Display panel and display device

Abstract

The utility model relates to the technical field of display devices, in particular to a display panel and a display device. The objective of the utility model is to solve the problem of poor bonding between an electronic device and a bonding area in the prior art. According to the display panel, the at least two groups of first bonding parts are arranged on the body at intervals in the long edge direction, so that the limitation of the size of the first bonding parts in the short edge direction of the body in the prior art is broken through, and the spacing distance between the adjacent first bonding parts can be increased. Meanwhile, the spacing distance between the adjacent first bonding parts is set to be larger than 50 times of the thickness of the anisotropic conductive adhesive film, so that when the anisotropic conductive adhesive film bonds the first bonding structures in the first bonding parts with the second bonding structures in the second bonding parts on the bonding area, bubbles formed on the anisotropic conductive adhesive film can be dissipated automatically; therefore, the problem of poor bonding when the electronic device is bonded in the bonding area is effectively avoided, the connection reliability of the electronic device and the bonding area is improved, and the stability of the electrical performance of the display device is ensured.

Description

Technical Field

[0001] This utility model relates to the field of display device technology, specifically to a display panel and a display device. Background Technology

[0002] In the manufacturing process of display devices, the electrical connection between the bonding area of ​​the display panel and electronic components is usually achieved through bonding processes. However, since some electronic components, such as driver chips and flexible printed circuit boards, are sensitive to high temperatures and cannot withstand the high-temperature environment required by traditional soldering processes, the industry widely adopts anisotropic conductive film (ACF) as an alternative connection solution.

[0003] Although ACF is widely used in the bonding process of display devices, its inherent tape properties still have significant shortcomings in practical applications. Specifically, taking driver chips as an example, as driver chips continue to miniaturize and their size decreases, to ensure that the number of bonding bumps on the driver chip remains constant, it is usually necessary to reduce the spacing between the input and output bonding portions along the short side of the driver chip, reducing the spacing from W1 to W2. Figure 1 As shown. This makes it easy for air bubbles to form between the anisotropic conductive film and the bonding area of ​​the display panel when using anisotropic conductive film to bond the driver chip. These air bubbles are difficult to eliminate on their own, which can easily lead to poor bonding between the driver chip and the bonding area. This not only reduces the connection reliability of the bonding interface, but may also negatively affect the electrical performance of the display device.

[0004] Accordingly, a new technical solution is needed in this field to solve the above problems. Utility Model Content

[0005] To address at least one of the aforementioned problems in the prior art, namely, the problem of poor bonding between electronic devices and the bonding area in the prior art, this application provides a display panel, the display panel comprising:

[0006] An electronic device, the electronic device comprising a body and at least two sets of first bonding portions spaced apart along the long side of the body, wherein the spacing distance is L and each set of first bonding portions includes a plurality of first bonding structures.

[0007] The display area and the bonding area adjacent to the display area, wherein the side of the bonding area adjacent to the display area is parallel to the direction of the long side, and the bonding area has a plurality of second bonding structures corresponding one-to-one with the plurality of first bonding structures;

[0008] An anisotropic conductive film is located between the electronic device and the bonding area to bond the first bonding structure and the corresponding second bonding structure, wherein the anisotropic conductive film has a dimension D in the thickness direction, and L>50D.

[0009] In the preferred embodiment of the above-described display panel, the dimension of the first bonding structure in the film thickness direction is T1, where T1 < 5D; and / or

[0010] The second bonding structure has a dimension of T2 in the film thickness direction, where T2 < 5D.

[0011] In the preferred embodiment of the above-mentioned display panel, the number of the anisotropic conductive adhesive film is one; or

[0012] The number of the anisotropic conductive films is multiple, and the multiple anisotropic conductive films are broken at interval positions.

[0013] In the preferred embodiment of the above-mentioned display panel, the electronic device is a driver chip;

[0014] The first bonding section includes two groups, namely a first input bonding section and a first output bonding section. The first bonding structures in the first input bonding section and the first output bonding section are arranged alternately along the long side direction and the short side direction perpendicular to the long side direction.

[0015] Correspondingly, the second bonding section also includes two groups, namely a second input bonding section corresponding to the first input bonding section and a second output bonding section corresponding to the first output bonding section.

[0016] In the preferred embodiment of the above-described display panel, the display panel further includes a peripheral area surrounding the display area, and the bonding area is located in the peripheral area;

[0017] The peripheral area also includes signal traces extending from the bonding area, wherein the signal traces include a first signal trace and a second signal trace respectively disposed in different layers of the display panel, the first signal trace being electrically connected to a second bonding structure in the second input bonding section, and the second signal trace being electrically connected to a second bonding structure in the second output bonding section.

[0018] In the preferred embodiment of the above-mentioned display panel, both the first bonding structure and the second bonding structure are bonding bumps.

[0019] In the preferred embodiment of the above-mentioned display panel, the electronic device is a flexible printed circuit board;

[0020] Both the first bonding structure and the second bonding structure are gold finger structures, and the body at the interval position of the at least two sets of first bonding portions is provided with a notch that is recessed away from the display area.

[0021] In the preferred embodiment of the above-mentioned display panel, the plurality of gold finger structures in each group of the first bonding portion are arranged in a single row along the long side direction.

[0022] In the preferred embodiment of the above-mentioned display panel, the gold finger structures in each group of first bonding portions are arranged in multiple rows along the long side direction.

[0023] In the preferred embodiment of the above-mentioned display panel, the gold finger structures that are not on the same row are respectively disposed on different layers of the body.

[0024] In the preferred embodiment of the above-mentioned display panel, the electronic device includes a driver chip and a flexible printed circuit board, wherein the driver chip is closer to the display area than the flexible printed circuit board;

[0025] The first bonding section of the driver chip includes two groups: a first input bonding section and a first output bonding section. The first bonding structures in both the first input bonding section and the first output bonding section are arranged alternately along the long side direction and the short side direction perpendicular to the long side direction. Correspondingly, the second bonding section bonded to the driver chip also includes two groups: a second input bonding section corresponding to the first input bonding section and a second output bonding section corresponding to the first output bonding section.

