A heat dissipation module, computing device

Abstract

The embodiment of the application provides a heat dissipation module and a computing device. It relates to the chip heat dissipation technology field in the computing device. It is mainly used for providing the cross heat exchange between the chips. The heat dissipation module comprises a mixed liquid cavity, a first heat dissipation plate and a second heat dissipation plate. The first heat dissipation plate is arranged on one side of the first chip and is fixedly connected with the first chip. The second heat dissipation plate is arranged on one side of the second chip and is fixedly connected with the second chip. The temperature of the first chip is not equal to the temperature of the second chip. The first heat dissipation plate and the second heat dissipation plate have flow channels. The first heat dissipation plate and the second heat dissipation plate have liquid outlets and liquid return ports which are connected with the flow channels. The liquid outlets and the liquid return ports are connected with the mixed liquid cavity. The flow channels and the mixed liquid cavity are used for flowing liquid medium. The heat dissipation module provided by the application can not only realize the local heat dissipation of the chip, but also realize the remote heat dissipation.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of heat dissipation of computing devices, in particular to a heat dissipation module, and to a computing device comprising the heat dissipation module. BACKGROUND

[0002] With the development of computer technology, large-scale computing devices are increasingly deployed, and the computing devices use a chassis to place multiple single boards integrated with chips. At present, as more and more highly integrated high-power chips are applied to computing devices, more and more heat is generated during the operation of the chips, resulting in an increasing demand for heat dissipation of the computing devices.

[0003] Figure 1 An existing computing device comprising a heat dissipation structure is given. Specifically, the computing device comprises a chassis 01, a plurality of slots for installing single boards are arranged in the chassis 01 along a preset direction, Figure 1 Exemplary first single board 021 and second single board 022 installed in the corresponding slots are shown; and a fan 03 as a heat dissipation structure is also arranged in the chassis 01. That is, Figure 1 In the structure shown, air is used as a heat transfer medium to conduct the heat generated by the heat source chip 04 on the single board to the outside of the chassis 01 through the fan 03 to complete the cooling of the chip 04.

[0004] In Figure 1 In the structure shown, the heat dissipation capacity of any single board is mainly limited by the slot space volume and the heat dissipation capacity of the fan 03. In order to improve the heat dissipation effect of the single board, one can increase the slot volume, and the other can enhance the heat dissipation effect of the fan 03. However, in specific implementation, the slot volume has a design standard, so the heat dissipation of the single board can only be enhanced by improving the heat dissipation capacity of the fan 03, so, Figure 1 The heat dissipation capacity of any single board in the structure shown is highly dependent on the heat dissipation capacity of the fan 03, and the improvement of the heat dissipation capacity of the existing fan has reached the ceiling, thereby restricting the heat dissipation effect of the single board. SUMMARY

[0005] The present application provides a heat dissipation module and a computing device comprising the heat dissipation module to realize cross heat exchange between chips and achieve uniform temperature.

[0006] To achieve the above-mentioned purpose, embodiments of the present application adopt the following technical solutions:

[0007] In a first aspect, the present application provides a computing device, which can be a data center, a server, or other interconnected computing devices.

[0008] The computing device includes a chassis, a first chip and a second chip, and a heat dissipation module. The heat dissipation module is used to dissipate heat from the first chip and the second chip, both of which are housed within the chassis. The heat dissipation module includes a mixing chamber, a first heat sink, and a second heat sink. The first heat sink is located on one side of the first chip and is fixedly connected to it. The second heat sink is located on one side of the second chip and is fixedly connected to it. The temperatures of the first chip and the second chip are not equal. Both the first and second heat sinks have flow channels and liquid outlets and return ports that communicate with the flow channels. Both the liquid outlets and return ports are connected to the mixing chamber, and a liquid medium flows between the flow channels and the mixing chamber.

[0009] The computing device provided in this application includes a mixing chamber, and either the first or second heat sink has a flow channel connected to the mixing chamber. In this way, for example, when the first chip is a high-power, high-heat-dissipating heat source, and the second chip is a low-power, low-heat-dissipating heat source, some of the heat dissipated by the high-power chip is transported to the mixing chamber through the liquid medium flowing in the flow channel, and some of the heat dissipated by the low-power chip is also transported to the mixing chamber through the liquid medium flowing in the flow channel. Thus, the two liquid media of different temperatures mix in the mixing chamber, and the mixed liquid medium can flow into the flow channel on the low-power chip, where the heat is dissipated by the heat dissipation module, thereby cooling the high-power chip and achieving temperature homogenization between the high-power and low-power chips.

[0010] Alternatively, in the computing device provided in this application, heat can not only be diffused through the heat dissipation module set on the chip (this heat dissipation method can be called local heat dissipation), but also some heat can be conducted to the mixing chamber through the liquid medium in the heat sink to mix with the liquid medium transferred from other chips. The mixed liquid medium is then transferred to the flow channel of the heat sink corresponding to other chips, that is, heat is dissipated through other heat sinks (this heat dissipation method can be called remote heat dissipation). In other words, by equalizing the temperature between chips, the heat dissipation system forms a heat dissipation mutual assistance system.

[0011] Furthermore, in this computing device, the flow channel is connected to the mixing chamber via the liquid outlet and return outlet, meaning the liquid medium continuously circulates between the mixing chamber and the flow channel of the heat sink. This continuously heats the chip, allowing it to evolve continuously.

[0012] In one possible implementation, the mixing chamber is located inside the chassis, or the mixing chamber is located outside the chassis.

[0013] The specific location of the mixing chamber can be set according to actual needs.

[0014] In one possible implementation, the chassis has a first slot and a second slot; a first chip and a first heatsink are pluggably disposed in the first slot, and a second chip and a second heatsink are pluggably disposed in the second slot.

[0015] In one possible implementation, the computing device further includes a fan, which is housed inside the chassis and whose exhaust side is connected to the outside of the chassis.

[0016] If a fan is added, the cooling system of the computing device will not only include the local and remote cooling mentioned above, but also cooling through air as a heat transfer medium. This will further improve the cooling effect and provide favorable conditions for the evolution of the chip.

[0017] Secondly, this application provides a heat dissipation module that can be installed in the computing device described in the first aspect.

[0018] The heat dissipation module includes a mixing chamber, a first heat sink, and a second heat sink. The first heat sink is disposed on one side of the first chip and fixedly connected to the first chip. The second heat sink is disposed on one side of the second chip and fixedly connected to the second chip. The temperatures of the first chip and the second chip are not equal. Both the first and second heat sinks have flow channels and liquid outlets and return ports that are connected to the flow channels. The liquid outlets and return ports are connected to the mixing chamber, and a liquid medium flows between the flow channels and the mixing chamber.

