Side storage compartment, equipment front-end module, and method for processing substrate

Abstract

An electronic device processing system including a side storage compartment is described herein. An electronic device processing system has: a side storage compartment having a first chamber configured to receive a side storage container; a panel having a panel opening; the panel configured to be coupled between the side storage container and a device front end module; the side storage container received in the first chamber; and an exhaust duct configured to be coupled to the side storage container, the side storage container being received and extending to the outside of the first chamber.

Description

[0001] This application is a divisional application of the invention patent application with the application date of May 25, 2018, application number 201880040461.8, and invention name "Side storage compartment, equipment front-end module and method for processing substrates".

[0002] Related Applications

[0003] This application claims priority to U.S. non-provisional application No. 15 / 632,074, filed on June 23, 2017, and entitled “SIDE STORAGE PODS, EQUIPMENT FRONT END MODULES, AND METHODS FOR PROCESSING SUBSTRATES” (Agent Docket No. 25135 / USA), the contents of which are incorporated herein by reference for all purposes. Technical Field

[0004] The present application relates to electronic device manufacturing; more particularly, to side storage bays and systems and methods for processing substrates. Background Art

[0005] Electronic device manufacturing systems may include a plurality of processing chambers arranged around a main frame housing having a transfer chamber and one or more load lock chambers configured to transfer substrates into the transfer chamber. For example, these systems may employ a transfer robot that may be housed in the transfer chamber. The transfer robot may be a selectively adaptable articulated robotic arm (SCARA) robot or the like, and may be adapted to transfer substrates between various chambers and one or more load lock chambers. For example, the transfer robot may transfer substrates from a processing chamber to a processing chamber, from a load lock chamber to a processing chamber, or vice versa.

[0006] Substrate processing in semiconductor component manufacturing may be performed in multiple tools, with substrates traveling between tools in a substrate carrier (e.g., a front opening unit or FOUP). Exposing the substrate to certain environmental conditions during processing may damage the substrate. For example, exposure to moisture during processing of the substrate may form acids on the substrate, which may degrade the quality of components manufactured on the substrate or destroy components manufactured on the substrate.

[0007] Therefore, improved systems, apparatus, and methods for controlling environmental conditions of substrates during processing are desirable. Summary of the invention

[0008] In one aspect, a side storage compartment is provided. The side storage compartment includes: a first chamber, the first chamber is configured to receive a side storage container; a panel, the panel having a first panel side, a second panel side, and a panel opening extending between the first panel side and the second panel side, the first panel side is configured to be coupled to the first chamber, wherein the panel opening is adjacent to the first chamber, and the second panel side is configured to be coupled to a device front end module; a side storage container, the side storage container is received in the first chamber, the side storage container has a plurality of vertically spaced substrate holders, each of the plurality of vertically spaced substrate holders is configured to support a substrate; and an exhaust duct, the exhaust duct is configured to be coupled to the side storage container, the side storage container is received and extends to the outside of the first chamber.

[0009] In another aspect, an electronic device processing system is provided. The electronic device processing system includes: a device front end module, the device front end module including a device front end module chamber having one or more interface openings; a side storage compartment, the side storage compartment having one or more chambers, each of the one or more chambers being configured to receive a side storage container, and each of the one or more chambers including: a panel opening, the panel opening being located near an interface opening of the one or more interface openings; an inner door, the inner door having an open state in which gas flow through the interface opening and the panel opening is enabled and a closed state in which gas flow through the interface opening and the panel opening is disabled; and an exhaust duct, the exhaust duct being configured to be coupled to the side storage container received in the one or more chambers.

[0010] In yet another aspect, a side storage container is provided. The side storage container includes: an interior configured to receive one or more substrates; a hatch opening, wherein the one or more substrates can be received into the interior via the hatch opening; an exhaust duct coupled to the interior; and an exhaust port coupled to the exhaust duct; wherein the hatch opening is configured to align with a panel opening in a panel coupled to the side storage container, and wherein an inner door can be received in the panel opening.

[0011] Numerous other aspects are provided according to these and other embodiments of the present application. Other features and aspects of the embodiments of the present application will become more apparent according to the following embodiments, the appended claims and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The drawings and the following description are for illustrative purposes and are not necessarily drawn to scale. The drawings are not intended to limit the scope of the present application in any way.

[0013] Figure 1A schematic top view of an electronic device handling system including a side storage compartment is shown according to an embodiment.

[0014] Figure 2A A front view of an equipment front end module (hereinafter "EFEM") including a side storage compartment coupled to the EFEM is shown according to an embodiment.

[0015] Figure 2B An isometric view of a side storage compartment coupled to an EFEM is shown in accordance with an embodiment.

[0016] Figure 3A A side view of a side storage compartment coupled to an EFEM with a side wall of the side storage compartment removed is shown in accordance with an embodiment.

[0017] Figure 3B A partial isometric view of a side storage compartment coupled to an EFEM with side walls, a top wall, and a door of the side storage compartment removed is shown in accordance with an embodiment.

[0018] Figure 3C A partial isometric view of a securing mechanism configured to retain a side storage container within a cavity of a side storage compartment is shown according to an embodiment.

[0019] Figure 4A A cross-sectional side view showing an interface between an EFEM and a side storage compartment according to an embodiment.

[0020] Figure 4B A cross-sectional side view of a seal between a door and a chamber is shown according to an embodiment.

[0021] Figure 5A A top plan view of a platform holding a side storage container within a cavity of a side storage compartment is shown in accordance with an embodiment.

[0022] Figure 5B According to the embodiment Figure 5A Side view of the platform.

[0023] Figure 6 A schematic diagram showing an exhaust gas duct and an exhaust gas control device according to an embodiment.

[0024] Figure 7 An isometric view of a side storage compartment coupled to an EFEM with an upper interior door in an open state and a lower interior door in a closed state is shown in accordance with an embodiment. DETAILED DESCRIPTION

[0025] Reference will now be made in detail to the exemplary embodiments of the present application shown in the accompanying drawings. As much as possible, the same reference numerals are used throughout the drawings to indicate the same or similar parts in several views. Unless otherwise specifically noted, the features of the various embodiments described herein may be combined with each other.

[0026] Electronic device manufacturing can involve very precise processing and involves rapid transfer of substrates between various locations. In particular, existing systems can transfer substrates between substrate carriers and load locks, and then into processing chambers, and vice versa. However, during processing, there may be a period of time when substrates may be idle while awaiting processing or after processing. During these idle periods, substrates may be exposed to relatively high humidity, high oxygen (O2) levels, and / or other environmental conditions that may adversely affect the substrates.

