Audio processing module, intelligent device and earphone

Abstract

The present disclosure relates to an audio processing module, a smart device and an earphone. The audio processing module comprises an audio processing chip and an audio switch chip connected with the audio processing chip. The audio processing chip comprises a left channel signal backflow path and a right channel signal backflow path. The left channel signal backflow path is connected with a first sensing port of the audio switch chip. The right channel signal backflow path is connected with a second sensing port of the audio switch chip. The present disclosure sets relatively independent left channel signal backflow path and right channel signal backflow path in the audio processing chip, reduces the common ground path inside the audio processing chip, reduces the common impedance, thereby reducing the noise of the audio signal and improving the user experience.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and more particularly to an audio processing module, a smart device, and headphones. Background Technology

[0002] In the field of electronics, audio devices are an indispensable part of mobile devices. Speakers, earpieces, headphones, microphones, and other acoustic recording or playback devices all transmit audio signals through analog signals, but analog signals are easily affected by external interference.

[0003] Currently, during the transmission of audio signals between the left and right channels of headphones, due to the circuit design of the chip, a portion of the signal loop between the left and right channels always shares a ground wire. This shared ground wire portion is affected by noise from the grounding impedance, which reduces the performance of the headphones. Summary of the Invention

[0004] To overcome the problems existing in related technologies, this disclosure provides an audio processing module, a smart device, and headphones.

[0005] According to a first aspect of the present disclosure, an audio processing module is provided, the audio processing module comprising:

[0006] An audio processing chip and an audio switch chip connected to the audio processing chip;

[0007] The audio processing chip includes a left channel signal return path and a right channel signal return path, wherein the left channel signal return path is connected to the first sensing port of the audio switch chip.

[0008] The right channel signal return path is connected to the second sensing port of the audio switch chip.

[0009] Optionally, the audio processing module further includes an audio interface;

[0010] When the audio interface is turned on in the first preset state, the left channel signal return path is connected to the first auxiliary port of the audio interface through the third sensing port of the audio switch chip.

[0011] The right channel signal return path is connected to the first auxiliary port of the audio interface through the fourth sensing port of the audio switch chip.

[0012] Optionally, the third sensing port is connected to the first auxiliary port via a first wiring, and the fourth sensing port is connected to the first auxiliary port via a second wiring. The first wiring and the second wiring are connected in parallel at a common ground point, which is connected to the first auxiliary port and the common ground point is connected to the reference ground point of the audio switch chip.

[0013] Optionally, the first end of the left channel signal return path is connected to the first sensing port of the audio switch chip, the first sensing port of the audio switch chip is connected to the third sensing port of the audio switch chip, and the third sensing port of the audio switch chip is connected to the first auxiliary port of the audio interface.

[0014] The first end of the right channel signal return path is connected to the second sensing port of the audio switch chip, the second sensing port of the audio switch chip is connected to the fourth sensing port of the audio switch chip, and the fourth sensing port of the audio switch chip is connected to the first auxiliary port.

[0015] Optionally, when the audio interface is turned on in the second preset state, the left channel signal return path is connected to the second auxiliary port of the audio interface through the fifth sensing port of the audio switch chip;

[0016] The right channel signal return path is connected to the second auxiliary port of the audio interface through the sixth sensing port of the audio switch chip.

[0017] Optionally, the audio switch chip includes a chip auxiliary port, which includes a first chip auxiliary port connected to the first auxiliary port and a second chip auxiliary port connected to the second auxiliary port.

[0018] Optionally, the auxiliary port of the audio switch chip is connected to the reference ground point of the audio switch chip.

[0019] Optionally, the audio processing chip includes a first amplifier and a second amplifier, and the second end of the left channel signal return path is connected to the first amplifier;

[0020] The second end of the right channel signal return path is connected to the second amplifier.

[0021] According to a second aspect of the present disclosure, a smart device is also provided, the smart device being provided with an audio processing module as described in the first aspect.

[0022] According to a third aspect of the present disclosure, an earphone is also provided, the earphone being provided with an audio processing module as described in the first aspect.

