A high-speed pavement detection system and method

Abstract

The application provides a high-speed pavement detection system and method, and belongs to the technical field of high-speed pavement detection. The method is realized through the system. The high-speed pavement detection system comprises a UAV, a remote system and / or a short-range controller configured to control the UAV to perform flight operation; an ultrasonic sensor mounted on the UAV, used to perform ultrasonic imaging on the high-speed pavement to obtain an ultrasonic image; and a storage device used to store the ultrasonic image. The remote system is loaded with an image processor. When the UAV communicates with the remote system, the remote system acquires the ultrasonic image stored in the storage device, controls the image processor to perform image processing on the ultrasonic image, and takes the image set obtained after the image processing as a high-speed pavement detection result. The UAV comprises a fuselage, at least six main rotor devices, and two auxiliary rotor devices. The top of the fuselage is provided with a mounting rack. The main rotor devices are all arranged on the mounting rack. The two auxiliary rotor devices are arranged at the front end and the rear end of the fuselage, respectively. The application can improve the detection efficiency.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of high-speed pavement detection, in particular to a high-speed pavement detection system and method. BACKGROUND

[0002] High-speed pavement detection is a technology that uses machines or devices to detect road conditions, usually using machines such as laser scanners, cameras, GPS, etc. to detect the width, thickness, flatness, damage, etc. of the road surface, so as to take timely measures to repair and improve the road surface conditions.

[0003] The method of high-speed pavement detection mainly includes static measurement and dynamic measurement. Static measurement is to detect the road conditions by using professional measuring instruments such as laser scanners, etc.; dynamic measurement is to detect the road conditions by using cameras and other devices, and to generate a road condition report by processing data through a computer.

[0004] Based on the current "five-gate integrated" security system, the need to promote "one road multi-party" collaborative governance, and the highway construction and maintenance of high-speed pavement belong to the necessary part of the system construction, high-speed pavement detection plays an important role in highway construction and maintenance, it can timely find the defects and problems of the road surface, and take effective measures to repair and improve the road surface conditions, to ensure the safety, comfort and economic operation of the highway.

[0005] Currently, manual or vehicle-mounted methods are usually used for high-speed pavement detection, and these methods have relatively low detection efficiency. SUMMARY

[0006] The present application provides a high-speed pavement detection system and method to improve detection efficiency.

[0007] To achieve the above-mentioned purpose, the present application adopts the following technical solutions:

[0008] The embodiment of the present application discloses a high-speed pavement detection system, comprising:

[0009] The unmanned aerial vehicle is configured with a remote system and / or a short-range controller for controlling the unmanned aerial vehicle to perform flight operations;

[0010] The ultrasonic sensor is mounted on the unmanned aerial vehicle and used for ultrasonic imaging of the high-speed pavement to obtain an ultrasonic image;

[0011] The memory is used for storing the ultrasonic image;

[0012] The remote system is loaded with an image processor, when the unmanned aerial vehicle communicates with the remote system, the remote system acquires the ultrasonic image stored in the memory, controls the image processor to perform image processing on the ultrasonic image, and takes the image set obtained after image processing as the highway surface detection result.

[0013] The unmanned aerial vehicle comprises:

[0014] A fuselage, a top of which is provided with a mounting frame;

[0015] At least six main rotor devices, each of which is arranged on the mounting frame;

[0016] Two auxiliary rotor devices, each of which is arranged at the front end and the rear end of the fuselage.

[0017] In an embodiment of the present specification, the main rotor device has eight and is symmetrically distributed on the mounting frame.

[0018] In an embodiment of the present specification, the horizontal heights of the two auxiliary rotor devices are inconsistent.

[0019] In an embodiment of the present specification, the bottom of the fuselage is provided with a rolling wheel.

[0020] In an embodiment of the present specification, the ultrasonic sensor comprises a control circuit, a power supply circuit, a transmitter circuit and a receiver circuit, the power supply circuit is connected with the control circuit, the transmitter circuit and the receiver circuit respectively to provide working voltage, and the control circuit is connected with the transmitter circuit and the receiver circuit respectively to perform ultrasonic imaging.

[0021] In an embodiment of the present specification, the power supply circuit comprises a power supply interface J1, a capacitor C20, a capacitor C15, a capacitor C21, a capacitor C16, a capacitor C22 and a voltage stabilizer U5; the pin 1 of the power supply interface J1 is connected with one end of the capacitor C20, one end of the capacitor C15, one end of the capacitor C21 and the pin 1 of the voltage stabilizer U5 to serve as a voltage terminal +12, the pin of the power supply interface J1 is connected with the other end of the capacitor C20 to serve as a ground terminal, the pin 3 of the voltage stabilizer U5 is connected with one end of the capacitor C16 and one end of the capacitor C22 to serve as a voltage terminal +5, and the other end of the capacitor C15 is connected with the other end of the capacitor C21, the pin 2 of the voltage stabilizer, the other end of the capacitor C16 and the other end of the capacitor C22 to serve as a ground terminal.

[0022] In an embodiment of the present specification, the control circuit comprises a microcontroller U4, a capacitor C14, a capacitor C18, a capacitor C19 and a crystal oscillator Y1; the pin 2 of the microcontroller U4 is connected with the capacitor C14 grounded and then connected with the voltage terminal +5, the pin 26 of the microcontroller U4 is connected with one end of the crystal oscillator Y1 and the capacitor C19 grounded, and the pin 27 of the microcontroller U4 is connected with the other end of the crystal oscillator Y1 and the capacitor C18 grounded.

