Chip appearance inspection apparatus

Abstract

The application provides a chip appearance detection device, which comprises a mounting seat, a feeding module, a lower surface detection module, a first conveying module and a suction module. The feeding module is arranged on the mounting seat and has a storage area and a feeding area. The feeding module is used for moving a tray on the storage area to the feeding area. The lower surface detection module is arranged on the mounting seat. The first conveying module is arranged on the mounting seat and crosses the feeding module and the lower surface detection module. The suction module is arranged on the first conveying module. The first conveying module is used for driving the suction module to move back and forth between the upper side of the feeding area and the upper side of the lower surface detection module, so that the suction module sucks the chips on the tray or releases the sucked chips back to the tray. Alternatively, the lower surface detection module detects the lower surface of the chips sucked by the suction module. The upper surface detection module is arranged on the first conveying module. The first conveying module drives the upper surface detection module to move to the upper side of the feeding area.

Description

Technical Field

[0001] This invention relates to the technical field of chip inspection, and more particularly to a chip appearance inspection device. Background Technology

[0002] Both the upper and lower surfaces of finished and semi-finished chips need to be inspected for various characteristic defects, including broken pins, poor soldering, short circuits, missing straight balls, dust adhesion, contamination, cracks, shell defects, and surface scratches.

[0003] In the existing technology, when testing chips, multiple testing devices are required to test the upper and lower surfaces of the chip separately. Specifically, the chip is first moved manually to the testing device for the upper surface to be tested. After the upper surface test is completed, the chip is then moved manually to the testing device for the lower surface. Therefore, manual handling of the chip is required to transfer the chip between multiple testing devices. However, the chip is prone to secondary damage during manual handling. Summary of the Invention

[0004] The purpose of this invention is to provide a chip appearance inspection device to solve the technical problem that when using multiple inspection devices to inspect the upper and lower surfaces of a chip, it is necessary to manually handle the chip to transfer it between the multiple inspection devices, which leads to secondary damage to the chip during the manual handling process.

[0005] This invention provides a chip appearance inspection device, comprising:

[0006] Mounting base;

[0007] A feeding module is disposed on the mounting base. The feeding module has a storage area and a receiving area. The storage area is used to stack trays carrying chips to be tested. The feeding module is used to transfer the trays on the storage area to the receiving area.

[0008] A lower surface detection module is mounted on the mounting base;

[0009] A first transport module is disposed on the mounting base, passing over the feeding module and the lower surface detection module;

[0010] A suction module is mounted on a first transport module. The first transport module drives the suction module to move back and forth between above the material receiving area and above the lower surface detection module. When the suction module is above the material receiving area, it picks up the chip on the tray or releases the picked-up chip back onto the tray. When the suction module is above the lower surface detection module, the lower surface detection module detects the lower surface of the chip picked up by the suction module.

[0011] An upper surface detection module is disposed on the first transport module. The first transport module drives the upper surface detection module to move above the material receiving area so that the upper surface detection module can detect the upper surface of the chip on the tray.

[0012] As an embodiment of the present invention, the chip appearance inspection device further includes a first recycling module, a second recycling module, a second transport module, and a sorting module;

[0013] The first recycling module and the second recycling module are arranged side by side on the mounting base, and the first recycling module is connected to the end of the feeding module away from the storage area;

[0014] The first recycling module has a first sorting area and a first recycling area. The feeding module is further used to transfer the pallet in the feeding area to the first sorting area, and the first recycling module is used to transfer the pallet in the first sorting area to the first recycling area. The second recycling module has a second sorting area and a second recycling area, and the first recycling module is used to transfer the pallet in the second sorting area to the second recycling area.

[0015] The second transport module spans the first recycling module, and the second recycling module is mounted on the mounting base;

[0016] The sorting module is mounted on the second transport module, which drives the sorting module to move back and forth between the first recycling module and the second recycling module to transport the tray or chip from the first sorting area to the second sorting area, or to transport the chip from the second sorting area to the first sorting area.

[0017] As an embodiment of the present invention, the feeding module includes a first support, a first conveying component, a material preparation and stacking component, and a first lifting component;

[0018] The storage area and the receiving area are formed by the first support;

[0019] The first conveying component is disposed on the first support, and the first conveying component includes a conveying tray that can move back and forth between the storage area and the receiving area;

[0020] The material preparation and stacking assembly includes a first telescopic drive and a first support. The first telescopic drive is disposed in the material storage area. The power output end of the first telescopic drive is connected to the first support. The first telescopic drive drives the first support to extend or retract.

[0021] The first lifting assembly is located in the storage area. The first lifting assembly includes a first lifting drive and a first lifting plate. The first lifting drive is located on the mounting base. The first lifting plate is connected to the power output end of the first lifting drive and is lower than the first support.

[0022] In this configuration, the first telescopic drive drives the first support to extend, and multiple pallets are stacked on the first support to form a pallet stack. When it is necessary to move the pallets in the storage area to the receiving area, the conveyor pallet is moved to the storage area and positioned between the first support and the first lifting plate. The first lifting drive drives the first lifting plate to rise, and the first lifting plate rises beside the conveyor pallet to lift the pallet stack. The first telescopic drive drives the first support to retract to avoid the pallet stack, and the first lifting drive drives the first lifting plate to descend. When the bottom pallet of the pallet stack descends below the first support, the first telescopic drive drives the first support to extend to support the pallet stack except for the bottom pallet. The first lifting drive drives the first lifting plate to support the bottom pallet and continue to descend until the pallets on the first lifting plate descend to the conveyor pallet, and the conveyor pallet moves the pallets to the receiving area.

[0023] As an embodiment of the present invention, the first lifting plate includes a first fixing part and at least two first lifting parts. The first fixing part is connected to the power output end of the first lifting drive member, and the two first lifting parts are respectively connected to the opposite sides of the first fixing part; wherein, the first lifting parts move up and down beside the conveying tray.

[0024] The first lifting assembly further includes a first bracket, a first sensor, a second sensor, and a first sensor trigger; the first bracket is disposed on the mounting base, and the first lifting drive is disposed on the first bracket; the first sensor and the second sensor are spaced apart on the first bracket along the driving direction of the first lifting drive, and the first sensor trigger is disposed on the power output end of the first lifting drive, the first sensor trigger being used to trigger the sensing of the first sensor or the second sensor; wherein, when the first sensor trigger triggers the sensing of the first sensor, the first lifting drive stops driving the first lifting plate to descend; when the first sensor trigger triggers the sensing of the second sensor, the first lifting drive stops driving the first lifting plate to rise.

[0025] As an embodiment of the present invention, the first support forms a first conveying channel, and the conveying tray and the pallet on it are both located in the first conveying channel;

[0026] The conveying pallet also has a first stop and a second stop, which are arranged at intervals along the moving direction of the conveying pallet, and the first stop and the second stop respectively block the opposite ends of the pallet;

[0027] The first conveying assembly further includes a first rotation drive, a first driving wheel, a first driven wheel, a first conveyor belt, a first guide rail, and a first slider; the first rotation drive is mounted on the first support, the power output end of the first rotation drive is connected to the first driving wheel, the first driven wheel is mounted on the first support, and the first conveyor belt is tensioned and sleeved on the first driving wheel and the first driven wheel; the first guide rail is mounted on the first support, and the first slider is slidably connected to the first guide rail; the conveying tray is connected to one side of the first conveyor belt and the first slider.

[0028] As an embodiment of the present invention, the first support also forms a material transfer area, and the conveying pallet can also be moved to the material transfer area;

[0029] The feeding module also includes a second lifting component disposed in the material transfer area. The second lifting component includes a second lifting drive and a second lifting plate. The second lifting drive is disposed on the mounting base, and the second lifting plate is connected to the power output end of the second lifting drive.

[0030] When the conveying pallet and the pallet on it move to the transfer area, the second lifting drive drives the second lifting plate to rise. The second lifting plate rises to lift the pallet next to the conveying pallet. The conveying pallet leaves the transfer area. The second lifting drive drives the second lifting plate to fall until the pallet falls onto the first recycling module.

[0031] As an embodiment of the present invention, the suction module includes a first support plate, a first lifting assembly, a first suction nozzle assembly, and a first elastic assembly;

[0032] The first support plate is disposed on the first transport module; the first lifting component is disposed on the first support plate, and the first lifting component includes a first lifting plate that can move up and down relative to the first support plate; the first suction nozzle component is disposed on the first lifting plate; one end of the first elastic component is connected to the first support plate, and the other end of the first elastic component is connected to the first lifting plate.

[0033] As an embodiment of the present invention, the first lifting assembly further includes a second rotation drive, an eccentric shaft, a second guide rail, and a second slider;

[0034] The second rotation drive is disposed on the first support plate, the eccentric shaft is connected to the power output shaft of the second rotation drive, and the eccentric shaft is offset from the central axis of the power output shaft of the second rotation drive; the first lifting plate has a strip-shaped hole, the length extension direction of the strip-shaped hole is perpendicular to the lifting direction of the first lifting plate, and one end of the eccentric shaft away from the second rotation drive extends into the strip-shaped hole; one of the second guide rail and the second slider is disposed on the first support plate, and the other is disposed on the first lifting plate, and the second slider is slidably connected to the second guide rail.

[0035] As an embodiment of the present invention, the first suction nozzle assembly includes a first adjusting rod, a second adjusting rod, a first adjusting block, a second adjusting block, and a first suction nozzle;

[0036] There are at least two first adjusting rods, which are arranged at intervals relative to each other on the first lifting plate; each first adjusting rod is movably sleeved with a first adjusting block; a second adjusting rod is arranged between each pair of first adjusting blocks arranged opposite to each of the two first adjusting rods; multiple second adjusting blocks are movably sleeved on the second adjusting rods; and each second adjusting block is connected to a first suction nozzle.

[0037] As an embodiment of the present invention, the lower surface detection module includes a first mounting cylinder, a first mounting bracket, a first front camera, a side camera assembly, and a first light source assembly;

[0038] The first mounting cylinder has a first cavity and an upper end plate and a lower end plate located at opposite ends of the first cavity; the upper end plate has a first opening communicating with the first cavity, and the lower end plate has a second opening communicating with the first cavity, and the second opening is disposed opposite to the first opening, wherein, when the chip is tested, the chip is located above the upper end plate, and the lower surface of the chip faces the first opening;

[0039] The first mounting bracket is connected to the lower end plate;

[0040] The forward-facing camera is mounted on the first mounting bracket, and the forward-facing camera captures images of the chip through the second opening, the first cavity, and the first opening.

[0041] The side-facing camera assembly includes a side-facing camera and a reflector. The side-facing camera is mounted on the first mounting bracket and is angled to the central axis of the second opening. The reflector is mounted on the cavity wall of the cavity. The reflector receives incident light from the chip through the first opening and reflects the reflected light onto the side-facing camera through the second opening.

[0042] The first light source assembly is disposed on the first mounting cylinder and / or the first mounting bracket, and the first light source assembly provides a light source for the shooting of the first front-facing camera and / or the shooting of the side-facing camera.

[0043] As an embodiment of the present invention, the first light source assembly includes a front monochromatic light source, a back light source, and a side light source disposed on the first mounting cylinder;

[0044] The front monochromatic light source is used to illuminate the lower surface of the chip. The front monochromatic light source includes a front monochromatic strong light source and a front monochromatic weak light source. The light intensity of the front monochromatic strong light source is stronger than that of the front monochromatic weak light source. The front monochromatic strong light source is disposed on the cavity wall of the first cavity near the upper end plate. The front monochromatic weak light source is disposed on the upper end plate and is arranged around the first opening.

[0045] The backlight is used to illuminate the upper surface of the chip. The backlight includes a strong backlight and a weak backlight. The light intensity of the strong backlight is greater than that of the weak backlight, and the height of the weak backlight relative to the upper plate is greater than that of the strong backlight relative to the upper plate.

[0046] The side light source is disposed on the upper end plate and is used to illuminate the peripheral surface of the chip.

[0047] As an embodiment of the present invention, the first light source assembly further includes a first single-sided reflector, a first multi-color light source, and a second multi-color light source;

[0048] The first single-sided reflector is disposed between the first forward camera and the second opening. The first multi-color light source is disposed beside the first single-sided reflector. The first multi-color light source is used to emit light to the first single-sided reflector. The first single-sided reflector is used to reflect the incident light from the first multi-color light source onto the lower surface of the chip. The reflected light from the first single-sided reflector is parallel to the central axis of the second opening.

[0049] The second multicolor light source is disposed in the first cavity. The second multicolor light source is arranged in a ring around the second opening. The second multicolor light source has an illumination slope, and the distance between the illumination slope and the upper end plate gradually increases in the direction from the inner periphery to the outer periphery of the second multicolor light source.

[0050] As an embodiment of the present invention, the upper surface detection module includes a second mounting cylinder, a third mounting bracket, a second forward camera, and a second light source assembly;

[0051] The second mounting cylinder forms a second cavity and a fourth opening and a fifth opening, both communicating with the second cavity, with the fourth opening and the fifth opening positioned opposite each other. The third mounting bracket is mounted on the second mounting cylinder. The second forward camera is mounted on the third mounting bracket, with its shooting direction perpendicular to the fourth opening. The second light source assembly includes a third multi-color light source, a second single-sided reflector, and an oblique light source. The second single-sided reflector is positioned between the second forward camera and the fourth opening. The third multi-color light source is positioned beside the second single-sided reflector, emitting light towards the second single-sided reflector. The second single-sided reflector reflects the incident light from the third multi-color light source through the fourth opening, with the reflected light parallel to the central axis of the fourth opening. The oblique light source is positioned in the second cavity, with its light passing through the fifth opening, and its illumination direction forming an angle with the central axis of the fifth opening.

[0052] As an embodiment of the present invention, the first transport module includes a first gantry frame, a third rotation drive member, a second driving wheel, a second driven wheel, a second conveyor belt, a third guide rail, a third slider, a ninth sensor, a tenth sensor, and a fifth sensor trigger member;

[0053] The first gantry frame spans the loading module, and the lower surface detection module is mounted on the mounting base; the third rotation drive is mounted on the first gantry frame, the second driving wheel is connected to the power output end of the third rotation drive, the second driven wheel is mounted on the first gantry frame, and the second conveyor belt is tensioned and sleeved on the second driving wheel and the second driven wheel; the third guide rail is mounted on the first gantry frame, and the third slider is slidably connected to the third guide rail;

[0054] The suction module and the upper surface detection module are both connected to one side of the second conveyor belt and the third slider.

[0055] The ninth and tenth sensors are spaced apart on the first gantry along the conveying direction of the second conveyor belt; the fifth sensor trigger is disposed on the third slider and is used to trigger the sensing of the ninth or tenth sensor.

[0056] As an embodiment of the present invention, the sorting module includes a first support frame, a second lifting assembly, a clamp, a second conveying assembly, a second support plate, a third lifting assembly, a second suction nozzle, and a second elastic assembly;

[0057] The first support frame is mounted on the second transport module;

[0058] The second lifting component is mounted on the first support frame. The power output end of the second lifting component is connected to the clamp. The second lifting component drives the clamp to move up and down. The clamp has a clamping state and a releasing state. In the clamping state, the clamp holds the tray. In the releasing state, the clamp releases the tray.

[0059] The second conveying component is disposed on the first support frame, and the conveying direction of the second conveying component is perpendicular to the conveying direction of the second conveying module;

[0060] The second support plate is disposed on the second conveying assembly, and the third lifting assembly is disposed on the second support plate. The third lifting assembly includes a second lifting plate that can move up and down relative to the second support plate, and the second suction nozzle is disposed on the second lifting plate. One end of the second elastic component is connected to the second support plate, and the other end of the second elastic component is connected to the second lifting plate.

[0061] As an embodiment of the present invention, the first recycling module includes a second support, a third conveying component, a first positioning component, and a first vibration component;

[0062] The second support is disposed on the mounting base, and the first sorting area and the first recycling area are formed by the second support; the third conveying assembly is disposed on the second support, and the third conveying assembly is used to transfer the pallet located in the first sorting area to the first recycling area; the first positioning assembly is disposed on the second support and / or the mounting base, and the first positioning assembly is used to confine the pallet in the first sorting area; the first vibration assembly is disposed on the second support, and the first vibration assembly is used to vibrate the pallet in the first sorting area;

[0063] The second recycling module includes a third support, a fourth conveying component, a second positioning component, and a second vibration component; the third support is disposed on the mounting base, and the second sorting area and the second recycling area are formed by the third support; the fourth conveying component is disposed on the third support and is used to transfer the tray located in the second sorting area to the second recycling area; the second positioning component is disposed on the mounting base and is used to confine the tray in the second sorting area; the second vibration component is disposed on the third support, and the first vibration component is used to vibrate the tray in the second sorting area.

[0064] As an embodiment of the present invention, the first recycling module further includes a first recycling stacking component and a third lifting component disposed on the first recycling area;

[0065] The first recycling stacking assembly includes a first bearing and a first rotating plate. The first bearing is disposed on the second support, and the first rotating plate is rotatably disposed on the first bearing. The first rotating plate has a first flat position and a first avoidance position. In the first flat position, the first rotating plate is used to carry a pallet, and in the first avoidance position, the first rotating plate is used to avoid the pallet.

[0066] The third lifting assembly includes a fourth lifting drive and a third lifting plate. The fourth lifting drive is mounted on the mounting base, and the third lifting plate is connected to the power output end of the fourth lifting drive.

[0067] When the third conveying component moves the tray above the third lifting plate, the fourth lifting drive drives the third lifting plate to support the tray and rise. The tray abuts against the first rotating plate, causing the first rotating plate to switch to the first clearance state. When the tray rises above the first rotating plate, the first rotating plate drops and switches to the first flat position. The fourth lifting drive drives the third lifting plate to descend until the tray falls onto the first rotating plate.

[0068] The second recycling module also includes a second recycling stacking assembly and a fourth lifting assembly disposed on the second recycling area;

[0069] The second recycling stacking assembly includes a second bearing and a second rotating plate. The second bearing is disposed on the third support, and the second rotating plate is rotatably disposed on the bearing. The second rotating plate has a second flat position and a second avoidance position. In the second flat position, the second rotating plate is used to carry the pallet, and in the second avoidance position, the second rotating plate is used to avoid the pallet.

