Sensor package structure

Abstract

A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a ring-shaped support formed on the sensor chip, and a light-transmissive layer disposed on the ring-shaped support. A top portion of the sensor chip defines a sensing region and a carrying region surrounding the sensing region and carrying the ring-shaped support. The top portion of the sensor chip includes a protection layer and a filter layer located between the sensing region and the carrying region, a pixel layer located in the sensing region and formed on the filter layer, and a microlens layer formed on the pixel layer. The filter layer in the carrying region is in a roughened configuration and at least partially embedded in the ring-shaped support. Accordingly, the bonding force between the ring-shaped support and the sensor chip is improved, thereby effectively avoiding peeling.

Description

Technical Field

[0001] This application relates to a packaging structure, and more particularly to a sensor packaging structure. Background Technology

[0002] Existing sensor packaging structures include a glass sheet, a sensing chip, and an adhesive layer bonded between the glass sheet and the sensing chip. Since structural changes to the sensing chip can easily affect its sensing results, most existing sensor packaging structures focus on improving the adhesive layer to enhance its connection with other components. However, these improvements have limitations.

[0003] Therefore, the inventor believed that the above-mentioned defects could be improved, and thus devoted himself to research and applied scientific principles, and finally proposed this application with a reasonable design that effectively improves the above-mentioned defects. Summary of the Invention

[0004] The present application provides a sensor packaging structure that can effectively improve the defects that may arise from existing sensor packaging structures.

[0005] This application discloses a sensor packaging structure, comprising: a substrate; a sensing chip disposed on the substrate and electrically coupled to the substrate; wherein the top of the sensing chip defines a sensing region and a support region surrounding the sensing region; the top of the sensing chip includes: a protective layer located in the sensing region and the support region; a filter layer having a central block located in the sensing region and a surrounding block located in the support region, and the surrounding block having a roughened structure; a pixel layer located in the sensing region and formed on the central block; and a microlens layer located in the sensing region and formed on the pixel layer; an annular support formed in the support region of the sensing chip, and at least a portion of the surrounding block of the filter layer is embedded in the annular support; and a light-transmitting layer disposed on the annular support, such that the light-transmitting layer, the annular support, and the sensing chip together form a closed space.

[0006] Optionally, the surrounding area of ​​the filter layer is recessed to form a plurality of annular grooves to create a roughened structure, and each annular groove surrounds the periphery of the central area, and at least one annular groove is filled by an annular support.

[0007] Optionally, each annular groove extends through the surrounding block to form multiple annular ribs spaced apart, and the annular support passes through at least one annular groove to be connected to the protective layer.

[0008] Optionally, the centers of the multiple annular grooves overlap each other.

[0009] Optionally, the surrounding area of ​​the filter layer has multiple protrusions spaced apart from each other to form a roughened structure, and the multiple protrusions are distributed around the periphery of the central area, with at least a portion of the multiple protrusions embedded within the annular support.

[0010] Optionally, the annular support is made of a solder resist layer, and the inner edge of the annular support has an annular diffuser surface; wherein, when a light ray passes through the light-transmitting layer and is projected onto the diffuser surface at an incident angle, the diffuser surface can cause the light ray to be diffused into multiple light rays at multiple angles different from the incident angle.

[0011] Optionally, the diffused bread contains a plurality of serrated stripes arranged at intervals, and the length direction of each serrated stripe is perpendicular to the inner surface of the light-transmitting layer.

[0012] Optionally, the substrate includes multiple solder pads located outside the sensing chip, and the sensing chip includes multiple connection pads located in the carrier area; wherein, the sensor package structure includes multiple metal lines, one end of the multiple metal lines is connected to the multiple solder pads, and the other end of the multiple metal lines is connected to the multiple connection pads.

[0013] Optionally, the sensing chip has at least one receiving groove in the carrier area that extends through the surrounding block and the protective layer, and a plurality of connection pads are located within the at least one receiving groove.

[0014] Optionally, the sensor package structure includes a package formed on a substrate, wherein the sensing chip, the annular support, and the light-transmitting layer are all embedded in the package, and a portion of the surface of the light-transmitting layer is exposed outside the package.

[0015] In summary, the sensor packaging structure disclosed in this application improves the bonding force between the annular support and the sensing chip by forming the roughened filter layer between them, thereby effectively preventing the annular support from peeling off from the sensing chip.

[0016] To further understand the features and technical content of this application, please refer to the following detailed description and drawings of this application. However, these descriptions and drawings are only used to illustrate this application and are not intended to limit the scope of protection of this application in any way. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 1 of this application.

[0018] Figure 2 for Figure 1 A top-view diagram.