[0019] As described in the computing device of the above embodiments, since the heat dissipation module includes a mixing chamber, and either the first heat sink or the second heat sink has a flow channel connected to the mixing chamber, for example, when the first chip is a high-power heat source that dissipates a lot of heat, and the second chip is a low-power heat source that dissipates less heat, some of the heat dissipated by the high-power chip will be transported to the mixing chamber through the liquid medium flowing in the flow channel, and some of the heat dissipated by the low-power chip will also be transported to the mixing chamber through the liquid medium flowing in the flow channel. Then, the two liquid media of different temperatures mix in the mixing chamber, and the mixed liquid medium can flow into the flow channel on the low-power chip, that is, the heat is dissipated by the heat dissipation module on the low-power chip, thereby cooling the high-power chip and achieving temperature homogenization between the high-power chip and the low-power chip.

[0020] In one possible implementation, the heat dissipation module further includes at least one drive pump; the flow channel within either the first heat dissipation plate or the second heat dissipation plate is connected to the mixing chamber via the drive pump.

[0021] The liquid medium flowing between the flow channel and the mixing chamber can be quickly transported from the flow channel, carrying a large amount of heat, to the mixing chamber under the drive of the pump, thereby achieving cross heat exchange and improving heat exchange efficiency.

[0022] In one possible implementation, a partition is provided inside the mixing chamber, which divides the mixing chamber into at least two interconnected channels.

[0023] By installing a baffle in the mixing chamber, at least two interconnected channels are formed. This increases the flow paths of the liquid medium supplied from the first heat sink and the liquid medium supplied from the second heat sink, ensuring thorough mixing of the liquid medium supplied from both heat sinks.

[0024] In one possible implementation, the first heat sink and the second heat sink are arranged along a first direction; the wall of the mixing chamber is provided with a first liquid inlet and a second liquid inlet communicating with the mixing chamber, the first liquid inlet and the second liquid inlet are arranged along the first direction, the first liquid inlet is connected to the liquid outlet of the first heat sink, and the second liquid inlet is connected to the liquid outlet of the second heat sink; the partition extends along the first direction, and the partition is provided with a liquid passage hole connecting two adjacent channels, the liquid passage hole being located between the first liquid inlet and the second liquid inlet.

[0025] This design also allows the liquid medium flowing in from the first inlet to be fully mixed with the liquid medium flowing in from the second inlet, thus improving the temperature uniformity of the chip.

[0026] In this feasible embodiment, since it includes a first mixing chamber and a second mixing chamber that are connected, the structure formed in this way can be called a multi-stage mixing chamber. By setting up a multi-stage mixing chamber, the mixing degree of liquid media at different temperatures can be improved, thereby improving the temperature uniformity effect.

[0027] In one possible implementation, the mixing chamber includes a first mixing chamber and a second mixing chamber, the first mixing chamber being connected to the outlet and the second mixing chamber being connected to the return port, and the first mixing chamber and the second mixing chamber being connected to each other through a connecting pipe.

[0028] In one possible implementation, the number of inlets for communicating with the flow channel in the first mixing chamber is greater than the number of outlets for communicating with the second mixing chamber; the heat dissipation module also includes: multiple drive pumps, with one drive pump connected to any one of the connecting pipes.

[0029] This reduces the number of drive pumps, lowers the overall energy consumption of the heat dissipation module, and reduces manufacturing costs.

[0030] In one possible implementation, the heat dissipation module further includes a first vapor chamber; the first vapor chamber is disposed close to the first chip relative to the first heat sink, and the first heat sink is disposed on the side of the first vapor chamber away from the first chip.

[0031] By adding a vapor chamber, the heat conduction area can be increased. This means that the heat dissipated by the chip is first evenly heated by the vapor chamber before being transferred to the first heat sink, which can further improve heat dissipation efficiency.

[0032] The vapor chamber is made of copper, aluminum or other sheet materials with high thermal conductivity; the vapor chamber can also be a sheet material structure with internal heat pipes, or it can be a VC vapor chamber.

[0033] In one possible implementation, the orthographic projection of the first heat sink onto the first vapor chamber is located within the edge of the first vapor chamber; a plurality of first heat sink fins are arranged at intervals on both the side of the first vapor chamber away from the first chip and the side of the first heat sink away from the first vapor chamber.

[0034] In other words, the area of ​​the heat sink is smaller than that of the vapor chamber. The advantage of this design is that it can shorten the heat transfer path of local heat dissipation, thereby allowing local heat dissipation to play its full role. At the same time, while the heat sink helps to move the chip heat away from the mixing chamber, it can minimize the flow rate requirement of the liquid medium, thereby reducing the requirements of the pump, reducing the difficulty of implementing the heat dissipation system, and reducing costs.

[0035] In one possible implementation, the orthographic projection of the first chip onto the first vapor chamber is located within the edge of the first vapor chamber.

[0036] In other words, the area of ​​the vapor chamber is larger than the area of ​​the chip. This way, the heat dissipated by the chip can be spread out through the larger vapor chamber, thus improving the heat dissipation effect.

[0037] In one possible implementation, the heat dissipation module further includes a first heat dissipation plate; the first heat dissipation plate is disposed close to the first chip relative to the first heat dissipation plate, the first heat dissipation plate is disposed on the side of the first heat dissipation plate away from the first chip, and a plurality of first heat dissipation fins are arranged at intervals on the side of the first heat dissipation plate away from the first heat dissipation plate.

[0038] In this embodiment, the heat sink is closer to the chip than the vapor chamber. In this way, the heat emitted by the chip will be conducted to the liquid medium inside the heat sink, and the heat will be carried to the mixing chamber through the liquid medium. In addition, some of the heat will be conducted to the vapor chamber and the first heat sink fins through the heat sink, thus achieving local heat dissipation.

[0039] In one possible implementation, at least one of the first and second heat sinks is a cold plate.

[0040] The cold plate has a liquid-containing cavity, and multiple second heat dissipation fins are arranged in the liquid-containing cavity. The liquid-containing cavity forms the flow channel, and the liquid outlet and the liquid return port are opened on opposite sides of the cold plate.

[0041] In this embodiment, the cold plate, which serves as a heat sink, has multiple second heat sink fins within the liquid cavity that forms the flow channel. These multiple second heat sink fins and multiple first heat sink fins can serve as a local heat dissipation structure, diffusing some of the heat emitted by the chip, while another portion of the heat is conducted away through the liquid medium within the cold plate.

