Display module and display device

Abstract

The application provides a display module and a display device. The display module comprises a display panel and a heat dissipation structure. The heat dissipation structure comprises a first heat-conducting adhesive layer, a heat-conducting layer, a second heat-conducting adhesive layer and a heat dissipation layer which are stacked in sequence. The side of the first heat-conducting adhesive layer away from the heat-conducting layer is bonded to the back side of the display panel. The heat dissipation structure is provided with a heat-conducting block which penetrates the first heat-conducting adhesive layer, the heat-conducting layer and the second heat-conducting adhesive layer in sequence along a first direction. The first direction is perpendicular to the panel surface of the display panel, and the first direction is the direction in which the second heat-conducting adhesive layer points to the first heat-conducting adhesive layer. The heat can be rapidly diffused, the temperature rise of the display module is reduced, and the service life of the display screen is prolonged.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display module and a display device. Background Technology

[0002] With the development of electronic display products, OLED is gradually replacing LCD as the mainstream display technology, especially in the high-end display field. Along with the demand for high resolution and high refresh rates, the heat generated by the screen is also increasing. Under prolonged operation, the temperature of the display screen can reach around 55℃. Due to the inherent characteristics of OLED displays, their lifespan is shortened at high temperatures. Therefore, the heat dissipation problem of the display screen seriously affects the product's lifespan, making it an urgent issue to improve the heat dissipation performance of the display screen. Summary of the Invention

[0003] This application proposes a display module and display device to solve the problem of poor heat dissipation in display screens.

[0004] According to a first aspect of the embodiments of this application, a display module is provided, including a display panel and a heat dissipation structure. The heat dissipation structure includes a first thermally conductive adhesive layer, a thermally conductive layer, a second thermally conductive adhesive layer, and a heat dissipation layer stacked sequentially. The side of the first thermally conductive adhesive layer away from the thermally conductive layer is bonded to the back side of the display panel. The heat dissipation structure is provided with a heat-conducting block that sequentially penetrates the first thermally conductive adhesive layer, the thermally conductive layer, and the second thermally conductive adhesive layer along a first direction. The first direction is perpendicular to the surface of the display panel, and the first direction is the direction from the second thermally conductive adhesive layer to the first thermally conductive adhesive layer.

[0005] As can be seen from the above embodiments, this embodiment employs a heat-conducting block that penetrates the first thermally conductive adhesive layer, the thermally conductive layer, and the second thermally conductive adhesive layer within the heat dissipation structure. This achieves several benefits: First, the heat generated by the display panel portion directly in contact with the first thermally conductive adhesive layer is sequentially conducted from the first thermally conductive adhesive layer to the thermally conductive layer, then to the heat-conducting block, and finally to the heat dissipation layer for dissipation. Second, compared to heat conduction via the first thermally conductive adhesive layer, the heat generated by the display panel portion directly in contact with the heat-conducting block is directly conducted to the heat dissipation layer via the heat-conducting block, resulting in more direct and rapid heat transfer and quick heat dissipation. Simultaneously, a portion of the back side of the display panel is in direct contact with the first thermally conductive adhesive layer. This first thermally conductive adhesive layer not only conducts heat but also works with the second thermally conductive adhesive layer to bond and fix the thermally conductive layer and the heat dissipation layer. This ensures that the heat dissipation structure is firmly adhered to the back side of the display panel while achieving heat dissipation, preventing relative displacement between the film layers. The various film layers within the heat dissipation structure cooperate to achieve rapid heat diffusion, reducing the temperature rise of the display module and extending the lifespan of the display screen.

[0006] In one embodiment, the heat dissipation layer has a groove on the side away from the second thermally conductive adhesive layer.

[0007] In one embodiment, the dimension of the groove along the first direction is greater than or equal to half the dimension of the heat dissipation layer along the first direction;

[0008] And / or, the dimension of the groove along the first direction is less than or equal to two-thirds of the dimension of the heat dissipation layer along the first direction.

[0009] In one embodiment, a plurality of the grooves are spaced apart on the side of the heat dissipation layer away from the second thermally conductive adhesive layer, and the groove width is equal to the groove spacing between adjacent grooves.