[0070] The fourth lifting assembly includes a fifth lifting drive component and a fourth lifting plate. The fifth lifting drive component is mounted on the mounting base, and the fourth lifting plate is connected to the power output end of the fifth lifting drive component.

[0071] When the fourth conveying component moves the tray above the fourth lifting plate, the fifth lifting drive drives the fourth lifting plate to support the tray and rise. The tray abuts against the second rotating plate, causing the second rotating plate to switch to the second avoidance state. When the tray rises above the second rotating plate, the second rotating plate falls and switches to the second flat position. The fifth lifting drive drives the fourth lifting plate to descend until the tray falls onto the second rotating plate.

[0072] As an embodiment of the present invention, the second transport module includes a second gantry frame, a fourth rotation drive member, a third driving wheel, a third driven wheel, a third conveyor belt, a fourth guide rail, a fourth slider, an eleventh sensor, a twelfth sensor, and a sixth sensor trigger member;

[0073] The second gantry spans the first recycling module, and the second recycling module is mounted on the mounting base; the fourth rotary drive is mounted on the second gantry, the third drive wheel is connected to the power output end of the fourth rotary drive, the third driven wheel is mounted on the second gantry, and the third conveyor belt is tensioned and sleeved on the third drive wheel and the third driven wheel; the fourth guide rail is mounted on the second gantry, and the fourth slider is slidably connected to the fourth guide rail;

[0074] The sorting module is connected to one side of the third conveyor belt and the fourth slider.

[0075] The eleventh and twelfth sensors are spaced apart on the second gantry along the conveying direction of the third conveyor belt; the sixth sensor trigger is disposed on the fourth slider and is used to trigger the sensing of the eleventh or twelfth sensor.

[0076] As an embodiment of the present invention, the chip appearance inspection device further includes a manual recycling module, which is arranged side by side with the first recycling module and the second recycling module, and the second transport module passes over the manual recycling module;

[0077] The manual recycling module includes a positioning support, a sliding guide assembly, a guide plate, and a recycling tray. The positioning support is mounted on the mounting base and has a first positioning structure. The sliding guide assembly is mounted on the mounting base and extends toward the positioning support. The end of the sliding guide assembly near the positioning support is a third sorting area, and the end away from the positioning support is a third recycling area. The guide plate is mounted on the sliding guide assembly and can move back and forth between the third sorting area and the third recycling area. The guide plate has a second positioning structure that cooperates with the first positioning structure to confine the guide plate to the third sorting area. The recycling tray is placed on the guide plate and is used to recycle chips.

[0078] Implementing the embodiments of the present invention will have the following beneficial effects:

[0079] In this embodiment of the invention, a tray carrying chips to be tested is stacked on the storage area of ​​the loading module. The loading module moves the tray from the storage area to the receiving area. At this point, the first transport module moves the suction module above the receiving area, allowing the suction module to adsorb the upper surface of the chips on the tray, thus removing the chips from the tray. The first transport module then moves the suction module above the lower surface detection module, so that the lower surface of the chip held by the suction module is above the lower surface detection module, allowing the lower surface detection module to detect the lower surface of the chip. After the lower surface of the chip is detected, the first transport module again moves the suction module above the receiving area, and the suction module... The chip with the lower surface inspection completed is released back into the tray; then, the upper surface inspection module is moved to above the material receiving area through the first transport module. At this time, the upper surface inspection module is located above the chip, so that the upper surface inspection module can inspect the upper surface of the chip on the tray. The chip appearance inspection equipment provided by this technical solution can complete the comprehensive inspection of the upper and lower surfaces of the chip, eliminating the need for manual handling to transfer the chip to other inspection equipment. This solves the technical problem of existing technologies that require manual handling of the chip to transfer it between multiple inspection equipment when using multiple inspection equipment to inspect the upper and lower surfaces of the chip, which leads to secondary damage to the chip during manual handling. Attached Figure Description

[0080] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0081] Figure 1 This is a schematic diagram of the overall structure of a chip appearance inspection device according to an embodiment of the present invention;

[0082] Figure 2 This is a schematic diagram of the overall structure of the feeding module in one embodiment of the present invention;

[0083] Figure 3 This is a partial structural diagram of the feeding module in one embodiment of the present invention;

[0084] Figure 4 This is a schematic diagram of the overall structure of the lower surface detection module in one embodiment of the present invention;

[0085] Figure 5 This is a cross-sectional view of the lower surface detection module in one embodiment of the present invention;

[0086] Figure 6 This is a schematic diagram of the overall structure of the first transport module, the suction module, and the upper surface detection module in one embodiment of the present invention;

[0087] Figure 7 This is a schematic diagram of the overall structure of the absorption module in one embodiment of the present invention;

[0088] Figure 8 This is a partial exploded structural diagram of the absorption module in one embodiment of the present invention;

[0089] Figure 9 This is a cross-sectional view of the upper surface detection module in one embodiment of the present invention;

[0090] Figure 10 This is a schematic diagram of the overall structure of the first recycling module in one embodiment of the present invention;

[0091] Figure 11 This is a partial structural diagram of the first recycling module in one embodiment of the present invention;

[0092] Figure 12 This is a schematic diagram of the overall structure of the second recycling module in one embodiment of the present invention;

[0093] Figure 13 This is a partial structural diagram of the second recycling module in one embodiment of the present invention;

[0094] Figure 14This is a schematic diagram of the overall structure of the second transport module and the sorting module in one embodiment of the present invention;

[0095] Figure 15 This is a schematic diagram of the overall structure of the second transport module in one embodiment of the present invention.

[0096] Figure 16 This is a schematic diagram of the overall structure of the sorting module in one embodiment of the present invention;

[0097] Figure 17 This is a partial structural diagram of a sorting module in one embodiment of the present invention;

[0098] Figure 18 This is a schematic diagram of the overall structure of the manual recycling module from a first-view perspective in one embodiment of the present invention;

[0099] Figure 19 This is a schematic diagram of the overall structure of the manual recovery module from a second perspective in one embodiment of the present invention.

[0100] in:

[0101] 100. Chip appearance inspection equipment; 10. Mounting base; 20. Feeding module; 20a. Storage area; 20b. Feeding area; 20c. First conveying channel; 20d. Transfer area; 21. First support; 211. First side plate; 212. First frame; 22. First conveying assembly; 221. Conveying tray; 2211. First stop; 2212. Second stop; 222. First rotation drive; 223. First driving wheel; 224. First driven wheel; 225. First conveyor belt; 226. First guide rail; 227. First slider; 228. Third sensor; 229. Fourth sensor; 23. Material stacking assembly; 231. First telescopic drive; 232. First support; 233. First limiting plate; 234. First through-beam sensor; 235. Second through-beam sensor; 24. First lifting assembly; 241. First lifting drive component; 242. First lifting plate; 2421. First fixing part; 2422. First lifting part; 243. First bracket; 244. First sensor; 245. Second sensor; 246. First sensing trigger; 25. Second lifting assembly; 251. Second lifting drive component; 252. Second lifting plate; 2521. Second fixing part; 2522. Second lifting part; 253. Second bracket; 254. Fifth sensor; 255. Sixth sensor; 256. Third sensing trigger; 30. Lower surface detection module; 31. First mounting cylinder; 311. First cavity; 312. Upper end plate 313. Lower end plate; 314. First opening; 315. Second opening; 32. First mounting bracket; 321. First connecting plate; 322. First mounting plate; 3221. Third opening; 323. Second mounting plate; 33. First front-facing camera; 34. Side-facing camera assembly; 341. Side-facing camera; 342. Reflector; 351. Front monochromatic light source; 3511. Front monochromatic strong light source; 3512. Front monochromatic weak light source; 352. Back light source; 3521. Back strong light source; 35211. First back strong light source; 35212. Second back strong light source; 3522. Back weak light source; 353. First condenser lens; 354. Second condenser lens; 355. Side light source; 356. First one-sided reflector; 3 57. First multi-color light source; 358. Second multi-color light source; 3581. Irradiation slope; 36. Second mounting bracket; 361. First plate; 362. Second plate; 363. Third plate; 364. Fourth plate; 365. Fifth plate; 40. First transport module; 41. First gantry frame; 42. Third rotation drive component; 43. Second driving wheel; 44. Second driven wheel; 45. Second conveyor belt; 46. Third guide rail; 47. Third slider; 48. Ninth sensor; 49. Tenth sensor; 50. Suction module; 51. First support plate; 52. First lifting assembly; 521. First lifting plate; 5211. Strip hole; 522. Second rotation drive component; 523. Eccentric shaft; 524. Second guide rail;528. Fourth sensor trigger; 53. First suction nozzle assembly; 531. First adjusting rod; 532. Second adjusting rod; 533. First adjusting block; 534. Second adjusting block; 535. First suction nozzle; 54. First elastic component; 60. Upper surface detection module; 61. Second mounting cylinder; 611. Second cavity; 612. Fourth opening; 613. Fifth opening; 62. Third mounting bracket; 63. Second forward-facing camera; 64. Second light source assembly; 641. Third multi-color light source; 642. Second single-sided reflector; 643. Oblique light source; 70. First recycling module; 70a. First sorting area; 70b. First recycling area; 71. Second support; 711. Second side plate; 72. Third conveying assembly; 721. 722. Seventh rotating drive component; 723. Sixth driving wheel; 724. Sixth driven wheel; 725. Sixth conveyor belt; 73. First positioning component; 731. First end stop; 732. First end pusher; 733. First side stop; 734. First side pusher; 74. Third through-beam sensor; 75. First vibration component; 76. First recycling stacking component; 761. First bearing seat; 762. First rotating plate; 763. First rotation limiter; 764. Second limit plate; 765. Fourth through-beam sensor; 766. Eighth through-beam sensor; 77. Third lifting component; 771. Fourth lifting drive component; 772. Third lifting plate; 80. Second recycling module; 80a. Second sorting area; 80b. Second recycling area; 81. Third support; 811. Third side plate; 82. Fourth conveyor assembly; 821. Eighth rotation drive; 822. Seventh driving wheel; 823. Seventh driven wheel; 824. Seventh conveyor belt; 83. Second positioning assembly; 831. Second end stop; 832. Second end pusher; 833. Second side stop; 834. Second side pusher; 84. Fifth through-beam sensor; 85. Second vibration assembly; 86. Second recycling stacking assembly; 861. Second shaft seat; 862. Second rotating plate; 863. Second rotation limiter; 864. Third limit plate; 865. Ninth through-beam sensor; 866. Tenth through-beam sensor; 87. Fourth lifting assembly; 871. Fifth lifting drive; 872. Fourth lifting... 90. Sorting module; 91. First support frame; 92. Second lifting assembly; 921. Third lifting drive; 922. Seventh guide rail; 923. Seventh slider; 924. Seventeenth sensor; 925. Eighteenth sensor; 926. Ninth sensor trigger; 93. Clamp; 94. Second conveyor assembly; 941. Fifth rotation drive; 942. Fourth drive wheel; 943. Fourth driven wheel; 944. Fourth conveyor belt; 945. Fifth guide rail; 946. Fifth slider; 947. Thirteenth sensor; 95. Second support plate; 96. Third lifting assembly; 961. Second lifting plate; 962. Sixth rotation drive; 963. Fifth drive wheel; 964. Fifth driven wheel; 965. Fifth conveyor belt;966. Sixth guide rail; 967. Sixth slider; 969. Sixteenth sensor; 9610. Eighth sensor trigger; 97. Second suction nozzle; 98. Second elastic component; 99. Cover plate; 110. Second transport module; 1101. Second gantry frame; 1102. Fourth rotation drive component; 1103. Third drive wheel; 1104. Third driven wheel; 1105. Third conveyor belt; 1106. Fourth guide rail; 1107. Fourth slider; 1108. Eleventh sensor; 1109. Twelfth sensor; 11010. Sixth sensor Triggering element; 120, Manual recycling module; 1201, Positioning support; 12011, First positioning structure; 1202, Sliding guide assembly; 1202a, Third sorting area; 1202b, Third recycling area; 12021, Eighth guide rail; 12022, Eighth slider; 1203, Guide tray; 12031, Second positioning structure; 12032, Handle; 12033, Limiting part; 1204, Recycling tray; 1205, Proximity switch; 1206, Sixth through-beam sensor; 1207, Seventh through-beam sensor. Detailed Implementation

[0102] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0103] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0104] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0105] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0106] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0107] See Figures 1-9 This invention provides a chip appearance inspection device 100, including a mounting base 10, a feeding module 20, a lower surface inspection module 30, a first transport module 40, and a suction module 50. The feeding module 20 is mounted on the mounting base 10 and has a storage area 20a and a receiving area 20b. The storage area 20a is used to stack trays carrying chips to be inspected, and the feeding module 20 is used to transfer the trays from the storage area 20a to the receiving area 20b. The lower surface inspection module 30 is mounted on the mounting base 10 and located beside the receiving area 20b. The first transport module 40 spans the feeding module 20, and the lower surface inspection module 30 is mounted on the mounting base 10. The suction module 50 is located on the first transport module 40. On module 40, the first transport module 40 is used to drive the suction module 50 to move back and forth between above the material receiving area 20b and above the lower surface detection module 30. When the suction module 50 is above the material receiving area 20b, the suction module 50 picks up the chip on the tray or releases the chip it has picked up back onto the tray. When the suction module 50 is above the lower surface detection module 30, the lower surface detection module 30 detects the lower surface of the chip picked up by the suction module 50. The upper surface detection module 60 is disposed on the first transport module 40. The first transport module 40 drives the upper surface detection module 60 to move above the material receiving area 20b so that the upper surface detection module 60 can detect the upper surface of the chip on the tray.

[0108] It should be noted that the chip has a peripheral side, a lower surface disposed at one end of the peripheral side, and an upper surface disposed at the other end of the peripheral side. The lower surface detection module 30 is used to detect the lower surface of the chip, and the upper surface detection module 60 is used to detect the upper surface of the chip.

[0109] In this embodiment of the invention, a tray carrying chips to be tested is stacked on the storage area 20a of the loading module 20. The loading module 20 moves the tray from the storage area 20a to the receiving area 20b. At this time, the first transport module 40 drives the suction module 50 to move above the receiving area 20b, allowing the suction module 50 to adsorb the upper surface of the chips on the tray, thereby removing the chips from the tray. The first transport module 40 then drives the suction module 50 to move above the lower surface detection module 30, so that the lower surface of the chip held by the suction module 50 is above the lower surface detection module 30, allowing the lower surface detection module 30 to detect the lower surface of the chip. After the lower surface of the chip is detected, the first transport module 40 again drives the suction module 50 to move to... Above the material receiving area 20b, the suction module 50 releases the chip, whose lower surface inspection has been completed, back into the tray. Then, the upper surface inspection module 60 is moved above the material receiving area 20b via the first transport module 40. At this time, the upper surface inspection module 60 is located above the chip, enabling it to inspect the upper surface of the chip on the tray. The chip appearance inspection equipment provided by this technical solution can complete the comprehensive inspection of the upper and lower surfaces of the chip, eliminating the need for manual handling to transfer the chip to other inspection equipment. This solves the technical problem in the prior art where, when using multiple inspection equipment to inspect the upper and lower surfaces of the chip separately, manual handling of the chip is required to transfer it between multiple inspection equipment, resulting in secondary damage to the chip during manual handling.

[0110] It should be noted that the chip appearance inspection equipment 100 provided by this technical solution can complete the comprehensive inspection of the chip in one go, effectively shortening the total inspection time of the chip.

[0111] It should be noted that the chip appearance inspection equipment 100 provided by this technical solution can complete the comprehensive inspection of the chip in one go, or it can selectively inspect the chip, such as only inspecting the upper surface of the chip, or only inspecting the lower surface of the chip.

[0112] The tray has multiple compartments, and each compartment contains a chip to be tested.

[0113] In some specific embodiments, the multiple compartments of the tray are arranged in a matrix.

[0114] In one embodiment, the chip appearance inspection device 100 further includes a protective shell (not shown in the figure), which is disposed on the mounting base 10 and covers the feeding module 20, the lower surface inspection module 30, the first transport module 40, the suction module 50, etc., to protect the chip appearance inspection device 100.

[0115] In one embodiment, the chip appearance inspection device 100 further includes an electrostatic eliminator (not shown in the figure), which is disposed in the protective housing to balance the static electricity inside the protective housing.

[0116] In one embodiment, combined with Figures 10-17 The chip appearance inspection device 100 further includes a first recycling module 70, a second recycling module 80, a second transport module 110, and a sorting module 90. The first recycling module 70 and the second recycling module 80 are arranged side by side on the mounting base 10, and the first recycling module 70 is connected to the end of the feeding module 20 away from the storage area 20a. The first recycling module 70 has a first sorting area 70a and a first recycling area 70b. The feeding module 20 is also used to transfer the tray in the receiving area 20b to the first sorting area 70a, and the first recycling module 70 is used to transfer the tray in the first sorting area 70a to the first recycling area 70b. The second recycling module 80 has... A second sorting area 80a and a second recycling area 80b are provided. The first recycling module 70 is used to transfer the tray in the second sorting area 80a to the second recycling area 80b. The second transport module 110 spans the first recycling module 70, and the second recycling module 80 is mounted on the mounting base 10. The sorting module 90 is mounted on the second transport module 110, and the second transport module 110 is used to drive the sorting module 90 to move back and forth between the first recycling module 70 and the second recycling module 80, so as to transport the tray or chip in the first sorting area 70a to the second sorting area 80a, or to transport the chip in the second sorting area 80a to the first sorting area 70a.

[0117] After all the chips on the trays in the material receiving area 20b have completed their appearance inspection, the feeding module 20 transfers the trays from the material receiving area 20b to the first sorting area 70a of the first recycling module 70. If there are no trays in the second sorting area 80a of the second recycling module 80, the sorting module 90 is moved by the second transport module 110 so that the sorting module 90 transports the trays to the second sorting area 80a of the second recycling module 80 and enters the sorting process. Specifically, the sorting module 90 is moved by the second transport module 110 so that the sorting module 90 transports the good chips on the trays in the second sorting area 80a to the trays in the first sorting area 70a. Thus, the chips sorted off from the trays in the second sorting area 80a are all defective products, and the chips sorted off to the trays in the first sorting area 70a are all good products.

