Sound device and vehicle device

Abstract

A sound device and a vehicle device including the same are disclosed. The sound device includes a housing at a rear surface of a vibrating member, a connecting member between the vibrating member and the housing, and a vibration device that vibrates the vibrating member.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefits to Korean Patent Application No. 10-2021-0194781, filed on December 31, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure pertains to sound devices. Background Technology

[0004] The equipment includes standalone speakers or sound devices that provide sound. When speakers are placed in the equipment, they occupy space, thus limiting the design and spatial arrangement of the equipment.

[0005] A loudspeaker used in a device can be, for example, an actuator comprising a magnet and a coil. However, when an actuator is applied to a device, its thickness increases. Therefore, piezoelectric elements for achieving thinner thicknesses are attracting considerable attention.

[0006] Because piezoelectric elements are fragile, they are easily damaged by external impacts, resulting in low reliability in sound reproduction. Furthermore, when loudspeakers using piezoelectric elements are applied to flexible devices, their fragility can cause damage. Summary of the Invention

[0007] The inventors of this disclosure have recognized the aforementioned problems and have conducted various experiments to realize a sound device (or vibrating device) that can enhance sound quality and sound pressure level characteristics. Through these experiments, the inventors have invented a new sound device (or vibrating device) and a device incorporating the sound device, which can enhance sound quality.

[0008] Therefore, this disclosure is intended to provide a device and a vehicle device that substantially eliminates one or more problems caused by the limitations and disadvantages of related technologies.

[0009] One aspect of this disclosure is intended to provide a device that can cause a vibrating component to vibrate to produce vibration or sound and can enhance sound characteristics and / or sound pressure level characteristics.

[0010] Further features and aspects of this disclosure will be set forth in the following description and will be apparent in part from the description, or may be learned by practicing the inventive concept provided herein. Other features and aspects of the inventive concept may be realized and obtained by means of structures particularly pointed out in the written description or derived therefrom, as well as the claims and drawings.

[0011] In order to achieve these and other aspects of the inventive concept, as implemented and broadly described, the sound device includes a vibrating member, a housing at the rear surface of the vibrating member, a connecting member between the vibrating member and the housing, and a vibrating device for vibrating the vibrating member.

[0012] In addition to the beneficial effects mentioned above in this disclosure, other features and advantages of this disclosure will be described below, or may be clearly understood by those skilled in the art from such description or illustration.

[0013] The sound device according to embodiments of this disclosure may include a device (or sound device) that vibrates a display panel or a vibrating member, and may generate sound such that the sound of the device travels toward the front surface of the display panel or the vibrating member.

[0014] Other systems, methods, features, and advantages will be or will become apparent to those skilled in the art upon examination of the following drawings and detailed description. All such additional systems, methods, features, and advantages are intended to be included within this specification, within the scope of this disclosure, and protected by the appended claims. Nothing in this section should be construed as limiting these claims. Other aspects and advantages are discussed below in conjunction with embodiments of this disclosure.

[0015] It should be understood that both the foregoing general description of this disclosure and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed disclosure. Attached Figure Description

[0016] The accompanying drawings are included to provide a further understanding of the disclosure, and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the disclosure and, together with the description, serve to illustrate the principles of the disclosure.

[0017] Figure 1 This is a perspective view illustrating a sound device according to an embodiment of the present disclosure.

[0018] Figure 2 It is along Figure 1 The cross-sectional view taken by line A-A' is shown in the figure.

[0019] Figure 3 It is along Figure 1 Another cross-sectional view taken by line A-A' is shown in the figure.

[0020] Figure 4 A vibration device according to an embodiment of the present disclosure is shown.

[0021] Figure 5 It is along Figure 4 The cross-sectional view taken by line B-B' is shown in the figure.

[0022] Figure 6 yes Figure 5 The image shows a three-dimensional view of the piezoelectric vibrating part.

[0023] Figures 7A to 7D This is a perspective view showing a piezoelectric vibrating section in a vibration device according to another embodiment of the present disclosure.

[0024] Figure 8 A vibration device according to another embodiment of the present disclosure is shown.

[0025] Figure 9 It is along Figure 8 The cross-sectional view taken by line C-C' is shown in the figure.

[0026] Figure 10 A vibration device according to another embodiment of the present disclosure is shown.

[0027] Figures 11 to 14 It is along Figure 1 Another cross-sectional view taken by line A-A' is shown in the figure.

[0028] Figures 15 to 17 It is along Figure 1 Another cross-sectional view taken by line A-A' is shown in the figure.

[0029] Figure 18A and Figure 18B This is a perspective view showing an inner housing according to an embodiment of the present disclosure.

[0030] Figure 19A , Figure 19B and Figure 19C This is a plan view showing an inner housing according to an embodiment of the present disclosure.

[0031] Figure 20 This is a perspective view showing a sound device according to another embodiment of the present disclosure.

[0032] Figure 21 It is along Figure 20 The cross-sectional view taken by line D-D' is shown in the figure.

[0033] Figure 22 The arrangement of the vibration device on the rear surface of the vibration member is shown.

[0034] Figure 23 It shows in Figure 2 The sound output characteristics of a sound device when no protruding vibrating component is provided in the sound device.

[0035] Figure 24The sound pressure level of the sound device relative to frequency is shown, where, in Figure 11 The sound equipment is provided with a groove for a vibrating component, and Figure 12 The sound equipment does not have a groove for the vibrating component.

[0036] Figures 25A to 25F This demonstrates how to prepare the groove portion of the vibrating component by making modifications under various conditions. Figure 12 The sound pressure level of a sound device relative to its frequency.

[0037] Figures 26A to 26E This illustrates a configuration achieved by varying the thickness of the vibrating member corresponding to the groove portion of the vibrating member under various conditions. Figure 12 The sound pressure level of a sound device relative to its frequency.

[0038] Figure 27 It shows that the application is used Figure 18A , Figure 18B , Figure 19A , Figure 19B and Figure 19C The sound pressure level of a sound device relative to a frequency is determined by the structure of its internal housing.

[0039] Figure 28 It shows in Figure 15 and Figure 16 sound equipment and Figure 12 The sound pressure level relative to the frequency of a structure in a sound device that does not have a groove for a vibrating component.

[0040] Figure 29 It shows Figure 22 The sound pressure level of a sound device relative to its frequency.

[0041] Throughout the accompanying drawings and detailed embodiments, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustration, and convenience, the relative dimensions and depictions of these elements may be exaggerated. Detailed Implementation

[0042] Reference will now be made in detail to embodiments of this disclosure, examples of which are illustrated in the accompanying drawings. In the following description, detailed descriptions of well-known functions or configurations relevant to this document will be omitted where such descriptions are deemed unnecessarily obscuring the essential points of the inventive concept. The described progression of processing steps and / or operations is illustrative; however, the order of steps and / or operations is not limited to the order set forth herein, except that they must occur in a specific order, and can be varied as is known in the art. Throughout the document, the same reference numerals denote the same elements. The names of the various elements used in the following description are chosen solely for convenience of writing the specification and may therefore differ from the names used in actual products.

[0043] The advantages and features of this disclosure and its implementation methods will be illustrated by the following description of embodiments with reference to the accompanying drawings. However, this disclosure may be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this disclosure to those skilled in the art.

[0044] The shapes, dimensions, ratios, angles, and numbers disclosed in the accompanying drawings used to describe embodiments of this disclosure are merely examples, and therefore, this disclosure is not limited to the details shown. Throughout the text, similar reference numerals refer to similar elements. In the following description, detailed descriptions of relevant known functions or configurations will be omitted where it is determined that such descriptions would unnecessarily obscure the focus of this disclosure. When using the terms "comprising," "having," and "including" as described in this specification, additional parts may be added unless "only" is used. Unless otherwise stated, singular terms may include plural forms.

[0045] When interpreting components, the components are explained as including a range of errors or tolerances, but there is no explicit description of such a range of errors or tolerances.

[0046] When describing positional relationships, for example, when the positional relationship between two parts is described as "on," "above," "below," and "next to," one or more other parts may be positioned between the two parts unless more restrictive terms such as "exactly" or "directly" are used. In the description of embodiments, when a structure is described as being "above" or "below" or "under" another structure, the description should be interpreted to include cases where these structures are in contact with each other and cases where a third structure is positioned between them.

[0047] When describing temporal relationships, such as when time sequence is described as "after", "following", "next" and "before", discontinuous situations may be included unless more restrictive terms such as "exactly", "immediately after", or "directly" are used.

[0048] It will be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this disclosure, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0049] In describing the elements of this disclosure, the terms “first,” “second,” “A,” “B,” “(a),” “(b),” etc., may be used. These terms are intended to identify the corresponding element from other elements, and the basis, order, or number of the corresponding elements shall not be limited by these terms. Unless otherwise stated, the expression “connected,” “coupled,” or “adhered” to another element or layer means that the element or layer may be directly connected, coupled, or adhered to another element or layer, or indirectly connected, coupled, or adhered to another element or layer, wherein one or more intermediate elements or layers are “set” or “inserted” between the elements or layers.

[0050] The term "at least one" should be understood to include any and all combinations of one or more of the associated listed items. For example, "at least one of the first, second, and third items" means a combination of all items drawn from two or more of the first, second, and third items, as well as the first, second, or third item.

[0051] The expressions "first element," "second element," and " / or" "third element" should be understood as one of the first element, the second element, and the third element, or as any or all combinations of the first element, the second element, and the third element. By way of example, A, B, and / or C can refer to only A; only B; only C; any or some combinations of A, B, and C; or all of A, B, and C.

[0052] As will be fully understood by those skilled in the art, the features of the various embodiments of this disclosure may be coupled or combined with each other in part or in whole, and may interoperate with each other and be technically driven in various ways. Embodiments of this disclosure may be performed independently of each other, or may be performed together in an interdependent relationship.

[0053] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Furthermore, for ease of description, the scale, dimensions, and thickness of each element shown in the drawings differ from actual scale, and therefore, embodiments of the present disclosure are not limited to the scales shown in the drawings.

[0054] Figure 1 This is a perspective view showing a sound device 10 according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 The cross-sectional view taken by line A-A' is shown in the figure.

[0055] Reference Figures 1 to 3 According to embodiments of the present disclosure, the sound device 10 may include a vibrating member 110 and a vibrating device 130.

[0056] The vibrating component 110 can output sound based on the vibration of the vibrating device 130. Therefore, the vibrating component 110 can be referred to as a vibrating object, a vibrating plate, a vibrating panel, a sound plate, or a sound output component, etc., but the embodiments of the present disclosure are not limited thereto.

[0057] The vibrating member 110 may be configured to be transparent, translucent, or opaque. The vibrating member 110 according to embodiments of this disclosure may include a metallic or non-metallic material (or a composite non-metallic material) having material properties suitable for sound output based on vibration. The metallic material of the vibrating member 110 according to embodiments of this disclosure may include any one or more of stainless steel, aluminum (Al), Al alloys, magnesium (Mg), Mg alloys, and magnesium-lithium (Mg-Li) alloys, but embodiments of this disclosure are not limited thereto. The non-metallic material (or composite non-metallic material) of the vibrating member 110 may include one or more of glass, plastic, fiber, leather, wood, fabric, rubber, carbon, mirror, and paper, but embodiments of this disclosure are not limited thereto.

[0058] The vibrating member 110 according to embodiments of this disclosure can realize a sign panel, such as a simulated sign like an advertising sign, poster, or bulletin board. For example, when the vibrating member 110 realizes a sign panel, the simulated sign may include sign content such as sentences, pictures, and logos. The sign content can be placed at the vibrating member 110 to make the sign content visible. For example, the sign content can be directly attached to one or more of a first surface (or front surface) and a second surface (or rear surface) different from (or opposite to) the first surface of the vibrating member 110. For example, the sign content can be printed on a medium such as paper, and the medium on which the sign content is printed can be directly attached to one or more of the first surface and the second surface of the vibrating member 110. For example, when the sign content is attached to the second surface of the vibrating member 110, the vibrating member 110 can be configured as a transparent material.

[0059] According to another embodiment of the present disclosure, the vibration member 110 may include one or more of the following: a display panel including pixels configured to display images, a light-emitting diode illumination panel, an organic light-emitting illumination panel, and an inorganic light-emitting illumination panel.

[0060] According to another embodiment of this disclosure, the vibration member 110 may include one or more of the following: a display panel including pixels configured to display images, a screen panel on which images will be projected from a display device, a lighting panel, a sign panel, vehicle interior materials, vehicle windows, vehicle exterior materials, building ceiling materials, building interior materials, building windows, aircraft interior materials, aircraft windows, metal, wood, rubber, plastic, glass, fiber, fabric, paper, leather, carbon, and mirror.

[0061] The vibration member 110 according to embodiments of this disclosure may include a plate structure having a quadrilateral shape. The vibration member 110 may have a horizontal length (or transverse length) parallel to a first direction X and a vertical length (or longitudinal length) parallel to a second direction Y intersecting the first direction X. For example, the vibration member 110 may have a rectangular shape with a horizontal length that is relatively longer than its vertical length. However, this disclosure is not limited thereto, and the vibration member 110 may have a square shape with the same horizontal and vertical lengths.

[0062] The vibration member 110 according to embodiments of the present disclosure may include a vibration member protrusion 111 formed to surround the edge of the vibration member 110 at a second surface of the vibration member 110. Figure 2 In this context, the protrusion 111 of the vibrating member can refer to an element that protrudes from the rear surface of the vibrating member 110. For example, the protrusion 111 of the vibrating member and the vibrating member 110 can be configured as a single unit, but the embodiments of this disclosure are not limited thereto. For example, the protrusion 111 of the vibrating member can be referred to as a protrusion portion 111.

[0063] The protrusion 111 of the vibrating member may be made of the same material as the vibrating member 110 and may be formed to protrude from the second surface of the vibrating member 110.

[0064] The vibration member 110 according to embodiments of this disclosure can be configured to have a plurality of natural vibration frequencies (or inherent frequencies). The vibration member 110 may include a non-planar structure and therefore may have a plurality of natural vibration frequencies. The vibration member 110 may have a plurality of natural vibration frequencies that are different for each region (or area). For example, the vibration member 110 may have a plurality of natural vibration frequencies that are different based on the thickness of each region (or area).

[0065] The vibration device 130 can be configured to vibrate (or shift or drive) autonomously based on an applied electrical signal (or voice signal), or it can be configured to vibrate (or shift or drive) the vibrating member (or vibrating plate or vibrating object) 110. For example, the vibration device 130 can be referred to as a vibration structure, vibrator, vibration generating device, vibration generating apparatus, vibration generator, sound generator, sound device, sound generating apparatus, or sound generator, etc., but the embodiments of this disclosure are not limited thereto.

[0066] The vibration device 130 according to embodiments of this disclosure may include a piezoelectric material (or electroactive material) having piezoelectric properties. The vibration device 130 may vibrate (or displace or drive) the vibration member 110 based on the vibration (or displacement or actuation) of the piezoelectric material generated by an electrical signal (or voice signal) applied thereto. For example, the vibration device 130 may vibrate (or displace or drive) by alternating and repeated contraction and expansion through the piezoelectric effect (or piezoelectric properties). For example, the vibration device 130 may vibrate (or displace or drive) in the vertical direction (or thickness direction) Z by alternating and repeated contraction and expansion through the inverse piezoelectric effect.

[0067] The vibration device 130 according to embodiments of this disclosure may include one or more vibration devices 131 of the piezoelectric type.

[0068] One or more vibration devices 131 according to embodiments of the present disclosure may be configured to be flexible. For example, one or more vibration devices 131 may be configured to bend into a non-planar shape including a curved surface. For example, one or more vibration devices 131 according to embodiments of the present disclosure may be referred to as a flexible vibration structure, flexible vibrator, flexible vibration generating device, flexible vibration generator, flexible sound generator, flexible sound device, flexible sound generating device, flexible sound generator, flexible actuator, flexible exciter, or flexible transducer, etc., but embodiments of the present disclosure are not limited thereto.

[0069] One or more vibration devices 131 according to embodiments of this disclosure may include a quadrilateral shape having a first length parallel to a first direction X and a second length parallel to a second direction Y intersecting the first direction X. For example, one or more vibration devices 131 may include a square shape with the first length and the second length being the same. However, embodiments of this disclosure are not limited thereto, and one or more vibration devices 131 may include a rectangular shape, a non-quadrilateral shape, a circular shape, or an elliptical shape where one of the first length and the second length is greater than the other.

[0070] According to embodiments of this disclosure, the vibration device 130 can be connected or coupled to the second surface of the vibration member 110 via the adhesive member 120.

[0071] An adhesive member 120 may be disposed between the vibrating member 110 and the vibrating device 130. For example, the adhesive member 120 may be disposed between the vibrating member 110 and one or more vibrating devices 131. For example, the adhesive member 120 may connect or couple one or more vibrating devices 131 to the second surface of the vibrating member 110.

[0072] The adhesive member 120 according to embodiments of this disclosure may include an adhesive layer (or adhesive layer) with good adhesion or bonding strength. For example, the adhesive member 120 may include double-sided tape, double-sided foam pad, or adhesive sheet. For example, when the adhesive member 120 includes an adhesive sheet (or adhesive layer), the adhesive member 120 may include only the adhesive layer or adhesive layer without including a base member such as a plastic material.

[0073] The adhesive layer (or adhesive layer) of the adhesive member 120 according to embodiments of the present disclosure may include epoxy resin, acrylic resin, silicone resin or polyurethane, but embodiments of the present disclosure are not limited thereto.

[0074] According to another embodiment of the present disclosure, the adhesive layer (or adhesive layer) of the adhesive member 120 may include pressure-sensitive adhesive (PSA), optically transparent adhesive (OCA), or optically transparent resin (OCR), but the embodiments of the present disclosure are not limited thereto.

[0075] The sound device 10 according to embodiments of this disclosure may further include a housing 150 and a connecting member 140.