[0042] In one possible implementation, a thermal interface material (TIM) layer is provided at the interface where the first vapor chamber contacts the first chip.

[0043] By setting a thermally conductive interface material layer, thermal resistance can be reduced, thereby further improving heat dissipation.

[0044] In one possible implementation, the heat dissipation module further includes a heat exchange plate with a fluid cavity formed therein. The heat exchange plate has an outlet and a return port that are connected to the fluid cavity, and both the outlet and the return port of the heat exchange plate are connected to the mixing cavity.

[0045] This embodiment can be understood as follows: when the computing device has a first slot, a second slot, and a third slot, a first chip is installed in the first slot, a second chip is installed in the second slot, but no chip is installed in the third slot. This scenario is considered a partial configuration. In a partial configuration scenario, by placing a heat exchange plate in the slot without a chip, the liquid medium in the mixing chamber can flow to the fluid chamber of the heat exchange plate, i.e., heat is diffused through the heat exchange plate. This further improves the heat dissipation effect on the first and second chips. In other words, it increases the distance of the heat dissipation path. For example, for the heat dissipation of the first chip, it can be cooled not only through the second chip but also through the heat exchange plate.

[0046] In one possible implementation, the heat dissipation module further includes a plurality of third heat dissipation fins; the plurality of third heat dissipation fins are spaced apart on the heat exchange plate.

[0047] By adding multiple third heat dissipation fins, the heat conducted to the heat exchange plate can be dissipated through these fins, thereby further improving the heat dissipation efficiency for the first and second chips.

[0048] In one possible implementation, the heat exchange plate can be a cold plate structure with a liquid cavity inside, and multiple second heat dissipation fins are arranged inside the liquid cavity, forming a fluid cavity.

[0049] In one possible implementation, the heat dissipation module further includes a mounting plate, on which the heat exchange plate is fixed, and the mounting plate is pluggably disposed within the computing device.

[0050] The heat exchange plate is fixed on the mounting plate, and the mounting plate is pluggable inside the computing device. For example, it can be pluggable and installed in the third slot of the computing device. When it is necessary to install a chip in the third slot, the heat exchange plate and the mounting plate can be pulled out and replaced with the chip structure, thus achieving a full-configuration scenario for the computing device.

[0051] In one possible implementation, the mounting plate includes a first plate, a second plate, and a connecting plate, wherein the first plate and the second plate are parallel and extend along the insertion / removal direction in the computing device, respectively; the connecting plate is used to shield the slot opening of the slot and connects the first plate and the second plate; wherein a heat exchange plate is disposed on the side of the first plate opposite to the second plate.

[0052] The first plate here serves as the carrier plate, and the heat exchange plate is placed on the first plate. In addition, since the connecting plate is placed at the slot opening, this design allows the connecting plate to seal the slot opening, suppressing electromagnetic radiation from reaching the chip in the computing device and affecting the chip's performance. Attached Figure Description

[0053] Figure 1 This is a partial structural diagram of a computing device in the prior art;

[0054] Figure 2 An exploded view of a computing device provided in an embodiment of this application;

[0055] Figure 3 A structural diagram of a computing device provided in an embodiment of this application;

[0056] Figure 4 A structural diagram of a single board in a computing device provided in an embodiment of this application;

[0057] Figure 5 A structural diagram of a computing device provided in an embodiment of this application;

[0058] Figure 6 This application provides a structural diagram of a heat dissipation module in a computing device.

[0059] Figure 7 A structural diagram of a cold plate in a computing device provided in an embodiment of this application;

[0060] Figure 8 This application provides a structural diagram of a heat dissipation module in a computing device.

[0061] Figure 9 This application provides a structural diagram of a heat dissipation module in a computing device.

[0062] Figure 10 A structural diagram of a mixing chamber in a computing device provided in an embodiment of this application;

[0063] Figure 11 A structural diagram of a computing device provided in an embodiment of this application;

[0064] Figure 12 A structural diagram of a heat exchange module for a computing device provided in an embodiment of this application;

[0065] Figure 13 A structural diagram of a computing device provided in an embodiment of this application;

[0066] Figure 14 A structural diagram of a computing device provided in an embodiment of this application;

[0067] Figure 15 A structural diagram of a computing device provided in an embodiment of this application;

[0068] Figure 16 A structural diagram of a computing device provided in an embodiment of this application;

[0069] Figure 17 This is a structural diagram of a computing device provided in an embodiment of this application.

[0070] Figure label:

[0071] 100 - Computing devices;

[0072] 01-Chassis;

[0073] 02-Single board; 021-First single board; 022-Second single board;

[0074] 02a - Heat sink assembly; 02b - Chip; 02c - Circuit board; 02d - Mounting plate; 02e - Flow channel;

[0075] 02a1-Heat dissipation plate; 02a11-Liquid chamber; 02a12-Second heat dissipation fins; 02a13-First opening; 02a14-Second opening;

[0076] 02a2-Population plate;

[0077] 02a3 - First heat dissipation fin;

[0078] 02d1 - Connecting plate; 02d2 - Second plate; 02d3 - First plate;

[0079] 03-Fan;

[0080] 04 - Slot; 041 - First Slot; 042 - Second Slot; 043 - Third Slot;

[0081] 051 - First inlet line; 052 - First return line;

[0082] 06-Mixing chamber; 06a-First channel; 06b-Second channel;

[0083] 061 - First mixing chamber; 062 - Second mixing chamber;

[0084] 07-Baffle; 071-Liquid passage;

[0085] 081 - First liquid inlet; 082 - Second liquid inlet;

[0086] 09-Drive pump;

[0087] 10-Heat exchanger module; 101-Heat exchange plate; 102-Third heat dissipation fin; 103-Second liquid inlet pipe; 1041-Second liquid return pipe; 104-Mounting plate; 105-Fluid chamber;

[0088] 11-Liquid cooling connector;

[0089] 12-First circuit board;

[0090] 13-Second circuit board. Detailed Implementation

[0091] This application provides a computing device, which may be a communication device or other computing devices, such as a server, a data center, or other interconnected communication devices.

[0092] Figure 2 This is an exploded view of a partial structure of a computing device. The computing device 100 includes a chassis 01, within which multiple slots 04 are arranged along a predetermined direction, for example... Figure 2 The given information is that multiple slots 04 are arranged along the height of chassis 01 (e.g., ...). Figure 2 (Z direction) arrangement. In the feasible structure, multiple spaced-apart plates can be set in the chassis 01, and the space formed between two adjacent plates can be called a slot 04.

