Display module and display device

Abstract

The display module comprises a flexible display panel, a printed circuit board and an anisotropic conductive adhesive. The flexible display panel is divided into a display area and a non-display area surrounding the display area, the non-display area comprises a first binding area, and the first binding area is located at one side of the non-display area. The printed circuit board comprises a second binding area and is located at one side of the printed circuit board. The anisotropic conductive adhesive is located between the flexible display panel and the printed circuit board, and the first binding area is electrically connected with the second binding area through the anisotropic conductive adhesive. In this way, the flexible display panel and the printed circuit board are directly bound, the number of binding processes of the display module can be reduced, the alignment accuracy of the flexible display panel and the printed circuit board is improved, in addition, the distance between the flexible display panel and the printed circuit board can be reduced without the intermediate connection of the flexible circuit board, thereby being beneficial to the narrow frame design of the flexible display panel.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, specifically to a display module and display device. Background Technology

[0002] With the continuous development of OLED (organic light-emitting diode) panels, flexible displays and full-screen displays have become the development trend in recent years. However, in the bonding process between flexible display panels and printed circuit boards (PCBs), because the flexible display panel is a bendable flexible material while the PCB is a rigid material that cannot be bent, multiple COP (COF On Panel) and FOP (FPC On Panel) processes are required to bond the PCB and flexible display panel together using FPCs (Flexible Printed Circuits) to achieve the various display functions of the flexible display panel. However, during the bonding process, the flexible display panel and the PCB are prone to misalignment, which affects the display function of the flexible display panel and reduces its yield. In addition, the FOP process increases the spacing between the flexible display panel and the PCB, thereby increasing the bonding area of ​​the flexible display panel, which is not conducive to the narrow bezel design of the flexible display panel. Summary of the Invention

[0003] The first aspect of this disclosure provides a display module including a flexible display panel, a printed circuit board, and an anisotropic conductive adhesive. The flexible display panel is divided into a display area and a non-display area surrounding the display area. The non-display area includes a first bonding area located on one side of the non-display area. The printed circuit board includes a second bonding area located on one side of the printed circuit board. The anisotropic conductive adhesive is located between the flexible display panel and the printed circuit board, and the first bonding area is electrically connected to the second bonding area via the anisotropic conductive adhesive.

[0004] In one implementation of the first aspect of this disclosure, the first binding region includes a plurality of first sub-binding regions set at intervals.

[0005] In one implementation of the first aspect of this disclosure, each first sub-bonding region is electrically connected to a second bonding region of a printed circuit board via anisotropic conductive adhesive.

[0006] In one implementation of the first aspect of this disclosure, the second binding area includes multiple second sub-binding areas spaced apart, and the number and position of the second sub-binding areas correspond one-to-one with those of the first sub-binding areas.

[0007] In one implementation of the first aspect of this disclosure, each first sub-binding region is electrically connected to each second sub-binding region via anisotropic conductive adhesive.

[0008] In one implementation of the first aspect of this disclosure, multiple chips are electrically connected to the first binding region.

[0009] In one implementation of the first aspect of this disclosure, each first sub-binding region has at least one chip.

[0010] In one implementation of the first aspect of this disclosure, the first binding region includes a plurality of first grooves such that each first sub-binding region has a gap.

[0011] In one implementation of the first aspect of this disclosure, each first groove has the same shape and size.

[0012] In one implementation of the first aspect of this disclosure, the second binding area includes a plurality of second grooves, the number of which is equal to the number of first grooves.

[0013] In one implementation of the first aspect of this disclosure, the size of the first groove opening is 3 mm to 5 mm.

[0014] In one implementation of the first aspect of this disclosure, both the first binding area and the second binding area include multiple pins, so that the first binding area and the second binding area can be aligned through the pins.

[0015] In one implementation of the first aspect of this disclosure, the anisotropic conductive adhesive includes a matrix and conductive particles, and the matrix material includes epoxy resin, acrylate resin, and polyurethane.

[0016] A second aspect of this disclosure provides a display device that includes the display module described above.

