Conveying mechanism, resin molding device, and method for manufacturing resin molded product

Abstract

The present application provides a kind of conveying mechanism, resin forming device and the manufacturing method of resin forming product, which can cope with the change of the thickness (height) of useless resin, can improve versatility.The conveying mechanism includes: a product holding part, holding resin forming product;Resin holding part, holding useless resin;And lifting support part, the resin holding part is supported in a manner that can be relatively raised and lowered relative to the product holding part.

Description

Technical Field

[0001] This invention relates to a conveying mechanism, a resin molding apparatus, and a method for manufacturing resin molded articles. Background Technology

[0002] Patent Document 1 discloses a technology involving a conveying mechanism for removing a resin-molded workpiece and waste resin (residue) from a mold. The conveying mechanism includes a workpiece holding section for holding the workpiece and a resin holding section for holding the waste resin. The conveying mechanism can hold the outer peripheral end of the workpiece by means of chuck jaws provided in the workpiece holding section, and can adsorb and hold the waste resin by means of adsorption pads provided in the resin holding section. The conveying mechanism can remove the workpiece and waste resin by retracting out of the mold while holding the workpiece and waste resin.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-26088 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] Here, generally speaking, the thickness (height) of the useless resin generated during molding will vary depending on the shape of the resin molded article. In the conveying mechanism disclosed in Patent Document 1, if the thickness of the useless resin changes, the useless resin cannot be properly held by the resin holding part, so the resin holding part or the conveying mechanism itself must be replaced to deal with it, thus there is room for improvement in the aspect of low versatility of the conveying mechanism.

[0008] The present invention was made in view of the above-described situation, and the problem to be solved is to provide a conveying mechanism, a resin molding apparatus and a method for manufacturing resin molded articles, which can cope with changes in the thickness (height) of useless resin and can improve versatility.

[0009] Technical means to solve the problem

[0010] The problem to be solved by the present invention is as described above. In order to solve the problem, the conveying mechanism of the present invention includes: a molded article holding part for holding a resin molded article; a resin holding part for holding useless resin; and a lifting support part for supporting the resin holding part in a manner that allows it to be lifted up and down relative to the molded article holding part.

[0011] In addition, the resin molding apparatus of the present invention includes: a molding die for obtaining the resin molded article by resin molding the object to be molded; and the conveying mechanism for conveying the resin molded article after resin molding by the molding die.

[0012] Furthermore, the method for manufacturing resin molded articles of the present invention uses the resin molding apparatus to manufacture resin molded articles.

[0013] The effects of the invention

[0014] According to the present invention, changes in the thickness (height) of the useless resin can be accommodated, thereby improving versatility. Attached Figure Description

[0015] Figure 1 This is a plan view showing the overall structure of the resin molding apparatus according to the first embodiment.

[0016] Figure 2 This is a flowchart illustrating a method for manufacturing a resin molded article according to the first embodiment.

[0017] Figure 3 This is a front sectional view showing the forming mold and lead frame.

[0018] Figure 4 This is a front sectional view showing the lower mold, the resin-sealed lead frame, and the unloading machine.

[0019] Figure 5 This is a partial sectional view of the side of the unloading machine (especially the resin holding part and the lifting support part).

[0020] Figure 6 This is a front sectional view of the unloading machine (especially the resin holding part and the lifting support part).

[0021] Figure 7 This is a diagram illustrating the process of moving the goods out.

[0022] Figure 8 This is a front cross-sectional view showing the resin holding part moving upwards.

[0023] Figure 9 This is a front sectional view of the unloading machine according to the second embodiment.

[0024] Figure 10 This is a front sectional view of the unloading machine according to the third embodiment.

[0025] Explanation of symbols

[0026] 1: Resin molding device

[0027] 210: Forming mold

[0028] 310: Uninstaller

[0029] 313: Resin holding section

[0030] 313a: Resin adsorption tube section

[0031] 313b: Resin Absorbent Pad

[0032] 314: Lifting Support Unit

[0033] 314b: Retractor

[0034] 314c: Guide axis

[0035] 314d: Return spring

[0036] 314e: Adjustment Department

[0037] 315: Molded part holding section

[0038] 316: Pressing part Detailed Implementation

[0039] The directions indicated by arrows U, D, L, R, F, and B in the diagram will be defined as up, down, left, right, forward, and backward, respectively.

[0040] First, use Figure 1 The structure of the resin molding apparatus 1 according to the first embodiment will be described. The resin molding apparatus 1 manufactures resin molded articles by sealing electronic components such as semiconductor chips with resin. In particular, in this embodiment, a resin molding apparatus 1 that uses the transfer molding method to perform resin molding is exemplified.

[0041] The resin molding apparatus 1 includes a supply module 100, a resin molding module 200, and a transfer module 300 as constituent components. Each constituent component is detachable and replaceable relative to the other constituent components.

[0042] The supply module 100 supplies lead frames 10 and resin sheets T to the resin molding module 200. The lead frame 10 is a type of substrate on which electronic components are mounted. Furthermore, while the lead frame 10 is exemplified in this embodiment, various other substrates (glass epoxy substrates, ceramic substrates, resin substrates, metal substrates, etc.) can be used in addition to the lead frame 100. The supply module 100 mainly includes a frame delivery unit 110, a frame supply unit 120, a resin delivery unit 130, a resin supply unit 140, a loader 150, and a control unit 160.

