A self-decoupled antenna array based on magnetoelectric dipoles and apparatus

Abstract

This invention discloses a self-decoupling antenna array and device based on a magnetoelectric dipole. The antenna array includes: a first dielectric substrate with two stepped microstrip lines on a first surface; two radiating elements, each composed of two identical magnetoelectric dipole antennas. Each magnetoelectric dipole antenna consists of two rectangular metal patches, three pairs of second metal-plated vias, and a Γ-shaped probe. The Γ-shaped probe includes two third metal-plated vias and a second metal patch. The antenna array is fed into the Γ-shaped probe through the stepped microstrip lines to excite the antenna. This invention achieves excellent decoupling functionality through the characteristics of higher-order electric dipole modes without introducing additional decoupling circuits or components. Simultaneously, the array structure is simple, easy to implement and expand, and has potential application prospects in millimeter-wave multiple-input multiple-output wireless communication systems. This invention can be widely applied in the field of mobile communication antennas.

Description

Technical Field

[0001] This invention relates to the field of mobile communication antennas, and more particularly to a self-decoupling antenna array and device based on a magnetoelectric dipole. Background Technology

[0002] In recent years, to meet the ever-increasing demand for massive data transmission, millimeter-wave (mm-wave) spectrum has become an option for fifth-generation (5G) mobile communication systems. However, the millimeter-wave band suffers from more severe spatial loss and congestion, and the signal-to-noise ratio (SNR) is significantly reduced. Using multiple-input multiple-output (MIMO) technology can leverage spatial diversity to improve the SNR, increasing transmission rates without consuming additional spectrum resources, thereby significantly enhancing communication channel capacity. Therefore, the integration of millimeter-wave and MIMO technologies for 5G communication will inevitably become a future trend. However, when two or more antennas are placed close together, mutual coupling inevitably occurs, degrading the performance of the antennas and even the entire system. Therefore, reducing mutual coupling between millimeter-wave antennas is a very important and meaningful task.

[0003] Over the past decade, researchers have developed various decoupling techniques, the most common of which can be categorized into three main types. The first type involves introducing additional coupling paths to cancel out the original coupling, such as neutralization lines and decoupling surfaces. The second type uses decoupling structures to block the propagation of the coupled field, typically achieved through the use of metamaterials, defective grounding layers, or resonators. The third type utilizes the antenna's inherent characteristics or operating mode to achieve self-decoupling without introducing additional decoupling structures.

[0004] Current research on decoupling technology mainly focuses on patch antennas in the microwave band. An analysis of existing technologies reveals the following: For example, the first existing technical solution introduces a neutralization line to cancel the original coupling through an additional coupling path. This solution integrates multiple decoupling techniques to achieve an isolation of -45dB. However, the applicability of this technology integration is too limited and lacks scalability. The second technical solution proposes achieving good isolation by etching slots on the ground plane. However, this method is only suitable for narrow-bandwidth antennas and cannot cover the entire operating bandwidth for millimeter-wave broadband antennas, while also increasing the antenna's back radiation. The third technical solution utilizes slotted complementary split-ring resonators to achieve an isolation of -35dB. However, due to limitations in manufacturing processes, fabricating such a small and complex decoupling structure in the millimeter-wave band is not easy and may also introduce other problems.

[0005] Magnetoelectric dipole antennas possess advantages such as wide bandwidth, stable gain, and ease of excitation, making them highly suitable candidate antennas for millimeter-wave systems. However, most current decoupling techniques can only achieve narrowband decoupling. Furthermore, although some decoupling methods are effective at microwave frequencies, directly extending these circuits to the millimeter-wave band is not a good approach due to limitations in fabrication technology. To date, there is no research on decoupling magnetoelectric dipole antenna arrays; therefore, researching a simple, wideband millimeter-wave antenna decoupling technique is of great significance. Summary of the Invention

[0006] In order to at least partially solve one of the technical problems existing in the prior art, the purpose of this invention is to provide a self-decoupling antenna array and device based on a magnetoelectric dipole.

[0007] The technical solution adopted in this invention is:

[0008] A self-decoupling antenna array based on a magnetoelectric dipole includes:

[0009] A first dielectric substrate has two stepped microstrip lines on its first surface and a metal ground plane on its second surface. The first dielectric substrate has two first metal-plated through holes, one end of which is connected to the stepped microstrip lines.