[0023] In an embodiment of the present specification, the transmitter circuit comprises an inductor L1, a capacitor C13, a capacitor C17, a NAND gate U3A, a NAND gate U3B, a NAND gate U3C, a NAND gate U3D, a NAND gate U3E, a transmitter LS3 and a transmitter LS4; one end of the inductor L1 is connected with the voltage terminal +5, the other end of the inductor L1 is connected with one end of the capacitor C17, one end of the capacitor C13 and the pin 14 of the NAND gate U3E, the other end of the capacitor C17 is connected with the other end of the capacitor C13 and the pin 7 of the NAND gate U3E grounded, the pin 9 of the microcontroller U4 is connected with the pin 4 of the NAND gate U3B and the pin 10 of the NAND gate U3C;

[0024] the pin 10 of the microcontroller U4 is connected with the pin 5 of the NAND gate U3B and the pin 2 of the NAND gate U3A, the pin 11 of the microcontroller U4 is connected with the pin 9 of the NAND gate U3C and the pin 13 of the NAND gate U3D, the pin 1 of the NAND gate U3A is connected with the pin 6 of the NAND gate U3B and one end of the transmitter LS3, the pin 3 of the NAND gate U3A is connected with the other end of the transmitter LS3, the pin 12 of the NAND gate U3D is connected with the pin 8 of the NAND gate U3C and one end of the transmitter LS4, and the pin 11 of the NAND gate U3D is connected with the other end of the transmitter LS4.

[0025] In an embodiment of the present specification, the receiver circuit comprises a receiver LS1, a receiver LS2, a capacitor C1, a capacitor C2, a capacitor C3, a capacitor C4, a capacitor C5, a capacitor C6, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C12, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a resistor R5, a resistor R6, a resistor R7, a resistor R8, a resistor R9, a resistor R10, a resistor R11, a resistor R12, a resistor R13, a resistor R14, a resistor R15, a resistor R16, a resistor R17, a resistor R18, a resistor R19, a resistor R20, a resistor R21, a resistor R22, a resistor R23, a resistor R24, a resistor R25, a resistor R26, an operational amplifier U1A, an operational amplifier U1B, an operational amplifier U1C, an operational amplifier U1D, an operational amplifier U2A, an operational amplifier U2B, an operational amplifier U2C, an operational amplifier U2D, a diode D1, a diode D12, a diode D3 and a diode D4.

[0026] One end of the receiver LS1 is grounded, the other end of the receiver LS1 is connected with one end of the capacitor C1, the other end of the capacitor C1 is connected with one end of the resistor R3, the other end of the resistor R3 is connected with one end of the resistor R23 and the inverting terminal of the operational amplifier U1A, the non-inverting terminal of the operational amplifier U1A is connected with one end of the resistor R1, one end of the resistor R2, one end of the capacitor C11, the non-inverting terminal of the operational amplifier U1B and the non-inverting terminal of the operational amplifier U1C, the other end of the resistor R1 is connected with the positive electrode of the operational amplifier U1A and then connected with the voltage terminal +12, the other end of the resistor R2 is connected with the other end of the capacitor C11 and then grounded, the output terminal of the operational amplifier U1A is connected with the other end of the resistor R23 and one end of the capacitor C2;

[0027] The other end of the capacitor C2 is connected with one end of the resistor R4, the other end of the resistor R4 is connected with the inverting terminal of the operational amplifier U1B and one end of the resistor R24, the output terminal of the operational amplifier U1B is connected with the other end of the resistor R24 and one end of the capacitor C3, the other end of the capacitor C3 is connected with one end of the resistor R5, the other end of the resistor R5 is connected with the inverting terminal of the operational amplifier U1C, the output terminal of the operational amplifier U1C is connected with one end of the resistor R21 and one end of the capacitor C4, the other end of the capacitor C4 is connected with the negative electrode of the diode D1 and the positive electrode of the diode D2, the positive electrode of the diode D1 is connected with one end of the capacitor C5 and then grounded, the other end of the capacitor C5 is connected with the negative electrode of the diode D2 and one end of the resistor R6;

[0028] The other end of the resistor R6 is connected with the inverting terminal of the operational amplifier U1D and the grounded resistor R28, the non-inverting terminal of the operational amplifier U1D is connected with one end of the resistor R7 and the grounded resistor R8, the other end of the resistor R7 is connected with the voltage terminal +12, the output terminal of the operational amplifier U1D is connected with one end of the resistor R9, the other end of the resistor R9 is connected with pin 5 of the microcontroller U4 and the grounded resistor R10;

[0029] One end of the receiver LS2 is grounded, the other end of the receiver LS2 is connected with one end of the capacitor C6, the other end of the capacitor C6 is connected with one end of the resistor R13, the other end of the resistor R13 is connected with one end of the resistor R26 and the inverting terminal of the operational amplifier U2A, the non-inverting terminal of the operational amplifier U2A is connected with one end of the resistor R11, one end of the resistor R12, one end of the capacitor C12, the non-inverting terminal of the operational amplifier U2B and the non-inverting terminal of the operational amplifier U2C, the other end of the resistor R11 is connected with the positive electrode of the operational amplifier U2A and then connected with the voltage terminal +12, the other end of the resistor R12 is connected with the other end of the capacitor C12 and then grounded, the output terminal of the operational amplifier U2A is connected with the other end of the resistor R26 and one end of the capacitor C7;