[0010] In one embodiment, the cross-sectional shape of the groove along the first direction includes a triangle, trapezoid, rectangle, or wave shape;

[0011] And / or, the cross-sectional shape of the groove along the direction perpendicular to the first direction includes a circle, an ellipse, a semicircle, a rectangle, or a polygon.

[0012] In one embodiment, the edge of the heat dissipation layer is provided with a baffle wall, which extends along the first direction and is at least partially attached to the sidewall of the heat-conducting layer.

[0013] In one embodiment, the heat-conducting block is integrally formed with the heat dissipation layer.

[0014] In one embodiment, the heat-conducting block has a heat dissipation channel inside, and a cooling medium flows through the heat dissipation channel. A control device is connected to each end of the heat dissipation channel, and the control device is used to control the circulation of the cooling medium within the heat dissipation channel.

[0015] In one embodiment, the cooling medium is gaseous, and both ends of the heat dissipation channel are connected to the outside air or the cooling gas, respectively.

[0016] In one embodiment, the cooling medium includes air.

[0017] In one embodiment, the cooling medium is liquid, and both ends of the heat dissipation channel are connected to a cooling container containing the coolant.

[0018] In one embodiment, the cooling medium includes any one or a combination of water and oil.

[0019] In one embodiment, the heat dissipation channels are arranged in a straight line or a U-shape when projected onto the back side of the display panel.

[0020] In one embodiment, the display module further includes a protective layer located on the side of the heat dissipation layer away from the second thermally conductive adhesive layer. The side of the protective layer close to the heat dissipation layer is fitted into the heat dissipation layer, and the side of the protective layer away from the heat dissipation layer is a flat surface.

[0021] According to a second aspect of the embodiments of this application, a display device is provided, including the display module as provided in the foregoing embodiments.

[0022] Additional aspects and advantages of this application will be set forth in part in the description which follows, and will become apparent from the description or may be learned by practice of this application. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0024] Figure 1 This is a schematic diagram of the structure of a display module in related technologies;

[0025] Figure 2 This is a schematic diagram of the structure of a display module provided in an embodiment of this application;

[0026] Figure 3 Provided for this application Figure 2 A cross-sectional schematic diagram of one embodiment at square frame A;

[0027] Figure 4 Provided for this application Figure 2 A cross-sectional schematic diagram of another embodiment at square frame A;

[0028] Figure 5 Provided for this application Figure 2 A cross-sectional schematic diagram of another embodiment at square frame A;

[0029] Figure 6 Provided for this application Figure 2 A tiled diagram of the display module in the diagram;

[0030] Figure 7 This is a schematic diagram of another display module provided in an embodiment of this application;

[0031] Figure 8 for Figure 7 A schematic diagram of the cross-section of the display module along line B-B'.

[0032] Figure 9 This is a schematic diagram of the structure of another display module provided in an embodiment of this application;

[0033] Figure 10 for Figure 9 A three-dimensional structural schematic diagram of one embodiment of the display module shown;

[0034] Figure 11 for Figure 9 A three-dimensional structural schematic diagram of another embodiment of the display module shown.

[0035] In the picture:

[0036] 1-Display panel; 2-Heat dissipation structure; 21-First thermally conductive adhesive layer; 22-Heat conductive layer; 23-Second thermally conductive adhesive layer; 24-Heat dissipation layer; 241-Groove; 242-Block; 25-Heat conductive block; 251-Heat dissipation channel; 3-Protective layer. Detailed Implementation

[0037] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0038] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0039] With the development of technology, consumers have increasingly higher requirements for the brightness of electronic display screens, leading to a gradual increase in the heat generated by the displays. Excessive heat after the screen is turned on can cause the screen casing to overheat, which in turn can cause the consumer's handheld portion to heat up, thus affecting the user experience. Therefore, corresponding heat dissipation structures have been added inside the displays, such as... Figure 1 As shown, current OLED module under-display solutions involve stacking three layers of materials—pressure-sensitive adhesive, foam, and copper foil—on the back of the display panel. However, both pressure-sensitive adhesive and foam are non-thermal conductive materials. Furthermore, the foam contains air, which has an extremely low thermal conductivity, further hindering heat conduction from the screen and causing heat accumulation and increased temperature rise.

