A ROF board optical module

Abstract

This invention relates to the field of optical communication technology and provides a ROF (Remote Optical Frame) onboard optical module. The module includes a housing formed by a base and a top cover fastened together, and a circuit board movably disposed within the housing. The circuit board moves in the direction from the top cover to the base. The circuit board has gold fingers that can be inserted into a socket. The housing has an opening for the gold fingers to extend out of the housing. This ROF onboard optical module, by movably disposing the circuit board within the housing, allows the optical module to perform gold finger communication while avoiding over-positioning interference when the gold fingers are inserted into the socket, thus completely solving the over-positioning interference problem in the application of this optical module.

Description

Technical Field

[0001] This invention relates to the field of optical communication technology, specifically to an ROF onboard optical module. Background Technology

[0002] The optical communication market demands not only superior performance from onboard optical modules for radio over optical communication (ROF), but also enhanced functionality to expand their application range and gain wider market share. Currently, due to over-positioning interference issues during application, none of these ROF onboard modules feature pluggable gold fingers, preventing them from simultaneously possessing pluggable gold finger communication capabilities.

[0003] In addition, the internal signals of existing optical modules on the optical radio over-the-board (ROF) are prone to interference, resulting in poor electrical performance. Summary of the Invention

[0004] The purpose of this invention is to provide a ROF onboard optical module that can at least solve some of the defects in the prior art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an ROF onboard optical module, comprising a housing formed by a base and a top cover fastened together, and a circuit board movably disposed in the housing, wherein the direction of movement of the circuit board is from the top cover to the base, the circuit board is provided with gold fingers that can be inserted into a socket, and the housing has an opening for the gold fingers to extend out of the housing.

[0006] Furthermore, both the base and the top cover have limiting surfaces for restricting the amount of movement of the circuit board.

[0007] Furthermore, the distance between the circuit board and the limiting surface of the upper cover, as well as the distance between the circuit board and the limiting surface of the base, are both controlled between 0.1 and 0.2 mm.

[0008] Furthermore, the base is provided with a limiting structure for limiting the displacement of the gold fingers on the circuit board in the direction of insertion into the socket.

[0009] Furthermore, it also includes heat dissipation structures for cooling electronic components on circuit boards.

[0010] Furthermore, the heat dissipation structure includes a heat dissipation pad attached to the circuit board.

[0011] Furthermore, the heat dissipation pads are attached to both the upper and lower surfaces of the circuit board.

[0012] Furthermore, the heat dissipation pad is an elastic pad.

[0013] Furthermore, notches are provided on both sides of the gold finger corresponding to the positions on the circuit board.

[0014] Furthermore, it also includes optical devices connected to the circuit board.

[0015] Compared with the prior art, the beneficial effects of the present invention are: a ROF onboard optical module, by movably setting the circuit board in the housing, enables the optical module to have the function of gold finger communication, while also avoiding over-positioning interference when the gold finger is inserted into the socket, thereby completely solving the over-positioning interference problem when the optical module is applied. Attached Figure Description

[0016] Figure 1 A schematic diagram of a ROF onboard optical module provided in an embodiment of the present invention;

[0017] Figure 2 for Figure 1 A diagram showing the removal of the top cover;

[0018] Figure 3 This is a schematic diagram of the mating of a circuit board and a top cover of an ROF onboard optical module provided in an embodiment of the present invention;

[0019] Figure 4 A first-view schematic diagram of the top cover of an ROF onboard optical module provided in an embodiment of the present invention;

[0020] Figure 5 A second-view schematic diagram of the top cover of an ROF onboard optical module provided in an embodiment of the present invention;

[0021] Figure 6 A schematic diagram of a base for an ROF onboard optical module provided in an embodiment of the present invention;

[0022] Figure 7 This is a schematic diagram of the circuit board and base of an ROF onboard optical module provided in an embodiment of the present invention;

[0023] Figure 8 A schematic diagram of the circuit board and base of a ROF onboard optical module provided in an embodiment of the present invention (one side is in cross-sectional view, the cross-section is transparent to show the first limiting post and the gap);

[0024] Figure 9 This is a first-view schematic diagram of an ROF onboard optical module with its casing removed, provided as an embodiment of the present invention.

[0025] Figure 10 This is a second-view schematic diagram of an ROF onboard optical module with its casing removed, provided as an embodiment of the present invention.

