Anisotropic conductive adhesive film bonding process line of camera module

Abstract

The utility model discloses an anisotropic conductive adhesive film bonding process line of a camera module, and relates to the technical field of anisotropic conductive adhesive film bonding of camera modules, and the anisotropic conductive adhesive film bonding process line of the camera module comprises a bonding device and a scanning device; the bonding equipment is used for bonding the camera module in a first state with a flexible circuit board through the anisotropic conductive adhesive film, so that the camera module in the first state is converted into a camera module in a second state; and the scanning equipment is positioned behind the bonding equipment and is used for scanning the camera module in the second state and identifying the code of the flexible circuit board on the camera module in the second state so as to trace the production process information of the camera module. According to the invention, related production information can be recorded in the bonding process of the anisotropic conductive adhesive film of the camera module, so that defective products can be conveniently traced when appearing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of camera module anisotropic conductive adhesive film bonding, and particularly relates to a camera module anisotropic conductive adhesive film bonding process line. BACKGROUND

[0002] In the manufacturing process of a camera module, the connection between the camera module and the flexible circuit board usually needs to be bonded by using a conductive adhesive film. The bonding process line of the camera module may have some problems in the bonding process, for example, low bonding efficiency, unstable bonding quality, etc. These problems affect the production efficiency and product quality of the camera module, and therefore, after discovering that the camera module has quality problems, relevant production information in the bonding process needs to be checked to facilitate rectification of the relevant problems. In the related art, in the anisotropic conductive adhesive film bonding process line of the camera module, there is no way to record and file the production information in the bonding process, which cannot trace the production information of the product. CONTENT OF THE UTILITY MODEL

[0003] The present application aims to at least solve one of the technical problems in the prior art, and provides a camera module anisotropic conductive adhesive film bonding process line, which can record relevant production information in the camera module anisotropic conductive adhesive film bonding process, and facilitate tracing when defective products occur.

[0004] The present application provides a camera module anisotropic conductive adhesive film bonding process line, which comprises a bonding device and a scanning device.

[0005] The bonding device is used to bond a camera module in a first state and a flexible circuit board by using an anisotropic conductive adhesive film, so that the camera module in the first state is converted into a camera module in a second state.

[0006] The scanning device is located behind the bonding device and is used to scan the camera module in the second state and identify the code of the flexible circuit board on the camera module in the second state, so as to facilitate tracing of the production process information of the camera module.

[0007] According to the technical scheme of the embodiment of the present application, at least the following beneficial effects are achieved: the anisotropic conductive adhesive film bonding process line of the camera module includes a bonding device and a scanning device, the bonding device is used to bond the camera module in the first state and the flexible circuit board through the anisotropic conductive adhesive film, that is, the bonding device is mainly used to complete the anisotropic conductive adhesive film bonding work of the camera module, and convert the camera module in the first state into a camera module in the second state, and the camera module in the second state can be understood as a camera module with a flexible circuit board; then, the scanning device scans the camera module in the second state, so as to collect and record the code of the flexible circuit board on the camera module in the second state, based on which, the specific model and batch of the flexible circuit board used in the anisotropic conductive adhesive film bonding process line and the production information that the flexible circuit board is specifically applied to which camera module can be recorded, so that the relevant production information can be recorded in the anisotropic conductive adhesive film bonding process of the camera module, and the traceability of the defective product can be facilitated.

[0008] According to some embodiments of the present application, a module transfer device is further included, and the module transfer device is used to transfer the camera module in the second state to a next process, and the bonding device, the scanning device and the module transfer device are arranged in sequence.

[0009] According to some embodiments of the present application, the bonding device includes a raw material transfer device and a bonding process device, the raw material transfer device is used to transfer the camera module in the first state to a bonding process carrier, and the bonding process device is used to bond the camera module in the first state and the flexible circuit board on the bonding process carrier.

[0010] According to some embodiments of the present application, the scanning device is further used to scan the bonding process carrier and identify the code of the bonding process carrier, so as to facilitate the traceability of the production information of the camera module.

[0011] According to some embodiments of the present application, the code of the bonding process carrier includes a serial number of the bonding process carrier, the code of the flexible circuit board includes a position number of the flexible circuit board on the bonding process carrier, and a serial number of the flexible circuit board.

[0012] According to some embodiments of the present application, the scanning device is further used to combine the serial number of the flexible circuit board, the serial number of the bonding process carrier and the position number of the flexible circuit board on the bonding process carrier into a bonding code set, so as to facilitate the traceability of the production information of the camera module through the bonding code set.