[0023] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: By setting relatively independent left channel signal return paths and right channel signal return paths within the audio processing chip, this disclosure reduces the common ground path and common impedance within the audio processing chip, thereby reducing the noise of the audio signal and improving the user experience.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0026] Figure 1 This is a schematic diagram illustrating an audio processing module according to an exemplary embodiment.

[0027] Figure 2 This is a schematic diagram illustrating an audio processing module according to an exemplary embodiment. Detailed Implementation

[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0029] In the field of electronics, audio devices are an indispensable part of mobile devices. Speakers, earpieces, headphones, microphones, and other acoustic recording or playback devices all transmit audio signals through analog signals, but analog signals are easily affected by external interference.

[0030] Currently, during the transmission of audio signals between the left and right channels of headphones, due to the circuit design of the chip, a portion of the signal loop between the left and right channels always shares a ground wire. This shared ground wire portion is affected by noise from the grounding impedance, which reduces the performance of the headphones.

[0031] To address the aforementioned issues, this disclosure proposes an audio processing module, comprising an audio processing chip and an audio switch chip connected to the audio processing chip. The audio processing chip includes a left channel signal return path and a right channel signal return path. The left channel signal return path is connected to a first sensing port of the audio switch chip, and the right channel signal return path is connected to a second sensing port of the audio switch chip. By establishing relatively independent left and right channel signal return paths within the audio processing chip, this disclosure reduces the common ground path and common impedance within the audio processing chip, thereby reducing audio signal noise and improving the user experience.

[0032] According to an exemplary embodiment, such as Figure 1 As shown, an audio processing module is illustrated. The audio processing module includes an audio processing chip 1 and an audio switch chip 2 connected to the audio processing chip 1. The audio processing chip 1 and the audio switch chip 2 are electrically connected. (Refer to...) Figure 1 The audio processing chip 1 includes a relatively independent left channel signal return path 11 and a right channel signal return path 12. The left channel signal return path 11 is connected to the first sensing port 21 of the audio switch chip 2, and the right channel signal return path 12 is connected to the second sensing port 22 of the audio switch chip 2. In this embodiment, by setting relatively independent left channel signal return paths 11 and right channel signal return paths 12 within the audio processing chip 1, the common ground path inside the audio processing chip 1 is reduced, the common impedance is reduced, thereby reducing the noise of the audio signal and improving the user experience.

[0033] Among them, reference Figure 1 The audio processing chip 1 also includes a left channel signal loop pin 111, and the audio switch chip 2 has a first sensing port 21. The left channel signal loop pin 111 is electrically connected to the first sensing port 21 for transmitting the left channel return signal. It is understood that the audio processing chip also includes a right channel signal loop pin 121, which is connected to the second sensing port 22 on the audio switch chip 2 for transmitting the right channel return signal.

[0034] In this embodiment, the audio processing chip 1 sets up two independent audio processing paths for the left and right channels respectively, and processes the signals in the left channel signal return path 11 and the right channel signal return path 12 respectively, so as to avoid the impedance signal generated by the left and right channels sharing the same reference ground line when the signal returns, thereby avoiding the noise influence of the common impedance signal and improving the audio quality.

[0035] In one exemplary embodiment, such as Figure 1As shown, the audio processing module includes an audio processing chip 1 and an audio switch chip 2 connected to the audio processing chip 1. The audio processing module also includes an audio interface 3, which is used by the terminal device to establish a wired connection with headphones to transmit audio signals when playing audio through headphones. (Refer to...) Figure 2 When the audio interface 3 is a Type-C interface, the female port of the Type-C interface has two auxiliary ports, namely the first auxiliary port 31 and the second auxiliary port 32, which are centrally symmetrically arranged. The male port of the Type-C interface has only one auxiliary port. Regardless of how the male port is inserted, either auxiliary port of the male or female port can be connected, thus enabling bidirectional connection of the Type-C interface. The first preset state is when the Type-C interface is connected, and the second preset state is when the male port of the Type-C interface is rotated 180° to connect with the female port. The difference between the first and second preset states lies in the auxiliary port used for transmitting audio signals. In some possible embodiments, the audio interface 3 can be a USB interface. The male and female ports of the USB interface can only be connected in one way; that is, the USB interface can only be connected in the first preset state.

