Solar cell plating device

Abstract

This application discloses a solar cell electroplating apparatus, relating to the field of solar photovoltaic technology. The electroplating apparatus has openings on opposite sides of the electroplating chamber for the solar cell to enter and exit. An anode, electrically connected to the positive terminal of an electroplating power source, is disposed inside the electroplating chamber. A conductive mechanism, electrically connected to the negative terminal of the electroplating power source, is disposed outside the electroplating chamber and is electrically connected to the solar cell. The electroplating apparatus further includes an external fluid balancing mechanism. This external fluid balancing mechanism is located outside the electroplating chamber and has a fluid jetting device. The external fluid balancing mechanism jets fluid through the fluid jetting device to ensure that the force balance position of the portion of the solar cell outside the electroplating chamber is located within the plane of the electroplating channel. The solar cell moves within the plane of the electroplating channel for electroplating. In this embodiment, scratches on the surface of the solar cell can be effectively avoided, improving the surface quality of the solar cell.

Description

Technical Field

[0001] This application belongs to the field of solar photovoltaic technology, specifically relating to a solar cell electroplating device. Background Technology

[0002] Currently, electroplating technology is being increasingly studied as a novel electrode preparation method for solar cells. As a promising electrode preparation method, electroplating can significantly reduce the cost of solar cell manufacturing processes. Furthermore, electrodes prepared by electroplating technology have a higher aspect ratio and better conductivity compared to electrodes prepared by traditional screen printing. They also have lower internal resistance and reduce shading losses, thereby effectively improving the photoelectric conversion efficiency of solar cells.

[0003] Traditional electroplating techniques for electrode fabrication typically involve immersing solar cells in an electroplating bath using racks and carriers. This inevitably leads to drawbacks such as low electroplating efficiency, high losses of the plating solution and fixtures, and high electroplating costs. To avoid these shortcomings, manufacturers have developed a planar plating process. In this process, solar cells are moved at a predetermined speed through an electroplating bath containing the plating solution, parallel to the plane of the solar cell, thus fabricating the electrodes.

[0004] However, in the planar electroplating process, when solar cells enter the electroplating bath, they are easily scratched and bumped against the side wall of the electroplating bath, which can lead to scratches or even fragments on the surface of the solar cells. Summary of the Invention

[0005] The purpose of this application is to provide a solar cell electroplating apparatus that can solve problems such as easy scratches or fragments on the surface of solar cells when electroplating on a flat surface.

[0006] To solve the above-mentioned technical problems, this application is implemented as follows:

[0007] This application provides a solar cell electroplating apparatus. The apparatus includes an electroplating chamber for containing an electroplating solution. The electroplating chamber has openings on opposite sides for the solar cell to enter and exit. These openings form at least a portion of the solar cell electroplating channel, and are located within the plane of the electroplating channel. The solar cell moves within the plane of the electroplating channel for electroplating. An anode electrically connected to the positive terminal of an electroplating power source is provided inside the electroplating chamber. A conductive mechanism electrically connected to the negative terminal of the electroplating power source is provided outside the electroplating chamber, and this conductive mechanism is used to electrically connect the solar cell.

[0008] The electroplating apparatus further includes: an external fluid balancing mechanism;

[0009] The external fluid balancing mechanism is located outside the electroplating chamber and has at least one set of fluid jetting devices for jetting fluid; the external fluid balancing mechanism jets fluid through the fluid jetting devices so that the force balance position of the portion of the solar cell outside the electroplating chamber is located in the plane of the electroplating channel.

[0010] Optionally, the external fluid balancing mechanism includes a first-side fluid balancing mechanism located outside the first side opening in the two side openings, and / or a second-side fluid balancing mechanism located outside the second side opening in the two side openings.

[0011] Optionally, the first-side fluid balancing mechanism and / or the second-side fluid balancing mechanism may include at least one set of the fluid injection devices.

[0012] Optionally, at least a portion of the fluid ejected by the set of fluid jetting devices forms a component fluid flowing toward the opening, the component fluid being fluid along the plane of the electroplating channel.

[0013] Optionally, at least one set of the fluid jetting devices includes at least two fluid jetting devices arranged in a mirror image along the plane containing the electroplating channel.

[0014] Optionally, the electroplating apparatus further includes: an internal fluid balancing mechanism, which is disposed inside the electroplating chamber and has at least one set of electrolyte spraying devices; the internal fluid balancing mechanism sprays electroplating liquid through the electrolyte spraying devices so that the force balance position of the solar cell inside the electroplating chamber is located in the plane where the electroplating channel is located.

[0015] Optionally, the set of fluid injection devices is connected to a fluid supply device; the fluid injection device includes a fluid guide having at least one fluid injection port.

[0016] Optionally, the fluid guide has a return channel between it and the electroplating chamber.

[0017] Optionally, the fluid injection port includes: a first sub-injection port and a second sub-injection port;

[0018] The first sub-jet port and the second sub-jet port are arranged alternately, with the first sub-jet port being away from the electroplating chamber and the second sub-jet port being close to the electroplating chamber.

[0019] Optionally, the first sub-jet port and the second sub-jet port eject fluid in different directions.

[0020] Optionally, the fluid guide has a flow channel connected to the fluid injection port, and a flow guide for flow equalization is provided in the flow channel.

[0021] Optionally, the fluid guide is a one-piece molded structure;

[0022] Alternatively, the fluid guide may include a first clamping plate and a second clamping plate, the first clamping plate and the second clamping plate being disposed opposite to each other, and a first preset gap forming the fluid injection port being formed between the first clamping plate and the second clamping plate.

[0023] Optionally, at least one of the first clamping plate and the second clamping plate is provided with a flow guide groove, which is connected to the fluid injection port and the fluid supply device respectively to form the flow guide channel.

[0024] Optionally, the at least one set of electrolyte spraying devices is connected to an electrolyte supply device; the electrolyte spraying device includes: an electrolyte guide having at least one electrolyte spray nozzle, the electrolyte guide being disposed within the electroplating chamber for guiding the electroplating solution to form a liquid flow within the electroplating chamber.

[0025] Optionally, the opening is disposed on the plate-like wall of the electroplating chamber;

[0026] Alternatively, the electroplating apparatus may further include at least one set of liquid-blocking roller assemblies, which are disposed on opposite sides of the electroplating chamber, wherein each set of liquid-blocking roller assemblies forms a wall on one side of the electroplating chamber. Each liquid-blocking roller assembly includes at least two stacked liquid-blocking rollers, and two adjacent liquid-blocking rollers are rotatable relative to each other. When the solar cell passes through two adjacent liquid-blocking rollers, the opening is formed between the two liquid-blocking rollers.

[0027] Optionally, the electroplating apparatus further includes: at least one set of rolling guide components;

[0028] The rolling guide assembly is disposed outside the electroplating cavity, and / or the rolling guide assembly is disposed inside the electroplating cavity.

[0029] Optionally, the rolling guide assembly includes two guide wheels or two guide rollers arranged opposite each other, the two guide wheels or the two guide rollers being disposed on both sides of the plane where the electroplating channel is located, and a second preset gap between the two guide wheels or the two guide rollers for the solar cell to pass through.

[0030] Optionally, the conductive mechanism is disposed outside the electroplating chamber and is electrically connected to the solar cell.

[0031] Optionally, the conductive mechanism includes: a driving mechanism and a conductive clamp;

[0032] The driving mechanism is connected to the conductive clamp to drive the solar cell through the opening into or out of the electroplating channel.

[0033] Alternatively, the drive mechanism may be connected to the conductive clamp and the solar cell respectively, so that the conductive clamp moves synchronously with the solar cell.

[0034] Optionally, the conductive clamp includes: a first conductive clamp and a second conductive clamp;

[0035] The first conductive clamp and the second conductive clamp are sequentially arranged on both sides of the electroplating chamber along the conveying direction of the solar cell. The first conductive clamp and the second conductive clamp are alternately electrically connected to the solar cell so that the solar cell remains electrically connected to the negative terminal of the electroplating power supply during the electroplating process.

[0036] Optionally, the plane containing the electroplating channel is parallel to the horizontal plane, or the plane containing the electroplating channel is perpendicular to the horizontal plane.

[0037] Optionally, when the solar cell moves in a direction parallel to the horizontal plane within the plane where the electroplating channel is located, the solar cell is perpendicular to or parallel to the horizontal plane; when the solar cell moves in a direction perpendicular to the horizontal plane within the plane where the electroplating channel is located, the solar cell is perpendicular to the horizontal plane.