[0013] According to some embodiments of the present application, the scanning device is used to scan the bonding process carrier first, and then scan the camera module in the second state.

[0014] According to some embodiments of the present application, the scanning device is further configured to upload the code of the bonding process carrier to a production management system connected to the scanning device, so as to bind the code of the bonding process carrier and the code of the camera module by the production management system, to facilitate tracing the production information of the camera module by the production management system.

[0015] According to some embodiments of the present application, the code of the flexible circuit board comprises a time when the camera module in the first state and the flexible circuit board are bonded by the bonding device.

[0016] According to some embodiments of the present application, the bonding process device comprises a first bonding process device for pasting the anisotropic conductive adhesive film on the camera module in the first state, a second bonding process device for bonding the camera module in the first state and the flexible circuit board, and a third bonding process device for heating to cure the anisotropic conductive adhesive film between the camera module in the first state and the flexible circuit board, and the first bonding process device, the second bonding process device and the third bonding process device are arranged in sequence.

[0017] Other features and advantages of the present application will be set forth in the following description, and in part will become apparent from the description, or can be learned by practice of the present application. The objects and other advantages of the present application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings are included to provide a further understanding of the technical scheme of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical scheme of the present application, and do not constitute a limitation on the technical scheme of the present application.

[0019] The present application will be further described below in conjunction with the drawings and embodiments;

[0020] Figure 1 is a structural schematic block diagram of an anisotropic conductive adhesive film bonding process line provided by an embodiment of the present application;

[0021] Figure 2 is a structural schematic block diagram of an anisotropic conductive adhesive film bonding process line provided by another embodiment of the present application;

[0022] Figure 3 is a structural schematic block diagram of an anisotropic conductive adhesive film bonding process line provided by another embodiment of the present application;

[0023] Figure 4 is a structural schematic block diagram of an anisotropic conductive adhesive film bonding process line provided by another embodiment of the present application. DETAILED DESCRIPTION

[0024] The detailed description of the application will be described in detail in this part, the preferred embodiments of the application are shown in the drawings, the role of the drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the application, but it cannot be understood as a limitation on the protection scope of the application.

[0025] In the description of the application, it should be understood that the orientation description, such as the orientation or position relationship indicated by up, down, front, back, left, right and the like, is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the application.

[0026] In the description of the application, several meanings are one or more, and the meaning of multiple is more than two, greater than, less than, more than and the like are not included in the number, and above, below, within and the like are included in the number. If it is described as first, second, it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or the sequence of indicated technical features

[0027] In the description of the application, unless otherwise explicitly limited, the words such as setting, installing, connecting and the like should be understood in a broad sense, and the person skilled in the art can reasonably determine the specific meaning of the above words in the application in combination with the specific content of the technical scheme.

[0028] The following will be described in detail in combination with the drawings Figures 1-4 The application will be further described.

[0029] As Figure 1 shown, Figure 1 is a structure schematic block diagram of the anisotropic conductive adhesive film bonding process line of the camera module provided by an embodiment of the application, the anisotropic conductive adhesive film bonding process line comprises a bonding device and a scanning device;

[0030] The bonding device is used for bonding the camera module in the first state and the flexible circuit board through the anisotropic conductive adhesive film, so as to convert the camera module in the first state into the camera module in the second state;

[0031] The scanning device is located behind the bonding device and is used for scanning the camera module in the second state, identifying the code of the flexible circuit board on the camera module in the second state, so as to trace the production information of the camera module.

[0032] It can be understood that the anisotropic conductive adhesive film is a special material with directional conductive function, and the anisotropic conductive adhesive film usually has tiny conductive particles, which are conductive in the Z-axis direction and non-conductive in the X-axis and Y-axis directions. In the production process of the camera module, especially in the production process of the camera module of the mobile phone, the main role is to realize the electrical connection between the chip and the substrate in the assembly process of the camera module.