[0027] According to one or more embodiments of the present application, electronic device processing systems and methods adapted to provide improved substrate processing are provided. The systems and methods described herein can provide efficiency and / or processing improvements in substrate processing by controlling environmental exposure of the substrate and (particularly) conditions within a side storage compartment coupled to an EFEM. One or more side storage containers are configured to receive substrate holders (e.g., racks) that receive substrates within the side storage compartment and include during a processing cycle (e.g., during idle periods before and / or after substrate processing). Gas can flow from the EFEM and into the side storage container, where the gas flows through the substrate. Thus, the substrate is exposed to the gas within the EFEM, which can have certain environmental conditions (e.g., relatively dry and / or having relatively low O2 levels). After passing through the substrate, the gas is exhausted from the side storage container.

[0028] Reference to this application Figures 1 to 7 Further details of exemplary embodiments of a side storage compartment, a system including a side storage compartment, and a method of processing a substrate in a side storage compartment are described below.

[0029] Figure 1 A schematic diagram of an exemplary embodiment of an electronic device processing system 100 according to one or more embodiments of the present application is shown. The electronic device processing system 100 may include a main frame housing 101 having a housing wall defining a transfer chamber 102. A transfer robot 103 (illustrated as a dashed circle) may be at least partially accommodated within the transfer chamber 102. The transfer robot 103 may be configured to place a substrate to a destination and extract a substrate from a destination via operation of an arm (not shown) of the transfer robot 103. A substrate as used herein may refer to an article used to manufacture an electronic device or circuit component, such as a semiconductor wafer, a silicon-containing wafer, a patterned wafer, and a glass plate, or the like.

[0030] When commands are issued from the controller 106, the movement of the various arm components of the transfer robot 103 may be controlled by appropriate commands to a drive assembly (not shown) including a plurality of drive motors of the transfer robot 103. Signals from the controller 106 may cause movement of the various components of the transfer robot 103. Suitable feedback mechanisms may be provided for one or more components by various sensors such as position encoders or the like.

[0031] The transfer robot 103 may include an arm that can rotate about a shoulder axis, and the arm may be located approximately centrally in the transfer chamber 102. The transfer robot 103 may include a base that is configured to be attached to a housing wall (e.g., a floor) that forms a lower portion of the transfer chamber 102. However, in some embodiments, the transfer robot 103 may be attached to a top plate. The transfer robot 103 may be a dual-type robot configured to service dual chambers (e.g., side-by-side chambers) when the tool includes a duplex process chamber (as shown). Other types of process chamber orientations and transfer robots may be used.

[0032] The transfer chamber 102 in the depicted embodiment may be square or slightly rectangular in shape and may include a first facet 102A, a second facet 102B opposite the first facet 102A, a third facet 102C, and a fourth facet 102D opposite the third facet 102C. The transfer robot 103 may preferably be adept at simultaneously transferring and / or retracting dual substrates into the chamber group. The first facet 102A, the second facet 102B, the third facet 102C, and the fourth facet 102D may be planar, and an entryway into the chamber group may be placed along each facet. However, other suitable shapes of the main frame housing 101 and multiple facets and processing chambers are possible.

[0033] The destination of the transfer robot 103 may be a first processing chamber set 108A, 108B coupled to the first facet 102A, and the first processing chamber set 108A, 108B may be configured and operable to perform a process on the substrate transferred thereto. The process may be any suitable process, such as plasma vapor deposition (PVD) or chemical vapor deposition (CVD), etching, annealing, pre-cleaning, metal or metal oxide removal, or the like. Other processes may be performed on the substrate therein.

[0034] The destination of the transfer robot 103 may also be a second processing chamber group 108C, 108D which may be opposite to the first processing chamber group 108A, 108B. The second processing chamber group 108C, 108D may be coupled to the second facet 102B and may be configured to perform any suitable process on the substrate (such as any of the processes described above). Similarly, the destination of the transfer robot 103 may also be a third processing chamber group 108E, 108F which may be opposite to the load lock device 112 coupled to the third facet 102C. The third processing chamber group 108E, 108F may be configured to perform any suitable process on the substrate (such as any of the processes described above).

[0035] The substrates may be received from the EFEM 114 into the transfer chamber 102 and also exit the transfer chamber 102 to the EFEM 114 via a load lock apparatus 112 coupled to a surface (e.g., a back wall) of the EFEM 114. The load lock apparatus 112 may include one or more load lock chambers (e.g., load lock chambers 112A, 112B). The load lock chambers 112A, 112B included in the load lock apparatus 112 may be single wafer load lock (SWLL) chambers, multi-wafer chambers, or a combination thereof.

[0036] The EFEM 114 may be any housing having sidewall surfaces (e.g., front, rear and sidewalls, top and bottom, for example) that form an EFEM chamber 114C. One or more load ports may be provided on a surface (e.g., front surface) of the EFEM 114, and the one or more load ports may be configured to receive one or more substrate carriers 116 (e.g., FOUPs) at the one or more load ports. Three substrate carriers 116 are illustrated, but a greater or lesser number of substrate carriers 116 may interface with the EFEM 114.

[0037] The EFEM 114 may include a suitable loading / unloading robot 117 (shown in phantom) of conventional construction within an EFEM chamber 114C of the EFEM 114. Once the door of the substrate carrier 116 is opened, the loading / unloading robot 117 may be configured and operated to extract substrates from the substrate carrier 116 and feed the substrates through the EFEM chamber 114C and into one or more load lock chambers 112A, 112B of the load lock apparatus 112. Optionally, once the door of the substrate carrier 116 is opened, the loading / unloading robot 117 may be configured and operated to extract substrates from the substrate carrier 116 and feed the substrates into a side storage bay 144 when the substrates are idle and awaiting processing. The side storage bay 144 is coupled to a side wall of the EFEM 114. The loading / unloading robot 117 may further be configured to extract substrates from and load substrates into the side storage bays 144 before and after processing in one or more of the processing chambers 108A-108F. In some embodiments, the loading / unloading robot 117 is a high Z robot configured to access substrates stacked greater than 26 high, or even 52 high or higher, in the side storage bays 144. Any suitable structure of the load lock apparatus 112 that allows for transfer of substrates between the transfer chamber 102 and the EFEM chamber 114C may be used.

[0038] In the depicted embodiment, the EFEM chamber 114C may be provided with environmental controls that provide an environmentally controlled atmosphere therein. In particular, an environmental control system 118 is coupled to the EFEM 114 and is operable to monitor and / or control environmental conditions within the EFEM chamber 114C. In some embodiments, and at certain times, the EFEM chamber 114C may receive an inert and / or non-reactive gas therein, such as argon (Ar), nitrogen (N2), or helium (He), from an inert gas supply 118A. In other embodiments, or at other times, air (e.g., dry filtered air) may be provided from an air supply 118B. The environmental conditions within the EFEM chamber 114C may exist in side storage containers (310 and 312, which are located within and as part of the side storage compartment 144). Figure 3A ) inside.