[0038] In this embodiment, an external fluid balancing mechanism is provided outside the electroplating chamber. This external fluid balancing mechanism has at least one set of fluid jetting devices for jetting fluid. The external fluid balancing mechanism jets fluid through the fluid jetting devices so that the force balance position of the part of the solar cell outside the electroplating chamber is located in the plane of the electroplating channel. Therefore, during the electroplating process of the solar cell, when the solar cell enters the electroplating chamber through the opening, the solar cell is already in the plane of the electroplating channel under the action of the fluid jetting device. In this way, when the solar cell enters the electroplating chamber through the opening for electroplating, the solar cell is equivalent to entering the electroplating channel in the electroplating chamber in a suspended state. This can effectively avoid scratching the cavity wall of the electroplating chamber at the opening, thereby reducing or avoiding the risk of scratching the surface of the solar cell, improving the surface quality and yield of the solar cell. Attached Figure Description

[0039] Figure 1 This is a three-dimensional structural schematic diagram of the solar cell electroplating apparatus described in the embodiments of this application;

[0040] Figure 2This is one of the schematic diagrams of the solar cell electroplating apparatus described in the embodiments of this application;

[0041] Figure 3 This is a second schematic diagram of the structure of the solar cell electroplating apparatus described in the embodiments of this application;

[0042] Figure 4 yes Figure 3 A schematic diagram of the solar cell electroplating device from another angle;

[0043] Figure 5 This is the third schematic diagram of the solar cell electroplating apparatus described in the embodiments of this application;

[0044] Figure 6 yes Figure 5 A schematic diagram of the solar cell electroplating device from another angle;

[0045] Figure 7 yes Figure 5 The diagram shows a structural schematic of the solar cell electroplating device from another angle.

[0046] Figure 8 yes Figure 5 The diagram shows the structure of the solar cell electroplating device from another angle.

[0047] Figure 9 This is the fourth schematic diagram of the solar cell electroplating apparatus described in the embodiments of this application;

[0048] Figure 10 yes Figure 9 A schematic diagram of the solar cell electroplating device from another angle;

[0049] Figure 11 yes Figure 9 The diagram shows a structural schematic of the solar cell electroplating device from another angle.

[0050] Figure 12 yes Figure 10 A magnified view of position A in the middle;

[0051] Figure 13 This is a schematic diagram of the structure of a fluid guide according to an embodiment of this application;

[0052] Figure 14 yes Figure 13 The diagram shows a structural schematic of the fluid guide from another angle.

[0053] Figure 15 This is a schematic diagram of another fluid guide component described in an embodiment of this application;

[0054] Figure 16 yes Figure 15The diagram shows a structural schematic of the fluid guide from another angle.

[0055] Figure 17 yes Figure 15 The diagram shows a fluid guide with openings on both sides.

[0056] Figure 18 This is a schematic diagram of the plate-like wall structure described in the embodiments of this application;

[0057] Figure 19 yes Figure 18 A schematic diagram of the structure of the plate-like wall at another angle.

[0058] Explanation of reference numerals in the attached figures:

[0059] 10: Solar cell; 20: Electroplating chamber; 201: Opening; 21: Liquid-blocking roller assembly; 210: Liquid-blocking roller; 211: Plate-shaped wall; 22: Rolling guide assembly; 221: Guide wheel; 30: Electroplating channel; 31: Return channel; 40: Fluid jetting device; 41: Fluid guide; 411: Fluid jetting port; 4111: First sub-jet port; 4112: Second sub-jet port; 412: Flow guiding channel; 413: Inlet; 414: Inlet channel; 415: Clearance notch; 42: Auxiliary support; 50: Anode; 2111: Clearance chamfer; 4121: Diverter block; 4122: Flow equalization block; 2111: Electrolyte injection port; 2112: Flow guide hole; 2113: Liquid replenishment port; 60: Conductive mechanism; 61: Drive mechanism; 62: Conductive clamp; 611: First clamp transmission mechanism; 612: Second clamp transmission mechanism; 621: First conductive electronic clamp; 622: Second conductive electronic clamp. Detailed Implementation

[0060] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0061] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0062] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0063] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0064] The solar cell electroplating apparatus provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0065] The solar cell electroplating apparatus described in this application embodiment can be applied to the electroplating of electrodes for solar cells of any size.

[0066] Reference Figures 1 to 11 The diagram shows various structural schematics of the solar cell electroplating apparatus described in the embodiments of this application.

[0067] In this embodiment, the solar cell electroplating apparatus includes an electroplating chamber 20 for containing electroplating solution. The electroplating chamber 20 has openings 201 on opposite sides for the solar cell 10 to enter and exit. These openings 201 form at least a portion of the electroplating channel 30 for the solar cell 10, and are located within the plane of the electroplating channel 30. The solar cell 10 moves within the plane of the electroplating channel 30 for electroplating. An anode 50, electrically connected to the positive terminal of the electroplating power supply, is provided inside the electroplating chamber 20. A conductive mechanism 60, electrically connected to the negative terminal of the electroplating power supply, is provided outside the electroplating chamber 20. The conductive mechanism 60 is used to electrically connect the solar cell 10. The electroplating apparatus also includes an external fluid balancing mechanism. This external fluid balancing mechanism is located outside the electroplating chamber 20 and has at least one set of fluid jetting devices 40 for jetting fluid. The external fluid balancing mechanism jets fluid through the fluid jetting devices 40 so that the force-balanced position of the portion of the solar cell 10 outside the electroplating chamber 20 is located within the plane of the electroplating channel 30.

[0068] In this embodiment, the electroplating chamber 20 has openings 201 on opposite sides for the solar cell 10 to enter and exit. During electroplating, the solar cell 10 enters the electroplating chamber 20 through one of the openings 201 and exits through the other. Specifically, the size of the opening 201 can be any value within the range of 0.1mm to 3mm along the direction perpendicular to the plane of the electroplating channel 30. Optionally, when the size of the opening 201 is within the range of 0.3mm to 0.8mm, the opening 201 can also have a liquid-blocking function, so that when the solar cell 10 passes through the opening 201, 60% to 80% of the electroplating liquid on the surface of the solar cell 10 can be blocked. It is understood that the size of the opening 201 can be adjusted according to the size and thickness of the solar cell 10 passing through; the above is only a partial illustrative description.

[0069] It should be noted that, in the embodiments of this application, the electroplating apparatus also includes a base, substrate, and bracket for auxiliary support of the electroplating chamber and other components. Those skilled in the art can set these according to actual conditions to achieve the function of the electroplating apparatus of this application, and the embodiments of this application will not elaborate further.

[0070] In this embodiment, the openings 201 on both sides of the electroplating cavity 20 can be considered as part of the electroplating channel 30. The plane containing the electroplating channel 30 can be understood as follows: Figure 2The plane containing the electroplating channel 30 is shown in the diagram. In practical applications, the plane containing the centerline of the electroplating channel 30 and parallel to the plane containing the solar cell 10 can be used as the reference plane for the electroplating channel 30. It should be noted that during the electroplating process, the solar cell 10 moves within the electroplating channel 30 with the reference plane as its reference. When the solar cell 10 is electroplated, it will have a slight offset on both sides of the reference plane, and the solar cell 10 will not collide with the cavity wall of the electroplating chamber 20, nor will it affect the electroplating quality.

[0071] In this embodiment, the conductive mechanism 60 is continuously electrically connected to the solar cell 10 during the electroplating process. In this embodiment, the conductive mechanism 60 is disposed outside the electroplating chamber 20, which effectively avoids the problem of the conductive mechanism 60 being plated during the electroplating process of the solar cell 10, thereby effectively extending the service life of the conductive mechanism 60.

[0072] In this embodiment, the anode 50, which is electrically connected to the positive terminal of the electroplating power supply, can be disposed on both sides or one side of the plane containing the electroplating channel 30. When the anode 50 is disposed on both sides of the plane containing the electroplating channel 30, both sides of the solar cell 10 can be electroplated simultaneously, resulting in higher electroplating efficiency; when the anode 50 is disposed on one side of the plane containing the electroplating channel 30, only one side of the solar cell 10 is electroplated.

[0073] In this embodiment, an external fluid balancing mechanism is located outside the electroplating chamber 20. A fluid jetting device 40 continuously sprays fluid onto the solar cell 10 that is about to enter the electroplating chamber 20. The fluid jetted by the external fluid balancing mechanism through the fluid jetting device 40 serves two purposes: First, it keeps the solar cell 10 in a balanced position within the plane of the electroplating channel 30 under the influence of the fluid. This allows the solar cell 10 to pass through the opening 201 in a suspended state and enter the electroplating chamber 20 for electroplating, effectively avoiding the risk of the solar cell 10 being scratched or damaged and fragmented when passing through the opening 201, thus improving the surface quality and yield of the solar cell 10. Second, the fluid also blows away residual liquid, dust, and impurities from the surface of the solar cell 10, improving the surface cleanliness. This further avoids the risk of impurities on the surface of the solar cell 10 causing hard contact and scratches or fragmentation when passing through the opening 201 due to the small opening size, thus improving the safety of the solar cell 10 when passing through the opening 201.

[0074] In this embodiment, the force balance position of the solar cell 10 outside the electroplating cavity 20 can be understood as follows: the solar cell 10 can float up and down around the reference plane of the electroplating channel 30 without touching the cavity wall of the electroplating cavity 20.