[0076] The housing 150 may be disposed on the rear surface of the vibrating member 110 to cover the second surface of the vibrating member 110 and one or more vibrating devices 131. The housing 150 may include a receiving space 150s for accommodating the vibrating devices 130 and may have a box-shaped shape with an opening on one side. In addition, the opening on one side of the receiving space 150s is covered by the vibrating member 110, and a predetermined air gap may be formed between the receiving space 150s and the vibrating member 110.

[0077] The housing 150 according to embodiments of this disclosure may include one or more of metallic and non-metallic materials (or composite non-metallic materials), but embodiments of this disclosure are not limited thereto. For example, housing 150 may include one or more of metallic, plastic, and wood materials, but embodiments of this disclosure are not limited thereto. For example, housing 150 may be referred to by terms such as shell, outer shell, shell component, enclosure, cabinet, cover, sealing component, sealing cap, sealing box, or speaker, but embodiments of this disclosure are not limited thereto. For example, the receiving space 150s of housing 150 may be referred to by terms such as gap space, air gap, vibration space, sound space, speaker, or sealed space, but embodiments of this disclosure are not limited thereto.

[0078] According to embodiments of this disclosure, the housing 150 can retain the air-based impedance component acting on the vibrating member 110 when it vibrates. For example, the air near the vibrating member 110 can resist the vibration of the vibrating member 110 and can act as an impedance component having a reactive component and a frequency-based resistance. Therefore, the housing 150 can be configured to surround the vibrating device 130, and thus can retain the impedance component (or air impedance or acoustic impedance) acting on the vibrating member 110 due to air, thereby enhancing the sound characteristics and / or sound pressure level characteristics of the low-pitched vocal cords generated by the vibration of the vibrating member 110, and enhancing the sound quality of the high-pitched vocal cords generated by the vibration of the vibrating member 110.

[0079] The housing 150 according to embodiments of this disclosure may include a bottom 151 and a side 152.

[0080] The bottom 151 may be disposed on the rear surface of the vibrating member 110 to cover the second surface of the vibrating member 110 and the vibrating device 130. For example, the bottom 151 may be configured to be spaced apart from the second surface of the vibrating member 110 and the vibrating device 130. For example, the bottom 151 may be referred to by terms such as housing plate or housing bottom, but embodiments of this disclosure are not limited thereto.

[0081] Side portion 152 may be connected to the outer peripheral portion of bottom portion 151. For example, side portion 152 may bend from the outer peripheral portion of bottom portion 151 along a third direction Z parallel to the thickness direction of vibrating member 110. For example, side portion 152 may include a first side portion to a fourth side portion. For example, side portion 152 may be referred to as housing side surface or housing sidewall, etc., but embodiments of the present disclosure are not limited thereto.

[0082] The side portion 152 can be integrated into the bottom portion 151. For example, the bottom portion 151 and the side portion 152 can be integrated as one piece, and thus, the receiving space 150s surrounded by the side portion 152 can be provided on the bottom portion 151. Therefore, the bottom portion 151 and the side portion 152 can have a box-shaped shape with an opening on one side.

[0083] Side portion 152 can be connected to or coupled to the second surface of vibrating member 110 via connecting member 140. For example, side portion 152 can be connected to or coupled to the outer peripheral portion of the second surface of vibrating member 110 via connecting member 140.

[0084] According to embodiments of this disclosure, when the housing 150 includes a side portion 152, the connecting member 140 may be disposed between the side portion 152 of the housing 150 and the vibration member protrusion 111 of the vibration member 110. For example, the connecting member 140 may connect or couple one end of the side portion 152 of the housing 150 and one end of the vibration member protrusion 111.

[0085] According to embodiments of this disclosure, the connecting member 140 disposed between the housing 150 and the vibrating member 110 can be configured to minimize or prevent the transmission of vibrations from the vibrating member 110 to the housing 150. The connecting member 140 may include material properties suitable for blocking vibrations. For example, the connecting member 140 may include a resilient material. For example, the connecting member 140 may include a material with elasticity for vibration absorption (or shock absorption). The connecting member 140 according to embodiments of this disclosure may be configured as a polyurethane material or a polyolefin material, but embodiments of this disclosure are not limited thereto. For example, the connecting member 140 according to embodiments of this disclosure may include one or more of double-sided polyurethane tape, double-sided polyurethane foam tape, or double-sided sponge tape.

[0086] According to embodiments of this disclosure, the connecting member 140 may have a thickness for minimizing or preventing the transmission of vibrations from the vibrating member 110 to the housing 150. The connecting member 140 may absorb vibrations from the vibrating member 110 based on its thickness and elasticity, thereby minimizing or preventing the transmission of vibrations from the vibrating member 110 to the housing 150. Furthermore, the connecting member 140 may prevent physical contact (or friction) between the vibrating member 110 and the housing 150, and therefore, may prevent the occurrence of noise (or jarring noise) caused by physical contact (or friction) between the vibrating member 110 and the housing 150. For example, the connecting member 140 may be referred to as a buffer member, elastic member, damping member, vibration absorbing member, or vibration blocking member, etc., but embodiments of this disclosure are not limited thereto.

[0087] According to embodiments of this disclosure, one or more vibration devices 131 can vibrate based on a vibration drive signal (or sound signal or speech signal) provided from a sound processing circuit to cause the vibrating member 110 to vibrate, thereby generating or outputting sound. In the sound generated based on the vibration of the vibrating member 110, the sound pressure level characteristics can be increased based on the vibration of the vibrating member 110 having various inherent vibration frequencies, and the reproducible tone vocal cords can be expanded.

[0088] Since the vibrating member 110 of the sound device 10 according to the embodiments of this disclosure also includes a vibrating member protrusion 111, the sound output characteristics of the sound device 10 can be improved, and more specifically, the drop phenomenon can be reduced and the sound characteristics can be enhanced. The drop phenomenon can be the phenomenon of preventing the occurrence of a specific frequency and generating a low sound pressure level. The sound output characteristics of the sound device 10 can be reduced by the drop phenomenon.

[0089] Figure 3 It is along Figure 1 Another cross-sectional view taken by line A-A' is shown in the figure. Figure 3 A sound device according to another embodiment of the present disclosure is shown, and modifications are also shown. Figure 2 The implementation method is based on the structure of the housing. Therefore, in the following description, repeated descriptions of other components besides the vibrating member and the housing, as well as related components, can be omitted.

[0090] Reference Figure 3 The housing 150 may further include a recess 153 formed inwardly from the side portion 152, and the recess 153 of the housing 150 may accommodate and fix the vibration member protrusion 111 of the vibration member 110. Additionally, according to embodiments of the present disclosure, the connecting member 140 may include a first connecting member 141 between the first surface of the vibration member 110 and the recess 153 of the housing 150, and a second connecting member 143 between the vibration member protrusion 111 and the recess 153 of the housing 150. According to embodiments of the present disclosure, the first connecting member 141 and the second connecting member 143 may be made of the same material as the connecting member 140.

[0091] According to embodiments of this disclosure, the vibrating member 110 can be fixed by the recess 153 or inserted into the recess 153. For example, since both ends of the vibrating member 110 are fixed by the recess 153, the reflected wave can be deflected at both ends of the vibrating member 110, and therefore, the peak or drop phenomenon of the sound characteristics caused by standing waves can be reduced, and the sound characteristics of the low-pitched vocal bands can be enhanced. The peak can be a phenomenon of the sound pressure level bouncing at a specific frequency, while the drop can be a phenomenon of a low pressure level due to the prevention of the occurrence of a specific frequency. The sound output characteristics of the sound device can be reduced by the peak or drop phenomenon. In detail, in another embodiment of the sound device according to this disclosure, the sound characteristics of the low-pitched vocal bands can be enhanced, and the drop phenomenon of the mid-pitched vocal bands and the drop phenomenon of the high-pitched vocal bands can be reduced. For example, the low-pitched sound can be in the frequency range of 500 Hz or less, the mid-pitched vocal bands can be in the frequency range of 500 Hz to 2000 Hz, and the high-pitched vocal bands can be in the frequency range of 2000 Hz to 20000 Hz. However, the frequency range of the mid-tone vocal cords and mid-high-tone vocal cords according to the embodiments of this disclosure is not limited thereto.

[0092] Figure 4 A vibration device according to an embodiment of the present disclosure is shown. Figure 5 It is along Figure 4 The cross-sectional view taken by line B-B' shown in the figure, and Figure 6 yes Figure 5 The image shows a three-dimensional view of the piezoelectric vibrating part. Figures 4 to 6 It shows Figures 1 to 3 Another embodiment of the vibration device shown in one or more of them.

[0093] Reference Figures 4 to 6 The vibration device 131 according to the embodiments of this disclosure may be called a flexible vibration structure, flexible vibrator, flexible vibration generating device, flexible vibration generator, flexible sound generator, flexible sound device, flexible sound generating device, flexible sound generator, flexible actuator, flexible loudspeaker, flexible piezoelectric loudspeaker, membrane actuator, membrane piezoelectric composite actuator, membrane loudspeaker, membrane piezoelectric loudspeaker or membrane piezoelectric composite loudspeaker, etc., but the embodiments of this disclosure are not limited to these.

[0094] The vibration device 131 according to the embodiments of the present disclosure may include a vibration generating part having a piezoelectric vibration part 131a, a first electrode part 131b and a second electrode part 131c.

[0095] The piezoelectric vibrating section 131a may include a piezoelectric material (or electroactive material) incorporating the piezoelectric effect. For example, the piezoelectric material may have the characteristic that when pressure or twisting (or bending) is applied to the crystal structure by an external force, a potential difference arises due to dielectric polarization caused by the change in the relative positions of positive (+) ions and negative (-) ions, and vibration is generated by an electric field based on the reverse voltage applied thereto. The piezoelectric vibrating section 131a may be referred to as a vibrating layer, piezoelectric layer, piezoelectric material layer, electroactive layer, vibrating section, piezoelectric material section, electroactive section, piezoelectric structure, piezoelectric composite layer, piezoelectric composite material, or piezoelectric ceramic composite material, etc., but embodiments of this disclosure are not limited thereto. The piezoelectric vibrating section 131a may be formed of a transparent, translucent, or opaque piezoelectric material (or electroactive material), and may be transparent, translucent, or opaque.

[0096] The piezoelectric vibrating section 131a according to embodiments of the present disclosure may include a plurality of first portions 131a1 and a plurality of second portions 131a2. For example, the plurality of first portions 131a1 and the plurality of second portions 131a2 may be arranged alternately and repeatedly along a first direction X (or a second direction Y). For example, the first direction X may be the width direction of the piezoelectric vibrating section 131a, and the second direction Y may be the length direction of the piezoelectric vibrating section 131a, but embodiments of the present disclosure are not limited thereto. For example, the first direction X may be the length direction of the piezoelectric vibrating section 131a, and the second direction Y may be the width direction of the piezoelectric vibrating section 131a.

[0097] Each of the plurality of first portions 131a1 may be configured as an inorganic material portion. The inorganic material portion may include a piezoelectric material, a composite piezoelectric material, or an electroactive material that includes a piezoelectric effect.

[0098] Each of the plurality of first portions 131a1 can be configured as a ceramic matrix material for generating relatively high vibrations, or can be configured as a piezoelectric ceramic having a perovskite-based crystal structure. The perovskite crystal structure can exhibit both piezoelectric and inverse piezoelectric effects and can be an oriented plate-like structure. The perovskite crystal structure can be represented by the chemical formula "ABO3". In the chemical formula, "A" can include a divalent metal element, and "B" can include a tetravalent metal element. For example, in the chemical formula "ABO3", "A" and "B" can be cations, and "O" can be an anion. For example, each of the plurality of first portions 131a1 can include at least one or more of lead(II) titanate (PbTiO3), lead zirconate (PbZrO3), lead zirconate titanate (PbZrTiO3), barium titanate (BaTiO3), and strontium titanate (SrTiO3), but embodiments of this disclosure are not limited thereto.

[0099] The first portion 131a1 of the piezoelectric vibrating section 131a according to embodiments of the present disclosure may include a lead zirconate titanate (PZT)-based material containing lead (Pb), zirconium (Zr), and titanium (Ti); or it may include a nickel lead zirconate niobate (PZNN)-based material containing lead (Pb), zirconium (Zr), nickel (Ni), and niobium (Nb), but embodiments of the present disclosure are not limited thereto. Additionally, the first portion 131a1 of the piezoelectric vibrating section 131a may include at least one or more of calcium titanate (CaTiO3), BaTiO3, and SrTiO3, none of which contain lead (Pb), but embodiments of the present disclosure are not limited thereto.

[0100] Each of the plurality of first portions 131a1 according to embodiments of the present disclosure may be disposed between a plurality of second portions 131a2 and may have a first width W1 parallel to a first direction X (or a second direction Y) and a length parallel to a second direction Y (or a first direction X). Each of the plurality of second portions 131a2 may have a second width W2 parallel to a first direction X (or a second direction Y) and may have a length parallel to a second direction Y (or a first direction X). The first width W1 may be the same as or different from the second width W2. For example, the first width W1 may be greater than the second width W2. For example, the first portions 131a1 and the second portions 131a2 may include line shapes or strip shapes having the same size or different sizes. Therefore, the piezoelectric vibrating portion 131a may include a 2-2 composite structure with piezoelectric characteristics having 2-2 vibration modes, and thus may have a resonant frequency of 20 kHz or less, but embodiments of the present disclosure are not limited thereto. For example, the resonant frequency of the piezoelectric vibrating portion 131a may vary based on at least one or more of the shape, length, and thickness, etc.

[0101] In the piezoelectric vibrating section 131a, each of the plurality of first portions 131a1 and the plurality of second portions 131a2 can be arranged (or arranged) in parallel on the same plane (or the same layer). Each of the plurality of second portions 131a2 can be configured to fill the gap between two adjacent first portions of the plurality of first portions 131a1 and can be connected or adhered to the adjacent second portion 131a2. Therefore, the piezoelectric vibrating section 131a can extend to a desired size or length based on the side coupling (or connection) of the first portions 131a1 and the second portions 131a2.

[0102] In the piezoelectric vibrating section 131a, the width (or dimension) W2 of each of the plurality of second parts 131a2 can gradually decrease in the direction from the center portion of the piezoelectric vibrating section 131a or the vibration device 131 to the two outer peripheries (or ends).

[0103] According to embodiments of this disclosure, the second portion 131a2 with the largest width W2 among the plurality of second portions 131a2 can be located at the portion where the maximum stress may be concentrated when the piezoelectric vibrating part 131a or the vibrating device 131 vibrates in the vertical direction Z (or the thickness direction). The second portion 131a2 with the smallest width W2 among the plurality of second portions 131a2 can be located at the portion where relatively low stress may occur when the piezoelectric vibrating part 131a or the vibrating device 131 vibrates in the vertical direction Z. For example, the second portion 131a2 with the largest width W2 among the plurality of second portions 131a2 can be provided at the central portion of the piezoelectric vibrating part 131a, and the second portion 131a2 with the smallest width W2 among the plurality of second portions 131a2 can be provided at each of the two outer peripheries of the piezoelectric vibrating part 131aa. Therefore, when the piezoelectric vibrating part 131a or the vibrating device 131 vibrates in the vertical direction Z, interference of sound waves or overlap of resonant frequencies that both occur in the portion where the highest stress is concentrated can be reduced or minimized. Therefore, the drop in sound pressure level in the low-pitched vocal cords can be reduced, thereby improving the flatness of the sound characteristics in the low-pitched vocal cords.

[0104] In the piezoelectric vibrating section 131a, each of the plurality of first portions 131a1 may have a different size (or width). For example, the size (or width) of each of the plurality of first portions 131a1 may gradually decrease or increase in the direction from the center portion of the piezoelectric vibrating section 131a or the two outer peripheries (or two ends). Therefore, in the piezoelectric vibrating section 131a, based on the various inherent vibration frequencies of the vibrations of each of the plurality of first portions 131a1 with different sizes, the sound pressure level characteristics of the sound can be enhanced and the sound reproduction band can be increased.

[0105] Multiple second portions 131a2 can be disposed between multiple first portions 131a1. Therefore, in the piezoelectric vibrating section 131a or vibrating device 131, the vibrational energy linked by the unit lattice of each first portion 131a1 can be increased by the corresponding second portion 131a2, thus increasing the vibrational characteristics and improving the piezoelectric properties and flexibility of the piezoelectric vibrating section 131a or vibrating device 131. For example, the second portion 131a2 may include one or more of epoxy-based polymers, acrylic polymers, and silicone polymers, but embodiments of this disclosure are not limited thereto.

[0106] According to embodiments of this disclosure, multiple second portions 131a2 can be configured as organic material portions. For example, the organic material portions can be disposed between the inorganic material portions and thus can absorb impacts applied to the inorganic material portions (or the first portions), can release stress concentrated on the inorganic material portions to enhance the overall durability of the piezoelectric vibrator 131a or the vibration device 131, and can provide flexibility to the piezoelectric vibrator 131a or the vibration device 131.

[0107] According to embodiments of this disclosure, the plurality of second portions 131a2 may have a modulus (or Young's modulus) and viscoelasticity less than that of each first portion 131a1, thus the second portions 131a2 may enhance the reliability of each first portion 131a1 which is susceptible to impact due to its fragile nature. For example, the second portions 131a2 may be configured as materials having a loss coefficient of about 0.01 to about 1 and a modulus of about 0.1 GPa to about 10 GPa.

[0108] The organic material portion disposed in the second part 131a2 may include one or more of organic materials, organic polymers, organic piezoelectric materials, and organic non-piezoelectric materials that have flexible properties compared to the inorganic material portion of the first part 131a1. For example, the second part 131a2 may be referred to as an adhesive portion, an elastic portion, a bending portion, a damping portion, or a flexible portion that is flexible in all these aspects, but embodiments of this disclosure are not limited thereto.