[0043] The frame delivery unit 110 delivers the unsealed lead frame 10, housed in an in-magazine unit (not shown), to the frame supply unit 120. The frame supply unit 120 receives the lead frame 10 from the frame delivery unit 110, arranges the received lead frame 10 appropriately, and transfers it to the loader 150.

[0044] The resin delivery unit 130 receives resin pieces T from the storage container (not shown) and delivers the resin pieces T to the resin supply unit 140. The resin supply unit 140 receives the resin pieces T from the resin delivery unit 130, arranges the received resin pieces T appropriately, and transfers them to the loader 150.

[0045] The loader 150 transports the lead frame 10 and resin sheet T received from the frame supply unit 120 and the resin supply unit 140 to the resin molding module 200.

[0046] The control unit 160 controls the operation of each module of the resin molding apparatus 1. The control unit 160 controls the operation of the supply module 100, the resin molding module 200, and the transfer module 300. In addition, the control unit 160 can be used to arbitrarily change (adjust) the operation of each module.

[0047] Furthermore, in this embodiment, an example is shown where the control unit 160 is provided in the supply module 100, but the control unit 160 may also be provided in other modules. Additionally, multiple control units 160 may be provided. For example, a control unit 160 may be provided for each module or each device, so that the operations of each module, etc., are linked together and controlled individually.

[0048] The resin molding module 200 seals the electronic components mounted on the lead frame 10 with resin. In this embodiment, two resin molding modules 200 are arranged in a row. By using two resin molding modules 200 to seal the lead frame 10 with resin in parallel, the manufacturing efficiency of the resin molded product can be improved. The resin molding module 200 mainly includes a molding die 210 and a mold closing mechanism (not shown).

[0049] The molding die 210 uses molten resin material to seal the electronic components mounted on the lead frame 10. The molding die 210 includes a pair of molds, namely an upper mold 220 and a lower mold 230 (see reference). Figure 3 (etc.). A heating element such as a heater is provided in the forming mold 210 (not shown).

[0050] The mold closing mechanism (not shown) closes or opens the forming mold 210 (upper mold 220 and lower mold 230) by moving the lower mold 230 up and down. Furthermore, for convenience, a diagram of the mold closing mechanism is omitted.

[0051] The unloading module 300 receives the resin-sealed lead frame 10 from the resin molding module 200 and unloads it. The unloading module 300 mainly includes an unloader 310 and a substrate receiving section 320.

[0052] The unloading machine 310 holds the resin-sealed lead frame 10 and moves it out toward the substrate receiving portion 320. Furthermore, the unloading machine 310 is one embodiment of the conveying mechanism of the present invention. The substrate receiving portion 320 receives the resin-sealed lead frame 10.

[0053] Next, use Figure 1 and Figure 2 An overview of the operation of the resin molding apparatus 1 configured as described above (a method for manufacturing resin molded articles using the resin molding apparatus 1) will be provided.

[0054] The method for manufacturing resin molded articles according to this embodiment mainly includes a loading process S10, a resin molding process S20, and a loading process S30.

[0055] The loading process S10 is the process of loading the lead frame 10 and the resin sheet T into the resin molding module 200.

[0056] In the loading process S10, the frame delivery unit 110 delivers the lead frame 10 housed in the box unit (not shown) to the frame supply unit 120. The frame supply unit 120 arranges the received lead frames 10 appropriately and transfers them to the loader 150.

[0057] Additionally, the resin delivery unit 130 delivers the resin flakes T received from the storage container (not shown) to the resin supply unit 140. The resin supply unit 140 then transfers the required number of the received resin flakes T to the loader 150.

[0058] The loader 150 transports the received lead frame 10 and resin sheet T to the molding die 210 of the resin molding module 200. After the lead frame 10 and resin sheet T are transported to the molding die 210, they are transferred from the loading process S10 to the resin molding process S20.

[0059] The resin molding process S20 is a process of sealing the electronic components mounted on the lead frame 10 with resin.

[0060] In the resin molding process S20, the mold closing mechanism (not shown) closes the molding mold 210. Then, the resin flakes T are heated and melted using the heating section (not shown) of the molding mold 210, and the resulting flowable resin is used to seal the lead frame 10. After the lead frame 10 is sealed with resin, it is transferred from the resin molding process S20 to the unloading process S30.

[0061] The removal process S30 is the process of receiving the resin-sealed lead frame 10 (resin molded article) from the resin molding module 200 and removing it.

[0062] In the unloading process S30, the mold closing mechanism (not shown) opens the molding mold 210. Then, the resin-sealed lead frame 10 is demolded. Afterward, the unloading machine 310 removes the lead frame 10 from the molding mold 210 and houses it in the substrate receiving portion 320 of the unloading module 300. At this time, the useless parts of the resin-molded lead frame 10 (the waste material 10b, the runner 10c, etc., described later) are appropriately removed. In this way, the resin-sealed lead frame 10 (resin molded article) is manufactured.