[0036] In one exemplary embodiment, such as Figure 1 As shown, the audio processing module includes an audio processing chip 1, an audio switch chip 2 connected to the audio processing chip 1, and an audio interface 3. The audio processing chip 1 includes a left channel signal return path 11 and a right channel signal return path 12. When the audio interface is connected in a first preset state, as shown... Figure 1 As shown, the left channel signal return path 11 is connected to the first auxiliary port 31 of the audio interface 3 through the third sensing port 23 of the audio switch chip 2, and the right channel signal return path 12 is connected to the first auxiliary port 31 of the audio interface 3 through the fourth sensing port 24 of the audio switch chip 2.

[0037] Reference Figure 1 The third sensing port 23 is connected to the first auxiliary port 31 of the audio interface 3 via the first wiring, and the fourth sensing port 24 is connected to the first auxiliary port 31 of the audio interface 3 via the second wiring. The first wiring and the second wiring are connected in parallel at a common ground point 4. The common ground point 4 is connected to the first auxiliary port 31 of the audio interface 3 and to the reference ground point 25 of the audio switch chip 2. Figure 1As shown, the audio switch chip 2 is provided with a third sensing port 23 and a fourth sensing port 24. It can be understood that by placing the third sensing port 23 and the fourth sensing port 24 on the side of the audio switch chip 2 closer to the audio interface 3, the common ground point 4 of the left channel signal return path 11 and the right channel signal return path 12 is located between the audio switch chip 2 and the audio interface 3. This shortens the shared reference ground connection between the left channel signal return path 11 and the right channel signal return path 12, reducing the impedance of the shared reference ground connection and lowering the interference of impedance signals on the audio signals. Specifically, the closer the common ground point 4 of the left channel signal return path 11 and the right channel signal return path 12 is to the audio interface 3, the shorter the shared reference ground connection is, and the lower the impedance of the shared reference ground connection is.

[0038] In one exemplary embodiment, such as Figure 1 As shown, the audio processing module includes an audio processing chip 1, an audio switch chip 2 connected to the audio processing chip 1, and an audio interface 3. The audio processing chip 1 includes a left channel signal return path 11 and a right channel signal return path 12. When the audio interface 3 is connected in a first preset state, as shown... Figure 1 As shown, the first end of the left channel signal return path 11 is connected to the first sensing port 21 of the audio switch chip 2, and the first end of the right channel signal return path 12 is connected to the second sensing port 22 of the audio switch chip 2. The left channel signal return path 11 is connected to the first auxiliary port 31 of the audio interface 3 through the first sensing port 21 and the third sensing port of the audio switch chip 2, and the right channel signal return path 12 is connected to the first auxiliary port 31 of the audio interface 3 through the second sensing port 22 and the fourth sensing port 24 of the audio switch chip 2.

[0039] In this embodiment, two paths are set inside the audio switch chip 2. The two paths are connected to the left channel signal return path 11 and the right channel signal return path 12 respectively, so that the signal return of the left and right channels is set separately. This prevents the left channel signal return path 11 and the right channel signal return path 12 from sharing the same reference ground connection, thereby avoiding the generation of impedance signals and improving audio quality.

[0040] The audio switch chip 2 is provided with a chip auxiliary port, which includes a chip first auxiliary port 20a. The chip first auxiliary port 20a is electrically connected to the first auxiliary port 31 of the audio interface 3. The chip first auxiliary port 20a of the audio switch chip 2 is connected to the reference ground point 25 of the audio switch chip 2, and is used to ground the left channel signal return path 11 and the right channel signal return path 12.

