on an axis. The tilting member 4533 can rotate the laser irradiation unit 4531 to tilt the irradiation direction of the laser L irradiated from the laser irradiation unit 4531. The tilting member 4533 may include a motor.

[0115] The bottom reflective member 4534 can change the irradiation direction of the laser L irradiated from the laser irradiation unit 4531. For example, the bottom reflective member 4534 can change the irradiation direction of the laser L irradiated in the horizontal direction to a vertically downward direction. For example, the bottom reflective member 4534 can change the irradiation direction of the laser L towards the irradiation end 4535, which will be described later. The laser L refracted by the bottom reflective member 4534 can be transmitted to the substrate M to be processed or the monitoring target 491, which will be described later, through the lens member 4535.

[0116] The bottom reflector 4534 can be positioned to coincide with the top reflector 4548, which will be described later, when viewed from above. The bottom reflector 4534 can be disposed below the top reflector 4548. The bottom reflector 4534 can be tilted at the same angle as the top reflector 4548.

[0117] Lens component 4535 may include a lens 4536 and a lens barrel 4537. In one embodiment, lens 4536 may be an objective lens. Lens barrel 4537 may be mounted at the bottom end of the lens. Lens barrel 4537 may have a generally cylindrical shape. Lens barrel 4537 may be inserted into an opening formed at the bottom end of housing 4510. The end of lens barrel 4537 may be positioned to protrude from the bottom end of housing 4510.

[0118] Lens component 4535 can be used as an illumination end 4535 through which laser L illuminates the substrate M. Laser L emitted by laser unit 4530 can be emitted onto substrate M through illumination end 4535. Image capture by camera unit 4542 can be provided through illumination end 4535. Light emitted by illumination module 4544 can be provided through illumination end 4535.

[0119] Imaging unit 4540 can image the laser L emitted by laser unit 4530. Imaging unit 4540 can acquire images, such as videos and / or photographs, of the area illuminated by laser L from laser module 4330. Imaging unit 4540 can monitor laser L illuminated by laser irradiation unit 4531.

[0120] The imaging unit 4540 can monitor information about the laser L irradiated by the laser illumination unit 4531. For example, the imaging unit 4540 can monitor the diameter information of the laser L. Additionally, the imaging unit 4540 can monitor the center information of the laser L. Furthermore, the imaging unit 4540 can monitor the contour information of the laser L. The imaging unit 4540 may include a camera unit 4542, an illumination unit 4544, and a top reflective member 4548.

[0121] Camera unit 4542 acquires an image of the laser L irradiated by laser irradiation unit 4531. For example, camera unit 4542 can acquire an image including the point irradiated by laser L irradiated by laser irradiation unit 4531. Additionally, camera unit 4542 acquires an image of the substrate M supported by support unit 420. Furthermore, camera unit 4542 can acquire an image of the monitored target 491 of detection unit 490, which will be described later.

[0122] Camera unit 4542 may be a camera. The direction in which camera unit 4542 images to acquire an image may be pointed towards the top reflective member 4548, which will be described later. Camera unit 4542 may transmit the acquired image to controller 30. Camera unit 4542 may acquire an image of the laser L illuminated by laser irradiation unit 4531 displayed on the monitored target 491 and transmit the acquired image to controller 30.

[0123] The illumination unit 4544 can provide light, allowing the camera unit 4542 to easily acquire images. The illumination unit 4544 may include an illumination member 4545, a first reflector 4546, and a second reflector 4547. The illumination member 4545 illuminates light. The illumination member 4545 provides light. The light provided by the illumination member 4545 can be reflected sequentially along the first reflector 4546 and the second reflector 4547. The light provided by the illumination member 4545 can be reflected from the second reflector 4547 and illuminates in a direction toward the top reflector 4548, which will be described later.

[0124] The top reflective member 4548 can change the imaging direction of the camera unit 4542. For example, the top reflective member 4548 can change the imaging direction of the camera unit 4542 from a horizontal direction to a vertically downward direction. For example, the top reflective member 4548 can change the imaging direction of the camera unit 4542 to face the illumination end 4535. The top reflective member 4548 can change the illumination direction of the light transmitted sequentially through the first reflector 4546 and the second reflector 4547 of the illumination member 4545 from a horizontal direction to a vertically downward direction. For example, the top reflective member 4548 can change the illumination direction of the light from the illumination unit 4544 to face the illumination end 4535.