[0010] Two radiating elements are composed of two identical magnetoelectric dipole antennas. Each magnetoelectric dipole antenna consists of two rectangular metal patches, three pairs of second metal-plated through holes, and a Γ-shaped probe. The Γ-shaped probe includes two third metal-plated through holes and a second metal patch.

[0011] Two of the aforementioned radiating units are disposed on a second dielectric substrate, the first surface of the second dielectric substrate is connected to the second surface of the first dielectric substrate, and the rectangular metal patch is disposed on the second surface of the second dielectric substrate;

[0012] The three second metal-plated through holes are located within the rectangular metal patch, with one end of each second metal-plated through hole connected to the rectangular metal patch and the other end connected to the metal ground plane.

[0013] The two third metal-plated through holes are located inside the second metal patch. One of the third metal-plated through holes is a blind hole, and one end of the other third metal-plated through hole is connected to the second metal patch, and the other end is connected to the first metal-plated through hole.

[0014] The antenna array is fed into the Γ-shaped probe through the stepped microstrip line to excite the antenna.

[0015] Furthermore, a Γ-shaped probe is used to reduce the overall size of the antenna in the x-direction.

[0016] Furthermore, the antenna input matching and impedance matching levels are optimized using a stepped microstrip line design.

[0017] Furthermore, the antenna array is decoupled by utilizing the 1-λ and 1.5-λ modes of the electric dipole in the magnetoelectric dipole.

[0018] Furthermore, a metal ring is provided at one end of the first metal-plated through hole, and an insulating ring is provided outside the metal ring.

[0019] Furthermore, an antenna radiating element is formed by three pairs of second metal-plated through holes and two rectangular planar metal patches, and the antenna radiating element is symmetrically installed on both sides of the Γ-shaped probe.

[0020] Furthermore, the effective electrical dimension between the antenna radiating element and the Γ-shaped probe is the length of a free-space wavelength at the center frequency.

[0021] Furthermore, the second metal-plated through-hole is positioned near the first side length, which is the side length of the rectangular metal patch closest to the Γ-shaped probe.

[0022] Furthermore, the second dielectric substrate includes two dielectric substrate layers, wherein a first surface of the first dielectric substrate layer is connected to a second surface of the first dielectric substrate, and a second surface of the first dielectric substrate layer is connected to a first surface of the second dielectric substrate layer, and the rectangular metal patch is disposed on the second surface of the second dielectric substrate layer;

[0023] The blind via does not penetrate the first dielectric substrate layer.

[0024] Furthermore, the first dielectric substrate layer and the second dielectric substrate layer are bonded together by an adhesive film.

[0025] Furthermore, the adhesive film is Rogers 4450F adhesive film, and both the first and second dielectric substrate layers are made of Rogers 5880 high-frequency board material.

[0026] Furthermore, the stepped microstrip line includes a first microstrip line and a second microstrip line connected in series, wherein the width of the first microstrip line is greater than the width of the second microstrip line, and one end of the second microstrip line is connected to one end of the first metal-plated through-hole.

[0027] Another technical solution adopted in this invention is:

[0028] A communication device includes a self-decoupling antenna array based on a magnetoelectric dipole as described above.

[0029] The beneficial effects of this invention are: without introducing additional decoupling circuits or decoupling components, this invention achieves good decoupling function through the characteristics of high-order electric dipole mode. At the same time, the array structure is simple, easy to implement and expand, and has potential application prospects in millimeter-wave multiple-input multiple-output wireless communication systems. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following description is provided with accompanying drawings of the relevant technical solutions in the embodiments of the present invention or the prior art. It should be understood that the accompanying drawings described below are only for the purpose of clearly illustrating some embodiments of the technical solutions of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a three-dimensional structural schematic diagram of a self-decoupling antenna array based on a magnetoelectric dipole according to an embodiment of the present invention;

[0032] Figure 2 This is a top view of the upper metal surface in an embodiment of the present invention;

[0033] Figure 3 This is a simulation diagram of the reflection coefficient of the self-decoupling antenna array in an embodiment of the present invention;

[0034] Figure 4 This is a simulation diagram of the gain of the self-decoupling antenna array in an embodiment of the present invention;

[0035] Figure 5 This is the radiation pattern of the first input port at each resonant point in this embodiment of the invention; wherein Figure 5 (a) shows the radiation pattern at 27 GHz. Figure 5 (b) shows the radiation pattern at 30 GHz. Figure 5 (c) shows the radiation pattern at 33 GHz.

