Camera module with chip anti-shake and reduced height

Abstract

The application provides a camera module capable of preventing shaking and reducing height, which comprises a shell, a base, a filter, a support seat, a PCB, an image sensor and an elastic plate. A lens is arranged at the upper end surface of the shell and located above a connecting through hole. The support seat and the PCB are movably arranged inside a cavity. The PCB is provided with a receiving hole penetrating through the upper and lower end surfaces thereof. The filter is arranged inside the support seat and located below the lens. The elastic plate is arranged at the upper end surface of the base and located below the PCB. The image sensor is arranged at the upper end surface of the elastic plate, accommodated inside the receiving hole and located below the filter. The camera module provided by the application can optimize the overall size of the camera module, realize miniaturized design, prevent shaking inside the camera module by the elastic plate instead of a suspension spring, further reduce the structural height of the camera module and further optimize the structure of the camera module.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of camera modules, and particularly to a camera module for realizing chip anti-shake and reducing height. BACKGROUND

[0002] At present, most of the automatic focusing camera modules are driven by VCM (Voice Coil Motor) voice coil motors to move the lens to realize focusing and OIS anti-shake functions. However, with the increasing requirements of terminal devices such as mobile phones and cameras on the camera quality, the size of the image sensor of the camera is designed to be larger and larger, and the lens is also heavier and heavier. For the voice coil motor, the load is also getting larger and larger. Therefore, in order to overcome the gradually increasing load to drive the lens to move, the size of the voice coil motor also needs to be adjusted to be larger and larger. Therefore, the existing camera module has the problem of large overall structure size after being assembled, and when the camera module is assembled into the terminal device, it occupies a large space, so the terminal device also needs to be adjusted in size, which does not meet the existing terminal devices, such as the trend of mobile phone thinning.

[0003] Furthermore, the existing voice coil motor structure generally includes a shell, a lens carrier, a driving coil, a driving magnet and a suspension spring. The lens carrier is used to carry the lens, and its two ends are installed in the shell through the suspension spring. The driving coil is arranged on the lens carrier, and the driving magnet is arranged on the shell. When the driving coil is energized, the magnetic field generated by the driving coil interacts with the magnetic field of the magnet, thereby driving the lens carrier and the lens above it to move on the shell to focus, and the suspension spring provides elastic force to the lens carrier to realize OIS anti-shake and keep the lens carrier stable. However, in the above motor structure, the damping structure composed of the suspension spring and other components occupies a large space in the motor, so after being assembled into the motor structure, the size of the motor structure is increased, and when the motor is assembled into the camera module, the structure size of the camera module is also increased.

[0004] Therefore, it is necessary to provide a technical solution for optimizing the structure of the camera module. SUMMARY

[0005] The present application provides a camera module for realizing chip anti-shake and reducing height to solve the problem of large overall structure size of the existing camera module.

[0006] The technical scheme adopted by the present application is as follows: a camera module realizing chip anti-shake and height reduction, comprising: a shell, a base, a filter, a support seat, a PCB, an image sensor and an elastic plate; the shell is provided with an inner cavity, the base is inserted into the bottom of the inner cavity of the shell; the inner cavity is communicated with the outside through a connecting through hole at the upper end surface of the shell, the upper end surface of the shell is provided with a lens, and the lens is located above the connecting through hole; the support seat and the PCB are movably arranged in the inner cavity, and the support seat is fixedly arranged at the upper end surface of the PCB, and the PCB is provided with a receiving hole penetrating through the upper and lower end surfaces thereof; the filter is arranged in the support seat, and the filter is located below the lens; the elastic plate is arranged at the upper end surface of the base and below the PCB; the image sensor is arranged at the upper end surface of the elastic plate and is arranged in the receiving hole and below the filter.

[0007] A plurality of coils are arranged at the upper end surface of the PCB and around the support seat, a plurality of magnets are arranged in the inner cavity of the shell, and the plurality of coils and the plurality of magnets correspond one-to-one; when the coils are powered, the magnetic field generated by the coils interacts with the magnetic field of the magnets to drive the image sensor to move, thereby performing focusing work, and the elastic plate provides elastic force to the image sensor to prevent shaking and reset.

[0008] In an embodiment, the side edge of the support seat is provided with a plurality of damping pins, a plurality of damping glue grooves are arranged in the shell, the damping pins are arranged in the damping glue grooves one by one, and the damping pins and the damping glue grooves are correspondingly arranged to reduce the vibration generated in the camera module.