[0033] In the embodiment, the anisotropic conductive adhesive film bonding process line is used to realize the anisotropic conductive adhesive film bonding process of the camera module, that is, the anisotropic conductive adhesive film is bonded between the camera module and the flexible circuit board to realize the conduction of the camera module and the flexible circuit board. It can be understood that the camera module before bonding has undergone a series of precise manufacturing and assembly processes. For example, before bonding, the lens, image sensor, fixed frame, circuit board and other electronic components are assembled into a camera module after precise machining and detection, and cleaning treatment such as removal of oil stains, dust and pollutants that may affect the bonding effect. In an embodiment, before assembly, each component of the camera module, especially the image sensor, needs to be verified for performance through functional testing, including key indicators such as sensitivity, resolution, color restoration. In order to ensure accurate alignment of the camera module during assembly, alignment marks are usually set on key components such as lenses and sensors to facilitate accurate placement of each component during bonding.

[0034] The flexible circuit board can integrate the image sensor, lens, signal processing chip and other electronic components in the camera module with the mainboard of the mobile phone or other electronic systems. The image data generated by the camera module is transmitted to the processor of the mobile phone through the flexible circuit board for processing. The flexible circuit board can withstand repeated bending without damage, so the anisotropic conductive adhesive film is used to bond between the camera module and the flexible circuit board, which can be bent and folded according to the design of the camera module and the internal structure of the mobile phone, and is suitable for narrow or complex space layout.

[0035] In the embodiment, the anisotropic conductive adhesive film bonding process line includes a bonding device and a scanning device. The bonding device is used to bond the camera module in the first state and the flexible circuit board by the anisotropic conductive adhesive film, that is, the bonding device is mainly used to complete the anisotropic conductive adhesive film bonding process of the camera module, and convert the camera module in the first state into the camera module in the second state. It can be understood that the camera module in the first state can be considered as a camera module without a flexible circuit board, and the camera module in the second state can be understood as a camera module with a flexible circuit board. Converting the camera module in the first state into the camera module in the second state means bonding the flexible circuit board to the camera module.

[0036] The bonding equipment in the anisotropic conductive adhesive film bonding process line can include multiple devices that realize different functions, for example, including an alignment device for accurately aligning the camera module and the flexible circuit board, the alignment device can use high-precision visual recognition technology and mechanical positioning device to realize alignment, ensuring that the alignment error between the two is in the micron level; an adhesive application device for accurately applying anisotropic conductive adhesive film to the specified position of the camera module or the flexible circuit board, the adhesive application device can be realized by a precision glue gun or a roller, which can control the amount of glue and the uniformity of the coating; a pressure control device that can adjust and maintain a constant pressure, during the bonding process, the pressure control device applies appropriate pressure to ensure that the conductive adhesive film is in full contact with the two bonding surfaces; a heating and curing device for heating the anisotropic conductive adhesive film to achieve optimal bonding strength and conductivity, the heating and curing device can use a hot plate or an infrared heating device, which can provide a uniform and controllable heating environment.

[0037] Based on this, through the bonding equipment, the camera module in the first state and the flexible circuit board are bonded using anisotropic conductive adhesive film. In this embodiment, the type of anisotropic conductive adhesive film can be anisotropic conductive adhesive film using different particles as conductive medium, or anisotropic conductive adhesive film with different curing characteristics.

[0038] The scanning device is located after the bonding equipment, and is used to scan the camera module in the second state after the bonding equipment completes the camera module and flexible circuit board bonding process, to identify the code of the flexible circuit board on the camera module in the second state.

[0039] It can be understood that, in the production process of the camera module, in order to facilitate the management of the camera module and the flexible circuit board, a unique identification such as a serial number is usually printed or engraved on the camera module and the flexible circuit board. Therefore, when the camera module in the first state and the flexible circuit board are bonded using anisotropic conductive adhesive film, the bonding can be performed according to the unique identification position on the camera module and the flexible circuit board, so that the unique identifications on the camera module and the flexible circuit board do not overlap. Based on this, after the bonding equipment completes the camera module and flexible circuit board bonding process, the camera module and the flexible circuit board are bonded together to become a camera module in the second state, and the unique identifications on the camera module and the flexible circuit board do not overlap. The scanning device can scan each camera module in the second state to identify the unique identifications on the camera module and the flexible circuit board, i.e., the codes on the camera module and the flexible circuit board. The codes on the camera module and the flexible circuit board can also be identified before the bonding process, before the camera module enters the bonding equipment. When the scanning device scans each camera module in the second state, the code on the flexible circuit board is identified. In this way, the codes on the camera module and the flexible circuit board can be identified separately, reducing the probability of misidentification.

[0040] Based on this, through the scanning device, the relevant information of the flexible circuit board bonded with each camera module can be identified, so that when subsequent poor bonding occurs, the production batch of the camera module with poor bonding can be determined through the code of the scanned flexible circuit board, thereby facilitating the production management of the production party.

