Display panel and manufacturing method thereof
By setting different stretchability of the organic encapsulation layer in different areas of the display panel, the problem of easy damage to the encapsulation layer during stretching is solved, and higher encapsulation reliability and deformation resistance are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HEFEI VISIONOX TECH CO LTD
- Filing Date
- 2023-02-24
- Publication Date
- 2026-06-19
Smart Images
Figure CN116471868B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of display technology, and in particular to a display panel and a method for manufacturing the same. Background Technology
[0002] With the development of flexible display technology, stretchable technology is a major development trend in display panels. It can form screens in the form of stretchable display panels, curved screens, foldable screens, etc.
[0003] When the display panel is stretched, it is affected by external forces. Due to the limitations of its tensile properties, the encapsulation layer of the display panel is easily damaged, especially in areas with large stretching, resulting in encapsulation failure. Summary of the Invention
[0004] The main technical problem addressed by this application is to provide a display panel and its manufacturing method, thereby improving the tensile strength of the encapsulation layer of the stretchable display panel and enhancing the encapsulation effect.
[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a display panel, including an array layer, a light-emitting layer and an encapsulation layer stacked together, wherein the encapsulation layer includes an organic encapsulation layer; in the extension direction of the display panel, the display panel includes multiple regions, and the organic encapsulation layers corresponding to the multiple regions have different stretchability.
[0006] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a method for manufacturing a display panel, including: forming an organic encapsulation layer; irradiating the organic encapsulation layer with ultraviolet light, wherein, in the extension direction of the display panel, the display panel includes multiple regions, and the organic encapsulation layers corresponding to the multiple regions have different stretchability.
[0007] The beneficial effects of this application are as follows: Unlike existing technologies, the display panel of this application is encapsulated in zones with different deformation requirements. The deformation requirements differ between these zones, and the organic encapsulation layers within the encapsulation layer have different stretchability for each zone. Since the higher the stretchability of the organic material, the stronger its resistance to deformation. Therefore, when the display panel is stretched or bent, the areas with higher stretchability are less prone to cracking or other damage during deformation, thus improving the reliability of the encapsulation layer. Conversely, the areas with lower stretchability exhibit higher adhesion between the encapsulation layers, resulting in a lower probability of layer detachment and ensuring the encapsulation performance. Attached Figure Description
[0008] Figure 1 This is a schematic diagram of the structure of one embodiment of the display panel of this application;
[0009] Figure 2This is a top view of one embodiment of the display panel of this application;
[0010] Figure 3 This is a top view of another embodiment of the display panel of this application;
[0011] Figure 4 This is a schematic diagram of another embodiment of the display panel of this application;
[0012] Figure 5 This is a top view of another embodiment of the display panel of this application;
[0013] Figure 6 This is a top view of another embodiment of the display panel of this application.
[0014] Figure 7 This is a schematic diagram of one structure of the organic encapsulation layer of this application;
[0015] Figure 8 This is another schematic diagram of the organic encapsulation layer in this application;
[0016] Figure 9 This is another schematic diagram of the organic encapsulation layer in this application;
[0017] Figure 10 This is a schematic diagram of another embodiment of the display panel of this application;
[0018] Figure 11 This is another structural schematic diagram of the display panel of this application;
[0019] Figure 12 This is a flowchart illustrating one embodiment of the method for manufacturing the display panel of this application. Detailed Implementation
[0020] To make the objectives, technical solutions, and effects of this application clearer and more explicit, the following detailed description is provided with reference to the accompanying drawings and embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0021] See Figure 1 , Figure 1 This is a schematic diagram of one embodiment of the display panel of this application. The display panel includes an array layer 1, a light-emitting layer 2, and an encapsulation layer 3 stacked together, wherein the encapsulation layer 3 includes an organic encapsulation layer 32;
[0022] In the extension direction of the display panel, the display panel includes multiple regions (not shown), and the organic encapsulation layers corresponding to the multiple regions have different stretchability.
[0023] The display panel of this application is partitioned and encapsulated in different areas, and the organic encapsulation layer 32 in the encapsulation layer 3 of different areas has different stretchability. Since the higher the stretchability of organic materials, the stronger their resistance to deformation, when the display panel is stretched, the organic encapsulation layer 32 in the area with higher deformation requirements can be set to have a higher stretchability, and the encapsulation layer 3 is less likely to be damaged by cracks during deformation, thus improving the reliability of the encapsulation layer 3; while the organic encapsulation layer 32 in the area with lower deformation requirements is set to have a lower stretchability. The adhesion between the film layers of the encapsulation layer 3 in the area with lower stretchability is higher, and the probability of film layer separation is lower, thus ensuring its encapsulation performance.