[0026] Both the first bonding structure and the second bonding structure of the flexible printed circuit board are gold finger structures, and a notch is provided on the body at the interval position of the at least two sets of first bonding portions, which is recessed away from the display area.

[0027] In the preferred embodiment of the above-described display panel, the display panel further includes a peripheral area surrounding the display area, and the bonding area is located in the peripheral area;

[0028] The peripheral area also includes signal traces extending from the bonding area, wherein the signal traces include a first signal trace and a second signal trace respectively disposed in different layers of the display panel, the first signal trace being electrically connected to a second bonding structure in the second input bonding section, and the second signal trace being electrically connected to a second bonding structure in the second output bonding section.

[0029] In the preferred embodiment of the above-mentioned display panel, both the first bonding structure and the second bonding structure are bonding bumps.

[0030] In the preferred embodiment of the above-mentioned display panel, the multiple gold finger structures in the first bonding portion of each group of flexible printed circuit boards are arranged in a single row along the long side direction.

[0031] In the preferred embodiment of the above-mentioned display panel, multiple gold finger structures in the first bonding portion of each group of flexible printed circuit boards are arranged in multiple rows along the long side direction.

[0032] In the preferred embodiment of the above-mentioned display panel, the gold finger structures that are not on the same row are respectively disposed on different layers of the body.

[0033] This application also provides a display device, which includes the display panel described in any of the above embodiments.

[0034] Those skilled in the art will understand that the display panel of this application, by providing at least two sets of first bonding portions spaced along the long side of the body, overcomes the limitation of the first bonding portion being restricted by the short side dimension of the body in the prior art, thus increasing the spacing between adjacent first bonding portions. Simultaneously, setting the spacing between adjacent first bonding portions to be greater than 50 times the thickness of the anisotropic conductive adhesive film helps bubbles formed on the anisotropic conductive adhesive film to dissipate spontaneously when the anisotropic conductive adhesive film bonds the first bonding structure in the first bonding portion to the second bonding structure in the second bonding portion on the bonding area. This effectively avoids bonding defects in the bonding area of ​​electronic devices, improves the connection reliability between electronic devices and the bonding area, and ensures the stability of the electrical performance of the display device.

[0035] Furthermore, by setting the dimensions of the first bonding structure and / or the second bonding structure in the film thickness direction to less than 5 times the thickness of the anisotropic conductive adhesive film, not only is the flatness of the body and the bonding area ensured, but the gas trapped between adjacent bonding structures can also be reduced, thereby reducing the generation of bubbles on the anisotropic conductive adhesive film.

[0036] Furthermore, by bonding at least two sets of first bonding portions to the bonding area using a single anisotropic conductive adhesive film, the bonding efficiency of the electronic device can be improved. In addition, by employing a split bonding scheme, multiple independently arranged anisotropic conductive adhesive films are used to bond the corresponding first and second bonding portions respectively, thereby effectively avoiding the generation of air bubbles and improving the bonding effect between the driver chip and the bonding area.

[0037] Furthermore, by arranging the first input bonding portion and the first output bonding portion in the driver chip at intervals along the long side, and bonding them with the second input bonding portion and the second output bonding portion in the bonding area through anisotropic conductive adhesive film, the bonding effect between the driver chip and the bonding area can be improved.

[0038] Furthermore, by placing the signal traces electrically connected to the bonding structure in the second input bonding section and the signal traces electrically connected to the bonding structure in the second output bonding section in different layers of the display panel, it is beneficial to connect the driver chip with other functional devices in the display panel, and it can also reduce signal interference.

[0039] Furthermore, by providing notches on the body of the flexible printed circuit board at the interval position of the adjacent first bonding portion, the adjacent first bonding portions are arranged at intervals in the long side direction, thereby improving the bonding effect between the flexible printed circuit board and the bonding area.

[0040] Furthermore, the gold finger structures, which are not on the same plane, are set on different layers of the main body, which can overcome the limitations of planar wiring and improve the space utilization of flexible printed circuit boards.

[0041] Furthermore, by arranging the first input and output bonding portions in the driver chip and at least two sets of first bonding portions in the flexible printed circuit board at intervals along the long side of their respective bodies, the bonding effect between the driver chip, the flexible printed circuit board and the bonding area can be improved when the driver chip and the flexible printed circuit board are bonded to different positions in the bonding area by the anisotropic conductive adhesive film. Attached Figure Description

[0042] The preferred embodiments of this utility model are described below with reference to the accompanying drawings, in which:

[0043] Figure 1 This is a schematic diagram of a driver chip in the prior art;

[0044] Figure 2 This is a schematic diagram of the display panel of this application;

[0045] Figure 3 This is a schematic diagram of the display substrate of this application;

[0046] Figure 4 yes Figure 3 Enlarged view of point A in the middle;

[0047] Figure 5 This is a schematic diagram of the driver chip in this application;

[0048] Figure 6 This is a schematic diagram of the driver chip being bonded in the first bonding area of ​​this application;

[0049] Figure 7 yes Figure 6 Enlarged view of point B in the middle;

[0050] Figure 8 yes Figure 6 Enlarged view of point C in the middle;

[0051] Figure 9This is a schematic diagram of the driver chip in this application before the first bonding area;

[0052] Figure 10 This is a schematic diagram of another embodiment of the driver chip being bonded in the first bonding region;

[0053] Figure 11 This is a schematic diagram of another embodiment of the driver chip in this application;

[0054] Figure 12 This is a schematic diagram of the flexible printed circuit board of this application;

[0055] Figure 13 This is a schematic diagram of the flexible printed circuit board bonded in the second bonding area of ​​this application;

[0056] Figure 14 yes Figure 13 Enlarged view of point D in the middle;

[0057] Figure 15 This is a schematic diagram of the flexible printed circuit board bonded before the second bonding area in this application;

[0058] Figure 16 This is a schematic diagram of another embodiment of the flexible printed circuit board bonded in the second bonding area of ​​this application;

[0059] Figure 17 yes Figure 12 Schematic diagram of the middle section;

[0060] Figure 18 This is a schematic diagram of another embodiment of the flexible printed circuit board of this application;

[0061] Figure 19 yes Figure 18 Schematic diagram of the middle section.