[0109] The second part 131a2 and the plurality of first parts 131a1 can be disposed on the same plane (or connected to the same plane), and therefore, the piezoelectric vibrating part 131a according to the embodiments of the present disclosure can have a single thin film type. For example, the piezoelectric vibrating part 131a can have a structure in which the plurality of first parts 131a1 are connected to one side. For example, the plurality of first parts 131a1 can have a structure connected to the entire piezoelectric vibrating part 131a. For example, the piezoelectric vibrating part 131a can be vibrated vertically by the first parts 131a1 having vibration characteristics, and can be bent into an arc shape by the elastic second parts 131a2. Furthermore, in the piezoelectric vibrating part 131a according to the embodiments of the present disclosure, the dimensions of the first parts 131a1 and the second parts 131a2 can be adjusted based on the piezoelectric characteristics and flexibility required by the piezoelectric vibrating part 131a or the vibration device 131. As an embodiment of this disclosure, when the piezoelectric vibrating part 131a requires piezoelectric properties rather than flexibility, the size of the first portion 131a1 can be adjusted to be larger than the size of the second portion 131a2. As another embodiment of this disclosure, when the piezoelectric vibrating part 131a requires flexibility rather than piezoelectric properties, the size of the second portion 131a2 can be adjusted to be larger than the size of the first portion 131a1. Therefore, the size of the piezoelectric vibrating part 131a can be adjusted based on its required properties, thus making the piezoelectric vibrating part 131a easy to design.

[0110] The first electrode portion 131b may be disposed on the first surface (or upper surface) of the piezoelectric vibrating portion 131a. The first electrode portion 131b may be disposed together on the first surface of each of the plurality of first portions 131a1 and the first surface of each of the plurality of second portions 131a2, or coupled to the first surface of each of the plurality of first portions 131a1 and the first surface of each of the plurality of second portions 131a2, and may be electrically connected to the first surface of each of the plurality of first portions 131a1. For example, the first electrode portion 131b may have a shape substantially the same as that of the piezoelectric vibrating portion 131a, but embodiments of this disclosure are not limited thereto.

[0111] The first electrode portion 131b according to embodiments of this disclosure may be formed of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the transparent or semi-transparent conductive material may include indium tin oxide (ITO) or indium zinc oxide (IZO), but embodiments of this disclosure are not limited thereto. The opaque conductive material may include aluminum (Al), copper (Cu), gold (Au), silver (Ag), molybdenum (Mo), magnesium (Mg), or any alloy thereof, but embodiments of this disclosure are not limited thereto.

[0112] The second electrode portion 131c can be disposed on a second surface (or rear surface) of the piezoelectric vibrating portion 131a that is different from (or opposite to) the first surface. The second electrode portion 131c can be commonly disposed on the second surface of each of the plurality of first portions 131a1 and the second surface of each of the plurality of second portions 131a2, or coupled to the second surface of each of the plurality of first portions 131a1 and the second surface of each of the plurality of second portions 131a2, and can be electrically connected to the second surface of each of the plurality of first portions 131a1. For example, the second electrode portion 131c can be in the shape of a single electrode (or a common electrode), and the second electrode portion 131c is disposed on the entire second surface of the piezoelectric vibrating portion 131a. The second electrode portion 131c can have the same shape as the piezoelectric vibrating portion 131a, but embodiments of this disclosure are not limited thereto. According to embodiments of this disclosure, the second electrode portion 131c can be formed of a transparent conductive material, a semi-transparent conductive material, or an opaque conductive material. For example, the second electrode portion 131c may be formed of the same material as the first electrode portion 131b, but the embodiments of this disclosure are not limited thereto. As another embodiment of this disclosure, the second electrode portion 131c may be formed of a different material than the first electrode portion 131b.

[0113] The piezoelectric vibrating section 131a can be polarized (or polarized) by applying a specific voltage to the first electrode section 131b and the second electrode section 131c in a specific temperature atmosphere or in a temperature atmosphere that can be changed from high temperature to room temperature, but the embodiments of this disclosure are not limited thereto. For example, the piezoelectric vibrating section 131a can vibrate by alternately and repeatedly contracting and expanding based on the inverse piezoelectric effect according to an externally applied sound signal (or voice signal) to the first electrode section 131b and the second electrode section 131c. For example, the piezoelectric vibrating section 131a can vibrate based on the vertical vibration and planar vibration of the first electrode section 131b and the second electrode section 131c. The piezoelectric vibrating section 131a can further improve the vibration by increasing the displacement of the vibrating member (or vibrating plate or vibrating object) through planar contraction and expansion.

[0114] The vibration device 131 according to the embodiments of this disclosure may further include a first cover member 131d and a second cover member 131e.

[0115] The first cover member 131d may be disposed on the first surface of the vibration device 131. For example, the first cover member 131d may be configured to cover the first electrode portion 131b. Accordingly, the first cover member 131d may protect the first electrode portion 131b.

[0116] The second cover member 131e may be disposed on the second surface of the vibration device 131. For example, the second cover member 131e may be configured to cover the second electrode portion 131c. Accordingly, the second cover member 131e may protect the second electrode portion 131c.

[0117] The first cover member 131d and the second cover member 131e according to embodiments of this disclosure may each comprise one or more materials selected from plastic, fiber, and wood; however, embodiments of this disclosure are not limited thereto. For example, each of the first cover member 131d and the second cover member 131e may comprise the same or different materials. For example, each of the first cover member 131d and the second cover member 131e may be a polyimide (PI) film or a polyethylene terephthalate (PET) film; however, embodiments of this disclosure are not limited thereto.

[0118] According to embodiments of this disclosure, the first cover member 131d can be connected or coupled to the first electrode portion 131b via a first adhesive layer 131f. For example, the first cover member 131d can be connected or coupled to the first electrode portion 131b via a thin film lamination process using the first adhesive layer 131f.

[0119] According to embodiments of this disclosure, the second cover member 131e can be connected or coupled to the second electrode portion 131c via the second adhesive layer 131g. For example, the second cover member 131e can be connected or coupled to the second electrode portion 131c via a thin film lamination process using the second adhesive layer 131g.

[0120] A first adhesive layer 131f may be disposed between the first electrode portion 131b and the first cover member 131d. A second adhesive layer 131g may be disposed between the second electrode portion 131c and the second cover member 131e. For example, the first adhesive layer 131f and the second adhesive layer 131g may be disposed between the first cover member 131d and the second cover member 131e to completely surround the piezoelectric vibrating portion 131a, the first electrode portion 131b, and the second electrode portion 131c. For example, the piezoelectric vibrating portion 131a, the first electrode portion 131b, and the second electrode portion 131c may be embedded or built into the first adhesive layer 131f and the second adhesive layer 131g.

[0121] Each of the first adhesive layer 131f and the second adhesive layer 131g according to embodiments of the present disclosure may include an electrically insulating material that is adhesive and capable of compression and decompression. For example, each of the first adhesive layer 131f and the second adhesive layer 131g may include an epoxy resin, an acrylic resin, a silicone resin, or a polyurethane resin, but embodiments of the present disclosure are not limited thereto.

[0122] According to embodiments of this disclosure, either the first cover member 131d or the second cover member 131e can be attached or coupled to a vibrating member (or vibrating plate or vibrating object) via an adhesive member. For example, either the first cover member 131d or the second cover member 131e can be attached or coupled to a vibrating member (or vibrating plate or vibrating object) via the reference above. Figures 1 to 3 The described adhesive member 120 is attached to or coupled to the vibrating member 110.

[0123] The vibration device 131 according to the embodiments of the present disclosure may further include a first power line PL1 disposed at the first cover member 131d, a second power line PL2 disposed at the second cover member 131e, and a pad portion 131p electrically connected to the first power line PL1 and the second power line PL2.

[0124] A first power line PL1 may be disposed between the first electrode portion 131b and the first cover member 131d, and may be electrically connected to the first electrode portion 131b. The first power line PL1 may extend along the second direction Y and may be electrically connected to the central portion of the first electrode portion 131b. As an embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 131b via an anisotropic conductive film. As another embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 131b via a conductive material (or particles) included in the first adhesive layer 131f.

[0125] The second power line PL2 can be disposed between the second electrode portion 131c and the second cover member 131e, and can be electrically connected to the second electrode portion 131c. The second power line PL2 can extend along the second direction Y and can be electrically connected to the central portion of the second electrode portion 131c. As an embodiment of the present disclosure, the second power line PL2 can be electrically connected to the second electrode portion 131c through an anisotropic conductive film. As another embodiment of the present disclosure, the second power line PL2 can be electrically connected to the second electrode portion 131c through a conductive material (or particles) included in the second adhesive layer 131g.

[0126] The pad portion 131p may be configured at an outer peripheral portion of either the first cover member 131d or the second cover member 131e to be electrically connected to a portion (or an end) of each of the first power line PL1 and the second power line PL2.

[0127] According to embodiments of the present disclosure, the pad portion 131p may include a first pad electrode electrically connected to one end of a first power line PL1, and a second pad electrode electrically connected to one end of a second power line PL2.

[0128] The first pad electrode may be disposed at an outer peripheral portion of either the first cover member 131d or the second cover member 131e to be electrically connected to a portion of the first power line PL1. For example, the first pad electrode may pass through either the first cover member 131d or the second cover member 131e to be electrically connected to a portion of the first power line PL1.

[0129] The second pad electrode can be arranged parallel to the first pad electrode to be electrically connected to a portion of the second power line PL2. For example, the second pad electrode can pass through either the first cover member 131d or the second cover member 131e to be electrically connected to a portion of the second power line PL2.

[0130] According to embodiments of this disclosure, each of the first power line PL1, the second power line PL2, and the pad portion 131p can be configured to be transparent, semi-transparent, or opaque.

[0131] According to another embodiment of this disclosure, the pad portion 131p can be electrically connected to the signal cable 132.

[0132] The signal cable 132 can be electrically connected to the pad portion 131p disposed at the vibration device 131, and can supply the vibration device 131 with a vibration drive signal (or sound signal or voice signal) provided from the sound processing circuit. According to embodiments of this disclosure, the signal cable 132 may include a first terminal electrically connected to a first pad electrode of the pad portion 131p and a second terminal electrically connected to a second pad electrode of the pad portion 131p. For example, the signal cable 132 may be configured as a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board, but embodiments of this disclosure are not limited thereto.

[0133] The sound processing circuit can generate an AC vibration drive signal, including a first vibration drive signal and a second vibration drive signal, based on sound data provided by an external sound data generation circuit. The first vibration drive signal can be either a positive (+) vibration drive signal or a negative (-) vibration drive signal, and the second vibration drive signal can also be either a positive (+) vibration drive signal or a negative (-) vibration drive signal. For example, the first vibration drive signal can be supplied to the first electrode section 131b via the first terminal of the signal cable 132, the first pad electrode of the pad section 131p, and the first power line PL1. The second vibration drive signal can be supplied to the second electrode section 131c via the second terminal of the signal cable 132, the second pad electrode of the pad section 131p, and the second power line PL2.

[0134] According to embodiments of this disclosure, the signal cable 132 may be configured to be transparent, semi-transparent, or opaque.

[0135] As described above, the vibration device 131 according to the embodiments of this disclosure can be implemented as a thin film type, wherein a first portion 131a1 having piezoelectric properties and a second portion 131a2 having flexibility are alternately repeated and connected, thus allowing it to be bent into a shape corresponding to the shape of the vibrating member or vibrating object. For example, when the vibration device 131 is connected or coupled to a vibrating member including various curved portions via an adhesive member 120, the vibration device 131 can be bent along the shape of the curved portion of the vibrating member, and despite being bent into a curved shape, its reliability against damage or failure may not be reduced.

[0136] Figures 7A to 7D This is a perspective view showing a piezoelectric vibrating section in a vibration device according to an embodiment of the present disclosure, and another embodiment of the present disclosure.

[0137] Reference Figure 7A According to another embodiment of the present disclosure, the piezoelectric vibration unit 131a may include a plurality of first portions 131a1 spaced apart from each other along a first direction X and a second direction Y, and a second portion 131a2 (or one or more second portions) disposed between the plurality of first portions 131a1.

[0138] Each of the plurality of first portions 131a1 may be configured to be spaced apart from each other along a first direction X and a second direction Y. For example, each of the plurality of first portions 131a1 may have a hexahedral shape (or a hexahedral shape) having the same dimensions and may be configured in a lattice shape. Each of the plurality of first portions 131a1 may include a piezoelectric material, which is consistent with the above reference. Figures 4 to 6 The first part 131a1 of the description is substantially the same, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0139] The second portion 131a2 may be disposed between the plurality of first portions 131a1 along each of the first direction X and the second direction Y. The second portion 131a2 may be configured to fill the gap or space between two adjacent first portions 131a1 or to surround each of the plurality of first portions 131a1, and thus may be connected to or adhered to adjacent first portions 131a1. According to embodiments of the present disclosure, the width of the second portion 131a2 disposed between two adjacent first portions 131a1 along the first direction X may be the same as or different from the width of the first portions 131a1, and the width of the second portion 131a2 disposed between two adjacent first portions 131a1 along the second direction Y may be the same as or different from the width of the first portions 131a1. The second portion 131a2 may include an organic material, which is the same as described above. Figures 4 to 6 The second part 131a2 is substantially the same as described, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0140] As described above, the piezoelectric vibrating section 131a according to another embodiment of the present disclosure may include a 1-3 composite structure having piezoelectric characteristics with 1-3 vibration modes, and therefore may have a resonant frequency of 30 MHz or lower, but the embodiments of the present disclosure are not limited thereto. For example, the resonant frequency of the piezoelectric vibrating section 131a may vary based on at least one or more of the shape, length, and thickness.

[0141] Reference Figure 7B According to another embodiment of the present disclosure, the piezoelectric vibration unit 131a may include a plurality of first portions 131a1 spaced apart from each other along a first direction X and a second direction Y, and a second portion (or one or more second portions) 131a2 disposed between the plurality of first portions 131a1.

[0142] Each of the plurality of first portions 131a1 may have a circular, flat structure. For example, each of the plurality of first portions 131a1 may have a circular plate shape, but embodiments of this disclosure are not limited thereto. For example, each of the plurality of first portions 131a1 may have a dotted shape including an oval, polygonal, or donut shape. Each of the plurality of first portions 131a1 may include a piezoelectric material, which is similar to the material referenced above. Figures 4 to 6 The first part 131a1 of the description is substantially the same, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0143] The second portion 131a2 may be disposed between the plurality of first portions 131a1 along each of the first direction X and the second direction Y. The second portion 131a2 may be configured to surround each of the plurality of first portions 131a1, and thus may be attached to or adhered to the side surface of each of the plurality of first portions 131a1. Each of the plurality of first portions 131a1 and the second portion 131a2 may be disposed (or arranged) in parallel on the same plane (or the same layer). The second portion 131a2 may include an organic material, which is consistent with the description above. Figures 4 to 6 The second part 131a2 is substantially the same as described, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0144] Reference Figure 7C In another embodiment of the vibration device 131 according to the present disclosure, the piezoelectric vibration part 131a may include a plurality of first parts 131a1 spaced apart from each other along a first direction X and a second direction Y, and a second part (or one or more second parts) 131a2 disposed between the plurality of first parts 131a1.

[0145] Each of the plurality of first portions 131a1 may have a flat structure in the shape of a triangle. For example, each of the plurality of first portions 131a1 may have a triangular shape. Each of the plurality of first portions 131a1 may include a piezoelectric material, which is similar to the material referenced above. Figures 4 to 6 The first part 131a1 of the description is substantially the same, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0146] According to embodiments of this disclosure, four adjacent first portions 131a1 of a plurality of first portions 131a1 may be adjacent to each other to form a quadrilateral shape (or a square shape or a quadrilateral shape). The vertices of the four adjacent first portions 131a1 forming the quadrilateral shape may be adjacent to each other at the center portion (or central portion) of the quadrilateral.

[0147] The second portion 131a2 may be disposed between the plurality of first portions 131a1 along each of the first direction X and the second direction Y. The second portion 131a2 may be configured to surround each of the plurality of first portions 131a1, and thus may be attached to or adhered to the side surface of each of the plurality of first portions 131a1. Each of the plurality of first portions 131a1 and the second portion 131a2 may be disposed (or arranged) in parallel on the same plane (or the same layer). The second portion 131a2 may include an organic material, which is consistent with the description above. Figures 4 to 6The second part 131a2 is substantially the same as described, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0148] Reference Figure 7D In another embodiment of the vibration device 131 according to the present disclosure, the piezoelectric vibration part 131a may include a plurality of first parts 131a1 spaced apart from each other along a first direction X and a second direction Y, and a second part (or one or more second parts) 131a2 disposed between the plurality of first parts 131a1.

[0149] Each of the plurality of first portions 131a1 may have a triangular, flat structure. For example, each of the plurality of first portions 131a1 may have a triangular shape. Each of the plurality of first portions 131a1 may include a piezoelectric material, which is similar to the material referenced above. Figures 4 to 6 The first part 131a1 of the description is substantially the same, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0150] According to another embodiment of this disclosure, six adjacent first portions 131a1 of a plurality of first portions 131a1 may be adjacent to each other to form a hexagonal shape (or a regular hexagonal shape). The vertices of the six adjacent first portions 131a1 forming the hexagonal shape may be adjacent to each other in the central portion (or central part) of the hexagon.

[0151] The second portion 131a2 may be disposed between the plurality of first portions 131a1 along each of the first direction X and the second direction Y. The second portion 131a2 may be configured to surround each of the plurality of first portions 131a1, and thus may be attached to or adhered to the side surface of each of the plurality of first portions 131a1. Each of the plurality of first portions 131a1 and the second portion 131a2 may be disposed (or arranged) in parallel on the same plane (or the same layer). The second portion 131a2 may include an organic material, which is consistent with the description above. Figures 4 to 6 The second part 131a2 is substantially the same as described, therefore, similar reference numerals can refer to similar elements and their repeated descriptions can be omitted.