[0030] The other end of the capacitor C7 is connected with one end of the resistor R14, the other end of the resistor R14 is connected with the inverting terminal of the operational amplifier U2B and one end of the resistor R25, the output terminal of the operational amplifier U2B is connected with the other end of the resistor R25 and one end of the capacitor C8, the other end of the capacitor C8 is connected with one end of the resistor R15, the other end of the resistor R15 is connected with the inverting terminal of the operational amplifier U2C, the output terminal of the operational amplifier U2C is connected with one end of the resistor R22 and one end of the capacitor C9, the other end of the capacitor C9 is connected with the negative electrode of the diode D3 and the positive electrode of the diode D4, the positive electrode of the diode D3 is connected with one end of the capacitor C10 and then grounded, the other end of the capacitor C10 is connected with the negative electrode of the diode D4 and one end of the resistor R16;

[0031] The other end of the resistor R16 is connected with the inverting terminal of the operational amplifier U2D and the grounded resistor R29, the non-inverting terminal of the operational amplifier U2D is connected with one end of the resistor R17 and the grounded resistor R18, the other end of the resistor R17 is connected with the voltage terminal +12, the output terminal of the operational amplifier U2D is connected with one end of the resistor R19, the other end of the resistor R19 is connected with pin 1 of the microcontroller U4 and the grounded resistor R20.

[0032] The embodiment of the present specification further discloses a high-speed road surface detection method, comprising the following steps:

[0033] S1. Controlling the unmanned aerial vehicle to fly along the high-speed road surface through a remote system and / or a short-range controller;

[0034] S2. Performing ultrasonic imaging on the high-speed road surface through an ultrasonic sensor on the unmanned aerial vehicle to obtain an ultrasonic image;

[0035] S3. Transmitting the ultrasonic image to the remote system;

[0036] S4. image processing the ultrasonic image by an image processor of the remote system, and taking the image set obtained after image processing as the high-speed road surface detection result.

[0037] In summary, the present application has at least the following beneficial effects:

[0038] The present application carries ultrasonic sensors on the unmanned aerial vehicle, controls the unmanned aerial vehicle to fly along the high-speed road surface by the remote system and / or the short-range controller, performs ultrasonic imaging on the high-speed road surface by the ultrasonic sensors to obtain ultrasonic images, processes the ultrasonic images by an image processor of the remote system, and takes the image set obtained after image processing as the high-speed road surface detection result. This high-speed road surface detection form effectively improves the detection efficiency, and can also save detection costs to a certain extent compared with artificial or vehicle-mounted detection forms. BRIEF DESCRIPTION OF DRAWINGS

[0039] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0040] Figure 1 It is a schematic diagram of the high-speed road surface detection system involved in the present application.

[0041] Figure 2 It is a side view schematic diagram of the unmanned aerial vehicle involved in the present application.

[0042] Figure 3 It is a top view schematic diagram of the unmanned aerial vehicle involved in the present application.

[0043] Figure 4 It is a schematic diagram of the power supply circuit involved in the present application.

[0044] Figure 5 It is a schematic diagram of the control circuit involved in the present application.

[0045] Figure 6 It is a partial schematic diagram of the transmitter circuit involved in the present application.

[0046] Figure 7 It is another partial schematic diagram of the transmitter circuit involved in the present application.

[0047] Figure 8 It is a partial schematic diagram of the receiver circuit involved in the present application.

[0048] Figure 9 It is another partial schematic diagram of the receiver circuit involved in the present application.

[0049] 1. body; 11. mounting bracket; 12. roller;

[0050] 2. main rotor device;

[0051] 3. auxiliary rotor device;

[0052] 100. driving motor; 200. propeller. DETAILED DESCRIPTION

[0053] In the following, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the embodiments of the present application. Therefore, the drawings and the description are considered to be exemplary in nature rather than limiting.

[0054] The following disclosure provides many different embodiments, or examples, for implementing different structures of the embodiments of the present application. For the purpose of simplifying the present application embodiments disclosure, the components and settings of specific examples are described in the following. Of course, they are only examples, and the purpose is not to limit the embodiments of the present application. In addition, the embodiments of the present application can refer to the same reference numerals and / or reference letters in different examples, and such repetition is for the purpose of simplification and clarity, which does not indicate the relationship between the various embodiments and / or settings discussed.

[0055] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0056] As shown in Figure 1 , Figure 2 and Figure 3 , the embodiments of the present application disclose a high-speed road surface detection system, comprising:

[0057] The unmanned aerial vehicle is configured with a remote system and / or a short-range controller for controlling the unmanned aerial vehicle to perform flight operations;

[0058] The ultrasonic sensor is carried on the unmanned aerial vehicle and is used for ultrasonic imaging of the high-speed road surface to obtain an ultrasonic image;

[0059] The memory is used for storing the ultrasonic image;

[0060] The remote system is loaded with an image processor, and when the unmanned aerial vehicle communicates with the remote system, the remote system acquires the ultrasonic image stored in the memory, controls the image processor to perform image processing on the ultrasonic image, and takes the image set obtained after image processing as a high-speed road surface detection result;

[0061] The unmanned aerial vehicle comprises:

[0062] The body 1 is provided with a mounting bracket 11 at the top.

[0063] At least 6 main rotor devices 2 are arranged on the mounting frame 11.

[0064] 2 auxiliary rotor devices 3 are arranged at the front end and the rear end of the fuselage 1 respectively.