[0041] In the embodiment, the code on the camera module and the flexible circuit board can be a bar code, a two-dimensional code or characters, and the scanning mode can be automatic identification and positioning of the code on the flexible circuit board through visual recognition technology.

[0042] In the embodiment, after the bonding device completes the bonding process of the camera module and the flexible circuit board, the camera module in the second state can be transferred from the bonding device to the code scanning device by a conveying belt or a visual mechanical arm or the like conveying device, or can be manually transferred from the bonding device to the code scanning device by a worker.

[0043] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, as shown in Figure 2 , the process line further includes a module transfer device, the module transfer device is used to transfer the camera module in the second state to the next process, and the bonding device, the scanning device and the module transfer device are arranged in sequence.

[0044] In the embodiment, in order to realize the automation of the production of the camera module, the production line of the camera module can include a plurality of automatic devices, and the anisotropic conductive adhesive film bonding process line of the camera module further includes a module transfer device in addition to the bonding device and the scanning device, and the bonding device, the scanning device and the module transfer device are arranged in sequence, that is, the module transfer device is located after the scanning device and is used to transfer the camera module in the second state to the next process after the scanning device completes the code identification and collection of the flexible circuit board. It can be understood that the production line of the camera module includes a plurality of different processes, and therefore, the automation of the production of the camera module can be realized through the module transfer device.

[0045] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, as shown in Figure 3 , the bonding device includes a raw material transfer device and a bonding process device, the raw material transfer device is used to transfer the camera module in the first state to the bonding process carrier, and the bonding process device is used to bond the camera module in the first state and the flexible circuit board on the bonding process carrier.

[0046] In the embodiment, in order to realize the automation of the production of the camera module, the production line of the camera module can include various automated devices, wherein the bonding device includes a material transfer device and a bonding process device, the material transfer device is used to transfer the camera module in the first state to the bonding process carrier, that is, the camera module without the flexible circuit board is transferred from the previous process to the bonding process carrier applied in the bonding process, so that the high automation in the production process of the camera module is realized through the material transfer device. It can be understood that the previous process of the bonding process can be a lens assembly and packaging process, a quality inspection process, a cleaning process, etc.

[0047] The bonding process carrier refers to a carrier used to carry the camera module in the bonding process. The bonding process carrier can be a tray or other types of carriers capable of carrying multiple camera modules. In the embodiment, all processes of bonding the camera module in the first state and the flexible circuit board can be performed on the bonding process carrier, and the bonding process carrier provides a stable support for the bonding process of the camera module.

[0048] The bonding process device is used to bond the camera module in the first state and the flexible circuit board on the bonding process carrier. The bonding process device can be a device capable of realizing the alignment of the camera module and the flexible circuit board, accurately coating the anisotropic conductive adhesive film on the specified position of the camera module or the flexible circuit board, adjusting and maintaining constant pressure, heating the anisotropic conductive adhesive film, etc. The bonding process device can also include multiple devices respectively realizing the alignment of the camera module and the flexible circuit board, accurately coating the anisotropic conductive adhesive film on the specified position of the camera module or the flexible circuit board, adjusting and maintaining constant pressure, heating the anisotropic conductive adhesive film, etc.

[0049] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the application, the scanning device is also used to scan the bonding process carrier and identify the code of the bonding process carrier, so as to trace the production information of the camera module.

[0050] It can be understood that the anisotropic conductive adhesive film is usually packaged in a roll form, can be continuously cut and used on the production line, and the anisotropic conductive adhesive film is usually a polymer film with a certain flexibility and a thickness generally between several tens of microns and several hundred microns. Therefore, there is usually no mark on the anisotropic conductive adhesive film, and if the batch of the anisotropic conductive adhesive film used for the camera module is to be recorded, it cannot be realized by identifying the anisotropic conductive adhesive film.

[0051] Based on this, the code can be arranged on the adhesive process carrier for carrying multiple camera modules, and when the scanning device scans the code of the flexible circuit board of the camera module in the second state, the adhesive process carrier is also scanned, and the code of the adhesive process carrier is identified. In this way, through the code of the adhesive process carrier, the batch of the anisotropic conductive adhesive film used by the camera module can be traced, so as to trace more production information of the camera module.

[0052] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, the code of the adhesive process carrier includes the serial number of the adhesive process carrier, the code of the flexible circuit board includes the position number of the flexible circuit board on the adhesive process carrier, and the serial number of the flexible circuit board.