[0041] In one exemplary embodiment, such as Figure 1 and Figure 2 As shown, the audio processing chip 1 of the audio processing module also includes a MIC port 17, which is connected to the preset input pin 28 of the audio switch chip 2, and then to the reference ground point 25 of the audio switch chip 2. The MIC port 17 is also connected to the first auxiliary port 20a of the audio switch chip 2, and thus can communicate with the first auxiliary port 31 of the audio interface 3 to realize the audio recording function of an external device (not shown).

[0042] In the above embodiments, the audio interface 3 is connected in a first preset state, and when the audio interface is a Type-C interface, it can also be connected in a second preset state.

[0043] like Figure 2 As shown, for reference Figure 1 The Type-C interface has a first auxiliary port 31 and a second auxiliary port 32. When the MIC port 17 is connected to the first auxiliary port 31, it is connected in the first preset state as described above. When the MIC port 17 is connected to the second auxiliary port 32, it is connected in the second preset state. The left channel signal return path 11 is connected to the second auxiliary port 32 of the audio interface 3 through the first sensing port 21 and the fifth sensing port 26 of the audio switch chip 2. The right channel signal return path 12 is connected to the second auxiliary port 32 of the audio interface 3 through the second sensing port 22 and the sixth sensing port 27 of the audio switch chip 2. The common ground point 4' is also located between the audio switch chip 2 and the audio interface 3, and is grounded through the second auxiliary port 20b of the audio switch chip 2. This enables the Type-C interface to reduce the noise of the audio signal when connected in both directions.

[0044] In one exemplary embodiment, such as Figure 1 As shown, the audio processing module includes an audio processing chip 1, an audio switch chip 2 connected to the audio processing chip 1, and an audio interface 3. The audio processing chip 1 includes a left channel signal return path 11 and a right channel signal return path 12. Figure 1 As shown, the audio processing chip 1 includes a converter 13 and an amplifier 14. The converter 13 is used to convert digital audio signals into analog audio signals. After being amplified by the amplifier 14, the analog audio signals can be connected to a handset, speaker, or headphones.

[0045] In this embodiment, audio playback through headphones is used as an example for explanation. (Refer to...) Figure 1The audio processing chip 1 includes a left channel processing unit and a right channel processing unit to process the audio signals in the left and right channels, respectively. The left channel processing unit includes a first converter 13a and a first amplifier 14a, and the right channel processing unit includes a second converter 13b and a second amplifier 14b.

[0046] like Figure 1 As shown, the first amplifier 14a has a left channel signal output pin 15 arranged horizontally to the right. The left channel signal output pin 15 is connected to the corresponding left channel signal pin of the audio switch chip 2 (not shown), and is used to output the left channel analog audio signal to the audio switch chip 2, and then to the audio interface 3. The second amplifier 14b has a right channel signal output pin 16 arranged horizontally to the right. The right channel signal output pin 16 is connected to the corresponding right channel pin of the audio switch chip 2 (not shown), and is used to output the right channel analog signal to the audio switch chip 2, and then to the audio interface 3.

[0047] Among them, such as Figure 1 As shown, the second end of the left channel signal return path 11 is connected to the reference terminal of the first amplifier 14a of the left channel processing unit of the audio processing chip 1, and the second end of the right channel signal return path 12 is connected to the reference terminal of the second amplifier 14b of the right channel processing unit of the audio processing chip 1. It can be understood that the second end of the left channel signal return path 11 is connected to the output terminal of the first converter 13a, and the second end of the right channel signal return path 12 is connected to the output terminal of the second converter 13b.

[0048] Reference Figure 1 The left channel signal return path 11 and the right channel signal return path 12 are separated inside the audio processing chip 1, which reduces the impedance signal generated by the left channel signal return path 11 and the right channel signal return path 12 sharing a common reference ground connection.

[0049] In the above embodiments, based on the principle that impedance = (conductivity × length) / area, the parasitic impedance of the common reference grounding wire can be reduced by widening, thickening, or increasing the conductivity of the common reference grounding wire.

[0050] This disclosure also provides a smart device, which can be a smartphone, laptop, or other device with audio input or playback capabilities. The smart device includes a main body and the aforementioned audio processing module, the audio processing module being installed inside the main body.