[0039] In more detail, the environmental control system 118 may control at least one of: 1) relative humidity (RH), 2) temperature (T), 3) amount of O2, or 4) amount of inert gas within the EFEM chamber 114C. Other environmental conditions of the EFEM 114 may be monitored and / or controlled, such as the flow rate of gas entering the EFEM chamber 114C, or the pressure within the EFEM chamber 114C, or both.

[0040] In some embodiments, the environmental control system 118 includes a controller 106. The controller 106 may include a suitable processor, memory, and electronic components for receiving inputs from various sensors and controlling one or more valves to control environmental conditions within the EFEM chamber 114C. In one or more embodiments, the environmental control system 118 may monitor relative humidity (RH) by sensing RH in the EFEM 114 using a relative humidity sensor 130 configured to sense relative humidity (RH). Any suitable type of relative humidity sensor 130 may be used (e.g., a capacitive type sensor). The RH may be reduced by flowing an appropriate amount of inert gas from an inert gas supply 118A of the environmental control system 118 into the EFEM chamber 114C. As described herein, the inert and / or non-reactive gas from the inert gas supply 118A may be argon, N2, helium, another non-reactive gas, or a mixture thereof. For example, compressed bulk inert gas having a low H2O level (eg, purity >= 99.9995%, H2O < 5 ppm) may be used as the inert gas supply 118A in the environmental control system 118. Other H2O levels may be used.

[0041] In another aspect, the environmental control system 118 measures the relative humidity value using the relative humidity sensor 130. As discussed above, the RH can be lowered to the environmental control system 118 by a control signal from the controller 106, thereby initiating a flow of an appropriate amount of inert and / or non-reactive gas from the inert gas supply 118A into the EFEM chamber 114C. In one or more embodiments, the predetermined reference relative humidity value can be less than 1000 ppm moisture, less than 500 ppm moisture, or even less than 100 ppm moisture, depending on the moisture level that can be tolerated by a particular process performed in the electronic device processing system 100 or a particular substrate exposed to the environment of the EFEM 114.

[0042] In some embodiments, the environmental control system 118 of the electronic device processing system 100 may include an air supply 118B coupled to the EFEM 114. The air supply 118B may be coupled to the EFEM 114 via suitable piping and one or more valves. The environmental control system 118 may include an oxygen sensor 132 configured and adapted to sense the level of oxygen (O2) within the EFEM 114. In some embodiments, a control signal from the controller 106 to the environmental control system 118 to initiate a flow of an appropriate amount of inert gas from the inert gas supply 118A into the EFEM chamber 114C may occur to control the level of oxygen (O2) below a threshold O2 value. In one or more embodiments, the threshold O2 value may be less than 50 ppm, less than 10 ppm, or even less than 5 ppm, depending on the level of O2 that can be tolerated (without affecting quality) by a particular process performed in the electronic device processing system 100 or a particular substrate exposed to the environment of the EFEM 114. The environmental control system 118 may further include a pressure sensor 133 that measures an absolute pressure or a relative pressure within the EFEM 114. In some embodiments, the controller 106 may control the amount of inert gas flowing from the inert gas supply 118A into the EFEM chamber 114C to control the pressure in the EFEM chamber 114C. In some embodiments, the oxygen sensor 132 may sense the oxygen level in the EFEM chamber 114C to ensure that the oxygen level is above a safe threshold level, thereby allowing entry into the EFEM chamber 114C.

[0043] In the embodiments depicted herein, the controller 106 may be any suitable controller having a suitable processor, memory, and peripheral components adapted to receive control inputs from various sensors (e.g., relative humidity sensor 130 and / or oxygen sensor 132), and the controller 106 implements a closed loop or other suitable control scheme. In one embodiment, the control scheme may vary the flow rate of gas introduced into the EFEM 114 to achieve predetermined environmental conditions therein. In another embodiment, the control scheme may determine when to transfer a substrate into the EFEM 114.

[0044] The side storage compartment 144 attached to the EFEM 114 can store substrates under specific environmental conditions. For example, the side storage compartment 144 can store substrates under the same environmental conditions as those present in the EFEM chamber 114C. The side storage compartment 144 can be fluidly coupled to the EFEM chamber 114C and can receive an inert gas from the EFEM 114. Therefore, the substrates stored in the side storage compartment 144 are exposed to the same environmental conditions as the EFEM 114. The side storage compartment 144 can include an exhaust duct to exhaust gas from the side storage compartment 144, which further enables the substrates stored in the side storage compartment 144 to be stably exposed to the same environmental conditions of the EFEM 114. Therefore, the environmental control of the EFEM chamber 114C also controls the environment within the side storage compartment 144.

[0045] Figure 2A A front view of the EFEM 114 and a side view of an embodiment of a side storage compartment 144 are shown. Figure 2B An isometric view of the side storage compartment 144 is shown. Figure 2A and Figure 2B The depicted side storage compartment 144 includes a first wall 200, a second wall 202 positioned opposite the first wall 200, a top wall 204, and a bottom wall 206. The front portion of the side storage compartment 144 may include an upper door 210 and a lower door 212. The upper door 210 and the lower door 212 may form a seal with the end portions of the first wall 200, the second wall 202, the top wall 204, and the bottom wall 206. The upper door 210 and the lower door 212 may be hinged doors that include hinges 213 or removable panel doors (e.g., screw-in sealed panel doors) that allow access to the interior of the side storage box 144 but can be sealed when closed. In some embodiments, a single door may be used instead of the upper door 210 and the lower door 212. Suitable O-rings, gaskets, or other seals on the upper door 210 and the lower door 212 or on the end portions may form a hermetic seal of the side storage compartment 144. In some embodiments, upper door 210 may form a first sealed compartment that is separate and separately sealable from a second sealed compartment sealed by lower door 212. Other types of doors may be used to access the interior of side storage compartment 144.

[0046] The side storage compartment 144 may have an interface side 215 positioned opposite the upper door 210 and the lower door 212. A panel 216 having a first side 217 and a second side 218 may be attached to the interface side 215 of the side storage compartment 144. Specifically, the first side 217 of the panel 216 may be attached to the interface side 215 of the side storage compartment 144. The second side 218 of the panel 216 may be attached to a surface 220 located on the exterior of the EFEM 114. As described below, the panel 216 may form an airtight sealed interface between the interior of the EFEM 114 and the interior of the side storage compartment 144. In some embodiments, the panel 216 may be integrally formed with the side storage compartment 144 or the EFEM 114.