[0036] Reference numerals: 11, First dielectric substrate layer; 12, Adhesive film; 13, Second dielectric substrate layer; 4, Metallized ground plane; 5, First dielectric substrate; 61, Rectangular metal patch on the first magnetoelectric dipole antenna; 62, Rectangular metal patch on the second magnetoelectric dipole antenna; 71, A set of second metallized vias on the first magnetoelectric dipole antenna; 72, Another set of second metallized vias on the first magnetoelectric dipole antenna; 73, A set of second metallized vias on the second magnetoelectric dipole antenna; 74, Another set of second metallized vias on the second magnetoelectric dipole antenna; 81, U-shaped probe on the first magnetoelectric dipole antenna; 82, U-shaped probe on the second magnetoelectric dipole antenna; 91, First stepped microstrip line; 92, Second stepped microstrip line. Detailed Implementation

[0037] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. The step numbers in the following embodiments are set only for ease of explanation, and there is no limitation on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0038] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0039] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0040] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0041] Based on existing technical problems, this invention proposes a self-decoupling technique suitable for magnetoelectric dipole antennas and applies it to millimeter-wave communication. By extending the length of the electric dipole to adjust the frequency of higher-order modes, the antenna can operate in 1-λ and 1.5-λ modes. The weak current region formed by the equal amplitude and opposite phase of the coupling current fields of the two modes at the feed location is utilized to improve the isolation of the antenna array. This method can effectively reduce H-plane coupling to -60dB without using any additional decoupling structures.

[0042] This embodiment provides a self-decoupling antenna array based on a magnetoelectric dipole. The antenna array is excited by a Γ-shaped probe fed from the bottom via a 50-ohm stepped microstrip line. The feeding structure is mounted on the lower surface of a bottom dielectric substrate. A metal ground plane is provided on the upper surface of the bottom dielectric substrate. Above the bottom dielectric substrate is a dielectric substrate containing the radiating element. Two metal vias are provided on the bottom dielectric substrate, with one end of each via connected to the stepped microstrip line.

[0043] The dielectric substrate housing the radiating elements consists of three layers. Two radiating elements are designed on two identical thin substrates, with a thin adhesive film bonded between them. Each radiating element comprises an identical magnetoelectric dipole antenna, consisting of two rectangular metal patches, three pairs of metal-plated vias, and a Γ-shaped probe. The three pairs of metal-plated vias are located near the interior corners of the rectangular metal patches, with one end connected to a metal ground plane. The Γ-shaped probe consists of two metal-plated vias and a small patch, which is connected to the stepped microstrip line via the mating of the metal-plated vias.

[0044] As an optional implementation, the through holes used are all metal-plated through holes, and there is a 0.2mm metal ring near the metal through holes. These metal rings will affect the antenna's electromagnetic wave leakage and matching problems.

[0045] As an alternative implementation, an antenna radiating element is formed by three pairs of metal-plated through-holes and two rectangular planar metal patches. The antenna radiating element is symmetrically mounted on both sides of a Γ-shaped probe, with an effective electrical dimension approximately equal to the length of one free-space wavelength at the center frequency. A Γ-shaped probe is used to reduce the overall size of the antenna in the x-direction. A stepped microstrip line design is used to optimize the antenna input matching and impedance matching levels. Decoupling of the antenna array is achieved using the 1-λ and 1.5-λ modes of the electric dipole in a magnetoelectric dipole.

[0046] As an optional implementation, the dielectric substrate of the antenna radiating unit is composed of two layers of Rogers 5880 high-frequency board with a thickness of 0.508mm. In addition, Rogers 4450F adhesive film is added between the two substrates to firmly bond them together.

[0047] As an optional implementation, the material of the entire metal surface is 0.04mm thick copper.

[0048] The following combination Figures 1-5 The structure and performance of the self-decoupling antenna array based on the magnetoelectric dipole are explained in detail.

[0049] Reference Figure 1 and Figure 2This embodiment provides a self-decoupling antenna array based on a magnetoelectric dipole, including a radiating element and a feeding circuit.