[0040] The display module and display device provided in this application are intended to solve the above-mentioned technical problems in related technologies.

[0041] The display module and display device in the embodiments of this application will now be described in detail with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments may complement or combine with each other.

[0042] This application provides a display module, such as... Figure 2 As shown, the device includes a display panel 1 and a heat dissipation structure 2. The heat dissipation structure 2 includes a first thermally conductive adhesive layer 21, a thermally conductive layer 22, a second thermally conductive adhesive layer 23, and a heat dissipation layer 24 stacked sequentially. The side of the first thermally conductive adhesive layer 21 away from the thermally conductive layer 22 is bonded to the back side of the display panel 1. The heat dissipation structure 2 is provided with a heat-conducting block 25 along a first direction z that passes through the first thermally conductive adhesive layer 21, the thermally conductive layer 22, and the second thermally conductive adhesive layer 23 sequentially. The first direction z is perpendicular to the surface of the display panel 1. Specifically, the first direction z is the direction from the second thermally conductive adhesive layer 23 to the first thermally conductive adhesive layer 21.

[0043] This embodiment employs a heat-conducting block that penetrates the first thermally conductive adhesive layer, the thermally conductive layer, and the second thermally conductive adhesive layer within the heat dissipation structure. This allows for two main benefits: First, heat generated by the display panel portion directly in contact with the first thermally conductive adhesive layer is sequentially conducted from the first thermally conductive adhesive layer to the thermally conductive layer, then to the heat-conducting block, and finally to the heat dissipation layer for dissipation. Second, compared to heat conduction via the first thermally conductive adhesive layer, the heat generated by the display panel portion directly in contact with the heat-conducting block is directly conducted to the heat dissipation layer, resulting in more direct and rapid heat transfer and faster heat dissipation. Simultaneously, a portion of the back side of the display panel is in direct contact with the first thermally conductive adhesive layer. The first thermally conductive adhesive layer 21 not only conducts heat but also works with the second thermally conductive adhesive layer 23 to bond and fix the thermally conductive layer 22 and the heat dissipation layer 24. This ensures that the heat dissipation structure 2 is firmly adhered to the back side of the display panel 1 while achieving heat dissipation, preventing relative displacement between the film layers. The various film layers within the heat dissipation structure 2 cooperate to achieve rapid heat diffusion, reducing the temperature rise of the display module and extending the lifespan of the display screen.

[0044] In some embodiments, this application also provides an embodiment in which a heat dissipation structure is provided on the back side of the display panel. The heat dissipation structure includes a first thermally conductive adhesive layer, a thermally conductive layer, a second thermally conductive adhesive layer and a heat dissipation layer stacked in sequence. No thermally conductive block is provided in the heat dissipation structure. The heat generated by the display panel is directly conducted and dissipated through the stacked heat dissipation structure, which can also improve the heat dissipation effect of the display panel.

[0045] In some embodiments, the thermally conductive layer 22 is made of graphite. The lateral heat dissipation coefficient of the graphite material after forming a thin film is as high as 1800w / m·k. Therefore, the heat conducted from the first thermally conductive adhesive layer 21 can be quickly conducted to the thermally conductive block 25, and then further conducted to the heat dissipation layer 24 through the thermally conductive block 25.

[0046] In some embodiments, the thickness of the thermally conductive layer 22 along the first direction z is 0.017 to 0.07 mm. For example, the thickness of the thermally conductive layer 22 along the first direction z is 0.017 mm, 0.027 mm, 0.035 mm, 0.05 mm, or 0.07 mm.

[0047] In some embodiments, the thickness of the first thermally conductive adhesive layer 21 along the first direction z is 0.03 to 0.1 mm. For example, the thickness of the first thermally conductive adhesive layer 21 along the first direction z is 0.03 mm, 0.05 mm, 0.07 mm, 0.09 mm or 0.1 mm.

[0048] In some embodiments, the thickness of the second thermally conductive adhesive layer 23 along the first direction z is 0.03 to 0.1 mm. For example, the thickness of the second thermally conductive adhesive layer 23 along the first direction z is 0.03 mm, 0.05 mm, 0.07 mm, 0.09 mm, or 0.1 mm.

