Vehicle headlamp module

Abstract

The invention relates to a vehicle headlamp module comprising a circuit arrangement for controlling at least one function of a vehicle headlamp and a housing for accommodating the circuit arrangement, wherein the housing has a metallic, electrically conductive shielding surface towards the circuit arrangement for electromagnetic shielding of the circuit arrangement, wherein the circuit arrangement has a touch-sensitive surface section, wherein the touch-sensitive surface section has no electrical components arranged thereon and a flat section towards the shielding surface of the housing, wherein an electrical strip conductor and / or a contact extends along the touch-sensitive surface section, wherein a plurality of solidified, electrically non-conductive adhesive points are arranged on the touch-sensitive surface section, which adhesive points project in the direction of the flat section of the shielding surface of the housing from the touch-sensitive surface section for ensuring a minimum distance between the touch-sensitive surface section and the flat section of the shielding surface of the housing.

Description

Vehicle headlight module Technical Field

[0001] The present invention relates to a vehicle headlight module, the vehicle headlight module comprising a circuit device for controlling at least one function of a vehicle headlight, and a housing for at least partially housing the circuit device, wherein the housing at least partially has a conductive shielding surface facing the metal of the circuit device for electromagnetic shielding of the circuit device, wherein the circuit device has at least one touch-sensitive surface segment configured as flat as possible, wherein the touch-sensitive surface segment does not have electrical components disposed thereon, and the flat segment facing the shielding surface of the housing, wherein an electrical strip wire and / or contact portion extends along the touch-sensitive surface segment. Background Technology

[0002] The placement of circuitry in vehicle headlight modules should generally be done in a space-efficient manner. Electromagnetic shielding of the circuitry is commonly achieved by enclosing at least a portion of it with a conductive housing. However, this approach presents a problem: the circuitry cannot be arbitrarily close to the conductive housing, as this could lead to a short circuit due to surface contact with the conductive surface. While applying an insulating varnish to the surface of the circuitry is well-known and suitable for preventing short circuits in the event of surface contact with a conductive surface, additional problems arise in vehicle applications: vehicle headlight modules are frequently exposed to mechanical influences such as vibration and vibration during operation, which can cause wear to the insulation covering the electrical contact areas or strip conductors. This can lead to short circuits. Manufacturing and installation tolerances result in inaccurate positioning of the circuitry and housing, necessitating the inclusion of a buffer zone when selecting the minimum safe distance between the circuitry and surrounding conductive housings or shielding elements during the planning of vehicle headlight modules. This buffer zone helps prevent short circuits due to undesirable housing contact. Summary of the Invention

[0003] Therefore, the object of the present invention is to provide a vehicle headlight module that achieves a space-saving structural type while maintaining a high level of operational safety. This object is achieved by a vehicle headlight module of the type mentioned earlier, wherein, according to the present invention, a plurality of cured non-conductive adhesive points are provided on a touch-sensitive surface segment configured as flat as possible, the adhesive points extending from the touch-sensitive surface segment toward a flat segment of the shielding surface of the housing, to ensure a minimum distance between the touch-sensitive surface segment and the flat segment of the shielding surface of the housing. This prevents the touch-sensitive surface segment from rubbing against the flat segment of the shielding surface even when the circuitry is positioned very close to the shielding surface, such that the adhesive points at least temporarily contact the shielding surface. Therefore, the present invention achieves a particularly space-saving structural type while maintaining a high level of operational safety.

[0004] The cured adhesive can be applied to the circuit device during the normal assembly process (typically in SMT technology) and can be cured, for example, during and / or before the soldering process performed in a so-called reflow oven.

[0005] In the assembly process of circuit devices for vehicle modules, devices and adhesive materials for applying adhesive points are generally available for vehicle modules. More specifically, they are used to fix the position of position-critical components, such as LED light sources, before the solder paste applied to the circuit device melts during the brazing process to establish a durable electrical connection. These position-critical components are placed on the solder paste after assembly. Therefore, the adhesive properties of the adhesive points are relevant in this regard, as the points can be applied to the circuit device in a simple, shape-stable, and position-reliable manner and adhere firmly to the circuit device after curing. After curing, the adhesive points act as spacers and typically have a dotted geometry because they can be dotted onto the circuit device by a dispenser during assembly and then cured in a soldering oven during the SMT brazing process.