[0065] It should be understood that the image processor can also be a device with existing specific image processing functions or a device equipped with image processing software. The image processing of the ultrasonic image is mainly to improve the accuracy and reliability of detection; the ultrasonic image after image processing can be used as the result of highway pavement detection. It should be noted that the embodiment of the present application is only a highway pavement detection scheme, and does not analyze the highway pavement detection result or judge the condition of the highway pavement; the analysis of the detection result or the judgment of the condition of the highway pavement can be performed according to the prior art.

[0066] Similarly, the flight operation of the unmanned aerial vehicle controlled by the remote system and / or the short-range controller is prior art, and the existing scheme can be referred to.

[0067] The focus of the embodiment is to improve the detection efficiency; the specific process is (which can be referred to as the highway pavement detection method):

[0068] The unmanned aerial vehicle is controlled to fly along the highway pavement by the remote system and / or the short-range controller; the ultrasonic sensor on the unmanned aerial vehicle is used to perform ultrasonic imaging on the highway pavement to obtain an ultrasonic image; the ultrasonic image is transmitted to the remote system; the image processor of the remote system is used to perform image processing on the ultrasonic image, and the image set obtained after the image processing is used as the result of highway pavement detection.

[0069] It can be understood that each main rotor device 2 of the unmanned aerial vehicle can work independently, and each auxiliary rotor device 3 can also work independently, which makes the unmanned aerial vehicle flexible to resist strong wind or sudden crosswind of the highway pavement. It is clear that the main rotor device 2 and the auxiliary rotor device 3 are both prior art, and each includes a driving motor 100, a propeller 200 and supporting parts, and the difference between them is only the installation position. In practical applications, the main rotor device 2 and the auxiliary rotor device 3 can select driving motors 100 of different types and specifications according to actual needs.

[0070] As shown in Figure 2 and Figure 3 In some embodiments, the main rotor device 2 has 8 and is symmetrically distributed on the mounting frame 11.

[0071] In the embodiment, the arrangement can provide stable and powerful flight power for the unmanned aerial vehicle when the eight main rotor devices 2 are started together, and can provide left or right flight power for the unmanned aerial vehicle when only some of them are started, so as to facilitate the unmanned aerial vehicle to turn and change direction, and also facilitate the unmanned aerial vehicle to resist strong wind, so as to avoid the unmanned aerial vehicle from being out of control and difficult to fly under the influence of strong wind. On this basis, the secondary rotor device 3 is started again, so as to facilitate the unmanned aerial vehicle to turn and change direction or resist strong wind.

[0072] As shown in Figure 2 and Figure 3 , in some embodiments, the horizontal heights of the two secondary rotor devices 3 are inconsistent.

[0073] In the embodiment, the front end secondary rotor device 3 can be lower than the rear end secondary rotor device 3, so that the unmanned aerial vehicle can fly forward with the front end downward and the rear end upward (tilting type), which can reduce wind resistance in cooperation with the oval fuselage 1, and also can realize tilting landing or take-off.

[0074] As shown in Figure 2 and Figure 3 , in some embodiments, the bottom of the fuselage 1 is provided with a roller 12.

[0075] In the embodiment, through the arrangement, the unmanned aerial vehicle can move on the highway, that is, the unmanned aerial vehicle can obtain ultrasonic images in flight and ultrasonic images in road movement, and the two kinds of ultrasonic images are compared, so as to effectively improve the accuracy and reliability of detection.

[0076] In some embodiments, the ultrasonic sensor includes a control circuit, a power supply circuit, a transmitter circuit and a receiver circuit, the power supply circuit is connected with the control circuit, the transmitter circuit and the receiver circuit respectively to provide working voltage, and the control circuit is connected with the transmitter circuit and the receiver circuit respectively to perform ultrasonic imaging.

[0077] As shown in Figure 4 , in some embodiments, the power supply circuit includes a power supply interface J1, a capacitor C20, a capacitor C15, a capacitor C21, a capacitor C16, a capacitor C22 and a voltage stabilizer U5; the pin 1 of the power supply interface J1 is connected with one end of the capacitor C20, one end of the capacitor C15, one end of the capacitor C21 and pin 1 of the voltage stabilizer U5 to serve as a voltage terminal +12, the pin of the power supply interface J1 is connected with the other end of the capacitor C20 to ground, pin 3 of the voltage stabilizer U5 is connected with one end of the capacitor C16 and one end of the capacitor C22 to serve as a voltage terminal +5, and the other end of the capacitor C15, the other end of the capacitor C21, pin 2 of the voltage stabilizer, the other end of the capacitor C16 and the other end of the capacitor C22 are connected to ground.

[0078] As shown in Figure 5As shown in some embodiments, the control circuit includes microcontroller U4, capacitor C14, capacitor C18, capacitor C19 and crystal Y1; pin 2 of microcontroller U4 is connected with capacitor C14 grounded and the voltage terminal +5 is connected outside, pin 26 of microcontroller U4 is connected with one end of crystal Y1 and capacitor C19 grounded, pin 27 of microcontroller U4 is connected with the other end of crystal Y1 and capacitor C18 grounded.