[0062] The attached figures are labeled as follows:

[0063] 1. Display panel; 11. Driver chip; 111. Body a; 112. First input bonding portion; 1121. First input bonding bump; 113. First output bonding portion; 1131. First output bonding bump; 12. Flexible printed circuit board; 121. Body b; 1211. Notch; 122. First bonding portion b; 1221. First gold finger structure; 13. First anisotropic conductive film; 14. Second anisotropic conductive film; 15. Bonding area; 151. First bonding area; 1511. Second input bonding portion; 15111. Second input bonding bump; 1512. Second output bonding portion; 15121. Second output bonding bump; 152. Second bonding area; 1521. Second bonding portion b; 15211. Second gold finger structure; 16. Peripheral area; 17. Display area. Detailed Implementation

[0064] Preferred embodiments of this application will now be described with reference to the accompanying drawings. Those skilled in the art should understand that these embodiments are merely illustrative of the technical principles of this application and are not intended to limit the scope of protection of this application.

[0065] It should be noted that in the description of this application, the terms "upper", "lower", "inner", "top", "bottom", etc., indicating the direction or positional relationship are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and is not intended to indicate or imply that the device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

[0066] Furthermore, it should be noted that, in the description of this application, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0067] Example 1

[0068] The display panel 1 of this application is described using an electronic device as the driving chip 11.

[0069] like Figure 2-4 As shown, the display panel 1 of this application includes a display substrate, a driver chip 11, and a first anisotropic conductive film 13. The display substrate includes a display area 17, a peripheral area 16, and a bonding area 15. The peripheral area 16 is disposed around the display area 17, and the bonding area 15 is disposed in the peripheral area 16. The bonding area 15 includes a first bonding area 151 and a second bonding area 152, with the first bonding area 151 being closer to the display area 17 than the second bonding area 152. The driver chip 11 is bonded to the first bonding area 151 via the first anisotropic conductive film 13.

[0070] It should be noted that the specific type of chip is not fixed in this application, and those skilled in the art can make adjustments as needed. For example, the chip can also be a Ram driver chip or a Ramless driver chip.

[0071] See next Figure 5The driver chip 11 includes a body a111 and two sets of first bonding portions a disposed on the body a111. These two sets of first bonding portions a are a first input bonding portion 112 and a first output bonding portion 113, respectively. The first input bonding portion 112 and the first output bonding portion 113 are spaced apart along the long side of the body a111. Correspondingly, the first bonding area 151 of the display panel 1 is provided with two sets of second bonding portions a. These two sets of second bonding portions a are a second input bonding portion 1511 and a second output bonding portion 1512, respectively. The second input bonding portion 1511 corresponds to the first input bonding portion 112 in the film thickness direction of the first anisotropic conductive adhesive film 13, and the second output bonding portion 1512 corresponds to the first output bonding portion 113 in the film thickness direction of the first anisotropic conductive adhesive film 13. The side of the first bonding area 151 adjacent to the display area 17 is parallel to the long side direction of the body a111. That is, the long side direction of the first bonding area is the long side direction of the body a111. Therefore, the second input bonding portion 1511 and the second output bonding portion 1512 are spaced apart along the long side direction. Compared with the prior art where the first input bonding portion 112 and the first output bonding portion 113 are spaced apart along the short side direction of the chip body, and the second input bonding portion 1511 and the second output bonding portion 1512 are spaced apart along the short side direction of the first bonding area 151, the spacing between the input bonding portion and the output bonding portion is no longer limited by the short side dimension, which helps to increase the spacing between the input bonding portion and the output bonding portion.

[0072] In this application, the film thickness direction refers to Figure 6 , 9 The Z-direction is shown in -11, 13, 15-16. The Z-direction includes both the positive and negative directions indicated by the arrows. The longer side direction refers to... Figure 1-3 The X direction is shown in 5-6, 9-13, 15-16 and 18. The X direction includes the positive and negative directions indicated by the arrow.

[0073] Of course, the number of groups for the first bonding section a in this application is not fixed, and those skilled in the art can adjust it as needed. For example, the number of groups for the first bonding section a can also be three, four, or other numbers. Here, we will describe the first bonding section a with three groups. In this case, the first bonding section a can include two groups of first input bonding sections 112 and one group of first output bonding sections 113.

[0074] See next Figure 6-9The first anisotropic conductive adhesive film 13 is of one size and extends along its long side. This film bonds the first input bonding bump 1121, the first output bonding bump 1131 on the driver chip 11, and the second input bonding bump 15111 and the second output bonding bump 15121 on the first bonding area 151. The first anisotropic conductive adhesive film 13 has a thickness dimension of D1. The distance between the first input bonding portion 112 and the first output bonding portion 113 along its long side is L. Since the first input bonding portion 112 corresponds to the second input bonding portion 1511 and the first output bonding portion 113 corresponds to the second output bonding portion 1512, the distance between the second input bonding portion 1511 and the second output bonding portion 1512 along its long side is also L. Where L > 50D1. By setting the spacing distance to be greater than 50 times the thickness of the first anisotropic conductive adhesive film 13, the bubbles formed on the first anisotropic conductive adhesive film 13 can dissipate on their own when the driver chip 11 is bonded to the first bonding area 151, thereby effectively avoiding the bonding failure problem when the driver chip 11 is bonded to the first bonding area 151, and thus improving the bonding effect between the driver chip 11 and the first bonding area 151.