[0152] Figure 8 A vibration device according to another embodiment of the present disclosure is shown. Figure 9 It is along Figure 8 The cross-sectional view taken by the C-C' line is shown in the figure. Figure 8 and Figure 9 It shows Figures 1 to 3 Another embodiment of one or more of the vibration devices shown.

[0153] Reference Figure 8 and Figure 9 According to another embodiment of the present disclosure, the vibration device 131 may include a first vibration generating unit 131-1 and a second vibration generating unit 131-2.

[0154] Each of the first vibration generating section 131-1 and the second vibration generating section 131-2 can be electrically isolated and configured, while being spaced apart from each other along the first direction X. Each of the first vibration generating section 131-1 and the second vibration generating section 131-2 can alternately and repeatedly contract and expand to vibrate based on the piezoelectric effect. For example, the first vibration generating section 131-1 and the second vibration generating section 131-2 can be arranged or laid flat along the first direction X at a certain interval (or distance) SD1. Therefore, the vibration device 131 in which the first vibration generating section 131-1 and the second vibration generating section 131-2 are laid flat can be a vibration array, a vibration array section, a vibration module array section, a vibration array structure, a laid-flat vibration array, a laid-flat vibration array module, or a laid-flat vibration film.

[0155] Each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 according to the embodiments of the present disclosure may have a quadrilateral shape. For example, each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 may have a quadrilateral shape with a width of approximately 5 cm or more. For example, each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 may have a square shape with dimensions of 5 cm × 5 cm or more, but the embodiments of the present disclosure are not limited thereto.

[0156] Each of the first vibration generating part 131-1 and the second vibration generating part 131-2 can be arranged or laid flat on the same plane, and thus the vibration device 131 can have an enlarged area based on the tiling of the first vibration generating part 131-1 and the second vibration generating part 131-2, which have relatively small dimensions.

[0157] Each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 can be arranged or laid out at a certain interval SD1, and can therefore be implemented as a vibration device (or a single vibration device) that is driven as a complete unit rather than being driven independently. According to the embodiments of the present disclosure, the first separation distance (or first interval) SD1 between the first vibration generating unit 131-1 and the second vibration generating unit 131-2 relative to the first direction X can be 0.1 mm or greater and less than 3 cm, but the embodiments of the present disclosure are not limited thereto.

[0158] According to embodiments of this disclosure, each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 can be arranged or tiled with a first separation distance (or interval) SD1 of 0.1 cm or more and less than 3 cm, and thus can be driven as a vibration device to increase the reproduction frequency band and sound pressure level characteristics of the sound generated based on the individual vibrations of the first vibration generating unit 131-1 and the second vibration generating unit 131-2. For example, the first vibration generating unit 131-1 and the second vibration generating unit 131-2 can be arranged in a first separation distance (or interval) SD1 of 0.1 mm or more and less than 5 mm to increase the reproduction frequency band of the sound generated based on the individual vibrations of the first vibration generating unit 131-1 and the second vibration generating unit 131-2, and to increase the sound in the low-pitched audio band (e.g., sound pressure level characteristics of 500 Hz or lower).

[0159] According to embodiments of this disclosure, when the first vibration generating part 131-1 and the second vibration generating part 131-2 are arranged in a gap SD1 of less than 0.1 mm or there is no gap SD1, the reliability of the first vibration generating part 131-1 and the second vibration generating part 131-2 or the vibration device 131 may be reduced due to damage or breakage caused by physical contact that occurs between each of the first vibration generating part 131-1 and the second vibration generating part 131-2 during vibration.

[0160] According to embodiments of this disclosure, when the first vibration generating unit 131-1 and the second vibration generating unit 131-2 are arranged at an interval SD1 of 3 cm or greater, since each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 vibrates independently, the first vibration generating unit 131-1 and the second vibration generating unit 131-2 do not need to be driven as a vibration device. Therefore, the reproduction frequency band and sound pressure level characteristics of the sound generated based on the vibration of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 can be reduced. For example, when the first vibration generating unit 131-1 and the second vibration generating unit 131-2 are arranged at an interval SD1 of 3 cm or greater, the low-pitched sound characteristics and sound pressure level characteristics (e.g., at 500 Hz or less) can be reduced.

[0161] According to embodiments of this disclosure, when the first vibration generating unit 131-1 and the second vibration generating unit 131-2 are arranged at a 5 mm interval SD1, each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 cannot be perfectly driven as a vibration device, and therefore, the sound characteristics and sound pressure level characteristics of the low-pitched audio band (e.g., at 200 Hz or lower) can be reduced.

[0162] According to another embodiment of this disclosure, when the first vibration generating unit 131-1 and the second vibration generating unit 131-2 are arranged at a 1 mm interval SD1, each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 can be driven as a vibration device, and thus, the sound reproduction frequency band can be increased and the sound of the low-pitched audio band can be increased (e.g., sound pressure level characteristics at 500 Hz or lower). For example, when the first vibration generating unit 131-1 and the second vibration generating unit 131-2 are arranged at a 1 mm interval SD1, the vibration device 131 can be implemented as a large-area vibrator, which is amplified based on the optimization of the separation distance between the first vibration generating unit 131-1 and the second vibration generating unit 131-2. Therefore, the vibration device 131 can be driven as a large-area vibrator based on the individual vibration of the first vibration generating part 131-1 and the second vibration generating part 131-2, and thus, the sound characteristics and sound pressure level characteristics can both increase the sound reproduction frequency band and the low-pitched sound frequency band generated based on the large-area vibration of the vibration device 131.

[0163] Therefore, in order to achieve individual vibration (or a single vibration device) of the first vibration generating unit 131-1 and the second vibration generating unit 131-2, the separation distance (or interval) SD1 between the first vibration generating unit 131-1 and the second vibration generating unit 131-2 can be adjusted to 0.1 mm or more and less than 3 cm. Furthermore, in order to achieve individual vibration (or a single vibration device) of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 and to improve the sound pressure level characteristics of the low-pitched audio band, the separation distance (or interval) SD1 between the first vibration generating unit 131-1 and the second vibration generating unit 131-2 can be adjusted to 0.1 mm or more and less than 5 mm.

[0164] Each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 according to the embodiments of the present disclosure may include a piezoelectric vibration unit 131a, a first electrode unit 131b, and a second electrode unit 131c.

[0165] The piezoelectric vibration section 131a of each of the first vibration generating section 131-1 and the second vibration generating section 131-2 may include a piezoelectric material (or an electroactive material) that includes a piezoelectric effect. For example, the piezoelectric vibration section 131a of each of the first vibration generating section 131-1 and the second vibration generating section 131-2 may be configured to be similar to the one described above. Figure 6 and Figures 7A to 7D Any of the piezoelectric vibrating parts 131a described are substantially the same; therefore, similar reference numerals may refer to similar elements and their repeated descriptions may be omitted.

[0166] According to embodiments of this disclosure, each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 may include the above-mentioned references. Figure 6 and Figures 7A to 7D The piezoelectric vibrating part 131a described may be any one of the piezoelectric vibrating parts 131a, or may include different piezoelectric vibrating parts 131a.

[0167] The first electrode portion 131b may be disposed on the first surface of the piezoelectric vibrating portion 131a and may be electrically connected to the first surface of the piezoelectric vibrating portion 131a. For example, the first electrode portion 131b may be the same as described above. Figure 5 The first electrode portion 131b described is substantially the same; therefore, similar reference numerals can refer to similar elements, and their repeated descriptions can be omitted.

[0168] The second electrode portion 131c can be disposed on the second surface of the piezoelectric vibrating portion 131a and electrically connected to the second surface of the piezoelectric vibrating portion 131a. The second electrode portion 131c can be referenced above. Figure 5 The second electrode section 131c described is substantially the same; therefore, similar reference numerals can refer to similar elements, and their repeated descriptions can be omitted.

[0169] According to another embodiment of the present disclosure, the vibration device 131 may further include a first cover member 131d and a second cover member 131e.

[0170] The first cover member 131d may be disposed on the first surface of the vibration device 131. For example, the first cover member 131d may cover the first electrode portion 131b, which is disposed on the first surface of each of the first vibration generating portions 131-1 and the second vibration generating portions 131-2, and thus the first cover member 131d may be connected to or support the first surface of each of the first vibration generating portions 131-1 and the second vibration generating portions 131-2. Therefore, the first cover member 131d may protect the first surface or the first electrode portion 131b of each of the first vibration generating portions 131-1 and the second vibration generating portions 131-2.

[0171] The second cover member 131e may be disposed on the second surface of the vibration device 131. For example, the second cover member 131e may cover the second electrode portion 131c, which is disposed on the second surface of each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2, and thus the second cover member 131e may be connected to or support the second surface of each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2. Therefore, the second cover member 131e may protect the second surface or the second electrode portion 131c of each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2.

[0172] The first cover member 131d and the second cover member 131e according to embodiments of this disclosure may both comprise one or more materials selected from plastic, fiber, and wood, but embodiments of this disclosure are not limited thereto. For example, each of the first cover member 131d and the second cover member 131e may comprise the same material or different materials. For example, each of the first cover member 131d and the second cover member 131e may be a polyimide (PI) film or a polyethylene terephthalate (PET) film, but embodiments of this disclosure are not limited thereto.

[0173] According to embodiments of the present disclosure, the first cover member 131d can be disposed on the first surface of each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2 via a first adhesive layer 131f. For example, the first cover member 131d can be directly disposed on the first surface of each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2 via a film lamination process using the first adhesive layer 131f. Therefore, each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2 can be integrated (or disposed) with or laid flat with the first cover member 131d at a certain interval SD1.

[0174] According to embodiments of the present disclosure, the second cover member 131e can be disposed on the second surface of each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2 via a second adhesive layer 131g. For example, the second cover member 131e can be directly disposed on the second surface of each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2 via a film lamination process using the second adhesive layer 131g. Therefore, each of the first vibration generating portion 131-1 and the second vibration generating portion 131-2 can be integrated (or disposed) with or laid flat with the second cover member 131e at a certain interval SD1.

[0175] The first adhesive layer 131f may be disposed between the first vibration generating part 131-1 and the second vibration generating part 131-2, and disposed on the first surface of each of the first vibration generating part 131-1 and the second vibration generating part 131-2. For example, the first adhesive layer 131f may be formed on the rear surface (or inner surface) of the first cover member 131d facing each of the first surfaces of the first vibration generating part 131-1 and the second vibration generating part 131-2, filling between the first vibration generating part 131-1 and the second vibration generating part 131-2, and disposed between the first cover member 131d and the first surface of each of the first vibration generating part 131-1 and the second vibration generating part 131-2.

[0176] The second adhesive layer 131g may be disposed between the first vibration generating part 131-1 and the second vibration generating part 131-2, and disposed on the second surface of each of the first vibration generating part 131-1 and the second vibration generating part 131-2. For example, the second adhesive layer 131g may be formed on the front surface (or inner surface) of the second surface of the second cover member 131e facing each of the first vibration generating part 131-1 and the second vibration generating part 131-2, filling between the first vibration generating part 131-1 and the second vibration generating part 131-2, and disposed between the second cover member 131e and the second surface of each of the first vibration generating part 131-1 and the second vibration generating part 131-2.

[0177] The first adhesive layer 131f and the second adhesive layer 131g can be connected or coupled to each other between the first vibration generating part 131-1 and the second vibration generating part 131-2. Therefore, each of the first vibration generating part 131-1 and the second vibration generating part 131-2 can be surrounded by the first adhesive layer 131f and the second adhesive layer 131g. For example, the first adhesive layer 131f and the second adhesive layer 131g can be disposed between the first cover member 131d and the second cover member 131e to completely surround the first vibration generating part 131-1 and the second vibration generating part 131-2. For example, each of the first vibration generating part 131-1 and the second vibration generating part 131-2 can be embedded or built into the space between the first adhesive layer 131f and the second adhesive layer 131g.

[0178] Each of the first adhesive layer 131f and the second adhesive layer 131g according to embodiments of the present disclosure may include an electrically insulating material that is viscous and capable of compression and decompression. For example, each of the first adhesive layer 131f and the second adhesive layer 131g may include an epoxy resin, an acrylic resin, a silicone resin, or a polyurethane resin, but embodiments of the present disclosure are not limited thereto. Each of the first adhesive layer 131f and the second adhesive layer 131g may be configured to be transparent, translucent, or opaque.

[0179] According to another embodiment of the present disclosure, the vibration device 131 may further include a first power line PL1 disposed at the first cover member 131d, a second power line PL2 disposed at the second cover member 131e, and a pad portion 131p electrically connected to the first power line PL1 and the second power line PL2.

[0180] A first power line PL1 may be disposed on the rear surface of the first surface of the first cover member 131d facing each of the first vibration generating parts 131-1 and 131-2. The first power line PL1 may be electrically connected to the first electrode portion 131b of each of the first vibration generating parts 131-1 and 131-2. For example, the first power line PL1 may be electrically connected and directly connected to the first electrode portion 131b of each of the first vibration generating parts 131-1 and 131-2. As an embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 131b of each of the first vibration generating parts 131-1 and 131-2 via an anisotropic conductive film. As another embodiment of this disclosure, the first power line PL1 may be electrically connected to the first electrode portion 131b of each of the first vibration generating parts 131-1 and 131-2 via a conductive material (or particles) included in the first adhesive layer 131f.

[0181] According to embodiments of this disclosure, the first power line PL1 may include a first upper power line PL11 and a second upper power line PL12 disposed along the second direction Y. For example, the first upper power line PL11 may be electrically connected to the first electrode portion 131b of the first vibration generating unit 131-1. The second upper power line PL12 may be electrically connected to the first electrode portion 131b of the second vibration generating unit 131-2.

[0182] The second power line PL2 can be disposed on the front surface of the second cover member 131e facing each of the second surfaces of the first vibration generating part 131-1 and the second vibration generating part 131-2. The second power line PL2 can be electrically connected to the second electrode portion 131c of each of the first vibration generating part 131-1 and the second vibration generating part 131-2. For example, the second power line PL2 can be electrically connected and directly connected to the second electrode portion 131c of each of the first vibration generating part 131-1 and the second vibration generating part 131-2. As an embodiment of this disclosure, the second power line PL2 can be electrically connected to the second electrode portion 131c of each of the first vibration generating part 131-1 and the second vibration generating part 131-2 via an anisotropic conductive film. As another embodiment of this disclosure, the second power line PL2 can be electrically connected to the second electrode portion 131c of each of the first vibration generating part 131-1 and the second vibration generating part 131-2 via a conductive material (or particles) included in the second adhesive layer 131g.

[0183] According to embodiments of this disclosure, the second power line PL2 may include a first lower power line PL21 and a second lower power line PL22 disposed along a second direction Y. For example, the first lower power line PL21 may be electrically connected to the second electrode portion 131c of the first vibration generating unit 131-1. For example, the first lower power line PL21 may overlap with the first upper power line PL11. For example, the first lower power line PL21 may be configured not to overlap with the first upper power line PL11. The second lower power line PL22 may be electrically connected to the second electrode portion 131c of the second vibration generating unit 131-2. For example, the second lower power line PL22 may overlap with the second upper power line PL12. For example, the second lower power line PL22 may be configured not to overlap with the second upper power line PL12.

[0184] The pad portion 131p can be configured on the outer peripheral portion of either the first cover member 131d or the second cover member 131e to be electrically connected to a portion (or one end) of each of the first power line PL1 and the second power line PL2.

[0185] According to embodiments of the present disclosure, the pad portion 131p may include a first pad electrode electrically connected to one end of a first power line PL1 and a second pad electrode electrically connected to one end of a second power line PL2.

[0186] The first pad electrode can be commonly connected to a portion of each of the first upper power line PL11 and the second upper power line PL12 of the first power line PL1. For example, a portion of each of the first upper power line PL11 and the second upper power line PL12 can branch off from the first pad electrode. The second pad electrode can be commonly connected to a portion of each of the first lower power line PL21 and the second lower power line PL22 of the second power line PL2. For example, a portion of each of the first lower power line PL21 and the second lower power line PL22 can branch off from the second pad electrode.

[0187] According to another embodiment of the present disclosure, the vibration device 131 may also include a signal cable 132.

[0188] The signal cable 132 can be electrically connected to the pad portion 131p disposed at the vibration device 131, and can supply the vibration device 131 with a vibration drive signal (or sound signal or voice signal) provided from the sound processing circuit. According to embodiments of this disclosure, the signal cable 132 may include a first terminal electrically coupled to a first pad electrode of the pad portion 131p and a second terminal electrically coupled to a second pad electrode of the pad portion 131p. For example, the signal cable 132 may be configured as a flexible printed circuit cable, a flexible flat cable, a single-sided flexible printed circuit, a single-sided flexible printed circuit board, a flexible multilayer printed circuit, or a flexible multilayer printed circuit board, but embodiments of this disclosure are not limited thereto.

[0189] The sound processing circuit can generate an AC vibration drive signal, including a first vibration drive signal and a second vibration drive signal, based on sound data. The first vibration drive signal can be either a positive (+) vibration drive signal or a negative (-) vibration drive signal, and the second vibration drive signal can also be either a positive (+) vibration drive signal or a negative (-) vibration drive signal. For example, the first vibration drive signal can be supplied to the first electrode portion 131b of each of the first vibration generating units 131-1 and the second vibration generating unit 131-2 via the first terminal of the signal cable 132, the first pad electrode of the pad portion 131p, and the first power line PL1. The second vibration drive signal can be supplied to the second electrode portion 131c of each of the first vibration generating units 131-1 and the second vibration generating unit 131-2 via the second terminal of the signal cable 132, the second pad electrode of the pad portion 131p, and the second power line PL2.

[0190] Figure 10 A vibration device according to another embodiment of the present disclosure is shown. Figure 10 It shows in Figure 8 and Figure 9The embodiment shown depicts a vibration device with four vibration generating units. Therefore, in the following text, elements other than the four vibration generating units and related elements may be referred to using similar reference numerals, and their repeated descriptions may be omitted or will be given briefly. Figure 9 The middle shows along Figure 10 The cross section shown is taken by the C-C' line.