[0079] As shown in some embodiments, the control circuit includes microcontroller U4, capacitor C14, capacitor C18, capacitor C19 and crystal Y1; pin 2 of microcontroller U4 is connected with capacitor C14 grounded and the voltage terminal +5 is connected outside, pin 26 of microcontroller U4 is connected with one end of crystal Y1 and capacitor C19 grounded, pin 27 of microcontroller U4 is connected with the other end of crystal Y1 and capacitor C18 grounded. Figure 6 Figure 7 As shown in some embodiments, the transmitter circuit includes inductor L1, capacitor C13, capacitor C17, NAND gate U3A, NAND gate U3B, NAND gate U3C, NAND gate U3D, NAND gate U3E, transmitter LS3 and transmitter LS4; one end of inductor L1 is connected with the voltage terminal +5 outside, the other end of inductor L1 is connected with one end of capacitor C17, one end of capacitor C13 and pin 14 of NAND gate U3E, the other end of capacitor C17 is connected with the other end of capacitor C13 and pin 7 of NAND gate U3E grounded, pin 9 of microcontroller U4 is connected with pin 4 of NAND gate U3B and pin 10 of NAND gate U3C.

[0080] Pin 10 of microcontroller U4 is connected with pin 5 of NAND gate U3B and pin 2 of NAND gate U3A, pin 11 of microcontroller U4 is connected with pin 9 of NAND gate U3C and pin 13 of NAND gate U3D, pin 1 of NAND gate U3A is connected with pin 6 of NAND gate U3B and one end of transmitter LS3, pin 3 of NAND gate U3A is connected with the other end of transmitter LS3, pin 12 of NAND gate U3D is connected with pin 8 of NAND gate U3C and one end of transmitter LS4, pin 11 of NAND gate U3D is connected with the other end of transmitter LS4.

[0081] As shown in some embodiments, the control circuit includes microcontroller U4, capacitor C14, capacitor C18, capacitor C19 and crystal Y1; pin 2 of microcontroller U4 is connected with capacitor C14 grounded and the voltage terminal +5 is connected outside, pin 26 of microcontroller U4 is connected with one end of crystal Y1 and capacitor C19 grounded, pin 27 of microcontroller U4 is connected with the other end of crystal Y1 and capacitor C18 grounded. Figure 8 Figure 9 As shown in some embodiments, the receiver circuit includes receiver LS1, receiver LS2, capacitor C1, capacitor C2, capacitor C3, capacitor C4, capacitor C5, capacitor C6, capacitor C7, capacitor C8, capacitor C9, capacitor C10, capacitor C11, capacitor C12, resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, resistor R7, resistor R8, resistor R9, resistor R10, resistor R11, resistor R12, resistor R13, resistor R14, resistor R15, resistor R16, resistor R17, resistor R18, resistor R19, resistor R20, resistor R21, resistor R22, resistor R23, resistor R24, resistor R25, resistor R26, operational amplifier U1A, operational amplifier U1B, operational amplifier U1C, operational amplifier U1D, operational amplifier U2A, operational amplifier U2B, operational amplifier U2C, operational amplifier U2D, diode D1, diode D12, diode D3 and diode D4.​​

[0082] One end of the receiver LS1 is grounded, the other end of the receiver LS1 is connected with one end of the capacitor C1, the other end of the capacitor C1 is connected with one end of the resistor R3, the other end of the resistor R3 is connected with one end of the resistor R23 and the inverting terminal of the operational amplifier U1A, the non-inverting terminal of the operational amplifier U1A is connected with one end of the resistor R1, one end of the resistor R2, one end of the capacitor C11, the non-inverting terminal of the operational amplifier U1B and the non-inverting terminal of the operational amplifier U1C, the other end of the resistor R1 is connected with the positive electrode of the operational amplifier U1A and then connected with the voltage terminal +12, the other end of the resistor R2 is connected with the other end of the capacitor C11 and then grounded, the output terminal of the operational amplifier U1A is connected with the other end of the resistor R23 and one end of the capacitor C2;

[0083] The other end of the capacitor C2 is connected with one end of the resistor R4, the other end of the resistor R4 is connected with the inverting terminal of the operational amplifier U1B and one end of the resistor R24, the output terminal of the operational amplifier U1B is connected with the other end of the resistor R24 and one end of the capacitor C3, the other end of the capacitor C3 is connected with one end of the resistor R5, the other end of the resistor R5 is connected with the inverting terminal of the operational amplifier U1C, the output terminal of the operational amplifier U1C is connected with one end of the resistor R21 and one end of the capacitor C4, the other end of the capacitor C4 is connected with the negative electrode of the diode D1 and the positive electrode of the diode D2, one end of the capacitor C5 is connected with the positive electrode of the diode D1 and then grounded, the other end of the capacitor C5 is connected with the negative electrode of the diode D2 and one end of the resistor R6;

[0084] The other end of the resistor R6 is connected with the inverting terminal of the operational amplifier U1D and the grounded resistor R28, the non-inverting terminal of the operational amplifier U1D is connected with one end of the resistor R7 and the grounded resistor R8, the other end of the resistor R7 is connected with the voltage terminal +12, the output terminal of the operational amplifier U1D is connected with one end of the resistor R9, the other end of the resistor R9 is connected with the pin 5 of the microcontroller U4 and the grounded resistor R10;

[0085] One end of the receiver LS2 is grounded, the other end of the receiver LS2 is connected with one end of the capacitor C6, the other end of the capacitor C6 is connected with one end of the resistor R13, the other end of the resistor R13 is connected with one end of the resistor R26 and the inverting terminal of the operational amplifier U2A, the non-inverting terminal of the operational amplifier U2A is connected with one end of the resistor R11, one end of the resistor R12, one end of the capacitor C12, the non-inverting terminal of the operational amplifier U2B and the non-inverting terminal of the operational amplifier U2C, the other end of the resistor R11 is connected with the positive electrode of the operational amplifier U2A and then connected with the voltage terminal +12, the other end of the resistor R12 is connected with the other end of the capacitor C12 and then grounded, the output terminal of the operational amplifier U2A is connected with the other end of the resistor R26 and one end of the capacitor C7;