[0118] If a tray has already been placed in the second sorting area 80a of the second recycling module 80, the sorting process will proceed directly. Specifically, the sorting module 90 will be moved by the second transport module 110, so that the sorting module 90 will transfer the defective chips on the tray in the first sorting area 70a to the tray in the second sorting area 80a. Thus, the chips sorted off the tray in the first sorting area 70a will all be good, and the chips sorted off the tray in the second sorting area 80a will all be defective.

[0119] At this point, all chips on the trays in the first sorting area 70a of the first recycling module 70 are good products. When the trays are full, the first recycling module 70 transfers the trays in the first sorting area 70a to the first recycling area 70b so that the first sorting area 70a can receive the next unsorted tray. All chips on the trays in the second sorting area 80a of the second recycling module 80 are defective products. When the trays are full, the second recycling module 80 transfers the trays in the second sorting area 80a to the second recycling area 80b so that the second sorting area 80a can receive the next unsorted tray.

[0120] In one embodiment, see Figure 4 and Figure 5The lower surface detection module 30 includes a first mounting cylinder 31, a first mounting bracket 32, a first frontal camera 33, a side camera assembly 34, and a first light source assembly. The first mounting cylinder 31 forms a first cavity 311 and an upper end plate 312 and a lower end plate 313 located at opposite ends of the first cavity 311. The upper end plate 312 forms a first opening 314 communicating with the first cavity 311, and the lower end plate 313 forms a second opening 315 communicating with the first cavity 311, with the second opening 315 opposite to the first opening 314. When detecting a chip, the chip is located above the upper end plate 312, and the lower surface of the chip faces the first opening 314. The first mounting bracket 32 ​​is connected to the lower end plate 313. The frontal camera is mounted on the first mounting bracket 32. The front camera captures images of the chip through the second opening 315, the first cavity 311, and the first opening 314. The side camera assembly 34 includes a side camera 341 and a reflector 342. The side camera 341 is mounted on the first mounting bracket 32 ​​and is angled to the central axis of the second opening 315. The reflector 342 is mounted on the cavity wall of the cavity. The reflector 342 receives incident light from the chip through the first opening 314 and reflects the reflected light onto the side camera 341 through the second opening 315. The first light source assembly is mounted on the first mounting cylinder 31 and / or the first mounting bracket 32. The first light source assembly provides a light source for the first front camera 33 to capture images and / or for the side camera 341 to capture images.

[0121] In this embodiment, when the lower surface of the chip needs to be inspected, the pick-up module 50 picks up the chip from the tray in the material area 20b, and the first transport module 40 transfers the pick-up module 50 to move the chip above the upper end plate 312, so that the projection of the chip is located in the first opening 314, and the lower surface of the chip faces the first opening 314. The first front camera 33 and the side camera 341, which are set on the lower end plate 313, are located below the lower surface of the chip. Then the first light source assembly is activated to provide light for the first front camera 33 and the side camera 341 to take pictures. Specifically, the first front camera 33, located directly below the second opening 315, can observe the chip through the second opening 315, the first cavity 311, and the first opening 314. The lower surface of the chip is clearly photographed from the front, meaning the shooting direction of the first front camera 33 is perpendicular to the lower surface of the chip, thereby enabling the detection of planar defects on the lower surface of the chip. The side camera 341 is set at an angle to the central axis of the second opening 315. Therefore, after the reflector 342 receives the incident light from the chip through the first opening 314, it can reflect the light through the second opening 315 to the side camera 341, allowing the side camera 341 to complete the oblique photograph of the lower surface of the chip. That is, the shooting direction of the side camera 341 is at an angle to the lower surface of the chip, thereby enabling the detection of three-dimensional defects on the lower surface of the chip. Thus, the lower surface detection module 30 can perform comprehensive detection of both planar and three-dimensional defects on the lower surface of the chip in one operation.

[0122] In some specific embodiments, there are two side cameras 341 and two reflectors 342. The two side cameras 341 are symmetrically arranged on both sides of the front camera, and the two reflectors 342 are respectively arranged corresponding to the two side cameras 341, so that the lower surface of the chip can be fully photographed through the two side cameras 341.

[0123] See Figure 4 and Figure 5 The first light source assembly includes a front monochromatic light source 351, which is used to illuminate the lower surface of the chip. This can be understood as follows: when the chip is moved above the upper plate 312, the height of the front monochromatic light source 351 is lower than the height of the lower surface of the chip, thus enabling the front monochromatic light source 351 to illuminate the lower surface of the chip, allowing the first front camera 33 and the side camera 341 to clearly capture images of the lower surface of the chip.

[0124] In some specific embodiments, the light source provided by the front monochromatic light source 351 is white light.

[0125] In some specific embodiments, see Figure 4 and Figure 5The front monochromatic light source 351 includes a front monochromatic strong light source 3511 and a front monochromatic weak light source 3512. The light intensity of the front monochromatic strong light source 3511 is stronger than that of the front monochromatic weak light source 3512. The front monochromatic strong light source 3511 is disposed on the cavity wall of the first cavity 311. The front monochromatic weak light source 3512 is disposed on the upper end plate 312 and is disposed around the first opening 314.

[0126] In this embodiment, the front monochromatic light source 351 is divided into a front monochromatic strong light source 3511 and a front monochromatic weak light source 3512. The front monochromatic strong light source 3511 is disposed on the cavity wall of the first cavity 311, and the front monochromatic weak light source 3512 is disposed on the upper end plate 312, thereby hiding the front monochromatic strong light source 3511 and making the front monochromatic weak light source 3512 closer to the lower surface of the chip. Specifically, the front monochromatic strong light source 3511 provides sufficient light to the lower surface of the chip. At the same time, the front monochromatic weak light source 3512 can cooperate with the front monochromatic strong light source 3511 to provide supplementary lighting to the lower surface of the chip, reducing the shadows on the features of the lower surface of the chip. Furthermore, the front monochromatic weak light source 3512 is arranged around the first opening 314, which improves the supplementary lighting effect.

[0127] It should be noted that the front monochromatic strong light source 3511 and the front monochromatic weak light source 3512 are each equipped with a light source controller. The brightness levels of the front monochromatic strong light source 3511 and the front monochromatic weak light source 3512 can be adjusted through the corresponding light source controllers. For example, the brightness of the front monochromatic strong light source 3511 can be divided into seven levels: P1, P2, P3, P4, P5, P6, and P7. The brightness of the front monochromatic strong light source 3511 is the dimmest at level P1 and the brightest at level P7. Similarly, the brightness level of the front monochromatic weak light source 3512 can also be set, which will not be elaborated here.

[0128] In some specific embodiments, see Figure 4 and Figure 5 The front monochromatic strong light source 3511 is located at one end of the first cavity 311 near the upper end plate 312. That is, the front monochromatic strong light source 3511 is close to the upper end plate 312, which is closer to the chip located above the upper end plate 312, thus improving the illumination effect of the front monochromatic strong light source 3511 on the lower surface of the chip.

[0129] In some specific embodiments, see Figure 4 and Figure 5 There are multiple front monochromatic high-intensity light sources 3511, and these multiple front monochromatic high-intensity light sources 3511 are arranged circumferentially along the inner wall of the first cavity 311.

[0130] In some specific embodiments, there can be multiple front monochromatic weak light sources 3512 or only one; when there are multiple front monochromatic weak light sources 3512, they are arranged around the first opening 314; when there is only one front monochromatic weak light source 3512, it is ring-shaped, and the ring-shaped front monochromatic weak light source 3512 is arranged around the first opening 314, such as... Figure 4 As shown.

[0131] In one embodiment, see Figure 4 and Figure 5 The first light source assembly further includes a backlight 352 disposed on the upper end plate 312, the backlight 352 being used to illuminate the upper surface of the chip. It is understood that the height of the backlight 352 is higher than the height of the upper surface of the chip. Illuminating the upper surface of the chip with the backlight 352 provides a clear background, improves the contrast of the lower surface of the chip, and makes the lower surface of the chip clearer.

[0132] See Figure 4 and Figure 5 The backlight 352 includes a strong backlight 3521 and a weak backlight 3522, wherein the illumination intensity of the strong backlight 3521 is greater than that of the weak backlight 3522. Therefore, when it is necessary to detect features with relatively weak contrast on the lower surface of the chip, the strong backlight 3521 can be selected; when it is necessary to detect features with relatively strong contrast on the lower surface of the chip, the weak backlight 3522 can be selected.

[0133] It should be noted that the rear low light source 3522 is also equipped with a light source controller. The brightness level of the rear low light source 3522 can be adjusted through the corresponding light source controller. The brightness level of the rear low light source 3522 can be referred to the front monochromatic high light source 3511, which will not be repeated here.

[0134] In some specific embodiments, see Figure 4 The height of the back weak light source 3522 relative to the upper end plate 312 is higher than the height of the back strong light source 3521 relative to the upper end plate 312. Therefore, when the chip is moved above the first opening 314, the height of the back weak light source 3522 relative to the upper surface of the chip is higher than the height of the back strong light source 3521 relative to the upper surface of the chip, thereby reducing the background brightness provided by the back weak light source 3522.

[0135] In some specific embodiments, see Figure 4In a direction perpendicular to the central axis of the first opening 314, the distance between the back weak light source 3522 and the first opening 314 is greater than the distance between the back strong light source 3521 and the first opening 314. Therefore, when the chip is moved above the first opening 314, the back weak light source 3522 is located on the upper periphery farther away from the chip, thereby further reducing the background brightness provided by the back weak light source 3522.

[0136] In some specific embodiments, see Figure 4 The back weak light source 3522 consists of two sets, which are arranged on both sides of the first opening 314 and staggered to further reduce the background brightness provided by the back weak light source 3522.

[0137] In some specific embodiments, see Figure 4 The back strong light source 3521 consists of two sets, which are symmetrically arranged on both sides of the first opening 314 to improve the background brightness provided when the back strong light source 3521 illuminates.

[0138] See Figure 4 and Figure 5 The back-mounted high-intensity light source 3521 includes a first back-mounted high-intensity light source 35211 and a second back-mounted high-intensity light source 35212. The first back-mounted high-intensity light source 35211 is disposed on the upper end plate 312, and the illumination direction of the first back-mounted high-intensity light source 35211 is the same as the orientation of the first opening 314. The second back-mounted high-intensity light source 35212 is disposed on the side of the first back-mounted high-intensity light source 35211 away from the first opening 314, and the illumination direction of the second back-mounted high-intensity light source 35212 is perpendicular to the central axis of the first opening 314. The first light source assembly also includes a first condenser lens 353, which is disposed at intervals from the first back-mounted high-intensity light source 35211 along the illumination direction of the first back-mounted high-intensity light source 35211.

[0139] In this embodiment, the illumination direction of the first back-side strong light source 35211 is the same as the orientation of the first opening 314. Therefore, the light from the first back-side strong light source 35211 cannot directly illuminate the chip located above the first opening 314. The second back-side strong light source 35212 is positioned on the side of the first back-side strong light source 35211 away from the first opening 314, and the illumination direction of the second back-side strong light source 35212 is perpendicular to the central axis of the first opening 314. Therefore, the light from the second back-side strong light source 35212 can directly illuminate the upper surface of the chip located above the first opening 314, and the second back-side strong light source 35212 blocks the light diffused outward from the first back-side strong light source 35211. In addition, the light source assembly also includes a first condenser lens 353, which is spaced apart from the first back-side strong light source 35211. Thus, the second condenser lens 354 blocks and concentrates the illumination from the first back-side strong light source 35211. As shown in the figure, the second back-side strong light source 35211... A backlight source 35211, a second backlight source 35212, and a first condenser lens 353 form a U-shaped structure. The opening of the U-shaped structure faces the central axis of the first opening 314. Therefore, the light from the first backlight source 35211 is confined within the U-shaped structure and shines onto the upper surface of the chip located above the first opening 314 through the opening of the U-shaped structure. In summary, the light intensity of the first backlight source 35211 is lower than that of the second backlight source 35212. The light emitted by the second backlight source 35212 is defined as strong light, and the light emitted by the first backlight source 35211 and the second backlight source 35212 together is defined as extremely strong light. Therefore, when the light intensity of the backlight source 3521 is required to be strong light, the second backlight source 35212 can be activated. When the light intensity of the backlight source 3521 is required to be extremely strong light, the first backlight source 35211 and the second backlight source 35212 can be activated. It should be noted that the first rear strong light source 35211 and the second rear strong light source 35212 are also equipped with light source controllers. The brightness levels of the first rear strong light source 35211 and the second rear strong light source 35212 can be adjusted by the corresponding light source controllers. The brightness levels of the first rear strong light source 35211 and the second rear strong light source 35212 can be referred to the front monochrome strong light source 3511, and will not be described again here.

[0140] In some specific embodiments, see Figure 4 The first light source assembly also includes a second condenser lens 354, which is disposed on the side of the first condenser lens 353 away from the second back strong light source 35212. The second condenser lens 354 is tilted toward the second back strong light source 35212. In the illumination direction of the second back strong light source 35212, the distance between the second condenser lens 354 and the upper end plate 312 gradually decreases.

[0141] It should be noted that the height of the second condenser lens 354 is higher than the height of the upper surface of the chip. Therefore, the second condenser lens 354 can focus and guide the light from the second back strong light source 35212 to the upper surface of the chip, thereby increasing the illumination intensity of the second back strong light source 35212.

[0142] In one embodiment, see Figure 4 The first light source assembly also includes a side light source 355 that is set on the upper plate 312. The side light source 355 is used to illuminate the peripheral side surface of the chip so that the first front camera 33 and the side camera 341 can more comprehensively and clearly capture some defects on the lower surface of the chip that require the cooperation of the side light source 355.

[0143] It should be noted that the side light source 355 is also equipped with a light source controller. The brightness level of the side light source 355 can be adjusted through the corresponding light source controller. The brightness level of the side light source 355 can be referred to the front monochromatic strong light source 3511, which will not be repeated here.

[0144] In some specific embodiments, see Figure 4 The first back light source 35211 is connected to the side of the side light source 355 away from the first opening 314, thereby indirectly mounting the first back light source 35211 on the upper end plate 312.

[0145] In one embodiment, see Figure 4 and Figure 5 The first light source assembly further includes a first single-sided reflector 356 and a first multi-color light source 357; the first single-sided reflector 356 is disposed between the first forward camera 33 and the second opening 315, the first multi-color light source 357 is disposed beside the first single-sided reflector 356, the first multi-color light source 357 is used to emit light to the first single-sided reflector 356, the first single-sided reflector 356 is used to reflect the incident light from the first multi-color light source 357 onto the lower surface of the chip, and the reflected light from the first single-sided reflector 356 is parallel to the central axis of the second opening 315.

[0146] It should be noted that the first single-sided reflector 356 can reflect the light from the first multi-color light source 357 vertically onto the lower surface of the chip, so that the light from the first multi-color light source 357 can illuminate the lower surface of the chip in the forward direction; and the single reflector 342 does not affect the image acquisition of the first forward camera 33; therefore, the combination of the first forward camera 33, the first multi-color light source 357 and the first single-sided reflector 356 can detect planar defects on the lower surface of the chip that require multi-color light illumination.

[0147] It should be noted that the first multicolor light source 357 has white, blue, red, and green light. The first multicolor light source 357 is also equipped with a light source controller. The brightness level of the first multicolor light source 357 can be adjusted and monochromatic light can be called to mix the desired color light through the corresponding light source controller.

[0148] In some specific embodiments, see Figure 5 The illumination direction of the first multicolor light source 357 is perpendicular to the shooting direction of the first forward camera 33, and the angle between the first single-sided reflector 356 and the first multicolor light source 357 is 45°.

[0149] In one embodiment, see Figure 5 The first light source assembly further includes a second multicolor light source 358 disposed in the first cavity 311. The second multicolor light source 358 is arranged in a ring around the second opening 315. The second multicolor light source 358 has an illumination slope 3581, and the distance between the illumination slope 3581 and the upper end plate 312 gradually increases in the direction from the inner periphery to the outer periphery of the second multicolor light source 358.

[0150] In this embodiment, the light from the second multicolor light source 358 is emitted through the irradiation slope 3581, and after passing through the first opening 314, it obliquely irradiates the lower surface of the chip. Therefore, the cooperation between the second multicolor light source 358 and the side camera 341 can detect three-dimensional defects on the lower surface of the chip that require multicolor light irradiation.

[0151] It should be noted that the second multicolor light source 358 has white, blue, red, and green light. The second multicolor light source 358 is also equipped with a light source controller. The brightness level of the second multicolor light source 358 can be adjusted and monochromatic light can be called to mix the desired color light through the corresponding light source controller.

[0152] In some specific embodiments, see Figure 4 and Figure 5 The first mounting bracket 32 ​​includes a first connecting plate 321 and a first mounting plate 322. One end of the first connecting plate 321 is connected to the lower end plate 313, and the other end of the first connecting plate 321 is connected to the first mounting plate 322, so that the first mounting plate 322 is located below the lower end plate 313. The first mounting plate 322 has a third opening 3221 that is opposite to the second opening 315. The first forward camera 33 is disposed on the side of the first mounting plate 322 away from the lower end plate 313. The first forward camera 33 captures images of the chip through the third opening 3221, the second opening 315, the first cavity 311, and the first opening 314.

[0153] The side camera 341 is mounted on the first mounting plate 322.

[0154] In some specific embodiments, there are two first connecting plates 321, which are arranged at intervals on the lower end plate 313. The two ends of the first mounting plate 322 are respectively connected to the ends of the two first connecting plates 321 that are away from the lower end plate 313, thereby improving the stability of the first mounting plate 322.

[0155] In one embodiment, see Figure 4 and Figure 5 The first mounting bracket 32 ​​also includes a second mounting plate 323, which is disposed on the side of the first mounting plate 322 away from the lower end plate 313, and the first forward camera 33 is disposed on the second mounting plate 323.

[0156] In some specific embodiments, the first single-sided reflector 356 and the first multi-color light source 357 are both disposed on the second mounting plate 323.