[0009] In an embodiment, the damping pin comprises a pin plate and a pin strip; the pin plate is provided with a positioning hole, the support seat is provided with a positioning strip, the positioning strip is correspondingly clamped into the positioning hole to mount the pin plate on the support seat; the pin strip is arranged on the side of the pin plate away from the support seat and is arranged in an upwardly bent manner, and the pin strip is correspondingly arranged in the damping glue groove.

[0010] In an embodiment, a connecting plate is arranged at the lower end surface of the PCB and around the receiving hole, the lower end of the connecting plate abuts against the elastic plate, the upper end surface of the connecting plate abuts against the PCB, the connecting plate is arranged between the PCB and the elastic plate, the connecting plate connects the middle structure of the elastic plate, and the connecting plate supports the PCB.

[0011] In an embodiment, a plurality of square hollow holes are arranged on the elastic plate, and the plurality of square hollow holes are arranged side by side to form a plurality of elastic arms in the form of strips between the square hollow holes; a structure surrounded by the plurality of elastic arms is a first substrate, a structure outside the plurality of elastic arms is a second substrate, the first substrate and the second substrate are connected through the elastic arms, the second substrate is fixedly arranged on the base, an upper end surface of the first substrate is provided with the image sensor, and the upper end surface of the first substrate is connected with a lower end surface of the connecting plate; the connecting plate can drive the first substrate to move together during movement and stretch the elastic arms.

[0012] A groove is arranged at an upper end surface of the base, the groove is below the first substrate, and the groove provides a space for avoiding when the first substrate moves downward.

[0013] In an embodiment, the first substrate, the connecting plate, the PCB and the support seat are sequentially and fixedly connected.

[0014] In an embodiment, a limiting frame is arranged at an edge of the upper end surface of the base, a space surrounded by the limiting frame is a limiting chamber, and the limiting chamber is used for corresponding installation of the elastic plate.

[0015] In an embodiment, a plurality of limiting blocks are arranged in the inner cavity of the shell, a plurality of limiting holes are arranged on the elastic plate, and the limiting blocks are correspondingly clamped into the limiting holes to limit and fix the installation of the elastic plate.

[0016] In an embodiment, a plurality of clamping grooves are arranged on a side edge of the shell, a plurality of clamping plates are arranged on a side edge of the base, and the clamping plates are correspondingly inserted into the clamping grooves to realize the insertion fit of the shell and the base.

[0017] In an embodiment, a through hole penetrating through upper and lower end surfaces of the support seat is arranged along a center line, and the optical filter is arranged inside the through hole.

[0018] A plurality of installation grooves are arranged in the inner cavity of the shell, and the installation grooves are correspondingly embedded with the magnets.

[0019] The present application has the following beneficial effects:

[0020] 1. The camera module provided by the application, the filter is arranged in the support seat, a receiving hole is arranged on the PCB, and the image sensor is arranged in the receiving hole after being mounted on the upper end surface of the elastic plate, so that the space utilization rate is improved, the height of the camera module is reduced, the structure size of other components is adjusted, the overall size of the camera module is optimized, and the camera module is miniaturized; in the application, the camera module is anti-shake by the elastic plate, instead of the suspension spring in the prior art, the structure height of the camera module is further reduced, and the structure size of the camera module is further optimized.

[0021] 2. In the application, the focusing is realized by driving the image sensor to move, which is different from the focusing realized by driving the lens to move in the prior art, and the driving load is smaller in the application because the lens is heavier and larger in structure than the image sensor, so the focusing can be faster under the same driving force, the shooting work is facilitated, the motor structure can be adjusted to be miniaturized without providing a large driving force, and the overall structure of the camera module is optimized. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the application and constitute a part of the specification, and are used to explain the application together with the specific embodiments below, but should not be used to limit the application. In the drawings:

[0023] Figure 1 It is a structural schematic view of an embodiment of the application;

[0024] Figure 2 It is an exploded view of an embodiment of the application;

[0025] Figure 3 It is a sectional view of an embodiment of the application;

[0026] Figure 4 It is a structural schematic view of a shell and a magnet of an embodiment of the application;

[0027] Figure 5 It is a structural schematic view of a shell of an embodiment of the application;

[0028] Figure 6 It is a structural schematic view of a coil, a support seat, a PCB, an elastic plate and a base of an embodiment of the application;

[0029] Figure 7 It is a structural schematic view of a support seat and a damping needle of an embodiment of the application;

[0030] Figure 8 It is a structural schematic view of a support seat of an embodiment of the application;

[0031] Figure 9 Structure diagram of elastic plate, PCB and image sensor of an embodiment of the present application;

[0032] Figure 10 Structure diagram of elastic plate of an embodiment of the present application;

[0033] Figure 11 Structure diagram of base of an embodiment of the present application.