[0075] It should be noted that the dimensions of the anisotropic conductive film in the thickness direction in this application refer to the original dimensions of the anisotropic conductive film before bonding with the bonding area. Furthermore, poor bonding refers to a small gap between the first bonding portions. When using anisotropic conductive film for bonding, the anisotropic conductive film easily forms air bubbles that are difficult to eliminate on their own between the two sets of first bonding portions. These trapped air bubbles hinder the formation of a complete and reliable electrical connection and mechanical bond between the bonding portions and the bonding area.

[0076] Of course, the number of the first anisotropic conductive adhesive film 13 is not fixed in this application, and those skilled in the art can adjust it as needed. Figure 10 As shown, the first anisotropic conductive adhesive film 13 may further include two first anisotropic conductive adhesive films 13. The two first anisotropic conductive adhesive films 13 are disconnected at the interval between the first input bonding portion 112 and the output bonding portion, so that one of the first anisotropic conductive adhesive films 13 can bond the first input bonding portion to the second input bonding portion, and the other first anisotropic conductive adhesive film 13 can bond the first output bonding portion to the second output bonding portion. This effectively avoids the generation of bubbles and improves the bonding effect between the driver chip 11 and the first bonding area 151. The number of first anisotropic conductive adhesive films 13 corresponds to the number of groups of first bonding portions a, so that the corresponding first bonding portion a and second bonding portion a can be bonded by one first anisotropic conductive adhesive film 13 respectively.

[0077] See next Figure 5-10The first input bonding portion 112 includes multiple first bonding structures a, each a being a first input bonding bump 1121. The first output bonding portion 113 includes multiple second bonding structures a, each a being a first output bonding bump 1131. The multiple first input bonding bumps 1121 are arranged at intervals along the long side direction and the short side direction perpendicular to the long side direction, forming an array. The number of arrays in the short side direction is four. By adopting the above-described arrangement strategy for the first input bonding portion 112, the size of the first input bonding portion 112 in the long side direction in the prior art is shortened, while ensuring that the number of first input bonding bumps 1121 remains unchanged. Multiple first output bonding bumps 1131 are arranged at intervals along the long and short sides to form an array. The array has two elements along the short side. By adopting this arrangement strategy, the size of the first output bonding portion 113 in the long side direction is shortened compared to the prior art, while ensuring that the number of first output bonding bumps 1131 remains constant. Correspondingly, the second input bonding portion 1511 includes multiple second input bonding bumps 15111 corresponding one-to-one with the first input bonding bumps 1121, and the second output bonding portion 1512 includes multiple second output bonding bumps 15121 corresponding one-to-one with the first output bonding bumps 1131. By adopting this arrangement, the spacing between the input and output bonding portions can be increased while ensuring that the number of input and output bonding bumps remains constant. This facilitates the self-dissipation of bubbles formed on the ACF, thereby improving the bonding effect between the driver chip 11 and the first bonding area 151.

[0078] It should be noted that in this application, the direction of the shorter side is perpendicular to the direction of the longer side, and the direction of the shorter side refers to... Figure 1-3 The Y-direction is shown in Figures 5-6, 9-13, 15-16, and 18. The Y-direction includes the positive and negative directions indicated by the arrows. It should also be noted that since the first input bonding bump 1121 corresponds to the second input bonding bump 15111, and the first output bonding bump 1131 corresponds to the second output bonding bump 15121, any change in the arrangement of the first input bonding bump 1121 and the first output bonding bump 1131 will result in a corresponding change in the arrangement of the second input bonding bump 15111 and the second output bonding bump 15121. This will not be elaborated further here.

[0079] Of course, the number of arrays of multiple input bonding bumps and multiple output bonding bumps formed in the short side direction is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the number of arrays of multiple input bonding bumps in the short side direction can be two, three, or other numbers, and / or the number of arrays of multiple output bonding bumps in the short side direction can be three or other numbers, as long as the distance L between the output bonding portion and the input bonding portion is greater than 50D1. Here, the input bonding bumps refer to the first input bonding bump 1121 and the second input bonding bump 15111, and the output bonding bumps refer to the first output bonding bump 1131 and the second output bonding bump 15121.

[0080] Furthermore, the arrangement of the plurality of first input bonding bumps 1121 in the first input bonding section 112 is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the plurality of first input bonding bumps 1121 can also be arranged in a non-matrix manner, that is, in an arbitrary random manner, such as... Figure 11 As shown. Furthermore, the arrangement of the plurality of first output bonding bumps 1131 in the first output bonding section 113 is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the plurality of first output bonding bumps 1131 can also be arranged in a non-matrix manner, that is, in an arbitrary random manner, such as... Figure 11 As shown.

[0081] See next Figure 5 Multiple first input bonding bumps 1121 are all parallelograms in shape and of the same size, and multiple first output bonding bumps 1131 are also parallelograms in shape and of the same size. The shapes of the first input bonding bumps 1121 and the first output bonding bumps 1131 are symmetrically arranged with respect to their shorter sides. Correspondingly, the shape and size of the second input bonding bump 15111 are the same as those of the first input bonding bump 1121, and the shape and size of the second output bonding bump 15121 are the same as those of the first output bonding bump 1131. This arrangement improves the foolproof performance of the driver chip 11.