[0093] Continue as Figure 2 As shown, slot 04 inside chassis 01 is for inserting single board 02.Figure 2 The diagram shows the structure after the single board 02 is pulled out of the slot 04. In actual operation, the single board 02 is inserted into the slot 04 along the direction from front to back of the chassis 01.

[0094] The single board 02 here includes at least a chip. In some optional embodiments, the chip can be a die, such as including a single die or multiple dies stacked in three dimensions. In other optional embodiments, the chip can also be a chip package structure, that is, when it is a chip package structure, in addition to including the die, it also includes a packaging substrate for carrying the die. In this regard, this application does not make any special limitation on the specific form of the chip.

[0095] The chips in board 02 generate heat during operation. To ensure their proper functioning, a heat dissipation structure needs to be installed inside chassis 01. For example, ... Figure 2 In the structure shown, a fan 03 is installed inside the chassis 01. Driven by the fan 03, the heat dissipated by the chip is dissipated to the outside of the chassis 01 by the flowing air, thereby reducing the chip's operating temperature. In some embodiments, such as... Figure 2 As shown, fan 03 is located inside chassis 01 and near the rear.

[0096] To avoid the fan 03 restricting the high power consumption development of the chip, this application proposes a novel method for heat dissipation of the chip. The structure and heat dissipation principle of the novel heat dissipation method of this application are described in detail below with reference to the accompanying drawings.

[0097] Figure 3 This is a structural diagram of a computing device provided in an embodiment of this application. Figure 3 It is along Figure 2 The diagram shown is a structural representation viewed from right to left. Figure 3 The diagram illustrates, for example, the first slot 041 and the second slot 042 within the chassis 01. The first slot 041 houses a first circuit board 021, and the second slot 042 houses a second circuit board 022. Of course, in addition to the first slot 041 and the second slot 042, more slots may be included. If all slots other than the first slot 041 and the second slot 042 are occupied by circuit boards, the computing device is in a fully configured scenario. If some slots are not occupied by circuit boards, the computing device is in a partially configured scenario. In specific implementations, the number of circuit boards inserted needs to be determined based on actual requirements; this application does not impose any special limitations on the number of circuit boards inserted or their arrangement.

[0098] Figure 4 A feasible structural diagram for either the first single board 021 or the second single board 022 is given. For example...Figure 4 As shown, either the first board 021 or the second board 022 includes a mounting plate 02d. A mounting cavity is formed within the mounting plate 02d, and a circuit board 02c, a chip 02b, and a heat sink assembly 02a are disposed within the mounting cavity. The chip 02b is integrated onto the circuit board 02c, and the heat sink assembly 02a is disposed on the side of the chip 02b away from the circuit board 02c. Other electronic components, such as capacitors, inductors, and resistors, can also be integrated onto the circuit board 02c. Figure 4 In the structure shown, since a heat sink assembly 02a is provided on the chip 02b, part of the heat dissipated by the chip 02b can be diffused away by the heat sink assembly 02a. In a specific implementation, the mounting plate 02d, which is provided with the circuit board 02c, the chip 02b, and the heat sink assembly 02a, can be inserted into the corresponding slot in a front-to-back direction.

[0099] The circuit board 02c involved in this application can be a printed circuit board (PCB). The structural forms that chip 02b can choose have been explained above and will not be repeated here.

[0100] Continue to combine Figure 3 and Figure 4 In addition to the single board and fan 03, the computing device 100 also includes a mixing chamber 06. In one possible implementation, the mixing chamber 06 can be formed by a hollow shell structure, that is, the hollow structure of the shell structure forms the mixing chamber 06.

[0101] Combined again Figure 3 and Figure 4 The heat sink assembly 02a of the single board has a flow channel 02e, which is connected to the mixing chamber 06 via a first liquid inlet pipe 051 and a first liquid return pipe 052. A liquid medium, such as water or other liquids with high specific heat capacity, can flow in the flow channel 02e. In this way, some heat emitted by the chip in the first single board 021 can be conducted to the mixing chamber 06 along with the liquid medium. Similarly, some heat emitted by the chip in the second single board 022 can also be conducted to the mixing chamber 06 along with the liquid medium. The liquid medium flowing into the mixing chamber 06 can be mixed, and the mixed liquid medium can then return to the flow channels of each single board.

[0102] The chip in the first board 021 can be called the first chip, and the chip in the second board 022 can be called the second chip.

[0103] In practical use, the power consumption of the chip in the first board 021 may differ from that of the chip in the second board 022. For example, the chip in the first board 021 may be a high-power chip, while the chip in the second board 022 may be a low-power chip. Consequently, the high-power chip will dissipate more heat than the low-power chip. Thus, the liquid medium in the flow channel 02e of the first board 021 will carry more heat to the mixing chamber 06, while the liquid medium in the flow channel 02e of the second board 022 will carry less heat. The two liquid media at different temperatures mix in the mixing chamber, and the mixed liquid medium can then flow back to the flow channel 02e of both the first and second boards. Therefore, the heat dissipated by the high-power chip in the first board 021 can be transferred to the flow channel 02e corresponding to the low-power chip in the second board 022 after passing through the mixing chamber 06, and then diffused out through the second board 022.

[0104] Based on the above description of the heat dissipation structure and process of the chips in the single board, it is easy to see that the heat dissipation methods for the chips in each single board include at least local heat dissipation and remote heat dissipation. In local heat dissipation, heat is dissipated through the heat sink assembly 02a covering one side of the chip to cool it down; while in remote heat dissipation, the heat emitted by one chip is transferred to another chip, that is, it is moved to the heat sink assembly corresponding to the chip in other single boards, and the heat is diffused away by other heat sink assemblies, thereby achieving temperature equalization for multiple chips in multiple single boards, and the medium for moving the heat away is the liquid medium flowing between the flow channel 02e and the mixing chamber 06.

[0105] Since the heat-carrying liquid medium in each board flows into the mixing chamber 06, mixes in the mixing chamber 06, and then returns to each board, the mixing chamber 06 can not only serve as a channel for exchanging liquid media, but in some other embodiments, the heat dissipated by the liquid medium in the mixing chamber 06 can also be partially diffused by the mixing chamber, thereby further reducing the heat conducted to other boards and further improving the heat dissipation effect on the chip. Therefore, the hollow shell structure forming the mixing chamber 06 can be made of a material with high thermal conductivity, such as metal (aluminum, iron, etc.).