[0063] Next, use Figures 3 to 6 The structure related to the unloading process S30 in the resin molding apparatus 1 will be described in more detail. Specifically, the structure of the molding die 210 (upper die 220 and lower die 230) and the unloading machine 310 will be described. Furthermore, Figure 3 The upper mold 220 and lower mold 230, as well as the lead frame 10 before resin sealing, are shown. Additionally, Figure 4 The lower mold 230, the resin-sealed lead frame 10, and the unloading machine 310 are shown. Furthermore, this embodiment illustrates (illustrated) the general outlines of the components described below; the specific shape, arrangement, number, etc., of each component are not limited. Additionally, electronic components are connected to the lead frame 10 before resin sealing, but... Figure 3 Abbreviated representation.

[0064] Figure 3 The upper mold 220 shown mainly includes the upper mold body 221.

[0065] The upper mold body 221 is a component that forms the main part of the upper mold 220. The upper mold body 221 is formed with suitable upper and lower thicknesses. The upper mold body 221 is fixed to a suitable support member (not shown). A mold cavity 221a, a residual material portion 221b, and a sprue portion 221c are formed on the lower surface of the upper mold body 221.

[0066] The mold cavity 221a is a recess for supplying resin material and for resin molding. The mold cavity 221a is formed at a position facing the lead frame 10 placed on the lower mold 230 (described later) (a position where electronic components can be resin sealed). The mold cavity 221a is formed with a suitable shape corresponding to the product (resin molded article).

[0067] The residual material portion 221b is a recess formed at a position facing the groove section 232 of the lower mold 230, which will be described later. In this embodiment, as... Figure 3 As shown, a residual material portion 221b is formed in the center of the upper mold body 221, and mold cavities 221a are formed on the left and right sides of the residual material portion 221b.

[0068] The sprue section 221c is a recess that connects the residual material section 221b to the mold cavity 221a. The depth of the sprue section 221c is shallower than that of the residual material section 221b.

[0069] The lower mold 230 mainly includes the lower mold body 231, the groove block 232, and the ejector pin 233.

[0070] The lower mold body 231 is a component that forms the main part of the lower mold 230. The lower mold body 231 is formed to have suitable upper and lower thicknesses. The lead frame 10, which is moved in during the moving process S10, is placed on the upper surface of the lower mold body 231.

[0071] The groove block 232 is a component that forms a groove 232a, which receives a resin sheet T supplied from the supply module 100. The groove block 232 is formed to have a suitable height. A groove 232a is formed in the groove block 232 with an opening on its upper surface. Multiple grooves 232a are formed at suitable intervals (not shown). In the resin molding process S20, the resin sheet T received in the groove 232a is ejected from the upper end of the groove 232a through a plunger (not shown) and resin molding is performed.

[0072] Figure 4 The ejector pin 233 shown is a component used to demold the formed lead frame 10 from the lower mold 230. The ejector pin 233 is formed in a generally cylindrical shape. The ejector pin 233 is arranged with its axis pointing in the vertical direction. The ejector pin 233 is arranged to be inserted into a through hole (not shown) formed in the lower mold body 231. The ejector pin 233 is configured to be able to move up and down relative to the lower mold body 231. Specifically, the ejector pin 233 protrudes from the upper surface of the lower mold body 231 as the lower mold body 231 descends.

[0073] Figure 4 The unloading machine 310 shown mainly includes an unloading machine body 311, a clamp 312, a molded article holding part 315, a resin holding part 313, and a lifting support part 314 (see reference). Figure 5 and Figure 6 ).

[0074] The unloading machine body 311 is a component that forms the main part of the unloading machine 310. The unloading machine body 311 is formed with a suitable vertical thickness. The unloading machine body 311 can be moved in the horizontal direction and the vertical direction (vertical direction) by a suitable moving mechanism.

[0075] The clamp 312 holds the lead frame 10. The clamp 312 is disposed on the unloader body 311. The clamp 312 is formed in a roughly L-shape when viewed from the front. More specifically, the clamp 312 is formed such that its lower end extends inward (towards the center of the unloader body 311). The upper end of the clamp 312 is rotatably connected relative to the unloader body 311. The clamp 312 is rotated by a driving force from a drive source (e.g., a motor, cylinder, etc.) not shown.

[0076] Figures 4 to 6 The resin holding section 313 shown is a portion that holds the resin material used in resin molding that is not needed in the molded product (unnecessary resin). More specifically, the resin holding section 313 is a portion that holds the residue 10b described later. Furthermore, in Figure 4 Detailed illustrations of the structure of the resin holding part 313 and the lifting support part 314 (described later) are omitted in the text. Figure 5 and Figure 6 As shown, the resin holding part 313 mainly includes a resin adsorption tube part 313a, a resin adsorption pad 313b, and a resin adsorption piping block 313c.

[0077] The resin adsorption tube 313a is a hollow cylindrical component. The resin adsorption tube 313a is arranged with its axial direction pointing upwards and downwards. The resin adsorption tube 313a is inserted into a through hole 311a that extends vertically through the unloading machine body 311. The lower end of the resin adsorption tube 313a is configured to protrude downwards from the lower surface of the unloading machine body 311. Furthermore, the resin adsorption tube 313a is one embodiment of the pad mounting portion of the present invention.