[0082] Of course, the shape and size of the first input bonding bump 1121 and the first output bonding bump 1131 are not fixed in this application, and those skilled in the art can adjust them as needed. For example, the shape of at least one of the first input bonding bump 1121 and the first output bonding bump 1131 can also be a regular shape such as a rectangle or a circle, or an irregular shape. And / or, the size of at least one of the multiple first input bonding bumps 1121 and the multiple first output bonding bumps 1131 can also be different. For example... Figure 11The first input bonding bump and the first output bonding bump shown are both circular in shape, and the sizes of the first output bonding bumps in the first output bonding section are not equal. It should be noted that since the first input bonding bump 1121 corresponds to the second input bonding bump 15111, and the first output bonding bump 1131 corresponds to the second output bonding bump 15121, when the shape and size of the first input bonding bump 1121 and the first output bonding bump 1131 change, the shape and size of the second input bonding bump 15111 and the second output bonding bump 15121 also change accordingly, which will not be elaborated here.

[0083] See next Figure 7-8 The dimension of the first input bonding bump 1121 in the film thickness direction is T. 11 The dimension of the first output bonding bump 1131 in the film thickness direction is T. 12 T 11 <5D1,T 12 <5D1. Correspondingly, the dimension of the second input bonding bump 15111 in the film thickness direction is T. 21 The dimension of the second output bonding bump 15121 in the film thickness direction is T. 22 T 21 <5D1,T 22 <5D1. By using the above settings, not only can the flatness of the body a111 be ensured, but the gas trapped between adjacent bumps can also be effectively reduced, thereby reducing the generation of bubbles.

[0084] In addition, the peripheral area 16 also includes signal traces extending from the bonding area 15. These signal traces include a first signal trace and a second signal trace, which are respectively disposed on different layers of the display panel 1. The first signal trace is used for electrical connection to the second bonding structure in the second input bonding section 1511, and the second signal trace is used for electrical connection to the second bonding structure in the second output bonding section 1512. This arrangement reduces signal crosstalk and improves the data transmission rate and stability between the driver chip 11 and the functional devices in the display panel 1.

[0085] Specifically, a first signal trace is disposed on the second layer of the display panel 1, a second signal trace is disposed on the fourth layer of the display panel 1, and the first port of the functional device on the display panel 1 is disposed on the fifth layer of the display panel 1, while the second port is disposed on the fourth layer. One end of the first signal trace is connected to the second input bonding section 1511, and the other end can pass through the holes on the third and fourth layers of the display panel 1 and connect to the first port; one end of the second signal trace is connected to the second output bonding section 1512, and the other end is connected to the second port. The second input bonding section 1511 and the second output bonding section 1512 are interconnected through traces disposed within the holes on the third layer. This wiring method enables the driver chip 11 to transmit signals with the functional device when it is bonded to the first bonding area.

[0086] Example 2

[0087] The display panel 1 of this application is described using an electronic device as a flexible printed circuit board 12.

[0088] like Figure 2 , 12 As shown in Figure -16, the flexible printed circuit board 12 is bonded to the second bonding area 152 by the second anisotropic conductive adhesive film 14. The flexible printed circuit board 12 includes a body b121 and two sets of first bonding portions b122 disposed on the body b121. These two sets of first bonding portions b122 are spaced apart along the long side direction, and a notch 1211 is provided on the body b121 at the spaced position between the two sets of first bonding portions b122. The notch 1211 is recessed in the direction away from the display area 17. That is, the two sets of first bonding portions b122 are arranged at intervals through the notch 1211. Correspondingly, the second bonding area 152 of the display panel 1 is provided with two sets of second bonding portions b1521, which are also spaced apart along the long side direction. The two sets of first bonding portions b122 are spaced apart by a distance L' along their long side. Since the two sets of first bonding portions b122 in the flexible printed circuit board 12 correspond one-to-one with the two sets of second bonding portions b1521 in the second bonding area, the distance between the two sets of second bonding portions b1521 is also L'. The second anisotropic conductive adhesive film 14 has a thickness dimension D2, where L' > D2. By setting the spacing distance to be greater than 50 times the thickness of the second anisotropic conductive adhesive film 14, bubbles formed on the second anisotropic conductive adhesive film 14 are allowed to dissipate naturally when the flexible printed circuit board 12 is bonded to the second bonding area 152. This effectively avoids bonding defects when the flexible printed circuit board 12 is bonded to the second bonding area 152, thereby improving the bonding effect between the flexible printed circuit board 12 and the second bonding area 152.

[0089] Of course, the number of first bonding portions b in this application is not fixed, and those skilled in the art can adjust it as needed. For example, the first bonding portions b122 can also be provided in three groups or other numbers, as long as the spacing between two adjacent groups of first bonding portions b122 is greater than 50D2. Since the first bonding portions b correspond to the second bonding portions b, the second bonding portions b also need to be adjusted accordingly after the number of the first bonding portions b is adjusted; therefore, the second bonding portions b will not be described in detail here. When the first bonding portions b include three groups or other numbers, a notch 1211 is provided on the body b121 at the interval between two adjacent groups of first bonding portions b122, meaning the number of notches 1211 is one less than the number of first bonding portions b.

[0090] See next Figure 13-15 The number of second anisotropic conductive adhesive films 14 is one. This anisotropic conductive adhesive film extends along its long side and bonds the two sets of first bonding portions b on the flexible printed circuit board 12 and the two sets of second bonding portions b on the second bonding area. Each set of first bonding portions b122 includes multiple first bonding structures b, each of which is a first gold finger structure 1221. The multiple first gold finger structures 1221 in each set of first bonding portions b122 are arranged in a single row along the long side of the body b121. That is, the array number of the multiple first gold finger structures 1221 in the short side direction is one. Correspondingly, each set of second bonding portions b1521 includes multiple second bonding structures b, each of which is a second gold finger structure 15211. The multiple second gold finger structures 15211 correspond one-to-one with the first gold finger structures 1221. The above configuration enables the first gold finger structure 1221 and the second gold finger structure 15211 to achieve bonding under the action of ACF when the flexible printed circuit board 12 is bonded to the second bonding area.