[0024] The inventors discovered through research that the stretchability of the organic encapsulation layer 32 can be changed by altering its curing rate.
[0025] Optionally, in some embodiments, the greater the deformation requirement of different regions, the lower the curing rate of the corresponding organic encapsulation layer 32, so as to increase the stretchability of the organic encapsulation layer 32. Specifically, the curing rate is 90%-95%. Specifically, the organic encapsulation layer 32 can be an organic adhesive layer, which can be cured by ultraviolet light irradiation. The higher the curing rate of the organic encapsulation layer 32, the higher its hardness and the stronger its adhesion to other film layers; while the lower the curing rate, the greater the stretchability of the organic encapsulation layer 32 and the stronger its resistance to deformation.
[0026] In one embodiment, see Figure 1 and Figure 2 , Figure 2This is a top view of one embodiment of the display panel of this application. The display panel can be a curved display panel. Multiple regions include a first region and a second region b, where the second region b is a planar portion and the first region a is a curved portion. The first region can be located on either side of the second region b. Alternatively, in other embodiments, the first region can surround the second region b. The deformation requirement of the curved portion is greater than that of the planar portion; therefore, the curing rate of the organic encapsulation layer 32 located in the first region a is greater than that of the organic encapsulation layer 32 located in the second region b. Specifically, the encapsulation layer 3 is sequentially stacked with a first inorganic layer 31, an organic encapsulation layer 32, and a second inorganic layer 33 along the direction away from the light-emitting layer 2. The curing rate of the organic encapsulation layer 32 located in the first region a is greater than that of the organic encapsulation layer 32 located in the second region b. Therefore, the organic encapsulation layer 32 in the first region a, which has a higher deformation requirement, has a higher stretchability. The encapsulation layer 3 in the first region a is less prone to cracks or other damage during bending, thus improving the reliability of the encapsulation layer 3 in this region. On the other hand, the organic encapsulation layer 32 in the second region b, which has a lower deformation requirement, has a lower stretchability or a higher curing rate. The organic encapsulation layer 32 in this region has a stronger adhesion to the first inorganic layer 31 and the second inorganic layer 33 on both sides, and the probability of separation between the film layers is low, thus ensuring its encapsulation performance.
[0027] In another embodiment, see Figure 3 , Figure 3 This is a top view of another embodiment of the display panel of this application. The display panel can be a bendable display panel, such as a foldable display screen. Multiple regions include a first region a and a second region b, where the second region b is a non-bendable portion and the first region a is a bendable portion. The second region b can be located on both sides of the first region a, and the display panel can be bent along the bendable portion and then bend along the two non-bendable portions. The deformation requirement of the bendable portion is greater than that of the non-bendable portion; therefore, the curing rate of the organic encapsulation layer (not shown) located in the first region a is greater than the curing rate of the organic encapsulation layer located in the second region b. Specifically, the curing rate of the organic encapsulation layer is 90%-95%, the curing rate of the organic encapsulation layer in the first region can be 90%, and the curing rate of the organic encapsulation layer 32 in the second region b can be 95%.
[0028] Optionally, see Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of another embodiment of the display panel of this application. Figure 5This is a top view of another embodiment of the display panel of this application. In this embodiment, multiple regions include a first region a, a second region b, and a transition region c connecting the second region b and the first region. The curing rate of the organic encapsulation layer 32 located in the transition region c is greater than that of the organic encapsulation layer 32 located in the first region, and less than that of the organic encapsulation layer 32 located in the second region b. The transition region c is used to connect the first region a and the second region b. When the curing rate of the organic encapsulation layer 32 in the transition region c is between the first region a and the second region b, the change in curing rate can be smoothly transitioned, reducing the probability of stress concentration problems at the junction of the first region a and the second region b. In other embodiments, multiple parallel transition regions c can be provided between the first region a and the second region b. In the direction from the second region b to the first region a, the curing rates of the organic encapsulation layers 32 in the multiple transition regions c decrease sequentially. Specifically, the curing rate of the organic encapsulation layer 32 is 90%-95%. For example, the curing rate of the organic encapsulation layer 32 in the first region a is 90%, the curing rate of the organic encapsulation layer 32 in the transition region c is 93%, and the curing rate of the organic encapsulation layer 32 in the second region b is 95%. Of course, in other embodiments, the curing rate of the organic encapsulation layer 32 can be gradually reduced from 95% to 90% in the direction from the second region b to the first region a, so that the change in stretchability is further smoothly transitioned and stress concentration is avoided.