[0019] Figure 3 for Figure 2A schematic cross-sectional view along section line III-III.

[0020] Figure 4 for Figure 3 A magnified view of a portion of the image.

[0021] Figure 5 for Figure 1 The top view of the sensor packaging structure, omitting the support, pixel layer and microlens layer of the sensing chip, light-transmitting layer, and package, is shown below.

[0022] Figure 6 for Figure 5 A schematic diagram of the changing state of the filter layer.

[0023] Figure 7 for Figure 5 A schematic diagram of another variation of the filter layer.

[0024] Figure 8 for Figure 4 A schematic diagram of the changing state of the ring-shaped support.

[0025] Figure 9 This is a three-dimensional schematic diagram of the sensor packaging structure according to Embodiment 2 of this application.

[0026] Figure 10 for Figure 9 A three-dimensional sectional view.

[0027] Figure 11 for Figure 9 The sensor packaging structure is shown in a three-dimensional diagram with the light-transmitting layer and the package body omitted.

[0028] Figure 12 for Figure 9 A cross-sectional view along section line XII-XII.

[0029] Figure 13 for Figure 12 A magnified view of a portion of the image. Detailed Implementation

[0030] The following specific embodiments illustrate the implementation of the "sensor packaging structure" disclosed in this application. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, the accompanying drawings of this application are for simple illustration only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this application in detail, but the disclosed content is not intended to limit the scope of protection of this application.

[0031] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the related listed items.

[0032] [Example 1]

[0033] Please see Figures 1 to 8 As shown, this is an embodiment of this application. Figure 1 and Figure 2 As shown, this embodiment discloses a sensor packaging structure 100; that is, the internal structure is not any structure for packaging a sensor, and its structural design basis is different from the sensor packaging structure 100 referred to in this embodiment, so the two are not suitable for comparison.

[0034] Please see Figures 2 to 4 As shown, the sensor packaging structure 100 in this embodiment includes a substrate 1, a sensing chip 2 disposed on the substrate 1 and electrically coupled to each other, multiple metal lines 3 electrically coupled to the sensing chip 2 and the substrate 1, an annular support 4 disposed on the sensing chip 2, a light-transmitting layer 5 disposed on the annular support 4, and a package 6 formed on the substrate 1.

[0035] In this embodiment, the sensor package structure 100 is described as including the aforementioned components, but it can be adjusted and varied according to design requirements. For example, in other embodiments not shown in this application, the sensor package structure 100 may omit multiple metal lines 3, and the sensing chip 2 may be fixed and electrically coupled to the substrate 1 via a flip-chip method; alternatively, the sensor package structure 100 may omit or replace the package body 6 with other structures. The structure and connection relationship of each component of the sensor package structure 100 in this embodiment will be described below.

[0036] In this embodiment, the substrate 1 is square or rectangular, but this application is not limited to this. The substrate 1 has a die-bonding region 111 approximately at the center of its upper surface 11, and a plurality of bonding pads 112 are formed on its upper surface 11 outside the die-bonding region 111 (or the sensing chip 2). In this embodiment, the bonding pads 112 are generally arranged in a ring, but this application is not limited to this. For example, in other embodiments not shown in this application, the bonding pads 112 may also be arranged in two rows on opposite sides of the die-bonding region 111.

[0037] In addition, the substrate 1 may also have a plurality of solder balls 7 on its lower surface 12, and the sensor package structure 100 can be soldered and fixed to an electronic component (not shown in the figure) by the plurality of solder balls 7, so that the sensor package structure 100 can be electrically connected to the electronic component.

[0038] In this embodiment, the sensing chip 2 is described as an image sensing chip, but this is not a limitation. The bottom surface 22 of the sensing chip 2 is fixed to the die-bonding region 111 of the substrate 1; that is, the sensing chip 2 is located inside the plurality of bonding pads 112. It should be further noted that in this embodiment, the sensor package structure 100 includes an adhesive material M (e.g., thermally conductive adhesive) disposed on the die-bonding region 111, and the sensing chip 2 is fixed to the die-bonding region 111 by the adhesive material M (e.g., the bottom surface 22 of the sensing chip 2 and the die-bonding region 111 are bonded and fixed to each other by the adhesive material M), but this application is not limited to this. For example, in other embodiments not illustrated in this application, the adhesive material M may be omitted or replaced by other components.

[0039] Furthermore, a top 21 of the sensing chip 2 defines a sensing region 21a and a support region 21b surrounding the sensing region 21a (in an annular shape), and the sensing chip 2 includes a plurality of connection pads 216 located in the support region 21b. In this embodiment, the number and position of the plurality of connection pads 216 of the sensing chip 2 correspond to the number and position of the plurality of solder pads 112 of the substrate 1, respectively.