[0106] To facilitate rapid flow of the liquid medium between flow channel 02e and mixing chamber 06, such as Figure 3 and Figure 4 The computing device 100 also includes a drive pump 09, which can increase the flow rate of the liquid medium, that is, enable the liquid medium to flow rapidly between the flow channel 02e and the mixing chamber 06, so as to improve the heat dissipation efficiency of the chip.

[0107] Figure 5This is a structural diagram of another computing device 100 including a heat dissipation system provided in this application. In this embodiment, as... Figure 5 As shown, the mixing chamber 06 includes a first mixing chamber 061 and a second mixing chamber 062 that are connected to each other. That is, this computing device includes two-stage mixing, which allows liquid media of different temperatures entering the mixing chambers to be thoroughly mixed, laying a good foundation for long-distance heat dissipation. Of course, it is also possible to... Figure 5 Based on the above, more mixing chambers are arranged to achieve multi-stage mixing.

[0108] In addition, for example Figure 5 The drive pump 09 is installed on the connecting pipe that connects the first mixing chamber 061 and the second mixing chamber 062. Thus, the liquid medium with a higher temperature flowing out of the flow channel 02e in the heat sink assembly first enters the first mixing chamber 061 for mixing and cooling, and then flows into the second mixing chamber 062 through the drive pump 09. In other words, the liquid medium with a higher temperature will not enter the drive pump 09 first, which protects the drive pump 09, reduces the possibility of damage to the drive pump 09 by the high temperature liquid medium, and thus improves the performance of the drive pump 09.

[0109] Also, in Figure 5 In the diagram, the thicker black dashed line with arrows indicates the transport path of the liquid medium between flow channel 02e and mixing chamber 06. Figure 5 This is merely an illustrative example and does not represent the specific location of the first inlet pipe 051 and the first return pipe 052 used to connect the flow channel 02e and the mixing chamber 06. This application does not specifically limit the location of the first inlet pipe 051 and the first return pipe 052.

[0110] The following describes various forms of heat sink assembly 02a structures, which are illustrated in the appendix. Figure 1 First, an explanation will be provided.

[0111] Figure 6 This is a structural diagram of one type of heat sink assembly 02a provided in the embodiments of this application. Specifically, the heat sink assembly 02a includes a heat sink 02a1, a heat spreader 02a2, and a plurality of first heat dissipation fins 02a3. The heat spreader 02a2 is disposed on the side of the chip 02b away from the circuit board 02c, and the heat sink 02a1 is disposed on the side of the heat spreader 02a2 away from the chip 02b. A plurality of first heat dissipation fins 02a3 are disposed on both the side of the heat sink 02a1 away from the heat spreader 02a2 and the side of the heat spreader 02a2 away from the chip 02b. Furthermore, a flow channel 02e for flowing liquid medium is formed within the heat sink 02a1.

[0112] Figure 6The heat released by the chip 02b is transferred through the following path: the heat emitted by the chip 02b is transferred to the heat spreader 02a2, the heat spreader 02a2 diffuses the heat to a larger heat dissipation area, and the heat after heat spread is transferred to the heat sink 02a1. Some of the heat is carried away by the liquid medium in the flow channel of the heat sink 02a1, and some of the heat is diffused away by multiple first heat dissipation fins 02a3.

[0113] In some implementations, the aforementioned vapor chamber 02a2 can be a sheet material structure, such as a copper plate, aluminum plate, or other sheet material. In other implementations, a heat pipe structure can be set within the sheet material structure to form the vapor chamber 02a2. Alternatively, in yet another implementation, a vapor chamber (VC) can be used as the vapor chamber structure. In other words, this application does not impose any special limitations on the feasible structure of the vapor chamber, as long as it has a temperature uniformity effect.

[0114] Figure 7 A structural diagram of a heat sink 02a1 is given. This structure is... Figure 6 The diagram shown is obtained after sectioning AA. See the diagram for the specific structure. Figure 7 The heat sink 02a1 is a cold plate structure with a liquid-containing cavity 02a11 formed within it. Multiple second heat dissipation fins 02a12 are arranged within the liquid-containing cavity 02a11, forming a flow channel 02e for the passage of a liquid medium. In addition, a first opening 02a13 and a second opening 02a14 communicating with the liquid-containing cavity 02a11 are formed on the wall of the heat sink 02a11. Furthermore, one of the first opening 02a13 and the second opening 02a14 is connected via a... Figure 4 The first inlet pipe 051 shown is connected to the mixing chamber 06, and another opening in the first opening 02a13 and the second opening 02a14 is connected through, as shown in the figure Figure 4 The first return line 052 shown is connected to the mixing chamber 06.

[0115] It should be noted that, Figure 7 The given example shows a U-shaped liquid-containing cavity 02a11 forming the flow channel 02e. However, other structures are possible and not specifically limited here. When the liquid-containing cavity 02a11 within the cold plate has a U-shaped structure, such as... Figure 7 As shown, in order to increase the transmission path of the liquid medium in the liquid cavity 02a11, the first opening 02a13 and the second opening 02a14 can be opened on the protruding side of the U-shaped structure.

[0116] Depend on Figure 7As can be seen from the example heat sink 02a1 structure, the liquid cavity 02a11 in the heat sink 02a1 not only plays the role of transferring liquid medium, but also the multiple second heat dissipation fins 02a12 located in the liquid cavity 02a11 can diffuse the heat diffused by the flowing liquid medium, thereby further improving the heat dissipation effect on the chip.

[0117] Combined Figure 6 In this embodiment, the orthographic projection of chip 02b onto the heat spreader 02a2 is located within the edge of the heat spreader 02a2. That is to say, the area of ​​chip 02b is smaller than the area of ​​heat spreader 02a2. In this way, heat spreader 02a2 can diffuse the heat emitted by chip 02b so that heat spreader 02a2 can play a role in temperature uniformity.

[0118] Continue to combine Figure 6 The orthographic projection of heat sink 02a1 onto heat spreader 02a2 lies within the edge of heat spreader 02a2, meaning the area of ​​heat sink 02a1 is smaller than the area of ​​heat spreader 02a2. Since the area of ​​heat sink 02a1 is smaller than the area of ​​heat spreader 02a2, heat sink 02a1 will not completely cover the surface of heat spreader 02a2, only partially. With this design, such as... Figure 6 As shown, multiple first heat dissipation fins 02a3 are arranged at intervals on the side of the heat spreader 02a2 away from the chip 02b and on the side of the heat sink 02a1 away from the heat spreader 02a2. This ensures that some of the heat dissipated by the chip 02b can be conducted away through the liquid medium, shortening the local heat dissipation path and allowing the multiple first heat dissipation fins 02a3 to fully utilize their local heat dissipation function. Furthermore, by allowing the multiple first heat dissipation fins 02a3 to fully utilize their local heat dissipation function, while the heat sink 02a1 effectively draws the heat from the chip 02b away from the mixing chamber 06, the flow rate requirement of the liquid medium can be minimized, thereby reducing the requirements for the drive pump 09, lowering the implementation difficulty of the heat dissipation system, and reducing costs.