[0047] like Figure 2B As best shown, the side storage compartment 144 may include an upper inner door 222 and a lower inner door 224 that allow or prevent gas from flowing between the EFEM chamber 114C of the EFEM 114 and the interior of the side storage compartment 144. The upper inner door 222 and the lower inner door 224 may be panels that slide in and out of a wall (e.g., the second wall 202 shown or another wall) and / or panels 216 as described in more detail below. Figure 2B As shown, the upper inner door 222 and the lower inner door 224 can seal the EFEM chamber 114C from the inside of the side storage compartment 144 when the upper inner door 222 and the lower inner door 224 are in a closed state. When the inner door is in an open state, the upper inner door 222 and the lower inner door 224 can allow gas to flow from the EFEM chamber 114C into the side storage containers 310, 312 ( Figure 3A Other configurations of the upper inner door 222 and the lower inner door 224 may be used in the side storage compartment 144 to implement selective opening and closing of the interior of the side storage containers 310, 312.

[0048] The side storage compartment 144 may include an upper interlock 225 and a lower interlock 226 that engage the upper interior door 222 and the lower interior door 224, respectively. The upper interlock 225 may include a latch 227 that may be movable to engage and disengage the upper interior door 222. For example, the latch 227 may be normally in a position that prevents the upper interior door 222 from opening. When certain interlock conditions described herein are met, the latch 227 may be moved or moved by a user to enable the upper interior door 222 to open. The lower interlock 226 may have a latch 228 that operates in the same manner as the latch 227. Other interlocks may be used to prevent the upper interior door 222 and the lower interior door 224 from opening unless certain conditions are met.

[0049] The side storage compartment 144 may include an upper chamber 302 and a lower chamber 304 ( Figure 3A), the upper chamber 302 and the lower chamber 304 include side storage containers 310, 312, and each of the upper chamber 302 and the lower chamber 304 may have an exhaust duct passing therethrough. The duct may be coupled to the side storage containers 310, 312 received in the upper chamber 302 and the lower chamber 304 to exhaust gas from the side storage containers 310, 312. Figure 2B and Figure 3B The depicted side storage compartment 144 includes an upper exhaust duct 230 and a lower exhaust duct 234. The upper exhaust duct 230 and the lower exhaust duct 234 can be coupled to quick-connect components 301U, 301L ( Figure 3B ) so that the upper side storage container 310 and the lower side storage container 312 can be quickly removed or quickly received with the corresponding upper chamber 302 and the lower chamber 304. In some embodiments, the quick connection components 301U, 301L can each include a valve (e.g., a check valve or other suitable control valve) that can regulate the airflow from the side storage container 310, 312 received in the side storage compartment 144 and can also allow for quick disconnection from the side storage container 310, 312. Optionally, the valve configured to regulate the airflow can be located elsewhere downstream of the quick connection components 301U, 301L. The side storage compartment 144 can have a sealing material 240 (e.g., a gasket or other airtight seal) located between the exhaust ducts 230, 234 and the wall (e.g., the second wall 202), which prevents gas from leaking into or out of the side storage compartment 144 adjacent to the duct. The exhaust ducts 230 , 234 may be routed in other configurations, such as through other walls.

[0050] Reference now Figure 3A and Figure 3B , Figure 3A and Figure 3B One embodiment of the interior of the side storage compartment 144 is shown. Figure 3A The removal of the first wall 200 ( Figure 2A ) is a front view of the EFEM 114 and the side storage compartment 144 to illustrate an embodiment of the interior of the side storage compartment 144. Figure 3B An isometric view of the side storage compartment 144 is shown with the top wall 204 , the first wall 200 , the upper door 210 , and the lower door 212 removed to illustrate an embodiment of the interior of the side storage compartment 144 .

[0051] As depicted, the side storage compartment 144 includes an upper chamber 302 and a lower chamber 304. However, other embodiments of the side storage compartment may include a greater number of chambers (e.g., three or more chambers stacked vertically). The upper chamber 302 is configured to receive an upper side storage container 310, such as via an upper door 210. The lower chamber 304 is configured to receive a lower side storage container 312, such as via a lower door 212. A plurality of substrates 335 (e.g., Figure 3B 108A-108F) can be transferred between the upper side storage container 310 and the EFEM 114 and the lower side storage container 312 and the EFEM 114. For example, before and / or after processing in one or more processing chambers 108A-108F, the loading / unloading robot 117 can transfer substrates 335 between the EFEM 114, the upper side storage container 310, and the lower side storage container 312. In some embodiments, the upper side storage container 310 and the lower side storage container 312 can each receive twenty-six substrates 335. The upper side storage container 310 and the lower side storage container 312 can maintain the substrates 335 under specific environmental conditions during storage of the substrates. For example, as described above, the substrates 335 can be exposed to an inert gas or other gas within the EFEM 114. The environmental conditions can be controlled to provide exposure below a preselected water and / or O2 threshold or other conditions as described above.

[0052] The upper side storage container 310 has a front portion 316 and a rear portion 318. The lower side storage container 312 has a front portion 320 and a rear portion 322. The front portion 316 of the upper side storage container 310 may have an upper flange 324, and the front portion 320 of the lower side storage container 312 may have a lower flange 326. The upper flange 324 and the lower flange 326 may have seals 327 (e.g., gaskets and O-rings and the like—see FIG. 1 ) around the perimeter of the upper flange 324 and the lower flange 326 that prevent gas from the EFEM 114, the interior of the upper side storage container 310, and the interior of the lower side storage container 312 from entering the upper chamber 302 and the lower chamber 304. Figure 3C ).

[0053] The upper flange 324 of the upper storage container 310 and the lower flange 326 of the lower storage container 312 may be attached (eg, clamped) to the first side 217 of the panel 216 via a fixing mechanism 330. Figure 3C, shows an enlarged view of an embodiment of a fixing mechanism 330 that fixes the upper flange 324 of the upper side storage container 310 to the first side 217 of the panel 216. The following description of the fixing mechanism 330 applies to all fixing mechanisms 330. The fixing mechanism 330 may include a block 332 and a lip portion 334. The lip portion 334 may be configured to engage with the upper flange 324 of the upper side storage container 310. The fastener 336 may pass through a slot 337 in the block 332 and may be screwed into the panel 216. When the fastener 336 is tightened, the fastener 336 pushes the upper flange 324 toward the first side 217 of the panel 216 to fix and seal the upper side storage container 310 to the panel 216.