[0049] In some embodiments, the heat-conducting block 25 is made of copper, which enables rapid heat transfer.

[0050] In some embodiments, the heat dissipation layer 24 is made of copper alloy or aluminum alloy, which has a high thermal conductivity, thus facilitating heat conduction and dissipation.

[0051] In some embodiments, such as Figure 2 As shown, a groove 241 is formed on the side of the heat dissipation layer 24 away from the second thermally conductive adhesive layer 23. The groove 241 can increase the surface area of ​​the heat dissipation layer 24, thus increasing the contact area between the heat dissipation layer 24 and the outside world and improving the heat dissipation performance.

[0052] In some embodiments, multiple holes can be formed on the surface of the heat dissipation layer 24 to increase the surface area of ​​the heat dissipation layer 24, improve heat dissipation performance, and achieve rapid heat diffusion.

[0053] In some embodiments, such as Figure 2 As shown, the dimension x1 of the groove 241 along the first direction z is greater than or equal to half the dimension of the heat dissipation layer 24 along the first direction z. This maximizes the surface area of ​​the heat dissipation layer 24, thereby improving heat dissipation efficiency.

[0054] In some embodiments, such as Figure 2 As shown, the dimension x1 of the groove 241 along the first direction z is less than or equal to two-thirds of the dimension of the heat dissipation layer 24 along the first direction z. This ensures the material strength of the heat dissipation layer 24 in the direction parallel to the surface of the display panel 1 (the direction of the plane formed by the x and y directions). It should be noted that, in conjunction with... Figure 2 and Figure 6 It can be seen that the plane formed by the x and y directions is perpendicular to the first direction z.

[0055] In some embodiments, the dimension x1 of the groove 241 along the first direction z is greater than or equal to half the dimension of the heat dissipation layer 24 along the first direction z, and the dimension of the groove 241 along the first direction z is less than or equal to two-thirds of the dimension of the heat dissipation layer 24 along the first direction z. This allows for an increase in surface area while maintaining the material strength of the heat dissipation layer 24 in the direction parallel to the surface of the display panel 1.

[0056] In some embodiments, when the dimension (thickness) of the heat dissipation layer 24 along the first direction z is 0.05 to 0.15 mm, the dimension (groove depth x1) of the groove 241 along the first direction z can be 0.025 to 0.1 mm.

[0057] For example, the dimension of the heat dissipation layer 24 along the first direction z is 0.05 mm, and the dimension x1 of the groove 241 along the first direction z is 0.025 mm. Alternatively, the dimension of the heat dissipation layer 24 along the first direction z is 0.15 mm, and the dimension x1 of the groove 241 along the first direction z is 0.1 mm. Alternatively, the dimension of the heat dissipation layer 24 along the first direction z is 0.15 mm, and the dimension x1 of the groove 241 along the first direction z is 0.075 mm.

[0058] In some embodiments, such as Figure 2 As shown, multiple grooves 241 are evenly spaced on the side of the heat dissipation layer 24 away from the second thermally conductive adhesive layer 23. The groove width d1 of the groove 241 is equal to the groove distance d2 between adjacent grooves 241. In this embodiment, making the groove width of the groove 241 equal to the groove distance between adjacent grooves 241 can increase the contact area between the heat dissipation layer 24 and the external environment while ensuring that the supporting function of the heat dissipation layer 24 for the display panel 1 is not affected. For example, in this embodiment, the groove width d1 of the groove 241 and the groove distance d2 between adjacent grooves 241 are both 1mm. It should be noted that the smaller the groove width d1 of the groove 241 and the groove distance d2 between adjacent grooves 241 in this embodiment, the larger the surface area that the groove 241 can form, and the larger the heat dissipation area. Those skilled in the art can set it according to the actual situation, and it is not limited to this.

[0059] In some embodiments, the cross-sectional shape of the groove 241 along the first direction z includes a triangle, trapezoid, rectangle, or wave shape. For example, when the cross-sectional shape of the groove 241 along the first direction z is trapezoidal, the surface area of ​​the heat dissipation layer 24 furthest from the display panel is the largest, resulting in relatively better heat dissipation. Those skilled in the art can set the shape according to actual conditions, and are not limited thereto.