[0125] The top reflector 4548 and the bottom reflector 4534 can be positioned to coincide when viewed from above. The top reflector 4548 can be positioned above the bottom reflector 4534. The top reflector 4548 and the bottom reflector 4534 can be tilted at the same angle. If the illumination direction of the laser L irradiated from the laser illumination unit 4531, the imaging direction for acquiring an image through the camera unit 4542, and the illumination direction of the light provided by the illumination unit 4544 are visible from above, the top reflector 4548 and the bottom reflector 4534 can have a coaxial axis.

[0126] The purge gas supply unit 4550 can be installed inside the housing 4510. The purge gas supply unit 4550 can be disposed in the installation space of the housing 4510. The purge gas supply unit 4550 may include a purge gas supply source (not shown) and a purge gas supply line 4552.

[0127] According to one embodiment, a purge gas supply source (not shown) may be located within the mounting space of the housing 4510. However, the inventive concept is not limited thereto, and the purge gas supply source (not shown) may be located outside the housing 4510. The purge gas supply source (not shown) serves as a source for storing and / or supplying purge gas. One end of the purge gas supply line 4552 may be connected to the purge gas supply source (not shown), and the other end of the purge gas supply line 4552 may be connected to a purge port 4512 formed on the bottom surface of the housing 4510. Purge gas flowing through the purge gas supply line 4552 may flow through the purge port 4512 into the flow space of the flow cover 4580, which will be described later.

[0128] Figure 8 It schematically shows the following based on Figure 6 The embodiment shows the cover and the flow cover as viewed from above. Figure 9 The diagram schematically illustrates the basis as viewed from above. Figure 6 The separating member of the embodiment. In the following, reference will be made to... Figures 6 to 9 A detailed description is given of the cap and flow cap according to embodiments of the present invention.

[0129] The cover 4560 is positioned at the bottom end of the housing 4510. When viewed from above, the cover 4560 may be configured to protrude downward from the bottom end of the housing 4510 at a position corresponding to the irradiation end 4535. The cover 4560 has an internal space. The end of the irradiation end 4535 may be positioned within the internal space of the cover 4560. For example, a portion of the lens barrel 4537 may be positioned within the internal space of the cover 4560. The cover 4560 may have a generally cylindrical shape.

[0130] The cap 4560 may be integrally formed with the housing 4510 and the flow cap 4580, which will be described later. However, the internal space is not limited thereto, and the housing 4510, cap 4560, and flow cap 4580 may be formed separately and may be combined by physical and / or chemical methods. Optionally, the cap 4560 and flow cap 4580 may be integrally formed, and the housing 4510 may be physically and / or chemically coupled to the cap 4560 and flow cap 4580.

[0131] An opening is formed at the bottom end of the cover 4560. This opening in the cover 4560 is positioned to coincide with the laser L emitted from the irradiation end 4535 when viewed from above. For example, the opening is positioned to coincide with the laser L emitted through the lens member 4535 when viewed from above. Furthermore, the size of the opening is configured so as not to interfere with the laser L emitted from the irradiation end 4535, the image capture by the camera unit 4542, or the light emitted by the illumination unit 4544.

[0132] A supply port 4562 may be formed on the side surface of the cover 4560. In one embodiment, such as Figure 8 As shown, a supply port 4562 may be formed on one side of the cover 4560, which, when viewed from above, corresponds to the central axis of the irradiation end 4535 based on the central axis of the irradiation end 4535. The supply port 4562 may communicate with a flow space formed inside the flow cover 4580, as described later. Therefore, purge gas supplied from the purge gas supply unit 4550 can be sequentially supplied through the supply port 4562 to the purge port 4512, the flow space of the flow cover 4580, and the internal space of the cover 4560.

[0133] The partition member 4570 can be installed in the internal space of the cover 4560. The partition member 4570 can divide the internal space of the cover 4560 into a top space and a bottom space. The top space of the partition member 4570 can be used as a buffer space. The buffer space can be configured to temporarily retain the purge gas supplied through the supply port 4562.