[0091] Of course, the number of second anisotropic conductive films 14 provided in this application is not fixed, and those skilled in the art can adjust it as needed. Figure 16 As shown, there are two second anisotropic conductive films 14. The two second anisotropic conductive films 14 are separated at the interval between the two sets of first bonding portions b, such that the two second anisotropic conductive films 14 correspond to the two sets of first bonding portions b respectively, thereby bonding the corresponding first bonding portions b and second bonding portions b respectively. When the number of first bonding portions b is three or other groups, the number of second anisotropic conductive films 14 corresponds to the number of groups of first bonding portions b, so that the corresponding first bonding portions b and second bonding portions b can be bonded by one second anisotropic conductive film 14 respectively.

[0092] Furthermore, the arrangement of the multiple gold finger structures in each group of first bonding portions b122 is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the multiple gold finger structures in each group of first bonding portions b122 can also be arranged in multiple rows along the long side, that is, the number of arrays of the multiple first gold finger structures 1221 in each group of first bonding portions b in the short side direction can be two, three, or other numbers. When the number of arrays of the multiple gold finger structures in each group of first bonding portions b122 in the short side direction is two, please refer to the appendix. Figure 18 .

[0093] See next Figure 13-17 The body b121 has a multi-layer structure, with the third layer of the body b121 protruding towards the display area 17. The projection of the protruding portion of the third layer in the film thickness direction does not coincide with the projections of other layers in the film thickness direction. Multiple first gold finger structures 1221 are formed on the protruding portion. The dimension of the first gold finger structure 1221 in the film thickness direction is T`1, where T`1 < 5D2, and the dimension of the first gold finger structure 1221 in the film thickness direction is greater than the sum of the dimensions of the second layer and the first layer in the film thickness direction. Correspondingly, the dimension of the second gold finger in the film thickness direction is T`2, where T`2 < 5D2. Through the above arrangement, not only is the flatness of the body b121 and the second bonding area 152 ensured, but the gas trapped between adjacent gold finger structures can also be effectively reduced, thereby reducing the generation of bubbles.

[0094] It should be noted that the dimension of the first gold finger structure 1221 in the film thickness direction refers to the dimension between its surface away from the forming layer and the forming layer, where the forming layer is... Figure 17 The third layer is shown. When the multiple gold finger structures in each group of first bonding parts b122 can also be arranged in multiple rows along the long side direction, the gold finger structures that are not in the same row are respectively set on different layers of the body b121. The explanation is based on the assumption that the number of arrays of multiple first gold finger structures 1221 in each group of first bonding parts b122 along the short side direction is two, as follows... Figure 19As shown, the second layer of the body b121 extends protruding towards the display area 17 to form a first protruding extension portion, and the third layer extends protruding towards the display area 17 to form a second protruding extension portion. The size of the first protruding extension portion in the short side direction is smaller than that of the second protruding extension portion in the short side direction. Multiple first gold finger structures 1221 located in the second row are provided with the first protruding extension portions, and multiple first gold finger structures 1221 located in the first row are provided with the second protruding extension portions. The sides of the first gold finger structures 1221 located in the first and second rows that are opposite to the third layer are flush. At this time, the size of the first gold finger structure 1221 in the film thickness direction is less than 5 times the ACF thickness, and all the first gold finger structures 1221 protrude from the surface of the first layer opposite to the second layer. Correspondingly, the second gold finger structures of the second bonding area can all be formed in the same layer of the second bonding area. Furthermore, not all of the flexible printed circuit board 12 is bonded to the second bonding area; rather, only the protruding extension portions of the flexible printed circuit board 12 having the first bonding portion b are bonded to the second bonding area, while the other portions of the flexible printed circuit board 12 extend beyond the display substrate.

[0095] It should also be noted that the routing design of the second bonding area and the second gold finger structure 15211 in this application is consistent with the prior art in principle; only the physical position of each trace has been optimized and adjusted to ensure its connection with the second gold finger structure 15211. Given that this routing scheme adopts a conventional design, the specific routing layout of the flexible printed circuit board 12 will not be described in detail here.

[0096] Example 3

[0097] The display panel 1 of this application is described using electronic devices as the driving chip 11 and the flexible printed circuit board 12.

[0098] like Figure 2-4 As shown in Figures 6, 9, and 12-15, the driver chip 11 is bonded to the first bonding region 151 via a first anisotropic conductive adhesive film 13, and the flexible printed circuit board 12 is bonded to the second bonding region 152 via a second anisotropic conductive adhesive film 14. The first bonding portion a of the driver chip 11 includes two groups: a first input bonding portion 112 and a first output bonding portion 113. The first input bonding portion 112 and the first output bonding portion 113 are arranged at intervals along their long sides. Correspondingly, the second bonding portion a bonded to the driver chip 11 also includes two groups: a second input bonding portion 1511 corresponding to the first input bonding portion 112 and a second output bonding portion 1512 corresponding to the first output bonding portion 113. The first bonding portion b122 of the flexible printed circuit board 12 also includes two sets, and the two sets of first bonding portions b122 are arranged at intervals along the long side direction; correspondingly, the second bonding portion b1521 bonded to the flexible printed circuit board 12 also includes two sets, and each corresponds to the first bonding portion b122.

[0099] Of course, the number of groups of the first bonding part a and the first bonding part b in this application is not fixed, and those skilled in the art can adjust them as needed. For example, the number of groups of the first bonding part a can also be three, four, or other groups. And / or, the number of groups of the first bonding part b can also be three, four, or other groups.