[0075] It should be noted that when the solar cell 10 enters the electroplating channel 30 within the electroplating chamber 20, the electroplating solution connects the electroplating circuit between the anode 50 and the solar cell 10, and the electroplating of the cell begins. In this embodiment, the solar cell 10 can remain in an electroplating state while moving within the plane of the electroplating channel 30 after entering the electroplating chamber 20 through the opening 201, thus effectively improving electroplating efficiency.

[0076] In this embodiment, the electroplating channels 30 formed by the two side openings 201 of the electroplating cavity 20 are first explained. In this embodiment, each side opening 201 can extend at any angle within the plane of the cavity wall of the electroplating cavity 20 within the range of 0 to 360°. Therefore, the plane of the electroplating channels 30 formed by the two side openings 201 can have an angle with the horizontal plane within the range of 0 to 360°. In this embodiment, the plane of the electroplating channels 30 can be parallel to the horizontal plane, that is, the angle between the plane of the electroplating channels 30 and the horizontal plane is 0° (or 180°), or the plane of the electroplating channels 30 can also be perpendicular to the horizontal plane, that is, the angle between the plane of the electroplating channels 30 and the horizontal plane is 90° (or 270°).

[0077] Specifically, when the solar cell 10 moves in a direction parallel to the horizontal plane within the plane of the electroplating channel 30 (which can be understood as...), Figure 2 The solar cell 10 moves from right to left or from left to right, and can be perpendicular or parallel to the horizontal plane. When the solar cell 10 moves perpendicular to the horizontal plane in the plane of the electroplating channel 30, it can be understood that the opening 201 is opened on the upper and lower sides of the electroplating chamber 20, and the solar cell 10 moves from top to bottom or from bottom to top. In other words, when the solar cell 10 is electroplated in the electroplating channel 30, the solar cell 10 can be electroplated in a state parallel to the horizontal plane, or in a state perpendicular to the horizontal plane, or in an inclined state with an angle of any value within the range of 0 to 360° with respect to the horizontal plane.

[0078] It should be noted that when the solar cell 10 moves in a direction parallel to the horizontal plane while perpendicular to it, impurities, debris, or residual liquid on the surface of the solar cell 10 can automatically fall off or drip off under the influence of gravity. This effectively improves the cleanliness of the solar cell surface and enhances the electroplating quality. Furthermore, when the solar cell 10 moves in a direction parallel to the horizontal plane while perpendicular to it, if debris occurs, the debris can sink to the bottom of the electroplating chamber under its own weight, allowing for better debris removal.

[0079] It is understood that when solar energy moves along a direction parallel to the horizontal plane in a state perpendicular to the horizontal plane, the conductive mechanism 60 of the solar cell 10 and the components that provide support for the solar cell 10 also need to be adjusted accordingly. Those skilled in the art can set and adjust them according to the situation, and this application embodiment will not elaborate on this further.

[0080] In the embodiments of this application, specifically using Figure 2 As shown, the solar cell 10 moves in a direction parallel to the horizontal plane. Figure 2 Taking the electroplating process as an example (where electroplating is performed in a direction from left to right or from right to left) and the plane where the electroplating channel 30 is located is parallel to the horizontal plane, the specific structure and principle of this application will be explained and described in detail.

[0081] In this embodiment, the external fluid balancing mechanism may specifically include a first-side fluid balancing mechanism located outside the first side opening in the two side openings 201, and / or a second-side fluid balancing mechanism located outside the second side opening in the two side openings 201. It can be understood that the first side opening and the second side opening in the two side openings 201 can be understood as the openings 201 through which the solar cell 10 passes sequentially during electroplating. Figure 2 The solar cell 10 has two openings (201) on both sides. It enters the electroplating chamber 20 through the first side opening and exits the electroplating chamber 20 through the second side opening. Alternatively, the solar cell 10 can also enter the electroplating chamber 20 through the second side opening and exit the electroplating chamber 20 through the first side opening.

[0082] In this embodiment, the configurations of the first-side fluid balancing mechanism and the second-side fluid balancing mechanism can be the same or different. Specifically, the first-side fluid balancing mechanism and / or the second-side fluid balancing mechanism include at least one set of fluid jetting devices 40. That is, the first-side fluid balancing mechanism may include at least one set of fluid jetting devices 40, and / or the second-side fluid balancing mechanism may also include at least one set of fluid jetting devices 40. In this embodiment, a set of fluid jetting devices 40 is provided at at least one of the two openings 201, which can effectively improve the surface cleanliness of the solar cell 10 and effectively avoid the risk of the solar cell 10 being scratched when passing through the opening 201.

[0083] It is understandable that when fluid jetting devices 40 are provided at both sides of the opening 201, when the solar cell 10 enters the electroplating chamber 20 through the first side opening 201, the fluid jetting device 40 at the first side opening 201 can effectively improve the surface cleanliness of the solar cell 10 and prevent the solar cell 10 from being scratched when passing through the opening 201. When the solar cell 10 passes through the second side opening 201 to the outside of the electroplating chamber 20, the fluid jetting device 40 at the second side opening 201 can quickly blow away the residual electroplating liquid on the surface of the solar cell 10, reducing the risk of electroplating liquid crystallizing on the surface of the solar cell 10. Therefore, when fluid jetting devices 40 are provided at both sides of the opening 201, the electroplating quality of the solar cell 10 can be improved to the greatest extent.

[0084] In this embodiment, the fluid injected by the fluid injection device 40 can be a gas, a liquid, or a gas-liquid mixture. Specifically, the liquid can be an electroplating cleaning solution or water (including but not limited to ordinary tap water or purified water), and the gas can be an inert gas such as nitrogen or compressed air.

[0085] In practical applications, one, two, or more sets of fluid jetting devices 40 can be provided at each side opening 201. When two sets of fluid jetting devices 40 are provided at one side opening 201, the two sets of fluid jetting devices 40 can be used in conjunction. For example, one set of fluid jetting devices 40 can jet a gas, while the other set of fluid jetting devices 40 can jet a liquid. In this way, the liquid jetted by the fluid jetting devices 40 can clean the surface of the battery cells, thereby reducing the cost of the jetted liquid or gas. In this embodiment of the application, the principle of the external fluid balancing mechanism is explained by taking the fluid jetting device 40 jetting a gas as an example.

[0086] In this embodiment, the fluid injected by the fluid jetting device 40 is used to bring the portion of the solar cell 10 outside the electroplating chamber 20 into a force-balanced position, specifically within the plane of the electroplating channel 30. At least a portion of the fluid injected by each set of fluid jetting devices 40 can form a component fluid flowing towards the opening 201, which is the fluid flowing along the plane of the electroplating channel 30. Specifically, when the fluid jetting device 40 encounters the solar cell 10, it will split along the plane of the solar cell 10. In this embodiment, by limiting the direction of the fluid jetting device 40, the fluid forms a component fluid flowing towards the opening 201 after encountering the solar cell 10. This component fluid flowing towards the opening 201 also effectively prevents the electroplating solution in the electroplating chamber 20 from overflowing through the opening 201.

[0087] In this embodiment, the angle between the vector direction of the fluid ejected by at least one set of fluid ejection devices 40 and the direction of movement of the solar cell 10 into the electroplating chamber 20 can vary from 90° to 0°. In practical applications, the component fluid flowing towards the opening 201 after the fluid ejected by the fluid ejection device 40 encounters the solar cell 10 can be considered as the first component fluid, and the component fluids in other directions can be considered as the second component fluid. In this embodiment, the first component fluid is not less than the second component fluid, so that the first component fluid can achieve a better liquid-blocking effect.

[0088] In this embodiment, each group of fluid jetting devices 40 corresponds to a group of fluid jetting devices 40, which may include one fluid jetting device 40, two fluid jetting devices 40, or multiple fluid jetting devices 40. When each group of fluid jetting devices 40 includes one fluid jetting device 40, the fluid jetting device 40 may be disposed on one side of the plane where the electroplating channel 30 is located (e.g., Figure 3 As shown), or in other words, a fluid jetting device 40 can be disposed on either side of the two openings 201. When each group of fluid jetting devices 40 includes two fluid jetting devices 40 (e.g....), Figure 2 As shown, the two fluid jetting devices 40 can be mirror-arranged along the plane of the electroplating channel 30, thereby making the suspension state of the solar cell 10 passing through the plane of the electroplating channel 30 more stable and reliable. When each group of fluid jetting devices 40 includes multiple fluid jetting devices 40, the multiple fluid jetting devices 40 can be arranged sequentially on one side of the plane of the electroplating channel 30 along the extension direction of the opening 201, or arranged on both sides of the plane of the electroplating channel 30. Those skilled in the art can choose the setting according to the situation.