[0034] BRIEF DESCRIPTION OF THE DRAWINGS: 1, shell; 101, connecting through hole; 102, damping glue groove; 103, limiting block; 104, clamping groove; 105, mounting groove; 106, inner cavity; 2, magnet; 3, coil; 4, damping needle; 401, needle plate; 402, needle strip; 403, positioning hole; 5, optical filter; 6, support seat; 601, through hole; 602, support block; 603, positioning strip; 7, PCB; 701, accommodating hole; 702, protruding block; 8, connecting plate; 9, image sensor; 10, elastic plate; 1001, limiting hole; 1002, hollow hole; 1003, first substrate; 1004, second substrate; 11, base; 1111, limiting frame; 1112, limiting chamber; 1113, clamping plate; 1114, groove. DETAILED DESCRIPTION

[0035] The specific embodiments of the present application are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present application, and are not intended to limit the present application.

[0036] Please refer to Figures 1-5 , Figure 6 , Figure 9The embodiment provides a camera module with chip anti-shake and reduced height, which comprises a shell 1, a base 11, a filter 5, a support seat 6, a PCB 7, an image sensor 9 and an elastic plate 10. The shell 1 is provided with an inner cavity 106, and the base 11 is inserted into the bottom of the inner cavity 106 of the shell 1. The inner cavity 106 is communicated with the outside through a connecting through hole 101 at the upper end surface of the shell 1, and a lens (not shown in the figure) is arranged at the upper end surface of the shell 1 and located above the connecting through hole 101. The support seat 6 and the PCB 7 are movably arranged in the inner cavity 106, and the support seat 6 is fixedly arranged at the upper end surface of the PCB 7. The PCB 7 is provided with a containing hole 701 penetrating the upper and lower end surfaces thereof, and the containing hole 701 is used for transmitting light to smoothly reach the upper surface of the image sensor 9. The filter 5 is arranged in the support seat 6 and located below the lens, and the filter 5 is used for filtering light. The elastic plate 10 is arranged at the upper end surface of the base 11 and located below the PCB 7. The image sensor 9 is arranged at the upper end surface of the elastic plate 10, arranged in the containing hole 701 and located below the filter 5. A plurality of coils 3 are arranged at the upper end surface of the PCB 7 and around the support seat 6, a plurality of magnets 2 are arranged in the inner cavity 106 of the shell 1, and the plurality of coils 3 and the plurality of magnets 2 are one-to-one corresponding. In the embodiment, when the camera module performs a camera shooting work, the lens converges and transmits the light of the observed target into the filter 5, the light is filtered at the filter 5, then the light is projected to the image sensor 9 after passing through the support seat 6, and the light source is calculated to form an image at the image sensor 9, so that the camera shooting work is completed.When the camera module is focusing, the elastic plate 10 is connected with the electric circuit, the image sensor 9 is electrically connected with the elastic plate 10, the coil 3 on the upper end surface of the PCB 7 is electrified, the magnetic field generated by the coil 3 and the magnetic field of the magnet 2 attract or repel each other, so as to drive the support base 6 and the PCB 7 to move. In fact, the image sensor 9 is arranged on the substrate in the middle region of the elastic plate 10, and the coil 3 and the magnet 2 drive the support base 6 and the PCB 7 to move up and down. When the PCB 7 moves up, the image sensor 9 arranged on the substrate in the middle region of the elastic plate 10 moves up together, which pushes the elastic plate 10 upward. When the PCB 7 moves down, the image sensor 9 arranged on the substrate in the middle region of the elastic plate 10 moves down together, which pushes the elastic plate 10 downward. In this way, the image sensor 9 moves up and down to focus. In addition, the elastic plate 10 provides elastic force to the image sensor 9 to prevent vibration, which can reduce the generation of resonance, thereby ensuring the shooting quality. After the image sensor 9 moves to the corresponding position, the elastic force provided by the elastic plate 10 and the driving force generated by the coil 3 and the magnet 2 are balanced, so that the image sensor 9 is in a stable state for shooting. After shooting is completed, the coil 3 is de-energized, the coil 3 and the magnet 2 do not generate force, and the elastic force provided by the elastic plate 10 can conveniently reset the image sensor 9.