[0100] See next Figure 4-6 9, 13, and 15, wherein the distance between the first input bonding portion 112 and the first output bonding portion 113 in the long side direction is L. Since the first input bonding portion 112 corresponds to the second input bonding portion 1511 and the first output bonding portion 113 corresponds to the second output bonding portion 1512, the distance between the second input bonding portion 1511 and the second output bonding portion 1512 in the long side direction is also L. The distance between the two sets of first bonding portions b122 in the long side direction is L', and correspondingly, the distance between the two sets of second bonding portions b1521 in the long side direction is also L'. The dimension of the first anisotropic conductive film 13 in the film thickness direction is D1, and the dimension of the second anisotropic conductive film 14 in its thickness direction is D2, where L>50D1 and L'>50D2. By setting the spacing distance to be greater than 50 times the thickness of the anisotropic conductive adhesive film, the air bubbles formed on the anisotropic conductive adhesive film can dissipate on their own when the driver chip 11 is bonded to the first bonding area 151 and the flexible printed circuit board 12 is bonded to the second bonding area 152. This effectively avoids bonding defects when the driver chip 11 and the flexible printed circuit board 12 are bonded to the bonding area 15, thereby improving the bonding effect between the driver chip 11, the flexible printed circuit board 12 and the bonding area 15.

[0101] It should be noted that when the number of groups of the first bonding part a is three, four or other, and the number of groups of the first bonding part b is three, four or other, the distance between adjacent first bonding parts a and adjacent first bonding parts b in the long side direction is only required to be greater than 50 times the thickness of the anisotropic conductive adhesive film.

[0102] See next Figure 6 , 9 13 and 15, the number of first anisotropic conductive adhesive films 13 is one, the anisotropic conductive adhesive film extends along the long side, and the first input and output bonding portion of the driver chip 11 and the second input and output bonding portion of the first bonding area are bonded through the anisotropic conductive adhesive film. The number of second anisotropic conductive adhesive films 14 is one, the anisotropic conductive adhesive film extends along the long side, and the two sets of first bonding portions b on the flexible printed circuit board 12 and the two sets of second bonding portions b on the second bonding area are bonded through the anisotropic conductive adhesive film.

[0103] It should be noted that the number of the first anisotropic conductive adhesive film 13 and the second anisotropic conductive adhesive film 14 is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the number of the first anisotropic conductive adhesive film 13 is two, so that the first input bonding part and the second input bonding part can be bonded through one first anisotropic conductive adhesive film 13, and the first output bonding part and the second output bonding part are bonded through another first anisotropic conductive adhesive film 13. And / or, the number of the second anisotropic conductive adhesive film 14 is two, and the two second anisotropic conductive adhesive films 14 are disconnected at the interval position of the two sets of first bonding parts b, so that the two second anisotropic conductive adhesive films 14 correspond to the two sets of first bonding parts b respectively, thereby making the corresponding first bonding parts b and second bonding parts b bonded respectively. Wherein, when the number of first bonding parts a is three or other groups, the same number of first anisotropic conductive adhesive films 13 as the number of first bonding parts a can also be provided, so that the corresponding first bonding parts a and second bonding parts a can be bonded through one first anisotropic conductive adhesive film 13 respectively. When the number of first bonding parts b is three or other groups, a second anisotropic conductive film 14 with the same number of first bonding parts b can be provided so that the corresponding first bonding parts b and second bonding parts b can be bonded by a second anisotropic conductive film 14 respectively.

[0104] See next Figure 4-9 In sections 12-15, the first input bonding section 112 includes a plurality of first input bonding bumps 1121, and the first output bonding section 113 includes a plurality of first output bonding bumps 1131. The plurality of first input bonding bumps 1121 are arranged at intervals along the long side and the short side, forming an array, with four arrays in the short side direction. The plurality of first output bonding bumps are arranged at intervals along the long side and the short side, forming an array, with two arrays in the short side direction. Correspondingly, the second input bonding section 1511 includes a plurality of second input bonding bumps 15111 corresponding one-to-one with the first input bonding bumps 1121, and the second output bonding section 1512 includes a plurality of second output bonding bumps 15121 corresponding one-to-one with the first output bonding bumps 1131. Each group of first bonding portions b122 includes multiple first bonding structures b, each of which is a first gold finger structure 1221. The multiple first gold finger structures 1221 in each group of first bonding portions b122 are arranged in a single row along the long side of the body b121. Correspondingly, each group of second bonding portions b1521 includes multiple second bonding structures b, each of which is a second gold finger structure 15211. The multiple second gold finger structures 15211 correspond one-to-one with the first gold finger structures 1221. By adopting the above arrangement, the spacing between bonding portions can be increased while maintaining the same number of bonding structures, thereby facilitating the self-dissipation of bubbles formed on the ACF and improving the bonding effect between the driver chip 11, the flexible printed circuit board 12, and the bonding area 15.

[0105] Of course, the number of arrays of multiple first input bonding bumps 1121 and multiple first output bonding bumps 1131 formed in the short side direction is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the number of arrays of multiple first input bonding bumps 1121 in the short side direction can also be two, three, or other numbers, and / or, the number of arrays of multiple first output bonding bumps 1131 in the short side direction can also be three or other numbers. In addition, the arrangement of multiple gold finger structures in each group of first bonding portions b122 is not fixed in this application, and those skilled in the art can adjust it as needed. For example, the multiple gold finger structures in each group of first bonding portions b122 can also be arranged in multiple rows along the long side direction, that is, the number of arrays of multiple first gold finger structures 1221 in the short side direction in each group of first bonding portions b can be two, three, or other numbers.

[0106] See next Figure 7-9 And 14-15, the dimensions of the first input bonding bump 1121, the first output bonding bump 1131, the second input bonding bump, and the second output bonding bump in the film thickness direction are T respectively. 11 T 12 T 21 and T 22 The dimensions of the first gold finger structure 1221 and the second gold finger structure 15211 in the film thickness direction are T`1 and T`2, respectively, and the dimensions of the first anisotropic conductive adhesive film 13 and the second anisotropic conductive adhesive film 14 in the film thickness direction are D1 and D2, respectively. Wherein, T... 11 <5D1,T 12 <5D1,T 21 <5D1,T 22 <5D1, T`1<5D2, T`2<5D2. This configuration not only improves the flatness of the body and bonding area but also effectively reduces the amount of gas trapped between adjacent bonding structures, thereby reducing bubble formation.