[0119] Figure 8 This is a structural diagram of another heat sink assembly 02a provided in an embodiment of this application. Figure 8 The heat sink assembly 02a shown also includes a heat sink 02a1, a heat spreader 02a2, and multiple first heat dissipation fins 02a3. A flow channel 02e is formed within the heat sink 02a1. The heat sink 02a1 can also be... Figure 7 The cold plate structure shown can be replaced with other heat dissipation plate structures.

[0120] Figure 8 The heat sink assembly 02a shown above and the above Figure 6 The difference in structure between the heat sink assembly 02a shown is that: Figure 8In this configuration, the heat sink 02a1 is positioned closer to the chip 02b than the vapor chamber 02a2. The vapor chamber 02a2 is located on the side of the heat sink 02a1 furthest from the chip 02b, and multiple first heat dissipation fins 02a3 are disposed on the surface of the vapor chamber 02a2 facing away from the heat sink 02a1. In some alternative embodiments, such as... Figure 8 This allows the orthographic projections of chip 02b and heat sink 02a1 onto vapor chamber 02a2 to be located within the edge of vapor chamber 02a2, meaning that the areas of chip 02b and heat sink 02a1 are both smaller than the area of ​​vapor chamber 02a2. This allows for the placement of a sufficient number of first heat sink fins 02a3 on a sufficiently large vapor chamber 02a2. Similarly, this allows multiple first heat sink fins 02a3 to fully utilize their local heat dissipation advantages.

[0121] Figure 9 This is a structural diagram of another heat sink assembly 02a provided in an embodiment of this application. Figure 9 The heat sink assembly 02a shown includes a heat sink 02a1 and a plurality of first heat sink fins 02a3. The heat sink 02a1 is disposed on the side of the chip 02b away from the circuit board 02c, and the plurality of first heat sink fins 02a3 are disposed on the side of the heat sink 02a1 opposite to the chip 02b. A flow channel 02e is also formed within the heat sink 02a1. The heat sink 02a1 can also be made of... Figure 7 The structure shown is correct, but other structures are also possible.

[0122] The above describes three different heat sink assemblies 02a. These assemblies 02a can not only achieve local heat dissipation but also transfer some of the heat dissipated by the chip away through a flowing liquid medium, further reducing temperature through distanced heat dissipation. Of course, in some implementations, heat sink assembly structures different from the three heat sink assemblies 02a described above can be selected.

[0123] Combined Figure 6 , Figure 8 and Figure 9 Regardless of whether the heat spreader 02a2 or the heat sink 02a1 is positioned close to the chip 02b, in order to reduce thermal resistance, a thermal interface material (TIM) layer can be formed on the surface of the chip 02b away from the circuit board 02c. For example, when the heat spreader 02a2 is close to the chip 02b relative to the heat sink 02a1, a thermal interface material layer can be set at the interface where the chip 02b and the heat spreader 02a2 are in contact, reducing the thermal resistance between the chip 02b and the heat spreader 02a2, so that enough heat can be dissipated.

[0124] When the liquid media from different plates flow into the mixing chamber 06, in order to ensure thorough mixing of liquid media at different temperatures, a baffle can be installed inside the mixing chamber. The baffle divides the mixing chamber into multiple interconnected channels, for example... Figure 10 As shown, a partition 07 is respectively installed in the first mixing chamber 061 and the second mixing chamber 062. The partition 07 in the first mixing chamber 061 divides the liquid into interconnected channels 06a and 06b. Similarly, the partition 07 in the second mixing chamber 062 also divides the liquid into interconnected channels 06a and 06b. This increases the transport path of the liquid medium within the mixing chamber, thereby ensuring thorough mixing of the incoming liquid medium and resulting in better temperature uniformity for different chips.

[0125] Continue as Figure 10 As shown, a first inlet 081 and a second inlet 082 are provided on the side wall of the first mixing chamber 061. The first inlet 081 and the second inlet 082 are connected... Figure 5 The flow channels in the first single plate 021 are connected, and the second liquid inlet 082 is connected to... Figure 5 The flow channels in the second single plate 022 are connected. Since the first single plate 021 and the second single plate 022 are arranged along the preset direction Z, then... Figure 10 The first liquid inlet 081 and the second liquid inlet 082 are also arranged accordingly along the preset direction Z. Therefore, in one possible embodiment, such as... Figure 10 The partition 07, which is disposed in the first mixing chamber 061, can be extended along the preset direction Z. The partition 07 has a liquid passage hole 071 for connecting the channels 06a and 06b, and the liquid passage hole 071 is located between the first liquid inlet 081 and the second liquid inlet 082. In this way, for example, when the chip in the first board 021 is a high-power chip and the chip in the second board 022 is a low-power chip, the high-temperature liquid medium output from the first board 021 will enter the channel 06a through the first liquid inlet 081 and flow downward, and the low-temperature liquid medium output from the second board 022 will enter the channel 06a through the second liquid inlet 082 and flow upward. The two liquid media of different temperatures will then enter the channel 06b through the liquid passage hole 071.

[0126] Combined Figure 10The number of inlets in the first mixing chamber 061 is greater than the number of outlets. The inlets of the first mixing chamber 061 are connected to the flow channel, and the outlets are connected to the second mixing chamber 062. The purpose of this design is that, since the drive pump 09 is installed on the connecting pipe between the first mixing chamber 061 and the second mixing chamber 062, by designing the number of outlets in the first mixing chamber 061 to be less than the number of inlets, the number of drive pumps 09 can be reduced accordingly. This, in turn, reduces the space occupied by the drive pumps, lowers manufacturing costs, and reduces the power consumption of the entire computing device.

[0127] In some implementations, a liquid-cooling connector can be installed at the inlet of the mixing chamber, for example, in Figure 10 In this process, a liquid-cooled connector 11 can be installed at both the first liquid inlet 081 and the second liquid inlet 082. That is, the liquid-cooled connector 11 is used to connect the mixing chamber to the pipeline, which facilitates process installation and subsequent maintenance. In some other embodiments, the pipeline can also be fixedly installed at the liquid inlet.