[0040] Furthermore, one end of each of the plurality of metal wires 3 is connected to a plurality of solder pads 112, and the other end of each of the plurality of metal wires 3 is connected to a plurality of connection pads 216, so that the substrate 1 can be electrically coupled to the sensing chip 2 through the plurality of metal wires 3.

[0041] More specifically, in this embodiment, the top 21 of the sensing chip 2 includes a passivation layer 211, a color filter layer 212, a pixel layer 213, and a micro-lens layer 214 arranged in a direction away from the substrate 1.

[0042] The protective layer 211 is located between the sensing region 21a and the carrier region 21b. The filter layer 212 has a central block 2121 located in the sensing region 21a and a surrounding block 2122 located in the carrier region 21b, and the surrounding block 2122 has a roughened structure. The pixel layer 213 is located in the sensing region 21a and formed on the central block 2121, and the microlens layer 214 is located in the sensing region 21a and formed on the pixel layer 213.

[0043] Furthermore, in this embodiment, the annular support 4 is described as an epoxy resin layer, and the annular support 4 is formed in the carrier region 21b of the sensing chip 2. At least a portion of the surrounding area 2122 of the filter layer 212 is embedded within the annular support 4, thereby enhancing the bonding force between the annular support 4 and the sensing chip 2 through the formation of the roughened filter layer 212, effectively preventing the annular support 4 from peeling off from the sensing chip 2.

[0044] It should be further noted that the filter layer 212, the pixel layer 213, and the microlens layer 214 located above the protective layer 211 of the sensing chip 2 are all optical components. Therefore, in this embodiment, the sensor packaging structure 100 improves its bonding effect with the annular support 4 by structurally designing the filter layer 212, which is an optical component. In other words, any packaging structure that does not improve the bonding of optical components is different from the sensor packaging structure 100 referred to in this embodiment.

[0045] Furthermore, the roughened structure formed by the filter layer 212 on the surrounding block 2122 in this embodiment can be adjusted and varied according to design requirements. For ease of understanding, the following description introduces several embodiments in which the filter layer 212 can provide better bonding effects, but this application is not limited thereto.

[0046] like Figures 3 to 5 As shown, the surrounding area 2122 of the filter layer 212 is recessed with a plurality of annular grooves 2123 to form the roughened structure, and each annular groove 2123 surrounds the periphery of the central area 2121. Preferably, the centers of the plurality of annular grooves 2123 overlap each other to form a concentric ring arrangement, and the annular support 4 may be disposed on at least one annular groove 2123; that is, at least one annular groove 2123 is filled by the annular support 4.

[0047] More specifically, in this embodiment, each of the annular grooves 2123 is through-holes in the surrounding block 2122, so that the surrounding block 2122 forms a plurality of annular ribs 2124 spaced apart, and the annular support 4 can be disposed on at least one of the annular grooves 2123; that is, the annular support 4 passes through at least one of the annular grooves 2123 and is connected to the protective layer 211, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, any of the annular grooves 2123 may not be through-holes, so that the annular support 4 and the protective layer 211 are separated by the surrounding block 2122 of the filter layer 212.

[0048] like Figure 6 and Figure 7 As shown, in this embodiment, the surrounding area 2122 of the filter layer 212 may also have a plurality of protrusions 2125 spaced apart from each other to form the roughened structure. The plurality of protrusions 2125 are distributed around the periphery of the central area 2121, and at least a portion of the plurality of protrusions 2125 are embedded within the annular support 4 (similar to...). Figure 4 It should be noted that, in this embodiment, the annular support 4 is in direct contact with the protective layer 211, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, the surrounding area 2122 of the filter layer 212 may have a thin film located on the protective layer 211, and a plurality of the protrusions 2125 are formed on the thin film, such that the annular support 4 and the protective layer 211 are separated by the thin film of the filter layer 212.

[0049] Furthermore, the shape of any of the protrusions 2125 can be adjusted and varied according to design requirements. For example, each protrusion 2125 can be as follows: Figure 6 The shown is a rectangular prism (e.g., a square or a rectangle) or as shown Figure 7 The prism shown is not limited to this.

[0050] In addition, such as Figures 3 to 5 As shown, the sensing chip 2 has at least one receiving groove 215 formed in the bearing area 21b, penetrating the surrounding block 2122 and the protective layer 211, and a plurality of the connecting pads 216 are located within at least one receiving groove 215. That is, the at least one receiving groove 215 may be annular and there may be only one such groove, so that a plurality of the connecting pads 216 may be located therein; or, there may be a plurality of receiving grooves 215, so that a plurality of the connecting pads 216 may be located therein respectively.