[0191] Combination Figure 9 Reference Figure 10 According to another embodiment of the present disclosure, the vibration device 131 may include a plurality of vibration generating units 131-1 to 131-4.

[0192] Multiple vibration generating units 131-1 to 131-4 may be electrically disconnected and are spaced apart from each other along a first direction X and a second direction Y. For example, the multiple vibration generating units 131-1 to 131-4 may be arranged or tiled in an i×j form on the same plane, so the vibration device 131 can be implemented with a relatively large area based on tiling multiple vibration generating units 131-1 to 131-4 with relatively small dimensions. For example, i may be the number of vibration generating units arranged along the first direction X, and may be 2 or a greater natural number; j may be the number of vibration generating units arranged along the second direction Y, and may be the same as or different from i, 2 or a greater natural number. An example of the vibration device 131 including the first vibration generating units 131-1 to the fourth vibration generating units 131-4 will be described below.

[0193] According to embodiments of this disclosure, the first vibration generating unit 131-1 and the second vibration generating unit 131-2 may be spaced apart from each other along a first direction X. The third vibration generating unit 131-3 and the fourth vibration generating unit 131-4 may be spaced apart from each other along the first direction X, and may be spaced apart from each of the first vibration generating unit 131-1 and the second vibration generating unit 131-2 along a second direction Y. The first vibration generating unit 131-1 and the third vibration generating unit 131-3 may be spaced apart from each other along the second direction Y so as to face each other. The second vibration generating unit 131-2 and the fourth vibration generating unit 131-4 may be spaced apart from each other along the second direction Y so as to face each other.

[0194] The first vibration generating units 131-1 to the fourth vibration generating units 131-4 can be disposed between the first cover member 131d and the second cover member 131e. For example, each of the first cover member 131d and the second cover member 131e can be connected to the first vibration generating units 131-1 to the fourth vibration generating units 131-4, or they can jointly support the first vibration generating units 131-1 to the fourth vibration generating units 131-4, and thus the first vibration generating units 131-1 to the fourth vibration generating units 131-4 can be driven as a vibration device (or a single vibration device). For example, the first vibration generating units 131-1 to the fourth vibration generating units 131-4 can be laid flat by the cover members 131d and 131e at certain intervals, and thus can be driven as a vibration device (or a single vibration device).

[0195] According to the implementation of this disclosure, as referred to above... Figure 8 and Figure 9 In order to achieve single-unit vibration or large-area vibration, the first vibration generating part 131-1 to the fourth vibration generating part 131-4 can be arranged (or laid flat) at intervals of 0.1 mm or more and less than 3 cm along the first direction X and the second direction Y. More preferably, they can be arranged (or laid flat) at intervals of 0.1 mm or more and less than 5 mm.

[0196] Each of the first vibration generating unit 131-1 to the fourth vibration generating unit 131-4 may include a piezoelectric vibration unit 131a, a first electrode unit 131b, and a second electrode unit 131c.

[0197] The piezoelectric vibration section 131a of each of the first vibration generating sections 131-1 to the fourth vibration generating sections 131-4 may include a piezoelectric material (or an electroactive material) that includes a piezoelectric effect. The piezoelectric vibration section 131a of each of the first vibration generating sections 131-1 to the fourth vibration generating sections 131-4 may be configured to be similar to the above-mentioned reference section. Figure 6 and Figures 7A to 7D Any of the piezoelectric vibrating parts 131a described are substantially the same; therefore, similar reference numerals may refer to similar elements and their repeated descriptions may be omitted.

[0198] According to embodiments of this disclosure, each of the first vibration generating unit 131-1 to the fourth vibration generating unit 131-4 may include the above-mentioned references. Figure 6 and Figures 7A to 7D The piezoelectric vibrating part 131a described may be any one of the piezoelectric vibrating parts 131a, or may include different piezoelectric vibrating parts 131a.

[0199] According to another embodiment of this disclosure, one or more of the first vibration generating unit 131-1 to the fourth vibration generating unit 131-4 may include the aforementioned reference. Figure 6 and Figures 7A to 7D Different piezoelectric vibrating parts 131a are described.

[0200] The first electrode portion 131b can be disposed on the first surface of the corresponding piezoelectric vibrating portion 131a and electrically connected to the first surface of the piezoelectric vibrating portion 131a. The first electrode portion 131b can be referenced above. Figure 5 The first electrode portion 131b described is substantially the same; therefore, similar reference numerals can refer to similar elements, and their repeated descriptions can be omitted.

[0201] The second electrode portion 131c can be disposed on the second surface of the corresponding piezoelectric vibrating portion 131a and electrically connected to the second surface of the piezoelectric vibrating portion 131a. The second electrode portion 131c can be referenced above. Figure 5 The second electrode section 131c described is substantially the same; therefore, similar reference numerals can refer to similar elements, and their repeated descriptions can be omitted.

[0202] According to embodiments of this disclosure, the first adhesive layer 131f and the second adhesive layer 131g can be interconnected or coupled between the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4. Therefore, each of the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4 can be surrounded by the first adhesive layer 131f and the second adhesive layer 131g. For example, the first adhesive layer 131f and the second adhesive layer 131g can be disposed between the first cover member 131d and the second cover member 131e to completely surround each of the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4. For example, each of the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4 can be embedded or built into the space between the first adhesive layer 131f and the second adhesive layer 131g.

[0203] According to another embodiment of the present disclosure, the vibration device 131 may further include a first power line PL1, a second power line PL2, and a pad portion 131p.

[0204] Apart from the electrical connection structure between the first power line PL1 and the second power line PL2 and the first vibration generating unit 131-1 to the fourth vibration generating unit 131-4, the first power line PL1 and the second power line PL2 can be the same as those mentioned above. Figure 8 and Figure 9The first power line PL1 and the second power line PL2 are basically the same. Therefore, the following will only briefly describe the electrical connection structure between the first power line PL1 and the second power line PL2 and the first vibration generating unit 131-1 to the fourth vibration generating unit 131-4.

[0205] According to embodiments of this disclosure, the first power line PL1 may include a first upper power line PL11 and a second upper power line PL12 disposed along a second direction Y. For example, the first upper power line PL11 may be electrically connected to the first electrode portion 131b of each of the first vibration generating portion 131-1 and the third vibration generating portion 131-3 (or the first group or the first vibration generating group) disposed in a first row, the first row being parallel to the second direction Y from the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4. The second upper power line PL12 may be electrically connected to the first electrode portion 131b of each of the second vibration generating portion 131-2 and the fourth vibration generating portion 131-4 (or the second group or the second vibration generating group) disposed in a second row, the second row being parallel to the second direction Y from the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4.

[0206] According to embodiments of this disclosure, the second power line PL2 may include a first lower power line PL21 and a second lower power line PL22 disposed along a second direction Y. For example, the first lower power line PL21 may be electrically connected to the second electrode portion 131c of each of the first vibration generating portion 131-1 and the third vibration generating portion 131-3 (or the first group or the first vibration generating group) disposed in a first row, the first row being parallel to the second direction Y from the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4. The second lower power line PL22 may be electrically connected to the second electrode portion 131c of each of the second vibration generating portion 131-2 and the fourth vibration generating portion 131-4 (or the second group or the second vibration generating group) disposed in a second row, the second row being parallel to the second direction Y from the first vibration generating portion 131-1 to the fourth vibration generating portion 131-4.

[0207] The pad portion 131p can be disposed on the outer peripheral portion of either the first cover member 131d or the second cover member 131e to be electrically connected to one side (or one end) of each of the first power line PL1 and the second power line PL2. The pad portion 131p can be... Figure 8 and Figure 9 The pad portion 131p shown is essentially the same as that shown in the figure; therefore, similar reference numerals can refer to similar components, and their repeated descriptions can be omitted.

[0208] As described above, the vibration device 131 according to another embodiment of this disclosure may have the same characteristics as described above. Figures 4 to 9The vibration device 131 described has the same effect, therefore its repeated description can be omitted.

[0209] Figures 11 to 14 It is along Figure 1 The cross-sectional view taken by line A-A' is shown. Figure 11 A sound device according to another embodiment of the present disclosure is shown, and modifications are also shown. Figure 3 The implementation method is based on the structure of the vibrating component. Figure 12 A sound device according to another embodiment of the present disclosure is shown, and modifications are also shown. Figure 2 The implementation method is based on the structure of the vibrating component. Figure 13 A sound device according to another embodiment of the present disclosure is shown, and modifications are also shown. Figure 11 The implementation method is achieved through the structure of the vibrating components and the housing. Figure 14 A sound device according to another embodiment of the present disclosure is shown, and modifications are also shown. Figure 2 The implementation method is achieved through the structure of the vibrating member and the housing. Therefore, in the following description, repeated descriptions of other components besides the vibrating member, the housing, and related elements can be omitted.

[0210] Reference Figure 1 and Figure 11 The vibrating member 110 can be constructed such that it is inserted into the recess 153 of the housing 150. According to another embodiment of the present disclosure, the vibrating member 110 of the sound device 10 can be constructed such that both ends of the first and second surfaces of the vibrating member 110 are fixed in the recess 153. Specifically, the first surface of the vibrating member 110 can be connected to the recess 153 of the housing 150 via a first connecting member 141, and the second surface of the vibrating member 110 can be connected to the recess 153 of the housing 150 via a second connecting member 143. According to another embodiment of the present disclosure, because both ends of the vibrating member 110 are fixed by the recess 153, reflected waves can be canceled at both ends of the vibrating member 110, and therefore, the peak or drop phenomenon of sound characteristics caused by standing waves can be reduced. A peak can be a phenomenon where the sound pressure level bounces at a specific frequency, while a drop can be a phenomenon where a low pressure level occurs due to the prevention of the occurrence of a specific frequency. The sound output characteristics of the sound device can be reduced by the peak or drop phenomenon.

[0211] In another embodiment of the sound device 10 according to this disclosure, since the two ends of the vibrating member 110 are fixed by the groove portion 153, the reflected wave can be canceled at both ends of the vibrating member 110. Therefore, the peak or drop phenomenon of sound characteristics caused by standing waves can be reduced, the sound characteristics of the low-pitched vocal band can be enhanced, and when the peak or drop phenomenon occurs, the sound output characteristics of the sound device can be reduced. Specifically, in another embodiment of the sound device according to this disclosure, the sound characteristics of the low-pitched vocal band can be enhanced, and the drop phenomenon of the mid-pitched vocal band and the drop phenomenon of the high-pitched vocal band can be reduced. For example, the low-pitched sound can be in the frequency range of 500 Hz or less, the mid-pitched vocal band can be in the frequency range of 500 Hz to 2000 Hz, and the high-pitched vocal band can be in the frequency range of 2000 Hz to 20000 Hz. However, the frequency range of the mid-pitched vocal band and the mid-high-pitched vocal band according to the embodiment of this disclosure is not limited to this.

[0212] Reference Figure 1 and Figure 12 The vibrating member 110 may also include a vibrating member groove 110a. Figure 12 In this context, for ease of description, the vibration member groove 110a can represent an empty space where the vibration member 110 is not provided; however, the vibration member groove 110a can also represent a portion of the vibration member 110 where at least a portion of the thickness t1 is thinner than another portion. At least a portion of the vibration member groove 110a can overlap with the vibration device 130. According to embodiments of this disclosure, the thickness of the vibration member 110 overlapping with the vibration member groove 110a can be thinner than the portion of the vibration member 110 that does not overlap with the vibration member groove 110a. For example, the thickness of the vibration member 110 overlapping with the vibration member groove 110a can be adjusted to 10% to 90% of the thickness of the portion of the vibration member 110 where the vibration member groove 110a is not provided.

[0213] The vibration device 130 can be adjusted to have a first length D1 in the first direction X and a second length in the second direction Y. The vibration member groove 110a can be configured to have a first length L1 in the first direction X and can be adjusted to have a second length in the second direction Y.

[0214] According to embodiments of the present disclosure, the first length D1 of the vibration device 130 may be equal to or different from the first length L1 of the vibration member groove 110a, and the second length of the vibration device 130 may be equal to or different from the second length of the vibration member groove 110a. According to embodiments of the present disclosure, the first length D1 of the vibration device 130 may be greater than or equal to the first length L1 of the vibration member groove 110a, and the second length of the vibration device 130 may be greater than or equal to the second length of the vibration member groove 110a.

[0215] According to embodiments of this disclosure, the size of the vibration member groove 110a, which is adjusted along the first direction X and the second direction Y, can have a value that is adjusted to twice the size of each dimension adjusted along the first direction X and the second direction Y. When adjusted in this way, the flatness of the sound pressure level output characteristics can be increased.

[0216] The groove portion 110a of the vibrating member can have a thickness that is thinner than another part of the vibrating member 110, and therefore, the bending stiffness of the vibrating device 130 disposed on the rear surface of the vibrating member 110 at a position corresponding to the groove portion 110a of the vibrating member can be reduced. Since the vibration displacement based on the applied driving force or voltage of the vibrating device 130 increases, the sound reproduction characteristics of the low-pitched vocal cords can be enhanced, and the drooping phenomenon of the mid-pitched vocal cords and the peaking phenomenon of the high-pitched vocal cords can be reduced.

[0217] According to embodiments of the present disclosure, the bending stiffness of the vibration device 130 can be calculated as expressed in Equation 1 below.

[0218] [Formula 1]

[0219] Bending stiffness = Eh3 / 12

[0220] In Equation 1, E can represent Young's modulus, and h can represent the thickness of the vibrating member at the location where the groove portion 110a of the vibrating member is provided. Therefore, referring to Equation 1, it can be seen that the bending stiffness is proportional to the cube (or the third power) of the thickness of the vibrating member 110.

[0221] According to embodiments of this disclosure, the bending stiffness should be 0.20 Nm or greater. For example, when the vibrating member 110 is configured to include an acrylonitrile-butadiene-styrene (ABS) material and has a thickness of 1 mm, a bending stiffness value of approximately 0.19 Nm can be calculated for the vibrating member 110. When the bending stiffness is less than 0.20 Nm, a sound pressure level of 75 dB or higher cannot be guaranteed near 100 Hz. Therefore, when the vibrating member 110 includes an ABS-containing material and is configured to have a thickness of less than 1 mm, the desired low-sound characteristics may not be achieved.

[0222] Reference Figure 1 and Figure 13 The vibrating member 110 can be constructed such that the vibrating member 110 is inserted into the recess 153 of the housing 150. According to another embodiment of the present disclosure, the vibrating member 110 of the sound device 10 can be constructed such that both ends of the first and second surfaces of the vibrating member 110 are fixed in the recess 153. Specifically, the first surface of the vibrating member 110 can be connected to the recess 153 of the housing 150 via a first connecting member 141, and the second surface of the vibrating member 110 can be connected to the recess 153 of the housing 150 via a second connecting member 143. According to another embodiment of the present disclosure, because both ends of the vibrating member 110 are fixed by the recess 153, reflected waves can be canceled at both ends of the vibrating member 110, and therefore, the peak or drop in sound characteristics caused by standing waves can be reduced. Additionally, the vibrating member 110 can be configured to also include a vibrating member recess 110a.

[0223] Reference Figure 1 and Figure 14 According to another embodiment of this disclosure, the vibration member 110 may be configured to further include a vibration member protrusion 111. The vibration member protrusion 111 may be connected to an outer peripheral portion of the vibration member 110. For example, the vibration member protrusion 111 may be bent from the outer peripheral portion of the vibration member 110 along a third direction Z parallel to the thickness direction of the vibration member 110. For example, the vibration member protrusion 111 may include a first side portion to a fourth side portion. The vibration member protrusion 111 may be connected to or coupled to a side portion 152 of the housing 150 via a connecting member 140. The vibration member protrusion 111 may be configured to increase the stiffness (or bending stiffness) of the vibration member 110. The vibration member 110 including the vibration member protrusion 111 may be configured to further include a vibration member recess 110a.

[0224] Figures 15 to 17 It is along Figure 1 Another cross-sectional view taken from line A-A' shown. Figures 15 to 17 This is a diagram illustrating a sound device according to another embodiment of the present disclosure, and showing an embodiment in which the structure of an inner housing is added to the interior portion of the housing, and the structure of the sound device is modified such that the inner housing is coupled to a secondary vibrating member. Therefore, in the following description, repeated descriptions of other elements besides the inner housing and related components are omitted.

[0225] Reference Figure 1 and Figure 15According to another embodiment of this disclosure, the sound device 10 may further include an inner housing 170 disposed inside (or inwardly) the housing 150. The housing 150 may be configured to surround the inner housing 170, may include a receiving space 170s for accommodating the vibrating device 130, and may have a box-shaped shape with one side open. In addition, the opening on one side of the receiving space 170s is covered by the vibrating member 110, and a predetermined air gap may be formed between the receiving space 170s and the vibrating member 110.

[0226] The inner housing 170 according to embodiments of this disclosure may include one or more of metallic and non-metallic materials (or composite non-metallic materials), but embodiments of this disclosure are not limited thereto. For example, the inner housing 170 may include one or more of metallic, plastic, and wood materials, but embodiments of this disclosure are not limited thereto. For example, the inner housing 170 may be referred to by terms such as inner shell, inner shell member, shell member, inner cabinet, inner shell cover, inner sealing member, inner sealing cap, inner sealing box, or inner speaker, but embodiments of this disclosure are not limited thereto. For example, the accommodating space 170s of the inner housing 170 may be referred to by terms such as gap space, air gap, vibration space, sound space, speaker, or sealing space, but embodiments of this disclosure are not limited thereto.

[0227] The inner housing 170 according to embodiments of this disclosure may include a bottom 171 and a side 172. The bottom 171 may be disposed at the rear surface of the vibrating member 110 to cover the second surface of the vibrating member 110 and the vibrating device 130. For example, the bottom 171 may be configured to be spaced apart from the second surface of the vibrating member 110 and the vibrating device 130.