[0157] In one embodiment, see Figure 4 The lower surface detection module 30 also includes a second mounting bracket 36, which includes a first plate portion 361, a second plate portion 362, a third plate portion 363, a fourth plate portion 364, and a fifth plate portion 365. The first plate portion 361 is connected to the side of the first back strong light source 35211 away from the first opening 314. The second plate portion 362 is formed by bending from the upper end of the first plate portion 361 in a direction away from the first back strong light source 35211, and the second back strong light source 35212 is disposed on the second plate portion 362. The third plate portion 363 is connected to the end of the second plate portion 362 away from the first plate portion 361, and the height extension direction of the third plate portion 363 is the same as the orientation of the first opening 314. The back weak light source 3522 is disposed on the third plate portion 363. This allows the low-light source 3522 to be positioned higher than the high-light source 3521 relative to the upper plate 312. The fourth plate 364 is connected to the third plate 363 and extends toward the central axis of the first opening 314, thus suspending the fourth plate 364 above the first high-light source 35211. The first condenser lens 353 is mounted on the fourth plate 364, achieving a relative arrangement between the first condenser lens 353 and the first high-light source 35211. The fifth plate 365 is connected to the end of the fourth plate 364 away from the third plate 363. The fifth plate 365 is tilted, and the second condenser lens 354 is mounted on the fifth plate 365, thus achieving a tilted arrangement of the second condenser lens 354.

[0158] In some specific embodiments, see Figure 4When there are two sets of strong back light source 3521 and weak back light source 3522, there are also two sets of second mounting brackets 36. One set of strong back light source 3521 and one set of weak back light source 3522 are installed on one set of second mounting brackets 36, and the other set of strong back light source 3521 and the other set of weak back light source 3522 are installed on the other set of second mounting brackets 36.

[0159] In one embodiment, see Figure 9 The upper surface detection module 60 includes a second mounting cylinder 61, a third mounting bracket 62, a second forward camera 63, and a second light source assembly 64. The second mounting cylinder 61 is connected to the first transport module 40. The second mounting cylinder 61 forms a second cavity 611 and a fourth opening 612 and a fifth opening 613, both of which communicate with the second cavity 611, and the fourth opening 612 and the fifth opening 613 are arranged opposite to each other. The third mounting bracket 62 is mounted on the second mounting cylinder 61. The second forward camera 63 is mounted on the third mounting bracket 62, and the shooting direction of the forward camera is perpendicular to the fourth opening 612. The second light source assembly 64 includes a third multi-color light source 641, a second single-sided reflector 642, and an oblique light source 643. The second one-sided reflector 642 is disposed between the second forward camera 63 and the fourth opening 612. The third multi-color light source 641 is disposed beside the second one-sided reflector 642. The third multi-color light source 641 is used to emit light to the second one-sided reflector 642. The second one-sided reflector 642 is used to reflect the incident light from the third multi-color light source 641 through the fourth opening 612, and the reflected light from the second one-sided reflector 642 is parallel to the central axis of the fourth opening 612. The oblique light source 643 is disposed in the second cavity 611. The light from the oblique light source 643 passes through the fifth opening 613, and the illumination direction of the oblique light source 643 is set at an angle to the central axis of the fifth opening 613.

[0160] In this embodiment, when the upper surface of the chip needs to be inspected, the first transport module 40 moves the upper surface inspection module 60 above the material receiving area 20b, so that the fifth opening 613 of the second mounting cylinder 61 faces the upper surface of the chip on the tray. Specifically, the second forward camera 63 acquires images of the upper surface of the chip through the fourth opening 612, the second cavity 611, and the fifth opening 613. The third multi-color light source 641 can emit light of multiple colors. After being reflected by the second single-sided reflector 642, the light is vertically irradiated onto the upper surface of the chip through the fourth opening 612, the second cavity 611, and the fifth opening 613, so that the second forward camera 63 can photograph defects that require vertical illumination of different colors of light. The light emitted by the oblique light source 643 is obliquely irradiated onto the upper surface of the chip through the fifth opening 613, so that the second forward camera 63 can photograph defects that require oblique illumination.

[0161] In some specific embodiments, see Figure 9 The illumination direction of the third multicolor light source 641 is perpendicular to the shooting direction of the second forward camera 63, and the angle between the second single-sided reflector 642 and the second multicolor light source 358 is 45°.

[0162] In some specific embodiments, there are several groups of oblique light sources 643, and the angle between the illumination direction of each group of oblique light sources 643 and the central axis of the fifth opening 613 is different, so that the illumination tilt angle of each group of oblique light sources 643 relative to the upper surface of the chip is different.

[0163] In some specific embodiments, there are four groups of oblique light sources 643, and the illumination angles of the four groups of oblique light sources 643 relative to the upper surface of the chip are 30°, 45°, 60° and 75° respectively.

[0164] It should be noted that the third multi-color light source 641 and the oblique light source 643 are respectively connected to corresponding light source controllers to realize the control of light color and light intensity.

[0165] See Figure 2 and Figure 3The feeding module 20 includes a first support 21, a first conveying component 22, a material preparation and stacking component 23, and a first lifting component 24; the storage area 20a and the receiving area 20b are formed by the first support 21; the first conveying component 22 is disposed on the first support 21, and the first conveying component 22 includes a conveying tray 221 that can move back and forth between the storage area 20a and the receiving area 20b; the material preparation and stacking component 23 includes a first telescopic drive component 231 and a first support component 232, and the first telescopic drive component 231 is disposed in the storage area 20a. At the location, the power output end of the first telescopic drive member 231 is connected to the first support member 232, and the first telescopic drive member 231 drives the first support member 232 to extend or retract; the first lifting assembly 24 is disposed at the storage area 20a, and the first lifting assembly 24 includes a first lifting drive member 241 and a first lifting plate 242. The first lifting drive member 241 is disposed on the mounting base 10, and the first lifting plate 242 is connected to the power output end of the first lifting drive member 241, and the first lifting plate 242 is lower than the first support member 232.

[0166] The first telescopic drive 231 drives the first support 232 to extend, and multiple pallets are stacked on the first support 232 to form a pallet stack. With the support of the first support 232, multiple pallets loaded with chips to be tested can be stored in the storage area 20a, realizing pallet preparation.

[0167] When a pallet needs to be transferred from the storage area 20a to the receiving area 20b, the conveying pallet 221 is moved to the storage area 20a and positioned between the first support member 232 and the first lifting plate 242. The first lifting drive member 241 drives the first lifting plate 242 to rise, and the first lifting plate 242 rises beside the conveying pallet 221 to lift the pallet stack. The first telescopic drive member 231 drives the first support member 232 to retract to avoid the pallet stack. The first lifting drive member 241 drives the first lifting plate 242 to descend. When the bottom pallet of the pallet stack descends below the first support member 232, the first telescopic drive member 231 drives the first support member 232 to extend to support the pallet stack except for the bottom pallet. The first lifting drive member 241 drives the first lifting plate 242 to support the bottom pallet and continue to descend until the pallet on the first lifting plate 242 descends onto the conveying pallet 221. The conveying pallet 221 then moves the pallet to the receiving area 20b.

[0168] Specifically, the first conveying component 22 is activated, moving the conveying pallet 221 toward the storage area 20a. When the conveying pallet 221 reaches the storage area 20a, it is positioned between the first support member 232 and the first top plate, i.e., below the pallet stack and above the first lifting plate 242. Next, the first lifting drive member 241 drives the first lifting plate 242 to rise, rising beside the conveying pallet 221 to avoid it and lift the pallet stack. After the first lifting plate 242 lifts the pallet stack, the first telescopic drive member 231 drives the first support member 232 to retract, meaning the first support member 232 is no longer below the pallet stack. At this point, the first lifting drive member 241... 1. Drive the first lifting plate 242 to descend. With the retraction of the first support member 232, the pallet stack also descends with the first lifting plate 242. When the bottom pallet of the pallet stack descends below the first support member 232, the first telescopic drive member 231 drives the first support member 232 to extend, so that the first support member 232 supports the pallet stack except for the bottom pallet, thereby separating the bottom pallet. The first lifting drive member 241 drives the first lifting plate 242 to continue to descend until the pallet on the first lifting plate 242 is lowered and placed on the conveyor plate 221. At this time, the first lifting plate 242 avoids the conveyor plate 221 in height. The first conveying assembly 22 is restarted to transfer the conveyor plate 221 and the pallets on it to the material receiving area 20b.

[0169] In some specific embodiments, a notch is formed on the periphery of the tray, and the first support member 232 extends into the notch to support the tray.

[0170] In some specific embodiments, see Figure 2 The first support 21 forms a first conveying channel 20c, and the conveying pallet 221 and the pallet on it are both located in the first conveying channel 20c. During the process of the conveying pallet 221 moving the pallet, the two sides of the pallet are restricted by the inner sidewall of the first conveying channel 20c, thereby reducing the degree of lateral swaying of the pallet during the conveying process and improving the stability of the pallet relative to the conveying pallet 221.

[0171] See Figure 3The conveying pallet 221 also has a first stop 2211 and a second stop 2212, which are arranged at intervals along the moving direction of the conveying pallet 221. The first stop 2211 and the second stop 2212 respectively block the opposite ends of the pallet. Therefore, after the first lifting plate 242 descends and places the pallet on the conveying pallet 221, the pallet is located between the first stop 2211 and the second stop 2212. By blocking the ends of the pallet with the first stop 2211 and the second stop 2212, the forward and backward displacement of the pallet during the conveying process can be reduced, and the stability of the pallet relative to the conveying pallet 221 can be improved.

[0172] In some specific embodiments, see Figure 3 The first lifting plate 242 includes a first fixing part 2421 and at least two first lifting parts 2422. The first fixing part 2421 is connected to the power output end of the first lifting drive member 241, and the two first lifting parts 2422 are respectively connected to the opposite sides of the first fixing part 2421. The first lifting parts 2422 move up and down beside the conveying tray 221, that is, the first fixing part 2421 and the two first lifting parts 2422 form a U-shaped structure, so that the first lifting plate 242 can move up and down around the conveying tray 221.

[0173] In one embodiment, see Figure 3 The first lifting assembly 24 further includes a first bracket 243, a first sensor 244, a second sensor 245, and a first sensing trigger 246. The first bracket 243 is disposed on the mounting base 10, and the first lifting drive 241 is disposed on the first bracket 243. The first sensor 244 and the second sensor 245 are spaced apart on the first bracket 243 along the driving direction of the first lifting drive 241. The first sensing trigger 246 is disposed on the power output end of the first lifting drive 241, and the first sensing trigger 246 is used to trigger the sensing of the first sensor 244 or the second sensor 245. When the first sensing trigger 246 triggers the sensing of the first sensor 244, the first lifting drive 241 stops driving the first lifting plate 242 to descend; when the first sensing trigger 246 triggers the sensing of the second sensor 245, the first lifting drive 241 stops driving the first lifting plate 242 to rise.

[0174] In this embodiment, the lifting movement of the first lifting plate 242 is limited by the first sensor 244 and the second sensor 245 to prevent the lifting movement of the first lifting plate 242 from exceeding the operating distance. Specifically, when the first sensor trigger 246 triggers the first sensor 244, the position of the first lifting plate 242 is defined as its origin position. When the first lifting plate 242 descends to the origin position, the tray on the first lifting plate 242 is placed on the conveyor tray 221, and the height of the first lifting plate 242 has avoided the conveyor tray 221, so that the conveyor tray 221 can move without obstruction. When the first sensor trigger 246 triggers the second sensor 245, the rising height of the first lifting plate 242 is sufficient to throw the tray away from the first support member 232. Therefore, the first lifting drive member 241 stops driving the first lifting plate 242 to continue to rise.

[0175] See Figure 3 The first conveying assembly 22 further includes a first rotation drive 222, a first drive wheel 223, a first driven wheel 224, a first conveyor belt 225, a first guide rail 226, and a first slider 227. The first rotation drive 222 is mounted on the first support 21, and the power output end of the first rotation drive 222 is connected to the first drive wheel 223. The first driven wheel 224 is mounted on the first support 21, and the first conveyor belt 225 is tensioned and sleeved on the first drive wheel 223 and the first driven wheel 224. The first guide rail 226 is mounted on the first support 21, and the first slider 227 is slidably connected to the first guide rail 226. The conveying pallet 221 is connected to one side of the first conveyor belt 225 and the first slider 227.

[0176] In this embodiment, when the conveyor pallet 221 needs to be moved, the first rotation drive 222 is activated, driving the first drive wheel 223 to rotate. Under the drive of the first driven wheel 224, the first conveyor belt 225 rotates with the rotation of the first drive wheel 223, and the first conveyor belt 225 carries the conveyor pallet 221 to move. In addition, the first conveying assembly 22 also includes a first guide rail 226 and a first slider 227 that are slidably connected. The first guide rail 226 is set on the first support 21, and the first slider 227 is connected to the conveyor pallet 221. The first guide rail 226 restricts the movement direction of the first slider 227, thereby also restricting the movement direction of the conveyor pallet 221. The movement of the conveyor pallet 221 is guided by the first guide rail 226 and the first slider 227, increasing the stability of the movement of the conveyor pallet 221.

[0177] In one embodiment, see Figure 3The first conveying assembly 22 further includes a third sensor 228, a fourth sensor 229, and a second sensor trigger. The third sensor 228 and the fourth sensor 229 are spaced apart on the first support 21 along the moving direction of the conveying tray 221. The second sensor trigger is used to trigger the sensing of the third sensor 228 or the fourth sensor 229. When the second sensor triggers the sensing of the third sensor 228 or the fourth sensor 229, the first rotation drive 222 stops driving the first drive wheel 223. When the first rotation drive 222 restarts, it drives the first drive wheel 223 to rotate in the opposite direction, thereby changing the conveying direction of the first conveyor belt 225 and preventing the conveying tray 221 from exceeding its movement range.

[0178] In one embodiment, see Figure 2 and Figure 3 The material preparation and stacking assembly 23 also includes a first limiting plate 233 disposed in the storage area 20a. The first limiting plate 233 is used to limit the periphery of the pallet, so that the pallet is stably stacked in the storage area 20a and the pallet is prevented from tilting and falling.

[0179] In some specific embodiments, see Figure 2 and Figure 3 The first limiting plate 233 has an L-shaped structure, and there are four first limiting plates 233. The four first limiting plates 233 are used to limit the four corners of the pallet.

[0180] In one embodiment, see Figure 2 The material stacking assembly 23 also includes a first through-beam sensor 234. The receiving end and the transmitting end of the first through-beam sensor 234 are located on both sides of the storage area 20a, respectively. The first through-beam sensor 234 is used to sense the remaining amount of the tray in the storage area 20a. Specifically, when the receiving end of the first through-beam sensor 234 receives the light emitted by the transmitting end of the first through-beam sensor 234, it indicates that the remaining amount of the tray in the storage area 20a is insufficient, and the tray carrying the chip to be tested needs to be added to the storage area 20a, that is, placed on the first support member 232.

[0181] In one embodiment, see Figure 2 The material stacking assembly 23 also includes a second through-beam sensor 235. The receiving end and the transmitting end of the second through-beam sensor 235 are located on both sides of the storage area 20a, respectively. The second through-beam sensor 235 is used to sense whether the pallet has descended onto the conveyor plate 221. Specifically, when the first lifting plate 242 descends and places the pallet onto the conveyor plate 221, the pallet on the conveyor plate 221 is blocked between the receiving end and the transmitting end of the second through-beam sensor 235. The receiving end of the second through-beam sensor 235 cannot receive the light from the transmitting end, indicating that the pallet has descended and been placed onto the conveyor plate 221.

[0182] In one embodiment, see Figure 2 and Figure 3 The first support 21 also forms a transfer area 20d, and the conveying pallet 221 can also move to the transfer area 20d; the loading module 20 also includes a second lifting component 25 disposed in the transfer area 20d, the second lifting component 25 includes a second lifting drive 251 and a second lifting plate 252, the second lifting drive 251 is disposed on the mounting base 10, and the second lifting plate 252 is connected to the power output end of the second lifting drive 251; wherein, when the conveying pallet 221 and the pallet on it move to the transfer area 20d, the second lifting drive 251 drives the second lifting plate 252 to rise, the second lifting plate 252 rises to lift the pallet beside the conveying pallet 221, the conveying pallet 221 leaves the transfer area 20d, the second lifting drive 251 drives the second lifting plate 252 to descend until the pallet descends to the first recycling module 70.

[0183] Specifically, after the appearance of the chip is inspected, the first conveying component 22 is activated, causing the conveying tray 221 to move towards the transfer area 20d. When the conveying tray 221 moves to the transfer drive, the conveying tray 221 is above the second lifting plate 252. The second lifting drive 251 drives the second lifting plate 252 to rise. The second lifting plate 252 rises beside the conveying tray 221 to push the tray away from the conveying tray 221, thereby separating the tray and the conveying tray 221. Then, the conveying tray 221 leaves the transfer area 20d, that is, there is no conveying tray 221 under the tray. When the second lifting drive 251 drives the second lifting plate 252 to descend, the tray can also descend with the second lifting plate 252 until the tray descends onto the first recycling module 70, thereby transferring the tray carrying the inspected chip to the first recycling module 70.

[0184] In some specific embodiments, see Figure 3 The second lifting plate 252 includes a second fixing part 2521 and at least two second lifting parts 2522. The second fixing part 2521 is connected to the power output end of the second lifting drive member 251, and the two second lifting parts 2522 are respectively connected to the opposite sides of the second fixing part 2521. The second lifting parts 2522 move up and down beside the conveying tray 221, that is, the second fixing part 2521 and the two second lifting parts 2522 form a U-shaped structure, so that the second lifting plate 252 can move up and down around the conveying tray 221.

[0185] In one embodiment, see Figure 3The second lifting assembly 25 further includes a second bracket 253, a fifth sensor 254, a sixth sensor 255, and a third sensor trigger 256. The second bracket 253 is mounted on the mounting base 10, and the second lifting drive 251 is mounted on the second bracket 253. The fifth sensor 254 and the sixth sensor 255 are spaced apart on the second bracket 253 along the driving direction of the second lifting drive 251. The third sensor trigger 256 is mounted on the power output end of the second lifting drive 251 and is used to trigger the sensing of the fifth sensor 254 or the sixth sensor 255. When the third sensor trigger 256 triggers the sensing of the fifth sensor 254, the second lifting drive 251 stops driving the second lifting plate 252 to descend; when the third sensor trigger 256 triggers the sensing of the sixth sensor 255, the second lifting drive 251 stops driving the second lifting plate 252 to rise.