[0053] In the present embodiment, the code of the adhesive process carrier identified by the scanning device scanning the adhesive process carrier includes the serial number of the adhesive process carrier, and the serial number of each adhesive process carrier is unique. In this way, the batch of the anisotropic conductive adhesive film used by the camera module can be traced through the serial number of each adhesive process carrier; the code of the flexible circuit board identified by the scanning device scanning the camera module in the second state includes the serial number of the flexible circuit board, and similarly, the serial number of each flexible circuit board is also unique. In this way, the batch of the anisotropic conductive adhesive film and the flexible circuit board used by the camera module can be traced through the serial number of each adhesive process carrier and the serial number of the flexible circuit board.

[0054] It can be understood that the adhesive process carrier can carry multiple camera modules at the same time, and each camera module can be placed at a different position of the adhesive process carrier, so that the positions of each camera module are different. Therefore, when multiple camera modules in the second state are placed at different positions of the adhesive process carrier, the positions of the flexible circuit boards corresponding to each camera module in the second state on the adhesive process carrier are different. By identifying the position of each flexible circuit board on the adhesive process carrier, the specific position of the camera module corresponding to each flexible circuit board on the adhesive process carrier can be known. Therefore, the code of the flexible circuit board identified by the scanning device scanning the camera module in the second state also includes the position number of the flexible circuit board on the adhesive process carrier. Through the position number of the flexible circuit board on the adhesive process carrier, the specific flexible circuit board used by the camera module can be traced.

[0055] It can be understood that the position number on the adhesive process carrier can be pre-set, and by identifying the position of the flexible circuit board, the position number of the flexible circuit board on the adhesive process carrier can be known.

[0056] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, the scanning device is further configured to combine the serial number of the flexible circuit board, the serial number of the bonding process carrier, and the position number of the flexible circuit board on the bonding process carrier into a bonding code set, so as to trace the production information of the camera module through the bonding code set.

[0057] In the present embodiment, the scanning device is further configured to combine the serial number of the flexible circuit board, the serial number of the bonding process carrier, and the position number of the flexible circuit board on the bonding process carrier into a bonding code set, and the bonding code set includes a plurality of different dimensions of production information in the bonding process of a plurality of camera modules on the current bonding process carrier. Therefore, through the current bonding code set, a plurality of production information of the current bonding process can be obtained, and through a plurality of bonding code sets of the current batch, a plurality of production information of the current bonding process can be obtained, so as to trace the production information of the camera module in a plurality of different dimensions through the bonding code set.

[0058] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, the scanning device is configured to scan the bonding process carrier first, and then scan the camera module in the second state.

[0059] In the present embodiment, the specific number of the camera module carried on the current bonding process carrier can be identified in advance, that is, the specific number of each camera module carried on the current bonding process carrier at different positions is identified in advance. Therefore, the scanning device can determine the specific number of each camera module carried on the current bonding process carrier by scanning the bonding process carrier first, and then scan the camera module in the second state to identify the code of the flexible circuit board of each camera module in the second state. In this way, each camera module carried on the current bonding process carrier at different positions can be associated with the corresponding flexible circuit board, thereby facilitating the tracing of the production information of the camera module.

[0060] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, the scanning device is further configured to upload the code of the bonding process carrier to a production management system connected to the scanning device, so as to bind the code of the bonding process carrier and the code of the camera module through the production management system, and facilitate the tracing of the production information of the camera module through the production management system.

[0061] In the present embodiment, the scanning device is in communication connection with the production management system, and the production management system can be a system for information management and process control of the overall production process of the camera module. Through the production management system, all data and information in the overall production process of the camera module, such as the code of each camera module carried on the bonding process carrier, can be uniformly managed, so as to facilitate the coordination and scheduling of the overall production process of the camera module by the staff.

[0062] Therefore, after the scanning device scans the bonding process carrier and identifies the code of the bonding process carrier, the scanning device can further upload the code of the bonding process carrier to a production management system connected to the scanning device. The production management system can determine the specific number of the current bonding process carrier according to the code of the bonding process carrier, thereby determining the code of each camera module carried on the current bonding process carrier, and further binding the code of the bonding process carrier and the code of the camera module. In this way, the management of data information in the production process of the camera module is strengthened, thereby facilitating the tracing of the production information of the camera module through the production management system.

[0063] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, the code of the flexible circuit board includes the time when the bonding device bonds the camera module in the first state and the flexible circuit board.