[0228] Side portion 172 may be connected to the outer peripheral portion of bottom portion 171. For example, side portion 172 may be bent from the outer peripheral portion of bottom portion 171 in a third direction Z parallel to the thickness direction of vibrating member 110. For example, side portion 172 may include a first side portion to a fourth side portion. Side portion 172 may be integrated into bottom portion 171. For example, bottom portion 171 and side portion 172 may be integrated into a single unit, and thus, receiving space 170s surrounded by side portion 172 may be provided on bottom portion 171. Therefore, bottom portion 171 and side portion 172 may have a box-shaped shape with one side open.

[0229] The inner housing 170 may also include a first reinforcing member 173, which is formed to protrude from the bottom 171 of the inner housing 170 toward the vibration device 130.

[0230] The first reinforcing member 173 may be formed to protrude from the center portion of the bottom 171 toward the vibrating device 130 and may be configured to contact the vibrating device 130. The first reinforcing member 173 may have a certain width at the portion that contacts the vibrating device 130, or may be implemented in a stump shape and may have a height that allows it to contact the vibrating device 130.

[0231] When an impact is applied from the outside (e.g., the rear surface of the bottom 171), the first reinforcing member 173 can disperse point contact impacts into line contact impacts, thereby preventing specific parts of the vibrating device 130 from being damaged.

[0232] The inner housing 170 can be coupled to the vibrating member 110 via the connecting member 117 (or the third connecting member). The connecting member 117 (or the third connecting member) can couple the inner housing 170 to the vibrating member 110.

[0233] The connecting member 117 according to embodiments of this disclosure may include an adhesive layer (or glue layer) with good adhesion or bonding strength. For example, the connecting member 117 may include double-sided adhesive tape, double-sided foam pad, or adhesive sheet. For example, when the connecting member 117 includes an adhesive sheet (or adhesive layer), the connecting member 117 may consist only of an adhesive layer or glue layer, without a base member such as a plastic material.

[0234] The adhesive layer (or adhesive layer) of the connecting member 117 according to embodiments of this disclosure may include epoxy resin, acrylic resin, silicone resin or polyurethane, but embodiments of this disclosure are limited thereto.

[0235] The adhesive layer (or adhesive layer) of the connecting member 117 according to another embodiment of the present disclosure may include pressure-sensitive adhesive (PSA), optically transparent adhesive (OCA) or optically transparent resin (OCR), but the embodiments of the present disclosure are limited thereto.

[0236] Reference Figure 1 and Figure 16 According to another embodiment of the present disclosure, the sound device 10 may further include a secondary vibration member 115 between the vibration device 130 and the vibration member 110, and may also include a connecting member 119 (or a fourth connecting member) between the secondary vibration member 115 and the vibration member 110.

[0237] The secondary vibrating component 115 may comprise a metallic or non-metallic material (or a composite non-metallic material) having material properties suitable for sound output based on vibration. The metallic material of the secondary vibrating component 115 according to embodiments of this disclosure may include any one or more of stainless steel, aluminum (Al), aluminum alloys, magnesium (Mg), magnesium alloys, and magnesium-lithium (Mg-Li) alloys, but embodiments of this disclosure are not limited thereto. The non-metallic material (or composite non-metallic material) of the secondary vibrating component 115 may include one or more of glass, plastic, fiber, leather, wood, fabric, rubber, carbon, and paper, but embodiments of this disclosure are not limited thereto.

[0238] The connecting member 119 according to embodiments of this disclosure may include an adhesive layer (or glue layer) with good adhesion or bonding strength. For example, the connecting member 119 may include double-sided adhesive tape, double-sided foam pad, or adhesive sheet. For example, when the connecting member 119 includes an adhesive sheet (or adhesive layer), the connecting member 119 may consist only of an adhesive layer or glue layer, without a base member such as a plastic material.

[0239] The adhesive layer (or adhesive layer) of the connecting member 119 according to embodiments of this disclosure may include epoxy resin, acrylic resin, silicone resin or polyurethane, but embodiments of this disclosure are limited thereto.

[0240] The adhesive layer (or adhesive layer) of the connecting member 119 according to another embodiment of the present disclosure may include pressure-sensitive adhesive (PSA), optically transparent adhesive (OCA), or optically transparent resin (OCR), but the embodiments of the present disclosure are limited thereto.

[0241] Furthermore, according to embodiments of this disclosure, the secondary vibration member 115, the vibration device 130 located on the rear surface of the secondary vibration member 115, and the inner housing 170 coupled to the secondary vibration member 115 can be configured as a module. Therefore, a vibration device module including the secondary vibration member 115, the vibration device 130, and the inner housing 170 can be assembled in a predetermined configuration, and then, as needed, connected or coupled to the rear surface of the vibration member 110 via the connecting member 119.

[0242] Reference Figure 1 and Figure 17 According to another embodiment of the present disclosure, the sound device 10 may further include a sound processing circuit 190 installed at the bottom of the inner housing 170, and the sound processing circuit 190 may be connected to the vibration device 130 via a signal cable 132.

[0243] The sound processing circuit 190 can be connected to the signal cable 132, or it can be installed at the signal cable 132.

[0244] The sound processing circuit 190 according to embodiments of the present disclosure may include: a decoding section that receives sound data provided from an external sound data generation circuit section; an audio amplifier circuit that outputs a first vibration drive signal and a second vibration drive signal based on the sound data provided from the decoding section; a memory circuit that stores setting values ​​of the audio amplifier circuit; a control circuit that controls the operation of each of the decoding section, the audio amplifier circuit, and the memory circuit; and passive elements such as resistors.

[0245] The sound processing circuit 190 can generate a first vibration drive signal and a second vibration drive signal based on sound data, and can output each of the generated first vibration drive signal and second vibration drive signal to a corresponding terminal in the first terminal and the second terminal through a corresponding contact pad and a corresponding drive signal supply line. Therefore, the vibration device 130 can vibrate based on the first vibration drive signal and the second vibration drive signal provided by the sound processing circuit 190 through the signal line of the signal cable 132, the first terminal and the second terminal, the pad portion, and each of the first power line and the second power line.

[0246] Figure 18A and Figure 18B This is a perspective view showing an inner housing according to an embodiment of the present disclosure. Figure 19A , Figure 19B and Figure 19C This is a plan view showing an inner housing according to an embodiment of the present disclosure.

[0247] Reference Figure 18A The inner housing 170 may also include a first reinforcing member 173, which is formed to protrude from the bottom 171 of the inner housing 170 toward the vibration device 130.

[0248] The first reinforcing member 173 may be formed to protrude from the center portion of the bottom 171 toward the vibrating device 130 and may be configured to contact the vibrating device 130. The first reinforcing member 173 may have a certain width at the portion that contacts the vibrating device 130, or may be implemented in a stubby shape and may have a height that allows it to contact the vibrating device 130.

[0249] When an impact is applied from the outside (e.g., the rear surface of the bottom 171), the first reinforcing member 173 can disperse point contact impacts into line contact impacts, thereby preventing specific parts of the vibrating device 130 from being damaged.

[0250] Reference Figure 18B The inner housing 170 may also include a second reinforcing member 175, which is formed to protrude from the bottom 171 of the inner housing 170 toward the vibration device 130.

[0251] The second reinforcing member 175 can be formed to protrude toward the vibrating device 130 in a mesh or mesh network form in all areas of the bottom 171 except for the area where the first reinforcing member 173 is disposed, and can be configured not to contact the vibrating device 130. The upper end of the second reinforcing member 175 can have a certain width or can be constructed in a stubby shape and can have a height lower than that of the first reinforcing member 173. For example, the first reinforcing member 173 and the second reinforcing member 175 can have the same width.

[0252] When an impact is applied from the outside (e.g., the rear surface of the bottom 171), the first reinforcing member 173 can disperse point contact impacts into line contact impacts, thereby preventing specific parts of the vibrating device 130 from being damaged.

[0253] When an impact is applied from the outside (e.g., the rear surface of the bottom 171), the second reinforcing member 175 can disperse the point contact impact to resemble surface contact in a mesh structure, thereby preventing specific parts of the vibrating device 130 from being damaged.

[0254] Reference Figures 19A to 19C The inner housing 170 may further include an opening 177 that communicates between a first surface (or upper surface) of the bottom 191 and a second surface (or lower surface) of the bottom 191. The opening 177 may be formed as a slit shape parallel to the second direction Y, or it may be formed as a cylindrical hole with certain standards. However, in this disclosure, when the opening 177 is configured as a slit shape, the long side of the opening 177 having the slit shape is not limited to being parallel to the second direction Y. Furthermore, Figure 19B The opening portion 177 with a cylindrical hole shape is not limited in shape and can be prepared into various shapes and opening portions with a cylindrical hole shape.

[0255] exist Figures 19A to 19C In this context, relative to a plane, the cross-sectional areas of multiple openings can be adjusted differently. For example, in... Figure 19A In this process, the sum of the cross-sectional areas of the opening portions 177 with multiple slit shapes can be adjusted to 700 mm. 2 Up to 1000 mm 2 The area, in Figure 19B In this process, the sum of the cross-sectional areas of the opening portion 177 with multiple cylindrical hole shapes can be adjusted to 50 mm. 2 Up to 200 mm 2 The area. And... Figure 19C In this process, the sum of the cross-sectional areas of the opening portions 177 with multiple slit shapes can be adjusted to 500 mm. 2Up to 700 mm 2 The area.

[0256] According to embodiments of this disclosure, when a plurality of openings 177 capable of communicating with air are formed in the rear surface of the vibrating device 130, the enclosed space surrounding the vibrating device 130 can be configured to communicate with the rear surface of the inner housing 170, and in this case, the impedance component (or air impedance or elastic impedance) acting on the vibrating member 110 can vary. For example, when a plurality of openings are formed in the inner housing 170, the sound characteristics of the high-pitched vocal cords can be enhanced.

[0257] Figure 20 This is a perspective view of a sound device according to another embodiment of the present disclosure. Figure 21 It is along Figure 20 The cross-sectional view taken by line D-D'. Figure 22 This illustrates the arrangement of the vibrating device on the rear surface of the vibrating component. The structure is modified to achieve... Figure 1 The size of the sound device 10 in the first direction X is the same as Figure 1 The sound device 10 is the same size in the second direction Y to achieve this. Figure 20 The sound device 20. Therefore, in the following description, repeated descriptions of other elements besides the arrangement of each of the vibrating member 110 and the vibrating device 130 can be omitted.

[0258] Reference Figure 20 and Figure 21 According to another embodiment of this disclosure, the sound device can be configured such that its size in the first direction X is the same as its size in the second direction Y. Additionally, Figure 21 The structure of each of the vibrating member 110 and the housing 150 in the sound device 20 can be applied as described above. Figure 2 , Figure 3 and Figures 11 to 17 The vibrating component 110 and the housing 150 of the described sound device 10 have the same structure.

[0259] Reference Figure 22 The vibrating member 110 may have a length corresponding to Xt in the first direction X and a length corresponding to Yt in the second direction Y. According to another embodiment of this disclosure, in the vibrating member 110, Xt in the first direction X may be adjusted to have the same length as Yt in the second direction Y, and therefore, the vibrating member 110 may be fabricated as a square. The vibration device 130 may be disposed on the second surface (or rear surface) of the vibrating member 110.

[0260] Regarding the direction parallel to the first direction X, the length from one side of the vibrating member 110 to the center of the vibrating device 130 can be a first length X1, and the length from the center of the vibrating device 130 to the other side of the vibrating member 110 can be a second length X2. The sum of the first length X1 and the second length X2 can be the same as the length Xt of the vibrating member 110 in the first direction X.

[0261] Regarding the direction parallel to the second direction Y, the length from one side of the vibrating member 110 to the center portion of the vibrating device 130 can be a first length Y1, and the length from the center portion of the vibrating device 130 to the other side of the vibrating member 110 can be a second length Y2. The sum of the first length Y1 and the second length Y2 can be the same as the length Yt of the vibrating member 110 in the first direction Y.

[0262] According to another embodiment of this disclosure, the acoustic characteristics of the sound device 20 can be enhanced based on the optimal arrangement of the rear surface of the vibrating member 110 of the vibrating device 130. For example, the vibrating device 130 may not be located at the center of the vibrating member 110, and the acoustic characteristics can be enhanced in a direction offset from the center of the vibrating member 110 toward a first direction X or a second direction Y.

[0263] Figure 23 Shown in Figure 2 The sound output characteristics of a sound device that does not have a protruding vibrating component.

[0264] Sound output characteristics can be measured using sound analysis equipment. Sound output characteristics are measured using B&K audio measurement equipment. The sound analysis equipment may include: a sound card that sends or receives sound from a control PC; an amplifier that amplifies the signal generated by the sound card and transmits the amplified signal to the vibration device; and a microphone that collects the sound generated by the vibration device in the display panel. For example, the microphone may be positioned at the center of the vibration device, and the distance between the display panel and the microphone may be 50 cm. Sound can be measured with the microphone perpendicular to the vibration device. The sound collected by the microphone can be input to the control PC via the sound card, and the control program can examine the input sound to analyze the sound of the vibration device. For example, the frequency response characteristics corresponding to a frequency range of 100 Hz to 20 kHz can be measured using a pulse program.

[0265] exist Figure 23 In the diagram, the horizontal axis represents the frequency in Hertz (Hz), and the vertical axis represents the sound pressure level (SPL) in Decibels (dB). Figure 23 The solid line represents Figure 2 The sound output characteristics of the sound device, and the dashed line indicates Figure 2 The sound output characteristics of the sound device structure without a protruding vibrating component 111.

[0266] Reference Figure 23 Compared to the dashed line, the solid line shows an enhancement in sound output characteristics across the frequency ranges of 2000 Hz to 4000 Hz and 6 kHz to 10 kHz. For example, compared to the dashed line, the solid line shows an enhancement in sound pressure levels in both the mid-tone and high-tone vocal bands. Specifically, compared to the dashed line, the solid line shows an average increase of approximately 10 dB or more in sound pressure levels across the 2000 Hz to 4000 Hz frequency range, and an increase of approximately 5 dB or more in the 6 kHz to 10 kHz frequency range.

[0267] Figure 24 The sound pressure level of the sound device relative to frequency is shown, where, in Figure 11 The sound equipment is provided with a groove for a vibrating component, and Figure 12 The sound equipment does not have a groove for the vibrating component.

[0268] Methods for measuring sound output characteristics can be compared with Figure 23 The descriptions are the same, so the repeated descriptions can be omitted.

[0269] exist Figure 24 In the diagram, the horizontal axis represents the frequency in Hertz (Hz), and the vertical axis represents the sound pressure level (SPL) in Decibels (dB). Figure 24 The solid line represents Figure 11 The sound output characteristics of the sound device, and the dashed line indicates Figure 12 The sound output characteristics of the sound device structure without a vibrating component groove 110a.

[0270] Reference Figure 24 Compared to the dashed line, the solid line shows that the sound output characteristics are enhanced in the frequency ranges of 100 Hz or lower, 500 Hz to 1000 Hz, and 2000 Hz or higher. For example, compared to the dashed line, the solid line shows enhanced sound pressure levels in the low-pitched, mid-pitched, and high-pitched vocal bands. For example, compared to the dashed line, the solid line shows an average increase of approximately 5 dB in the sound output characteristics in the frequency range of 100 Hz or lower, a reduction in drop-off in the frequency range of 500 Hz to 1000 Hz, and a reduction in peaking in the high-pitched vocal bands at 2000 Hz or higher.

[0271] Figures 25A to 25F This illustrates how the groove portion of the vibrating component is fabricated by modifying it under various conditions. Figure 12 The sound pressure level of a sound device relative to its frequency.

[0272] Methods for measuring sound output characteristics can be compared with Figure 23 The descriptions are the same, and therefore the repeated descriptions can be omitted.

[0273] exist Figures 25A to 25E In the diagram, the horizontal axis represents frequency in Hertz (Hz), and the vertical axis represents sound pressure level (SPL) in decibels (dB). Figures 25A to 25E In the diagram, the solid line indicates that the thickness of the vibrating component is set to 1 mm. Figure 12 The sound output characteristics of the sound device, and the dashed line indicates Figure 12 The sound output characteristics of a sound device structure that does not have a vibrating member groove 110a and whose vibrating member thickness is set to 1 mm. Figure 25F In the middle, the solid line represents the middle. Figure 12 The sound output characteristics of the sound device structure when the vibration member groove 110a is not provided in the sound device structure and the thickness of the vibration member is set to 3mm.

[0274] exist Figures 25A to 25F In this process, the vibrating component 110 can be configured with a material including acrylonitrile-butadiene-styrene (ABS).

[0275] exist Figures 25A to 25E In the experiment, the thickness of the vibration member corresponding to the groove portion 110a of the vibration member was adjusted to 1 mm, the length of the groove portion 110a of the vibration member in the first direction X and the second direction Y was formed into the same square shape, and the length of one corner of it was changed to 60 mm, 120 mm, 140 mm, 180 mm and 240 mm, and the length of the vibration device 130 in the first direction X and the second direction Y was formed into the same square shape of 120 mm.

[0276] Reference Figure 25A When the length of the groove portion 110a of the vibrating member shown by the solid line in the first direction X and the second direction Y is adjusted to 60 mm, it can be seen that the low sound peak observed at the lowest frequency is measured as a value of about 90 dB at about 190 Hz.

[0277] Compared to the dashed line, the solid line shows an improvement in the descent of the mid-pitched vocal cords and an increase in the sound pressure level of the high-pitched vocal cords. For example, the mid-pitched vocal cords cover a frequency range of 500 Hz to 1000 Hz, while the high-pitched vocal cords can cover a frequency range greater than 10 kHz.