[0054] When the fasteners 336 are loosened, the slots 337 enable the fixing mechanism 330 to move toward and away from the upper flange 324. This movement enables the fixing mechanism 330 to engage the upper flange 324 when the upper flange 324 is in different positions relative to the panel 216. The movement further enables the fixing mechanism 330 to slide away from the upper flange 324 to disengage the upper flange 324 without removing the fasteners 336. Thus, the upper side storage container 310 can be removed from the panel 216 without removing the fasteners 336. Other mechanisms can be used to fix the upper side storage container 310 and the lower side storage container 312 to the panel 216. In the depicted embodiment, four fixing mechanisms 330 (two on each side) can be used to fix each of the upper side storage container 310 and the lower side storage container 312. However, other numbers and positions of fixing mechanisms 330 can be used.

[0055] The upper chamber 302 and the lower chamber 304 may be individually sealed. Specifically, the upper chamber 302 may be sealable to prevent gas exchange between the interior of the upper chamber 302 and the exterior of the side storage compartment 144. The interior of the upper chamber 302 may also be sealable so that no gas is exchanged with the EFEM chamber 114C. The seal may further prevent gas exchange between the upper chamber 302 and the lower chamber 304. However, gas may flow from the EFEM chamber 114C into the upper side storage container 310 and out of the upper exhaust duct 230. Likewise, gas may flow from the EFEM chamber 114C into the lower side storage container 312 and out of the lower exhaust duct 234.

[0056] Figure 4A A cross-sectional side view of an embodiment of an interface between the EFEM 114 and the side storage compartment 144 is shown. Specifically, Figure 4A The interface between the upper storage container 310 and the EFEM 114 is shown, which can be connected to the lower storage container 312 ( Figure 3B) and the interface between the EFEM 114 is the same. The panel 216 includes an interface portion 400 extending from the first side 217 to engage the front portion 316 of the upper storage container 310. The interface portion 400 extends around the periphery of a panel opening 402 formed in the panel 216. The panel opening 402 is located adjacent to the interface opening 404 in the EFEM 114. Figure 4A The upper chamber 302 is shown in a closed position with the upper inner door 222 in place adjacent the panel opening 402 to block airflow between the EFEM chamber 114C and the upper side storage container 310 .

[0057] The interface portion 400 may include a door groove 406 extending around the perimeter of the panel opening 402, the door groove 406 receiving the upper inner door 222, the door seal 410, and the door guide 412. In other embodiments, the upper inner door 222, the door seal 410, and the door guide 412 may be received in separate grooves. The door seal 410 may be an elastic material that prevents gas from leaking through the upper inner door 222 and / or leaking through the gap left when the upper inner door 222 is removed. Therefore, the door seal 410 can prevent gas from leaking into the interior of the upper chamber 302 and also prevent leakage out of the side storage compartment 144. The door guide 412 may be made of a material and / or structure that supports the upper inner door 222 in a predetermined position and pushes the upper inner door 222 against the door seal 410. Other seals and door guides may be used in the side storage compartment 144.

[0058] The upper side storage container 310 may have a hatch opening 416 located near the panel opening 402 to form a single opening in the interior of the upper side storage container 310 when the upper inner door 222 is in an open state. The panel opening 402 may be approximately the same size as the hatch opening 416. A hatch groove 418 may be formed in the upper flange 324 and may extend around the periphery of the hatch opening 416. A hatch seal 420 may be received in the hatch groove 418. The hatch seal 420 prevents gas from leaking through the interface of the front portion 316 of the upper side storage container 310 and the interface portion 400 of the panel 216. The hatch seal 420 may be a bendable material such as an elastomer-based material that contacts the hatch groove 418 and the interface portion 400. In some embodiments, the hatch seal 420 is a bendable tube that can be deformed to form a seal between the hatch groove 418 and the interface portion 400. Other types of seals may be used to seal the upper side storage container 310 and the interface portion 400.

[0059] The second side 218 of the panel 216 may have a panel groove 424 formed therein, extending around the perimeter of the panel opening 402. A panel seal 426 may be received in the panel groove 424 to prevent gas exchange between the panel 216 and the surface 220 of the EFEM 114. The panel seal 426 is a flat seal and may be made of ethylene propylene diene monomer (EPDM) rubber. In some embodiments, the panel seal 426 is about 11 mm deep and has a compression of about 5.8 mm. Other types of sealing mechanisms and materials may be used to form a seal between the surface 220 and the panel 216.

[0060] The interior of the upper storage container 310 may include a plurality of substrate holders 430 configured to support substrates 335 on the substrate holders 430. Figure 3B ). The substrate holders 430 may be vertically stacked shelves formed to the sides of the upper-side storage container 310, and may include a top substrate holder 432 and a bottom substrate holder 434. The substrate holders 430 may be spaced apart from each other by a distance such that gas can flow around (e.g., above and below) a substrate 335 received by and supported on the substrate holders 430. Specifically, gas entering the interior of the upper-side storage container 310 from the EFEM chamber 114C through the panel opening 402, the interface opening 404, and the cabin opening 416 may flow around the substrate 335 received on the substrate holder 430. Thus, the substrate 335 is maintained under the same environmental conditions as those existing in the EFEM 114.

[0061] The rear portion 318 of the upper side storage container 310 may include an opening 436 coupling the interior of the upper side storage container 310 with an exhaust duct 338. The exhaust duct 338 may be configured to provide the above-mentioned gas to flow around the substrate 335 received on the substrate holder 430. The exhaust duct 338 may have a height extending vertically between the top substrate holder 432 and the bottom substrate holder 434. The width of the exhaust duct 338 may be approximately the width of the substrate 335. For example, for a 300 mm wafer, the width may be approximately 250 mm to 350 mm. The exhaust duct 338 may include a duct configured to couple to the upper exhaust pipe 230 ( Figure 2B ) of the upper storage container 310. Thus, airflow through the interior of the upper storage container 310 enters the chamber opening 416, flows around the substrate 335 supported on the substrate holder 430, enters the exhaust duct 338 through the opening 436, and is exhausted through the exhaust port 440 and the upper exhaust duct 230. The airflow configuration enables the substrate 335 received in the substrate holder 430 to be placed under the same environmental conditions as the EFEM 114. In some embodiments, as Figure 4AAs shown, the exhaust port 440 is located near the lowest portion of the exhaust conduit 338 .

[0062] The upper storage container 310 may be disposed on a platform 444. The platform 444 may include a fixing mechanism and a leveling mechanism coupled to the platform 444. The lower storage container 312 ( Figure 3A ) may be disposed on a platform that is the same or similar to platform 444. In some embodiments, platform 444 is integral with side storage compartment 144, and in other embodiments, platform 444 is a separate unit attached to a structure within side storage compartment 144. Referring now additionally to FIG. 4 which illustrates a top view of an embodiment of platform 444 Figure 5A and a side view of the platform 444 Figure 5B The platform 444 may include an upper surface 500 and a lower surface 502 on which the upper-side storage container 310 may be positioned.