[0128] When the computing device is not under full load, that is, when there are slots in the chassis where no single board is inserted, for example, in Figure 11 In the structural diagram of a computing device 100, a single circuit board is inserted in both the first slot 041 and the second slot 042, but no single circuit board is inserted in the third slot 043. This is to fully utilize the heat dissipation capacity of the other slots, such as... Figure 11 A heat exchange module 10 can be installed in the third slot 043 where no single board is inserted. The heat exchange module 10 can diffuse the heat emitted by the first single board 021 and the second single board 022, thereby improving heat dissipation efficiency.

[0129] Figure 12 A feasible structural diagram of a heat exchange module 10 is presented. (This is combined with...) Figure 11 and Figure 12 As shown, the heat exchange module 10 includes a heat exchange plate 101, within which a fluid cavity 105 is formed. The fluid cavity 105 is connected to the mixing chamber 06 via a second inlet pipe 103 and a second return pipe 1041. In this way, the liquid medium in the mixing chamber 06 can also flow into the fluid cavity 105 within the heat exchange plate 101, i.e., heat dissipation is achieved through the space of the third slot. Therefore, the heat dissipation for the first board 021 and the second board 022 is not limited to the spaces of the first slot 041 and the second slot 042, but also utilizes the unused space of the third slot 043. This means that the entire space within the chassis can be fully utilized, heat dissipation capacity is not wasted, and the fan speed requirement for the 03 can be reduced, thus lowering the system's heat dissipation power consumption.

[0130] The heat exchange plate 101 in the heat exchange module 10 of the above embodiment can be adopted Figure 7 The heat sink 02a1 structure shown can further dissipate heat from the liquid medium flowing in the heat sink 02a1 by having multiple second heat dissipation fins 02a12, thereby further improving the heat dissipation efficiency of the first single plate 021 and the second single plate 022.

[0131] The function of the heat exchange module 10 located in the third slot 043 in the embodiments of this application can be understood as follows: for example, for the high-power first board 021, the remote heat dissipation includes at least two heat dissipation paths, one of which is remote heat dissipation through the heat dissipation plate assembly in the second board 022, and the other of which is remote heat dissipation through the heat exchange module 10.

[0132] To further improve the heat dissipation efficiency of the heat exchange module 10, such as Figure 12 The heat exchange module 10 also includes multiple third heat dissipation fins 102, which are spaced apart on the heat exchange plate 101. In this way, the liquid medium in the fluid cavity 105 that is transferred to the heat exchange plate 101 can also be cooled by the multiple third heat dissipation fins 102.

[0133] In addition, such as Figure 12 The heat exchange module 10 also includes a mounting plate 104, on which the heat exchange plate 101 is fixed. The mounting plate 104 is pluggably disposed in the third slot 043. If a single board needs to be installed in the third slot 043, the heat exchange module 10 can be pulled out and the single board can be inserted into the third slot 043. In this way, the heat exchange module 10 can be installed flexibly and freely according to the usage scenario.

[0134] The mounting plate 104 that supports and fixes the heat exchange plate 101 has various possible structures, such as... Figure 12 One embodiment is provided, in which the mounting plate 104 includes a first plate 02d3, a connecting plate 02d1, and a second plate 02d2, wherein the second plate 02d2 and the first plate 02d3 are inserted into the heat exchange module 10 in the following directions (e.g., ...). Figure 12 Parallel to the direction of P), where the direction of P is... Figure 2 In the Y-direction from the front to the rear of the chassis 01, the connecting plate 02d1 is perpendicular to the insertion direction of the heat exchange module 10 and is fixedly connected to the second plate 02d2 and the first plate 02d3. Furthermore, the heat exchange plate 101 is fixed to the side of the first plate 02d3 facing the second plate 02d2. In other possible implementations, the mounting plate 104 may also adopt other structures.

[0135] for Figure 12In the illustrated mounting plate 104 structure, during specific implementation, the connecting plate 02d1 of the heat exchange module 10, inserted into the third slot 043, is located at the slot opening and can seal the opening to prevent debris from entering the third slot. Furthermore, the connecting plate 02d1, sealing the slot opening, also serves as electromagnetic shielding, suppressing external electromagnetic interference from entering the slot and disrupting chip operation.

[0136] In the above Figure 3 , Figure 5 and Figure 11 In the computing device 100 shown, the drive pump 09 is located inside the chassis 01 and outside the slot. That is, the drive pump 09 will not occupy additional space in the external cabinet and is convenient for later maintenance.

[0137] When the drive pump 09 is located outside the slot, each board can be connected to one drive pump, or multiple drive pumps connected in series. For example, in Figure 3 In this configuration, one circuit board corresponds to one drive pump. Additionally, in some embodiments, such as... Figure 5 Multiple circuit boards can be connected to a single drive pump, meaning one drive pump is used to drive the flow of liquid media within multiple circuit boards. This is just a limitation on the drive pump connection method; other connection methods are also possible.

[0138] Figure 13 Another computing device 100 is shown in a structural diagram. In this embodiment, unlike the above embodiment, the drive pump 09 is set in the slot and on the circuit board 02c. That is, the chip, heat sink assembly and drive pump are all integrated on the circuit board 02c.

[0139] In the above Figure 3 , Figure 5 and Figure 11 ,as well as Figure 13 In the computing device 100 shown, the mixing chamber 06 is disposed inside the chassis 01. Figure 14 In another structural diagram of the computing device 100, the mixing chamber 06 is installed outside the chassis 01, i.e., inside the external cabinet, and the drive pump 09 is located inside the chassis 01 and is mounted on the circuit board 02c.

[0140] exist Figure 14 In the computing device 100 shown, the drive pump 09 is installed on the liquid medium return pipeline. That is, the high-temperature liquid medium flowing out of the single board first passes through the mixing chamber 06 and then returns to the single board via the drive pump 09. This prevents the high-temperature liquid medium from affecting the performance of the drive pump. Similarly, in the various implementation structures of the aforementioned computing devices, the drive pump can also be installed on the liquid medium return pipeline.

[0141] Figure 15 Another structural diagram of a computing device 100 is given, such as... Figure 15 The diagram shows a first mixing chamber 061 and a second mixing chamber 062 that are connected to each other, and both the first mixing chamber 061 and the second mixing chamber 062 are located outside the housing 01, and the drive pump 09 is also located outside the housing 01.

[0142] In some embodiments, if there are multiple mixing chambers, some mixing chambers may be located inside the chassis 01, and some mixing chambers may be located outside the chassis 01. The location of the mixing chambers can be determined according to actual needs, such as the accommodating space inside the chassis 01.

[0143] Within the computing device 100, not only will multiple single-board 02s be installed, but other circuit board structures will also be set up and electrically connected to the single-board 02s.