[0086] The other end of the capacitor C7 is connected with one end of the resistor R14, the other end of the resistor R14 is connected with the inverting terminal of the operational amplifier U2B and one end of the resistor R25, the output terminal of the operational amplifier U2B is connected with the other end of the resistor R25 and one end of the capacitor C8, the other end of the capacitor C8 is connected with one end of the resistor R15, the other end of the resistor R15 is connected with the inverting terminal of the operational amplifier U2C, the output terminal of the operational amplifier U2C is connected with one end of the resistor R22 and one end of the capacitor C9, the other end of the capacitor C9 is connected with the negative electrode of the diode D3 and the positive electrode of the diode D4, the positive electrode of the diode D3 is connected with one end of the capacitor C10 and then grounded, the other end of the capacitor C10 is connected with the negative electrode of the diode D4 and one end of the resistor R16;

[0087] The other end of the resistor R16 is connected with the inverting terminal of the operational amplifier U2D and the resistor R29 grounded, the noninverting terminal of the operational amplifier U2D is connected with one end of the resistor R17 and the resistor R18 grounded, the other end of the resistor R17 is connected with the voltage terminal +12, the output terminal of the operational amplifier U2D is connected with one end of the resistor R19, the other end of the resistor R19 is connected with the pin 1 of the microcontroller U4 and the resistor R20 grounded.

[0088] In the embodiment, the working voltage is provided by the voltage stabilizer U5, the working frequency is provided for the transmitter LS3 and the transmitter LS4 by the microcontroller U4, the NAND gate U3A, the NAND gate U3B, the NAND gate U3C, the NAND gate U3D and the NAND gate U3E, and the receiver LS1, the receiver LS2, the transmitter LS3 and the transmitter LS4 are installed at the front end and the rear end of the body 1 respectively, the transmitter LS3 and the transmitter LS4 emit ultrasonic waves to the highway surface, the ultrasonic waves generate reflected waves on the highway surface, the reflected waves (reflected signals) are received by the receiver LS1 and the receiver LS2, the reflected signals are amplified by the operational amplifier U1A, the operational amplifier U1B, the operational amplifier U1C and the operational amplifier U1D, or by the operational amplifier U2A, the operational amplifier U2B, the operational amplifier U2C and the operational amplifier U2D, and then transmitted to the microcontroller U4, the microcontroller U4 generates ultrasonic wave images and stores the ultrasonic wave images in the memory, that is, two sets of ultrasonic wave images can be obtained, and the accuracy and reliability of the detection result can be effectively improved by comparing the two sets of ultrasonic wave images.

[0089] The device parameters, types and connection relationships not described above refer to Figures 4 to 9 That is, the device parameters and types can also be set according to actual needs.

[0090] The embodiment of the present application also discloses a highway surface detection method, which comprises the following steps:

[0091] S1. Controlling the unmanned aerial vehicle to fly along the highway surface by a remote system and / or a short-range controller;

[0092] S2. An ultrasonic image is obtained by using an ultrasonic sensor on the unmanned aerial vehicle to perform ultrasonic imaging on the highway surface;

[0093] S3. The ultrasonic image is transmitted to a remote system;

[0094] S4. The ultrasonic image is processed by an image processor of the remote system, and a set of images obtained after the processing is taken as a highway surface detection result.

[0095] The highway surface detection method can be implemented by using a highway surface detection system.

[0096] The above-described embodiments are used to illustrate the present application, and are not used to limit the present application, so that the change of example values or the replacement of equivalent elements should still belong to the scope of the present application.

[0097] From the above detailed description, it can be seen that the present application can achieve the above-mentioned purposes, and has met the requirements of the Patent Law.

[0098] Although the preferred embodiments of the present application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic inventive concept. Therefore, the appended claims are intended to be interpreted as including all the preferred embodiments and all the changes and modifications falling within the scope of the present application. The above description is only the preferred embodiments of the present application and is not used to limit the present application. It should be noted that any modification, equivalent replacement and improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

[0099] It should be noted that the above description of the flow is only for example and illustration, and does not limit the scope of the present application. Those skilled in the art can make various modifications and changes to the flow under the guidance of the present application. However, these modifications and changes are still within the scope of the present application.

[0100] The above has described the basic concept, and it is obvious that the above-mentioned application disclosure is only as an example and does not constitute a limitation on the present application for those skilled in the art after reading this application. Although it is not explicitly stated here, those skilled in the art can make various modifications, improvements and modifications to the present application. Such modifications, improvements and modifications are suggested in the present application, so such modifications, improvements and modifications still belong to the spirit and scope of the exemplary embodiments of the present application.

[0101] Also, the use of "a" or "an" to describe elements of the application is merely for convenience and is not intended in a limiting sense unless specifically so indicated. Furthermore, some of the features of the application could be used to advantage without the corresponding use of other features. As such, the foregoing description shall not be construed to be a limitation on the scope thereof and it is understood that numerous other modifications and embodiments could be devised by those skilled in the art which fall within the scope of the principles of this application. More generally, the scope of the application is indicated by the appended claims rather than by the foregoing description.