[0089] In this embodiment of the application, regardless of how many sets of fluid jetting devices 40 are provided, at least one set of fluid jetting devices 40 may include: at least two fluid jetting devices 40 mirror-arranged along the plane where the electroplating channel 30 is located, thereby making the suspension state of the solar cell 10 passing through the plane where the electroplating channel 30 is located more stable and reliable.

[0090] In this embodiment, a group of fluid injection devices 40 are connected to a fluid supply device (not shown in the figure). The fluid supply device is used to supply fluid with a preset pressure or flow rate to the fluid injection devices 40. Specifically, the fluid supply device can be understood as an auxiliary configuration device of an external fluid balancing mechanism, including but not limited to water pumps, air pumps, high-pressure air tanks, etc. In this embodiment, one fluid supply device can supply fluid to multiple fluid injection devices 40 via pipelines, diversion valves, etc. Those skilled in the art can configure the device according to actual conditions.

[0091] In this embodiment, the fluid jetting device 40 may specifically include a fluid guide 41 having at least one fluid jet port 411. The fluid guide 41 is used to jet fluid through the fluid jet port 411 onto the solar cell 10 passing through the plane of the electroplating channel 30. Specifically, the fluid jetting device 40 may include one fluid guide 41, two fluid guides 41, or multiple fluid guides 41; one fluid guide 41 may be disposed on one side of the plane of the electroplating channel 30 (e.g., ...). Figure 3 (as shown); the two fluid guides 41 can be symmetrically arranged on both sides of the plane where the electroplating channel 30 is located (e.g. Figure 2 (As shown); Among the multiple fluid guides 41, at least two fluid guides 41 can be symmetrically arranged on both sides of the plane where the electroplating channel 30 is located; it can be understood that when two fluid guides 41 are symmetrically arranged on both sides of the plane where the electroplating channel 30 is located, the fluid injection port 411 of each fluid guide 41 can spray fluid toward the solar cell 10 passing through the plane where the electroplating channel 30 is located, so that the suspension state of the solar cell 10 passing through the plane where the electroplating channel 30 is located can be more stable and reliable.

[0092] It should be noted that, in this embodiment, when the fluid guide 41 is only provided on one side of the plane where the electroplating channel 30 is located, an auxiliary support 42 can also be provided on the other side of the plane where the electroplating channel 30 is located. Specifically, the auxiliary support 42 can be a guide roller, guide wheel 221, etc. Figure 3 and Figure 4 The diagram shows a structure in which a fluid guide 41 is provided on one side of the plane containing the electroplating channel 30, and a guide roller is provided on the other side. The guide roller can support and guide the solar cell 10. In practical applications, the guide roller can rotate in the direction of conveying the solar cell 10.

[0093] Reference Figures 12 to 17 The diagram shows a schematic representation of the structure of the fluid guide 41 described in an embodiment of this application.

[0094] In this embodiment, each fluid guide 41 may have one, two, or more fluid injection ports 411. Specifically, when each fluid guide 41 has one fluid injection port 411, the fluid injection port 411 extends along the extension direction of the opening 201 to make the injection area of ​​the fluid injection port 411 larger, and the fluid injected through the fluid injection port 411 makes it easier for the force balance position of the solar cell 10 outside the electroplating chamber 20 to be located in the plane where the electroplating channel 30 is located; when each fluid guide 41 has two or more fluid injection ports 411, the two or more fluid injection ports 411 may be arranged sequentially along the conveying direction of the solar cell 10 or along the extension direction of the opening 201 to achieve the technical effect of diverting and equalizing the flow of fluid.

[0095] like Figure 13 As shown in Figure 15, in this embodiment of the application, a fluid jet port 411, which can be regarded as a whole from left to right as a fluid guide 41, is used as an example for explanation. In practical applications, multiple fluid jet ports 411 may also be provided at intervals along the extension direction of the opening 201, so that the fluid jetted from the fluid jet port 411 can cover the entire solar cell 10 passing through the opening 201.

[0096] In this embodiment, the direction of the fluid ejected from the fluid jet nozzle 411 can intersect or be parallel to the plane containing the electroplating channel 30, so that the solar cell 10 is in a force-balanced position within the plane containing the electroplating channel 30 under the action of the fluid. When the direction of the fluid ejected from the fluid jet nozzle 411 intersects the plane containing the electroplating channel 30, it can be understood that the angle between the vector direction of the fluid ejected from the fluid jet nozzle 411 and the direction of movement of the solar cell 10 into the electroplating chamber 20 is an acute angle or perpendicular. When the angle between the vector direction of the fluid ejected from the fluid jet nozzle 411 and the direction of movement of the solar cell 10 into the electroplating chamber 20 is an acute angle, a portion of the fluid ejected from the fluid jet nozzle 411 can be directed towards the opening 201, which helps to prevent the electroplating solution in the electroplating chamber 20 from overflowing from the opening 201.

[0097] In this embodiment, when the angle between the vector direction of the fluid ejected from the fluid jet nozzle 411 and the direction of movement of the solar cell 10 into the electroplating chamber 20 is any value within the range of 30° to 75°, 20% to 40% of the electroplating solution can be driven back into the electroplating chamber 20 for continued recycling. In this embodiment, the cooperation between the opening 201 and the fluid jet nozzle 411 can effectively seal the electroplating solution within the electroplating chamber 20.

[0098] In this embodiment, the distance between the fluid jet nozzle 411 and the reference plane of the electroplating channel 30 can be any value within the range of 0.1mm to 3mm. It should be noted that the above distance range is only an example, and the distance between the fluid jet nozzle 411 and the reference plane of the electroplating channel 30 can be adjusted according to the thickness of the solar cell 10. Those skilled in the art can set it arbitrarily according to actual conditions.

[0099] In this embodiment, the fluid guide 41 can be disposed outside the electroplating chamber 20 near the opening 201, and each opening 201 can be provided with one, two, or more fluid guides 41. A return channel 31 is also provided between the fluid guide 41 and the electroplating chamber 20, so that the fluid ejected from the fluid guide 41 through the fluid injection port 411 can be discharged through the return channel 31. Specifically, the return channel 31 can also be part of an electrolyte recovery tank, or the return channel 31 can also be connected to a gas return device, etc.

[0100] like Figure 16 and Figure 17 As shown, in some embodiments of this application, the fluid jet port 411 may specifically include: a first sub-jet port 4111 and a second sub-jet port 4112; the first sub-jet port 4111 and the second sub-jet port 4112 are arranged alternately, with the first sub-jet port 4111 being away from the electroplating chamber 20 and the second sub-jet port 4112 being close to the electroplating chamber 20. In other words, the first sub-jet port 4111 and the second sub-jet port 4112 are arranged alternately along the conveying direction of the solar cell 10, wherein one of the first sub-jet port 4111 and the second sub-jet port 4112 is arranged close to the electroplating chamber 20 and the other is arranged away from the electroplating chamber 20. In this embodiment of the application, by setting the first sub-jet port 4111 and the second sub-jet port 4112, on the one hand, the residual liquid (water, electroplating solution) on the surface of the solar cell can be minimized, and on the other hand, the solar cell 10 can be suspended in the fluid jet port 411 without colliding with the fluid guide 41 at the fluid jet port 411, thereby effectively avoiding the risk of the surface of the solar cell 10 being scratched.

[0101] In other embodiments of this application, there may be multiple first sub-jet ports 4111 and multiple second sub-jet ports 4112. Multiple first sub-jet ports 4111 and multiple second sub-jet ports 4112 are arranged sequentially at intervals along the extension direction of the opening 201. This can be referred to the case where there are multiple jet ports in the above embodiments, and will not be repeated here.

[0102] It should be noted that in this embodiment, the fluid ejected from the first sub-jet port 4111 and the second sub-jet port 4112 can be in the same direction. For example, the fluid ejected from both the first sub-jet port 4111 and the second sub-jet port 4112 can be perpendicular to the plane where the electroplating channel 30 is located, so that the control of the fluid ejected from the first sub-jet port 4111 and the second sub-jet port 4112 is simpler, and the structure of the fluid guide 41 is simpler and easier to process.

[0103] In other embodiments of this application, the directions of the fluid ejected by the first sub-jet port 4111 and the second sub-jet port 4112 may also be different, such as... Figure 16 and Figure 17 As shown, when the first sub-jet port 4111 is far from the electroplating chamber 20 and the second sub-jet port 4112 is close to the electroplating chamber 20, the direction of the vector fluid ejected by the first sub-jet port 4111 can be perpendicular to the plane where the electroplating channel 30 is located, and the direction of the vector fluid ejected by the second sub-jet port 4112 can be at an acute angle to the conveying direction of the solar cell 10 (preferably any value within the range of 30° to 75°). In this way, when the solar cell 10 moves along the direction from the first sub-jet port 4111 to the second sub-jet port 4112, the fluid ejected by the first sub-jet port 4111 can be used to maximize the use of the solar cell 10 to enter the plane where the electroplating channel 30 is located in a suspended state, while the fluid ejected by the second sub-jet port 4112 is mainly used to keep the solar cell 10 in a suspended state on the plane where the electroplating channel 30 is located. In addition, the fluid ejected by the second sub-jet port 4112 can also effectively prevent the electroplating liquid in the electroplating chamber 20 from overflowing through the opening 201.