[0078] The resin adsorption pad 313b is the portion that contacts the unwanted resin. The resin adsorption pad 313b is mounted on the resin adsorption tube 313a by being fixed to the lower end of the tube. The resin adsorption pad 313b is formed from an elastic raw material such as rubber. The resin adsorption pad 313b can achieve close contact with the unwanted resin by slightly flexing when in contact with it. Furthermore, the resin adsorption pad 313b is one embodiment of the adsorption pad of the present invention.

[0079] Multiple resin adsorption tubes 313a and resin adsorption pads 313b are provided at positions described later where they can adsorb residual material 10b. In this embodiment, as shown... Figure 5 As shown, multiple resin adsorption tubes 313a and resin adsorption pads 313b are arranged in a front-to-back configuration. The number of resin adsorption tubes 313a and resin adsorption pads 313b can be set according to the number of residues 10b.

[0080] The resin adsorption piping block 313c supports the resin adsorption tubes 313a. The resin adsorption piping block 313c is formed in a generally rectangular parallelepiped shape extending front to back. A flow path 313d for adsorbing air and removing unwanted resin is formed in the resin adsorption piping block 313c. The flow path 313d is connected to a suction device (not shown) such as a vacuum pump. The resin adsorption piping block 313c is positioned on the upper side of the unloading machine body 311. The upper ends of each resin adsorption tube 313a are fixed to the resin adsorption piping block 313c. The hollow portion of each resin adsorption tube 313a is connected to the flow path 313d of the resin adsorption piping block 313c.

[0081] The lifting support 314 is a part that supports the resin holding part 313 in a way that allows the resin holding part 313 to move up and down. The lifting support 314 mainly includes a bushing 314a, a return plate 314b, a guide shaft 314c, and a return spring 314d.

[0082] The bushing 314a serves as a guide for the resin adsorption tube 313a. The bushing 314a is cylindrical. The bushing 314a is fixed to the through hole 311a of the unloading machine body 311 with its axis pointing vertically. The resin adsorption tube 313a is inserted into the bushing 314a. The outer circumferential surface of the resin adsorption tube 313a is in contact with the inner circumferential surface of the bushing 314a, allowing it to slide vertically relative to the inner circumferential surface. Therefore, the bushing 314a prevents the resin adsorption tube 313a from moving horizontally and guides it by moving it vertically.

[0083] The return plate 314b is a portion fixed to the resin holding section 313. The return plate 314b is disposed on the upper side of the unloading machine body 311. The return plate 314b is formed by adapting the plate-shaped member to bend. Specifically, the return plate 314b is formed such that the left and right central portions of the horizontally arranged plate-shaped member protrude upwards. The left and right central portions of the return plate 314b are fixed to the upper surface of the resin adsorption piping block 313c. Thus, the return plate 314b is configured to span the resin adsorption piping block 313c from left to right. The return plate 314b is respectively disposed at the front and rear ends of the resin adsorption piping block 313c. The return plate 314b can be raised and lowered integrally with the resin holding section 313. Furthermore, the return plate 314b is one embodiment of the lifting section of the present invention.

[0084] The guide shaft 314c guides the return plate 314b to move up and down, and defines the range of movement of the return plate 314b. The guide shaft 314c is configured to extend vertically through both ends of the return plate 314b. The lower end of the guide shaft 314c is fixed to the upper surface of the unloader body 311. Thus, the guide shaft 314c prevents the return plate 314b from moving horizontally and guides it to move up and down. Furthermore, a head with a larger diameter than other parts is formed at the upper end of the guide shaft 314c. This head restricts the upward movement of the return plate 314b. Therefore, the return plate 314b can move up and down within the range between the upper surface of the unloader body 311 and the head of the guide shaft 314c. Moreover, the guide shaft 314c is one embodiment of the movable range defining part of the present invention.

[0085] The return spring 314d applies a downward force to the return plate 314b. The return spring 314d is formed of a compression coil spring. The return spring 314d is inserted into the guide shaft 314c and positioned between the head of the return plate 314b and the head of the guide shaft 314c. Thus, the return spring 314d can always apply a downward force to the return plate 314b. Furthermore, the return spring 314d is one embodiment of the applying part of the present invention.

[0086] Figure 4 The molded article holding portion 315 shown is the portion that holds the resin material used in resin molding that becomes the resin molded article. More specifically, the molded article holding portion 315 is the portion that holds the sealing portion 10a, which will be described later. The molded article holding portion 315 mainly includes a molded article adsorption tube portion 315a and a molded article adsorption pad 315b.

[0087] The adsorption tube section 315a is a hollow cylindrical component. The adsorption tube section 315a is configured to extend downwards from the lower surface of the unloading machine body 311. The upper end of the adsorption tube section 315a is fixed to the unloading machine body 311. The adsorption tube section 315a is connected to a suction device (not shown) such as a vacuum pump via an air flow path formed in the unloading machine body 311.

[0088] The molded article adsorption pad 315b is the part that comes into contact with the resin. The molded article adsorption pad 315b is fixed to the lower end of the molded article adsorption tube 315a. The molded article adsorption pad 315b is formed of an elastic raw material such as rubber.