[0186] In this embodiment, the lifting and lowering movement of the second lifting plate 252 is limited by the fifth sensor 254 and the sixth sensor 255 to prevent the lifting and lowering movement of the second lifting plate 252 from exceeding the operating distance. Specifically, when the fifth sensor triggers the third sensor 228, the position of the second lifting plate 252 is defined as its origin position. When the second lifting plate 252 descends to the origin position, the tray on the second lifting plate 252 is placed on the first recycling module 70. When the third sensor triggers the sixth sensor 255, the rising height of the second lifting plate 252 is sufficient to throw the tray away from the conveyor plate 221. Therefore, the second lifting drive 251 stops driving the second lifting plate 252 to continue to rise.

[0187] In some specific embodiments, see Figure 2 The first support 21 includes two first side plates 211, and the first conveying channel 20c is formed by the two first side plates 211 being arranged at a relative interval.

[0188] In some specific embodiments, there are two first guide rails 226 and two first sliders 227. The two first guide rails 226 are respectively disposed on the two first side plates 211 facing each other. The two first sliders 227 are slidably connected to the two first guide rails 226 respectively, and the two first sliders 227 are respectively connected to the opposite two sides of the conveying tray 221, thereby further realizing the conveying stability of the conveying tray 221.

[0189] In some specific embodiments, see Figure 2 The first lifting component 24 is located between the two first side plates 211.

[0190] In some specific embodiments, see Figure 2 The second lifting component 25 is located between the two first side plates 211.

[0191] In some specific implementations, there are four first telescopic drive members 231 and four first support members 232. Two of the first telescopic drive members 231 are mounted on one of the first side plates 211, and the two first support members 232 are respectively connected to the power output ends of the two first telescopic drive members 231. The two first support members 232 are used to support the two ends of one side of the pallet. The other two first telescopic drive members 231 are mounted on the other first side plate 211, and the other two first support members 232 are respectively connected to the power output ends of the two first telescopic drive members 231. The two first support members 232 are used to support the two ends of the other side of the pallet.

[0192] In some specific embodiments, see Figure 2 The first support 21 also includes a first frame 212, a first rotation drive 222 is disposed on the first frame 212, and a first driven wheel 224 is disposed on one of the first side plates 211.

[0193] In one embodiment, see Figure 7 and Figure 8 The suction module 50 includes a first support plate 51, a first lifting component 52, and a first suction nozzle component 53; the first support plate 51 is disposed on the first transport module 40; the first lifting component 52 is disposed on the first support plate 51, and the first lifting component 52 includes a first lifting plate 521 that can move up and down relative to the first support plate 51; the first suction nozzle component 53 is disposed on the first lifting plate 521.

[0194] In this embodiment, when the first transport module 40 is activated, it drives the first support plate 51 to move, thereby driving the entire suction module 50 to move. When the suction module 50 moves above the material receiving area 20b or above the lower surface detection module 30, the first lifting component 52 is activated, causing the first lifting plate 521 to move up and down relative to the first support plate 51. The first suction nozzle component 53 disposed on the first lifting plate 521 also moves up and down accordingly. For example, the first lifting plate 521 drives the first suction nozzle component 53 to descend, so as to pick up the chip on the tray in the material receiving area 20b; or the first lifting plate 521 drives the first suction nozzle component 53 to rise, so as to pick up the chip and carry it away from the tray; or the first lifting plate 521 drives the first suction nozzle component 53 to rise and fall, so as to adjust the distance between the chip and the lower surface detection module 30; or the first lifting plate 521 drives the first suction nozzle component 53 to descend, so as to release the chip on it back onto the tray.

[0195] In one embodiment, see Figure 7 and Figure 8 The suction module 50 also includes a first elastic component 54, one end of which is connected to the first support plate 51, and the other end of which is connected to the first lifting plate 521. Therefore, when the first lifting component 52 malfunctions, the first elastic component 54 can hold the first lifting plate 521, thereby holding the first suction nozzle assembly 53, preventing the first suction nozzle assembly 53 from falling and hitting the material receiving area 20b or the lower surface detection module 30.

[0196] In some specific embodiments, the first elastic component 54 includes two first elastic elements, one end of which is connected to both sides of the first lifting plate 521, thereby holding the first lifting plate 521 in a balanced manner.

[0197] See Figure 8 The first lifting assembly 52 further includes a second rotation drive 522 and an eccentric shaft 523; the second rotation drive 522 is disposed on the first support plate 51, the eccentric shaft 523 is connected to the power output shaft of the second rotation drive 522, and the eccentric shaft 523 is offset from the central axis of the power output shaft of the second rotation drive 522; the first lifting plate 521 has a strip hole 5211, the length extension direction of the strip hole 5211 is perpendicular to the lifting direction of the first lifting plate 521, and one end of the eccentric shaft 523 away from the second rotation drive 522 extends into the strip hole 5211.

[0198] In this embodiment, the eccentric shaft 523 is offset from the central axis of the power output shaft of the second rotation drive 522. Therefore, when the power output shaft of the second rotation drive 522 rotates, the eccentric shaft 523 moves in an arc, and its position changes both laterally and vertically. A strip-shaped hole 5211 is formed on the first lifting plate 521, and the strip-shaped hole 5211 is perpendicular to the lifting direction of the first lifting plate 521. Therefore, the strip-shaped hole 5211 not only conforms to the lateral position change of the eccentric shaft 523, but the hole wall of the strip-shaped hole 5211 also abuts against the eccentric shaft 523, so as to convert the vertical position change of the eccentric shaft 523 into the lifting motion of the first lifting plate 521. In this embodiment, the second rotation drive 522 drives the eccentric shaft 523 to rotate, thereby driving the first lifting plate 521 to move up and down. This makes the first lifting assembly 52 able to withstand greater force and respond faster, and can drive the first suction nozzle assembly 53 to move up and down more quickly and stably.

[0199] In one embodiment, see Figure 8The first lifting assembly 52 further includes a second guide rail 524 and a second slider. One of the second guide rail 524 and the second slider is disposed on the first support plate 51, and the other is disposed on the first lifting plate 521. The second slider is slidably connected to the second guide rail 524. The sliding guide of the second guide rail 524 and the second slider guides the lifting direction of the first lifting plate 521, so that the first lifting plate 521 lifts and lowers stably and avoids the first lifting plate 521 from swaying.

[0200] In one embodiment, see Figure 8 The first lifting assembly 52 further includes a seventh sensor, an eighth sensor, and a fourth sensor trigger 528. The seventh and eighth sensors are disposed on the first support plate 51 along the lifting direction of the first lifting plate 521. The fourth sensor trigger 528 is disposed on the first lifting plate 521 and is used to trigger the seventh or eighth sensor. When the fourth sensor trigger 528 triggers the seventh sensor, the second rotation drive 522 stops driving the first lifting plate 521 to rise; when the fourth sensor trigger 528 triggers the eighth sensor, the second rotation drive 522 stops driving the first lifting plate 521 to descend. This limits the range of motion of the first lifting plate 521, preventing it from descending too far and colliding with the chip or the lower surface detection module 30.

[0201] See Figure 7 The first suction nozzle assembly 53 includes a first adjusting rod 531, a second adjusting rod 532, a first adjusting block 533, a second adjusting block 534, and a first suction nozzle 535; there are at least two first adjusting rods 531, which are arranged at intervals relative to each other on the first lifting plate 521; each first adjusting rod 531 is movably sleeved with a first adjusting block 533, and a second adjusting rod 532 is arranged between each pair of first adjusting blocks 533 arranged opposite to each other on the two first adjusting rods 531; a plurality of second adjusting blocks 534 are movably sleeved on the second adjusting rod 532, and each second adjusting block 534 is connected to a first suction nozzle 535.

[0202] Specifically: Multiple second adjusting blocks 534 are sleeved on the second adjusting rod 532, and each second adjusting block 534 is connected to a first suction nozzle 535. Therefore, each second adjusting rod 532 has a row of first suction nozzles 535 arranged through the multiple second adjusting blocks 534. A second adjusting rod 532 is arranged between each pair of opposing first adjusting blocks 533 on the two first adjusting rods 531. Therefore, by setting the number of second adjusting rods 532, multiple rows of first suction nozzles 535 can be arranged. Sliding the second adjusting block 534 along the second adjusting rod 532 allows for adjustment of the same... The distance between two adjacent second adjusting blocks 534 on the second adjusting rod 532 can be adjusted, that is, the distance between two adjacent first suction nozzles 535 in the same row can be adjusted; by sliding the first adjusting block 533 along the first adjusting rod 531, the distance between two adjacent first adjusting blocks 533 on the same first adjusting rod 531 can be adjusted, thereby adjusting the distance between two adjacent second adjusting rods 532, and realizing the distance between two adjacent rows of first suction nozzles 535; thus enabling the first suction nozzle assembly 53 to adapt to trays of different sizes, and realize the first suction nozzle assembly 53 to pick up the chips on the tray.

[0203] In some specific embodiments, see Figure 7 Each first adjusting rod 531 has two first adjusting blocks 533 movably sleeved on it, and there are two second adjusting rods 532; one of the second adjusting rods 532 is connected between two sets of oppositely arranged first adjusting blocks 533, and the other second adjusting rod 532 is connected between two sets of oppositely arranged first adjusting blocks 533, so that the first suction nozzle assembly 53 has two rows of first suction nozzles 535; specifically: when the suction module 50 is used to suck up the chip and move it above the lower surface detection module 30, the suction module 50 sucks up the first row and the second row of chips on the tray at one time. After completing the lower surface detection of the first row and the second row of chips, the conveying tray 221 moves so that the third row and the fourth row of chips on the tray are located below the suction module 50, so that the suction module 50 sucks up the third row and the fourth row of chips on the tray for lower surface detection... This is repeated to perform lower surface detection on all the chips on the tray.

[0204] In some specific embodiments, fourteen second adjusting blocks 534 are movably sleeved on each second adjusting rod 532, so that each row of first suction nozzles 535 of the first suction nozzle assembly 53 has fourteen nozzles.

[0205] In some specific embodiments, see Figure 7 A first set screw hole is formed on the first adjusting block 533, and a first set screw rod is provided in the first set screw hole. After adjusting the position of the first adjusting block 533 along the first adjusting rod 531, the first set screw rod is used to position the first adjusting block 533.

[0206] In some specific embodiments, see Figure 7 The second adjusting block 534 has a second set screw hole, and a second set screw rod is provided in the second set screw hole. After adjusting the position of the second adjusting block 534 along the second adjusting rod 532, the second set screw rod is used to position the first adjusting block 533.

[0207] In some specific embodiments, the first suction nozzle 535 is provided with a buffer spring to increase the adaptability of the first suction nozzle 535 when adsorbing the chip.

[0208] See Figure 6 The first conveying module 40 includes a first gantry frame 41, a third rotation drive component 42, a second drive wheel 43, a second driven wheel 44, a second conveyor belt 45, a third guide rail 46, and a third slider 47. The first gantry frame 41 spans the loading module 20, and the lower surface detection module 30 is mounted on the mounting base 10. The third rotation drive component 42 is mounted on the first gantry frame 41. The second drive wheel 43 is connected to the power output end of the third rotation drive component 42. The second driven wheel 44 is mounted on the first gantry frame 41. The second conveyor belt 45 is tensioned and sleeved on the second drive wheel 43 and the second driven wheel 44. The third guide rail 46 is mounted on the first gantry frame 41, and the third slider 47 is slidably connected to the third guide rail 46. The suction module 50 and the upper surface detection module 60 are both connected to one side of the second conveyor belt 45 and the third slider 47.

[0209] In this embodiment, when it is necessary to move the suction module 50 and the upper surface detection module 60, the third rotation drive 42 is activated, driving the second drive wheel 43 to rotate. Under the drive of the second driven wheel 44, the second conveyor belt 45 rotates with the rotation of the second drive wheel 43, and the second conveyor belt 45 carries the suction module 50 and the upper surface detection module 60 to move. In addition, the first transport module 40 also includes a third guide rail 46 and a third slider 47 that are slidably connected. The third guide rail 46 is set on the first gantry 41, and the third slider 47 is connected to the suction module 50 and the upper surface detection module. The third guide rail 46 restricts the movement direction of the third slider 47, thereby also restricting the movement direction of the suction module 50 and the upper surface detection module. The movement of the suction module 50 and the upper surface detection module is guided by the third guide rail 46 and the third slider 47, increasing the stability of the movement of the suction module 50 and the upper surface detection module.

[0210] In one embodiment, see Figure 6The first conveying module 40 further includes a ninth sensor 48, a tenth sensor 49, and a fifth sensor trigger. The ninth sensor 48 and the tenth sensor 49 are spaced apart on the first gantry 41 along the conveying direction of the second conveyor belt 45. The fifth sensor trigger is disposed on the third slider 47 and is used to trigger the sensing of the ninth sensor 48 or the tenth sensor 49. When the fifth sensor triggers the sensing of the ninth sensor 48 or the tenth sensor 49, the third rotation drive 42 stops driving the second drive wheel 43. When the third rotation drive 42 restarts, it drives the second drive wheel 43 to rotate in the opposite direction to change the conveying direction of the second conveyor belt 45 and prevent the suction module 50 and the upper surface detection module from exceeding their movement range.

[0211] In one embodiment, see Figure 14 and Figure 15 The second transport module 110 includes a second gantry frame 1101, a fourth rotation drive 1102, a third drive wheel 1103, a third driven wheel 1104, a third conveyor belt 1105, a fourth guide rail 1106, and a fourth slider 1107. The second gantry frame 1101 spans the first recycling module 70, and the second recycling module 80 is mounted on the mounting base 10. The fourth rotation drive 1102 is mounted on the second gantry frame 1101, and the third drive wheel 1103 is connected to the fourth drive wheel 1107. The power output end of the drive unit 1102 is connected, the third driven wheel 1104 is mounted on the second gantry frame 1101, and the third conveyor belt 1105 is tensioned and sleeved on the third drive wheel 1103 and the third driven wheel 1104; the fourth guide rail 1106 is mounted on the second gantry frame 1101, and the fourth slider 1107 is slidably connected to the fourth guide rail 1106; wherein, the sorting module 90 is connected to one side of the third conveyor belt 1105 and the fourth slider 1107;

[0212] In this embodiment, when the sorting module 90 needs to be moved, the fourth rotation drive 1102 is activated, driving the third drive wheel 1103 to rotate. Under the drive of the third driven wheel 1104, the third conveyor belt 1105 rotates along with the rotation of the third drive wheel 1103, and the third conveyor belt 1105 carries the sorting module 90 to above the first sorting area 70a or above the second sorting area 80a. In addition, the second transport module 110 also includes a fourth guide rail 1106 and a fourth slider 1107 that are slidably connected. The fourth guide rail 1106 is set on the second gantry 1101, and the fourth slider 1107 is connected to the sorting module 90. The fourth guide rail 1106 restricts the movement direction of the fourth slider 1107, thereby also restricting the movement direction of the sorting module 90. The movement of the sorting module 90 is guided by the fourth guide rail 1106 and the fourth slider 1107, which improves the stability of the sorting module 90.

[0213] In one embodiment, see Figure 15 The second transport module 110 further includes an eleventh sensor 1108, a twelfth sensor 1109, and a sixth sensor trigger 11010. The eleventh sensor 1108 and the twelfth sensor 1109 are spaced apart on the second gantry 1101 along the transport direction of the third conveyor belt 1105. The sixth sensor trigger 11010 is disposed on the fourth slider 1107 and is used to trigger the sensing of the eleventh sensor 1108 or the twelfth sensor 1109. When the sixth sensing trigger 11010 triggers the eleventh sensing element 1108 or the twelfth sensing element 1109, the fourth rotation drive 1102 stops driving the third drive wheel 1103. When the fourth rotation drive 1102 restarts, it drives the third drive wheel 1103 to rotate in the opposite direction to change the conveying direction of the third conveyor belt 1105 and prevent the sorting module 90 from exceeding its movement range.

[0214] In one embodiment, see Figure 14 , Figure 16 as well as Figure 17The sorting module 90 includes a first support frame 91, a second lifting assembly 92, a clamp 93, a second conveying assembly 94, a second support plate 95, a third lifting assembly 96, and a second suction nozzle 97. The first support frame 91 is mounted on the second conveying module 110. The second lifting assembly 92 is mounted on the first support frame 91, and its power output end is connected to the clamp 93. The second lifting assembly 92 drives the clamp 93 to move up and down. The clamp 93 has a clamping state and a released state. In the clamping state... When in the first state, the clamp 93 holds the tray; when in the released state, the clamp 93 releases the tray. The second conveying component 94 is disposed on the first support frame 91, and the conveying direction of the second conveying component 94 is perpendicular to the conveying direction of the second conveying module 110. The second support plate 95 is disposed on the second conveying component 94, and the third lifting component 96 is disposed on the second support plate 95. The third lifting component 96 includes a second lifting plate 961 that can move up and down relative to the second support plate 95, and the second suction nozzle 97 is disposed on the second lifting plate 961.

[0215] Specifically: when it is necessary to move the pallet in the first sorting area 70a to the second sorting area 80a, the second lifting component 92 drives the clamp 93 to descend, and the clamp 93 switches to the clamping state to clamp the pallet in the first sorting area 70a; the second lifting component 92 drives the clamp 93 to rise, so that the clamp 93 brings the pallet out of the first sorting area 70a; then the second transport module 110 is activated to drive the first carrier frame 91 to move upward toward the second sorting area 80a. The second lifting component 92 and the clamp 93 set on the first carrier frame 91 move upward toward the second sorting area 80a. The second lifting component 92 drives the clamp 93 to descend, and the clamp 93 switches from the clamping state to the release state, thereby releasing the pallet and placing the pallet into the second sorting area 80a of the second recycling module 80.