[0104] like Figure 17 This illustrates the fluid flow direction from the guide channel 412 on the fluid guide 41 to the first sub-jet port 4111 and the second sub-jet port 4112. (See diagram for example.) Figure 17As shown, when the solar cell 10 runs from left to right, the fluid ejected from the first sub-jet port 4111 of the left fluid guide 41, perpendicular to the plane of the electroplating channel 30, is first sprayed. Under the action of the fluid ejected from the first sub-jet port 4111, the force equilibrium position of the part of the solar cell 10 outside the electroplating chamber 20 is located in the plane of the electroplating channel 30. This allows for the initial cleaning of surface impurities and residual liquid from the solar cell 10. Then, as the solar cell 10 continues to run to the right, the fluid ejected from the second sub-jet port 4112 of the left fluid guide 41 is tilted towards the opening 201. This allows for a secondary cleaning of the surface of the solar cell 10 and also seals the electroplating liquid at the opening 201, reducing the overflow of the electroplating liquid from the opening 201. The fluid then passes through the second sub-jet port 4112 of the left fluid guide 41. Afterwards, the solar cell 10 continues to move to the right in a suspended state through the opening 201 and enters the electroplating chamber for electroplating. Simultaneously, the solar cell continues to move to the right until it exits through the right-side opening 201 in a suspended state, and then proceeds to the second sub-jet port 4112 of the right-side fluid guide 41. Since the second sub-jet port 4112 of the right-side fluid guide 41 sprays fluid towards the opening 201, it can, on the one hand, seal the electroplating solution at the opening 201, reducing the overflow of electroplating solution from the opening 201; on the other hand, it can also blow the residual electroplating solution on the surface of the solar cell 10 back into the electroplating chamber, effectively improving the recycling rate of the electroplating solution. Furthermore, the right-side fluid guide... The fluid ejected from the second sub-jet port 4112 of 41 can also ensure that the force balance position of the portion of the solar cell 10 outside the electroplating chamber 20 is located within the plane of the electroplating channel 30. As the solar cell 10 continues to move to the right, passing through the first sub-jet port 4111 of the right-side fluid guide 41, the airflow ejected through the first sub-jet port 4111, perpendicular to the plane of the electroplating channel 30, can further clean the residual electroplating solution on the surface of the solar cell 10, preventing the residual electroplating solution from crystallizing on the surface of the solar cell 10. The solar cell 10 continues to move to the right until the entire solar cell 10 has passed through the right-side fluid guide 41, thus completing one electroplating process for the solar cell 10. It is understood that after one electroplating, the solar cell can re-enter the electroplating chamber from right to left for a second electroplating, a process identical to the first electroplating from left to right, which will not be described further in this embodiment.

[0105] In some optional embodiments of this application, the fluid ejected from the first sub-jet port 4111 has a fluid component that is away from the electroplating chamber 20, which can blow away or clean impurities on the surface of the solar cell 10. The fluid ejected from the second sub-jet port 4112 may have a fluid separation component that is towards the electroplating chamber 20, so that the fluid can also play a role in flow obstruction. It is understood that the direction of the fluid ejected from both the first sub-jet port 4111 and the second sub-jet port 4112 can be limited by those skilled in the art according to the actual situation, and this application embodiment does not limit this.

[0106] Optionally, the first sub-jet port 4111 and the second sub-jet port 4112 can have the same diameter to reduce processing difficulty; or, the diameters of the first sub-jet port 4111 and the second sub-jet port 4112 can be set to be different sizes. For example, the diameter of the second sub-jet port 4112 closer to the electroplating chamber 20 can be larger than the diameter of the first sub-jet port 4111 farther from the electroplating chamber 20, thereby making the suspension state of the solar cell 10 more stable when passing through the opening 201.

[0107] In this embodiment, the fluid guide 41 has a flow channel 412 (or can be understood as a flow cavity) connected to the fluid injection port 411, so as to continuously supply fluid to the fluid injection port 411 through the flow channel 412. In this embodiment, the other end of the flow channel 412 can also be connected to the inlet 413 (e.g., Figures 13 to 17 As shown in the diagram, the inlet 413 can be connected to a fluid supply device via a pipeline, allowing the fluid supply device to provide fluid to the fluid jet nozzle 411 through the inlet 413 and the guide channel 412. In practical applications, the number of inlets 413 can be one, two, or more. It is understood that when the length of the fluid jet nozzle 411 is relatively long, providing two or more inlets 413 can make the fluid jetted from the fluid jet nozzle 411 more uniform.

[0108] like Figure 13 or Figure 15 As shown in the embodiment of this application, a schematic diagram of the structure of the inlet 413, the guide channel 412, and the fluid jet port 411 on the fluid guide member 41 is given when there are two inlets 413.

[0109] like Figure 13As shown, the inlet 413 and the fluid jet 411 can be located on opposite sides of the fluid guide 41. The inlet 413 is connected to the guide channel 412 via the inlet channel 414. The inlet channel 414 can extend perpendicularly to the plane where the fluid jet 411 is located, thereby effectively shortening the guide distance between the inlet 413 and the fluid jet 411. It should be noted that the inlet channel 414 between the inlet 413 and the guide channel 412 can also be curved or can have a 90° bend (e.g., Figure 15 As shown in the figure, this makes the direction of the fluid entering the guide channel 412 through the inlet channel 414 parallel to the plane where the fluid jet 411 is located, so that the fluid can be more evenly distributed in the guide channel 412.

[0110] In some embodiments of this application, a flow guide for uniform flow may be provided in the flow channel 412 and / or at the fluid injection port 411, so that the fluid ejected from the fluid injection port 411 is more uniform, thereby allowing the solar cell 10 to enter the electroplating chamber 20 through the opening 201 in a more stable suspended state. Specifically, the flow guide may include a porous mesh screen, a flow divider, etc.

[0111] In other embodiments of this application, special structures, such as flow divider blocks 4121 and flow guide grooves, can be provided within the flow guide channel 412 to achieve the function of flow equalization. Figure 13 and Figure 15 As shown, multiple flow dividers 4121 are arranged at intervals within the flow guiding channel 412 to guide and equalize the flow. Specifically, the flow dividers can be cylindrical, square, or similar shapes.

[0112] like Figure 12 , Figure 13 and Figure 15 As shown, multiple flow equalization blocks 4122 can also be provided at the fluid injection port 411. These multiple flow equalization blocks 4122 are arranged sequentially at intervals along the extension direction of the fluid injection port 411, with a flow equalization gap formed between adjacent flow equalization blocks. This allows airflow to pass through the flow equalization gap, thus achieving the function of equalizing the airflow ejected from the fluid injection port 411. Specifically, the flow equalization block 4122 can also be triangular, square, circular, etc. In this embodiment, a triangular flow equalization block 4122 is used as an example for illustrative purposes.

[0113] In this embodiment, the fluid guide 41 can be a one-piece molded structure to make the overall strength and structure of the fluid guide 41 more stable. For example, the fluid guide 41 can be processed by injection molding, so that the fluid guide 41 has a backflow channel inside and a fluid injection port 411 on the outside. Since injection molding can process more complex structures and has higher processing accuracy, the flow channel 412 of the fluid guide 41 set by injection molding can be a variety of complex structures such as straight line and curved line, and the dimensional accuracy control of the fluid injection port 411 is better.

[0114] In some other embodiments of this application, the fluid guide 41 can also be configured as a detachable structure. For example, the fluid guide 41 may include a first clamping plate and a second clamping plate, which are disposed opposite to each other, and a first preset gap is formed between the first clamping plate and the second clamping plate to form a fluid injection port 411. In the embodiments of this application, the fluid injection port 411 is formed by setting a first preset gap between the two clamping plates, which has a simple structure and is easy to process. It should be noted that the first clamping plate and the second clamping plate can be connected by bolts or other connecting parts, or by adhesive bonding or other methods.

[0115] In this embodiment, at least one of the first clamping plate and the second clamping plate may be provided with a flow guide groove, which is connected to the fluid injection port 411 and the fluid supply device to form a flow guide channel 412. It should be noted that the fluid guide member 41 is also provided with an inlet 413, and the fluid supply device can be connected to the inlet 413 through a pipeline or the like to continuously supply fluid with a preset pressure and preset flow rate to the fluid injection port 411 through the flow guide channel 412.

[0116] In this embodiment, at least one of the first and second clamping plates may have a flow-dividing protrusion structure (which can be understood as a flow-dividing block) within its flow-guiding channel 412. This protrusion structure can also divert, guide, and equalize the flow. In practical applications, the first and second clamping plates may have symmetrically arranged flow-dividing protrusion structures. The cooperation between these structures simplifies the installation and assembly of the first and second clamping plates and also enables the diverting, guiding, and equalizing of the flow. Specifically, the flow-dividing protrusion structure can be cylindrical, square, triangular, frustum, or other shapes.