[0134] In the following text, for ease of explanation, the area in the interior space of the cover 4560 adjacent to the location where the supply port 4562 is installed is defined as the first area A, and the area in the interior space of the cover 4560 facing the first area A is defined as the second area B.

[0135] like Figure 9 As shown, the partition member 4570 can be formed in an annular shape. The outer circumferential surface of the partition member 4570 can contact the inner surface of the cover 4560. The inner circumferential surface of the partition member 4570 can contact the outer surface of the irradiation end 4535.

[0136] A first slit 4572 and a second slit 4574 may be formed in the partition member 4570. The first slit 4572 may be formed in a region corresponding to the first region A. The first slit 4572 may be configured as a slit extending from the top end to the bottom end of the partition member 4570. The first slit 4572 may be formed along the circumferential direction of the partition member 4570. The first slit 4572 may have a first opening area D1.

[0137] The second slit 4574 can be formed in the region corresponding to the second region B. The second slit 4574 can be configured as a vertical slit penetrating the partition member 4570. The second slit 4574 can be formed along the circumferential direction of the partition member 4570. The second slit 4574 can have a second opening area D2. The second opening area D2 is configured to be relatively larger than the first opening area D1.

[0138] The partition member 4570 can uniformly discharge the purge gas supplied to the interior space of the cover 4560 from the interior space. The purge gas supplied to the buffer space of the cover 4560 is temporarily retained in the buffer space. The purge gas flowing in the buffer space passes through the first slit 4572 and the second slit 4574 formed in the partition member 4570. By forming different opening areas of the first slit 4572 and the second slit 4574, the average flow rate of the purge gas passing through the first slit 4572 is less than the average flow rate of the purge gas passing through the second slit 4574. Therefore, the purge gas flowing in the bottom space of the interior space of the cover 4560 can be uniformly distributed. The purge gas with a uniform flow rate in the bottom space is uniformly discharged outside the cover 4560 through the opening formed at the bottom end of the cover 4560.

[0139] A flow cover 4580 can connect cover 4560 and housing 4510. The flow cover 4580 can be attached to the side surface of cover 4560. The flow cover 4580 can be connected to extend from cover 4560 in the lateral direction. The flow cover 4580 is positioned at the bottom end of housing 4510. The flow cover 4580 can be connected to purge port 4512 and supply port 4562 respectively. The flow cover 4580 has a flow space through which purge gas flows. The flow cover 4580 can have a flow space through which purge gas supplied from purge port 4512 flows. Therefore, the flow space of the flow cover 4580 can communicate with purge port 4512 and supply port 4562.

[0140] Purge gas supplied from the gas supply line 4552 connected to the purge port 4512 flows in the flow space of the flow cover 4580. The purge gas supplied from the purge port 4512 is supplied through the flow space of the flow cover 4580 to the supply port 4562. The purge gas supplied to the supply port 4562 is supplied to the interior space of the cover 4560. In one embodiment, the purge gas supplied to the supply port 4562 flows into a buffer space of the cover 4560. The purge gas supplied to the buffer space passes through a first slit 4572 and a second slit 4574 formed in the partition member 4570 and is evenly discharged into an opening formed at the bottom end of the cover 4560.

[0141] Typically, if a liquid processing or heat treatment process is performed on substrate M, the distance between substrate M and substrate processing equipment 1 is very close. Therefore, processing liquid splashed back from substrate M during the process can adhere to the irradiation module 450. Additionally, particles generated from substrate M during the process, such as fumes, can adhere to the irradiation module 450. Specifically, if droplets and / or particles adhere to the irradiation end 4535 where various types of light are irradiated, the path and / or contour of the laser L irradiated from the irradiation module 450 changes. This makes it difficult to perform a precise etching process on substrate M.

[0142] Figure 10 The purge gas is schematically shown in... Figure 6 The flow state inside the irradiation module. (Reference) Figure 8 and Figure 10 According to an embodiment of the present invention, the illumination module 450 may provide: a laser unit 4530 that illuminates a laser L; a camera unit 4542 for imaging an image; and an illumination unit 4544 provided to surround the housing 4510, thereby protecting the laser unit 4530, the camera unit 4542 for imaging the image, and the illumination unit 4544 from ink droplets and / or particles generated during the process.