[0089] In the unloading machine 310 configured in this way, the resin holding part 313 is supported so that it can move up and down relative to the unloading machine body 311 or the molded article holding part 315.

[0090] Next, use Figure 3and Figure 4 The resin-sealed lead frame 10 will be described.

[0091] If the molten resin material is injected from the groove 232a in the resin molding process S20, the resin material passes through the upper mold 220 (refer to...). Figure 3 The residual material 221b and the sprue 221c are supplied to the mold cavity 221a. Thus, as Figure 4 As shown, resin with shapes corresponding to the residual material portion 221b, the sprue portion 221c, and the mold cavity 221a of the upper mold 220 is formed on the upper surface of the lead frame 10. Hereinafter, the resins formed in the mold cavity 221a, the residual material portion 221b, and the sprue portion 221c will be referred to as the sealing portion 10a, the residual material 10b, and the sprue 10c, respectively.

[0092] The sealing part 10a, formed in the mold cavity 221a, is the part that seals the electronic component mounted on the lead frame 10 with resin. The sealing part 10a and the lead frame 10 are the parts that become the product (resin molded article). On the other hand, the scrap 10b and the sprue 10c are parts formed for ease of manufacturing and are not needed as part of the product (waste resin). Thus, in the resin molding process S20, not only is the sealing part 10a, which is needed as part of the product, formed, but also the waste resin (scrape 10b and sprue 10c) is formed. In the unloading process S30, not only the resin molded article (sealing part 10a and lead frame 10), which is needed as part of the product, but also the waste resin needs to be unloaded from the molding mold 210.

[0093] Next, use Figure 7 and Figure 8 The process of removing the resin-sealed lead frame 10 from the forming mold 210 in the removal process S30 is described in detail. Furthermore, in... Figure 7 For convenience, the symbols for each component have been omitted.

[0094] In the removal process S30, firstly, as... Figure 7 As shown in (a), the lower mold body 231 is lowered by a predetermined amount. Simultaneously, the ejector pin 233 moves upward relative to the lower mold body 231, with its upper end protruding upward beyond the upper surface of the lower mold body 231. Thus, by causing the ejector pin 233 to protrude from the lower mold body 231, the lead frame 10, placed on the upper surface of the lower mold body 231, can be pushed upward from below, causing the lead frame 10 to rise from the lower mold body 231 (demolding). This creates a gap between the lead frame 10 and the upper surface of the lower mold body 231.

[0095] Next, as Figure 7 As shown in (b), the unloader 310 is moved above the lower mold 230 and lowered to a predetermined position. Specifically, as Figure 7 As shown in (c), the unloader 310 is lowered to the position where the resin holding part 313 and the molded article holding part 315 are in contact with the residual material 10b and the sealing part 10a, respectively.

[0096] Here, the resin holding part 313 is configured to appropriately absorb residual material 10b by moving up and down relative to the unloading machine body 311 and the molded article holding part 315. The operation of the resin holding part 313 will be described in detail below.

[0097] like Figure 8 As shown, when the unloader 310 descends and the resin holding part 313 comes into contact with the residue 10b, the resin holding part 313 is pushed upward by the residue 10b. As a result, the resin holding part 313 moves upward along the bushing 314a. Additionally, the return plate 314b, fixed to the resin holding part 313, also moves upward along the guide shaft 314c while causing the return spring 314d to contract.

[0098] Thus, the resin holding section 313 is not fixed relative to the unloading machine body 311, but is supported so that it can move up and down. With this structure, even if the thickness (height) of the residue 10b changes, the resin holding section 313 can move up and down according to the height of the residue 10b, thus appropriately adsorbing the residue 10b. Here, by using a suction device such as a vacuum pump (not shown), vacuum suction is performed via the resin adsorption piping section 313c to adsorb the residue 10b.

[0099] For example, even if the thickness of the residue 10b is designed to be different depending on the type of resin molded product, the residue 10b can be properly adsorbed without changing the structure of the unloading machine 310. Furthermore, when using a plunger (not shown) to push the residue 10b upwards to demold it, the resin holding part 313 can also move upwards as the residue 10b rises, thus appropriately adsorbing the residue 10b. Therefore, by allowing the resin holding part 313 to move up and down, the unloading machine 310 of this embodiment can accommodate changes in the thickness (height) or movement (rising) of the residue 10b, improving its versatility.

[0100] In the removal process S30, when the resin holding part 313 and the molded article holding part 315 are in contact with the residual material 10b and the sealing part 10a respectively in this manner (see reference) Figure 7 (c) causes the suction device (not shown) to operate, and the residual material 10b and the sealing part 10a are respectively adsorbed through the resin holding part 313 and the molded article holding part 315.

[0101] Next, as Figure 7As shown in (c), the lower end of the clamp 312 is rotated inward. This inserts the lower end of the clamp 312 into the gap between the lead frame 10 and the upper surface of the lower mold body 231. Thus, the unloading machine 310 uses the resin holding part 313 and the molded article holding part 315 to hold the resin-sealed lead frame 10, and uses the clamp 312 to support it from below, thereby retaining the lead frame 10.