[0144] in, Figure 16 and Figure 17 Two structural diagrams are given, including single board 02, other circuit boards, and the aforementioned heat dissipation system. Figure 16 In the chassis 01, in addition to multiple single boards 02 and fans 03, multiple first circuit boards 12 are also included, with the multiple single boards 02 along... Figure 16 The Z-direction arrangement is such that multiple first circuit boards 12 are arranged along the Y-direction perpendicular to the Z-direction, and each first circuit board 12 is parallel to the insertion / removal direction P of the single board 02. Multiple single boards 02 and multiple first circuit boards 12 are electrically connected. For example, single boards 02 and first circuit boards 12 can be electrically connected by connectors. Such a structure can be called the orthogonal architecture of a computing device.

[0145] exist Figure 17 In the chassis 01, in addition to multiple single-board 02 and fans 03, multiple second circuit boards 13 are also included. The multiple single-board 02 are arranged along... Figure 17 The single board 02 is arranged in the Z direction, and multiple second circuit boards 13 are arranged in the X direction, which is perpendicular to the Z direction. Each second circuit board 13 is perpendicular to the insertion / removal direction P of the single board 02. The multiple single boards 02 and the multiple second circuit boards 13 are electrically connected. This structure can be called the front-panel backplane architecture of a computing device. Figure 17 An example is shown of a second circuit board 13.

[0146] exist Figure 16 and Figure 17 In this context, the location of the mixing chamber is not specified; for example, in... Figure 16 In the orthogonal architecture, the mixing chamber can be positioned above, below, to the right, or to the left of multiple first circuit boards 12, or in other locations. Similarly, in Figure 17In this configuration, the mixing chamber can be located above, below, to the right or left of multiple second circuit boards 13, or in other locations.

[0147] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0148] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A heat dissipation module for dissipating heat from chips in a computing device, characterized in that, The heat dissipation module includes: Mixing chamber; A first heat sink and a second heat sink, wherein the first heat sink is disposed on one side of the first chip and the second heat sink is disposed on one side of the second chip, and the temperature of the first chip and the temperature of the second chip are not equal. The first heat sink and the second heat sink both have flow channels, and both have liquid outlets and liquid return ports that are connected to the flow channels. The liquid outlets and liquid return ports are connected to the mixing chamber, and the flow channels and the mixing chamber are used for the flow of liquid media. The first heat sink and the second heat sink are arranged along the first direction; The wall of the mixing chamber is provided with a first liquid inlet and a second liquid inlet that communicate with the mixing chamber. The first liquid inlet and the second liquid inlet are arranged along the first direction. The first liquid inlet is connected to the liquid outlet of the first heat sink, and the second liquid inlet is connected to the liquid outlet of the second heat sink.

2. The heat dissipation module according to claim 1, characterized in that, The heat dissipation module also includes: at least one drive pump; The flow channel within either the first heat sink or the second heat sink is connected to the mixing chamber via the drive pump.

3. The heat dissipation module according to claim 1 or 2, characterized in that, The mixing chamber is equipped with a partition, which divides the mixing chamber into at least two interconnected channels.

4. The heat dissipation module according to claim 3, characterized in that, The partition extends along the first direction, and the partition is provided with a liquid passage hole that connects two adjacent channels. The liquid passage hole is located between the first liquid inlet and the second liquid inlet.

5. The heat dissipation module according to claim 1 or 2, characterized in that, The mixing chamber includes a first mixing chamber and a second mixing chamber. The first mixing chamber is connected to the outlet, and the second mixing chamber is connected to the return port. The first mixing chamber and the second mixing chamber are connected by a connecting pipe.

6. The heat dissipation module according to claim 5, characterized in that, In the first mixing chamber, the number of inlets for communicating with the flow channel is greater than the number of outlets for communicating with the second mixing chamber. The heat dissipation module further includes: multiple drive pumps, with one drive pump connected to any of the connecting pipes.

7. The heat dissipation module according to claim 1 or 2, characterized in that, The heat dissipation module further includes: a first heat spreader; The first vapor chamber is positioned close to the first chip relative to the first heat sink, and the first heat sink is positioned on the side of the first vapor chamber away from the first chip.

8. The heat dissipation module according to claim 7, characterized in that, The orthographic projection of the first heat sink onto the first vapor chamber is located within the edge of the first vapor chamber. Multiple first heat dissipation fins are arranged at intervals on the side of the first heat spreader away from the first chip and on the side of the first heat sink away from the first heat spreader.

9. The heat dissipation module according to claim 1 or 2, characterized in that, The heat dissipation module further includes: a first heat spreader; The first heat sink is positioned close to the first chip relative to the first vapor chamber. The first vapor chamber is positioned on the side of the first heat sink away from the first chip. Multiple first heat sink fins are arranged at intervals on the side of the first vapor chamber away from the first heat sink.

10. The heat dissipation module according to claim 1 or 2, characterized in that, At least one of the first and second heat sinks is a cold plate. The cold plate has a liquid-containing cavity, and multiple second heat dissipation fins are arranged in the liquid-containing cavity. The liquid-containing cavity forms the flow channel, and the liquid outlet and the liquid return port are opened on opposite sides of the cold plate.

11. The heat dissipation module according to claim 1 or 2, characterized in that, The heat dissipation module also includes: A heat exchange plate has a fluid cavity inside. The heat exchange plate has an outlet and a return port that are connected to the fluid cavity. Both the outlet and the return port of the heat exchange plate are connected to the mixing cavity.

12. The heat dissipation module according to claim 11, characterized in that, The heat dissipation module also includes: multiple third heat dissipation fins; The plurality of third heat dissipation fins are spaced apart on the heat exchange plate.

13. A computing device, characterized in that, include: Chassis; First chip; The second chip, both the first chip and the second chip are disposed inside the chassis; The heat dissipation module as described in any one of claims 1-12; The first heat sink is disposed on one side of the first chip and is fixedly connected to the first chip, and the second heat sink is disposed on one side of the second chip and is fixedly connected to the second chip.

14. The computing device according to claim 13, characterized in that, The mixing chamber may be located inside the chassis or outside the chassis.

15. The computing device according to claim 13 or 14, characterized in that, The chassis has a first slot and a second slot; The first chip and the first heat sink are detachably disposed in the first slot, and the second chip and the second heat sink are detachably disposed in the second slot.

16. The computing device according to claim 13 or 14, characterized in that, The computing device further includes a fan, which is disposed inside the chassis, and the exhaust side of the fan is connected to the outside of the chassis.

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