[0060] For example, such as Figure 3As shown, the cross-sectional shape of the groove 241 along the first direction z is triangular. The width d3 of the side of the groove 241 away from the display panel 1 is 1 to 3 mm. For example, d3 is 1 mm, 1.5 mm, 2 mm, 2.5 mm or 3 mm. The spacing d4 between the grooves 241 is 0.5 to 1 mm. For example, d4 is 0.5 mm, 0.6 mm, 0.75 mm, 0.9 mm or 1 mm.

[0061] For example, such as Figure 4 As shown, the cross-sectional shape of the groove 241 along the first direction z is trapezoidal. The width d5 ​​of the groove 241 on the side closer to the display panel 1 is 0.5 to 1.5 mm. For example, d5 is 0.5 mm, 0.7 mm, 1 mm, 1.2 mm or 1.5 mm. The width d6 of the groove 241 on the side away from the display panel 1 is 1 to 3 mm. For example, d6 is 1 mm, 1.5 mm, 2 mm, 2.5 mm or 3 mm. The spacing d7 between the grooves 241 is 0.5 to 1 mm. For example, d7 is 0.5 mm, 0.6 mm, 0.75 mm, 0.9 mm or 1 mm.

[0062] For example, such as Figure 5 As shown, the cross-sectional shape of the groove 241 along the first direction z is wavy. The smooth shape can minimize the stress on the heat dissipation layer 24, which could lead to cracks.

[0063] In some embodiments, the cross-sectional shape of the groove 241 along the plane formed by the x and y directions includes a circle, an ellipse, a semicircle, a rectangle, a rhombus, or a polygon.

[0064] For example, such as Figure 6 As shown, the cross-sectional shape of the groove 241 is rhomboid, and the length d8 in the major axis direction is 5 to 10 mm. For example, d8 is 5 mm, 6 mm, 7.5 mm, 9 mm or 10 mm. The spacing d9 between each groove 241 is 1 to 3 mm. For example, d9 is 1 mm, 1.5 mm, 2 mm, 2.5 mm or 3 mm.

[0065] In some embodiments, such as Figure 2 As shown, the edge of the heat dissipation layer 24 is provided with a baffle 242. The baffle 242 extends along the first direction z and is at least partially attached to the sidewall of the heat-conducting layer 22, which can prevent the heat-conducting layer 22 from detaching due to its material properties. It should be noted that the baffle 242 can be in contact with the first thermally conductive adhesive layer 21 and the second thermally conductive adhesive layer 23 to enhance the adhesion of the thermally conductive adhesive layer to the sidewall of the baffle, avoid relative displacement, and extend the service life of the device. Alternatively, the baffle can not be in contact with the first thermally conductive adhesive layer 21 and the second thermally conductive adhesive layer 23 to reduce the size of the baffle along the first direction z and save material costs.

[0066] Furthermore, the thickness of the baffle wall along the direction from the center area to the edge area can be flexibly set. If the baffle wall is thicker, the baffle wall 242 and the heat-conducting layer 22 will be in direct contact, allowing the area where the baffle wall 242 is set to achieve rapid heat conduction without the need for the heat-conducting block 25, thus dissipating heat quickly. If the baffle wall is thinner, it will increase the area where the heat-conducting adhesive layer is located in the center area, which can improve the adhesion effect and avoid relative displacement between the film layers.

[0067] Furthermore, since the baffle 242 is located in the edge region, in some embodiments, the projection of the baffle 242 onto the plane formed in the xy direction coincides with the projection of the border area of ​​the display panel 1. This allows the screen display area of ​​the display panel 1 to coincide with the effective heat dissipation area, enabling more precise heat conduction to the light-emitting area, which is the main heat dissipation area. In some embodiments, the position of the baffle 242 may also extend beyond the border area of ​​the display panel. Those skilled in the art can flexibly set it according to specific circumstances, and it is not limited thereto.