[0102] Next, as Figure 7 As shown in (d), by raising the unloading machine 310, the resin-sealed lead frame 10 (lead frame 10, sealing part 10a, residual material 10b, and sprue 10c) can be lifted. The unloading machine 310 is then moved to remove the resin-sealed lead frame 10 from the molding mold 210. Afterwards, the unloading machine 310 is moved to the removal module 300, where the unwanted resin (residual material 10b and sprue 10c) is removed, and the lead frame 10 is housed in the substrate housing part 320 (see reference). Figure 1 Thus, the unloading process S30 is completed.

[0103] Furthermore, after the useless resin (residue 10b and runner 10c) is removed, the resin holding section 313 descends again to its lowest position due to its own weight (the position where the resin adsorption piping block 313c or the return plate 314b contacts the upper surface of the unloading machine body 311, see reference). Figure 6 At this time, the return spring 314d exerts a force downward on the return plate 314b, so the force exerted by the return spring 314d can be used to assist the resin holding part 313 in descending.

[0104] As described above, the unloading machine 310 (transfer mechanism) of this embodiment includes:

[0105] Molded article holding part 315 holds the resin molded article;

[0106] Resin holding section 313 holds unused resin; and

[0107] The lifting support 314 supports the resin holding part 313 in a manner that allows it to move up and down relative to the molded article holding part 315.

[0108] This configuration allows for adjustments to the thickness (height) of the waste resin, improving the versatility of the unloading machine 310. Specifically, the resin holding section 313 can be raised or lowered according to the thickness (height) of the residue 10b (waste resin), thus ensuring proper retention of the residue 10b even when its thickness changes. Therefore, even with changes in the thickness of the residue 10b, the structure of the unloading machine 310 does not need to be altered, further enhancing its versatility.

[0109] Additionally, the resin holding portion 313 includes:

[0110] Resin absorbent pad 313b (absorbent pad) is in contact with the useless resin; and

[0111] The resin adsorption tube section 313a (pad mounting section) is used to mount the resin adsorption pad 313b.

[0112] The lifting support 314 supports the resin adsorption tube 313a in a manner that allows the resin adsorption tube 313a to move up and down.

[0113] This configuration allows for adjustments to the thickness (height) of the useless resin, thus improving versatility.

[0114] Additionally, the lifting support 314 includes:

[0115] The return plate 314b (lifting part) can be lifted and lowered integrally with the resin adsorption tube 313a; and

[0116] The guide shaft 314c (movable range defining part) defines the lifting range of the return plate 314b.

[0117] This configuration allows for the definition of the lifting range of the resin holding part 313. This prevents the resin holding part 313 from moving excessively and coming into contact with other components, thus avoiding undesirable situations.

[0118] In addition, the lifting support 314 also includes a return spring 314d (applying part) that applies force downward to the resin holding part 313.

[0119] With this configuration, the return spring 314d can be used to assist the resin holding part 313 in returning downward due to its own weight.

[0120] Furthermore, the resin molding apparatus 1 of this embodiment includes:

[0121] The molding die 210 obtains the resin molded article by resin molding the lead frame 10 (the object to be molded); and

[0122] The unloading machine 310 (conveying mechanism) transports the resin-molded article after it has been resin-molded by the molding die 210.

[0123] This configuration improves the versatility of the unloading machine 310, and consequently improves the versatility of the resin molding apparatus 1.

[0124] Furthermore, the resin molding method of this embodiment uses a resin molding apparatus 1 to manufacture resin molded articles.

[0125] This configuration improves the versatility of the unloading machine 310, and consequently improves the versatility of the resin molding apparatus 1.

[0126] Hereinafter, variations of the unloading machine 310 (the second embodiment and the third embodiment) will be described. Furthermore, in the following description, the same reference numerals are used for structures identical to those in the first embodiment, and descriptions may be omitted as appropriate.

[0127] Figure 9 The unloading machine 310 of the second embodiment shown is the same as the unloading machine 310 of the first embodiment (see reference). Figure 6 The difference (etc.) is that the force applied by the return spring 314d can be adjusted. This will be explained in detail below.

[0128] The unloading machine 310 of the second embodiment includes an adjustment part 314e (guide bolt 314f and adjustment nut 314g) that can adjust the force given by the return spring 314d to replace the guide shaft 314c of the unloading machine 310 of the first embodiment.

[0129] The guide bolt 314f guides the return plate 314b to move up and down, and defines the range of movement of the return plate 314b. The guide bolt 314f is configured to pass vertically through both ends of the return plate 314b. The lower part of the guide bolt 314f is fastened to the adjusting nut 314g, which will be described later. Furthermore, the lower end of the guide bolt 314f (the portion protruding further downward than the adjusting nut 314g) is inserted into a through hole (not shown) formed in the unloader body 311.

[0130] Adjusting nuts 314g are used to adjust the force imparted by the return spring 314d by changing the length of the guide bolt 314f (the length of the protruding portion on the upper surface of the unloader body 311). Adjusting nuts 314g are fixed to the upper surface of the unloader body 311. Adjusting nuts 314g are positioned corresponding to the guide bolts 314f.