[0037] In the embodiment, the filter 5 is arranged in the support base 6, and the accommodating hole 701 is arranged on the PCB 7. The image sensor 9 is arranged in the accommodating hole 701 after being mounted on the upper end surface of the elastic plate 10. In this way, the space utilization rate can be improved, the height of the camera module can be reduced, the structure size of other components can be adjusted, the overall size of the camera module can be optimized, and the camera module can be miniaturized. In addition, the elastic plate 10 is used to prevent vibration in the camera module, which replaces the suspension spring in the voice coil motor structure in the prior art, further reduces the structure height of the camera module, and further optimizes the structure of the camera module.

[0038] Specifically, the shell 1 is a square block, and an inner cavity 106 for mounting various components is arranged in the shell 1, and the inner cavity 106 is communicated with the outside through a connecting through hole 101 at the upper end surface of the shell 1, and the base 11 is a generally square plate structure, and the area size corresponds to the cross-sectional area of the shell 1, and is correspondingly inserted and connected at the bottom of the inner cavity 106 of the shell 1, and the lens is mounted at the upper end surface of the shell 1 and corresponds to the position above the connecting through hole 101; the support seat 6 is generally square, and a through hole 601 penetrating the upper and lower end surfaces is arranged at the center line in the middle, and the cross-sectional shape of the through hole 601 is T-shaped, and the filter 5 is mounted on the upper part of the through hole 601 of the support seat 6 and corresponds to the position below the lens, and a glue layer is arranged between the bottom edge of the filter 5 and the support seat 6, and the filter 5 is fixedly connected with the support seat 6 through the glue layer, and the filter 5 is arranged in the inner part of the support seat 6, which can improve the space utilization rate during assembly, thereby correspondingly reducing the height of the camera module after assembly; the PCB 7 is square, and the cross-sectional area of the PCB 7 is larger than that of the support seat 6, and the PCB 7 is supported at the bottom surface of the support seat 6, and a glue layer can be arranged between the two to fixedly connect them, and the middle of the PCB 7 is provided with a receiving hole 701, and the area of the receiving hole 701 is smaller than the cross-sectional area of the support seat 6, so as to prevent the support seat 6 from being clamped into the receiving hole 701 of the PCB 7, so as to facilitate the effective fixation of the support seat 6 on the PCB 7, and in addition, protrusions 702 (see Figure 9 ) are arranged on both sides of the receiving hole 701, which are further supported at the bottom surface of the support seat 6, thereby further preventing the support seat 6 from being clamped into the receiving groove and affecting the installation of other components; the elastic plate 10 is fixedly limited on the base 11 and below the PCB 7, and the image sensor 9 is fixedly arranged at the upper end surface of the elastic plate 10, and can be fixedly connected between the bottom surface of the image sensor 9 and the elastic plate 10 by soldering, actually, the bottom surface of the image sensor 9 is fixedly connected with the substrate of the middle region of the elastic plate 10 by soldering, and the two are electrically connected, and the image sensor 9 is arranged in the receiving hole 701 of the PCB 7, thereby improving the space utilization rate during assembly, thereby correspondingly reducing the height of the camera module after assembly; in this embodiment, the magnet 2 and the coil 3 are used as driving components to drive the image sensor 9 to move for focusing, wherein four coils 3 are arranged around the outer side of the support seat 6 at the periphery of the upper end surface of the PCB 7, and four mounting grooves 105 (see Figure 5), each mounting slot 105 is mounted with a magnet 2, and the magnet 2 corresponds to the coil 3, when the coil 3 is energized, the magnetic field generated by the coil 3 and the magnetic field of the magnet 2 attract or repel each other, so as to drive the support seat 6 and the PCB 7 to move, in fact, the image sensor 9 is arranged on the substrate in the middle region of the elastic plate 10, and is driven to move up and down by the action of the coil 3 and the magnet 2, when the PCB 7 is driven to move up, the image sensor 9 arranged on the substrate in the middle region of the elastic plate 10 is driven to move up together, which pushes the elastic plate 10 upward, and when the PCB 7 is driven to move down, the image sensor 9 arranged on the substrate in the middle region of the elastic plate 10 is driven to move down together, which pushes the elastic plate 10 downward, so as to drive the image sensor 9 to move downward; through the above arrangement, the image sensor 9 moves up and down, so as to perform focusing work.