[0064] In the present embodiment, the code of the flexible circuit board includes the time when the bonding device bonds the camera module in the first state and the flexible circuit board. By recording the time point, the data information in the production process of the camera module is further enriched, thereby facilitating the tracing of the production information of the camera module.

[0065] In the anisotropic conductive adhesive film bonding process line provided in some embodiments of the present application, as shown in Figure 4 the bonding process device includes a first bonding process device for pasting an anisotropic conductive adhesive film to a camera module in a first state, a second bonding process device for bonding the camera module in the first state and a flexible circuit board, and a third bonding process device for heating to cure the anisotropic conductive adhesive film between the camera module in the first state and the flexible circuit board. The first bonding process device, the second bonding process device and the third bonding process device are arranged in sequence.

[0066] In the present embodiment, the bonding process device includes a plurality of devices respectively implementing different work processes of the bonding process, including a first bonding process device for pasting an anisotropic conductive adhesive film to a camera module in a first state, a second bonding process device for bonding the camera module in the first state and a flexible circuit board, and a third bonding process device for heating to cure the anisotropic conductive adhesive film between the camera module in the first state and the flexible circuit board. The first bonding process device, the second bonding process device and the third bonding process device are arranged in sequence to implement the anisotropic conductive adhesive film bonding process of the camera module.

[0067] The embodiments of the present application are described in detail above in combination with the drawings, but the present application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the purpose of the present application.

Claims

1. A bonding process line for anisotropic conductive adhesive film of a camera module, characterized in that, include: An adhesive bonding device is used to bond a camera module in a first state and a flexible circuit board using the anisotropic conductive adhesive film, so as to convert the camera module in the first state into a camera module in a second state. A scanning device, located after the bonding device, is used to scan the camera module in the second state and identify the encoding of the flexible circuit board on the camera module in the second state, so as to trace the production information of the camera module.

2. The anisotropic conductive adhesive film bonding process line according to claim 1, characterized in that, It also includes a module transfer device, which is used to transfer the camera module in the second state to the next process. The bonding device, the scanning device and the module transfer device are arranged in sequence.

3. The anisotropic conductive adhesive film bonding process line according to claim 1, characterized in that, The bonding equipment includes a material transfer device and a bonding process device. The material transfer device is used to transfer the camera module in the first state to the bonding process carrier. The bonding process device is used to bond the camera module in the first state and the flexible circuit board on the bonding process carrier.

4. The anisotropic conductive adhesive film bonding process line according to claim 3, characterized in that, The scanning device is also used to scan the bonding process carrier and identify the code of the bonding process carrier in order to trace the production information of the camera module.

5. The anisotropic conductive adhesive film bonding process line according to claim 4, characterized in that, The coding of the bonding process carrier includes the serial number of the bonding process carrier, and the coding of the flexible circuit board includes the position number of the flexible circuit board on the bonding process carrier and the serial number of the flexible circuit board.

6. The anisotropic conductive adhesive film bonding process line according to claim 5, characterized in that, The scanning device is also used to combine the serial number of the flexible circuit board, the serial number of the bonding process carrier, and the position number of the flexible circuit board on the bonding process carrier into a bonding code set, so as to trace the production information of the camera module through the bonding code set.

7. The anisotropic conductive adhesive film bonding process line according to claim 4, characterized in that, The scanning device is used to first scan the bonding process carrier, and then scan the camera module in the second state.

8. The anisotropic conductive adhesive film bonding process line according to claim 4, characterized in that, The scanning device is also used to upload the code of the bonding process carrier to the production management system connected to the scanning device, so as to bind the code of the bonding process carrier and the code of the camera module through the production management system, so as to trace the production information of the camera module through the production management system.

9. The anisotropic conductive adhesive film bonding process line according to claim 1, characterized in that, The encoding of the flexible circuit board includes the time when the bonding device bonds the camera module and the flexible circuit board in the first state.

10. The anisotropic conductive adhesive film bonding process line according to claim 3, characterized in that, The bonding process equipment includes a first bonding process equipment for attaching the anisotropic conductive adhesive film to the camera module in the first state, a second bonding process equipment for bonding the camera module in the first state and the flexible circuit board, and a third bonding process equipment for heating to cure the anisotropic conductive adhesive film between the camera module in the first state and the flexible circuit board. The first bonding process equipment, the second bonding process equipment and the third bonding process equipment are arranged in sequence.

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