[0006] The circuit device is configured to control at least one function of the vehicle headlights. This could be, for example, one or more of the following lighting functions: high beam, matrix lights, low beam, parking lights, taillights, etc. Any electrical component that can be used in the vehicle headlight module is considered as an electrical device. Examples include ICs, capacitors, coils, resistors, diodes, etc. The electrical strip wires and / or contacts along the touch-sensitive surface section can also be covered by an insulating layer, such as a solder resist layer. The statement "a plurality of non-conductive adhesive points are provided on a touch-sensitive surface section configured as flat as possible" means that the surface section is configured so that the protruding adhesive points protrude from the surface section, more precisely, so that the adhesive points protrude from any slight unevenness in the surface, such that when in contact with a parallel-oriented, flat, conductive metal shielding surface, the adhesive points contact the conductive metal shielding surface, thereby separating the touch-sensitive surface section from the shielding surface. That is, the adhesive points extend from or protrude beyond the flattest possible touch-sensitive surface segment to ensure minimal spacing. The number of adhesive points is, in principle, freely selectable and optimized in practice for the corresponding size of the touch-sensitive surface segment. Examples include at least two, four, six, ten, twenty, or forty adhesive points. Of course, the adhesive points can also be located outside the flat touch-sensitive surface segment or extend beyond it onto the circuitry.

[0007] In particular, it can be proposed that adjacent adhesive points be set relative to each other with a desired spacing between 1.5 mm and 8 mm, especially between 2 mm and 6 mm. This spacing is measured from the center of the respective adhesive point. In this way, a favorable number of adhesive points are ensured per area unit. Furthermore, it can be proposed that the adhesive points be distributed as uniformly as possible along the touch-sensitive surface segment, such that each imaginary circular area unit of the touch-sensitive surface segment has at least one adhesive point, the circular area unit having a diameter at the level of the maximum value of the desired spacing. This means that the entire flat surface segment of the contact-sensitive area has adhesive points, or that the adhesive points are distributed across the entire flat surface segment.

[0008] In particular, it can be proposed that the adhesive points are arranged in rows and columns, with the number of rows between two and four, and the number of columns between eight and sixteen. The rows and columns correspond to straight lines, with the columns preferably oriented orthogonally to the rows, and all rows and columns lying in a plane. In this way, the dispersion of adhesive points can be carried out particularly effectively.

[0009] Furthermore, it can be proposed that the height of the adhesive point is between 0.05 mm and 0.4 mm, particularly between 0.1 mm and 0.25 mm. In particular, it can be proposed that the diameter of the adhesive point in the contact area with the touch-sensitive surface segment is between 0.25 mm and 1.5 mm. Preferably, the adhesive point has a circular shape, more precisely, a circular shape when viewed from a angle perpendicular to the plane of the surface segment. Here, it can be an SMT adhesive point. The ratio of the diameter to the height of the adhesive point can be, for example, between 3:1 and 5:1, particularly 4:1, meaning the diameter is several times larger than the height of the adhesive point. The adhesive point can also be used as a spacer relative to other components such as metal plates, coolants, circuit boards, connectors, covers, etc. Furthermore, the circuit carrier can be screwed onto the housing—thus ensuring spacing and position within a certain tolerance range. Preferably, screw connections are combined with the adhesive points, meaning that one area of ​​the circuit device is screwed on, while another area is separated from the surrounding environment by a minimum distance via the adhesive point.

