A laser processing method and system for controlling laser cutting depth at intersections of line segments

Abstract

This invention discloses a laser processing method and system for controlling the laser cutting depth at line segment intersections. The method includes the following steps: placing and fixing the product to be cut on a processing platform; obtaining a processing pattern and marking the line segment intersections in the processing pattern; performing laser processing on the product to be cut according to the processing line segment paths in the processing pattern; when processing along the X-axis, applying a first laser energy to unmarked sections to cut the unmarked sections, applying a second laser energy to marked sections to cut the marked sections along the X-axis; when processing along the Y-axis, applying a first laser energy to unmarked sections to cut the unmarked sections, and applying a third laser energy to marked sections to cut the marked sections along the Y-axis, wherein the sum of the second and third laser energies applied to the same marked section is equal to the first laser energy. This invention can avoid depth deviations at cross intersections without reducing processing efficiency.

Description

Technical Field

[0001] This invention belongs to the field of laser processing technology, specifically relating to a laser processing method and system for controlling the laser cutting depth at the intersection of line segments. Background Technology

[0002] During conventional laser cutting, the bottom of the material cutting path needs to be open to allow for collimation and coaxial high-pressure air blowing, which removes molten material slag from the kerf. Because ceramics are fragile, the inner mold product may fall off after cutting, causing scratches or breakage.

[0003] In ceramic cutting applications, the majority of cutting methods utilize controlled laser beam energy applied to the material surface to increase output and thus depth (controlled fracture cutting). This significantly improves processing efficiency, requiring less energy compared to full cuts and minimizing thermal impact on the material. Laser scribing typically controls the scribing depth to 30%-60% to prevent the entire sheet from scattering due to excessive depth during automated loading / unloading or manual handling after separation. Without adjustment, the depth at the cross-section and in the x and y directions will be inconsistent; excessive depth at the cross-section can lead to material penetration.

[0004] The existing solution involves splitting line segments and breaking individual line segments to complete the processing in stages, which greatly reduces processing efficiency. Summary of the Invention

[0005] The purpose of this invention is to overcome the defects of the prior art and provide a laser processing method and system for controlling the laser cutting depth at the intersection of line segments, which can avoid depth deviation at the intersection without reducing processing efficiency.

[0006] The technical solution of this invention is implemented as follows: This invention discloses a laser processing method for controlling the laser cutting depth at the intersection of line segments, comprising the following steps:

[0007] Place the product to be cut on the processing platform and fix it in place;

[0008] Once the processing graphic is obtained, the intersections of line segments in the processing graphic are marked.

[0009] The product to be cut is laser-processed according to the processing line path in the processing graphic. During the laser processing, when processing along the X-axis, a first laser energy is applied to the unmarked section to cut the unmarked section, and a second laser energy is applied to the marked section to cut the marked section along the X-axis. When processing along the Y-axis, a first laser energy is applied to the unmarked section to cut the unmarked section, and a third laser energy is applied to the marked section to cut the marked section along the Y-axis. The sum of the second laser energy and the third laser energy applied to the same marked section is equal to the first laser energy.

[0010] Furthermore, the mark size of each marked segment is the length of a single light spot.

[0011] Furthermore, the intersections of line segments are marked, specifically including: automatically identifying the intersections of line segments and marking them.

[0012] Furthermore, the software marks the intersections of the line segments and edits the length of the markings at the intersections according to the editing instructions to adapt to the changes in line width under different laser focal conditions.

[0013] Furthermore, the product to be cut is laser-processed according to the processing line path in the processing graphic. Specifically, this includes: laser-processing the product to be cut along the X-axis and Y-axis directions according to the processing line path in the processing graphic. When processing any line segment, the laser beam cuts from the beginning to the end of the line segment along the X-axis or Y-axis, ensuring that the cutting stroke remains unchanged. The cutting speed is accelerated from 0 to the set value and held for a period of time, and then decelerated to 0 from the set value.

[0014] Furthermore, during laser processing, compressed gas is blown onto the processing area to reduce the heat generated during laser processing and remove the slag produced during cutting.

[0015] Furthermore, the product to be cut is fixed on the processing platform by adsorption fixation.

[0016] Furthermore, after laser processing is completed, the material is removed and split to complete the entire processing procedure.