[0050] The dielectric substrate containing the radiating unit consists of three layers (11, 12, and 13). The first dielectric substrate layer 11 and the second dielectric substrate layer 13 are two Rogers 5880 dielectric substrates of the same thickness, with a dielectric constant of 2.2, dimensions of 12mm × 21.8mm, and a height of 0.508mm. The intermediate layer 12 is a thin Rogers 4450 dielectric film with a dielectric constant of 4.5 and a height of 0.3mm, which serves to firmly bond the first dielectric substrate layer 11 and the second dielectric substrate layer 13 together.

[0051] The radiating element consists of two identical magnetoelectric dipole antennas. Each magnetoelectric dipole antenna comprises two rectangular metal patches, three pairs of 0.5mm diameter metal-plated through holes, and a Γ-shaped probe. The rectangular metal patches measure 3.8mm × 2.7mm. The through holes are located near the interior corners of the rectangular metal patches, and their bottom surfaces are connected to the metal ground plane.

[0052] The Γ-shaped probe consists of two metal-plated through holes and a small patch. One of the through holes is a blind hole with a diameter of 0.2 mm; the other through hole directly penetrates the first dielectric substrate layer 11 and the second dielectric substrate layer 13 and connects with the through hole on the bottom dielectric substrate. This through hole has a diameter of 0.5 mm.

[0053] In summary, the rectangular metal patch 61, the second metal-plated through-hole 71, the second metal-plated through-hole 72, and the Γ-shaped probe 81 constitute one magnetoelectric dipole antenna; the rectangular metal patch 62, the second metal-plated through-hole 73, the second metal-plated through-hole 74, and the Γ-shaped probe 82 combine to form another magnetoelectric dipole antenna. Figure 1 4 in the figure represents a metallized ground plane, which exists on the lower surface of the second dielectric substrate layer 13 and the upper surface of the first dielectric substrate 5.

[0054] The power supply circuit is printed on a thin Rogers5880 dielectric substrate with a dielectric constant of 2.2 and a height of 0.254 mm. Stepped microstrip lines 91 and 92 are printed on the lower surface of the first dielectric substrate 5. The stepped microstrip lines include two segments, with the first segment having a width of 0.74 mm and the second segment having a width of 0.4 mm.

[0055] The distance d between the two antenna elements is 4.8 mm, which is approximately 0.49 free space wavelengths at the center frequency.

[0056] To further illustrate the excellent performance of the self-decoupling antenna array based on magnetoelectric dipoles of the present invention, this embodiment was modeled and simulated using the electromagnetic simulation software HFSS. Figures 3-5 The simulation results are for this single-layer broadband dual-polarized millimeter-wave patch antenna.

[0057] like Figure 3 As shown, the S-parameter simulation results of this embodiment are presented. The self-decoupling antenna array has a bandwidth of 27.5GHz-35.07GHz with a reflection coefficient less than -10dB, an absolute bandwidth of 7.57GHz, and a relative operating bandwidth greater than 24.2%. It generates two resonant frequencies at 29GHz and 33.5GHz, and these two resonant frequencies work together to produce good broadband performance. Meanwhile, the self-decoupling antenna array has a bandwidth of 27.13GHz-36.46GHz with an isolation of less than -20dB, an absolute bandwidth of 9.33GHz, and a relative operating bandwidth greater than 29.34%, with the highest isolation value approaching 60dB.

[0058] like Figure 4 As shown, the gain simulation results of this embodiment are presented. The highest gain of the antenna is 6.07 dBi, and the gain fluctuation within the impedance bandwidth of 27.5 GHz to 35.07 GHz is less than 1 dBi.

[0059] like Figure 5 As shown, the radiation pattern at each resonant point in this embodiment is presented, wherein... Figure 5 (a) Figure 5 (b) and Figure 5 (c) The radiation analysis diagrams of the first input port at 27 GHz, 30 GHz and 33 GHz are shown in sequence.

[0060] Low cross-polarization and good radiation performance were observed throughout the passband. X-pol represents cross-polarization, while Co-pol represents the dominant polarization.

[0061] In summary, this invention proposes a self-decoupling technique suitable for magnetoelectric dipole antennas and applies it to millimeter-wave communication. By extending the length of the electric dipole to adjust the frequency of higher-order modes, the antenna can operate in 1-λ and 1.5-λ modes. The weak current region formed by the equal amplitude and opposite phase of the coupling current fields at the feed position of the two modes is utilized to improve the isolation of the antenna array. This method does not require additional decoupling circuits or components, does not increase the complexity of the array, and has a simple structure. The array achieves an impedance bandwidth of 24.6% and a decoupling bandwidth of 29.34%, effectively reducing H-plane coupling to -60dB. The antenna also possesses a stable in-band gain of 5.16–6.07dBi.