[0029] In another embodiment, see Figure 6 , Figure 6 This is a top view of another embodiment of the display panel of this application. In the direction away from the center O of the display panel (direction A as indicated by arrow in the figure), the curing rate of the organic encapsulation layer 32 gradually decreases. This embodiment can be understood as follows: in the direction away from the center O of the display panel, the display panel is divided into multiple (unlimited) inner and outer annular regions (shown by dashed lines in the figure), wherein the organic encapsulation layer 32 in the central region has the highest curing rate among all regions. This embodiment is applicable to stretchable display panels, i.e., the display panel can be stretched from the center O to the sides or all around.
[0030] In other embodiments, the stretchability of the organic encapsulation layer 32 can also be altered by changing its structure. The inventors have discovered that the organic encapsulation layer 32 with the cutout portion 321 has a higher stretchability.
[0031] In one embodiment, see Figure 7 , Figure 7 This is a schematic diagram of one structure of the organic encapsulation layer 32 of this application. At least a portion of the organic encapsulation layer 32 includes a plurality of spaced-apart cutouts 321. Figure 2Taking the curved display panel shown as an example, the organic encapsulation layer 32 located in the first region a includes a plurality of spaced-apart cutouts 321, while the organic encapsulation layer 32 located in the second region b does not have cutouts 321. Specifically, the cutouts 321 can be exposed to form a patterned organic encapsulation layer 32; specifically, in this application, the organic encapsulation layer 32 has a mesh structure. This embodiment further improves the stretchability of the encapsulation layer 3 in the first region a by changing the structure of the organic encapsulation layer 32. Because of the hollow portions 321 formed on the organic encapsulation layer 32 in the first region a, where deformation requirements are high, cracks and other damage are less likely to occur in the organic encapsulation layer 32 when the display panel is bent, thus improving the deformation resistance of the organic encapsulation layer 32 in the first region a. At the same time, even if cracks appear on the organic encapsulation layer 32 under large deformation, the crack will stop spreading when it encounters the hollow portions 321, thus avoiding further deterioration of the encapsulation performance. In addition, because the hollow portions 321 are spaced apart, the organic encapsulation layer 32 in the first region a forms a continuous pattern, ensuring that the organic encapsulation layer 32 has a certain strength.
[0032] It should be noted that the hollowed-out portion 321 and the organic encapsulation layer 32 with different curing rates formed in different regions can coexist or be set separately, as long as the region with greater deformation requirements has a greater stretchability. For example, based on the hollowed-out portion 321 in at least some regions, the curing rate of the corresponding organic encapsulation layer 32 in each region can be kept consistent, or the curing rate can be changed according to the deformation requirements of different regions, as shown in the previous embodiment. Figure 2 Taking the display panel shown as an example, the curing rate of the organic encapsulation layer 32 in the first region a is lower than that in the second region b. Since the curing rate can only vary within a certain range (e.g., 90%-95%), the increase in stretchability is relatively limited. The region with the cutout portion 321 can further improve the stretchability. For example, based on forming organic encapsulation layers 32 with different curing rates in different regions, the cutout portion 321 can be set only on the portion of the organic encapsulation layer 32 with greater deformation requirements, or it can be set on the entire organic encapsulation layer 32, or the cutout portions 321 located in different regions can have different average dimensions.
[0033] In one embodiment, see Figure 8 , Figure 8This is another structural schematic diagram of the organic encapsulation layer 32 of this application. In this embodiment, the curing rate of the organic encapsulation layer 32 located in the first region a is less than that of the organic encapsulation layer 32 located in the second region b, and both the organic encapsulation layers 32 located in the first region a and the second region b are provided with multiple hollow portions 321, which are spaced apart. Specifically, in this embodiment, the organic encapsulation layers 32 in the first region a and the second region b are a continuous integrated structure. Since hollow portions 321 are formed on the entire organic encapsulation layer 32, cracks and other damage are less likely to occur in the organic encapsulation layer 32 when the display panel is bent, further improving the deformation resistance of the organic encapsulation layer 32; at the same time, even if cracks occur on the organic encapsulation layer 32 due to bending, the cracks are less likely to continue to spread on the organic encapsulation layer 32, avoiding further deterioration of the encapsulation performance; in addition, since the hollow portions 321 are spaced apart, the entire organic encapsulation layer 32 forms a continuous pattern, ensuring that the organic encapsulation layer 32 has a certain strength.