[0017] In this disclosure, by directly bonding the first bonding area of ​​the flexible display panel to the second bonding area of ​​the printed circuit board using anisotropic conductive adhesive, the flexible display panel and the printed circuit board can be directly bonded without the need for a flexible circuit board. This reduces the number of bonding processes in the display module, thereby improving the alignment accuracy between the flexible display panel and the printed circuit board. Furthermore, without the need for an intermediate connection using a flexible circuit board, the distance between the flexible display panel and the printed circuit board can be reduced, which is beneficial for the narrow bezel design of the flexible display panel. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments or conventional technologies of this disclosure, the accompanying drawings used in the description of the embodiments or conventional technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of a display module according to an embodiment of the present disclosure.

[0020] Figure 2 This is a schematic diagram of the structure of another display module according to an embodiment of the present disclosure.

[0021] Figure 3 This is a schematic diagram of the structure of another display module according to an embodiment of the present disclosure.

[0022] Figure 4 This is a flowchart of a method for binding a display module according to an embodiment of this disclosure.

[0023] Explanation of reference numerals in the attached figures:

[0024] 100 - Display module; 110 - Flexible display panel; 111 - First bonding area; 112 - First sub-bonding area; 113 - First groove; 120 - Printed circuit board; 121 - Second bonding area; 122 - Second sub-bonding area; 123 - Second groove; 130 - Chip; AA - Display area; NA - Non-display area. Detailed Implementation

[0025] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0026] Currently, in the bonding process between flexible display panels and printed circuit boards (PCBs), because the flexible display panel is a bendable flexible material while the PCB is a rigid material that cannot be bent, multiple COP (Chip-on-Panel) and FOP (Flexible Printed Circuit) processes are required to bond the PCB and flexible display panel together using an FPC (Flexible Printed Circuit) to achieve the various display functions of the flexible display panel. However, during this bonding process, the flexible display panel and the PCB are prone to misalignment, which affects the display function of the flexible display panel and reduces its yield. Furthermore, the FOP process increases the spacing between the flexible display panel and the PCB, thus increasing the bonding area of ​​the flexible display panel and hindering the narrow bezel design of the flexible display panel.

[0027] This disclosure provides a display module that may include a flexible display panel, a printed circuit board (PCB), and anisotropic conductive adhesive. The flexible display panel may be divided into a display area and a non-display area surrounding the display area. The non-display area may include a first bonding area, which may be located on one side of the non-display area. The PCB may include a second bonding area, which may be located on one side of the PCB. The anisotropic conductive adhesive is located between the flexible display panel and the PCB, and the first bonding area is electrically connected to the second bonding area via the anisotropic conductive adhesive. By directly connecting the first bonding area of ​​the flexible display panel to the second bonding area of ​​the PCB via the anisotropic conductive adhesive, the flexible display panel and the PCB can be directly bonded without the need for a flexible PCB, reducing the number of bonding processes in the display module and improving the alignment accuracy between the flexible display panel and the PCB. Furthermore, without the need for an intermediate connection via a flexible PCB, the distance between the flexible display panel and the PCB can be reduced, which is beneficial for the narrow bezel design of the flexible display panel.

[0028] Furthermore, in existing technologies, when bonding a flexible display panel and a printed circuit board using a flexible circuit board, the relatively low rigidity of both the flexible circuit board and the flexible display panel leads to significant simultaneous changes in their expansion amounts. This makes it difficult to accurately calculate and control the expansion, thus reducing the success rate of bonding. In contrast, this application eliminates the need for an intermediate flexible circuit board connection. By directly bonding the flexible display panel and the printed circuit board, the higher rigidity of the printed circuit board results in smaller expansion. Only the expansion of the flexible display panel is noticeable, making it easier to determine the expansion amount and thus facilitating bonding. This improves the success rate of bonding. Additionally, the direct bonding of the flexible display panel and the printed circuit board provides valuable reference for determining the specific locations of bonding terminals in the subsequent bonding area.

[0029] The components of the flexible display panel provided in the embodiments of this disclosure will now be described in detail with reference to the accompanying drawings.

[0030] In one embodiment of this disclosure, such as Figure 1 As shown, the flexible display panel 110 can be divided into a display area AA and a non-display area NA surrounding the display area AA. The non-display area NA may include a first bonding area 111, which may be located on one side of the non-display area NA. In other words, the first bonding area 111 may be located on one side of the flexible display panel 110 and extend away from the display area AA, thereby giving the flexible display panel 110 a first bonding area 111 extending away from the display area AA. This design facilitates bonding with the printed circuit board 120 without affecting the bending function of the flexible display panel 110.