[0051] Furthermore, such as Figure 3 and Figure 4 As shown, the annular support 4 may be located inside at least one of the receiving grooves 215; or, as... Figure 8 As shown, the annular support 4 may also be located on at least one of the receiving grooves 215, so that each of the connecting pads 216 and each of the metal wires 3 connected thereto are partially embedded in the annular support 4.

[0052] like Figures 3 to 5 As shown, the light-transmitting layer 5 in this embodiment is described as a transparent flat glass, but this application is not limited to this. The light-transmitting layer 5 is disposed above the sensing chip 2 via the annular support 4; that is, in this embodiment, the annular support 4 is sandwiched between the light-transmitting layer 5 and the sensing chip 2. The light-transmitting layer 5, the annular support 4, and the sensing chip 2 together form a closed space E, and the sensing area 21a (e.g., the central block 2121 of the filter layer 212, the pixel layer 213, and the microlens layer 214) is located within the closed space E and faces the light-transmitting layer 5.

[0053] Furthermore, in this embodiment, the light-transmitting layer 5 includes an outer surface 51, an inner surface 52 located on the opposite side of the outer surface 51, and an annular side surface 53 connecting the outer surface 51 and the inner surface 52. The inner surface 52 faces the sensing area 21a, and the outer edge 43 of the annular support 4 is recessed inward from the annular side surface 53 of the light-transmitting layer 5 by a certain distance; however, this application is not limited to this. For example, such as... Figure 8 As shown, the outer edge 43 of the annular support 4 can also be cut flush with the annular side surface 53 of the light-transmitting layer 5, and a portion of the multiple connecting pads 216 and the metal wires 3 connected to them are embedded in the annular support 4.

[0054] like Figures 3 to 5 As shown, in this embodiment, the package 6 is formed on the upper surface 11 of the substrate 1 and its edges are flush with the edges of the substrate 1. The sensing chip 2, the annular support 4, the light-transmitting layer 5, and at least a portion of each of the metal lines 3 are embedded within the package 6, and a portion of the surface of the light-transmitting layer 5 (e.g., the outer surface 51) is exposed outside the package 6.

[0055] Furthermore, in this embodiment, the package 6 is described as a liquid compound, but this application is not limited thereto. For example, in other embodiments not illustrated in this application, a molding compound may be further formed on the top surface of the liquid compound of the package 6; or, the package 6 may simply be a molding compound.

[0056] [Example 2]

[0057] Please see Figures 9 to 13 As shown, this is Embodiment Two of this application. Since this embodiment is similar to Embodiment One described above, the similarities between the two embodiments will not be repeated. The differences between this embodiment and Embodiment One are roughly explained as follows:

[0058] In this embodiment, the annular support 4 is composed of a solder mask layer, and an annular diffuser surface 41 is formed on the inner edge of the annular support 4. The diffuser surface 41 includes a plurality of serrated stripes 42 arranged at intervals. In this embodiment, the serrated stripes 42 of the diffuser surface 41 are arranged in a ring at equal intervals, but this application is not limited thereto. For example, in other embodiments not shown in this application, the serrated stripes 42 may also be connected to each other or arranged in a ring at non-equal intervals according to design requirements.

[0059] Furthermore, the diffuser surface 41 and the sensing area 21a form an angle σ, which is described as 90 degrees in this embodiment, but this application is not limited to this. For example, the angle σ can be adjusted to between 80 and 100 degrees according to design requirements. Preferably, the longitudinal direction of each sawtooth stripe 42 of the diffuser surface 41 is perpendicular to the inner surface 52 of the light-transmitting layer 5 (or the top 21 of the sensing chip 2).

[0060] Accordingly, when a ray L passes through the light-transmitting layer 5 and is projected onto the light-scattering surface 41 at an incident angle (e.g.: Figure 10 The diffuser surface 41 (or the plurality of the sawtooth stripes 42) can diffuse the light L into multiple light rays at multiple angles different from the incident angle, thereby effectively reducing glare in the sensor package structure 100.

[0061] [Technical Effects of the Embodiments in this Application]

[0062] In summary, the sensor packaging structure disclosed in this application improves the bonding force between the annular support and the sensing chip by forming the roughened filter layer between them, thereby effectively preventing the annular support from peeling off from the sensing chip.