[0117] In this embodiment, to allow the solar cell 10 to pass quickly through the fluid injection port 411 and reduce the risk of collision between the solar cell 10 and the fluid guide 41, a clearance notch 415 is provided on the fluid guide 41 near the fluid injection port 411 (e.g., ...). Figure 16 and Figure 17As shown, the clearance notch 415 is increased near the fluid injection port 411 by increasing the clearance dimension of the fluid guide 41. Specifically, the clearance notch 415 can be formed by chamfering on the fluid guide 41. In this embodiment, clearance notches 415 can be provided on both sides of the fluid injection port 411 as needed, so that the risk of collision between the solar cell 10 and the fluid guide 41 can be reduced when it is near or away from the fluid injection port 411, thereby improving the safety of the solar cell 10 when passing through the fluid guide 41.

[0118] In some embodiments of this application, the opening 201 can be disposed on the plate-like wall 211 of the electroplating chamber 20, that is, the opening 201 is formed by creating a slit in the plate-like wall 211 of the electroplating chamber 20 (e.g., Figure 2 , Figure 3 , Figure 9 , Figure 10 As shown in the figure, this simplifies the structure and processing of the electroplating chamber 20 and the opening 201. It should be noted that when the cavity wall of the electroplating chamber 20 is a plate-shaped wall 211, the fluid guide 41 and the cavity wall of the electroplating chamber 20 can be set as an integral structure, so that the fluid injection port 411, the guide channel 412, the return channel 31 and the opening 201 can also be an integral structure, reducing the number of parts in the electroplating device of the solar cell 10, enabling the electroplating device to achieve modular design, facilitating mass production and the assembly and handling of the electroplating device.

[0119] It should be noted that when the opening 201 is formed by creating a slit in the plate-like wall 211, in order to effectively prevent the solar cell 10 from colliding with the plate-like wall 211 when passing through the opening 201 and causing scratches on the surface of the solar cell 10, in this embodiment of the application, a chamfer 2111 (such as a clearance chamfer) is also provided at the opening 201 of the plate-like wall 211. Figure 2 , Figure 3 or Figure 11 As shown, by setting the chamfer 2111, the probability of the solar cell 10 being scratched or broken when passing through the opening 201 can be effectively reduced.

[0120] In other embodiments of this application, the electroplating apparatus further includes at least one set of liquid-blocking roller assemblies 21 (such as...). Figure 5 , Figure 7 , Figure 8As shown, at least one set of liquid-blocking roller assemblies 21 are disposed on opposite sides of the electroplating chamber 20, wherein each set of liquid-blocking roller assemblies 21 forms a wall on one side of the electroplating chamber 20. The liquid-blocking roller assembly 21 includes at least two stacked liquid-blocking rollers 210, and two adjacent liquid-blocking rollers 210 can rotate relative to each other. When the solar cell 10 passes through two adjacent liquid-blocking rollers 210, an opening 201 is formed between the two liquid-blocking rollers 210. That is, a gap for the solar cell 10 to pass through can be formed between the two liquid-blocking rollers 210 to form the openings 201 on both sides of the electroplating chamber 20, which can more effectively reduce the overflow of electroplating liquid at the openings 201. In this embodiment, the outer surface of the liquid-blocking roller 210 can be a hard and smooth material, such as stainless steel or PEEK material, or stainless steel coated with PEEK material, or other hard resin, or it can be a flexible soft material, such as stainless steel or PEEK material coated with silicone, rubber, or other flexible resin. This embodiment does not limit this.

[0121] like Figure 7 As shown, the liquid-blocking roller assembly 21 includes three stacked liquid-blocking rollers 210, wherein an opening 201 for solar cells to pass through is provided between two of the liquid-blocking rollers 210. Of the two liquid-blocking rollers 210, one can serve as the driving roller and the other as the driven roller; the third (another) liquid-blocking roller 210 serves as an auxiliary support. In this embodiment, the combination of the liquid-blocking rollers 210 and the plate-shaped wall 211 can achieve a better liquid-blocking effect and prevent the electroplating solution in the electroplating chamber 20 from overflowing; specifically, the contact surfaces of the plate-shaped wall 211 and the liquid-blocking rollers 210 are mutually matched arc-shaped surfaces.

[0122] It should be noted that the openings 201 on both sides of the electroplating chamber 20 can be formed by a combination of a plate-like wall 211 and a liquid-blocking roller 210. For example... Figures 5 to 8 As shown, the opening 201 on one side of the electroplating chamber 20 is formed by an opening 201 provided on the plate-like wall 211, and the opening 201 on the other side is formed between two adjacent stacked liquid-blocking rollers 210. In practical applications, those skilled in the art can freely combine the above embodiments according to the actual situation, and the embodiments of this application do not limit this.

[0123] In this embodiment, when the solar cell 10 enters or exits the electroplating chamber 20 through the opening 201, a structure or component that can guide and limit the solar cell 10 may be provided. Specifically, the electroplating apparatus may further include: at least one set of rolling guide components 22; the rolling guide components 22 are disposed outside the electroplating chamber 20, and / or, the rolling guide components 22 are disposed inside the electroplating chamber 20. In this embodiment, the rolling guide components 22 may be disposed outside the electroplating chamber 20 near the opening 201, and / or inside the electroplating chamber 20 near the opening 201, to better guide and limit the solar cell 10 passing through the opening 201.

[0124] In this embodiment of the application, a rolling guide assembly 22 (such as...) can also be provided at a position before the solar cell 10 is conveyed to the fluid guide 41. Figure 8 As shown, the rolling guide assembly 22 is used to limit and guide the solar cell 10. It can be understood that the rolling guide assembly 22 can be set at any selectable position during the conveying and electroplating process of the solar cell 10 to achieve a more accurate and stable conveying effect of the solar cell 10.

[0125] It should be noted that the rolling guide component 22 can also be set at any position in the electroplating channel 30 according to the actual situation, which will not be elaborated in this embodiment.

[0126] In this embodiment, the rolling guide assembly 22 may specifically include two guide wheels 221 or two guide rollers arranged opposite each other. The two guide wheels 221 or two guide rollers are disposed on both sides of the plane where the electroplating channel 30 is located, and there is a second preset gap between the two guide wheels 221 or two guide rollers for the solar cell 10 to pass through. In practical applications, the second preset gap may be the same size as the opening 201, or the second preset gap may also be the same size as the electroplating channel 30. Those skilled in the art can set it according to the actual situation, and it is not limited here.

[0127] In this embodiment, when each set of rolling guide components 22 consists of two guide wheels 221, the number of rolling guide components 22 can be one set. The two guide wheels 221 of one set of rolling guide components 22 can be set at the center of the opening 201 to guide the center of the solar cell 10 and prevent the solar cell 10 from tilting during movement. When there are two sets of rolling guide components 22, one set of rolling guide components 22 is set at each end of the opening 201 so that both ends of the solar cell 10 can be guided, and the solar cell 10 can also be effectively prevented from tilting during movement. When there are multiple sets of rolling guide components 22, the multiple sets of rolling guide components 22 can be arranged sequentially at intervals along the extension direction of the opening 201.

[0128] In this embodiment, when each set of rolling guide components 22 consists of two guide rollers, the length of the guide rollers can be matched with the size of the opening 201 / electroplating cavity 20 to provide better guidance for the solar cell 10. In practical applications, the surface of the guide wheel 221 / guide roller can have a flexible film layer to improve the safety performance of the solar cell 10 and reduce scratches on the surface of the solar cell 10.

[0129] like Figure 1 In this embodiment, the conductive mechanism 60 can be a movable conductive mechanism that moves with the solar cell 10, or a fixed conductive mechanism. Specifically, the conductive mechanism 60 may include a driving mechanism 61 and a conductive clamp 62; the driving mechanism 61 is connected to the conductive clamp 62 to drive the solar cell 10 through the opening 201 into or out of the electroplating channel 30; or, the driving mechanism 61 is connected to both the conductive clamp 62 and the solar cell 10, so that the conductive clamp 62 moves synchronously with the solar cell 10. In this embodiment, the driving mechanism 61 can provide driving force to the solar cell 10 and / or the conductive clamp 62, and the conductive clamp 62 mainly serves to conduct electrical connection between the solar cell 10 and the negative terminal of the electroplating power source. In this embodiment, the driving mechanism 61 can provide driving force to the solar cell 10 and the conductive clamp 62 simultaneously, so that the conductive clamp 62 moves synchronously with the solar cell 10, thereby effectively improving the electroplating quality of the solar cell 10 and avoiding the problem that the conductive probe (or conductive brush, conductive bundle, etc.) of the conductive clamp 62 is out of sync with the solar cell 10 during the movement, causing misalignment between the two and thus affecting the electroplating quality.