[0031] The positions of various components of the flexible display panel 110 in at least one embodiment of this disclosure will be described below using a two-dimensional Cartesian coordinate system with reference to the flexible display panel 110. For example, in the above-described Cartesian coordinate system, the X-axis and Y-axis directions are parallel to the surface of the flexible display panel 110.

[0032] In one embodiment of this disclosure, the first bonding area 111 may include a plurality of spaced-apart first sub-bonding areas 112. Specifically, each first sub-bonding area 112 has the same shape and is arranged in a line along one side of the flexible display panel 110. In other words, the first bonding area 111 has a plurality of spaced-apart first sub-bonding areas 112 distributed along the X-axis direction, and the spacing of each first sub-bonding area 112 in the X-axis direction may be the same or different. Under this design, each first sub-bonding area 112 can be electrically connected to the second bonding area 121 of the printed circuit board 120 through anisotropic conductive adhesive, thereby improving its bonding effect. It is worth noting that the number of first sub-bonding areas 112 can be multiple, and this disclosure does not impose a special limitation on this. Those skilled in the art can appropriately select the appropriate number of first sub-bonding areas 112 according to the actual bonding process of the flexible display panel 110. Optionally, a plurality of chips 130 are electrically connected to the first bonding area 111, and each first sub-bonding area 112 has at least one chip 130.

[0033] For example, each first sub-bonding area 112 can be electrically connected to the second bonding area 121 of the printed circuit board 120 via anisotropic conductive adhesive, thereby connecting the first bonding area 111 to the second bonding area 121 and bonding the flexible display panel 110 to the printed circuit board 120. When the first bonding area 111 of the flexible display panel 110 is electrically connected to the second bonding area 121 of the printed circuit board 120 via anisotropic conductive adhesive, since the first bonding area 111 is located on one side of the flexible display panel 110 and can also be bent, it does not affect the bending function of the flexible display panel 110.

[0034] For example, the first bonding area 111 may also include multiple first grooves 113, so that each first sub-bonding area 112 has a gap. That is, the first grooves 113 are arranged sequentially along the X-axis, and the number of first grooves 113 corresponds to the number of first sub-bonding areas 112. In other words, if the number of first sub-bonding areas 112 is four, then the number of first grooves 113 is three; if the number of first sub-bonding areas 112 is three, then the number of first grooves 113 is two. Under this design, during the bonding process between the flexible display panel 110 and the printed circuit board 120, the flexible display panel 110 will generate a certain amount of expansion along the X-axis. This expansion will gradually accumulate along the X-axis during the bonding process, causing the size of each first sub-bonding area 112 to change, thereby affecting its bonding alignment. The first grooves 113 can accommodate the size change of the first sub-bonding area 112, that is, the size change of the first sub-bonding area 112 will not affect the other first sub-bonding areas 112, so that each first sub-bonding area 112 has independent space to allow its size change.

[0035] Optionally, each first groove 113 can have the same shape and size. Specifically, the shape of the first groove 113 can be rectangular or square. The opening size of the first groove 113 can be the same; for example, the opening size of the first groove is 3 mm to 5 mm, that is, the dimension of each first groove 113 extending along the X-axis direction can be 3 mm, 3.5 mm, 4 mm, or 5 mm. Furthermore, the depth of the opening of the first groove 113 can also be the same; that is, the dimension of the first groove 113 extending along the Y-axis direction ranges from 6 mm to 10 mm, that is, the dimension of each first groove 113 extending along the Y-axis direction can be 6 mm, 7 mm, 8 mm, 9 mm, or 10 mm. This disclosure does not impose any special limitations on this; those skilled in the art can design the corresponding dimensions of the first groove 113 according to different bonding requirements of the flexible display panel 110.

[0036] In other embodiments, the dimensions of the first groove 113 extending along the X-axis can also be different. That is, the dimensions of the first groove 113 extending along the X-axis can gradually increase. Since the expansion of the flexible display panel 110 continuously accumulates and increases along the X-axis, the continuously increasing dimensions of the first groove 113 along the X-axis can adapt to the continuously increasing expansion of the flexible display panel 110, thereby avoiding affecting its bonding effect. For example, if there are four first sub-bonding areas 112 and three first grooves 113, the dimensions of the first grooves 113 extending along the X-axis can be 3 mm, 3.5 mm, and 4 mm, respectively. This allows the dimensions of each first groove 113 extending along the X-axis to continuously increase, thereby adapting to the continuously increasing expansion of the flexible display panel 110.