[0034] In another embodiment, see Figure 9 , Figure 9 This is another schematic diagram of the organic encapsulation layer 32 of this application. In the direction perpendicular to the stacking direction, the average size of the cutout portion 321 located in the second region b is smaller than the average size of the cutout portion 321 located in the first region a. Specifically, in this embodiment, the width d2 of the cutout portion 321 located in the second region b in the direction perpendicular to the stacking direction is smaller than the width d1 of the cutout portion 321 located in the first region a in the direction perpendicular to the stacking direction; for example, d2 is 130 μm and d1 is 160 μm. Since d1 > d2, the organic encapsulation layer 32 located in the first region a has better stretchability than the organic encapsulation layer 32 located in the second region b, ensuring the encapsulation effect.
[0035] Optionally, see Figure 10 , Figure 10 This is a schematic diagram of another embodiment of the display panel of this application. The cutout portion 321 penetrates the organic encapsulation layer 32 along the stacking direction (Z direction in the figure). Specifically, in this embodiment, the encapsulation layer 3 includes a first inorganic layer 31, an organic encapsulation layer 32, and a second inorganic layer 33 arranged sequentially along the stacking direction. A planarization layer 4 covers the second inorganic layer 33. The cutout portion 321 penetrates the organic encapsulation layer 32 along the stacking direction, further improving the resistance to deformation and making the exposure energy easier to control. It should be noted that because the organic encapsulation layer 32 is patterned, the encapsulation layer 3 forms an uneven upper surface. This uneven surface can be eliminated by providing a planarization layer 4 on the encapsulation layer 3, ensuring encapsulation performance.
[0036] Optionally, please continue reading Figure 8Multiple cutout portions 321 form multiple cutout groups 322 in a first direction (X direction in the figure). Each cutout group 322 includes multiple cutout portions 321 spaced apart along a second direction perpendicular to the first direction (Y direction in the figure), and adjacent cutout groups 322 are staggered in the second direction. This further improves the stretchability of the organic encapsulation layer 32 and makes the stress distribution more uniform, avoiding damage such as cracks. Specifically, the cutout portions 321 in the array layer ( Figure 5 The orthographic projection on (not shown) is hexagonal. Specifically, multiple cutouts 321 are arranged in a honeycomb pattern. The continuous honeycomb structure of the organic encapsulation layer 32 has high strength and uniform stress distribution, avoiding damage such as cracks. Even if cracks form, they are not easily allowed to propagate outward, preventing further deterioration of encapsulation performance. In other embodiments, the cutouts 321 can also be rectangular or other polygonal structures.
[0037] For details, please refer to [link / reference]. Figure 8 The width d of the cutout portion 321 in the direction perpendicular to the stacking direction is 100μm-200μm (e.g., 120μm, 150μm, 180μm); the width d0 of the organic encapsulation layer 32 surrounding the cutout portion 321 in the direction perpendicular to the stacking direction is 20μm-40μm (e.g., 25μm, 30μm, 35μm).
[0038] Optionally, see Figure 11 , Figure 11 This is another structural schematic diagram of the display panel of this application. In the stacking direction, the organic encapsulation layer 32 includes multiple organic layers. Specifically, in this embodiment, the organic encapsulation layer 32 includes a first organic layer 32a and a second organic layer 32b. In the stacking direction, the display panel includes a neutral layer (not shown). The stretchability of the multiple organic layers decreases sequentially in the direction away from the neutral layer. The neutral layer is the layer with zero deformation rate in the stacking direction when bent. The deformation requirement increases further away from the neutral layer. Therefore, in the case of multiple organic layers, the stretchability can be set layer by layer in the stacking direction. For example, when the display panel is bent, if the neutral layer is located on the first organic layer 32a, or if the neutral layer is located on the side of the first organic layer 32a away from the second organic layer 32b, then the stretchability of the second organic layer 32b is greater than the stretchability of the first organic layer 32a. The stretchability can still be improved by setting a cutout portion and / or reducing the curing rate in the aforementioned embodiments. In other embodiments, more organic layers can be provided, which will not be elaborated further.