[0130] In this embodiment, the conductive clamp 62 needs to remain electrically connected to the solar cell 10 throughout the electroplating process. The solar cell 10 enters through one opening 201 of the two openings 201 on either side of the electroplating chamber 20 and exits through the other opening 201. To reduce the design complexity of the conductive clamp 62, it can include a first conductive clamp 621 and a second conductive clamp 622. The first conductive clamp 621 and the second conductive clamp 622 are sequentially arranged on both sides of the electroplating chamber 20 along the conveying direction of the solar cell 10. The first conductive clamp 621 and the second conductive clamp 622 are alternately electrically connected to the solar cell 10 so that the solar cell 10 remains electrically connected to the negative terminal of the electroplating power supply during the electroplating process. In this embodiment, both the first conductive clamp 621 and the second conductive clamp 622 can be positioned close to the opening 201.

[0131] In practical applications, the first conductive electronic clamp 621 and the second conductive electronic clamp 622 can be made into follow-up conductive electronic clamps. During the electroplating process of the solar cell 10, the first conductive electronic clamp 621 can clamp the end of the solar cell 10 away from the electroplating chamber 20 to be electrically connected to the solar cell 10 and move synchronously with the solar cell 10. The other side of the solar cell 10 enters the electroplating channel 30 of the electroplating chamber 20 through the opening 201. The electroplating solution conducts the electrical connection between the solar cell 10 and the anode 50, thereby conducting the entire electroplating circuit. Electroplating begins when the solar cell 10 is located in the electroplating channel 30. As the solar cell 10 moves, the end of the solar cell 10 away from the first conductive electronic clamp 621 can exit the electroplating chamber 20 through the other opening 201. Then, the second conductive electronic clamp 622... The first conductive electronic clamp 621 is disconnected from the solar cell 10 when it is clamped at the end of the solar cell 10 that protrudes from the electroplating chamber 20. The solar cell 10 and the second conductive electronic clamp 622 continue to move synchronously until the solar cell 10 is completely protruding from the opening 201 on the other side. This process is equivalent to completing one electroplating of the solar cell 10. Then, the solar cell 10 after the first electroplating can move in the opposite direction and enter the electroplating channel 30 in the electroplating chamber 20 through the opening 201 again for a second electroplating. The process of the second electroplating in the opposite direction is the same as the first electroplating. The only difference is that the second conductive electronic clamp 622 is first electrically connected to the solar cell 10. It should be noted that the solar cell 10 after one plating can also be conveyed back to the position of the first conductive electronic fixture 621 by a conveying mechanism, repeating the plating process once to perform a second plating; alternatively, multiple solar cell 10 electroplating devices described in this application embodiment can be arranged sequentially along the movement direction of the solar cell 10, so that after the solar cell 10 passes through one electroplating chamber 20, it can enter another electroplating chamber 20 for electroplating. Those skilled in the art can choose and set the multiple electroplating methods for the solar cell 10 according to the actual situation, and this application embodiment does not limit this.

[0132] As can be seen from the above embodiments, during the entire electroplating process, the first conductive electronic clamp 621 and the second conductive electronic clamp 622 can be clamped at both ends of the solar cell 10 respectively, and reciprocate on both sides of the electroplating chamber 20, thereby maintaining a continuous electrical connection with the solar cell 10. Both the first conductive electronic clamp 621 and the second conductive electronic clamp 622 are located outside the electroplating chamber 20, which minimizes contact between the first conductive electronic clamp 621 and the second conductive electronic clamp 622 and the electroplating solution, avoiding plating problems on the conductive probes (or conductive brushes, conductive bundles, etc.) of the first conductive electronic clamp 621 and the second conductive electronic clamp 622. Furthermore, in this embodiment, the fluid jet nozzle 411 of the fluid guide 41 can also reduce the residue of the electroplating solution on the solar cell 10, thereby further reducing the plating problem on the conductive probes at the conductive angle.

[0133] It is understood that the first conductive electronic clamp 621 and the second conductive electronic clamp 622 can both be fixed conductive electronic clamps. For example, the first conductive electronic clamp 621 and the second conductive electronic clamp 622 can both be conductive brush structures or conductive roller structures. The position of the solar cell 10 outside the electroplating chamber 20 can always be in contact with the conductive brush structure or conductive roller structure to achieve real-time electrical connection with the solar cell 10.

[0134] In this embodiment, the drive mechanism 61 may include two independent first clamping transmission mechanisms 611 and second clamping transmission mechanisms 612. The first clamping transmission mechanism 611 drives the movement of the first conductive electronic clamp 621, and the second clamping transmission mechanism 612 drives the movement of the second conductive electronic clamp 622. Alternatively, the drive mechanism may be a single clamping transmission mechanism that drives the first conductive electronic clamp 621 and the second conductive electronic clamp 622 at different time intervals. The drive mechanism 61 may be a linear motion mechanism such as a synchronous belt mechanism, a lead screw and slider mechanism, or a gear and rack mechanism that uses a motor as input power.

[0135] In this embodiment, the electroplating apparatus may further include: an internal fluid balancing mechanism disposed within the electroplating chamber 20, and having at least one set of electrolyte spraying devices (not shown in the figure); the internal fluid balancing mechanism sprays electroplating liquid through the electrolyte spraying devices, so that the force balance position of the solar cell 10 within the electroplating chamber 20 is located within the plane of the electroplating channel 30. At least one set of electrolyte spraying devices is connected to an electrolyte supply device (not shown in the figure); the electrolyte spraying device includes: an electrolyte guide with at least one electrolyte spray nozzle, used to guide the electroplating liquid to form a liquid flow within the electroplating chamber 20. In this embodiment, each set of electrolyte spraying devices may include one, two, or more electrolyte guides. The electrolyte guide may be disposed within the electroplating chamber 20 near the opening 201.

[0136] In this embodiment, the electrolyte supply device can be disposed inside or outside the electroplating chamber 20. The electrolyte supply device can be connected to the electrolyte guide through pipelines or the like to provide a continuous supply of electrolyte to the electrolyte spray port of the electrolyte guide. The electrolyte guide is disposed inside the electroplating chamber 20 and is used to spray electroplating liquid onto the surface of the solar cell 10 inside the electroplating chamber 20 through the electrolyte spray port.

[0137] In this embodiment, the electrolyte supply device can specifically be a water pump, a submersible pump, etc. One electrolyte supply device can supply electrolyte to at least one set of electrolyte injection devices.

[0138] In this embodiment, the internal fluid balancing mechanism can make the state of the solar cell 10 more stable during electroplating in the electroplating chamber 20. On the other hand, under the impact of the liquid flow formed by the electroplating solution, it can accelerate the replenishment and replacement of the electrolyte on the surface of the solar cell 10, so as to improve the quality of the electroplated electrode of the solar cell 10.

[0139] In this embodiment, the structure of the electrolyte guide can be the same as that of the fluid guide 41 in the above embodiments. The only difference is that the fluid in the electrolyte guide is electrolyte, while the fluid in the fluid guide 41 can be gas or liquid. Therefore, in this embodiment, the specific structure and principle of the electrolyte guide can refer to the fluid guide 41 in any of the above embodiments.

[0140] It should be noted that, in the embodiments of this application, when the cavity wall of the electroplating cavity 20 is a plate-shaped wall 211, an electrolyte spray nozzle can also be provided on the plate-shaped wall 211 near the opening 201. In this way, the plate-shaped wall 211 can both block the electroplating cavity 20 and serve as an electrolyte guide, spraying electroplating liquid into the solar cell 10 entering the electroplating cavity 20, so as to accelerate the replacement of the electroplating liquid on the surface of the solar cell 10 and continuously replenish fresh electroplating liquid to the electroplating position of the solar cell 10.

[0141] like Figure 18 and Figure 19 Figure 18 shows a schematic diagram of a plate-like wall structure according to an embodiment of this application. Figure 19As shown, the plate-shaped wall 211 is provided with a guide hole 2112 connecting the electrolyte spray port 2111 and the electrolyte replenishment port 2113. The electrolyte replenishment port 2113 can be connected to the electrolyte supply device through a pipeline. The electrolyte enters the guide hole 2112 through the electrolyte replenishment port 2113 and is sprayed out through the electrolyte spray port 2111. In this embodiment, the electrolyte spray port 2111 can be set at the opening 201 and symmetrically arranged along the electroplating channel 30 at the opening 201. In this way, the electrolyte can be sprayed onto the solar cell 10 passing through the opening 201 through the electrolyte spray port 2111 at the opening 201. This can accelerate the replacement frequency of the electrolyte on the surface of the solar cell 10 and improve the safety of the solar cell 10 when passing through the opening 201, avoiding the risk of surface scratches caused by the solar cell 10 colliding with the wall at the opening 201 when passing through the opening 201.