[0037] In one embodiment of this disclosure, the second bonding area 121 may include a plurality of spaced-apart second sub-bonding areas 122, the number and position of which correspond one-to-one with the number of first sub-bonding areas 112. Specifically, each second sub-bonding area 122 may have the same shape and be arranged in a line along one side of the printed circuit board 120. In other words, the second bonding area 121 has a plurality of spaced-apart second sub-bonding areas 122 distributed along the X-axis direction, and the spacing of each second sub-bonding area 122 in the X-axis direction may be the same or different. In this design, each first sub-bonding area 112 can be electrically connected to each second sub-bonding area 122 by anisotropic conductive adhesive, thereby enabling the flexible display panel 110 to be bonded to the printed circuit board 120. Furthermore, the number and position of the first sub-binding area 112 and the second sub-binding area 122 can correspond one-to-one. This improves the alignment accuracy of the first sub-binding area 112 and the second sub-binding area 122, thereby improving the binding accuracy of the first binding area 111 and the second binding area 121, and ultimately enhancing the binding effect. In other words, the number of the first sub-binding area 112 and the second sub-binding area 122 are the same, and their positions correspond one-to-one. For example, if there are four first sub-binding areas 112, then there are also four second sub-binding areas 122, and the size of the first sub-binding area 112 and the second sub-binding area 122 are the same.

[0038] Optional, such as Figure 2 and Figure 3 As shown, the second bonding area 121 may further include multiple second grooves 123, so that each second sub-bonding area 122 has a gap. That is, the second grooves 123 can be arranged sequentially along the X-axis direction, and the number of second grooves 123 corresponds to the number of second sub-bonding areas 122. For example, if the number of second sub-bonding areas 122 is four, then the number of second grooves 123 is three; if the number of second sub-bonding areas 122 is three, then the number of second grooves 123 is two. Under this design, during the bonding process between the flexible display panel 110 and the printed circuit board 120, the printed circuit board 120 will generate a certain amount of expansion along the X-axis direction. This expansion will gradually accumulate along the X-axis direction during the bonding process, thereby causing the size of each second sub-bonding area 122 to change, thus affecting its bonding alignment. The second grooves 123 can accommodate the size change of the second sub-bonding area 122, that is, the size change of the second sub-bonding area 122 will not affect other second sub-bonding areas 122, so that each second sub-bonding area 122 has independent space to allow its size change. Furthermore, the number of the second groove 123 and the first groove 113 can be equal.

[0039] It is worth noting that since the expansion amounts of the flexible display panel 110 and the printed circuit board 120 are not the same, the accumulated expansion amount of the flexible display panel 110 along the X-axis direction and the accumulated expansion amount of the printed circuit board 120 along the X-axis direction are inconsistent, resulting in different size variations of the first sub-bonding area 112 and the second sub-bonding area 122. To solve the above technical problem, the positions of the first groove 113 and the second groove 123 may not correspond, and the sizes of the first groove 113 and the second groove 123 may be different. That is, after the flexible display panel 110 and the printed circuit board 120 are bonded, the first groove 113 and the second groove 123 can be staggered, thus accommodating the different expansion amounts of the flexible display panel 110 and the printed circuit board 120.

[0040] For example, as described above, the number of first sub-bonding areas 112 is four, and the number of first grooves 113 is three. The dimensions of the first grooves 113 extending along the X-axis can be 3 mm, 3.5 mm, and 4 mm, respectively. Similarly, the number of second sub-bonding areas 122 can also be four, and the number of second grooves 123 can also be three. The dimensions of the second grooves 123 extending along the X-axis can then be 3.5 mm, 4 mm, and 4.5 mm, respectively. Thus, by setting different sizes for the first grooves 113 and the second grooves 123, it is possible to accommodate different expansion amounts of the flexible display panel 110 and the printed circuit.

[0041] In one embodiment of this disclosure, both the first bonding area 111 and the second bonding area 121 may include multiple pins to align the first bonding area 111 and the second bonding area 121 via these pins. When bonding the flexible display panel 110 and the printed circuit board 120, the pins of the first bonding area 111 and the pins of the second bonding area 121 need to be aligned for initial electrical connection. It should be noted that since the first bonding area 111 includes multiple first sub-bonding areas 112 and the second bonding area 121 includes multiple second sub-bonding areas 122, the first sub-bonding areas 112 and the second sub-bonding areas 122 may include multiple pins for alignment.