[0063] The platform 444 may include a plurality of kinematic pins 508 configured to assist in leveling the upper side storage container 310 . Figure 5A and Figure 5B The embodiment includes three kinematic pins 508 extending from the upper surface 500 and engaging with the upper side storage container 310. Other embodiments may include three or more kinematic pins 508. In some embodiments, the height of the engaging end of the kinematic pin 508 is adjustable so that the height of the kinematic pin 508 extending from the upper surface 500 can be adjusted. Adjusting the height of the three kinematic pins 508 allows the upper side storage container 310 to be reoriented (e.g., leveling and / or height adjustment) relative to the platform 444 (and more specifically, the loading / unloading robot 117 in the EFEM chamber 114C). Each kinematic pin 508 can provide a height adjustment of about 0 mm to 5 mm, or even 0 mm to 2 mm. The kinematic pin 508 can be received in a concave portion 545 formed in the lower side of the upper side storage container 310. The kinematic pin 508 may include any suitable end shape, including a cone, a dome, and a combination thereof. Other devices can be used to level and / or adjust the height of the upper side storage container 310 relative to the platform 444.

[0064] The platform 444 may further include a plurality of platform sensors 514 that generate electrical signals in response to placement of the upper storage container 310 on the platform 444. The platform sensors 514 may be any suitable proximity sensors, such as contact sensors or non-contact sensors (e.g., reed sensors, Hall effect sensors, force sensitive resistor (FSR) sensors, magnetic sensors, micro contact switches, roller lever micro switches, push button switches, and the like). Figure 5A and Figure 5BThe embodiment includes three platform sensors 514, one located near each motion pin 508. The platform sensor 514 can be a switch that changes state when the upper storage container 310 is properly placed on the platform 444 and / or on the motion pin 508. The state of the platform sensor 514 can be used to provide an interlock signal to determine whether the upper inner door 222 ( Figure 4A Other sensor devices can be used to determine whether the upper storage container 310 is correctly placed on the platform 444.

[0065] The fixing device 520 may be configured to fix the upper-side storage container 310 to the platform 444 . Figure 5A and Figure 5B The fixture 520 depicted in FIG. 4 may include a cylinder 523 that pushes the upper side storage container 310 toward the upper surface 500 of the platform 444. The fixture 520 may extend through a hole 522 in the platform 444. A tab 526 may engage an engagement portion 527 formed on the lower side of the upper side storage container 310. The cylinder may then force the tab 526 toward the upper surface 500, which secures the upper side storage container 310 to the platform 444. In some embodiments, the tab 526 is normally in a position to force the upper side storage container 310 toward the platform 444 and is released in response to an increase in air pressure entering the fixture 520. In some embodiments, when the cylinder 523 is actuated, the concave portion 545 on the lower side of the upper side storage container 310 is pushed into contact with the engagement end of the motion pin 508 so that the tab 526 exerts a force on the engagement portion 527.

[0066] See again Figure 4A , seal 450 may be positioned between upper door 210 and the wall of upper chamber 302. Similarly, seal 452 may be positioned between lower door 212 and the wall of lower chamber 304. Seal 450 and seal 452 may be used to hermetically seal upper door 210 to upper chamber 302 and lower door 212 to lower chamber 304. Seal 450 may have the same physical configuration as seal 452.

[0067] Reference now Figure 4B , Figure 4B An enlarged side cross-sectional view of seal 450 is shown. Seal 450 can be a spherical seal and can include a ring 453 configured to contact the wall of upper chamber 302. The contact can compress or deform the ring 453 to form an airtight seal between the wall and upper door 210. Rod 454 can couple ring 453 to foot 456 that can be fastened (e.g., adhered) to upper door 210. Seal 452 ( Figure 4A) may have the same configuration as seal 450 and may be secured to lower door 212. Ring 453 may have a diameter of approximately 12 mm and may be compressed to approximately 6 mm. Seals 450 and 452 may be made of EPDM rubber. Other sealing configurations and materials may be used.

[0068] Figure 6 A schematic diagram illustrating an embodiment of an exhaust conduit and an exhaust control device coupled thereto is shown. Figure 6 The upper chamber 302 and the lower chamber 304 are shown positioned in a side-by-side orientation (rather than one above the other) for illustration purposes only. In the illustrated embodiment, the upper exhaust duct 230 may include a first valve 600 coupled in series, and the lower exhaust duct 234 may have a second valve 602 coupled in series. The upper exhaust duct 230 and the lower exhaust duct 234 may be coupled to a main exhaust duct 610, which may have a main valve 612 coupled in series. The first valve 600 controls the flow of gas through the upper exhaust duct 230, and the second valve 602 controls the flow of gas through the lower exhaust duct 234. The main valve 612 controls the flow of gas through the main exhaust duct 610. A pump 620 may be coupled to the main exhaust duct 610 to force gas through the upper exhaust duct 230 and the lower exhaust duct 234. The pump 620 may be a vacuum pump that draws gas from the upper exhaust duct 230 and the lower exhaust duct 234 (and thereby from the exhaust conduit 338). In some embodiments, the controller 106 ( Figure 1 ) together with the inflow from the inert gas supply 118A sets the gas flow through the main valve 612 to control the gas pressure within the EFEM chamber 114C. In some embodiments, for example, the absolute pressure within the EFEM chamber 114C can be between about 1" H20 (250 Pa) or about 2.5" H20 (625 Pa).

[0069] The first valve 600, the second valve 602, the main valve 612, and the pump 620 may be operated by a controller, such as the controller 106. The controller 106 may open or close the valves and may set the vacuum pressure of the pump 620. Other exhaust configurations and controls may be used.

[0070] Having described the numerous components of the EFEM 114 and the side storage compartment 144, their operation will now be described. The second side 218 of the panel 216 may be fastened to the surface 220 of the EFEM 114. This fastening causes the panel seal 426 to engage the surface 220 of the side wall of the EFEM 114 and prevent gas from leaking from the EFEM chamber 114C. The upper inner door 222 and the lower inner door 224 may be inserted into the panel 216 to prevent gas from the EFEM chamber 114C from flowing into the upper chamber 302 and the lower chamber 304. Subsequently, the EFEM 114 may be operable because the EFEM 114 is sealed from the upper chamber 302, the lower chamber 304, and the factory environment outside of the EFEM chamber 114C.