[0142] like Figure 18 As shown, there are multiple electrolyte injection ports 2111, which are spaced apart along the extension direction of the opening 201. This allows the entire surface of the solar cell 10 to be covered by the multiple electrolyte injection ports 2111, increasing the frequency of electrolyte replacement on the entire surface of the solar cell 10. In practical applications, the number of replenishment ports 2113 can be equal to or less than the number of electrolyte injection ports 2111. Specifically, those skilled in the art can choose the appropriate setting based on the actual situation, and this application embodiment does not limit this.

[0143] In this embodiment, the extension direction of the guide hole 2112 can be set to a curved shape, a straight shape, or an arc shape, depending on the actual situation. In practical applications, the guide hole 2112 connecting the liquid replenishment port 2113 and the electrolyte injection port 2111 is a smooth curved structure, which can reduce the resistance received by the electrolyte.

[0144] It should be noted that, in this embodiment of the application, when fluid guides 41 and guide wheels 221 / guide rollers 210 are provided on both sides of the plane where the electroplating channel 30 is located, the solar cell 10 can move horizontally and quickly between the upper and lower anodes 50 in the electroplating chamber 20, thereby ensuring that the solar cell 10 and the wall of the electroplating chamber 20 are in non-contact or rolling contact. In this way, the risk of the solar cell 10 being scratched or broken during the movement can be effectively avoided.

[0145] In summary, the solar cell electroplating apparatus described in this application has at least the following advantages:

[0146] In this embodiment, an external fluid balancing mechanism is provided outside the electroplating chamber. This external fluid balancing mechanism has at least one set of fluid jetting devices for jetting fluid. The external fluid balancing mechanism jets fluid through the fluid jetting devices so that the force balance position of the part of the solar cell outside the electroplating chamber is located in the plane of the electroplating channel. Therefore, during the electroplating process of the solar cell, when the solar cell enters the electroplating chamber through the opening, the solar cell is already in the plane of the electroplating channel under the action of the fluid jetting device. In this way, when the solar cell enters the electroplating chamber through the opening for electroplating, the solar cell is equivalent to entering the electroplating channel in the electroplating chamber in a suspended state. This can effectively avoid scratching the cavity wall of the electroplating chamber at the opening, thereby reducing or avoiding the risk of scratching the surface of the solar cell, improving the surface quality and yield of the solar cell.

[0147] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A solar cell electroplating apparatus, characterized in that, The solar cell electroplating apparatus is provided with an electroplating chamber for containing electroplating solution. The electroplating chamber has openings on opposite sides for the solar cell to enter and exit the chamber. These openings form at least a portion of the solar cell electroplating channel, and are located within the plane of the electroplating channel. The solar cell moves within the plane of the electroplating channel for electroplating. An anode electrically connected to the positive terminal of the electroplating power supply is provided inside the electroplating chamber. A conductive mechanism electrically connected to the negative terminal of the electroplating power supply is provided outside the electroplating chamber, and this conductive mechanism is used to electrically connect the solar cell. The electroplating apparatus further includes: an external fluid balancing mechanism; The external fluid balancing mechanism is disposed outside the electroplating chamber and has at least one set of fluid jetting devices for jetting fluid; the external fluid balancing mechanism jets fluid through the fluid jetting devices so that the force balance position of the portion of the solar cell outside the electroplating chamber is located in the plane of the electroplating channel. The external fluid balancing mechanism includes a first-side fluid balancing mechanism located outside the first side opening in the two side openings, and a second-side fluid balancing mechanism located outside the second side opening in the two side openings; the first-side fluid balancing mechanism and / or the second-side fluid balancing mechanism includes at least one set of the fluid injection devices.

2. The solar cell electroplating apparatus according to claim 1, characterized in that, At least a portion of the fluid ejected by the set of fluid jetting devices forms a component fluid flowing toward the opening, the component fluid being fluid along the plane of the electroplating channel.

3. The solar cell electroplating apparatus according to claim 1, characterized in that, At least one set of the fluid jetting devices includes at least two fluid jetting devices arranged in a mirror image along the plane containing the electroplating channel.

4. The solar cell electroplating apparatus according to claim 1, characterized in that, The electroplating apparatus further includes an internal fluid balancing mechanism, which is disposed within the electroplating chamber and has at least one set of electrolyte spraying devices. The internal fluid balancing mechanism sprays electroplating liquid through the electrolyte spraying devices so that the force balance position of the solar cell inside the electroplating chamber is located in the plane of the electroplating channel.

5. The solar cell electroplating apparatus according to any one of claims 1-4, characterized in that, The set of fluid injection devices is connected to the fluid supply device; The fluid injection device includes a fluid guide having at least one fluid injection port.

6. The solar cell electroplating apparatus according to claim 5, characterized in that, The fluid guide has a return channel between it and the electroplating chamber.

7. The solar cell electroplating apparatus according to claim 5, characterized in that, The fluid injection port includes: a first sub-injection port and a second sub-injection port; The first sub-jet port and the second sub-jet port are arranged alternately, with the first sub-jet port being away from the electroplating chamber and the second sub-jet port being close to the electroplating chamber.

8. The solar cell electroplating apparatus according to claim 7, characterized in that, The first sub-jet port and the second sub-jet port eject fluid in different directions.

9. The solar cell electroplating apparatus according to claim 5, characterized in that, The fluid guide has a flow channel connected to the fluid injection port, and a flow guide for flow equalization is provided in the flow channel.

10. The solar cell electroplating apparatus according to claim 5, characterized in that, The fluid guide component is a one-piece molded structure; Alternatively, the fluid guide may include a first clamping plate and a second clamping plate, the first clamping plate and the second clamping plate being disposed opposite to each other, and a first preset gap forming the fluid injection port being formed between the first clamping plate and the second clamping plate.

11. The solar cell electroplating apparatus according to claim 10, characterized in that, At least one of the first clamping plate and the second clamping plate is provided with a flow guide groove, which is connected to the fluid injection port and the fluid supply device respectively to form the flow guide channel.

12. The solar cell electroplating apparatus according to claim 4, characterized in that, The at least one set of electrolyte injection devices is connected to the electrolyte supply device; The electrolyte spraying device includes an electrolyte guide having at least one electrolyte spray nozzle, the electrolyte guide being disposed within the electroplating chamber for guiding the electroplating solution to form a liquid flow within the electroplating chamber.

13. The solar cell electroplating apparatus according to claim 5, characterized in that, The opening is located on the plate-like wall of the electroplating chamber; Alternatively, the electroplating apparatus may further include at least one set of liquid-blocking roller assemblies, which are disposed on opposite sides of the electroplating chamber, wherein each set of liquid-blocking roller assemblies forms a wall on one side of the electroplating chamber. Each liquid-blocking roller assembly includes at least two stacked liquid-blocking rollers, and two adjacent liquid-blocking rollers are rotatable relative to each other. When the solar cell passes through two adjacent liquid-blocking rollers, the opening is formed between the two liquid-blocking rollers.

14. The solar cell electroplating apparatus according to any one of claims 1-4, characterized in that, The electroplating apparatus further includes: at least one set of rolling guide components; The rolling guide assembly is disposed outside the electroplating cavity, and / or the rolling guide assembly is disposed inside the electroplating cavity.

15. The solar cell electroplating apparatus according to claim 14, characterized in that, The rolling guide assembly includes two guide wheels or two guide rollers arranged opposite each other, the two guide wheels or the two guide rollers being disposed on both sides of the plane where the electroplating channel is located, and a second preset gap between the two guide wheels or the two guide rollers for the solar cell to pass through.

16. The solar cell electroplating apparatus according to any one of claims 1-4, characterized in that, The conductive mechanism is located outside the electroplating chamber and is electrically connected to the solar cell.

17. The solar cell electroplating apparatus according to claim 16, characterized in that, The conductive mechanism includes: a driving mechanism and a conductive clamp; The driving mechanism is connected to the conductive clamp to drive the solar cell through the opening into or out of the electroplating channel. Alternatively, the drive mechanism may be connected to the conductive clamp and the solar cell respectively, so that the conductive clamp moves synchronously with the solar cell.

18. The solar cell electroplating apparatus according to claim 17, characterized in that, The conductive clamp includes: a first conductive clamp and a second conductive clamp; The first conductive clamp and the second conductive clamp are sequentially arranged on both sides of the electroplating chamber along the conveying direction of the solar cell. The first conductive clamp and the second conductive clamp are alternately electrically connected to the solar cell so that the solar cell remains electrically connected to the negative terminal of the electroplating power supply during the electroplating process.

19. The electroplating apparatus according to any one of claims 1-4, characterized in that, The plane containing the electroplating channel is parallel to the horizontal plane, or the plane containing the electroplating channel is perpendicular to the horizontal plane.

20. The electroplating apparatus according to claim 19, characterized in that, When the solar cell moves in a direction parallel to the horizontal plane within the plane where the electroplating channel is located, the solar cell is perpendicular to or parallel to the horizontal plane; when the solar cell moves in a direction perpendicular to the horizontal plane within the plane where the electroplating channel is located, the solar cell is perpendicular to the horizontal plane.

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