[0039] Further, the support seat 6 is provided with a position sensor (not shown in the figure), which monitors the position of the image sensor 9 in real time during focusing, so as to accurately move the image sensor 9 to the corresponding position, and realize accurate focusing. The position sensor can be a Hall sensor, and the specific structure and working principle of the Hall sensor can be known from the prior art, which will not be described here.

[0040] Further, please refer to Figure 2 , Figures 4-8The side of the support base 6 is provided with a plurality of damping pins 4, and the shell 1 is provided with a plurality of damping glue grooves 102, the damping pins 4 and the damping glue grooves 102 are correspondingly arranged, preferably, in the embodiment, the side of the support base 6 is provided with four damping pins 4, and the cavity top surface of the inner cavity 106 of the shell 1 is provided with four damping glue grooves 102, and the damping pins 4 are correspondingly arranged in the damping glue grooves 102, wherein, through the corresponding cooperation of the damping pins 4 and the damping glue grooves 102, the vibration generated when the support base 6, the PCB 7 and the image sensor 9 move upward can be reduced, and the lens can be quickly stabilized when the lens is shaken during shooting, thereby improving the shooting quality, and through the cooperation of the damping pins 4 and the damping glue grooves 102, the position of the support base 6 can be positioned, and the support base 6 and the shell 1 can be quickly connected and matched. Specifically, the damping pin 4 comprises a pin plate 401 and a pin strip 402; the pin plate 401 is provided with a positioning hole 403, the side of the support base 6 is provided with a support block 602, the structure of the support block 602 corresponds to the structure of the pin plate 401, so as to correspondingly support the placement of the pin plate 401, and the support block 602 is provided with a positioning strip 603, the positioning strip 603 is used for being correspondingly clamped into the positioning hole 403, so that the pin plate 401 is stably installed on the support block 602 of the support base 6 by welding or riveting; and the pin strip 402 is arranged on the side of the pin plate 401 away from the support base 6, and the pin strip 402 is arranged in an upward bending mode, so as to be correspondingly arranged in the damping glue groove 102; and wherein the pin strip 402 can adopt elastic elements such as springs and rubbers, and the damping glue groove 102 is provided with damping glue, the damping glue is a non-solidified colloid, and is a jelly-like colloid formed after being solidified in a specific mode, and the damping glue groove 102 cooperates with the pin strip 402, and the two are in complete contact without gaps, so as to better reduce the generation of vibration and achieve the anti-shake effect; therefore, through the structural characteristics, when the pin strip 402 contacts the damping glue groove 102, the contact between the two can be buffered, thereby reducing the vibration to achieve the anti-shake effect.

[0041] Further, please refer to Figures 2-3 、 Figures 6-11 , the lower end surface of the PCB 7 is provided with a connecting plate 8, the connecting plate 8 is in a square frame structure and is arranged around the containing hole 701, and the lower end of the connecting plate 8 abuts against the elastic plate 10 and is connected and fixed by a glue layer, and the upper end surface also abuts against the PCB 7 and is connected and fixed by a glue layer, the connecting plate 8 is arranged between the PCB 7 and the elastic plate 10, the connecting plate 8 connects the middle structure of the elastic plate 10, and the connecting plate 8 has a supporting effect on the PCB 7. Wherein, in the process of moving the PCB 7 downward, the connecting plate 8 can move downward together, thereby pushing the substrate structure of the middle region of the elastic plate 10, and driving the image sensor 9 to move for focusing; at the same time, the connecting plate 8 supports the PCB 7, so that the PCB 7 can be stably arranged above the elastic plate 10, and the PCB 7 and the image sensor 9 are isolated, so that they do not interfere with each other.