[0278] Reference Figure 25BWhen the length of the groove portion 110a of the vibrating member shown by the solid line in the first direction X and the second direction Y is adjusted to 120 mm, it can be seen that the low sound peak observed at the lowest frequency is measured as a value of about 85 dB at about 180 Hz.

[0279] Compared to the dashed line, the solid line shows an increase in the sound pressure level of the high-pitched vocal cords. For example, the high-pitched vocal cords can be in a frequency range greater than 10 kHz.

[0280] Reference Figure 25C When the length of the groove portion 110a of the vibrating member shown by the solid line in the first direction X and the second direction Y is adjusted to 140 mm, it can be seen that the low sound peak observed at the lowest frequency is measured as a value of about 85 dB at about 170 Hz.

[0281] Compared to the dashed line, the solid line shows an increase in the sound pressure level of the high-pitched vocal cords. For example, the high-pitched vocal cords can be in a frequency range greater than 10 kHz.

[0282] Reference Figure 25D When the length of the groove portion 110a of the vibrating member shown by the solid line in the first direction X and the second direction Y is adjusted to 180 mm, it can be seen that the low sound peak observed at the lowest frequency is measured as a value of about 82 dB at about 150 Hz.

[0283] Compared to the dashed line, the solid line shows that the sound pressure level of the low-pitched vocal cords is enhanced, and the sound pressure level of the high-pitched vocal cords is also enhanced. For example, the low-pitched vocal cords can be in a frequency range less than 200 Hz, and the high-pitched vocal cords can be in a frequency range greater than 10 kHz.

[0284] Reference Figure 25E When the length of the groove portion 110a of the vibrating member shown by the solid line in the first direction X and the second direction Y is adjusted to 240 mm, it can be seen that the low sound peak observed at the lowest frequency is measured as a value of about 80 dB at about 130 Hz.

[0285] Compared to the dashed line, the solid line shows an enhanced sound pressure level (SPL) characteristic in the low-pitched, mid-pitched, and high-pitched vocal bands. Furthermore, compared to the dashed line, the solid line shows improved flatness of the overall SPL across a frequency range of 200 Hz or higher. For example, the low-pitched vocal bands could be in a frequency range below 200 Hz, the mid-pitched vocal bands could be in a frequency range from 500 Hz to 2000 kHz, and the high-pitched vocal bands could be in a frequency range greater than 10 kHz.

[0286] Reference Figure 25F When the thickness of the vibrating member 110 is adjusted to 3 mm, it can be seen that the low sound peak observed at the lowest frequency is measured to be approximately 72 dB at about 100 Hz. Compared to the dashed line, the sound pressure level characteristics of the bass vocal cords are enhanced in the solid line.

[0287] Reference Figures 25A to 25E The results have confirmed that as the relative length of the groove portion 110a of the vibrating member relative to the vibrating device 130 gradually increases in the first direction X and the second direction Y, the low-frequency sound peaks observed in the low frequencies shift in the decreasing direction. Therefore, it can be seen that, compared to the vibrating device 130, the sound characteristics of the bass-tone vocal cords increase as the size of the groove portion 110a of the vibrating member increases.

[0288] Figures 26A to 26E This illustrates how the thickness of the vibrating member corresponding to the groove of the vibrating member is varied under different conditions to provide... Figure 12 The sound pressure level of a sound device relative to its frequency.

[0289] Methods for measuring sound output characteristics can be compared with Figure 23 The descriptions are the same, so the repeated descriptions can be omitted.

[0290] exist Figures 26A to 26E In the diagram, the horizontal axis represents frequency in Hertz (Hz), and the vertical axis represents sound pressure level (SPL) in decibels (dB). Figures 26A to 26E In the diagram, the solid line indicates that the thickness of the vibrating member 110 corresponding to the groove portion 110a is adjusted to be between 0.5 mm and 2.5 mm. Figure 12 The sound output characteristics of the sound device, and the dashed line indicates Figure 12 The sound output characteristics of the sound device structure that does not include a groove 110a for the vibrating member and whose thickness is adjusted to 3 mm. Furthermore, in... Figures 26A to 26E In the process, the length of the groove portion 110a of the vibrating component in the first direction X and the second direction Y is adjusted to 240 mm, and Figures 26A to 26E The vibrating component 110 in the middle includes a material containing acrylonitrile butadiene styrene (ABS).

[0291] Reference Figure 26AIn the dashed line, it can be seen that the low-frequency peak observed at the lowest frequency is measured as approximately 90 dB at approximately 180 Hz. In the solid line, when the thickness of the vibrating member 110 corresponding to the groove portion 110a is adjusted to 0.5 mm, the low-frequency peak observed at the lowest frequency is measured as approximately 62 dB at approximately 70 Hz. Therefore, when the thickness of the vibrating member 110 is adjusted to 1.0 mm or less, the acoustic efficiency of the bass-heavy vocal cords can be reduced because the bending stiffness of the vibrating member 110 for proper driving of the vibrating device 130 is not met. For example, the bass-heavy vocal cords may have a frequency range of less than 200 Hz.

[0292] Reference Figure 26B In the dashed line, it can be seen that the low-frequency peak observed at the lowest frequency is measured as approximately 90 dB at approximately 180 Hz. In the solid line, when the thickness of the vibrating member 110 corresponding to the groove portion 110a of the vibrating member is adjusted to 1.0 mm, the low-frequency peak observed at the lowest frequency is measured as approximately 80 dB at approximately 130 Hz.

[0293] Compared to the dashed line, the solid line shows enhanced sound pressure level (SPL) characteristics in both the low-pitched and high-pitched vocal cords, while reducing peaking in the mid-to-high-pitched vocal cords. For example, the low-pitched vocal cords can be in a frequency range below 200 Hz, and the mid-to-high-pitched vocal cords can be in a frequency range from 2000 Hz to 5000 kHz. The high-pitched vocal cords can be in a frequency range greater than 10 kHz.

[0294] Reference Figure 26C In the dashed line, it can be seen that the low sound peak observed at the lowest frequency was measured as approximately 90 dB at approximately 180 Hz. In the solid line, when the thickness of the vibrating member 110 corresponding to the groove portion 110a of the vibrating member is adjusted to 1.5 mm, the low sound peak observed at the lowest frequency is measured as approximately 90 dB at approximately 150 Hz.

[0295] Compared to the dashed line, the solid line shows that the sound pressure level characteristics of the low-pitched vocal cords are enhanced, the peaking phenomenon of the mid-to-high-pitched vocal cords is reduced, and the flatness of the sound pressure level is improved across the entire frequency range of 200 Hz or greater. For example, the low-pitched vocal cords can be in a frequency range below 200 Hz, and the mid-to-high-pitched vocal cords can be in a frequency range of 2000 Hz to 5000 kHz.

[0296] Reference Figure 26DIn the dashed line, it can be seen that the low-frequency peak observed at the lowest frequency is measured as approximately 90 dB at approximately 180 Hz. In the solid line, when the thickness of the vibrating member 110 corresponding to the groove portion 110a of the vibrating member is adjusted to 2.0 mm, the low-frequency peak observed at the lowest frequency is measured as approximately 90 dB at approximately 170 Hz. Compared to the dashed line, in the solid line, it can be seen that the sound pressure level characteristics of the bass vocal cords are enhanced, the flatness of the sound pressure level is improved across the entire frequency range of 200 Hz or greater, and the peaking phenomenon of the mid-frequency vocal cords is reduced. For example, the bass vocal cords can be in a frequency range of less than 200 Hz, and the mid-frequency vocal cords can be in a frequency range of 500 Hz to 2000 kHz.

[0297] Reference Figure 26E In the dashed line, it can be seen that the low-frequency peak observed at the lowest frequency is measured as approximately 90 dB at approximately 180 Hz. In the solid line, when the thickness of the vibrating member 110 corresponding to the groove portion 110a is adjusted to 2.5 mm, the low-frequency peak observed at the lowest frequency is measured as approximately 92 dB at approximately 180 Hz. Compared to the dashed line, the solid line shows an enhanced sound pressure level characteristic of the bass-heavy vocal cords, with improved sound pressure level flatness across the entire frequency range of 200 Hz or greater. For example, the bass-heavy vocal cords can be in a frequency range less than 200 Hz.

[0298] Reference Figures 26A to 26E As a result, the thickness of the vibrating member 110 corresponding to the groove portion 110a can be adjusted to have a thickness greater than or equal to the minimum thickness to ensure the bending stiffness based on the vibrating device 130. For example, when the vibrating member 110 includes a material containing ABS, the minimum thickness can be adjusted to 1 mm, and for example, the bending stiffness of the vibrating member 110 can be 0.20 Nm or greater. Furthermore, when the groove portion 110a is provided and the vibrating member 110 meets the desired thickness, the sound characteristics of the low-pitched vocal cords can be enhanced, the flatness of the sound pressure level can be improved across the entire frequency range, and the drop-off phenomenon of the mid-pitched vocal cords and the peak of the high-pitched vocal cords can be reduced.

[0299] Figure 27 It shows that it has been applied. Figure 18A , Figure 18B , Figure 19A , Figure 19B and Figure 19C The sound pressure level of a sound device relative to a frequency is determined by the structure of its internal housing.

[0300] Methods for measuring sound output characteristics can be compared with Figure 23 The descriptions are the same, and therefore the repeated descriptions can be omitted.

[0301] exist Figure 27 In the diagram, the horizontal axis represents the frequency in Hertz (Hz), and the vertical axis represents the sound pressure level (SPL) in Decibels (dB).

[0302] exist Figure 27 In the middle, the thick solid line indicates that it is applied. Figure 18A The sound output characteristics of the sound device with an inner casing of 150 are indicated by the thin solid line. Figure 18B The sound output characteristics of the sound device with an inner casing of 150 are indicated by the thick dashed line. Figure 19A The sound output characteristics of the sound device with an inner casing of 150 are indicated by the thin dashed line. Figure 19B The sound output characteristics of the sound device with the inner casing 150 structure, and the single-dotted line indicates the application of... Figure 19C The sound output characteristics of the sound device with an inner casing of 150.

[0303] Reference Figure 27 In the sound device 10, shown by thick solid lines, thin solid lines, thick dashed lines, thin dashed lines, and single-dot lines, it can be seen that there is almost no difference in sound output characteristics between the mid-to-high pitch bands or smaller frequency ranges. Compared to the thick solid lines, thin solid lines, thin dashed lines, and single-dot lines, the sound pressure level is enhanced in the high-pitched frequency range, as shown by the thick dashed lines. For example, the high-pitched frequency range can be from 8000 Hz to 10000 Hz.

[0304] Figure 28 It shows Figure 15 and Figure 16 sound equipment and Figure 12 The sound pressure level relative to the frequency of a structure in a sound device that does not have a groove for a vibrating component.

[0305] Methods for measuring sound output characteristics can be compared with Figure 23 The descriptions are the same, so the repeated descriptions can be omitted.

[0306] exist Figure 28 In the diagram, the horizontal axis represents the frequency in Hertz (Hz), and the vertical axis represents the sound pressure level (SPL) in Decibels (dB).

[0307] exist Figure 28 In the middle, the dashed line indicates that it is applied. Figure 15 The sound output characteristics of the sound device within the housing are shown by the solid line, indicating the application of... Figure 16 The sound output characteristics of the sound device within the internal casing are indicated by the dashed line. Figure 12 The sound output characteristics of the sound device 10 without a groove for the vibrating component.

[0308] Reference Figure 28 Compared to the dashed line, the dashed and solid lines show that the sound pressure level characteristics are enhanced in the frequency range of the mid-low tone vocal band. For example, the mid-low tone vocal band can be in the frequency range of 300 Hz to 500 Hz. Furthermore, compared to the dashed line, the dashed and solid lines show that there is no difference in sound output characteristics between the full-tone vocal bands, except for the mid-low tone vocal band.

[0309] Figure 29 It shows Figure 22 The sound pressure level of a sound device relative to its frequency.

[0310] Methods for measuring sound output characteristics can be compared with Figure 23 The descriptions are the same, so the repeated descriptions can be omitted.

[0311] exist Figure 28 In the diagram, the horizontal axis represents the frequency in Hertz (Hz), and the vertical axis represents the sound pressure level (SPL) in Decibels (dB).

[0312] exist Figure 29 In this configuration, the length of the vibrating member 110 in the first direction X and the length of the vibrating member 110 in the second direction Y are both adjusted to 150 mm, and the length of the effective vibrating plate of the vibrating member 110 can be reduced by connecting members 140 on one side and the other side of the vibrating member 110. Figure 29 In this process, the length of the connecting member 140 in the first direction is adjusted to 10 mm. Therefore, the effective vibrating plate length of the vibrating member 110 is 130 mm. The vibration device 130 is positioned at the center of the vibrating member 110, and then, while moving 5 mm toward one side of the vibrating member in the respective first direction X, the sound pressure level output characteristics are measured.

[0313] exist Figure 22 In the figure, the dashed lines represent the values ​​measured under the condition that each of the first length X1 and the second length X2 of the vibrating member 110 in the first direction X is 65 mm and each of the first length Y1 and the second length Y2 of the vibrating member 110 in the second direction Y is 65 mm.

[0314] exist Figure 22 In the figure, the solid line represents the value measured under the condition that each of the first length X1 and the second length X2 of the vibrating member 110 in the first direction X is 65 mm, the first length Y1 of the vibrating member 110 in the second direction Y is 60 mm, and the second length Y2 of the vibrating member 110 in the second direction Y is 70 mm.

[0315] exist Figure 22In the figure, the single-dotted line represents the value measured under the condition that each of the first length X1 and the second length X2 of the vibrating member 110 in the first direction X is 65 mm, the first length Y1 of the vibrating member 110 in the second direction Y is 55 mm, and the second length Y2 of the vibrating member 110 in the second direction Y is 75 mm.

[0316] exist Figure 22 In the figure, the thick dashed line represents the value measured under the condition that each of the first length X1 and the second length X2 of the vibrating member 110 in the first direction X is 65 mm, the first length Y1 of the vibrating member 110 in the second direction Y is 50 mm, and the second length Y2 of the vibrating member 110 in the second direction Y is 80 mm.

[0317] exist Figure 22 In the figure, the thick solid line represents the value measured under the condition that each of the first length X1 and the second length X2 of the vibrating member 110 in the first direction X is 65 mm, the first length Y1 of the vibrating member 110 in the second direction Y is 45 mm, and the second length Y2 of the vibrating member 110 in the second direction Y is 85 mm.

[0318] Compared to dashed lines, the sound pressure level of the low-pitched vocal band or main resonance band of the vibrating device 130 may increase in the solid lines, dotted lines, and thick solid lines. For example, the sound pressure level in the low-pitched vocal band or main resonance band may increase by about 400 Hz. Therefore, the sound pressure level of the low-pitched vocal band may be advantageous in the solid lines, dotted lines, and thick solid lines compared to dashed lines.

[0319] Within a specific frequency range of 2 kHz, including the quaternary resonant point, the sound pressure level can decrease in directions away from the central portion of the vibrating member 110. For example, the sound pressure level may decrease by approximately 6 dB in the thick dashed line compared to the dashed line.

[0320] Therefore, for example, when the position of one corner of the vibrating member 110 in the first direction X is defined as 0% and the position of the other corner of the vibrating member 110 in the first direction X is defined as 100%, the vibration device 130 can be set in the range of 35% to 65% in the first direction X of the vibrating member 110, or it can be set in the range of 38.5% to 61.5%.

[0321] Therefore, for example, when the position of one corner of the vibrating member 110 in the second direction Y is defined as 0% and the position of the other corner of the vibrating member 110 in the second direction Y is defined as 100%, the vibration device 130 can be set in the range of 35% to 65% in the second direction Y of the vibrating member 110, or it can be set in the range of 38.5% to 61.5%.

[0322] The sound device according to embodiments of this disclosure will now be described.

[0323] An apparatus according to an embodiment of the present disclosure may include: a vibrating member; a housing at the rear surface of the vibrating member; a connecting member between the vibrating member and the housing; and a vibrating device that causes the vibrating member to vibrate.

[0324] According to some embodiments of this disclosure, the vibrating member may have a non-flat structure.

[0325] According to some embodiments of this disclosure, the vibration member may include a vibration member protrusion that protrudes from the rear surface of the vibration member, and the vibration member protrusion and the vibration member may be configured as one unit.

[0326] According to some embodiments of the present disclosure, the vibrating member may further include a vibrating member recess, which may be disposed on a first surface of the vibrating member to have a thickness thinner than another part of the vibrating member, and the vibrating device may overlap with at least a portion of the vibrating member recess.

[0327] According to some embodiments of this disclosure, the housing may include: a bottom; a side portion connected to the outer periphery of the bottom to protrude toward the vibrating member; and a recess portion disposed on the inner surface of the side portion.

[0328] According to some embodiments of this disclosure, the outer peripheral portion of the vibrating member can be inserted into a recess in the housing.

[0329] According to some embodiments of this disclosure, the vibration member may include a vibration member protrusion, and the vibration member protrusion may protrude from the second surface of the vibration member and be inserted into the groove.

[0330] According to some embodiments of the present disclosure, the vibrating member may further include a vibrating member recess, which may be disposed on a first surface of the vibrating member to have a thickness thinner than another part of the vibrating member. The vibrating device may overlap with at least a portion of the vibrating member recess, and the outer peripheral portion of the vibrating member may be inserted into the recess of the housing.

[0331] According to some embodiments of this disclosure, the connecting member may include: a first connecting member disposed at the upper end of the recessed portion of the housing; and a second connecting member disposed at the lower end of the recessed portion of the housing.

[0332] According to some embodiments of the present disclosure, the sound device may further include an inner housing disposed inside the housing to surround the vibrating device, the inner housing may include: a bottom; a side portion connected to the outer periphery of the bottom to project toward the vibrating member; and a first reinforcing member disposed at the central portion of the bottom, the first reinforcing member projecting to contact the vibrating device.