[0216] When it is necessary to move chips from the first sorting area 70a to the second sorting area 80a or vice versa, the second transport module 110 is activated to drive the first carrier 91 to move above the first sorting area 70a or the second sorting area 80a. The third lifting component 96 and the second suction nozzle 97, which are mounted on the first carrier 91, move to the top of the first sorting area 70a or the second sorting area 80a. Then, the third lifting component 96 drives the second suction nozzle 97 to lift and lower to suck up chips from the tray of the first sorting area 70a, or release the chips it has sucked onto the tray of the first sorting area 70a, or suck up chips from the tray of the second sorting area 80a, or release the chips it has sucked onto the tray of the second sorting area 80a.

[0217] In some specific embodiments, a buffer spring is provided in the second suction nozzle 97 to increase the adaptability of the second suction nozzle 97 when adsorbing the chip.

[0218] In one embodiment, see Figure 14 and Figure 17 The sorting module 90 also includes a second elastic component 98. One end of the second elastic component 98 is connected to the second support plate 95, and the other end of the second elastic component 98 is connected to the second lifting plate 961. Therefore, when the third lifting component 96 malfunctions, the second elastic component 98 can hold the second lifting plate 961, thereby holding the second suction nozzle 97, preventing the second suction nozzle 97 from falling and hitting the first sorting area 70a or the second sorting area 80a.

[0219] In some specific implementations, see Figure 14 The second conveying assembly 94 includes a fifth rotation drive 941, a fourth drive wheel 942, a fourth driven wheel 943, a fourth conveyor belt 944, a fifth guide rail 945, and a fifth slider 946. The fifth rotation drive 941 is mounted on the first support frame 91. The fourth drive wheel 942 is connected to the power output end of the fifth rotation drive 941. The fourth driven wheel 943 is mounted on the first support frame 91. The fourth conveyor belt 944 is tensioned and sleeved on the fourth drive wheel 942 and the fourth driven wheel 943. The fifth guide rail 945 is mounted on the first support frame 91. The fifth slider 946 is slidably connected to the fifth guide rail 945. The second support plate 95 is connected to one side of the fourth conveyor belt 944 and the fifth slider 946.

[0220] In this embodiment, when it is necessary to move the second support plate 95 and its second suction nozzle 97, the fifth rotation drive member 941 is activated, driving the fourth drive wheel 942 to rotate. Under the drive of the fourth driven wheel 943, the fourth conveyor belt 944 rotates along with the rotation of the fourth drive wheel 942. The fourth conveyor belt 944 then moves the second support plate 95, causing the second suction nozzle 97 to move above the first sorting area 70a along the length of the tray or above the second sorting area 80a along the length of the tray, thus enabling the second suction nozzle 97 to move. The nozzle 97 can pick up any chip on the tray; in addition, the second transfer assembly 94 also includes a fifth guide rail 945 and a fifth slider 946 that are slidably connected. The fifth guide rail 945 is set on the first support frame 91, and the fifth slider 946 is connected to the second support plate 95. The fifth guide rail 945 restricts the movement direction of the fifth slider 946, thereby also restricting the movement direction of the second support plate 95. The movement of the second support plate 95 is guided by the fifth guide rail 945 and the fifth slider 946, which improves the stability of the second support plate 95.

[0221] In one embodiment, see Figure 14 The second conveying assembly 94 further includes a thirteenth sensor 947, a fourteenth sensor, and a seventh sensor trigger. The thirteenth sensor 947 and the fourteenth sensor are spaced apart on the second support frame along the conveying direction of the fourth conveyor belt 944. The seventh sensor trigger is disposed on the fifth slider 946 and is used to trigger the sensing of the thirteenth sensor 947 or the fourteenth sensor. When the seventh sensor triggers the sensing of the thirteenth sensor 947 or the fourteenth sensor, the fifth rotation drive 941 stops driving the fourth drive wheel 942. When the fifth rotation drive 941 restarts, it drives the fourth drive wheel 942 to rotate in the opposite direction, thereby changing the conveying direction of the fourth conveyor belt 944 and preventing the second support plate 95 from exceeding its movement range.

[0222] In some specific implementations, see Figure 17 The third lifting assembly 96 further includes a sixth rotation drive 962, a fifth drive wheel 963, a fifth driven wheel 964, and a fifth conveyor belt 965; the sixth rotation drive 962 is disposed on the first support plate 51, the fifth drive wheel 963 is connected to the power output end of the sixth rotation drive 962, the fifth driven wheel 964 is disposed on the first support plate 51, the fifth driven wheel 964 and the fifth drive wheel 963 are spaced apart along the lifting direction of the second lifting plate 961, and the fifth conveyor belt 965 is tensioned and sleeved on the fifth drive wheel 963 and the fifth driven wheel 964, wherein the second lifting plate 961 is connected to one side of the fifth conveyor belt 965.

[0223] In this embodiment, when it is necessary to drive the second lifting plate 961 and the second suction nozzle 97 thereon to move up and down, the sixth rotation drive 962 is activated, driving the fifth drive wheel 963 to rotate. Under the drive of the fifth driven wheel 964, the fifth conveyor belt 965 rotates with the rotation of the fifth drive wheel 963. Since the fifth driven wheel 964 and the fifth drive wheel 963 are spaced apart along the lifting direction of the second lifting plate 961, the fifth conveyor belt 965 sleeved on the fifth driven wheel 964 and the fifth drive wheel 963 can carry the second lifting plate 961 to move up and down, thereby enabling the second suction nozzle 97 thereon to move up and down.

[0224] In some specific embodiments, see Figure 17 The third lifting assembly 96 also includes a sixth guide rail 966 and a sixth slider 967 that are slidably connected. One of the sixth guide rail 966 and the sixth slider 967 is disposed on the second support plate 95, and the other is connected to the second lifting plate 961. The sixth guide rail 966 restricts the movement direction of the sixth slider 967, thereby also restricting the lifting direction of the second lifting plate 961. The lifting of the second lifting plate 961 is guided by the sixth guide rail 966 and the sixth slider 967, thereby improving the stability of the second lifting plate 961.

[0225] In one embodiment, see Figure 17 The third lifting assembly 96 further includes a fifteenth sensor, a sixteenth sensor 969, and an eighth sensor trigger 9610. The fifteenth and sixteenth sensors 969 are spaced apart on the second support plate 95 along the conveying direction of the fifth conveyor belt 965. The eighth sensor trigger 9610 is disposed on the second lifting plate 961 and is used to trigger the sensing of the fifteenth or sixteenth sensor 969. When the eighth sensor trigger 9610 triggers the sensing of the fifteenth or sixteenth sensor 969, the sixth rotation drive 962 stops driving the fifth drive wheel 963. When the sixth rotation drive 962 restarts, it drives the fifth drive wheel 963 to rotate in the opposite direction, thereby changing the conveying direction of the fifth conveyor belt 965 and preventing the second lifting plate 961 from exceeding its movement range.

[0226] In some specific embodiments, see Figure 17 There are at least two sets of third lifting components 96, at least two second lifting plates 961, and at least two second suction nozzles 97. Each set of third lifting components 96 has a second lifting plate 961 at its power output end, and each second lifting plate 961 has a second suction nozzle 97. Therefore, when sorting chips, two chips can be picked up at once. Moreover, the lifting of the two second suction nozzles 97 is controlled separately, so that the two first suction nozzles 535 are not limited by the position of the chips.

[0227] Correspondingly, there are two second elastic components 98, which are used to elastically hold the two second lifting plates 961 respectively.

[0228] In some specific implementations, see Figure 16 The second lifting assembly 92 includes a third lifting drive 921, a seventh guide rail 922 and a seventh slider 923. The third lifting drive 921 is mounted on the first support frame 91. The power output end of the third lifting drive 921 is connected to the clamp 93 to drive the clamp 93 to perform lifting movements, so that the clamp 93 can move toward or away from the tray.

[0229] One of the seventh guide rail 922 and the seventh slider 923 is mounted on the first support frame 91, and one of them is connected to the clamp 93, thereby guiding the lifting direction of the clamp 93 and enabling the clamp 93 to achieve stable lifting.

[0230] In some specific embodiments, see Figure 16 The second lifting assembly 92 further includes a seventeenth sensor 924, an eighteenth sensor 925, and a ninth sensor trigger 926. The seventeenth sensor 924 and the eighteenth sensor 925 are spaced apart on the first support frame 91 along the lifting direction of the clamp 93. The ninth sensor trigger 926 is disposed on the power output end of the third lifting drive 921 and is used to trigger the sensing of the seventeenth sensor 924 or the eighteenth sensor 925. Specifically, when the eighth sensor trigger 9610 triggers the sensing of the seventeenth sensor 924, the third lifting drive 921 stops driving the clamp 93 to descend; when the eighth sensor trigger 9610 triggers the sensing of the eighteenth sensor 925, the third lifting drive 921 stops driving the clamp 93 to rise, preventing the clamp 93 from exceeding its range of motion.

[0231] In one embodiment, see Figure 14 and Figure 16 The sorting module 90 also includes a cover plate 99, which is located on the power output end of the second lifting assembly 92. When the clamp 93 holds the tray, the cover plate 99 presses down on the tray to prevent the chips from falling off the tray.

[0232] In some specific embodiments, see Figure 16 The cover plate 99 is connected to the power output end of the third lifting drive component 921, and the clamp 93 is set on the side of the cover plate 99 away from the third lifting drive component 921.

[0233] In some specific embodiments, see Figure 16The cover plate 99 is connected to the seventh guide rail 922 or the seventh slider 923, thereby realizing the connection between the clip 93 and the seventh guide rail 922 or the seventh slider 923.

[0234] In one embodiment, see Figure 10 and Figure 11 The first recycling module 70 includes a second support 71, a third conveying component 72, and a first positioning component 73. The second support 71 is disposed on the mounting base 10, and the first sorting area 70a and the first recycling area 70b are formed by the second support 71. The third conveying component 72 is disposed on the second support 71 and is used to transfer the tray located on the first sorting area 70a to the first recycling area 70b. The first positioning component 73 is disposed on the second support 71 and / or the mounting base 10 and is used to confine the tray within the first sorting area 70a.

[0235] In this embodiment, when the tray is placed in the first sorting area 70a, the first positioning component 73 restricts and positions the tray to ensure that the tray is placed accurately, so that the subsequent chip sorting work can proceed smoothly; after sorting is completed, the third conveying component 72 moves the tray from the first sorting area 70a to the first recycling area 70b.

[0236] In some specific embodiments, see Figure 10 and Figure 11 The first positioning component 73 includes a first end stop 731, a first end pusher 732, a first side stop 733, and a first side pusher 734. The first end stop 731 is disposed on the second support 71. The first end pusher 732 is disposed on the mounting base 10 opposite to the first end stop 731. The first side stop 733 and the first side pusher 734 are disposed opposite to each other on the second support 71, and the arrangement direction of the first end stop 731 and the first end pusher 732 is the same as that of the first side stop 731. The arrangement direction of the first side pusher 734 is perpendicular to that of the first end stop 731 and the first end pusher 732. After the tray is placed in the first sorting area 70a, the first end stop 731 and the first end pusher 732 are located at the two ends of the tray, and the first side stop 733 and the first side pusher 734 are located on both sides of the tray. The first end pusher 732 pushes the tray toward the first end stop 731, and the first side pusher 734 pushes the tray toward the first side stop 733, thereby realizing the positioning of the tray in the first sorting area 70a.

[0237] In some specific embodiments, the first end pusher 732 has a retracted state. When it is necessary to move the tray in the first sorting area 70a to the first recycling area 70b, the first end pusher 732 switches to the retracted state so that the tray can be moved.

[0238] In some specific embodiments, the first end pusher 732 adopts a combination of a first telescopic rotary cylinder and a first push rod. The first telescopic rotary cylinder is mounted on the mounting base 10, and the first push rod is connected to the power output end of the first telescopic rotary cylinder. The first telescopic rotary cylinder drives the first push rod to move toward the pallet to push the pallet. The first telescopic rotary cylinder can also drive the first push rod to rotate so that the first push rod switches to a retracted state to avoid obstructing the movement of the pallet.

[0239] In some specific embodiments, the first side stop 733 adopts a first telescopic cylinder, which pushes the tray through the power output end of the first telescopic cylinder.

[0240] In some specific embodiments, see Figure 10 The first recycling module 70 also includes a third through-beam sensor 74. The receiving end and the transmitting end of the third through-beam sensor 74 are respectively disposed on both sides of the first sorting area 70a. The third through-beam sensor 74 is used to sense whether a tray is placed in the first sorting area 70a. Specifically, when the receiving end of the third through-beam sensor 74 does not receive the light emitted by its transmitting end, it indicates that a tray has been placed in the first sorting area 70a, and the tray blocks the light emitted by the transmitting end of the third through-beam sensor.

[0241] In one embodiment, see Figure 10 and Figure 11 The first recycling module 70 also includes a first vibration component 75, which is disposed on the second support 71. The first vibration component 75 is used to vibrate the tray in the first sorting area 70a. By vibrating the second support 71, the first vibration component 75 can vibrate and guide the tilted chips on the tray in the first sorting area 70a to be aligned.

[0242] In some specific embodiments, the first vibration component 75 includes a first striking cylinder, which is mounted on the mounting base 10. The power output end of the first striking cylinder is connected to the second support 71, thereby realizing the vibration of the second support 71 and the tray.

[0243] In some specific embodiments, see Figure 11The third conveying assembly 72 includes a seventh rotary drive 721, a sixth driving wheel 722, a sixth driven wheel 723, and a sixth conveyor belt 724. The seventh rotary drive 721 is mounted on a second support 71. The sixth driving wheel 722 is connected to the seventh rotary drive 721. The sixth driven wheel 723 is spaced apart from the sixth driving wheel 722 on the second support 71. The sixth conveyor belt 724 is tensioned and fitted onto the sixth driving wheel 722 and the sixth driven wheel. When the pallet is placed in the first sorting area 70a, the pallet is located on the sixth conveyor belt 724. Therefore, when it is necessary to move the pallet from the first sorting area 70a to the first recycling area 70b, the seventh rotary drive 721 is activated, driving the sixth driving wheel 722 to rotate. Driven by the sixth driven wheel 723, the sixth conveyor belt 724 moves, moving the pallet to the first recycling area 70b.

[0244] In some specific embodiments, there are two sixth driving wheels 722, six driven wheels 723, and six conveyor belts 724. One sixth conveyor belt 724 is mounted on one of the sixth driving wheels 722 and six driven wheels 723, and the other sixth conveyor belt 724 is mounted on the other sixth driving wheel 722 and six driven wheel 723. The two sixth conveyor belts 724 are spaced apart and support the two sides of the pallet respectively, thereby realizing the smooth transport of the pallet.

[0245] In some specific embodiments, see Figure 10 The second support 71 includes two second side plates 711 arranged at relative intervals.

[0246] In some specific embodiments, the first end-position pusher 732 is located between the two second side plates 711.

[0247] In some specific embodiments, two sixth driving wheels 722 are rotatably disposed on the side of the two second side plates 711 facing each other; two sixth driven wheels 723 are rotatably disposed on the side of the two second side plates 711 facing each other.

[0248] In one embodiment, see Figure 10 and Figure 11The first recycling module 70 further includes a first recycling stacking assembly 76 and a third lifting assembly 77 disposed on the first recycling area 70b; the first recycling stacking assembly 76 includes a first bearing 761 and a first rotating plate 762, the first bearing 761 is disposed on the second support 71, and the first rotating plate 762 is rotatably disposed on the first bearing 761. The first rotating plate 762 has a first flat position and a first clearance position. In the first flat position, the first rotating plate 762 is used to carry the pallet, and in the first clearance position, the first rotating plate 762 is used to clear the pallet; the third lifting assembly 77 includes a fourth lifting drive 771 and a third lifting plate 772, the fourth lifting drive... Component 771 is disposed on the mounting base 10, and the third lifting plate 772 is connected to the power output end of the fourth lifting drive component 771; wherein, when the third conveying component 72 moves the tray above the third lifting plate 772, the fourth lifting drive component 771 drives the third lifting plate 772 to support the tray and rise, the tray abuts against the first rotating plate 762, causing the first rotating plate 762 to switch to the first avoidance state, so that when the tray rises above the first rotating plate 762, the first rotating plate 762 falls and switches to the first flat state, and the fourth lifting drive component 771 drives the third lifting plate 772 to descend until the tray falls onto the first rotating plate 762.

[0249] Specifically, after the trays in the first sorting area 70a are full, the third conveying component 72 conveys the trays in the first sorting area 70a to the first recycling area 70b. At this time, the trays are located above the third lifting plate 772, and the first rotating plate 762 is located above the trays. The third lifting drive component 921 drives the third lifting plate 772 to rise, and the third lifting plate 772 lifts the trays off the third conveying component 72. During the process of the third lifting plate 772 lifting the trays, the trays abut against the first rotating plate 762, causing the first rotating plate 762 to rotate to the first clearance state, thereby allowing the trays to rise above the first rotating plate 762. At this time, the trays no longer abut against the first rotating plate 762, and the first rotating plate 762 rotates to the first flat state under the action of gravity. The fourth lifting drive component 771 then begins to drive the third lifting plate 772 to descend until the trays on the third lifting plate 772 fall onto the first rotating plate 762, thereby stacking the trays on the first rotating plate 762.

[0250] In some specific embodiments, there are four first bearing seats 761 and four first rotating plates 762. Two first bearing seats 761 are disposed on one of the second side plates 711, and two first rotating plates 762 are rotatably connected to the two first bearing seats 761 respectively. The two first rotating plates 762 are used to support the two ends of one side of the pallet. The other two first bearing seats 761 are disposed on the other second side plate 711, and the other two first rotating plates 762 are rotatably connected to the two first bearing seats 761 respectively. The two first rotating plates 762 are used to support the two ends of the other side of the pallet.

[0251] In some specific embodiments, see Figure 10 and Figure 11 The first recycling stacking assembly 76 also includes a first rotation limiter 763, which is disposed on the first bearing 761. The first rotation limiter 763 is used to limit the rotation angle of the first rotating plate 762 to ensure that the first rotating plate 762 can rotate to the first flat position under the action of gravity.

[0252] In some specific embodiments, see Figure 10 and Figure 11 The first recycling stacking structure also includes a second limiting plate 764, which is used to limit the periphery of the pallet so that the pallet is stably stacked on the first rotating plate 762 and the pallet is prevented from tilting and falling.