[0010] Furthermore, it can be proposed that the adhesive joints are made of thermosetting adhesive materials. An adhesive with the name "Loctite 3621" is exemplarily referred to as a thermosetting adhesive material, which is commercially available, for example, through Henkel Central Eastern Europe GmbH. The circuit device, along with the components disposed thereon and the adhesive joints, can be first heated during the SMT process after assembly, and then proceed to a preheating zone, in which, for example, the thermosetting adhesive joints can cure, and the solder paste or brazing material has not yet melted, so as to advantageously ensure that the adhesive cures before the brazing material loses its holding / adhesive strength. Thermosetting can be performed, for example, at a temperature of 150°C for a duration of, for example, 90 to 120 seconds. After the specified duration, the temperature is rapidly increased to rapidly melt the brazing material, and by melting the brazing material disposed thereon, the electrical components are permanently connected to the associated contact surfaces. After the specified duration ends, the temperature can then be lowered again. Thus, the curing of the adhesive is thermally coupled to the brazing process. Therefore, it is possible, for example, to propose a curing temperature below the melting temperature of the brazing joint, and that the adhesive, in its cured state, can be heated to the melting temperature of the brazing joint without damage during this period, particularly to a temperature of 250°C. The term "can be heated without damage" is understood here to mean a process in which, after curing occurs at a temperature below 250°C, the mechanical, thermal, and electrical properties of the adhesive remain unchanged even after heating to 250°C during this period. The duration of this heating is typically a few seconds.

[0011] In particular, it can be proposed that the circuit device is constituted by a circuit carrier and electrical components disposed thereon, wherein the touch-sensitive surface segment is constituted by a surface segment of the circuit carrier, wherein the circuit carrier is a semi-flexible circuit board, the semi-flexible circuit board comprising at least three substantially rigid segments, namely two outer segments and one intermediate segment, and two flexible bending segments, wherein the two outer segments are respectively connected to the intermediate segment via the flexible bending segments, and wherein adhesive points are provided at least on the intermediate segment. In this way, a particularly space-saving arrangement can be achieved by bending, especially folding, the circuit carrier. The adhesive points are not necessarily provided only on the intermediate segment, but can also be placed through the intermediate segment and into the bending segments. The semi-flexible circuit board can be understood as a circuit board having flexible and rigid areas. The flexible area does not necessarily have to be permanently flexible. For the present invention, it is sufficient if the flexible area can be bent at least once after the electrical components are assembled, without damaging the involved strip wires and / or contacts. If, for example, only temporarily flexible areas are needed in a circuit board, such as to enable mounting in a limited space, then a circuit board constructed from multiple prepreg sheets can be stacked down to several layers by milling or pre-stamping prepreg sheets with open areas. The downsized areas typically have a durable, flexible enamel layer and can then be bent several times. Therefore, despite the presence of bends at 90° or 180°, the circuit board can be constructed in one piece, thus favoring space-saving structural types. Such circuit boards are available, for example, from the company "Würth Elektronik GmbH & Co. KG".

[0012] Furthermore, it can be proposed that at least the middle section be a flat section relative to the shielding surface of the housing.

[0013] In particular, it is possible to propose forming an opening between two outer sections, the opening extending from one outer section towards the other, wherein the opening is defined by the outer sections, the laterally adjacent areas of the intermediate section, and two flexible curved sections, wherein another opening is provided in the shielding surface of the housing, the other opening at least partially overlapping the opening of the circuit carrier. The opening can, for example, be provided for accommodating connectors or wires delivered from the outside.

[0014] Furthermore, it can be proposed that the circuit carrier additionally has a rigid additional external section and an additional flexible curved section, by means of which the additional external section is flexibly connected to one of the external sections. The curvature in the curved section can be, for example, 90°, wherein a circular portion with a constant bending radius is preferably provided in order to avoid a critical minimum value in the bending radius.

[0015] In particular, it can be proposed that the circuit device includes a light source for emitting light, especially an LED light source. The light source can be configured to, in conjunction with a projection system connected downstream, emit a light distribution corresponding to the light function already mentioned.

[0016] Furthermore, it can be proposed that the flat sections of the touch-sensitive surface and the shielding surface are oriented parallel to each other.

[0017] In particular, it can be proposed that the spacing between the flat sections of the touch-sensitive surface and the shielding surface is at most 5 mm. Therefore, this type of structure is particularly compact.