[0143] Furthermore, according to an embodiment of the present invention, the irradiation end 4535, in which laser L is irradiated, image capture is performed, and light is emitted, can be protected by a cover 4560. An opening is formed at the bottom end of the cover 4560, so that the laser L, image capture, and light irradiation emitted from the irradiation end 4535 are not disturbed, but ink droplets and / or particles that can be introduced into the opening can be supplied to the internal space of the cover 4560, thus providing secondary protection for the irradiation module 450.

[0144] Furthermore, most of the purge gas supplied to the first region A within the interior space of the cover 4560 flows out through the opening along the sidewall of the opening adjacent to the first region A. Therefore, the amount of purge gas flowing into the second region B within the interior space of the cover 4560 is relatively less than the amount flowing into the region adjacent to the first region A. Consequently, the supply of purge gas to the second region B within the interior space of the cover 4560 cannot be smoothly executed. Therefore, particles and / or droplets generated during the process can be introduced from the opening adjacent to the second region B.

[0145] According to an embodiment of the invention, the opening areas of the first slit 4572 and the second slit 4574 installed in the interior space of the cover 4560 can be formed differently, so that particles and / or ink droplets generated from the process can be uniformly supplied to the second region B, which is the region facing the supply port 4562 to which the purge gas is supplied and the first region A.

[0146] Figure 11 The detection unit and are schematically shown. Figure 4 An embodiment of the support unit. Figure 12 yes Figure 11 A view of the detection unit as seen from above. (Reference) Figure 11 and Figure 12 The detection unit 490 can check whether an error occurs between the irradiation position of the laser L and the preset target position TP. For example, the detection unit 490 can be disposed in the internal space of the housing 410. Alternatively, if the irradiation end 4535 is in the aforementioned standby position, the detection unit 490 can be installed in the area below the irradiation end 4535. The detection unit 490 may include a monitoring target 491, a plate 492, and a support frame 493. The plate 492 and the support frame 493 can be configured as standby ports providing space for the irradiation end 4535 when it is in standby mode. The standby ports are located at the standby position where the irradiation end 4535 is in standby mode. Therefore, when viewed from above, the plate 492 and the support frame 493 can be positioned at the standby position.

[0147] The monitoring target 491 can be referred to as a global coordinate system. A preset target position TP can be displayed on the monitoring target 491. Additionally, the monitoring target 491 can include a scale to confirm the error between the target position TP and the irradiation position of the irradiated laser L. The monitoring target 491 can have an origin corresponding to the center of the irradiation end 4535 located above the backup port. The monitoring target 491 can also have an origin corresponding to the center of the laser L irradiated from the irradiation end 4535 located above the backup port.

[0148] The monitoring target 491 can be mounted on the plate 492. The plate 492 can be supported by the support frame 493. The height of the monitoring target 491, determined by the plate 492 and the support frame 493, can be the same as the height of the substrate M supported by the support unit 420. For example, the height from the bottom surface of the housing 410 to the top surface of the monitoring target 491 can be the same as the height from the bottom surface of the housing 410 to the top surface of the substrate M supported by the support unit 420. This is to ensure that the height of the laser irradiation end 4535 matches the height of the irradiation end 4535 when the substrate M is heated, when checking for errors using the detection unit 490.

[0149] If the irradiation direction of the laser L irradiated from the irradiation end 4535 is slightly distorted relative to the third direction Z, the monitoring target 491 can be set at the same height as the substrate M supported by the support unit 420, because the irradiation position of the laser L can vary depending on the height of the irradiation end.

[0150] Except where additional descriptions are provided, the substrate processing apparatus 1 according to the embodiments described below will be provided in a configuration substantially similar to the substrate processing apparatus 1 according to the example described above.

[0151] Figure 13 schematically shown Figure 6 A top view of another embodiment of the separator member. (See reference) Figure 13 The partition member 4570 can be installed in the interior space of the cover 4560. The partition member 4570 can distribute the purge gas supplied to the interior space. The partition member 4570 can also distribute the purge gas supplied in the direction of the interior space in the opposite direction to the direction of the purge space. In the following text, for ease of explanation, the area in the interior space of the cover 4560 adjacent to the point where the supply port 4562 is installed is defined as the first area A, and the area in the interior space of the cover 4560 opposite to the first area A is defined as the second area B.