[0253] In some specific embodiments, the second limiting plate 764 has an L-shaped structure, and there are four second limiting plates 764, which are used to limit the four corners of the tray respectively.

[0254] In some specific embodiments, see Figure 10 The first recycling stacking assembly 76 also includes a fourth through-beam sensor 765. The receiving end and the transmitting end of the fourth through-beam sensor 765 are located on opposite sides of the first recycling area 70b, respectively. The fourth through-beam sensor 765 is used to sense whether the third conveying assembly 72 is moving the tray into the first recycling area 70b. Specifically, when the receiving end of the fourth through-beam sensor 765 does not receive the light emitted by its transmitting end, it indicates that the third conveying assembly 72 is moving the tray into the first recycling area 70b, and the third conveying assembly 72 is controlled to slow down its conveying speed.

[0255] In some specific embodiments, see Figure 10The first recycling stacking assembly 76 also includes an eighth through-beam sensor 766, which is used to detect the stacking amount of trays in the first recycling area 70b. The receiving end and the transmitting end of the eighth through-beam sensor 766 are respectively arranged on both sides of the first recycling area 70b. Specifically, when the receiving end of the eighth through-beam sensor 766 cannot receive the light emitted by its transmitting end, it indicates that the height of the trays in the first recycling area 70b has been stacked so high that it blocks the light emitted by the transmitting end of the eighth through-beam sensor 766, that is, the stacking amount of trays in the first recycling area 70b has reached the predetermined quantity.

[0256] In some specific embodiments, the receiving end and the transmitting end of the eighth photoelectric sensor 766 are respectively disposed on two second limiting plates 764 located on both sides of the first recovery area 70b and arranged opposite to each other.

[0257] In one embodiment, see Figure 12 and Figure 13 The second recycling module 80 includes a third support 81, a fourth conveying component 82, and a second positioning component 83. The third support 81 is disposed on the mounting base 10, and the second sorting area 80a and the second recycling area 80b are formed by the third support 81. The fourth conveying component 82 is disposed on the third support 81 and is used to transfer a tray located on the second sorting area 80a to the second recycling area 80b. The second positioning component 83 is disposed on the third support 81 and / or the mounting base 10 and is used to confine the tray within the second sorting area 80a.

[0258] In this embodiment, when the tray is placed in the second sorting area 80a, the second positioning component 83 restricts and positions the tray to ensure that the tray is placed accurately, so that the subsequent chip sorting work can proceed smoothly. After sorting is completed, the fourth conveying component 82 moves the tray from the second sorting area 80a to the second recycling area 80b.

[0259] In some specific embodiments, the second positioning component 83 includes a second end stop 831, a second end pusher 832, a second side stop 833, and a second side pusher 834. The second end stop 831 is disposed on the third support 81, the second end pusher 832 is disposed on the mounting base 10 opposite to the second end stop 831, and the second side stop 833 and the second side pusher 834 are disposed opposite to each other on the third support 81. The arrangement direction of the second end stop 831 and the second end pusher 832 is perpendicular to the second end stop 831. The side stop 833 and the second side pusher 834 are arranged perpendicularly. After the tray is placed in the second sorting area 80a, the second end stop 831 and the second end pusher 832 are located at the two ends of the tray, respectively, and the second side stop 833 and the second side pusher 834 are located on both sides of the tray, respectively. The second end pusher 832 pushes the tray toward the second end stop 831, and the second side pusher 834 pushes the tray toward the second side stop 833, thereby achieving the positioning of the tray in the second sorting area 80a.

[0260] In some specific embodiments, the second end pusher 832 has a retracted state. When it is necessary to move the tray in the second sorting area 80a to the second recycling area 80b, the second end pusher 832 switches to the retracted state so that the tray can be moved.

[0261] In some specific embodiments, the second end pusher 832 adopts a combination of a second telescopic rotary cylinder and a second push rod. The second telescopic rotary cylinder is mounted on the mounting base 10, and the second push rod is connected to the power output end of the second telescopic rotary cylinder. The second telescopic rotary cylinder drives the second push rod to move toward the pallet to push the pallet. The second telescopic rotary cylinder can also drive the second push rod to rotate so that the second push rod switches to a retracted state to avoid obstructing the movement of the pallet.

[0262] In some specific embodiments, the second side stop 833 adopts a second telescopic cylinder, which pushes the tray through the power output end of the second telescopic cylinder.

[0263] In some specific embodiments, see Figure 12 The second recycling module 80 also includes a fifth through-beam sensor 84. The receiving end and the transmitting end of the fifth through-beam sensor 84 are respectively disposed on both sides of the second sorting area 80a. The fifth through-beam sensor 84 is used to sense whether a tray is placed in the second sorting area 80a. Specifically, when the receiving end of the fifth through-beam sensor 84 does not receive the light emitted by its transmitting end, it indicates that a tray has been placed in the second sorting area 80a, and the tray blocks the light emitted by the transmitting end of the fifth through-beam sensor.

[0264] In one embodiment, see Figure 12 and Figure 13The second recycling module 80 also includes a second vibration component 85, which is disposed on the third support 81. The second vibration component 85 is used to vibrate the tray in the second sorting area 80a. By vibrating the third support 81, the second vibration component 85 corrects the tilted chips on the tray in the second sorting area 80a.

[0265] In some specific embodiments, the second vibration assembly 85 includes a second striking cylinder, which is mounted on the mounting base 10. The power output end of the second striking cylinder is connected to the third support 81, thereby realizing the vibration of the third support 81 and the tray.

[0266] In some specific embodiments, see Figure 13 The fourth conveying assembly 82 includes an eighth rotary drive 821, a seventh driving wheel 822, a seventh driven wheel 823, and a seventh conveyor belt 824. The eighth rotary drive 821 is mounted on a third support 81. The seventh driving wheel 822 is connected to the eighth rotary drive 821. The seventh driven wheel 823 is spaced apart from the seventh driving wheel 822 on the third support 81. The seventh conveyor belt 824 is tensioned and fitted onto the seventh driving wheel 822 and the seventh driven wheel. When the pallet is placed in the second sorting area 80a, the pallet is located on the seventh conveyor belt 824. Therefore, when it is necessary to move the pallet from the second sorting area 80a to the seventh recycling area, the eighth rotary drive 821 is activated, driving the seventh driving wheel 822 to rotate. Under the influence of the seventh driven wheel 823, the seventh conveyor belt 824 moves, moving the pallet to the second recycling area 80b.

[0267] In some specific embodiments, there are two seventh driving wheels 822, seven driven wheels 823, and seven conveyor belts 824. One seventh conveyor belt 824 is mounted on one of the seventh driving wheels 822 and seven driven wheels 823, and the other seventh conveyor belt 824 is mounted on the other seventh driving wheel 822 and seven driven wheel 823. The two seventh conveyor belts 824 are spaced apart and support the two sides of the pallet respectively, thereby realizing the smooth transport of the pallet.

[0268] In some specific embodiments, see Figure 12 The third support 81 includes two third side plates 811 that are arranged at relative intervals.

[0269] In some specific embodiments, the second end pusher 832 is located between the two third side plates 811.

[0270] In some specific embodiments, the two seventh driving wheels 822 are rotatably disposed on the side of the two third side plates 811 facing each other; the two seventh driven wheels 823 are rotatably disposed on the side of the two third side plates 811 facing each other.

[0271] In one embodiment, see Figure 12 and Figure 13 The second recycling module 80 further includes a second recycling stacking assembly 86 and a fourth lifting assembly 87 disposed on the second recycling area 80b; the second recycling stacking assembly 86 includes a second bearing 861 and a second rotating plate 862, the second bearing 861 being disposed on the third support 81, and the second rotating plate 862 being rotatably disposed on the bearing, the second rotating plate 862 having a second flat position and a second clearance position, in the second flat position the second rotating plate 862 is used to carry the pallet, and in the second clearance position the second rotating plate 862 is used to clear the pallet; the fourth lifting assembly 87 includes a fifth lifting drive 871 and a fourth lifting plate 872, the fifth lifting drive 871... 71. The fourth lifting plate 872 is connected to the power output end of the fifth lifting drive component 871 on the mounting base 10. When the fourth conveying component 82 moves the tray above the fourth lifting plate 872, the fifth lifting drive component 871 drives the fourth lifting plate 872 to support the tray and rise. The tray abuts against the second rotating plate 862, causing the second rotating plate 862 to switch to the second avoidance state. When the tray rises above the second rotating plate 862, the second rotating plate 862 falls and switches to the second flat state. The fifth lifting drive component 871 drives the fourth lifting plate 872 to descend until the tray falls onto the second rotating plate 862.

[0272] Specifically, after the trays in the second sorting zone 80a are full, the fourth conveying component 82 conveys the trays in the second sorting zone 80a to the second recycling zone 80b. At this time, the trays are located above the fourth lifting plate 872, and the second rotating plate 862 is located above the trays. The fifth lifting drive component 871 drives the fourth lifting plate 872 to rise, and the fourth lifting plate 872 lifts the trays off the fourth conveying component 82. During the process of the fourth lifting plate 872 lifting the trays, the trays abut against the second rotating plate 862, causing the second rotating plate 862 to rotate to the second avoidance state, thereby allowing the trays to rise above the second rotating plate 862. At this time, the trays no longer abut against the second rotating plate 862, and the second rotating plate 862 rotates to the second flat state under the action of gravity. The fifth lifting drive component 871 then begins to drive the fourth lifting plate 872 to descend until the trays on the fourth lifting plate 872 fall onto the second rotating plate 862, thereby stacking the trays on the second rotating plate 862.

[0273] In some specific embodiments, see Figure 12 and Figure 13 The second recycling stacking assembly 86 also includes a second rotation limiter 863, which is disposed on the second bearing 861. The second rotation limiter 863 is used to limit the rotation angle of the second rotating plate 862 to ensure that the second rotating plate 862 can rotate to the second flat position under the action of gravity.

[0274] In some specific embodiments, see Figure 12 and Figure 13 The second recycling stacking structure also includes a third limiting plate 864, which is used to limit the periphery of the pallet so that the pallet is stably stacked on the second rotating plate 862 and to prevent the pallet from tilting and falling.

[0275] In some specific embodiments, the third limiting plate 864 has an L-shaped structure, and there are four third limiting plates 864, which are used to limit the four corners of the tray respectively.

[0276] In some specific embodiments, see Figure 12 The second recycling stacking assembly 86 also includes a ninth through-beam sensor 865. The receiving end and the transmitting end of the ninth through-beam sensor 865 are located on opposite sides of the second recycling area 80b, respectively. The ninth through-beam sensor 865 is used to sense whether the fourth conveying assembly 82 is moving the tray into the second recycling area 80b. Specifically, when the receiving end of the ninth through-beam sensor 865 does not receive the light emitted by its transmitting end, it indicates that the fourth conveying assembly 82 is moving the tray into the second recycling area 80b, and the fourth conveying assembly 82 is controlled to slow down its conveying speed.

[0277] In some specific embodiments, see Figure 12 The second recycling stacking assembly 86 also includes a tenth beam sensor 866, which is used to detect the stacking amount of trays in the second recycling area 80b. The receiving end and the transmitting end of the tenth beam sensor 866 are respectively located on both sides of the second recycling area 80b. Specifically, when the receiving end of the tenth beam sensor 866 cannot receive the light emitted by its transmitting end, it indicates that the height of the trays in the second recycling area 80b has been stacked so high that it blocks the light emitted by the transmitting end of the tenth beam sensor 866, that is, the stacking amount of trays in the second recycling area 80b has reached the predetermined quantity.

[0278] In some specific embodiments, the receiving end and the transmitting end of the tenth pair of beam sensors 866 are respectively disposed on two third limiting plates 864 located on both sides of the second recovery area 80b and arranged opposite to each other.

[0279] In one embodiment, see Figure 1 , Figure 18 as well as Figure 19The chip appearance inspection device 100 also includes a manual recycling module 120, which is arranged side by side with the first recycling module 70 and the second recycling module 80, and the second transport module 110 spans the manual recycling module 120. The manual recycling module 120 includes a recycling tray 1204. The sorting module 90 is also used to transport the chips in the first sorting area 70a or the second sorting area 80a to the recycling tray 1204 of the manual recycling module 120.

[0280] Based on the defective condition of the chips, chips with upper surface defects are sorted onto the tray in the second sorting area 80a, while chips with lower surface defects are sorted onto the recycling tray 1204 of the manual recycling module 120. Specifically, when sorting chips on the tray in the first sorting area 70a, the sorting module 90 is moved by the second transport module 110, so that the sorting module 90 transports chips with upper surface defects from the tray in the first sorting area 70a to the tray in the second sorting area 80a, and sorts chips with lower surface defects... The chips are transferred to the recycling tray 1204 of the manual recycling module 120. When sorting the chips on the tray in the second sorting area 80a, the sorting module 90 is moved by the second transport module 110, so that the sorting module 90 transfers the good chips on the tray in the second sorting area 80a to the tray in the first sorting area 70a, and transfers the chips with lower surface defects to the recycling tray 1204 of the manual recycling module 120, so that the chips remaining on the tray in the second sorting area 80a all have upper surface defects.

[0281] For example, chips with more than a predetermined number of defective features are sorted to the recycling tray 1204 of the manual recycling module 120, and chips with less than a predetermined number of defective features are sorted to the tray of the second sorting area 80a; there are no restrictions on the placement of chips during sorting.

[0282] See Figure 18 as well as Figure 19The manual recycling module 120 further includes a positioning support 1201, a sliding guide assembly 1202, and a guide plate 1203. The positioning support 1201 is disposed on the mounting base 10 and has a first positioning structure 12011. The sliding guide assembly 1202 is disposed on the mounting base 10 and extends toward the positioning support 1201. The end of the sliding guide assembly 1202 near the positioning support 1201 is the third sorting area 1202a, and the end of the sliding guide assembly 1202 away from the positioning support 1201 is... The third recycling area 1202b is defined as follows: a guide plate 1203 is disposed on the sliding guide assembly 1202, and the guide plate 1203 can move back and forth between the third sorting area 1202a and the third recycling area 1202b; the guide plate 1203 has a second positioning structure 12031, which cooperates with the first positioning structure 12011 to restrict the guide plate 1203 in the third sorting area 1202a; a recycling tray 1204 is placed on the guide plate 1203 and is used to recycle chips.

[0283] Specifically, when the recycling tray 1204 is full of chips, the guide plate 1203 is manually pulled from the third sorting area 1202a of the sliding guide assembly 1202 to the third recycling area 1202b, unloading the full recycling tray 1204 from the guide plate 1203. Then, the empty recycling tray 1204 is placed on the guide plate 1203, and the guide plate 1203 is pushed so that it moves from the third recycling area 1202b of the sliding guide assembly 1202 to the third sorting area 1202a. Through the cooperation of the second positioning structure 12031 and the first positioning structure 12011, the guide plate 1203 is restricted to the third sorting area 1202a, so that the recycling tray 1204 on the guide plate 1203 receives the chips sorted by the sorting module 90.

[0284] In some specific embodiments, see Figure 18 The guide plate 1203 has a handle portion 12032, which facilitates pulling the guide plate 1203.

[0285] In some specific embodiments, see Figure 18 The guide plate 1203 also forms a limiting part 12033, which is used to limit the periphery of the recycling tray 1204.

[0286] In some specific embodiments, one of the first positioning structure 12011 and the second positioning structure 12031 is a snap-fit ​​opening, and the other is a snap-fit ​​protrusion. The snap-fit ​​protrusion engages with the snap-fit ​​opening, thereby achieving mutual cooperation between the first positioning structure 12011 and the second positioning structure 12031.

[0287] In some specific embodiments, one of the first positioning structure 12011 and the second positioning structure 12031 is a first magnetic element, and the other is a second magnetic element. The first magnetic element and the second magnetic element attract each other magnetically, thereby realizing the mutual cooperation between the first positioning structure 12011 and the second positioning structure 12031.

[0288] In some specific embodiments, one of the first positioning structure 12011 and the second positioning structure 12031 is a snap-fit ​​and a first magnetic element, and the other is a snap-fit ​​and a second magnetic element. The snap-fit ​​is engaged in the snap-fit, and the first magnetic element and the second magnetic element are magnetically attracted to each other, thereby realizing the mutual cooperation of the first positioning structure 12011 and the second positioning structure 12031.

[0289] In some specific embodiments, see Figure 19 The sliding guide assembly 1202 includes an eighth guide rail 12021 and an eighth slider 12022 that are slidably connected. The eighth guide rail 12021 is mounted on the mounting base 10. The third sorting area 1202a and the third recycling area 1202b are formed by the eighth guide rail 12021. The guide plate 1203 is mounted on the eighth slider 12022.

[0290] In one embodiment, see Figure 19 The manual recycling module 120 also includes a proximity switch 1205, which is used to sense whether the guide tray 1203 has moved into place in the third sorting area 1202a.

[0291] In one embodiment, see Figure 18 The third recycling module also includes a sixth through-beam sensor 1206 disposed on the positioning support 1201. The sixth through-beam sensor 1206 is used to detect whether the guide plate 1203 is placed with a recycling tray 1204.

[0292] In one embodiment, see Figure 19 The third recycling module also includes a seventh through-beam sensor 1207 mounted on the positioning support 1201. The seventh through-beam sensor 1207 is used to detect whether multiple recycling trays 1204 are placed on the guide tray 1203, so as to avoid accidentally placing multiple recycling trays 1204 on the guide tray 1203, which would increase the height of the third recycling module and cause it to collide with the sorting components.

[0293] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of the present invention according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of the present invention. These technical solutions also fall within the scope of protection of the present invention.