[0102] Furthermore, those of ordinary skill in the art will appreciate that the various aspects of the application can be implemented in a variety of configurations or settings, including as a method, as a system, as a computer readable medium, or as a computer program product. Accordingly, the aspects of the application can be implemented in a variety of ways, including as a method, as a system, as a computer readable medium, or as a computer program product.

[0103] Furthermore, the order of processing elements or sequence of steps in which elements of the application are carried out, as well as the use of numbering and other nomenclature, are not intended to limit the order or process in which techniques of the application are carried out unless explicitly indicated as such. Although the above disclosure discusses some presently preferred embodiments of the application, the present application should not be limited to these embodiments alone. Rather, the scope of the present application is to be determined by the appended claims and their equivalents. For example, although the implementation of various components described above can be realized in hardware, it can also be realized in software. For example, the implementation can be realized as a software solution on an existing server or mobile device.

[0104] Similarly, it is to be noted that, as used in the preceding description, the expressions "a" or "one" are intended to mean "at least one" or "one or more" unless specifically indicated to the contrary. Furthermore, the use of the term "or" is intended to mean "and / or" unless specifically indicated to the contrary.

Claims

1. A high-speed road surface detection system, characterized in that, include: The drone is equipped with a remote system and / or a proximity controller for controlling the drone to perform flight operations; An ultrasonic sensor, mounted on the UAV, is used to perform ultrasonic imaging of the highway surface to obtain ultrasonic images; A memory for storing the ultrasonic images; The remote system is equipped with an image processor. When the UAV communicates with the remote system, the remote system acquires the ultrasonic image stored in the memory, controls the image processor to perform image processing on the ultrasonic image, and uses the image set obtained after image processing as the highway road detection result. The drone includes: The fuselage has a mounting bracket on its top; At least six main rotor units are mounted on the mounting frame; Two auxiliary rotor units are respectively located at the front and rear ends of the fuselage; The bottom of the fuselage is equipped with rollers, which allow the drone to move on the high-speed road. This allows the drone to obtain ultrasonic images during flight and ultrasonic images during road movement, and the two types of ultrasonic images can be compared to improve the accuracy and reliability of the detection. The ultrasonic sensor includes a transmitter circuit and a receiver circuit. The transmitter circuit includes transmitters LS3 and LS4, and the receiver circuit includes receivers LS1 and LS2. Receivers LS1, LS2, LS3, and LS4 are installed in pairs at the front and rear ends of the sensor body, respectively. Transmitters LS3 and LS4 emit ultrasonic waves towards the highway surface. The ultrasonic waves are reflected by the highway surface, and receivers LS1 and LS2 receive the reflected waves, ultimately obtaining two sets of ultrasonic images. By comparing the two sets of ultrasonic images, the accuracy and reliability of the detection results can be further improved.

2. The highway pavement detection system according to claim 1, characterized in that, The main rotor assembly consists of eight units, which are symmetrically distributed on the mounting frame.

3. The high-speed road surface detection system according to claim 1, characterized in that, The horizontal heights of the two auxiliary rotor devices are inconsistent.

4. The highway pavement detection system according to claim 1, characterized in that, The ultrasonic sensor also includes a control circuit and a power supply circuit. The power supply circuit is connected to the control circuit, the transmitter circuit, and the receiver circuit respectively to provide operating voltage. The control circuit is connected to the transmitter circuit and the receiver circuit respectively to perform ultrasonic imaging.

5. The high-speed pavement detection system according to claim 4, characterized in that, The power supply circuit includes a power interface J1, capacitors C20, C15, C21, C16, C22, and a voltage regulator U5. Pin 1 of the power interface J1 is connected to one end of capacitors C20, C15, and C21, and pin 1 of the voltage regulator U5 to serve as the +12 voltage terminal. Pin 3 of the power interface J1 is connected to the other end of capacitor C20 and then grounded. Pin 3 of the voltage regulator U5 is connected to one end of capacitor C16 and one end of capacitor C22 to serve as the +5 voltage terminal. The other end of capacitor C15 is connected to the other end of capacitor C21, pin 2 of the voltage regulator, the other end of capacitor C16, and the other end of capacitor C22 and then grounded.

6. The high-speed pavement detection system according to claim 5, characterized in that, The control circuit includes a microcontroller U4, capacitors C14, C18, and C19, and a crystal oscillator Y1. Pin 2 of the microcontroller U4 is connected to the grounded capacitor C14 and then connected to an external voltage terminal +5. Pin 26 of the microcontroller U4 is connected to one end of the crystal oscillator Y1 and the grounded capacitor C19. Pin 27 of the microcontroller U4 is connected to the other end of the crystal oscillator Y1 and the grounded capacitor C18.

7. The high-speed pavement detection system according to claim 6, characterized in that, The transmitter circuit also includes an inductor L1, a capacitor C13, a capacitor C17, a NAND gate U3A, a NAND gate U3B, a NAND gate U3C, a NAND gate U3D, and a NAND gate U3E; one end of the inductor L1 is connected to an external voltage terminal +5, and the other end of the inductor L1 is connected to one end of the capacitor C17, one end of the capacitor C13, and pin 14 of the NAND gate U3E; the other end of the capacitor C17 is connected to the other end of the capacitor C13 and pin 7 of the NAND gate U3E and then grounded; pin 9 of the microcontroller U4 is connected to pin 4 of the NAND gate U3B and pin 10 of the NAND gate U3C. Pin 10 of the microcontroller U4 is connected to pin 5 of the NAND gate U3B and pin 2 of the NAND gate U3A. Pin 11 of the microcontroller U4 is connected to pin 9 of the NAND gate U3C and pin 13 of the NAND gate U3D. Pin 1 of the NAND gate U3A is connected to pin 6 of the NAND gate U3B and one end of the transmitter LS3. Pin 3 of the NAND gate U3A is connected to the other end of the transmitter LS3. Pin 12 of the NAND gate U3D is connected to pin 8 of the NAND gate U3C and one end of the transmitter LS4. Pin 11 of the NAND gate U3D is connected to the other end of the transmitter LS4.