[0042] In a further scheme, the elastic plate 10 is provided with a plurality of square hollow holes 1002, and the plurality of hollow holes 1002 are arranged side by side to form a plurality of elastic arms in the form of strips (see Figure 10 ), and the structure surrounded by the plurality of elastic arms is a first substrate 1003, that is, the substrate of the middle region of the elastic plate 10 is the first substrate 1003, the structure outside the plurality of elastic arms is a second substrate 1004, the first substrate 1003 and the second substrate 1004 are both hard plates, and are connected by the elastic arms; wherein the plurality of elastic arms are arranged side by side around the first substrate 1003, the plurality of elastic arms are used to provide elastic force for resetting the first substrate 1003, the first substrate 1003 supports the image sensor 9 at the upper end surface thereof, and the first substrate 1003 is located directly below the connecting plate 8, the first substrate 1003 is electrically connected with the image sensor 9, specifically, the lower end surface of the connecting plate 8 abuts against the upper end surface of the first substrate 1003, and the structure of the connecting plate 8 surrounds the image sensor 9, when the connecting plate 8 moves downward, the first substrate 1003 and the image sensor 9 thereon are driven to move together, so as to focus, and the elastic arms at the hollow holes 1002 are stretched during the movement of the first substrate 1003, so as to provide elastic force for the first substrate 1003 of the elastic plate 10, thereby preventing the image sensor 9 from shaking and facilitating the resetting of the image sensor 9. During the movement of the first substrate 1003 downward, that is, during the movement of the first substrate 1003 toward the base 11, the base 11 is provided with a groove 1114 at the upper end surface to avoid the movement of the first substrate 1003, the area of the groove 1114 is the same as that of the first substrate 1003 and is located directly below the first substrate 1003, so as to provide space for the movement of the first substrate 1003 by the groove 1114 during the movement of the first substrate 1003 downward, avoiding the first substrate 1003, thereby avoiding damage to the movement of the first substrate 1003.

[0043] In addition, the first substrate 1003 and the second substrate 1004 of the elastic plate 10 can be ceramic substrates, which can guide the heat generated by the image sensor 9 to the outside through the elastic plate 10 when the image sensor 9 is working, so as to achieve the effect of heat dissipation.

[0044] Furthermore, it is worth noting that the second substrate 1004 of the elastic plate 10 is fixedly positioned within the limiting chamber 1112 of the base 11. The lower end face of the connecting plate 8 is connected and fixed to the first substrate 1003 of the elastic plate 10 via an adhesive layer, the upper end face of the connecting plate 8 is connected and fixed to the PCB 7 via an adhesive layer, and the upper end face of the PCB 7 is connected and fixed to the support base 6 via an adhesive layer. Therefore, the first substrate 1003, the connecting plate 8, the PCB 7, and the support base 6 are sequentially and fixedly connected, forming a stable whole. After the second substrate 1004 of the elastic plate 10 is fixed, during the movement of the PCB7 and support base 6 driven by the coil 3 and magnet 2, the first substrate 1003 and the image sensor 9 will move together to focus, but the second substrate 1004 will not move. Moreover, the first substrate 1003, the connecting plate 8, the PCB7 and the support base 6 form a stable whole. During the focusing process, these four move synchronously, and there will be no situation where the position of the PCB7, the support base 6 or the connecting plate 8 shifts and affects the focusing work, thus ensuring the shooting quality.

[0045] For further details, please refer to Figure 1 , Figures 5-6 , Figure 11 A limiting frame 1111 is provided along the edge of the upper end surface of the base 11. The space surrounded by the limiting frame 1111 is a limiting chamber 1112. The limiting chamber 1112 is used to install the second substrate 1004, and the size of the limiting chamber 1112 corresponds to that of the second substrate 1004. This prevents the second substrate 1004 from shifting after installation and affecting the camera module's imaging operation. Meanwhile, the groove 1114 is located in the middle of the limiting chamber 1112 and corresponds to the first substrate 1003 above it, allowing the first substrate 1003 to move and focus within the limiting chamber 1112.

[0046] For further details, please refer to Figures 5-6 The inner cavity 106 of the outer shell 1 is provided with a plurality of limiting blocks 103, and the elastic plate 10 is provided with a plurality of limiting holes 1001. Preferably, in this embodiment, a limiting block 103 is provided at each of the four corners of the top surface of the inner cavity 106 of the outer shell 1, and a limiting hole 1001 is provided at each of the four corners of the elastic plate 10. When the outer shell 1 and the base 11 are inserted and fitted together, the limiting blocks 103 are inserted into the limiting holes 1001 one by one, thereby limiting and fixing the installation of the elastic plate 10, so that it is stably set between the shell and the base 11.