[0039] Optionally, please continue reading Figure 11In this embodiment, at least a portion of the first organic layer 32a and the second organic layer 32b each include multiple spaced-apart cutouts 321. In the stacking direction, the cutouts 321 of the second organic layer 32b are staggered with the cutouts 321 of the first organic layer 32a. Specifically, in this embodiment, at least a portion of the second organic layer 32b's orthogonal projection onto the first organic layer 32a lies within the cutouts 321 of the first organic layer 32a. The staggered cutouts 321 enhance the strength of the encapsulation layer 3 in the stacking direction, avoiding stress concentration. In other embodiments, the cutouts 321 of each layer in the organic encapsulation layer 32 can be completely aligned in the stacking direction. Alternatively, the cutouts 321 of a portion of the area (e.g., the second area) can be staggered, while the cutouts 321 of the remaining areas (e.g., the first area) can be aligned. In other embodiments, only one organic layer may have cutouts 321 to enhance the deformability of the display panel, while other organic layers may not have cutouts 321 to ensure the encapsulation performance of the encapsulation layer 3.
[0040] See Figure 12 , Figure 12 This is a flowchart illustrating one embodiment of the method for manufacturing the display panel according to this application. The method includes:
[0041] Step S101: Forming an organic encapsulation layer 32;
[0042] Step S102: The organic encapsulation layer 32 is cured by ultraviolet irradiation, wherein the ultraviolet irradiation energy received by the organic encapsulation layer 32 corresponding to multiple regions is different, so as to result in different stretchability; specifically, the greater the deformation demand of a region, the smaller the ultraviolet irradiation energy received by its corresponding organic encapsulation layer 32, so as to increase the stretchability of the organic encapsulation layer 32; and / or,
[0043] Multiple spaced cutouts are formed on the organic encapsulation layer 32. The average size of the cutouts corresponding to the multiple regions is different in the direction perpendicular to the stacking, so that the stretchability is different. Specifically, the greater the deformation requirement of a region, the larger the average size of its corresponding cutout in the direction perpendicular to the stacking, so that the stretchability of the organic encapsulation layer 32 is greater.
[0044] This manufacturing method divides the organic encapsulation layer 32 into zones corresponding to areas with different deformation requirements, giving them different stretchability. Since the higher the stretchability of organic materials, the stronger their resistance to deformation. Therefore, when the display panel is stretched, areas with higher deformation requirements have higher stretchability, and their encapsulation layer 3 is less prone to cracking or damage during deformation, thus improving the reliability of the encapsulation layer 3. Conversely, areas with lower deformation requirements have lower stretchability, resulting in higher adhesion between the film layers of the encapsulation layer 3 in these areas, reducing the probability of film layer detachment and ensuring its encapsulation performance.
[0045] The treatment of the organic encapsulation layer 32 includes changing the structure of the organic encapsulation layer 32 or changing the ultraviolet energy obtained by the organic encapsulation layer 32 to change the curing rate of the organic encapsulation layer 32, and ultimately change the stretchability of the organic encapsulation layer 32.
[0046] The change in ultraviolet energy obtained by the organic encapsulation layer 32 can be achieved by changing the ultraviolet irradiation intensity or the ultraviolet irradiation time. In S102, the step of curing the organic encapsulation layer 32 by ultraviolet irradiation includes:
[0047] A: The shorter the UV irradiation time for the organic encapsulation layer 32 corresponding to multiple regions, the lower the UV irradiation energy received by the corresponding organic encapsulation layer 32, thus increasing the stretchability of the organic encapsulation layer 32. Specifically, regions with different deformation requirements can be processed in batches, with different UV irradiation times for different batches. Each batch of processing includes the concentrated formation of the organic encapsulation layer 32, followed by UV irradiation curing of the organic encapsulation layer 32 for the same duration.