[0026] Figure 11A third-view schematic diagram of an ROF onboard optical module with its casing removed, provided as an embodiment of the present invention;

[0027] In the attached diagram, the following labels are used: 1-base; 10-first limiting post; 11-third limiting post; 12-barrier; 120-fixed position; 13-weight reduction hole; 14-first slot; 2-top cover; 20-second limiting post; 21-conductive adhesive; 22-mating groove; 23-second slot; 3-circuit board; 30-gold finger; 31-notch; 32-mounting groove; 4-optical device; 5-optical port; 6-heat dissipation pad; 7-RF coaxial cable; 8-gap; 9-tube bundle groove. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Please see Figures 1 to 11 This invention provides a ROF onboard optical module, including a housing formed by a base 1 and a top cover 2 fastened together. The module further includes a circuit board 3 movably disposed within the housing. The direction of movement of the circuit board 3 is from the top cover 2 to the base 1. The circuit board 3 has gold fingers 30 that can be inserted into a socket. The housing has an opening for the gold fingers 30 to extend out of the housing. In this embodiment, by movably disposing of the circuit board 3 within the housing, the optical module, while possessing the communication function of the gold fingers 30, also avoids over-positioning interference when the gold fingers 30 are inserted into the socket, thus completely solving the over-positioning interference problem during the application of this optical module. Specifically, because the circuit board 3 has a movement margin within the housing, even if the circuit board 3 is in a "floating" state, over-positioning interference when the gold fingers 30 are inserted into the socket can be avoided. The direction of this "floating" is from the top cover 2 to the base 1, i.e. Figure 1 The vertical direction shown is not movable, but the horizontal direction is restricted by a limiting structure.

[0030] Please see Figures 3 to 8To further refine the specific method of the aforementioned "floating," both the base 1 and the upper cover 2 have limiting surfaces for restricting the movement of the circuit board 3. The distance between the limiting surfaces of the circuit board 3 and the upper cover 2, and the distance between the circuit board 3 and the limiting surface of the base 1, are both controlled between 0.1 and 0.2 mm. In this embodiment, the "floating" amount of the circuit board 3 is limited by limiting surfaces, which exist on both the base 1 and the upper cover 2. Specifically, on the base 1, these limiting surfaces are located on its first limiting post 10, and on the upper cover 2, they are located on its second limiting post 20. The "floating" amount is the gap 8 designed between the limiting surface and the circuit board 3, which is controlled between 0.1 and 0.2 mm, preferably 0.15 mm. In other words, whether the circuit board 3 moves towards the base 1 or towards the top cover 2, there will be a gap of 0.15mm for it to move. Since this size is very small, it will not affect the function of the circuit board 3 in the housing, ensuring that the protocol is met, and it can also provide a certain amount of "float", thus solving the problem of interference from over-positioning.

[0031] Please see Figures 6 to 8 The base 1 is provided with a limiting structure for restricting the displacement of the gold fingers 30 on the circuit board 3 in the direction of insertion into the socket. In this embodiment, the limiting structure is used to restrict the displacement of the circuit board 3 in this direction of insertion into the socket, that is, as shown... Figure 1 The movement is shown in the left and right directions. Specifically, there are many ways to limit the movement. For example, a third limiting post 11 can be used on the base 1 to block the circuit board 3. Preferably, the third limiting post 11 and the first limiting post 10 can cooperate to form a stepped structure, which can provide a place for the circuit board 3 to rest on, and at the same time, it can limit the movement of the circuit board 3.

[0032] Please see Figure 2 and Figure 9 This optical module also includes a heat dissipation structure for cooling the electronic components on the circuit board 3. In this embodiment, some electronic components on the circuit board 3 have high power consumption and generate a lot of heat, so a heat dissipation pad 6 is needed to dissipate heat. Specifically, the heat dissipation method can be to attach the heat dissipation pad 6 to the position of the heat-generating electronic component on the circuit board 3, and the heat dissipation pad 6 can conduct heat to the housing. Preferably, the heat dissipation pad 6 is attached to both the upper and lower surfaces of the circuit board 3, which can achieve better heat dissipation effect. The heat dissipation pad 6 is an elastic pad, and the elastic compression of the elastic pad 6 is 20% of the thickness of the elastic pad. In this way, while dissipating heat from the heat-generating electronic components (chips) on the circuit board 3, the circuit board 3 can also be kept in a "floating" state.

[0033] Please see Figure 10 and Figure 11The gold fingers 30 have notches 31 on both sides corresponding to the positions on the circuit board 3. In this embodiment, there are two notches 31 on the circuit board 3, which makes the protruding gold fingers 30 narrower, thus giving it a certain degree of "flexibility". This can further reduce the stress generated by inserting and removing the gold fingers 30, increase its safety factor, and improve the reliability of the module.

[0034] Please see Figure 2 , Figure 9 , Figure 10 and Figure 11 This optical module also includes optical devices 4. Multiple optical devices 4 can be designed as needed, such as eight optical devices 4, with eight corresponding optical ports 5 on the housing. Eight RF coaxial cables 7 are also designed to correspond to them. The circuit board 3 and each of the optical devices 4 are placed inside the housing; each optical device 4 is connected to the circuit board 3, and the optical devices 4 are arranged side-by-side, with adjacent optical devices 4 separated by a barrier 12. In this embodiment, when there are multiple optical devices 4, they are arranged side-by-side, and the barrier 12 can be used to separate adjacent optical devices 4. Separating each optical device 4 by the barrier 12 can reduce internal signal interference and improve electrical performance.