[0017] This invention also discloses a laser processing system for controlling the laser cutting depth at the intersection of line segments, comprising a laser, a processing platform, and a control system, wherein:

[0018] The processing platform is used to support and fix the product to be cut;

[0019] The laser is connected to the control system, which controls the laser to emit a laser beam of corresponding laser energy according to a preset program, and emits the beam through the laser head to the surface of the product to be cut. When the control system executes the preset program, it implements the steps of the laser processing method described above for controlling the laser cutting depth at the intersection of line segments.

[0020] Furthermore, the processing platform is designed to fix the product to be cut using an adsorption method.

[0021] Furthermore, the laser head is fixed with an air blowing device for blowing air onto the processing area to reduce the heat generated during laser processing and remove the molten slag produced during cutting.

[0022] This invention has at least the following beneficial effects: In the application of depth control in the cutting of ceramic materials or ceramic copper-clad laminates, depth deviation at the cross intersection can affect the slicing effect in subsequent processes. By using the method of this invention for control and adjustment, depth deviation at the cross intersection can be avoided, and line segment splitting is not required. A single line segment does not undergo multiple acceleration and deceleration processes, thus not affecting processing efficiency. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A flowchart of a laser processing method for controlling the laser cutting depth at the intersection of line segments, provided in an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of a laser processing system for controlling the laser cutting depth at the intersection of line segments, provided in an embodiment of the present invention;

[0026] Figure 3 This is a schematic diagram of the processing platform of a laser processing system for controlling the laser cutting depth at the intersection of line segments, as provided in an embodiment of the present invention.

[0027] In the attached diagram, 1 is the laser, 2 is the laser head, 3 is the processing platform, 31 is the fixture platform, and 32 is the XY motion axis. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0030] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; in the description of this invention, unless otherwise stated, "a plurality of" or "several" means two or more.

[0031] Laser processing technology is a technology that utilizes the interaction between laser beams and matter to cut, weld, surface treat, drill, micro-machine materials (including metals and non-metals), and also to use them as a light source for object recognition. The largest traditional application area is laser cutting technology.

[0032] Laser cutting of ceramics is often used to create grid-like patterns, and the cutting depth is mostly controlled by straight lines.

[0033] Example 1

[0034] See Figure 1 This invention discloses a laser processing method for controlling the laser cutting depth at the intersection of line segments, comprising the following steps:

[0035] Place the product to be cut on the processing platform and fix it in place;

[0036] The processing graphic can be obtained by editing the processing graphic using software or importing a preset processing graphic. The intersections of line segments in the processing graphic are marked, and the laser processing parameters are set.

[0037] The product to be cut is laser-processed according to the processing line path in the processing graphic. During the laser processing, the laser processing parameters need to meet the following requirements: When processing along the X-axis, a first laser energy is applied to the unmarked section to cut the unmarked section, and a second laser energy is applied to the marked section to cut the marked section along the X-axis. When processing along the Y-axis, a first laser energy is applied to the unmarked section to cut the unmarked section, and a third laser energy is applied to the marked section to cut the marked section along the Y-axis. The sum of the second laser energy and the third laser energy applied to the same marked section is equal to the first laser energy. For example, if the first laser energy is 50W, when the second laser energy is 50W, the third laser energy is 0.

[0038] When machining the intersection of line segments along the X-axis and / or Y-axis, this invention reduces the energy frequency or energy output at the intersection to control the cutting depth at the intersection. Furthermore, when machining a straight line segment, there are no multiple acceleration and deceleration processes that reduce efficiency, and the overall depth remains consistent.

[0039] Editing and processing graphics using software specifically includes editing and processing line segment paths within the software.

[0040] Furthermore, the product to be cut is fixed on the processing platform by adsorption fixation.

[0041] Furthermore, the marking size of each marking segment is the length of a single light spot, ensuring that the laser linewidth along the XY axis is consistent and that the marking area connects the XY axis line segments.

[0042] Furthermore, the intersections of line segments are marked, specifically including: automatically identifying all intersections of line segments and marking all intersections of line segments.

[0043] Furthermore, marking is performed at the intersections of line segments. Specifically, the marking is performed using software, and the length of the marking at the intersections can be edited according to editing instructions to adapt to the changes in line width under different laser focal conditions. For example, if the laser line width is 100um, the marking area is changed to 100um for matching; if the laser line width is 200um, the marking area is changed to 200um for matching.