[0152] The partition member 4570 may be formed in an annular shape. The outer circumferential surface of the partition member 4570 may contact the inner surface of the cover 4560. The inner circumferential surface of the partition member 4570 may contact the outer surface of the irradiation end 4535.

[0153] like Figure 13 As shown, a first hole H1 and a second hole H2 can be formed in the partition member 4570. Multiple first holes H1 and multiple second holes H2 can be provided. Multiple first holes H1 can be formed in a region corresponding to the first region A. The first holes H1 are configured as through holes penetrating from the top end to the bottom end of the partition member 4570. The first holes H1 can be spaced apart from each other along the circumferential direction of the partition member 4570. The first holes H1 can have different diameters. For example, as... Figure 13As shown, compared with the first hole H1 located at a position far from the first region A1, the first hole H1 located near the first region A1 can have a smaller diameter.

[0154] The second hole H2 is configured to penetrate from the top to the bottom of the partition member 4570. The second holes H2 can be spaced apart from each other along the circumference of the partition member 4570. The second holes H2 can have different diameters. For example, as... Figure 13 As shown, compared to the second hole H2 located relatively far from the supply port 4562, the second hole H2 located in the region adjacent to the supply port 4517 can have a smaller diameter. The average diameter of the second hole H2 can be set to be smaller than the average diameter of the first hole H1.

[0155] According to an embodiment of the invention, the average diameters of the first hole H1 and the second hole H2 installed in the purge space are formed differently, so that particles and / or ink droplets generated from the process can be uniformly supplied to the second region B, which is the region facing the supply port 4562 to which the purge gas is supplied and the first region A.

[0156] Unlike the embodiments described above, the first hole H1 can have the same diameter. Additionally, the second hole H2 can have the same diameter. The diameter of the first hole H1 can be smaller than the diameter of the second hole H2.

[0157] Figure 14 schematically shown Figure 6 A top view of another embodiment of the lid and the flow cover. Figure 15 The purge gas is schematically shown in... Figure 14 The state of flow within the swept space. (Reference) Figure 14 and Figure 15 A supply port 4562 may be formed on the side surface of the cover 4560. In one embodiment, such as Figure 14 As shown, the supply port 4562 can be installed at a position spaced apart from the central axis of the irradiation end 4535 when viewed from above. The supply port 4562 can communicate with the flow space inside the flow cover 4580. Purge gas flowing through the flow space of the flow cover 4580 via the supply port 4562 can be supplied to the interior space of the cover 4560. Because the supply port 4562 is installed spaced apart from the central axis of the irradiation end 4535, the purge gas supplied to the interior space of the cover 4560 can rotate and flow within the interior space, such as... Figure 15 As shown.

[0158] According to an embodiment of the invention, even if the supply port 4562 for supplying purge gas is installed on one side of the cover 4560, the purge gas flows by rotating within the internal space of the cover 4560, allowing the purge gas to flow uniformly in a helical direction within the internal space of the cover 4560. Therefore, particles and / or droplets generated during the process can be effectively prevented from flowing into the internal space of the cover 4560.

[0159] Furthermore, since the purge gas rotates and flows within the internal space of the cover 4560, it can flow toward the side of the opening formed at the bottom of the cover 4560. Therefore, the irradiation module 450 can be effectively protected without causing vibrations in the liquid film previously formed on the substrate M or damaging the previously formed liquid film during the processing of the substrate M.

[0160] Figure 16 schematically shown Figure 6 A front view of another embodiment of the irradiation module. (See reference) Figure 16 A cover plate 4590 can be mounted on a cover 4560. The cover plate 4590 can be made of a light-transmitting material. Alternatively, the cover plate 4590 can be formed of a transparent material. For example, the cover plate 4590 can cover an opening formed at the bottom end of the cover 4560. The cover plate 4590 can seal the opening formed in the cover 4560. The cover plate 4590 can seal the internal space of the irradiation module 450 by sealing the opening. Therefore, damage to the laser unit 4530, camera unit 4542, and illumination unit 4544 mounted inside the housing 4510 by particles and / or droplets can be effectively prevented without affecting the laser L, image capture, and light illumination emitted by the irradiation module 450.