[0068] In some embodiments, such as Figure 2 As shown, the height of the baffle 242 along the first direction z is equal to the sum of the heights of the first thermally conductive adhesive layer 21, the thermally conductive layer 22, and the second thermally conductive adhesive layer 23 along the first direction z. This allows the side of the baffle 242 closest to the display panel 1 to contact the frame area of ​​the display panel 1, directly conducting the heat generated by the display panel 1 to the heat dissipation layer 24, thus improving heat dissipation efficiency.

[0069] In some embodiments, such as Figure 7 As shown, the heat-conducting block 25 and the heat dissipation layer 24 are integrally formed. This simplifies the manufacturing process of the display module, and the heat does not need to be transferred through a medium of two materials, thus improving heat transfer efficiency and enhancing the heat dissipation effect of the display screen.

[0070] In some embodiments, such as Figure 8 As shown, the shape of the projection of the heat-conducting block 25 in the xy direction is circular. It should be noted that, in this embodiment, the shape of the projection of the heat-conducting block 25 in the xy direction can be circular, elliptical, square, or polygonal. Those skilled in the art can design flexibly according to actual conditions, without making specific limitations.

[0071] In some embodiments, such as Figures 9-11 As shown, the heat-conducting block 25 has a heat dissipation channel 251 inside, and a cooling medium flows in the heat dissipation channel 251. A control device (not shown in the figure) is connected to both ends of the heat dissipation channel 251. The control device is used to control the circulation of the cooling medium in the heat dissipation channel 251.

[0072] In this embodiment, a heat dissipation channel 251 is provided inside the heat-conducting block 25, and a cooling medium circulates in the heat dissipation channel 251. Compared with the passive heat dissipation achieved by the heat-conducting block 25 and the heat dissipation layer 24 in the previous embodiment, this embodiment actively removes the heat conducted from the display panel 1 to the heat-conducting block 25 in the form of heat exchange by the cooling medium, which can further improve the heat dissipation effect.

[0073] In some embodiments, such as Figures 9-11 As shown, a heat dissipation channel 251 is formed inside the heat-conducting block 25 by creating an opening with two connected ends, and heat dissipation is further achieved through a cooling medium. In this embodiment, the heat dissipation channel 251 is formed inside the heat-conducting block 25, eliminating the need for additional heat pipes. The heat dissipation channel 251 does not occupy extra volume or space within the film layer, and can achieve further active heat dissipation without increasing the thickness of the display module.

[0074] In some embodiments, the cooling medium is gaseous, and both ends of the heat dissipation channel 251 are respectively connected to the outside air or a cooling gas. For example, the cooling medium is air.

[0075] In some embodiments, the cooling medium is liquid, and both ends of the heat dissipation channel 251 are respectively connected to a cooling container containing coolant. When the cooling medium is liquid, a liquid with a high specific heat capacity can be selected; for example, water or oil is used. It should be noted that in different application scenarios, those skilled in the art can set the cooling medium according to the actual needs, and this application does not limit this.

[0076] In some embodiments, the cooling medium is a solid-liquid mixture, such as an ice-water mixture.

[0077] In some embodiments, the heat dissipation channels 251 are arranged in a straight line or a U-shape in the front projection of the back side of the display panel 1. For example, as shown... Figures 9-11 As shown, the heat dissipation channel 251 is arranged in a straight line.

[0078] In some embodiments, such as Figure 2 , Figure 7 and Figure 9As shown, the display module also includes a protective layer 3. The protective layer 3 is located on the side of the heat dissipation layer 24 away from the second thermally conductive adhesive layer 23. The side of the protective layer 3 closest to the heat dissipation layer 24 is fitted into the heat dissipation layer 24, while the side of the protective layer 3 away from the heat dissipation layer 24 is a flat surface. If the outermost surface of the display module is uneven, mold marks may appear due to uneven pressure when the heat dissipation structure 2 is attached to the display panel 1. Therefore, in this embodiment, a protective layer 3 is added to the side of the heat dissipation layer 24 away from the display panel 1 in the display module. This ensures that when the protective layer 3 is rolled by a roller, the mold mark problem can be avoided because the side of the protective layer 3 away from the heat dissipation layer 24 is a flat surface. It should be noted that when assembling the product, the protective layer 3 can be removed to expose the heat dissipation layer 24 for better heat dissipation, or the protective layer 3 can be retained to maintain the flatness of the outer surface of the display module, facilitating the attachment of other components to the terminal device.