[0018] Furthermore, the present invention relates to a vehicle headlight, particularly a motor vehicle headlight, the vehicle headlight comprising a vehicle headlight module according to the present invention and at least one optical projection system for emitting light distribution. Attached Figure Description

[0019] The invention is now described in detail with reference to exemplary and non-limiting embodiments, which are illustrated in the accompanying drawings. The drawings show:

[0020] Figure 1 shows a perspective view of a vehicle headlight module according to the present invention;

[0021] Figure 2 shows a perspective view of the vehicle headlight module according to Figure 1 without the housing disposed thereon;

[0022] Figure 3 shows a side view of the vehicle headlight module according to Figures 1 and 2;

[0023] Figure 4 shows a detailed view of the vehicle headlight module according to Figures 1 to 3;

[0024] Figure 5 shows a detailed view of the circuit arrangement and adhesive points provided thereon of the vehicle headlight module according to Figures 1 to 4 in the uninstalled state.

[0025] Figure 6 shows another detailed view of the circuit arrangement;

[0026] Figure 7 shows a cross-sectional view of the circuit carrier and the bonding points disposed thereon;

[0027] Figure 8 shows a schematic diagram of a vehicle headlight, which includes a vehicle headlight module according to the present invention.

[0028] In the following figures, --unless otherwise stated--the same reference numerals denote the same features. Detailed Implementation

[0029] Figure 1 shows a perspective view of a vehicle headlight module 1 according to the present invention. The vehicle headlight module 1 includes a circuit device 2 for controlling at least one function of a vehicle headlight 3, and a housing 4 for at least partially housing the circuit device 2. The housing 4 has at least a portion of a conductive shielding surface 4a (see Figure 3) facing the metal of the circuit device 2 for electromagnetic shielding of the circuit device 2.

[0030] Regarding Figure 2, it should be mentioned that the circuit device 2 has at least one touch-sensitive surface segment 2a configured as flat as possible. This touch-sensitive surface segment 2a does not have any electrical components 5a disposed thereon. Furthermore, this segment 2a extends towards a flat segment 4a' of the shielding surface 4a of the housing 4 (see Figure 3), with an electrical strip wire 6a and / or contact portion 6b extending along the touch-sensitive surface segment 2a. A plurality of cured, non-conductive adhesive points 7 are disposed on the touch-sensitive surface segment 2a configured as flat as possible, extending from the touch-sensitive surface segment 2a towards the flat segment 4a' of the shielding surface 4a of the housing 4, to ensure a minimum distance between the touch-sensitive surface segment 2a and the flat segment 4a' of the shielding surface 4a of the housing 4. This minimum distance can correspond to the height h of the adhesive points 7, which is preferably between 0.05 mm and 0.4 mm, particularly between 0.1 mm and 0.25 mm (see Figure 7). It can be proposed that adjacent bonding points 7 be set relative to each other with a desired spacing between 1.5mm and 8mm, especially between 2mm and 6mm.

[0031] As can also be seen in Figure 2, the adhesive points 7 are arranged in rows R and columns S (see also Figure 5), where the number of rows R is between two and four, and the number of columns S is between eight and sixteen. The circuit device 2 is constituted by a circuit carrier 5b and electrical components 5a disposed thereon. The touch-sensitive surface segment 2a is constituted by a surface segment of the circuit carrier 5b, wherein the circuit carrier 5b is a semi-flexible circuit board comprising at least three substantially rigid segments, namely two outer segments 5bsa1 and 5bsa2 and an intermediate segment 5bsz1, and two flexible curved segments 5bf1 and 5bf2. The two outer segments 5bsa1 and 5bsa2 are connected to the intermediate segment 5bsz1 by means of the flexible curved segments 5bf1 and 5bf2, respectively. The adhesive points 7 are provided at least on the intermediate segment 5bsz1 and can also be disposed on the circuit carrier 2a. As can be clearly seen in Figures 3 and 4, the intermediate segment 5bsz1 is disposed relative to the flat segment 4a' of the shielding surface 4a of the housing 4. In particular, these two segments 5bsz1 and 4a' are disposed parallel to each other. It can be proposed that the distance L between the touch-sensitive surface segment 2a and the flat segment 4a' of the shielding surface 4a is at most 5 mm.