[0161] In the embodiments of the above-described inventive concept, a flow cover 4580 is provided, and purge gas is supplied to the interior space of the cover 4560 through the flow space in the flow cover 4580. However, the inventive concept is not limited thereto. For example, the flow cover 4580 may not be provided, and the purge port 4512 may not be formed on the bottom surface of the housing 4510. For example, the purge gas supply unit 4550 may directly supply purge gas to the interior space of the cover 4560.

[0162] In the above embodiments of the inventive concept, the etching rate of the second pattern P2 has been improved in a substrate M having a first pattern P1 as a monitoring pattern for monitoring exposure and a second pattern P2 as a condition setting pattern for processing the substrate. However, unlike this, the functions of the first pattern P1 and the second pattern P2 may differ from those in the embodiments of the inventive concept described above. Furthermore, according to embodiments of the internal space, only one of the first pattern P1 and the second pattern P2 is provided, and the etching rate of one of the first pattern P1 and the second pattern P2 can be improved. Additionally, according to embodiments of the inventive concept, this can also be applied when improving the etching rate of a specific area on a substrate (such as a wafer or glass, rather than a photomask).

[0163] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains can clearly understand any effects not mentioned from the specification and drawings.

[0164] Although preferred embodiments of the inventive concept have been shown and described up to now, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which the inventive concept relates can implement the inventive concept differently without departing from the essence of the inventive concept as claimed in the claims, and should not be interpreted or modified separately from the technical spirit or prospect of the inventive concept.

Claims

1. A substrate processing apparatus, comprising: A support unit configured to support and rotate a substrate in a processing space; A liquid supply unit configured to supply liquid to the substrate supported at the support unit; A housing having an installation space; A laser unit configured to include a laser irradiation unit positioned in the mounting space for irradiating a laser, and an irradiation end having an end positioned to project from the housing and irradiating the laser irradiated from the laser irradiation unit onto a substrate supported on the support unit, wherein the irradiation end has a lens barrel; and A cover having an internal space and positioned such that the end of the irradiation end protruding from the housing is positioned within the internal space, and An opening is formed at the bottom end of the cover so that, when viewed from above, the opening coincides with the laser beam emitted from the irradiation end. An opening is formed at the bottom end of the housing, and a portion of the lens barrel protrudes from the bottom end of the housing through the opening.

2. The substrate processing apparatus according to claim 1, further comprising: A purge gas supply unit is provided for supplying purge gas to the interior space.

3. The substrate processing apparatus according to claim 2, wherein an annular partition member is installed in the internal space of the cover to divide the internal space into an upper buffer space and a bottom space.

4. The substrate processing apparatus according to claim 3, wherein the separating member comprises: A first slit is formed in the interior space in a region adjacent to the location where the purge gas is supplied to the interior space, and the first slit has a first opening area. as well as A second slit is formed in the interior space at the region facing the location where the purge gas is supplied to the interior space, and the second slit has a second opening area. The area of ​​the first opening is smaller than the area of ​​the second opening.

5. The substrate processing apparatus according to claim 3, wherein the separating member comprises: First orifices, wherein multiple first orifices are provided and formed in the internal space in a region adjacent to the location where the purge gas is supplied to the internal space; and Second holes, of which a plurality of second holes are provided, are formed in the region of the interior space facing the portion where the purge gas is supplied to the interior space, and The average diameter of the first hole is smaller than the average diameter of the second hole.

6. The substrate processing apparatus according to claim 2, wherein a purge port is formed at an end of the housing and the purge port is connected to the purge gas supply unit, and A supply port for supplying the purging gas to the interior space is formed on the side of the cover, and The substrate processing apparatus further includes a flow cover, which is combined with the side of the cover to connect the purge port and the supply port, the flow cover having a flow space for allowing the purge gas to flow therein.

7. The substrate processing apparatus of claim 6, wherein the supply port is located at a position spaced apart from the central axis of the irradiation end when viewed from the front.

8. The substrate processing apparatus of claim 7, further comprising a cover plate provided for covering an opening of the cover, and the cover plate being provided as a material through which the laser passes.

9. The substrate processing apparatus according to any one of claims 1 to 8, further comprising an imaging unit for imaging the laser emitted from the laser unit; and The imaging unit is located in the mounting space.