[0079] In some embodiments, the protective layer 3 is made of PET (Polyethylene terephthalate) or PU (polyurethane).

[0080] Based on the same inventive concept, this application provides a display device including the display module as provided in the foregoing embodiments. Thus, the display device possesses all the features and advantages of the aforementioned display module, which will not be repeated here.

[0081] It should be noted that the display device can be any device that displays images, whether moving (e.g., video) or fixed (e.g., still images), and whether it contains text or images. More specifically, the intended embodiments can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat panel displays, computer monitors, automotive displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0082] The above embodiments of this application can complement each other without causing conflict.

[0083] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0084] The terms “center,” “upper,” “lower,” “front,” “back,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0085] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0086] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the claims.

[0087] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A display module, characterized in that, include: Display panel; A heat dissipation structure includes a first thermally conductive adhesive layer, a thermally conductive layer, a second thermally conductive adhesive layer, and a heat dissipation layer stacked sequentially. The side of the first thermally conductive adhesive layer away from the thermally conductive layer is bonded to the back side of the display panel. The heat dissipation structure is provided with a thermally conductive block that sequentially penetrates the first thermally conductive adhesive layer, the thermally conductive layer, and the second thermally conductive adhesive layer along a first direction. The first direction is perpendicular to the surface of the display panel, and the first direction is the direction from the second thermally conductive adhesive layer to the first thermally conductive adhesive layer. The heat dissipation layer includes a heat dissipation main body located on the side of the second thermally conductive adhesive layer away from the display panel and a baffle connected to the edge of the heat dissipation main body. The baffle extends along the first direction and is at least partially attached to the sidewall of the thermally conductive layer. The side of the baffle close to the display panel contacts the frame area of ​​the side surface of the display panel facing the heat dissipation structure. The thermally conductive block is integrally formed with the heat dissipation layer.

2. The display module according to claim 1, characterized in that, The heat dissipation layer has a groove on the side away from the second thermally conductive adhesive layer.

3. The display module according to claim 2, characterized in that, The dimension of the groove along the first direction is greater than or equal to one-half of the dimension of the heat dissipation layer along the first direction; And / or, the dimension of the groove along the first direction is less than or equal to two-thirds of the dimension of the heat dissipation layer along the first direction.

4. The display module according to claim 2, characterized in that, The plurality of grooves are spaced apart on the side of the heat dissipation layer away from the second thermally conductive adhesive layer, and the groove width is equal to the groove spacing between adjacent grooves.

5. The display module according to claim 2, characterized in that, The cross-sectional shape of the groove along the first direction includes a triangle, trapezoid, rectangle, or wave shape; And / or, the cross-sectional shape of the groove along the direction perpendicular to the first direction includes a circle, an ellipse, a semicircle, a rectangle, or a polygon.

6. The display module according to claim 1, characterized in that, The heat-conducting block has a heat dissipation channel inside, and a cooling medium flows through the heat dissipation channel. A control device is connected to each end of the heat dissipation channel, and the control device is used to control the circulation of the cooling medium in the heat dissipation channel.

7. The display module according to claim 6, characterized in that, The cooling medium is gaseous, and the two ends of the heat dissipation channel are respectively connected to the outside air or the cooling gas.

8. The display module according to claim 7, characterized in that, The cooling medium includes air.

9. The display module according to claim 6, characterized in that, The cooling medium is liquid, and both ends of the heat dissipation channel are connected to a cooling container containing the coolant.

10. The display module according to claim 9, characterized in that, The cooling medium includes any one or a combination of water and oil.

11. The display module according to claim 6, characterized in that, The heat dissipation channels are arranged in a straight line or a U-shape when projected onto the back side of the display panel.

12. The display module according to claim 1, characterized in that, Also includes: A protective layer is located on the side of the heat dissipation layer away from the second thermally conductive adhesive layer. The side of the protective layer close to the heat dissipation layer is embedded with the heat dissipation layer, and the side of the protective layer away from the heat dissipation layer is a flat surface.

13. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 12.

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