[0062] This embodiment also provides a communication device, including, for example: Figure 1 The diagram shows a self-decoupling antenna array based on a magnetoelectric dipole.

[0063] The communication device in this embodiment has Figure 1 The self-decoupling antenna array shown has the function of this antenna array, and therefore has corresponding advantages and beneficial effects.

[0064] In the foregoing description of this specification, references to terms such as "one embodiment," "another embodiment," or "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0065] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

[0066] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A self-decoupling antenna array based on a magnetoelectric dipole, characterized in that, include: A first dielectric substrate has two stepped microstrip lines on its first surface and a metal ground plane on its second surface. The first dielectric substrate has two first metal-plated through holes, one end of which is connected to the stepped microstrip lines. Two radiating elements are composed of two identical magnetoelectric dipole antennas. Each magnetoelectric dipole antenna consists of two rectangular metal patches, three pairs of second metal-plated through holes, and a Γ-shaped probe. The Γ-shaped probe includes two third metal-plated through holes and a second metal patch. Two of the aforementioned radiating units are disposed on a second dielectric substrate, the first surface of the second dielectric substrate is connected to the second surface of the first dielectric substrate, and the rectangular metal patch is disposed on the second surface of the second dielectric substrate; The three second metal-plated through holes are located within the rectangular metal patch, with one end of each second metal-plated through hole connected to the rectangular metal patch and the other end connected to the metal ground plane. The two third metal-plated through holes are located inside the second metal patch. One of the third metal-plated through holes is a blind hole, and one end of the other third metal-plated through hole is connected to the second metal patch, and the other end is connected to the first metal-plated through hole. The antenna array is fed into the Γ-shaped probe through the stepped microstrip line to excite the antenna.

2. The self-decoupling antenna array based on a magnetoelectric dipole according to claim 1, characterized in that, A metal ring is provided at one end of the first metal-plated through hole, and an insulating ring is provided outside the metal ring.

3. The self-decoupling antenna array based on a magnetoelectric dipole according to claim 1, characterized in that, The antenna radiating element is formed by three pairs of second metal-plated through holes and two rectangular planar metal patches, and the antenna radiating element is symmetrically installed on both sides of the Γ-shaped probe.

4. A self-decoupling antenna array based on a magnetoelectric dipole according to claim 3, characterized in that, The effective electrical dimension between the antenna radiating element and the Γ-shaped probe is the length of one free-space wavelength at the center frequency.

5. A self-decoupling antenna array based on a magnetoelectric dipole according to claim 3, characterized in that, The second metal-plated through hole is located near the first side length, which is the side length of the rectangular metal patch closest to the Γ-shaped probe.

6. A self-decoupling antenna array based on a magnetoelectric dipole according to claim 1, characterized in that, The second dielectric substrate includes two dielectric substrate layers, wherein a first surface of the first dielectric substrate layer is connected to a second surface of the first dielectric substrate, and a second surface of the first dielectric substrate layer is connected to a first surface of the second dielectric substrate layer, and the rectangular metal patch is disposed on the second surface of the second dielectric substrate layer; The blind via does not penetrate the first dielectric substrate layer.

7. A self-decoupling antenna array based on a magnetoelectric dipole according to claim 6, characterized in that, The first dielectric substrate layer and the second dielectric substrate layer are bonded together by an adhesive film.

8. A self-decoupling antenna array based on a magnetoelectric dipole according to claim 7, characterized in that, The adhesive film is Rogers 4450F adhesive film, and both the first and second dielectric substrate layers are made of Rogers 5880 high-frequency board material.

9. A self-decoupling antenna array based on a magnetoelectric dipole according to claim 1, characterized in that, The stepped microstrip line includes a first microstrip line and a second microstrip line connected in series, wherein the width of the first microstrip line is greater than the width of the second microstrip line, and one end of the second microstrip line is connected to one end of the first metal-plated through-hole.

10. A communication device, characterized in that, Including a self-decoupling antenna array based on a magnetoelectric dipole as described in any one of claims 1-9.

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