[0032] Figure 5 shows a detailed view of the circuit arrangement 2 of the vehicle headlight module 1 according to Figures 1 to 4, which has adhesive points 7 provided thereon in its unfolded, uninstalled state. An opening 8a (also see Figure 2) is formed between the two outer segments 5bsa1 and 5bsa2, extending from one outer segment 5bsa1 towards the other outer segment 5bsa2. The opening 8a is defined by the laterally adjacent areas of the outer segments 5bsa1 and 5bsa2, the intermediate segment 5bsz1, and the two flexible curved segments 5bf1 and 5bf2. Another opening 8b is provided in the shielding surface 4a of the housing 4, and this other opening at least partially overlaps with the opening 8a of the circuit carrier 5b.

[0033] Referring to Figure 2, the circuit carrier 5b additionally includes a rigid additional external segment 5bsa3 and an additional flexible bending segment 5bf3, by means of which the additional external segment 5bsa3 is (at least temporarily) flexibly connected to one of the external segments 5bsa2. In the context of this invention, the term "flexible" means that the element in question is at least temporarily flexible and can be bent without being damaged. In extreme cases, a single bend without damage is sufficient.

[0034] Figure 7 shows a cross-sectional view of the circuit carrier 2 and the adhesive point 7 disposed thereon. In the contact area with the touch-sensitive surface segment 2a, the diameter d of the adhesive point 7 is between 0.25 mm and 1.5 mm. It can be proposed that the adhesive point 7 is made of a thermosetting adhesive material.

[0035] Figure 8 shows a schematic diagram of a vehicle headlight 3. The vehicle headlight 3, particularly a motor vehicle headlight, includes a vehicle headlight module 1 according to the invention and at least one optical projection system 10 for emitting light distribution. The circuit device 2 can include a light source 9, particularly an LED light source, for emitting light.

[0036] This invention is not limited to the embodiments shown, but is defined by the entire scope of the claims. Various aspects of the invention or its embodiments can also be adopted and combined with each other. Any reference numerals in the claims are exemplary and used only for easier readability, and do not limit the scope of the claims.

Claims

1. A vehicle headlight module (1), the vehicle headlight module comprising: - A circuit device (2) for controlling at least one function of a vehicle headlight (3), and - a housing (4) for at least partially housing the circuit device (2), wherein the housing (4) has at least partially a conductive shielding surface (4a) of metal facing the circuit device (2) for electromagnetic shielding of the circuit device (2), wherein the circuit device (2) has at least one touch-sensitive surface segment (2a) configured as flat as possible, wherein the touch-sensitive surface segment (2a) does not have electrical components (5a) disposed thereon, and the flat segment (4a') facing the shielding surface (4a) of the housing (4) contains an electrical strip-shaped conductive surface. The line (6a) and / or the contact portion (6b) extend along the touch-sensitive surface segment (2a), characterized in that a plurality of cured non-conductive adhesive points (7) are provided on the touch-sensitive surface segment (2a) which is constructed as flat as possible, the adhesive points extending from the touch-sensitive surface segment (2a) toward the flat segment (4a') of the shielding surface (4a) of the housing (4) to ensure a minimum distance between the touch-sensitive surface segment (2a) and the flat segment (4a') of the shielding surface (4a) of the housing (4).

2. The vehicle headlight module (1) according to claim 1, wherein adjacent bonding points (7) are arranged relative to each other at a desired spacing between 1.5 mm and 8 mm.

3. The vehicle headlight module (1) according to claim 2, wherein the adhesive points (7) are distributed as evenly as possible along the touch-sensitive surface segment (2a) in such a way that each imaginary circular area unit of the touch-sensitive surface segment (2a) has at least one adhesive point (7), and the circular area unit has a diameter at the level of the maximum value of the desired spacing.