[0071] The following description describes attaching the upper side storage container 310 within the upper chamber 302, and is also applicable to attaching the lower side storage container 312 within the lower chamber 304. The upper side storage container 310 can be received in the upper chamber 302 by opening or removing the upper door 210. The upper side storage container 310 can then be disposed near the upper surface 500 of the platform 444. The motion pin 508 can be received in a concave portion 545 formed in the lower side of the upper side storage container 310. The height of the motion pin 508 can be adjusted to raise, lower and / or level the upper side storage container 310 to a horizontal plane or a plane of the end effector of the loading / unloading robot 117. When the upper side storage container 310 is correctly disposed on the platform 444, the upper side storage container 310 can toggle the platform sensor 514. The upper flange 324 can be fastened to the first side 217 of the panel 216 by a fixing mechanism 330. Tightening causes the cabin seal 420 to engage the interface portion 400, which prevents gas from the EFEM chamber 114C from entering the upper chamber 302. The upper exhaust duct 230 can be fastened to the exhaust port 440, such as by a quick connect member 301U, and the upper door 210 can be closed. At this point, the upper door 210 is in a closed configuration, and a latch (not shown) or the like can prevent accidental opening of the upper door 210.

[0072] A controller such as controller 106 may check certain interlocks and place the upper inner door 222 in an open state before the latch 227 is moved. Interlocks may ensure that the platform sensor 514 is in the correct state and that the upper door 210 is closed and / or locked. Other interlocks may ensure that the upper side storage container 310 is adjacent to the first side 217 of the panel 216 and that the panel 216 is located near the surface 220 of the EFEM 114. Other interlocks may ensure that the upper exhaust duct 230 is coupled to the quick connect member 301U. More, fewer, or different interlock conditions may be used. When all interlock conditions are met, the latch 227 may be moved or otherwise released to allow the upper inner door 222 to be removed. At this time or before this time, the controller 106 may open the first valve 600 and the main valve 612, and may operate the pump 620. Similarly, the inert gas supply 118A may begin to supply inert gas to the EFEM chamber 114C. In some embodiments, removal of the upper inner door 222 may lock the upper door 210 so that the upper door 210 cannot be opened when the upper inner door 222 is in the open state.

[0073] The loading / unloading robot 117 may move substrates 335 in and out of the substrate holders 430. The loading / unloading robot 117 may be a high Z robot having sufficiently high and low vertical entrances to access substrates in the top substrate holders 432 of the upper side storage container 310 and in the bottom substrate holders 434 of the lower side storage container 312. In some embodiments, substrates 335 are placed in the upper side storage container 310 and the lower side storage container 312 during idle periods of processing.

[0074] Gas from the EFEM chamber 114C flows through the port opening 404, the panel opening 402, and the hatch opening 416 and into the interior of the upper side storage container 310. Thus, the substrate 335 received on the substrate holder 430 is exposed to the environmental conditions of the EFEM 114, which are set by the controller 106 as described above. The gas continues to flow into the exhaust conduit 338 and out of the exhaust port 440. The gas is exhausted through the upper exhaust duct 230 and exhausted to the main exhaust duct 610 by at least the pump 620. In some embodiments, the gas passing through the substrate 335 may be contaminated after contacting the substrate 335, so the gas may not be recycled back into the EFEM 114, but may flow to a suitable scrubber.

[0075] At some time, the upper side storage container 310, the lower side storage container 312, or both may be removed, such as for cleaning. The following description describes the removal of the upper side storage container 310, and the following description also applies to the removal of the lower side storage container 312. The upper inner door 222 may be replaced within the panel 216, and the upper inner door 222 prevents gas from flowing from the EFEM 114 into the interior of the upper side storage container 310. Other evacuation techniques may be used to remove residual gas from the upper side storage container 310. The first valve 600 in series with the upper exhaust duct 230 may be closed. Replacing the upper inner door 222 may enable the upper door 210 to be opened. The upper exhaust duct 230 may be released from the quick connect member 301U, and the fixing mechanism 330 may be released from the upper flange 324. The fixing device 520 may be actuated to release the tab 526, and the upper side storage container 310 may be removed from the upper chamber 302. During the removal of the upper storage container 310 from the upper chamber 302, the latch 227 may be engaged to prevent the upper inner door 222 from opening. For example, the latch 227 may engage the upper inner door 222 in response to the upper door 210 opening.

[0076] The EFEM 114 may continue to operate during removal and replacement of the upper side storage container 310. Specifically, the upper inner door 222 remains in place, hermetically sealing the EFEM 114 from the interior of the upper chamber 302. Likewise, during removal and replacement of the lower side storage container 312, the upper side storage container 310 may be operated and accessed by the loading / unloading robot 117.

[0077] Reference now Figure 7 , Figure 7 An isometric view of another embodiment of a side storage compartment 144 coupled to the EFEM 114 is shown with the upper interior door 222 in a partially open state and the lower interior door 224 in a closed state. Referring to the upper interior door 222, the upper interior door 222 can be identical to the lower interior door 224. The upper interior door 222 can include a handle 700 and an opening 702 that allow a user to grasp the upper interior door 222 and move the upper interior door 222 into and out of the panel 216.

[0078] The handle 700 may have a recess 710 therein that receives an upper latch 716 to prevent the upper inner door 222 from being removed from the panel 216 unless certain interlock conditions are met. The side storage compartment 144 may include a lower latch 718 that may be received in a similar recess (not shown) on the lower inner door 224. Figure 7The lower latch 718 depicted in FIG. 1 is received in a groove in the lower inner door 224, thereby preventing the lower inner door from being removed from the panel 216 and being locked in a closed state. The upper latch 716 is not received in the groove 710, so the upper inner door 222 is in an open state and can be removed from the panel 216. When the upper inner door 222 is removed, the port 719 is closed by the door seal 410 and the door guide 412 ( Figure 4A ) to reseal. Similarly, in the closed state, the door seal 410 and the door guide 412 ( Figure 4A ) operation to seal the port 721 that receives the lower inner door 224.

[0079] The electronic device processing system 100 described herein provides an improved buffer station to store substrates 335 during idle periods in processing. Specifically, the substrates 335 can be placed in the upper-side storage container 310 and the lower-side storage container 312 during this idle period. While the substrates 335 are stored, they are stably exposed to the environmental conditions of the EFEM 114, which is controlled by the controller 106. Gas from the EFEM 114 that enters the interior of the upper-side storage container 310 and the lower-side storage container 312 can be exhausted and not returned to the EFEM 114. Therefore, if the substrates 335 release any contaminants, those contaminants will not return to the EFEM 114.

[0080] The side storage compartment 144 enables either or both of the upper side storage container 310 or the lower side storage container 312 to be removed without disabling continued operation of the EFEM 114 or the electronic device processing system 100. For example, the upper interior door 222 may be placed in the panel 216 and retained by the upper latch 716. The upper side storage container 310 and the upper chamber 302 are thus sealed from the EFEM chamber 114C. The upper side storage container 310 may then be removed without interrupting operation of the EFEM 114.