[0131] In the adjustment section 314e configured as described above, the length of the guide bolt 314f can be adjusted by screwing the guide bolt 314f into or out of the adjusting nut 314g. This allows adjustment of the length of the return spring 314d, which is positioned between the return plate 314b and the head of the guide bolt 314f. The shorter the length of the return spring 314d, the greater the force exerted by it; conversely, the longer the length of the return spring 314d, the smaller the force exerted by it. Thus, by using the guide bolt 314f and the adjusting nut 314g, the force exerted by the return spring 314d can be adjusted according to the shape of the scrap 10b, etc.

[0132] As described above, the lifting support 314 of the second embodiment also includes an adjustment part 314e, which can adjust the force applied by the return spring 314d (applying part).

[0133] With this configuration, the force applied by the return spring 314d can be adjusted according to the shape of the residue 10b, etc. For example, in cases where the sprue 10c is formed below the lead frame 10 and the residue 10b is formed above the sprue 10c, there is a possibility that unwanted resin (residue 10b and sprue 10c) may peel off from the lead frame 10 due to the downward force. In this case, by reducing the force applied by the return spring 314d, it is possible to prevent the residue 10b from falling off during transport.

[0134] Figure 10 The unloading machine 310 of the third embodiment shown is the same as the unloading machine 310 of the first embodiment (see reference). Figure 6 The difference from (etc.) is that it also includes a pressing part 316 that presses downwards to hold the useless resin held by the resin holding part 313. This will be explained in detail below.

[0135] The pressing part 316 mainly includes a pressing block 316a, a guide shaft 316b, and a pressing spring 316c.

[0136] The pressing block 316a is the portion that contacts the waste resin. The pressing block 316a is formed into a generally rectangular parallelepiped shape. The pressing blocks 316a are respectively disposed on the left and right sides of the resin holding part 313. The pressing blocks 316a are positioned above the waste resin (in this embodiment, the gating system 10c). The pressing blocks 316a are mounted on the lower surface of the unloading machine body 311 via the guide shaft 316b described later.

[0137] The guide shaft 316b is a portion that supports the pressing block 316a in a manner that allows the pressing block 316a to move up and down. The lower end of the guide shaft 316b is fixed to the pressing block 316a. The upper part of the guide shaft 316b is inserted into the lower surface of the unloading machine body 311. The guide shaft 316b is configured to move up and down relative to the unloading machine body 311. In addition, the guide shaft 316b is configured to not detach from the unloading machine body 311 by appropriate means.

[0138] Furthermore, the structure of the guide shaft 316b is not limited to this; it can be any structure that can support the pressing block 316a vertically. For example, the guide shaft 316b can also be a telescopic shaft-shaped component.

[0139] The pressing spring 316c applies downward force to the pressing block 316a. The pressing spring 316c is formed by a compression coil spring. The pressing spring 316c is inserted into the guide shaft 316b and positioned between the unloading machine body 311 and the pressing block 316a. Thus, the pressing spring 316c can always apply downward force to the pressing block 316a.

[0140] The pressing part 316 configured in this way allows the useless resin held by the resin holding part 313 to be pressed downwards. Specifically, as Figure 10 As shown, with the residual material 10b adsorbed by the resin holding part 313, the pressing block 316a contacts the sprue 10c from above. The pressing block 316a presses the sprue 10c downward by its own weight and the force given by the pressing spring 316c.

[0141] Here, the force exerted by the pressing part 316 on the downward-pressing sprue 10c is set to be less than the holding force (adsorption force) based on the resin holding part 313. That is, when the resin holding part 313 adsorbs the residual material 10b, the residual material 10b and the sprue 10c will not fall off from the resin holding part 313 due to the pressing force of the pressing part 316. Therefore, during the unloading machine 310's removal of the lead frame 10 from the molding mold 210, the unwanted resin will not accidentally fall off the unloading machine 310.

[0142] On the other hand, when the lead frame 10 is removed from the molding die 210 by the unloading machine 310 and the waste resin is removed by the unloading machine 310, the adsorption performed by the resin holding part 313 stops. Additionally, air is ejected from the resin holding part 313 (resin adsorption pad 313b) as needed. At this time, the pressing part 316 presses the waste resin downwards, thus applying a force away from the resin adsorption pad 313b to the waste resin, causing it to quickly detach from the resin holding part 313.

[0143] Thus, by pressing the useless resin with the pressing part 316, even if the useless resin adheres to the resin adsorption pad 313b due to heat or material effects, the useless resin can be easily removed. Especially when the useless resin (residue 10b and sprue 10c) separates from the resin molded product (sealing part 10a and lead frame 10) after resin molding, since the useless resin is relatively light, it is assumed that even if the adsorption of the resin holding part 313 is stopped, the useless resin will stick to the resin adsorption pad 313b and not fall off. However, by providing the pressing part 316 as in this embodiment, even the lighter useless resin can be easily removed from the resin holding part 313.

[0144] As described above, the unloading machine 310 of the third embodiment also includes a pressing part 316, which presses the useless resin held by the resin holding part 313 downward.

[0145] With this configuration, when the retention (adsorption) of useless resin by the resin holding part 313 ends, the useless resin can be easily detached from the resin holding part 313.