4. The vehicle headlight module (1) according to any one of the preceding claims, wherein the adhesive points (7) are arranged in rows (R) and columns (S), wherein the number of rows (R) is between two and four, and the number of columns (S) is between eight and sixteen.

5. The vehicle headlight module (1) according to any one of claims 1 to 3, wherein the height (h) of the adhesive point (7) is between 0.05 mm and 0.4 mm.

6. The vehicle headlight module (1) according to any one of claims 1 to 3, wherein in the contact area with the touch-sensitive surface segment (2a), the diameter (d) of the adhesive point (7) is between 0.25 mm and 1.5 mm.

7. The vehicle headlight module (1) according to any one of claims 1 to 3, wherein the adhesive point (7) is made of a thermosetting adhesive material.

8. The vehicle headlight module (1) according to any one of claims 1 to 3, wherein the circuit device (2) is constituted by a circuit carrier (5b) and an electrical component (5a) disposed thereon, wherein the touch-sensitive surface segment (2a) is constituted by a surface segment of the circuit carrier (5b), wherein the circuit carrier (5b) is a semi-flexible circuit board, the semi-flexible circuit board comprising at least three substantially rigid segments, namely two outer segments (5bsa1, 5bsa2) and an intermediate segment (5bsz1), and two flexible curved segments (5bf1, 5bf2), wherein the two outer segments (5bsa1, 5bsa2) are respectively connected to the intermediate segment (5bsz1) via the flexible curved segments (5bf1, 5bf2), wherein the adhesive point (7) is provided at least on the intermediate segment (5bsz1).

9. The vehicle headlight module (1) according to claim 8, wherein at least the intermediate segment (5bsz1) is disposed relative to the flat segment (4a') of the shielding surface (4a) of the housing (4).

10. The vehicle headlight module (1) according to claim 8, wherein an opening (8a) is formed between the two outer segments (5bsa1, 5bsa2), the opening extending from one outer segment (5bsa1) toward the other outer segment (5bsa2), wherein the opening (8a) is defined by the laterally adjacent areas of the outer segments (5bsa1, 5bsa2) and the intermediate segment (5bsz1) and the two flexible curved segments (5bf1, 5bf2), wherein another opening (8b) is provided in the shielding surface (4a) of the housing (4), the other opening at least partially overlapping the opening (8a) of the circuit carrier (5b).

11. The vehicle headlight module (1) according to claim 8, wherein the circuit carrier (5b) additionally has a rigid additional outer section (5bsa3) and an additional flexible curved section (5bf3), wherein the additional outer section (5bsa3) is flexibly connected to one of the outer sections (5bsa2) by means of the additional flexible curved section.

12. The vehicle headlight module (1) according to any one of claims 1 to 3, wherein the circuit device (2) includes a light source (9) for emitting light.

13. The vehicle headlight module (1) according to any one of claims 1 to 3, wherein the flat portion (4a') of the touch-sensitive surface segment (2a) and the shielding surface (4a) are oriented parallel to each other.

14. The vehicle headlight module (1) according to any one of claims 1 to 3, wherein the distance (L) between the touch-sensitive surface segment (2a) and the flat segment (4a') of the shielding surface (4a) is at most 5 mm.

15. The vehicle headlight module (1) according to claim 2, wherein adjacent bonding points (7) are arranged relative to each other at a desired spacing between 2 mm and 6 mm.

16. The vehicle headlight module (1) according to claim 5, wherein the height (h) of the adhesive point (7) is between 0.1 mm and 0.25 mm.

17. The vehicle headlight module (1) according to claim 12, wherein the circuit device (2) includes an LED light source for emitting light.

18. A vehicle headlight (3), the vehicle headlight comprising a vehicle headlight module (1) according to any one of the preceding claims and at least one optical projection system (10) for emitting light distribution.

19. The vehicle headlight (3) according to claim 18, wherein the vehicle headlight (3) is a motor vehicle headlight.

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