[0044] Furthermore, laser processing is performed on the product to be cut according to the processing line path in the processing graphic. Specifically, this includes: laser processing the product to be cut along the X-axis and Y-axis directions according to the processing line path in the processing graphic. When processing any line segment, the laser beam cuts from the beginning to the end of the line segment along the X-axis or Y-axis, ensuring that the cutting stroke remains constant. The cutting speed is accelerated from 0 to a set value (max), maintained for a period of time, and then decelerated to 0 from the set value (max). The acceleration and deceleration are completed within a very short distance. When processing any line segment using the solution of this invention, the entire cutting stroke involves only one acceleration (corresponding to a very short distance at the beginning of the line segment) and one deceleration (corresponding to a very short distance at the end of the line segment). In contrast, traditional solutions require processing a line segment in several steps to avoid intersections with line segments along other axes.

[0045] Furthermore, the laser head is generally positioned at a height of no less than 1 mm above the surface of the product to be cut during processing. For example, in one embodiment, the laser head is controlled to move along the Z-axis to a height of 1-3 mm above the surface of the product to be cut before emitting light.

[0046] Furthermore, during laser processing, compressed gas is blown onto the processing area to reduce the heat generated during laser processing and remove the slag produced during cutting. Because laser processing generates high heat, slag is produced during ceramic cutting; therefore, simultaneous air blowing is necessary to both reduce the heat generated during laser processing and remove the slag produced during ceramic cutting. The high-speed airflow has a cooling effect on the laser-ceramic interaction zone, reducing the heat conduction depth of the interaction between the laser and ceramic into the matrix. This reduces the thickness of the recast layer caused by rapid cooling after melting. When the laser beam strikes the ceramic sample, the energy density at the laser beam focal point exceeds the ceramic's destructive threshold, causing the ceramic at the cutting point to vaporize into ceramic particles. Compressed air is then blown in to quickly remove these vaporized ceramic particles to prevent them from affecting subsequent processing.

[0047] Furthermore, after laser processing is completed, the material is removed and split to complete the entire processing procedure.

[0048] The processing steps of one embodiment of applying the method of the present invention to ceramic cutting are as follows:

[0049] The product to be cut is a ceramic plate made of alumina ceramic material with a thickness of 1.0 mm. The cutting depth is controlled at 50% and the removal amount is 500 μm.

[0050] Place the ceramic slab on the processing platform;

[0051] The software edits and processes the graphic. After obtaining the processed graphic, the cross-shaped intersection of the processed graphic is marked with segment markers. The purpose of the segment markers is to regulate the energy of the marked segments, reduce the light emission frequency or the output pulse width, and reduce the energy effect.

[0052] The product to be cut is laser-processed according to the processing line path in the processing graphic. The laser is energy-controlled in the marked area to reduce the energy output in order to achieve depth control. The laser beam should be able to move relative to the material along the X, Y, and Z axes.

[0053] After laser cutting is completed, the material is removed and then manually split into pieces to complete the entire processing procedure.

[0054] The selected laser is a quasi-continuous fiber laser with a wavelength of 1070nm, a peak output power of 10-30%, a frequency of 500-4000Hz, and a pulse width of 50-200µs.

[0055] Example 2

[0056] See Figure 2 and Figure 3 The present invention also discloses a laser processing system for controlling the laser cutting depth at the intersection of line segments, comprising a laser 1, a processing platform 3, and a control system, wherein:

[0057] The processing platform 3 is used to support and fix the product to be cut;

[0058] The laser 1 is connected to the control system, which controls the laser 1 to emit a laser beam of corresponding laser energy according to a preset program, and emits it through the laser head 2 to the surface of the product to be cut.

[0059] When the control system executes the preset program, it implements the steps of the laser processing method for controlling the laser cutting depth at the intersection of line segments as described in Embodiment 1.

[0060] Furthermore, the laser processing system also includes a light guiding system, which is used to adjust the focal position of the laser beam emitted by the laser 1.