[0146] The embodiments of the present invention have been described above, but the present invention is not limited to the described embodiments and can be appropriately modified within the scope of the technical concept of the invention as described in the claims.

[0147] For example, in the described embodiment, a resin molding apparatus 1 using a transfer molding method (a resin molding apparatus 1 using a transfer method) is illustrated, but the present invention is not limited thereto, and other methods (such as compression methods) can also be used.

[0148] Furthermore, the constituent components (supply module 100, etc.) used in the resin molding apparatus 1 of the above embodiment are examples of components that can be easily installed, removed, or replaced. For example, the number of resin molding modules 200 can be changed. Additionally, the structure or operation of the constituent components (supply module 100, etc.) used in the resin molding apparatus 1 of this embodiment are examples of components that can be easily modified.

[0149] Furthermore, in the described embodiment, an example of using small flake-shaped resin material (resin flakes T) is shown, but the present invention is not limited thereto. That is, as the resin material, not only ingot-shaped resin materials, but also resin materials in any form such as granules, powders, or liquids can be used.

[0150] In addition, as an example of a conveying mechanism described in the above embodiment, an unloading machine 310 for removing resin molded articles from the molding mold 210 is shown, but the present invention is not limited to this and can be applied to various conveying mechanisms.

[0151] Furthermore, in the described embodiment, a structure is illustrated in which the resin molded article is adsorbed and held in the form of a molded article holding portion 315, but the present invention is not limited thereto. For example, the resin molded article may not be adsorbed, but held solely by the clamp 312. In this case, the configuration of the clamp 312 may be appropriately modified so that the resin molded article can be held properly.

[0152] Furthermore, in the described embodiment, an example is shown where a return plate 314b is fixed to the resin holding portion 313, but the present invention is not limited thereto. For example, the return plate 314b may also be constructed from a component integral with the resin holding portion 313. In this case, the guide shaft 314c (see reference) can be used to guide the return plate. Figure 6 ) or guide bolt 314f (refer to) Figure 9 The range of rise and fall of the resin holding part 313 is specified.

[0153] Additionally, in the described embodiment, a guide axis 314c (reference) is shown. Figure 6 ) or guide bolt 314f (refer to) Figure 9 The present invention is not limited to this example, but the range of lifting of the resin holding part 313 can also be defined by other suitable components.

[0154] Furthermore, in the above embodiment, an example is shown where a return spring 314d is provided to exert force on the resin holding portion 313 downwards. However, the present invention is not limited to this and can also be configured without the return spring 314d.

[0155] Furthermore, in the described embodiment, a structure is shown in which multiple resin adsorption pads 313b (resin adsorption tube portions 313a) are fixed to the resin adsorption piping block 313c, and the multiple resin adsorption pads 313b are raised and lowered as a single unit. However, the present invention is not limited to this. For example, a structure in which the multiple resin adsorption pads 313b are raised and lowered one by one can also be provided.

[0156] Furthermore, in the above embodiment (second embodiment), an adjustment section 314e is shown to adjust the force applied by the return spring 314d. However, the structure of the adjustment section 314e is not limited to this. As long as the structure can adjust the force applied by the return spring 314d, it can be arbitrarily changed.

[0157] Furthermore, in the aforementioned embodiment (third embodiment), a pressing part 316 that presses the useless resin downwards is shown, but the structure of the pressing part 316 is not limited to this, and can be arbitrarily changed as long as it is a structure capable of pressing the useless resin.

[0158] Furthermore, in the described embodiment, the molded article holding part 315 holding the resin molded article is fixed to the unloading machine body 311, but the present invention is not limited to this. For example, it is also possible to configure the molded article holding part 315 to be able to move up and down in the same way as the resin holding part 313. This can further improve the versatility of the unloading machine 310.

Claims

1. A conveying mechanism, comprising: Molded article holding section, which holds the resin molded article; Resin holding section, which holds unused resin; as well as The lifting support section supports the resin holding section in a manner that allows it to move up and down relative to the molded article holding section. The resin retaining portion includes: An absorbent pad is in contact with the useless resin; and The pad mounting section is used to mount the adsorption pad. The lifting support part supports the pad mounting part in a manner that allows the pad mounting part to move up and down. The lifting support unit includes: The lifting unit is capable of being lifted and lowered integrally with the pad mounting unit; and The movable range specification section specifies the lifting range of the lifting unit.

2. The conveying mechanism according to claim 1, wherein The lifting support also includes a force-applying part that applies force downward to the resin holding part.

3. The conveying mechanism according to claim 2, wherein The lifting support also includes an adjustment section capable of adjusting the force applied by the imparting section.

4. The conveying mechanism according to any one of claims 1 to 3 further includes a pressing part. The pressing part presses downwards against the useless resin held by the resin holding part.

5. A resin molding apparatus, comprising: A molding die is used to obtain a resin-molded product by molding an object with resin. as well as The conveying mechanism according to any one of claims 1 to 4 conveys the resin-molded article after resin molding by the molding die.

6. A method for manufacturing a resin molded article, comprising manufacturing the resin molded article using the resin molding apparatus as described in claim 5.

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