[0042] Optionally, the pins of the first bonding region 111 and the second bonding region 121 may be attached with anisotropic conductive adhesive for bonding the first bonding region 111 and the second bonding region 121. For example, the anisotropic conductive adhesive may include a matrix and conductive particles. The matrix material may be epoxy resin, acrylate resin, or polyurethane.

[0043] This disclosure also provides a method for binding a display module 100, such as... Figure 4 As shown, the method may include the following steps:

[0044] Step S110: Apply anisotropic conductive adhesive to the first bonding area 111 or the second bonding area 121.

[0045] Step S120: Align the pins on the first binding area 111 with the pins on the second binding area 121;

[0046] Step S130: The first binding area 111 and the second binding area 121 are bound together by heating.

[0047] In this disclosure, by directly connecting the first bonding area 111 of the flexible display panel 110 to the second bonding area 121 of the printed circuit board 120 using anisotropic conductive adhesive, the alignment accuracy between the flexible display panel 110 and the printed circuit board 120 can be improved without the use of an FPC, thereby avoiding any impact on the display function of the flexible display panel 110 and improving the yield of the flexible display panel 110. Furthermore, without using an FPC, the spacing between the flexible display panel 110 and the printed circuit board 120 can be reduced, which is beneficial for the narrow bezel design of the flexible display panel 110.

[0048] It should be noted that when performing the bonding process on the first bonding area 111 and the second bonding area 121, anisotropic conductive adhesive can be applied sequentially to the first sub-bonding area 112 or the second sub-bonding area 122 to align the pins on the first sub-bonding area 112 with the pins on the second sub-bonding area 122. This can reduce the number of bonding processes, improve the alignment accuracy and bonding effect, and thus reduce production costs.

[0049] This disclosure also provides a display device, which includes the display module described in any of the above embodiments. The display device can be a smartphone screen, computer monitor, digital camera frame, tablet computer, electronic display screen, electronic billboard, or other types of electronic products. Since this display device has any of the display modules described in the above-described display module embodiments, it has the same beneficial effects, and will not be repeated here.

[0050] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications or equivalent substitutions made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A display module, characterized in that, include: A flexible display panel is divided into a display area and a non-display area surrounding the display area, wherein the non-display area includes a first bonding area, and the first bonding area is located on one side of the non-display area; A printed circuit board, including a second bonding area, located on one side of the printed circuit board; as well as An anisotropic conductive adhesive is located between the flexible display panel and the printed circuit board, and the first bonding area is electrically connected to the second bonding area through the anisotropic conductive adhesive; The first binding area includes multiple first sub-binding areas set at intervals; The first binding area includes a plurality of first grooves so that each of the first sub-binding areas has a gap.

2. The display module according to claim 1, characterized in that, Each of the first sub-bonding regions is electrically connected to the second bonding region of the printed circuit board via the anisotropic conductive adhesive.

3. The display module according to claim 1, characterized in that, The second binding area includes multiple second sub-binding areas spaced at intervals, and the number and position of the second sub-binding areas correspond one-to-one with those of the first sub-binding areas.

4. The display module according to claim 3, characterized in that, Each of the first sub-binding regions is electrically connected to each of the second sub-binding regions via the anisotropic conductive adhesive.

5. The display module according to claim 1, characterized in that, Multiple chips are connected to the first bonding area when powered on.

6. The display module according to claim 5, characterized in that, Each of the first sub-binding regions has at least one of the aforementioned chips.

7. The display module according to claim 1, characterized in that, Each of the first grooves has the same shape and size.

8. The display module according to claim 1, characterized in that, The second binding area includes a plurality of second grooves, the number of which is equal to the number of the first grooves.

9. The display module according to claim 1, characterized in that, The size of the opening of the first groove is 3 mm to 5 mm.

10. The display module according to any one of claims 1 to 9, characterized in that, Both the first binding area and the second binding area include multiple pins so that the first binding area and the second binding area can be aligned through the pins.

11. The display module according to any one of claims 1 to 9, characterized in that, The anisotropic conductive adhesive includes a matrix and conductive particles, wherein the matrix is ​​made of epoxy resin, acrylate resin, or polyurethane.

12. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 11.

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