[0107] It should be noted that not all of the flexible printed circuit board 12 is bonded to the second bonding area, but only the portion of the flexible printed circuit board 12 having the first bonding portion b is bonded to the second bonding area, while the other portions of the flexible printed circuit board 12 extend beyond the display substrate.

[0108] In addition, other details regarding the bonding of the driver chip and flexible printed circuit board 12 with the bonding area 15 are the same as in Embodiments 1 and 2, and will not be repeated here.

[0109] In addition, this application also provides a display device, wherein the display device includes the electronic devices described in the above embodiments.

[0110] The display device can be a mobile phone, tablet, etc.

[0111] Those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, any of the claimed embodiments in the claims of this application can be used in any combination.

[0112] The technical solutions of this application have been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of this application is obviously not limited to these specific embodiments. Without departing from the principles of this application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of this application.

Claims

1. A display panel, characterized by, The display panel (1) comprises: An electronic device comprising a body and at least two groups of first bonding parts arranged at intervals along a long side direction of the body, wherein the interval distance is L and each group of the first bonding parts comprises a plurality of first bonding structures; A display area (17) and a bonding area (15) adjacent to the display area (17), an edge of the bonding area (15) adjacent to the display area (17) is parallel to the long side direction, and the bonding area (15) has a plurality of second bonding structures corresponding one-to-one to the plurality of first bonding structures; An anisotropic conductive adhesive film between the electronic device and the bonding area (15) for bonding the first bonding structure and the corresponding second bonding structure, wherein the size of the anisotropic conductive adhesive film in the film thickness direction is D, and L>50D.

2. The display panel of claim 1, wherein, The size of the first bonding structure in the film thickness direction is T1, T1<5D; and / or The size of the second bonding structure in the film thickness direction is T2, T2<5D.

3. The display panel of claim 1, wherein, The number of the anisotropic conductive adhesive films is one; or The number of the anisotropic conductive adhesive films is multiple, and multiple anisotropic conductive adhesive films are disconnected at interval positions.

4. The display panel of any of claims 1-3, wherein, The electronic device is a driving chip (11); Wherein, the first bonding part comprises two groups, which are the first input bonding part (112) and the first output bonding part (113), respectively, and the first bonding structures in the first input bonding part (112) and the first output bonding part (113) are arranged at intervals along the long side direction and the short side direction perpendicular to the long side direction; Correspondingly, the second bonding part also comprises two groups, which are the second input bonding part (1511) corresponding to the first input bonding part (112) and the second output bonding part (1512) corresponding to the first output bonding part (113).

5. The display panel of claim 4, wherein, The display panel (1) further comprises a peripheral area (16) surrounding the display area (17), and the bonding area (15) is located in the peripheral area (16); The peripheral area (16) further comprises a signal trace extending from the bonding area (15), wherein the signal trace comprises a first signal trace and a second signal trace arranged in different layers of the display panel (1) respectively, the first signal trace is electrically connected with the second bonding structure in the second input bonding part (1511), and the second signal trace is electrically connected with the second bonding structure in the second output bonding part (1512).

6. The display panel of claim 4, wherein, The first bonding structure and the second bonding structure are both bonding bumps.

7. The display panel of any of claims 1-3, wherein, The electronic device is a flexible printed circuit board (12); Wherein, the first bonding structure and the second bonding structure are both gold finger structures, and a notch (1211) recessed away from the display area (17) is arranged on the body at the interval position of the at least two groups of first bonding parts.

8. The display panel of claim 7, wherein, The plurality of gold finger structures in each group of the first bonding parts are arranged in a single row along the long side direction.

9. The display panel of claim 7, wherein, The gold finger structures in each group of first bonding parts are arranged in multiple rows along the long side direction.

10. The display panel of claim 9, wherein, The gold finger structures not on the same row are respectively arranged on different layers of the body.

11. The display panel of any of claims 1-3, wherein, The electronic device comprises a driving chip (11) and a flexible printed circuit board (12), the driving chip (11) is closer to the display area (17) than the flexible printed circuit board (12); The first bonding part of the driving chip (11) comprises two groups, which are a first input bonding part (112) and a first output bonding part (113), respectively, the first bonding structures in the first input bonding part (112) and the first output bonding part (113) are arranged in the long direction and the short direction perpendicular to the long direction; correspondingly, the second bonding part bonded with the driving chip (11) also comprises two groups, which are a second input bonding part (1511) corresponding to the first input bonding part (112) and a second output bonding part (1512) corresponding to the first output bonding part (113); and The first bonding structure and the second bonding structure of the flexible printed circuit board (12) are both gold finger structures, and the body at the interval position of the at least two groups of first bonding parts is provided with a notch (1211) recessed away from the display area (17).

12. The display panel of claim 11, wherein, The display panel (1) further comprises a peripheral area (16) surrounding the display area (17), and the bonding area (15) is located in the peripheral area (16); The peripheral area (16) further comprises a signal trace extending from the bonding area (15), wherein the signal trace comprises a first signal trace and a second signal trace arranged in different layers of the display panel (1) respectively, the first signal trace is electrically connected with the second bonding structure in the second input bonding part (1511), and the second signal trace is electrically connected with the second bonding structure in the second output bonding part (1512).

13. The display panel of claim 11, wherein, The first bonding structure and the second bonding structure are both bonding bumps.

14. The display panel of claim 11, wherein, The plurality of gold finger structures in each group of the first bonding part of the flexible printed circuit board (12) are arranged in a single row along the long direction.

15. The display panel of claim 11, wherein, The plurality of gold finger structures in each group of the first bonding part of the flexible printed circuit board (12) are arranged in multiple rows along the long direction.

16. The display panel of claim 15, wherein, The gold finger structures not on the same row are respectively arranged on different layers of the body.

17. A display device comprising: The display device comprises the display panel of claims 1-16.

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