[0333] According to some embodiments of this disclosure, the inner housing may further include a second reinforcing member disposed at the outer periphery of the first reinforcing member to protrude from the bottom toward the vibrating device, and the second reinforcing member may have a lower height than the first reinforcing member.

[0334] According to some embodiments of this disclosure, the inner housing may further include an opening portion formed through a first surface of the bottom and a second surface of the bottom opposite to the first surface, and the opening portion may include at least one of a hole shape and a slit shape.

[0335] According to some embodiments of this disclosure, the sound device may further include: a secondary vibrating member between the inner housing and the vibrating member; a third connecting member between the inner housing and the secondary vibrating member; and a fourth connecting member between the secondary vibrating member and the vibrating member.

[0336] According to some embodiments of this disclosure, the sound device may further include a sound processing circuit installed at the bottom of the inner housing, and the sound processing circuit may be connected to the vibration device via a signal cable.

[0337] According to some embodiments of the present disclosure, the vibration device can be configured to overlap with the vibration member between one corner and another corner in a first direction or a second direction, and the central portion of the horizontal surface of the vibration device can overlap with the central portion of the horizontal surface of the vibration member, or be configured close to the central portion of the horizontal surface of the vibration member in the first direction or the second direction.

[0338] According to some embodiments of this disclosure, the central portion of the horizontal surface of the vibrating device may be arranged in the range of 0% to 15% from the central portion of the horizontal surface of the vibrating member in a first direction or a second direction, relative to the size of the effective vibrating plate of the vibrating member.

[0339] According to some embodiments of the present disclosure, the vibration device may include a vibration apparatus, which may include: a vibration part; a first electrode part located on a first surface of the vibration part; and a second electrode part located on a second surface different from the first surface of the vibration part.

[0340] According to some embodiments of this disclosure, the vibration device may further include: a first cover member located at the first electrode portion; and a second cover member located at the second electrode portion.

[0341] According to some embodiments of the present disclosure, the vibration device may further include: a first adhesive layer between the first cover member and the first electrode portion; and a second adhesive layer between the second cover member and the second electrode portion.

[0342] According to some embodiments of this disclosure, the vibrating part may include an inorganic material portion having piezoelectric properties.

[0343] According to some embodiments of this disclosure, the vibrating part may include: a plurality of inorganic material portions having piezoelectric properties; and a plurality of organic material portions situated between the plurality of inorganic material portions.

[0344] According to some embodiments of this disclosure, the vibrating component may include a metallic material, or one or more single non-metallic materials or composite non-metallic materials selected from wood, rubber, plastic, glass, fiber, fabric, paper, mirror, carbon and leather.

[0345] According to some embodiments of this disclosure, the vibrating component may include one or more of the following: a display panel including pixels configured to display images, a light-emitting diode illumination panel, an organic light-emitting illumination panel, and an inorganic light-emitting illumination panel.

[0346] According to some embodiments of this disclosure, the vibrating component may include one or more of the following: a display panel including pixels configured to display images, a screen panel on which images will be projected from a display device, a lighting panel, a sign panel, vehicle interior materials, vehicle windows, vehicle exterior materials, building ceiling materials, building interior materials, building windows, aircraft interior materials, aircraft windows, metal, wood, rubber, plastic, glass, fiber, fabric, paper, leather, carbon, and mirror.

[0347] The sound device according to embodiments of this disclosure can be connected to all electronic devices via wired or wireless means and can be used as a sound device for the corresponding electronic device. For example, devices capable of connecting to the sound device according to some embodiments of this disclosure can be applied to mobile devices, video phones, smartwatches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, bending devices, sliding devices, variable devices, electronic managers, e-books, portable multimedia players (PMPs), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop personal computers (PCs), laptop PCs, netbooks, workstations, navigation devices, vehicle navigation devices, vehicle display devices, vehicle equipment, theater equipment, theater display devices, televisions, wallpaper display devices, signage devices, game consoles, laptop computers, monitors, cameras, portable camcorders, and home appliances, etc. Furthermore, the sound device according to some embodiments of this disclosure can be applied to organic light-emitting lighting devices or inorganic light-emitting lighting devices. When the sound device according to some embodiments of this disclosure is applied to a lighting device, the lighting device can function as both lighting and a speaker. Furthermore, when a sound device according to some embodiments of this disclosure is applied to a mobile device or the like, the sound device may be one or more of a speaker, a receiver, and a tactile device, but the embodiments of this disclosure are not limited thereto.

[0348] At least some implementation methods are defined by the examples given below.

[0349] Example 1. A sound device, comprising:

[0350] Vibrating components;

[0351] A housing located on the rear surface of the vibrating member;

[0352] A connecting member, the connecting member being located between the vibrating member and the housing; and

[0353] A vibration device that causes the vibrating component to vibrate.

[0354] Example 2. The sound device according to Example 1, wherein the vibrating member has a non-flat structure.

[0355] Example 3. The sound device according to Example 2, wherein:

[0356] The vibrating component includes a vibrating component protrusion.

[0357] The protrusion of the vibrating component protrudes from the rear surface of the vibrating component, and

[0358] The protruding part of the vibration component and the vibration component are configured as one unit.

[0359] Example 4. The sound device according to Example 2 or 3, wherein:

[0360] The vibrating component also includes a vibrating component groove.

[0361] The groove portion of the vibrating member is provided on the first surface of the vibrating member, so as to have a thinner thickness than another part of the vibrating member, and

[0362] The vibration device overlaps with at least a portion of the groove of the vibration component.

[0363] Example 5. The sound device according to Example 1, wherein the housing comprises:

[0364] bottom;

[0365] Side portion, the side portion being connected to the outer periphery of the bottom and projecting toward the vibrating member; and

[0366] A groove portion is provided on the inner surface of the side portion.

[0367] Example 6. The sound device according to Example 5, wherein the outer peripheral portion of the vibrating member is inserted into the recessed portion of the housing.

[0368] Example 7. The sound device according to Example 5, wherein the vibrating member includes a vibrating member protrusion, and

[0369] The protrusion of the vibrating member protrudes from the second surface of the vibrating member and is inserted into the groove.

[0370] Example 8. The sound device according to Example 5, wherein:

[0371] The vibrating component also includes a vibrating component groove.

[0372] The groove portion of the vibrating member is provided on the first surface of the vibrating member, so as to have a thinner thickness than another part of the vibrating member.

[0373] The vibration device overlaps with at least a portion of the groove of the vibration component, and

[0374] The outer peripheral portion of the vibrating component is inserted into the groove of the housing.

[0375] Example 9. The sound device according to Example 6, wherein the connecting member comprises:

[0376] A first connecting member is disposed at the upper end of the recessed portion of the housing; and

[0377] A second connecting member is disposed at the lower end of the groove portion of the housing.

[0378] Example 10. The sound device according to Example 1 further includes an inner housing disposed inside the housing to surround the vibrating device.

[0379] The inner shell includes:

[0380] bottom;

[0381] Side portion, the side portion being connected to the outer periphery of the bottom and projecting toward the vibrating member; and

[0382] A first reinforcing member is disposed at the center portion of the bottom and protrudes to contact the vibrating device.

[0383] Example 11. The sound device according to Example 10, wherein:

[0384] The inner housing further includes a second reinforcing member disposed at the outer peripheral portion of the first reinforcing member to protrude from the bottom toward the vibration device, and

[0385] The second reinforcing member has a lower height than the first reinforcing member.

[0386] Example 12. The sound device according to Example 10, wherein:

[0387] The inner housing also includes an opening portion formed through a first surface of the bottom and a second surface of the bottom opposite to the first surface.

[0388] The opening includes at least one of a hole shape and a slit shape.

[0389] Example 13. The sound device according to Example 10 further includes:

[0390] A secondary vibration component is located between the inner housing and the vibration component.

[0391] A third connecting member is located between the inner housing and the secondary vibration member; and

[0392] A fourth connecting member is provided between the secondary vibration member and the vibration member.

[0393] Example 14. The sound device according to Example 10 further includes a sound processing circuit mounted at the bottom of the inner housing, and

[0394] The sound processing circuit is connected to the vibration device via a signal cable.

[0395] Example 15. The sound device according to Example 1, wherein:

[0396] The vibration device is arranged to overlap with the vibration member in a first or second direction, between one corner and another corner of the vibration member, and

[0397] The central portion of the horizontal surface of the vibrating device overlaps with the central portion of the horizontal surface of the vibrating member, or is configured to be close to the central portion of the horizontal surface of the vibrating member in the first direction or the second direction.

[0398] Example 16. The sound device according to Example 15, wherein, relative to the size of the effective vibrating plate of the vibrating member, the central portion of the horizontal surface of the vibrating device is arranged in the first direction or the second direction, within a range of 0% to 15% from the central portion of the horizontal surface of the vibrating member.

[0399] Example 17. A sound device according to any one of Examples 1 to 16, wherein the vibrating device includes a vibrating mechanism.

[0400] The vibration device includes:

[0401] Vibrating part;

[0402] A first electrode portion, the first electrode portion being located at a first surface of the vibrating portion; and

[0403] The second electrode portion is located on a second surface that is different from the first surface of the vibrating portion.

[0404] Example 18. The sound device according to Example 17, wherein the vibration device further comprises:

[0405] A first cover member, the first cover member being located at the first electrode portion; and

[0406] The second cover member is located at the second electrode portion.

[0407] Example 19. The sound device according to Example 18, wherein the vibration device further comprises:

[0408] A first adhesive layer, the first adhesive layer being between the first cover member and the first electrode portion; and

[0409] A second adhesive layer is disposed between the second cover member and the second electrode portion.

[0410] Example 20. The sound device according to Example 17, wherein the vibrating part comprises an inorganic material portion having piezoelectric properties.

[0411] Example 21. The sound device according to Example 17, wherein the vibrating part comprises:

[0412] Multiple inorganic material portions, wherein the multiple inorganic material portions have piezoelectric properties; and

[0413] Multiple organic material portions, wherein the organic material portions are located between the multiple inorganic material portions.

[0414] Example 22. The sound device according to Example 21, wherein the plurality of inorganic material portions and the plurality of organic material portions are arranged alternately and repeatedly along the width or length direction of the vibrating part.

[0415] Example 23. The sound device according to Example 22, wherein each of the plurality of organic material portions has a different width from each other, and

[0416] The organic material portion with the largest width among the plurality of organic material portions is arranged at the portion where the maximum stress occurs when the vibrating part vibrates in the vertical direction, and the organic material portion with the smallest width among the plurality of organic material portions is arranged at the portion where the lower stress occurs when the vibrating part vibrates in the vertical direction.

[0417] Example 24. The sound device according to Example 22, wherein the width of each of the plurality of inorganic material portions gradually decreases or increases in the direction from the center portion of the vibrating part to the outer periphery.

[0418] Example 25. The sound device according to Example 22, wherein the plurality of organic material portions have a smaller modulus and viscoelasticity than the plurality of inorganic material portions.

[0419] Example 26. A sound device according to any one of Examples 1 to 16, wherein the vibrating member comprises a metallic material, or a single nonmetallic material or composite nonmetallic material comprising one or more of wood, rubber, plastic, glass, fiber, fabric, paper, mirror, carbon and leather.

[0420] Example 27. A sound device according to any one of Examples 1 to 16, wherein the vibrating member comprises one or more of the following: a display panel including pixels configured to display images, a light-emitting diode illumination panel, an organic light-emitting illumination panel and an inorganic light-emitting illumination panel, a screen panel on which images are projected from the display device, a sign panel, vehicle interior material, vehicle window, vehicle exterior material, building ceiling material, building interior material, building window, aircraft interior material and aircraft window.

[0421] Example 28. A vehicle device including a sound device according to any one of Examples 1 to 16.

[0422] It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure without departing from the spirit or scope thereof. Therefore, this disclosure is intended to cover modifications and variations thereof, provided they fall within the scope of the appended claims and their equivalents.

Claims

1. A sound device, comprising: Vibrating components; A housing located on the rear surface of the vibrating member; A connecting member, the connecting member being located between the vibrating member and the housing; and A vibration device that causes the vibrating component to vibrate. The vibration component includes a vibration component groove. The groove portion of the vibration member is provided on the first surface of the vibration member to have a thinner thickness than another portion of the vibration member, and the surface of the vibration member opposite to the first surface is closer to the vibration device.

2. The sound device according to claim 1, wherein: The vibrating component includes a vibrating component protrusion. The protrusion of the vibrating component protrudes from the rear surface of the vibrating component, and The protruding part of the vibration component and the vibration component are configured as one unit.

3. The sound device according to claim 1, wherein: The vibration device overlaps with at least a portion of the groove of the vibration component.

4. The sound device according to claim 2, wherein: The vibration device overlaps with at least a portion of the groove of the vibration component.

5. The sound device according to claim 1, wherein, The housing includes: bottom; Side portion, the side portion being connected to the outer periphery of the bottom and projecting toward the vibrating member; and A groove portion is provided on the inner surface of the side portion.

6. The sound device according to claim 5, wherein, The outer portion of the vibrating component is inserted into the groove of the housing.

7. The sound device according to claim 5, wherein, The vibrating component includes a vibrating component protrusion, and The protrusion of the vibrating member protrudes from the second surface of the vibrating member and is inserted into the groove.

8. The sound device according to claim 5, wherein: The vibration device overlaps with at least a portion of the groove of the vibration component, and The outer portion of the vibrating component is inserted into the recessed portion of the housing.

9. The sound device according to claim 6, wherein, The connecting component includes: A first connecting member is disposed at the upper end of a recess in the housing; and The second connecting member is disposed at the lower end of the groove portion of the housing.

10. The sound device according to claim 1, further comprising an inner housing disposed within the housing to surround the vibrating device. in, The inner shell includes: bottom; Side portion, the side portion being connected to the outer periphery of the bottom and projecting toward the vibrating member; and A first reinforcing member is disposed at the center portion of the bottom and protrudes to contact the vibrating device.

11. The sound device according to claim 10, wherein: The inner housing further includes a second reinforcing member disposed at the outer peripheral portion of the first reinforcing member to protrude from the bottom toward the vibration device, and The second reinforcing member has a lower height than the first reinforcing member.

12. The sound device according to claim 10, wherein: The inner housing also includes an opening portion formed through a first surface of the bottom and a second surface of the bottom opposite to the first surface. The opening includes at least one of a hole shape and a slit shape.

13. The sound device according to claim 10, further comprising: A secondary vibration component is located between the inner housing and the vibration component. A third connecting member is located between the inner housing and the secondary vibration member; as well as A fourth connecting member is provided between the secondary vibration member and the vibration member.

14. The sound device of claim 10, further comprising a sound processing circuit mounted at the bottom of the inner housing, and The sound processing circuit is connected to the vibration device via a signal cable.

15. The sound device according to claim 1, wherein: The vibration device is arranged to overlap with the vibration member in a first or second direction, between one corner and another corner of the vibration member, and The central portion of the horizontal surface of the vibrating device overlaps with the central portion of the horizontal surface of the vibrating member, or is configured to be close to the central portion of the horizontal surface of the vibrating member in the first direction or the second direction.

16. The sound device according to claim 15, wherein, Relative to the size of the effective vibrating plate of the vibrating member, the central portion of the horizontal surface of the vibrating device is arranged within a range of 0% to 15% from the central portion of the horizontal surface of the vibrating member in either the first or second direction.

17. The sound device according to any one of claims 1 to 16, wherein, The vibration equipment includes a vibration device. The vibration device includes: Vibrating part; A first electrode portion, the first electrode portion being located at a first surface of the vibrating portion; and The second electrode portion is located on a second surface of the vibrating portion that is different from the first surface.

18. The sound device according to claim 17, wherein, The vibration device also includes: A first cover member, the first cover member being located at the first electrode portion; and The second cover member is located at the second electrode portion.

19. The sound device according to claim 18, wherein, The vibration device also includes: A first adhesive layer, the first adhesive layer being between the first cover member and the first electrode portion; and A second adhesive layer is disposed between the second cover member and the second electrode portion.

20. The sound device according to claim 17, wherein, The vibrating part includes an inorganic material portion with piezoelectric properties.

21. The sound device according to claim 17, wherein, The vibrating part includes: Multiple inorganic material portions, wherein the multiple inorganic material portions have piezoelectric properties; and Multiple organic material portions, wherein the organic material portions are located between the multiple inorganic material portions.

22. The sound device according to claim 21, wherein, The plurality of inorganic material portions and the plurality of organic material portions are arranged alternately and repeatedly along the width or length direction of the vibrating part.

23. The sound device according to claim 22, wherein, Each of the plurality of organic material portions has a different width from the others, and The organic material portion with the largest width among the plurality of organic material portions is arranged at the portion where the maximum stress occurs when the vibrating part vibrates in the vertical direction, and the organic material portion with the smallest width among the plurality of organic material portions is arranged at the portion where the lower stress occurs when the vibrating part vibrates in the vertical direction.

24. The sound device according to claim 22, wherein, The width of each of the plurality of inorganic material portions gradually decreases or increases in the direction from the center portion of the vibrating part to the outer periphery.

25. The sound device according to claim 22, wherein, The plurality of organic material portions have a smaller modulus and viscoelasticity than the plurality of inorganic material portions.

26. The sound device according to any one of claims 1 to 16, wherein, The vibrating component includes metallic materials, or one or more single or composite non-metallic materials selected from wood, rubber, plastic, glass, fiber, fabric, paper, mirror, carbon, and leather.

27. The sound device according to any one of claims 1 to 16, wherein, The vibrating component includes one or more of the following: a display panel comprising pixels configured to display images, a light-emitting diode illumination panel, an organic light-emitting illumination panel and an inorganic light-emitting illumination panel, a screen panel on which images are projected from a display device, a sign panel, vehicle interior materials, vehicle windows, vehicle exterior materials, building ceiling materials, building interior materials, building windows, aircraft interior materials and aircraft windows.

28. A vehicle device comprising a sound device according to any one of claims 1 to 16.

Images