10. The substrate processing apparatus of claim 9, wherein the laser unit further comprises a beam expander for controlling the characteristics of the laser irradiated by the laser irradiation unit, and The imaging unit includes: A camera unit configured to image an image of the laser light irradiated from the laser unit and / or the substrate; as well as An illumination unit, configured to provide light for acquiring the image from the camera unit, and The laser irradiation direction, the camera unit imaging direction, and the light irradiation direction are coaxial.

11. An illumination module for illuminating a substrate with light, comprising: A housing having an installation space; A laser unit, configured to include a laser irradiation unit positioned in the mounting space for irradiating a laser, and an irradiation end having an end positioned to project from the housing and irradiating the laser irradiated from the laser irradiation unit onto the substrate, wherein the irradiation end has a lens barrel; and A cover having an internal space and positioned such that the end of the irradiation end protruding from the housing is positioned within the internal space, and An opening is formed at the bottom end of the cover so that, when viewed from above, the opening coincides with the laser beam emitted from the irradiation end. An opening is formed at the bottom end of the housing, and a portion of the lens barrel protrudes from the bottom end of the housing through the opening.

12. The irradiation module according to claim 11, further comprising: A purge gas supply unit is provided for supplying purge gas to the interior space.

13. The irradiation module according to claim 12, wherein an annular partition member is installed in the internal space of the cover to divide the internal space into an upper buffer space and a bottom space.

14. The irradiation module according to claim 13, wherein the separating member comprises: A first slit is formed in the interior space in a region adjacent to the location where the purge gas is supplied to the interior space, and the first slit has a first opening area. as well as A second slit is formed in the interior space at the region facing the location where the purge gas is supplied to the interior space, and the second slit has a second opening area. The area of ​​the first opening is smaller than the area of ​​the second opening.

15. The irradiation module of claim 12, wherein a purge port is formed at an end of the housing and the purge port is connected to the purge gas supply unit, and A supply port is installed on the side of the cover, which, when viewed from the front, is spaced apart from the central axis of the irradiation end, and the supply port supplies the purge gas into the internal space. The irradiation module further includes a flow cover, which is combined with the side of the cover to connect the purge port and the supply port, the flow cover having a flow space for the purge gas to flow therein.

16. The irradiation module according to claim 11, further comprising: A cover plate is provided to cover the opening of the cover, and the cover plate is provided as a material through which the laser can pass.

17. A substrate processing apparatus for processing a mask having multiple units, comprising: A support unit configured to support and rotate the mask, wherein a first pattern is formed on the mask within the plurality of units and a second pattern is formed outside the area where the units are formed; A liquid supply unit configured to supply liquid to the mask supported at the support unit; A housing having an installation space; A laser unit, configured to include a laser irradiation unit positioned in the mounting space and irradiating a laser, and an irradiation end having an end positioned to project from the housing and irradiating the laser irradiated from the laser irradiation unit into a second pattern between the first and second patterns, wherein the irradiation end has a lens barrel; and A cover having an internal space and positioned such that the end of the irradiation end protruding from the housing is positioned within the internal space, and An opening is formed at the bottom end of the cover so that, when viewed from above, the opening coincides with the laser beam emitted from the irradiation end. An opening is formed at the bottom end of the housing, and a portion of the lens barrel protrudes from the bottom end of the housing through the opening.

18. The substrate processing apparatus according to claim 17, further comprising: A purge gas supply unit is provided for supplying purge gas to the interior space.

19. The substrate processing apparatus of claim 18, wherein an annular partition member is installed in the internal space of the cover to divide the internal space into an upper buffer space and a bottom space, and The partition component includes: A first slit is formed in the interior space in a region adjacent to the location where the purge gas is supplied to the interior space, and the first slit has a first opening area. as well as A second slit is formed in the interior space at the region facing the location where the purge gas is supplied to the interior space, and the second slit has a second opening area. The area of ​​the first opening is smaller than the area of ​​the second opening.

20. The substrate processing apparatus of claim 18, wherein a purge port is formed at an end of the housing and the purge port is connected to the purge gas supply unit, and A supply port is installed on the side of the cover, which, when viewed from the front, is spaced apart from the central axis of the irradiation end, and the supply port supplies the purge gas into the internal space. The substrate processing apparatus further includes a flow cover, which is combined with the side of the cover to connect the purge port and the supply port, the flow cover having a flow space for allowing the purge gas to flow therein.

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