[0035] Please see Figure 10 The circuit board 3 has a mounting slot 32 for the retaining wall 12 to be inserted. In this embodiment, the circuit board 3 has a mounting slot 32 to cooperate with the retaining wall 12.

[0036] Please see Figure 6 and Figure 7 At least one of the retaining walls 12 is provided with a fixing position 120, and the upper cover 2 is fixed to the base 1 through the fixing position 120. In this embodiment, the retaining wall 12 can be provided with a fixing position 120 to facilitate the installation and fixing of the upper cover 2 and the base 1. The fixing position 120 can be a screw hole for screws to be screwed in.

[0037] Please see Figures 3 to 8 The base 1 and the upper cover 2 have a fixing structure for securing the optical device 4. The fixing structure includes a first slot 14 on the base 1 and a second slot 23 on the upper cover 2, which together form a locking area to hold the optical device 4. In this embodiment, the optical device 4 can be fixed by the fixing structure using a snap-fit ​​method. The shape formed by the first slot 14 and the second slot 23 matches the shape of the optical device 4.

[0038] Please see Figure 5The upper cover 2 has mating grooves 22 for each of the retaining walls 12 to engage. In this embodiment, the retaining walls 12 can engage into the corresponding mating grooves 22 on the upper cover 2. Preferably, conductive adhesive 21 is provided in the mating grooves 22. This way, when the retaining walls 12 engage in the mating grooves 22 and press the conductive adhesive 21 together, the electromagnetic shielding effectiveness of the module can be improved. Furthermore, after the retaining walls 12 come into contact with the conductive adhesive 21, isolation can be achieved, internal signal interference can be reduced, and electrical performance can be improved. Preferably, the conductive adhesive 21 is an elastic conductive adhesive 21.

[0039] Please see Figure 1 , Figure 2 , Figure 9 , Figure 10 and Figure 11 The circuit board 3 is connected to radio frequency coaxial cables 7, the same number and corresponding one-to-one with each of the optical devices 4. In this embodiment, the radio frequency coaxial cables 7 can output signals. Preferably, at least one of the base 1 and the upper cover 2 is provided with a confinement groove 9 for confining the radio frequency coaxial cables 7. Designing confinement grooves 9 on the base 1 and / or the upper cover 2 can play a certain role in restraining the radio frequency coaxial cables 7 and preventing the radio frequency coaxial cables 7 from shaking.

[0040] Please see Figure 1 , Figure 2 and Figure 7 The housing has optical ports 5, which are the same number as and correspond one-to-one with each of the optical devices 4, with each optical device 4 facing its corresponding optical port 5. In this embodiment, the number of optical ports 5 can also be designed to be eight, corresponding one-to-one with eight optical devices 4. The optical ports 5 are located on the base 1.

[0041] Please see Figure 6 and Figure 7 The base 1 is provided with weight-reduction holes 13. In this embodiment, the weight of the optical module can be reduced by drilling holes on the edge of the base 1.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A ROF onboard optical module, comprising a housing formed by a base and a top cover fastened together, characterized in that: It also includes optical devices and a circuit board movably disposed in the housing. The circuit board moves in the direction from the top cover to the base. The circuit board has gold fingers that can be inserted into sockets. The housing has an opening for the gold fingers to extend out of the housing. The optical devices are connected to the circuit board. The circuit board is connected to radio frequency coaxial cables that are the same number as each optical device and correspond one-to-one. At least one of the base and the top cover has a constriction groove for constricting the radio frequency coaxial cables. Both the base and the top cover have limiting surfaces for limiting the movement of the circuit board. The distance between the limiting surfaces of the circuit board and the top cover, and the distance between the limiting surfaces of the circuit board and the base are both controlled between 0.1 and 0.2 mm.

2. The ROF onboard optical module as described in claim 1, characterized in that: The base is provided with a limiting structure for restricting the displacement of the gold fingers on the circuit board in the direction of insertion into the socket.

3. The ROF onboard optical module as described in claim 1, characterized in that: It also includes heat dissipation structures for cooling electronic components on circuit boards.

4. The ROF onboard optical module as described in claim 3, characterized in that: The heat dissipation structure includes a heat dissipation pad attached to the circuit board.

5. A ROF onboard optical module as described in claim 4, characterized in that: The heat dissipation pads are attached to both the upper and lower surfaces of the circuit board.

6. A ROF onboard optical module as described in claim 4, characterized in that: The heat dissipation pad is an elastic pad.

7. The ROF onboard optical module as described in claim 1, characterized in that: The gold fingers have notches on both sides corresponding to the positions on the circuit board.

Images