[0081] The above description discloses exemplary embodiments of the present application. Modifications of the above disclosed devices, systems and methods that fall within the scope of the present application will be apparent to those of ordinary skill in the art. Therefore, although the present application has been disclosed in conjunction with exemplary embodiments, it should be understood that other embodiments may fall within the scope of the present application as defined by the claims.

Claims

1. A device front-end module, include: a plurality of side walls forming a device front end module chamber configured to receive an inert gas from an inert gas supply, the plurality of side walls including a first side wall configured to be attached to a panel second side of a panel, wherein the panel forms a panel opening extending between the panel first side and the panel second side, wherein the panel first side is configured to be attached to a side storage compartment; and a robot disposed in the equipment front end module chamber, wherein the robot is configured to transfer a substrate from the equipment front end module chamber to the side storage compartment via the panel opening, wherein a side storage container is disposed in a chamber formed by the side storage compartment, and wherein the first side of the panel is configured to be sealed to the side storage container, wherein an exhaust pipe is coupled to the side storage container to discharge gas from the side storage container to the outside of the side storage compartment, and The inert gas received by the equipment front-end module chamber from the inert gas supply enters the interior of the side storage container through the panel opening, flows around the substrate on the substrate holder received in the side storage container, and is exhausted from the side storage container via the exhaust duct, and the flow of the inert gas maintains the substrate supported on the substrate holder under the same environmental conditions as those existing in the equipment front-end module.

2. An equipment front-end module according to claim 1, wherein the side storage compartment includes an inner door, the panel opening opens in response to the inner door being in an open state, and wherein in response to the inner door being in the open state, the inert gas is received by the equipment front-end module chamber.

3. The equipment front end module of claim 1, wherein the substrate holders are vertically stacked, and wherein the side storage containers form a bay opening for receiving the substrate from the equipment front end module.

4. The equipment front-end module according to claim 1, wherein the side storage container is configured to receive the inert gas from the equipment front-end module chamber via the panel opening, and wherein at least a portion of the inert gas will be discharged from the side storage container via the exhaust duct.

5. The device front-end module according to claim 1, wherein a valve is coupled to the exhaust duct, wherein a controller is configured to control the inert gas and the valve to control the pressure in the device front-end module chamber and the side storage container, and wherein the valve is configured to regulate the gas flow from the side storage container. 6 . The equipment front end module of claim 5 , wherein the controller is configured to control the inert gas and the valve according to sensor data associated with the equipment front end module chamber.

7. A system, include: a device front end module, the device front end module comprising a plurality of side walls forming a device front end module chamber, the device front end module chamber being configured to receive an inert gas from an inert gas supply, the plurality of side walls comprising a first side wall; a panel, the panel comprising a panel first side and a panel second side, the panel second side being configured to be attached to the first side wall of the device front end module, wherein the panel forms a panel opening extending between the panel first side and the panel second side; and a side storage compartment configured to be attached to the panel first side of the panel to receive a substrate from the device front end module via the panel opening, wherein a side storage container is disposed in a cavity formed by the side storage compartment, and wherein the panel first side is configured to be sealed to the side storage container, wherein an exhaust pipe is coupled to the side storage container to discharge gas from the side storage container to the outside of the side storage compartment, and The inert gas received by the equipment front-end module chamber from the inert gas supply enters the interior of the side storage container through the panel opening, flows around the substrate on the substrate holder received in the side storage container, and is exhausted from the side storage container via the exhaust duct, and the flow of the inert gas maintains the substrate supported on the substrate holder under the same environmental conditions as those existing in the equipment front-end module.

8. The system of claim 7, wherein the side storage compartment includes an inner door, the panel opening is open when the inner door is in an open state, and wherein the inert gas is received by the equipment front end module chamber in response to the inner door being in the open state.

9. The system of claim 7, wherein the side storage container is configured to receive the inert gas from the equipment front-end module chamber via the panel opening, and wherein at least a portion of the inert gas is exhausted from the side storage container via the exhaust duct.

10. The system of claim 7, wherein a valve is coupled to the exhaust duct, wherein a controller is configured to control the inert gas and the valve to control the pressure in the equipment front-end module chamber and the side storage container, and wherein the valve is configured to regulate the gas flow from the side storage container.

11. The system of claim 10, wherein the controller is configured to control the inert gas and the valve based on sensor data associated with the equipment front end module chamber.

12. A side storage compartment of a front-end module of an equipment, include: a first chamber configured as a receiving-side storage container; a panel having a panel first side, a panel second side, and a panel opening extending between the panel first side and the panel second side, wherein the panel opening is adjacent to the first cavity, and the panel second side is configured to be coupled to the equipment front end module; the side storage container disposed in the first chamber, the side storage container having vertically stacked substrate holders and a bay opening, wherein the bay opening is sealed against the panel opening; and an exhaust duct coupled to the side storage container and extending to the outside of the first chamber to exhaust gas from the side storage container, The inert gas received by the equipment front-end module enters the interior of the side storage container through the panel opening and the cabin opening, flows around the substrates received on the vertically stacked substrate holders, and is discharged from the side storage container via the exhaust duct, wherein the flow of the inert gas keeps the substrates supported on the vertically stacked substrate holders under the same environmental conditions as those existing in the equipment front-end module.

13. The side storage compartment of claim 12, wherein the compartment opening is coupled to a container interior, the container interior being configured to receive one or more substrates through the compartment opening.

14. The side storage compartment of claim 13, wherein the side storage container further comprises an exhaust port coupled to the container interior and configured to be coupled to the exhaust duct.

15. The side storage compartment of claim 14, further comprising a valve coupled to the exhaust conduit.

16. The side storage compartment of claim 13, wherein the side storage container includes an exhaust duct extending along an end of the side storage container opposite the compartment opening, the exhaust duct coupled to the container interior and to the exhaust pipe.

17. The side storage compartment of claim 12, further comprising: include: a platform configured to receive the side storage container on the platform; and a leveling mechanism coupled to the platform and configured to level the side storage container received on the platform, wherein the leveling mechanism includes three or more pins.

18. The side storage compartment of claim 17, further comprising one or more platform sensors coupled to the platform, the one or more platform sensors configured to change state in response to the side storage container being received into proximity with the platform.

19. The side storage compartment of claim 12, further comprising an inner door, the panel opening opening in response to the inner door being in an open state, and wherein the inert gas is received by the equipment front end module in response to the inner door being in the open state.

20. The side storage compartment of claim 19, further comprising a latch configured to engage the inner door, the latch configured to prevent the inner door from entering the open state in response to one or more interlock conditions not being satisfied.

21. The side storage compartment of claim 12, further comprising: include: a second chamber, one of the first chamber and the second chamber being disposed vertically above the other; and A second side storage container is received in the second chamber.

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