[0061] Furthermore, the laser processing system also includes a motion mechanism connected to a control system. The control system controls the movement of the motion mechanism according to a preset program, adjusting the relative movement direction and speed between the laser head 2 and the product to be cut. The motion mechanism can drive the laser head and / or the processing platform 3 to move, adjusting the relative movement direction and speed between the laser beam and the product to be cut.

[0062] Furthermore, the laser processing system also includes an air blowing device for blowing air onto the processing area of ​​the product to be cut, in order to reduce the heat generated during laser processing and remove the molten slag produced during cutting. The air blowing nozzle of the air blowing device moves together with the laser head.

[0063] Furthermore, the air blowing device is fixed to the laser head.

[0064] Furthermore, the processing platform 3 is designed to fix the product to be cut using an adsorption method.

[0065] Furthermore, the processing platform 3 includes a fixture platform 31, which is provided with adsorption holes for adsorbing and fixing the product to be cut.

[0066] Furthermore, the fixture platform 31 is a hollowed-out adsorption platform, which is a metal fixture with adsorption holes and hollowed-out processing positions.

[0067] Furthermore, the fixture platform 31 is mounted on the XY motion axis 32.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A laser processing method for controlling the laser cutting depth at the intersection of line segments, characterized in that, Includes the following steps: Place the product to be cut on the processing platform and fix it in place; Once the processing graphic is obtained, the intersections of line segments in the processing graphic are marked. The product to be cut is laser-processed according to the processing line path in the processing graphic. During the laser processing, when processing along the X-axis, a first laser energy is applied to the unmarked section to cut the unmarked section, and a second laser energy is applied to the marked section to cut the marked section along the X-axis. When processing along the Y-axis, a first laser energy is applied to the unmarked section to cut the unmarked section, and a third laser energy is applied to the marked section to cut the marked section along the Y-axis. The sum of the second laser energy and the third laser energy applied to the same marked section is equal to the first laser energy.

2. The laser processing method for controlling the laser cutting depth at the intersection of line segments as described in claim 1, characterized in that: The size of each marked section is the length of a single light spot.

3. The laser processing method for controlling the laser cutting depth at the intersection of line segments as described in claim 1, characterized in that: Marking the intersections of line segments involves automatically identifying and marking these intersections.

4. The laser processing method for controlling the laser cutting depth at the intersection of line segments as described in claim 1 or 3, characterized in that: The software marks the intersections of line segments and edits the length of the markings at the intersections according to editing instructions to adapt to changes in line width under different laser focal conditions.

5. The laser processing method for controlling the laser cutting depth at the intersection of line segments as described in claim 1, characterized in that: Laser processing is performed on the product to be cut according to the processing line path in the processing graphic. Specifically, the laser beam is used to process the product to be cut along the X-axis and Y-axis directions according to the processing line path in the processing graphic. When processing any line segment, the laser beam cuts from the beginning to the end of the line segment along the X-axis or Y-axis, ensuring that the cutting stroke remains unchanged. The cutting speed is accelerated from 0 to the set value and held for a period of time, and then decelerated to 0 from the set value.

6. The laser processing method for controlling the laser cutting depth at the intersection of line segments as described in claim 1, characterized in that: During laser processing, compressed gas is blown onto the processing area to reduce the heat generated during laser processing and remove the slag produced during cutting.

7. The laser processing method for controlling the laser cutting depth at the intersection of line segments as described in claim 1, characterized in that: The product to be cut is fixed on the processing platform by adsorption.

8. The laser processing method for controlling the laser cutting depth at the intersection of line segments as described in claim 1, characterized in that: After laser processing is completed, the material is removed and split to complete the entire processing procedure.

9. A laser processing system for controlling the laser cutting depth at the intersection of line segments, characterized in that: Includes laser, processing platform and control system, among which, The processing platform is used to support and fix the product to be cut; The laser is connected to the control system, which controls the laser to emit a laser beam of corresponding laser energy according to a preset program, and emits the beam through the laser head to the surface of the product to be cut. When the control system executes the preset program, it implements the steps of the laser processing method for controlling the laser cutting depth at the intersection of line segments as described in any one of claims 1 to 5.

10. The laser processing system for controlling the laser cutting depth at the intersection of line segments as described in claim 9, characterized in that: The laser head is equipped with an air blowing device, which is used to blow air onto the processing area to reduce the heat generated during laser processing and remove the molten slag produced during cutting.

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