[0047] For further details, please refer to Figure 1 , Figure 5 , Figure 11The outer shell 1 has several slots 104 on its side, and the base 11 has several plates 1113 on its side. Preferably, the outer shell 1 has a slot 104 on both the front and rear side walls, and the base 11 has a plate 1113 on both the front and rear edges. The plates 1113 protrude from the limiting frame 1111. When assembling the outer shell 1 and the base 11, the plates 1113 are inserted into the slots 104 one by one to achieve the insertion and engagement of the outer shell 1 and the base 11.

[0048] Compared with existing technologies:

[0049] 1. The camera module provided in this application has a filter 5 housed inside the support base 6, and a receiving hole 701 is provided on the PCB 7. The image sensor 9 is installed on the upper surface of the elastic plate 10 and can be correspondingly housed in the receiving hole 701. This can improve space utilization, reduce the height of the camera module, and adjust the structural dimensions of other components accordingly, ultimately optimizing the overall size of the camera module and achieving a miniaturized design. At the same time, in this application, the elastic plate 10 is used for image stabilization inside the camera module, replacing the suspension spring in the prior art, which can further reduce the structural height of the camera module and further optimize the structure of the camera module.

[0050] 2. In this application, the elastic plate 10 is fitted into the limiting chamber 1112 of the base 11 and then fixed by the outer shell 1, so that the elastic plate 10 is stably set, thereby preventing it from shifting during focusing and affecting the focusing effect. At the same time, it can stably support the image sensor 9, thereby reducing shaking and further improving the imaging effect.

[0051] 3. In this application, the elastic plate 10 can be set as a ceramic substrate. When the image sensor 9 is working, the heat generated by the image sensor 9 can be discharged through the elastic plate 10 to achieve heat dissipation and thus ensure that the working environment of the image sensor 9 remains stable.

[0052] 4. In this application, during the upward movement of PCB7 and support 6, the damping pin 4 and damping groove 102 work together to reduce the vibration caused by contact or collision with housing 1 when moving upward, thereby reducing lens shake and keeping the lens stable, thus ensuring shooting quality.

[0053] 5. In this application, a position sensor is set inside the camera module. The position sensor monitors the position relationship of the image sensor 9 in real time during the focusing process, so that the image sensor 9 can be accurately moved to the corresponding position to achieve precise focusing.

[0054] 6. In this application, focusing is achieved by driving the image sensor 9 to move, which is different from the prior art that focuses by driving the lens to move. Moreover, since the lens is heavier and larger than the image sensor 9, the driving load in this application is smaller. Therefore, focusing can be achieved faster with the same driving force, which facilitates shooting. Furthermore, without needing to provide a large driving force, the motor structure can be adjusted accordingly to make it more miniaturized, thereby optimizing the overall structure of the camera module.

[0055] In the accompanying drawings, for clarity, the dimensions and relative dimensions of layers and regions are exaggerated. It should be understood that when an element, such as a layer, region, or substrate, is referred to as "formed on," "mounted on," "disposed on," or "located on" another element, the element may be directly disposed on said other element, or there may be intermediate elements present. Conversely, when an element is referred to as "directly formed on" or "directly disposed on" another element, there are no intermediate elements.

[0056] In this document, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of these terms based on the specific circumstances.

[0057] In this document, the terms "upper," "lower," "front," "back," "left," "right," "top," "bottom," "inner," "outer," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only used for the clarity of expressing the technical solution and for the convenience of description, and therefore should not be construed as limiting the present invention.

[0058] In this document, unless otherwise stated, "multiple" or "several" means two or more.

[0059] In this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, which includes not only the elements listed but also other elements not expressly listed.

[0060] Any combination of various embodiments of the present invention, provided it does not violate the inventive concept of the present invention, shall be regarded as the content disclosed by the present invention; within the scope of the technical concept of the present invention, any simple modifications to the technical solution and any combination of different embodiments that do not violate the inventive concept of the present invention shall be within the protection scope of the present invention.