8. The high-speed pavement detection system according to claim 7, characterized in that, The receiver circuit also includes capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, and C12; resistors R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12, R13, R14, R15, R16, R17, R18, R19, R20, R21, R22, R23, R24, R25, and R26; operational amplifiers U1A, U1B, U1C, U1D, U2A, U2B, U2C, and U2D; and diodes D1, D12, D3, and D4. One end of receiver LS1 is grounded, and the other end of receiver LS1 is connected to one end of capacitor C1. The other end of capacitor C1 is connected to one end of resistor R3. The other end of resistor R3 is connected to one end of resistor R23 and the inverting input of operational amplifier U1A. The non-inverting input of operational amplifier U1A is connected to one end of resistor R1, one end of resistor R2, one end of capacitor C11, the non-inverting input of operational amplifier U1B, and the non-inverting input of operational amplifier U1C. The other end of resistor R1 is connected to the positive terminal of operational amplifier U1A and then connected to an external voltage terminal +12. The other end of resistor R2 is connected to the other end of capacitor C11 and then grounded. The output terminal of operational amplifier U1A is connected to the other end of resistor R23 and one end of capacitor C2. The other end of capacitor C2 is connected to one end of resistor R4. The other end of resistor R4 is connected to the inverting input of operational amplifier U1B and one end of resistor R24. The output terminal of operational amplifier U1B is connected to the other end of resistor R24 ​​and one end of capacitor C3. The other end of capacitor C3 is connected to one end of resistor R5. The other end of resistor R5 is connected to the inverting input of operational amplifier U1C. The output terminal of operational amplifier U1C is connected to one end of resistor R21 and one end of capacitor C4. The other end of capacitor C4 is connected to the cathode of diode D1 and the anode of diode D2. The anode of diode D1 is connected to one end of capacitor C5 and then grounded. The other end of capacitor C5 is connected to the cathode of diode D2 and one end of resistor R6. The other end of resistor R6 is connected to the inverting input of operational amplifier U1D and the grounded resistor R28. The non-inverting input of operational amplifier U1D is connected to one end of resistor R7 and the grounded resistor R8. The other end of resistor R7 is connected to the external voltage terminal +12. The output terminal of operational amplifier U1D is connected to one end of resistor R9. The other end of resistor R9 is connected to pin 5 of microcontroller U4 and the grounded resistor R10. One end of receiver LS2 is grounded, and the other end of receiver LS2 is connected to one end of capacitor C6. The other end of capacitor C6 is connected to one end of resistor R13. The other end of resistor R13 is connected to one end of resistor R26 and the inverting input of operational amplifier U2A. The non-inverting input of operational amplifier U2A is connected to one end of resistor R11, one end of resistor R12, one end of capacitor C12, the non-inverting input of operational amplifier U2B, and the non-inverting input of operational amplifier U2C. The other end of resistor R11 is connected to the positive terminal of operational amplifier U2A and then connected to the external voltage terminal +12. The other end of resistor R12 is connected to the other end of capacitor C12 and then grounded. The output terminal of operational amplifier U2A is connected to the other end of resistor R26 and one end of capacitor C7. The other end of capacitor C7 is connected to one end of resistor R14. The other end of resistor R14 is connected to the inverting input of operational amplifier U2B and one end of resistor R25. The output terminal of operational amplifier U2B is connected to the other end of resistor R25 and one end of capacitor C8. The other end of capacitor C8 is connected to one end of resistor R15. The other end of resistor R15 is connected to the inverting input of operational amplifier U2C. The output terminal of operational amplifier U2C is connected to one end of resistor R22 and one end of capacitor C9. The other end of capacitor C9 is connected to the cathode of diode D3 and the anode of diode D4. The anode of diode D3 is connected to one end of capacitor C10 and then grounded. The other end of capacitor C10 is connected to the cathode of diode D4 and one end of resistor R16. The other end of resistor R16 is connected to the inverting input of operational amplifier U2D and grounded resistor R29. The non-inverting input of operational amplifier U2D is connected to one end of resistor R17 and grounded resistor R18. The other end of resistor R17 is connected to the external voltage terminal +12. The output terminal of operational amplifier U2D is connected to one end of resistor R19. The other end of resistor R19 is connected to pin 1 of microcontroller U4 and grounded resistor R20.

9. A method for detecting highway pavement, characterized in that, The highway pavement detection system according to any one of claims 1 to 8 is used, and the highway pavement detection method includes the following steps: S1. Control the drone to fly along the highway via a remote system and / or a proximity controller; S2. Using the ultrasonic sensor on the UAV, ultrasonic imaging is performed on the highway surface to obtain an ultrasonic image; S3. Transmit the ultrasonic image to the remote system; S4. The ultrasonic image is processed by the image processor of the remote system, and the resulting image set is used as the highway road surface detection result.

Images