[0051] By employing the aforementioned audio processing module, noise interference to the audio signal is reduced when smart devices record or play audio, thereby improving audio quality and enhancing the user experience.

[0052] This disclosure also provides an earphone in which a single reference grounding wire shared by the left and right channels inside the earphone is replaced with two reference grounding wires, thereby reducing the impedance generated when the earphone shares a reference grounding wire and improving audio quality.

[0053] By employing the aforementioned audio processing module, noise interference to the audio signal is reduced when the headphones are recording or playing audio, thereby improving audio quality and enhancing the user experience.

[0054] The headphones provided in this embodiment can be used in combination with the smart devices provided in this embodiment, or in combination with unmodified smart devices. The unmodified headphones can also be used in combination with the smart devices provided in this embodiment, all of which can reduce the noise impact caused by common impedance.

[0055] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0056] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. An audio processing module, characterized in that, The audio processing module includes: An audio processing chip and an audio switch chip connected to the audio processing chip, as well as an audio interface; The audio processing chip includes a left channel signal return path and a right channel signal return path, wherein the left channel signal return path is connected to the first sensing port of the audio switch chip. The right channel signal return path is connected to the second sensing port of the audio switch chip, the left channel signal return path and the right channel signal return path are relatively independent, and the first sensing port and the second sensing port are located on the side of the audio switch chip closer to the audio processing chip. The audio switch chip further includes a third sensing port and a fourth sensing port. The first sensing port is connected to the third sensing port, and the second sensing port is connected to the fourth sensing port. The third sensing port and the fourth sensing port are located on the side of the audio switch chip closer to the audio interface. The third sensing port is connected to the audio interface through a first wire, and the fourth sensing port is connected to the audio interface through a second wire. The first wire and the second wire are connected in parallel at a common ground point. The common ground point of the left channel signal return path and the right channel signal return path is located between the audio switch chip and the audio interface, and the common ground point is connected to the reference ground point of the audio switch chip and the audio interface.

2. The audio processing module according to claim 1, characterized in that, When the audio interface is turned on in the first preset state, the left channel signal return path is connected to the first auxiliary port of the audio interface through the third sensing port of the audio switch chip. The right channel signal return path is connected to the first auxiliary port of the audio interface through the fourth sensing port of the audio switch chip.

3. The audio processing module according to claim 2, characterized in that, The third sensing port is connected to the first auxiliary port via a first wiring connection, the fourth sensing port is connected to the first auxiliary port via a second wiring connection, and the common ground point is connected to the first auxiliary port.

4. The audio processing module according to claim 2, characterized in that, The audio switch chip also includes a fifth sensing port and a sixth sensing port, which are located on the side of the audio processing chip closer to the audio interface; When the audio interface is turned on in the second preset state, the left channel signal return path is connected to the second auxiliary port of the audio interface through the fifth sensing port of the audio switch chip; The right channel signal return path is connected to the second auxiliary port of the audio interface through the sixth sensing port of the audio switch chip; The common ground point for the wiring of the fifth sensing port and the sixth sensing port with the second auxiliary port is located between the audio switch chip and the audio interface.

5. The audio processing module according to claim 4, characterized in that, The audio switch chip includes a chip auxiliary port, which includes a first chip auxiliary port connected to the first auxiliary port and a second chip auxiliary port connected to the second auxiliary port.

6. The audio processing module according to claim 5, characterized in that, The auxiliary port of the audio switch chip is connected to the reference ground point of the audio switch chip.

7. The audio processing module according to claim 1, characterized in that, The audio processing chip includes a first amplifier and a second amplifier, and the second end of the left channel signal return path is connected to the first amplifier. The second end of the right channel signal return path is connected to the second amplifier.

8. A smart device, characterized in that, The smart device is equipped with an audio processing module as described in any one of claims 1-7.

9. An earphone, characterized in that, The headphones are equipped with an audio processing module as described in any one of claims 1-7.

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