Claims

1. A chip appearance inspection device, characterized in that, include: Mounting base; A feeding module is disposed on the mounting base. The feeding module has a storage area and a receiving area. The storage area is used to stack trays carrying chips to be tested. The feeding module is used to transfer the trays on the storage area to the receiving area. A lower surface detection module is mounted on the mounting base; A first transport module is disposed on the mounting base, passing over the feeding module and the lower surface detection module; A suction module is mounted on a first transport module. The first transport module drives the suction module to move back and forth between above the material receiving area and above the lower surface detection module. When the suction module is above the material receiving area, it picks up the chip on the tray or releases the picked-up chip back onto the tray. When the suction module is above the lower surface detection module, the lower surface detection module detects the lower surface of the chip picked up by the suction module. An upper surface detection module is disposed on the first transport module. The first transport module drives the upper surface detection module to move above the material receiving area so that the upper surface detection module can detect the upper surface of the chip on the tray. The first transport module includes a first gantry frame, a third rotary drive component, a second driving wheel, a second driven wheel, a second conveyor belt, a third guide rail, and a third slider; The first gantry frame spans the loading module, and the lower surface detection module is mounted on the mounting base; the third rotation drive is mounted on the first gantry frame, the second driving wheel is connected to the power output end of the third rotation drive, the second driven wheel is mounted on the first gantry frame, and the second conveyor belt is tensioned and sleeved on the second driving wheel and the second driven wheel; the third guide rail is mounted on the first gantry frame, and the third slider is slidably connected to the third guide rail; The suction module and the upper surface detection module are both connected to one side of the second conveyor belt and the third slider.

2. The chip appearance inspection equipment according to claim 1, characterized in that, The chip appearance inspection equipment also includes a first recycling module, a second recycling module, a second transport module, and a sorting module; The first recycling module and the second recycling module are arranged side by side on the mounting base, and the first recycling module is connected to the end of the feeding module away from the storage area; The first recycling module has a first sorting area and a first recycling area. The feeding module is further used to transfer the pallet in the feeding area to the first sorting area, and the first recycling module is used to transfer the pallet in the first sorting area to the first recycling area. The second recycling module has a second sorting area and a second recycling area, and the first recycling module is used to transfer the pallet in the second sorting area to the second recycling area. The second transport module spans the first recycling module, and the second recycling module is mounted on the mounting base; The sorting module is mounted on the second transport module, which drives the sorting module to move back and forth between the first recycling module and the second recycling module to transport the tray or chip from the first sorting area to the second sorting area, or to transport the chip from the second sorting area to the first sorting area.

3. The chip appearance inspection equipment according to claim 2, characterized in that, The feeding module includes a first support, a first conveying component, a material stacking component, and a first lifting component; The storage area and the receiving area are formed by the first support; The first conveying component is disposed on the first support, and the first conveying component includes a conveying tray that can move back and forth between the storage area and the receiving area; The material preparation and stacking assembly includes a first telescopic drive and a first support. The first telescopic drive is disposed in the material storage area. The power output end of the first telescopic drive is connected to the first support. The first telescopic drive drives the first support to extend or retract. The first lifting assembly is located in the storage area. The first lifting assembly includes a first lifting drive and a first lifting plate. The first lifting drive is located on the mounting base. The first lifting plate is connected to the power output end of the first lifting drive and is lower than the first support. In this configuration, the first telescopic drive drives the first support to extend, and multiple pallets are stacked on the first support to form a pallet stack. When it is necessary to move the pallets in the storage area to the receiving area, the conveyor pallet is moved to the storage area and positioned between the first support and the first lifting plate. The first lifting drive drives the first lifting plate to rise, and the first lifting plate rises beside the conveyor pallet to lift the pallet stack. The first telescopic drive drives the first support to retract to avoid the pallet stack, and the first lifting drive drives the first lifting plate to descend. When the bottom pallet of the pallet stack descends below the first support, the first telescopic drive drives the first support to extend to support the pallet stack except for the bottom pallet. The first lifting drive drives the first lifting plate to support the bottom pallet and continue to descend until the pallets on the first lifting plate descend to the conveyor pallet, and the conveyor pallet moves the pallets to the receiving area.

4. The chip appearance inspection equipment according to claim 3, characterized in that, The first lifting plate includes a first fixing part and at least two first lifting parts. The first fixing part is connected to the power output end of the first lifting drive member, and the two first lifting parts are respectively connected to the opposite sides of the first fixing part. The first lifting parts move up and down beside the conveying pallet. The first lifting assembly further includes a first bracket, a first sensor, a second sensor, and a first sensor trigger; the first bracket is disposed on the mounting base, and the first lifting drive is disposed on the first bracket; the first sensor and the second sensor are spaced apart on the first bracket along the driving direction of the first lifting drive, and the first sensor trigger is disposed on the power output end of the first lifting drive, the first sensor trigger being used to trigger the sensing of the first sensor or the second sensor; wherein, when the first sensor trigger triggers the sensing of the first sensor, the first lifting drive stops driving the first lifting plate to descend; when the first sensor trigger triggers the sensing of the second sensor, the first lifting drive stops driving the first lifting plate to rise.

5. The chip appearance inspection equipment according to claim 3, characterized in that, The first support forms a first conveying channel, and the conveying tray and the pallet on it are both located in the first conveying channel; The conveying pallet also has a first stop and a second stop, which are arranged at intervals along the moving direction of the conveying pallet, and the first stop and the second stop respectively block the opposite ends of the pallet; The first conveying assembly further includes a first rotation drive, a first driving wheel, a first driven wheel, a first conveyor belt, a first guide rail, and a first slider; the first rotation drive is mounted on the first support, the power output end of the first rotation drive is connected to the first driving wheel, the first driven wheel is mounted on the first support, and the first conveyor belt is tensioned and sleeved on the first driving wheel and the first driven wheel; the first guide rail is mounted on the first support, and the first slider is slidably connected to the first guide rail; the conveying tray is connected to one side of the first conveyor belt and the first slider.

6. The chip appearance inspection equipment according to claim 3, characterized in that, The first support also forms a material transfer area, and the conveying pallet can also be moved to the material transfer area; The feeding module also includes a second lifting component disposed in the material transfer area. The second lifting component includes a second lifting drive and a second lifting plate. The second lifting drive is disposed on the mounting base, and the second lifting plate is connected to the power output end of the second lifting drive. When the conveying pallet and the pallet on it move to the transfer area, the second lifting drive drives the second lifting plate to rise. The second lifting plate rises to lift the pallet next to the conveying pallet. The conveying pallet leaves the transfer area. The second lifting drive drives the second lifting plate to fall until the pallet falls onto the first recycling module.

7. The chip appearance inspection equipment according to any one of claims 1-6, characterized in that, The suction module includes a first support plate, a first lifting assembly, a first suction nozzle assembly, and a first elastic assembly; The first support plate is disposed on the first transport module; the first lifting component is disposed on the first support plate, and the first lifting component includes a first lifting plate that can move up and down relative to the first support plate; the first suction nozzle component is disposed on the first lifting plate; one end of the first elastic component is connected to the first support plate, and the other end of the first elastic component is connected to the first lifting plate.

8. The chip appearance inspection equipment according to claim 7, characterized in that, The first lifting assembly also includes a second rotation drive, an eccentric shaft, a second guide rail, and a second slider; The second rotation drive is disposed on the first support plate, the eccentric shaft is connected to the power output shaft of the second rotation drive, and the eccentric shaft is offset from the central axis of the power output shaft of the second rotation drive; the first lifting plate has a strip-shaped hole, the length extension direction of the strip-shaped hole is perpendicular to the lifting direction of the first lifting plate, and one end of the eccentric shaft away from the second rotation drive extends into the strip-shaped hole; one of the second guide rail and the second slider is disposed on the first support plate, and the other is disposed on the first lifting plate, and the second slider is slidably connected to the second guide rail.

9. The chip appearance inspection equipment according to claim 7, characterized in that, The first suction nozzle assembly includes a first adjusting rod, a second adjusting rod, a first adjusting block, a second adjusting block, and a first suction nozzle; There are at least two first adjusting rods, which are arranged at intervals relative to each other on the first lifting plate; each first adjusting rod is movably sleeved with a first adjusting block; a second adjusting rod is arranged between each pair of first adjusting blocks arranged opposite to each of the two first adjusting rods; multiple second adjusting blocks are movably sleeved on the second adjusting rods; and each second adjusting block is connected to a first suction nozzle.

10. The chip appearance inspection device according to any one of claims 1-6, characterized in that, The lower surface detection module includes a first mounting cylinder, a first mounting bracket, a first front camera, a side camera assembly, and a first light source assembly; The first mounting cylinder has a first cavity and an upper end plate and a lower end plate located at opposite ends of the first cavity; the upper end plate has a first opening communicating with the first cavity, and the lower end plate has a second opening communicating with the first cavity, and the second opening is disposed opposite to the first opening, wherein, when the chip is tested, the chip is located above the upper end plate, and the lower surface of the chip faces the first opening; The first mounting bracket is connected to the lower end plate; The forward-facing camera is mounted on the first mounting bracket, and the forward-facing camera captures images of the chip through the second opening, the first cavity, and the first opening. The side-facing camera assembly includes a side-facing camera and a reflector. The side-facing camera is mounted on the first mounting bracket and is angled to the central axis of the second opening. The reflector is mounted on the cavity wall of the cavity. The reflector receives incident light from the chip through the first opening and reflects the reflected light onto the side-facing camera through the second opening. The first light source assembly is disposed on the first mounting cylinder and / or the first mounting bracket, and the first light source assembly provides a light source for the shooting of the first front-facing camera and / or the shooting of the side-facing camera.

11. The chip appearance inspection device according to claim 10, characterized in that, The first light source assembly includes a front monochromatic light source, a back light source, and a side light source disposed on the first mounting cylinder; The front monochromatic light source is used to illuminate the lower surface of the chip. The front monochromatic light source includes a front monochromatic strong light source and a front monochromatic weak light source. The light intensity of the front monochromatic strong light source is stronger than that of the front monochromatic weak light source. The front monochromatic strong light source is disposed on the cavity wall of the first cavity near the upper end plate. The front monochromatic weak light source is disposed on the upper end plate and is arranged around the first opening. The backlight is used to illuminate the upper surface of the chip. The backlight includes a strong backlight and a weak backlight. The light intensity of the strong backlight is greater than that of the weak backlight, and the height of the weak backlight relative to the upper plate is greater than that of the strong backlight relative to the upper plate. The side light source is disposed on the upper end plate and is used to illuminate the peripheral surface of the chip.

12. The chip appearance inspection equipment according to claim 10, characterized in that, The first light source assembly also includes a first single-sided reflector, a first multi-color light source, and a second multi-color light source; The first single-sided reflector is disposed between the first forward camera and the second opening. The first multi-color light source is disposed beside the first single-sided reflector. The first multi-color light source is used to emit light to the first single-sided reflector. The first single-sided reflector is used to reflect the incident light from the first multi-color light source onto the lower surface of the chip. The reflected light from the first single-sided reflector is parallel to the central axis of the second opening. The second multicolor light source is disposed in the first cavity. The second multicolor light source is arranged in a ring around the second opening. The second multicolor light source has an illumination slope, and the distance between the illumination slope and the upper end plate gradually increases in the direction from the inner periphery to the outer periphery of the second multicolor light source.

13. The chip appearance inspection equipment according to any one of claims 1-6, characterized in that, The upper surface detection module includes a second mounting cylinder, a third mounting bracket, a second forward camera, and a second light source assembly; The second mounting cylinder forms a second cavity and a fourth opening and a fifth opening, both communicating with the second cavity, with the fourth opening and the fifth opening positioned opposite each other. The third mounting bracket is mounted on the second mounting cylinder. The second forward camera is mounted on the third mounting bracket, with its shooting direction perpendicular to the fourth opening. The second light source assembly includes a third multi-color light source, a second single-sided reflector, and an oblique light source. The second single-sided reflector is positioned between the second forward camera and the fourth opening. The third multi-color light source is positioned beside the second single-sided reflector, emitting light towards the second single-sided reflector. The second single-sided reflector reflects the incident light from the third multi-color light source through the fourth opening, with the reflected light parallel to the central axis of the fourth opening. The oblique light source is positioned in the second cavity, with its light passing through the fifth opening, and its illumination direction forming an angle with the central axis of the fifth opening.

14. The chip appearance inspection device according to any one of claims 1-6, characterized in that, The first transmission module also includes a ninth sensor, a tenth sensor, and a fifth sensor trigger; The ninth and tenth sensors are spaced apart on the first gantry along the conveying direction of the second conveyor belt; the fifth sensor trigger is disposed on the third slider and is used to trigger the sensing of the ninth or tenth sensor.

15. The chip appearance inspection device according to any one of claims 2-6, characterized in that, The sorting module includes a first support frame, a second lifting assembly, a clamp, a second conveying assembly, a second support plate, a third lifting assembly, a second suction nozzle, and a second elastic assembly; The first support frame is mounted on the second transport module; The second lifting component is mounted on the first support frame. The power output end of the second lifting component is connected to the clamp. The second lifting component drives the clamp to move up and down. The clamp has a clamping state and a releasing state. In the clamping state, the clamp holds the tray. In the releasing state, the clamp releases the tray. The second conveying component is disposed on the first support frame, and the conveying direction of the second conveying component is perpendicular to the conveying direction of the second conveying module; The second support plate is disposed on the second conveying assembly, and the third lifting assembly is disposed on the second support plate. The third lifting assembly includes a second lifting plate that can move up and down relative to the second support plate, and the second suction nozzle is disposed on the second lifting plate. One end of the second elastic component is connected to the second support plate, and the other end of the second elastic component is connected to the second lifting plate.

16. The chip appearance inspection device according to any one of claims 2-6, characterized in that, The first recycling module includes a second support, a third conveying component, a first positioning component, and a first vibration component; The second support is disposed on the mounting base, and the first sorting area and the first recycling area are formed by the second support; the third conveying assembly is disposed on the second support, and the third conveying assembly is used to transfer the pallet located in the first sorting area to the first recycling area; the first positioning assembly is disposed on the second support and / or the mounting base, and the first positioning assembly is used to confine the pallet in the first sorting area; the first vibration assembly is disposed on the second support, and the first vibration assembly is used to vibrate the pallet in the first sorting area; The second recycling module includes a third support, a fourth conveying component, a second positioning component, and a second vibration component; the third support is disposed on the mounting base, and the second sorting area and the second recycling area are formed by the third support; the fourth conveying component is disposed on the third support and is used to transfer the tray located in the second sorting area to the second recycling area; the second positioning component is disposed on the mounting base and is used to confine the tray in the second sorting area; the second vibration component is disposed on the third support, and the first vibration component is used to vibrate the tray in the second sorting area.

17. The chip appearance inspection device according to claim 16, characterized in that, The first recycling module also includes a first recycling stacking component and a third lifting component disposed on the first recycling area; The first recycling stacking assembly includes a first bearing and a first rotating plate. The first bearing is disposed on the second support, and the first rotating plate is rotatably disposed on the first bearing. The first rotating plate has a first flat position and a first avoidance position. In the first flat position, the first rotating plate is used to carry a pallet, and in the first avoidance position, the first rotating plate is used to avoid the pallet. The third lifting assembly includes a fourth lifting drive and a third lifting plate. The fourth lifting drive is mounted on the mounting base, and the third lifting plate is connected to the power output end of the fourth lifting drive. When the third conveying component moves the tray above the third lifting plate, the fourth lifting drive drives the third lifting plate to support the tray and rise. The tray abuts against the first rotating plate, causing the first rotating plate to switch to the first clearance state. When the tray rises above the first rotating plate, the first rotating plate drops and switches to the first flat position. The fourth lifting drive drives the third lifting plate to descend until the tray falls onto the first rotating plate. The second recycling module also includes a second recycling stacking assembly and a fourth lifting assembly disposed on the second recycling area; The second recycling stacking assembly includes a second bearing and a second rotating plate. The second bearing is disposed on the third support, and the second rotating plate is rotatably disposed on the bearing. The second rotating plate has a second flat position and a second avoidance position. In the second flat position, the second rotating plate is used to carry the pallet, and in the second avoidance position, the second rotating plate is used to avoid the pallet. The fourth lifting assembly includes a fifth lifting drive component and a fourth lifting plate. The fifth lifting drive component is mounted on the mounting base, and the fourth lifting plate is connected to the power output end of the fifth lifting drive component. When the fourth conveying component moves the tray above the fourth lifting plate, the fifth lifting drive drives the fourth lifting plate to support the tray and rise. The tray abuts against the second rotating plate, causing the second rotating plate to switch to the second avoidance state. When the tray rises above the second rotating plate, the second rotating plate falls and switches to the second flat position. The fifth lifting drive drives the fourth lifting plate to descend until the tray falls onto the second rotating plate.

18. The chip appearance inspection equipment according to any one of claims 2-6, characterized in that, The second transport module includes a second gantry, a fourth rotation drive, a third drive wheel, a third driven wheel, a third conveyor belt, a fourth guide rail, a fourth slider, an eleventh sensor, a twelfth sensor, and a sixth sensor trigger. The second gantry spans the first recycling module, and the second recycling module is mounted on the mounting base; the fourth rotary drive is mounted on the second gantry, the third drive wheel is connected to the power output end of the fourth rotary drive, the third driven wheel is mounted on the second gantry, and the third conveyor belt is tensioned and sleeved on the third drive wheel and the third driven wheel; the fourth guide rail is mounted on the second gantry, and the fourth slider is slidably connected to the fourth guide rail; The sorting module is connected to one side of the third conveyor belt and the fourth slider. The eleventh and twelfth sensors are spaced apart on the second gantry along the conveying direction of the third conveyor belt; the sixth sensor trigger is disposed on the fourth slider and is used to trigger the sensing of the eleventh or twelfth sensor.

19. The chip appearance inspection device according to any one of claims 2-6, characterized in that, The chip appearance inspection equipment also includes a manual recycling module, which is arranged side by side with the first recycling module and the second recycling module, and the second transport module passes over the manual recycling module; The manual recycling module includes a positioning support, a sliding guide assembly, a guide plate, and a recycling tray. The positioning support is mounted on the mounting base and has a first positioning structure. The sliding guide assembly is mounted on the mounting base and extends toward the positioning support. The end of the sliding guide assembly near the positioning support is a third sorting area, and the end away from the positioning support is a third recycling area. The guide plate is mounted on the sliding guide assembly and can move back and forth between the third sorting area and the third recycling area. The guide plate has a second positioning structure that cooperates with the first positioning structure to confine the guide plate to the third sorting area. The recycling tray is placed on the guide plate and is used to recycle chips.

Images