[0063] Furthermore, the sensor packaging structure disclosed in this application has a light-diffusing surface formed on the inner edge of the annular support (or the annular solder mask layer), so that light rays passing through the light-transmitting layer and projected onto the light-diffusing surface can be diffused into multiple light rays at multiple angles different from the incident angle, thereby effectively reducing the glare phenomenon generated in the sensor packaging structure.

[0064] Furthermore, when the annular support in this embodiment is implemented using the annular solder mask layer, since the annular solder mask layer can be manufactured by methods such as stamping, photolithography, printing, or coating, the thickness of the annular solder mask layer can be effectively and precisely controlled, and the shape of the annular solder mask layer (e.g., the shape of the diffused surface) can also be precisely shaped. Accordingly, the sensor packaging structure can more effectively reduce the generation of glare.

[0065] Furthermore, in the sensor packaging structure disclosed in the embodiments of this application, the light-diffusing surface of the annular support (or the annular solder mask layer) can also be formed with a specific structure (e.g., the light-diffusing surface and the sensing area are sandwiched at an angle between 80 degrees and 100 degrees, the length direction of each of the sawtooth stripes of the light-diffusing surface is perpendicular to the inner surface of the light-transmitting layer, or the plurality of sawtooth stripes of the light-diffusing surface are arranged at equal intervals), so that the sensor packaging structure can further reduce the generation of glare.

[0066] The content disclosed above is only an optional and feasible embodiment of this application, and is not intended to limit the patent scope of this application. Therefore, all equivalent technical changes made using the content of this application specification and drawings are included in the patent scope of this application.

Claims

1. A sensor package structure, characterized by, The sensor packaging structure includes: One substrate; A sensing chip is disposed on the substrate and electrically coupled to the substrate; wherein, the top of the sensing chip defines a sensing region and a bearing region surrounding the sensing region; the top of the sensing chip includes: A protective layer is located between the sensing area and the bearing area; A filter layer having a central block located in the sensing area and a surrounding block located in the bearing area, wherein the surrounding block has a roughened structure; A pixel layer, located in the sensing area and formed on the central block; and A microlens layer is located in the sensing area and formed on the pixel layer; An annular support is formed in the carrier region of the sensing chip, and at least a portion of the surrounding block of the filter layer is embedded in the annular support; and A light-transmitting layer is disposed on the annular support, so that the light-transmitting layer, the annular support, and the sensing chip together form a closed space.

2. The sensor package structure according to claim 1, wherein The surrounding area of ​​the filter layer is recessed to form a plurality of annular grooves to constitute the roughened structure, and each annular groove surrounds the periphery of the central area, and at least one annular groove is filled by the annular support.

3. The sensor packaging structure according to claim 2, characterized in that, Each of the annular grooves extends through the surrounding block to form a plurality of spaced annular ribs in the surrounding block, and the annular support passes through at least one of the annular grooves and is connected to the protective layer.

4. The sensor packaging structure according to claim 2, characterized in that, The centers of the multiple annular grooves overlap each other.

5. The sensor packaging structure according to claim 1, characterized in that, The surrounding area of ​​the filter layer has a plurality of protrusions spaced apart from each other to form the roughened structure, and the plurality of protrusions are distributed around the periphery of the central area, with at least a portion of the plurality of protrusions embedded within the annular support.

6. The sensor packaging structure according to claim 1, characterized in that, The annular support is composed of a solder resist layer, and the inner edge of the annular support has an annular diffuser surface; wherein, when a light ray passes through the light-transmitting layer and is projected onto the diffuser surface at an incident angle, the diffuser surface can cause the light ray to be diffused into multiple light rays at multiple angles different from the incident angle.

7. The sensor packaging structure according to claim 6, characterized in that, The light-diffusing bread contains a plurality of serrated stripes arranged at intervals, and the length direction of each serrated stripe is perpendicular to the inner surface of the light-transmitting layer.

8. The sensor packaging structure according to claim 1, characterized in that, The substrate includes a plurality of solder pads located outside the sensing chip, and the sensing chip includes a plurality of connection pads located in the carrier region; wherein, the sensor package structure includes a plurality of metal lines, and one end of the plurality of metal lines is connected to the plurality of solder pads, and the other end of the plurality of metal lines is connected to the plurality of connection pads.

9. The sensor packaging structure according to claim 8, characterized in that, The sensing chip has at least one receiving groove in the bearing area that extends through the surrounding block and the protective layer, and the plurality of the connecting pads are located within at least one receiving groove.

10. The sensor packaging structure according to claim 1, characterized in that, The sensor packaging structure includes a package formed on the substrate, wherein the sensing chip, the annular support, and the light-transmitting layer are all embedded in the package, and a portion of the surface of the light-transmitting layer is exposed outside the package.

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