Claims

1.A camera module for implementing chip anti-shake and reducing height, characterized in that, It includes: The shell, base, filter, support seat, PCB, image sensor and elastic plate; The shell has an inner cavity, the base is inserted into the bottom of the inner cavity of the shell, the inner cavity is communicated with the outside through a connecting through hole at the upper end surface of the shell, a lens is arranged at the upper end surface of the shell, and the lens is located above the connecting through hole; The support seat and the PCB are movably arranged in the inner cavity, and the support seat is fixedly arranged at the upper end surface of the PCB; The PCB is provided with a receiving hole penetrating through the upper and lower end surfaces thereof; The filter is arranged in the support seat, and the filter is located below the lens; The elastic plate is arranged at the upper end surface of the base and below the PCB; The image sensor is arranged at the upper end surface of the elastic plate and is accommodated in the receiving hole below the filter; A plurality of coils are arranged at the upper end surface of the PCB and around the support seat, a plurality of magnets are arranged in the inner cavity of the shell, and the plurality of coils correspond to the plurality of magnets one by one; When the coils are powered, the magnetic field generated by the coils interacts with the magnetic field of the magnets to drive the image sensor to move, thereby performing focusing work, and providing elastic force to the image sensor through the elastic plate to prevent shaking and reset. 2.The camera module for implementing chip anti-shake and height reduction according to claim 1, wherein: A plurality of damping pins are arranged on the side of the support seat, a plurality of damping glue grooves are arranged in the shell, the damping pins are correspondingly accommodated in the damping glue grooves, and the damping pins and the damping glue grooves are correspondingly arranged to reduce the vibration generated in the camera module. 3.The camera module for implementing chip anti-shake and height reduction according to claim 2, wherein: The damping pin includes a pin plate and a pin strip; The pin plate is provided with a positioning hole, the support seat is provided with a positioning strip, the positioning strip is correspondingly clamped into the positioning hole, and the pin plate is mounted on the support seat; The pin strip is arranged on the side of the pin plate away from the support seat and is arranged in an upward bending manner, and the pin strip is correspondingly accommodated in the damping glue groove. 4.The camera module for implementing chip anti-shake and height reduction according to claim 1, wherein: A connecting plate is arranged at the lower end surface of the PCB and around the receiving hole, the lower end surface of the connecting plate abuts against the elastic plate, the upper end surface of the connecting plate abuts against the PCB, the connecting plate is arranged between the PCB and the elastic plate, the connecting plate connects the middle structure of the elastic plate, and the connecting plate supports the PCB. 5.The camera module for implementing chip anti-shake and height reduction according to claim 4, wherein: A plurality of square hollow holes are arranged on the elastic plate, and a plurality of elastic arms are formed between the hollow holes; The structure surrounded by the plurality of elastic arms is a first substrate, the structure outside the plurality of elastic arms is a second substrate, the first substrate and the second substrate are connected through the elastic arms, the second substrate is fixedly arranged on the base, the image sensor is arranged at the upper end surface of the first substrate, and the upper end surface of the first substrate is connected with the lower end surface of the connecting plate; The connecting plate can drive the first substrate to move together and stretch the elastic arms during movement. A groove is arranged at the upper end surface of the base, and is located below the first substrate to provide a space for avoiding the first substrate when it moves downward. 6.The camera module for implementing chip anti-shake and height reduction according to claim 5, wherein: The first substrate, the connecting plate, the PCB and the support seat are sequentially fixed and connected. 7.The camera module for implementing chip anti-shake and height reduction according to claim 1, wherein: A limiting frame is arranged at the edge of the upper end surface of the base, and a limiting chamber surrounded by the limiting frame is used for corresponding installation of the elastic plate. 8.The camera module for implementing chip anti-shake and height reduction according to claim 1, wherein: A plurality of limiting blocks are arranged in the inner cavity of the shell, and a plurality of limiting holes are arranged on the elastic plate, the limiting blocks are correspondingly clamped into the limiting holes to limit and fix the installation of the elastic plate. 9.The camera module for implementing chip anti-shake and height reduction according to claim 1, wherein: A plurality of clamping grooves are arranged on the side edge of the shell, and a plurality of clamping plates are arranged on the side edge of the base, the clamping plates are correspondingly inserted into the clamping grooves to realize the insertion fit of the shell and the base. 10.The camera module for implementing chip anti-shake and height reduction according to claim 1, wherein: The support seat is provided with a through hole penetrating through the upper and lower end surfaces along the center line, and the optical filter is installed in the through hole. A plurality of installation grooves are arranged in the inner cavity of the shell, and the installation grooves are correspondingly embedded with the magnets.

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