[0048] or,
[0049] B: A mask is placed on the organic encapsulation layer 32. The transmittance of the masks corresponding to multiple regions is different. Multiple regions are subjected to ultraviolet (UV) irradiation for the same duration. The lower the transmittance of the mask corresponding to a region, the less UV irradiation energy is received by the corresponding organic encapsulation layer 32, thus increasing the stretchability of the organic encapsulation layer 32. Specifically, regions with different deformation requirements can be processed in batches. The transmittance of the masks corresponding to different batches of organic encapsulation layers 32 is different. Each batch of processing includes forming the organic encapsulation layer 32, then placing a mask with the same transmittance on the organic encapsulation layer 32, and then subjecting it to UV irradiation for the same duration for curing.
[0050] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.
Claims
1. A display panel, characterized in that, It includes an array layer, a light-emitting layer, and an encapsulation layer stacked together, wherein the encapsulation layer includes an organic encapsulation layer; In the extending direction of the display panel, the display panel includes multiple regions, and the organic encapsulation layers corresponding to the multiple regions have different stretchability; at least some of the regions correspond to organic encapsulation layers, which include multiple spaced-apart cutouts to form a patterned organic encapsulation layer, which has a mesh structure; wherein, the greater the deformation requirement of the region, the larger the average size of the cutouts of the corresponding organic encapsulation layer in the direction perpendicular to the stacking direction, so as to make the stretchability of the organic encapsulation layer greater.
2. The display panel according to claim 1, characterized in that, The greater the stretchability of the organic encapsulation layer, the lower its curing rate.
3. The display panel according to claim 2, characterized in that, The curing rate is 90%. 95%.
4. The display panel according to claim 2, characterized in that, In the direction away from the center of the display panel, the curing rate of the organic encapsulation layer in multiple regions gradually decreases.
5. The display panel according to claim 2, characterized in that, The plurality of regions include a first region, a second region, and a transition region connecting the second region and the first region, wherein the curing rate of the organic encapsulation layer located in the transition region is greater than the curing rate of the organic encapsulation layer located in the first region and less than the curing rate of the organic encapsulation layer located in the second region.
6. According to claim 1 The display panel described in any one of the 5 is characterized in that, The hollow portion extends through the organic encapsulation layer along the stacking direction.
7. The display panel according to claim 1, characterized in that, The plurality of cutout portions form a plurality of cutout groups in a first direction, each cutout group comprising a plurality of cutout portions spaced apart along a second direction perpendicular to the first direction, and adjacent cutout groups are staggered in the second direction; The orthographic projection of the hollowed-out portion onto the array layer is hexagonal.
8. The display panel according to claim 7, characterized in that, The multiple hollow sections are arranged in a honeycomb pattern.
9. The display panel according to claim 1, characterized in that, In the stacking direction, the organic encapsulation layer includes multiple organic layers; At least two of the organic layers include a plurality of spaced-apart cutouts in a portion of their respective regions, and the cutouts of the at least two organic layers are staggered in the stacking direction; And / or, In the stacking direction, the display panel includes a neutral layer, wherein the stretchability of the plurality of organic layers decreases sequentially in the direction away from the neutral layer.
10. A manufacturing method of a display panel, comprising: In the extending direction of the display panel, the display panel includes multiple areas, and the method includes: Form an organic encapsulation layer; The organic encapsulation layer is cured by ultraviolet irradiation, wherein the ultraviolet irradiation energy received by the organic encapsulation layer corresponding to multiple regions is different, so as to result in different stretchability. Multiple spaced cutouts are formed on the organic encapsulation layer to form a patterned organic encapsulation layer with a mesh structure; wherein the average size of the cutouts corresponding to the multiple regions is different in the direction perpendicular to the stacking, so that the stretchability is different.
11. The method for manufacturing a display panel according to claim 10, characterized in that, The step of curing the organic encapsulation layer by ultraviolet irradiation includes: The shorter the ultraviolet irradiation time of the organic encapsulation layer corresponding to the multiple regions, the lower the ultraviolet irradiation energy of the corresponding organic encapsulation layer, so as to make the stretchability of the organic encapsulation layer greater.
12. The manufacturing method of a display panel according to claim 10, wherein, The step of curing the organic encapsulation layer with ultraviolet light further includes: A photomask is disposed on the organic encapsulation layer. The photomasks corresponding to multiple regions have different transmittances. The multiple regions are subjected to ultraviolet irradiation for the same duration. The smaller the transmittance of the photomask corresponding to a region, the less ultraviolet irradiation energy is received by the corresponding organic encapsulation layer, so as to make the stretchability of the organic encapsulation layer greater.